Shaft seal structure and semiconductor device

Abstract

This invention provides a shaft sealing structure and a semiconductor device. The shaft sealing structure includes: a base with through-holes at both ends; a moving shaft assembled in the mounting holes; a gap between the outer wall of the moving shaft and the inner wall of the mounting holes; and a venting pipe within the moving shaft, having an inlet end and an outlet end. The inlet end is connected to an air supply source, and the outlet end is connected to the gap. This invention, through the venting pipe, forms an airtight seal in the gap between the moving shaft and the base, which helps prevent waste liquids and gases from diffusing through the gap and causing cross-contamination. Introducing this sealing structure into a semiconductor device prevents the process chamber from communicating with the outside through the gap, especially in wet processing equipment. This prevents impurities, waste gases, waste liquids, and corrosive liquids from entering the gap and prevents these waste gases and liquids from diffusing to the outside and causing corrosion to other components or equipment in the semiconductor device.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment manufacturing, and in particular relates to a shaft sealing structure and semiconductor equipment. Background Technology

[0002] In advanced semiconductor manufacturing processes, lifting mechanisms are typically used to facilitate the process. During the lifting process, gases or liquids can easily flow or diffuse between the process chamber and the outside environment through the gap between the lifting mechanism's motion shaft and the base of the assembly motion shaft, causing mutual interference. Furthermore, wet processing for wafer fabrication is increasingly widely used in advanced semiconductor manufacturing processes. Various chemical liquids are used in these wet processing steps, many of which are toxic and hazardous. Therefore, baffles can be installed on wet processing equipment to prevent the diffusion and splashing of chemical liquids. However, the lifting mechanism of the baffle, especially the motion shaft that drives the baffle up and down, has a clearance fit with the process chamber. Small amounts of chemical liquids or gases can easily diffuse out of the process chamber through this gap, causing corrosion to other components or equipment. Effectively sealing these gaps to solve the problems of contamination and corrosion is difficult.

[0003] Therefore, it is necessary to provide a shaft sealing structure and a semiconductor device to solve the above problems. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a shaft sealing structure and a semiconductor device to solve the problems of pollution and damage caused by the flow of waste gas and waste liquid in the gap between the moving shaft and the base in the prior art.

[0005] To achieve the above and other related objectives, the present invention provides a shaft seal structure, the shaft seal structure comprising:

[0006] A base having through mounting holes running vertically through it;

[0007] A motion shaft is assembled in the mounting hole, and there is a gap between the outer wall of the motion shaft and the inner wall of the mounting hole;

[0008] A venting pipe is provided inside the motion shaft. The venting pipe has an inlet end and an outlet end. The inlet end is connected to an air supply source, and the outlet end is connected to the gap, so as to introduce gas into the gap through the venting pipe and form an air seal in the gap.

[0009] Optionally, a bushing is installed on the inner wall of the mounting hole, and a gap is formed between the outer wall of the motion shaft and the bushing to form the gap.

[0010] Optionally, the motion shaft is connected to a drive device, which drives the motion shaft to move up and down within the base.

[0011] Optionally, during the up-and-down movement of the motion shaft, the air outlet of the vent pipe is always located within the mounting hole.

[0012] Optionally, the outer wall of the motion shaft is provided with a ventilation ring groove, which is arranged along the circumference of the motion shaft and connected to the outlet end of the ventilation pipe.

[0013] Optionally, the top side of the venting ring groove is inclined outward from bottom to top to form an air guiding slope, and / or the bottom side of the venting ring groove is inclined outward from top to bottom to form an air guiding slope.

[0014] Optionally, multiple ventilation ring grooves are provided, and the multiple ventilation ring grooves are arranged at equal intervals along the axial direction of the motion shaft.

[0015] Optionally, the motion shaft is provided with a plurality of vent holes for connecting the vent ring groove and the vent pipe, and the plurality of vent holes are evenly distributed along the circumference of the motion shaft.

[0016] The present invention also provides a semiconductor device, the semiconductor device comprising:

[0017] The process cavity has a base, and the base has a through mounting hole.

[0018] A lifting mechanism, mounted on the base, includes:

[0019] A motion shaft is assembled in the mounting hole, and there is a gap between the outer wall of the motion shaft and the inner wall of the mounting hole, the gap being in communication with the internal atmosphere of the process cavity;

[0020] A ventilation pipe is provided inside the motion shaft. The ventilation pipe has an inlet end and an outlet end. The inlet end is connected to an air supply source, and the outlet end is connected to the gap, so as to introduce gas into the gap through the ventilation pipe and form an air seal in the gap.

[0021] A drive device is used to drive the motion shaft to move up and down within the mounting hole.

[0022] Optionally, the semiconductor device further includes:

[0023] A wafer stage is disposed on the base and located within the process cavity;

[0024] A baffle, connected to the motion shaft, is arranged around the periphery of the wafer stage. The motion shaft drives the baffle to move up and down above the base.

[0025] Optionally, the semiconductor device further includes a liquid collection tank, which is formed on the base and located around the wafer stage, and the baffle moves up and down above the liquid collection tank.

[0026] Optionally, the number of liquid collection tanks and the number of flow deflectors are one or more, and the flow deflectors correspond one-to-one with the liquid collection tanks. The two or more liquid collection tanks are arranged sequentially along the radial direction of the base, and the motion shaft connected to the flow deflector corresponding to the liquid collection tank is set in the tank wall of each liquid collection tank on the side away from the wafer stage.

[0027] As described above, the shaft sealing structure of the present invention forms an air seal in the gap between the moving shaft and the base through the arrangement of the vent pipe. This helps to prevent waste liquid, waste gas, etc. from spreading through the gap and causing mutual contamination. In addition, the introduction of the above sealing structure into semiconductor equipment can prevent the process chamber from communicating with the outside through the gap. Especially in wet processing equipment, it can prevent impurities, waste gas, waste liquid, corrosive liquid, etc. from entering the gap and prevent the above impurities, waste gas, waste liquid, corrosive liquid, etc. from spreading to the outside and causing corrosion to other components or other equipment of the semiconductor equipment. Attached Figure Description

[0028] Figure 1(a) shows a cross-sectional schematic diagram of a shaft seal structure according to an example of the present invention.

[0029] Figure 1(b) shows a cross-sectional schematic diagram of a shaft seal structure with two ventilation lines in an example of the present invention.

[0030] Figure 1(c) shows a cross-sectional schematic diagram of a shaft seal structure with a venting ring groove and a venting hole in an example of the present invention.

[0031] Figure 1(d) shows a cross-sectional view of the structure in Figure 1(c) from another perspective.

[0032] Figure 2 The diagram shows the connection between the motion axis and the drive device of the present invention.

[0033] Figure 3 The image shown is a perspective view of the semiconductor device of the present invention.

[0034] Figure 4 This is a perspective view of the semiconductor device of the present invention from another angle.

[0035] Figure 5 The diagram shows the structure of the semiconductor device of the present invention when both the inner and outer baffles are raised.

[0036] Figure 6 Displayed as Figure 5 A magnified view of region B in the middle.

[0037] Figure 7 The diagram shows the structure of the semiconductor device of the present invention when the outer baffle rises and the inner baffle descends.

[0038] Figure 8 The diagram shows the structure of the semiconductor device of the present invention when both the inner and outer baffles are lowered.

[0039] Component designation explanation

[0040] 101, 200 base

[0041] 102 motion axes

[0042] 102a Air vent

[0043] Gap between 103 and 215

[0044] 104, 211 Ventilation lines

[0045] 104a intake end

[0046] 104b Exhaust end

[0047] 105, 214 bushings

[0048] 106, 216 Ventilation ring grooves

[0049] 106a, 106b gas guide slope

[0050] Vent holes 107 and 217

[0051] 108, 205, 212 cylinders

[0052] 109, 213 Installation Platform

[0053] 201 Process Chamber

[0054] 202 Outer fairing

[0055] 203 External Lifting Mechanism

[0056] 204 Internal Lifting Mechanism

[0057] 206 Inner fairing

[0058] 207 External collection tank

[0059] 208 Internal collection tank

[0060] 209 Wafer Stage

[0061] 210 Internal motion axis

[0062] 218 External motion axis Detailed Implementation

[0063] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0064] Please see Figures 1(a) to 8 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Although the illustrations only show components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation, the shape, quantity and proportion of each component in the actual implementation can be arbitrarily changed, and the layout of the components may also be more complex.

[0065] Example 1

[0066] like Figure 1(a)-1(d) and Figure 2 As shown, the present invention provides a shaft sealing structure, wherein the shaft sealing structure includes a base 101 and a moving shaft 102. The base 101 has a through mounting hole and is used to mount the moving shaft 102. The base 101 can be the basic structure of any device, and other components can also be mounted on the base 101.

[0067] The shaft sealing structure further includes a moving shaft 102, which is fitted into the mounting hole of the base 101. A gap 103 exists between the outer wall of the moving shaft 102 and the inner wall of the mounting hole. In one example, the gap 103 is an annular gap, meaning that for the portion of the moving shaft 102 located within the base 101, there is a distance between the outer wall of the moving shaft 102 and the inner wall of the mounting hole. Optionally, the distance between the two gaps is equal at all positions of the moving shaft 102 corresponding to the inner wall of the mounting hole, thereby forming a uniform annular gap around the moving shaft 102 and the base 101, resulting in a clearance fit between the moving shaft 102 and the base 101. Of course, in other examples, a portion of the outer wall of the moving shaft 102 may contact the inner wall of the mounting hole, and the gap 103 between them may connect the upper and lower sides of the base 101. This should not unduly limit the scope of protection of the present invention.

[0068] As an example, a bushing 105 is installed on the inner wall of the mounting hole, and a gap 103 is formed between the outer wall of the motion shaft 102 and the bushing 105. The bushing 103 protects the motion shaft 102 and may be made of a wear-resistant material, which helps prevent damage to the motion shaft 102 caused by friction during movement of the base 101. The bushing 105, as a wear-bearing component, can be replaced after wear.

[0069] In addition, the shaft sealing structure also includes a vent pipe 104, which is opened inside the moving shaft 102. The vent pipe 104 has an inlet end 104a and an outlet end 104b. The inlet end 104a is connected to an air supply source (not shown in the figure). The inlet end 104a can be an opening at one end of the vent pipe 104, which is directly connected to the air supply source through a pipe. The outlet end 104b is connected to the gap 103 to introduce gas into the gap 103 and form an air seal in the gap 103. In the above manner, gas can be filled between the outer wall of the motion shaft 102 and the corresponding position of the base 101, thereby achieving a seal between the two and preventing impurities, corrosive liquids or gases in the process from entering the gap 103. This also prevents gas or liquid on the upper and lower sides of the base 101 from diffusing through the gap 103. The gas forming the gas seal, that is, the gas supplied by the gas supply source connected to the gas inlet 104a, can be selected according to actual conditions. For example, it can be nitrogen, but it is not limited to this.

[0070] Referring to Figure 1(a), one ventilation pipe 104 can be provided. The air outlet 104b of the ventilation pipe 104 consists of several air guide holes 102a directly opened on the motion shaft 102, connecting the gap 103 and the ventilation pipe 104. The several air guide holes 102a can be arranged at equal intervals along the circumference of the motion shaft 102 to allow the gas to be introduced into the gap 103 more evenly. Preferably, the air guide holes 102a are cylindrical holes.

[0071] As an example, at least two ventilation pipes 104 may be provided. Figure 1(b) shows a cross-sectional view of at least two ventilation pipes 104 within the motion shaft 102. When there are two or more ventilation pipes 104, each ventilation pipe 104 is arranged parallel to the axial direction of the motion shaft 102, that is, multiple ventilation pipes 104 are provided inside the motion shaft 102 for gas delivery. Preferably, the multiple ventilation pipes 104 are arranged in a circumferential array inside the motion shaft 102 in the axial direction surrounding the motion shaft 102, so that the outlet ends 104b of the multiple ventilation pipes 104 are evenly spaced along the circumference of the motion shaft 102, thereby facilitating the uniform introduction of gas into the gap 103 and the formation of a stable gas seal therein. Preferably, the air outlet 104b of each of the ventilation pipes 104 is an air guide hole 102a opened on the motion shaft 102 to connect the gap 103 and the ventilation pipe 104, and each of the air guide holes 102a is located on the same horizontal plane, that is, the plane formed by the air outlets 104b of each of the ventilation pipes 104 is parallel to the plane on the upper surface of the base 101, as shown in Figure 1(b).

[0072] As an example, the air outlet 104b of the vent pipe 104 is lower than the position exposed above the base 101 when the motion shaft 102 rises to its highest point. In a further optional example, during the up-and-down movement of the motion shaft 102, the air outlet 104b of the vent pipe 104 is always located within the mounting hole, which helps to control the formation of an air seal between the motion shaft 102 and the base 101.

[0073] As an example, as shown in Figures 1(c) and 1(d), the outer wall of the motion shaft 102 is provided with a venting annular groove 106. The venting annular groove 106 serves to evenly distribute and buffer the gas, so that the gas supplied by the venting pipe 104 can smoothly enter the gap 103. The venting annular groove 106 is arranged circumferentially along the motion shaft 102 and is connected to the outlet end 104b of the venting pipe 104. In this example, the ventilation ring groove 106 enables communication between the ventilation pipe 104 and the gap 103, so that the gas supplied by the ventilation pipe 104 can be evenly distributed in the gap 103, thereby forming a stable gas seal in the gap 103. In one example, the top side of the ventilation ring groove 106 is inclined outward from bottom to top to form a gas guiding slope 106a, and / or the bottom side of the ventilation ring groove 106 is inclined outward from top to bottom to form a gas guiding slope 106b, which is beneficial for the gas source to be introduced into the gap 103 from the ventilation pipe 104 to form the gas seal. In a further preferred example, the cross-sectional shape of the ventilation ring groove 106 on the plane where the axis of the motion shaft 102 is located includes an inverted trapezoid, that is, the groove with the inverted trapezoidal cross-section connects the ventilation pipe 104 and the gap 103, wherein the shorter upper base of the inverted trapezoid is close to the connecting pipe 104, and the longer lower base of the inverted trapezoid is close to the gap 103, and the opening formed by the lower base of the inverted trapezoid can be directly connected to the gap 103.

[0074] As an example, multiple ventilation ring grooves 106 are provided, and the multiple ventilation ring grooves 106 are arranged at equal intervals along the axial direction of the motion shaft 102. That is, the ventilation ring grooves 106 are evenly spaced along the motion direction of the motion shaft, which can improve the uniformity of air output and improve the air sealing effect.

[0075] The motion shaft 102 is provided with a vent hole 107. One end of the vent hole 107 is connected to the vent ring groove 106, and the other end of the vent hole 107 is connected to the air outlet 104b of the vent pipe 104. The vent hole 107 can be a cylindrical hole formed in the motion shaft 102. One end of the cylindrical hole opens to contact the bottom surface of the vent ring groove 106 near the vent pipe 104, thereby connecting with the vent ring groove 106. The other end of the cylindrical hole is connected to the air outlet 104b. Optionally, an opening corresponding to the vent hole 107 is formed near the port of the vent pipe 104, and the other end of the vent hole 107 is directly connected to this opening, so that the vent hole 107 is connected to the vent pipe 104. It is understandable that when two or more ventilation pipes 104 are provided, the air outlet 104a of the ventilation pipe 104 is bent and directly connected to the ventilation ring groove 106.

[0076] As an example, the motion shaft 102 is provided with a plurality of vent holes 107 for connecting the vent ring groove 106 and the vent pipe 104. The plurality of vent holes 107 are evenly distributed around the circumference of the motion shaft 102. When there are a plurality of vent ring grooves 106, the number of vent holes 107 corresponding to each vent ring groove 106 is a plurality and evenly distributed around the circumference of the motion shaft 102. In an optional example, the vent holes 107 corresponding to each vent ring groove 106 can be arranged in the same manner or arranged in an alternating manner. Through the above arrangement, the uniformity of air output can be improved and the air sealing effect can be improved. Of course, the arrangement of the vent ring grooves 106 and the vent holes 107 can also be arranged in other ways according to the actual situation.

[0077] As an example, such as Figure 2 As shown, the motion shaft 102 is connected to a drive device, which drives the motion shaft 102 to move up and down within the base 101. Optionally, the drive device includes a cylinder 108, or other actuators, such as hydraulic cylinders or linear actuators, which provide linear motion. In one example, a cylinder 108 is selected. The connection between the motion shaft 102 and the cylinder 108 can be a direct connection between the motion shaft 102 and the drive shaft of the cylinder 108, thereby directly driving the movement of the motion shaft 102. In other examples, the motion shaft 102 can be indirectly connected to the drive shaft of the cylinder 108 via a mounting platform 109, that is, the free end of the drive shaft of the cylinder 108 is equipped with a mounting platform 109, and the bottom end of the motion shaft 102 is fixed on the mounting platform 109.

[0078] Example 2

[0079] The present invention also provides a semiconductor device, which employs the shaft sealing structure described in any of the above embodiments, the specific structure and related description of which are given in Embodiment 1. In this semiconductor device, other components can be fabricated on a base to cooperate with the shaft sealing structure. In one example, the semiconductor device can be a device for wet etching of semiconductors, wherein the moving shaft in the shaft sealing structure serves as part of a lifting mechanism within the semiconductor device.

[0080] like Figure 3-8 As shown, this embodiment provides a semiconductor device. Wherein, Figure 3 The image shown is a perspective view of the semiconductor device. Figure 4 This is a perspective view of the semiconductor device from another angle. Figure 5 The diagram shows a longitudinal section with both the inner and outer fairings raised. Figure 6 Displayed as Figure 5 Enlarged view of region B in the middle. Figure 7The diagram shows a longitudinal section of the outer fairing as it rises and the inner fairing descends. Figure 8 The diagram shows a longitudinal section with both the inner and outer fairings lowered.

[0081] In this example, the semiconductor device employs the shaft sealing structure. The semiconductor device includes a process cavity 201 with a base 200. The base 200 has a through mounting hole. Additionally, the semiconductor device includes a lifting mechanism mounted on the base 200. The lifting mechanism includes a motion shaft, a vent pipe, and a drive device. The motion shaft is fitted into the mounting hole, and a gap exists between the outer wall of the motion shaft and the inner wall of the mounting hole. This gap communicates with the internal atmosphere of the process cavity 201. Figure 5-6 The diagram shows the positional relationship between the gap 215 and the process chamber 201; the vent pipe is opened inside the motion shaft, the vent pipe has an inlet end and an outlet end, wherein the inlet end is connected to the air supply source, and the outlet end is connected to the gap, so as to introduce gas into the gap based on the vent pipe to form an air seal in the gap; the drive device is used to drive the motion shaft to move up and down in the mounting hole.

[0082] As an example, the semiconductor device further includes a wafer stage 209, which is disposed on the base 200 and located within the process cavity 201. The wafer stage 209 is used to carry the wafer 300 to be processed and to rotate the wafer 300 to be processed, so as to process the wafer 300 to be processed within the process cavity 201. Figure 3 and Figure 5 , 7 Figure 8 shows the positional relationship between the wafer stage 209 and the wafer 300 to be processed. Additionally, the semiconductor device includes a baffle connected to the motion shaft, which drives the baffle to move up and down above the base. The baffle can shield against splashes of chemicals or other liquids from the wafer stage.

[0083] As an example, the semiconductor device further includes a liquid collection tank disposed on the base 200 and located around the wafer stage 209. The liquid collection tank can be used to receive waste liquid generated during the processing of the wafer 300 to be processed. A flow deflector is connected to the motion shaft of the shaft sealing structure, and the motion shaft drives the flow deflector to move up and down above the liquid collection tank, thereby preventing the diffusion and splashing of chemical liquids. In one example, the flow deflector and the liquid collection tank correspond one-to-one.

[0084] in, Figure 3-8The semiconductor device is described using two liquid collection tanks and two flow deflectors as examples. The semiconductor device includes an outer flow deflector 202 and an inner flow deflector 206, and correspondingly includes an outer liquid collection tank 207 and an inner liquid collection tank 208. The outer flow deflector 202 moves vertically above the outer liquid collection tank 207, and the inner flow deflector 206 moves vertically above the inner liquid collection tank 208. Furthermore, the inner flow deflector 206 moves based on the drive of a driving device such as an inner motion shaft 210 and a cylinder 212. Figure 5-8 As shown, the inner motion shaft 210 and the cylinder 212 (i.e., the drive device) constitute the inner lifting mechanism 204, as follows: Figure 4 As shown, the outer baffle 202 moves up and down based on the drive of the outer motion shaft 218 and the cylinder, etc., wherein the outer motion shaft 218 and the cylinder 205 constitute the outer lifting mechanism 203, as shown. Figure 3-4 As shown. Furthermore, the number of the liquid collection tanks and the corresponding baffles can be selected according to actual needs. When there are two or more, the liquid collection tanks are arranged sequentially along the radial direction of the base 101. Additionally, in an optional example, the motion shaft connected to the baffle corresponding to the liquid collection tank is disposed within the tank wall on the side of each liquid collection tank away from the wafer stage, for example, as... Figure 3 , 4 As shown in Figure 5, the inner motion shaft 210 that drives the inner baffle 206 is located in the inner liquid collection tank 208 away from the wafer stage 209, and the outer motion shaft 218 that drives the outer baffle 202 is located in the outer liquid collection tank 207 away from the wafer stage 209.

[0085] Among them, such as Figure 5-6As shown, each lifting mechanism that drives the baffle to move up and down includes a motion shaft as in Embodiment 1. In this example, the inner motion shaft 210 and related structures of the inner motion mechanism are described as an example. It includes the inner motion shaft 210, the vent pipe 211, the bushing 214, the gap 215, the vent ring groove 216, the vent hole 217, the cylinder 212, and the mounting platform 213. The above structures and features are described in Embodiment 1 and will not be repeated here. Based on the above solution, in the semiconductor equipment, especially in the semiconductor wet processing equipment, corrosive chemical solutions such as hydrogen peroxide and sulfuric acid are commonly used. As the wafer 300 to be processed rotates, they are thrown into the baffle of the process cavity 201 and splashed onto the lifting mechanism. In order to prevent the chemical solutions and the chemical gases formed by their volatilization from diffusing or being discharged into the external environment of the process cavity 201 through the gap (e.g., the moving annular gap) formed between the moving shaft and the base 200, the lifting mechanism in this invention adopts a moving shaft with a shaft sealing structure. Positive pressure is formed between the moving shaft and the base or the bushing to prevent the chemical components in the process cavity from diffusing through the gap, thereby improving the safety of the process.

[0086] See Figure 5 , 7 As shown in Figures 8 and 9, the operating mode of the semiconductor device of the present invention can be as follows: Figure 5 As shown, when the inner baffle 206 rises, it overlaps with the outer baffle 202, and the chemical liquid ejected from the wafer 300 flows into the inner collection tank 208 and is discharged through it; Figure 7 As shown, when the inner baffle 206 descends, the inner baffle 206 separates from the outer baffle 202, and the chemical liquid splashed off the wafer 300 flows into the outer collection tank 207 and is discharged through the outer collection tank 207; as Figure 8As described above, when the inner baffle 206 and the outer baffle 202 descend simultaneously, the wafer 300 to be processed is exposed outside the top openings of the inner baffle 206 and the outer baffle 202, facilitating the gripping and release of the wafer 300. Furthermore, when there are three or more collection tanks and baffles, the operation is similar. For example, in a specific process, such as wafer etching, the inner baffle 206 rises, allowing the etching solution to drain from the inner collection tank 208. After wafer etching, cleaning is required; at this time, the inner baffle 206 descends, allowing the cleaning solution to drain from the outer collection tank 207. Through the design of the above scheme, when wet processes often involve two or more chemical liquids, since different chemical liquids need to be recovered separately, the wet processing equipment uses the raising and lowering of the baffles to achieve selective entry of chemical liquids into different liquid collection tanks, where they are discharged separately, avoiding mixing between different chemical liquids.

[0087] In summary, this invention provides a shaft sealing structure and a semiconductor device. The shaft sealing structure of this invention, through the arrangement of a venting pipe, forms an air seal in the gap between the moving shaft and the base, which helps prevent waste liquids and gases from diffusing through the gap and causing mutual contamination. Furthermore, introducing this sealing structure into the semiconductor device can prevent the process chamber from communicating with the outside through the gap, especially in wet processing equipment. This prevents impurities, waste gases, waste liquids, and corrosive liquids from entering the gap and from diffusing to the outside, thus preventing corrosion of other components or equipment in the semiconductor device.

[0088] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A semiconductor device, characterized in that, The semiconductor device includes: The process cavity has a base, and the base has a through mounting hole. A lifting mechanism, mounted on the base, includes: A motion shaft is assembled in the mounting hole, and there is a gap between the outer wall of the motion shaft and the inner wall of the mounting hole, the gap being in communication with the internal atmosphere of the process cavity; A ventilation pipe is provided inside the motion shaft. The ventilation pipe has an inlet end and an outlet end. The inlet end is connected to an air supply source, and the outlet end is connected to the gap, so as to introduce gas into the gap through the ventilation pipe and form an air seal in the gap. A drive device for driving the motion shaft to move up and down within the mounting hole; During the up-and-down movement of the motion shaft, the air outlet of the vent pipe is always located within the mounting hole.

2. The semiconductor device according to claim 1, characterized in that, A bushing is installed on the inner wall of the mounting hole, and there is a gap between the outer wall of the motion shaft and the bushing to form the gap.

3. The semiconductor device according to claim 1, characterized in that, The outer wall of the motion shaft is provided with a ventilation ring groove, which is arranged along the circumference of the motion shaft and connected to the air outlet of the ventilation pipe.

4. The semiconductor device according to claim 3, characterized in that, The top side of the ventilation ring groove slopes outward from bottom to top to form a guiding slope, and / or the bottom side of the ventilation ring groove slopes outward from top to bottom to form a guiding slope.

5. The semiconductor device according to claim 4, characterized in that, The ventilation ring groove is provided in multiple ways, and the multiple ventilation ring grooves are arranged at equal intervals along the axial direction of the motion shaft.

6. The semiconductor device according to claim 5, characterized in that, The motion shaft is provided with multiple vent holes to connect the vent ring groove and the vent pipe. The multiple vent holes are evenly distributed along the circumference of the motion shaft.

7. The semiconductor device according to any one of claims 1-6, characterized in that, The semiconductor device also includes: A wafer stage is disposed on the base and located within the process cavity; A baffle, connected to the motion shaft, is arranged around the periphery of the wafer stage. The motion shaft drives the baffle to move up and down above the base.

8. The semiconductor device according to claim 7, characterized in that, The semiconductor device also includes a liquid collection tank, which is formed on the base and located around the wafer stage, and the baffle moves up and down above the liquid collection tank.

9. The semiconductor device according to claim 8, characterized in that, The number of liquid collection tanks and the number of flow deflectors are one or more, and the flow deflectors correspond one-to-one with the liquid collection tanks. The two or more liquid collection tanks are arranged sequentially along the radial direction of the base, and the motion shaft connected to the flow deflector corresponding to the liquid collection tank is set in the tank wall of each liquid collection tank on the side away from the wafer stage.

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