Control device, control system, and recording medium having a program recorded

Abstract

A control device, a control system, and a recording medium recording a program control an operation of a laser processing device capable of changing an irradiation angle of laser light irradiated to a workpiece. The control device includes: a processing information acquisition section that acquires a processing result for the workpiece obtained by irradiating the workpiece with laser light as processing information; a target value acquisition section that acquires a target value of the processing result; a reference command value calculation section that calculates a command value of an operation command of the laser processing device as a reference command value based on the acquired target value; a correction amount decision section that decides a correction amount of the laser light based on the acquired processing information and the acquired target value; a correction command value decision section that decides a correction command value obtained by correcting the reference command value based on the calculated reference command value and the decided correction amount; and an execution control section that causes the irradiation of the laser light of the laser processing device to be executed based on the decided correction command value.

Description

Technical Field

[0001] This invention relates to a control device, a control system, and a recording medium containing a program. Background Technology

[0002] Previously, a laser processing apparatus was known that processes workpieces by irradiating them with a laser. This apparatus uses the laser to melt the workpiece at the irradiated location, thereby enabling processes such as cutting and welding.

[0003] Regarding laser processing equipment, there is a device that can change the illumination angle of the laser's optical axis. For example, a three-dimensional galvanometer scanner can change the illumination position (illumination angle) of the laser reflected from the light source on the workpiece by changing the angle of the mirror.

[0004] Furthermore, regarding the laser beam diameter at the irradiation position, the greater the deviation from the position facing the exit port of the laser processing device, the more the beam diameter deviates from a perfect circle. For example, the beam diameter becomes an elliptical diameter as the position deviates from the facing position. Moreover, compared to processing workpieces with straight cross-sections, the beam diameter deforms more when processing workpieces with curved cross-sections. Therefore, it is difficult to process the workpiece uniformly. Therefore, a laser scanning device that corrects the rotation angle of a galvanometer scanner based on the target position of the irradiated laser has been proposed (for example, see Patent Document 1).

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2008-216873 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] In the laser scanning apparatus described in Patent Document 1, the correction amount for the correction position is calculated by pre-inputting the target position to be irradiated by the laser. In the laser scanning apparatus described in Patent Document 1, the laser spot diameter is specified. Furthermore, in the laser scanning apparatus described in Patent Document 1, the rotation angles of the X-axis galvanometer scanner, Y-axis galvanometer scanner, and Z-axis galvanometer scanner are determined based on the correction amount for the correction position and the laser spot diameter. Therefore, in the laser scanning apparatus described in Patent Document 1, processing can be easily optimized.

[0010] On the other hand, in Patent Document 1, the laser irradiation conditions cannot be corrected according to the actual processing conditions. For further optimization, it is preferable to be able to correct the laser irradiation conditions using the actual processing conditions.

[0011] Solution for solving the problem

[0012] (1) This disclosure relates to a control device for controlling the operation of a laser processing apparatus, wherein the laser processing apparatus is capable of changing the irradiation angle of a laser irradiating a workpiece. The control device comprises: a processing information acquisition unit that acquires processing results obtained by irradiating the workpiece with the laser as processing information; a target value acquisition unit that acquires a target value of the processing result; a reference command value calculation unit that calculates a command value of an operation command of the laser processing apparatus based on the acquired target value as a reference command value; a correction amount determination unit that determines a correction amount of the laser based on the acquired processing information and the acquired target value; a correction command value determination unit that determines a correction command value obtained by correcting the reference command value based on the calculated reference command value and the determined correction amount; and an execution control unit that causes the irradiation of the laser by the laser processing apparatus to be executed based on the determined correction command value.

[0013] (2) In addition, this disclosure relates to a control system comprising: the control device described in (1) above; and a sensor that outputs the processing result obtained by the laser processing device for the workpiece as processing information.

[0014] (3) In addition, this disclosure relates to a recording medium containing a program that enables a computer to function as a control device for controlling the operation of a laser processing apparatus capable of changing the irradiation angle of a laser irradiating a workpiece. The program enables the computer to function as the following units: a processing information acquisition unit that acquires processing results for the workpiece obtained by irradiating the workpiece with the laser as processing information; a target value acquisition unit that acquires a target value of the processing result; a reference command value calculation unit that calculates a command value of the operation command of the laser processing apparatus based on the acquired target value as a reference command value; a correction amount determination unit that determines a correction amount of the laser based on the acquired processing information and the acquired target value; a correction command value determination unit that determines a correction command value obtained by correcting the reference command value based on the calculated reference command value and the determined correction amount; and an execution control unit that causes the irradiation of the laser by the laser processing apparatus to be executed based on the determined correction command value.

[0015] The effects of the invention

[0016] According to this disclosure, a control device, a control system, and a recording medium containing a program can be provided that can correct the laser irradiation conditions using actual processing conditions. Attached Figure Description

[0017] Figure 1 This is a schematic structural diagram showing a three-dimensional galvanometer scanner controlled by a control system according to one embodiment of the present disclosure.

[0018] Figure 2 It is a schematic plan view showing the processing result of a workpiece processed by a control system according to one embodiment.

[0019] Figure 3 This is a schematic diagram illustrating the structure of a control system according to one embodiment.

[0020] Figure 4 This is a block diagram illustrating a control device according to one embodiment.

[0021] Figure 5 This is a schematic structural diagram showing the structure of the sensor in the modified example.

[0022] Figure 6 This is a schematic cross-sectional view showing the machining result obtained by machining the workpiece in the modified example.

[0023] Figure 7 It is a graph showing the difference between the measured value and the target value of the processing result in the modified example.

[0024] Figure 8 This is a schematic diagram showing the relationship between the processing result and the weld width in the modified example.

[0025] Explanation of reference numerals in the attached figures

[0026] 1: Control device; 2: Laser processing device; 3: Sensor; 11: Processing information acquisition unit; 13: Target value acquisition unit; 14: Reference command value calculation unit; 15: Correction amount determination unit; 16: Correction command value determination unit; 17: Execution control unit; 20: Focusing lens; 100: Control system; L: Laser; W: Workpiece. Detailed Implementation

[0027] Below, refer to Figures 1 to 4 To illustrate one embodiment of the present disclosure, we will describe the control device 1, the control system 100, and the program involved.

[0028] Before describing the control device 1, control system 100, and program of each embodiment, the laser processing apparatus 2 controlled by the control device 1, control system 100, and program will be described first.

[0029] Laser processing device 2 is, for example, a galvanometer scanner. Figure 1 As shown, the laser processing apparatus 2 includes: a focusing lens 20 capable of adjusting the focal point of a laser L from a laser source P; two mirrors 21 and 22 that sequentially reflect the laser L passing through the focusing lens 20; two motors 23 and 24 that drive the mirrors 21 and 22 to rotate around their respective rotation axes X1 and X2; and a focusing lens 25 that converges the laser L. These components—the focusing lens 20, mirrors 21 and 22, motors 23 and 24, and focusing lens 25—constitute the emission section 200.

[0030] The focusing lens 20 is configured to move between the laser source P and the mirror 21. The focusing lens 20 can change its focal length by moving between the laser source P and the mirror 21. The focusing lens 20 can change the beam diameter of the laser L irradiating the workpiece W by changing its focal length.

[0031] Mirrors 21 and 22 are configured to rotate about two mutually orthogonal rotation axes X1 and X2. Motors 23 and 24, for example, are servo motors that drive mirrors 21 and 22 to rotate, thereby scanning the laser L emitted from the laser source P.

[0032] like Figure 1 As shown, the laser L from the laser source P is reflected sequentially at two mirrors 21 and 22 after passing through the focusing lens 20. The laser L is then focused by the condenser lens 25 and directed towards the workpiece W. If motors 23 and 24 drive the two mirrors 21 and 22 to rotate, the incident angle of the laser L incident on these mirrors 21 and 22 changes continuously. As a result, the laser L, sequentially reflected by mirrors 21 and 22 and reaching the workpiece W, scans along a predetermined scanning path on the workpiece W. Thus, as... Figure 2 As shown, a groove with a specified cutting width and depth is formed on the workpiece as a machining path.

[0033] Furthermore, the laser L from the laser source P irradiates the workpiece from the optical axis S of the condenser lens 25 at an irradiation angle θ, depending on the irradiation position. The larger the irradiation angle θ, the closer the diameter of the laser beam L irradiating the workpiece is to an ellipse relative to a perfect circle. Additionally, in the laser processing apparatus 2, the distance from the exit port to the irradiation surface of the workpiece W is relatively long. Furthermore, in the laser processing apparatus 2, the laser L can be irradiated freely within its irradiation range. Therefore, in the laser processing apparatus 2, it is difficult to perform high-precision processing such as the conventional gap control. Therefore, the control device 1, control system 100, and program according to this embodiment suppress deviations in the processing results by correcting the processing conditions based on the actual processing results.

[0034] Next, the control device 1, the control system 100, and the program involved in this embodiment will be described.

[0035] like Figure 3 As shown, the control system 100 includes a laser processing device 2, a sensor 3, and a control device 1.

[0036] The laser processing apparatus 2 is a device capable of irradiating a workpiece W with a laser L. The laser processing apparatus 2 irradiates the workpiece with the laser L from the optical axis S of the focusing lens 25 at an irradiation angle θ. A three-dimensional galvanometer scanner is capable of, for example, cutting and welding the workpiece W. In this embodiment, as an example, the laser processing apparatus 2 for cutting the workpiece W will be described.

[0037] Sensor 3 is, for example, a ranging sensor. Sensor 3 quantifies and outputs the processing result within the processing area R, including the irradiation position of laser L. Sensor 3, for example, quantifies and outputs the ranging result of the area melted by laser irradiation (near the irradiation position) as the processing result. Sensor 3 can output, for example... Figure 2 The physical quantity representing the cutting width of the groove shown. Additionally, sensor 3 can output, for example... Figure 2 The depth of the groove shown is a physical quantity. Furthermore, here, "near the irradiation position" refers to the location of the workpiece W, including the irradiation position, where processing is currently being performed by laser L.

[0038] Control device 1 controls the operation of laser processing device 2, and laser processing device 2 can change the irradiation angle θ of the laser L irradiating the workpiece W. For example... Figure 4 As shown, the control device 1 includes a processing information acquisition unit 11, a target value storage unit 12, a target value acquisition unit 13, a reference command value calculation unit 14, a correction amount determination unit 15, a correction command value determination unit 16, and an execution control unit 17.

[0039] The machining information acquisition unit 11 is implemented, for example, by a CPU. The machining information acquisition unit 11 acquires the machining result of the workpiece W obtained by irradiating the workpiece W with laser L as machining information. For example, the machining information acquisition unit 11 acquires the cutting width and depth of the groove as machining information.

[0040] The target value storage unit 12 is a secondary recording medium such as a hard disk. The target value storage unit 12 stores the target value of the processing result. For example, the target value storage unit 12 stores the values ​​of cutting position, cutting width, cutting amount, etc. on the workpiece W as target values.

[0041] The target value acquisition unit 13 is implemented, for example, by the CPU. The target value acquisition unit 13 acquires the target value of the processing result. For example, the target value acquisition unit 13 acquires the target value by reading the target value stored in the target value storage unit 12.

[0042] The reference command value calculation unit 14 is implemented, for example, by the CPU. Based on the acquired target value, the reference command value calculation unit 14 calculates the command value of the operation command of the laser processing device 2 as a reference command value. The reference command value calculation unit 14 analyzes the target value as a processing program, for example. Based on the processing program, the reference command value calculation unit 14 calculates the energy density of the laser L, the acceleration / deceleration of the motors 23 and 24, the focal length, etc., as reference command values.

[0043] The correction amount determination unit 15 is implemented, for example, by a CPU. The correction amount determination unit 15 determines the correction amount for the laser L based on the acquired processing information and the acquired target value. The correction amount determination unit 15 calculates, for example, the difference between the processing information and the target value. Based on this difference, the correction amount determination unit 15 determines the correction amount for the energy density of the laser L, the acceleration / deceleration of the motors 23 and 24, the focal length (the amount of movement of the focusing lens 20), etc. Furthermore, the correction amount determination unit 15 sets the correction direction (movement direction) based on the current position as Sz, the transformation coefficient (mechanical position movement amount) as Cz, the weight between data as Wi, the target value as ai, the processing information as mi (e.g., cutting width), and determines the correction amount ΔZ as the result of the calculation of the following equation 1.

[0044] [Formula 1]

[0045]

[0046] The correction command value determination unit 16 is implemented, for example, by the CPU. Based on the calculated reference command value and the determined correction amount, the correction command value determination unit 16 determines the correction command value obtained by correcting the reference command value. For example, the correction command value determination unit 16 determines the correction command value as the sum of the reference command value and the correction amount. The correction command value determination unit 16 sets the correction direction to SL, the transformation coefficient to α, and determines the correction command value Δ (laser command) as the result of the following equation 2.

[0047] [Formula 2]

[0048] Δ(laser command) = s L ×α×ΔZ

[0049] The execution control unit 17 is implemented, for example, by a CPU. The execution control unit 17 causes the laser processing apparatus 2 to be irradiated with laser based on a determined correction value. For example, the execution control unit 17 causes the laser processing apparatus 2 to operate with the determined correction command value.

[0050] Next, the operation of the control system 100 and the control device 1 will be explained.

[0051] First, the target value acquisition unit 13 acquires the target value from the target value storage unit 12. The reference command value calculation unit 14 calculates the reference command value based on the target value. At this stage, the laser L is not irradiated onto the workpiece, so the sensor 3 does not output processing results (processing information). Therefore, the correction amount determination unit 15 determines the correction amount to be 0. Consequently, the correction command value determination unit 16 determines only the reference command value as the correction command value. The execution control unit 17 causes the laser processing apparatus 2 to irradiate the workpiece with the determined correction command value.

[0052] When laser L is applied, sensor 3 begins to output processing information. The correction amount determination unit 15 calculates the difference between the processing information and the target value. The correction amount determination unit 15 converts this difference into the energy density of laser L, the acceleration / deceleration of motors 23 and 24, focal length, etc. The correction amount determination unit 15 determines the converted value as the correction amount.

[0053] The correction command value determination unit 16 determines the correction command value by summing the reference command value and the correction amount. For example, the correction command value determination unit 16 determines the correction command value based on factors such as correcting the heat input at the opposing irradiation position to bring it close to a constant value, the energy density of the laser L, the acceleration / deceleration of the motors 23 and 24, and the focal length (the moving distance of the focusing lens 20). The execution control unit 17 controls the execution of laser irradiation of the laser processing apparatus 2 based on the correction command value.

[0054] Next, the procedures involved in this embodiment will be explained.

[0055] The various structures included in the control device 1 can be implemented individually by hardware, software, or a combination thereof. Here, implementation by software means implementation by having a computer read in a program and execute that program.

[0056] Programs can be stored and provided to a computer using various types of non-transitory computer-readable media. Non-transitory computer-readable media include tangible storage media of various types. Examples of non-transitory computer-readable media include magnetic recording media (e.g., floppy disks, magnetic tapes, hard disk drives), magneto-optical recording media (e.g., magneto-optical disks), CD-ROMs (Read Only Memory), CD-Rs, CD-R / Ws, and semiconductor memories (e.g., mask ROMs, PROMs (Programmable ROMs), EPROMs (Erasable PROMs), flash ROMs, and RAMs (Random Access Memory)). Alternatively, display programs can also be provided to a computer using various types of transient computer-readable media. Examples of transient computer-readable media include electrical signals, optical signals, and electromagnetic waves. Transient computer-readable media provide programs to a computer via wired communication paths such as wires and optical fibers, or via wireless communication paths.

[0057] The control system 100, control device 1, and program described above in this embodiment achieve the following effects.

[0058] (1) A control device 1 controls the operation of a laser processing apparatus 2, wherein the laser processing apparatus 2 can change the irradiation angle of a laser L irradiating a workpiece W. The control device 1 includes: a processing information acquisition unit 11, which acquires the processing result of the workpiece obtained by irradiating it with a laser as processing information; a target value acquisition unit 13, which acquires the target value of the processing result; a reference command value calculation unit 14, which calculates the command value of the operation command of the laser processing apparatus 2 based on the acquired target value as a reference command value; a correction amount determination unit 15, which determines the correction amount of the laser based on the acquired processing information and the acquired target value; a correction command value determination unit 16, which determines the correction command value obtained by correcting the reference command value based on the calculated reference command value and the determined correction amount; and an execution control unit 17, which executes the irradiation of the laser by the laser processing apparatus 2 based on the determined correction command value. Thus, the irradiation conditions of the laser L can be corrected using the actual processing conditions. Therefore, the amount of heat input to the irradiation position can be made closer to constant, thereby stabilizing the processing conditions.

[0059] (2) The processing information acquisition unit 11 acquires processing information from the sensor 3, which quantifies and outputs the processing results within the processing area, including the laser irradiation position. This allows for feedback control of the laser L irradiation conditions based on the actual processing conditions. Consequently, it enables flexible responses to unexpected irradiation conditions. For example, it allows for flexible responses even if the surface of the workpiece W has unexpected deviations (unevenness).

[0060] (3) The reference command value calculation unit 14 calculates a reference command value including information on the angles of the mirrors 21 and 22 used to change the irradiation direction of the laser L, the position of the focusing lens 20 used to change the focal length of the laser L, and the energy density of the laser L. The correction amount determination unit 15 determines the angles of the mirrors 21 and 22 used to change the irradiation direction of the laser, the position of the focusing lens 20 used to change the focal length of the laser L, and the energy density of the laser L. The correction command value determination unit 16 determines the correction command value for the angles of the mirrors 21 and 22 used to change the irradiation direction of the laser L, the position of the focusing lens 20 used to change the focal length of the laser L, and the energy density of the laser L. Thus, the amount of heat input to the irradiation position can be flexibly changed.

[0061] The above describes a preferred embodiment of the control system, control device, and program of this disclosure. However, this disclosure is not limited to the above embodiment and appropriate modifications can be made.

[0062] For example, in the above embodiment, sensor 3 can also be configured as a coaxial sensor of the laser L of the laser processing apparatus 2. That is, for the ranging light LS irradiating the processing surface of the workpiece W, sensor 3 can also cause the emitted light from the light source PS to be reflected at the mirror 31 on the sensor side and then reflected at the mirrors 21 and 22 of the laser processing apparatus 2 before irradiating the processing area of ​​the workpiece W. In addition, sensor 3 can also cause the ranging light LS reflected at the mirrors 21 and 22 of the laser processing apparatus 2 to be reflected at the mirror 31 on the sensor side and then received by the light receiving unit 32. Furthermore, the angle of the mirror 31 on the sensor side can be freely changed as long as it can irradiate the ranging light LS onto the mirrors 21 and 22 of the laser processing apparatus 2.

[0063] Furthermore, in the above embodiments, the processing is not limited to cutting, but can also be welding. In the case where the processing is welding, such as... Figure 6 and Figure 7 As shown, sensor 3 measures the depth of the main hole diameter (perforation diameter) based on the surface height R1 before machining in the welding direction and the hole height R2 of the workpiece W during welding (melting). The calibration determination unit 15 determines a calibration value so that the difference between the measured value and the target value is close to zero. Alternatively, sensor 3 can also be configured as follows... Figure 8As shown, the width of the weld bead B formed by welding is used to determine the correction amount in the same way as the depth of the groove.

[0064] Furthermore, in the above embodiments, the laser processing apparatus 2 is not limited to a three-dimensional galvanometer scanner.

[0065] Furthermore, in the above embodiments, the sensor is not limited to a ranging sensor. The sensor may also be, for example, a range sensor. Additionally, the sensor may output a camera image including the processing position of the laser L as a processing result. The control device 1 may also include, for example, a processing result calculation unit (not shown) that calculates the width and height of the groove based on the output camera image.

[0066] Furthermore, in the above embodiment, the correction amount determination unit 15 can also determine the correction amount of laser L based on the processing content performed by the laser processing apparatus 2, and on the weighted processing information and target value. For example, when welding is performed by the laser processing apparatus 2, the value of the cutting width included in the acquired processing information is not necessary when determining the correction amount. Therefore, the correction amount determination unit 15 sets the weight of the cutting width included in the processing information to 0 (invalidates it), and determines the correction amount of laser L based on the weighted processing information and target value. In addition, the correction amount determination unit 15 can also obtain the processing content from the processing content setting unit (not shown), which is provided separately from the control device 1. In addition, the target value acquisition unit 13 can also read the target value from the target value storage unit 12 based on the processing content set by the processing content setting unit. Here, the processing content setting unit can also be an input device such as a keyboard. In addition, the processing content setting unit can also obtain the processing content set by the processing program used to process the workpiece W. In addition, the processing content setting unit can also set the parameters of the weight to be applied to the processing information based on the processing content.

Claims

1. A control device for controlling the operation of a laser processing apparatus using a galvanometer scanner, the laser processing apparatus being capable of changing the irradiation angle of a laser beam irradiating a workpiece, the control device comprising: The processing information acquisition unit acquires the processing result of the workpiece obtained by irradiating the workpiece with the laser as processing information; The target value acquisition unit acquires the target value of the processing result; The reference command value calculation unit calculates the command value of the action command of the laser processing device as the reference command value based on the acquired target value. The correction amount determination unit determines the correction amount of the laser based on the acquired processing information and the acquired target value; The correction command value determination unit determines the correction command value obtained by correcting the reference command value based on the calculated reference command value and the determined correction amount. as well as The execution control unit causes the laser irradiation of the laser processing apparatus to be executed based on the determined correction command value. The reference command value calculation unit calculates a reference command value that includes information on the angles of the two mirrors used to change the irradiation direction of the laser, the position of the focusing lens used to change the focal length of the laser, and the energy density of the laser. The two mirrors are rotated about their respective axes by two motors, sequentially reflecting the laser light that has passed through the focusing lens. The correction amount determination unit determines the angles of the two mirrors used to change the irradiation direction of the laser, the position of the focusing lens used to change the focal length of the laser, and the correction amount of the laser's energy density by calculating the result of Equation 1 based on the difference between the processing information and the target value, setting the correction direction based on the current position as Sz, the transformation coefficient as Cz, the weight between data as Wi, the target value as ai, and the processing information as mi. [Formula 1] The correction command value determination unit determines the angles of the two mirrors used to change the irradiation direction of the laser, the position of the focusing lens used to change the focal length of the laser, and the correction command value for the energy density of the laser. The control device is configured to suppress deviations in the processing result, wherein the deviations in the processing result are caused by the deformation of the laser beam diameter at the irradiation position relative to a perfect circle when the laser irradiation position deviates from the position facing the exit port of the laser processing device, or when the cross-section of the workpiece has a curved shape.

2. The control device according to claim 1, wherein, The processing information acquisition unit acquires processing information from the sensor, which is used to quantify and output the processing results within the processing area including the irradiation position of the laser.

3. The control device according to claim 1 or 2, wherein, The laser processing device is a three-dimensional galvanometer scanner.

4. A control system comprising: The control device according to any one of claims 1 to 3; and The sensor outputs the processing results obtained by the laser processing device for the workpiece as processing information.

5. A recording medium containing a program for enabling a computer to function as a control device for controlling the operation of a laser processing apparatus using a galvanometer scanner, the laser processing apparatus being capable of changing the angle of the laser beam irradiating the workpiece. The program enables the computer to function as the following components: The processing information acquisition unit acquires the processing result of the workpiece obtained by irradiating the workpiece with the laser as processing information; The target value acquisition unit acquires the target value of the processing result; The reference command value calculation unit calculates the command value of the action command of the laser processing device as the reference command value based on the acquired target value. The correction amount determination unit determines the correction amount of the laser based on the acquired processing information and the acquired target value; The correction command value determination unit determines the correction command value obtained by correcting the reference command value based on the calculated reference command value and the determined correction amount. as well as The execution control unit causes the laser irradiation of the laser processing apparatus to be executed based on the determined correction command value. The reference command value calculation unit calculates a reference command value that includes information on the angles of the two mirrors used to change the irradiation direction of the laser, the position of the focusing lens used to change the focal length of the laser, and the energy density of the laser. The two mirrors are rotated about their respective axes by two motors, sequentially reflecting the laser light that has passed through the focusing lens. The correction amount determination unit determines the angles of the two mirrors used to change the irradiation direction of the laser, the position of the focusing lens used to change the focal length of the laser, and the correction amount of the laser's energy density by calculating the result of Equation 1 based on the difference between the processing information and the target value, setting the correction direction based on the current position as Sz, the transformation coefficient as Cz, the weight between data as Wi, the target value as ai, and the processing information as mi. [Formula 1] The correction command value determination unit determines the angles of the two mirrors used to change the irradiation direction of the laser, the position of the focusing lens used to change the focal length of the laser, and the correction command value for the energy density of the laser. The program is configured to suppress deviations in the processing results, wherein the deviations in the processing results are caused by deviations in the laser irradiation position relative to the position facing the exit port of the laser processing device, or by deformation of the laser beam diameter relative to a perfect circle in the case where the cross-section of the workpiece has a curved shape.

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