Electronic atomization device and power supply component thereof

Abstract

The present invention relates to an electronic atomization device and a power supply assembly therefor. The power supply assembly, used in the electronic atomization device, comprises a bracket, an airflow sensing device mounted on the bracket, and an airflow channel connected to the airflow sensing device. The bracket is provided with a leak-proof structure to prevent leakage of liquid medium in the airflow channel. By providing the leak-proof structure on the bracket to prevent leakage of liquid medium in the airflow channel, the power supply assembly reduces corrosion of the airflow sensing device and a first circuit board by the liquid atomized medium, thereby improving the performance of the power supply assembly.

Description

Technical Field

[0001] The present invention relates to an atomization device, and more particularly to an electronic atomization device and a power supply component thereof. Background Art

[0002] In the electronic atomization device of the related art, liquid atomization medium easily leaks from the atomizer of the electronic atomization device and flows into the power supply component along the airflow channel of the airflow sensing device that activates the electronic atomization device, contaminating the airflow sensing device and the circuit board in the power supply component. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an improved power supply assembly and further provide an improved electronic atomization device.

[0004] The technical solution adopted by the present invention to solve the technical problem is: constructing a power supply assembly for an electronic atomization device, comprising a bracket, an airflow sensing device disposed on the bracket, and an airflow channel connected to the airflow sensing device;

[0005] The bracket is provided with a liquid leakage prevention structure to prevent the liquid medium in the air flow channel from leaking out.

[0006] Preferably, the bracket includes a bottom wall;

[0007] The liquid leakage prevention structure is arranged on the bottom wall and is located in the air flow channel.

[0008] Preferably, the liquid leakage prevention structure includes a liquid suction groove for absorbing the liquid medium flowing out of the air flow channel by generating capillary force.

[0009] Preferably, there are a plurality of liquid suction grooves, and the plurality of liquid suction grooves are arranged side by side along the gas flow direction in the air flow channel.

[0010] Preferably, the bracket is provided with a first end wall arranged opposite to the atomizer of the electronic atomization device;

[0011] The first end wall is provided with a vent hole communicating with the air flow channel and the outside.

[0012] Preferably, the liquid suction groove is a strip-shaped groove, and the liquid suction groove is extended to both sides of the vent hole along an air inlet direction perpendicular to the vent hole.

[0013] Preferably, there are multiple liquid suction grooves.

[0014] The plurality of liquid suction grooves are arranged side by side in a direction away from the vent hole.

[0015] Preferably, the width of the liquid suction groove is 0.3-0.4 mm.

[0016] Preferably, the anti-leakage structure further comprises a groove wall, which is arranged on the outer periphery of the liquid suction groove to form an embedding groove for embedding an air guide component for guiding air to the airflow sensing device.

[0017] Preferably, the anti-leakage structure is integrally formed with the bracket.

[0018] Preferably, the airflow channel includes a main channel connected to the airflow sensing device; and the anti-leakage structure is arranged toward the main channel.

[0019] Preferably, the airflow channel further comprises a first communication channel communicating with the outside and the main channel, and a second communication channel communicating with the main channel and the airflow sensing device.

[0020] Preferably, it further comprises an air guide member cooperating with the bracket to form the air flow channel.

[0021] Preferably, the air guide member further comprises at least one reflux groove in communication with the main channel to reduce reflux of condensate;

[0022] The liquid leakage prevention structure is arranged toward the reflux groove.

[0023] Preferably, the air guide member includes an embedded portion mounted in cooperation with the liquid leakage prevention structure;

[0024] The embedded portion is provided with an air guide groove;

[0025] The air guide groove and the liquid leakage prevention structure together form a main channel of the air flow channel.

[0026] Preferably, the air guide component further includes a boss which is arranged on a side of the embedded portion opposite to the air guide groove and extends outward.

[0027] Preferably, the air guide member is made of soft material.

[0028] Preferably, the power supply assembly further comprises a first circuit board connected to the airflow sensing device;

[0029] The airflow sensing device is arranged on the first circuit board.

[0030] The present invention also constructs an electronic atomization device, which is characterized by comprising the power supply component of the present invention and an atomizer connected to the power supply component.

[0031] The electronic atomization device and its power supply assembly of the present invention have the following beneficial effects: the power supply assembly is provided with a liquid-leakage-proof structure on the bracket to prevent the liquid medium in the airflow channel from leaking out, thereby reducing the corrosion of the liquid atomization medium on the airflow sensing device and the first circuit board, thereby improving the performance of the power supply assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0033] Figure 1 1 is a schematic structural diagram of an electronic atomization device according to a first embodiment of the present invention;

[0034] Figure 2 yes Figure 1 A schematic diagram of the structure of the power supply assembly of the electronic atomization device shown;

[0035] Figure 3 yes Figure 2 A schematic diagram of the partial structure of the power supply component shown;

[0036] Figure 4 yes Figure 3 A partial structural cross-sectional view of the power supply assembly shown;

[0037] Figure 5 yes Figure 3 A schematic diagram of the partial structural decomposition of the power supply component shown;

[0038] Figure 6 yes Figure 3 A schematic structural diagram of the bracket assembly of the power supply assembly shown in FIG. 1 , which houses the battery cell, the first circuit board, and the second circuit board;

[0039] Figure 7 yes Figure 6 A schematic structural diagram of the bracket assembly of the power supply assembly shown;

[0040] Figure 8 yes Figure 7 A schematic structural diagram of a bracket of the bracket assembly shown;

[0041] Figure 9 yes Figure 3 A schematic structural diagram of the conductive structure of the bracket assembly shown;

[0042] Figure 10 yes Figure 3 A schematic structural diagram of the air guide structure of the power supply assembly shown;

[0043] Figure 11 yes Figure 3 A schematic structural diagram of the sealing member of the power supply assembly shown;

[0044] Figure 12 This is a schematic structural diagram of a bracket assembly of an electronic atomization device according to a second embodiment of the present invention, which houses a battery cell, a first circuit board, and a second circuit board;

[0045] Figure 13 yes Figure 12 A schematic structural diagram of the bracket assembly of the power supply assembly shown;

[0046] Figure 14 1 is a schematic structural diagram of a bracket assembly of an electronic atomization device according to a third embodiment of the present invention. DETAILED DESCRIPTION

[0047] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described in detail with reference to the accompanying drawings.

[0048] Figure 1 The first embodiment of the electronic atomization device of the present invention is shown. In this embodiment, the electronic atomization device includes an atomizer A and a power supply assembly B. The atomizer A can be used to heat the atomized medium. The power supply assembly B can be mechanically and / or electrically connected to the atomizer A to provide electrical energy to the atomizer A.

[0049] like Figures 2 to 5 As shown, further, in this embodiment, the power supply assembly includes a housing 10, a bracket assembly 20, a battery cell 30, a first circuit board 40, a charging interface 50, and a second circuit board 60. The housing 10 is used to accommodate the bracket assembly 20, the battery cell 30, and the first circuit board 40. The bracket assembly 20 is disposed in the housing 10 and can support the battery cell 30 and the first circuit board 40. The battery cell 30 is disposed on the bracket assembly 20, located at the bottom of the bracket assembly 20, and can provide power to the atomizer A. The first circuit board 40 can be disposed on the bracket assembly 20 and can be electrically connected to the battery cell 30. The charging interface 50 can be disposed on the bracket assembly 20 and can be connected to an external power source to charge the battery cell 30. The second circuit board 60 can be disposed on the bracket assembly 20 and can be electrically connected to the charging interface 50 and the first circuit board 40.

[0050] Furthermore, in this embodiment, the housing 10 is a cylindrical structure with an opening at one end. The housing 10 can be an injection molded part. Of course, it is understandable that in other embodiments, the housing 10 can also be a metal housing.

[0051] like Figure 6 and Figure 7 As shown, further, in this embodiment, the bracket assembly 20 may include a bracket 21 and a conductive structure 22. The bracket 21 may be used to accommodate the battery cell 30 and the first circuit board 40. The conductive structure 22 may be disposed on the bracket 21 and may be integrally formed with the bracket 21.

[0052] Furthermore, in this embodiment, the bracket 21 may be roughly flat, and in some embodiments, the cross-section of the bracket 21 may be elliptical. The bracket 21 may be an insulating member. Specifically, in some embodiments, the bracket 21 may be an injection-molded member. Preferably, the bracket 21 may be made of plastic. Of course, it is understood that in some other embodiments, the bracket 21 may not be limited to plastic materials, and may be ceramic or other insulating materials. Of course, it is understood that in some embodiments, the bracket 21 may not be limited to insulating members, and may be insulated from the conductive structure 22 by providing an insulating member. In this embodiment, the bracket 21 may include a bottom wall 211, a side wall 212, a first end wall 213, and a second end wall 214.

[0053] The bottom wall 211 can be a long bottom wall, and a cutting notch 2111 can be set on the bottom wall 211. The cutting notch 2111 can be set at intervals along the length direction of the bottom wall 211 to facilitate cutting of the conductive structure 22. In some embodiments, a positioning through hole 2112 can also be set on the bottom wall 211, and the positioning through hole 2112 can be used to position the conductive structure 22.

[0054] The side walls 212 may be disposed on two opposite sides of the bottom wall 211 and may be spaced apart from the bottom wall 211. The side walls 212 may be integrally formed with the bottom wall 211, and a hollow structure 2113 may be disposed between the side walls 212 and the bottom wall 211. The hollow structure 2113 may facilitate demolding of the entire bracket 21. In some embodiments, the bracket 21 is provided with a first clamping structure 2120. Specifically, the first clamping structure 2120 may be located on the side walls 212 and may be used to clamp the first circuit board 40. Specifically, in some embodiments, the first clamping structure 2120 may include two elastic buckles 2121. The two elastic buckles 2121 may be located on two opposite sides of the bracket 21 to allow the entire bracket 21 to have a degree of deformation. Specifically, the two elastic buckles 2121 may be located on the side walls 212 on the two opposite sides and may be integrally formed with the side walls 212. In some embodiments, the two elastic buckles 2121 can cooperate with each other to clamp the first circuit board 40. When the robot clamps the first circuit board 40 and installs it on the bracket 21, the provision of the two elastic buckles 2121 can make the first circuit board 40 easier to install and can adapt to the first circuit board 40 with appropriate deviations, facilitating automated production. Furthermore, in this embodiment, the bracket 21 can be provided with a second clamping structure 2122, which can be used to clamp the second circuit board 60. The second clamping structure 2122 can be located on two opposite sides of the bracket 21. Specifically, in some embodiments, the second clamping structure 2122 can be located on the side wall 212, and can be a clamping position provided on two opposite side walls. The two clamping positions can cooperate with each other to clamp the second circuit board 60. Furthermore, in this embodiment, the side wall 212 can be provided with a first avoidance hole 2123, which can be used for detection by an infrared detection device. The first avoidance hole 2123 can be connected to the hollow structure 2113. In this embodiment, the side wall 212 can further be provided with a second avoidance hole 2124, which can be spaced apart from the first avoidance hole 2123 along the length direction of the side wall 212 and can be used for detection by an infrared detection device.

[0055] The first end wall 213 can be disposed at one end of the bottom wall 211. Specifically, the first end wall 213 can be located at the end connected to the atomizer A. In some embodiments, a vent hole 2131 can be disposed on the first end wall 213. The vent hole 2131 can allow gas to be transmitted to activate the airflow sensing device 42 on the first circuit board 40. In some embodiments, the first end wall 213 can also be disposed with a first mounting hole 2132. The first mounting hole 2132 can be used to mount the magnetic element 120. In some embodiments, there can be two first mounting holes 2132. The two first mounting holes 2132 can be disposed sequentially along the length of the first end wall 213. In some embodiments, the first end wall 213 can also be disposed with a second mounting hole 2133. The two second mounting holes 2133 can be disposed sequentially along the length of the first end wall 213 and can be located between the two first mounting holes 2132. The electrode ejector 130 can be mounted thereon.

[0056] The second end wall 214 can be set at the other end of the bottom wall 211. The second end wall 214 can be provided with a plug port 2141 for plugging in a power cord. Of course, it can be understood that in some other embodiments, the plug port 2141 is not limited to being connected to a power cord, and can be used to connect to a data cable for data transmission. In some embodiments, the plug port 2141 can be set corresponding to the charging port 50 to facilitate the connection of the charging port 50 to the power cord. The first end wall 213 can be set parallel to the second end wall 214. The bottom wall 211, the side wall 212, the first end wall 213 and the second end wall 214 can be enclosed to form a receiving space with an opening that can accommodate the battery cell 30 and the circuit board 40.

[0057] Furthermore, in some embodiments, a retaining wall 210 may be provided on the bracket 21. This retaining wall 210 can be used to separate the receiving space of the bracket 21 into a first receiving chamber 2101 and a second receiving chamber 2102, and can also support and limit the first circuit board 40, preventing the conductive structure 22 from being crushed. The first receiving chamber 2101 can be used to accommodate the battery cell 30, and the second receiving chamber 2102 can be used to accommodate the first circuit board 40. In this embodiment, the first receiving chamber 2101 and the second receiving chamber 2102 can be provided independently and isolated from each other, thereby preventing the electrolyte in the battery cell 30 from corroding the first circuit board 40, thereby improving the sensitivity of the airflow sensing device 42. In this embodiment, both the first accommodating chamber 2101 and the second accommodating chamber 2102 can be rectangular parallelepiped-shaped, and the second accommodating chamber 2102 can be arranged side by side with the first accommodating chamber 2101, and can be located near the end of the bracket 21 that contacts the atomizer A. The size of the second accommodating chamber 2102 can be smaller than that of the first accommodating chamber 2101. Specifically, the length of the second accommodating chamber 2102 is shorter than that of the first accommodating chamber 2101. This can better prevent the electrolyte in the battery cell 30 from corroding the first circuit board 40 and shorten the sensing airway of the airflow sensing device 42, thereby improving the sensitivity of the airflow sensing device 42. In this embodiment, a first opening 2104 is correspondingly provided on the first accommodating chamber 2101. The first opening 2104 can be used to accommodate the battery cell 30 in the first accommodating chamber 2101. The first opening 2140 can be provided corresponding to the bottom wall 211. In this embodiment, a second opening 2105 is correspondingly provided on the second accommodating cavity 2102. The second opening 2105 can be used to accommodate the first circuit board 40 in the second accommodating cavity 2102. In this embodiment, the second opening 2105 can also be disposed opposite the bottom wall 211. In this embodiment, the first clamping structure 2120 can be located on two opposite sides of the second accommodating cavity 2102.

[0058] In this embodiment, the bracket 21 may further include a third accommodating chamber 2103, which may be used to accommodate the charging port 50 and the third circuit board 30. The third accommodating chamber 2103 may be located at an end of the first accommodating chamber 2101 away from the atomizer A. The third accommodating chamber 2103 may be located near the second end wall 214. The third accommodating chamber 2103 may be provided with a third opening 2106; the third opening 2106 may be used to accommodate the charging port 50 and the second circuit board 40 within the third accommodating chamber 2103. In this embodiment, the second clamping structure 2122 may be located on opposite sides of the third accommodating chamber 2103.

[0059] In this embodiment, the bracket 21 may further be provided with a first support structure 215. The first support structure 215 may be located on the bottom wall 211, may protrude toward the second accommodating cavity 2102, and may be disposed near the retaining wall 210 to support the conductive structure 22. The first support structure 215 may be a boss protruding from the second accommodating cavity 2102.

[0060] In this embodiment, a second supporting structure 216 may also be provided on the bracket 21. The second supporting structure 216 may be located on the bottom wall 211 and may protrude toward the second accommodating cavity 2103. The second supporting structure 216 may be located at the partition between the first accommodating cavity 2101 and the second accommodating cavity 2103 to separate the first accommodating cavity 2101 and the second accommodating cavity 2103. The second supporting structure 216 may be used to support the conductive structure 22.

[0061] like Figures 7 and 8 As shown, in this embodiment, the conductive structure 22 can be provided on the bottom wall 211 and can be integrally formed with the bottom wall 211. Specifically, the conductive structure 22 can be formed inside the bottom wall 211 to electrically connect the first circuit board 40 and the second circuit board 60. Of course, it is understood that in some embodiments, the conductive structure 22 is not limited to being formed inside the bottom wall 211. In other embodiments, the conductive structure 22 can be formed on the surface of the bottom wall. In other embodiments, the conductive structure 22 is not limited to connecting the first circuit board 40 and the second circuit board 60, and can be used to connect other two components that require conductive connection. In some embodiments, the conductive structure 22 can be integrally injection molded with the bottom wall 211. Of course, it is understood that in other embodiments, the conductive structure 22 can also be integrally formed with the bottom wall 211 by sintering or other methods. The conductive structure 22 may be in a sheet shape, and the thickness direction of the conductive structure 22 may be consistent with the thickness direction of the bracket 21 , that is, the thickness direction of the conductive structure 22 may be consistent with the thickness direction of the bottom wall 211 .

[0062] like Figure 9As shown, further, in this embodiment, the conductive structure 22 may include two conductive members 22a and 22b. The two conductive members 22a and 22b may include a first conductive member 22a and a second conductive member 22b. The first conductive member 22a may be a positive conductive member connected to the positive terminals of the first circuit board 40 and the second circuit board 60. The second conductive member 22b may be a negative conductive member connected to the negative terminals of the first circuit board 40 and the second circuit board 60. It will be understood that in other embodiments, the number of conductive members 22a and 22b may not be limited to two, and may be one or more than two. In this embodiment, the structures of the first conductive member 22a and the second conductive member 22b are substantially the same. In some embodiments, before the conductive structure 22 is injection molded with the bottom wall 211, a connecting piece can be provided between the two conductive parts 22a and 22b of the conductive structure 22 to form an integral structure. After injection molding with the bottom wall 211, a punching device can be used to penetrate through the cutting opening 2111 on the bottom wall 211 to punch out the connecting piece between the two conductive parts 22a and 22b.

[0063] Furthermore, in this embodiment, the conductive members 22a, 22b may be sheet-like structures. Specifically, the conductive members 22a, 22b may be metal springs, preferably made of stainless steel or phosphor bronze. Of course, it is understood that in other embodiments, the metal springs may not be limited to stainless steel or phosphor bronze. In this embodiment, the width of the conductive members 22a, 22b may be greater than or equal to 1.0 mm. When the width is less than 1.0 mm, deformation may occur during assembly, electroplating, and other processes, thereby compromising product consistency.

[0064] Furthermore, in this embodiment, the conductive members 22a and 22b may include a conductive connection portion 221, a first elastic abutting electrode 222, and a second elastic abutting electrode 223. The ends of the conductive connection portion 221 may be connected to the first elastic abutting electrode 222 and the second elastic abutting electrode 223, respectively. The first elastic abutting electrode 222 may be disposed at one end of the conductive connection portion 221 and may be used for elastic abutment with the first circuit board 40. The first elastic abutting electrodes of the two conductive members 22a and 22b are arranged in the same orientation. It is understood that in some embodiments, the first elastic abutting electrode 222 may be omitted. The second elastic abutting electrode 223 may be disposed at the other end of the conductive connection portion 221 and may be used for elastic abutment with the second circuit board 60. The second elastic abutting electrodes of the two conductive members 22a and 22b may be arranged in the same orientation; it is understood that in some embodiments, the second elastic abutting electrode 223 may be omitted. In some embodiments, the conductive connection structure 221, the first elastic abutting electrode 222, and the second elastic abutting electrode 223 can be integrally formed. Specifically, the conductive connection structure 221, the first elastic abutting electrode 222, and the second elastic abutting electrode 223 can be formed into an integral structure by bending. In this embodiment, the bracket 21 is provided with a first hollow structure 2114. The first hollow structure 2114 is located on the bottom wall 211 and in the second cavity 2102. It can be arranged corresponding to the first elastic abutting electrode 222 to facilitate demolding of the first elastic abutting electrode 222. In this embodiment, the bracket 21 is provided with a second hollow structure 2115. The second hollow structure 2115 can be located on the bottom wall 211 and in the third cavity 2103. It can be arranged corresponding to the second elastic abutting electrode 223 to facilitate demolding of the second elastic abutting electrode 223.

[0065] Furthermore, in this embodiment, the conductive connection portion 221 may be an elongated sheet-like structure. The conductive connection portion 221 may be located in the first cavity 2101, and its entire length may be integrally formed on the bottom wall 211 and may be completely embedded in the bottom wall 211. Of course, it is understood that in other embodiments, the conductive connection structure 221 may also be partially embedded in the bottom wall 211. In this embodiment, the bottom wall 211 may include a first end and a second end. The first end may extend toward the second cavity 2102, and the second end may extend toward the third cavity 2103. In this embodiment, the conductive connection portion 221 may extend from the first end toward the second end. In some embodiments, a through hole 2211 may be provided on the conductive connection portion 221, and the through hole 2211 may cooperate with the bracket 21 to improve the bonding force between the bracket 21 and the conductive members 22a, 22b. Specifically, during the injection molding process, the through hole 2211 may allow the plastic used to form the bracket 21 to be bonded to the conductive members 22a, 22b through the through hole 2211, thereby enhancing the bonding force between the bracket 21 and the conductive members 22a, 22b.

[0066] Furthermore, in this embodiment, the first elastic abutting electrode 222 can extend from the bottom wall 211 into the second cavity 2102 and has elastic deformation capabilities, allowing for elastic abutment with the first circuit board 40. In this embodiment, the first elastic abutting electrode 222 can first extend upward along the plane of the conductive connection portion 221 and then extend toward a side of the conductive connection portion 221. The first elastic abutting electrode 222 can form a set angle with the plane of the conductive connection portion 221. The set angle can be a right angle or an obtuse angle. In some embodiments, the first elastic abutting electrode 222 can extend from a side of the first supporting and positioning structure 215 and can be supported and positioned by the first supporting and positioning structure 215 to enhance the stability of contact with the first circuit board 40. In this embodiment, the height of the first elastic abutting electrode 222 can be lower than the second opening 2105. Of course, it is understood that in other embodiments, the height of the first elastic abutting electrode 222 can also be higher than the second opening 2105.

[0067] Furthermore, in this embodiment, the first elastic abutting electrode 222 may include a first main body portion 2221, a first connecting portion 2222, a second connecting portion 2223, a first abutting portion 2224, and a first guiding portion 2225. The first main body portion 2221, the first connecting portion 2222, the second connecting portion 2223, the first abutting portion 2224, and the first guiding portion 2225 may be integrally formed.

[0068] The first main body portion 2221 may be arranged parallel to the conductive connection portion 221. Of course, it is understood that in other embodiments, the first main body portion 2221 is not limited to being parallel to the conductive connection portion 221. The first main body portion 2221 may be sheet-shaped and may be located between the first abutting portion 2224 and the second connecting portion 2223.

[0069] The first coupling portion 2222 may be disposed on a sidewall of one end of the conductive connection portion 221 and may be coupled to the conductive connection portion 221 and may be disposed perpendicular to the conductive connection portion 221. Of course, it is understood that in other embodiments, the first coupling portion 2222 may not be limited to being disposed perpendicular to the conductive connection portion 221. In some embodiments, the first coupling portion 2222 may be integrally formed with the bracket 21. Specifically, in some embodiments, the first coupling portion 2222 may be integrally formed with the first support and positioning structure 215 and may be integrally formed with the first support and positioning structure 215 by injection molding, thereby better fixing the first elastic abutting electrode 222.

[0070] The second connecting portion 2223 may be arc-shaped, and may connect the first connecting portion 2222 and the first main portion 2221 , and further connect the first connecting portion 2222 and the first abutting portion 2224 .

[0071] In some embodiments, the first abutting portion 2224 can be disposed at an end of the first main portion 2221 away from the first coupling portion 2222 and can be arranged obliquely relative to the first main portion 2221. Specifically, the first abutting portion 2224 can extend obliquely upward along the first main portion 2221. The first abutting portion 2224 can be used to abut against the circuit board on the bracket. Specifically, in some embodiments, the first abutting portion 2224 can elastically abut against the first circuit board 40. By adopting elastic contact to electrically connect the first circuit board 40 to the conductive members 22a, 22b, soldering can be reduced and the process can be simplified. The first abutting portion 2224 can provide the first elastic abutting electrode 222 with elastic deformation space, allowing the first elastic abutting electrode 222 to form good contact with the first circuit board 40. In some embodiments, the width of the first abutting portion 2224 may be smaller than the width of the first main portion 2221, thereby reducing the elastic force exerted by the first abutting portion 2224 on the first circuit board 40. In some embodiments, the junction of the first main portion 2221 and the first abutting portion 2224 may be bent to form a first deformable portion 2226, making the deformation of the first abutting portion 2224 controllable.

[0072] In some embodiments, the first guide portion 2225 can be disposed at one end of the first abutting portion 2224. Specifically, the first guide portion 2225 can be disposed at an end of the first abutting portion 2224 away from the first main portion 2221 and bent relative to the first abutting portion 2224. The first guide portion 2225 can be used to guide the first abutting portion 2224 in contact with the first circuit board 40 and facilitate elastic deformation of the first abutting portion 2224. In some embodiments, the contact end of the first elastic abutting electrode 222 and the first circuit board 40 is provided with a first conductive layer. Specifically, in this embodiment, the first conductive layer can be disposed at the junction of the first abutting portion 2224 and the first guide portion 2225. The first conductive layer can be a metal conductive layer, preferably made of gold. The metal conductive layer can be disposed on the surface where the first abutting portion 2224 and the first guiding portion 2225 meet by electroplating, thereby reducing resistance and making the conductive connection between the first elastic abutting electrode 222 and the first circuit board 40 more reliable.

[0073] Furthermore, in this embodiment, the second elastic abutting electrode 223 can extend from the bottom wall 211 into the second accommodating cavity 2103 and has elastic deformation capabilities, allowing it to abut against the second circuit board 60. In this embodiment, the second elastic abutting electrode 223 can extend upward along the plane of the conductive connection portion 221 and then extend toward one side of the conductive connection portion 221. The second elastic abutting electrode 223 can form a set angle with the plane of the conductive connection portion 221. The set angle can be a right angle or an obtuse angle. In some embodiments, the second elastic abutting electrode 223 can extend from one side of the second supporting and positioning structure 216 and can be supported and positioned by the second supporting and positioning structure 216 to improve the stability of contact with the second circuit board 60. In this embodiment, the height of the second elastic abutting electrode 223 can be lower than the third opening 2106. Of course, it is understood that in other embodiments, the height of the second elastic abutting electrode 223 can also be higher than the third opening 2106. In this embodiment, the first elastic abutting electrode 222 and the second elastic abutting electrode 223 located on the same conductive connecting portion 221 may be located on the same side of the conductive connecting portion 221 .

[0074] Furthermore, in this embodiment, the second elastic abutting electrode 223 may include a second main body portion 2231, a second connecting portion 2232, a fourth connecting portion 2233, a second abutting portion 2234, and a second guiding portion 2235. The second main body portion 2231, the third connecting portion 2232, the fourth connecting portion 2233, the second abutting portion 2234, and the second guiding portion 2235 may be integrally formed.

[0075] The second main body portion 2231 can be arranged parallel to the conductive connection portion 221. Of course, it is understandable that in other embodiments, the second main body portion 2231 is not limited to being parallel to the conductive connection portion 221. The second main body portion 2231 can be sheet-shaped and can be located between the second abutting portion 2234 and the fourth connecting portion 2233.

[0076] The third coupling portion 2232 may be disposed on a sidewall of one end of the conductive connection portion 221 and may be coupled to the conductive connection portion 221 and may be disposed perpendicularly to the conductive connection portion 221. Of course, it is understood that in other embodiments, the third coupling portion 2232 may not be limited to being disposed perpendicularly to the conductive connection portion 221. In some embodiments, the third coupling portion 2232 may be integrally formed with the bracket 21. Specifically, in some embodiments, the third coupling portion 2232 may be integrally formed with the second support and positioning structure 216 and may be integrally formed with the second support and positioning structure 216 by injection molding, thereby better securing the second elastic abutting electrode 223.

[0077] The fourth connecting portion 2233 may be arc-shaped, and may connect the third connecting portion 2232 and the second main portion 2231 , and further connect the third connecting portion 2232 and the second abutting portion 2234 .

[0078] In some embodiments, the second abutting portion 2234 can be disposed at an end of the second main body portion 2231 away from the fourth coupling portion 2233 and can be arranged obliquely relative to the second main body portion 2231. Specifically, the second abutting portion 2234 can extend obliquely upward along the second main body portion 2231. The second abutting portion 2234 can be used to abut against the circuit board on the bracket. Specifically, in some embodiments, the second abutting portion 2234 can elastically abut against the second circuit board 60. By adopting elastic contact to electrically connect the second circuit board 60 to the conductive members 22a, 22b, soldering can be reduced and the process can be simplified. The second abutting portion 2234 can provide the second elastic abutting electrode 223 with elastic deformation space, allowing the second elastic abutting electrode 223 to form good contact with the second circuit board 60. In some embodiments, the width of the second abutting portion 2234 may be smaller than the width of the second main portion 2231, thereby reducing the elastic force exerted by the second abutting portion 2234 on the second circuit board 60. In some embodiments, the junction of the second main portion 2231 and the second abutting portion 2234 may be bent to form a second deformable portion 2236, making the deformation of the second abutting portion 2234 controllable.

[0079] In some embodiments, the second guide portion 2235 can be disposed at one end of the second abutting portion 2234. Specifically, the second guide portion 2235 can be disposed at an end of the second abutting portion 2234 away from the second main portion 2231 and bent relative to the second abutting portion 2234. The second guide portion 2235 can be used to guide the second abutting portion 2234 in contact with the second circuit board 60 and facilitate elastic deformation of the second abutting portion 2234. In some embodiments, the contact end of the second elastic abutting electrode 223 and the second circuit board 60 is provided with a second conductive layer. Specifically, in this embodiment, the second conductive layer can be disposed at the junction of the second abutting portion 2234 and the second guide portion 2235. The second conductive layer can be a metal conductive layer, preferably made of gold. The metal conductive layer can be disposed on the surface where the second abutting portion 2234 and the second guiding portion 2235 meet by electroplating, thereby reducing resistance and making the conductive connection between the second elastic abutting electrode 223 and the second circuit board 60 more reliable.

[0080] In this embodiment, the first elastic abutting electrodes 222 of the two conductive members 22a and 22b can both extend toward the first end of the battery cell. By setting the extension direction of the first elastic abutting electrodes 222 of the two or more conductive members 22a and 22b to be the same, automated assembly can be facilitated. The connection of the top ends of the first elastic abutting electrodes 222 of the two conductive members 22a and 22b may not intersect with the side wall 212 of the bracket 21, so as to facilitate infrared detection of the first elastic abutting electrodes 222 of the two conductive members 22a and 22b, that is, when the first elastic abutting electrode 222 is set lower than the side wall 212, the top end of the first elastic abutting electrode 222 can be observed through the first avoidance hole 2123, and the infrared detection device emits an infrared light source from the first avoidance hole 2123 to the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b; in this embodiment, the adjacently arranged The first elastic abutting electrodes 222 of the two conductive members 22a and 22b can be arranged in mirror-symmetrical arrangement. That is, the first elastic abutting electrodes 222 of the first conductive member 22a and the first elastic abutting electrodes 222 of the second conductive member 22b can be arranged in mirror-symmetrical arrangement. Specifically, the first elastic abutting electrodes 222 of the first conductive member 22a and the first elastic abutting electrodes 222 of the second conductive member 22b can extend along the width direction of the bottom wall 211 and in opposite directions. This can facilitate infrared detection by the infrared detection device on the first elastic abutting electrodes 222 of the first conductive member 22a and the first elastic abutting electrodes 222 of the second conductive member 22b. It is understood that in other embodiments, the first elastic abutting electrodes 222 of the two conductive members 22a and 22b are not limited to being arranged in mirror-symmetrical arrangement. In this embodiment, the first end wall 213 includes a plane disposed opposite the conductive members 22a and 22b. The first elastic contact electrodes 222 of the two adjacent conductive members 22 a and 22 b may extend in a direction parallel to the plane of the first end wall 213 and respectively correspond to the first avoidance holes 2123 .After the first conductive member 22a and the second conductive member 22b are injection molded with the bracket 21, a conventional infrared detection device can be used to emit an infrared light source from the first avoidance hole 2123 to the first elastic abutting electrode 222 of the first conductive member 22a and the second conductive member 22b and obtain an infrared image of the first elastic abutting electrode 222 of the first conductive member 22a and the second conductive member 22b, and by identifying and processing the infrared image, it is determined whether the first conductive member 22a and the second conductive member 22b are completely overlapped. Specifically, it can be determined whether the first elastic abutting electrode 222 of the first conductive member 22a and the second conductive member 22b is completely overlapped. Whether the infrared image of the first abutment portion 2224 of 22 is completely overlapped, and complete overlap means that the deviation of the infrared images of the first elastic abutment electrode 222 of the first conductive member 22a and the second conductive member 22b in the horizontal and vertical directions is within a predetermined range. When the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are completely overlapped, the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are installed on the same horizontal line, and the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b can be in good contact with the first circuit board 40. When the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b do not overlap for the most part or do not overlap at all (the overlapping range is not within the predetermined range), the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b are not installed on the same horizontal line. After the first circuit board 40 and the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b are installed, the pre-pressure applied by the first circuit board 40 to the first elastic abutting electrode 222 of the first conductive member 22a and the first elastic abutting electrode 222 of the second conductive member 22b will be different, so that the contact resistance between the first elastic abutting electrode 222 of the first conductive member 22a and the first elastic abutting electrode 222 of the second conductive member 22b and the first circuit board 40 is different, resulting in poor contact stability between the first conductive member 22a and the second conductive member 22b and the first circuit board 40.

[0081] In this embodiment, the second elastic abutting electrodes 223 of the two conductive members 22a, 22b can both extend toward the second end of the battery cell. By setting the extension direction of the second elastic abutting electrodes 223 of the two or more conductive members 22a, 22b to be the same, automated assembly can be facilitated. The connection of the top ends of the second elastic abutting electrodes 223 of the two conductive members 22a, 22b may not intersect with the side wall 212 of the bracket 21, so as to facilitate infrared detection of the second elastic abutting electrodes 223 of the two conductive members 22a, 22b, that is, when the second elastic abutting electrode 223 is set lower than the side wall 212, the top end of the second elastic abutting electrode 223 can be observed through the first avoidance hole 2123, and the infrared detection device emits an infrared light source from the first avoidance hole 2123 to the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b; in this embodiment, the adjacently arranged The second elastic abutting electrodes 223 of the two conductive members 22a and 22b can be arranged in mirror-symmetrical arrangement. That is, the second elastic abutting electrodes 223 of the first conductive member 22a and the second elastic abutting electrodes 223 of the second conductive member 22b can be arranged in mirror-symmetrical arrangement. Specifically, the second elastic abutting electrodes 223 of the first conductive member 22a and the second elastic abutting electrodes 223 of the second conductive member 22b can extend along the width direction of the bottom wall 211 and in opposite directions. This can facilitate infrared detection by the infrared detection device. It is understood that in other embodiments, the second elastic abutting electrodes 223 of the two conductive members 22a and 22b are not limited to being arranged in mirror-symmetrical arrangement. In this embodiment, the second end wall 214 includes a plane disposed opposite the conductive members 22a and 22b. The second elastic contact electrodes 223 of the two adjacent conductive members 22 a and 22 b may extend in a direction parallel to the plane of the second end wall 214 and respectively correspond to the second avoidance holes 2124 .After the first conductive member 22a and the second conductive member 22b are injection molded with the bracket 21, a conventional infrared detection device can be used to emit an infrared light source from the second avoidance hole 2124 to the second elastic abutting electrode 223 of the first conductive member 22a and the second conductive member 22b and obtain an infrared image of the second elastic abutting electrode 223 of the first conductive member 22a and the second conductive member 22b, and by identifying and processing the infrared image, it is determined whether the first conductive member 22a and the second conductive member 22b are completely overlapped. Specifically, it can be determined whether the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b are completely overlapped. Whether the infrared image of the second abutment portion 2234 of 23 completely overlaps, and complete overlap means that the deviation of the infrared images of the second elastic abutment electrode 223 of the first conductive member 22a and the second conductive member 22b in the horizontal and vertical directions is within a predetermined range. When the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b completely overlap, the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b are installed on the same horizontal line, and the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b can be in good contact with the second circuit board 60. When the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b mostly overlap or do not overlap at all (the overlapping range is not within the predetermined range), the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b are not installed on the same horizontal line. After the second circuit board 60 and the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b are installed, the pre-pressure applied by the second circuit board 60 to the second elastic abutting electrodes 223 of the first conductive member 22a and the second elastic abutting electrodes 223 of the second conductive member 22b will be different, so that the contact resistance between the second elastic abutting electrodes 223 of the first conductive member 22a and the second elastic abutting electrodes 223 of the second conductive member 22b and the second circuit board 60 is different, resulting in poor contact stability between the first conductive member 22a and the second conductive member 22b and the second circuit board 60.

[0082] For example Figure 5 and Figure 6As shown, further, in this embodiment, the battery cell 30 can be accommodated in the first accommodating cavity 2101. The battery cell 30 can be a rechargeable battery that can be powered by an external power source, thereby continuously providing power to the atomizer, thereby improving the recyclability of the power supply component and reducing resource waste. In this embodiment, the battery cell 30 may include a battery cell body 31 and a protective plate 32. The battery cell body 31 can be accommodated in the first accommodating cavity 2101, and the protective plate 32 can be attached to the surface of the battery cell body 31. One end of the battery cell body 31 can be provided with an electrode sheet 311 that extends toward the second accommodating cavity 2102 and connects to the first circuit board 40. The electrode sheet 311 can be two, namely a positive electrode sheet and a negative electrode sheet, and can be welded to the first circuit board 40. The battery cell 30 can include a first end 3101 and a second end 3102; the first end 3101 and the second end 3102 can extend along the length of the battery cell 30. The conductive structure can extend from the first end 3101 of the battery cell 30 toward the second end 3102 of the battery cell 30, and at least two of the first elastic abutting electrodes 222 of the conductive structure 22 are located at the first end 3101 of the battery cell 30. Specifically, the first elastic abutting electrode 222 can extend from the bottom wall 211 along the first end 3101 of the battery cell 30, and at least two of the second elastic abutting electrodes 223 of the conductive structure 22 are located at the second end of the battery cell 30. Specifically, the second elastic abutting electrode 223 can extend from the bottom wall 211 along the second end 3102 of the battery cell 30.

[0083] Furthermore, in this embodiment, the first circuit board 40 can be accommodated in the second accommodating cavity 2102. Of course, in other embodiments, the first circuit board 40 can be located at the second opening 2105 of the second accommodating cavity 2102 and can be arranged higher than the second opening 2105. In this embodiment, the first circuit board 40 can be a main control board. The first circuit board 40 can be provided with two solder pads 41, which can be arranged corresponding to the two electrode pads 311 of the battery cell 30, so that the electrode pads 311 can be soldered thereto. In this embodiment, the power supply assembly B can also include an airflow sensing device 42. The airflow sensing device 42 can be disposed on the bracket 21. Specifically, the airflow sensing device 42 can be disposed on the first circuit board 40 and can be electrically connected to the first circuit board 40, and can be used to activate the atomizer A. In some embodiments, the airflow sensing device 42 can be a MEMS sensor.

[0084] Furthermore, in this embodiment, the charging interface 50 may be located in the third accommodating cavity 2103 and may be provided corresponding to the plug interface 2141. In some embodiments, the charging interface 50 may be a USB interface. Of course, it is understood that in other embodiments, the charging interface 50 may not be limited to a USB interface.

[0085] Furthermore, in this embodiment, the second circuit board 60 can be a charging circuit board, which can be conductively connected to the charging interface 50 and conductively connected to the first circuit board 40 through the conductive members 22a, 22b. When the battery cell 30 of the electronic atomization device needs to be charged, a power cord connected to an external power source can be inserted through the plug port 2141 to conductively connect to the charging interface 50. Electric energy can be input from the charging interface 50, flow through the second circuit board 60, the conductive members 22a, 22b, the first circuit board 40, and then enter the battery cell 30.

[0086] Furthermore, in this embodiment, the power supply assembly may further include an air guide member 70. The air guide member 70 may be used to guide air to the airflow sensing device 42 to facilitate starting the airflow sensing device 42. Further, in this embodiment, the air guide member 70 may be located in the second accommodating cavity 2102. In some embodiments, the air guide member 70 may be a silicone member. Of course, it is understandable that in other embodiments, the air guide member 70 may not be limited to silicone members, and may be made of other soft materials. The air guide member 70 may be arranged on the side of the first circuit board 40 opposite to the airflow sensing device 42, and may be in communication with the airflow sensing device 42.

[0087] like Figure 4 and Figure 10As shown, further, in this embodiment, the air guide member 70 may include an embedded portion 71, which may be embedded and installed in the liquid leakage prevention structure 217 provided on the bracket 21. The embedded portion 71 may be generally rectangular. Of course, it is understood that in other embodiments, the embedded portion 71 may not be limited to a rectangular parallelepiped shape. The embedded portion 71 may be provided with an air guide groove 711. The air guide groove 711 may be a main air vent groove, which may be provided along the length of the embedded portion 71 and may be connected to the air vent 2131 on the first end wall 213. It can be used to guide the gas that activates the airflow sensing device 42 to the air vent 2131, so that the airflow sensing device 42 generates negative pressure. In this embodiment, the air guide groove 711 may be distributed in a straight line and may be centrally located. In this embodiment, the air guide member 70 further includes at least one reflux groove 712, which can be disposed on the embedded portion 71. There can be multiple reflux grooves 712, and multiple reflux grooves 712 can be distributed on both opposite sides of the air guide groove 711. The reflux groove 712 can be disposed in communication with the air guide groove 711, and can be used to increase the fluid path, reduce the condensate backflow to the first circuit board 40, and prevent the condensate from contaminating the first circuit board 40 and the airflow sensing device 42. The reflux groove 712 can be disposed at an angle relative to the air guide groove 711 to form a set angle. The set angle can be an acute angle. Specifically, the set angle can be 30 to 60 degrees, preferably 45 degrees. By tilting the reflux groove 712 at an acute angle relative to the longitudinal axis of the air guide groove 711, the structural space can be optimized.

[0088] Furthermore, in this embodiment, the reflux groove 712 may include a flow portion 7121, a return portion 7122, and a connecting portion 7123. The flow portion 7121 may be connected to the air guide groove 711, allowing condensate to flow from the air guide groove 711 into the flow portion 7121. The return portion 7122 may be connected to the air guide groove 711 and the flow portion 7121. The return portion 7122 and the flow portion 7121 may be arranged in a straight line, and the flow portion 7121 and the return portion 7122 may be arranged parallel to each other. Of course, it is understood that in other embodiments, the return portion 7122 and the flow portion 7121 may not only be arranged in a straight line, but may also be arranged in a curved line. In other embodiments, the flow portion 7121 and the return portion 7122 may not only be arranged in parallel, but may also be arranged in a figure-eight pattern. The connecting portion 7123 may be used to connect the flow portion 7121 and the return portion 7122. The condensate may flow from the flow portion 7121 and then flow through the connecting portion 7123 to the return portion 7122 , and then return to the air guide groove 711 from the return portion 7122 .

[0089] Furthermore, in this embodiment, the embedded portion 71 may be provided with a first notch 713 and a second notch 714. The first notch 713 may be provided at one end of the air guide groove 711 and may communicate with the vent 2131 to allow liquid to flow in or air to flow out. The second notch 714 may be provided at the other end of the air guide groove 711 and may communicate with the air flow sensing device 42 to allow air to be output to the air guide groove 711.

[0090] Furthermore, in this embodiment, the air-guiding component 70 may also include a boss 72, which may be arranged on the side of the embedded portion 71 opposite to the air-guiding groove 711 and may extend outward, so as to support the embedded portion 71 and prevent the air-guiding groove 711 and the reflux groove 712 on the air-guiding component 70 from being deformed, and may form a sealing structure with the anti-leakage structure 217 on the bracket 21 to prevent condensate from flowing out, thereby strengthening the sealing effect between the anti-leakage structure 217 and the air-guiding structure 70.

[0091] like Figure 5 and Figure 11 As shown, further, in this embodiment, a sealing member 80 may be provided at the opening of the second accommodating cavity 2102. The sealing member 80 may be pressed onto the first circuit board 40 and may be connected and fixed to the bracket 21 via screws. In this embodiment, the sealing member 80 may include a body 81 and a positioning post 82 provided on the body 81. The positioning post 82 may be provided with a through hole for the screw to pass through. In this embodiment, a screw hole 218 may be provided on the bottom wall 211 of the bracket 21. The screw hole 218 may be located in the second accommodating cavity 2102, may be provided corresponding to the positioning post 82, and may be connected to the through hole on the positioning post 82. It may be used for screw connection, thereby allowing the sealing member 80 to be detachably connected to the bracket 21.

[0092] Furthermore, in this embodiment, the power supply component B may also include a lamp post 90, which can be set on the sealing member 80, and can be set through the shell 10, and can be connected to the first circuit board 40, and can be used to display the usage status of the atomizer A.

[0093] Furthermore, in this embodiment, the power supply assembly may also include an airflow channel 100; the airflow channel 100 may serve as an activation air passage for activating the airflow sensing device 42. In this embodiment, the airflow channel 100 may communicate with the vent 2131 and the airflow sensing device 42. In this embodiment, the airflow channel 100 may include a main channel 100a, a first connecting channel 100b, and a second connecting channel 100c. The main channel 100a may communicate with the airflow sensing device 42 and may be used to activate the airflow sensing device 42. The reflux groove 712 may be disposed in communication with the main channel 100a. The first connecting channel 100b may be located at one end of the main channel 100a and may communicate with the outside and the main channel 100a. Specifically, the first connecting channel 100b may be formed in the vent 2131, connecting the vent 2131 with the main channel 100a. The second communication channel 100c may be located at the other end of the main channel 100a and may be used to connect the main channel 100a with the airflow sensing device 42. The second communication channel 100c may be formed in the embedding portion 71 of the air guide member 70 and may connect the second notch 714 with the airflow sensing device 42.

[0094] Furthermore, in the present embodiment, a liquid leakage prevention structure 217 may be provided in the airflow channel 100. The liquid leakage prevention structure 217 may be located on the bracket 21 and may be integrally formed with the bracket 21 to prevent leakage of the liquid medium in the airflow channel. The liquid leakage prevention structure 217 may be located in the second accommodating cavity 2102 of the bracket 21 and may be located on the bottom wall 211 and may be integrally formed with the bottom wall 211 by injection molding. Specifically, in some embodiments, the liquid leakage prevention structure 217 may be integrally formed with the bottom wall 211 by injection molding. In the present embodiment, the liquid leakage prevention structure 217 may be provided toward the reflux groove 712 and, together with the air guide component 70, form the main channel 100a. In the present embodiment, the liquid leakage prevention structure 217 may form the main channel 100a together with the air guide groove 711 of the air guide component 70.

[0095] Furthermore, in this embodiment, the liquid leakage prevention structure 217 may include a liquid absorption groove 2171. The liquid absorption groove 2171 may be disposed on the bracket 21, may be located within the second accommodating cavity 2102, and may be located on the bottom wall 211. The liquid absorption groove 2171 may be a capillary groove that can absorb liquid medium flowing out of the airflow channel by generating capillary force, thereby reducing the corrosion of the liquid medium on the airflow sensing device 42 and the first circuit board 40. In some embodiments, there may be multiple liquid absorption grooves 2171, and the multiple liquid absorption grooves 2171 are arranged side by side in a direction away from the vent 2131, thereby gradually storing the liquid medium. Specifically, they may be arranged side by side along the direction of gas flow in the airflow channel 100. Furthermore, in this embodiment, the liquid absorption groove 2171 can be a strip-shaped groove. The liquid absorption groove 2171 can be arranged along both sides of the vent hole 2131 in a direction perpendicular to the air inlet direction of the vent hole 2131, that is, a transverse groove, thereby reducing the time it takes for the condensate to flow down. Furthermore, in some embodiments, the width of the liquid absorption groove 2171 can be 0.3-0.4 mm.

[0096] Furthermore, in this embodiment, the liquid leakage prevention structure 217 may further include a groove wall 2172. The groove wall 2172 may be a generally rectangular parallelepiped structure, such as a frame, and may be disposed on the periphery of the liquid suction groove 2171 so that the multiple liquid suction grooves 2172 are disposed therein. The groove wall 2172 may be surrounded by an embedding groove 2173, which may be used to embed and install the air guide member 70. Specifically, in some embodiments, the embedding portion 71 of the air guide member 70 may be embedded in the embedding groove 2173 in the liquid leakage prevention structure 217, thereby being installed in conjunction with the liquid leakage prevention structure 217. In this embodiment, the boss 72 of the air guide member 70 may seal the embedding groove 2173 to prevent leakage of the liquid medium.

[0097] Furthermore, in this embodiment, the power supply assembly B may further include a sealing cover 110, which may be sleeved on the first end wall 213 and may be used to form a seal with the housing 10 to prevent liquid in the atomizer A from flowing into the power supply assembly B through the side wall between the housing 10 and the bracket 21. The sealing cover 110 may be a silicone cover having holes formed therein corresponding to the vent hole 2131 and the first mounting hole 2132.

[0098] Furthermore, in this embodiment, the power supply component B may also include a magnetic component 120. There may be two magnetic components 120. The two magnetic components 120 may be arranged at intervals and may be respectively passed through the sealing cover 110 and the first end wall 213, and may be installed corresponding to the first mounting hole 2132 for connecting the power supply component B and the atomizer A.

[0099] Furthermore, in this embodiment, the power supply component B may also include an electrode pin 130. There may be two electrode pins 130. The two electrode pins 130 may be arranged at intervals and may be respectively passed through the sealing cover 110 and the first end wall 213, and may be installed in the second mounting hole 2133 for connecting the first circuit board 40 and the atomizer A.

[0100] Figure 12 and Figure 13 A second embodiment of the electronic atomization device of the present invention is shown, which differs from the first embodiment in that the first avoidance hole 2123 and the second avoidance hole 2124 on the bracket 21 can be omitted.

[0101] The first elastic abutting electrodes 222 of the at least two conductive members 22a, 22b can extend toward the first opening 2104 and the top end thereof can be arranged higher than the side wall 212; specifically, the first opening 2104 can be arranged side by side and flush with the second opening 2105, the first elastic abutting electrode 222 can pass through the second opening 2105 of the second accommodating cavity 2102, and the top end of the first abutting portion 2224 can protrude from the second opening 2105, thereby achieving non-intersection with the side wall 212, and the first circuit board 40 can be located above the second opening 2105 and can elastically abut against the first elastic abutting electrode 222. After the first conductive member 22a and the second conductive member 22b are injection molded with the bracket 21, a conventional infrared detection device can be used to emit an infrared light source from one side of the second opening 2105 to the first elastic abutting electrode 222 of the first conductive member 22a and the second conductive member 22b and obtain an infrared image of the first elastic abutting electrode 222 of the first conductive member 22a and the second conductive member 22b, and by identifying and processing the infrared image, it is determined whether the first conductive member 22a and the second conductive member 22b are completely overlapped. Specifically, it can be determined whether the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b are completely overlapped. Whether the infrared image of the first abutment portion 2224 of 222 is completely overlapped, when the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are completely overlapped, complete overlap means that the deviation of the infrared images of the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b in the horizontal and vertical directions is within a predetermined range, then the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b are installed on the same horizontal line, and the first elastic abutment electrodes 222 of the first conductive member 22a and the second conductive member 22b can be in good contact with the first circuit board 40. When the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b do not overlap for the most part or do not overlap at all (the overlapping range is not within the predetermined range), the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b are not installed on the same horizontal line. After the first circuit board 40 and the first elastic abutting electrodes 222 of the first conductive member 22a and the second conductive member 22b are installed, the pre-pressure applied by the first circuit board 40 to the first elastic abutting electrode 222 of the first conductive member 22a and the first elastic abutting electrode 222 of the second conductive member 22b will be different, so that the contact resistance between the first elastic abutting electrode 222 of the first conductive member 22a and the first elastic abutting electrode 222 of the second conductive member 22b and the first circuit board 40 is different, resulting in poor contact stability between the first conductive member 22a and the second conductive member 22b and the first circuit board 40.

[0102] The second elastic abutting electrode 223 of the at least two conductive members 22a, 22b may extend toward the first opening 2104, and its top end may be positioned higher than the sidewall 212. Specifically, the first opening 2104 may be aligned and flush with the third opening 2106. The second elastic abutting electrode 223 may extend toward the third opening 2106 of the third accommodating cavity 2103, and the top end of the first abutting portion 2224 may protrude from the third opening 2106 and be positioned slightly higher than the third opening 2106, thereby avoiding intersecting the sidewall 212. The second circuit board 60 may be located above the third opening 2106 and elastically abut against the second elastic abutting electrode 223. After the first conductive member 22a and the second conductive member 22b are injection molded with the bracket 21, a conventional infrared detection device can be used to emit an infrared light source from one side of the third opening 2106 to the second elastic abutting electrode 223 of the first conductive member 22a and the second conductive member 22b and obtain an infrared image of the second elastic abutting electrode 223 of the first conductive member 22a and the second conductive member 22b, and by identifying and processing the infrared image, it is determined whether the first conductive member 22a and the second conductive member 22b are completely overlapped. Specifically, it can be determined whether the second elastic abutting electrodes of the first conductive member 22a and the second conductive member 22b are completely overlapped. Whether the infrared image of the second abutment portion 2234 of 223 completely overlaps, and complete overlap means that the deviation of the infrared images of the second elastic abutment electrode 223 of the first conductive member 22a and the second conductive member 22b in the horizontal and vertical directions is within a predetermined range. When the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b completely overlap, the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b are installed on the same horizontal line, and the second elastic abutment electrodes 223 of the first conductive member 22a and the second conductive member 22b can be in good contact with the second circuit board 60. When the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b do not overlap for the most part or do not overlap at all (the overlapping range is not within the predetermined range), the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b are not installed on the same horizontal line. After the second circuit board 60 and the second elastic abutting electrodes 223 of the first conductive member 22a and the second conductive member 22b are installed, the pre-pressure applied by the second circuit board 60 to the second elastic abutting electrode 223 of the first conductive member 22a and the second elastic abutting electrode 223 of the second conductive member 22b will be different, so that the contact resistance between the second elastic abutting electrode 223 of the first conductive member 22a and the second elastic abutting electrode 223 of the second conductive member 22b and the second circuit board 60 is different, resulting in poor contact stability between the first conductive member 22a and the second conductive member 22b and the second circuit board 60.

[0103] Figure 14The third embodiment of the electronic atomization device of the present invention is shown. This embodiment differs from the second embodiment in that the second clamping structure 2122 on the bracket 21 is omitted. Positioning bosses 2125 may be provided on the sidewalls 212 on opposite sides of the third accommodating cavity 2103. These bosses 2125 further seal the third accommodating cavity 2103 and serve to position the second circuit board 60 within the cavity 2103, preventing it from falling out.

[0104] It is understandable that the above embodiments only express the preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can be made, all of which fall within the scope of protection of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A power supply assembly for an electronic atomization device, characterized in that: It comprises a bracket (21), an airflow sensing device (42) disposed on the bracket (21), an airflow channel (100) communicating with the airflow sensing device (42), and an air guide member (70) cooperating with the bracket (21) to form the airflow channel (100); The bracket (21) is provided with a liquid leakage prevention structure (217) for preventing the liquid medium in the air flow channel (100) from leaking out; the liquid leakage prevention structure (217) includes a liquid absorption groove (2171) for absorbing the liquid medium flowing out of the air flow channel (100) by generating capillary force; The bracket (21) has a vent hole (2131) communicating with the air flow channel (100) and the outside; the liquid suction groove (2171) is extended toward both sides of the vent hole (2131) along an air inlet direction perpendicular to the vent hole (2131); The liquid leakage prevention structure (217) further includes a groove wall (2172); the groove wall (2172) is arranged on the outer periphery of the liquid suction groove (2171) to form an embedded groove (2173); the air guide component (70) is embedded in the embedded groove (2173); The air guide component (70) includes a boss (72) for sealing the embedding groove (2173).

2. The power supply assembly according to claim 1, characterized in that: The bracket (21) includes a bottom wall (211); The liquid leakage prevention structure (217) is arranged on the bottom wall (211) and is located in the air flow channel (100).

3. The power supply assembly according to claim 1, characterized in that: There are a plurality of liquid suction grooves (2171), and the plurality of liquid suction grooves (2171) are arranged side by side along the gas flow direction in the air flow channel (100).

4. The power supply assembly according to claim 3, characterized in that: The bracket (21) is provided with a first end wall (213) disposed opposite to the atomizer of the electronic atomization device; The vent hole (2131) is provided on the first end wall (213).

5. The power supply assembly according to claim 4, characterized in that: The liquid suction groove (2171) is a strip-shaped groove.

6. The power supply assembly according to claim 1, characterized in that: There are multiple liquid suction grooves (2171). The plurality of liquid suction grooves (2171) are arranged side by side in a direction away from the vent hole (2131).

7. The power supply assembly according to claim 1, characterized in that: The width of the liquid suction groove (2171) is 0.3-0.4 mm.

8. The power supply assembly according to claim 1, characterized in that: The anti-leakage structure (217) and the bracket (21) are integrally formed.

9. The power supply assembly according to claim 1, characterized in that: The airflow channel (100) comprises a main channel (100a) connected to the airflow sensing device (42); the anti-leakage structure (217) is arranged toward the main channel (100a).

10. The power supply assembly according to claim 9, characterized in that: The airflow channel (100) further comprises a first communication channel (100b) communicating with the outside and the main channel (100a), and a second communication channel (100c) communicating with the main channel (100a) and the airflow sensing device (42).

11. The power supply assembly according to claim 10, characterized in that: The air guide member (70) further includes at least one reflux groove (712) in communication with the main channel (100a) to reduce reflux of condensate; The liquid leakage prevention structure (217) is arranged toward the reflux groove (712).

12. The power supply assembly according to claim 11, characterized in that: The air guide component (70) includes an embedded portion (71) mounted in cooperation with the liquid leakage prevention structure (217); The embedded portion (71) is provided with an air guide groove (711); The air guide groove (711) and the liquid leakage prevention structure (217) together form a main channel (100a) of the air flow channel (100).

13. The power supply assembly according to claim 12, characterized in that: The boss (72) is arranged on a side of the embedded portion (71) opposite to the air guide groove (711) and extends outward.

14. The power supply assembly according to claim 1, characterized in that: The air guide component (70) is made of soft material.

15. The power supply assembly according to claim 1, characterized in that: The power supply assembly further includes a first circuit board (40); The airflow sensing device (42) is arranged on the first circuit board (40).

16. An electronic atomization device, characterized in that: It comprises the power supply assembly according to any one of claims 1 to 15, and an atomizer connected to the power supply assembly.

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