Display device

Abstract

According to an embodiment, a display device includes: a substrate; a light-emitting diode; an input sensing member disposed on the light-emitting diode; a color conversion layer and a light blocking member disposed on the input sensing member; an adhesion layer disposed on the color conversion layer and the light blocking member; and a window bonded to the adhesion layer, wherein, at ‑20°C, the storage modulus of the adhesion layer may be 0.2 MPa or less, and the glass transition temperature (Tg) of the adhesion layer may be ‑30°C or less.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0169823 filed on December 18, 2019, in the Korean Intellectual Property Office, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present disclosure are directed to a display device. Background Art

[0004] Recently, electronic devices that can be bent or folded have been actively developed. Such flexible electronic devices include electronic panels such as flexible display panels or flexible touch panels and various other components. The other components have different functions. The other components are arranged on at least one side surface of the electronic device.

[0005] Other components may be bent, curved or folded together with the electronic device. Other components are relatively flexible, so they may be bent, curved or folded. Summary of the invention

[0006] The embodiment provides a display device having improved reliability and flexibility.

[0007] The display device according to the embodiment includes: a light emitting diode; an input sensing member disposed on the light emitting diode; a color conversion layer and a light blocking member disposed on the input sensing member; an adhesive layer disposed on the color conversion layer and the light blocking member; and a window bonded to the adhesive layer. At -20°C, the storage modulus of the adhesive layer may be 0.2MPa or less, and the glass transition temperature (Tg) of the adhesive layer may be -30°C or less.

[0008] The display device may include a red emission region, a green emission region, and a blue emission region.

[0009] The color conversion layer may include: a red conversion layer overlapping the red emission region; and a green conversion layer overlapping the green emission region.

[0010] The red conversion layer and the green conversion layer may include at least one of quantum dots and solid fluorescent dyes, respectively.

[0011] The adhesion layer may contact the input sensing member in the blue emission region. The adhesion layer may contact the red conversion layer in the red emission region, and the adhesion layer may contact the green conversion layer in the green emission region.

[0012] The display device may further include: a substrate; a circuit component disposed on the substrate, wherein the light emitting diode may be disposed on the circuit component; and an encapsulation layer disposed on the light emitting diode and the circuit component, wherein the input sensing member may be disposed on the encapsulation layer. The substrate may be flexible.

[0013] The display device may further include a transparent layer disposed in the blue emission region.

[0014] The adhesive layer may contact an upper surface of the color conversion layer and an upper surface of the transparent layer.

[0015] The display device may further include an upper overlayer overlapping the blue emission region.

[0016] The upper covering layer may contact the input sensing member, and the adhesive layer may be disposed between the upper covering layer and the window.

[0017] The color conversion layer may further include a blue conversion layer overlapping the blue emission region.

[0018] The blue conversion layer may include at least one of quantum dots and solid fluorescent dyes, and the light emitting diode may emit ultraviolet light.

[0019] A display device according to another embodiment includes: an encapsulation layer; a color conversion layer and a light blocking member disposed on the encapsulation layer; an adhesive layer disposed on the color conversion layer and the light blocking member; and a window bonded to the adhesive layer. The adhesive layer may include at least one of methyl methacrylate, styrene, vinyl toluene, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, lauryl methacrylate, acrylamide, N-methylacrylamide, hydroxyalkyl acrylate, glycidyl methacrylate, acrylic acid, methacrylic acid, itaconic acid, and maleic anhydride, and the adhesive layer may contact the color conversion layer and the light blocking member.

[0020] The storage modulus of the adhesive layer may be 0.2 MPa or less at -20°C, and the glass transition temperature (Tg) of the adhesive layer may be -30°C or less.

[0021] The adhesive force of the adhesive layer may be 600 gf / in or more, the transmittance of the adhesive layer may be 90% or more, and the haze value of the adhesive layer may be 5% or less.

[0022] The display device may include a red emission region, a green emission region, and a blue emission region, and the color conversion layer may include a red conversion layer overlapping the red emission region and a green conversion layer overlapping the green emission region.

[0023] The display device may further include an input sensing member disposed between the encapsulation layer and the color conversion layer, and the adhesion layer may contact the input sensing member in the blue emission region.

[0024] The adhesion layer may contact the red conversion layer in the red emission region, and the adhesion layer may contact the green conversion layer in the green emission region.

[0025] The display device may further include: a substrate; and a circuit component and a light emitting diode disposed on the substrate. The encapsulation layer may be disposed on the circuit component and the light emitting diode.

[0026] A display device according to another embodiment includes: a light emitting diode; a color conversion layer and a light blocking member disposed on the light emitting diode, wherein the display device includes a red emission region, a green emission region, and a blue emission region; an adhesive layer disposed on the color conversion layer and the light blocking member; and a window bonded to the adhesive layer. The adhesive force of the adhesive layer is 600 gf / in or more, the transmittance of the adhesive layer is 90% or more, and the haze value of the adhesive layer is 5% or less.

[0027] According to the embodiments, a display device having improved reliability through improved adhesiveness or improved flexibility through an adhesive layer having a low storage modulus may be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a perspective view of a display device according to an embodiment.

[0029] Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E , Figure 2F and Figure 2G is folded or rolled in Figure 1 A perspective view of a display device is shown in FIG.

[0030] Figure 3 is a cross-sectional view of a display device according to an embodiment.

[0031] Figure 4 is a cross-sectional view of a stacked structure of circuit components according to an embodiment.

[0032] Figure 5 is a cross-sectional view of a display device according to an embodiment.

[0033] Figure 6 , Figure 7 and Figure 8 is a cross-sectional view of a display device according to an embodiment. DETAILED DESCRIPTION

[0034] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present disclosure are shown. As will be appreciated by those skilled in the art, the exemplary embodiments may be modified in various different ways without departing from the spirit or scope of the present disclosure.

[0035] In addition, in the drawings, for the convenience of description, the size and thickness of each element may be arbitrarily shown, and the present disclosure is not necessarily limited to those shown in the drawings. In the drawings, for the sake of clarity, the thickness of layers, films, panels, regions, parts, etc. may be exaggerated, and the same reference numerals may represent the same elements throughout the specification.

[0036] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may also be present.

[0037] In the following, reference will be made to Figure 1 and Figures 2A to 2G A display device according to the embodiment is described. Figure 1 is a perspective view of a display device according to an embodiment, Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E , Figure 2F and Figure 2G is folded or rolled in Figure 1 A perspective view of a display device is shown in FIG.

[0038] First, according to the embodiment, referring to Figure 1 , the display device 1000 includes a display area DA that displays an image on one surface S1 and a peripheral area PA surrounding the display area DA. The peripheral area PA is an area where no image is displayed, and the shapes of the display area DA and the peripheral area PA may be relatively changed. In some embodiments, the peripheral area PA is substantially omitted. In this specification, Figure 1 The icons of the application and the clock window are shown as examples, and the display area DA has a rectangular shape. The surface is parallel to a plane defined by a first direction DR1 and a second direction DR2 crossing the first direction DR1, and displays an image in a third direction DR3 orthogonal to the first direction DR1 and the second direction DR2.

[0039] According to an embodiment, the display device 1000 may be a foldable display device, a rollable display device, a bendable display device, or a stretchable display device. The display device 1000 according to an embodiment may be used in large electronic devices such as televisions, monitors, etc., or in small and medium-sized electronic devices such as mobile phones, tablet computers, car navigation devices, game consoles, smart watches, etc.

[0040] In the following, reference is made to Figure 1 and Figure 2A , the display device 1000 is folded inwardly around the bending axis BX parallel to the second direction DR2.

[0041] Because the display device 1000 according to the embodiment is folded inwardly about the bending axis BX, the first surface S1 of the display device 1000 is folded about the bending axis BX, so that the first surface S1 of the display device 1000 is divided by the bending axis BX and folded to face itself, and the rear surface of the display device 1000 opposite to the first surface S1 is exposed outward.

[0042] Reference Figure 2B According to the embodiment, the display device 1000 is folded outward around the bending axis BX parallel to the second direction DR2. Because the display device 1000 according to the embodiment is folded outward around the bending axis BX, the first surface S1 of the display device 1000 is exposed outward, and the rear surface opposite to the first surface S1 is folded inward around the bending axis BX, so that two sides of the rear surface are divided by the bending axis BX and face each other.

[0043] Reference Figure 1 and Figure 2C According to the embodiment, the display device 1000 is folded inwardly about the bending axis BY parallel to the first direction DR1. Because the display device 1000 according to the embodiment is folded inwardly about the bending axis BY, the first surface S1 of the display device 1000 is folded to face itself, and the rear surface facing the first surface S1 is exposed outwardly.

[0044] Reference Figure 2D , the display device 1000 according to the embodiment is folded outward around the bending axis BY parallel to the first direction DR1. Because the display device 1000 according to the embodiment is folded outward around the bending axis BY, the first surface S1 of the display device 1000 is exposed outward, and the rear surface facing the first surface S1 is folded around the bending axis BY, and the two surfaces of the rear surface are divided by the bending axis BY and face each other.

[0045] Reference Figure 2E to Figure 2G , the display device 1000 according to the embodiment can be folded or rolled in various ways. Figure 2EAs shown in , the display device 1000 according to the embodiment can be rolled or folded inward from its end. Figure 2F As shown in , the display device 1000 according to the embodiment can be rolled or folded outward from its end. Figure 2G As shown in , the display device 1000 according to the embodiment may be rolled or folded in a diagonal direction. Figures 2A to 2G A rolled or folded state of the display device 1000 is shown as an example, however, the embodiments of the present disclosure are not limited thereto, and in other embodiments, the display device 1000 may be folded or rolled in various other ways.

[0046] In the following, reference will be made to Figures 3 to 5 A display device according to the embodiment is described. Figure 3 is a cross-sectional view of a display device according to an embodiment, Figure 4 is a cross-sectional view of a stacked structure of circuit components according to an embodiment, and Figure 5 is a cross-sectional view of a display device according to an embodiment.

[0047] First, refer to Figure 3 According to the embodiment, the display device includes: a circuit component PC stacked on a substrate SUB; a first light emitting diode EL1 electrically connected to the circuit component PC; an encapsulation layer EN disposed on the first light emitting diode EL1; an input sensing member TP disposed on the encapsulation layer EN; color conversion layers CF1 and CF2, a light blocking member BM, an adhesion layer AL disposed on the input sensing member TP; and a window WIN located on the adhesion layer AL.

[0048] According to an embodiment, the substrate SUB may be a glass substrate or a plastic substrate, and may be flexible.

[0049] In the embodiment, the circuit component PC disposed on the substrate SUB includes a plurality of transistors. The circuit component PC is connected to the first light emitting diode EL1 to be described below, and will be referred to below. Figure 4 Describe in detail.

[0050] In an embodiment, the first light emitting diode EL1 is electrically connected to the circuit component PC. The first light emitting diode EL1 includes a pixel electrode 191, a light emitting layer 370, and a common electrode 270 (see FIG. 2 ). Figure 4 ). Holes and electrons are injected into the light emitting layer 370 from the pixel electrode 191 and the common electrode 270, respectively, and combine to form excitons in an excited state, and emit light when the excitons decay from the excited state back to the ground state. The first light emitting diode EL1 according to the embodiment emits blue light, and for example, the first light emitting diode EL1 emits light having a wavelength in the range of 425 nm to 475 nm.

[0051] In an embodiment, a partition wall PDL is disposed between adjacent first light emitting diodes EL1 , and the partition wall PDL partitions the red emission region R, the green emission region G, and the blue emission region B apart.

[0052] In an embodiment, the encapsulation layer EN is disposed on the first light emitting diode EL1 and the partition wall PDL. The encapsulation layer EN may include a single inorganic layer, a single organic layer, a plurality of inorganic layers and a plurality of organic layers, or it may have a structure in which inorganic layers and organic layers are alternately stacked. In an embodiment, the encapsulation layer EN has a structure in which an organic layer is stacked between two inorganic layers, or a structure in which an organic layer, an inorganic layer, an organic layer, and an inorganic layer are sequentially stacked.

[0053] In an embodiment, an input sensing member TP is disposed on the encapsulation layer EN. The input sensing member TP may sense an externally applied touch and generate an electrical signal. The touch may be one of various forms of external inputs such as body contact / proximity, conductive object contact / proximity, light, heat, pressure, etc. The input sensing member TP includes a sensor for sensing various inputs, such as a conductive sensor, an optical sensor, or a thermal sensor. The input sensing member TP may sense an applied touch by a capacitive method or a pressure sensing method.

[0054] The input sensing member TP according to the embodiment has a structure in which an organic film, an input sensing electrode, and an organic film are sequentially stacked, but the embodiment is not limited thereto, and in other embodiments, the input sensing member TP has various other stack structures.

[0055] The input sensing member TP according to the embodiment is integrally formed on the encapsulation layer EN through a continuous process. In this case, the input sensing member TP is referred to as an input sensing unit or an input sensing circuit.

[0056] In addition, according to an embodiment, an optical member is further provided between the input sensing member TP and the encapsulation layer EN. The optical member reduces the reflectivity of incident light from the front surface of the optical member, or improves the transmittance of light incident on the rear surface of the optical member. The optical member includes at least one of a polarizing film, an anti-reflection film, a delay film, and an anti-scattering film.

[0057] The display device according to the embodiment includes a red emission region R, a green emission region G, and a blue emission region B. The red emission region R, the green emission region G, and the blue emission region B are spaced apart by a light blocking member BM.

[0058] The display device according to the embodiment includes the color conversion layers CF1 and CF2 overlapping the red emission region R and the green emission region G, respectively, and the adhesion layer AL overlapping the blue emission region B.

[0059] In an embodiment, the color conversion layers CF1 and CF2 include a red conversion layer CF1 and a green conversion layer CF2. The red conversion layer CF1 overlaps the red emission region R, and converts the blue light emitted from the first light emitting diode EL1 into red light and emits it. The green conversion layer CF2 overlaps the green emission region G, and converts the blue light emitted from the first light emitting diode EL1 into green light and emits it.

[0060] In an embodiment, each of the red conversion layer CF1 and the green conversion layer CF2 is formed of a photosensitive resin composition and, for example, may include a material formed by a low temperature curing process. In addition, each of the red conversion layer CF1 and the green conversion layer CF2 includes at least one of quantum dots and solid fluorescent dyes.

[0061] In an embodiment, the quantum dots included in the red conversion layer CF1 and the green conversion layer CF2 are independently selected from group II-VI compounds, group III-V compounds, group IV-VI compounds, group IV elements, group IV compounds, or combinations thereof.

[0062] In an embodiment, the II-VI compound may be one of a binary compound, a ternary compound, and a quaternary compound. The binary compound is selected from CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, or a mixture thereof; the ternary compound is selected from AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnT e, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS or a mixture thereof; and, the four-element compound is selected from HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe or a mixture thereof.

[0063] In an embodiment, the III-V compound may be one of a binary compound, a ternary compound, and a quaternary compound. The binary compound is selected from GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, or a mixture thereof; the ternary compound is selected from GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InPSb, or a mixture thereof; and the quaternary compound is selected from GaAlNAs, GaAlNSb, GaAlNP, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, or a mixture thereof.

[0064] In an embodiment, the IV-VI compound may be one of a binary compound, a ternary compound, and a quaternary compound. The binary compound is selected from SnS, SnSe, SnTe, PbS, PbSe, PbTe, or a mixture thereof; the ternary compound is selected from SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, or a mixture thereof; the quaternary compound is selected from SnPbSSe, SnPbSeTe, SnPbSTe, or a mixture thereof. The IV group element is selected from Si, Ge, or a mixture thereof. The IV group compound is a binary compound selected from SiC, SiGe, or a mixture thereof.

[0065] In an embodiment, the quantum dot particles have a uniform concentration of a two-element compound, a three-element compound, or a four-element compound, or the quantum dot particles can be divided into regions with partially different concentrations. In addition, a core / shell structure in which some quantum dots surround some other quantum dots is feasible. The interface between the core and the shell has a concentration gradient in which the concentration of the element of the shell decreases as it approaches its center.

[0066] In some embodiments, the quantum dot has a core-shell structure, which includes a core having the above-mentioned nanocrystals and a shell surrounding the core. The shell of the quantum dot can be a passivation layer that maintains semiconductor properties, or can be a charging layer that applies electrophoretic properties to the quantum dot by preventing chemical denaturation of the core. The shell can be a single layer or have multiple layers. Exemplary quantum shells can include metal or non-metal oxides, semiconductor compounds, or combinations thereof.

[0067] For example, according to an embodiment, the metal or non-metal oxide is SiO 2 、Al 2 O 3 、TiO 2 、ZnO、MnO、Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 or binary compounds such as NiO, or MgAl 2 O 4 、CoFe 2 O 4 、NiFe 2 O 4 or CoMn 2 O 4 However, the embodiments of the present disclosure are not limited thereto.

[0068] In addition, according to an embodiment, the semiconductor compound is one of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP and AlSb, but the embodiments of the present disclosure are not limited thereto.

[0069] In an embodiment, the quantum dot has a full width at half maximum (FWHM) of a light emission wavelength spectrum equal to or less than about 45 nm, or equal to or less than about 40 nm, or equal to or less than about 30 nm, and within this range, color purity or color reproducibility is improved. In addition, since the light emitted by the quantum dot is emitted in all directions, the viewing angle of the light is improved.

[0070] In addition, according to the embodiment, the shape of the quantum dot is not particularly limited, and may be spherical, pyramidal, or multi-armed, or may be cubic nanoparticles, nanotubes, nanowires, nanofibers, or nanoplate particles, etc.

[0071] In an embodiment, the quantum dots control the color of emitted light according to their particle size, and thus, the quantum dots may emit light of various colors such as blue, red, or green.

[0072] According to an embodiment, each of the red conversion layer CF1 and the green conversion layer CF2 including quantum dots further includes a scatterer. The scatterer increases the amount of light emitted by the color conversion layers CF1 and CF2 and provides uniform front and side brightness. The scatterer may include any material that can uniformly scatter incident light. For example, the scatterer may include TiO 2 、ZrO 2 、Al 2 O 3 、In 2 O 3 、ZnO、SnO 2 , Sb 2 O 3 and at least one of ITO.

[0073] In an embodiment, the solid fluorescent dye in the red conversion layer CF1 absorbs light in the wavelength range of 425nm to 475nm and emits light in the wavelength range of 625nm to 675nm. Any solid fluorescent dye that absorbs and emits light in the specified wavelength range is feasible.

[0074] In addition, in an embodiment, the solid fluorescent dye in the green conversion layer CF2 absorbs light in the wavelength range of 425nm to 475nm and emits light in the wavelength range of 525nm to 575nm. Any solid fluorescent dye that absorbs and emits light in the specified wavelength range is feasible.

[0075] The solid fluorescent dye according to the embodiment has an aggregated form. The average size of the aggregated solid fluorescent dye is about 100 nanometers or less, for example, about 30 nanometers to about 40 nanometers.

[0076] According to an embodiment, the organic fluorescent dye provides excellent fluorescence efficiency in solution, but in the solid state, non-radiative processes such as excimer formation or energy transfer increase, so that the fluorescence efficiency decreases rapidly. The solid fluorescent dye according to an embodiment provides almost no fluorescence in solution, but in the solid state, its fluorescence intensity increases rapidly.

[0077] According to an embodiment, the blue emission region B does not overlap with the separate color conversion layer. The adhesion layer AL is disposed in the blue emission region B. The adhesion layer AL allows incident light to pass as it is.

[0078] According to an embodiment, the adhesive layer AL includes at least one of an optically clear adhesive (OCA), an optically clear resin (OCR), and a pressure-sensitive adhesive (PSA), and specifically includes at least one of an acrylic compound, an organic silicon compound, and an acrylic-silicon mixed compound. For example, the adhesive layer AL includes at least one of methyl methacrylate, styrene, and vinyl toluene that provide a predetermined hardness. Optionally, the adhesive layer AL includes at least one of methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, and lauryl methacrylate. In addition, the adhesive layer AL includes at least one of acrylamide, N-methylacrylamide, hydroxyalkyl acrylate (e.g., 2-HEMA, HEA, HPMA, or HPA), glycidyl methacrylate, acrylic acid, methacrylic acid, itaconic acid, and maleic anhydride that play a cross-linking role.

[0079] According to an embodiment, at -20°C, the storage modulus (G') of the adhesion layer AL is 0.2 MPa or less. In addition, the glass transition temperature (Tg) of the adhesion layer AL is -30°C or less. When the storage modulus and the glass transition temperature of the adhesion layer AL meet the above values, the adhesion layer AL is easily bonded to the window WIN by providing a flat upper surface. In addition, since no other stacking structure is included between the color conversion layers CF1 and CF2 and the window WIN, time, cost and material can be reduced due to the simplified structure, and the transmittance is improved.

[0080] In addition, according to the embodiment, the adhesion of the adhesive layer AL is 600 gf / in or more with respect to a glass substrate or a plastic substrate such as a polyimide substrate and a polyaramide substrate, the transmittance of the adhesive layer AL is 90% or more, and the haze value thereof is 5% or less.

[0081] According to the embodiment, the adhesion layer AL described above is highly planarized Even if a separate transparent resin layer or a color conversion layer is not provided in the blue emission region B, the adhesion layer AL provides a transparent layer.

[0082] According to an embodiment, the thickness of the adhesive layer AL is about 5 micrometers to about 50 micrometers. When the thickness of the adhesive layer AL is less than about 5 micrometers, it may not be bonded to the window WIN, the color conversion layers CF1 and CF2, and the light blocking member BM, and when the thickness of the adhesive layer AL is greater than about 50 micrometers, the flexibility of the display device is reduced due to the increase in the thickness of the adhesive layer AL.

[0083] According to the embodiment, since a separate color conversion layer or a transparent resin layer is not provided in the blue emission region B, a process for forming the blue conversion layer or the transparent resin layer may be omitted. Therefore, time and cost of the process are reduced.

[0084] The display device according to the embodiment includes a red conversion layer CF1, a green conversion layer CF2, a light blocking member BM, and an adhesion layer AL disposed in a blue emission region B. The light blocking member BM prevents light emitted from adjacent pixels of different colors from mixing, and separates regions where the red conversion layer CF1, the green conversion layer CF2, and the adhesion layer AL are disposed.

[0085] According to an embodiment, an adhesive layer AL is further disposed on the red conversion layer CF1, the green conversion layer CF2 and the light blocking member BM. The adhesive layer AL overlaps not only the blue emission region B but also the red emission region R and the green emission region G. The adhesive layer AL overlaps the entire surface of the substrate SUB.

[0086] According to an embodiment, the adhesive layer AL directly contacts the red conversion layer CF1 in the red emission region R, directly contacts the green conversion layer CF2 in the green emission region G, and directly contacts the input sensing member TP in the blue emission region B. In addition, the adhesive layer AL directly contacts the light blocking member BM.

[0087] According to an embodiment, a window WIN is disposed on the adhesive layer AL. The window WIN protects the display device from external impact and provides an input surface to a user. The window WIN includes an outer surface exposed to the outside.

[0088] According to the embodiment, the display device does not include a separate polarization layer by including the color conversion layers CF1 and CF2 disposed outside the display panel. The color conversion layers CF1 and CF2 absorb external light, etc., thereby reducing reflectivity and improving display quality.

[0089] In addition, since the display device according to the embodiment does not include a separate color conversion layer or a transparent resin layer disposed in the blue emission region, the number of masks may be reduced, thereby reducing time and cost of a manufacturing process.

[0090] In addition, the display device according to the embodiment includes a flat adhesive layer without a separate planarization layer. Because the adhesive layer is substantially flexible, it helps to provide a foldable, rollable, stretchable, slidable or flexible display device.

[0091] Will refer to Figure 4 A circuit component PC according to an embodiment and a first light emitting diode EL1 electrically connected thereto are described. Descriptions of components and contents identical or similar to those described above may be omitted.

[0092] According to an embodiment, the circuit component PC disposed on the substrate SUB includes a buffer layer 111. The buffer layer 111 may include an inorganic insulating material such as silicon oxide, silicon nitride, or aluminum oxide, or an organic insulating material such as polyimide or acrylic resin. In some embodiments, the buffer layer 111 is omitted. The buffer layer 111 flattens one surface of the substrate SUB, or prevents moisture, impurities, etc. from diffusing to other layers through the circuit component PC.

[0093] According to an embodiment, the semiconductor layer 151 is disposed on the buffer layer 111. The semiconductor layer 151 may include an amorphous semiconductor, a polycrystalline semiconductor, or an oxide semiconductor.

[0094] According to an embodiment, semiconductor layer 151 includes source region 153 connected to source electrode 173 , drain region 155 connected to drain electrode 175 , and channel region 154 disposed between source region 153 and drain region 155 .

[0095] According to an embodiment, the gate insulating film 140 is disposed on the semiconductor layer 151 and those portions of the buffer layer 111 that are not covered by the semiconductor layer 151. The gate insulating film 140 may include an inorganic material such as silicon nitride or silicon oxide, or an organic insulating material. Here, silicon nitride (silicon nitride) may be, for example, SiN x or SiON, and the silicon oxide may be, for example, SiO x .

[0096] According to an embodiment, the gate electrode 124 is disposed on the gate insulating film 140. The gate electrode 124 overlaps the channel region 154 of the semiconductor layer 151.

[0097] According to an embodiment, the interlayer insulating film 160 is disposed on the exposed portion of the gate insulating film 140 and covers the gate electrode 124. The interlayer insulating film 160 may include an inorganic insulating material or an organic insulating material.

[0098] According to an embodiment, source electrode 173 and drain electrode 175 are disposed on interlayer insulating film 160. Source electrode 173 and drain electrode 175 are electrically connected to source region 153 and drain region 155 of semiconductor layer 151 through contact holes 163 and 165 passing through interlayer insulating film 160 and gate insulating film 140, respectively.

[0099] According to an embodiment, a planarization insulating film 180 is disposed on the exposed portions of the source electrode 173, the drain electrode 175, and the interlayer insulating film 160. The planarization insulating film 180 may include an inorganic insulating material or an organic insulating material.

[0100] According to an embodiment, a pixel electrode 191 as a first electrode is disposed on the planarization insulating film 180. The pixel electrode 191 is connected to the drain electrode 175 through a contact hole passing through the planarization insulating film 180.

[0101] According to an embodiment, a partition wall PDL is disposed on the pixel electrode 191 and the planarization insulating film 180. The partition wall PDL overlaps at least a portion of the pixel electrode 191. The partition wall PDL has an opening 361 exposing the pixel electrode 191. The light emitting layer 370 is disposed in the opening 361. The common electrode 270 is disposed on the light emitting layer 370 and the partition wall PDL. The encapsulation layer EN is disposed on the common electrode 270. The encapsulation layer EN may have a structure in which an organic film and an inorganic film are alternately stacked, or may have a structure such as a substrate SUB, but the embodiment is not limited thereto. The pixel electrode 191, the light emitting layer 370, and the common electrode 270 form a first light emitting diode EL1.

[0102] In some embodiments, the pixel electrode 191 is an anode as a hole injection electrode, and the common electrode 270 is a cathode as an electron injection electrode. However, in other embodiments, the pixel electrode 191 is a cathode, and the common electrode 270 is an anode. When holes and electrons are injected into the light-emitting layer 370 from the pixel electrode 191 and the common electrode 270, respectively, the holes and electrons recombine to form excitons in an excited state, and light is emitted when the excitons decay back to the ground state.

[0103] In the following, reference will be made to Figure 5 The structure of the rear surface of the substrate SUB is described in more detail. Descriptions of components identical to those described above will be omitted.

[0104] The display device according to the embodiment further includes a protection film PF and a metal layer ML disposed on the rear surface of the substrate SUB The protection film PF prevents external moisture from penetrating into the display device and absorbs external impact.

[0105] According to an embodiment, the protection film PF includes a protection layer PL and a cushion layer CL.

[0106] According to an embodiment, the protective layer PL includes a plastic film. For example, the protective layer PL includes at least one of polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone), and combinations thereof.

[0107] According to an embodiment, the protection layer PL includes the same material as the substrate SUB, but the substrate SUB has higher heat resistance than the protection layer PL, and the protection layer PL is more flexible than the substrate SUB.

[0108] However, the material included in the protective layer PL is not limited to the plastic resin described above, and in other embodiments, includes an organic / inorganic composite material. For example, the protective layer PL includes a porous organic layer and an inorganic material filled in the pores of the organic layer. The protective layer PL may also include a film functionalization layer formed on a plastic film. The film functionalization layer includes a resin layer. The film functionalization layer is formed by a coating method.

[0109] According to the embodiment, the cushion layer CL absorbs physical impact applied to the display device. In addition, the cushion layer CL may have a protrusion-depression structure or an embossed structure, etc. for impact absorption.

[0110] exist Figure 5 2 shows an embodiment in which the cushion layer CL is formed as a single layer, but the embodiments of the present disclosure are not limited thereto, and in other embodiments, the cushion layer CL is formed as a multi-layer structure.

[0111] According to an embodiment, the cushion layer CL includes any material capable of absorbing impact. The cushion layer CL may include a polymer resin such as, for example, polyurethane, polycarbonate, polypropylene, polyimide, or polyethylene, or it may include rubber liquid, urethane material, or sponge obtained by foaming an acrylic material.

[0112] According to an embodiment, the metal layer ML is disposed on the rear surface of the protection film PF. The metal layer ML overlaps the entire surface of the protection film PF.

[0113] According to an embodiment, the metal layer ML is relatively thin and helps the display device to maintain a fixed shape when being foldable or flexible.

[0114] According to an embodiment, the adhesive layers A1, A2 and A3 are respectively disposed between the substrate SUB and the protective layer PL, between the protective layer PL and the cushion layer CL, and between the cushion layer CL and the metal layer ML. The adhesive layers A1, A2 and A3 attach two adjacent layers. For example, the adhesive layers A1, A2 and A3 include one of an optically clear adhesive (OCA), an optically clear resin (OCR), and a pressure-sensitive adhesive (PSA).

[0115] In the following, reference will be made to Figure 6 , Figure 7 and Figure 8 A display device according to the embodiment is described. Figure 6 , Figure 7 and Figure 8 Description of the same components as those described above will be omitted.

[0116] First, refer to Figure 6, the display device according to the embodiment includes a transparent layer TL disposed in the blue emission region B. The transparent layer TL allows the blue light emitted from the first light emitting diode EL1 to pass therethrough as it is.

[0117] According to an embodiment, the transparent layer TL is formed by a patterning process. The transparent layer TL may include any material that can be patterned, and for example, includes a transparent negative photosensitive resin composition. For example, the transparent layer TL includes a transparent acrylic resin composition. The transparent layer TL is formed by a photocuring (UV) process, or by applying a photocuring process and a thermal curing process together.

[0118] According to an embodiment, an adhesive layer AL is disposed on the red conversion layer CF1, the green conversion layer CF2, the transparent layer TL and the light blocking member BM. The adhesive layer AL bonds the window WIN to the red conversion layer CF1, the green conversion layer CF2, the transparent layer TL and the light blocking member BM.

[0119] According to an embodiment, the adhesive layer AL directly contacts the upper surfaces of the red conversion layer CF1, the green conversion layer CF2, the transparent layer TL, and the light blocking member BM. Although there are steps between the red conversion layer CF1, the green conversion layer CF2, the transparent layer TL, and the light blocking member BM, the adhesive layer AL provides a planarized top surface thereon.

[0120] Next, refer to Figure 7 , the display device according to the embodiment includes an overcoat layer OC overlapping the blue emission region B. The overcoat layer OC is transparent and transmits the blue light emitted from the first light emitting diode EL1 as it is.

[0121] The upper overcoat layer OC according to an embodiment includes a transparent photosensitive resin composition, which includes, for example, an acrylic resin composition. The upper overcoat layer OC is formed by a thermal curing process or a photocuring process.

[0122] According to an embodiment, the overcoat OC overlaps the entire surface of the substrate SUB, and specifically, the overcoat OC overlaps the red conversion layer CF1, the green conversion layer CF2, the light blocking member BM, and the input sensing member TP. The overcoat OC overlaps the red emission region R, the green emission region G, and the blue emission region B. The thickness of the overcoat OC overlapping the red emission region R and the green emission region G is different from the thickness of the overcoat OC overlapping the blue emission region B. The thickness of the overcoat OC overlapping the red emission region R and the green emission region G is less than the thickness of the overcoat OC overlapping the blue emission region B. The overcoat OC in the red emission region R and the green emission region G is disposed between the red conversion layer CF1 and the adhesion layer AL and between the green conversion layer CF2 and the adhesion layer AL, while the overcoat OC in the blue emission region B is disposed between the input sensing member TP and the adhesion layer AL.

[0123] The adhesive layer AL according to the embodiment is disposed between the overcoat layer OC and the window WIN. The adhesive layer AL directly contacts the upper surface of the overcoat layer OC. The overcoat layer OC provides a relatively flat upper surface, and the adhesive layer AL is disposed thereon with substantially the same thickness. The window WIN according to the embodiment is attached to the overcoat layer OC through the adhesive layer AL.

[0124] Next, refer to Figure 8 The display device according to the embodiment includes a second light emitting diode EL2 connected to the circuit component PC. The second light emitting diode EL2 emits light in an ultraviolet wavelength band, for example, light in a wavelength band of about 350 nanometers to 370 nanometers.

[0125] According to an embodiment, the red conversion layer CF1 disposed in the red emission region R converts the light in the ultraviolet wavelength band received from the second light emitting diode EL2 into red light and emits it. The green conversion layer CF2 disposed in the green emission region G converts the light in the ultraviolet wavelength band received from the second light emitting diode EL2 into green light and emits it. The blue conversion layer CF3 disposed in the blue emission region B converts the light in the ultraviolet wavelength band received from the second light emitting diode EL2 into blue light and emits it.

[0126] According to an embodiment, each of the red conversion layer CF1, the green conversion layer CF2, and the blue conversion layer CF3 includes quantum dots or solid fluorescent dyes that convert ultraviolet light into light within a specific wavelength band. Examples of quantum dots have been described above.

[0127] In an embodiment, a solid fluorescent dye is included in the red conversion layer CF1 which absorbs light in the wavelength range of 340nm to 400nm and emits light in the wavelength range of 625nm to 675nm.Any solid fluorescent dye that absorbs and emits light in the wavelength range as described above is suitable.

[0128] In addition, in an embodiment, a solid fluorescent dye is included in the green conversion layer CF2, which absorbs light in the wavelength range of 340nm to 400nm, and in this case, emits light in the wavelength band of 525nm to 575nm. Any solid fluorescent dye that absorbs and emits light in the wavelength range described above is suitable.

[0129] In an embodiment, a solid fluorescent dye is included in the blue conversion layer CF3, which absorbs light in the wavelength range of 340nm to 400nm and emits light in the wavelength band of 425nm to 475nm. Any solid fluorescent dye that absorbs and emits light in the wavelength range described above is suitable.

[0130] According to an embodiment, the adhesion layer AL directly contacts the red conversion layer CF1, the green conversion layer CF2, the blue conversion layer CF3 and the light blocking member BM. The adhesion layer AL joins the window WIN to the red conversion layer CF1, the green conversion layer CF2, the blue conversion layer CF3 and the light blocking member BM. Although there are steps between the red conversion layer CF1, the green conversion layer CF2, the blue conversion layer CF3 and the light blocking member BM, the adhesion layer AL provides a substantially flat upper surface. The joining of the adhesion layer AL and the window WIN will be stable.

[0131] While embodiments of the present disclosure have been described in conjunction with what are presently considered to be exemplary embodiments, it should be understood that the embodiments of the present disclosure are not limited to exemplary embodiments, but, on the contrary, are intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A display device, wherein: The display device comprises: substrate; Circuit components and light-emitting diodes are arranged on the substrate; An encapsulation layer, disposed on the light emitting diode; A red emission region, a green emission region, and a blue emission region; A color conversion layer and a light blocking member are disposed on the encapsulation layer, the color conversion layer comprising a red conversion layer overlapping the red emission region and a green conversion layer overlapping the green emission region; an adhesive layer disposed on the color conversion layer and the light blocking member; an input sensing member disposed between the encapsulation layer and the color conversion layer, and the adhesive layer directly contacts the input sensing member in the blue emission region; and window, bonded to the adhesive layer, wherein at -20°C, the storage modulus of the adhesive layer is 0.2 MPa or less, and the glass transition temperature of the adhesive layer is -30°C or less, Wherein, the adhesive layer comprises at least one of vinyl toluene, lauryl methacrylate, acrylamide, N-methyl acrylamide, hydroxyalkyl acrylate, acrylic acid, itaconic acid and maleic anhydride.

2. The display device according to claim 1, wherein: The red conversion layer and the green conversion layer each include at least one of quantum dots and solid fluorescent dyes.

3. The display device according to claim 1, wherein: The adhesive layer contacts an upper surface of the color conversion layer.

4. The display device according to any one of claims 1 to 3, wherein: The adhesion layer contacts the window.

Images