Components for substrate processing apparatus and substrate processing systems

Abstract

The present invention provides a component for a substrate processing apparatus and a substrate processing system. The component for a substrate processing apparatus has a processed mark on a surface and / or inside of the component, and the mark is configured to be able to read two-dimensional code information according to a groove formed by processing and / or two or more colors of the component. According to the present invention, management of the component for a substrate processing apparatus can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a component for a substrate processing apparatus and a substrate processing system. BACKGROUND

[0002] Management of the component can be performed by attaching a tape on which a serial number of the component is displayed to the component. For example, management of the component in a manufacturing site of the substrate processing apparatus is performed by manually inputting and recording the serial number of the component displayed on the tape attached to the component, and confirming which component is installed in the substrate processing apparatus.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENTS

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 4-146649 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The present application provides a technology capable of improving management of a component for a substrate processing apparatus.

[0008] MEANS OF SOLVING THE PROBLEM

[0009] According to one aspect of the present application, there is provided a component for a substrate processing apparatus, having a processed mark on a surface and / or inside of the component, the mark being configured to be able to read two-dimensional code information according to a groove formed in the component by processing and / or two or more colors.

[0010] EFFECTS OF THE INVENTION

[0011] According to one aspect, management of a component for a substrate processing apparatus can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a drawing showing one example of a mark engraved on a component of an embodiment.

[0013] Figure 2 is a drawing showing a material of a component and a state after being engraved of an embodiment.

[0014] Figure 3 is a drawing showing a substrate processing system of an embodiment.

[0015] Figure 4 is a drawing showing a cross-sectional view of a substrate processing apparatus of an embodiment.

[0016] Figure 5 is a drawing showing one example of a component management system of an embodiment.

[0017] Figure 6 is a drawing showing one example of information on a component included in the two-dimensional code information of the embodiment.

[0018] Figure 7 is a drawing showing one example of usable information set by each user of the embodiment.

[0019] Explanation of Reference Numerals

[0020] 1 substrate processing system

[0021] 11 substrate processing apparatus

[0022] 14 loading table

[0023] 14c mark

[0024] 25 edge ring

[0025] 25c mark

[0026] 34 top plate

[0027] 34c mark

[0028] 80, 81 computer

[0029] 100 host computer

[0030] 111 to 114 processing chamber

[0031] 120 vacuum transfer chamber

[0032] P component

[0033] R reader DETAILED DESCRIPTION

[0034] Hereinafter, a mode for carrying out the present application will be described with reference to the drawings. In each drawing, the same structural parts are denoted by the same reference numerals, and repeated description will be omitted at times.

[0035] [Marking of Component]

[0036] First, the marking of a component of the embodiment will be described with reference to Figure 1 Figure 1 is a drawing showing one example of a mark marked on a component of the embodiment. Figure 1 The component of

[0037] ​A mark 25c is formed on the surface of the edge ring 25. The mark 25c is an engraving formed by processing the surface of the member, and has a two-dimensional code in which information about the edge ring 25 is graphically represented by the groove 25al formed in the edge ring 25. The code formed in the mark 25c can be a two-dimensional code such as a QR (Quick Response) code, a Data Matrix, or a bar code, or a three-dimensional code. In the embodiment, the two-dimensional code information can be acquired from the mark 25c.

[0038] The mark 25c is embedded in the edge ring 25 by directly processing the edge ring 25 with, for example, a laser, and is not a mark pasted on the edge ring 25 in the form of a sticker or a mark directly drawn on the edge ring 25. Therefore, even if the surface of the edge ring 25 is consumed by repeated processing in the substrate processing apparatus (etching processing of the substrate, etc.), the mark 25c can be made not to disappear by digging the groove to a prescribed depth. Thus, the two-dimensional code information embedded in the mark 25c can be read with a reader, and the two-dimensional code information can be managed integrally with the edge ring 25. The reading of the two-dimensional code information can be performed with a mobile reader, or can be performed with a reader mounted on the apparatus.

[0039] Further, in the case of a mark pasted on the edge ring 25 in the form of a sticker or a mark directly drawn on the edge ring 25, the mark 25c can be peeled off or disappear when the edge ring 25 is consumed. Thus, the substrate processing apparatus can be contaminated, and adversely affect processing.

[0040] However, in the embodiment, the edge ring 25 is directly processed to dig the groove 25al in the edge ring 25 itself, and the mark 25c is formed. The member used in the substrate processing apparatus is a member that does not adversely affect processing performed in the substrate processing apparatus. Therefore, even if the mark 25c is consumed together with the edge ring 25, no adverse effect on processing occurs. According to the above, by engraving the mark 25c in the member for the substrate processing apparatus of the embodiment, adverse effects on processing can be avoided, and the efficiency of member management and the improvement of management accuracy can be achieved.

[0041] The two-dimensional code information possessed by the mark 25c can be read by the contrast (difference, contrast) of light produced by the reflection of light irradiated to the mark 25c from the reader by the groove 25al of the mark 25c. The position of the mark 25c is not limited to the upper surface of the edge ring 25 in the example. Figure 1 The mark 25c is embedded in the edge ring 25 by directly processing the edge ring 25 with, for example, a laser, and is not a mark pasted on the edge ring 25 in the form of a sticker or a mark directly drawn on the edge ring 25. Therefore, even if the surface of the edge ring 25 is consumed by repeated processing in the substrate processing apparatus (etching processing of the substrate, etc.), the mark 25c can be made not to disappear by digging the groove to a prescribed depth. Thus, the two-dimensional code information embedded in the mark 25c can be read with a reader, and the two-dimensional code information can be managed integrally with the edge ring 25. The reading of the two-dimensional code information can be performed with a mobile reader, or can be performed with a reader mounted on the apparatus.

[0042] [Engraving]

[0043] Next, with reference to Figure 2 , the material of the component and the engraving method will be described. Figure 2 is a view showing the material of the component P of the embodiment and the state after being engraved. In Figure 2 , a part of the region Pa indicated by the reference numeral 25c in Figure 1 will be shown schematically.

[0044] The reference numeral 25c is engraved to the component P by heat processing the component with a laser. Figure 2 (a) of

[0045] In the case where the component P is quartz, the concavo-convex is formed by bringing the laser into contact with the quartz to apply heat to the engraved part including the region Pa to melt it, thereby engraving the reference numeral 25c to the component P. Thus, the amount of reflection of light changes between the part of the groove Pa1 that has been melted to become smooth and the part Pb of the frosted glass, producing a contrast of light.

[0046] As a result, when the light output from the reader comes into contact with the reference numeral 25c, the reader reads the two-dimensional code information from the reference numeral 25c formed on the component P according to the contrast of the light incident to the groove Pa1 formed on the surface of the component P and the light incident to the part Pb of the surface. Thus, it is possible to acquire information about the component P such as the component number, the serial number, the date of manufacture, and the like of the component P included in the two-dimensional code information.

[0047] Figure 2 (b) of

[0048] In the case where the component P is ceramic, the concavo-convex is formed by bringing the laser into contact with the ceramic region Pa to apply heat to the region Pa to melt it, thereby engraving the reference numeral 25c to the component P. Thus, the amount of reflection of light changes between the part of the groove Pa1 that has been melted to become smooth and the part other than that, producing a contrast of light. In addition, the region Pa to which heat has been applied changes color. The region other than the region Pa to which heat has been applied is the color of the ceramic before the color change, so a color contrast is produced between the color of the part Pa2 that has changed color and the part other than that.

[0049] As a result, when the light output from the reader contacts the mark 25c, the reader reads a contrast of the light incident to the groove Pal formed on the surface of the component P from the mark 25c formed on the component P and the light incident to other surface portions from the mark 25c formed on the component P. Also, the reader reads a contrast of the color of the portion Pa2 which is discolored and the color of other portions from the mark 25c formed on the component P. Then, the reader reads the two-dimensional code information based on the contrast of the light and the contrast of the color which are read. Thus, it is possible to acquire information on the component P such as the component number, the serial number, the manufacturing date and time of the component P which are included in the two-dimensional code information.

[0050] Figure 2 (c) of FIG. 21 indicates a state of a portion Pa of the mark 25c which is engraved on the component P in a case where the component P is any one of aluminum, stainless steel (SUS), a material on which an anodizing treatment is performed on a surface of aluminum, or silicon. The mark 25c is constituted by the groove Pal formed on the component P and the unevenness of the surface of the groove Pal.

[0051] In a case where the component P is any one of aluminum, stainless steel (SUS), a material on which an anodizing treatment is performed on a surface of aluminum, or silicon, the surface on which the groove Pal is formed is formed with the unevenness by thinning the surface by irradiating laser to the component P to engrave the mark 25c on the component P. The unevenness of the surface of the groove Pal is smaller in size than the unevenness in a case where the component P is quartz or ceramic, causes diffusion of light, and the portion of the groove Pal becomes white due to the diffusion of light.

[0052] As a result, when the light output from the reader contacts the mark 25c, the reader reads a contrast of the light from the mark 25c formed on the component P based on an amount of reflected light which is reflected by the unevenness of the groove Pal formed on the surface of the component P. Also, the reader reads a contrast of the white of the portion of the groove Pal and the color of other portions due to the diffusion of light. The reader acquires the two-dimensional code information corresponding to the contrast of the light and / or the contrast of the color which are read. Thus, it is possible to acquire information on the component P such as the component number, the serial number, the manufacturing date and time of the component P which are included in the two-dimensional code information.

[0053] Figure 2 (d) of FIG. 21 indicates a state of a portion Pa of the mark 25c which is engraved on the component P in a case where the component P is aluminum or stainless steel. The mark 25c is constituted by a color of the oxide film formed on the component P by laser processing and a color of the component P before discoloration.

[0054] When component P is made of aluminum or stainless steel, when a laser is irradiated onto component P, the focal point is deflected, transferring heat to a degree that prevents component P from melting. This allows an oxide film Pa3 to be formed on the surface of component P without removing it. This oxide film Pa3 is black. This creates a contrast between the black color of the region Pa where the oxide film Pa3 is formed and the color of the aluminum or stainless steel in the surrounding areas.

[0055] As a result, when the light output from the reader comes into contact with mark 25c, the reader reads the contrast between the black color of the region Pa where the oxide film Pa3 is formed and the color of the other areas. The reader then acquires QR code information corresponding to the color contrast read. Thus, it is possible to obtain information about component P, such as its part number, serial number, and manufacturing date, contained in the QR code information.

[0056] However, in Figure 2 When component P shown in (d) is made of aluminum or stainless steel, the metal may become discolored due to heat transfer, and there is a possibility that the etched portion including area Pa may bulge due to thermal expansion. In this case, there is a possibility that QR code information may be transferred to the bulge. In this case, there is also a possibility that area Pa may not form a black portion, and the code may only be etched in the white portion.

[0057] exist Figure 2 In the case of any material shown, the mark 25c is directly machined onto component P. This avoids adverse effects from etching or other processes caused by the mark 25c. Furthermore, in the case of component P that is consumed by plasma, such as the edge ring 25, by forming a groove Pa1 of a certain depth on component P, even if the mark 25c is exposed to plasma, the difficult-to-dispose mark 25c can be machined onto component P. Moreover, in cases where component P is easily consumed, a reader can read the position of the mark 25c if it is preferably formed on the side or other surface of component P, where it is difficult to be exposed to plasma.

[0058] Furthermore, in the above description, the mark 25c is engraved on the surface of component P, but it is not limited to this. The mark 25c can also be, for example, formed into a groove (hollow space) inside component P. When the mark 25c is formed inside component P, the mark 25c can be identified by the color contrast caused by the hollow space inside component P. In addition, when component P is transparent, it can also be identified by the contrast of light.

[0059] In this way, in the mark 25c of the embodiment, the two-dimensional code information readable by the reader is embedded in the mark 25c engraved in the component P. Further, the mark 25c has a function of correcting an error of the two-dimensional code information. The size and the amount of information of the two-dimensional code information are determined by three factors of a unit size (size of each dot), a unit number (number of dots constituting the two-dimensional code), and an error correction level (data recovery ability).

[0060] For example, the larger the unit size, the larger the size of each dot, and thus the easier the information is read. Further, the larger the unit number, the larger the number of dots constituting the code, and thus the larger the amount of information. Further, the higher the error correction level, the larger the size of the code, and thus the smaller the amount of information.

[0061] However, the higher the error correction level, the higher the data recovery ability. Thus, in a case where a part of the mark 25c is damaged or stained due to consumption of the component P, the information about the component P included in the two-dimensional code information can be acquired by error correction. As described above, the mark 25c is configured to be able to correct an error of the two-dimensional code information.

[0062] According to the above-described engraving method, the mark 25c is engraved in the component P directly, and thus the mark 25c constitutes a part of the component P. Thus, even if the component P for the substrate processing apparatus is consumed, the mark 25c does not adversely affect processing.

[0063] Further, the mark 25c is configured to be able to read the two-dimensional code information according to the groove formed in the component P by lowering and / or two or more colors. Thus, by the reader, the information about the component P included in the two-dimensional code information can be acquired from the mark 25c. Further, the mark 25c has a function of correcting an error of the two-dimensional code information, and thus even in a case where a part of the mark 25c is removed due to consumption of the component P, the two-dimensional code information can be recovered using the error correction function.

[0064] Further, in a case where the mark 25c of the embodiment is engraved, the engraving range required can be reduced to about 1 / 13 compared to a case where a serial number of the component is engraved directly in the component. Thus, it becomes easy to perform processing at a position where the mark 25c is not exposed to plasma of the component P. Further, since the two-dimensional code information embedded in the mark 25c can be acquired using the reader, the information about the component P cannot be acquired visually without using the reader. Thus, the information about the component P can be protected. Further, by acquiring and recording the two-dimensional code information embedded in the mark 25c using the reader, it is possible to contribute to reduction of recording operation time and reduction of recording errors.

[0065] [Substrate processing system and substrate processing apparatus]

[0066] For a substrate processing system having a substrate processing apparatus configured with the above-described mark-embossed member and a transfer chamber that transfers a substrate to the substrate processing apparatus, reference is made to Figure 3 For a substrate processing system having a substrate processing apparatus configured with the above-described mark-embossed member and a transfer chamber that transfers a substrate to the substrate processing apparatus, reference is made to Figure 4 For a substrate processing apparatus, reference is made to Figure 3 is a diagram showing a substrate processing system 1 of an embodiment. Figure 4 is a cross-sectional schematic view showing a substrate processing apparatus 11 of an embodiment. Figure 3 and Figure 4 is an embodiment in which a reader is mounted, but the reader can also be used without being mounted on the substrate processing system and the substrate processing apparatus, and a mobile reader can be used.

[0067] The substrate processing system 1 includes processing chambers 111 to 114, a vacuum transfer chamber 120, load lock chambers 131, 132, an atmospheric transfer chamber 140, robot arms 151 to 153, gate valves 161 to 168, and a computer 81. The vacuum transfer chamber 120 and the atmospheric transfer chamber 140 are examples of transfer chambers. The processing chambers 111 to 114 are examples of processing chambers of a substrate processing apparatus.

[0068] The processing chambers 111 to 114 have stages 111a to 114a on which wafers W are placed, and are connected to the vacuum transfer chamber 120 via the gate valves 161 to 164. Inside the processing chambers 111 to 114, a predetermined vacuum atmosphere is established, and desired processing is performed on the wafers W inside.

[0069] The vacuum transfer chamber 120 has a transfer mechanism 121 provided therein, and a predetermined vacuum atmosphere is established inside the vacuum transfer chamber 120. The transfer mechanism 121 is used to transfer the wafers W between the processing chambers 111 to 114 and the load lock chambers 131, 132.

[0070] The load lock chambers 131, 132 have stages 131a, 132a on which wafers W are placed, and are connected to the vacuum transfer chamber 120 via the gate valves 165, 166, and are connected to the atmospheric transfer chamber 140 via the gate valves 167, 168. The load lock chambers 131, 132 have a function of switching between an atmospheric atmosphere and a vacuum atmosphere.

[0071] The atmospheric transfer chamber 140 has an atmospheric atmosphere established therein, and has a transfer mechanism 141 provided therein. The transfer mechanism 141 is used to transfer the wafers W between the load lock chambers 131, 132 and carriers C of the robot arms 151 to 153.

[0072] The computer 81 controls the entire substrate processing system 1. For example, the computer 81 controls the operations of the processing chambers 111 to 114, the operations of the transport mechanisms 121, 141, the opening and closing of the gate valves 161 to 168, the switching of the vacuum atmosphere or the atmospheric atmosphere in the load lock chambers 131, 132, and the like. The computer 81 is one example of a control section that controls the substrate processing system 1.

[0073] In Figure 3 In the present embodiment, the reader R is provided in the vacuum transport chamber 120, but is not limited thereto and can be provided at any position on a transport path on which the substrate W is transported to the processing chambers 111 to 114 of the substrate processing apparatus via the vacuum transport chamber 120 and the atmospheric transport chamber 140. For example, the reader R can be provided in the processing chambers 111 to 114, the load lock chambers 131, 132, the atmospheric transport chamber 140, the robot arms 151 to 153, and the gate valves 161 to 168. Further, the reader R is not limited to one and a plurality of readers R can be provided. As described above, the reader R can not be provided in the substrate processing system and the substrate processing apparatus and a mobile reader R can be used.

[0074] The reader R reads the two-dimensional code information from the mark engraved on the component P provided in the processing chambers 111 to 114, the component P being transported, or the component P provided in another chamber. The reader R transmits the read two-dimensional code information to the computer 81. The computer 81 acquires the component number, the serial number, the manufacturing date, and the like of the component P from the received two-dimensional code information.

[0075] For example, in a case where the mark 25c is engraved in the edge ring 25, the edge ring 25 is transported on a path on which the substrate W is transported. In this case, the mark 25c is read by the reader R when the edge ring 25 is transported, and the two-dimensional code information can be acquired. Thus, the component management of the edge ring 25 to be replaced can be easily performed. Further, by reading the mark 25c by the reader R, the management of whether the component provided in the substrate processing apparatus is a product of the present company or a product of another company can be correctly performed.

[0076] (Substrate processing apparatus)

[0077] Hereinafter, the structure of the substrate processing apparatus 11 will be described with reference to Figure 4 The substrate processing apparatus 11 includes a chamber 10 having an internal space 10s, and thereby, for example, a processing chamber 10p is formed in the internal space 10s. The substrate processing apparatus 11 includes a substrate support 10a on which a substrate W is mounted, and a substrate support mechanism 10b that moves the substrate support 10a in the internal space 10s. The substrate support mechanism 10b is controlled by a substrate support mechanism control section 10c. Figure 3The processing chambers 111 to 114. The chamber 10 has a chamber main body 12 of a substantially cylindrical shape. A passage 12p is formed in the side wall of the chamber main body 12. The substrate W passes through the passage 12p when the substrate W is transported between the inside space 10s and the outside of the chamber 10. The passage 12p is opened and closed by a gate valve 12g. The gate valve 12g is provided along the side wall of the chamber main body 12. The passage 12p is a passage for transporting the substrate W and the edge ring 25, and a reader R is provided in the passage 12p. The reader R can also be provided in the gate valve 12g.

[0078] A support portion 13 is provided on the bottom of the chamber main body 12. The support portion 13 has a substantially cylindrical shape and is formed of an insulating material. An edge ring 25 (also referred to as a focus ring) that surrounds the periphery of the substrate and a stage 14 are provided on the support portion 13. The edge ring 25 can have a substantially cylindrical shape and is formed of silicon or the like. A mark 25c is engraved on the upper surface of the edge ring 25. The position of the mark 25c is a position that can be read by the reader R or another reader outside the substrate processing apparatus 11, and is not limited to the upper surface of the edge ring 25, but can be the side surface or the back surface of the edge ring 25, or can be formed inside the edge ring 25.

[0079] The substrate processing apparatus 11 is provided with the stage 14 in the inside space 10s. The stage 14 supports the substrate W. The stage 14 has an electrostatic chuck 20, a lower electrode 18, and an electrode plate 16. The electrode plate 16 and the lower electrode 18 are formed of a conductor such as aluminum and have a substantially disc shape.

[0080] The electrostatic chuck 20 is provided on the lower electrode 18. The electrode of the electrostatic chuck 20 is connected to a direct current power supply. When a voltage from the direct current power supply is applied to the electrode, the substrate W can be held to the electrostatic chuck 20 by electrostatic attraction. The electrostatic chuck 20 supports the substrate W and the edge ring 25. A mark 14c is engraved on the side surface of the stage 14. The position of the mark 14c is a position that can be read by the reader R or another reader outside the substrate processing apparatus 11, and is not limited to the side surface of the stage 14, but can be the upper surface of the stage 14, or can be formed inside the stage 14.

[0081] An upper electrode 30 is provided above the stage 14. The upper electrode 30 is supported to the upper portion of the chamber main body 12 via an insulating member 32. The upper electrode 30 can include a top plate 34 and a support body 36. The top plate 34 can be formed of a conductor or a semiconductor having low resistance and generating little Joule heat. A plurality of gas release holes 34a are formed in the top plate 34. The plurality of gas release holes 34a penetrate the top plate 34 in the plate thickness direction of the top plate 34.

[0082] A mark 34c is engraved on the lower surface of the top plate 34. The position of the mark 34c is a position that can be read by the reader R or another reader outside the substrate processing apparatus 11, and is not limited to the lower surface of the top plate 34, but can be the side surface of the top plate 34 or can be formed inside the top plate 34. Hereinafter, the reader R or another reader outside the substrate processing apparatus 11 will be referred to as "the reader R or the like".

[0083] The support body 36 supports the top plate 34 in a detachable manner. The support body 36 is formed of an electrically conductive material such as aluminum. A gas diffusion chamber 36a is provided inside the support body 36. A plurality of gas holes 36b are formed in the support body 36. The plurality of gas holes 36b extend downward from the gas diffusion chamber 36a. The plurality of gas holes 36b respectively communicate with the plurality of gas release holes 34a. A gas introduction port 36c is formed in the support body 36. The gas introduction port 36c is connected to the gas diffusion chamber 36a. A gas supply pipe 38 is connected to the gas introduction port 36c, and a gas source 40 is connected to the gas supply pipe 38. Gas from the gas source 40 is guided from the gas supply pipe 38, through the gas introduction port 36c, via the gas diffusion chamber 36a, through the plurality of gas holes 36b, and from the gas release holes 34a.

[0084] In the substrate processing apparatus 11, a shield member 46 is detachably provided along the inner wall surface of the chamber main body 12. The shield member 46 is also provided to the outer periphery of the support portion 13. The shield member 46 prevents reaction products such as etching by-products from adhering to the chamber main body 12.

[0085] A baffle plate 48 is provided between the support portion 13 and the side wall of the chamber main body 12. The baffle plate 48 is formed, for example, by forming a film having corrosion resistance on the surface of a member formed of aluminum. A plurality of through holes are formed in the baffle plate 48. An exhaust port 12e is provided below the baffle plate 48 and at the bottom of the chamber main body 12. An exhaust device 50 is connected to the exhaust port 12e via an exhaust pipe 52.

[0086] The substrate processing apparatus 11 has a high-frequency power source 62 that applies electric power of high frequency RF. The high-frequency power source 62 is connected to the electrode plate 16 via a matcher 66, and generates electric power of high frequency RF to generate plasma from gas in the chamber 10. The frequency of the high frequency HF is, for example, a frequency in the range of 27 MHz to 100 MHz.

[0087] The substrate processing apparatus 11 can further include a computer 80. The computer 80 is one example of a control portion that controls each portion of the substrate processing apparatus 11. The computer 80 executes a control program, and controls each portion of the substrate processing apparatus 11 in accordance with recipe data, whereby various processes are performed in the substrate processing apparatus 11.

[0088] In the substrate processing apparatus 11 of the above-described structure, as one example of the components for the substrate processing apparatus 11, the top plate 34, the edge ring 25, and the stage 14 on which marks are engraved are exemplified, but are not limited thereto. For example, as other examples of the components for the substrate processing apparatus 11, the baffle 48, the shield 46, and the like can be exemplified, and marks are engraved in these components.

[0089] [Component management system]

[0090] Next, with reference to Figure 5 , one example of a component management system to which the computer 80 that controls the substrate processing apparatus 11 and the computer 81 that controls the substrate processing system 1 are connected will be described. Figure 5 is a view that shows one example of the component management system of the embodiment.

[0091] In the components P arranged in the substrate processing apparatus 11 and the components P arranged in the substrate processing system 1, marks (34c, 14c, 25c, and the like) are sometimes engraved. The reader R or the like reads the two-dimensional code information of the marks engraved in the components P and transmits it to the computer 80 that controls the substrate processing apparatus 11 or the computer 81 that controls the substrate processing system 1.

[0092] The computer 80 and the computer 81 record the information on the components P included in the two-dimensional code information in the recording medium. Figure 6 is a view that shows one example of the information on the components P included in the two-dimensional code information of the embodiment.

[0093] The computer 80 and the computer 81 record, as the information on the components P, for example, the component number "ER11", the component name "edge ring", the serial number "123456", and the manufacturing date "20190101" in the recording medium. Also, the installation date and time "20200315 / 15:38" and the disassembly date and time "20210915 / 12:21" are recorded in the recording medium. In the mark, each of the information of the component number, the serial number, and the manufacturing date must be embedded. Thereby, the computer 80 and the computer 81 can determine the components P by acquiring the component number, the serial number, and the manufacturing date.

[0094] The computer 80 and the computer 81 are connected to the superior computer 100 via the network N. The number of the computer 80 and the computer 81 is not limited to two, and can be several. The superior computer 100 can be a computer on the cloud.

[0095] The computer 80 and the computer 81 can transmit the information on the components P to the superior computer 100. The superior computer 100 can accumulate the information on the components P received from the computer 80 and the computer 81 in the recording medium and use it as history information for component management.

[0096] The timing of collection of information on the component P will be described. The supplier of the component or the manufacturer of the substrate processing apparatus directly stamps the mark including the two-dimensional code of the serial number or the like on the component P at the time of shipment to the customer. Thus, by reading the two-dimensional code information embedded in the stamped mark with the reader R or the like before shipment to the customer, and recording the read information on the component P in the recording medium of the upper computer 100 or the like, it is possible to know which component P is shipped. The information on the component P including the serial number or the like is also recorded at the time of manufacturing the substrate processing apparatus 11, and becomes a state of knowing which component P is assembled in which substrate processing apparatus 11. When a new component P is assembled in the substrate processing apparatus 11 or when a consumed component P is disassembled, the two-dimensional code information embedded in the mark is also read with the reader R or the like, and the read information is recorded in the recording medium of the upper computer 100 or the like. Thus, based on the recorded information on the component P, it is possible to manage which component is disassembled in which apparatus at which time.

[0097] For example, by comparing the two-dimensional code information read at the time of shipment and the two-dimensional code information read at the time of disassembly of the component P, it is possible to confirm the presence or absence of a third-party manufactured component. Further, by recording the operation information of the substrate processing apparatus 11 in the recording medium of the upper computer 100 or the like, it is possible to calculate the operation time of each component P, and easily confirm the correlation with the processing characteristics.

[0098] Next, an example of use of the information on the component P will be described. The upper computer 100 and the computers 80 and 81 can extract the accumulated information on the component P in the case where a problem occurs in each substrate processing apparatus 11, and use it for investigation of the problem. Further, based on the accumulated information on the component P, it is possible to confirm the correlation with the processing results of etching or the like, and use it when performing a more refined and complex processing.

[0099] For example, at the time of installation of the substrate processing apparatus 11, by reading the mark stamped on the component P with the reader R or the like, it is possible to quickly grasp which component P is used in the installed substrate processing apparatus 11, and it is possible to efficiently perform management and analysis of the components.

[0100] Further, at the time of disassembly of the component P from the substrate processing apparatus 11, by reading the mark formed on the disassembled component P, it is possible to quickly grasp at what time from the substrate processing apparatus 11 a component P manufactured at what time and where is disassembled, and it is possible to perform efficient management and analysis of the components.

[0101] In addition, for example, the cumulative time of use of each component P can be managed based on the history information of the installation date and time of the substrate processing apparatus 11 and the history information of the dismounting date and time of the component from the substrate processing apparatus 11. Further, based on the history information described above, in the case where a problem such as a breakage or a failure of the component P has occurred, the investigation of the component P in which the breakage or the failure has occurred can be promptly performed.

[0102] The upper computer 100 and the computers 80, 81 are not limited to the information usable in the history information accumulated by the user. Figure 7 is a diagram showing one example of the usable information set by each user in the embodiment.

[0103] In Figure 7 In the example of, the user "A" can use the component number, the serial number, and the manufacturing year and month in the recorded history information. For example, in the case where the upper computer 100 or the computers 80, 81 displays the history information on the component P on the display portion of the terminal device possessed by the user "A", the information showing the component number, the serial number, and the manufacturing year and month is displayed on the display portion, and other information is not displayed.

[0104] On the other hand, the user "B" can use the component number, the component name, the serial number, the manufacturing year and month, the installation date and time, and the dismounting date and time in the recorded history information. That is, the history information on the component P displayed on the terminal device possessed by the user "A" is different from the history information on the component P displayed on the terminal device possessed by the user "B". Thus, the display range of the history information on the component P can be managed for each user.

[0105] As described above, the component P for the substrate processing apparatus of the embodiment has the mark in which the serial number is encoded directly formed on the component P by laser processing. The reader R or the like acquires the two-dimensional code information buried in the mark and records it in the recording medium of the upper computer 100 or the like. Thus, the shortening of the recording operation time and the reduction of recording errors can be facilitated. Further, by recording the read two-dimensional code information in the recording medium of the upper computer 100 or the like, the history information of the components in one or a plurality of substrate processing apparatuses 11 can be accumulated. Thus, based on the accumulated history information of the components, the management, the investigation, and the analysis of the components can be promptly performed.

[0106] Further, by bringing the mark engraved in the component into the finder screen of the reader or the camera, it is possible to realize the function of augmented reality (AR: Augmented Reality) that displays the virtual content corresponding to the mark in superposition with the display in the real environment. In this case, the content information associated with the mark is stored in advance in the upper computer 100 or the like. Then, the mark is read by the reader or the camera, and the content information associated with the mark is transmitted from the upper computer 100 or the like to the reader or the camera. Thus, it is possible to display the desired content on the display section of the reader or the camera.

[0107] It should be considered that the components for the substrate processing apparatus and the substrate processing system of the embodiments disclosed in the present application are illustrative and not limiting in all aspects. The above-described embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The contents described in the above-described embodiments can be added with other structures within a non-contradictory range, and can be combined within a contradictory range.

[0108] The substrate processing apparatus of the present application can also be applied to any type of apparatuses such as ALD (Atomic Layer Deposition), Capacitively Coupled Plasma (CCP), Inductively Coupled Plasma (ICP), Radial Line Slot Antenna (RLSA), Electron Cyclotron Resonance Plasma (ECR), and Helicon Wave Plasma (HWP).

Claims

1. A substrate processing apparatus characterized by comprising: including: a processing chamber having a chamber body; an edge ring as a component of the substrate processing apparatus; a gate valve provided to the chamber body, which opens and closes a passage between an inner space of the chamber body and an outside of the processing chamber; and a reader configured to the gate valve, the reader is configured to read a mark processed on a surface and / or an inside of the edge ring disposed in the inner space, the mark of the edge ring includes a groove of a depth that does not disappear even in a case where a surface of the edge ring is consumed by repeatedly performing processing in the processing chamber.

2. The substrate processing apparatus according to claim 1, wherein: the mark is configured to be read two-dimensional code information according to a groove formed by processing on the edge ring and / or two or more colors.

3. The substrate processing apparatus according to claim 2, wherein: the mark is configured to be read the two-dimensional code information according to a contrast of light incident to the groove formed on the surface and / or the inside of the edge ring.

4. The substrate processing apparatus according to claim 2 or 3, wherein: the mark is configured to be read the two-dimensional code information according to a contrast of the two or more colors formed on the surface and / or the inside of the edge ring.

5. The substrate processing apparatus according to claim 2 or 3, wherein: the mark is configured to perform error correction of the two-dimensional code information.

6. The substrate processing apparatus according to any one of claims 1 to 3, wherein: the edge ring is quartz, the mark is constituted by a groove formed on the edge ring by laser processing. including:

7. A substrate processing system, comprising: the substrate processing apparatus according to any one of claims 1 to 6 is configured; a transport chamber that transports the edge ring to the substrate processing apparatus; and a control section, the reader reads two-dimensional code information from a mark formed on the edge ring provided to the substrate processing apparatus and / or the edge ring transported in the passage, the control section acquires information on the edge ring included in the read two-dimensional code information, and records information on the edge ring in a recording medium. ​

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