Inspection when transferring electronic components from a first substrate to a second substrate

Abstract

The invention relates to an inspection unit, which is intended in particular for use in a device for transferring electronic components from a first substrate to a second substrate and / or for applying adhesive from a reservoir to a second substrate, comprising an image capturing unit, which is assigned an illumination unit, wherein the illumination unit is designed to direct light of different wavelengths onto a second holder, which in turn is designed to support an object located on the second substrate, which is to be captured by the image capturing unit, wherein a sixteenth, a seventeenth, an eighteenth and / or a nineteenth transfer unit is designed to transfer a respective image capturing unit and / or its associated optics, including focusing optics, a beam deflector and / or an illumination unit, along the second holder.

Description

TECHNICAL FIELD

[0001] Described herein is an inspection when transferring electronic components from a first substrate to a second substrate and an apparatus and method for applying adhesive to the second substrate. In particular, an apparatus and method are described for performing an inspection when separating and directly transferring electronic components from a first substrate to a second substrate, either before or after applying adhesive to the second substrate, either before or after. BACKGROUND

[0002] A general problem in transferring electronic components, in particular chips (or "die"), and in particular in transferring singulated electronic components, is that these components are easily damaged and thus have to be handled very carefully. Furthermore, electronic components are subject to a constant miniaturization, which leads to a constant increase in the requirements for precision when transferring electronic components.

[0003] WO2017 / 076989A1 relates to a handling system and method for handling a flexible substrate, for example a roll of foil, using a tensioning device having a vacuum plate movable along a conveying direction of the flexible substrate and an indexer that intermittently moves the flexible substrate for handling. The vacuum plate is configured to move along the conveying direction. The indexer is configured to intermittently move the flexible substrate for handling. A controller is configured to control the tensioning device and the indexer such that a relative speed between the indexer and the vacuum plate of the tensioning device remains above a predetermined threshold value under all operating conditions, even when the flexible substrate is stopped. The roll of foil that can be used in the handling system has a plurality of electrical structures spaced apart from each other by a distance. The electrical structures can be any type of flexible electronics.

[0004] DE102011104225B4 relates to an apparatus for positioning electronic components to be transferred relative to an ejection device, wherein the ejection device has a slide for at least one electronic component and a housing surrounding the slide, the housing having a first light-transmissive region. A first substrate provides the electronic components to be transferred. The first substrate has a first side facing the ejection device and a second side facing away from the ejection device. A plurality of electronic components is arranged on the second side. An image data acquisition device is designed to acquire image data of a region in which the slide is designed to interact with the at least one electronic component through the first light-transmissive region of the housing. A controller is designed to determine position data of the electronic components to be transferred from the acquired image data and to generate a control command based on the position data. At least one actuator is designed to move the first substrate and the ejection device relative to each other based on the control command in order to change an offset between a longitudinal axis of the slide and a central axis of the electronic components to be transferred, wherein the ejection device comprises a first mirror arranged inside the housing.

[0005] DE10349847B3 relates to a positioning device and method for transferring electronic components. Here, a semiconductor wafer disposed on a carrier film is positioned above and parallel to a roll-shaped foil substrate. The wafer can be moved within its plane by means of a wafer holder and can also be rotated about a rotation axis perpendicular to the wafer plane. An ejection device includes an ejector pin that acts downwards on the rear side of the chip to be separated, detaching the chip from the carrier film. The chip separated from the carrier film is then placed at an adhesive position on the roll-shaped foil substrate.

[0006] JP2003-109979A relates to an apparatus having at least two sliders for separating elements from a first substrate. Here, these elements are picked up by a pipette of a transfer element. In a final step, the transfer element, having the pipette and the element, is positioned above a second substrate, which has been prepared with adhesive, and the element is placed on the second substrate. In this case, the element is not transferred directly from the first substrate to the second substrate, but is received after being separated from the first substrate by means of the transfer element, and is then precisely oriented and attached to the second substrate by the transfer element in a subsequent step.

[0007] Document US7042580B1 relates to an apparatus for optical measurement electronics that can be integrated into a processing station. In this case, the apparatus is physically separated from the processing station but electronically coupled to it. The apparatus for optical measurement electronics includes a camera sensor that is pointed at the measurement area and can be moved by means of a transfer unit.

[0008] Document DE102015013495A1 discloses an apparatus for transferring electronic components from a wafer to a substrate, wherein an optical detection sensor is used to inspect the electronic components from different directions during the transfer process.

[0009] Document DE102011104225A1 discloses an apparatus for positioning an electronic component to be transferred relative to an ejection device. Here, the ejection device has a slider for at least one electronic component and a housing surrounding the slider, wherein the housing has a first light-transmitting area. The electronic component to be transferred is provided by a first substrate, which includes a first side facing the ejection device and a second side facing away from the ejection device, wherein a plurality of electronic components are disposed on the second side. Here, at least one image data acquisition device is configured to acquire image data of an area through the first light-transmitting area of ​​the housing, in which the slider is configured to interact with at least one electronic component. A controller is designed to determine position data of the electronic component to be transferred based on the acquired image data and generate a control command based on the position data; and at least one actuator is designed to move the first substrate and the ejection device relative to each other based on the control command, thereby changing the offset between the longitudinal axis of the slider and the central axis of the electronic component to be transferred.

[0010] Other apparatuses and methods for transferring electronic components that form the technical background of the apparatus and methods described herein are described in the following documents: JP 5267451 A, EP 0 565 781 B1 and DE198 22 512 A1, US 4,667,402 B1, US 2008 / 0086874 A1, EP 2 764 826 A1, US 2002 / 0019074 A1, US 2009 / 242124 A1, EP 0 140 126 A1, US 4,990,051 B1, US 2006 / 237142 A1, US 2007 / 293022 A1, US 6,201,306 B1, JP 2009-238881 A, JP 2010-161155 A, JP 60-097634 A, JP 01-109737 A, JP 55-070041 A, JP 2002-050670 A, JP O9-162204 A, JP 53-100765 A, JP 2008-004936 A, WO 2007 / 137888 A1, WO 2000 / 014789 A1, EP 949 662 A2, US 2006 / 013680 A1, US 2016 / 308269 A1, DE 10 2011017218 A1, EP 2 491 583 B1. Summary of the Invention

[0011] Problem

[0012] In this context, there is a need for an apparatus and method that can improve throughput when transferring components from a first substrate to a second substrate with high accuracy and reproducibility. It should also be possible to use a second substrate ranging from almost opaque to completely transparent without any loss of quality in terms of positional accuracy of component assembly. Finally, these components should be handled with care.

[0013] Proposed solution

[0014] To achieve this objective, an apparatus for transferring electronic components from a first substrate to a second substrate is proposed, wherein...

[0015] - The first substrate carries a plurality of monolithic components that can be separated from it, and

[0016] - The second substrate is configured to be virtually infinite and carries a plurality of electronic sub-assemblies in its longitudinal and lateral extensions, one of which is to be transferred from the first substrate to the sub-assembly, and wherein...

[0017] The device includes:

[0018] - A first holder, which is designed to hold the first substrate;

[0019] - A second holder, designed to carry the second substrate along a longitudinal extension of the second substrate in the transport direction of the second substrate;

[0020] in

[0021] - The first holder is designed to hold the first substrate such that the element supported by the first holder is oriented toward the second holder;

[0022] - A separation unit designed to separate the element from the first substrate by contact or without contact in order to transfer the element to the second substrate;

[0023] - A first transfer unit, which is configured and designed to move the first holder in a transfer direction transverse to the second substrate relative to the second holder;

[0024] - A second transfer unit, which is configured and designed to move the separation unit transversely to the transfer direction of the second substrate relative to the second holder;

[0025] - A first inspection unit, configured and designed to detect the position of at least one of the elements relative to the assembly position on the second holder carrying the second substrate;

[0026] - A second inspection unit is arranged upstream of the assembly position and configured to detect the position of at least one of the plurality of electronic sub-components on the second substrate relative to the second holder, and to signal information indicating the detected position to the controller.

[0027] - A third transfer unit, configured and designed to transfer the second substrate to its position relative to the assembly position in response to a signal from the controller, such that at least one of the plurality of electronic sub-components on the second substrate reaches the assembly position on the second holder carrying the second substrate.

[0028] Advantages, configurations and modes of operation

[0029] To date, for the assembly of sub-assemblies or leadframes via Direct Die Assembly (DDA), a single row of foil material is typically used as the second substrate, on which components from the first substrate are placed. The proposed solution allows for the use of multiple rows of foil material as the second substrate. The reduced complexity and higher throughput of the direct die structure are thus transferred to a region capable of handling systems with multiple rows of foil material. Multiple rows of foil material are typically used to mount components in so-called pick-and-place systems or flip-chip systems. The proposed solution also allows for the replacement of previous inspections of the second substrate at the assembly location. Therefore, even second substrates that are nearly opaque to completely opaque can be used without any loss of component assembly quality.

[0030] Traditional systems designed to handle multi-row rolls of foil material typically work with an adhesive head that receives an element in a region outside the foil material, positions the element in the X / Y direction to an assembly position on the foil material, and then places the element onto the foil material in the Z direction.

[0031] To identify the assembly location on the foil roll material before die assembly, conventional DDA systems for single-row foil roll material use a camera mounted directly on the assembly area behind / below the foil roll material of the second substrate. Due to this arrangement, conventional DDA systems can only handle fully transparent materials such as PET without limiting assembly accuracy; opaque materials are generally not feasible as a second substrate.

[0032] The proposed solution detects the assembly position on the foil material (in both spatial and temporal aspects) before actual component assembly, wherein the second inspection unit directly detects the corresponding component assembly point on the second substrate itself, thus bypassing the second substrate. Then, the second substrate is controlled to be conveyed to the assembly position such that when the separation unit separates the component from the first substrate, the component assembly point is aligned as precisely as possible with the position of the component to be assembled on the first substrate, and then the component is transferred to the second substrate along the Z-direction.

[0033] Compared to pick-and-place systems or flip-chip systems, the proposed solution achieves significantly higher component throughput due to its lower structural complexity. Here, components can be directly and individually separated from the (sawed) wafer and placed into corresponding sub-assemblies (or lead frames or the like) on a second substrate; an intermediate substrate, as in conventional pick-and-place machines, is no longer required. The transparency of the second substrate material no longer affects positional accuracy during component assembly.

[0034] Configuration of the proposed solution

[0035] In one variant, a first holder having a first substrate is located directly above a second substrate on a second holder. Unlike prior art, the first holder and the separation unit have a movement space transverse to the transport direction of the second substrate, which at least substantially corresponds to the width of the second substrate. The working / component assembly area is thus significantly increased across the width of the second substrate. Therefore, multiple adjacent rows of electronic sub-components, such as RFID antennas, on the wide second substrate can be reached by the first substrate and assembled at the assembly location by operating the separation unit.

[0036] In one variant, the first substrate has a first side facing the separation unit and a second side facing away from the separation unit and facing the second holder, wherein a plurality of elements are detachably mounted on the second side of the first substrate; a first inspection unit is designed to capture image data of a region in which the separation unit is designed to interact with at least one of the plurality of elements, either with contact or without contact, to separate it from the first substrate; and a controller is designed to determine position data of the elements to be transferred based on the captured image data, and to generate control commands for the separation unit and the corresponding transfer unit based on the position data.

[0037] In one variant, the second inspection unit is arranged upstream of the assembly position on the second substrate relative to the transport direction of the second substrate, and is configured to detect the position of one or more of a plurality of electronic sub-components on the second substrate relative to the second holder, transverse to the transport direction of the second substrate, and to signal information indicating the detected position to the controller.

[0038] In one variant, a first sensor unit is associated with a third transfer unit, the sensor unit being configured and designed to signal information about the transfer direction and transfer path of the second substrate relative to the assembly position to the controller.

[0039] In one variant, the controller is configured and designed to control the second conveying unit based on information from the second inspection unit regarding the position of the at least one electronic sub-component and information regarding the conveying direction and path of the second substrate, and based on information from the first inspection unit regarding the at least one element relative to the assembly position, so as to move the separation unit to the assembly position transverse to the conveying direction of the second substrate and activate the separation unit.

[0040] In one variant, the device includes a fourth transfer unit configured and designed to move the first holder relative to the second holder along the transfer direction of the second substrate in response to information sent by the controller; and / or a fifth transfer unit configured and designed to rotate the first holder by an angle (θ) relative to the second holder in response to information signaled by the controller.

[0041] In another variation, the device includes a sixth transfer unit configured and designed to transfer the second substrate along the transfer direction via the second holder (without slippage and therefore without elongation) in response to a message issued by the controller, such that at least one of the plurality of electronic sub-components on the second substrate reaches the assembly position on the second holder carrying the second substrate.

[0042] In another variation of the device, if the separation unit is designed to separate the element from the first substrate by contact, the separation unit includes a pusher designed and sized to pierce the first substrate in response to a signal from the controller, so as to separate one of the elements from the first substrate and transfer it to the second substrate in each case; or if the separation unit is designed to separate the element from the first substrate without contact, the separation unit includes a controllable energy source designed and sized to charge the first substrate with energy in response to a signal from the controller, so as to separate one of the elements from the first substrate and transfer it to the second substrate respectively.

[0043] In another variation of the device, the second holder includes a (circular) cylindrical drum or convex surface through which the second substrate reaches an assembly position on the second holder. In one variation, the second holder has an outlet on its housing / surface that carries the second substrate, the outlet being designed to hold the second substrate on the second holder (without slipping or elongating) by means of a vacuum.

[0044] In another variation, the device includes a third inspection unit arranged downstream of the assembly position relative to the transport direction of the second substrate, and configured to detect the position of at least one of a plurality of electronic sub-components on the second substrate and the position of the elements transferred to the second substrate relative to each other, and to signal information indicating the detected position to a controller.

[0045] In another variation, the device includes an eighth transfer unit configured to transfer a second inspection unit relative to the second holder and assembly position to detect at least one component assembly point on the second substrate and / or detect the position of at least one of a plurality of electronic sub-assemblies on the second substrate, and to signal information indicating the detected position to a controller; and / or a ninth transfer unit configured to transfer a third inspection unit relative to the second holder and assembly position to detect the position of at least one of a plurality of electronic sub-assemblies on the second substrate and the position of the components transferred thereon relative to each other, and to signal information indicating the detected position to a controller.

[0046] Alternatively, the second inspection unit and / or the third inspection unit may be pivotally supported on the second holder and the orientation of the component assembly points or electronic subassemblies on the second substrate and the orientation of the components transferred onto them may be adjusted electronically or manually.

[0047] To achieve this objective, another device for applying adhesive from a reservoir to a second substrate is also proposed, wherein the second substrate is configured to be nearly infinite and supports a plurality of electronic sub-assemblies to which adhesive will be applied in its longitudinal and lateral extensions for subsequent transfer of components to one of the plurality of sub-assemblies, and wherein the other device comprises: a third holder designed to carry the second substrate along its longitudinal extension in the transport direction of the second substrate; and an adhesive dispensing unit designed to dispense adhesive in a controlled and metered manner at the adhesive application location toward the third holder onto an adhesive point on the second substrate, wherein one of the plurality of electronic sub-assemblies is located at... At the adhesive application location; an eleventh conveying unit configured to move the adhesive dispensing unit transversely to the conveying direction of the second substrate relative to the third holder; a fourth inspection unit disposed upstream of the adhesive application location and configured to detect the position of at least one of a plurality of electronic sub-components on the second substrate relative to the third holder, and to signal information indicating the detected position to the controller; and a twelfth conveying unit configured to convey the second substrate to its position relative to the adhesive application location in response to information from the controller, such that at least one of the plurality of electronic sub-components having bonding points on the second substrate reaches the adhesive application location on the third holder carrying the second substrate.

[0048] The device for applying the adhesive advantageously interacts with and is upstream of the device for transferring electronic components from the first substrate to the second substrate, but will also be used independently of the transfer device.

[0049] The same applies to the apparatus used for applying adhesives, which allows the use of multi-row foil material as a second substrate, where reduced complexity and higher throughput during adhesive application are transferred to areas of the system capable of handling multi-row foil material. The solution for adhesive application presented here also allows for the replacement of prior inspection of the second substrate at the adhesive application site. Therefore, when applying adhesives prior to component assembly, even nearly opaque to completely opaque second substrates can be used without any loss of quality.

[0050] To identify the adhesive application location on the foil material before adhesive application, conventional DDA systems for single-row foil materials use a camera mounted directly on the back / underside assembly area of ​​the foil material on the second substrate. Due to this arrangement, conventional DDA systems can only process completely transparent materials such as PET without limiting assembly accuracy; opaque materials are generally not feasible as a second substrate.

[0051] The proposed solution detects adhesive points on the foil material (spatially / temporally) before actual adhesive application, wherein a fourth inspection unit detects corresponding adhesive points directly on the second substrate itself that are associated with the respective electronic components, thus bypassing the second substrate. The second substrate is then conveyed in a controlled manner to the adhesive application location such that when the dispensing unit outputs (meters a portion) adhesive onto the adhesive points, the adhesive points are aligned as precisely as possible with the outlet position of the adhesive dispensing unit.

[0052] In one variant, the fourth inspection unit is configured and designed to detect the position of one or more of a plurality of electronic sub-components on the second substrate relative to the third holder in a transport direction transverse to the second substrate, and to signal information indicating the detected position to the controller. The fourth inspection unit is arranged upstream of the adhesive application position on the second substrate in a transport direction relative to the second substrate.

[0053] In one variant, the second sensor unit is associated with the twelfth transfer unit, which is configured and designed to signal information about the transfer direction and transfer path of the second substrate relative to the adhesive application position to the controller.

[0054] In one variant, the controller is configured and designed to control the eleventh transfer unit based on information from the fourth inspection unit regarding the position of at least one electronic sub-component and information regarding the transfer direction and transfer path of the second substrate, and based on information from the fourth inspection unit regarding the position of at least one element relative to the adhesive application position, so as to move the dispensing unit to the assembly position transverse to the transfer direction of the second substrate, and to activate the dispensing unit to achieve the purpose of separating the element from the first substrate.

[0055] In one variant, the device includes a thirteenth transfer unit configured and designed to transfer the second substrate along the transfer direction via the second holder (without slippage and therefore without elongation) in response to a message issued by the controller, such that at least one of the plurality of electronic sub-components on the second substrate reaches the adhesive application position on the second holder carrying the second substrate.

[0056] In another variation of the device, the third holder includes a (circular) cylindrical drum or convex surface through which the second substrate reaches an assembly position on the third holder. In one variation, the second holder has an outlet on its housing / surface that carries the second substrate, the outlet being designed to hold the second substrate on the third holder (without slipping or elongating) by means of a vacuum.

[0057] In another variation, the device includes a fifth inspection unit arranged downstream of the adhesive application location relative to the transport direction of the second substrate, and configured to detect the position of at least one of a plurality of electronic sub-components on the second substrate and the adhesive applied thereto relative to each other, and to signal information indicating the detected position to a controller.

[0058] In another variation, the device includes a fourteenth transfer unit configured to transfer a fourth inspection unit relative to the third holder and adhesive application position, so as to detect at least one bonding point on the second substrate by a fifth inspection unit, detect the position of at least one of a plurality of electronic sub-components on the second substrate, and signal information indicating the detected position to a controller; and / or a fifteenth transfer unit configured to transfer the fifth inspection unit relative to the third holder and adhesive application position, so as to detect the position of at least one of a plurality of electronic sub-components on the second substrate and the adhesive applied thereto relative to each other, and signal information indicating the detected position to a controller.

[0059] Optionally, the fourth and / or fifth inspection units may be pivotally supported, and their orientation may be adjusted electronically or manually.

[0060] In the aforementioned apparatus for transferring electronic components from a first substrate to a second substrate and / or for applying adhesive from a reservoir to a second substrate, the second to fifth inspection units may be configured as follows: An illumination unit is associated with the image capture unit, wherein the illumination unit is designed to guide light of different wavelengths onto a second holder, the second holder being designed to support an object located on the second substrate to be captured by the image capture unit; the sixteenth, seventeenth, eighteenth, and / or nineteenth transport units are designed to transport the corresponding image capture unit and its associated illumination unit along the second holder; and the eighth, ninth, fourteenth, and / or fifteenth transport units are configured and designed to transport the corresponding second, third, fourth, and / or fifth inspection units along the transport direction of the second substrate relative to the corresponding second and / or third holders and the component assembly position or adhesive application position.

[0061] In one variant of the inspection unit, the lighting unit includes a white light source, an infrared light source, or a red light source and / or an (ultra) blue light source.

[0062] In one variant of the illumination unit, an infrared or red light source and / or an (ultra) blue light source are configured as a ring light source, which at least partially surrounds the capture area of ​​the image capture unit.

[0063] In one variant of the inspection unit, a white light source is arranged on the side of a beam deflector that is at least partially transparent, away from the capture area of ​​the image capture unit.

[0064] In a variant of the inspection unit, the image capture unit includes a focusing optics arranged at a distance from the optically facing side of a beam deflector that is at least partially transparent, the distance being fixed.

[0065] Even though the operating modes of the reference device describe some of the aspects described above, these aspects can also relate to the structure of the device. In exactly the same way, the aspects described for the reference device above can be applied accordingly to the operating modes. Although the various aspects of the device and the operating modes are described together to explain their interactions, they are also disclosed independently of each other, independent of other devices and other operating modes. Attached Figure Description

[0066] Further objects, features, advantages, and applications will become apparent from the following description of exemplary embodiments, with reference to the accompanying drawings, which should not be construed as limiting. All features described and / or depicted herein, either alone or in any combination, illustrate the subject matter disclosed herein, even independently of their grouping in the claims or their references. In this context, the dimensions and scale of the elements shown in the figures are not necessarily to scale; they may differ from those shown in the embodiments to be implemented herein.

[0067] Figure 1 A schematic side view of an apparatus for transferring electronic components from a first substrate to a second substrate and an apparatus for applying adhesive to the second substrate are shown.

[0068] Figure 2 A schematic plan view of an adjustable worktable in the X- / Y- / θ coordinate system is shown.

[0069] Figure 3 A schematic plan view of the second to fifth inspection units is shown.

[0070] The method and apparatus variations and their functions and operations described herein are provided only for a better understanding of the structure, operating modes, and characteristics of the invention, and are not intended to limit the scope of the invention to the exemplary embodiments. The accompanying drawings are partial schematic diagrams, in which substantial features and effects are significantly enlarged to illustrate functions, effective principles, technical configurations, and features. The various operating modes, principles, technical configurations, and features disclosed in the foregoing drawings or text can be freely combined in any form with all claims of this application, features in the foregoing and other drawings, and other operating modes, principles, technical configurations, and features contained herein or deduced herein, so that all conceivable combinations are associated with the described apparatus. In this case, combinations between all individual implementations in the text, i.e., combinations between each part of the specification, combinations between different variations in the claims and in the text, and combinations in the claims and in the drawings, are also included and can be the subject of other claims. The claims do not limit the content of this disclosure, and therefore do not limit the possibility of combinations of all features shown with each other. All disclosed features are also explicitly disclosed individually herein, and these disclosed features can be combined with all other features. Detailed Implementation

[0071] In the accompanying drawings, corresponding or functionally similar elements are given corresponding reference numerals. The method and apparatus will now be described based on exemplary embodiments.

[0072] Figure 1 (On the right-hand side) An apparatus 100 for transferring electronic components B from a first substrate W to a second substrate BM is shown. In this variant, the first substrate W is designed as a generally circular semiconductor wafer and supports a plurality of monolithic components B, which can be detached from the first substrate in a manner further described below. The second substrate BM is configured as a nearly infinite roll of foil material and supports a plurality of electronic sub-assemblies ANT in its longitudinal and lateral extensions. In the variant shown here, the sub-assemblies ANT are printed antenna portions of an RFID module. One of the components B from the first substrate W will be transferred to each of the plurality of electronic sub-assemblies ANT, respectively. The apparatus has a first holder A1 designed to hold the first substrate W. The first holder A1 is adapted in design to the first substrate W.

[0073] In the variant shown, the second holder A2 has the form of a cylindrical drum. The second substrate BM is carried along its longitudinal extension in the transport direction FR via an outer wall in the shape of a cylindrical outer sleeve. Further details are explained below. The first holder A1 holds the first substrate W such that the element B supported by the first substrate W is oriented toward the second holder A2. A separation unit TE is provided on the side of the first holder A1 away from the second holder A2. The first substrate W has a first side facing the separation unit TE and a second side facing away from the separation unit, the second side being opposite the second substrate BM on / at the second holder A2. The plurality of elements B are detachably mounted on the second side of the first substrate W. The separation unit TE is used to separate the element B from the first substrate W by contact or non-contact, so as to transfer the element B to the second substrate BM at the assembly position AP.

[0074] The first holder A1 is part of a worktable that is adjustable in the X / Y / θ coordinates, and its respective X / Y axis and rotational position θ are adjusted by a transfer unit controlled by an electronic control unit (ECU). Specifically, the first transfer unit F1, in the form of a linear servo drive, is configured and designed to move the first holder A1 relative to the second holder A2 transversely to the transfer direction FR of the second substrate BM. (See also...) Figure 2 The second transfer unit F2, in the form of a linear servo drive, is configured and designed to move the separation unit TE relative to the second holder A2 in the transfer direction FR transverse to the second substrate BM.

[0075] The first inspection unit I1, in the form of a camera, is associated with the separation unit TE and is used to detect the position of at least one of the elements B relative to the assembly position AP on the second holder A2 carrying the second substrate BM.

[0076] The second inspection unit I2 is arranged upstream of the assembly position AP and associated with the second holder A2. The second inspection unit I2 can be moved in a controlled manner along the longitudinal extension of the drum-shaped second holder A2, thereby moving transversely to the transport direction FR of the second substrate BM, or can be manually or by a motor adjusted by a predetermined angle along the circumference of the shell surface of the drum-shaped second holder A2. For example, the inspection unit I2 can be connected to the second holder A2 via a pivot arm.

[0077] The second inspection unit I2 is used to detect the position of at least one of the plurality of electronic sub-components ANT on the second substrate BM relative to the second holder A2, and to signal information indicating the detected position to the controller ECU. In this configuration, the third transfer unit F3 is formed by two controllably driven transfer rollers arranged upstream and downstream of the drum-shaped second holder A2, guiding the second substrate BM around these rollers. In response to the information issued by the controller ECU, the two controllably driven transfer rollers transfer the second substrate BM to its position relative to the assembly position AP, such that at least one of the plurality of electronic sub-components ANT on the second substrate BM reaches the assembly position AP on the second holder A2 carrying the second substrate BM.

[0078] It can be understood that, depending on the sub-component ANT on the second substrate BM that will cooperate with component B, the assembly position AP changes in both the longitudinal direction and the lateral extension direction of the second substrate BM. Simultaneously, the corresponding area of ​​the second substrate BM is located on the second retainer A2 and is aligned with the first substrate W. Therefore, the first substrate W will also move in both the longitudinal direction and the lateral extension direction of the second substrate BM under the control of the controller ECU.

[0079] Multi-row foil material can obviously be used as a second substrate. This can be understood as foil material supporting several rows of sub-components ANT in its lateral extension. Substrate materials ranging from almost opaque to completely opaque can be used as the second substrate BM without sacrificing any precision in component assembly.

[0080] Before actual component assembly, the assembly position AP on the foil material of the second substrate BM is detected in both space and time. In this case, the second inspection unit I2 directly detects the corresponding component assembly point on the second substrate BM itself, thus bypassing the second substrate. Then, the second substrate BM is conveyed to the assembly position AP in a controlled manner, such that when the separation unit TE separates the component B from the first substrate W, the component assembly point is aligned as precisely as possible with the position of the component to be assembled on the first substrate W, and then the component B is transferred to the second substrate BM along the Z direction.

[0081] A first holder A1, having a first substrate W, is located directly above a second substrate BM on a second holder A2. Here, the first holder A1 and the separation unit TE have a movement space transverse to the transport direction FR of the second substrate BM, which at least substantially corresponds to the width of the second substrate BM. (See...) Figure 2The working / component assembly area thus extends approximately across the width of the second substrate BM. In one variation, the movement space of the holder A1 and / or the separation unit TE transverse to the transport direction FR of the second substrate BM can be greater than the transverse extension of the second substrate BM, thereby allowing at least the first substrate W to be fully positioned, or at least its center / centerline to be positioned beyond the transverse extension of the second substrate BM. Therefore, multiple adjacent rows of electronic sub-components ANT, such as RFID antennas, can reach the wide second substrate BM via the first substrate W and can be assembled at the assembly position AP by operating the separation unit TE.

[0082] The first inspection unit I1 is designed to capture image data of a region in which the separation unit TE is designed to separate the element B from the first substrate W by interacting with it, either in contact or without contact.

[0083] The controller ECU is designed to determine the position data of the component B to be transferred based on the captured image data, and generate control commands for the separation unit TE and each transfer unit F1, ... Fn based on the position data.

[0084] The second inspection unit I2 is arranged upstream of the assembly position AP on the second substrate BM in the transport direction X of the second substrate BM, and is configured to detect the position of one or more of the multiple electronic sub-components ANT on the second substrate BM relative to the second holder in the transport direction X of the second substrate BM, and send information indicating the detected position to the controller ECU.

[0085] Associated with the third transfer unit F3 is the first sensor unit SE1, which is configured to send information to the controller ECU about the transfer direction and transfer path of the second substrate BM relative to the assembly position AP.

[0086] Based on information from the second inspection unit I2 regarding the position of at least one electronic sub-component ANT and the transport direction and path of the second substrate BM, and based on information from the first inspection unit I1 regarding the position of at least one of the components B relative to the assembly position AP, the controller ECU controls the second transport unit F2. The controller ECU then moves the separation unit TE (along the transport direction) laterally to the transport direction X of the second substrate BM at the assembly position AP, and the separation unit TE is activated to separate the component B from the first substrate W.

[0087] The fourth transmission unit F4 is used to move the first holder A1 relative to the second holder A2 along the transmission direction FR of the second substrate BM in response to the information issued by the controller ECU.

[0088] In summary, each element B of the first substrate W can be positioned within the double-dotted area AF in such a way that appropriate X- / Y-drivers of the transfer units F1 and F4 are controlled accordingly, so as to transfer element B to the second substrate BM on the second holder A2. In a variation, the double-dotted area AF may be larger than the lateral extension of the second substrate BM.

[0089] The fifth transmission device F5 is used to rotate the first retainer A1 relative to the second retainer A2 by an angle θ in response to information sent by the controller ECU.

[0090] The sixth transfer unit F6 can, in response to information from the controller ECU, cause the second holder A2 to rotate in a controlled manner along and against the transfer direction FR. The sixth transfer unit F6 is used to transfer the second substrate BM along the transfer direction FR through the second holder A2 without slippage or elongation, such that at least one of the plurality of electronic sub-components ANT on the second substrate BM reaches the corresponding assembly position AP on the second holder A2 carrying the second substrate BM.

[0091] In one variant, the separation unit TE is designed to separate element B from the first substrate W via contact. For this purpose, the separation unit TE has a push pin N, which is designed and sized to respond to information sent by the controller ECU (from...). Figure 1 The upper part of the component (TE) pierces the first substrate W to separate one of the elements B from the first substrate W in each case and transfer that element to the second substrate BM. In a second variation, the component B is designed to be separated from the first substrate W without contact. For this purpose, the separation unit TE has a controllable energy source designed and sized to charge the first substrate W with laser energy, for example, in response to information sent by a controller ECU, so as to separate one of the elements B from the first substrate W in each case and transfer that element to the second substrate BM.

[0092] The second retainer A2 is a cylindrical drum or a convex surface, through which the second substrate BM can reach the assembly position AP on the second retainer A2. In one variant, the second retainer A2 has multiple small outlets on its housing / surface that carries the second substrate BM, so as to hold the second substrate BM on the second retainer A2 by vacuum Vak without slipping or elongating.

[0093] In one variation, the housing / surface of the second retainer may be designed, or the vacuum Vak may be controlled, such that there is no vacuum Vak on the housing / surface below the assembly position, but only on the upstream and downstream sides of the assembly position AP. The second substrate BM is thus held by vacuum upstream and downstream of the assembly position AP; there is no vacuum at the assembly position.

[0094] In one variation, the second holder A2 can be moved along the Z direction towards and away from the first holder A1 via a transfer unit to set the distance between the first holder and the second holder.

[0095] In another variation, the second holder A2 and / or the third holder A3 may have compressed air introduced at least in a portion of the respective region where the second substrate BM is not supported on the respective holder A2 or A3, and the compressed air is discharged through an opening to blow out dust that has been drawn into the vacuum hole over time.

[0096] The third inspection unit I3 is positioned downstream of the assembly position AP at the second holder A2, relative to the transport direction FR of the second substrate BM. It is used to detect the position of at least one of the plurality of electronic sub-components ANT on the second substrate BM and the element B transferred thereon relative to each other, and to signal information indicating the detected position to the controller ECU.

[0097] The eighth transfer unit F8 is used to transfer the second inspection unit I2 relative to the second holder A2 and the assembly position AP, so as to detect at least one component assembly point on the second substrate BM by means of the second inspection unit I2. Therefore, the second inspection unit I2 moves in a controlled manner both in the longitudinal extension of the drum-shaped second holder A2, thereby moving laterally to the transfer direction FR of the second substrate BM, and also moves circumferentially by a predetermined angle on the housing surface of the drum-shaped second holder A2. Alternatively, the angle can be manually set before the start of operation.

[0098] The position of at least one of the multiple electronic sub-components ANT on the second substrate BM can also be detected in this way, and information indicating the detected position can be signaled to the controller ECU. Furthermore, in this variant, a ninth transfer unit F9 is provided to transfer the third inspection unit I3 relative to the second holder A2 and the assembly position AP in a manner similar to that performed on the second inspection unit I2 via the eighth transfer unit F8. The third inspection unit I3 can therefore detect the position of at least one of the multiple electronic sub-components ANT on the second substrate BM and the element B transferred thereon relative to each other, and can signal information indicating the detected position to the controller ECU.

[0099] For example Figure 1Another (sub)device shown on the left-hand side is used to apply adhesive K from the reservoir to the second substrate BM. As described above, the second substrate BM is configured to be nearly infinite and supports multiple electronic sub-components ANT to which adhesive K will be applied in its longitudinal and lateral extensions, so that element B can subsequently be transferred to one of the sub-components ANT. The other device includes a third retainer A3, which carries the second substrate BM along its longitudinal extension in the transport direction FR of the second substrate BM.

[0100] exist Figure 1 In this process, the adhesive K dispensing unit SE is positioned above the third holder A3 to dispense the adhesive K onto the adhesive point KS on the second substrate BM in a controlled and metered manner at the adhesive application location KAP toward the third holder A3, where one of the multiple electronic sub-components ANT is located at the adhesive application location KAP.

[0101] The eleventh transfer unit F11 moves the adhesive dispensing unit SE in the transfer direction FR transverse to the second substrate BM relative to the third holder A3. The fourth inspection unit I4 is associated with the third holder A3 and is arranged upstream of the adhesive application position KAP. The fourth inspection unit I4 is used to detect the position of at least one of the plurality of electronic sub-components ANT on the second substrate BM relative to the third holder A3, and to signal information indicating the detected position to the controller ECU.

[0102] In this configuration, the twelfth transfer unit F12 consists of two controllably driven transfer rollers positioned upstream and downstream of the drum-shaped third holder A3, respectively, and guiding the second substrate BM around these rollers. In response to information from the controller ECU, the two controllably driven transfer rollers transport the second substrate BM to its position relative to the adhesive application position KAP, such that at least one of the plurality of electronic sub-assemblies ANT having adhesive points KS on the second substrate BM reaches the adhesive application position KAP on the third holder A3 carrying the second substrate BM.

[0103] In the configuration shown here, the adhesive application device cooperates with the device for transferring components from the first substrate to the second substrate. Therefore, the adhesive application device is used upstream of the component transfer device.

[0104] The same applies to the adhesive application device, which allows the use of multiple rows of foil material as a second substrate.

[0105] In this apparatus, adhesive points on the foil material are detected spatially and temporally before the actual application of adhesive. Here, the fourth inspection unit I4 directly detects the corresponding adhesive point KS at the corresponding electronic component on the second substrate BM itself, thus bypassing the second substrate BM. The second substrate BM is then conveyed in a controlled manner to the adhesive application position KAP, such that when the dispensing unit dispenses a metered portion of adhesive K onto the adhesive point KS, the position of the adhesive point KS is aligned as precisely as possible with the outlet position of the adhesive dispensing unit SE.

[0106] The fourth inspection unit I4 is located upstream of the adhesive application position KAP on the circumference of the drum-shaped third holder A3, relative to the conveying direction FR of the second substrate BM. It is used to detect the position of one or more of the multiple electronic sub-components ANT on the second substrate BM relative to the third holder A3 in the transverse conveying direction FR of the second substrate BM, and to send information indicating the detected position to the controller ECU.

[0107] Associated with the twelfth transfer unit F12 is the second sensor unit SE2, which signals information about the transfer direction and transfer path of the second substrate BM relative to the adhesive application position KAP to the controller ECU.

[0108] Based on the information from the fourth inspection unit I4 regarding the position of at least one electronic sub-component ANT and the information regarding the transport direction and transport path of the second substrate BM, and based on the information from the fourth inspection unit I4 regarding the position of at least one element B relative to the adhesive application position KAP, the controller ECU controls the eleventh transport unit F11 to move the dispensing unit SE laterally to the transport direction FR of the second substrate BM.

[0109] In response to a message from the controller ECU, the thirteenth transfer unit F13 transfers the second substrate BM along the transfer direction FR via the third holder A3. Under the control of the controller ECU, this is performed without slippage or elongation, such that at least one of the plurality of electronic sub-components ANT on the second substrate BM reaches the adhesive application position KAP on the third holder A3 that carries the second substrate BM.

[0110] Similar to the second holder A2, the third holder A3 is a cylindrical drum or a convex surface through which the second substrate BM reaches the adhesive application position KAP on the third holder A3. Here, the third holder also has an outlet on its housing / surface that carries the second substrate BM, so that the second substrate BM can be held on the third holder A3 without slippage or elongation by a vacuum (Vak).

[0111] The fifth inspection unit I5 is arranged downstream of the adhesive application position KAP on the circumference of the drum-shaped third holder A3 in the conveying direction FR of the second substrate BM, and is used to detect the position of at least one of the multiple electronic sub-components ANT on the second substrate BM and the adhesive K applied thereto relative to each other, and sends information indicating the detected position to the controller ECU.

[0112] The fourteenth transfer unit F14 is used to transfer the fourth inspection unit F4 relative to the third holder A3 and the adhesive application position KAP. The fourth inspection unit F4 can therefore detect at least one adhesive point KS on the second substrate BM to detect the position of at least one of the plurality of electronic components ANT on the second substrate BM, and send information indicating the detected position to the controller ECU.

[0113] The fifteenth transfer unit F15 is used to transfer the fifth inspection unit I5 along the circumference of the third holder A3 relative to the third holder A3 and the adhesive application position KAP. The fifth inspection unit I5 can therefore detect the position of at least one of the plurality of electronic sub-components ANT on the second substrate BM and the adhesive K applied thereto relative to each other, and can signal information indicating the detected position to the controller ECU.

[0114] according to Figure 2 The adjustable worktable in the X- / Y- / θ coordinates is configured in a particularly simple and advantageous manner as follows: a retainer A1 holding the first substrate W is arranged on the first carrier plate, wherein the fifth transfer unit F5 is used to rotate the first retainer A1 relative to the first carrier plate by an angle θ.

[0115] The first carrier plate is movably arranged on the second substrate BM in the lateral extension direction (Y). The first transfer unit F1 is configured to move the first carrier plate (only) in the transfer direction FR of the second substrate BM, and thus also move the first holder A1.

[0116] The second carrier plate is movably arranged on the rigid third carrier plate or support frame in the conveying direction FR of the second substrate BM. The fourth conveying unit F4 is configured to move the first holder A1, the first carrier plate and the second carrier plate relative to the third carrier plate (only) in the conveying direction FR of the second substrate BM.

[0117] exist Figure 3 In the above-described apparatus, the second inspection unit to the fifth inspection unit I2…I5 are configured to transfer the electronic component B from the first substrate W to the second substrate BM and to apply the adhesive K from the storage device to the second substrate BM.

[0118] In one configuration, the image acquisition unit BE (camera) can be moved along the Y direction at the inspection units I2…I5. In this variant, the beam deflector can be omitted. Alternatively, the remaining optics, including the focusing optics, beam deflector, and / or illumination, can be moved along the Y direction, while the camera remains stationary and does not move in the Y direction. In this variant, the camera is set at a certain angle only by a pivot arm.

[0119] The camera-type image capture unit BE has associated illumination units WL, RLB, and BLB. Illumination units WL, RLB, and BLB have a white light source WL, an infrared light source RLR, and a blue light source BLB. Illumination units WL, RLB, and BLB are used to guide light of different wavelengths onto the second holder A2. Therefore, different details of the components / subassemblies and adhesives can be visually captured by the image capture unit BE, which is pointed at the second substrate BM.

[0120] The sixteenth, seventeenth, eighteenth, and / or nineteenth transmission units F16…F19 are designed to transmit the corresponding image capturing unit BE and its associated illumination units WL, RLB, and BLB along the second holder A2 or the third holder A3, i.e., in the transmission direction transverse to the second substrate BM. In other words, the sixteenth, seventeenth, eighteenth, and / or nineteenth transmission units F16…F19 are Y-type drivers, while the eighth, ninth, fourteenth, and / or fifteenth transmission units F8, F9, F14, and F15 are motor pivot arms, whose functions can also be implemented manually.

[0121] The eighth, ninth, fourteenth, and / or fifteenth transfer units F8, F9, F14, and F15 are used to transfer the corresponding second, third, fourth, and / or fifth inspection units I2…I5 along the transfer direction FR of the second substrate BM relative to the corresponding second holder A2 and / or third holder A3 and component assembly position AP or adhesive application position KAP. The corresponding second, third, fourth, and / or fifth inspection units I2…I5 can thus be advantageously adapted to different spacings of electronic sub-assemblies on the second substrate.

[0122] In the variant of the illumination units WL, RLR, and RLB shown, the infrared light RLR and the blue light source RLB are configured as annular light sources surrounding the capture area EB of the image capture unit BE. The white light source WL is arranged on one side of a partially transparent beam deflector SU in the form of a 45-degree mirror, which is away from the capture area EB of the image capture unit BE. The image capture unit BE has a focusing optics FO, which is arranged at a fixed adjustable distance FL from the side of the at least partially transparent beam deflector SU facing the focusing optics FO.

Claims

1. An inspection unit (I2…I5) for transferring electronic components (B) from a first substrate (W) to a second substrate (BM) and / or applying adhesive from a reservoir to the second substrate (BM), said inspection unit having: - Image capture unit, - Illumination units (WL, RLR, RLB) are associated with the image capture unit, wherein the illumination units (WL, RLR, RLB) are designed to guide light of different wavelengths onto a second holder (A2), the second holder being designed to carry the second substrate along a longitudinal extension of the second substrate in the transport direction of the second substrate and support an object located on the second substrate (BM), the object to be captured by the image capture unit, wherein... - The second retainer (A2) has a convex curved surface. - The sixteenth, seventeenth, eighteenth, and / or nineteenth transport units (F16…F19) are designed to transport corresponding image capture units and / or their associated optical components along the transport direction of the second holder and transverse to the second substrate. The associated optical components include focusing optics, beam deflectors, and / or illumination units (WL, RLR, RLB); and - The eighth, ninth, fourteenth, and / or fifteenth transfer units (F8, F9, F14, F15) are configured and designed to transfer the inspection unit along the transfer direction of the second substrate (BM) relative to the assembly position or adhesive application position of the second holder (A2) and the element.

2. The inspection unit (I2…I5) according to claim 1, wherein, - The lighting unit (WL, RLR, RLB) includes a white light source, an infrared light source, or a red light source and / or a blue light source, and / or one of them. In the lighting units (WL, RLR, RLB), - The infrared or red light source and / or the blue light source are configured as a ring light source, the ring light source at least partially surrounding the capture area of ​​the image capture unit.

3. The inspection unit (I2…I5) according to claim 1 or 2, wherein, In the lighting units (WL, RLR, RLB), - A white light source is arranged on the side of the beam deflector that is at least partially transparent, away from the capture area of ​​the image capture unit.

4. The inspection unit (I2…I5) according to claim 1 or 2, wherein - The image capture unit includes a focusing optics arranged at a distance that can be fixedly positioned from the side of the beam deflector that is at least partially transparent to the light.

5. The inspection unit (I2…I5) according to claim 1 or 2, wherein - The second holder (A2) has an outlet on its surface that carries the second substrate, the outlet being designed to hold the second substrate on the second holder (A2) by vacuum.

6. The inspection unit (I2…I5) according to claim 1 or 2, wherein - The pivot arm is accordingly set and designed to adjust the inspection unit relative to the assembly position of the corresponding second holder (A2) and the element or the adhesive application position along the transport direction of the second substrate.

7. A method for inspection by inspection units (I2…I5), said inspection units (I2…I5) intended for use in an apparatus for transferring electronic components (B) from a first substrate (W) to a second substrate (BM) and / or for applying adhesive from a reservoir to the second substrate (BM), said method comprising the steps of: - Provides an image capture unit, - Illumination units (WL, RLR, RLB) are associated with the image capture unit, wherein the illumination units (WL, RLR, RLB) are designed to guide light of different wavelengths onto a second holder (A2), the second holder being designed to carry the second substrate along a longitudinal extension of the second substrate in the transport direction of the second substrate and support an object located on the second substrate (BM), the object to be captured by the image capture unit. -The second retainer (A2) has a convex curved surface. - Provide a sixteenth, seventeenth, eighteenth, and / or nineteenth transmission unit (F16…F19), wherein the sixteenth, seventeenth, eighteenth, and / or nineteenth transmission units (F16…F19) are designed to transmit a corresponding image capture unit and / or its associated optics along the second holder and in a transmission direction transverse to the second substrate, the associated optics including focusing optics, beam deflectors, and / or illumination units (WL, RLR, RLB), and - Provide an eighth, ninth, fourteenth, and / or fifteenth transfer unit, wherein the eighth, ninth, fourteenth, and / or fifteenth transfer units are configured and designed to transfer the inspection unit along the transfer direction of the second substrate (BM) relative to the assembly position or adhesive application position of the second holder (A2) and the element.

Images