A pre-positioning bearing device and a positioning bearing method

Abstract

A pre-positioning bearing device and a pre-positioning bearing method, wherein the device comprises a bearing, a correcting element and a positioning element; the correcting element is detachably connected to the bearing, and the correcting element is provided with a receiving position for matching the bearing; the bearing is controllably moved along a first direction to make the center of the bearing coincide with the center of the correcting element when the bearing is received in the receiving position; the positioning element is at least three and is distributed around the first direction, and the positioning element is controllably moved along a second direction intersecting the first direction to make the center of a geometric area surrounded by the positioning element coincide with the center of the correcting element after abutting against the edge of the correcting element. By using the correcting element as a reference element, the relative position relationship between the multiple positioning elements is adjusted to realize the correction positioning of the positioning element, so as to determine the center of the area surrounded by each positioning element, make the center of the area coincide with the center of the bearing, and provide protection for the accurate alignment and uniform bearing force between the bearing and the workpiece.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and specifically to a pre-positioning support device and a positioning support method. Background Technology

[0002] As is well known, in the manufacturing and testing of semiconductor devices such as wafers, integrated chips, flat panel display devices, and other micro or precision semiconductor devices, it is usually necessary to use a carrier device (chuck) to provide the necessary support and fixation for the semiconductor device, and then to realize the change of the semiconductor device's posture or work position by transporting the semiconductor device.

[0003] In existing applications, load-bearing devices typically utilize robotic arms or similar gripping devices to move the workpiece to a preset position. The load-bearing device then operates, using methods such as adsorption, clamping, or support to secure and fix the workpiece. However, due to a certain deviation between the movement trajectory of the load-bearing device and the position of the load-bearing action and the workpiece's location, the working surface of the load-bearing device may not perfectly match the stress-bearing surface of the workpiece. This can easily lead to uneven force application, affecting the final load-bearing effect. Taking a wafer as an example, if the center of the load-bearing device's working surface cannot be as close as possible to or overlap with the center of the wafer, it will severely impact the uniformity of force on the wafer. This can cause warping, sagging, or even breakage in localized areas of the wafer, affecting not only the finished wafer quality but also hindering wafer manufacturing and inspection. Summary of the Invention

[0004] The main technical problem solved by this invention is to provide a pre-positioning bearing device and a positioning bearing method using the pre-positioning bearing device, so as to ensure the bearing and fixing of the workpiece by pre-positioning the bearing position.

[0005] According to a first aspect, one embodiment provides a pre-positioning carrier device, comprising:

[0006] A support member that can move controllably along a first direction, the support member being used to fix and support the workpiece;

[0007] A calibration component for matching a workpiece, the calibration component being detachably connected to a carrier component, and the calibration component having a receiving position that matches the carrier component to accommodate the carrier component, such that the center of the carrier component coincides with the center of the calibration component; and

[0008] Positioning elements are used to abut against the edge of the corrector, at least three of which are distributed around a first direction, and the positioning elements are controllably movable along a second direction so that the center of the geometric area enclosed by all the positioning elements coincides with the center of the corrector; wherein the second direction intersects the first direction.

[0009] In one embodiment, the receiving position is a through-hole structure that passes through the correction component, or the receiving position is a groove structure provided in the correction component.

[0010] In one embodiment, the correction member has opposing first and second surfaces, and the receiving position includes a first receiving groove disposed on the first surface and a second receiving groove disposed on the second surface; the shape of the first receiving groove is different from the shape of the second receiving groove, and / or the size of the first receiving groove is different from the size of the second receiving groove.

[0011] In one embodiment, the carrier is a circular or regular polygonal disc structure, and the shape of the storage compartment is the same as the shape of the carrier.

[0012] In one embodiment, the profile of the corrector is circular or a regular polygon.

[0013] In one embodiment, the positioning element includes:

[0014] Support members are used to fix the device in a preset position; and

[0015] An adjusting member is controllably movable along a second direction, and the adjusting member is movably connected to the support member to abut against the edge of the correcting member.

[0016] In one embodiment, the positioning member further includes a driving member, the power output end of which is coupled to an adjusting member to drive the adjusting member to move relative to the support member in a second direction.

[0017] In one embodiment, the system further includes a substrate having a travel through hole for the carrier to move through the substrate in a first direction, and the positioning member is disposed on the substrate and located at the edge of the travel through hole.

[0018] In one embodiment, the carrier includes:

[0019] The supporting substrate moves controllably along a first direction; and

[0020] Multiple vacuum holes are evenly distributed on the bearing surface of the carrier substrate. The vacuum holes are used to communicate with a vacuum source to generate an adsorption force, thereby adsorbing and fixing the workpiece to the carrier substrate.

[0021] In one embodiment, the carrier further includes an annular flange surrounding the edge of the carrier substrate to enclose a vacuum cavity on the carrier substrate; a plurality of vacuum holes are located within the vacuum cavity to generate a negative pressure effect within the vacuum cavity.

[0022] In one embodiment, the carrier further includes a plurality of support protrusions evenly distributed in the vacuum cavity, the height of the annular flange being greater than or equal to the height of the support protrusions, and the vacuum hole being located within a gap formed by at least two adjacent support protrusions, so that the workpiece abuts against the support protrusions when adsorbing the workpiece.

[0023] According to the second aspect, one embodiment provides a positioning and bearing method, which uses the pre-positioning and bearing device described in the first aspect to position and bear a workpiece, including the following steps:

[0024] Control the carrier to move along the first direction to approach the corrector and accommodate the carrier in the storage position;

[0025] Control the positioning elements to move along the second direction so that all the positioning elements abut against the edge of the correction element, thereby making the center of the geometric area enclosed by all the positioning elements coincide with the center of the correction element;

[0026] Control the carrier to move out of the storage position to remove the correction element;

[0027] A workpiece matching the contour shape and size of the correction piece is placed on the positioning piece so that the positioning piece abuts against the edge of the workpiece.

[0028] The carrier is controlled to move along a first direction to approach the workpiece and thus fix the workpiece in place.

[0029] A pre-positioning bearing device according to the above embodiment includes a bearing member, a corrector member, and a positioning member. The corrector member is detachably connected to the bearing member and has a receiving position for matching the bearing member. The bearing member can be controllably moved along a first direction so that when it is received in the receiving position, the center of the bearing member coincides with the center of the corrector member. At least three positioning members are distributed around the first direction, and the positioning members can be controllably moved along a second direction intersecting the first direction so that after abutting against the edge of the corrector member, the center of the geometric area enclosed by the positioning members coincides with the center of the corrector member. By using the corrector member as a reference element, the position of the positioning members can be corrected and positioned by adjusting the relative positional relationship between the multiple positioning members, thereby determining the center of the area enclosed by each positioning member, so that the center of the area coincides with the center of the bearing member, thus ensuring accurate alignment between the bearing member and the workpiece and uniform load application. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structural assembly of a prepositioning bearing device according to one embodiment.

[0031] Figure 2 This is an exploded view of the structure of a prepositioning support device according to one embodiment.

[0032] Figure 3 for Figure 2 A schematic diagram of the structural relationship between the positioning component and related components.

[0033] Figure 4 This is a schematic diagram of the motion trajectory of the positioning element in a pre-positioning bearing device according to one embodiment.

[0034] Figure 5 This is a schematic diagram of the structure of the correction element in a prepositioning bearing device according to one embodiment.

[0035] Figure 6 This is a schematic diagram of the surface structure of the carrier member in a prepositioning carrier device according to one embodiment.

[0036] Figure 7 This is a schematic diagram of the back side structure of the carrier member in a prepositioning carrier device according to one embodiment.

[0037] Figure 8 This is a flowchart of a positioning and bearing method according to one embodiment.

[0038] In the figure: 10, bearing component; 11, bearing base; 12, annular flange; 13, vacuum hole; 14, support protrusion; 15, connecting hole; 20, correction component; 30, positioning component; 31, support component; 32, adjustment component; 32-1, axial part; 32-2, radial part; 40, base plate component; 41, base plate part; 42, protruding ring support part; a, storage position; a1, first storage groove; a2, second storage groove; b, stroke through hole. Detailed Implementation

[0039] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0040] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0041] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0042] The term "center" as used in this article refers to the center of the geometry of each component, which can be the center point or the center line; therefore, "center coincidence" can be understood as the center point or the center line coinciding.

[0043] Example 1

[0044] Please refer to Figures 1 to 7 This embodiment provides a pre-positioning support device, including a support member 10, a correction member 20, and multiple positioning members 30. The support device primarily utilizes the correction member 20 as a reference element to adjust the relative positional relationship between the multiple positioning members 30, ensuring that the center of the area enclosed by the multiple positioning members 30 ultimately coincides with the center of the support member 10, thus achieving the purpose of pre-correcting and positioning the positioning members 30. Later, when the support member 10 supports and fixes the workpiece, the shape and size of the correction member 20 match the workpiece, ensuring that the center of the support member 10 coincides with the center of the workpiece. This ensures that the support member 10 can uniformly apply force to the workpiece, guaranteeing the uniformity of the force on the workpiece. The "workpiece" refers to the object ultimately supported and fixed by the support device, including but not limited to wafers, integrated chips, flat panel display devices, and other miniature, precision semiconductor devices or non-semiconductor components. As a common application of this support device, this embodiment uses a wafer as an example, which will be described below.

[0045] Please see Figure 1 , Figure 2 , Figure 6 and Figure 7The carrier 10 primarily serves to fix and support the wafer. By selecting and controlling the movement state and travel path of the carrier 10, the wafer can be transported (e.g., causing changes in the wafer's position and orientation), realizing wafer transport and wafer transfer between different workstations. The carrier 10 is configured to move controllably along a first direction, such as through a linear drive mechanism or transmission mechanism, so that the carrier 10 has the movement conditions or action performance to approach (or move away from) the calibrator 20 or the wafer. In some embodiments, the carrier 10 is also configured to rotate around the axis of the first direction. It should be noted that the "first direction" can be understood as the arrangement direction between the carrier 10 and the calibrator 20 or the wafer when the carrier device is used. Generally, it refers to the vertical direction or the vertical axis direction.

[0046] Please see Figure 1 , Figure 2 , Figure 4 and Figure 5 The calibrator 20 is mainly used to match the wafer and correct the position of the positioning element 30 to ensure that the center of the area enclosed by the multiple positioning elements 30 coincides with the center of the carrier element 10. This matching relationship between the wafer and the calibrator 20 ensures that the center of the carrier element 10 coincides with the center of the wafer. Generally, since the wafer is usually circular, the outline of the calibrator 20 should be a centrally symmetrical shape, such as a circle or a regular polygon with a center. This establishes a structural matching relationship between the calibrator 20 and the wafer. For example, when the calibrator 30 is a regular polygon, the dimensions of its circumcircle or incircle have a certain linear correspondence with the dimensions of the wafer. Similarly, if the workpiece, including the wafer, is a regular polygon and the calibrator 30 is circular, although their shapes are different, their dimensions still have a linear correspondence. Therefore, the shape of the wafer and the shape of the calibrator 20 can be chosen as either a circle or a regular polygon according to actual needs, and their dimensions can be the same or different. The calibrator 20 is configured to be detachably connected to the carrier 10 so that after the calibrator 20 completes the position calibration and positioning of the positioning element 30, the calibrator 20 can be separated from the carrier 10, thereby creating conditions for the subsequent support and fixation of the wafer by the carrier 10 and the support and positioning of the wafer by the positioning element 30 by removing or removing the calibrator 20.

[0047] In this embodiment, a receiving position a is provided on the calibration component 20, the center of which coincides with the center of the calibration component 20. The receiving position a can be a through-hole structure that penetrates the calibration component 20 along the first direction. This through-hole structure can be a through-hole structure with a constant inner diameter to match wafers of a single size, or it can be a through-hole structure with a variable diameter to match wafers of various sizes. The receiving position a can also be a groove structure formed on the surface of the calibration component 20, or it can be a receiving space formed by several structural components on the calibration component 20. The key point is that the shape and size of the receiving position a should be similar to the shape and size of the carrier component 10. If the support member 10 is a disc structure with a central symmetry such as a circle or regular polygon, the shape (including the size) of the receiving position a should be the same as that of the support member 10. In this way, it is easy to establish a structural matching relationship between the receiving position a and the support member 10, so that after the support member 10 moves along the first direction and approaches the corrector 20, it can be finally accommodated in the receiving position a or fill the structural space of the receiving position a. Then, by utilizing the structural feature that the center of the receiving position a coincides with the center of the corrector 20 and the structural matching relationship between the receiving position a and the support member 10, it is ensured that the center of the support member 10 coincides with the center of the corrector 20.

[0048] Please see Figures 1 to 4The positioning element 30 is mainly used to determine its own position by abutting against the edge of the calibrator 20. Simultaneously, during the process of the carrier device carrying and fixing the wafer, the positioning element 30 also plays a supporting and positioning role for the wafer, so that after the carrier 10 moves along the first direction and approaches the wafer, it can drive the wafer to detach from the positioning element 30, completing the carrying, fixing, and transporting of the wafer. The positioning element 30 is configured to move controllably along the second direction, such as through a drive mechanism, transmission mechanism, etc., in an automatic or manual manner, so that the positioning element 30 has the movement conditions or action performance to approach or move away from the calibrator 20. Therefore, the position of the positioning element 30 when it abuts against the edge of the calibrator 20 can be used as the initial position or reference position of the positioning element 30 after calibration. The number of positioning elements 30 is at least three, and at least three positioning elements 30 are distributed around the first direction so that after all positioning elements 30 are corrected to the aforementioned initial position or reference position, they can be on the same circumferential trajectory (i.e., equivalent to using the positioning elements 30 to jointly construct a geometric region around the first direction), and the center of the circumferential trajectory or geometric region coincides with the center of the correction element 20; as far as the shape of the correction element 20 adopts a centrally symmetric figure, when the outline shape of the correction element 20 is circular, the circumferential trajectory is the outline trajectory of the correction element 20; when the correction element 20 is a regular polygon, if all positioning elements 30 simultaneously abut against the edge of the correction element 20, then the circumferential trajectory at this time is the outline trajectory of the inscribed circle of the correction element 20; if all positioning elements 30 simultaneously abut against the corner of the correction element 20, then the circumferential trajectory at this time is the outline trajectory of the circumscribed circle of the correction element 20.

[0049] In one embodiment, there are four positioning elements 30, arranged in pairs. The two positioning elements 30 in each pair are symmetrically distributed around a first direction. Simultaneously, the two pairs of positioning elements 30 are also symmetrically distributed around the first direction, thus forming a layout where the four positioning elements 30 are arranged around the first direction. In a certain state (i.e., when the edges of the positioning elements 30 and the correction element 20 are touching), the four positioning elements 30 will be on the same circular trajectory. In other embodiments, the positioning elements 30 can be three, four, five, six, or more, or, referring to the aforementioned embodiments, symmetrically or uniformly arranged in groups, or directly arranged around the first direction in a uniform or non-uniform distribution, so that multiple positioning elements 30 can be distributed along the same circular trajectory in a certain state. It should be noted that the second direction intersects with the first direction. If the first direction refers to the up-down direction or the vertical axis direction, the second direction is the horizontal direction or multiple directions such as front, back, left, and right. It can also be understood that the movement direction of each positioning element 30 is defined as the second direction. Based on the layout of the positioning element 30, it is equivalent to the first direction corresponding to at least three second directions distributed around it.

[0050] Based on this, by utilizing the matching relationship between the receiving position a and the carrier 10, it can be ensured that the centers of the carrier 10 and the corrector 20 coincide. Using the corrector 20 as the correction reference for the positioning member 30, the initial or final position of each positioning member 30 can be corrected and positioned when all positioning members 30 simultaneously abut the edge of the corrector 20. This ensures that the center of the area enclosed by each positioning member 30 coincides with the center of the corrector 20. Consequently, after each positioning member 30 is corrected and positioned, the center of the carrier 10 coincides with the center of the area corresponding to the positioning member 30, achieving pre-positioning of each positioning member 30. In later applications, this carrier device only requires removing the corrector 20, and the workpiece can be directly placed... The workpiece is placed on the positioning member 30 to support and position it. Due to the structural matching relationship between the workpiece and the correction member 20, the center of the workpiece will naturally correspond to the center of the support member 30 (e.g., on the same straight line). When the support member 30 is driven to move closer to the workpiece and come into contact with it, the centers of the two will naturally coincide, thereby ensuring that the support member 30 can apply force to the workpiece evenly and maximize the contact area between the two. This effectively avoids a series of problems caused by uneven force on the workpiece, especially avoiding warping, sagging, or even breakage in local areas of the wafer, creating favorable conditions for wafer manufacturing, inspection, and improving the quality of finished wafers.

[0051] In one embodiment, please refer to Figure 2 and Figure 5 The calibrator 20 adopts a disc-shaped structure with a centrally symmetrical outline, thus naturally forming opposing first and second surfaces on the calibrator 20. Correspondingly, the receiving position a adopts a groove structure. The cooperation between the receiving position a and the carrier 10 can constrain the position of the calibrator 20, ensuring precise alignment between the carrier 10 and the calibrator 20 and guaranteeing that their centers coincide, while also preventing positional misalignment between the carrier 10 and the calibrator 20. In this embodiment, the receiving position a includes a first receiving groove a1 disposed on the first surface and a second receiving groove a2 disposed on the second surface. The shape and / or size of the first receiving groove a1 and the second receiving groove a2 can be the same or different. In the illustrated embodiment, the two receiving grooves have the same shape but different sizes, thus matching wafers or other workpieces with the same shape but different sizes. In another embodiment, the shape and size of the first receiving groove a1 are different from those of the second receiving groove a2, so as to match different workpieces and enhance the adaptability of the calibrator 20. Of course, in other embodiments, the first storage slot a1 and the second storage slot a2 have the same shape and size, so that they can not only serve as a backup, but also do not need to be identified and distinguished when applying the calibration member 20.

[0052] Please see Figures 1 to 4 One embodiment provides a prepositioning support device, which further includes a substrate 40. The substrate 40 is mainly used as a carrier for assembling and moving the positioning member 30. The substrate 40 is provided with travel through holes b distributed along a first direction. The travel through holes b are mainly used to allow the support member 10 to move along the first direction and pass through the substrate 40 so that the support member 10 reaches the position that contacts the alignment member 10 or the wafer. The positioning member 30 is arranged on the substrate 40 and located at the edge of the travel through holes b so as to move along the substrate 40 in a second direction. In specific implementation, the carrier 10 can be driven to move from the side of the substrate 40 away from the positioning member 30 along the first direction toward the substrate 40, so that after the carrier 10 passes through the travel through hole b through the substrate 40, it reaches the structural space or area composed of multiple positioning members 30 (of course, the structural space or area at this time may be circular or other geometric shapes). Then, the correction member 20 is stacked on the carrier 10 so that the carrier 10 is accommodated in the storage position a, thereby positioning the correction member 20 so that its center coincides with the center of the carrier 10. Subsequently, each positioning member 30 is driven to move along the second direction on the substrate 40 until each positioning member 30 abuts against the edge of the correction member 20. Finally, the correction member 20 is removed or unloaded to complete the initial or final correction and positioning of each positioning member 30, so that each positioning member 30 is on the same circumferential trajectory, that is, the center of the geometric area enclosed by each positioning member 30 coincides with the center of the correction member 20 and the center of the carrier 10.

[0053] In one embodiment, please refer to Figures 1 to 4 The positioning member 30 includes a support member 31 and an adjusting member 32. The support member 31 is fixed at a preset position, such as on the substrate member 40 in the aforementioned embodiment and located at the edge of the travel through hole b, to provide structural support and guidance for the movement of the adjusting member 32. The adjusting member 32 is a moving component of the positioning member 30, mainly used to determine its final corrected position by abutting against the edge of the corrector 20. The adjusting member 32 and the support member 31 can be connected to each other by referring to existing slide rail modules, lead screw transmission modules, etc., so that by driving the adjusting member 32, it can move relative to the support member 31 in the second direction, thereby moving closer to or away from the corrector 20. At the same time, when the carrying device performs a carrying and fixing operation on the workpiece including the wafer, the adjusting member 32 can also be used to support the workpiece so that after the carrying member 10 contacts and fixes the workpiece, it can drive the workpiece away from the positioning member 30 to realize the carrying of the workpiece.

[0054] In one embodiment, please refer to Figures 1 to 3The base plate 40 mainly consists of a base plate portion 41 and a convex ring support portion 42. The travel through hole b is formed on the base plate portion 41, and the convex ring support portion 42 is disposed around the edge of the travel through hole b. The convex ring support portion 42 is mounted on the base plate portion 42 in a detachable or non-detachable manner. It is mainly used to provide structural assembly space for the positioning member 30 on the base plate portion 41 and to enable the positioning member 30 to be set on the base plate portion 41 at a certain height. As for the positioning member 30, the support member 31 can be a protrusion structure formed on the end face of the convex ring support portion 42 away from the base plate portion 41. The support members 31 of the multiple positioning members 30 are distributed around the center line of the convex ring support portion 42. The adjusting member 32 can adopt an approximately "L" shaped structure, so that it has an axial portion 32-1 distributed parallel to the axial direction of the convex ring support portion 42 and a radial portion 32-2 distributed along the radial direction of the convex ring support portion 42. The radial portion 32-2 and the support member 31 are linearly slidably connected along the radial direction of the convex ring support portion 42 (at this time, this direction is equivalent to the aforementioned second direction). During the positioning and correction process of the positioning member 30, when the carrier member 10 is stored in the storage position a, by manipulating the adjusting member 32 to move along the second direction, one end of the radial portion 32-2 or the axial portion 32-1 can finally abut against the circumferential surface of the correction member 20, thereby realizing the operation of the positioning member 30 abutting against the edge of the correction member 20, that is, achieving the purpose of position correction and positioning of each positioning member 30. In other embodiments, the base plate 40 may be omitted, and the support 31 may be pre-set in a fixed spatial position; or the protruding ring support 42 may be omitted, and a structure that can be movably connected with the adjustment member 32 and can support and guide the adjustment member 32 may be formed directly on the base plate 42.

[0055] In one embodiment, the positioning member 32 further includes a driving member (not shown in the figure). The driving member can be composed of power devices such as micro motors and cylinders, as well as components such as encoders, transmission mechanisms, and sensors, depending on the actual situation. The power output end of the driving member is coupled to the adjusting member 32 to drive the adjusting member 32 to move relative to the convex ring support 42, the base plate 41, etc. in the second direction, thereby realizing the adjustment of the specific position of the adjusting member 32 in an automatic control manner, and finally completing the correction positioning with the cooperation of the correction member 20.

[0056] In one embodiment, please refer to Figure 5 and Figure 6The support member 10 includes a support base 11, an annular flange 12, and multiple vacuum holes 13. The support base 11 is the basic structure of the support member 10 and can be coupled to the power end of a power component such as a linear drive device, so that the entire support member 10 can move controllably in a first direction under the drive of the power component. The annular flange 12 surrounds the edge of the support base 11 to form a vacuum cavity on the support base 11, and the outline shape and size of the structure formed by the annular flange 12 and the support base 11 match the receiving position a, so that it can be accommodated in the receiving position a, and the center of the structure coincides with the center of the corrector 20. The multiple vacuum holes 13 are evenly distributed in... Located on the support substrate 11 and within the vacuum chamber, the vacuum hole 13 is connected to a vacuum source such as a vacuum pump, which generates a negative pressure effect within the area enclosed by the vacuum chamber. This enables the entire support 10 to generate adsorption force. In particular, when workpieces, including wafers, are stacked on the support substrate 11 and the surface of the annular flange 12 abuts against the surface of the workpiece, the vacuum chamber is effectively sealed, thus forming a sealed chamber between the workpiece and the support 10. After the positioning element 30 is corrected and the correction element 20 is removed, the workpiece can be adsorbed and fixed on the support substrate 11 (i.e., on the support 10) based on the principle of vacuum adsorption, thus achieving adsorption-type support and fixation of the workpiece.

[0057] In one embodiment, please refer to Figure 5The carrier 10 also includes a plurality of support protrusions 14 for the workpiece to abut against. The plurality of support protrusions 14 are evenly distributed on the surface of the carrier substrate 11 and located in the vacuum cavity. The end of the support protrusion 14 that contacts the workpiece can be a hemispherical structure to achieve point contact and smooth contact with the workpiece. With the surface of the carrier substrate 11 as a reference, the height of the annular flange 12 is equal to the height of the support protrusions 14, and the vacuum hole 13 is located in the gap formed by at least two adjacent support protrusions 14. Thus, when carrying workpieces including wafers, a gripping device such as a robot can be used to place the workpiece on the carrier 10, so that the surface of the workpiece abuts against both the support protrusions 14 and the annular flange 12. Then, the adsorption force generated by the vacuum hole 13 can be used to make the workpiece firmly abut against the support protrusions 14 and the annular flange 12, thereby completing the adsorption-type carrying and fixing of the workpiece. Using uniformly distributed support protrusions 14 to support the workpiece not only creates conditions for improving the flatness of the carrier 10 itself, but also allows for full-area point contact between the carrier 10 and the workpiece surface, which helps reduce scratches and damage to the workpiece. Simultaneously, the adsorption force generated by the uniformly distributed vacuum holes 13, combined with the support protrusions 14, ensures the uniformity of force on the workpiece, avoiding problems such as warping and sagging in localized areas due to uneven force distribution. This, in turn, helps improve the flatness of the supported workpiece, enabling it to better meet the process requirements of manufacturing and testing procedures. It should be noted that... Figure 2 The carrier 10 shown is a simplified diagram, omitting the support protrusion 14 and vacuum hole 13.

[0058] In another embodiment, the height of the annular flange 12 may also be greater than the height of the supporting protrusion 14. In this case, if the shape of the annular flange 12 is the same as the outline shape and size of the workpiece including the wafer, the workpiece can be pressed down in the direction of the bearing substrate 11 so that the circumferential surface of the workpiece can be attached to the inner circumferential wall of the annular flange 14 and abut against the supporting protrusion 14. Thus, a closed vacuum chamber can be formed between the workpiece and the bearing member 10 to finally complete the bearing and fixing of the workpiece.

[0059] In one embodiment, vacuum holes 13 are distributed throughout the support substrate 11, and the end of the vacuum hole 13 furthest from the annular flange 12 is connected to a vacuum source via a pipe to create conditions for the vacuum hole 13 to generate adsorption force. In another embodiment, please refer to... Figure 6A vacuum pipeline is provided inside the support substrate 11. The vacuum hole 13 extends from the side surface of the support substrate 11 adjacent to the annular flange 12 to the vacuum pipeline. At the same time, a connecting hole 15 is provided on the side surface of the support substrate 11 away from the annular flange 14, so that it can be connected to the vacuum hole 13 through the vacuum pipeline. Thus, the vacuum source can be directly connected to the connecting hole 15 through the pipeline. A complete flow channel can be established between the vacuum hole 13, the vacuum pipeline and the connecting hole 15, so that the vacuum hole 13 can ultimately meet the conditions for generating adsorption force.

[0060] Example 2

[0061] This embodiment provides a positioning and support method, mainly using the pre-positioning and support device of Embodiment 1 to position and support workpieces, including wafers. This embodiment uses a wafer as an example for illustrative purposes; please refer to... Figure 8 and combined Figures 1 to 7 The method includes steps S1 to S5, which are described below.

[0062] Step S1: Control the carrier 10 to move along the first direction to approach the corrector 20, so that the carrier 10 is accommodated in the storage position a.

[0063] In specific implementation, the carrier 10 can be coupled to the power output end of the linear drive device. The linear drive device drives the carrier 10 to move along the first direction and to the spatial position corresponding to the multiple positioning elements 30 (i.e., the spatial area enclosed by the closed-loop trajectory of the multiple positioning elements 30), where it stops and waits. Then, the correction element 20 is stacked on the carrier 10 mechanically or manually, so that the carrier 10 is stored in the storage position a, and the center of the carrier 10 coincides with the center of the correction element 20. In other embodiments, the correction element 20 can be placed on the carrier 10 in advance and stored in the storage position a, so that in subsequent steps, the carrier 10 drives the correction element 20 to move along the first direction and to the spatial position corresponding to the multiple positioning elements 30.

[0064] Step S2: Control the positioning member 30 to move along the second direction so that all positioning members 30 abut against the edge of the correction member 20, thereby making the center of the geometric area enclosed by all positioning members 30 coincide with the center of the correction member 20.

[0065] Specifically, after the carrier 10 is housed in the storage position a, it is equivalent to using the carrier 10 to complete the positioning of the calibrator 20. Utilizing the structural characteristics of the positioning member 30 or configuring corresponding driving components, the positioning member 30 is driven manually or automatically to move towards the calibrator 20 in the second direction until it abuts against the edge of the calibrator 20. At this time, based on the contour shape characteristics of the calibrator 20, each positioning member 30 is placed on a circumferential trajectory distributed around the center of the calibrator 20. It is equivalent to each positioning member 30 forming a geometric region, and the center of this geometric region coincides with the center of the calibrator 20. Thus, the center of the calibrator 20, the center of the carrier 30, and the center of the geometric region coincide as one, completing the preliminary or final correction and positioning of the positioning member 30.

[0066] Step S3: Control the carrier 10 to move out of the storage position a to remove the correction member 20.

[0067] Specifically, removing the carrier 10 from the storage position a or removing the calibrator 20 is a relative operation control or movement method. That is, since the position of the positioning member 30 has been calibrated and positioned, the calibrator 20 can be directly removed to remove it from the entire device, thus moving the carrier 10 out of the storage position a; or the carrier 10 can be moved first to move it out of the storage position a, and then the calibrator 20 can be removed from the entire device. In short, the carrier 10 and the calibrator 20 are separated.

[0068] Step S4: Place the workpiece that matches the contour shape and size of the correction part 10 on the positioning part 30 so that the positioning part 30 abuts against the edge of the workpiece.

[0069] After removing the calibrator 20, since the positions of each positioning element 30 are already determined, a gripping device such as a robotic arm can be used to place the workpiece on each positioning element 30. That is, the workpiece is used to replace the removed calibrator 20, so that each positioning element 30 can abut against the edge of the workpiece to support it. This allows the workpiece to be placed on the movement trajectory of the carrier 10, and the center of the workpiece and the center of the carrier 10 are on the same straight line. Of course, when the shape or size of the calibrator 20 and the workpiece are different, but there is a certain matching relationship between them, such as when the calibrator 20 is a regular polygon and the workpiece is circular, the shape and size of the workpiece will have a certain linear correspondence with the shape and size of the inscribed circle or circumscribed circle of the calibrator 20. In this case, the final calibration and positioning of each positioning element 30 can be achieved by adjusting the displacement of each positioning element 30 in the second direction with the same parameters.

[0070] Step S5: Control the carrier 10 to move along the first direction to get closer to the workpiece and achieve the bearing and fixing of the workpiece.

[0071] After the positioning member 30 is used to support and position the workpiece, the linear drive device drives the carrier member 10 to move along the first direction and approach the workpiece. When the carrier member 10 contacts the workpiece, the workpiece can be fixed on the carrier member 10 by means such as adsorption, thereby completing the support and fixation of the workpiece. Finally, the carrier member 10 can be driven to continue moving along the first direction to drive the workpiece away from the positioning member 30, or the carrier member 10 can be driven to drive the workpiece to rotate (such as rotating around the first direction between the positioning members 30, or transporting the workpiece to other spatial areas for rotation) so that the workpiece can be processed in subsequent processes, such as wafer cutting, scribing, grinding, polishing, defect detection, etc.

[0072] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. A pre-positioning bearing device, characterized in that, include: A support member that can move controllably along a first direction, the support member being used to fix and support the workpiece; A calibration component is used to match a workpiece. The calibration component is detachably connected to a carrier component, and the calibration component has a storage compartment. The shape and size of the storage compartment match the shape and size of the carrier component. The storage compartment is used to accommodate the carrier component so that the center of the carrier component coincides with the center of the calibration component. as well as Positioning elements are used to abut against the edge of the corrector, and there are at least three positioning elements distributed around a first direction; the positioning elements are controllably movable along a second direction so that the center of the geometric area enclosed by all the positioning elements coincides with the center of the corrector; wherein the second direction intersects the first direction.

2. The pre-positioning bearing device as described in claim 1, characterized in that, The receiving position is a through hole structure that passes through the correction component, or the receiving position is a groove structure provided in the correction component.

3. The pre-positioning bearing device as described in claim 2, characterized in that, The corrector has a first surface and a second surface opposite to each other, and the storage position includes a first storage groove disposed on the first surface and a second storage groove disposed on the second surface; the shape of the first storage groove is different from the shape of the second storage groove, and / or the size of the first storage groove is different from the size of the second storage groove.

4. The pre-positioning bearing device as described in claim 1, characterized in that, The support member is a circular or regular polygonal disc structure, and the shape of the storage compartment is the same as that of the support member.

5. The pre-positioning bearing device as described in claim 1, characterized in that, The outline of the correction component is circular or a regular polygon.

6. The pre-positioning bearing device as described in claim 1, characterized in that, The positioning element includes: Support members are used to fix the device in a preset position; and An adjusting member is controllably movable along a second direction, and the adjusting member is movably connected to the support member to abut against the edge of the correcting member.

7. The pre-positioning bearing device as described in claim 6, characterized in that, The positioning element also includes a driving element, the power output end of which is coupled to an adjusting element to drive the adjusting element to move relative to the support element in a second direction.

8. The pre-positioning bearing device as described in claim 1, characterized in that, It also includes a base plate having a travel through hole for the carrier to move through the base plate in a first direction, and the positioning member is arranged on the base plate and located at the edge of the travel through hole.

9. The pre-positioning bearing device as described in claim 1, characterized in that, The carrier includes: The supporting substrate moves controllably along a first direction; and Multiple vacuum holes are evenly distributed on the bearing surface of the carrier substrate. The vacuum holes are used to communicate with a vacuum source to generate an adsorption force, thereby adsorbing and fixing the workpiece to the carrier substrate.

10. The pre-positioning bearing device as described in claim 9, characterized in that, The carrier also includes an annular flange, which surrounds the edge of the carrier substrate to form a vacuum cavity on the carrier substrate; a plurality of vacuum holes are located in the vacuum cavity to generate a negative pressure effect in the vacuum cavity.

11. The pre-positioning bearing device as described in claim 10, characterized in that, The carrier also includes a plurality of support protrusions evenly distributed in the vacuum cavity. The height of the annular flange is greater than or equal to the height of the support protrusions, and the vacuum hole is located in the gap formed by at least two adjacent support protrusions, so that the workpiece abuts against the support protrusions when adsorbing the workpiece.

12. A positioning and bearing method, characterized in that, Positioning and supporting a workpiece using the pre-positioning bearing device as described in any one of claims 1-11 includes the following steps: Control the carrier to move along the first direction to approach the corrector and accommodate the carrier in the storage position; Control the positioning elements to move along the second direction so that all the positioning elements abut against the edge of the correction element, thereby making the center of the geometric area enclosed by all the positioning elements coincide with the center of the correction element; Control the carrier to move out of the storage position to remove the correction element; A workpiece matching the contour shape and size of the correction piece is placed on the positioning piece so that the positioning piece abuts against the edge of the workpiece. The carrier is controlled to move along a first direction to approach the workpiece and thus fix the workpiece in place.

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