A 5G millimeter wave communication module for mobile terminals

By designing a 5G millimeter wave communication module connecting horizontal and vertical beam antenna submodules, and using phased array chips to control beam scanning, the problem that 5G millimeter wave antenna modules in the prior art cannot achieve all-round beam coverage in mobile terminals, and high-efficiency beam coverage in miniaturized installation positions is achieved.

CN112864585BActive Publication Date: 2025-05-13SUZHOU SOBEIDE INNOVATION TECH RES CO LTD
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Patent Information

Application Number
CN202110090541.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-01-22
Publication Date
2025-05-13
Estimated Expiration
2041-01-22

AI Technical Summary

Technical Problem

The existing 5G millimeter wave antenna module can only realize one-dimensional beam scanning in mobile terminals, making it difficult to achieve all-round beam coverage and occupy a large installation position, which violates the trend of miniaturization of mobile terminals.

Method used

A 5G millimeter wave communication module including a horizontal beam antenna submodule and a vertical beam antenna submodule is designed, and the two are connected through a transmission line soft substrate, and a phased array chip is arranged at the bottom of the vertical beam antenna submodule to control both to perform horizontal and vertical beam scanning.

Benefits of technology

It realizes all-round beam coverage on mobile terminals, avoids the problem of installation position expansion caused by the use of multiple millimeter wave antenna modules, and adapts to the development trend of mobile terminals to miniaturize.

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Abstract

The present application relates to the field of communication technology, and provides a 5G millimeter wave communication module for mobile terminals, including a horizontal beam antenna submodule and a vertical beam antenna submodule; the horizontal beam antenna submodule is connected to the vertical beam antenna submodule through a transmission line soft substrate; a phased array chip is also provided at the bottom of the vertical beam antenna submodule, and the phased array chip connects the horizontal beam antenna submodule and the vertical beam antenna submodule. In actual application, the horizontal beam antenna submodule is fitted on a plane of the terminal, and the transmission line soft substrate bypasses one edge of the terminal, and the vertical beam antenna submodule is fitted on another plane of the terminal. The horizontal beam antenna submodule and the vertical beam antenna submodule with mutually perpendicular scanning surfaces are used to achieve all-round beam coverage, avoiding the use of multiple millimeter wave antenna modules, which results in the problem that a large installation position needs to be reserved for the mobile terminal.
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Description

Technical Field

[0001] The present application relates to the field of communication technology, and more particularly to a 5G millimeter wave communication module for use in a mobile terminal. Background Art

[0002] As spectrum resources become increasingly scarce and 5G communication technology develops rapidly, the development and utilization of millimeter wave spectrum resources used in satellite and radar military systems has become the focus of the fifth generation of mobile communication technology. Millimeter wave: Electromagnetic waves with a wavelength of 1 to 10 mm are called millimeter waves. They are located in the wavelength range where microwaves and far-infrared waves overlap, so they have the characteristics of both spectra. Millimeter wave antennas have the advantages of extremely wide bandwidth and narrow beams. Compared with lasers, the propagation of millimeter waves is much less affected by climate and can be considered to have all-weather characteristics. Compared with microwaves, the size of millimeter wave components is much smaller, so millimeter wave systems are easier to miniaturize.

[0003] In October 2018, the smallest new product in the millimeter wave antenna module series for smartphones and other types of mobile terminals was launched, a fully integrated 5G new air interface millimeter wave module. The latest millimeter wave antenna module is 25% smaller than the first batch of millimeter wave antenna modules released in July 2018. In September 2019, the QTM527 millimeter wave antenna module for the X555G modem and RF system was launched, providing the world's first fully integrated extended-range millimeter wave solution for 5G fixed wireless access, supporting mobile operators to provide fixed Internet broadband services to homes and businesses through their 5G network infrastructure.

[0004] However, when 5G millimeter wave antennas are used in terminals, millimeter wave antenna modules can only be placed in limited space due to the influence of the overall machine environment. Existing millimeter wave antenna modules are mainly one-dimensional beam scanning, which can only achieve one-dimensional beam scanning in the horizontal plane or one-dimensional beam scanning in the vertical plane. Omnidirectional beam coverage is achieved by placing 3-4 millimeter wave antenna modules at different directions at the same time, which results in the need to reserve a larger installation space for mobile terminals, which is contrary to the trend of miniaturization of mobile terminals. Summary of the invention

[0005] In order to set a 5G millimeter wave antenna with omni-directional beam coverage on a mobile terminal and ensure that a smaller installation position of the mobile terminal is occupied to adapt to the miniaturization development trend of mobile terminals, the present application provides a 5G millimeter wave communication module applied to a mobile terminal, including a horizontal beam antenna submodule and a vertical beam antenna submodule; the horizontal beam antenna submodule is connected to the vertical beam antenna submodule through a transmission line soft substrate;

[0006] The horizontal beam antenna submodule is laminated on a plane of the terminal, the transmission line soft substrate bypasses one edge of the terminal, and is laminated on another plane of the terminal. After the laminated arrangement, the arrangement surface of the horizontal beam antenna submodule is perpendicular to the arrangement surface of the vertical beam antenna submodule;

[0007] A phased array chip is also provided at the bottom of the vertical beam antenna submodule, and the phased array chip is connected to the horizontal beam antenna submodule and controls the horizontal beam antenna submodule to perform beam scanning in the horizontal plane; and the phased array chip is connected to the vertical beam antenna submodule and controls the vertical beam antenna submodule to perform beam scanning in the vertical plane.

[0008] Optionally, the horizontal beam antenna submodule includes a horizontal radiation plate, a horizontal dielectric substrate, a horizontal antenna metal layer, a horizontal soft dielectric substrate, a horizontal feeder line and a horizontal feeder line metal layer which are stacked in sequence.

[0009] Optionally, the phased array chip is connected to the horizontal radiation sheet through the horizontal feed line.

[0010] Optionally, the horizontal radiator is a double-layer parasitic antenna unit, including two stacked layers of horizontal parasitic patches and a horizontal main radiator.

[0011] Optionally, the horizontal feed line is connected to the horizontal radiation sheet through a first vertical via hole, and the horizontal feed line is located at a lower layer of the horizontal radiation sheet.

[0012] Optionally, the vertical beam antenna submodule includes a vertical radiation plate, a vertical dielectric substrate, a vertical antenna metal layer, a vertical hard dielectric substrate, a control layer, a radio frequency isolation metal layer, a vertical soft dielectric substrate, a vertical feed line and a vertical feed line metal layer which are stacked in sequence.

[0013] Optionally, the phased array chip is connected to the vertical radiation plate through the vertical feed line.

[0014] Optionally, the vertical radiator is a double-layer parasitic antenna unit, including two stacked layers of vertical parasitic patches and a vertical main radiator.

[0015] Optionally, the vertical feed line is connected to the vertical radiation plate through a second vertical via hole, and the vertical feed line is located at a lower layer of the vertical radiation plate.

[0016] Optionally, the control layer includes a digital circuit, a radio frequency circuit and a power supply.

[0017] It can be seen from the above technical solution that the present application provides a 5G millimeter wave communication module applied to a mobile terminal, including a horizontal beam antenna submodule and a vertical beam antenna submodule; the horizontal beam antenna submodule is connected to the vertical beam antenna submodule through a transmission line soft substrate; a phased array chip is also provided at the bottom of the vertical beam antenna submodule, and the phased array chip is connected to the horizontal beam antenna submodule, and controls the horizontal beam antenna submodule to perform beam scanning in the horizontal plane; and, the phased array chip is connected to the vertical beam antenna submodule, and controls the vertical beam antenna submodule to perform beam scanning in the vertical plane.

[0018] In actual application, the horizontal beam antenna submodule is attached to a plane of the terminal, and the transmission line is attached to the soft dielectric substrate by combining the soft dielectric substrate and the hard dielectric substrate to form the transmission line soft substrate, which bypasses one edge of the terminal and is attached to another plane of the terminal. After the attachment, the setting surface of the horizontal beam antenna submodule is perpendicular to the setting surface of the vertical beam antenna submodule. The horizontal beam antenna submodule and the vertical beam antenna submodule are connected through the transmission line soft substrate, and the transmission line is set on the connecting line, so that the phased array chip set at the bottom of the vertical beam antenna submodule can connect and control the horizontal beam antenna submodule, thereby achieving all-round beam coverage through the horizontal beam antenna submodule and the vertical beam antenna submodule whose scanning surfaces are perpendicular to each other, avoiding the use of multiple millimeter wave antenna modules, resulting in the problem that a large installation position needs to be reserved for the mobile terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 A schematic diagram of the installation position of a 5G millimeter wave communication module applied to a mobile terminal provided in an embodiment of the present application;

[0021] Figure 2 A schematic side view of the installation position of a 5G millimeter wave communication module applied to a mobile terminal provided in an embodiment of the present application;

[0022] Figure 3 An overall schematic diagram of a 5G millimeter wave communication module applied to a mobile terminal provided in an embodiment of the present application;

[0023] Figure 4A schematic diagram of the structure of a horizontal beam antenna submodule of a 5G millimeter wave communication module applied to a mobile terminal provided in an embodiment of the present application;

[0024] Figure 5 A schematic diagram of the structure of a vertical beam antenna submodule of a 5G millimeter wave communication module applied to a mobile terminal provided in an embodiment of the present application;

[0025] In the figure: 1-horizontal beam antenna submodule, 11-horizontal radiation plate, 12-horizontal feed line, 13-first vertical via, 2-vertical beam antenna submodule, 21-vertical radiation plate, 22-vertical feed line, 23-second vertical via, 3-transmission line soft substrate, 4-phased array chip. DETAILED DESCRIPTION

[0026] In order to set a 5G millimeter wave antenna with omnidirectional beam coverage on a mobile terminal and ensure that it occupies a smaller installation position of the mobile terminal to adapt to the miniaturization development trend of mobile terminals. The present application embodiment provides a 5G millimeter wave communication module for a mobile terminal, such as Figure 1 As shown, it is a schematic diagram of the installation position of a 5G millimeter wave communication module applied to a mobile terminal provided in an embodiment of the present application; Figure 3 As shown, it is an overall schematic diagram of a 5G millimeter wave communication module applied to a mobile terminal provided by an embodiment of the present application. The 5G millimeter wave communication module includes a horizontal beam antenna submodule 1 and a vertical beam antenna submodule 2; the horizontal beam antenna submodule 1 is connected to the vertical beam antenna submodule 2 through a transmission line soft substrate 3; a phased array chip 4 is also provided at the bottom of the vertical beam antenna submodule 2, the phased array chip 4 is connected to the horizontal beam antenna submodule 1, and controls the horizontal beam antenna submodule 1 to perform beam scanning in the horizontal plane; and the phased array chip 4 is connected to the vertical beam antenna submodule 2, and controls the vertical beam antenna submodule 2 to perform beam scanning in the vertical plane.

[0027] In actual application, Figure 2 As shown, it is a schematic side view of the installation position of a 5G millimeter wave communication module applied to a mobile terminal provided by an embodiment of the present application. The horizontal beam antenna submodule 1 is fitted on a plane of the terminal, and the transmission line is set on the soft dielectric substrate in the form of a combination of a soft dielectric substrate and a hard dielectric substrate to form the transmission line soft substrate 3, and the transmission line soft substrate 3 bypasses one edge of the terminal, and the vertical beam antenna submodule 2 is fitted on another plane of the terminal. After the fitting, the setting surface of the horizontal beam antenna submodule 1 is perpendicular to the setting surface of the vertical beam antenna submodule 2.

[0028] The horizontal beam antenna submodule 1 and the vertical beam antenna submodule 2 are connected via a transmission line soft substrate 3, and a transmission line is arranged on the connecting line, so that the phased array chip 4 arranged at the bottom of the vertical beam antenna submodule 2 can be connected to and control the horizontal beam antenna submodule 1, thereby achieving all-round beam coverage through the horizontal beam antenna submodule 1 and the vertical beam antenna submodule 2 whose scanning surfaces are perpendicular to each other, avoiding the use of multiple millimeter-wave antenna modules, resulting in the need to reserve a larger installation position for the mobile terminal.

[0029] Further, in some embodiments of the present application, Figure 4 As shown, a schematic diagram of the structure of a horizontal beam antenna submodule of a 5G millimeter wave communication module applied to a mobile terminal provided in an embodiment of the present application. The horizontal beam antenna submodule 1 includes a horizontal radiation sheet 11, a horizontal dielectric substrate, a horizontal antenna metal layer, a horizontal soft dielectric substrate, a horizontal feeder 12 and a horizontal feeder metal layer stacked in sequence.

[0030] Among them, the horizontal radiator 11 is a double-layer parasitic antenna unit, including two stacked layers of horizontal parasitic patches and a horizontal main radiator, but is not limited to a double-layer parasitic antenna unit. Other forms of radiating units can be used according to actual design requirements. The antenna design with a double-layer parasitic patch can effectively improve the scanning loss of the horizontal radiator 11.

[0031] The phased array chip 4 is connected to the horizontal radiation plate 11 through the horizontal feed line 12. The horizontal feed line 12 is located in the lower layer of the horizontal radiation plate 11, and is connected to the horizontal radiation plate 11 through the first vertical via 13, and a part of the horizontal feed line 12 is arranged on the transmission line soft substrate 3, so as to connect the phased array chip 4 arranged at the bottom of the vertical beam antenna submodule 2, thereby providing the integration of the 5G millimeter wave communication module. In actual application, the first vertical via 13 has an impedance discontinuity problem, which may cause impedance mismatch and increase the transmission loss S21. In order to avoid this problem, in the process of designing the position of the first vertical via 17, a suitable layout is selected to ensure that there is sufficient clearance around the horizontal radiation plate 11, thereby optimizing the impedance mismatch caused by the impedance discontinuity of the first vertical via 13.

[0032] Further, in some embodiments of the present application, Figure 5 As shown, it is a schematic diagram of the structure of a vertical beam antenna submodule of a 5G millimeter wave communication module applied to a mobile terminal provided in an embodiment of the present application. The vertical beam antenna submodule 2 includes a vertical radiation plate 21, a vertical dielectric substrate, a vertical antenna metal layer, a vertical hard dielectric substrate, a control layer, a radio frequency isolation metal layer, a vertical soft dielectric substrate, a vertical feed line 22 and a vertical feed line metal layer stacked in sequence.

[0033] Among them, the vertical radiator 21 is a double-layer parasitic antenna unit, including two layers of stacked vertical parasitic patches and a vertical main radiator, but is not limited to a double-layer parasitic antenna unit. Other forms of radiating units can be used according to actual design requirements. The antenna design using a double-layer parasitic patch can effectively improve the scanning loss of the vertical radiator 21.

[0034] The phased array chip 4 is connected to the vertical radiation plate 21 through the vertical feed line 22. The vertical feed line 22 is connected to the vertical radiation plate 21 through the second vertical via 23, and the vertical feed line 22 is located at the lower layer of the vertical radiation plate 21. Through the design of the second vertical via 23, the vertical beam antenna submodule 2 is designed in a stacked manner to ensure the high integration of the 5G millimeter wave communication module. In actual application, the second vertical via 23 has an impedance discontinuity problem, which may cause impedance mismatch and increase the transmission loss S21. In order to avoid this problem, in the process of designing the position of the second vertical via 23, a suitable layout is selected to ensure that there is sufficient clearance around the vertical radiation plate 21, thereby optimizing the impedance mismatch caused by the impedance discontinuity of the second vertical via 23.

[0035] It can be seen from the above technical scheme that the embodiment of the present application provides a 5G millimeter wave communication module applied to a mobile terminal, including a horizontal beam antenna sub-module 1 and a vertical beam antenna sub-module 2; the horizontal beam antenna sub-module 1 is connected to the vertical beam antenna sub-module 2 through a transmission line soft substrate 3; a phased array chip 4 is also provided at the bottom of the vertical beam antenna sub-module 2, and the phased array chip 4 is connected to the horizontal beam antenna sub-module 1, and controls the horizontal beam antenna sub-module 1 to perform beam scanning in the horizontal plane; and, the phased array chip 4 is connected to the vertical beam antenna sub-module 2, and controls the vertical beam antenna sub-module 2 to perform beam scanning in the vertical plane.

[0036] In actual application, the horizontal beam antenna submodule 1 is attached to a plane of the terminal, and the transmission line is attached to the soft dielectric substrate by combining the soft dielectric substrate and the hard dielectric substrate to form the transmission line soft substrate 3, which bypasses one edge of the terminal. The vertical beam antenna submodule 2 is attached to another plane of the terminal. After the attachment, the setting surface of the horizontal beam antenna submodule 1 is perpendicular to the setting surface of the vertical beam antenna submodule 2. The horizontal beam antenna submodule 1 and the vertical beam antenna submodule 2 are connected through the transmission line soft substrate 3, and the transmission line is set on the connecting line, so that the phased array chip 4 set at the bottom of the vertical beam antenna submodule 2 can be connected and controlled by the horizontal beam antenna submodule 1, so that the horizontal beam antenna submodule 1 and the vertical beam antenna submodule 2 with mutually perpendicular scanning planes can achieve all-round beam coverage, avoiding the use of multiple millimeter wave antenna modules, resulting in the problem of requiring a large installation position to be reserved for the mobile terminal.

[0037] The present application is described in detail above in conjunction with specific implementation methods and exemplary examples, but these descriptions cannot be understood as limiting the present application. Those skilled in the art understand that, without departing from the spirit and scope of the present application, a variety of equivalent replacements, modifications or improvements can be made to the technical solution of the present application and its implementation methods, all of which fall within the scope of the present application. The scope of protection of the present application shall be subject to the attached claims.

Claims

1. A 5G millimeter wave communication module applied to a mobile terminal, characterized in that: It comprises a horizontal beam antenna submodule (1) and a vertical beam antenna submodule (2); the horizontal beam antenna submodule (1) is connected to the vertical beam antenna submodule (2) via a transmission line soft substrate (3); The horizontal beam antenna submodule (1) is arranged on a plane of the terminal, comprising a soft dielectric substrate and a hard dielectric substrate, and a transmission line is arranged on the soft dielectric substrate to form the transmission line soft substrate (3), the transmission line soft substrate (3) bypasses one edge of the terminal, and the vertical beam antenna submodule (2) is arranged on another plane of the terminal. After the arrangement is arranged, the arrangement surface of the horizontal beam antenna submodule (1) is perpendicular to the arrangement surface of the vertical beam antenna submodule (2), and the vertical beam antenna submodule (2) comprises a vertical radiation plate (21), a vertical dielectric substrate, a vertical antenna metal layer, a vertical hard dielectric substrate, a control layer, a radio frequency isolation metal layer, a vertical soft dielectric substrate, a vertical feeder (22) and a vertical feeder metal layer, which are arranged in sequence and stacked. The horizontal beam antenna submodule (1) is arranged on a plane of the terminal; A phased array chip (4) is also provided at the bottom of the vertical beam antenna submodule (2), and the phased array chip (4) is connected to the horizontal beam antenna submodule (1) and controls the horizontal beam antenna submodule (1) to perform beam scanning in the horizontal plane; and the phased array chip (4) is connected to the vertical beam antenna submodule (2) and controls the vertical beam antenna submodule (2) to perform beam scanning in the vertical plane; The horizontal beam antenna submodule (1) comprises a horizontal radiating plate (11) and a horizontal feeder (12); the horizontal feeder (12) is located at a lower layer of the horizontal radiating plate (11) and is connected to the horizontal radiating plate (11) via a first vertical via (13); and a portion of the horizontal feeder (12) is arranged on the transmission line soft substrate (3), so that the horizontal radiating plate (11) is connected to a phased array chip (4) arranged at the bottom of the vertical beam antenna submodule (2) via the horizontal feeder (12).

2. A 5G millimeter wave communication module for a mobile terminal according to claim 1, characterized in that: The horizontal beam antenna submodule (1) further comprises a horizontal dielectric substrate, a horizontal antenna metal layer, a horizontal soft dielectric substrate, and a horizontal feeder metal layer; and the horizontal radiation sheet (11), the horizontal dielectric substrate, the horizontal antenna metal layer, the horizontal soft dielectric substrate, the horizontal feeder (12), and the horizontal feeder metal layer are stacked in sequence.

3. A 5G millimeter wave communication module for a mobile terminal according to claim 2, characterized in that: The horizontal radiation piece (11) is a double-layer parasitic antenna unit, comprising two layers of stacked horizontal parasitic patches and a horizontal main radiation piece.

4. The 5G millimeter wave communication module for a mobile terminal according to claim 1, characterized in that: The phased array chip (4) is connected to the vertical radiation sheet (21) via the vertical feed line (22).

5. The 5G millimeter wave communication module for a mobile terminal according to claim 1, characterized in that: The vertical radiation piece (21) is a double-layer parasitic antenna unit, comprising two layers of stacked vertical parasitic patches and a vertical main radiation piece.

6. A 5G millimeter wave communication module for a mobile terminal according to claim 4, characterized in that: The vertical feed line (22) is connected to the vertical radiation sheet (21) via a second vertical via hole (23), and the vertical feed line (22) is located at a lower layer of the vertical radiation sheet (21).

7. The 5G millimeter wave communication module for a mobile terminal according to claim 1, characterized in that: The control layer includes a digital circuit, a radio frequency circuit and a power supply.

Citation Information

Patent Citations

  • 5G millimeter wave communication module applied to mobile terminal

    CN214957320U

  • Antenna device and circuit board including the same

    JP2019004241A