A dual-light pod

Abstract

The present invention discloses a dual-optical pod, which relates to the technical field of unmanned aerial vehicles. It includes an infrared thermal imaging camera, and the infrared thermal imaging camera includes an infrared module, an image processing board, a decoding board, a core processing board, and an interface board. The image processing board is arranged on the upper side of the infrared module, the decoding board is arranged on the lower side of the infrared module, the core processing board is arranged on the left side of the infrared module, and the interface board is arranged on the rear side of the infrared module. The four circuit boards surround the infrared module to form a small rectangular camera module. Compared with the traditional method of integrating the circuit boards uniformly at the rear of the module, the volume is smaller, so the volume of the dual-optical pod is reduced; at the same time, the size of the externally wrapped infrared thermal imaging camera is relatively consistent with that of the visible light camera, which is convenient for the overall design of the dual-optical pod and improves the space utilization rate inside the pod.

Description

Technical Field

[0001] The present invention relates to the technical field of unmanned aerial vehicles, and particularly to a dual - optical pod. Background Art

[0002] In recent years, small unmanned aerial vehicles have developed rapidly in both military and civilian fields. Due to the limitations of small - sized unmanned aerial vehicles in terms of internal space, load capacity, endurance, etc., the demand for miniaturized and lightweight optoelectronic payloads is becoming increasingly urgent.

[0003] An optoelectronic pod is an airborne optoelectronic device for unmanned aerial vehicles. Existing dual - optical optoelectronic pods mainly include optoelectronic pods containing infrared and visible light cores. Visible light is used for daytime reconnaissance, and infrared thermal imaging is used for reconnaissance at night or under low - illumination conditions. However, the housing of existing dual - optical pods is mainly designed as a sphere close to a spherical shape or a combination of a sphere and a square, with a relatively large overall size; its ventilation system does not have a separate air duct, and usually uses heat sinks for heat dissipation, which is prone to damage the internal cores and circuit boards under conditions of dust and water mist. At the same time, using heat sinks for heat dissipation results in a relatively large overall weight of the pod; due to the relatively complex coordination algorithm between the circuit boards of infrared thermal imaging, the circuit boards of the infrared thermal imaging core are all at the rear of the core, resulting in a relatively large overall volume of the core, thus limiting the volume of the optoelectronic pod. Summary of the Invention

[0004] Therefore, the present invention provides a dual - optical pod to solve the problem of the relatively large volume of existing optoelectronic pods.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A dual - optical pod includes an infrared thermal imaging camera. The infrared thermal imaging camera includes an infrared module, an image processing board, a decoding board, a core processing board, and an interface board. The image processing board is arranged on the upper side of the infrared module, the decoding board is arranged on the lower side of the infrared module, the core processing board is arranged on the left side of the infrared module, and the interface board is arranged on the rear side of the infrared module.

[0007] Further, the infrared module includes an infrared lens, an infrared sensor board, and an infrared interface board. The infrared lens is arranged on the front side of the infrared sensor board, and the infrared interface board is arranged on the rear side of the infrared sensor board.

[0008] Further, the dual - optical pod further includes a visible light camera, and the visible light camera is arranged on the right side of the infrared module.

[0009] Further, the dual - optical pod further includes a fixing frame and a housing. The visible light camera and the infrared thermal imaging camera are arranged inside the fixing frame. The upper and lower sides of the fixing frame have mounting holes, and the fixing frame is arranged inside the housing through the mounting holes.

[0010] Further, the dual-optical pod further includes a plurality of heat sinks and air duct baffles. The plurality of heat sinks are evenly spaced and disposed on the upper side of the fixing frame. The air duct baffle is disposed on the upper side of the heat sink to form a heat dissipation air duct. The length direction of the heat sink is the same as the air flow direction in the heat dissipation air duct. The housing is provided with an air inlet and an air outlet. The air inlet is disposed on the front side of the housing, and the air outlet is disposed on the rear side of the housing. One end of the heat dissipation air duct communicates with the air inlet, and the other end of the heat dissipation air duct communicates with the air outlet.

[0011] Further, the housing has a spherical structure. The left and right sides of the housing have convex structures. The convex structure includes a planar convex and a curved convex. The curved convex is disposed on the front and rear sides of the planar convex.

[0012] Further, the housing includes a front housing and a rear housing. The front housing has an air inlet and an air inlet duct. The air inlet is disposed on the upper side of the front housing. The air inlet duct communicates with the air inlet and is disposed inside the front housing. The rear housing has an air outlet and an air outlet duct. The air outlet is disposed on the upper side of the rear housing. The air outlet duct communicates with the air outlet and is disposed inside the rear housing. One end of the heat dissipation air duct communicates with the air inlet duct, and the other end of the heat dissipation air duct communicates with the air outlet duct.

[0013] Further, a fan is provided at one end of the air outlet duct close to the heat dissipation air duct.

[0014] The present invention has the following advantages: The four circuit boards surround the infrared module to form a small rectangular camera movement. Compared with the traditional method of integrating the circuit boards at the rear of the movement, the volume is smaller, so the volume of the dual-optical pod is reduced. At the same time, the size of the externally wrapped infrared thermal imaging camera is relatively consistent with that of the visible light camera, which is convenient for the overall design of the dual-optical pod and improves the space utilization rate inside the pod. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only exemplary, and for those of ordinary skill in the art, without creative efforts, other implementation drawings can be obtained according to the provided drawings.

[0016] The structures, ratios, sizes, etc. shown in this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical essential significance. Any modification of the structure, change of the ratio relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention.

[0017] Figure 1Schematic diagram of the overall structure of a dual - optical pod provided by the specific embodiment of the present invention;

[0018] Figure 2 Schematic diagram of the structure of the infrared thermal imaging camera of a dual - optical pod provided by the specific embodiment of the present invention;

[0019] Figure 3 Schematic diagram of the structure of the housing of a dual - optical pod provided by the specific embodiment of the present invention;

[0020] Figure 4 Schematic diagram of the structure of the heat dissipation air duct of a dual - optical pod provided by the specific embodiment of the present invention;

[0021] Figure 5 Schematic diagram of the convex structure of the housing of a dual - optical pod provided by the specific embodiment of the present invention.

[0022] In the figure: 1 - infrared thermal imaging camera; 11 - infrared module; 12 - image processing board; 13 - decoding board; 14 - core processing board; 15 - interface board; 2 - visible - light camera; 3 - fixing bracket; 31 - mounting hole; 32 - heat dissipation air duct; 33 - heat sink; 34 - air duct baffle; 41 - front housing; 411 - air inlet; 412 - air inlet duct; 42 - rear housing; 421 - air outlet; 422 - air outlet duct; 423 - fan; 43 - planar convexity; 44 - arc - shaped convexity. Specific embodiment

[0023] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0024] Terms such as "upper", "lower", "left", "right", "middle" cited in this specification are only for the convenience of clear narration, rather than to limit the scope of implementation of the present invention. Changes or adjustments in their relative relationships, without substantial changes in the technical content, should also be regarded as within the scope of implementation of the present invention.

[0025] Such as Figure 1 And Figure 2As shown in the figure, the specific embodiment of the present invention provides a dual - light pod, which includes an infrared thermal imaging camera 1. The infrared thermal imaging camera 1 includes an infrared module 11, an image processing board 12, a decoding board 13, a core processing board 14, and an interface board 15. The image processing board 12 is arranged on the upper side of the infrared module 11, the decoding board 13 is arranged on the lower side of the infrared module 11, the core processing board 14 is arranged on the left side of the infrared module 11, and the interface board 15 is arranged on the rear side of the infrared module 11. The four circuit boards surround the infrared module 11 to form a small rectangular movement. Compared with the traditional way of integrating circuit boards at the rear of the movement, the volume is smaller; at the same time, the size of the externally - wrapped infrared thermal imaging camera 1 is relatively consistent with that of the visible - light camera 2, which is convenient for the overall design of the dual - light pod and improves the space utilization rate inside the pod.

[0026] In a preferred embodiment, the infrared module 11 includes an infrared lens, an infrared sensor board, and an infrared interface board. The infrared lens is arranged on the front side of the infrared sensor board, and the infrared interface board is arranged on the rear side of the infrared sensor board. This reduces the occupied space and improves the space utilization rate inside the pod.

[0027] In a preferred embodiment, as Figure 1 shown, the dual - light pod further includes a visible - light camera 2, and the visible - light camera 2 is arranged on the right side of the infrared module 11. This reduces the occupied space and improves the space utilization rate inside the pod. Moreover, it integrates visible light and infrared. Whether it is day or night, it can clearly present the target object and ensure that the target is accurately located.

[0028] In a preferred embodiment, as Figure 1 shown, the dual - light pod further includes a fixing frame 3 and a housing. The visible - light camera 2 and the infrared thermal imaging camera 1 are arranged inside the fixing frame 3. The upper and lower sides of the fixing frame 3 have mounting holes 31, and the fixing frame 3 is arranged inside the housing through the mounting holes 31. The fixing frame 3 can be designed to have high strength. The fixing frame 3 can improve the overall stiffness performance of the visible - light camera 2 and the infrared thermal imaging camera 1. The housing of the dual - light pod can be designed to be easily crushed and deformed during impact, so as to have a buffering and energy - absorbing effect, used to absorb the impact force and reduce the impact on the visible - light camera 2 and the infrared thermal imaging camera 1 during impact.

[0029] In a preferred embodiment, as Figure 4As shown in the figure, the dual - light pod further includes a plurality of heat sinks 33 and air duct baffles 34. The plurality of heat sinks 33 are evenly spaced and arranged on the upper side of the fixing frame 3. The air duct baffle 34 is arranged on the upper side of the heat sink 33 to form a heat dissipation air duct 32. The length direction of the heat sink 33 is the same as the air flow direction in the heat dissipation air duct 32. The housing is provided with an air inlet 411 and an air outlet 421. The air inlet 411 is arranged on the front side of the housing, and the air outlet 421 is arranged on the rear side of the housing. One end of the heat dissipation air duct 32 is connected to the air inlet 411, and the other end of the heat dissipation air duct 32 is connected to the air outlet 421. Having a plurality of heat sinks 33 on the upper side of the fixing frame 3 takes up less space compared with the prior art method of attaching the heat sinks 33 to the circuit board. The heat sink 33 can be a metal block such as copper or aluminum, or a thermally conductive polymer composite material. The fixing frame 3 transfers the heat dissipated by the infrared thermal imaging camera 1 and the visible - light camera 2 to the heat sink 33, and the heat dissipation effect is good.

[0030] In a preferred embodiment, as Figure 5 shown in the figure, the main body of the housing is in a spherical structure. The left and right sides of the housing have protruding structures, and the protruding structures include a planar protrusion 43 and a curved - surface protrusion 44. The curved - surface protrusion 44 is arranged on the front side and the rear side of the planar protrusion 43. The spherical structure of the main body of the housing can reduce the wind resistance of the housing, improve the wind resistance, and make the drone have less resistance and less energy consumption during flight. The left and right sides of the housing have protruding structures, and the curved - surface protrusion 44 is arranged on the front side and the rear side of the planar protrusion 43, so that the left and right sides of the fixing frame 3 can be accommodated inside the planar protrusion 43 and the curved - surface protrusion 44. Therefore, the spherical main body of the housing can have a smaller diameter, thereby reducing the volume of the dual - light pod and improving the space utilization rate inside the pod.

[0031] In a preferred embodiment, as Figure 1 shown in the figure, the housing includes a front shell 41 and a rear shell 42. The front shell 41 has an air inlet 411 and an air inlet duct 412. The air inlet 411 is arranged on the upper side of the front shell 41, and the air inlet duct 412 is connected to the air inlet 411 and arranged inside the front shell 41. The rear shell 42 has an air outlet 421 and an air outlet duct 422. The air outlet 421 is arranged on the upper side of the rear shell 42, and the air outlet duct 422 is connected to the air outlet 421 and arranged inside the rear shell 42. One end of the heat dissipation air duct 32 is connected to the air inlet duct 412, and the other end of the heat dissipation air duct 32 is connected to the air outlet duct 422. In the prior art, attaching the heat sink 33 to the circuit board not only increases the weight of the entire pod due to the addition of the heat sink 33, but also allows the air path to enter the interior of the pod, damaging the internal electronic components. In this solution, the air path avoids the core and the circuit board, preventing damage to the internal electronic components in harsh environments such as dust and water mist.

[0032] In a preferred embodiment, as Figure 3As shown, one end of the air outlet duct 422 close to the heat dissipation duct 32 is provided with a fan 423, which increases the air flow rate and enhances the heat dissipation effect.

[0033] Although the present invention has been described in detail with general descriptions and specific embodiments above, on the basis of the present invention, some modifications or improvements can be made, which are obvious to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection required by the present invention.

Claims

1. A dual-light pod, characterized in that: It includes an infrared thermal imaging camera (1), and the infrared thermal imaging camera (1) includes an infrared module (11), an image processing board (12), a decoding board (13), a core processing board (14) and an interface board (15). The image processing board (12) is arranged on the upper side of the infrared module (11), the decoding board (13) is arranged on the lower side of the infrared module (11), the core processing board (14) is arranged on the left side of the infrared module (11), and the interface board (15) is arranged on the rear side of the infrared module (11); The infrared module (11) includes an infrared lens, an infrared sensor board and an infrared interface board. The infrared lens is arranged on the front side of the infrared sensor board, and the infrared interface board is arranged on the rear side of the infrared sensor board; The dual-light pod further includes a visible light camera (2), and the visible light camera (2) is arranged on the right side of the infrared module (11); The dual-light pod further includes a fixing frame (3) and a housing. The visible light camera (2) and the infrared thermal imaging camera (1) are arranged inside the fixing frame (3). The upper and lower sides of the fixing frame (3) have mounting holes (31), and the fixing frame (3) is arranged inside the housing through the mounting holes (31); The dual-light pod further includes a plurality of heat sinks (33) and air duct baffles (34). The plurality of heat sinks (33) are arranged on the upper side of the fixing frame (3) at equal intervals. The air duct baffle (34) is arranged on the upper side of the heat sink (33) to form a heat dissipation air duct (32). The length direction of the heat sink (33) is the same as the air flow direction in the heat dissipation air duct (32). The housing is provided with an air inlet (411) and an air outlet (421). The air inlet (411) is arranged on the front side of the housing, and the air outlet (421) is arranged on the rear side of the housing. One end of the heat dissipation air duct (32) communicates with the air inlet (411), and the other end of the heat dissipation air duct (32) communicates with the air outlet (421); The housing is in a spherical structure. The left and right sides of the housing have convex structures, and the convex structures include a planar convex (43) and a curved convex (44). The curved convex (44) is arranged on the front side and the rear side of the planar convex (43); The housing includes a front housing (41) and a rear housing (42). The front housing (41) has the air inlet (411) and the air inlet duct (412). The air inlet (411) is provided on the upper side of the front housing (41). The air inlet duct (412) communicates with the air inlet (411) and is provided inside the front housing (41). The rear housing (42) has an air outlet (421) and an air outlet duct (422). The air outlet (421) is provided on the upper side of the rear housing (42). The air outlet duct (422) communicates with the air outlet (421) and is provided inside the rear housing (42). One end of the heat dissipation duct (32) communicates with the air inlet duct (412), and the other end of the heat dissipation duct (32) communicates with the air outlet duct (422).

2. The dual-light pod according to claim 1, wherein: One end of the air outlet duct (422) close to the heat dissipation duct (32) is provided with a fan (423).

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