Liquid supply unit and device and method for processing substrate

Abstract

A device for processing a substrate, comprising: a housing; a supporting unit that supports the substrate in the housing; a nozzle that distributes a processing liquid onto the substrate; and a liquid supply unit that supplies the processing liquid to the nozzle. The liquid supply unit includes: a container having a storage space for storing the processing liquid; a liquid supply pipe through which the processing liquid flows from the container to the nozzle; and an ultrasonic applying member that applies ultrasonic waves to the processing liquid before the processing liquid is supplied to the nozzle. The ultrasonic applying member includes: a liquid reservoir having an internal space for accommodating liquid; and an ultrasonic generator that applies ultrasonic waves to the liquid contained in the liquid reservoir. A portion of the liquid supply pipe is immersed in the liquid contained in the liquid reservoir.

Description

Technical Field

[0001] Embodiments of the inventive concepts described herein relate to a liquid supply unit and an apparatus and method for processing a substrate, and more particularly, to a liquid supply unit for processing a substrate with liquid by dispensing the liquid onto the substrate, and a substrate processing apparatus and method using the liquid supply unit. Background Art

[0002] Various processes such as photolithography, deposition, ashing, etching, ion implantation, etc. are performed to manufacture semiconductor elements. In some of the processes, a processing liquid is dispensed onto a substrate to perform liquid processing on the substrate.

[0003] In the process of dispensing the processing liquid onto the substrate, impurities generated from a liquid supply pipe, a liquid reservoir, a nozzle, etc. for supplying the processing liquid may be supplied to the substrate. Therefore, a filter is installed in the liquid supply pipe to remove the impurities.

[0004] However, the size of impurities that can be filtered via the filter is limited, and thus fine impurities may be provided to the substrate without being filtered by the filter. Summary of the invention

[0005] Embodiments of the inventive concept provide a liquid supply unit for effectively gathering and removing impurities in a processing liquid, and a substrate processing apparatus and method using the liquid supply unit.

[0006] Technical problems to be solved by the present inventive concept are not limited to the above-mentioned problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present inventive concept belongs from the following description.

[0007] According to an exemplary embodiment, a device for processing a substrate includes: a housing having a processing space inside the housing; a support unit supporting the substrate in the housing; a nozzle dispensing a processing liquid onto the substrate supported on the support unit; and a liquid supply unit supplying the processing liquid to the nozzle. The liquid supply unit includes: a container having a storage space for storing the processing liquid; a liquid supply pipe through which the processing liquid flows from the container to the nozzle; and an ultrasonic applying member applying an ultrasonic wave to the processing liquid before the processing liquid is supplied to the nozzle. The ultrasonic applying member includes: a liquid reservoir having an internal space for containing liquid; and an ultrasonic generator applying an ultrasonic wave to the liquid contained in the liquid reservoir. A portion of the liquid supply pipe is immersed in the liquid contained in the liquid reservoir.

[0008] According to one embodiment, the portion of the liquid supply pipe is arranged in a zigzag shape in the area immersed in the liquid contained in the liquid reservoir.

[0009] According to one embodiment, the portion of the liquid supply pipe is arranged in the form of a coil in the area immersed in the liquid contained in the liquid reservoir.

[0010] According to one embodiment, the apparatus may further include a filter installed in the liquid supply pipe and filtering foreign matter from the treatment liquid to be supplied to the nozzle, and the ultrasonic wave applying member may be provided upstream of the filter.

[0011] According to one embodiment, the device may further include an electromagnetic field generator that generates an electromagnetic field in the liquid supply pipe.

[0012] According to one embodiment, the electromagnetic field generator may be arranged downstream of the ultrasonic generator.

[0013] According to one embodiment, the area of ​​the liquid supply pipe immersed in the liquid contained in the liquid reservoir may include: a first tubular portion, through which the treatment liquid flows upward; a second tubular portion, which is connected to the first tubular portion and through which the treatment liquid flows in a direction perpendicular to the first tubular portion; and a third tubular portion, which is connected to the second tubular portion and through which the treatment liquid flows downward, and an electromagnetic field generator may be provided on the third tubular portion.

[0014] According to one embodiment, the treatment liquid may include chemicals or organic solvents.

[0015] According to an exemplary embodiment, the liquid supply unit includes: a container having a storage space for storing a treatment liquid; a liquid supply pipe through which the treatment liquid flows from the container to a nozzle, and an ultrasonic wave applying member that applies ultrasonic waves to the treatment liquid before the treatment liquid is supplied to the nozzle. The ultrasonic wave applying member includes: a liquid reservoir having an internal space for accommodating liquid; and an ultrasonic generator that applies ultrasonic waves to the liquid accommodated in the liquid reservoir. A portion of the liquid supply pipe is immersed in the liquid accommodated in the liquid reservoir.

[0016] According to one embodiment, the portion of the liquid supply pipe immersed in the liquid contained in the liquid reservoir is arranged in a zigzag form.

[0017] According to one embodiment, the liquid supply unit may further include a filter installed in the liquid supply pipe and filtering foreign matter from the treatment liquid to be supplied to the nozzle, and the ultrasonic wave applying member may be provided upstream of the filter.

[0018] According to one embodiment, the liquid supply unit may further include an electromagnetic field generator that generates an electromagnetic field in the liquid supply pipe.

[0019] According to one embodiment, the treatment liquid may include a chemical or an organic solvent, the chemical may be sulfuric acid, hydrofluoric acid or a mixture thereof, and the organic solvent may be isopropyl alcohol.

[0020] According to an exemplary embodiment, a method for treating a substrate with a treatment liquid includes: collecting and removing impurities in the treatment liquid while dispensing the treatment liquid onto the substrate, immersing a liquid supply pipe through which the treatment liquid flows in liquid contained in a liquid reservoir, and applying ultrasonic waves to the liquid to collect the impurities.

[0021] According to one embodiment, the accumulated impurities may be removed by a filter.

[0022] According to one embodiment, the accumulated impurities may be removed by providing an electromagnetic field to a path through which the treatment fluid flows.

[0023] According to one embodiment, the electromagnetic field may be provided downstream of a region of the liquid supply pipe where the ultrasonic waves are applied to the treatment liquid.

[0024] According to one embodiment, the treatment liquid may include a chemical or an organic solvent, the chemical may be sulfuric acid, hydrofluoric acid, or a mixture thereof, and the organic solvent may be isopropyl alcohol. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and wherein:

[0026] Figure 1 is a schematic plan view illustrating a substrate processing apparatus according to an embodiment of the present inventive concept;

[0027] Figure 2 It is shown Figure 1 A schematic diagram of an embodiment of a liquid processing chamber;

[0028] Figure 3 is a schematic diagram illustrating a liquid supply unit according to an embodiment of the present inventive concept;

[0029] Figure 4 and Figure 5 The figures illustrate an ultrasonic wave applying member according to one embodiment and another embodiment of the inventive concept;

[0030] Figures 6 to 8 FIG. 1 is a diagram sequentially illustrating a substrate processing method according to an embodiment of the present inventive concept.

[0031] Fig. 9 and Fig.10 is a schematic diagram illustrating a liquid supply unit according to other embodiments of the present inventive concept; and

[0032] Fig.11 FIG. 2 illustrates an ultrasonic wave applying member according to another embodiment of the present inventive concept. DETAILED DESCRIPTION

[0033] Hereinafter, embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. However, the inventive concept can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the inventive concept will be thorough and complete and will fully convey the scope of the inventive concept to those skilled in the art. In the accompanying drawings, the sizes of the components are exaggerated for clarity of illustration.

[0034] In this embodiment, a cleaning process of treating a substrate with chemicals and a rinse solution will be described as an example. However, this embodiment is not limited thereto and is applicable to a process of treating a substrate using a treatment solution (eg, an etching process, an ashing process, a developing process, etc.).

[0035] Figure 1 is a schematic plan view showing a substrate processing apparatus according to an embodiment of the present inventive concept. Figure 1 , the substrate processing apparatus includes an indexing module 10 and a processing module 20. According to one embodiment, the indexing module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged is referred to as a first direction 92, a direction perpendicular to the first direction 92 when viewed from above is referred to as a second direction 94, and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0036] The indexing module 10 transfers the substrate W from the carrier 80 to the processing module 20, and transports the substrate W completely processed in the processing module 20 into the carrier 80. The indexing module 10 is arranged so that its length direction is parallel to the first direction 92. The indexing module 10 has a loading port 12 and an indexing frame 14. The loading port 12 is located on the opposite side of the processing module 20 relative to the indexing frame 14. The carriers 80 (each having a substrate W accommodated therein) are placed on the loading port 12. The loading port 12 may be arranged along the second direction 94.

[0037] An airtight carrier such as a front opening unified unit (FOUP) may be used as the carrier 80. The carrier 80 may be placed on the load port 12 by a transfer unit (not shown) such as an overhead conveyor, an overhead conveyor, an automatic guided vehicle, or by an operator.

[0038] An indexing robot 120 is provided in the indexing frame 14. A guide rail 140 (whose length direction is parallel to the second direction 94) is provided in the indexing frame 14. The indexing robot 120 can move on the guide rail 140. The indexing robot 120 includes a hand 122 for placing the substrate W. The hand 122 can move forward and backward, can rotate around an axis facing the third direction 96, and can move along the third direction 96. The hands 122 can be spaced apart from each other in the up / down direction. The hands 122 can move forward and backward independently.

[0039] The process module 20 includes a buffer unit 200, a transfer chamber 300, and a liquid treatment chamber 400. The buffer unit 200 provides a space in which a substrate W carried into the process module 20 and a substrate W to be carried out of the process module 20 temporarily stay. Each liquid treatment chamber 400 performs liquid treatment on the substrate W by dispensing liquid onto the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid treatment chamber 400.

[0040] The transfer chamber 300 may be disposed such that its length direction is parallel to the first direction 92. The buffer unit 200 may be disposed between the index module 10 and the transfer chamber 300. The liquid processing chamber 400 may be disposed on an opposite side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be disposed along the second direction 94. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0041] According to an embodiment, on opposite sides of the transfer chamber 300 , the liquid processing chambers 400 may be arranged in an A×B array (A and B are natural numbers of 1 or more) along the first direction 92 and the third direction 96 .

[0042] The transfer chamber 300 has a transfer robot 320. A guide rail 340 (whose length direction is parallel to the first direction 92) may be provided in the transfer chamber 300, and the transfer robot 320 may move along the guide rail 340. The transfer robot 320 includes a hand 322 for placing the substrate W. The hand 322 may move forward and backward, may rotate about an axis facing the third direction 96, and may move along the third direction 96. The hand 322 may be spaced apart from each other in the up / down direction. The hand 322 may move forward and backward independently.

[0043] The buffer unit 200 includes a plurality of buffers 220 in which the substrate W is placed. The buffers 220 may be spaced apart from each other along the third direction 96. The front and rear of the buffer unit 200 are open. The front is a surface facing the index module 10, and the rear is a surface facing the transfer chamber 300. The index robot 120 may approach the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit 200 through the rear.

[0044] Figure 2 It is shown Figure 1 A schematic diagram of one embodiment of a liquid processing chamber 400 is shown. Figure 2 The liquid processing chamber 400 has a housing 410 , a cup-shaped portion 420 , a support unit 440 , a liquid dispensing unit 460 , and a lifting unit 480 .

[0045] The housing 410 has a substantially rectangular parallelepiped shape. The cup 420 , the support unit 440 , and the liquid dispensing unit 460 are disposed in the housing 410 .

[0046] The cup-shaped portion 420 has a processing space opened at the top, and processes the substrate W with liquid in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid dispensing unit 460 dispenses the liquid onto the substrate W supported on the support unit 440. The liquid may be dispensed onto the substrate W in sequence. The lifting unit 480 adjusts the height of the cup-shaped portion 420 relative to the support unit 440.

[0047] According to one embodiment, the cup 420 has a plurality of recovery bowls 422, 424, and 426. The recovery bowls 422, 424, and 426 have a recovery space for recovering liquid used to process the substrate W. The recovery bowls 422, 424, and 426 have a ring shape surrounding the support unit 440. The processing liquid sputtered by the rotation of the substrate W during the liquid treatment process can be introduced into the recovery space through the inlets 422a, 424a, and 426a of the corresponding recovery bowls 422, 424, and 426.

[0048] According to one embodiment, the cup 420 has a first recovery bowl 422, a second recovery bowl 424, and a third recovery bowl 426. The first recovery bowl 422 is disposed around the support unit 440, the second recovery bowl 424 is disposed around the first recovery bowl 422, and the third recovery bowl 426 is disposed around the second recovery bowl 424. The second inlet 424a (through which the liquid is introduced into the second recovery bowl 424) may be located at a higher position than the first inlet 422a (through which the liquid is introduced into the first recovery bowl 422), and the third inlet 426a (through which the liquid is introduced into the third recovery bowl 426) may be located at a higher position than the second inlet 424a.

[0049] The support unit 440 has a support plate 442 and a driving shaft 444. The upper surface of the support plate 442 may have a substantially circular shape and may have a larger diameter than the substrate W. A support pin 442a is provided at a central portion of the support plate 442 to support the rear surface of the substrate W. The support pin 442a protrudes upward from the support plate 442 to space the substrate W from the support plate 442 by a predetermined distance.

[0050] A chuck pin 442b is provided on an edge portion of the support plate 442. The chuck pin 442b protrudes upward from the support plate 442 and supports the side of the substrate W to prevent the substrate W from being disengaged from the support unit 440 when rotating. The drive shaft 444 is driven by an actuator 446. The drive shaft 444 is connected to the center of the rear surface of the support plate 442, and rotates the support plate 442 around its central axis.

[0051] The lifting unit 480 moves the cup 420 in the vertical direction. The height of the cup 420 relative to the substrate W is changed by the vertical movement of the cup 420. Therefore, the recovery bowls 422, 424 and 426 for recovering the processing liquid can be changed according to the type of liquid dispensed onto the substrate W, so that the liquids can be recovered separately. Different from the above description, the cup 420 can be fixed, and the lifting unit 480 can move the support unit 440 in the vertical direction.

[0052] The liquid dispensing unit 460 dispenses the processing liquid onto the substrate W. The liquid dispensing unit 460 includes an arm 461 and a nozzle 462 that is fixedly coupled to an end of the arm 461 and dispenses the liquid onto the substrate W.

[0053] According to one embodiment, the liquid dispensing unit 460 may dispense different types of processing liquids onto the substrate W. The processing liquids may include chemicals, rinse solutions, and organic solvents. The chemicals may include diluted sulfuric acid (H 2 SO 4 ), phosphoric acid (P 2 O 5), hydrofluoric acid (HF) and ammonium hydroxide (NH 4 OH). In addition, the chemical may be a mixture of sulfuric acid and hydrofluoric acid. The organic solvent may be isopropyl alcohol (IPA). The rinse solution may be deionized water (DIW). The liquid supply unit 500 supplies the treatment liquid to the liquid dispensing unit 460.

[0054] In the following, reference will be made to Figures 3 to 5 Embodiments of the inventive concept are described in detail.

[0055] Figure 3 is a schematic diagram illustrating a liquid supply unit according to an embodiment of the present inventive concept. Figure 4 and Figure 5 The drawings illustrate an ultrasonic wave applying member according to one embodiment and another embodiment of the present inventive concept.

[0056] As described above, the processing liquid distributed by the liquid dispensing unit 460 may include chemicals, rinse solutions, and organic solvents. The chemicals may include sulfuric acid, hydrofluoric acid, or a mixture thereof. The organic solvent may be isopropyl alcohol (IPA). In the following embodiments, it will be illustrated that chemicals are distributed onto the substrate W, and the chemicals include sulfuric acid, hydrofluoric acid, or a mixture thereof.

[0057] refer to Figure 3 , the liquid supply unit 500 may include a treatment liquid supply source 510 , a container 530 , a liquid supply pipe 540 , a filter 560 , and an ultrasonic wave applying member 520 .

[0058] The treatment liquid supply source 510 supplies chemicals to the container 530. The treatment liquid supply source 510, the container 530, and the nozzle 462 are connected through a liquid supply pipe 540, and a first valve 552, a second valve 554, and a third valve 556 are installed in the liquid supply pipe 540. The first valve 552, the second valve 554, and the third valve 556 may be an on / off valve or a flow rate control valve.

[0059] The first valve 552 adjusts the flow rate of the chemical supplied from the process liquid supply source 510 to the container 530. The second valve 554 adjusts the flow rate of the chemical supplied from the container 530 to the filter 560. The third valve 556 adjusts the flow rate of the chemical dispensed onto the substrate W through the nozzle 462. The container 530 receives the chemical from the process liquid supply source 510 and stores the chemical. The chemical in the container 530 is supplied to the nozzle 462.

[0060] In one embodiment, a second valve 554 and a flow meter 559 may be installed in the liquid supply pipe 540. The second valve 554 may adjust the flow rate of the chemical supplied from the container 530. The second valve 554 may be an on / off valve or a flow rate control valve. The flow meter 559 may directly or indirectly measure the flow rate of the chemical flowing through the liquid supply pipe 540.

[0061] According to one embodiment, the filter 560 is disposed downstream of the ultrasonic wave applying member 520, the second valve 554, the pump 558, and the flow meter 559. Therefore, impurities generated when the chemical passes through the second valve 554, the pump 558, or the flow meter 559 and impurities accumulated in the ultrasonic wave applying member 520 may be filtered by the filter 560.

[0062] like Figure 4 As shown, the ultrasonic applying member 520 includes a reservoir 522 and an ultrasonic generator 524. The reservoir 522 has an internal space for accommodating liquid therein. In one embodiment, the internal space of the reservoir 522 is isolated from the outside. Therefore, the reduction of the liquid level due to evaporation of the liquid in the reservoir 522 can be prevented. Alternatively, the reservoir 522 can be configured to be open at the top. In one embodiment, the liquid contained in the reservoir 522 is water. A portion of the liquid supply pipe 540 is immersed in the liquid contained in the internal space of the reservoir 522.

[0063] The ultrasonic generator 524 applies ultrasonic waves to the liquid contained in the liquid reservoir 522. The ultrasonic waves are applied to the inside of the liquid supply pipe 540, a portion of which is immersed in the liquid in the liquid reservoir 522. In one embodiment, in the area 548 immersed in the liquid contained in the liquid reservoir 522, a portion of the liquid supply pipe 540 is arranged in a zigzag form.

[0064] refer to Figure 5 , the ultrasonic wave applying member 520 may include an electromagnetic field generator 526. In one embodiment, a region 548 of the liquid supply pipe 540 immersed in the liquid contained in the liquid reservoir 522 includes a first tubular portion 542, a second tubular portion 544, and a third tubular portion 546. The first tubular portion 542 is configured so that the chemical flows upward through the first tubular portion 542. The second tubular portion 544 is connected to the first tubular portion 542 and is configured so that the chemical flows through the second tubular portion 544 in a direction perpendicular to the first tubular portion 542. The third tubular portion 546 is connected to the second tubular portion 544 and is configured so that the chemical flows downward through the third tubular portion 546. The electromagnetic field generator 526 is provided on one of the third tubular portions 546.

[0065] In the following, reference will be made to Figure 6 and Figure 7The substrate processing method of the present invention is described in detail. First, chemicals are supplied from the processing liquid supply source 510 to the liquid supply pipe 540. Then, the ultrasonic generator 524 applies ultrasonic waves to the chemicals. When ultrasonic waves are applied to the chemicals, as shown in FIG. Figure 6 As shown, bubbles B are generated in the chemical. The bubbles B generated in the liquid supply pipe 540 move upward in the liquid supply pipe 540. After the bubbles B are generated in the chemical, the bubbles B and the impurities P collide with each other, and the impurities P gather around the bubbles B in the process.

[0066] In one embodiment, the impurities P generated by sulfuric acid, hydrofluoric acid or a mixture thereof are mainly positively charged, while the bubbles B are negatively charged. Therefore, the impurities P gather around the bubbles B. After the positively charged impurities P gather around the negatively charged bubbles B, the negatively charged impurities P also gather together. Therefore, the impurities P gather to a size that can be filtered by the filter 560.

[0067] Some bubbles B generated in the chemical may burst before moving to the upper portion of the liquid supply pipe 540. The bursting energy of the bubbles B is generated around the area where the bubbles B are burst. Due to this, a hot spot is formed where the temperature is locally increased due to the impact applied to the chemical or the adiabatic expansion of the chemical. Due to the high temperature and high pressure environment of the hot spot, the impurities P actively gather around the hot spot. Therefore, the impurities P gather in a short time.

[0068] The accumulated impurities P are removed by the filter 560. In one embodiment, the accumulated impurities P may be removed by providing an electromagnetic field to the path where the chemical flows before being removed by the filter 560. For example, an electromagnetic field generator 526 is provided on one of the third tubular portions 546. In the case where the air bubbles B are mainly negatively charged, positive charges are applied to the electromagnetic field generator 526, and the air bubbles B are captured by the electromagnetic field generator 526. The positively charged impurities P are gathered onto the negatively charged impurities P, and are captured by the electromagnetic field generator 526 together with the air bubbles B.

[0069] When the chemical is dispensed onto the substrate W, power may be supplied to the electromagnetic field generator 526 to capture the impurities P, and when the chemical is not dispensed onto the substrate W, the electromagnetic field generator 526 may be powered off. The bubbles B move upward in the liquid supply pipe 540 due to their nature. The bubbles B move at the lowest speed in the third tubular portion 546, in which the flow direction of the chemical is different from the moving direction of the bubbles B. Therefore, the electromagnetic field generator 526 is installed on one of the third tubular portions 536 in order to capture the impurities B gathered around the bubbles B.

[0070] In the above-mentioned embodiment, it has been described that the electromagnetic field generator 526 is provided in the ultrasonic wave applying member 520. However, in another embodiment, as Fig. 9 As shown, the electromagnetic field generator 526 may be disposed downstream of the ultrasonic wave applying member 520. Therefore, the impurities P gathered by the bubbles B generated by the ultrasonic wave applying member 520 may be captured.

[0071] In the above-mentioned embodiment, it has been described that the liquid supply unit 500 of the present inventive concept includes both the electromagnetic field generator 526 and the filter 560. However, in another embodiment, as Fig.10 As shown, the liquid supply unit may not include the filter 560. For example, the electromagnetic field generator 526 is disposed downstream of the ultrasonic generator 524, and captures impurities P gathered by the bubbles B. When the chemical is dispensed onto the substrate W, power is supplied to the electromagnetic field generator 526 to capture the impurities P, and when the chemical is not dispensed onto the substrate W, the electromagnetic field generator 526 is powered off. After the electromagnetic field generator 526 is powered off, the impurities P floating in the chemical can be removed by performing pre-dispensing.

[0072] In the above-mentioned embodiment, it has been described that a portion of the liquid supply pipe 540 is arranged in a zigzag form in the area 548 immersed in the liquid contained in the liquid reservoir 522. However, in another embodiment, as Fig.11 As shown, a portion of the liquid supply tube 540 may be disposed in a coil in a region 548 that is immersed in the liquid contained in the reservoir 522 .

[0073] In the above-described embodiment, the ultrasonic generator 524 is shown as being attached to the lower portion of the outer wall of the reservoir 522. However, in another embodiment, the ultrasonic generator 524 may be attached to the upper portion or side portion of the outer wall of the reservoir 522, or may be disposed inside the reservoir 522 to apply ultrasonic waves to the interior of the reservoir 522.

[0074] In the above-mentioned embodiment, it has been illustrated that ultrasonic waves are applied to the liquid contained in the liquid reservoir 522 and are transmitted to the chemicals through the liquid. However, the inventive concept is not limited thereto. An ultrasonic wave applying member according to another embodiment may include a tank having a containing space and a probe for generating ultrasonic waves. The probe may be arranged in the containing space of the tank. Chemicals may be supplied to the containing space of the tank. In this case, the probe arranged in the containing space may directly apply ultrasonic waves to the chemicals supplied to the containing space. Therefore, an ultrasonic wave applying component according to another embodiment may further improve the efficiency of removing impurities P floating in the chemicals.

[0075] According to the inventive concept, the ultrasonic applying member 520 is disposed upstream of the filter 560. Therefore, before the chemicals flowing through the liquid supply pipe 540 reach the filter 560, impurities are gathered in the chemicals and become larger in size. As described above, impurities in the chemicals are gathered in front of the filter 560 and filtered by the filter 560. Therefore, the circulation path of the chemicals can be reduced or omitted.

[0076] According to the present inventive concept, the area 548 of the liquid supply pipe 540 immersed in the liquid contained in the liquid reservoir 522 is arranged in a zigzag form or a coil form. Therefore, the surface area of ​​the liquid supply pipe 540 to which ultrasonic waves are applied can be increased, so bubbles B can be easily generated.

[0077] According to embodiments of the inventive concept, impurities in a treatment liquid may be effectively aggregated and removed.

[0078] The effects of the present inventive concept are not limited to the above-mentioned effects, and any other effects not mentioned herein may be clearly understood by those skilled in the art to which the present inventive concept belongs based on the specification and the accompanying drawings.

[0079] The above description illustrates the inventive concept. In addition, the above content describes exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, changes and environments. That is, the inventive concept can be modified or modified without departing from the scope of the inventive concept disclosed in the specification, the scope equivalent to the written disclosure and / or the technology or knowledge scope of those skilled in the art. The written implementation describes the best state of the technical spirit for realizing the inventive concept, and various changes required for the specific application and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed implementation state. In addition, it should be interpreted that the attached claims include other implementations.

[0080] Although the present invention has been described with reference to exemplary embodiments, it is apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. A device for processing a substrate, the device include: A housing having a processing space therein; a supporting unit configured to support the substrate in the housing; a nozzle configured to dispense a processing liquid onto the substrate supported on the support unit; and a liquid supply unit configured to supply the treatment liquid to the nozzle, Wherein the liquid supply unit comprises: a container having a storage space for storing the treatment liquid, a liquid supply pipe through which the treatment liquid flows from the container to the nozzle, and an ultrasonic wave applying member configured to apply ultrasonic waves to the treatment liquid before the treatment liquid is supplied to the nozzle, Wherein, the ultrasonic applying component comprises: a liquid reservoir having an inner space for accommodating liquid; and an ultrasonic generator configured to apply ultrasonic waves to the liquid contained in the liquid reservoir, and to generate bubbles in the treatment liquid when the ultrasonic waves are applied to the treatment liquid, and wherein a portion of the liquid supply pipe is immersed in the liquid contained in the liquid reservoir, The ultrasonic wave applying member further includes an electromagnetic field generator configured to generate an electromagnetic field in the liquid supply pipe, the electromagnetic field generator being disposed downstream of the ultrasonic generator and capturing impurities gathered by the bubbles, Wherein, the area of ​​the liquid supply pipe immersed in the liquid contained in the liquid reservoir includes: a first tubular portion through which the treatment liquid flows upward; a second tubular portion connected to the first tubular portion and through which the treatment liquid flows in a direction perpendicular to the first tubular portion; and a third tubular portion connected to the second tubular portion and through which the treatment liquid flows downward, and Wherein, the electromagnetic field generator is only arranged on the third tubular portion.

2. The device according to claim 1, in, The portion of the liquid supply pipe is disposed in a zigzag shape in a region immersed in the liquid contained in the liquid reservoir.

3. The device according to claim 1, in, The portion of the liquid supply pipe is provided in a coil form in a region immersed in the liquid contained in the liquid reservoir.

4. The device according to any one of claims 1 to 3, further comprising: include: a filter installed in the liquid supply pipe and configured to filter impurities from the treatment liquid to be supplied to the nozzle, Wherein, the ultrasonic wave applying member is arranged upstream of the filter.

5. The device according to any one of claims 1 to 3, in, The treatment liquid includes chemicals or organic solvents.

6. A liquid supply unit, include: a container having a storage space for storing a treatment liquid, a liquid supply pipe through which the treatment liquid flows from the container to the nozzle, and an ultrasonic wave applying member configured to apply ultrasonic waves to the treatment liquid before the treatment liquid is supplied to the nozzle, Wherein, the ultrasonic applying component comprises: a liquid reservoir having an inner space for accommodating liquid; and an ultrasonic generator configured to apply ultrasonic waves to the liquid contained in the liquid reservoir, and to generate bubbles in the treatment liquid when the ultrasonic waves are applied to the treatment liquid, and wherein a portion of the liquid supply pipe is immersed in the liquid contained in the liquid reservoir, and the ultrasonic applying member further comprises: an electromagnetic field generator configured to generate an electromagnetic field in the liquid supply pipe, the electromagnetic field generator being disposed downstream of the ultrasonic generator and capturing impurities gathered by the bubbles, Wherein, the area of ​​the liquid supply pipe immersed in the liquid contained in the liquid reservoir includes: a first tubular portion through which the treatment liquid flows upward; a second tubular portion connected to the first tubular portion and through which the treatment liquid flows in a direction perpendicular to the first tubular portion; and a third tubular portion connected to the second tubular portion and through which the treatment liquid flows downward, and Wherein, the electromagnetic field generator is only arranged on the third tubular portion.

7. The liquid supply unit according to claim 6, in, The portion of the liquid supply pipe immersed in the liquid contained in the liquid reservoir is arranged in a zigzag shape.

8. The liquid supply unit according to claim 6 or 7, further comprising: include: a filter installed in the liquid supply pipe and configured to filter impurities from the treatment liquid to be supplied to the nozzle, Wherein, the ultrasonic wave applying member is arranged upstream of the filter.

9. The liquid supply unit according to claim 6 or 7, in, The treatment liquid includes chemicals or organic solvents, wherein the chemical is sulfuric acid, hydrofluoric acid or a mixture thereof, and Wherein, the organic solvent is isopropanol.

10. A method for treating a substrate with a treatment liquid by dispensing the treatment liquid onto the substrate, the method include: while dispensing the processing liquid onto the substrate, collecting and removing impurities in the processing liquid, wherein a liquid supply pipe through which the treatment liquid flows is immersed in liquid contained in a liquid reservoir, and ultrasonic waves are applied to the liquid to gather the impurities, wherein the ultrasonic wave is applied to the treatment liquid to generate bubbles in the treatment liquid, wherein the electromagnetic field generator is configured to generate an electromagnetic field in the liquid supply pipe and provide the electromagnetic field downstream of a region of the liquid supply pipe where the ultrasonic wave is applied to the treatment liquid, and capture impurities gathered by the bubbles; Wherein, the area of ​​the liquid supply pipe immersed in the liquid contained in the liquid reservoir includes: a first tubular portion through which the treatment liquid flows upward; a second tubular portion connected to the first tubular portion and through which the treatment liquid flows in a direction perpendicular to the first tubular portion; and a third tubular portion connected to the second tubular portion and through which the treatment liquid flows downward, and Wherein, the electromagnetic field generator is only arranged on the third tubular portion.

11. The method according to claim 10, in, The accumulated impurities are removed by means of filters.

12. The method according to claim 10 or 11, in, The treatment liquid includes chemicals or organic solvents.

13. The method according to claim 12, in, The chemical is sulfuric acid, hydrofluoric acid or a mixture thereof.

14. The method according to claim 12, in, The organic solvent is isopropanol.

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