A wave-absorbing metamaterial, a wave-absorbing structural component, and a mobile carrier
By applying wave absorbing metamaterials on mobile carriers, combining electromagnetic metasurface materials and multi-layer structures to dynamically adjust the wave absorbing function, the problem that traditional coatings cannot adapt to complex electromagnetic environments is solved, and efficient anti-interference ability in complex electromagnetic environments is achieved.
Patent Information
- Application Number
- CN201911324512.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-12-20
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2039-12-20
AI Technical Summary
The electromagnetic wave absorption coatings of traditional mobile carriers cannot adapt to the complex and changeable electromagnetic environment and cannot dynamically deal with changes in the frequency of electromagnetic interference sources, resulting in insufficient anti-interference ability.
The wave absorbing metamaterial is adopted, including electromagnetic metasurface material, the first electromagnetic wave absorbing material and impedance matching material. By embedding lumped elements in the metal microstructure, the absorption peak and absorption frequency band are regulated, and the frequency migration is achieved using the combination of capacitor, inductance and resistance. Combining the multi-layer structure design and the electromagnetic metasurface material functional layer, the wave absorbing function is dynamically adjusted.
It effectively improves the anti-interference ability in complex electromagnetic environments, can dynamically adjust the absorbing frequency, adapt to the variable electromagnetic interference frequency band, and expands the absorbing bandwidth.
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Figure CN113013629B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of materials, and more specifically, to a wave-absorbing metamaterial, a wave-absorbing structural component, and a mobile carrier. Background Art
[0002] In the current complex electromagnetic environment, electromagnetic compatibility performance is a very important indicator. How to achieve good anti-interference capability in complex dynamic electromagnetic environment is of great significance.
[0003] In addition to the difficulties of spraying and maintaining traditional electromagnetic wave absorbing coatings for mobile carriers, they also cannot change their absorption frequency band after being applied to the mobile carrier, and cannot prevent new electromagnetic interference during movement. Therefore, traditional electromagnetic wave absorbing coatings cannot adapt to the complex and changing electromagnetic environment, especially the increasingly frequent electromagnetic spectrum that generates interference, and cannot effectively respond. Therefore, in this complex electromagnetic interference environment, how to cope with the frequency variation of interference sources and design absorbing structures that can dynamically respond to electromagnetic environments is a problem that needs to be solved. Summary of the Invention
[0004] To address the above problems, the present invention provides an absorbing metamaterial, wherein the absorbing metamaterial comprises an electromagnetic metasurface material and a first electromagnetic absorbing material and an impedance matching material superimposed on the front and back surfaces of the electromagnetic metasurface material. The electromagnetic metasurface material is a series connection of a capacitor and an inductor in the equivalent circuit of the absorbing metamaterial, and the first electromagnetic absorbing material and the impedance matching material are both resistors in the equivalent circuit of the absorbing metamaterial.
[0005] In which, one or more metal microstructures are respectively arranged in the electromagnetic metasurface periodic structure, and a lumped element is embedded in each metal microstructure. The migration of the absorption peak and the absorption band is achieved by changing the bias voltage on the lumped element. The metal trace length of each metal microstructure is λ / 50 to λ / 5, and λ is the wavelength of the electromagnetic wave transmitted in the electromagnetic metasurface material.
[0006] Preferably, the impedance matching material includes a glass fiber composite material, an aramid fiber composite material or a quartz fiber composite material, and the first electromagnetic absorbing material includes an absorbing glass fiber composite material, an absorbing polyimide composite material or an absorbing aramid fiber composite material.
[0007] Preferably, the absorbing metamaterial further includes an electromagnetic reflective material superimposed on the first electromagnetic absorbing material, and the electromagnetic reflective material envelops a metal material and a carbon fiber composite material.
[0008] Preferably, the absorbing metamaterial further includes a second electromagnetic absorbing material disposed between the electromagnetic metasurface material and the impedance matching material, and the second electromagnetic absorbing material includes an absorbing glass fiber composite material or an absorbing polyimide fiber composite material.
[0009] Preferably, when the electromagnetic metasurface periodic structure includes only one metal microstructure, the metal microstructure is arranged in the middle region of the electromagnetic metasurface periodic structure.
[0010] Preferably, when the electromagnetic metasurface periodic structure includes a plurality of metal microstructures, the plurality of metal microstructures are respectively arranged in edge corner areas of the electromagnetic metasurface periodic structure.
[0011] Preferably, the lumped element includes a switching diode or a varactor diode.
[0012] In addition, the present invention further provides a wave-absorbing structural component, wherein the wave-absorbing structural component comprises any of the above-mentioned wave-absorbing metamaterials.
[0013] In addition, the present invention also provides a mobile carrier, wherein the mobile carrier includes any of the above-mentioned absorbing metamaterials.
[0014] Furthermore, the present invention also provides an application of any of the above-mentioned absorbing metamaterials in the field of electromagnetic compatibility.
[0015] The technical solution provided by the present invention can adapt to complex and changeable electromagnetic environments. In view of the complex frequency characteristics of electromagnetic interference frequency bands, the present invention combines electromagnetic metasurface materials with functional absorbing substrates to dynamically change the absorption frequency of the absorbing functional structure in a targeted manner, thereby effectively improving the anti-interference ability in complex electromagnetic environments. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 Schematic cross-sectional view of a multi-layer structure included in the wave-absorbing metamaterial in Example 1 of the present invention;
[0017] Figure 2 : is an equivalent circuit diagram of the wave-absorbing metamaterial in Example 1 of the present invention;
[0018] Figure 3 Schematic cross-sectional view of a multi-layer structure included in the wave-absorbing metamaterial in the second embodiment of the present invention;
[0019] Figure 4 Schematic cross-sectional view of a multi-layer structure included in the wave-absorbing metamaterial in the third embodiment of the present invention;
[0020] Figure 5 Schematic diagram of the arrangement structure of multiple metal microstructures included in the electromagnetic metasurface periodic structure of the wave-absorbing metamaterial in an embodiment of the present invention;
[0021] Figure 6 This is an equivalent circuit diagram of the absorbing metamaterial after adding lumped elements to the electromagnetic metasurface material layer in an embodiment of the present invention;
[0022] Figure 7 In the embodiment of the present invention, Figure 5 The multiple metal microstructures in the electromagnetic metasurface periodic structure are applied to Figure 3 Schematic diagram of simulation test results after the multi-layer structure shown;
[0023] Figure 8 Schematic diagram of a second layout structure of multiple metal microstructures included in the electromagnetic metasurface periodic structure of the wave-absorbing metamaterial in an embodiment of the present invention;
[0024] Figure 9 In the embodiment of the present invention, Figure 8 The multiple metal microstructures in the electromagnetic metasurface periodic structure are applied to Figure 3 Schematic diagram of simulation test results after the multi-layer structure shown;
[0025] Figure 10 Schematic diagram of a third layout structure of multiple metal microstructures included in the electromagnetic metasurface periodic structure of the wave-absorbing metamaterial in an embodiment of the present invention;
[0026] Figure 11 In the embodiment of the present invention, Figure 10 The multiple metal microstructures in the electromagnetic metasurface material layer are applied to Figure 4 Schematic diagram of simulation test results after the multi-layer structure shown;
[0027] Figure 12 is the corresponding arch field reflection test curve in the embodiment of the present invention. DETAILED DESCRIPTION
[0028] The following examples may enable those skilled in the art to more fully understand the present invention, but are not intended to limit the present invention in any way.
[0029] Figure 1 Schematic cross-sectional view of the multi-layer structure included in the wave-absorbing metamaterial in Example 1 of the present invention.
[0030] The absorbing metamaterial of the present invention adopts a multi-layer structure design. The absorbing metamaterial includes an electromagnetic metasurface material 1 and a first electromagnetic absorbing material 2 and an impedance matching material 3 superimposed on the front and back surfaces of the electromagnetic metasurface material. The electromagnetic metasurface material 1 is provided as an intermediate layer in the multi-layer structure, and the first electromagnetic absorbing material 2 and the impedance matching material 3 are superimposed on the front and back surfaces of the electromagnetic metasurface material 1. Among them, the electromagnetic metasurface material 1 is a series connection of a capacitor and an inductor in the equivalent circuit of the absorbing metamaterial, and the first electromagnetic absorbing material 2 and the impedance matching material 3 are both resistors in the equivalent circuit of the absorbing metamaterial. Figure 2 shown.
[0031] Figure 2 1 is an equivalent circuit diagram of the wave-absorbing metamaterial in Example 1 of the present invention.
[0032] like Figure 2 As shown, the electromagnetic metasurface material 1 of the absorbing metamaterial is connected in series with a capacitor and an inductor in the equivalent circuit, and plays a regulating role, regulating the capacitance and inductance in the circuit. The first electromagnetic absorbing material 2 and the impedance matching material 3 on both sides of the electromagnetic metasurface material 1 are both resistors in the equivalent circuit, and play a resistive role. The absorbing metamaterial in the first embodiment of the present invention can achieve good absorption of broadband signals at the port through the coordination of capacitance, inductance and resistance, wherein the impedance matching material 3 can achieve good entry of electromagnetic waves from free space into the absorbing structure of the absorbing metamaterial, the electromagnetic metasurface material 1 can be customized to design the material absorption frequency band, and the first electromagnetic absorbing material 2 can effectively reduce vertically incident, large-angle incident electromagnetic waves and surface traveling wave echoes. As shown in FIG. Figure 2 As shown, Z1 is the equivalent impedance of the impedance matching material 3 in the equivalent circuit of the absorbing metamaterial, which is related to the material thickness and electromagnetic parameters. Z2 is the equivalent impedance of the first electromagnetic absorbing material 2 in the equivalent circuit of the absorbing metamaterial.
[0033] Continue reading Figure 1 The impedance matching material 3 includes a glass fiber composite material (such as a fiberglass composite material) or a quartz fiber composite material, specifically including epoxy resin glass fiber prepreg, epoxy resin quartz fiber prepreg, etc. The first electromagnetic absorbing material 2 includes an absorbing composite material, such as an absorbing glass fiber composite material, an absorbing polyimide composite material or an absorbing aramid fiber composite material, specifically including modified epoxy resin glass fiber absorbing prepreg, modified epoxy resin polyimide fiber absorbing composite material, etc.
[0034] Figure 3 Schematic cross-sectional view of the multi-layer structure included in the wave-absorbing metamaterial in the second embodiment of the present invention.
[0035] like Figure 3 As shown, the absorbing metamaterial in the second embodiment of the present invention is Figure 1 On the basis of the electromagnetic absorbing material 2, it also includes an electromagnetic reflective material 4 superimposed on the first electromagnetic absorbing material 2. The specific structure is that the electromagnetic metasurface material 1 is superimposed on one side and the electromagnetic reflective material 4 is superimposed on the other side on the front and back sides of the first electromagnetic absorbing material 2, wherein the electromagnetic reflective material 4 envelops metal materials and carbon fiber composite materials.
[0036] Figure 4 Schematic cross-sectional view of the multi-layer structure included in the wave-absorbing metamaterial in the third embodiment of the present invention.
[0037] like Figure 4 As shown, the absorbing metamaterial in the third embodiment of the present invention is Figure 3 The second electromagnetic absorbing material 5 is further provided between the electromagnetic metasurface material 1 and the impedance matching material 3. Specifically, the electromagnetic metasurface material 1 is stacked on one side and the impedance matching material 3 is stacked on the other side of the second electromagnetic absorbing material 5. The second electromagnetic absorbing material 5 is a composite absorbing material, such as a glass fiber absorbing material or a polyimide fiber absorbing material, specifically a modified epoxy resin glass fiber absorbing material or a modified epoxy resin polyimide fiber absorbing material. The addition of the second electromagnetic absorbing material 5 in the third embodiment of the present invention further expands the absorption bandwidth.
[0038] Figure 5 Schematic diagram of the arrangement structure of multiple metal microstructures included in the periodic structure of one layer of the electromagnetic metasurface of the absorbing metamaterial in an embodiment of the present invention.
[0039] like Figure 5As shown, a periodic structure of an electromagnetic metasurface material layer includes multiple metal microstructures, each of which is disposed at an edge corner region of the electromagnetic metasurface periodic structure. That is, in the embodiment of the present invention, the absorbing metamaterial is provided with four metal microstructures at each of the four corner regions of the electromagnetic metasurface periodic structure, each with a different shape. The four metal microstructures include a first metal microstructure 11, a second metal microstructure 12, a third metal microstructure 13, and a fourth metal microstructure 14. The metal traces of the first metal microstructure 11 are L-shaped, and the first metal microstructure 11 is not connected to the edge of the electromagnetic metasurface material 1. The metal traces of the second metal microstructure 12 are F-shaped, and the second metal microstructure 12 is not connected to the edge of the electromagnetic metasurface material 1. The metal traces of the third metal microstructure 13 are approximately H-shaped, and the third metal microstructure 13 is connected to the edge of the electromagnetic metasurface material 1. The metal traces of the fourth metal microstructure 14 are approximately H-shaped, and the fourth metal microstructure 14 is connected to the edge of the electromagnetic metasurface material 1. The third metal microstructure 13 has the same shape as the fourth metal microstructure 14, and their positions differ by 90 degrees. That is, the fourth metal microstructure 14 is obtained by rotating the third metal microstructure 13 90 degrees clockwise. Furthermore, the first metal microstructure 11, the second metal microstructure 12, the third metal microstructure 13, and the fourth metal microstructure 14 may also have other shapes, as long as the metal trace length of each metal microstructure is between λ / 50 and λ / 5, where λ is the wavelength of the electromagnetic wave transmitted within the electromagnetic metasurface material 1.
[0040] like Figure 5 As shown, a lumped element 15 is embedded in each metal microstructure. The lumped element 15 includes a switching diode or a varactor diode. By integrating the lumped element 15 with the four metal microstructures (11, 12, 13, 14) in the electromagnetic metasurface material layer 1, and then heterogeneously integrating it with the absorbing structure (such as the first electromagnetic absorbing material 2 and the second electromagnetic absorbing material 5), the electromagnetic response characteristics of the electromagnetic metasurface material 1 can be changed by the signal, thereby changing the electromagnetic response characteristics of the entire absorbing structure. The equivalent circuit of the absorbing metamaterial after the lumped element 15 is added to the electromagnetic metasurface material layer 1 is shown as follows: Figure 6 shown.
[0041] Figure 6 FIG4 is an equivalent circuit diagram of the absorbing metamaterial after adding lumped elements to the electromagnetic metasurface material layer in an embodiment of the present invention.
[0042] like Figure 6 As shown, the lumped element 15 can regulate the capacitance and inductance values in the equivalent circuit of the absorbing metamaterial. By changing the bias voltage of the lumped element 15, the absorption peak and absorption band can be shifted.
[0043] Figure 7 In the embodiment of the present invention, Figure 5 The multiple metal microstructures in the electromagnetic metasurface material layer are applied to Figure 3 Schematic diagram of simulation test results after the multi-layer structure is shown.
[0044] Will Figure 5 The multiple metal microstructures in the electromagnetic metasurface material layer are applied to Figure 3 Following the multi-layer structure shown, the absorbing metamaterial comprises four layers: an electromagnetic metasurface material 1, a first electromagnetic absorbing material 2, an impedance matching material 3, and an electromagnetic reflective material 4. Specific structural dimensions include: the thickness of the electromagnetic metasurface material 1 is 0.2 mm, the thickness of the first electromagnetic absorbing material 2 is 1 mm, the thickness of the impedance matching material 3 is 1.8 mm, and the thickness of the electromagnetic reflective material 4 is 0.2 mm, for a total thickness of 3.2 mm. The electromagnetic parameters of the impedance matching material 3 at 10 GHz are: Er' = 3.3, tan δ = 0.017. The electromagnetic parameters of the first electromagnetic absorbing material 2 at 10 GHz are: Er' = 7.8, tan δ = 0.03. The metal microstructures (11, 12, 13, 14) involved in the electromagnetic metasurface material 1 use metal copper conductors with a conductivity of 5.8×10^7S / m. Of course, other metals can also be used, which is not limited here. In addition, the lumped element 15 in the electromagnetic metasurface material 1 is a varactor diode, and the capacitance variation range of the varactor diode is 0.1 to 5pF. At the same time, the metal traces of the first metal microstructure 11 are L-shaped, the metal traces of the second metal microstructure 12 are F-shaped, the metal traces of the third metal microstructure 13 are roughly h-shaped, and the metal traces of the fourth metal microstructure 14 are roughly h-shaped. The common feature of these shapes is that the size of each metal microstructure is related to the wavelength of the electromagnetic wave, specifically 1 / 4 to 1 / 20 of the wavelength. The distance between adjacent metal microstructures affects the mutual capacitance and inductance, thereby affecting the electromagnetic response characteristics. When the electromagnetic wave is vertically incident on the absorbing metamaterial, the parameters of the lumped element 15 are adjusted by external voltage and other signals. The simulation results of the S11 parameters are as follows. Figure 7 As shown, from Figure 7 It can be seen that in the embodiment of the present invention, by changing the bias voltage of the lumped element 15, the absorption peak and the absorption band can be shifted. The absorption peak shifts from 10 GHz to 11 GHz. It can be seen that the present invention combines the absorption multi-layer structure design and the functional layer structure design of the electromagnetic metasurface material, and by adjusting the component parameters, the electromagnetic metasurface material 1 can have different electromagnetic response characteristics, thereby affecting the peak frequency of electromagnetic wave absorption. The use of multiple absorption mechanisms can expand the absorption bandwidth under low-profile conditions. It can be seen that the present invention can dynamically adjust the frequency of electromagnetic wave absorption and realize dynamic frequency adjustment within the X-band.
[0045] Figure 8 Schematic diagram of a second layout structure of multiple metal microstructures included in the electromagnetic metasurface material layer of the wave-absorbing metamaterial in an embodiment of the present invention.
[0046] like Figure 8 As shown, the electromagnetic metasurface material 1 layer of the absorbing metamaterial in the embodiment of the present invention includes four metal microstructures (11, 12, 13, 14) and four lumped elements 15. The four metal microstructures are identical in shape, each with an L-shaped metal trace, and each metal microstructure is not connected to the edge of the electromagnetic metasurface material 1. Furthermore, a lumped element 15 is embedded in each metal microstructure, and the lumped element 15 comprises a switching diode or a varactor diode. By integrating the lumped element 15 with the four metal microstructures (11, 12, 13, 14) in the electromagnetic metasurface material 1 layer, and then heterogeneously integrating it with the absorbing structure (such as the first electromagnetic absorbing material 2 and the second electromagnetic absorbing material 5), the electromagnetic response characteristics of the electromagnetic metasurface material 1 can be modified by a signal, thereby changing the electromagnetic response characteristics of the entire absorbing structure. The lumped element 15 can regulate the capacitance and inductance values in the equivalent circuit of the absorbing metamaterial. By changing the bias voltage of the lumped element 15, the absorption peak and absorption band can be shifted.
[0047] Figure 9 In the embodiment of the present invention, Figure 8 The multiple metal microstructures in the electromagnetic metasurface periodic structure are applied to Figure 3 Schematic diagram of simulation test results after the multi-layer structure is shown.
[0048] Will Figure 8 The multiple metal microstructures in the electromagnetic metasurface periodic structure are applied to Figure 3Following the multi-layer structure shown, the absorbing metamaterial comprises four layers: an electromagnetic metasurface material 1, a first electromagnetic absorbing material 2, an impedance matching material 3, and an electromagnetic reflective material 4. Specific structural dimensions include: the thickness of the electromagnetic metasurface material 1 is 0.2 mm, the thickness of the first electromagnetic absorbing material 2 is 1 mm, the thickness of the impedance matching material 3 is 1.8 mm, and the thickness of the electromagnetic reflective material 4 is 0.2 mm, for a total thickness of 3.2 mm. The electromagnetic parameters of the impedance matching material 3 at 10 GHz are: Er' = 3.3, tan δ = 0.017. The electromagnetic parameters of the first electromagnetic absorbing material 2 at 10 GHz are: Er' = 7.8, tan δ = 0.03. The metal microstructures (11, 12, 13, 14) involved in the electromagnetic metasurface material 1 are made of copper conductors with a conductivity of 5.8×10^7 S / m. Of course, other metals can also be used, and this is not limited here. In addition, the lumped element 15 in the electromagnetic metasurface material 1 is a varactor diode, and the capacitance variation range of the varactor diode is 0.1 to 5 pF. The equivalent capacitance and inductance values are regulated by the lumped element 15. At the same time, the shapes of the first metal microstructure 11, the second metal microstructure 12, the third metal microstructure 13, and the fourth metal microstructure 14 are exactly the same. The metal traces of each metal microstructure are L-shaped, and each metal microstructure is not connected to the edge of the electromagnetic metasurface material 1. The common feature of these shapes is that the size of each metal microstructure is related to the wavelength of the electromagnetic wave, specifically 1 / 4 to 1 / 20 of the wavelength. The distance between adjacent metal microstructures affects the mutual capacitance and inductance, thereby affecting the electromagnetic response characteristics. When the electromagnetic wave is incident vertically on the absorbing metamaterial, the parameters of the lumped element 15 are adjusted by external voltage and other signals. The simulation results of the S11 parameter are as follows: Figure 9 As shown, from Figure 9 It can be seen that in the embodiment of the present invention, by changing the bias voltage of the lumped element 15, the absorption peak and absorption band can be shifted. The absorption peak shifts from 10 GHz to 11 GHz. From this, it can be seen that the present invention combines the absorption multi-layer structure design and the functional layer structure design of the electromagnetic metasurface material, and by adjusting the component parameters, the electromagnetic metasurface material 1 can have different electromagnetic response characteristics, thereby affecting the radar wave absorption frequency peak. The use of multiple absorption mechanisms can expand the absorption bandwidth under low-profile conditions. It can be seen that the present invention can dynamically adjust the frequency of electromagnetic wave absorption and realize dynamic frequency adjustment within the X-band.
[0049] In the above embodiment, when a single periodic electromagnetic metasurface structure includes multiple metal microstructures, a lumped element is embedded in each metal microstructure. By varying the bias voltage across the lumped element, the absorption peak and absorption band shifts, dynamically adjusting the frequency of electromagnetic wave absorption, enabling dynamic frequency adjustment within the X-band. Dynamic frequency adjustment within the X-band can also be achieved when a single periodic electromagnetic metasurface structure includes only one metal microstructure, as described below.
[0050] Figure 10 Schematic diagram of a third layout structure of multiple metal microstructures included in the electromagnetic metasurface periodic structure of the wave-absorbing metamaterial in an embodiment of the present invention.
[0051] like Figure 10 As shown, the electromagnetic metasurface 1 periodic structure of the absorbing metamaterial in the embodiment of the present invention includes five metal microstructures (11, 12, 13, 14, 16) and a lumped element 15. The four metal microstructures (11, 12, 13, 14) are respectively arranged in the four corner areas of the electromagnetic metasurface 1 periodic structure and have exactly the same shape, all L-shaped. The lumped element 15 is embedded in the metal microstructure 16 and is jointly arranged in the middle position of the electromagnetic metasurface 1 periodic structure. The metal microstructure 16 is spiral. In the embodiment of the present invention, adding a spiral microstructure can further improve the absorption capacity under large-angle incidence conditions.
[0052] Will Figure 10 The multiple metal microstructures in the electromagnetic metasurface periodic structure are applied to Figure 4Following the multi-layer structure shown, the absorbing metamaterial comprises five layers: an electromagnetic metasurface material 1, a first electromagnetic absorbing material 2, an impedance matching material 3, an electromagnetic reflective material 4, and a second electromagnetic absorbing material 5. Specific structural dimensions include: the thickness of the electromagnetic metasurface material 1 is 0.2 mm, the thickness of the first electromagnetic absorbing material 2 is 1 mm, the thickness of the second electromagnetic absorbing material 5 is 1 mm, the thickness of the impedance matching material 3 is 1.3 mm, and the thickness of the electromagnetic reflective material 4 is 0.1 mm, for a total thickness of 3.6 mm. The electromagnetic parameters of the impedance matching material 3 at 10 GHz are: Er' = 3.3, tan δ = 0.017. The electromagnetic parameters of the first electromagnetic absorbing material 2 at 10 GHz are: Er' = 7.8, tan δ = 0.03. The metal microstructures (11, 12, 13, and 14) involved in the electromagnetic metasurface material 1 are made of copper conductors with a conductivity of 5.8×10^7 S / m. Of course, other metals can also be used, and this is not limited here. In addition, the lumped element 15 in the electromagnetic metasurface material 1 is a varactor diode, and the capacitance of the varactor diode varies in the range of 0.1 to 5 pF. The equivalent capacitance and inductance values are controlled by the lumped element 15. At the same time, the metal microstructure 16 is a spiral microstructure, with lengths from the center of 1.125, 1.25, 2.25, 2.25, 3.25, 3.25, and 4.125 mm, respectively.
[0053] The inductance of the spiral microstructure can be calculated using the following formula:
[0054]
[0055] where l is the circumference of the helical microstructure and w is the line width of the microstructure, both in m.
[0056] When the electromagnetic wave is incident vertically on the absorbing metamaterial, the parameters of the lumped element 15 are adjusted by external voltage and other signals. The simulation results of the S11 parameter are as follows: Figure 11 As shown, from Figure 11 It can be seen that in the embodiment of the present invention, by changing the bias voltage of the lumped element 15, the absorption peak and absorption frequency band can be shifted, as well as the absorption peak can be changed. From this, it can be seen that the present invention combines the design of the multi-layer structure of absorption and the functional layer structure design of the electromagnetic metasurface material. By adjusting the parameters of the components, the electromagnetic metasurface material 1 can have different electromagnetic response characteristics, thereby affecting the peak frequency of electromagnetic wave absorption. By utilizing multiple absorption mechanisms, the absorption bandwidth can be expanded under low-profile conditions, and the absorption performance under high-angle incidence conditions can be improved. It can be seen that the present invention can dynamically adjust the frequency of electromagnetic wave absorption and realize dynamic frequency adjustment within the X-band.
[0057] Figure 12The curve is a corresponding arc-shaped field reflection test curve in an embodiment of the present invention. The curve shows that the dynamic adjustment of the absorption performance is achieved by selecting different variable capacitance values.
[0058] In addition, the present invention further provides an absorbing structural component, wherein the absorbing structural component comprises any of the above-mentioned absorbing metamaterials. The absorbing structural component provided by the present invention can dynamically adjust the frequency of electromagnetic wave absorption, and can achieve dynamic frequency adjustment within the X-band.
[0059] The present invention also provides a mobile carrier comprising any of the aforementioned absorbing metamaterials. The mobile carrier provided by the present invention can dynamically adjust the frequency of electromagnetic wave absorption, enabling dynamic frequency adjustment within the X-band.
[0060] Furthermore, the present invention also provides an application of any of the above-mentioned absorbing metamaterials in the field of electromagnetic compatibility.
[0061] The technical solution provided by the present invention can adapt to the complex and changeable outdoor electromagnetic environment. In view of the complex and changeable characteristics of the electromagnetic interference frequency in the outdoor environment, the present invention combines the electromagnetic metasurface material with the functional absorbing substrate to dynamically change the absorption frequency of the absorbing functional structure in a targeted manner, thereby effectively improving the anti-interference ability in a complex electromagnetic environment.
[0062] It should be understood by those skilled in the art that the above embodiments are merely exemplary embodiments and that various changes, substitutions, and alterations may be made without departing from the spirit and scope of the present invention.
Claims
1. A wave-absorbing metamaterial, characterized in that: The absorbing metamaterial includes an electromagnetic metasurface material and a first electromagnetic absorbing material and an impedance matching material superimposed on the front and back surfaces of the electromagnetic metasurface material, wherein the electromagnetic metasurface material is a series connection of a capacitor and an inductor in the equivalent circuit of the absorbing metamaterial, and the first electromagnetic absorbing material and the impedance matching material are both resistors in the equivalent circuit of the absorbing metamaterial; One or more metal microstructures are respectively provided in one or more regions of the electromagnetic metasurface material, and a lumped element is embedded in each metal microstructure; the lumped element is used to regulate the capacitance or inductance value in the equivalent circuit of the absorbing metamaterial, and the migration of the absorption peak and the absorption band is achieved by changing the bias voltage on the lumped element. The period length of each metal microstructure is λ / 50 to λ / 5, where λ is the wavelength of the electromagnetic wave transmitted in the electromagnetic metasurface material; Wherein, when the electromagnetic metasurface periodic structure includes a plurality of metal microstructures, the plurality of metal microstructures are respectively arranged in edge corner regions of the electromagnetic metasurface periodic structure, and the shapes of the plurality of metal microstructures are not completely the same.
2. The wave-absorbing metamaterial according to claim 1, wherein: The impedance matching material includes a glass fiber composite material, and the first electromagnetic wave absorbing material is a wave absorbing composite material.
3. The wave-absorbing metamaterial according to claim 1, wherein: The absorbing metamaterial further includes an electromagnetic reflective material superimposed on the first electromagnetic absorbing material, and the electromagnetic reflective material includes a metal material and a carbon fiber composite material.
4. The wave-absorbing metamaterial according to claim 3, wherein: The absorbing metamaterial further includes a second electromagnetic absorbing material disposed between the electromagnetic metasurface material and the impedance matching material, and the second electromagnetic absorbing material is a absorbing composite material.
5. The wave-absorbing metamaterial according to claim 1, wherein: The lumped element includes a switching diode or a varactor diode.
6. The wave-absorbing metamaterial according to any one of claims 1 to 5, characterized in that: It is used in the field of electromagnetic compatibility.
7. A wave absorbing structural component, characterized in that: The wave-absorbing structural component comprises the wave-absorbing metamaterial according to any one of claims 1 to 5.
8. A mobile carrier, characterized in that: The mobile carrier comprises the wave-absorbing metamaterial according to any one of claims 1 to 5.
Citation Information
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