Apparatus and method related to embedded filters

Abstract

Apparatuses and methods related to embedded filters. In some embodiments, a radio-frequency apparatus can include a substrate and first and second filter apparatuses mounted on the substrate with respective support structures such that at least a portion of the second filter apparatus is positioned in a space defined by an underside of the first filter apparatus and the support structure of the first filter apparatus. Such a radio-frequency apparatus can be, for example, a package module for use in an electronic device such as a wireless device.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Provisional Application No. 62 / 726,127, filed August 31, 2018, entitled “DEVICES AND METHODS RELATED TONESTED FILTERS”, the disclosure of which is incorporated herein by reference in its entirety and expressly combined. Technical Field

[0003] This application relates to apparatus and methods for nested filters used in radio frequency applications. Background Technology

[0004] In radio frequency (RF) applications, filters are used to condition signals, such as signals to be transmitted and / or received. Such filters may include, for example, low-pass filters, high-pass filters, and / or band-pass filters. Summary of the Invention

[0005] In some embodiments, this application relates to a radio frequency device, including: a substrate and a first filter device and a second filter device mounted on the substrate, having corresponding support structures such that at least a portion of the second filter device is positioned in a space defined by the lower side of the first filter device and the support structure of the first filter device.

[0006] In some embodiments, the substrate may include multiple layers having a first layer on the upper side of the substrate and a second layer below the first layer. In some embodiments, each of the first filter device and the second filter device may be mounted on the first layer. In some embodiments, the substrate may include a cavity defined by at least the first layer and including a floor, such that the second filter device is mounted on the floor of the cavity. The cavity may have a depth substantially the same as the thickness of the first layer, such that the upper surface of the second layer is on or near the floor of the cavity. The first filter device may be mounted on the upper surface of the first layer.

[0007] In some embodiments, each of the support structures for the first filter device can be adjusted in size to provide sufficient height in the space to accommodate the second filter device. Each of the support structures for the first filter device may include a metal structure and a solder structure, wherein the metal structure has a melting point higher than that of the solder structure to prevent the first filter device from collapsing onto the second filter device in the event of failure of the solder structure. In some embodiments, the metal structure may include a copper core or copper pillar.

[0008] In some embodiments, the first filter device may include a transmit filter, and the second filter device may include a receive filter. The transmit filter may be configured to support multiple corresponding frequency bands, and the receive filter may be configured to support multiple corresponding frequency bands. The frequency band associated with the transmit filter may be the same as the frequency band associated with the receive filter. In some embodiments, the first filter device does not include any receive filter, and the second filter device does not include any transmit filter.

[0009] In some embodiments, the radio frequency device may further include a molded structure implemented over the substrate to substantially encapsulate the first filter device and the second filter device.

[0010] According to several embodiments, this application relates to a method for manufacturing a radio frequency (RF) device. The method includes providing or forming a substrate, and positioning an embedding device on the substrate such that a support structure associated with the embedding device is between the embedding device and a corresponding mounting surface of the substrate. The method further includes positioning a nesting device on the substrate such that a support structure associated with the nesting device is between the nesting device and a corresponding mounting surface of the substrate, such that at least a portion of the embedding device is positioned within a space defined by a lower side of the nesting device and the support structure associated with the nesting device.

[0011] In some embodiments, the method may further include providing solder material to contact pads associated with the support structure of the embedding device and the nesting device prior to the positioning of the embedding device and the nesting device. The method may also include performing a reflow operation to melt the solder material, thereby forming reflow solder for the respective support structure. The reflow operation may be performed after the positioning of the embedding device and the nesting device.

[0012] In some embodiments, the embedded device may be a receiving filter, and the nested device may be a transmitting filter.

[0013] In some embodiments, providing or forming the substrate may include providing or forming a substrate having multiple layers, including a first layer on the upper side of the substrate and a second layer below the first layer. The positioning of the embedding device may be performed prior to the positioning of the nesting device.

[0014] In some embodiments, the nesting device may be positioned on the first layer. In some embodiments, the embedding device may be positioned on the first layer. In some embodiments, the method may further include providing or forming a cavity defined by at least the first layer and including a base plate, such that the embedding device is mounted on the base plate of the cavity.

[0015] In some embodiments, the method may further include forming a molded structure over the substrate to substantially encapsulate the embedded and nested devices.

[0016] In several embodiments, this application relates to a packaging module comprising: a packaging substrate configured to accommodate a plurality of components; and a filter assembly implemented relative to the packaging substrate. The filter assembly includes a first filter device and a second filter device arranged in an embedded manner, such that at least a portion of the second filter device is positioned in a space defined by a lower side of the first filter device.

[0017] In some embodiments, the first filter device and the second filter device may be mounted on the packaging substrate. In some embodiments, the first and second filter devices may be mounted on another substrate, which is then mounted on the packaging substrate.

[0018] In some teachings, this application relates to a wireless device comprising: a transceiver; an antenna communicating with the transceiver and configured to support either or both of transmit and receive operations; and a radio frequency (RF) module implemented between the transceiver and the antenna. The RF module includes a substrate and a first filter device and a second filter device mounted on the substrate with corresponding support structures, such that at least a portion of the second filter device is positioned within a space defined by a lower side of the first filter device and the support structure of the first filter device.

[0019] For the purpose of summarizing this disclosure, certain aspects, advantages, and novel features of the invention have been described herein. It should be understood that not all such advantages may be achieved according to any particular embodiment of the invention. Therefore, the invention may be embodied or practiced in a manner that realizes or optimizes one or more advantages as taught herein, without necessarily realizing other advantages as taught or suggested herein. Attached Figure Description

[0020] Figure 1 A packaged radio-frequency (RF) device with a substrate and embedded filters is shown.

[0021] Figure 2A packaged RF device is shown, comprising a substrate and a filter in an unfolded configuration mounted on the substrate.

[0022] Figure 3 A packaged RF device is shown, comprising a substrate and a filter in an embedded configuration mounted on the substrate.

[0023] Figure 4 In some embodiments, the packaging device may include a substrate having a first side for supporting components for an embedded device, and a second side configured to allow the packaging device to be mounted to a circuit board.

[0024] Figure 5 As shown in some embodiments, the packaging device may include a substrate having a first side and a second side, the first side having a cavity for supporting components of the embedded device, and the second side configured to allow the packaging device to be mounted to a circuit board.

[0025] Figure 6 It shows Figure 4 A more specific example of the packaging device, wherein the support structure can be implemented as solder balls with corresponding copper cores.

[0026] Figure 7 It shows Figure 4 Another more specific example of the encapsulation device is that the support structure can be implemented as a copper pillar.

[0027] Figure 8 It shows Figure 5 A more specific example of the packaging device, wherein the support structure can be implemented as solder balls with corresponding copper cores.

[0028] Figure 9 It shows Figure 5 Another more specific example of the encapsulation device is that the support structure can be implemented as a copper pillar.

[0029] Figure 10 In some embodiments, a packaged device having one or more features as described herein can be implemented as an RF filter device.

[0030] Figure 11A-11F It shows that it can be realized to manufacture Figure 10 The example encapsulates the various stages of the example process for an RF filter device.

[0031] Figure 12 An RF filter device is shown, which can be Figure 11F A more specific example of a packaged RF filter device.

[0032] Figure 13A An example connection pin assignment for a contact pad array is shown. Figure 12The bottom view of the receiving filter device.

[0033] Figure 13B An example connection pin assignment for a copper core array is shown. Figure 12 Bottom view of the emission filter device.

[0034] Figure 13C A bottom view shows the embedded arrangement of the receiving filter device and the transmitting filter device.

[0035] Figure 13D It shows that it can be used Figure 11A-11F An example layout design of a laser blocking layer implemented on a substrate of an RF filter device.

[0036] Figure 13E It shows that it can be used Figure 11A-11F An example layout design of a grounding ring implemented on a layer of the substrate of an RF filter device.

[0037] Figure 14 As shown in some embodiments, an RF filter device having one or more features as described herein may include multiple embedded components.

[0038] Figure 15 In some embodiments, components for embedding devices can be implemented on a substrate to obtain an RF device such as an RF filter device.

[0039] Figure 16 As shown in some embodiments, the components of the embedded device may be implemented on a substrate together with one or more filter and / or non-filter devices.

[0040] Figure 17 In some embodiments, an RF device having one or more features as described herein can be mounted on another substrate to obtain a packaged module.

[0041] Figure 18 An example wireless device having one or more of the advantageous features described herein is depicted. Detailed Implementation

[0042] The headings provided herein (if any) are for convenience only and do not necessarily affect the scope or meaning of the claimed invention.

[0043] Figure 1A packaged radio-frequency (RF) device 100 is depicted, having a substrate 102 and an embedded filter component 104. Various examples related to the packaged device 100 are described in more detail herein. While some of these examples are described in the context of embedded filters, it should be understood that one or more features associated with the nested configuration can be implemented with other electronics such as RF devices.

[0044] Figure 2 An RF device 10 is shown, which has a substrate 12 and a component 14 of filters (15, 16) mounted on the substrate 12. Figure 2 In the example, the two filters (15, 16) of component 14 are shown arranged in an unfolded configuration on substrate 12 to occupy a relatively large footprint.

[0045] Figure 3 An RF device 100 is shown, comprising a substrate 102 and an assembly 104 of filters (110, 112) mounted on the substrate 102. Figure 3 In the example, the two filters (110, 112) of component 104 are shown to be arranged in an embedded configuration on substrate 102 to occupy a reduced area.

[0046] If we assume Figure 2 The sizes of the two filters in the example are... Figure 3 Similar to the corresponding filter, we can see that when compared with... Figure 2 Compared to the lateral area of ​​the packaging device 10, the significantly reduced footprint of the filter assembly 104 allows for the packaging of the RF device 100 ( Figure 3 It also has a significantly reduced lateral area.

[0047] Through specific examples in RF applications, it should be noted that power amplifiers with integrated duplexer modules (PAiDs) continue to see functional increases. Support for new frequency bands has been added, while the overall module size is expected to decrease significantly. Furthermore, the cost of such modules is expected to decrease. It should also be noted that in a typical current low-band PAiD module, up to approximately 70% of the usable area on the top surface of the substrate is occupied by the duplexer. Therefore, a significant reduction in the duplexer's footprint is crucial for achieving a reduction in module size.

[0048] In some embodiments, the reduction in duplexer footprint can be achieved by having tighter spacing and feature size design rules within the filter itself, reduced spacing between duplexers mounted on the module substrate, stacking duplexers in face-to-face or back-to-back configurations, and / or embedding duplexers within the module substrate. Each of these embodiments involves a combination of trade-offs regarding cost, size, thickness, cycle time, and manufacturing infrastructure.

[0049] In some embodiments, a packaged device having one or more features as described herein may include an embedded filter component to provide a significant reduction in surface mount area. In the case of the aforementioned PAiD application, the estimated surface mount area reduction is approximately 30%. More specific details of such PAiD applications are described in more detail herein.

[0050] Figure 4 and Figure 5 An example of a nested configuration that can be implemented for a packaged device is shown. Such a packaged device can be a packaged RF device (e.g., a PAiD module or a module for other RF applications), or a packaged device for non-RF applications.

[0051] Figure 4 As shown in some embodiments, the packaging device 100 may include a substrate 102 having a first side for supporting components 104 of the embedded devices 110, 112 and a second side configured to allow the packaging device 100 to be mounted to a circuit board. Figure 4 In the example, the first device 110 is shown to be mounted and supported on a first side of the substrate 102 by a plurality of support structures 120, thereby positioning it above the second device 112, which is also mounted and supported on the first side of the substrate 102 by a plurality of support structures 122. Therefore, the second device 112 is embedded within the space defined by the lower side of the first device 110, the support structures 120, and the first side of the substrate 102.

[0052] exist Figure 4 In the example, the lower side of the first device 110 is depicted as being separated from the upper side of the second device 112 by a gap. It should be understood that such a gap may or may not be present, such that the lower side of the first device 110 may or may not contact the upper side of the second device 112.

[0053] Figure 5 As shown in some embodiments, the packaging device 100 may include a substrate 102 having a first side for supporting components 104 of the embedded devices 110, 112 and a second side configured to allow the packaging device 100 to be mounted to a circuit board. Figure 5In the example, the first device 110 is shown to be mounted and supported on a first side of the substrate 102 by a plurality of support structures 120, thereby positioning on the second device 112, which is also mounted and supported on the first side of the substrate 102 by a plurality of support structures 122.

[0054] exist Figure 5 In the example, the first side of the substrate 102 is shown as defining a cavity 130, which is sized to allow the second device 112 to be mounted at a level within the cavity 130 that is lower than the portion of the first side of the substrate 102 outside the cavity 130. Therefore, the second device 112 is embedded within the space defined by the lower side of the first device 110, the support structure 120, and the cavity 130 on the first side of the substrate 102.

[0055] In some embodiments, the aforementioned cavity structure 130 can provide flexibility in how the components 104 of the embedded devices 110, 112 are configured and / or arranged. For example, if Figure 5 The dimensions of the first and second devices 110 and 112 are similar to Figure 4 The first and second devices 110 and 112, then Figure 5 The total height of component 104 in the middle can be less than Figure 4 The total height of component 104 in the middle, where Figure 5 The supporting structure 120 in the example is relatively short. In another example, if... Figure 5 The first and second devices 110, 112 and their corresponding support structures (120, 122) and Figure 4 The first and second devices 110, 112 and their corresponding support structures (120, 122) are similarly sized, then in Figure 5 In the example, the second device 112 can be separated by a larger gap.

[0056] Figure 6 and Figure 7 It shows Figure 4 A more specific example of the support structures 120 and 122 of the packaging device 100, wherein the first side of the substrate 102 is generally flat. Figure 8 and 9 It shows Figure 5 A more specific example of the support structures 120 and 122 of the packaging device 100, wherein the first side of the substrate 102 includes a cavity 130.

[0057] exist Figure 6-9 In each of the examples, substrate 102 is shown to include four layers. Such layers may be, for example, laminates, ceramic layers, etc. It should be understood that a substrate of a packaging device having one or more features as described herein may have more or fewer layers.

[0058] For the purpose of description Figure 6-9 For this purpose, the first device 110 can be called a nested device, and the second device 112 can be called an embedded device. For example... Figure 6-9 As seen in each of the examples, the embedded device 112 is mounted relatively close to its mounting surface, and the nested device 110 is mounted away from its mounting surface because space is needed to accommodate the embedded device 112.

[0059] Figure 6-9 In some embodiments, the embedding device 112 can be mounted to its respective mounting surface via a plurality of support structures 122. Each of such support structures may include, for example, a solder structure 152 formed between a contact pad 156 on the mounting surface of the substrate 102 and a contact pad 150 on the underside of the embedding device 112. Examples of how such solder structures (152) are formed will be described in more detail herein.

[0060] It should be noted that, Figure 6 and Figure 7 In each of the examples, contact pads 156 for solder structure 152 are formed on the generally flat upper surface of the first layer (L1) of substrate 102. Therefore, Figure 6 and 7 Each of the corresponding embedding devices 112 is mounted on the generally flat upper surface of the substrate 102.

[0061] exist Figure 8 and Figure 9 In each of the examples, contact pads 156 for solder structure 152 are formed on a recessed surface at the bottom of cavity 130 of substrate 102. In some embodiments, such cavity may have a depth similar to the thickness of a first layer (L1) of substrate 102. In this configuration, contact pads 156 may be implemented on a second layer (L2), and the resulting surface of layer L2 may serve as the bottom plate of cavity 130. Therefore, Figure 8 and 9 Each of the corresponding embedding devices 112 is mounted on the recessed bottom plate of the cavity 130 of the substrate 102.

[0062] Figure 6 and 8 As shown in some embodiments, the nesting device 110 can be mounted to its respective mounting surface via a plurality of support structures 120. Each such support structure may include, for example, a solder ball having a copper core 144. When solder portions 142 are formed around the copper core 144, the copper core can be adjusted to provide a desired height and enhanced support between the underside of the nesting device 110 and the corresponding mounting surface on the substrate 102. Examples of how such solder ball structures are formed are described in more detail herein.

[0063] It should be noted that, Figure 6 and Figure 8 In each of the examples, contact pads 146 for the solder balls supporting structure 120 are implemented on the upper surface of the first layer (L1) of substrate 102. Similarly, contact pads 140 for the solder balls supporting structure 120 are implemented on the lower surface of nesting device 110.

[0064] exist Figure 6 and Figure 8 In the example, the copper core 144 can provide enhanced support for the conductivity of the nested device 110, so that the nested device 110 has sufficient height above the embedded device 112. Therefore, even if the solder portion 142 of the support structure 120 fails or melts, the presence of the copper core 144 can prevent the nested device 110 from collapsing onto the embedded device 112.

[0065] Figure 7 and 9 Other forms of reinforcing support can be provided for the nested device. For example, copper pillars 162 can be implemented on corresponding contact pads 140 on the underside of the nested device 110. Such copper pillars can be formed, for example, by an electroplating process.

[0066] exist Figure 7 and Figure 9 In the example, the copper pillar 162 is shown mounted to the corresponding contact pad 146 of the substrate 102 via a corresponding solder structure 164. In this mounting configuration, the copper pillar 162 can be formed on the underside of the nesting device 110 before the nesting device 110 is mounted onto the substrate 102. However, it should be understood that other mounting sequences can be implemented. For example, the copper pillar can be formed on the substrate, and the pillarless nesting device can be mounted onto such an in-place pillar. In another example, a pre-formed copper pillar can be dropped onto the substrate, and the pillarless nesting device can be mounted onto such an in-place pillar.

[0067] Figure 10 In some embodiments, a packaging device 100 having one or more features as described herein can be implemented as an RF filter device 200. Figure 10 In the examples, the packaged RF filter device 100 / 200 is depicted as having a similar Figure 8 The example shows a nested configuration. However, it should be understood that a packaged RF filter device with one or more features as described herein can be implemented using other nested configurations.

[0068] It should be noted that, for a given frequency band, the transmit (Tx) filter typically occupies a larger area than the receive (Rx) filter. Therefore, in some embodiments, the filter embedding component 104 may include a Tx filter device 110 implemented as a nested device and an Rx filter device 112 implemented as an embedded device.

[0069] For illustrative purposes, Tx and Rx filter devices 110, 112 can be configured to support corresponding frequency ranges in one or more operating frequency bands. For example, Tx filter device 110 can be configured to support the transmitting portion of frequency band A, and Rx filter device 112 can be configured to support the receiving portion of frequency band A. In another example, Tx filter device 110 can be configured to support the transmitting portion of frequency band A and the transmitting portion of frequency band B, and Rx filter device 112 can be configured to support the receiving portion of frequency band A and the receiving portion of frequency band B. In yet another example, Tx filter device 110 can be configured to support the transmitting portion of each of more than two frequency bands, and Rx filter device 112 can be configured to support the receiving portion of each of more than two frequency bands.

[0070] Although various examples are described herein in the context of nested and embedded filters supporting corresponding portions of the same operating frequency band, it should be understood that one or more features of this disclosure can be implemented in configurations where nested and embedded (e.g., Tx and Rx) filter devices support corresponding portions of different frequency bands. For example, a Tx filter device may be configured to support the transmit portion of frequency band A, and an Rx filter device may be configured to support the receive portion of frequency band B. In such an example, the Tx filter device may or may not support the transmit portion of frequency band B, and the Rx filter device may or may not support the receive portion of frequency band A.

[0071] Figure 11A-11F It shows that it can be achieved to manufacture Figure 10 The example process for the example packaged RF filter device 200 is described below. It should be understood that suitable processes can also be implemented to manufacture other example packaged devices disclosed herein.

[0072] Figure 11A A side sectional view of substrate 102 is shown. Substrate 102 is configured to accommodate an Rx filter device in a mounting region within cavity 130 and a Tx filter device in a mounting region on the upper surface of substrate 102, thereby allowing the Tx and Rx filter devices to be arranged in an embedded configuration. Figure 11A In the example, substrate 102 has four layers; however, it should be understood that other numbers of layers may also be used.

[0073] refer to Figure 11AThe base plate of cavity 130 is shown to include example contact pads 156a and 156b. Contact pad 156a is depicted as electrically connected to contact pad 210 on the underside of substrate 102 via a conductive via, a conductive path 208, and another conductive via. Contact pad 156b is depicted as electrically connected to a conductive plane 212 within substrate 102 via a conductive via 206.

[0074] For illustrative purposes, the contact pads 210 on the underside of substrate 102 can be used to route RF signals to and / or from the antenna to RF signals, and the conductive plane 212 can be used as a ground plane. It should be understood that the ground plane 212 can be electrically connected to the ground contact pads on the underside of substrate 102 via one or more vias. It should also be understood that one or more other contact pads can be implemented on the base plate of cavity 130 to support the routing of signals, for example, received via contact pad 156a and filtered by the Rx filter device.

[0075] refer to Figure 11A The upper surface of substrate 102 is shown to include example contact pads 146a and 146b. Contact pad 146a is depicted as being electrically connected to contact pad 210 on the lower side of substrate 102 via conductive via 207 and lower conductive via.

[0076] In an exemplary case where contact pads 210 are located on the underside of substrate 102 for routing RF signals to and / or from an antenna, contact pad 146b can be used as an input contact pad for routing transmit signals to a Tx filter device. Therefore, contact pad 146b can be, for example, a transmit signal contact pad electrically connectable to a power amplifier. It should also be understood that in some embodiments, one or more additional contact pads may be implemented on the upper surface of substrate 102 to, for example, provide a ground connection for the Tx filter device.

[0077] exist Figure 11A In the example, substrate 102 is depicted as having a mask layer 202 on its upper surface. This mask layer 202 allows contact pads 146a, 146b to be exposed for mounting of the Tx filter device and allows the formation of cavity 130.

[0078] exist Figure 11A In some examples, cavity 130 may be pre-formed during the fabrication of substrate 102, or formed from a cavity-free substrate, or any combination thereof. In some embodiments, such cavity may be formed by, for example, laser ablation. In such cavity formation, substrate 102 may include a laser blocking layer 214 configured to control the lateral dimensions of the cavity formed by the laser.

[0079] exist Figure 11AIn the example, substrate 102 is also shown to include a grounding ring 204. This grounding ring may be formed around the base plate region of cavity 130 and provides isolation between the Tx filter device and the Rx filter device.

[0080] Figure 11B The illustration shows a manufacturing stage in which solder material is introduced onto contact pads for mounting Rx and Tx filter devices. More specifically, solder 222a and 222b are shown being introduced onto corresponding contact pads 156a and 156b on the bottom plate of the cavity. Similarly, solder 220a and 220b are shown being introduced onto corresponding contact pads 146a and 146b on the upper surface of the substrate 102. In some embodiments, the aforementioned solder can be introduced onto their respective contact pads, for example, by printing, ball dropping, etc.

[0081] Figure 11C The illustration shows a manufacturing stage during which the Rx filter device 112 is positioned such that the contact pads 150a, 150b of the Rx filter device 112 are bonded to solder 222a, 222b. In some embodiments, at least the contact pads 150a, 150b of the Rx filter device 112 may be applied with flux (e.g., immersed in flux) before being positioned on the solder 222a, 222b.

[0082] Figure 11D The illustration shows a manufacturing stage in which the Tx filter device 110 is positioned such that the copper cores 144a, 144b already attached to the underside of the Tx filter device 110 are bonded to the solders 220a, 220b. In some embodiments, at least the copper cores 144a, 144b on the underside of the Tx filter device 110 may be coated with flux (e.g., immersed in flux) before being positioned onto the solders 220, 220b.

[0083] exist Figure 11D In the example, it is assumed that copper cores 144a and 144b have been attached to the underside of the Tx filter device 110. This attachment of copper cores 144a and 144b can be achieved, for example, by introducing solder into contact pads 140a and 140b, drop-feeding copper cores 144a and 144b onto the corresponding contact pads, and reflowing the solder to obtain solder structures 230a and 230b. It should be understood that copper cores 144a and 144b can also be initially mounted onto contact pads 146a and 146b (of the substrate 102), and the Tx filter device 110 without copper cores (but with solder on contact pads 140a and 140b) can be positioned above the copper cores.

[0084] In some embodiments, heating such as Figure 11DThe components shown allow for the reflow of solder (222a, 222b, 220a, 220b, 230a, 230b). Figure 11E The manufacturing stage is shown, in which this reflow of solder yields the support structures 122a, 122b of the Rx filter device 112 and the support structures 120a, 120b of the Tx filter device 110.

[0085] Figure 11F The diagram illustrates a manufacturing stage in which a mold cap 230 can be formed over substrate 102 to substantially encapsulate the embedded components of Tx filter device 110 and Rx filter device 112, thereby producing packaged RF filter device 200. In some embodiments, such a mold cap can be formed by a molding process (e.g., injection molding, compression molding, etc.).

[0086] exist Figure 11A-11F The example process depicts the various stages of manufacturing a packaging device. It should be understood that in some embodiments, some or all of the manufacturing processes may be performed on an array of joined individual cells. For example, Figure 11A The individual substrate 102 can be part of a substrate sheet having an array of such individual substrate units. Figure 11B-11F The remaining related stages are also implemented in this array configuration. Figure 11F The packaged RF filter device 200 can be one of an array of similar units combined together. In this manufacturing process, additional steps can be implemented to divide the array into multiple individual packaged RF filter devices.

[0087] It should be noted that since Tx filters are typically larger than their corresponding Rx filters (e.g., if arranged in the same plane in an unfolded configuration, Tx filters can occupy approximately 70% of the total area), nesting of Tx and Rx filter devices as described herein (with appropriate interconnection structures for the Tx and Rx filter devices) can be achieved without increasing the lateral dimensions of the Tx filter devices. Similarly, a reduction in the lateral dimensions of the Rx filter devices is not required for this embedded configuration. Therefore, no increase in the cost associated with the filter devices is necessary.

[0088] As described herein, and as needed or desired, cavity structures can be used to mount embedded devices (e.g., Rx filter devices) onto, for example, a second (L2) or third (L3) layer of a substrate. This mounting configuration can provide additional clearance in the vertical direction (when the substrate is assumed to be in a horizontal plane), thereby providing greater flexibility in nested configurations of embedded and nested devices.

[0089] Figure 12 An RF filter device 200 is shown, which is Figure 11FA more specific example of the packaged RF filter device 200. Figure 12 In the example, the Tx filter device (nested device) can be configured to support two Tx bands, and the Rx filter device (embedded device) can be configured to support two corresponding Rx bands. Together with Figure 12 Example, Figures 13A-13E The examples of various configurations in the document assume that the two Tx bands are B28A(Tx) and B28B(Tx) cellular bands, and the two Rx bands are B28A(Rx) and B28B(Rx) cellular bands. It should be understood that other combinations of bands can also be supported by packaged RF filter devices having one or more of the features described herein.

[0090] exist Figure 12 In the example, thickness estimates are provided for the various portions of the packaged RF filter device 200. It should be understood that some or all of these thicknesses may vary as needed or desired.

[0091] refer to Figure 12 And assuming the substrate 102 has a thickness of approximately 207 μm, the total thickness of the packaged RF filter device 200 is approximately 637 μm, excluding the ball grid array (BGA) (not shown) beneath the substrate 102. If we assume that this BGA provides an additional thickness of 180 μm, the total height of the packaged RF filter device 200 (with the BGA) is approximately 817 μm.

[0092] exist Figure 12 In the example, the left support structure associated with the Rx filter device 112 ( Figure 11E 122a) and the left support structure associated with the Tx filter device 110 (in the middle) Figure 11E 120a) is described as providing an electrical connection to an antenna (ANT). Figure 12 In the same example, the right support structure associated with the Rx filter device 112 ( Figure 11E 122b) is depicted as electrically connected to ground (GND). This connection pin assignment can be appropriately designed to support two example frequency bands.

[0093] For example, Figure 13A It shows Figure 12 The Rx filter device 112 has a bottom view of an example connection pin assignment for the array of contact pads 150. Antenna contact pads for the B28A and B28B bands are shown, as well as signal output pads (Rxout) for the same band. Some or all of the other contact pads can be used as ground connections.

[0094] In another example, Figure 13B It shows Figure 12 The Tx filter device 110 has a bottom view of an example connection pin assignment for the copper core array 144. Antenna contact pads for the B28A and B28B bands are shown, as well as signal input pads (Txin) for the same band. Some or all of the other contact pads can be used as ground connections.

[0095] exist Figure 13A and 13B In the examples, various lateral dimensions are shown as the lower side for Rx and Tx filter devices. It should be understood that these dimensions can be appropriately adjusted to, for example, adapt to filter device design, and / or to footprint requirements when such devices are mounted on a circuit board.

[0096] Figure 13C A bottom view shows the embedded arrangement of the Rx filter device (embedded) and the Tx filter device (nested). Figures 13A-13C Various example horizontal dimensions are shown in the diagram; however, it should be understood that these dimensions can be adjusted appropriately.

[0097] Figure 13D and 13E This illustrates a laser blocking layer that can be implemented on the second layer (L2). Figure 11A 214 in the middle) and grounding ring ( Figure 11A Example layout design of ground ring 204 (204). As shown in the figure, the outer size of laser blocking layer 214 can be selected to fit the inner size of ground ring 204. Regarding ground ring 204, the ground contact pads ( Figure 11A 156b) can be directly connected to the grounding ring 204 on the second layer (L2) or through another layer. Figure 13D and 13E Various example horizontal dimensions are shown in the diagram; however, it should be understood that these dimensions can be adjusted appropriately.

[0098] In the various examples described herein, the RF filter device 200 is depicted as an embedded component having a Tx filter device and an Rx filter device. Figure 14 As shown in some embodiments, an RF filter device 200 having one or more features as described herein may include a plurality of embedded components (e.g., 250a, 250b). In some embodiments, some or all of such embedded components may be configured such that an Rx frequency band supported by an Rx filter device (112a and / or 112b) corresponds to a Tx frequency band supported by a Tx filter device (110a and / or 110b). In some embodiments, an Rx frequency band supported by an Rx filter device of one embedded component may correspond to a Tx frequency band supported by a Tx filter device of another embedded component.

[0099] exist Figure 14 In the example, the two embedded components 250a, 250b may have corresponding connections such as signal connections and ground connections implemented on and / or within the package substrate 102. Furthermore, the two embedded components 250a, 250b may be encapsulated by an overmolded member 230.

[0100] In some embodiments, an RF filter device 200 having one or more features as described herein may include embedded components of Tx filter devices and Rx filter devices, as well as one or more filter devices not arranged in an embedded configuration.

[0101] Figure 15-18 Various examples of products in which one or more features of this disclosure may be implemented are shown. For example, Figure 15 In some embodiments, component 104 of the embedded devices 110, 112 can be implemented on substrate 102 to obtain an RF device 100 such as an RF filter device 200. In some embodiments, such a device can be configured to be mounted on a circuit board such as a telephone board.

[0102] In another example, Figure 16 As shown in some embodiments, component 104 of the embedded devices 110, 112 can be implemented on substrate 102. On such substrate, one or more filter and / or non-filter devices (e.g., device 3302) can be mounted to obtain a packaged device 300 including filtering functionality. In some embodiments, such devices can be configured to be mounted on a circuit board such as a telephone board.

[0103] In yet another example, Figure 17 In some embodiments shown, it has as described herein (such as...) Figure 15 An RF device 100 having one or more features may be mounted on another substrate 402 to obtain a package module 400.

[0104] exist Figure 15-17 In the various examples, it should be understood that, similar to Figure 11F For example, the molded structure can be implemented above the corresponding substrate. Figure 17 In the example, the RF device 100 may include such a molded structure before being mounted on the substrate 402. Alternatively, when mounted on the substrate 402, the RF device 100 may not have a molded structure, and a common molded structure may be implemented to cover the components 104 of the embedded devices 110, 112 and other parts of the module above the substrate 402.

[0105] For descriptive purposes, it should be understood that, in Figure 15-17 Each device in the examples can be considered a packaged device or module. Therefore, in Figure 17 In the example, the packaging module or device 400 may include another packaging module or device 100.

[0106] exist Figure 15-17 In the examples, the embedded configuration of a device, such as a filter, is depicted as being implemented on a corresponding substrate, such as a packaging substrate; and the resulting packaged device can be configured to be mounted on a circuit board, such as a telephone board. It should be understood that, in some embodiments, the embedded configuration of the device as described herein can be implemented directly on a circuit board (e.g., a telephone board), providing a desired reduction in the footprint of the components of such a device.

[0107] In the various examples described herein, the filters can be implemented in a die-like manner. Such die-like filters can include, for example, surface acoustic wave (SAW) filters. It should be understood that filters as described herein can also be implemented in other ways.

[0108] In some implementations, an architecture, device, and / or circuit having one or more features as described herein can be included in an RF device such as a wireless device. Such an architecture, device, and / or circuit can be implemented directly in the wireless device, in one or more modular forms as described herein, or in some combination thereof. In some embodiments, such a wireless device may include, for example, a cellular phone, a smartphone, a handheld wireless device with or without telephone functionality, a wireless tablet, a wireless router, a wireless modem configured to support machine-type communication, a wireless access point, a wireless base station, etc. Although described in the context of a wireless device, it should be understood that one or more features of this disclosure may also be implemented in other RF systems such as base stations.

[0109] Figure 18 An example wireless device 500 having one or more advantageous features as described herein is depicted. In some embodiments, an RF device 100 having one or more features as described herein may be implemented in or as part of a module such as a front-end module (FEM) 400 of the wireless device 500. It should be understood that an RF module 100 having one or more features as described herein may also be implemented in one or more other modules, directly on the circuit board of the wireless device 500, or any combination thereof.

[0110] exist Figure 18In the example, a power amplifier (PA) is depicted in PA module 512. This power amplifier can receive corresponding RF signals from transceiver 510, which can be configured and operated to generate RF signals to be amplified and transmitted, and to process the received signals. Transceiver 510 is shown interacting with baseband subsystem 508, which is configured to provide conversion between data and / or voice signals suitable for the user and RF signals suitable for transceiver 510. Transceiver 510 is also shown connected to power management component 506, which is configured to manage power for the operation of wireless device 500. This power management can also control the operation of baseband subsystem 508 and other components of wireless device 500.

[0111] The baseband subsystem 508 is shown connected to the user interface 502 to facilitate various inputs and outputs of voice and / or data provided to and received from the user. The baseband subsystem 508 may also be connected to a memory 504, which is configured to store data and / or instructions to facilitate the operation of the wireless device and / or to provide information storage for the user.

[0112] exist Figure 18 In the example, diversity receive (DRx) module 540 can be implemented between one or more diversity antennas (e.g., diversity antenna 530) and front-end module 100. This configuration allows RF signals received through diversity antenna 530 to be processed (in some embodiments, including amplification by an LNA) with little or no loss and / or little or no added noise to the RF signals from diversity antenna 530. This processed signal from DRx module 540 can then be routed to front-end module 100 via one or more signal paths.

[0113] exist Figure 18 In the example, multiple antennas (e.g., 520a, 520b) may be configured to, for example, facilitate the transmission of RF signals from PA module 512. In some embodiments, reception operations may also be implemented using some or all of antennas 520a, 520b.

[0114] Unless the context clearly requires otherwise, throughout the specification and claims, the words “comprising,” “including,” etc., should be interpreted in an inclusive rather than exclusive or exhaustive sense; that is, in the sense of “including but not limited to.” As commonly used herein, the word “coupled” means two or more elements that can be directly connected or connected by means of one or more intermediate elements. Additionally, when used in this application, the words “this,” “above,” “below,” and similar terms should refer to the application as a whole, and not any particular part of the application. Where the context permits, singular or plural words used in the foregoing description may also include the plural or singular, respectively. The word “or” refers to a list of two or more items, and this word encompasses all the following interpretations of the word: any item in the list, all items in the list, and any combination of items in the list.

[0115] The above description of embodiments of the present invention is not intended to be exhaustive or to limit the invention to the precise forms disclosed above. Although specific embodiments and examples of the invention have been described above for illustrative purposes, various equivalent variations are possible within the scope of the invention, as will be appreciated by those skilled in the art. For example, although processes or blocks are presented in a predetermined order, alternative embodiments may execute routines having these steps in a different order or employ systems having these blocks, and some processes or blocks may be deleted, moved, added, subdivided, combined, and / or modified. Each of these processes or blocks can be implemented in various different ways. Furthermore, although processes or blocks are sometimes shown as being executed sequentially, these processes or blocks may instead be executed in parallel or may be executed at different times.

[0116] The teachings of the present invention provided herein can be applied to other systems, not just those described above. Elements and actions of the various embodiments described above can be combined to provide further embodiments.

[0117] While some embodiments of the invention have been described, these embodiments are presented by way of example only and are not intended to limit the scope of this application. In fact, the novel methods and systems described herein can be embodied in various other forms; furthermore, various omissions, substitutions, and changes can be made to the form of the methods and systems described herein without departing from the scope and spirit of this application. The claims and their equivalents are intended to cover such forms or variations that fall within the scope and spirit of this application.

Claims

1. A radio frequency device, comprising: A substrate includes multiple layers, having a first layer located on an upper side of the substrate and a second layer located below the first layer, the first layer having an upper surface and the second layer having an upper surface, such that a cavity is defined by a base plate provided by the upper surfaces of the first layer and the second layer; A barrier layer is implemented on the upper surface of the second layer to form a boundary surrounding the cavity; The first set of contact pads is implemented on the upper surface of the first layer, thereby located within a first region overlapping with the base plate of the cavity. The first set of contact pads includes two input pins and two antenna pins. When the antenna is in operation, each antenna pin is connected to one or more antennas. The two input pins and two antenna pins are located at various corners of the first region. The second set of contact pads is implemented on the base plate of the cavity. The second set of contact pads includes two antenna pins and two output pins. When the antenna is running, each antenna pin is connected to one or more antennas. The two antenna pins and two output pins are arranged such that the two antenna pins are located at the corners of the base plate, such that the two antenna pins of the second set of contact pads are adjacent to the two antenna pins of the first set of contact pads. The first and second sets of support structures are respectively implemented above the first and second sets of contact pads; as well as Transmit and receive filter devices are respectively located above the first and second sets of support structures, such that the receive filter device is mounted on the substrate and thus located in the space defined by the lower side of the transmit filter device and the first set of support structures. Each of the first set of support structures is adjusted to provide sufficient height in the space to accommodate the receive filter device. Each of the first set of support structures includes a solder structure and a metal structure formed of a copper core or copper pillar. The metal structure is configured to prevent the transmit filter device from collapsing onto the receive filter device in the event of failure of the solder structure. The transmit filter device includes two output pins, each connected to a corresponding one of the two input pins of the first set of contact pads. The receive filter device includes two input pins, each connected to a corresponding one of the two output pins of the second set of contact pads.

2. The radio frequency device according to claim 1, wherein, The transmitting filter device is configured to support multiple corresponding frequency bands, and the receiving filter device is configured to support multiple corresponding frequency bands.

3. The radio frequency device according to claim 2, wherein, The frequency band associated with the transmitting filter device is the same as the frequency band associated with the receiving filter device.

4. The radio frequency device according to claim 2, wherein the transmit filter device does not include any receive filter, and the receive filter device does not include any transmit filter.

5. The radio frequency device according to claim 1, further comprising: A molded structure is implemented above the substrate to substantially encapsulate the transmit filter device and the receive filter device.

6. A method for manufacturing a radio frequency device, the method comprising: A substrate is provided or formed, the substrate comprising a plurality of layers having a first layer located on an upper side of the substrate and a second layer located below the first layer, the first layer having an upper surface and the second layer having an upper surface, such that a cavity is defined by a base plate provided by the upper surfaces of the first layer and the second layer; A barrier layer is implemented on the upper surface of the second layer to form a boundary around the cavity; A first set of contact pads is formed on the upper surface of the first layer, thereby located within a first region overlapping with the base plate of the cavity. The first set of contact pads includes two input pins and two antenna pins. When the antenna is in operation, each antenna pin is connected to one or more antennas. The two input pins and two antenna pins are located at various corners of the first region. A second set of contact pads is implemented on the base plate of the cavity. The second set of contact pads includes two antenna pins and two output pins. When the antenna is running, each antenna pin is connected to one or more antennas. The two antenna pins and two output pins are arranged such that the two antenna pins are located at the corners of the base plate, such that the two antenna pins of the second set of contact pads are adjacent to the two antenna pins of the first set of contact pads. First and second sets of support structures are respectively implemented above the first and second sets of contact pads; Position the receiving filter device above the second set of support structures; as well as The transmit filter device is positioned above the first set of support structures such that the receive filter device is mounted on the substrate, thereby situated within the space defined by the lower side of the transmit filter device and the first set of support structures. Each of the first set of support structures is adjusted to provide sufficient height in the space to accommodate the receive filter device. Each of the first set of support structures includes a solder structure and a metal structure formed of a copper core or copper pillar. The metal structure is configured to prevent the transmit filter device from collapsing onto the receive filter device in the event of failure of the solder structure. The transmit filter device includes two output pins, each connected to a corresponding one of the two input pins of the first set of contact pads. The receive filter device includes two input pins, each connected to a corresponding one of the two output pins of the second set of contact pads.

7. The method according to claim 6, further comprising: Prior to the positioning of the receiving filter device and the transmitting filter device, solder material is provided to the contact pads associated with the support structure of the receiving filter device and the transmitting filter device.

8. The method according to claim 7, further comprising: A reflow operation is performed to melt the solder material, thereby forming a reflow solder for the corresponding support structure.

9. The method according to claim 8, wherein, The reflow operation is performed after the positioning of the receiving filter device and the transmitting filter device.

10. The method according to claim 6, wherein, The positioning of the receiving filter device is performed before the positioning of the transmitting filter device.

11. The method of claim 6, further comprising: A molded structure is formed over the substrate to substantially encapsulate the receiving filter and the transmitting filter assembly.

12. A packaging module, comprising: A packaging substrate is configured to accommodate multiple components. The packaging substrate includes multiple layers, having a first layer located on an upper side of the packaging substrate and a second layer located below the first layer. The first layer has an upper surface, and the second layer has an upper surface, such that a cavity is defined by a base plate provided by the upper surfaces of the first layer and the second layer. A barrier layer is implemented on the upper surface of the second layer to form a boundary surrounding the cavity; The first set of contact pads is implemented on the upper surface of the first layer, thereby located within a first region overlapping with the base plate of the cavity. The first set of contact pads includes two input pins and two antenna pins. When the antenna is in operation, each antenna pin is connected to one or more antennas. The two input pins and two antenna pins are located at various corners of the first region. The second set of contact pads is implemented on the base plate of the cavity. The second set of contact pads includes two antenna pins and two output pins. When the antenna is running, each antenna pin is connected to one or more antennas. The two antenna pins and two output pins are arranged such that the two antenna pins are located at the corners of the base plate, such that the two antenna pins of the second set of contact pads are adjacent to the two antenna pins of the first set of contact pads. The first and second sets of support structures are respectively implemented above the first and second sets of contact pads; as well as A filter assembly, implemented relative to the package substrate, includes an embedded transmit filter and a receive filter, the transmit and receive filters being positioned above the first and second sets of support structures, respectively, such that the receive filter is mounted on the package substrate and located within a space defined by the lower side of the transmit filter and the first set of support structures. Each of the first set of support structures is adjusted to provide sufficient height in the space to accommodate the receive filter. Each of the first set of support structures includes a solder structure and a metal structure formed of a copper core or copper pillar, the metal structure being configured to prevent the transmit filter from collapsing onto the receive filter in the event of failure of the solder structure. The transmit filter includes two output pins, each connected to a corresponding one of the two input pins of the first set of contact pads. The receive filter includes two input pins, each connected to a corresponding one of the two output pins of the second set of contact pads.

13. A wireless device, comprising: Transmitter circuit and receiver circuit; One or more antennas configured to support transmit and receive operations; as well as A radio frequency (RF) module, operatively coupled to the transmitter circuitry, the receiver circuitry, and the one or more antennas, includes a substrate comprising multiple layers having a first layer located on an upper side of the substrate and a second layer located below the first layer. The first layer has an upper surface, and the second layer has an upper surface, such that a cavity is defined by a base plate provided by the upper surfaces of the first and second layers. The RF module further includes a barrier layer disposed on the upper surface of the second layer to form a boundary surrounding the cavity. The RF module also includes a first set of contact pads disposed on the upper surface of the first layer, thereby located within a first region overlapping with the base plate of the cavity. The first set of contact pads includes two input pins and two antenna pins, each antenna pin being connected to an antenna of the one or more antennas when the antennas are in operation. The two input pins and two antenna pins are located at respective corners of the first region. The RF module further includes a second set of contact pads disposed on the base plate of the cavity. The second set of contact pads includes two antenna pins and two output pins, each antenna pin being connected to an antenna of the one or more antennas when the antennas are in operation. The two antenna pins and two output pins are located at respective corners of the first region. The output pins are arranged such that the two antenna pins are located at the corners of the base plate, such that the two antenna pins of the second set of contact pads are adjacent to the two antenna pins of the first set of contact pads. The RF module also includes first and second sets of support structures, respectively implemented above the first and second sets of contact pads. The RF module also includes transmit and receive filter devices, respectively located above the first and second sets of support structures, such that the receive filter device is mounted on the substrate and located in the space defined by the lower side of the transmit filter device and the first set of support structures. Each of the first set of support structures is adjusted to provide sufficient height in the space to accommodate the receive filter device. Each of the first set of support structures includes a solder structure and a metal structure formed by a copper core or copper pillar. The metal structure is configured to prevent the transmit filter device from collapsing onto the receive filter device in the event of failure of the solder structure. The transmit filter device includes two output pins, each connected to a corresponding one of the two input pins of the first set of contact pads. The receive filter device includes two input pins, each connected to a corresponding one of the two output pins of the second set of contact pads.

14. The wireless device according to claim 13, wherein, Each of the transmitting filter device and the receiving filter device is implemented as a surface acoustic wave filter.

15. The wireless device according to claim 13, wherein, The transmitting filter device is configured to support multiple corresponding frequency bands, and the receiving filter device is configured to support multiple corresponding frequency bands.

16. The wireless device according to claim 15, wherein, The frequency band associated with the transmitting filter device is the same as the frequency band associated with the receiving filter device.

17. The wireless device according to claim 13, wherein, The radio frequency module further includes a molded structure implemented above the substrate to substantially encapsulate the transmit filter device and the receive filter device.

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