Touch sensor, method of manufacturing the same, and display device having the same

Abstract

Disclosed are a touch sensor for a display device, a method of manufacturing the same, and a display device having the same. The touch sensor includes a base layer, a first conductive layer disposed on the base layer in a sensing area, an insulating layer disposed on the first conductive layer, a second conductive layer disposed on the insulating layer in the sensing area, a first insulating pattern disposed on the second conductive layer, a plurality of signal lines disposed in a non-sensing area, the plurality of signal lines electrically connected to the first conductive layer and the second conductive layer, and a second insulating pattern disposed on the plurality of signal lines. The first insulating pattern and the second insulating pattern include the same material and are disposed in the same layer.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0159197, filed on December 3, 2019, which is incorporated herein by reference as if fully set forth herein for all purposes. TECHNICAL FIELD

[0002] Exemplary embodiments of the present invention relate generally to a touch sensor, and more particularly, to a touch sensor including a conductive pattern, a manufacturing method thereof, and a display device having the same. BACKGROUND

[0003] A touch sensor is an information input device, and can be provided and used in a display device. In an example, the touch sensor can be attached to one surface of a display panel or can be integrally formed with the display panel. A user can input information by pressing or touching the touch sensor while viewing an image displayed on a screen.

[0004] The above information disclosed in this BACKGROUND section is only for the understanding of the background of the present invention, and, therefore, it can contain information that does not constitute prior art. SUMMARY

[0005] Applicants have found that foreign matter can be introduced during a manufacturing process of a touch sensor, which can cause a short circuit failure during use of the touch sensor.

[0006] The touch sensor and the display device including the same and the method for manufacturing the touch sensor according to the principles of the present invention and exemplary embodiments have improved reliability. For example, the touch sensor and the method for manufacturing the touch sensor can include an insulating pattern to reduce and / or minimize a failure due to a manufacturing process of the touch sensor. The insulating pattern can be disposed on the conductive pattern of the sensing area and the sensing line of the non-sensing area such that the insulating pattern can prevent a short circuit failure caused by foreign matter introduced in the manufacturing process.

[0007] Additional features of the inventive concept will be set forth in the description that follows, and in part will be apparent from the description, or can be learned by practice of the inventive concept.

[0008] According to one aspect of the present application, a touch sensor for a display device includes a base layer; a first conductive layer disposed on the base layer in a sensing area; an insulating layer disposed on the first conductive layer; a second conductive layer disposed on the insulating layer in the sensing area; a first insulating pattern disposed on the second conductive layer; a plurality of signal lines disposed in a non-sensing area, the plurality of signal lines electrically connected to the first conductive layer and the second conductive layer; and a second insulating pattern disposed on the plurality of signal lines. The first insulating pattern and the second insulating pattern include the same material and are disposed in the same layer.

[0009] The first insulating pattern can be superposed with the second conductive layer, and the second insulating pattern can be superposed with the signal lines.

[0010] The first insulating pattern and the second conductive layer can have substantially the same shape in a plane, and the second insulating pattern and the signal lines can have substantially the same shape in a plane.

[0011] The first insulating pattern can be in contact with at least a portion of the second conductive layer.

[0012] The first insulating pattern and the second insulating pattern can include at least one of an inorganic insulating material and an organic insulating material.

[0013] The second conductive layer can include a second conductive pattern including a plurality of first sensor patterns disposed on the insulating layer, the plurality of first sensor patterns being arranged in a first direction; a plurality of second sensor patterns disposed on the insulating layer, the plurality of second sensor patterns being arranged in a second direction intersecting the first direction, the plurality of second sensor patterns being spaced apart from the first sensor patterns; and a plurality of second bridge patterns connecting the second sensor patterns to each other. The first conductive layer can include a first conductive pattern including a plurality of first bridge patterns disposed between the base layer and the insulating layer in the sensing area, the plurality of first bridge patterns connecting the first sensor patterns to each other.

[0014] The first insulating pattern can be disposed on each of the first sensor patterns, the second sensor patterns, and the second bridge patterns.

[0015] The first insulating pattern can be formed in the same process as each of the first sensor patterns, the second sensor patterns, and the second bridge patterns.

[0016] The first insulating pattern can be in contact with at least a portion of each of the first sensor patterns, at least a portion of each of the second sensor patterns, and at least a portion of each of the second bridge patterns.

[0017] The first insulating pattern can be in contact with an upper surface of the first sensor pattern, an upper surface of the second sensor pattern, and an upper surface of the second bridge pattern.

[0018] The second insulating pattern can be in contact with at least a portion of each of the signal lines.

[0019] The signal lines can include sensing lines, and at least some of the sensing lines can include a first metal layer disposed between the base layer and the insulating layer, and a second metal layer disposed between the insulating layer and the second insulating pattern, the second metal layer being stacked with the first metal layer. The second insulating pattern and the second metal layer can be disposed through the same process.

[0020] According to another aspect of the inventive concept, a method of manufacturing a touch sensor for a display device includes the steps of: disposing a base layer for a sensing area and a non-sensing area surrounding at least one side of the sensing area; forming a first conductive layer in the sensing area and at least one first metal layer in the non-sensing area on the base layer; forming an insulating layer on the first conductive layer and the first metal layer, the insulating layer including a contact hole exposing at least a portion of the first conductive layer; sequentially forming a metal material layer and an insulating material layer on the insulating layer; and forming a second conductive layer and a first insulating pattern disposed on top thereof, and a second metal layer and a second insulating pattern disposed on top thereof, by etching the metal material layer and the insulating material layer at the same time. The second conductive layer and the first insulating pattern correspond to the sensing area on the insulating layer, and the second metal layer and the second insulating pattern correspond to the non-sensing area on the insulating layer. The first insulating pattern and the second insulating pattern include at least one of an inorganic insulating material and an organic insulating material.

[0021] The second conductive layer can include: a plurality of first sensor patterns disposed on the insulating layer, the plurality of first sensor patterns being arranged in a first direction; a plurality of second sensor patterns disposed on the insulating layer, the plurality of second sensor patterns being arranged in a second direction intersecting the first direction, the plurality of second sensor patterns being spaced apart from the first sensor patterns; and a plurality of second bridge patterns connecting the second sensor patterns to each other. The first conductive layer can include a plurality of first bridge patterns disposed between the base layer and the insulating layer in the sensing area, the plurality of first bridge patterns connecting the first sensor patterns to each other.

[0022] The first insulating pattern can be disposed on each of the first sensor pattern, the second sensor pattern, and the second bridge pattern.

[0023] The first insulating pattern can be in contact with an upper surface of the first sensor pattern, an upper surface of the second sensor pattern, and an upper surface of the second bridge pattern.

[0024] According to still another aspect of the present application, a display device includes a display panel for displaying an image, and a touch sensor disposed on the display panel. The touch sensor includes a base layer disposed on the display panel, a first conductive layer disposed on the base layer in a sensing area, an insulating layer disposed on the first conductive layer, a second conductive layer disposed on the insulating layer in the sensing area, a first insulating pattern disposed on the second conductive layer, a plurality of signal lines disposed on the base layer in a non-sensing area, the plurality of signal lines electrically connected to the first conductive layer and the second conductive layer, and a second insulating pattern disposed on the plurality of signal lines. The first insulating pattern and the second insulating pattern include the same material and are disposed in the same layer.

[0025] The first insulating pattern and the second insulating pattern can include at least one of an inorganic insulating material and an organic insulating material.

[0026] The first insulating pattern can be superposed with the second conductive layer, and the second insulating pattern can be superposed with the signal lines. The first insulating pattern and the second conductive layer can have substantially the same shape in a plane, and the second insulating pattern and the signal lines can have substantially the same shape in the plane.

[0027] The second conductive layer can include a second conductive pattern including a plurality of first sensor patterns disposed on the insulating layer, the plurality of first sensor patterns being arranged in a first direction, a plurality of second sensor patterns disposed on the insulating layer, the plurality of second sensor patterns being arranged in a second direction intersecting the first direction, the plurality of second sensor patterns being spaced apart from the first sensor patterns, and a plurality of second bridge patterns connecting the second sensor patterns to each other. The first conductive layer can include a first conductive pattern including a plurality of first bridge patterns disposed between the base layer and the insulating layer in the sensing area, the plurality of first bridge patterns connecting the first sensor patterns to each other.

[0028] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the application as claimed. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the application and together with the description serve to explain the principles of the application.

[0030] Figure 1 is a perspective view of an exemplary embodiment of a display device constructed in accordance with the principles of the present application.

[0031] Figure 2 is Figure 1 is a schematic cross-sectional view of a display device of

[0032] Figure 3 is a plan view of an exemplary embodiment of a display panel of Figure 2

[0033] Figure 4A is an equivalent circuit diagram of a representative pixel of Figure 3

[0034] Figure 4B is a sectional view of a portion of a display panel of Figure 3

[0035] Figure 5 is a schematic sectional view of an exemplary embodiment of a touch sensor of Figure 2

[0036] Figure 6 is a schematic plan view of an exemplary embodiment of a touch sensor of Figure 2

[0037] Figure 7 is an enlarged plan view of a portion EA1 of Figure 6

[0038] Figure 8 is a sectional view taken along line I-I’ of Figure 7

[0039] Figure 9 is an enlarged plan view schematically showing a portion EA3 of Figure 7

[0040] Figure 10 is an enlarged plan view schematically showing a portion EA2 of Figure 6

[0041] Figure 11A and Figure 11B is a sectional view taken along line II-II’ of Figure 10

[0042] Figures 12A-12E is a schematic sectional view of an exemplary embodiment of a touch sensor sequentially showing some processes in manufacturing the touch sensor according to the principles of the application.

[0043] Figure 13 is a perspective view of another exemplary embodiment of a display device constructed according to the principles of the application.

[0044] Figure 14 is a plan view of a display device of Figure 13

[0045] Figure 15 is a sectional view taken along Figure 14 ​​​​​​​​​​​cross-sectional view taken along line III-III' of

[0046] Figure 16 is along Figure 14 cross-sectional view taken along line IV-IV' of DETAILED DESCRIPTION

[0047] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various exemplary embodiments or implementations of the present invention. "Embodiment" and "implementation" as used herein are used interchangeably, and are non-limiting examples of an apparatus or method employing one or more of the inventive concepts disclosed herein. It will be apparent, however, that various exemplary embodiments can be practiced without these specific details, or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the various exemplary embodiments. In addition, various exemplary embodiments can be different from one another but not necessarily mutually exclusive. For example, a specific shape, configuration, and / or characteristic of an exemplary embodiment can be used or implemented in another exemplary embodiment without departing from the inventive concepts.

[0048] Unless otherwise indicated, the exemplary embodiments shown are understood to provide exemplary features of variations of some ways in which the inventive concepts can be implemented in practice. Thus, unless otherwise indicated, features, components, modules, layers, films, panels, regions, and / or aspects of various embodiments, etc. (hereinafter, individually or collectively referred to as "elements") can be additionally combined, separated, interchanged, and / or rearranged, without departing from the inventive concepts.

[0049] The use of cross-hatching and / or shading in the drawings is generally provided to illustrate the boundaries, edges, and / or surfaces of elements of the system. As such, unless otherwise specified, the presence of cross-hatching or shading in a drawing generally indicates a boundary, edge, and / or surface that generally is not intended to be cross-hatched and / or shaded. Moreover, the inclusion of broadening phrases such as "generally," "approximately," "exemplary," "configurations," and / or the like are not used to limit or otherwise narrow the scope of the inventive concepts. Further, the size and relative sizes of the elements as shown in the drawings can be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be carried out in different ways, specific sequences of processes can be performed in different sequences. For example, two sequentially described processes can be performed at about the same time or in the reverse order described. Additionally, like reference numerals denote like elements throughout the drawings.

[0050] When a component or layer is referred to as being "on," "connected to," or "bonded to" another component or layer, the component or layer may be directly on, directly connected to, or directly bonded to the other component or layer, or there may be intermediate components or layers present. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly bonded to" another component or layer, there are no intermediate components or layers present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection, with or without intermediate components. Furthermore, the D1, D2, and D3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) but can be interpreted in a broader sense. For example, the D1, D2, and D3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0051] Although the terms “first,” “second,” etc., may be used here to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be referred to as the second element without departing from the publicly stated teachings.

[0052] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., as in a “sidewall”) may be used herein to describe the relationship of one element to another (or other) elements as shown in the accompanying drawings. Spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture other than those depicted in the drawings. For example, if the device in the drawings is flipped, then an element described as “below” or “under” other elements or features would subsequently be positioned “above” said other elements or features. Thus, the exemplary term “below” can encompass both above and below orientations. Furthermore, the device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), thus interpreting the spatial relative descriptive terms used herein accordingly.

[0053] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the use of the terms "including," "containing," and / or "comprising" in this specification, and in the claims that follow, are used to mean that there are additions to the described features, elements, steps, operations, components, and / or components, but do not exclude the presence or addition of other features, elements, steps, operations, components, and / or groups thereof. It is also noted that the use of the terms "first," "second," "third," etc. herein does not generally limit the quantities or order of elements, steps, operations, components, and / or groups thereof. Rather, these terms can be used to identify particular claim elements from one another in a specific claim. Thus, these terms are used merely to distinguish different claim elements or limit the scope of the claims, and do not distinguish the claimed subject matter from what is not claimed.

[0054] Various example embodiments are described herein with reference to cross-sectional and / or exploded illustrations that are schematic illustrations of idealized embodiments and / or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, examples embodiments disclosed herein should not necessarily be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result from, for example, manufacturing. In this manner, regions illustrated in the figures can have a somewhat inexact shape and such should not be interpreted as limiting the scope of examples embodiments.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0056] Figure 1 is a perspective view of an example embodiment of a display device constructed in accordance with the principles of the invention. Figure 2 is Figure 1 is a schematic cross-sectional view of a display device.

[0057] Referring to Figure 1 and Figure 2 , the display device DD can include a display module DM and a window WD.

[0058] The display device DD can be provided in various shapes. In an example, the display device DD can be provided in a substantially rectangular plate shape having two pairs of substantially parallel sides, but the example embodiments are not limited thereto. When the display device DD is provided in a rectangular plate shape, any one of the two pairs of sides can be provided longer than the other pair of sides. In an embodiment, for convenience of description, a case where the display device DD is provided in a rectangular shape having one pair of long sides and one pair of short sides is shown. The longitudinal extension direction of the long sides is denoted as a second direction DR2, the longitudinal extension direction of the short sides is denoted as a first direction DR1, and a direction perpendicular to the first direction DR1 and the second direction DR2 is denoted as a third direction DR3. As described above, in the display device DD provided in a substantially rectangular plate shape, a corner portion in which one long side and one short side contact each other can have a circular shape.

[0059] In an embodiment, at least a portion of the display device DD can have flexibility, and the display device DD can be folded at the portion having flexibility.

[0060] The display device DD can include a display area DD_DA for displaying an image and a non-display area DD_NDA provided at at least one side of the display area DD_DA. The non-display area DD_NAD is an area in which an image is not displayed.

[0061] In some embodiments, the display device DD can include a sensing area SA and a non-sensing area NSA vertically stacked with the display area DD_DA and the non-display area DD_NDA, respectively. The display device DD can not only display an image through the sensing area SA, but also sense a touch input and / or light incident from the front thereof. The non-sensing area NSA can surround the sensing area SA. However, this is merely illustrative, and the example embodiments are not limited thereto. Although the sensing area SA is shown to have a shape including a circular corner and to correspond to the display area DD_DA in Figure 1 In some embodiments, a partial area of the display area DD_DA can correspond to the sensing area SA.

[0062] The shape, size, and arrangement position of the sensing area SA of the display device DD can be variously modified according to a sensor pattern which will be described later.

[0063] The display module DM can include a display panel DP and a touch sensor TS.

[0064] Display panel DP can display images. Self-emissive display panels, such as organic light-emitting display panels (OLED panels), can be used as display panel DP. In addition, non-emissive display panels, such as liquid crystal display panels (LCD panels), electrophoretic display panels (EPD panels), and electrowetting display panels (EWD panels), can be used as display panel DP. When a non-emissive display panel is used as display panel DP, the display device DD can have a backlight unit for supplying light to the display panel DP.

[0065] A touch sensor TS can be positioned on the surface from which the image of the display panel DP is emitted to receive user touch input. The touch sensor TS can recognize touch events on the display device DD caused by the user's hand or a separate input device. The touch sensor TS can recognize touch events using a capacitive method.

[0066] A window WD (Display Window) can be installed on the display module DM to protect its exposed surfaces. The window WD protects the display module DM from external impacts and provides an input and / or display surface to the user. The window WD can be attached to the display module DM using an optically clear adhesive (or bonding) (OCA) component.

[0067] Window WD can have a multi-layered structure selected from glass substrates, plastic films, and plastic substrates. The multi-layered structure can be formed through a continuous process or by using an adhesive layer attachment process. Window WD, either wholly or partially, can be flexible.

[0068] Figure 3 yes Figure 2 A plan view of an exemplary embodiment of the display panel.

[0069] Reference Figures 1-3 The display panel DP may include a substrate SUB, a pixel PXL disposed on the substrate SUB, a driving unit disposed on the substrate SUB to drive the pixel PXL, and a line unit connecting the pixel PXL to the driving unit.

[0070] A base SUB can be provided as a region with an approximately rectangular shape. However, the number of regions provided in a base SUB can vary, and the shape of the base SUB can be changed depending on the region provided in the base SUB.

[0071] The substrate SUB can be made of an insulating material such as glass or resin. Also, the substrate SUB can be made of a material having flexibility to be bendable or foldable, and have a single layer or a multi-layer structure. For example, the material having flexibility can include at least one of polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyether sulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, cellulose acetate propionate, or the like.

[0072] However, the material constituting the substrate SUB can be variously changed, and the substrate SUB can be made of a fiber-reinforced plastic (FRP) or the like.

[0073] The substrate SUB can include a display area DA and a non-display area NDA. The display area DA can be an area in which pixels PXL are disposed to display an image, and the non-display area NDA is an area in which the pixels PXL are not disposed. The non-display area NDA can be an area in which an image is not displayed. For convenience of description, a representative pixel PXL is shown in Figure 3 A plurality of pixels PXL can be substantially arranged in the display area DA of the substrate SUB.

[0074] The display area DA of the display panel DP can correspond to a display area DD_DA of the display device DD, and the non-display area NDA of the display panel DP can correspond to a non-display area DD_NDA of the display device DD.

[0075] The non-display area NDA can be provided with a driving unit for driving the pixels PXL and some lines connecting the pixels PXL to the driving unit. The non-display area NDA can correspond to a bezel area of the display device DD.

[0076] The pixels PXL can be disposed in the display area DA of the substrate SUB. Each of the pixels PXL can be a minimum unit of displaying an image. Each of the pixels PXL can include an organic light emitting device that emits white light and / or color light. Each of the pixels PXL can emit light of any one color among red, green, and blue. However, the exemplary embodiments are not limited thereto, and the pixels PXL can emit light of any color such as cyan, magenta, or yellow.

[0077] The pixels PXL can be arranged in a matrix form along rows extending in a first direction DR1 and columns extending in a second direction DR2 intersecting the first direction DR1. However, the arrangement form of the pixels PXL is not particularly limited, and the pixels PXL can be arranged in various forms.

[0078] The driving unit provides a signal to each of the pixels PXL through a line unit, and controls the driving of the pixels PXL. For convenience of description, a representative pixel PXL is shown inFigure 3 The line unit is omitted. The line unit will be described later with reference to Figure 4A The line unit.

[0079] The driving unit can include a scan driver SDV for transferring a scan signal to each of the pixels PXL along a scan line, an emission driver EDV for providing an emission control signal to each of the pixels PXL along an emission control line, a data driver DDV for providing a data signal to each of the pixels PXL along a data line, and a timing controller. The timing controller controls the scan driver SDV, the emission driver EDV, and the data driver DDV.

[0080] Figure 4A is an equivalent circuit diagram of a representative pixel of Figure 3

[0081] With reference to Figures 1-4A Each of the pixels PXL can include a light emitting element OLED and a pixel circuit PC for driving the light emitting element OLED. In an embodiment, the light emitting element OLED can refer to an organic light emitting diode.

[0082] The pixel circuit PC can be connected to a scan line Si and a data line Dj of the corresponding pixel PXL. In an example, when the pixel PXL is disposed on an i-th (i is a natural number) row and a j-th (j is a natural number) column of a display area DA of the display panel DP, the pixel circuit PC of the pixel PXL can be connected to an i-th scan line Si and a j-th data line Dj of the display area DA. In some embodiments, the pixel circuit PC can be further connected to at least another scan line. For example, one pixel PXL disposed on the i-th row of the display area DA can be further connected to an i-1-th scan line Si-1 and / or an i+1-th scan line Si+1. In some embodiments, the pixel circuit PC can be further connected to a third power source in addition to the first pixel power source ELVDD and the second pixel power source ELVSS. For example, the pixel circuit PC can be further connected to an initialization power source Vint.

[0083] The pixel circuit PC can include a first transistor T1 to a seventh transistor T7 and a storage capacitor Cst.

[0084] One electrode (e.g., a source electrode) of the first transistor T1 (a driving transistor) can be connected to a power line to which the first pixel power source ELVDD is applied via the fifth transistor T5, and the other electrode (e.g., a drain electrode) of the first transistor T1 can be connected to the light emitting element OLED via the sixth transistor T6. In addition, a gate electrode of the first transistor T1 can be connected to a first node N1. The voltage of the first node N1 controlled by the first transistor T1 controls a driving current flowing between the first pixel power source ELVDD and the second pixel power source ELVSS via the light emitting element OLED.​

[0085] The second transistor T2 (a switching transistor) can be connected between the jth data line Dj connected to the pixel PXL and the source electrode of the first transistor T1. Also, the gate electrode of the second transistor T2 can be connected to the ith scan line Si connected to the pixel PXL. The second transistor T2 can be turned on when a scan signal having a gate-on voltage (e.g., a low voltage) is supplied from the ith scan line Si, to electrically connect the jth data line Dj to the source electrode of the first transistor T1. Thus, when the second transistor T2 is turned on, a data signal supplied from the jth data line Dj is transferred to the first transistor T1.

[0086] The third transistor T3 can be connected between the drain electrode of the first transistor T1 and the first node N1. Also, the gate electrode of the third transistor T3 can be connected to the ith scan line Si. The third transistor T3 can be turned on when a scan signal having a gate-on voltage is supplied from the ith scan line Si, to electrically connect the drain electrode of the first transistor T1 and the first node N1.

[0087] The fourth transistor T4 can be connected between the first node N1 and an initialization power line to which an initialization power source Vint is applied. Also, the gate electrode of the fourth transistor T4 can be connected to a previous scan line (e.g., the (i-1)th scan line Si-1). The fourth transistor T4 can be turned on when a scan signal having a gate-on voltage is supplied from the (i-1)th scan line Si-1, to transfer a voltage of the initialization power source Vint to the first node N1. The initialization power source Vint can have a voltage equal to or less than the lowest voltage of the data signal.

[0088] The fifth transistor T5 can be connected between the first pixel power source ELVDD and the first transistor T1. Also, the gate electrode of the fifth transistor T5 can be connected to a corresponding emission control line (e.g., the ith emission control line Ei). The fifth transistor T5 can be turned off when an emission control signal having a gate-off voltage is supplied from the ith emission control line Ei, and turned on in other cases.

[0089] The sixth transistor T6 can be connected between the first transistor T1 and the light emitting element OLED. Also, the gate electrode of the sixth transistor T6 can be connected to the ith emission control line Ei. The sixth transistor T6 can be turned off when an emission control signal having a gate-off voltage is supplied from the ith emission control line Ei, and turned on in other cases.

[0090] The seventh transistor T7 can be connected between the light emitting element OLED and an initialization power line to which an initialization power source Vint is applied. Also, a gate electrode of the seventh transistor T7 can be connected to any one of the next stage scan lines (for example, the i+1th scan line Si+1). The seventh transistor T7 can be turned on when a scan signal having a gate-on voltage is supplied from the i+1th scan line Si+1, to supply a voltage of the initialization power source Vint to the light emitting element OLED.

[0091] The storage capacitor Cst can be connected between the first pixel power source ELVDD and the first node N1. The storage capacitor Cst can store a data signal supplied to the first node N1 and a threshold voltage of the first transistor T1 in each frame period.

[0092] An anode electrode of the light emitting element OLED can be connected to the first transistor T1 via the sixth transistor T6, and a cathode electrode of the light emitting element OLED can be connected to the second pixel power source ELVSS. The light emitting element OLED can generate light having a luminance corresponding to an amount of current supplied through the first transistor T1. The first pixel power source ELVDD can be set to have a voltage higher than that of the second pixel power source ELVSS, so that a current can flow through the light emitting element OLED. A potential difference between the first pixel power source ELVDD and the second pixel power source ELVSS can be set to be a threshold voltage of the light emitting element OLED or more during the emission period.

[0093] Figure 4B is Figure 3 a cross-sectional view of a portion of the display panel.

[0094] In Figure 4B , for ease of description, only a cross section of a portion corresponding to each of the second transistor T2 and the sixth transistor T6 among the first to seventh transistors T1 to T7 shown in Figure 4A

[0095] Referring to Figures 1-4B , the display panel DP can include a substrate SUB, a pixel circuit layer PCL, a display element layer DPL, and a thin film encapsulation layer TFE.

[0096] The substrate SUB can include an insulating material such as glass, an organic polymer, or quartz. Also, the substrate SUB can be made of a material having flexibility to be bendable or foldable, and have a single layer or a multi-layer structure. The substrate SUB can have the same configuration as that of the substrate SUB described with reference to Figure 3

[0097] The pixel circuit layer PCL can include a buffer layer BFL, the second transistor T2 and the sixth transistor T6, and a passivation layer PSV. ​​

[0098] The buffer layer BFL can be provided on the substrate SUB, and can prevent impurities from diffusing into the second transistor T2 and the sixth transistor T6. The buffer layer BFL can be provided as a single layer, or as a multi-layer including at least two layers. The buffer layer BFL can be omitted depending on the material of the substrate SUB and process conditions.

[0099] Each of the second transistor T2 and the sixth transistor T6 can include a semiconductor layer SCL, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0100] The semiconductor layer SCL of each of the second transistor T2 and the sixth transistor T6 can be provided on the buffer layer BFL. The semiconductor layer SCL can include a source region and a drain region in contact with the source electrode SE and the drain electrode DE, respectively. A region between the source region and the drain region can be a channel region.

[0101] The semiconductor layer SCL can be a semiconductor pattern made of polysilicon, amorphous silicon, an oxide semiconductor, or the like. The channel region is an intrinsic semiconductor pattern that is not doped with impurities. The impurities can include impurities such as n-type impurities, p-type impurities, and other metals. Each of the source region and the drain region can be a semiconductor pattern doped with impurities.

[0102] The gate electrode GE of each of the second transistor T2 and the sixth transistor T6 can be provided on the corresponding semiconductor layer SCL with a gate insulating layer GI interposed therebetween.

[0103] The source electrode SE of each of the second transistor T2 and the sixth transistor T6 can be in contact with the source region of the corresponding semiconductor layer SCL through a contact hole that penetrates the interlayer insulating layer ILD and the gate insulating layer GI. In an example, the source electrode SE of the second transistor T2 can be in contact with the source region of the corresponding semiconductor layer SCL through a first contact hole CH1 that penetrates the interlayer insulating layer ILD and the gate insulating layer GI, and the source electrode SE of the sixth transistor T6 can be in contact with the source region of the corresponding semiconductor layer SCL through a third contact hole CH3 that penetrates the interlayer insulating layer ILD and the gate insulating layer GI.

[0104] The drain electrode DE of each of the second transistor T2 and the sixth transistor T6 can be in contact with the drain region of the corresponding semiconductor layer SCL through a contact hole that penetrates the interlayer insulating layer ILD and the gate insulating layer GI. In an example, the drain electrode DE of the second transistor T2 can be in contact with the drain region of the corresponding semiconductor layer SCL through a second contact hole CH2 that penetrates the interlayer insulating layer ILD and the gate insulating layer GI, and the drain electrode DE of the sixth transistor T6 can be in contact with the drain region of the corresponding semiconductor layer SCL through a fourth contact hole CH4 that penetrates the interlayer insulating layer ILD and the gate insulating layer GI.

[0105] In an embodiment, each of the interlayer insulating layer ILD and the gate insulating layer GI can be configured with an inorganic insulating layer including an inorganic material or an organic insulating layer including an organic material.

[0106] The passivation layer PSV can be provided on the second transistor T2 and the sixth transistor T6 to cover the second transistor T2 and the sixth transistor T6. The passivation layer PSV can include a fifth contact hole CH5 through which a portion of the drain electrode DE of the sixth transistor T6 is exposed to the outside.

[0107] The display element layer DPL can include an emission element OLED provided on the passivation layer PSV, the emission element OLED emitting light.

[0108] The emission element OLED can include a first electrode AE and a second electrode CE and an emission layer EML provided between the two electrodes AE and CE. Any one of the first electrode AE and the second electrode CE can be an anode electrode, and the other of the first electrode AE and the second electrode CE can be a cathode electrode. For example, the first electrode AE can be an anode electrode, and the second electrode CE can be a cathode electrode. When the emission element OLED is a top emission organic light emitting device, the first electrode AE can be a reflective electrode, and the second electrode CE can be a transmissive electrode. In an embodiment, a case where the emission element OLED is a top emission organic light emitting device and the first electrode AE is an anode electrode is described by way of example.

[0109] The first electrode AE can be electrically connected to the drain electrode DE of the sixth transistor T6 through the fifth contact hole CH5 that penetrates the passivation layer PSV. The first electrode AE can include a reflective layer capable of reflecting light and a transparent conductive layer provided on the top or bottom of the reflective layer. At least one of the transparent conductive layer and the reflective layer can be electrically connected to the drain electrode DE of the sixth transistor T6.

[0110] The display element layer DPL can further include a pixel definition layer PDL having an opening OP through which a portion of the first electrode AE (e.g., an upper surface of the first electrode AE) is exposed.

[0111] Each pixel PXL provided in the display panel DP can be provided in a pixel region included in the display area DA. In an embodiment, the pixel region can include an emission area EMA and a non-emission area NEMA adjacent to the emission area EMA. The non-emission area NEMA can surround the emission area EMA. In this embodiment, the emission area EMA can be defined corresponding to a partial region of the first electrode AE exposed by the opening OP.

[0112] The display element layer DPL can include a hole control layer HCL and an electron control layer ECL.

[0113] The hole control layer HCL can be commonly disposed in the emission area EMA and the non-emission area NEMA. A common layer such as the hole control layer HCL can be formed in the plurality of pixels PXL.

[0114] The emission layer EML is disposed on the hole control layer HCL. The emission layer EML can be disposed in an area corresponding to the opening OP. That is, the emission layer EML can be separated to be disposed in the plurality of pixels PXL, respectively. The emission layer EML can include an organic material and / or an inorganic material. In an embodiment, a patterned emission layer EML is exemplarily illustrated. However, in some embodiments, the emission layer EML can be commonly disposed in the pixel PXL. A color of light generated in the emission layer EML can be one of red, green, blue, and white, but the embodiment is not limited thereto. For example, the color of light generated in the emission layer EML can be one of magenta, cyan, and yellow.

[0115] The electron control layer ECL can be disposed on the emission layer EML. The electron control layer ECL can be commonly formed in the pixel PXL and functions to inject and / or transport electrons into the emission layer EML.

[0116] The second electrode CE can be disposed on the electron control layer ECL. The second electrode CE can be commonly disposed in the pixel PXL.

[0117] A thin film encapsulation layer TFE covering the second electrode CE can be disposed on the second electrode CE.

[0118] The thin film encapsulation layer TFE can be disposed as a single layer or multiple layers. The thin film encapsulation layer TFE can include a plurality of insulating layers covering the light emitting element OLED. Specifically, the thin film encapsulation layer TFE can include at least one inorganic layer and at least one organic layer. For example, the thin film encapsulation layer TFE can have a structure in which the inorganic layer and the organic layer are alternately stacked. In some embodiments, the thin film encapsulation layer TFE can be an encapsulation substrate disposed on the light emitting element OLED and bonded to the substrate SUB by a sealing agent.

[0119] Figure 5 is Figure 2 A schematic cross-sectional view of an exemplary embodiment of a touch sensor.

[0120] Referring to Figures 1-5 , the touch sensor TS can include a base substrate layer BSL, a first conductive layer which can be in the form of a conductive pattern CP1, a touch insulating layer INS, and a second conductive layer which can be in the form of a conductive pattern CP2. A protective film PTF can be disposed and / or formed on the touch sensor TS.

[0121] The first conductive pattern CP1 can be disposed directly on the thin film encapsulation layer TFE of the display panel DP, but exemplary embodiments are not limited thereto. In some embodiments, another insulating layer (e.g., a base layer BSL) can be disposed between the first conductive pattern CP1 and the thin film encapsulation layer TFE. The first conductive pattern CP1 can be disposed directly on the base layer BSL.

[0122] Each of the first conductive pattern CP1 and the second conductive pattern CP2 can have a single layer structure, or can have a multi-layer structure in which a plurality of layers are stacked in a thickness direction thereof. The conductive pattern having a single layer structure can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, and alloys thereof. The transparent conductive layer can include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). In addition, the transparent conductive layer can include PEDOT, metal nanowires, and graphene.

[0123] The conductive pattern having a multi-layer structure can include a multi-layer metal layer. The multi-layer metal layer can have, for example, a three-layer structure of titanium / aluminum / titanium. The conductive pattern having a multi-layer structure can include a single-layer metal layer and a transparent conductive layer. The conductive pattern having a multi-layer structure can include a multi-layer metal layer and a transparent conductive layer.

[0124] In an embodiment, each of the first conductive pattern CP1 and the second conductive pattern CP2 can include a sensor pattern and a sensing line.

[0125] An intermediate insulating layer in the form of a touch insulating layer INS is disposed between the first conductive pattern CP1 and the second conductive pattern CP2. The touch insulating layer INS can include an inorganic insulating layer including an inorganic material or an organic insulating layer including an organic material. The inorganic insulating layer can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic insulating layer can include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, an ethylene resin, an epoxy resin, a polyurethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0126] A protective film PTF can be disposed on the second conductive pattern CP2 to cover the second conductive pattern CP2. The protective film PTF can protect the second conductive pattern CP2 from foreign matter, etc. that can be generated during a manufacturing process of the touch sensor TS. The protective film PTF can be attached to components included in the touch sensor TS to protect the components during the manufacturing process of the touch sensor TS, and can be removed from the components after a series of processes is completed. The protective film PTF can be made of, for example, a resin including PET having adhesive (or glue properties) or the like, but the exemplary embodiments are not limited thereto.

[0127] Figure 6 is a schematic plan view of an exemplary embodiment of a touch sensor. Figure 2 Figure 7 is an enlarged plan view of a portion EA1 of Figure 6 Figure 8 is a cross-sectional view taken along line I-I' of Figure 7 Figure 9 is an enlarged plan view of a portion EA3 of Figure 7 Figure 10 is an enlarged plan view of a portion EA2 of Figure 6 Figure 11A and Figure 11B are cross-sectional views taken along line II-II' of Figure 10

[0128] Referring to Figures 1-11B , the touch sensor TS can include a base layer BSL including a sensing area SA capable of sensing a touch input and a non-sensing area NSA surrounding at least a portion of the sensing area SA.

[0129] The base layer BSL can be formed of tempered glass, transparent plastic, a transparent film, etc. In some embodiments, the base layer BSL can be omitted.

[0130] The sensing area SA can be disposed in a central area of the base layer BSL to overlap with a display area DA of a display panel DP shown in Figure 3 . The sensing area SA can be disposed in a shape substantially the same as a shape of the display area DA, but the exemplary embodiments are not limited thereto. Sensor electrodes for sensing a touch input can be disposed and / or formed in the sensing area SA.

[0131] The non-sensing area NSA can be disposed at an edge of the base layer BSL to surround the sensing area SA. Figure 3 ​​​​​​The non-display area NDA of the display panel DP shown in FIG. 1 is overlaid. The sensing lines SL are electrically connected to the sensor electrodes to receive and transmit the sensing signals, and the signal lines in the form of the sensing lines SL can be disposed and / or formed in the non-sensing area NSA. In addition, the pad ("pad" can also be referred to as "land") units PDA connected to the sensor electrodes to be electrically connected to the sensing area SA can be disposed in the non-sensing area NSA. The pad units PDA can include a plurality of pads PD.

[0132] The sensor electrodes can include a plurality of sensor patterns SP and first and second bridge patterns BRP1 and BRP2.

[0133] The sensor patterns SP can include a plurality of first sensor patterns SP1 and a plurality of second sensor patterns SP2 electrically insulated from the first sensor patterns SP1.

[0134] The first sensor patterns SP1 can be arranged in a first direction DR1 and can be electrically connected to adjacent first sensor patterns SP1 by the first bridge patterns BRP1 to constitute at least one sensor row. The second sensor patterns SP2 can be arranged in a second direction DR2 intersecting the first direction DR1 and can be electrically connected to adjacent second sensor patterns SP2 by the second bridge patterns BRP2 to constitute at least one sensor column.

[0135] Each of the sensor rows and the sensor columns of the first sensor patterns SP1 and the second sensor patterns SP2 can be electrically connected to one pad PD through a corresponding sensing line SL.

[0136] The first sensor patterns SP1 can correspond to and / or function as driving electrodes that receive driving signals for detecting touch positions in the sensing area SA, and the second sensor patterns SP2 can correspond to and / or function as sensing electrodes that output sensing signals for detecting touch positions in the sensing area SA. However, exemplary embodiments are not limited thereto. The first sensor patterns SP1 can correspond to the sensing electrodes, and the second sensor patterns SP2 can correspond to the driving electrodes.

[0137] In an embodiment, the touch sensor TS can recognize a user's touch by sensing a change in mutual capacitance formed between the first sensor patterns SP1 and the second sensor patterns SP2.

[0138] In an embodiment, each of the second sensor patterns SP2 can include as Figure 9The second sensor pattern SP2 can include a plurality of conductive fine lines CFL1 and CFL2 as shown in FIG. 1. In an example, each of the second sensor pattern SP2 can include a plurality of first conductive fine lines CFL1 extending in a direction oblique to the first direction DR1 and substantially parallel to each other, and a plurality of second conductive fine lines CFL2 extending in a direction oblique to the second direction DR2 and substantially parallel to each other. Due to the first conductive fine lines CFL1 and the second conductive fine lines CFL2, each of the second sensor pattern SP2 can have a grid structure. The grid structure can include a plurality of openings, for example, areas formed when the first conductive fine lines CFL1 and the second conductive fine lines CFL2 intersect each other.

[0139] Although a case in which each of the second sensor pattern SP2 has a grid structure is shown in the drawings, the exemplary embodiments are not limited thereto. For example, the first sensor pattern SP1 as well as the first bridge pattern BRP1 and the second bridge pattern BRP2 can also have a grid structure including conductive fine lines such as the first conductive fine lines CFL1 and the second conductive fine lines CFL2.

[0140] Each of the first bridge pattern BRP1 serves to electrically connect the first sensor pattern SP1 arranged in the first direction DR1, and can be provided in a shape extending along the first direction DR1. Each of the first bridge pattern BRP1 can include a 1-1 bridge pattern BRP1_1 and a 1-2 bridge pattern BRP1_2.

[0141] Each of the second bridge pattern BRP2 serves to electrically connect the second sensor pattern SP2 arranged in the second direction DR2, and can be provided in a shape extending along the second direction DR2. In an embodiment, each of the second bridge pattern BRP2 can be integrally provided with the second sensor pattern SP2. When each of the second bridge pattern BRP2 is integrally provided with the second sensor pattern SP2, the second bridge pattern BRP2 can be a part of the second sensor pattern SP2.

[0142] The touch sensor TS can include a first conductive pattern CP1 provided on a base substrate layer BSL, a touch insulating layer INS provided on the first conductive pattern CP1, and a second conductive pattern CP2 provided on the touch insulating layer INS.

[0143] The base substrate layer BSL can be provided on a substrate layer SBL. Figure 4BThe base layer BSL can be the uppermost layer of the thin film encapsulation layer TFE of the display panel DP. For example, the base layer BSL can be an inorganic insulating layer (or inorganic layer) that is the uppermost layer of the thin film encapsulation layer TFE. In some embodiments, the base layer BSL can be an inorganic insulating layer (inorganic buffer layer) that is additionally provided on the thin film encapsulation layer TFE. For example, the base layer BSL can include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc.

[0144] The first conductive pattern CP1 can be directly provided on the base layer BSL. In some embodiments, the first conductive pattern CP1 can be electrically connected to and / or physically connected to the base layer BSL through a contact hole CNT that penetrates the base layer BSL. Figure 4B The pixel definition layer PDL is stacked as illustrated in FIG. 1A. In an embodiment, the first conductive pattern CP1 can include a first sensor pattern SP1 and a second sensor pattern SP2 as illustrated in FIG. 1A. Figure 8 The first bridge pattern BRP1 is illustrated in FIG. 1A.

[0145] The first conductive pattern CP1 can include a conductive material. The conductive material can include a transparent conductive oxide or a metal material. In addition, the first conductive pattern CP1 can include a plurality of stacked metal layers. Examples of the transparent conductive oxide can be indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), etc. Examples of the metal material can be copper, silver, gold, platinum, palladium, nickel, tin, aluminum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, lead, etc. The first conductive pattern CP1 can have a single layer or a multi-layer structure.

[0146] A touch insulating layer INS can be provided and / or formed on the first conductive pattern CP1. The touch insulating layer INS can include the same material as that of the base layer BSL, but exemplary embodiments are not limited thereto. In an embodiment, the touch insulating layer INS can include an organic insulating layer including an organic material or an inorganic insulating layer including an inorganic material. The touch insulating layer INS can have the same configuration as that of the touch insulating layer INS described with reference to FIG. 1A. Figure 5 The touch insulating layer INS described with reference to FIG. 1A can have the same configuration as that of the touch insulating layer INS described with reference to FIG. 1A.

[0147] Like the first conductive pattern CP1, the second conductive pattern CP2 can include a single conductive material layer or include a plurality of stacked conductive material layers. As illustrated in FIG. 1A, the second conductive pattern CP2 can include a first sensor pattern SP1 and a second sensor pattern SP2 provided on the touch insulating layer INS and a second bridge pattern BRP2. Figure 8 As illustrated in FIG. 1A, the second conductive pattern CP2 can include a first sensor pattern SP1 and a second sensor pattern SP2 provided on the touch insulating layer INS and a second bridge pattern BRP2. The first sensor patterns SP1 adjacent to each other in the first direction DR1 can be electrically connected and / or physically connected to each other by the first bridge pattern BRP1 through a contact hole CNT that penetrates the touch insulating layer INS.

[0148] In the above-described embodiments, the case where the first bridge pattern BRP1 is included in the first conductive pattern CP1 and the first and second sensor patterns SP1 and SP2 and the second bridge pattern BRP2 are included in the second conductive pattern CP2 is described by way of example, but the example embodiments are not limited thereto. In some embodiments, the first and second sensor patterns SP1 and SP2 and the second bridge pattern BRP2 can be included in the first conductive pattern CP1, and the first bridge pattern BRP1 can be included in the second conductive pattern CP2.

[0149] Further, in the above-described embodiments, the case where the first conductive pattern CP1 is provided on the base substrate layer BSL and the second conductive pattern CP2 is provided on the touch insulating layer INS is described by way of example, but the example embodiments are not limited thereto. In some embodiments, the first conductive pattern CP1 can be provided on the touch insulating layer INS, and the second conductive pattern CP2 can be provided on the base substrate layer BSL.

[0150] Further, in the above-described embodiments, the case where the first and second sensor patterns SP1 and SP2 are provided in the same layer is described by way of example, but the example embodiments are not limited thereto. In some embodiments, the first and second sensor patterns SP1 and SP2 can be provided in different layers.

[0151] The sensor electrodes provided and / or formed in the sensing area SA can include dummy electrodes provided to be spaced apart from each other between the first and second sensor patterns SP1 and SP2. The dummy electrodes are floating electrodes and are not electrically connected to the first and second sensor patterns SP1 and SP2. The dummy electrodes are provided in the sensing area SA such that a boundary area between the first and second sensor patterns SP1 and SP2 is not visible to a user. Further, the stripe effect between the first and second sensor patterns SP1 and SP2 can be controlled by adjusting the width and thickness of the dummy electrodes, and the capacitance between the first and second sensor patterns SP1 and SP2 can be optimized.

[0152] The touch sensor TS can be formed by a repetitive arrangement of unit sensor blocks USB as shown in Figure 6 and Figure 7 The unit sensor block USB can be a virtual unit block having an area that includes at least some of the sensor patterns SP adjacent in the first direction DR1 and at least some of the sensor patterns SP adjacent in the second direction DR2 in a corresponding sensing area. It will be understood that the unit sensor block USB corresponds to a smallest repeating unit in the arrangement of sensor patterns SP in the corresponding sensing area.

[0153] In an embodiment, the sensing lines SL can include a plurality of first sensing lines SL1 connected to the first sensor pattern SP1 and a plurality of second sensing lines SL2 connected to the second sensor pattern SP2.

[0154] The first sensing lines SL1 can be connected to the first sensor pattern SP1. Each of the first sensing lines SL1 can be connected to one sensor row of the first sensor pattern SP1 arranged along the first direction DR1.

[0155] The second sensing lines SL2 can be connected to the second sensor pattern SP2. Each of the second sensing lines SL2 can be connected to one sensor column of the second sensor pattern SP2 arranged along the second direction DR2.

[0156] The first sensing lines SL1 and the second sensing lines SL2 can be made of a conductive material. The conductive material can include a metal, a metal alloy, a conductive polymer, a conductive metal oxide, a nano-conductive material, etc. In an embodiment, examples of the metal can be copper, silver, gold, platinum, palladium, nickel, tin, aluminum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, lead, etc. Examples of the conductive polymer can be polythiophene-based compounds, polypyrrole-based compounds, polyaniline-based compounds, polyacetylene-based compounds, polyphenylene-based compounds, mixtures thereof, etc. Specifically, a PEDOT / PSS compound can be used as the polythiophene-based compounds. Examples of the conductive metal oxide can be indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), etc. Further, examples of the nano-conductive material can be silver nanowires (AgNW), carbon nanotubes, graphene, etc.

[0157] In an embodiment, the first sensing lines SL1 can be configured as a double layer including a first metal layer SL1a included in the first conductive pattern CP1 and a second metal layer SL1b included in the second conductive pattern CP2 as shown in FIG. 11B. Figure 11A The second metal layer SL1b can be disposed and / or formed on the first metal layer SL1a with the touch insulation layer INS interposed therebetween. The first metal layer SL1a and the second metal layer SL1b can be stacked on each other when viewed in a planar direction. The first metal layer SL1a and the second metal layer SL1b can be electrically connected to each other through a contact hole that penetrates the touch insulation layer INS.

[0158] Although it has been described in the above embodiment that each of the first sensing lines SL1 is configured as a double layer including the first metal layer SL1a and the second metal layer SL1b, the example embodiments are not limited thereto. For example, the first sensing lines SL1 can be configured as a single layer including only the first metal layer SL1a as shown in FIG. 11A. Figure 11BThe second sensing lines SL2 can be configured as single layers included in the second conductive pattern CP2 as shown in the middle. Like the first sensing lines SL1, each of the second sensing lines SL2 can also be configured as double layers including one metal layer included in the first conductive pattern CP1 and another metal layer included in the second conductive pattern CP2, the metal layers being stacked and connected to each other.

[0159] Each of the first sensor patterns SP1 can be applied with a driving signal for touch sensing through a corresponding first sensing line SL1, and each of the second sensor patterns SP2 can transmit a touch sensing signal through a corresponding second sensing line SL2. However, exemplary embodiments are not limited thereto, and the opposite case is possible.

[0160] The touch sensor TS can include a first insulating layer and a second insulating layer, the first insulating layer can be in the form of an insulating pattern INSP1 disposed and / or formed on the sensor patterns SP, and the second insulating layer can be in the form of an insulating pattern INSP2 disposed and / or formed on the sensing lines SL. In an embodiment, the first insulating pattern INSP1 and the second insulating pattern INSP2 can be disposed and / or formed in the same layer, include the same material, and be formed by the same manufacturing process.

[0161] The first insulating pattern INSP1 and the second insulating pattern INSP2 can include the same material as that of the touch insulating layer INS. In an example, the first insulating pattern INSP1 and the second insulating pattern INSP2 can include an inorganic insulating layer including an inorganic material or an organic insulating layer including an organic material. The inorganic insulating layer can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic insulating layer can include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, an ethylene resin, an epoxy resin, a polyurethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0162] The first insulating pattern INSP1 can be located in the sensing area SA, and the second insulating pattern INSP2 can be located in the non-sensing area NSA.

[0163] In an embodiment, the first insulating pattern INSP1 can be directly disposed and / or formed on the sensor patterns SP included in the second conductive pattern CP2. In an example, the first insulating pattern INSP1 can be disposed and / or formed on the first sensor patterns SP1, the second sensor patterns SP2, and the second bridge pattern BRP2, respectively.

[0164] The first insulating pattern INSP1 can overlap the sensor pattern SP included in the second conductive pattern CP2 when viewed in a planar direction. In an example, the first insulating pattern INSP1 can have a planar shape substantially identical to a planar shape of each of the first sensor pattern SP1, the second sensor pattern SP2, and the second bridge pattern BRP2. That is, the first insulating pattern INSP1 on the first sensor pattern SP1 can have a planar shape substantially identical to a planar shape of each of the first sensor pattern SP1, the first insulating pattern INSP1 on the second sensor pattern SP2 can have a planar shape substantially identical to a planar shape of each of the second sensor pattern SP2, and the first insulating pattern INSP1 on the second bridge pattern BRP2 can have a planar shape substantially identical to a planar shape of each of the second bridge pattern BRP2. For example, when each of the first sensor pattern SP1 has a planar shape of a substantially rhombus, the first insulating pattern INSP1 disposed on a top of the first sensor pattern SP1 can have a planar shape of a substantially rhombus.

[0165] The first insulating pattern INSP1 disposed on each of the first sensor pattern SP1 can be spaced apart from the first insulating pattern INSP1 disposed on each of the second sensor pattern SP2 in the sensing area SA. The first insulating pattern INSP1 disposed on each of the second bridge pattern BRP2 can be integrally disposed with the first insulating pattern INSP1 disposed on each of the second sensor pattern SP2.

[0166] The second insulating pattern INSP2 can be directly disposed and / or formed on the sensing line SL included in the second conductive pattern CP2. In an example, the second insulating pattern INSP2 can be directly disposed and / or formed on the second metal layer SL1b of each of the first sensing line SL1. Further, the second insulating pattern INSP2 can be directly disposed and / or formed on the second metal layer of each of the second sensing line SL2.

[0167] The second insulating pattern INSP2 can be superposed with each of the first sense lines SL1 when viewed in a plane. In an example, the second insulating pattern INSP2 can have a planar shape that is substantially the same as a planar shape of each of the first sense lines SL1. In some embodiments, when each of the first sense lines SL1 has an elongated strip-type planar shape extending in a certain direction, the second insulating pattern INSP2 disposed on top of the first sense lines SL1 can also have an elongated strip-type planar shape corresponding to the elongated strip-type planar shape of the first sense lines SL1. Also, when each of the second sense lines SL2 has an elongated strip-type planar shape extending in a certain direction, the second insulating pattern INSP2 disposed on top of the second sense lines SL2 can also have an elongated strip-type planar shape corresponding to the elongated strip-type planar shape of the second sense lines SL2.

[0168] In an embodiment, the first insulating pattern INSP1 can be formed by a process identical to that of each of the first sensor pattern SP1, the second sensor pattern SP2, and the second bridge pattern BRP2 included in the second conductive pattern CP2. In an example, the second conductive pattern CP2 and the first insulating pattern INSP1 located on top of the second conductive pattern CP2 can be simultaneously formed in the sensing area SA by performing a process using a mask on metal layers and insulating material layers sequentially stacked on the touch insulating layer INS. Also, the second conductive pattern CP2 and the second insulating pattern INSP2 located on top of the second conductive pattern CP2 can be simultaneously formed in the non-sensing area NSA by performing a process using a mask on metal layers and insulating material layers sequentially stacked on the touch insulating layer INS. The metal layers and the insulating material layers in the sensing area SA and the metal layers and the insulating material layers in the non-sensing area NSA are identical components.

[0169] The first insulating pattern INSP1 can directly contact at least a portion of each of the first sensor pattern SP1, the second sensor pattern SP2, and the second bridge pattern BRP2. In an example, the first insulating pattern INSP1 on the first sensor pattern SP1 can be disposed only on an upper surface of each of the first sensor pattern SP1 to directly contact the upper surface. The first insulating pattern INSP1 on the first sensor pattern SP1 can not be disposed on any side surface of each of the first sensor pattern SP1, thereby not contacting any of the side surfaces. The first insulating pattern INSP1 on the second sensor pattern SP2 can be directly disposed only on an upper surface of each of the second sensor pattern SP2 to directly contact the upper surface. The first insulating pattern INSP1 on the second sensor pattern SP2 can not be disposed on any side surface of each of the second sensor pattern SP2, thereby not contacting any of the side surfaces. The first insulating pattern INSP1 on the second bridge pattern BRP2 can be directly disposed only on an upper surface of each of the second bridge pattern BRP2 to directly contact the upper surface. The first insulating pattern INSP1 on the second bridge pattern BRP2 can not be disposed on any side surface of each of the second bridge pattern BRP2, thereby not contacting any of the side surfaces.

[0170] The second insulating pattern INSP2 can contact at least a portion of the second metal layer SL1b of the first sense line SL1 and at least a portion of the second metal layer of the second sense line SL2. In an example, the second insulating pattern INSP2 on the second metal layer SL1b of each of the first sense lines SL1 can be directly disposed only on an upper surface of the second metal layer SL1b to directly contact the upper surface. The second insulating pattern INSP2 on the second metal layer SL1b of each of the first sense lines SL1 can not be disposed on any side surface of the second metal layer SL1b, thereby not contacting both side surfaces. The second insulating pattern INSP2 on the second metal layer of each of the second sense lines SL2 can be directly disposed only on an upper surface of the second metal layer of each of the second sense lines SL2 to directly contact the upper surface. The second insulating pattern INSP2 on the second metal layer of each of the second sense lines SL2 can not be disposed on any side surface of the second metal layer of each of the second sense lines SL2, thereby not contacting both side surfaces.

[0171] Each of the first insulating pattern INSP1 and the second insulating pattern INSP2 can cover and thereby protect the components disposed beneath the insulating pattern. In the example, the first insulating pattern INSP1 can protect each of the first sensor pattern SP1, the second sensor pattern SP2, and the second bridging pattern BRP2 disposed beneath the first insulating pattern INSP1, thereby preventing malfunctions caused by foreign matter, defects, etc., formed or deposited in the sensitive electronic components during the manufacturing process of the touch sensor TS. The second insulating pattern INSP2 can protect each of the sensing lines SL disposed beneath the second insulating pattern INSP2, thereby preventing malfunctions caused by foreign matter, defects, etc., formed or deposited on the sensing lines SL.

[0172] In some embodiments, in the touch sensor TS, after forming the second conductive pattern CP2 on the touch insulating layer INS, another insulating layer (e.g., an organic insulating layer disposed on substantially the entire top of the second conductive pattern CP2) is skipped to simplify the process and reduce costs. For example, after forming the second conductive pattern CP2, a protective film (such as...) is then... Figure 5 The protective film (PTF) shown is attached to the second conductive pattern CP2 before subsequent processes are performed. When a laser-beam cutting process is performed to change the shape of the touch sensor TS, as a portion of the protective film PTF is thermally removed by the laser beam, the protective film PTF located at the portion where the cutting process is performed is damaged and separates from other components such as the second conductive pattern CP2. This creates a gap. Foreign matter (e.g., carbide material) generated during the cutting process can be introduced through the gap and then adhere to the second conductive pattern CP2. In this case, due to the foreign matter adhering to the second conductive pattern CP2, a fault such as a short circuit in the second conductive pattern CP2 may occur.

[0173] Additionally, when the protective film PTF is removed, the surface of the second conductive pattern CP2 that is to be adhered to may be damaged, or adhesive (or glue) may remain on the surface. In such cases, faults such as short circuits in the second conductive pattern CP2 may occur.

[0174] According to an exemplary embodiment, the first insulating pattern INSP1 and the second insulating pattern INSP2 are formed on top of the second conductive pattern CP2 using the same process as the second conductive pattern CP2, so that the second conductive pattern CP2 can be protected while preventing faults such as short circuit faults of the second conductive pattern CP2 caused by foreign matter or other defects occurring in the manufacturing process of the touch sensor TS.

[0175] Figures 12A-12Eare schematic cross-sectional views sequentially illustrating exemplary embodiments of a touch sensor in some processes of manufacturing a touch sensor according to principles of the present invention.

[0176] Referring to Figures 1-12A A base layer BSL is formed on the thin film encapsulation layer TFE. The base layer BSL can be an inorganic insulating layer including an inorganic material. In an example, the base layer BSL can be made of nitride (e.g., SiN x ).

[0177] Subsequently, referring to Figures 1-12B A first conductive pattern CP1 is formed on the base layer BSL. The first conductive pattern CP1 can include a 1-1 bridge pattern BRP1_1 located in the sensing area SA and a first metal layer SL1a located in the non-sensing area NSA. In an example, each of the 1-1 bridge pattern BRP1_1 and the first metal layer SL1a can be provided as a multi-layer in which titanium (Ti) / aluminum (Al) / titanium (Ti) are sequentially stacked.

[0178] Referring to Figures 1-12C A touch insulating layer INS including a contact hole CNT exposing a portion of the 1-1 bridge pattern BRP1_1 is formed on the first conductive pattern CP1. The touch insulating layer INS can be provided to cover the sensing area SA and the non-sensing area NSA. The touch insulating layer INS can be an inorganic insulating layer including an inorganic material. In an example, the touch insulating layer INS can be made of nitride (e.g., SiN x ).

[0179] Referring to Figures 1-12D A metal layer MTL and an insulating material layer INSM are sequentially stacked on the touch insulating layer INS. The insulating material layer INSM is located on the metal layer MTL.

[0180] The metal layer MTL can be provided as a multi-layer in which titanium (Ti) / aluminum (Al) / titanium (Ti) are sequentially stacked. The insulating material layer INSM can be an inorganic insulating layer including an inorganic material or an organic insulating layer including an organic material.

[0181] Referring to Figures 1-12EThe second conductive pattern CP2 and the first and second insulating patterns INSP1 and INSP2 on top of the second conductive pattern CP2 are simultaneously formed through the same process. The second conductive pattern CP2 and the first and second insulating patterns INSP1 and INSP2 are formed by disposing a mask on top of the insulating material layer INSM and then sequentially performing a light process, an etching process, and a peeling process. The etching process can be a dry etching process. Through the above-described process, each of the first and second insulating patterns INSP1 and INSP2 can be formed on the upper surface of the corresponding second conductive pattern CP2.

[0182] The second conductive pattern CP2 can include each of the first and second sensor patterns SP1 and SP2 in the sensing area SA and include the second metal layer SL1b of each of the first sensing lines SL1 in the non-sensing area NSA. In addition, the second conductive pattern CP2 can include each of the second bridge patterns BRP2 in the sensing area SA and include the second metal layer of each of the second sensing lines SL2 in the non-sensing area NSA.

[0183] The first insulating pattern INSP1 is disposed on each of the upper surfaces of the first sensor patterns SP1, the upper surfaces of the second sensor patterns SP2, and the upper surfaces of the second bridge patterns BRP2. The second insulating pattern INSP2 is disposed on the second metal layer SL1b of each of the first sensing lines SL1 and on the second metal layer of each of the second sensing lines SL2.

[0184] After the first and second insulating patterns INSP1 and INSP2 and the second conductive pattern CP2 are simultaneously formed, Figure 5 The protective film PTF shown in FIG. 10 is attached on top of the first and second insulating patterns INSP1 and INSP2, and then a subsequent process can be performed. In an example, the subsequent process can be a shape cutting process using a laser beam. When the shape cutting process is performed using a laser beam, a gap is generated between the protective film PTF and the surface on which the protective film PTF is attached while a portion of the protective film PTF is removed. In this case, foreign substances can be introduced through the gap and can be attached to the surface such as the first and second insulating patterns INSP1 and INSP2. In addition, the foreign substances can be attached to both side surfaces of the second conductive pattern CP2 which are not covered by the first and second insulating patterns INSP1 and INSP2.

[0185] Subsequently, a cleaning process is performed after the protective film PTF is removed. Foreign matter can be removed in the cleaning process. If the first insulating pattern INSP1 and the second insulating pattern INSP2 are not disposed on the second conductive pattern CP2, foreign matter can directly adhere to the upper surface of the second conductive pattern CP2 because the area of the upper surface of the second conductive pattern CP2 is relatively wide than the areas of the two side surfaces of the second conductive pattern CP2. In this case, the foreign matter can not be easily removed by the cleaning process. According to an exemplary embodiment, the first insulating pattern INSP1 and the second insulating pattern INSP2 are formed on the upper surface of the second conductive pattern CP2, thereby it can be possible to prevent foreign matter from adhering to the upper surface of the second conductive pattern CP2. In an exemplary embodiment, the first insulating pattern INSP1 and the second insulating pattern INSP2 are formed only on the upper surface of the second conductive pattern CP2, not on the side surfaces of the second conductive pattern CP2.

[0186] Figure 13 is a perspective view of another exemplary embodiment of a display device constructed according to the principles of the present invention. Figure 14 is a plan view of the display device of Figure 13 Figure 15 is a cross-sectional view taken along line III-III' of Figure 14 Figure 16 is a cross-sectional view taken along line IV-IV' of Figure 14 Figure 3 In Figure 14 additional components of the display panel DP and components of the touch sensor TS are shown in one plane.

[0187] With regard to the display device DD shown in Figures 13-16 , only parts different from the above-described embodiments will be mainly described to avoid redundancy. The parts not specifically described in this embodiment follow the parts of the above-described embodiments. In addition, the same reference numerals refer to the same components, and similar reference numerals refer to similar components.

[0188] Referring to Figures 13-16 , the display device DD can include a display panel DP and a touch sensor TS. The display device DD can further include a window.

[0189] The display device DD can include a display area DD_DA for displaying an image and a non-display area DD_NDA disposed at at least one side of the display area DD_DA. The display area DD_DA can correspond to a sensing area SA of the touch sensor TS, and the non-display area DD_NDA can correspond to a non-sensing area NSA of the touch sensor TS. In an embodiment, the display area DD_DA can be the display area DA shown in Figure 3 , and the non-display area DD_NDA can be the non-display area NDA shown in​​​Figure 3 a non-display area NDA illustrated in FIG. 1A.

[0190] At least a portion of the display device DD can have flexibility, and the display device DD can be folded at the portion having flexibility. In an embodiment, the term "folded" does not refer to a fixed shape, but refers to a shape that can be deformed from an original shape to another shape, and includes a shape that is folded, bent, or rolled into a roll along at least one specific line (i.e., a folding line).

[0191] The display device DD can include a bending area BA having flexibility and being bent in one direction, and a flat area FA that is continuous at at least one side of the bending area BA and is substantially flat without being bent. The flat area FA can or can not have flexibility.

[0192] In an embodiment, a case where the bending area BA is disposed in the non-display area DD_NDA is illustrated, but the exemplary embodiment is not limited thereto. In some embodiments, the bending area BA can be disposed in the display area DD_DA. The flat area FA can include a first flat area FA1 and a second flat area FA2 that are spaced apart from each other with the bending area BA interposed therebetween. The first flat area FA1 can be disposed in at least a portion of the non-display area DD_NDA and the display area DD_DA. The bending area BA can be continuous with the first flat area FA1 and can be disposed in the non-display area DD_NDA. The second flat area FA2 can be continuous with the bending area BA and can be disposed in the non-display area DD_NDA. The bending area BA and the second flat area FA2 can be disposed in a protruding area of the non-display area DD_NDA.

[0193] The display device DD can be disposed to be folded such that one surface of the first flat area FA1 and one surface of the second flat area FA2 are positioned substantially parallel to each other and face each other, but the exemplary embodiment is not limited thereto. In some embodiments, the display device DD can be folded such that the surface of the first flat area FA1 and the surface of the second flat area FA2 form an angle (e.g., an acute angle, a right angle, or an obtuse angle) with the bending area BA interposed therebetween.

[0194] In an embodiment, the protruding area of the non-display area DD_NDA can be subsequently bent (or folded) along the bending axis BX. The protruding area of the non-display area DD_NDA is bent (or folded), and thus the width of the bezel can be reduced.

[0195] The pixels (see FIG. 1A) can be arranged in a matrix form in the display area DD_DA. Figure 3The PXL shown and the sensor electrodes can be disposed in the display area DD_DA. The driving unit, pad unit PDA, and sensing line SL can be disposed in the non-display area DD_NDA. The pad unit PDA may include at least one display panel pad DP_PD electrically connected to the display panel DP and at least one touch sensor pad TS_PD electrically connected to the touch sensor TS.

[0196] The display device DD may also include a dam section DMP disposed in the display panel DP and located in the non-display area DD_NDA. The dam section DMP may extend along the edge of the display area DD_DA.

[0197] The dam section DMP can be set within the first flat area FA1. The dam section DMP can include a first dam section DMP1 and a second dam section DMP2. The first dam section DMP1 can surround the display area DD_DA. The second dam section DMP2 can be set outside the first dam section DMP1. Figure 14 The image shows the second dam section DMP2, which is divided into two groups spaced apart from each other in the first direction DR1.

[0198] The first dam section DMP1 can have a dual-layer structure. The lower DMP1a can be formed simultaneously with the passivation layer PSV, and the upper DMP1b can be formed simultaneously with the pixel defining layer PDL. The first dam section DMP1 can prevent liquid organic materials from flowing out from the inorganic insulating layer (e.g., the gate insulating layer GI and the interlayer insulating layer ILD) during the process of forming the organic layer included in the thin-film encapsulation layer TFE.

[0199] The second dam section DMP2 can be constructed as an inorganic layer comprising inorganic materials. When an impact is applied from the outside to the edge of the display device DD, the second dam section DMP2 can absorb the impact while being damaged. Therefore, the second dam section DMP2 can prevent external impacts from being transmitted to the display area DD_DA.

[0200] The display panel DP may include a substrate SUB, a pixel circuit layer PCL, a display element layer DPL, and a thin-film encapsulation layer TFE. The display panel DP may have the same characteristics as the reference. Figures 3-4B The described display panel DP has the same construction.

[0201] like Figure 15 and Figure 16 As shown, the driving unit included in the pixel circuit layer PCL (e.g., Figure 3 The scan driver (SDV), transmit driver (EDV), and data driver (DDV) shown can be located in the non-display area DD_NDA. The driving unit can include components that function as transistor pixels (see...). Figure 3The sixth transistor T6 and at least one driver transistor SDV_T formed by the same process as the source electrode SE and the drain electrode DE of the sixth transistor T6. Each of the sixth transistor T6 and the driver transistor SDV_T can include a semiconductor layer SCL, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0202] Further, the drive unit can include a signal line SDV_SL disposed on the same layer as the source electrode SE and the drain electrode DE of the sixth transistor T6.

[0203] A power electrode PWE that provides a second pixel power supply (see Figure 4A The power electrode PWE that provides the second pixel power supply ELVSS illustrated in the ELVSS can be disposed at the outside of the drive unit (e.g., the scan driver SDV). The power electrode PWE can receive the second pixel power supply ELVSS from the outside. A connection electrode E_CNT can be disposed on the passivation layer PSV. The connection electrode E_CNT can connect the power electrode PWE to a second electrode CE that constitutes the light emitting element OLED. Since the connection electrode E_CNT is formed by the same process as the first electrode AE that constitutes the light emitting element OLED, the connection electrode E_CNT can include the same layer structure and the same material as those of the first electrode AE. The connection electrode E_CNT can have the same thickness as that of the first electrode AE.

[0204] The thin film encapsulation layer TFE can include a first encapsulation layer ENC1 positioned throughout the display area DD_DA and the non-display area DD_NDA, a second encapsulation layer ENC2 positioned on the first encapsulation layer ENC1 and positioned throughout at least a portion of the non-display area DD_NDA and the display area DD_DA, and a third encapsulation layer ENC3 positioned on the second encapsulation layer ENC2 and positioned throughout at least a portion of the non-display area DD_NDA and the display area DD_DA. In some embodiments, the third encapsulation layer ENC3 can be positioned throughout the entire display area DD_DA and the non-display area DD_NDA.

[0205] The first encapsulation layer ENC1 and the third encapsulation layer ENC3 can be configured as inorganic layers including an inorganic material, and the second encapsulation layer ENC2 can be configured as an organic layer including an organic material.

[0206] The pixel circuit layer PCL can include a line unit, a bend insulating layer INS_B, and a bridge pattern BRP positioned in the non-display area DD_NDA.

[0207] The line unit can include at least one data line DL and can be a fan-out line that connects the drive unit to the pixel PXL. In an example, the data line DL can extend up to an area in which the pad unit PDA is positioned at a boundary point of the display area DD_DA and the non-display area DD_NDA.

[0208] The data line DL can include a plurality of sub lines. In an example, the data line DL can include a first sub line DLa located in the display area DD_DA, a second sub line DLb located in the first flat area FA1 in the non-display area DD_NDA, a third sub line DLc located in the bending area BA in the non-display area DD_NDA, and a fourth sub line DLd located in the second flat area FA2 in the non-display area DD_NDA. The first to fourth sub lines DLa to DLd can be electrically and / or physically connected to each other. In an example, the first sub line DLa can be connected to the second sub line DLb, the second sub line DLb can be connected to the third sub line DLc, the third sub line DLc can be connected to the fourth sub line DLd, and the fourth sub line DLd can be connected to one display panel pad DP_PD included in the pad unit PDA through the bridge pattern BRP.

[0209] The first sub line DLa can have the same configuration as the configuration of the jth data line Dj described with reference to FIG. 2. Figure 4A The first sub line DLa can be integrally or non-integrally formed with the source electrode SE of the second transistor T2 to be connected to the source electrode SE.

[0210] The bending portion insulating layer INS_B can be disposed in the opening located in the bending area BA. The opening can be formed by a process of removing a portion of the insulating layer located in the bending area BA. For example, when the buffer layer BFL, the gate insulating layer GI, and the interlayer insulating layer ILD are removed in the bending area BA, the opening can be formed. However, the insulating layer removed to form the opening is not limited to the above-described example.

[0211] The bending portion insulating layer INS_B can fill the opening. The bending portion insulating layer INS_B can be an organic insulating layer including an organic material. The organic material can include, for example, an organic insulating material such as a polypropylene-based compound, a polyimide-based compound, a fluorine-based compound such as Teflon, or a benzocyclobutene-based compound. The third sub line DLc can be located on the bending portion insulating layer INS_B.

[0212] The touch sensor TS can include a base substrate layer BSL, a sensor electrode, and a sensing line SL. The touch sensor TS can have the same configuration as the configuration of the touch sensor TS described with reference to FIG. 2. Figures 6-12E The touch sensor TS can have the same configuration as the configuration of the touch sensor TS described with reference to FIG. 2.

[0213] The sensor electrode can include a plurality of first bridge patterns BRP1 included in the first conductive pattern CP1 (also shown in FIG. 2) and a second bridge pattern BRP2 included in the second conductive pattern CP2 (also shown in FIG. 2). Figure 5 The second bridge pattern BRP2 can be formed integrally or non-integrally with the second conductive pattern CP2. Figure 5The plurality of sensor patterns SP and the plurality of second bridge patterns BRP2 included in the second conductive pattern CP2 can be formed by the same process. The plurality of sensor patterns SP and the plurality of second bridge patterns BRP2 included in the second conductive pattern CP2 can be formed by different processes.

[0214] The sensing lines SL can include a plurality of first sensing lines SL1 and a plurality of second sensing lines SL2 included in the second conductive pattern CP2.

[0215] In an embodiment, a first insulating pattern INSP1 can be disposed and / or formed on each of the first sensor pattern SP1 and the second sensor pattern SP2, and a second insulating pattern INSP2 can be disposed and / or formed on each of the sensing lines SL. The first insulating pattern INSP1 and the second insulating pattern INSP2 can be configured to be substantially the same as described with reference to Figures 6-11B The first insulating pattern INSP1 and the second insulating pattern INSP2 described can be substantially the same. The first insulating pattern INSP1 and the second insulating pattern INSP2 can include the same material and can be disposed in the same layer. In an example, the first insulating pattern INSP1 and the second insulating pattern INSP2 can be an inorganic insulating layer including an inorganic material or an organic insulating layer including an organic material.

[0216] The first insulating pattern INSP1 can be formed with each of the first sensor pattern SP1, the second sensor pattern SP2, and the second bridge pattern BRP2 disposed thereunder by the same process. The second insulating pattern INSP2 can be formed with each of the sensing lines SL disposed thereunder by the same process. The first insulating pattern INSP1 can be disposed on components disposed thereunder to protect the components from foreign substances, etc. from the outside. In addition, the second insulating pattern INSP2 can be disposed on components disposed thereunder to protect the components from foreign substances, etc. from the outside.

[0217] The pad unit PDA can include at least one display panel pad DP_PD and at least one touch sensor pad TS_PD which can be included in the second conductive pattern CP2. The display panel pad DP_PD and the touch sensor pad TS_PD do not require a separate protection device such as the first insulating pattern INSP1 and the second insulating pattern INSP2 to contact with an external IC. That is, an insulating pattern is not disposed on each of the display panel pad DP_PD and the touch sensor pad TS_PD included in the pad unit PDA.

[0218] While certain example embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to such embodiments, but only to the scope of the appended claims and various obvious modifications and equivalent arrangements as would be apparent to one ordinarily skilled in the art having the benefit of this description.

Claims

1. A touch sensor for a display device, the touch sensor comprising: a base layer; a first conductive layer disposed on the base layer in a sensing area; an insulating layer disposed on the first conductive layer; a second conductive layer disposed on the insulating layer in the sensing area; a first insulating pattern disposed on the second conductive layer; a plurality of signal lines disposed in a non-sensing area, the plurality of signal lines electrically connected to the first conductive layer and the second conductive layer; and a second insulating pattern disposed on the plurality of signal lines, wherein the first insulating pattern and the second insulating pattern comprise a same material and are disposed in a same layer, and wherein the first insulating pattern and the second conductive layer are etched simultaneously to have a same shape in a plane. The first insulating pattern is superposed with the second conductive layer, and the second insulating pattern is superposed with the plurality of signal lines.

2. The touch sensor of claim 1, wherein, The second insulating pattern and the plurality of signal lines have a same shape in a plane.

3. The touch sensor of claim 2, wherein, The first insulating pattern is in contact with at least a portion of the second conductive layer.

4. The touch sensor of claim 2, wherein, The first insulating pattern and the second insulating pattern comprise at least one of an inorganic insulating material and an organic insulating material.

5. The touch sensor of claim 4, wherein, The second conductive layer comprises a second conductive pattern, the second conductive pattern comprising:

6. The touch sensor of claim 5, wherein, a plurality of first sensor patterns disposed on the insulating layer, the plurality of first sensor patterns arranged in a first direction; a plurality of second sensor patterns disposed on the insulating layer, the plurality of second sensor patterns arranged in a second direction intersecting the first direction, the plurality of second sensor patterns spaced apart from the plurality of first sensor patterns; and a plurality of second bridge patterns connecting the plurality of second sensor patterns to each other, wherein the first conductive layer comprises a first conductive pattern, the first conductive pattern comprising a plurality of first bridge patterns disposed between the base layer and the insulating layer in the sensing area, the plurality of first bridge patterns connecting the plurality of first sensor patterns to each other. The first insulating pattern is disposed on each of the plurality of first sensor patterns, the plurality of second sensor patterns, and the plurality of second bridge patterns.

7. The touch sensor of claim 6, wherein, The first insulating pattern is formed in a same process as each of the plurality of first sensor patterns, the plurality of second sensor patterns, and the plurality of second bridge patterns.

8. The touch sensor of claim 7, wherein, The first insulating pattern is in contact with at least a portion of each of the plurality of first sensor patterns, at least a portion of each of the plurality of second sensor patterns, and at least a portion of each of the plurality of second bridge patterns.

9. The touch sensor of claim 8, wherein, The first insulating pattern is in contact with an upper surface of each of the plurality of first sensor patterns, an upper surface of each of the plurality of second sensor patterns, and an upper surface of each of the plurality of second bridge patterns.

10. The touch sensor of claim 9, wherein, The second insulating pattern is in contact with at least a portion of each of the plurality of signal lines.

11. The touch sensor of claim 5, wherein, The plurality of signal lines comprises sensing lines, and at least some of the sensing lines comprise:

12. The touch sensor of claim 11, wherein, a first metal layer disposed between the base layer and the insulating layer; and a second metal layer disposed on the insulating layer. a second metal layer disposed between the insulating layer and the second insulating pattern, the second metal layer being stacked with the first metal layer, wherein the second insulating pattern and the second metal layer are disposed by the same process.

13. A method of manufacturing a touch sensor for a display device, the method comprising the steps of: disposing a base layer for a sensing region and a non-sensing region surrounding at least one side of the sensing region; forming a first conductive layer in the sensing region and at least one first metal layer in the non-sensing region on the base layer; forming an insulating layer on the first conductive layer and the first metal layer, the insulating layer including a contact hole exposing at least a portion of the first conductive layer; sequentially forming a metal material layer and an insulating material layer on the insulating layer; and forming a second conductive layer and a first insulating pattern disposed thereon and a second metal layer and a second insulating pattern disposed thereon by etching the metal material layer and the insulating material layer at the same time, wherein the second conductive layer and the first insulating pattern correspond to the sensing region on the insulating layer, and the second metal layer and the second insulating pattern correspond to the non-sensing region on the insulating layer, and wherein the first insulating pattern and the second insulating pattern include at least one of an inorganic insulating material and an organic insulating material. The second conductive layer includes:

14. The method of claim 13, wherein, a plurality of first sensor patterns disposed on the insulating layer, the plurality of first sensor patterns being arranged in a first direction; a plurality of second sensor patterns disposed on the insulating layer, the plurality of second sensor patterns being arranged in a second direction intersecting the first direction, the plurality of second sensor patterns being spaced apart from the plurality of first sensor patterns; and a plurality of second bridge patterns connecting the plurality of second sensor patterns to each other, wherein the first conductive layer includes a plurality of first bridge patterns disposed between the base layer and the insulating layer in the sensing region, the plurality of first bridge patterns connecting the plurality of first sensor patterns to each other. The first insulating pattern is disposed on each of the plurality of first sensor patterns, the plurality of second sensor patterns, and the plurality of second bridge patterns.

15. The method of claim 14, wherein, The first insulating pattern is in contact with an upper surface of each of the plurality of first sensor patterns, an upper surface of each of the plurality of second sensor patterns, and an upper surface of each of the plurality of second bridge patterns.

16. The method of claim 15, wherein, a display panel for displaying an image; and 17. A display device comprising: a touch sensor disposed on the display panel, wherein the touch sensor includes: a base layer disposed on the display panel; a first conductive layer disposed in a sensing region on the base layer; an insulating layer disposed on the first conductive layer; a second conductive layer disposed on the insulating layer in the sensing region; a first insulating pattern disposed on the second conductive layer; a plurality of signal lines disposed in a non-sensing region on the base layer, the plurality of signal lines being electrically connected to the first conductive layer and the second conductive layer; and ​ a second insulating pattern disposed on the plurality of signal lines, wherein the first insulating pattern and the second insulating pattern comprise the same material and are disposed in the same layer, and wherein the first insulating pattern and the second conductive layer are etched simultaneously to have the same shape in a plane.

18. The display device of claim 17, wherein, The first insulating pattern and the second insulating pattern comprise at least one of an inorganic insulating material and an organic insulating material.

19. The display device of claim 18, wherein, The first insulating pattern is stacked with the second conductive layer, and the second insulating pattern is stacked with the plurality of signal lines, wherein the second insulating pattern and the plurality of signal lines have the same shape in a plane.

20. The display device of claim 19, wherein, The second conductive layer comprises a second conductive pattern, the second conductive pattern comprising: a plurality of first sensor patterns disposed on the insulating layer, the plurality of first sensor patterns being arranged in a first direction; a plurality of second sensor patterns disposed on the insulating layer, the plurality of second sensor patterns being arranged in a second direction intersecting the first direction, the plurality of second sensor patterns being spaced apart from the plurality of first sensor patterns; and a plurality of second bridge patterns connecting the plurality of second sensor patterns to each other, wherein the first conductive layer comprises a first conductive pattern, the first conductive pattern comprising a plurality of first bridge patterns disposed between the base layer and the insulating layer in the sensing region, the plurality of first bridge patterns connecting the plurality of first sensor patterns to each other.

Images