Multilayer ceramic electronic components

Abstract

The present disclosure provides a multilayer ceramic electronic component, the multilayer ceramic electronic component comprising: a ceramic body having a capacitor forming part, the capacitor forming part being arranged in such a manner that a dielectric layer and a first internal electrode and a second internal electrode are stacked and the dielectric layer is interposed between the first internal electrode and the second internal electrode; and a first external electrode and a second external electrode, respectively arranged on the ceramic body, the first external electrode and the second external electrode comprising a first base electrode and a second base electrode respectively connected to the first internal electrode and the second internal electrode, and a first conductive layer and a second conductive layer respectively arranged to cover the first base electrode and the second base electrode. The first conductive layer and the second conductive layer have a thickness in the range of 0.1 μm to 10 μm.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0004691 filed on January 14, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety for all purposes by reference. Technical Field

[0002] The present disclosure relates to a multilayer ceramic electronic component. Background Art

[0003] Recently, with the trend of miniaturization of electronic products, multilayer ceramic electronic components have also been required to be miniaturized and have high capacity. In order to meet the needs of miniaturization and high capacity of multilayer ceramic electronic components, the external electrodes of the multilayer ceramic electronic components are also thinned.

[0004] On the other hand, the application fields of multilayer ceramic electronic components are expanding from traditional fields such as IC products to industrial electronics. In order to apply multilayer ceramic electronic components to various fields, it is necessary to exhibit a certain level or higher performance in various special environments.

[0005] The prior art multilayer ceramic electronic components use external electrodes with a multilayer structure to satisfy physical properties such as moisture-proof reliability and solder bonding performance. However, the external electrodes with such a multilayer structure have different interface properties, and therefore, when exposed to a harsh environment, there may be problems such as separation between different external electrodes or peeling therebetween. Summary of the invention

[0006] This summary is provided to introduce selected concepts in a simplified form, and the concepts are further described in the following detailed description. This summary is neither intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0007] An aspect of the present disclosure is to provide a multilayer ceramic electronic component that can prevent a separation phenomenon between external electrodes.

[0008] An aspect of the present disclosure is to provide a multilayer ceramic electronic component that can prevent electrical performance from being degraded even in a harsh environment.

[0009] According to one aspect of the present disclosure, a multilayer ceramic electronic component includes: a ceramic body having a fifth surface and a sixth surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a first surface and a second surface opposite to each other in a third direction, the ceramic body including a capacitance forming portion, the capacitance forming portion being arranged in such a manner that a dielectric layer and a first internal electrode and a second internal electrode are stacked in the third direction and the dielectric layer is interposed between the first internal electrode and the second internal electrode; and a first external electrode and a second external electrode, respectively arranged on the fifth surface and the sixth surface of the ceramic body, the first external electrode and the second external electrode including a first base electrode and a second base electrode connected to the first internal electrode and the second internal electrode, respectively, and a first conductive layer and a second conductive layer respectively arranged to cover the first base electrode and the second base electrode. The first conductive layer and the second conductive layer have a thickness in the range of 0.1 μm to 10 μm.

[0010] According to one aspect of the present disclosure, a multilayer ceramic electronic component includes: a ceramic body having a fifth surface and a sixth surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a first surface and a second surface opposite to each other in a third direction, the ceramic body including a capacitor forming part in which a dielectric layer and a first internal electrode and a second internal electrode are stacked in the third direction and the dielectric layer is interposed between the first internal electrode and the second internal electrode; and a first external electrode and a second external electrode, respectively disposed on the fifth surface and the sixth surface of the ceramic body, the first external electrode and the second external electrode including a first base electrode and a second base electrode connected to the first internal electrode and the second internal electrode, respectively, and a first conductive layer and a second conductive layer respectively disposed to cover the first base electrode and the second base electrode. Each of the first conductive layer and the second conductive layer includes a conductive material and a binder, and the binder is in a range of 7 wt % to 30 wt % relative to the total weight of the corresponding one of the first conductive layer and the second conductive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a perspective view schematically illustrating a multilayer ceramic electronic component according to an exemplary embodiment;

[0013] Figure 2 is a perspective view schematically showing a ceramic body of a multilayer ceramic electronic component according to an exemplary embodiment;

[0014] Figure 3 It is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0015] Figure 4 shows TGA analysis data of a first conductive layer and a second conductive layer according to an exemplary embodiment; and

[0016] Figure 5 DSC analysis data of a first conductive layer and a second conductive layer according to an exemplary embodiment are shown. DETAILED DESCRIPTION

[0017] The following detailed description is provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, various variations, modifications and equivalents of the methods, devices and / or systems described herein will be apparent to those of ordinary skill in the art. The order of operations described herein is merely exemplary and is not limited to the order set forth herein, but changes may be made that will be apparent to those of ordinary skill in the art, except for operations that must occur in a particular order. In addition, descriptions of functions and configurations that will be well known to those of ordinary skill in the art may be omitted for clarity and brevity.

[0018] The features described herein may be presented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0019] Here, it is noted that the use of the term "may" with respect to an example or embodiment (e.g., with respect to what an example or embodiment may include or implement) means that there is at least one example or embodiment that includes or implements such features, and all examples and embodiments are not limited thereto.

[0020] Throughout the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, or “coupled to” another element, the element may be directly “on”, “connected to”, or “coupled to” the other element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on”, “directly connected to”, or “directly coupled to” another element, there may be no other elements present between them.

[0021] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0022] Although terms such as "first", "second", and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited to these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Therefore, without departing from the teachings of the examples described herein, the first member, first component, first region, first layer, or first portion referred to in the examples may also be referred to as the second member, second component, second region, second layer, or second portion.

[0023] For ease of description, spatially relative terms such as "above," "above," "below," and "below" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientations depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "above" relative to another element will then be "below" or "below" relative to the other element. Therefore, the term "above" includes both above and below orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein will be interpreted accordingly.

[0024] The terms used herein are only used to describe various examples and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "comprise", "include" and "have" list the existence of the stated features, quantities, operations, components, elements and / or their combinations, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or their combinations.

[0025] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0026] The features of the examples described herein can be combined in various ways that will be apparent after obtaining an understanding of the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations that will be apparent after obtaining an understanding of the disclosure of the present application are feasible.

[0027] The drawings may not be drawn to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.

[0028] In the present specification, expressions such as "at least one of A or B", "at least one of A or / and B", or "one or more of A or / and B" may include all possible combinations of the items listed together. For example, "A or B", "at least one of A and B", or "at least one of A or B" includes all cases of: (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B.

[0029] The values ​​of parameters used to describe such as 1D dimensions of an element (including but not limited to "length", "width", "thickness", "diameter", "distance", "gap" and / or "size"), 2D dimensions of an element (including but not limited to "area" and / or "size"), 3D dimensions of an element (including but not limited to "volume" and / or "size"), and properties of an element (including but not limited to "roughness", "density", "weight", "weight ratio" and / or "molar ratio") can be obtained by the methods and / or tools described in the present disclosure. However, the present disclosure is not limited thereto. Other methods and / or tools that are understood by a person of ordinary skill in the art, even if not described in the present disclosure, may also be used.

[0030] In the drawings, the X direction may be defined as a first direction, an L direction or a length direction, the Y direction may be defined as a second direction, a W direction or a width direction, and the Z direction may be defined as a third direction, a T direction or a thickness direction.

[0031] In the following, reference will be made to Figures 1 to 3 A multilayer ceramic electronic component according to an exemplary embodiment is described in detail.

[0032] Reference Figures 1 to 3 According to an exemplary embodiment, a multilayer ceramic electronic component 100 includes a ceramic body 110 having a fifth surface S5 and a sixth surface S6 opposite to each other in a first direction (X direction), a third surface S3 and a fourth surface S4 opposite to each other in a second direction (Y direction), and a first surface S1 and a second surface S2 opposite to each other in a third direction (Z direction), and the ceramic body 110 includes a capacitor forming portion in which a dielectric layer 111 and a first internal electrode 121 and a second internal electrode 122 are disposed in the third direction ( The ceramic body 110 is stacked in the Z direction) and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122; and the first outer electrode 131 and the second outer electrode 132 include a first base electrode 131a and a second base electrode 132a respectively arranged on the fifth surface S5 and the sixth surface S6 of the ceramic body 110 and connected to the first inner electrode 121 and the second inner electrode 122 respectively, and a first conductive layer 131b and a second conductive layer 132b respectively arranged to cover the first base electrode 131a and the second base electrode 132a.

[0033] In this case, the thickness T1 of the first conductive layer 131b and the second conductive layer 132b may be in the range of 0.1 μm to 10 μm. The thickness T1 of the first conductive layer 131b and the second conductive layer 132b may refer to the length of the first conductive layer 131b and the second conductive layer 132b in the first direction (X direction). The thickness T1 may be the average of 10 values ​​measured at any point of the first conductive layer 131b on the fifth surface S5 of the ceramic body 110 and the second conductive layer 132b on the sixth surface S6. The thickness may be measured by scanning the central (middle) portion of the external electrode using a scanning electron microscope. When the first conductive layer 131b and the second conductive layer 132b include an adhesive and a conductive material as described below, the first conductive layer 131b and the second conductive layer 132b may be used as a conductive adhesive layer and may be used to improve the adhesion between heterogeneous materials. If the thickness T1 of the first conductive layer 131b and the second conductive layer 132b is less than 0.1μm, the bonding strength between the first base electrode and the first terminal electrode to be described below and between the second base electrode and the second terminal electrode to be described below is weakened, so that the mechanical strength of the external electrode may deteriorate, and when the thickness T1 of the first conductive layer 131b and the second conductive layer 132b exceeds 10μm, the resistance of the external electrode may increase, resulting in the problem of degradation of electrical characteristics.

[0034] In an exemplary embodiment, the ceramic body 110 may include a capacitor forming portion in which a dielectric layer 111 and first and second internal electrodes 121 and 122 are stacked in a third direction (Z direction) with the dielectric layer 111 interposed therebetween.

[0035] Although the ceramic body 110 is not limited to a specific shape, the ceramic body 110 may have a hexahedral shape or a shape similar thereto, as shown in the accompanying drawings. Due to the shrinkage of the ceramic powder included in the ceramic body 110 during the firing process, the ceramic body 110 may have a substantially hexahedral shape, although it has an incompletely straight hexahedral shape. The ceramic body 110 may have a fifth surface S5 and a sixth surface S6 opposite to each other in the length direction (X direction), a third surface S3 and a fourth surface S4 connected to the fifth surface S5 and the sixth surface S6 and opposite to each other in the width direction (Y direction), and a first surface S1 and a second surface S2 connected to the fifth surface S5 and the sixth surface S6, connected to the third surface S3 and the fourth surface S4 and opposite to each other in the thickness direction (Z direction).

[0036] The ceramic body 110 may be formed by alternately stacking ceramic green sheets having the first internal electrodes 121 printed on the dielectric layer 111 and ceramic green sheets having the second internal electrodes 122 printed on the dielectric layer 111 in a thickness direction (Z direction).

[0037] The capacitor forming part may be formed by alternately stacking dielectric layers 111 and internal electrodes 121 and 122 in a third direction (Z direction). The plurality of dielectric layers 111 forming the capacitor forming part are in a fired state, and adjacent dielectric layers 111 may be integrated to such an extent that the boundaries may not be confirmed without a scanning electron microscope (SEM).

[0038] According to an exemplary embodiment, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacity can be obtained therewith. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material may be used.

[0039] In addition, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added to powder particles such as barium titanate (BaTiO 3 ) as a material for forming the dielectric layer 111 according to the purpose in the exemplary embodiment.

[0040] For example, the dielectric layer 111 may be formed by coating a slurry including a powder such as barium titanate (BaTiO3) on a carrier film and drying the slurry to prepare a plurality of ceramic sheets. The ceramic sheets may be formed by mixing ceramic powder, a binder, and a solvent to prepare a slurry and forming the slurry into a sheet having a thickness of several μm by a doctor blade method, but the forming method is not limited thereto.

[0041] In the multilayer ceramic electronic component according to the exemplary embodiment, the plurality of internal electrodes 121 and 122 may be disposed to face each other with the dielectric layer 111 interposed between the plurality of internal electrodes 121 and 122. The internal electrodes (121 and 122) may include first internal electrodes 121 and second internal electrodes 122, which are alternately disposed to face each other with the dielectric layer 111 interposed between them.

[0042] The first internal electrode 121 may be exposed to one surface S5 of the ceramic body 110 in the first direction (X direction), and an exposed portion of the first internal electrode 121 exposed to the one surface S5 in the first direction (X direction) may be connected to the first base electrode 131a. The second internal electrode 122 may be exposed to the other surface S6 of the ceramic body 110 in the first direction (X direction), and an exposed portion of the second internal electrode 122 exposed to the other surface S6 in the first direction (X direction) may be connected to the second base electrode 132a. The first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0043] The material forming the first and second internal electrodes 121 and 122 is not particularly limited, and the first and second internal electrodes 121 and 122 may be formed using a conductive paste including one or more materials of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The conductive paste may be printed using a screen printing method or a gravure printing method, but the present disclosure is not limited thereto.

[0044] In a multilayer ceramic electronic component according to an exemplary embodiment, an edge portion may be provided on both surfaces of a capacitor forming portion in a second direction (Y direction). The edge portions may be provided on both surfaces of the capacitor forming portion in a second direction (Y direction) perpendicular to the first direction and the third direction (X direction and Z direction), respectively. The edge portions may be used to prevent damage to the internal electrode due to physical stress or chemical stress.

[0045] The edge portion may be formed using an insulating material, and may be formed using a ceramic material such as barium titanate. In this case, the edge portion may include the same ceramic material as the ceramic material included in the dielectric layer 111, or may be formed using the same material as the material of the dielectric layer 111. The method for forming the edge portion is not particularly limited. For example, the edge portion may be formed in the following manner: by forming the area of ​​the dielectric layer included in the capacitor forming portion to be larger than the area of ​​the inner electrode, or by forming an edge region on the remaining circumference of the inner electrode except for the portion of the inner electrode connected to the outer electrode, the edge region is formed by coating a slurry including ceramic, or by attaching a dielectric sheet to the two surfaces of the capacitor forming portion in the second direction (Y direction).

[0046] The multilayer ceramic electronic component according to the exemplary embodiment may include a covering portion. The covering portion may be disposed on the outermost portions of the first and second internal electrodes 121 and 122. The covering portion may be disposed on the lower portion of the lowermost internal electrode of the body 110 and on the upper portion of the uppermost internal electrode of the body 110. In this case, the covering portion may be formed using the same component as the dielectric layer 111 and may be formed by stacking one or more of the dielectric layers not including the internal electrodes on the uppermost internal electrode and below the lowermost internal electrode of the body 110, respectively. The covering portion may be substantially used to prevent the internal electrodes from being damaged due to physical stress or chemical stress.

[0047] In an exemplary embodiment, the first base electrode 131a connected to the first internal electrode 121 and the second base electrode 132a connected to the second internal electrode 122 of the multilayer ceramic electronic component 100 according to the exemplary embodiment may be a fired electrode including a first conductive metal. Various metals having good contact with the internal electrodes may be used as the first conductive metal included in the first base electrode 131a and the second base electrode 132a, for example, one or more conductive metals such as copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof may be used. For example, when the first base electrode 131a and the second base electrode 132a are formed using the fired electrode including the first conductive metal as in the present embodiment, the connection with the internal electrode may be increased, and the mechanical strength of the multilayer ceramic electronic component may be improved.

[0048] In an example, the first base electrode 131a and the second base electrode 132a may further include a glass component. The glass component may be a component in which an oxide is mixed, and is not particularly limited, but may be one or more selected from the group consisting of silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, and alkaline earth metal oxide. The transition metal may be selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni), the alkali metal may be selected from the group consisting of lithium (Li), sodium (Na), and potassium (K), and the alkaline earth metal may be selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba). One or more selected. In an example, the first base electrode 131a and the second base electrode 132a may be sintered electrodes including a first conductive metal.

[0049] The method of forming the first base electrode 131a and the second base electrode 132a is not particularly limited. For example, among various methods of forming the first base electrode 131a and the second base electrode 132a, a conductive paste containing a first conductive metal may be printed or applied to the surface of the ceramic body 110 by screen printing or gravure printing, the ceramic body 110 may be immersed in the conductive paste, or a dry film obtained by drying the conductive paste may be transferred onto the ceramic body 110, but the method is not limited thereto.

[0050] In an exemplary embodiment, the first conductive layer 131b provided to cover the first base electrode 131a and the second conductive layer 132b provided to cover the second base electrode 132a may include a conductive material and an adhesive. When the first conductive layer 131b and the second conductive layer 132b include a conductive material and an adhesive, the first conductive layer 131b and the second conductive layer 132b may be substantially used as a conductive adhesive layer. The adhesive is not particularly limited as long as it satisfies the required adhesive strength, but may be, for example, one or more selected from polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber and / or acrylic thermoplastic resins and phenol, epoxy, urethane, melamine and / or alkyd thermosetting resins.

[0051] Detailed examples of thermoplastic resins may be styrene resins, (meth) acrylic resins, organic acid vinyl ester resins, vinyl ether resins, halogen-containing resins, olefin resins (including alicyclic olefin resins), polycarbonate resins, polyester resins, polyamide resins, thermoplastic polyurethane resins, polysulfone resins (e.g., polyethersulfone, polysulfone), polyphenylene ether resins (e.g., 2,6-xylenol polymers), cellulose derivatives (e.g., cellulose esters, cellulose carbamates, cellulose ethers), silicone resins (e.g., polydimethylsiloxane, polymethylphenylsiloxane), rubbers or elastomers (e.g., diene rubbers (such as polybutadiene, polyisoprene, etc.), styrene-butadiene copolymers, acrylonitrile-butadiene copolymers, acrylic rubbers, polyurethane rubbers, and silicone rubbers), etc., which may be used alone or in combination of two or more thereof, but the examples are not limited thereto.

[0052] Among them, the polyester resin may include any suitable polyol. Suitable examples of the polyol include, but are not limited to, 2,2,4,4-tetraalkylcyclobutane-1,3-diol (TACD); alkylene glycols such as ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, hexylene glycol, polyethylene glycol, polypropylene glycol, and neopentyl glycol; hydrogenated bisphenol A; cyclohexanediol; propylene glycols such as 1,2-propylene glycol, 1,3-propylene glycol, butylethylpropylene glycol, 2-methyl-1,3-propylene glycol, and 2-ethyl-2-butyl-1,3-propylene glycol; butanediols such as 1,4-butanediol, 1,3-butanediol, and 2-ethyl-1,4-butanediol; pentanediols such as trimethylpentanediol and 2-methylpentanediol; cyclohexanedimethanol; hexanediols such as 1,6-hexanediol; caprolactone diols (such as the reaction product of ε-caprolactone and ethylene glycol); hydroxyalkylated bisphenols; polyether diols such as poly(oxytetramethylene) glycol; trimethylolpropane; pentaerythritol; dipentaerythritol; trimethylolethane; trimethylolbutane; dimethylolcyclohexane; bio-derived polyols such as glycerol, sorbitol and isosorbide; or the like or combinations thereof, but the embodiments are not limited thereto.

[0053] In addition, detailed examples of thermosetting resins may include phenolic resins, urea resins, diallyl phthalate resins, melanin resins, guanamine resins, unsaturated polyester resins, polyurethane resins, epoxy resins, aminoalkyd resins, melamine-urea co-condensation resins, silicone resins, polysiloxane resins, etc., but examples are not limited thereto. In the case of using a thermosetting resin, a crosslinking agent, a curing agent (such as a polymerization initiator, a polymerization accelerator, a solvent, a viscosity modifier, etc.) may also be used as needed.

[0054] In an example, the first conductive layer 131b and the second conductive layer 132b may include an adhesive in a range of 7 wt % to 30 wt %. In the present specification, "adhesive" may refer to an adhesive material capable of adhering two interfaces having the same or different surface properties to each other in a curing process, and may refer to a material capable of having a binding force with respect to the surface molecules of the adhesive and the adherend through chemical / mechanical interactions. Based on the total weight of the first conductive layer 131b and the second conductive layer 132b, the content of the adhesive may be greater than or equal to 7wt%, greater than or equal to 8wt%, greater than or equal to 9wt%, or greater than or equal to 10wt%, and may be less than or equal to 30wt%, less than or equal to 29wt%, less than or equal to 28wt%, less than or equal to 27wt%, less than or equal to 26wt%, or less than or equal to 25wt%. In the multilayer ceramic electronic component according to this embodiment, since the first conductive layer 131b disposed on the first base electrode 131a and the second conductive layer 132b disposed on the second base electrode 132a include an adhesive within the above range, the first conductive layer 131b and the second conductive layer 132b can have the above-mentioned thickness, and even when the multilayer ceramic electronic component is exposed to a relatively high temperature environment, defects such as warping of the external electrode can be prevented.

[0055] In another embodiment, the first conductive layer 131b provided to cover the first base electrode 131a and the second conductive layer 132b covering the second base electrode 132a may include a conductive material in a range of less than or equal to 93 weight %. The conductive material may be included in a range of, for example, less than or equal to 93 weight %, less than or equal to 92 weight %, less than or equal to 91 weight % or less than or equal to 90 weight %, and in a range of greater than or equal to 70 weight %, greater than or equal to 71 weight %, greater than or equal to 72 weight %, greater than or equal to 73 weight %, greater than or equal to 74 weight % or greater than or equal to 75 weight %, but the embodiment is not limited thereto. In the multilayer ceramic electronic component according to the exemplary embodiment, since the conductive material included in the first conductive layer 131b and the second conductive layer 132b satisfies the above range, defects such as warping of the first conductive layer 131b and the second conductive layer 132b may be prevented while exhibiting excellent electrical properties.

[0056] In an example, the conductive material included in the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component according to the exemplary embodiment may include a second conductive metal and / or a conductive polymer. As a non-limiting example, examples of the second conductive metal may include lithium (Li), sodium (Na), potassium (K), rubidium (Rb), cesium (Cs), francium (Fr), beryllium (Be), magnesium (Mg), calcium (Ca), strontium (Sr), barium (Ba), radium (Ra), scandium (Sc), yttrium (Y), titanium (Ti), zirconium (Zr), hafnium (Hf), (Rf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), (Sg), manganese (Mn), technetium (Tc), rhenium (Re), (Bh), iron (Fe), ruthenium (Ru), osmium (Os), One or more of niobium (Hs), cobalt (Co), rhodium (Rh), iridium (Ir), nickel (Ni), palladium (Pd), platinum (Pt), copper (Cu), silver (Ag), gold (Au), zinc (Zn), cadmium (Cd), mercury (Hg), aluminum (Al), gallium (Ga), indium (In), thallium (Tl), tin (Sn), lead (Pb), bismuth (Bi) and / or polonium (Po), but the examples are not limited thereto.

[0057] Non-limiting examples of conductive polymers may include compounds containing sulfur and / or nitrogen (N), such as poly(thiophene) (PT), poly(ethylenedioxy)thiophene (PEDOT), poly(p-phenylene sulfide) (PPS), polyaniline (PANI), poly(3-hexylthiophene-2,5-diyl) (P3HT), poly(4-butylphenyl diphenylamine) (PolyTPD), poly(4-butylphenyl diphenylamine) (PSS), poly(9-vinyl carbazole) (PVK), poly(4,4'-dimethoxydithiophene) (PDBT), polyaniline, polypyrrole, and the like, and may include compounds without heteroatoms, such as poly(fluorine), polyphenylene, polypyrene, polyazulene, polynaphthalene, poly(acetylene) (PAC), poly(p-phenylene vinylene) (PPV), but the examples are not limited thereto.

[0058] The conductive material is a material for imparting conductivity to the first conductive layer 131b and the second conductive layer 132b, and may further include a separate conductive filler or the like within a range satisfying the above-mentioned content range. Examples of the conductive filler may include carbon fillers such as carbon nanotubes, graphene, fullerene, etc., and / or spherical, elliptical, flake, fiber, or resin (dendritic) alloy fillers, but examples are not limited thereto.

[0059] In an example, the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component according to the exemplary embodiment may be configured in such a manner that the 10% weight loss temperature measured by a thermogravimetric analysis (TGA) device is higher than or equal to 160°C. The multilayer ceramic electronic component according to the exemplary embodiment may further include a terminal electrode mounted on a substrate as described later. In this case, in the process of forming the terminal electrode, thermal stability in which the first conductive layer 131b and the second conductive layer 132b are not thermally decomposed is required. The first conductive layer and the second conductive layer of the multilayer ceramic electronic component according to the exemplary embodiment can maintain excellent bonding strength between the base electrode and the terminal electrode by suppressing thermal decomposition at a temperature higher than or equal to 160°C. In an exemplary embodiment, thermal stability is evaluated using a thermogravimetric analysis (TGA) device. During heating from 30°C to 350°C at a rate of 5°C / min under a nitrogen atmosphere, the temperature at which the weight of the first conductive layer and the second conductive layer is reduced by 10% is measured, and the temperature is evaluated as thermal stability. The 10% weight loss temperature may be higher than or equal to 160°C, higher than or equal to 165°C, higher than or equal to 170°C, or higher than or equal to 175°C, and the upper limit thereof is not particularly limited but may be lower than or equal to 500°C.

[0060] In another example, the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component according to the exemplary embodiment may be configured in such a manner that the difference (ΔT) between the thermal decomposition start temperature and the thermal decomposition end temperature measured by a thermogravimetric analysis (TGA) device may be higher than or equal to 15°C. The thermal decomposition start temperature of the first conductive layer 131b and the second conductive layer 132b may be, for example, higher than or equal to 160°C, higher than or equal to 163°C, or higher than or equal to 165°C, and the thermal decomposition end temperature may be lower than or equal to 190°C, lower than or equal to 187°C, or lower than or equal to 185°C, but is not limited thereto. The thermal decomposition start temperature and the thermal decomposition end temperature may be values ​​measured in a process of heating from 30°C to 350°C at a rate of 5°C / min under a nitrogen atmosphere using the above-mentioned thermogravimetric analysis (TGA) device. The difference (ΔT) between the thermal decomposition start temperature and the thermal decomposition end temperature of the first conductive layer 131b and the second conductive layer 132b according to the exemplary embodiment satisfies the above range, thereby effectively suppressing defects such as warping of the external electrode.

[0061] In an exemplary embodiment, the first terminal electrode 131c and the second terminal electrode 132c may be disposed on the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component 100, respectively. The first terminal electrode 131c and the second terminal electrode 132c may be disposed to cover the first conductive layer 131b and the second conductive layer 132b, respectively. In the present specification, the terminal electrodes 131c and 132c are disposed to cover the conductive layers 131b and 132b, which may mean that the terminal electrodes 131c and 132c are disposed so that the conductive layers 131b and 132b are not exposed to the outside. Specifically, the first conductive layer 131b and the second conductive layer 132b are disposed inside the first external electrode 131 and the second external electrode 132, respectively, so that only the first terminal electrode 131c and the second terminal electrode 132c are visible from the outside.

[0062] In an exemplary embodiment, the first terminal electrode 131c disposed on the first conductive layer 131b and the second terminal electrode 132c disposed on the second conductive layer 132b may be a conductive resin layer. The conductive resin layer may include a third conductive metal and a matrix resin. The conductive resin layer may be formed using a conductive paste including metal particles and a matrix resin for an external electrode.

[0063] The conductive resin layer includes a third conductive metal, and the third conductive metal may be in the form of a powder. The shape of the third conductive metal powder may be a spherical shape or a flake shape. In the conductive resin layer, the third conductive metal particles may be arranged in contact with or adjacent to each other, and the matrix resin may be arranged to surround the metal particles.

[0064] The third conductive metal is not particularly limited as long as it is a particle of a metal having excellent conductivity, and may include, for example, copper (Cu), silver (Ag), nickel (Ni), and / or an alloy thereof.

[0065] The matrix resin may be a thermosetting resin, and the thermosetting resin may be an epoxy resin, but is not limited thereto.

[0066] The first terminal electrode 131c disposed on the first conductive layer 131b and the second terminal electrode 132c disposed on the second conductive layer 132b are formed using a conductive resin layer to protect the multilayer ceramic electronic component from external thermal stress, chemical stress, and physical stress, to prevent moisture from penetrating into the ceramic body, and to prevent a plating solution from penetrating into the ceramic body when forming a plating layer. Therefore, the moisture-proof reliability of the multilayer ceramic electronic component according to the exemplary embodiment can be improved.

[0067] <Test Example>

[0068] The first conductive layer and the second conductive layer are formed by preparing a sintered sheet in which a first base electrode and a second base electrode including nickel (Ni) are formed, and by preparing an adhesive and a second conductive metal having a thickness shown in Table 1 below and a composition shown in Table 2 below, and then coating the sheet.

[0069] Figure 4 and Figure 5 The TGA and DSC (differential scanning calorimetry) analysis results of the first conductive layer and the second conductive layer are shown. Figure 4 and Figure 5 , it can be seen that the weight loss at a temperature lower than or equal to 100° C. is analyzed as solvent volatilization, and the loss by thermal decomposition around 180° C. is within 10 wt %. Therefore, it was confirmed that there was no abnormality in thermal stability.

[0070] In addition, after forming the first and second conductive layers, evaluation of ESR and defects such as warping was performed by using a sheet in which the first and second terminal electrodes including copper (Cu) were formed to cover the first and second conductive layers.

[0071] In Table 1 and Table 2, defects such as warping were evaluated by using an internal measuring device, a universal material tester (Tira) volumetric method, and ESR was measured after evaluating the flexural strength of a 3225 size sheet.

[0072] [Table 1]

[0073]

[0074] Referring to Table 1, when the thickness of the first conductive layer and the second conductive layer is less than or equal to 50nm, the ESR value is not significantly improved, and it can be confirmed that defects such as warping occur, and when the thickness of the first conductive layer and the second conductive layer is greater than or equal to 100nm, it can be seen that an excellent ESR value can be obtained and defects such as warping can be prevented. Therefore, it can be seen that when the first conductive layer and the second conductive layer provided between the base electrode and the terminal electrode are layers having a thickness greater than or equal to 100nm, warping inside the external electrode can be prevented.

[0075] When the thickness of the first conductive layer and the second conductive layer exceeds 1 μm, defects such as delamination are still well prevented; however, due to thermal degradation of the polymer, electrical properties are reduced. Therefore, it is recommended that the thickness of the first conductive layer and the second conductive layer be less than 1 μm.

[0076] [Table 2]

[0077]

[0078] Referring to Table 2, it can be seen that when the content of the binder is 5 wt%, defects such as warping occur, but when the content of the binder is 10 wt%, an excellent ESR value is exhibited without causing defects such as warping. Therefore, it can be meant that the warping of the inner part of the outer electrode can be prevented by including an intermediate value of 5 wt% and 10 wt% in the binder.

[0079] In addition, in Table 2, when the binder was 30 wt%, defects such as warping did not occur, but it was confirmed that the ESR looked relatively high. Therefore, it can be seen that the contents of the conductive material and the binder should be adjusted to an appropriate range.

[0080] In addition, in Table 2, when the binder exceeds 30 wt % (e.g., 50 wt %), defects such as warping do not occur; however, it can be confirmed that the ESR appears to be relatively high. Such an insulating material (D-sorbitol) may obstruct electrical paths and have a deleterious effect on electrical properties.

[0081] As described above, according to exemplary embodiments, a multilayer ceramic electronic component capable of preventing a separation phenomenon between external electrodes having a multilayer structure may be provided.

[0082] According to exemplary embodiments, a multilayer ceramic electronic component capable of maintaining electrical performance even in a harsh environment may be provided.

[0083] Although the present disclosure includes detailed examples, it will be apparent to those of ordinary skill in the art that various changes in form and detail may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered as descriptive only and not for limiting purposes. The description of the features or aspects in each example will be considered to be applicable to similar features or aspects in other examples. If the described techniques are performed in a different order, and / or if the components in the described systems, architectures, devices, or circuits are combined in different ways and / or replaced or supplemented with other components or their equivalents, the appropriate results may be obtained. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents will be interpreted as included in the present disclosure.

Claims

1. A multilayer ceramic electronic component comprising: a ceramic body having a fifth surface and a sixth surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a first surface and a second surface opposite to each other in a third direction, the ceramic body comprising a capacitor forming part in which a dielectric layer and first and second internal electrodes are stacked in the third direction with the dielectric layer interposed between the first and second internal electrodes; and a first external electrode and a second external electrode, respectively disposed on the fifth surface and the sixth surface of the ceramic body, wherein the first external electrode and the second external electrode include a first base electrode and a second base electrode respectively connected to the first internal electrode and the second internal electrode, and a first conductive layer and a second conductive layer respectively disposed to cover the first base electrode and the second base electrode, The first conductive layer and the second conductive layer have a thickness in a range of 0.1 μm to 10 μm, and each of the first conductive layer and the second conductive layer includes an adhesive and a conductive material, and the conductive material includes a conductive polymer.

2. The multilayer ceramic electronic component according to claim 1, wherein: The first base electrode and the second base electrode each include a sintered electrode including a first conductive metal.

3. The multilayer ceramic electronic component according to claim 2, wherein: The first conductive metal includes one or more of copper, nickel, tin, palladium, platinum, iron, gold, silver, tungsten, titanium, lead or alloys thereof.

4. The multilayer ceramic electronic component according to claim 1, wherein: The first base electrode and the second base electrode each include a first conductive metal and a glass component.

5. The multilayer ceramic electronic component according to claim 1, wherein: The adhesive is one or more selected from polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber and / or acrylic thermoplastic resins and phenol, epoxy, urethane, melamine and / or alkyd thermosetting resins.

6. The multilayer ceramic electronic component according to claim 5, wherein: Each of the first conductive layer and the second conductive layer includes the binder in a range of 7 wt % to 30 wt % with respect to a total weight of a corresponding one of the first conductive layer and the second conductive layer.

7. The multilayer ceramic electronic component according to claim 5, wherein: A corresponding one of the first conductive layer and the second conductive layer includes the conductive material in an amount less than or equal to 93 wt % relative to a total weight of each of the first conductive layer and the second conductive layer.

8. The multilayer ceramic electronic component according to claim 5, wherein: The conductive material further includes a second conductive metal and / or a conductive filler.

9. The multilayer ceramic electronic component according to claim 8, wherein: The second conductive metal includes lithium, sodium, potassium, rubidium, cesium, francium, beryllium, magnesium, calcium, strontium, barium, radium, scandium, yttrium, titanium, zirconium, hafnium, Vanadium, niobium, tantalum, chromium, molybdenum, tungsten, Manganese, technetium, rhenium, Iron, ruthenium, osmium, One or more of cobalt, rhodium, iridium, nickel, palladium, platinum, copper, silver, gold, zinc, cadmium, mercury, aluminum, gallium, indium, thallium, tin, lead, bismuth or polonium.

10. The multilayer ceramic electronic component according to claim 1, wherein: A 10% weight loss temperature of each of the first conductive layer and the second conductive layer is higher than or equal to 160°C.

11. The multilayer ceramic electronic component according to claim 10, wherein: The 10% weight loss temperature higher than or equal to 160° C. is measured by a thermogravimetric analysis apparatus.

12. The multilayer ceramic electronic component according to claim 1, further comprising: An edge portion provided on two surfaces of the capacitance forming portion in the second direction; as well as The covering portion is provided on both surfaces of the capacitance forming portion in the third direction. 13 . The multilayer ceramic electronic component of claim 1 , further comprising a first terminal electrode and a second terminal electrode, the first terminal electrode and the second terminal electrode being disposed on the first conductive layer and the second conductive layer, respectively.

14. The multilayer ceramic electronic component according to claim 13, wherein: The first terminal electrode and the second terminal electrode each include a conductive resin layer including a third conductive metal and a matrix resin.

15. The multilayer ceramic electronic component according to claim 14, wherein: The third conductive metal includes copper, silver, nickel and / or alloys thereof.

16. The multilayer ceramic electronic component according to claim 1, wherein: The first conductive layer and the second conductive layer have a thickness in a range of 0.1 μm to 1 μm.

17. A multilayer ceramic electronic component comprising: a ceramic body having a fifth surface and a sixth surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a first surface and a second surface opposite to each other in a third direction, the ceramic body comprising a capacitor forming part in which a dielectric layer and first and second internal electrodes are stacked in the third direction with the dielectric layer interposed between the first and second internal electrodes; and a first external electrode and a second external electrode, respectively disposed on the fifth surface and the sixth surface of the ceramic body, wherein the first external electrode and the second external electrode include a first base electrode and a second base electrode respectively connected to the first internal electrode and the second internal electrode, and a first conductive layer and a second conductive layer respectively disposed to cover the first base electrode and the second base electrode, Each of the first conductive layer and the second conductive layer includes a conductive material and an adhesive, and the adhesive is in a range of 7 wt % to 30 wt % relative to the total weight of the corresponding one of the first conductive layer and the second conductive layer, and the conductive material includes a conductive polymer.

18. The multilayer ceramic electronic component according to claim 17, wherein: The binder includes D-sorbitol.

Images