Electronic module and method for manufacturing an electronic module

Abstract

The invention relates to an electronic module having: a circuit board; a first structural element arranged on the assembly side of the circuit board and in electrical contact with the assembly side; at least one contact body arranged with its circuit board-side end on the assembly side of the circuit board; an electrically insulating protective material to be processed in a liquid state and then capable of age hardening, which covers the assembly side of the circuit board such that the first structural element is embedded in the protective material and the contact body is surrounded laterally by the protective material and the end of the contact body remote from the circuit board projects from the protective material; a second structural element with a plastic body having at least one recess in which a metal insert is arranged; and a soldered connection between the insert and the contact body. According to the invention, it is proposed that both the contact body and the metal insert are only used for mechanically fixing the second structural element on the circuit board and are not electrically connected to the electronic circuits provided on the circuit board and the electrical functional elements of the second structural element. In addition, a manufacturing method for such an electronic module is described.

Description

Field of the Invention

[0001] The present invention relates to an electronic module which can be used in particular to implement a controller, such as a transmission controller in a motor vehicle, for example, and a method for manufacturing an electronic module. Background Art

[0002] Electronic modules are used to construct switching circuits in which different electrical and / or electronic structural elements are connected to each other. With the help of the thus-connected structural elements, the electronic module can provide specific functions.

[0003] For example, an electronic module in the form of a transmission control module is used to control the functions of a transmission in a motor vehicle. In addition to simple structural elements such as resistors, capacitors, inductive coils, etc., or more complex structural elements such as integrated circuits (ICs) or application-specific integrated circuits (ASICs), this electronic module can also have sensors to measure, for example, the state inside the transmission to be controlled or the state in the surroundings, and / or have plugs to be able to electrically connect the electronic module or its components to an external switching circuit, for example. The structural elements can be arranged on a circuit board here.

[0004] The sensitive structural elements of the electronic module should be protected against damage caused by mechanical loads and against damage caused by the erosion of chemically aggressive substances. For this purpose, the structural elements can be wrapped, for example, in a protective material that covers the surface of the circuit board carrying the structural elements. The protective material can be made of plastic, such as a thermosetting plastic, in particular a polymer, such as epoxy resin.

[0005] In order to be able to make electrical contact with the circuit board, for example, to be able to electrically connect additional structural elements and / or mating plugs on the circuit board, contact pins can be provided on the circuit board, which protrude through the protective layer made of the protective material covering the circuit board.

[0006] DE 102015214311 A1 describes an electronic module with structural elements that can be flexibly placed on a base element and a method for manufacturing the electronic module. DE 102016209488 A1 describes another electronic module with a clamping connection for a transmission controller.

[0007] An electronic module is known from DE 102017210176 A1, which has a circuit board. A first structural element is arranged on the mounting side of the circuit board and is in electrical contact with the mounting side. Furthermore, at least one contact body is provided, and the at least one contact body is arranged with its circuit board-side end on the mounting side of the circuit board. An electrically insulating protective material to be subjected to a liquid removal process and then capable of age hardening covers the mounting side of the circuit board such that the first structural element is embedded in the protective material and the contact body is surrounded by the protective material on the side and the end of the contact body remote from the circuit board projects from the protective material. A second structural element is provided with a plastic body having at least one recess in which a metallic insert is arranged.

[0008] In DE 102017210176 A1, the insert is welded to the contact body, wherein the welded connection is intended to establish an electrical connection between the circuit board and the second structural element. For this purpose, the contact body is electrically connected via the conductor circuit of the circuit board to an electronic circuit provided on the circuit board and the metallic insert is electrically connected to an electrical functional part of the second structural element. The functional part of the second structural element is electrically connected to the electronic circuit on the circuit board via the welded connection between the contact body and the insert. Summary of the Invention

[0009] The invention provides that in an electronic module of the type defined at the beginning, contact bodies and metallic inserts are provided which are only used for mechanically fixing the second structural element to the circuit board, wherein neither the contact bodies nor the inserts are electrically connected to an electronic circuit provided on the circuit board and to the electrical functional parts of the second structural element. Furthermore, the invention relates to a method for manufacturing such an electronic module.

[0010] The invention is based on the following considerations: In order to manufacture an electronic module of the type defined, the circuit board together with the electronic circuit provided thereon and the second structural element must be manufactured by separate manufacturing methods and then connected to each other, and the second structural element can be, for example, a sensor, a plug or an electronic sub-module for controlling an electrical component. For the electrical contact between the second structural element and the circuit board, it is advantageous to use proven and tested methods such as soldering and welding, wherein in principle signal interruptions and resistance changes in the region of the electrical contact during operation of the electronic module must be avoided. This can be achieved by a separate mechanical fixing part which is carried out independently of the electrical connection of the components.

[0011] A feasible solution studied in the preliminary tests, for example, lies in arranging a retaining strip made of plastic on the circuit board, wherein the retaining strip is connected to the plastic body of the second structural element by means of plastic rivets. However, an additional process is required for this, because the plastic rivets cannot be established in the same process as the electrical soldering or welding connection between the second structural element and the circuit board.

[0012] Advantageously, by providing not only contact bodies but also metal inserts only for mechanically fixing the second structural element to the circuit board, it is possible to establish a mechanical connection between the second structural element and the circuit board by means of an inexpensive soldering method. The electrical contact can be achieved at other locations by other or similar means. This can also include, for example, an additional soldering connection between the electrical contact pins on the circuit board and other electrical inserts on the second structural element. The contact bodies and metal inserts for mechanical fixation are not electrically connected to the electronic circuits provided on the circuit board and the electrical functional components of the second structural element. Therefore, the contact bodies and metal inserts can be optimally designed in terms of mechanical strength.

[0013] The mechanical connection between the second structural element and the circuit board can advantageously be established at low cost by a soldering method, especially a laser soldering method, because the soldering connection has higher strength than the plastic rivet connection.

[0014] In particular, it is possible to provide a large number of contact bodies on the circuit board, and a large number of metal inserts are assigned to the large number of contact bodies. Multiple second structural elements can be provided with multiple metal inserts, and each of the multiple metal inserts is assigned a contact body on the circuit board. A favorable embodiment, for example, has two metal inserts on the second structural element, and the two metal inserts on the second structural element are fixed to two contact bodies on the circuit board. In addition, each second structural element can also have a large number of electrical connection conductors. An electrical contact pin on the circuit board can be assigned to each electrical connection conductor.

[0015] Advantageous designs and improvements of the present invention can be achieved by the features described below.

[0016] Particularly advantageously, at least one electrical contact pin is provided, which electrically contacts the assembly side of the circuit board with its circuit board-side end, wherein the at least one contact pin is surrounded by a protective material on the side and the end of the contact pin remote from the circuit board projects out of the protective material. The second structural element can have an electrical connecting conductor assigned to the at least one contact pin and embedded in a plastic body, wherein the plastic body has a recess, the electrical connecting conductor being exposed at the recess, and wherein the connecting conductor exposed in the recess is soldered to the end of the electrical contact pin remote from the circuit board. With this design, it can be advantageously achieved that the electrical connection between the second structural element and the circuit board can be realized with the same technology as the mechanical connection of the second structural element to the circuit board. Thereby, the electronic module can be manufactured particularly inexpensively.

[0017] Furthermore advantageously, the electrical connecting conductor has an elastically deflectable region. Since the mechanical fixation between the contact body and the metal insert is very stable, different expansions of the second structural element and the circuit board under temperature cycling loads cause thermal stresses, which act on the electrical connection location. Therefore, it is advantageous that the at least one electrical connecting conductor is provided with an elastically deflectable region, which prevents the thermal stresses from being transmitted to the electrical connection location.

[0018] As an alternative or in addition, the metal insert can be arranged at the plastic body by means of an elastically deflectable connection region. The elastically deflectable connection region preferably has its elasticity along a direction parallel to the assembly side of the circuit board, while the following embodiment is also possible, which, for example, has no elasticity along a direction perpendicular to the assembly side.

[0019] The circuit board together with the structural elements assembled thereon can be protected against damage caused by chemically aggressive media and / or external mechanical influences by means of a protective material deposited thereon in a wrapping manner. The contact body and the contact pin can pass through the protective material from the assembly side of the circuit board, such that the contact body and the contact pin are accessible from the outside.

[0020] The contact body and the contact pin can be placed on the assembly side of the circuit board before applying the protective material. For this purpose, the contact pin may have a widened foot, which can be soldered planar to the contact surface on the assembly side.

[0021] Subsequently, the protective material can be applied such that the protective material covers a first structural element that is to be protected and that is capable of forming an electronic circuit and laterally adjoins or surrounds the contact body and the contact pin at the sides, wherein the ends of the contact body and the contact pin that are remote from the circuit board project outwards beyond the protective material accordingly and are thus freely accessible. The protective material can surround the contact body and the contact pin such that the protective material directly contacts the contact body and the contact pin at the sides or is spaced apart from the contact body and the contact pin by a gap at the sides. Thus, if a holding strip is provided, then, for example, the contact pin cannot be directly contacted by the protective material because the protective material is spaced apart from the contact pin by the holding strip in this case. However, even in this case, the contact pin is surrounded by the protective material at the sides. It is also possible, however, for the protective material to penetrate into the holding strip and be in direct contact with the contact pin at the sides.

[0022] The protective material can then be age-hardened. For this purpose, the circuit board together with the protective material is mostly placed in a furnace, for example a through-furnace, in order to be able to age-harden the protective material at an elevated temperature. The circuit board together with the protective material can have a small structural height in this case, such that the furnace used can be designed as space-saving as possible. The circuit board is to be accommodated in a volume space for heating in the furnace, and the volume space can in particular be flat. The protective material can be applied as a so-called HCD (Hard Cover Dispense) according to the dam-fill method. For this purpose, a surrounding dam made of a highly viscous material is applied to the assembly side and then a flowable filler is filled into the region surrounded by the dam. Age-hardening is then carried out in a furnace. After the protective material has been age-hardened, a second structural element can be arranged at the exposed ends of the contact body and the contact pin that are remote from the circuit board. The electrical connection conductors of the second structural element can be electrically connected to the ends of the contact pin, for example, by soldering, clamping or preferably welding.

[0023] The second structural element can be, for example, a sensor that projects from the circuit board in order to be able to locally measure physical parameters. As an alternative, the second structural element can be, for example, a plug that can be contacted from the outside in order to be able to establish, for example, an electrical connection to an external sensor or another switching circuit. The second structural element can have a structural height that is similar to or greater than that of the circuit board together with the protective material applied thereto. The second structural element can be connected to the ends of the contact body and the contact pin that are remote from the circuit board at a later time, that is to say after the circuit board has been provided with the protective material and the protective material has been age-hardened.

[0024] The second structural element has a plastic body which can act mechanically together with a holding strip arranged on a circuit board in order to fix the second structural element to the holding strip.

[0025] Furthermore, the electronic module can have a chip protection cover which covers the region of the contact pins remote from the circuit board. The chip protection cover can in particular cover the region of the contact pins which would be exposed without the chip protection cover and at which, for example, electrically conductive metal chips could come into contact with the contact pins and short-circuit them with one another. Description of the Drawings

[0026] In the drawings:

[0027] Figure 1 A cross-sectional view through the electronic module serving for the illustration of the perspective is shown;

[0028] Figure 2 A partial cross-section through the electronic module according to the invention is shown;

[0029] Figure 2a A partial cross-section in the case of removal of the chip protection cover during the manufacture of the electronic module is shown Figure 2 in;

[0030] Figure 3a and 3b An embodiment of the second structural element is shown;

[0031] Figure 4a Another embodiment of the second structural element is shown;

[0032] Figure 4b A sectional cross-section along line A-A through Figure 4a is shown;

[0033] Figure 5 Another embodiment of the second structural element is shown.

[0034] The drawings are merely schematic and not to scale. Identical reference signs in the drawings denote identical or functionally identical features. Detailed Description

[0035] Figure 1A cross-sectional view through the electronic module 1 is shown. The electronic module 1 can for example have: a controller with electrical components for signal processing, power electronics, and discrete components such as sensors for detecting position and rotational speed, an electrical interface in the form of a plug connection for example, and at least one plug connection for connecting to a vehicle cable harness. The electronic module 1 can be used in transmission oil and be subjected to high temperatures there (for example -40... +150 °C). Therefore, the design of the control module should meet different requirements, such as for example contributing to avoiding chemical corrosion due to the aggressive oil and having good temperature and vibration resistance and preventing short circuits due to metal chips. The position of the discrete components is mostly predefined by the design of the transmission mechanism. Usually, this position is outside the plane of the controller. Electrical conductors are required for electrical connection to the controller. The electrical conductors can for example be cables, punched grids, or flexible films. However, embodiments of the present invention can also be used in other electronic modules, especially other controllers.

[0036] The electronic module 1 includes a circuit board 3, on the assembly side 7 of which one or preferably a plurality of electronic first structural elements 5 are arranged. The structural elements 5 can be electrically connected to a conductive structure (not explicitly shown), such as a conductor circuit on the circuit board 3 for example, and form an electronic circuit 50. These conductor circuits of the circuit board 3 can in turn be conductively connected to electrical contact pins 9. Electrical contact of a second structural element 19 can be achieved by means of the electrical contact pins 9.

[0037] The contact pins 9 can for example be arranged in a holding strip 17, which mechanically holds the contact pins 9 and positions them closely adjacent to each other. The contact pins 9 can be significantly longer than their diameter and significantly longer than the spacing between the nearest adjacent contact pins 9. Preferably, the contact pins 9 can be received in the holding strip 17 with parallel orientation to each other. The holding strip 17 can be a simple plastic component. For example, a plurality of contact pins 9 can be extrusion-encapsulated with electrically insulating plastic by injection molding.

[0038] When assembling the electronic module 1, a plurality of contact pins 9 can be jointly installed in such a way that they are received in the holding strip 17 by arranging the holding strip 17 on the assembly side 7 of the circuit board 3 and then electrically connecting, especially soldering together, the circuit board-side ends 13 of the contact pins 9 to the respective contact surfaces on the circuit board 3.

[0039] In order to protect the first structural element 5, in particular against corrosion caused by chemically aggressive media such as transmission oil, during the manufacture of the electronic module 1, after the structural element 5 and the holding strip 17 together with the contact pins 9 are arranged on the assembly side 7, the assembly side 7 is covered with a polymeric protective material 11. The protective material 11 covers the first structural element 5 here and thereby encloses the first structural element 5. However, compared to the first structural element 5, the holding strip 17 has a greater height, which is in particular greater than the thickness of the protective layer formed by the protective material 11, such that the protective material 11 abuts against the circuit board side region of the holding strip 17, but the region of the holding strip 17 remote from the circuit projects upwards out of the protective material 11 and is thereby exposed. However, the holding strip 17 is not absolutely necessary. The protective material 11 can in particular have an epoxy resin.

[0040] The protective material 11 can be applied to the assembly side 7 by means of a so-called dam method. Here, as outlined in Figure 2 , first a dam 60 made of a highly viscous material surrounding the at least one first structural element 5 and / or the electronic circuit 50 is applied to the assembly side 7. Subsequently, the protective material 11, which consists of a flowable and age-hardening material, such as a low-viscosity epoxy resin, is filled into the region surrounded by the dam 60 until the first structural element 5 and / or the electronic circuit 50 is completely covered with the protective material 11.

[0041] Figure 2 shows a partial cross-section through a first embodiment of an electronic module according to the invention, in which the circuit board 3 is connected to a second structural element 19. The second structural element can for example be a sensor, a plug or a sub-module. The second structural element 19 can have Figure 3aThe electrical functional part 51 outlined in the figure. The electrical functional part 51 can be, for example, a sensor element, a plug receptacle of a plug part configured to accommodate a mating plug, an electronic circuit part, or other functional parts. The second structural element 19 has a plastic body 21, in which at least one metallic insert 42 is arranged. The metallic insert 42 is not electrically connected to the functional part 51. The metallic insert 42 can be configured, for example, as a blanking grid part, which is extrusion-encapsulated with the plastic of the plastic body 21 by an injection molding method. The plastic body 21 has a recess 43, in which the metallic insert 42 is exposed. The recess 43 can be configured, for example, as a through recess or an edge recess. The circuit board 3 is provided with a contact body 41, the circuit board-side end 44 of which is arranged on the assembly side 7 of the circuit board 3, for example, in such a way that the contact body 41 is soldered to the connection surface 47 of the circuit board 3. The contact body 41 can be made of metal and, for example, has a cylindrical housing. The connection surface 47 is not in electrical contact with the electronic circuit 50 of the circuit board 3.

[0042] In order to mechanically fix the second structural element 19 to the circuit board 3, the metallic insert 42 is welded to the end 45 of the contact body 41 remote from the circuit board. As can be seen, the contact body 41 and the metallic insert 42 are not electrically connected to the electronic circuit 50 provided on the circuit board 3 or the electrical functional part 51 of the second structural element 19 and are only provided for mechanically fixing the second structural element 19 to the circuit board 3.

[0043] The electrical contact part between the second structural element 19 and the circuit board 3 can be implemented in different ways. A particularly advantageous implementation is described below.

[0044] For this purpose, the circuit board 3 can be provided with at least one electrical contact pin 9, the circuit board-side end 13 of which is soldered to the contact surface 48 of the circuit board 3 as already described in Figure 1 The contact pin 9 projects with its end 15 remote from the circuit board from the protective material 11. At least one connection conductor 25 electrically connected to the functional part 51 projects from the plastic body 21 in the recess 46. This exposed section of the connection conductor 25 is welded to the end 15 of the contact pin 9 remote from the circuit board.

[0045] To prevent metal chips floating, for example, in the transmission mechanism oil from reaching the exposed ends of the contact pins 9 or the connecting conductors 25 and causing an electrical short circuit, a chip protection cover 23 is provided near the connection position between the retaining strip 17 and the mating strip 21. The chip protection cover 23 can cover the area of the contact pin 9 remote from the circuit board near the end 15 of the contact pin 9 remote from the circuit board, so that no metal chips can reach there. In a similar manner, the chip protection cover 23 can also cover the contact joint 25. The chip protection cover 23 can be made of an electrically insulating plastic material and can be, for example, a simple injection-molded component.

[0046] The retaining strip 17 can additionally be mounted on the circuit board. However, this is not necessarily mandatory. The contact pins 9 can be arranged, for example, in a similar manner as in Figure 1 in the retaining strip 17. The retaining strip 17 can be a simple plastic component and is provided with an opening 31 through which the contact pins 9 extend with a certain lateral clearance. The contact pins 9 are held on the remainder of the retaining strip 17 only by tabs 33. Thus, although the contact pins 9 are roughly positioned in the retaining strip 17, before the retaining strip 17 is mounted and the contact pins 9 are then soldered, for example, with their circuit board-side ends 13 to the assembly side 7 of the circuit board 3 with a contact surface 35, the contact pins 9 can still move slightly laterally. The plastic body 21 of the second structural element 21 can be placed flat on the retaining strip 17 as shown in Figure 2

[0047] The chip protection cover 23, the retaining strip 17, and the plastic body can be geometrically configured such that a labyrinth seal is formed at the transition regions between these components. Along this labyrinth seal, the path leading into the interior of the volume space covered by the chip protection cover 23 oscillates back and forth in a labyrinthine manner, so that no elongated metal chips can pass through. However, fluids, such as especially transmission mechanism oil, may be able to pass through this labyrinth seal.

[0048] Figure 3a and 3b A top view shows an embodiment of the second structural element. As can be seen in Figure 3a the second structural element 19 can, for example, have four connecting conductors 25 extending parallel to each other. The metallic insert 42 is arranged in the center of the plastic body 21. Below it is the metallic contact body 41. Figure 3b A similar embodiment with 12 connecting conductors 25 is shown. One electrical contact pin 9 is assigned to each connecting conductor 25.

[0049] Figure 4a ​Another embodiment of the second structural element 19 is shown. Figure 4b A partial cross-section along line A-A through Figure 4a is shown. In this embodiment, the electrical connection conductor 25 has an elastically deflectable region 25a. The elastically deflectable region 25a can for example be configured as a C-shaped or U-shaped bend. The elastically springy region 25a can compensate for thermal stresses that exist between the second structural element 19 and the circuit board 3. Two metallic inserts 41 extend into plastic recesses at the edge of the plastic body 21.

[0050] Figure 5 Another embodiment of the second structural element 19 is shown. In this embodiment, a plurality of connection conductors 25 are provided, which are arranged in a chamber and extend parallel to one another. Two metallic inserts 42 are arranged at the plastic body 21 by means of an elastically deflectable connection region 49. The elastically deflectable connection region 49 can for example include a plastic frame or a plastic fork. The elastically deflectable connection region 49 has a recess 43, in which the inserts 42 are correspondingly arranged. The inserts 42 are fixed at the connection region 49. The elastically deflectable connection region 49 allows the inserts 42 to elastically deflect relative to the plastic body 21 in the Figure 5 plane, that is parallel to the mounting side 7 of the circuit board 3.

[0051] FIG. 4 and Figure 5 the embodiments can of course also be combined in order to achieve a further better compensation with respect to thermal cyclic loads.

[0052] To be described with the aid of Figure 2a a favorable manufacturing method for an electronic module according to the invention.

[0053] For this purpose, a circuit board 3 is provided, which has the first structural element 5, which is arranged on the mounting side 7 of the circuit board 3 and is in electrical contact with the mounting side 7. The at least one contact body 41 has already been arranged with its circuit board-side end 44 on the mounting side 7 of the circuit board 3. The electrically insulating protective material 11 covers the mounting side 7 of the circuit board 3 in such a way that the first structural element 5 is enclosed in the protective material 11 and the contact body 41 is surrounded on the side by the protective material 11 and the end 45 of the contact body 41 remote from the circuit board projects from the protective material 11. In addition, the circuit board 3 can for example have at least one electrical contact pin 9, which is in electrical contact with the mounting side 7 of the circuit board 3 with its circuit board-side end 13, wherein the at least one contact pin 9 is surrounded on the side by the protective material 11 and the end 15 of the contact pin 9 remote from the circuit board projects from the protective material 11.

[0054] Furthermore, the second structural element 19 is provided. The second structural element 19 has a plastic body 21, the plastic body 21 having at least one recess 43, in which a metallic insert 42 is arranged. The second structural element 19 can have at least one electrical connection conductor 25 embedded in the plastic body 21, wherein the plastic matrix 21 has a recess 46 at which the electrical connection conductor 25 is exposed.

[0055] The second structural element 19 is arranged on the circuit board 3 such that the contact body 41 penetrates into the recess 43 until the metallic insert 42 is seated on the end 45 of the contact body 41 remote from the circuit board and the connection conductor 25 is seated on the end 15 of the contact pin 9 remote from the circuit board. Subsequently, in the same method step in a soldering device, the insert 42 can be soldered to the contact body 41, for example by means of a laser beam input 102, and the connection conductor 25 can be soldered to the contact pin 9 by means of a laser beam input 101. Finally, the chip protection cover 23 can be installed.

Claims

1. An electronic module (1), comprising: A circuit board (3); A first structural element (5), which is arranged on the assembly side (7) of the circuit board (3) and is in electrical contact with the assembly side (7); At least one contact body (41), the at least one contact body (41) having a circuit board-side end (44) arranged on the assembly side (7) of the circuit board (3); An electrically insulating protective material (11), which is to be processed in a liquid state and can then age-harden, and the protective material (11) covers the assembly side (7) of the circuit board (3) such that the first structural element (5) is encapsulated in the protective material (11) and the contact body (41) is surrounded by the protective material (11) on the side and the end (45) of the contact body (41) remote from the circuit board projects out of the protective material (11); A second structural element (19) with a plastic body (21), the plastic body (21) having at least one recess (43) in which a metallic insert (42) is arranged; and A soldered connection between the insert (42) and the contact body (41), characterized in that Not only the contact body (41) but also the metallic insert (42) are only provided for mechanically fixing the second structural element (19) to the circuit board (3) and are not electrically connected to the electronic circuitry (50) provided on the circuit board (3) and the electrical functional elements (51) of the second structural element (19).

2. The electronic module according to claim 1, characterized in that At least one electrical contact pin (9) is provided, which electrically contacts the assembly side (7) of the circuit board (3) with its circuit board-side end (13), wherein the at least one electrical contact pin (9) is surrounded on the side by the protective material (11) and the circuit board-remote end (15) of the electrical contact pin (9) projects out of the protective material (11).

3. The electronic module according to claim 2, characterized in that The second structural element (19) has at least one electrical connection conductor (25) embedded in the plastic body (21), wherein the plastic body (21) has a recess (46) at which the electrical connection conductor (25) is exposed, and wherein the connection conductor (25) exposed in the recess (46) is soldered to the circuit board-remote end (15) of the electrical contact pin (9).

4. The electronic module according to claim 3, characterized in that The electrical connection conductor (25) has an elastically deflectable region (25a).

5. The electronic module according to claim 3 or 4, characterized in that The metallic insert (42) is arranged on the plastic body (21) by means of an elastically deflectable connection region (49).

6. A method for manufacturing an electronic module (1), having the following steps: - Provide a circuit board (3) having: a first structural element (5) arranged on the assembly side (7) of the circuit board (3) and in electrical contact with the assembly side (7); at least one contact body (41) having a circuit board-side end (44) arranged on the assembly side (7) of the circuit board (3); an electrically insulating protective material (11) to be processed in a liquid state and then capable of age hardening, and the protective material (11) covering the assembly side (7) of the circuit board (3) such that the first structural element (5) is encapsulated in the protective material (11) and the contact body (41) is surrounded laterally by the protective material (11) and the circuit board-remote end (45) of the contact body (41) projects from the protective material (11). - Provide a second structural element (19) with a plastic body (21) having at least one recess (43) in which a metallic insert (42) is arranged. - Arrange the second structural element (19) on the circuit board (3) such that the metallic insert (42) rests on the contact body (41); and - Weld the insert (42) to the contact body (41). It is characterized in that Not only the contact body (41) but also the metallic insert (42) are only provided for mechanically fixing the second structural element (19) to the circuit board (3) and are not electrically connected to the electronic circuitry (50) provided on the circuit board (3) and the electrical functional elements (51) of the second structural element (19).

7. The method according to claim 6, characterized in that At least one electrical contact pin (9) is provided, which electrically contacts the assembly side (7) of the circuit board (3) with its circuit board-side end (13), wherein the at least one electrical contact pin (9) is surrounded on the side by the protective material (11) and the circuit board-remote end (15) of the electrical contact pin (9) projects out of the protective material (11), and the second structural element (19) has at least one electrical connection conductor (25) embedded in the plastic body (21), wherein the plastic body (21) has a recess (46) at which the electrical connection conductor (25) is exposed, and wherein the connection conductor (25) exposed in the recess (46) is soldered to the circuit board-remote end (15) of the electrical contact pin (9).

8. The method according to claim 7, characterized in that The step of soldering the insert (42) to the contact body (41) is carried out in a soldering device, in which the connection conductor (25) exposed in the recess (46) is also soldered to the circuit board-remote end (15) of the electrical contact pin (9) in parallel.

9. The method according to claim 8, characterized in that The steps of welding the insert (42) to the contact body (41) and welding the connection conductor (25) exposed in the recess (46) to the end (15) of the electrical contact pin (9) remote from the electrical conductor are carried out by means of laser welding.

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