Light-emitting diode bracket, manufacturing method thereof and light-emitting diode

Abstract

The present invention discloses a light-emitting diode bracket. The light-emitting diode bracket includes an insulator and an electrode. The insulator includes a side wall and a bottom wall, and the bottom wall includes a step structure. The step structure includes a first step surface, a connecting surface, and a second step surface, and there is a height difference between the first step surface and the second step surface. The electrode includes a solder pad and a conductive foot. The conductive foot includes a connecting end and a suspended end. The suspended end is accommodated in the step structure, and the suspended end includes a side surface, a first surface and a second surface arranged opposite to each other, and the distance between the first surface and the second surface is less than the height difference between the first step surface and the second step surface. Through the above-mentioned technical means, the present invention solves the technical problem that the suspended end of the existing diode bracket is easily scratched and lifted up by external objects during installation and transportation, resulting in poor performance of the light-emitting diode bracket.

Description

Technical field

[0001] The present invention relates to the technical field of light-emitting diodes, and in particular to a light-emitting diode bracket, a manufacturing method thereof, and a light-emitting diode. [Background Technology]

[0002] Light-emitting diodes (LEDs), with their numerous advantages, including high luminous efficiency, long service life, energy conservation, and environmental friendliness, are increasingly being used in a wide range of applications, including indoor and outdoor lighting, as well as backlighting. LEDs primarily rely on a driver chip to drive the luminescent material to produce illumination. Therefore, a LED holder is required to work with the driver chip and the luminescent material. The LED holder comprises an insulator and conductive pins.

[0003] In the prior art, when manufacturing the LED holder, the LED holder is usually formed by stamping and electroplating the conductive pins from a metal base plate, and then further forming the insulator through injection molding. The back of the insulator is provided with a stepped structure. During this process, the conductive pins bend and are accommodated in the stepped structure on the back of the insulator.

[0004] However, the above technical solution has the following technical drawbacks: one end of the conductive leg is suspended, and the height of this suspended end is higher than the height of the step structure. As a result, the suspended end is easily scratched and lifted during installation and transportation of the LED bracket, resulting in a defective LED bracket. Furthermore, during the bending process, the corners of the suspended end are not chamfered, which causes stress concentration, causing the suspended end to lift under the influence of the stress concentration, resulting in a defective LED bracket.

[0005] To solve the above technical problems, the existing technology solves this problem by adding a layer of paper. That is, during the actual transportation process, a layer of paper is sandwiched between every two adjacent light-emitting diode brackets to protect the conductive pins. However, this method is inefficient and increases labor and material costs. More importantly, this method cannot completely solve the defects such as poor diode bracket performance caused by the warping of the conductive pins. [Summary of the invention]

[0006] In order to solve the technical problems of high defect rate, high labor cost and high material cost of LED brackets in the prior art, the present invention provides a LED bracket with high yield rate, low labor and material cost, and easy transportation and processing.

[0007] Also provided are a method for manufacturing a light-emitting diode bracket and a light-emitting diode using the light-emitting diode bracket.

[0008] A light-emitting diode support comprises an insulator and an electrode. The insulator comprises side walls, a bottom wall, and a step structure, wherein the side walls and the bottom wall enclose a cavity, and the step structure is provided on a side surface away from the cavity. The electrode comprises a pad and a conductive foot, and the electrode passes through the insulator, with one end of the electrode provided in the cavity and the other end extending to the back surface of the insulator. The pad is disposed in the cavity. The conductive foot comprises a connecting end, a conductive foot body, and a suspended end. The conductive foot body is located between the connecting end and the suspended end and is electrically connected to the connecting end and the pad. The suspended end is accommodated in the step structure. The suspended end comprises a side surface, a first surface, and a second surface disposed opposite each other. The side surface connects the first surface and the second surface, and the first surface is away from the cavity. The distance between the surface of the step structure and the bottom wall is greater than or equal to the distance between the first surface and the bottom wall.

[0009] Preferably, the first surface and the side surface are transitionally connected via an inclined surface or an arc surface.

[0010] Preferably, the plane where the bottom wall is located is defined as the horizontal direction, and the direction perpendicular to the horizontal direction is defined as the vertical direction. The vertical direction and the horizontal direction jointly define a plane coordinate system. The conductive foot body extends obliquely toward the direction of the step structure, and its extension direction forms an acute angle with the vertical direction.

[0011] Preferably, the plane where the bottom wall is located is defined as the horizontal direction, and the direction perpendicular to the horizontal direction is defined as the vertical direction. The vertical direction and the horizontal direction jointly define a plane coordinate system. The suspended end extends obliquely toward the direction of the step structure, and its extension direction forms an acute angle with the X-axis direction.

[0012] Preferably, the step structure includes a first step surface, a connecting surface and a second step surface, the connecting surface connects the first step surface and the second step surface, there is a height difference between the first step surface and the second step surface, and the height difference forms a step.

[0013] Preferably, the conductive foot includes a notch, and the notch is provided on the contact surface between the conductive foot and the insulator. The insulator includes a protrusion, and the protrusion is correspondingly accommodated in the notch.

[0014] Preferably, the side surface includes an end surface, a first side surface and a second side surface, the end surface connects the first side surface and the second side surface, the first side surface and the second side surface are arranged opposite to each other, the first side surface is arranged opposite to the step structure, and the second side surface is away from the step structure.

[0015] Preferably, the first surface and the end surface are transitionally connected by an inclined surface or an arc surface.

[0016] Preferably, the first surface and the second side surface are transitionally connected by an inclined surface or an arc surface.

[0017] A method for manufacturing a light-emitting diode bracket comprises the following steps:

[0018] S1. Carrying the hardware raw materials to the stamping station, stamping the hardware raw materials to form electrode plates after stamping;

[0019] S2, carrying the electrode plate to the electroplating station and performing electroplating treatment on the electrode plate;

[0020] S3, performing injection molding on the electrode plate that has undergone the electroplating process to form an insulator in the diode bracket, wherein the insulator is fixedly formed on the electrode plate;

[0021] S4, bending and cutting the electrode plate to form an electrode in the light-emitting diode bracket, wherein the electrode penetrates and is accommodated on the surface of the insulator;

[0022] S5. Extruding the electrode to form an inclined or curved transition zone on the electrode.

[0023] A light-emitting diode support comprises an insulator, an electrode, and a light-emitting material. The insulator comprises side walls, a bottom wall, and a step structure. The side walls and the bottom wall form a cavity, and the step structure is provided on a side surface away from the cavity. The electrode comprises a pad and a conductive foot. The electrode passes through the insulator, with one end of the electrode provided in the cavity and the other end extending to the back of the insulator. The pad is positioned in the cavity, and the conductive foot comprises a connecting end, a conductive foot body, and a suspended end. The light-emitting material is housed in the cavity and electrically connected to the pad. The conductive foot body is located between the connecting end and the suspended end and is electrically connected to the connecting end and the pad. The suspended end is housed in the step structure. The suspended end comprises a side surface, a first surface, and a second surface disposed opposite each other. The side surface connects the first surface and the second surface, and the first surface is away from the cavity. The distance between the surface of the step structure and the bottom wall is greater than or equal to the distance between the first surface and the bottom wall.

[0024] Compared to the prior art, the LED holder provided by the present invention sets the distance between the first surface and the second surface to be smaller than the distance between the first step surface and the second step surface, so that the first step surface protrudes relative to the first surface, thereby preventing the suspended end of the conductive foot from being scraped off by foreign objects during actual transportation and transmission, resulting in product defects. At the same time, by using a curved or beveled transition connection between the side surface and the first surface, the risk of the suspended end being scraped off is further reduced, and the stress concentration caused by the end surface of the suspended end being at right angles to the first surface in the prior art is also reduced, thereby effectively preventing the suspended end from warping and causing product defects. Furthermore, by setting the distance between the first surface and the second surface to be smaller than the distance between the first step surface and the second step surface, and by using a curved or beveled transition connection between the side surface of the suspended end and the first surface, the conventional method of sandwiching a paper layer between each two adjacent LED holders to protect the conductive foot is replaced, facilitating the transportation of the diode holders and reducing material and labor costs.

Brief Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0026] Figure 1 This is a three-dimensional schematic diagram of the light-emitting diode bracket disclosed in the first embodiment of the present invention;

[0027] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the light-emitting diode bracket from another angle;

[0028] Figure 3 It is along Figure 1 A schematic cross-sectional view of line III-III is shown;

[0029] Figure 4 yes Figure 1 A three-dimensional schematic diagram of the four conductive pins in the light-emitting diode;

[0030] Figure 5 yes Figure 4 A three-dimensional schematic diagram of the four conductive pins of the light-emitting diode from another angle;

[0031] Figure 6 yes Figure 4 a side view of one of the conductive legs;

[0032] Figure 7 It is magnified Figure 3 Schematic diagram of region VII shown;

[0033] Figure 8 This is a flowchart of the production process of light-emitting diode bracket and light-emitting diode;

[0034] Figure 9 It is a schematic diagram of the three-dimensional structure of the conductive pins of the light-emitting diode bracket disclosed in the second embodiment of the present invention. [Specific implementation method]

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] The present invention provides a light emitting diode, which includes a light emitting diode frame and a light emitting material. The light emitting material is embedded in the light emitting diode frame and is in a working state under the driving action of a driving chip to generate a light beam.

[0037] Please also see Figure 1 and Figure 2 ,in Figure 1 This is a three-dimensional schematic diagram of the light-emitting diode bracket disclosed in the present invention. Figure 2 yes Figure 1 The LED support 10 includes an insulator 11 and four electrodes 13. The four electrodes 13 extend through the insulator 11, with one end disposed inside the insulator 11 and the other end extending to the back of the insulator 11.

[0038] The insulator 11 includes a bottom wall 111, four side walls 113 and a step structure 115. The side wall 113 is arranged on the same side of the bottom wall 111. The four side walls 113 are connected end to end and cooperate with the bottom wall 111 to form a cavity 110 with one end open. The step structure 115 is arranged on the side surface of the bottom wall 111 away from the cavity 110. The step structure 115 includes a first step surface 1151, a connecting surface 1153 and a second step surface 1155. The connecting surface 1153 connects the first step surface 1151 and the second step surface 1155. There is a height difference between the first step surface 1151 and the second step surface 1155, and the height difference forms a step. The step structure 115 includes four steps arranged in an array to accommodate the end of the electrode 13.

[0039] Please refer to Figure 3、 Figure 4 and Figure 5 ,in Figure 3 yes Figure 1 A side cross-sectional view of the light emitting diode support shown, Figure 4 yes Figure 1 The three-dimensional schematic diagram of the conductive foot shown, Figure 5 yes Figure 4 A perspective view of the conductive foot from another angle is shown. The electrode 13 includes a pad 131 and a conductive foot 133, and the pad 131 and the conductive foot 133 are electrically connected to each other. The pad 131 is disposed within the cavity 110 and embedded in the bottom wall 111. The surface of the pad 131 is substantially flush with the bottom wall 111, and the pad 131 is exposed in the cavity 110.

[0040] The surface of the bottom wall 111 is defined as the horizontal direction, i.e., the X-axis direction. The vertical direction perpendicular to the horizontal direction is the Y-axis direction. The X-axis direction and the Y-axis direction together define a plane coordinate system. Within this plane coordinate system, the conductive foot 133 includes a connecting end 1331, a conductive foot body 1333, and a suspended end 1335, which are sequentially connected. The conductive foot body 1333 is located between the connecting end 1331 and the suspended end 1335.

[0041] The connection end 1331 is electrically connected to the pad 131. The surface of the pad 131 is parallel to the X-axis direction, and the connection end 1331 is parallel to the X-axis direction.

[0042] The conductive pin body 1333 extends obliquely toward the step structure 115, and the extending direction forms an acute angle a with the Y-axis direction (see FIG. Figure 6 ).

[0043] The hanging end 1335 bends and extends from the conductive limb body 1333 toward the location of the step. The conductive limb body 1333 and the hanging end 1335 form an angle less than or equal to 90 degrees at the junction, that is, the hanging end 1335 is arranged inwardly relative to the conductive limb body 1333 (see Figure 6 ).

[0044] The hanging end 1335 extends obliquely toward the step structure 115, and the extending direction forms an acute angle β with the X-axis direction (see Figure 6 ).

[0045] The suspended end 1335 is away from the pad 131 and is connected to an external power source to provide an electrical signal.

[0046] Please also see Figure 3 、 Figure 4 and Figure 5,in Figure 5 yes Figure 4 A side view of one of the conductors in the LED support is shown. The overhanging end 1333 includes a first surface 13331, a second surface 13333, and surrounding side surfaces. The side surfaces connect the first surface 13331 and the second surface 13333. The first surface 13331 and the second surface 13333 are disposed opposite each other. The first surface 13331 is disposed away from the insulator 11. The second surface 13333 is disposed opposite the insulator 11. The distance a between the first surface 13331 and the second surface 13333 is less than the distance b between the first step surface 1153 and the second step surface 1151. That is, the first surface 1331 is lower than the surface of the step structure 115, and there is a height difference between the first surface 1331 and the second surface 13333.

[0047] The side surface includes an end surface 13337, a first side surface 13338, and a second side surface 13339. The end surface 13337 connects the first side surface 13338 and the second side surface 13339. The first side surface 13338 and the second side surface 13339 are oppositely arranged. The first surface 13331 and the end surface 13337 are connected by a curved surface transition.

[0048] See also Figure 7 ,yes Figure 3 The conductive foot 133 further includes a notch 1335 , which is located on the contact surface between the conductive foot 133 and the insulator 11 . The insulator 11 includes a protrusion 117 , which is correspondingly received in the notch 1335 .

[0049] See also Figure 8 , Figure 8 This is a flow chart of the production process of the light-emitting diode bracket 10. The production process of the light-emitting diode bracket 10 includes the following steps:

[0050] S1. Carrying the hardware raw materials to the stamping station, stamping the hardware raw materials to form electrode plates after stamping;

[0051] S2, carrying the electrode plate to the electroplating station and performing electroplating treatment on the electrode plate;

[0052] S3, performing injection molding on the electrode plate that has undergone electroplating to form the insulator 11 in the diode bracket, wherein the insulator 11 is fixedly formed on the electrode plate;

[0053] S4, bending and cutting the electrode plate to form the electrode 13 in the light-emitting diode bracket 10, and the electrode 13 is accommodated on the surface of the insulator 11;

[0054] S5. Performing an extrusion process between the first surface 13331 and the side surface 1333 on the conductive foot 133 of the electrode 13 to form an inclined surface or arc surface transition connection between the two.

[0055] In addition, the production process of the light emitting diode further includes the following steps based on the manufacturing of the light emitting diode bracket 10:

[0056] S6 , installing the light-emitting material inside the cavity 110 of the light-emitting diode holder 10 , and electrically connecting the light-emitting material to the pad 131 .

[0057] Compared to the prior art, the LED holder 10 provided by the present invention ensures that the distance between the first surface 13331 and the second surface 13333 is less than the height difference between the first stepped surface 1153 and the second stepped surface 1151, so that the first stepped surface 1153 protrudes relative to the first surface 13331 of the overhanging end 1333. This prevents the overhanging end 1333 of the conductive foot 133 from being scraped off by foreign objects during transportation and transport, which could result in product defects. Furthermore, by providing a curved or beveled transition between the side surface and the first surface 13331, the risk of the overhanging end 1333 being scraped off is further reduced. This also reduces the stress concentration between the first surface 13331 and the side surface, which is common in the prior art. This effectively prevents product defects caused by the overhanging end 1333 from warping. Furthermore, the present invention replaces the conventional method of sandwiching a paper layer between two adjacent LED holders 10 to protect the conductive foot, facilitating transportation of the diode holder 10 and reducing material and labor costs.

[0058] See also Figure 9 , is the second embodiment of the present invention. The conductive pin disclosed in this embodiment is basically the same as the conductive pin disclosed in the first embodiment, with the difference that: in the second embodiment, the suspended end of the conductive pin includes a first surface 13331, an end surface 13337 and a second side surface 13339, and the first surface 13331 and the end surface 13337 are connected by an arcuate transition, and the first surface 13331 and the second side surface 13339 are also connected by an arcuate transition.

[0059] The arcuate transition between the first surface 13331 and the end surface 13337, and the arcuate transition between the first surface 13331 and the second side surface 13339, reduces the risk of the overhanging end 1333 being blown off during transportation. This also reduces stress concentration between the first surface 13331 and the side surface, and between the first surface and the second side surface 13339, as is common in the prior art. This effectively prevents product defects caused by warping of the overhanging end 1333. Furthermore, the arcuate transition treatment effectively eliminates stress concentration between the first surface 13331 and the side surface.

[0060] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A light-emitting diode bracket, comprising: Insulators, including: sidewalls; a bottom wall, wherein the side walls and the bottom wall form a cavity; and a step structure, the step structure being provided on a side surface away from the cavity; An electrode, wherein the electrode passes through the insulator, one end of the electrode is disposed in the cavity, and the other end extends to the back of the insulator, comprising: a soldering pad, the soldering pad being disposed in the cavity; A conductive foot, comprising a connecting end, a conductive foot body and a suspended end, wherein the conductive foot body is located between the connecting end and the suspended end, and is electrically connected to the connecting end and the pad, and the suspended end is accommodated in the step structure, and the suspended end comprises a side surface, a first surface and a second surface arranged opposite to each other, the side surface connecting the first surface and the second surface, and the first surface is away from the cavity, characterized in that the distance between the surface of the step structure and the bottom wall is greater than the distance between the first surface and the bottom wall, The step structure includes a first step surface, a connecting surface, and a second step surface. The connecting surface connects the first step surface and the second step surface. There is a height difference between the first step surface and the second step surface, and the height difference forms a step. A distance a between the first surface and the second surface is smaller than a distance b between the first step surface and the second step surface.

2. The light emitting diode bracket according to claim 1, characterized in that: The first surface and the side surface are transitionally connected via an inclined surface or an arc surface.

3. The light emitting diode support according to claim 1, characterized in that: The plane where the bottom wall is located is defined as the horizontal direction, and the direction perpendicular to the horizontal direction is defined as the vertical direction. The vertical direction and the horizontal direction jointly define a plane coordinate system. The conductive foot body extends obliquely toward the step structure, and its extension direction forms an acute angle with the vertical direction.

4. The light emitting diode support according to claim 1, characterized in that: The plane where the bottom wall is located is defined as the horizontal direction, and the direction perpendicular to the horizontal direction is defined as the vertical direction. The vertical direction and the horizontal direction jointly define a plane coordinate system. The suspended end extends obliquely toward the step structure, and its extension direction forms an acute angle with the horizontal direction.

5. The light emitting diode support according to claim 1, characterized in that: The conductive foot includes a notch, which is provided on the contact surface between the conductive foot and the insulator. The insulator includes a protrusion, which is correspondingly received in the notch.

6. The light emitting diode support according to claim 1, characterized in that: The side surface includes an end surface, a first side surface and a second side surface, the end surface connects the first side surface and the second side surface, the first side surface and the second side surface are arranged opposite to each other, the first side surface is arranged opposite to the step structure, and the second side surface is away from the step structure.

7. The light emitting diode support according to claim 6, characterized in that: The first surface and the end surface are connected by a bevel or arcuate transition, or the first surface and the second side surface are connected by a bevel or arcuate transition.

8. A method for manufacturing a light emitting diode support according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1. Carrying the hardware raw materials to the stamping station, stamping the hardware raw materials to form electrode plates after stamping; S2, carrying the electrode plate to the electroplating station and performing electroplating treatment on the electrode plate; S3, performing injection molding on the electrode plate that has undergone the electroplating process to form an insulator in the diode bracket, wherein the insulator is fixedly formed on the electrode plate; S4, bending and cutting the electrode plate to form an electrode in the light-emitting diode bracket, wherein the electrode penetrates and is accommodated on the surface of the insulator; S5. Extruding the electrode to form an inclined or curved transition zone on the electrode.

9. A light-emitting diode comprising: Insulators, including: sidewalls; a bottom wall, wherein the side walls and the bottom wall form a cavity; and a step structure, the step structure being provided on a side surface away from the cavity; An electrode, wherein the electrode passes through the insulator, one end of the electrode is disposed in the cavity, and the other end extends to the back of the insulator, comprising: a soldering pad, the soldering pad being disposed in the cavity; A conductive foot, comprising a connecting end, a conductive foot body, and a suspended end, wherein the conductive foot body is located between the connecting end and the suspended end and is electrically connected to the connecting end and the pad, the suspended end is accommodated in the step structure, and the suspended end comprises a side surface, a first surface, and a second surface disposed opposite to each other, the side surface connecting the first surface and the second surface, and the first surface is away from the cavity; a light-emitting material, the light-emitting material being contained in the cavity and electrically connected to the pad; It is characterized in that the distance between the surface of the step structure and the bottom wall is greater than the distance between the first surface and the bottom wall, The step structure includes a first step surface, a connecting surface, and a second step surface. The connecting surface connects the first step surface and the second step surface. There is a height difference between the first step surface and the second step surface, and the height difference forms a step. A distance a between the first surface and the second surface is smaller than a distance b between the first step surface and the second step surface.

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