Display device

Abstract

The display device can include a display panel; and a signal transfer film including a first extension portion extending in a first direction and forming a first contact hole at a first side portion, a second extension portion extending from the first side portion of the first extension portion in a second direction different from the first direction, and a first dummy pattern disposed adjacent to the first contact hole at the first side portion, the signal transfer film being connected to one side of the display panel. Thus, the upper protective film and the signal transfer film can not be separated at the first side portion during bending of the signal transfer film, and misalignment of the signal transfer film can be prevented.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a display device. In more detail, the present disclosure relates to a display device including a signal transmission film. BACKGROUND

[0002] Flat panel display devices are being used as display devices to replace cathode ray tube display devices due to characteristics such as lightness and thinness. As representative examples of such flat panel display devices, there are liquid crystal display devices and organic light emitting display devices.

[0003] A display device can include a display structure including a pixel, a sensor structure disposed on the display structure and including a sensor electrode, etc. Here, the display structure can display an image through the pixel, and the sensor structure can sense a part of a user's body or an object, etc. located on the front surface of the display device through the sensor electrode. In other words, the display device can receive provision of an image signal provided to the display structure and a sensor signal provided to the sensor structure from an external device. In order to receive the provision of the image and the sensor signal, a signal transmission film transmitting the image and the sensor signal can be attached to a part of the display device, and the image and the sensor signal generated from the external device can be provided to the display device through the signal transmission film. SUMMARY

[0004] An object of the present disclosure is to provide a display device including a signal transmission film.

[0005] However, the present disclosure is not limited to the above-described object, and can be variously extended without departing from the scope of the idea and the field of the present disclosure.

[0006] In order to achieve the aforementioned object of the present disclosure, a display device according to an exemplary embodiment of the present disclosure can include a display panel; and a signal transmission film including a first extension portion extending in a first direction and forming a first contact hole at a first side portion, a second extension portion extending from the first side portion of the first extension portion in a second direction different from the first direction, and a first dummy pattern disposed adjacent to the first contact hole at the first side portion, the signal transmission film being connected to one side of the display panel.

[0007] In an exemplary embodiment, the signal transmission film can further include a third extension portion extending from a side portion of the second extension portion in the second direction, and a fourth extension portion protruding from the first extension portion in a third direction opposite to the second direction.

[0008] In an exemplary embodiment, the fourth extension portion of the signal transmission film can be curved with the first direction as an axis, such that the signal transmission film is located on a bottom surface of the display panel.

[0009] In an illustrative embodiment, the fourth extension portion can be connected to the one side of the display panel, and the first, second, third, and fourth extension portions can be integrally formed by being connected to each other.

[0010] In an illustrative embodiment, the signal transfer film can further include a first lower wiring disposed on the first side portion of the first extension portion, the second extension portion, and the third extension portion, and a first upper wiring disposed on one of the first side portion of the first extension portion and the fourth extension portion.

[0011] In an illustrative embodiment, the first lower wiring and the first upper wiring can be connected by the first contact hole in the first side portion of the first extension portion.

[0012] In an illustrative embodiment, the first lower wiring and the first upper wiring can be disposed on different layers from each other.

[0013] In an illustrative embodiment, the first dummy pattern can include a first lower dummy pattern disposed apart from the first lower wiring, and a first upper dummy pattern disposed apart from the first upper wiring.

[0014] In an illustrative embodiment, the first lower dummy pattern and the first upper dummy pattern can be disposed on different layers from each other and exist overlapping each other.

[0015] In an illustrative embodiment, the signal transfer film can further include a lower substrate, a first insulating layer disposed on the lower substrate and covering the first lower dummy pattern in the first side portion of the first extension portion and having the first contact hole exposing a portion of the first lower wiring, a second insulating layer disposed on the first insulating layer and covering the first upper dummy pattern and the first upper wiring, and an upper substrate disposed on the second insulating layer.

[0016] In an illustrative embodiment, the upper substrate can form a step protruding from a periphery in a portion in which the respective first contact holes, the first upper dummy pattern, and the first lower dummy pattern are formed.

[0017] In an illustrative embodiment, a second contact hole can be formed in a second side portion of the second extension portion, and the signal transfer film can further include a second dummy pattern disposed adjacent to the second contact hole.

[0018] In an illustrative embodiment, the signal transmission film can further include a second lower wiring disposed on the second side portion of the second extension portion and the third extension portion, and a second upper wiring disposed on one of the second side portion of the second extension portion, the first extension portion, and the fourth extension portion.

[0019] In an illustrative embodiment, the second lower wiring and the second upper wiring can be connected by the second contact hole on the second side portion of the second extension portion, and the second lower wiring and the second upper wiring can be disposed on different layers from each other.

[0020] In an illustrative embodiment, the first lower wiring and the second lower wiring can be disposed on the same layer, and the first upper wiring and the second upper wiring can be disposed on the same layer.

[0021] In an illustrative embodiment, the second dummy pattern can include a second lower dummy pattern disposed apart from the second lower wiring, and a second upper dummy pattern disposed apart from the second upper wiring.

[0022] In an illustrative embodiment, the signal transmission film can further include a third wiring disposed on one of the third extension portion, the second extension portion, the first extension portion, and the fourth extension portion.

[0023] In an illustrative embodiment, the third wiring can not overlap the first lower wiring and the second lower wiring on the third extension portion, and a portion of the third wiring can overlap the first upper wiring or the second upper wiring on the second extension portion and the first extension portion.

[0024] In an illustrative embodiment, the display panel can include a display structure, and a sensing structure disposed on the display structure, and the signal transmission film can be connected to the sensing structure.

[0025] In an illustrative embodiment, the display panel can further include a protection member disposed on the sensing structure.

[0026] (EFFECT OF DISCLOSURE)

[0027] A display device according to an illustrative embodiment of the disclosure includes a first dummy pattern and a second dummy pattern, thereby forming a third step and a fourth step around a first step and a second step. Thus, the upper protection film can additionally contact the third step and the fourth step, and the adhesion of the upper protection film and the signal transmission film on the first side portion can be relatively increased. That is, the upper protection film and the signal transmission film can not be separated on the first side portion during the bending of the signal transmission film, and the misalignment of the signal transmission film can be prevented.

[0028] However, the effects of the present disclosure are not limited to the above-described effects, and various extensions can be made without departing from the scope of the concept and the field of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 and Figure 2 is a plan view showing a display device according to an illustrative embodiment of the present disclosure.

[0030] Figure 3 is a perspective view showing a display panel included in the display device of Figure 1 .

[0031] Figure 4 is a cross-sectional view for explaining a light emitting structure included in the display panel of Figure 3 .

[0032] Figure 5 is a cross-sectional view for explaining a sensing structure included in the display panel of Figure 3 .

[0033] Figure 6 is a plan view for explaining a signal transfer film included in the display device of Figure 1 and Figure 2 .

[0034] Figure 7 is a partial enlarged plan view that enlargedly shows a region "A" of Figure 6 .

[0035] Figure 8A is a cross-sectional view taken along a line I-I' of Figure 7 .

[0036] Figure 8B is a cross-sectional view taken along a line II-II' of Figure 7 .

[0037] Figure 9 is a cross-sectional view for explaining a signal transfer film included in a conventional display device.

[0038] Figures 10 to 13 is a plan view showing a manufacturing method of a display device according to an illustrative embodiment of the present disclosure.

[0039] (Explanation of Reference Numerals)

[0040] 100: display device 110: substrate

[0041] 130: active layer 150: gate insulating layer

[0042] 170: gate electrode 190: interlayer insulating layer

[0043] 210: source electrode 230: drain electrode

[0044] 250: semiconductor element 270: planarization layer

[0045] 290: lower electrode 300: display panel

[0046] 301: display structure 302: sensing structure

[0047] 303: protective member 310: pixel defining film

[0048] 330: light emitting layer 340: upper electrode

[0049] 382: first sensing electrode 384: second sensing electrode

[0050] 386: connecting electrode 410: package substrate

[0051] 500: signal transfer film 510: first extension

[0052] 511: first contact hole 520: second extension

[0053] 521: second contact hole 530: third extension

[0054] 540: fourth extension 541: first curved extension

[0055] 542: second curved extension 543: third curved extension

[0056] 610: first lower wiring 611: first upper wiring

[0057] 620: second lower wiring 621: second upper wiring

[0058] 630: third wiring 710: first dummy pattern

[0059] 711: first lower dummy pattern 712: first upper dummy pattern

[0060] 720: second dummy pattern 721: second lower dummy pattern

[0061] 722: second upper dummy pattern 810: lower substrate

[0062] 820: lower insulating layer 830: first insulating layer

[0063] 840: second insulating layer 850: upper insulating layer

[0064] 860: upper substrate 861: first step

[0065] 862: Second step 863: Third step

[0066] 864: Fourth step; 910: Upper protective film

[0067] 911: Adhesive film; 912: Protective component

[0068] 920: Lower protective film Detailed Implementation

[0069] Hereinafter, a display device and a method of manufacturing the display device according to exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or similar reference numerals are used for the same or similar components.

[0070] Figure 1 as well as Figure 2 This is a top view showing a display device according to an exemplary embodiment of the present disclosure. Figure 3 It is shown that it includes Figure 1 A perspective view of the display panel in a display device. For example, Figure 1 The image shows a top view of the display device 100 before the signal transmission film 500 is bent. Figure 2 The image shows a top view of the back of the display device 100 after the signal transmission film 500 has been bent.

[0071] Reference Figure 1 , Figure 2 as well as Figure 3 The display device 100 may include a display panel 300, a signal transmission film 500, etc. Here, the display panel 300 may include a display structure 301, a sensing structure 302, and a protective component 303, and the display device 100 may be divided into a first surface S1 (e.g., the front surface) and a second surface S2 (e.g., the back surface). In an exemplary embodiment, the signal transmission film 500 may be connected to the sensing structure 302.

[0072] A display structure 301 can be provided. Multiple pixels included in the display structure 301 ( Figure 4 The lower electrode 290, the light-emitting layer 330, and the upper electrode 340 emit light. Additionally, the display structure 301 may also include a plurality of semiconductor elements (e.g., [missing information]) that control the pixels and are electrically connected to the pixels. Figure 4The semiconductor element can receive an image signal provided from an external device and control the pixels. Thus, the display structure 301 can display an image. For example, the image signal can include a gate signal, a data signal, a data initialization signal, an initialization voltage, a light emission control signal, a power voltage, and the like. The external device and the display structure 301 can be electrically connected through a printed circuit board (PCB), a flexible printed circuit board (FPCB), a flexible flat cable (FFC), or the like.

[0073] A sensing structure 302 can be disposed on the display structure 301. For example, the sensing structure 302 can be substantially transparent. The image can be transmitted through the sensing structure 302. The sensing structure 302 can include a first sensing electrode 382 and a second sensing electrode 384. Figure 5 The sensing structure 302 can sense a part of the user's body or an object, etc. located on the first surface S1 of the display device 100 through the sensing electrodes. In other words, an external device can generate a sensing signal, and the sensing signal generated from the external device can be transmitted to the sensing electrodes through the signal transmission film 500. The sensing structure 302 can receive the sensing signal transmitted to the sensing electrodes and sense a part of the user's body or an object, etc. located on the front surface of the display device 100. In an exemplary embodiment, the sensing electrodes of the sensing structure 302 can include a proximity sensing electrode that senses whether a user or an object is close to the display device 100 or a touch sensing electrode that senses a part of the user's body.

[0074] A protective member 303 can be disposed on the sensing structure 302. The protective member 303 can be substantially transparent. The image transmitted through the sensing structure 302 can be transmitted through the protective member 303 and can be visually recognized by the user of the display device 100. In addition, even though the protective member 303 is disposed on the sensing structure 302, the sensing structure 302 can sense a part of the user's body or an object, etc. on the protective member 303. The protective member 303 can protect the display structure 301 and the sensing structure 302. The protective member 303 can include a strengthened glass, a strengthened plastic, or the like.

[0075] The signal transmission film 500 can be connected to one side of the display panel 300. As described before, the signal transmission film 500 can be connected with the sensing structure 302. For example, the sensing signal generated from the external device can be transmitted to the sensing structure 302 through the signal transmission film 500, and the sensing signal transmitted to the sensing structure 302 can also be transmitted to the external device through the signal transmission film 500. For example, as shown in FIG. 1B, the signal transmission film 500 can be connected to one side of the display panel 300 (e.g., the sensing structure 302). For example, as shown in FIG. 1C, the signal transmission film 500 can be connected to one side of the display panel 300 (e.g., the sensing structure 302) and can be bent in the first direction D1. For example, as shown in FIG. 1D, the signal transmission film 500 can be connected to one side of the display panel 300 (e.g., the sensing structure 302) and can be bent in the second direction D2. Figure 1 For example, as shown in FIG. 1C, the signal transmission film 500 can be connected to one side of the display panel 300 (e.g., the sensing structure 302) and can be bent in the first direction D1. For example, as shown in FIG. 1D, the signal transmission film 500 can be connected to one side of the display panel 300 (e.g., the sensing structure 302) and can be bent in the second direction D2. Figure 2 For example, as shown in FIG. 1C, the signal transmission film 500 can be connected to one side of the display panel 300 (e.g., the sensing structure 302) and can be bent in the first direction D1. For example, as shown in FIG. 1D, the signal transmission film 500 can be connected to one side of the display panel 300 (e.g., the sensing structure 302) and can be bent in the second direction D2.

[0076] Figure 4 is a cross-sectional view illustrating a light emitting structure included in a display panel of Figure 3 .

[0077] Referring to Figure 4 , the display structure 301 can include a substrate 110, a semiconductor element 250, a planarization layer 270, a lower electrode 290, a pixel defining film 310, a light emitting layer 330, an upper electrode 340, an encapsulation substrate 410, etc. The semiconductor element 250 can include an active layer 130, a gate insulating layer 150, a gate electrode 170, an interlayer insulating layer 190, a source electrode 210, and a drain electrode 230.

[0078] The substrate 110 can be provided to include a transparent or non-transparent material. The substrate 110 can include a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a F-doped quartz substrate, a soda lime glass substrate, a non-alkali glass substrate, etc.

[0079] Alternatively, the substrate 110 can also be composed of a transparent resin substrate having flexibility. As an example of the transparent resin substrate that can be used as the substrate 110, a polyimide substrate can be given. In such a case, the polyimide substrate can be composed of a first polyimide layer, a barrier film layer, a second polyimide layer, and the like. For example, the polyimide substrate can have a structure in which the first polyimide layer, the barrier film layer, and the second polyimide layer are sequentially stacked on a hard glass substrate. In the manufacturing method of the display device 100, after the insulating layer (e.g., a buffer layer) is provided on the second polyimide layer of the polyimide substrate, the upper structure (e.g., the semiconductor element 250, the lower electrode 290, the light-emitting layer 330, the upper electrode 340, and the like) can be provided on the insulating layer. After the upper structure is formed, the hard glass substrate can be removed. That is, since the polyimide substrate is thin and flexible, it can be difficult to directly form the upper structure on the polyimide substrate. In view of this, after the upper structure is formed using the hard glass substrate, the glass substrate is removed, so that the polyimide substrate can be used as the substrate 110.

[0080] The active layer 130 can be provided on the substrate 110, and can include a metal oxide semiconductor, an inorganic semiconductor (e.g., amorphous silicon, poly silicon), or an organic semiconductor, and the like. The active layer 130 can include a channel region, a source region, and a drain region.

[0081] The gate insulating layer 150 can be provided on the active layer 130. The gate insulating layer 150 can cover the active layer 130 on the substrate 110, and can be provided in its entirety on the substrate 110. The gate insulating layer 150 can sufficiently cover the active layer 130 on the substrate 110, and can have a top surface that is substantially flat without a step around the active layer 130. Alternatively, the gate insulating layer 150 can cover the active layer 130 on the substrate 110, and can be provided along the profile of the active layer 130 with a uniform thickness. The gate insulating layer 150 can include a silicon compound, a metal oxide, and the like. In another exemplary embodiment, the gate insulating layer 150 can also have a multilayer structure including a plurality of insulating layers. For example, the plurality of insulating layers can differ from each other in thickness or include different substances from each other.

[0082] The gate electrode 170 can be disposed on a portion of the gate insulating layer 150 where the active layer 130 is present below (e.g., the channel region of the active layer 130). The gate electrode 170 can include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, or the like. These can be used alone or in combination with each other. In another exemplary embodiment, the gate electrode 170 can include a multilayer structure including a plurality of metal layers. For example, the plurality of metal layers can differ from each other in thickness or include different substances from each other.

[0083] The interlayer insulating layer 190 can be disposed on the gate electrode 170. The interlayer insulating layer 190 can cover the gate electrode 170 on the gate insulating layer 150 and can be disposed integrally on the gate insulating layer 150. The interlayer insulating layer 190 can sufficiently cover the gate electrode 170 on the gate insulating layer 150 and can have a substantially flat top surface without forming a step around the gate electrode 170. Alternatively, the interlayer insulating layer 190 can cover the gate electrode 170 on the gate insulating layer 150 and can be disposed along the profile of the gate electrode 170 with a uniform thickness. The interlayer insulating layer 190 can include a silicon compound, a metal oxide, or the like. In another exemplary embodiment, the interlayer insulating layer 190 can also have a multilayer structure including a plurality of insulating layers. For example, the plurality of insulating layers can differ from each other in thickness or include different substances from each other.

[0084] The source electrode 210 and the drain electrode 230 can be disposed on the interlayer insulating layer 190. The source electrode 210 can be connected to the source region of the active layer 130 through a contact hole formed by removing a first portion of the gate insulating layer 150 and the interlayer insulating layer 190, and the drain electrode 230 can be connected to the drain region of the active layer 130 through a contact hole formed by removing a second portion of the gate insulating layer 150 and the interlayer insulating layer 190. The source electrode 210 and the drain electrode 230 can each include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, or the like. These can be used alone or in combination with each other. In another exemplary embodiment, the source electrode 210 and the drain electrode 230 can each also have a multilayer structure including a plurality of metal layers. For example, the plurality of metal layers can differ from each other in thickness or include different substances from each other.

[0085] Thus, the semiconductor element 250 including the active layer 130, the gate insulating layer 150, the gate electrode 170, the interlayer insulating layer 190, the source electrode 210, and the drain electrode 230 can be disposed.

[0086] However, although described as the display device 100 has a structure including one transistor (e.g., the semiconductor element 250), the structure of the present disclosure is not limited thereto. For example, the display device 100 can also have a structure including at least two transistors and at least one capacitor.

[0087] In addition, although described as the semiconductor element 250 has a top-gate structure, the structure of the present disclosure is not limited thereto. For example, the semiconductor element 250 can also have a bottom-gate structure and / or a dual-gate structure.

[0088] A planarization layer 270 can be provided on the interlayer insulating layer 190, the source electrode 210, and the drain electrode 230. For example, the planarization layer 270 can be provided on the interlayer insulating layer 190 with a relatively thick thickness so as to sufficiently cover the source electrode 210 and the drain electrode 230, in which case the planarization layer 270 can have a substantially planar top surface. In order to achieve such a planar top surface of the planarization layer 270, a planarization process can be added to the planarization layer 270. A portion of the top surface of the drain electrode 230 can be exposed through a contact hole formed by removing a portion of the planarization layer 270. The planarization layer 270 can include an organic substance or an inorganic substance, or the like. In an exemplary embodiment, the planarization layer 270 can include an organic substance.

[0089] A lower electrode 290 can be provided on the planarization layer 270. The lower electrode 290 can be connected to the drain electrode 230 through the contact hole of the planarization layer 270. In addition, the lower electrode 290 can be electrically connected to the semiconductor element 250. The lower electrode 290 can include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, or the like. These can be used alone or in combination with each other. In another exemplary embodiment, the lower electrode 290 can also have a multilayer structure including a plurality of metal layers. For example, the plurality of metal layers can differ in thickness from each other or include different substances from each other.

[0090] A pixel defining film 310 can be provided on a portion of the lower electrode 290 and the planarization layer 270. The pixel defining film 310 can cover both side portions of the lower electrode 290 and can expose a portion of the top surface of the lower electrode 290. The pixel defining film 310 can be composed of an organic substance or an inorganic substance. In an exemplary embodiment, the pixel defining film 310 can include an organic substance.

[0091] The light emitting layer 330 can be disposed on the lower electrode 290 exposed by the pixel defining film 310. The light emitting layer 330 can be formed using at least one of light emitting substances that can emit different colors of light (i.e., red light, green light, blue light, etc.) according to the pixels. Unlike this, the light emitting layer 330 can emit white light as a whole by laminating a plurality of light emitting substances that can generate different colors of light such as red light, green light, blue light, etc. In this case, a color filter (e.g., disposed on the bottom surface or the top surface of the encapsulation substrate 410 so as to overlap the light emitting layer 330) can also be disposed on the light emitting layer 330. The color filter can include at least one of a red color filter, a green color filter, a blue color filter. Alternatively, the color filter can also include a yellow color filter, a cyan color filter, and a magenta color filter. The color filter can include a photosensitive resin or a color photoresist.

[0092] The upper electrode 340 can be disposed on the pixel defining film 310 and the light emitting layer 330. The upper electrode 340 can include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, etc. These can be used alone or in combination with each other. In another exemplary embodiment, the upper electrode 340 can also have a multi-layer structure including a plurality of metal layers. For example, the plurality of metal layers can have different thicknesses from each other or include different substances from each other.

[0093] The encapsulation substrate 410 can be disposed on the upper electrode 340. The encapsulation substrate 410 can be opposite to the substrate 110. The encapsulation substrate 410 can include substantially the same material as the substrate 110. For example, the encapsulation substrate 410 can include a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped quartz substrate, a soda lime glass substrate, an alkali-free glass substrate, etc. In another exemplary embodiment, the encapsulation substrate 410 can also include a transparent inorganic substance or a flexible plastic. For example, the encapsulation substrate 410 can include a transparent resin substrate having flexibility. In this case, in order to improve the flexibility of the display structure 301, a structure in which at least one inorganic layer and at least one organic layer are alternately laminated can be provided. The laminated structure can be composed of a first inorganic layer, an organic layer, and a second inorganic layer. For example, a first inorganic layer having flexibility can be disposed along the contour of the upper electrode 340, an organic layer having flexibility can be disposed on the first inorganic layer, and a second inorganic layer having flexibility can be disposed on the organic layer. That is, the laminated structure can correspond to a thin film encapsulation structure directly contacting the upper electrode 340.

[0094] Thus, a display structure 301 including the substrate 110, the semiconductor element 250, the planarization layer 270, the lower electrode 290, the pixel defining film 310, the light emitting layer 330, the upper electrode 340, and the encapsulation substrate 410 can be provided.

[0095] Figure 5 is a cross-sectional view for explaining a sensing structure included in a display panel of Figure 3

[0096] Referring to Figure 5 , the sensing structure 302 can include first sensing electrodes 382, second sensing electrodes 384, and connection electrodes 386. For example, the first sensing electrodes 382 and the second sensing electrodes 384 can be disposed on the package substrate 410. Optionally, an insulating layer can be disposed between the package substrate 410 and the first sensing electrodes 382 and the second sensing electrodes 384. The first sensing electrodes 382 can each extend in a second direction D2 (e.g., a direction orthogonal to the first direction D1) and can be disposed apart from each other in the first direction D1. The second sensing electrodes 384 can be disposed apart from each other in the second direction D2 between two first sensing electrodes 382 adjacent among the first sensing electrodes 382. For example, the first sensing electrodes 382 and the second sensing electrodes 384 can each include carbon nano-tubes (CNT), transparent conductive oxides, indium tin oxide (ITO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), graphene, silver nano-wires (Ag nano-wire; AgNW), copper (Cu), chromium (Cr), or the like.

[0097] An insulating layer can be disposed on the first sensing electrodes 382 and the second sensing electrodes 384. The insulating layer can cover the first sensing electrodes 382 and the second sensing electrodes 384 and be disposed along the profile of the first sensing electrodes 382 and the second sensing electrodes 384 with a uniform thickness. The insulating layer can include an organic substance or an inorganic substance.

[0098] The connection electrodes 386 can be disposed on the insulating layer. The connection electrodes 386 can electrically connect two second sensing electrodes 384 adjacent in the first direction D1 among the second sensing electrodes 384 through a contact hole formed by removing a portion of the insulating layer. For example, the connection electrodes 386 can include the same substance as the first sensing electrodes 382 and the second sensing electrodes 384. Optionally, the connection electrodes 386 can also include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, or the like. These can be used alone or in combination with each other.

[0099] Thus, the sensing structure 302 including the first sensing electrodes 382, the second sensing electrodes 384, and the connection electrodes 386 can be provided.

[0100] Figure 6 is a cross-sectional view for explaining a sensing structure included in a display panel of Figure 1 and​Figure 2 A top view of the signal transmission membrane in a display device. Figure 7 It is shown in magnification Figure 6 A magnified top view of area "A". For example, Figure 6 The signal transmission film 500 is shown bent and located on the second surface S2 of the display device 100. Figure 2 The signal transmission membrane 500 shown is shown.

[0101] Reference Figure 6 as well as Figure 7 The signal transmission film 500 may include a first lower wiring 610, a first upper wiring 611, a second lower wiring 620, a second upper wiring 621, a third wiring 630, a first dummy pattern 710, a second dummy pattern 720, etc. Additionally, the signal transmission film 500 may also include a first extension 510, a second extension 520, a third extension 530, and a fourth extension 540. Here, the fourth extension 540 may include a first curved extension 541, a second curved extension 542, and a third curved extension 543.

[0102] The first extension 510 may extend in a first direction D1, and the first contact hole 511 may be located on a first side of the first extension 510 (e.g., the left side of the first extension 510). In an exemplary embodiment, a first dummy pattern 710 may be arranged adjacent to the first contact hole 511.

[0103] The second extension 520 can extend from the first side portion of the first extension 510 toward a second direction D2 orthogonal to the first direction D1. The second contact hole 521 can be located on the second side portion of the second extension 520 (e.g., the right side portion of the second extension 520). In an exemplary embodiment, a second dummy pattern 720 can be arranged adjacent to the second contact hole 521.

[0104] The third extension 530 can extend from the side of the second extension 520 (e.g., the left side of the second extension 520) in the second direction D2. The end portion of the third extension 530 (e.g., the portion opposite to the end of the third extension 530 adjacent to the second extension 520) can be electrically connected to an external device and can receive a sensing voltage from the external device. The received sensing voltage can be applied to the first lower wiring 610, the second lower wiring 620, and the first portion of the third wiring 630 disposed on the third extension 530. In other words, the end portion of the third extension 530 can correspond to the signal input portion of the signal transmission membrane 500.

[0105] The fourth extension 540 can protrude from the central portion of the first extension 510 (for example, from the portion of the first extension 510 where the first side portion is located in the opposite direction of the first direction D1) in a third direction D3 orthogonal to the first direction D1. The first curved extension 541 can be located on the left side of the second curved extension 542, the third curved extension 543 can be located on the right side of the second curved extension 542, and the second curved extension 542 can be located between the first curved extension 541 and the third curved extension 543. In addition, the first curved extension 541, the second curved extension 542, and the third curved extension 543 can be connected to the sensing structure 302 and can be curved with the first direction D1 as an axis. The sensing voltage applied to the first lower wiring 610, the second lower wiring 620, and the third wiring 630 can be transmitted to the first upper wiring 611 disposed at the first curved extension 541, the second upper wiring 621 disposed at the second curved extension 542, and the second portion of the third wiring 630 disposed at the third curved extension 543. In other words, the fourth extension 540 can correspond to a signal output portion of the signal transmission film 500, and the sensing voltage transmitted to the first upper wiring 611, the second upper wiring 621, and the second portion of the third wiring 630 can be provided to the sensing structure 302.

[0106] The first lower wiring 610 can be disposed at the third extension 530, the second extension 520, and the first side portion of the first extension 510. The first upper wiring 611 can be disposed at the first side portion of the first extension 510 and the first curved extension 541. In an exemplary embodiment, the first lower wiring 610 and the first upper wiring 611 can be located at different layers from each other and can be connected through the first contact hole 511 located at the first side portion of the first extension 510. For example, a first end portion of the first lower wiring 610 can be located at the end portion of the third extension 530, and a second end portion of the first lower wiring 610 opposite to the first end portion can be located at the first contact hole 511. A first end portion of the first upper wiring 611 can be located at the first contact hole 511, and a second end portion of the first upper wiring 611 opposite to the first end portion can be located at the first curved extension 541. In an exemplary embodiment, as shown in FIG. 8, the first lower wiring 610 and the first upper wiring 611 can overlap each other in order to be connected at the portion where the first contact hole 511 is present, and the portion where the first contact hole 511 is present can form a first step 861 protruding from the periphery. Figure 8A

[0107] ​The second lower wiring 620 can be disposed at the second side portion of the third extension portion 530 and the second extension portion 520. The second upper wiring 621 can be disposed at the second side portion of the second extension portion 520, the first extension portion 510, and the second curved extension portion 542. In an exemplary embodiment, the second lower wiring 620 and the second upper wiring 621 can be located at different layers from each other, and can be connected by the second contact hole 521 located at the second side portion of the second extension portion 520. For example, a first end portion of the second lower wiring 620 can be located at the distal end portion of the third extension portion 530, and a second end portion of the second lower wiring 620 opposite to the first end portion can be located at the second contact hole 521. A first end portion of the second upper wiring 621 can be located at the second contact hole 521, and a second end portion of the second upper wiring 621 opposite to the first end portion can be located at the second curved extension portion 542. In an exemplary embodiment, for example, Figure 8B As shown, at a portion where the second contact hole 521 is present, the second lower wiring 620 and the second upper wiring 621 can overlap each other for connection, and the portion where the second contact hole 521 is present can form a second step 862 protruding from the periphery.

[0108] The third wiring 630 can be disposed at the third extension portion 530, the second extension portion 520, the first extension portion 510, and the third curved extension portion 543. In an exemplary embodiment, the third wiring 630 can not overlap the first lower wiring 610 and the second lower wiring 620 at the third extension portion 530, and a portion of the third wiring 630 can overlap the first upper wiring 611 or the second upper wiring 621 at the second extension portion 520 and the first extension portion 510 (for example, a portion of the third wiring 630 and the second upper wiring 621 cross each other at a portion adjacent to the second curved extension portion 542). In addition, the third wiring 630, the first lower wiring 610, and the second lower wiring 620 can be located at the same layer and can be disposed apart from each other. Further, the third wiring 630, the first upper wiring 611, and the second upper wiring 621 can be located at different layers from each other.

[0109] Thus, a signal transmission film 500 including the first extension portion 510, the second extension portion 520, the third extension portion 530, the fourth extension portion 540, the first lower wiring 610, the first upper wiring 611, the second lower wiring 620, the second upper wiring 621, the third wiring 630, and the like can be provided. Here, the first extension portion 510, the second extension portion 520, the third extension portion 530, and the fourth extension portion 540 can be integrally formed by being connected to each other.

[0110] However, although it is described that the first lower wiring 610, the first upper wiring 611, the second lower wiring 620, the second upper wiring 621, and the third wiring 630 each include one wiring, the structure of this disclosure is not limited to this. For example, the first lower wiring 610, the first upper wiring 611, the second lower wiring 620, the second upper wiring 621, and the third wiring 630 may each include multiple wirings. In such a case, the first contact hole 511 and the second contact hole 521 may each include multiple contact holes.

[0111] like Figure 7 As shown, a first dummy pattern 710 can be configured adjacent to the first contact hole 511. For example, the first dummy pattern 710 can be configured on the first extension 510. The first dummy pattern 710 may not overlap with the first lower wiring 610, the second lower wiring 620, the first upper wiring 611, the second upper wiring 621, and the third wiring 630. In an exemplary embodiment, as... Figure 8A As shown, a first dummy pattern 710 can be configured at a distance from the portion where the first contact hole 511 exists, in the first direction D1. The portion where the first dummy pattern 710 is configured can form a third step 863 protruding from the periphery.

[0112] The second dummy pattern 720 can be configured adjacent to the second contact hole 521. For example, the second dummy pattern 720 can be configured on the second extension 520. The second dummy pattern 720 may not overlap with the first lower wiring 610, the second lower wiring 620, the first upper wiring 611, the second upper wiring 621, and the third wiring 630. In an exemplary embodiment, such as Figure 8B As shown, a second dummy pattern 720 can be configured in a direction opposite to the first direction D1 from the portion where the second contact hole 521 exists, and the portion where the second dummy pattern 720 is configured can form a fourth step 864 protruding from the periphery.

[0113] The top surfaces of the first step 861 formed in the portion where the first contact hole 511 exists, the second step 862 formed in the portion where the second contact hole 521 exists, the third step 863 formed in the portion where the first dummy pattern 710 is disposed, and the fourth step 864 formed in the portion where the second dummy pattern 720 is disposed can be substantially the same (e.g., the height from the top surface of the lower substrate 810 to said top surface). In other words, the display device 100 includes the first dummy pattern 710 and the second dummy pattern 720, so that the third step 863 and the fourth step 864 can be formed in the portions adjacent to the portions where the first step 861 and the second step 862 are formed.

[0114] In the manufacturing process of conventional display devices, protective films (e.g., release paper or pads) can be disposed on the top and bottom surfaces of the signal transmission film 500 to protect the signal transmission film 500. The signal transmission film 500 with the protective film attached can be connected to the display panel 300 (see reference). Figure 10 as well as Figure 11 For example, such as Figure 10 As shown, before the signal transmission film 500 is bent, the upper protective film 910 can be located on the top surface of the signal transmission film 500, which exists parallel to the first surface S1 of the display device 100. Additionally, as... Figure 11 As shown, before the signal transmission film 500 is bent, the lower protective film 920 can be located on the bottom surface of the signal transmission film 500, which exists parallel to the second surface S2 of the display device 100. Figure 12 As shown, after the signal transmission film 500, to which the upper protective film 910 and the lower protective film 920 are attached, is connected to the display panel 300, the lower protective film 920 can be removed from the bottom surface of the signal transmission film 500. Figure 13 As shown, after removing the lower protective film 920, the fourth extension 540 can be bent about the first direction D1. Here, the bending axis of the signal transmission film 500 can correspond to the fourth extension 540, and the bending axis of the upper protective film 910 can be the portion adjacent to the first side portion of the first extension 510 of the signal transmission film 500. For example, a portion of the upper protective film 910, which overlaps with the third extension 530, can be fixed to the manufacturing equipment, thereby bending the signal transmission film 500 with the upper protective film 910 attached to it.

[0115] To configure multiple wirings within the limited space of the signal transmission film 500, a first lower wiring 610 and a first upper wiring 611 can be connected via a first contact hole 511, and a second lower wiring 620 and a second upper wiring 621 can be connected via a second contact hole 521. However, for the lower wirings (e.g., the first lower wiring 610 or the second lower wiring 620) and the upper wirings (e.g., the first upper wiring 611 or the second upper wiring 621) to be connected, a portion of the lower wiring and a portion of the upper wiring need to overlap, and the overlapping portion of the wiring can form a step that protrudes beyond the surrounding area. In such a case, the bending axis of the signal transmission film 500 is different from the bending axis of the upper protective film 910, and due to the first step 861 formed on the first side, the adhesive force between the upper protective film 910 and the signal transmission film 500 may be relatively low on the first side (see reference). Figure 9 Therefore, during the bending process, the upper protective film 910 may separate from the signal transmission film 500 on the first side, and the signal transmission film 500 may tilt on the second surface S2 of the display device. In other words, after the signal transmission film 500 is bent, misalignment of the signal transmission film 500 may occur.

[0116] The display device 100 according to the exemplary embodiments of the present disclosure includes the first dummy pattern 710 and the second dummy pattern 720, so that the third step 863 and the fourth step 864 can be formed around the first step 861 and the second step 862. Thus, the upper protective film 910 can additionally contact the third step 863 and the fourth step 864, and the adhesion of the upper protective film 910 and the signal transmission film 500 can be relatively increased at the first side portion. That is, the upper protective film 910 and the signal transmission film 500 can not be separated at the first side portion during the signal transmission film 500 is bent, and the misalignment of the signal transmission film 500 can be prevented.

[0117] However, although it is described in the present disclosure that the first contact hole 511 and the first dummy pattern 710 are located only at the first side portion, and the second contact hole 521 and the second dummy pattern 720 are located only at the second side portion, the structure of the present disclosure is not limited thereto. For example, the contact hole connecting the upper and lower wirings can be formed in at least one of the first extension portion 510, the second extension portion 520, the third extension portion 530, and the fourth extension portion 540, and the dummy pattern can be disposed around the contact hole.

[0118] Figure 8A is a cross-sectional view taken along the line I-I' of Figure 7 is a cross-sectional view taken along the line II-II' of Figure 8B is a cross-sectional view taken along the line III-III' of Figure 7 is a cross-sectional view taken along the line IV-IV' of Figure 9 is a cross-sectional view for explaining a signal transmission film included in a conventional display device.

[0119] Referring to Figure 8A and Figure 8B , the signal transmission film 500 can include a lower substrate 810, a lower insulating layer 820, a first insulating layer 830, a second insulating layer 840, an upper insulating layer 850, an upper substrate 860, a first lower wiring 610, a first upper wiring 611, a second lower wiring 620, a second upper wiring 621, a third wiring 630, a first dummy pattern 710, a second dummy pattern 720, and the like. Here, the first dummy pattern 710 can include a first lower dummy pattern 711 and a first upper dummy pattern 712, and the second dummy pattern 720 can include a second lower dummy pattern 721 and a second upper dummy pattern 722.

[0120] A lower substrate 810 can be provided. The lower substrate 810 can include polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), polycarbonate (PC), polystyrene (PS), polysulfone (PSU), polyethylene (PE), polyphthalamide (PPA), polyethersulfone (PES), polyarylate (PAR), polycarbonate oxide (PCO), modified polyphenylene oxide (MPPO), urethane, thermoplastic polyurethane (TPU), or the like. The lower substrate 810 can further include a light-shielding material in order to have black color. The light-shielding material can include carbon black, titanium nitride oxide, titanium black, phenylene black, aniline black, cyanine black, nigrosine acid black, black resin, or the like.

[0121] A lower insulating layer 820 can be disposed on the lower substrate 810. The lower insulating layer 820 can be disposed in its entirety on the lower substrate 810. The lower insulating layer 820 can include an organic insulating material such as photoresist, polyacryl-based resin, polyimide-based resin, polyamide-based resin, siloxane-based resin, acryl-based resin, epoxy-based resin, or the like.

[0122] The first lower wiring 610 can be disposed on the first side portion of the first extension portion 510 on the lower insulating layer 820. The first lower wiring 610 can be disposed on the third extension portion 530, the second extension portion 520, and the first side portion of the first extension portion 510 on the lower insulating layer 820. In an exemplary embodiment, the first lower wiring 610 can overlap at least a portion of the first upper wiring 611 on the first side portion. In addition, the first lower wiring 610 can not be disposed on the remaining portion of the first extension portion 510 except for the first side portion.

[0123] The second lower wiring 620 can be disposed on the second side portion of the second extension portion 520 on the lower insulating layer 820. The second lower wiring 620 can be disposed on the third extension portion 530, the second side portion of the second extension portion 520 on the lower insulating layer 820. In an exemplary embodiment, the second lower wiring 620 can overlap at least a portion of the second upper wiring 621 on the first side portion. In addition, the second lower wiring 620 can not be disposed on the remaining portion of the second extension portion 520 except for the second side portion.

[0124] The first lower dummy pattern 711 can be disposed apart from the first lower wiring 610 on the lower insulating layer 820 on the first side portion, and the second lower dummy pattern 721 can be disposed apart from the second lower wiring 620 on the lower insulating layer 820 on the second side portion.

[0125] The third wiring 630 (see FIG. 10) can be disposed apart from the first lower wiring 610, the second lower wiring 620, the first lower dummy pattern 711, and the first upper dummy pattern 712 on the lower insulating layer 820. In an exemplary embodiment, the third wiring 630 can not overlap the first lower wiring 610 and the second lower wiring 620 on the third extension portion 530, and a portion of the third wiring 630 can overlap the first upper wiring 611 or the second upper wiring 621 on the second extension portion 520 and the first extension portion 510. Figure 6 ) can be disposed apart from the first lower wiring 610, the second lower wiring 620, the first lower dummy pattern 711, and the first upper dummy pattern 712 on the lower insulating layer 820. In an exemplary embodiment, the third wiring 630 can not overlap the first lower wiring 610 and the second lower wiring 620 on the third extension portion 530, and a portion of the third wiring 630 can overlap the first upper wiring 611 or the second upper wiring 621 on the second extension portion 520 and the first extension portion 510.

[0126] The first lower wiring 610, the second lower wiring 620, the third wiring 630, the first lower dummy pattern 711, and the second lower dummy pattern 721 each can include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, or the like. For example, the first lower wiring 610, the second lower wiring 620, the third wiring 630, the first lower dummy pattern 711, and the second lower dummy pattern 721 each can include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), an aluminum-containing alloy, aluminum nitride (AIN), a silver-containing alloy, tungsten nitride (WN), a copper-containing alloy, a molybdenum-containing alloy, titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide (IZO), or the like. These can be used alone or in combination with each other. In another illustrative embodiment, the first lower wiring 610, the second lower wiring 620, the third wiring 630, the first lower dummy pattern 711, and the second lower dummy pattern 721 each can also have a multilayer structure including a plurality of metal layers. For example, the plurality of metal layers can differ from each other in thickness or include different substances from each other.

[0127] The first lower wiring 610, the second lower wiring 620, the third wiring 630, the first lower dummy pattern 711, and the second lower dummy pattern 721 each can include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, or the like. For example, the first lower wiring 610, the second lower wiring 620, the third wiring 630, the first lower dummy pattern 711, and the second lower dummy pattern 721 each can include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), an aluminum-containing alloy, aluminum nitride (AIN), a silver-containing alloy, tungsten nitride (WN), a copper-containing alloy, a molybdenum-containing alloy, titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide (IZO), or the like. These can be used alone or in combination with each other. In another illustrative embodiment, the first lower wiring 610, the second lower wiring 620, the third wiring 630, the first lower dummy pattern 711, and the second lower dummy pattern 721 each can also have a multilayer structure including a plurality of metal layers. For example, the plurality of metal layers can differ from each other in thickness or include different substances from each other.

[0128] The first upper wiring 611 can be provided in the first contact hole 511. The first upper wiring 611 can be provided in the first side portion of the first extension 510 and the first curved extension 541 on the first insulating layer 830. In an exemplary embodiment, the first upper wiring 611 can overlap at least a portion of the first lower wiring 610 in the first side portion. In addition, the first upper wiring 611 can not be provided in the second extension 520 and the third extension 530.

[0129] The second upper wiring 621 can be provided in the second contact hole 521. The second upper wiring 621 can be provided in the second side portion of the second extension 520, the first extension 510, and the second curved extension 542 on the first insulating layer 830. In an exemplary embodiment, the second upper wiring 621 can overlap at least a portion of the second lower wiring 620 in the second side portion. In addition, the second upper wiring 621 can not be provided in the third extension 530.

[0130] The first upper dummy pattern 712 can be provided apart from the first upper wiring 611 on the first insulating layer 830 in the first side portion. In an exemplary embodiment, the first upper dummy pattern 712 and the first lower dummy pattern 711 can be provided in different layers from each other and can exist overlapping each other. Thus, the first dummy pattern 710 including the first lower dummy pattern 711 and the first upper dummy pattern 712 can be provided.

[0131] The second upper dummy pattern 722 can be provided apart from the second upper wiring 621 on the first insulating layer 830 in the second side portion. In an exemplary embodiment, the second upper dummy pattern 722 and the second lower dummy pattern 721 can be provided in different layers from each other and can exist overlapping each other. Thus, the second dummy pattern 720 including the second lower dummy pattern 721 and the second upper dummy pattern 722 can be provided.

[0132] The first upper wiring 611, the second upper wiring 621, the first upper dummy pattern 712, and the second upper dummy pattern 722 can each include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive substance, or the like. These can be used alone or in combination with each other. In another exemplary embodiment, the first upper wiring 611, the second upper wiring 621, the first upper dummy pattern 712, and the second upper dummy pattern 722 can each also have a multilayer structure including a plurality of metal layers. For example, the plurality of metal layers can differ in thickness from each other or include different substances from each other.

[0133] The second insulating layer 840 can be disposed on the first upper wiring 611, the second upper wiring 621, the first upper dummy pattern 712, and the second upper dummy pattern 722. The second insulating layer 840 can cover the first upper wiring 611, the second upper wiring 621, the first upper dummy pattern 712, and the second upper dummy pattern 722 on the first insulating layer 830, and be disposed in a uniform thickness along the outlines of the first upper wiring 611, the second upper wiring 621, the first upper dummy pattern 712, and the second upper dummy pattern 722. The second insulating layer 840 can include an inorganic insulating substance or an organic insulating substance.

[0134] The upper insulating layer 850 can be disposed on the second insulating layer 840. The upper insulating layer 850 can be integrally disposed on the second insulating layer 840. The upper insulating layer 850 can include an organic insulating substance.

[0135] The upper substrate 860 can be disposed on the upper insulating layer 850. The upper substrate 860 can be integrally disposed on the upper insulating layer 850. In an exemplary embodiment, portions in which the respective first contact holes 511, the first dummy pattern 710, the second contact holes 521, and the second dummy pattern 720 are formed can form steps protruding from the periphery. For example, a portion in which the first contact hole 511 is present can form a first step 861, a portion in which the second contact hole 521 is present can form a second step 862, a portion in which the first dummy pattern 710 is present can form a third step 863, and a portion in which the second dummy pattern 720 is present can form a fourth step 864. The upper substrate 860 can include PI, PET, PEN, PP, PC, PS, PSU, PE, PPA, PES, PAR, PCO, MPPO, urethane, TPU, or the like. The upper substrate 860 can further include a light-shielding material in order to have a black color.

[0136] The display device 100 according to an exemplary embodiment of the disclosure can have a relatively large number of steps at the first side portion and the second side portion. When compared with Figure 9 When the upper protective film 910 is disposed on the upper substrate 860, the upper protective film 910 can have a relatively large contact area with the upper substrate 860 at the first side portion and the second side portion by the steps, and the upper protective film 910 and the signal transmission film 500 can not be separated at the first side portion and the second side portion during bending of the signal transmission film 500 to which the upper protective film 910 is attached.

[0137] Figures 10 to 13 FIG. 10 is a plan view illustrating a manufacturing method of a display device according to an exemplary embodiment of the disclosure.

[0138] Referring to Figure 10 and Figure 11The signal transmission film 500 to which the upper protective film 910 and the lower protective film 920 are attached can be attached to one side of the display panel 300. As shown in FIG. 10, before the signal transmission film 500 is bent, the upper protective film 910 can be positioned on the top surface of the signal transmission film 500 existing in parallel with the first surface S1 of the display device 100. Also, as shown in FIG. 11, before the signal transmission film 500 is bent, the lower protective film 920 can be positioned on the bottom surface of the signal transmission film 500 existing in parallel with the second surface S2 of the display device 100. For example, the upper protective film 910 can include an adhesive film 911 and a protective member 912, and the lower protective film 920 can also include an adhesive film and a protective member (see FIGS. 10 and 11). Figure 10 Figure 11 Figure 9

[0139] Figure 12 After the signal transmission film 500 to which the upper protective film 910 and the lower protective film 920 are attached is attached to the display panel 300, the lower protective film 920 can be removed from the bottom surface of the signal transmission film 500.

[0140] Figure 13 After the lower protective film 920 is removed, the fourth extension part 540 can be bent about the first direction D1. For example, a portion of the upper protective film 910 existing in overlap with the third extension part 530 can be fixed to a manufacturing apparatus, so that the signal transmission film 500 to which the upper protective film 910 is attached is bent.

[0141] Figure 2 After the signal transmission film 500 to which the upper protective film 910 is attached is bent, the upper protective film 910 can be removed from the top surface of the signal transmission film 500.

[0142] Accordingly, the display device 100 shown in FIG. 1 can be manufactured. Figures 1 to 8B

[0143] In the manufacturing method of the display device according to the exemplary embodiment of the present disclosure, the display device 100 includes the first dummy pattern 710 and the second dummy pattern 720, so that the third step 863 and the fourth step 864 can be formed around the first step 861 and the second step 862. Accordingly, the upper protective film 910 can additionally contact the third step 863 and the fourth step 864, and the adhesion of the upper protective film 910 and the signal transmission film 500 can be relatively increased at the first side portion. That is, the upper protective film 910 and the signal transmission film 500 can not be separated at the first side portion during the bending of the signal transmission film 500, and the misalignment of the signal transmission film 500 can be prevented.

[0144] ​​​​​​​As described above, the explanation was made with reference to the illustrative embodiments of the present disclosure, but it is understood by those skilled in the art with the general indications that various modifications and changes can be made to the present disclosure within the scope of the concept and field of the present disclosure recited in the following claims.

[0145] (Industrial applicability)

[0146] The present disclosure can be applied to various display devices that can have a display apparatus. For example, the present disclosure can be applied to many display devices such as a display apparatus for a vehicle, a ship, and an aircraft, a communication apparatus for a portable, a display apparatus for a presentation or information transmission, a display apparatus for a medical treatment, and the like.

Claims

1. A display device, characterized by comprising: The display device includes: a display panel; and a signal transfer film including: a first extension portion extending in a first direction and forming a first contact hole at a first side portion; a second extension portion extending from the first side portion of the first extension portion in a second direction different from the first direction; a first dummy pattern disposed adjacent to the first contact hole at the first side portion; a first lower wiring; and a first upper wiring, the signal transfer film being connected to one side of the display panel, the first dummy pattern including: a first lower dummy pattern disposed apart from the first lower wiring; and a first upper dummy pattern disposed apart from the first upper wiring.

2. The display device according to claim 1, wherein the signal transfer film further includes: a third extension portion extending from a side portion of the second extension portion in the second direction; and a fourth extension portion protruding from the first extension portion in a third direction opposite to the second direction.

3. The display device according to claim 2, wherein the fourth extension portion of the signal transfer film is bent with the first direction as an axis, so that the signal transfer film is located on a bottom surface of the display panel.

4. The display device according to claim 2, wherein the fourth extension portion is connected to the one side of the display panel, and the first extension portion, the second extension portion, the third extension portion, and the fourth extension portion are integrally formed.

5. The display device according to claim 2, wherein the first lower wiring is disposed at the second extension portion, the third extension portion, and the first side portion of the first extension portion, the first upper wiring is disposed at one of the first side portion of the first extension portion and the fourth extension portion.

6. The display device according to claim 5, wherein the first lower wiring and the first upper wiring are connected by the first contact hole at the first side portion of the first extension portion.

7. The display device according to claim 5, wherein the first lower wiring and the first upper wiring are disposed at different layers from each other.

8. The display device according to claim 5, wherein the first lower dummy pattern and the first upper dummy pattern are disposed at different layers from each other and exist overlapping each other.

9. The display device according to claim 5, wherein the signal transfer film further includes: a lower substrate; a first insulating layer disposed on the lower substrate and covering the first lower dummy pattern at the first side portion of the first extension portion and having the first contact hole exposing a part of the first lower wiring; a second insulating layer disposed on the first insulating layer and covering the first upper dummy pattern and the first upper wiring; and an upper substrate disposed on the second insulating layer.

10. The display device according to claim 9, wherein the upper substrate forms a step protruding from a periphery at a portion where each of the first contact hole, the first upper dummy pattern, and the first lower dummy pattern is formed.

11. The display device according to claim 5, wherein a second contact hole is formed in a second side portion of the second extension portion, the signal transfer film further includes: a second dummy pattern disposed adjacent to the second contact hole.

12. The display device according to claim 11, wherein the signal transfer film further includes: a second lower wiring disposed in the third extension portion and the second side portion of the second extension portion; and a second upper wiring disposed in one of the second side portion of the second extension portion, the first extension portion, and the fourth extension portion.

13. The display device according to claim 12, wherein the second lower wiring and the second upper wiring are connected by the second contact hole in the second side portion of the second extension portion, and the second lower wiring and the second upper wiring are disposed in different layers from each other.

14. The display device according to claim 12, wherein the first lower wiring and the second lower wiring are disposed in the same layer, and the first upper wiring and the second upper wiring are disposed in the same layer.

15. The display device according to claim 12, wherein the second dummy pattern includes: a second lower dummy pattern disposed apart from the second lower wiring; and a second upper dummy pattern disposed apart from the second upper wiring.

16. The display device according to claim 12, wherein the signal transfer film further includes: a third wiring disposed in one of the third extension portion, the second extension portion, the first extension portion, and the fourth extension portion.

17. The display device according to claim 16, wherein the third wiring does not overlap the first lower wiring and the second lower wiring in the third extension portion, and a portion of the third wiring overlaps the first upper wiring or the second upper wiring in the second extension portion and the first extension portion.

18. The display device according to claim 1, wherein the display panel includes: a display structure; and a sensor structure disposed on the display structure, the signal transfer film is connected to the sensor structure.

19. The display device according to claim 18, wherein the display panel further includes: a protection member disposed on the sensor structure.

Images