Organic light-emitting panel and organic light-emitting display device including the same

Abstract

An organic light-emitting panel and an organic light-emitting display device including the organic light-emitting panel are provided. In the organic light-emitting panel, a planarization layer has at least one contact hole in an active area, and a first side surface of the planarization layer located in an inactive area and closest to a dam portion has a first inclination relative to a top surface of a substrate that is smaller than a second inclination of a second side surface of the planarization layer surrounding the contact hole relative to the top surface of the substrate. Due to the gentle inclination of the first side surface of the planarization layer, each of the connection electrode, dam portion, and first encapsulation layer disposed on the first side surface of the planarization layer may also have a gentle inclination, so that a second encapsulation layer material having higher fluidity may flow along the top surface of the first encapsulation layer, thereby covering the surfaces of the planarization layer and dam portion in the inactive area. Thus, the encapsulation capability of the encapsulation component in the inactive area is improved.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2019-0179716, filed on December 31, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Embodiments relate to an organic light emitting panel and an organic light emitting display device including the same, and more particularly, to an organic light emitting panel and an organic light emitting display device having a reliable encapsulation layer structure. Background Art

[0004] Organic light-emitting display devices are self-luminous display devices. Unlike liquid crystal display (LCD) devices, organic light-emitting display devices do not require a separate light source and can be manufactured with a thin and lightweight design. Furthermore, organic light-emitting display devices not only have advantages in terms of power consumption due to their low driving voltage, but also have excellent characteristics such as high color reproduction, fast response speed, wide viewing angle, and high contrast ratio (CR). Therefore, organic light-emitting display devices have been studied as next-generation display devices.

[0005] Since the light-emitting layer uses organic materials, organic light-emitting display devices are susceptible to oxygen, moisture, etc. Therefore, in order to minimize the penetration of oxygen, moisture, etc. from the external environment into the organic layers including the light-emitting layer, various technical solutions are being used to seal organic light-emitting elements such as organic light-emitting diodes (OLEDs). Summary of the Invention

[0006] Thin-film encapsulation technology, which alternates inorganic and organic layers, has been used to encapsulate organic light-emitting elements such as organic light-emitting diodes (OLEDs). For example, a three-layer encapsulation layer structure may be used. Here, the encapsulation layer structure may include a first encapsulation layer, a second encapsulation layer disposed on the first encapsulation layer, and a third encapsulation layer disposed on the second encapsulation layer.

[0007] In a case where the first encapsulation layer has a defective region caused by foreign matter or particles, the first encapsulation layer may be protected by a second encapsulation layer covering the first encapsulation layer.

[0008] However, due to the high fluidity of the second encapsulation layer material containing an organic material, the second encapsulation layer may exceed the actual design. In the case where the second encapsulation layer material is applied in a smaller amount in consideration of its fluidity, the second encapsulation layer may be provided only on a portion of the top surface of the bank in the inactive area of the organic light-emitting panel.

[0009] In this case, the second encapsulation layer material will not properly cover the first encapsulation layer. In the case of a defective area in the first encapsulation layer, moisture or oxygen may penetrate into the defective area of the first encapsulation layer. In this regard, even considering the fluidity of the second encapsulation layer material, the inventors of the present disclosure have invented a novel structure and method for manufacturing an organic light-emitting panel and an organic light-emitting display device, in which an encapsulation layer structure including an organic layer can be arranged to cover the surface of the bank and the planarization layer in the non-active area.

[0010] According to an embodiment of the present disclosure, an organic light-emitting panel and an organic light-emitting display device having such a structure are provided, through which the inclination of the first side surface of the planarization layer arranged closest to the dam portion in the inactive area can be adjusted to control the fluidity of the second encapsulation layer material on the first side surface of the planarization layer, so that even if the second encapsulation layer material is applied to the surface of the substrate in a small amount, the second encapsulation layer can still be arranged in the inactive area to cover the dam portion and the planarization layer.

[0011] The purpose of the present disclosure is not limited to the foregoing description, and those skilled in the art in the technical field to which the present disclosure belongs will clearly understand other purposes not explicitly disclosed herein from the description provided later.

[0012] According to the planarization layer and embankment structure of the embodiment of the present disclosure, an organic light-emitting panel is provided, which has a structure in which a second encapsulation layer can cover the surface of the planarization layer and the embankment in the inactive area. The organic light-emitting panel having an active area and an inactive area located outside the active area includes a planarization layer provided on a substrate, the planarization layer having at least one contact hole provided in the active area. The organic light-emitting panel further includes an organic light-emitting diode, the organic light-emitting diode including: a first electrode provided on the planarization layer; a embankment provided on a portion of the top surface of the planarization layer and a portion of the top surface of the first electrode; an organic layer provided on the top surface of the first electrode in a first opening area of the embankment provided in the active area; and a second electrode provided on the organic layer and the embankment. The organic light-emitting panel further includes: at least one dam located in the inactive area to surround the active area; and an encapsulation member provided on the second electrode and the substrate on which the dam is provided. Among the side surfaces of the planarization layer, a first side surface of the planarization layer located in the ineffective area and closest to the dam portion has a first inclination relative to the top surface of the substrate that is smaller than a second inclination of a second side surface of the planarization layer surrounding the contact hole relative to the top surface of the substrate.

[0013] According to an embodiment of the present disclosure, a planarization layer and bank structure provides an organic light-emitting display device having a structure in which a second encapsulation layer can cover the surface of the planarization layer and bank in an inactive area. The organic light-emitting display device includes an organic light-emitting panel having an active area and an inactive area located outside the active area, and a driver circuit for driving the organic light-emitting panel. The organic light-emitting panel includes a planarization layer disposed on a substrate, the planarization layer having at least one contact hole disposed in the active area. The organic light-emitting panel further includes an organic light-emitting diode (OLED), the OLED comprising: a first electrode disposed on the planarization layer; a bank disposed on a portion of the top surface of the planarization layer and a portion of the top surface of the first electrode; an organic layer disposed on the top surface of the first electrode in a first opening region of the bank disposed in the active area; and a second electrode disposed on the organic layer and the bank. The organic light-emitting panel further includes: at least one bank located in the inactive area to surround the active area; and an encapsulation member disposed on the second electrode and the substrate having the bank disposed thereon. Among the side surfaces of the planarization layer, a first side surface of the planarization layer located in the ineffective area and closest to the dam portion has a first inclination relative to the top surface of the substrate that is smaller than a second inclination of a second side surface of the planarization layer surrounding the contact hole relative to the top surface of the substrate.

[0014] According to an embodiment of the present disclosure, the first side surface of the planarization layer located in the inactive region and closest to the dam portion has a first inclination relative to the top surface of the substrate that is smaller than the second side surface of the planarization layer surrounding the contact hole relative to the top surface of the substrate. Therefore, the second encapsulation layer can be provided to cover the surface of the planarization layer and the dam portion in the inactive region, thereby improving the encapsulation capability of the encapsulation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other objects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a schematic diagram illustrating an example system of an organic light emitting display device according to an embodiment;

[0017] Figure 2 is a plan view schematically illustrating a display panel structure of an organic light emitting display device according to an embodiment;

[0018] Figure 3 yes Figure 2 A cross-sectional view of region X (i.e., a portion of the effective area) in FIG;

[0019] Figure 4 It is along Figure 2 A cross-sectional view taken along line AB in FIG.

[0020] Figure 5 yes Figure 4 An enlarged view of part K in FIG;

[0021] Figure 6 is a cross-sectional view illustrating a portion of an active area and a portion of a non-active area of a display device according to another embodiment;

[0022] Figure 7 yes Figure 6 An enlarged view of part L in FIG;

[0023] Figure 8 is a cross-sectional view illustrating a portion of an active area and a portion of a non-active area of a display device according to another embodiment;

[0024] Figure 9 yes Figure 8 Magnified view of portion M in FIG. DETAILED DESCRIPTION

[0025] The advantages and features of the present disclosure and their implementation methods will be apparent through reference to the accompanying drawings and detailed description of the embodiments. The present disclosure should not be construed as being limited to the embodiments set forth herein and may be implemented in a variety of different forms. Rather, these embodiments are provided to make the present disclosure comprehensive and complete and to fully convey the scope of the present disclosure to those of ordinary skill in the art. The scope of the present disclosure should be defined by the appended claims.

[0026] The shapes, sizes, proportions, angles, quantities, etc. depicted in the accompanying drawings for the purpose of illustrating the embodiments are merely illustrative, and the present disclosure is not limited to the embodiments shown in the accompanying drawings. Throughout the application, the same figure numerals and symbols will be used to refer to the same or similar parts. In the description below the present disclosure, in the event that the subject matter of the present disclosure is not clear, the detailed description of the known functions and components incorporated into the present disclosure will be omitted. It will be understood that the terms "comprises," "comprising," "having," and any variations thereof used herein are intended to cover non-exclusive inclusions, unless clearly described to the contrary. The description of the components in the singular used herein is intended to include the description of the components in the plural form, unless clearly described to the contrary.

[0027] When analyzing components, it should be understood that a margin of error is included even if not explicitly described.

[0028] When spatially relative terms such as "on," "over," "below," "under," and "on one side of" are used herein to describe the relationship between one element or component and another element or component, one or more intervening elements or components may be present between the one and the other element or component unless terms such as "immediately" or "directly" are used.

[0029] In addition, the text may use terms such as "first" and "second" to describe various components. However, it should be understood that these components are not limited by these terms. These terms are merely used to distinguish one element or component from other elements or components. Thus, within the spirit of the present disclosure, a first component referred to as first below may be a second component.

[0030] The features of the embodiments of the present disclosure may be combined or combined with each other in part or in whole, and may work in conjunction with each other or may operate in various technical methods. In addition, the various embodiments may be implemented independently or may be related to each other and implemented in conjunction with each other.

[0031] Hereinafter, various configurations of an organic light emitting panel and an organic light emitting display device, each including a planarization layer and a bank structure, according to embodiments will be described in detail.

[0032] According to the configuration of an organic light-emitting panel and an organic light-emitting display device of the present disclosure, there is provided an organic light-emitting panel having an active area and an inactive area located outside the active area. The organic light-emitting panel may include: a substrate; a planarization layer disposed on the substrate, the planarization layer having at least one contact hole disposed in the active area; a first electrode disposed on the planarization layer; a dam disposed on a portion of a top surface of the planarization layer and a portion of a top surface of the first electrode; an organic layer disposed on the top surface of the first electrode in a first opening region of the dam disposed in the active area; a second electrode disposed on the organic layer and the dam; at least one dam located in the inactive area to surround the active area; and an encapsulation member disposed on the second electrode and the substrate on which the dam is disposed. Among the side surfaces of the planarization layer, a first side surface of the planarization layer located in the inactive area and closest to the dam has a first inclination relative to the top surface of the substrate that is smaller than a second inclination of a second side surface of the planarization layer surrounding the contact hole relative to the top surface of the substrate.

[0033] According to the configuration of the organic light-emitting panel and the organic light-emitting display device of the present disclosure, in the inactive area, the first side surface of the embankment located in the inactive area and closest to the dam portion may overlap with the first side surface of the planarization layer, and one edge of the embankment may overlap with one edge of the planarization layer.

[0034] In the inactive region, a third inclination of the first side surface of the bank relative to the top surface of the substrate may be equal to or greater than the first inclination of the planarization layer. The third inclination may be less than a fourth inclination of the second side surface of the bank relative to the top surface of the substrate in the first opening region surrounding the bank. The first encapsulation layer of the encapsulation member may be disposed on the first side surface of the bank, and in a region corresponding to the region where the first side surface of the bank is disposed, the first encapsulation layer has an inclination corresponding to the third inclination. In the inactive region, the outermost portion of the top surface of the planarization layer and the outermost portion of the top surface of the bank may be disposed equally spaced from the dam, and the end portion of the first side surface of the planarization layer and the end portion of the first side surface of the bank may be disposed equally spaced from the dam. Alternatively, in the inactive region, the outermost portion of the top surface of the planarization layer may be spaced farther from the dam than the outermost portion of the top surface of the bank, and the end portion of the first side surface of the planarization layer and the end portion of the first side surface of the bank may be equally spaced from the dam.

[0035] According to the configuration of the organic light-emitting panel and the organic light-emitting display device of the present disclosure, in the inactive region, the bank may be provided to cover the first side surface of the planarization layer.

[0036] In the inactive area, a third inclination of the first side surface of the embankment relative to the top surface of the substrate may be smaller than the first inclination of the planarization layer. The third inclination may be smaller than a fourth inclination of the second side surface of the embankment in the first opening area surrounding the embankment relative to the top surface of the substrate. The first encapsulation layer of the encapsulation member may be provided on the first side surface of the embankment, and in an area corresponding to an area in which the first side surface of the embankment is provided, the first encapsulation layer may have an inclination corresponding to the third inclination. In the inactive area, an outermost portion of the top surface of the planarization layer may be provided closer to the dam than an outermost portion of the top surface of the embankment, and an end portion of the first side surface of the planarization layer may be spaced farther from the dam than an end portion of the first side surface of the embankment.

[0037] According to configurations of the organic light emitting panel and the organic light emitting display device of the present disclosure, in the inactive region, the bank may be provided to overlap with the top surface of the planarization layer and expose the first side surface of the planarization layer.

[0038] Here, the third inclination of the first side surface of the embankment located in the inactive area and closest to the dam relative to the top surface of the substrate may be smaller than the first inclination of the planarization layer. The third inclination may be smaller than the fourth inclination of the second side surface of the embankment in the first opening area surrounding the embankment relative to the top surface of the substrate. The outermost portion of the top surface of the planarization layer may be positioned closer to the dam than the end portion of the first side surface of the embankment. The first encapsulation layer of the encapsulation member may be provided on the first side surface of the embankment and the first side surface of the planarization layer, and the inclination of the first encapsulation layer relative to the top surface of the substrate may vary at the boundary between the first side surface of the embankment and the first side surface of the planarization layer.

[0039] According to configurations of the organic light-emitting panel and the organic light-emitting display device of the present disclosure, an angle defined between the first side surface of the planarization layer and the top surface of the substrate may range from 15° to 30°.

[0040] According to the configurations of the organic light-emitting panel and the organic light-emitting display device of the present disclosure, in the inactive region, a second encapsulation layer may be provided to cover the first side surface of the planarization layer and the bank.

[0041] According to the configurations of the organic light emitting panel and the organic light emitting display device of the present disclosure, one edge of the second encapsulation layer of the encapsulation member may be disposed closer to the dam portion than the planarization layer and the bank portion.

[0042] According to the configuration of the organic light-emitting panel and the organic light-emitting display device of the present disclosure, the embankment may have at least one second opening area, the at least one second opening area exposing the connecting electrode on the planarization layer arranged in the non-effective area, and the third inclination of the first side surface of the embankment arranged closest to the dam portion relative to the top surface of the substrate may be smaller than the fifth inclination of the third side surface of the embankment surrounding the second opening area relative to the top surface of the substrate.

[0043] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0044] Figure 1 is a schematic diagram illustrating an example system of an organic light emitting display device according to an embodiment.

[0045] Reference Figure 1 In the organic light-emitting display device 100 according to the embodiment, a data driver (DDR) may be implemented using a COF structure among multiple structures such as a tape automated bonding (TAB) structure, a chip on glass (COG) structure, and a chip on film (COF) structure, and a gate driver (GDR) may be implemented using a GIP structure among various structures such as a TAB structure, a COG structure, a COF structure, and a gate in panel (GIP) structure.

[0046] The data driver (DDR) may be composed of one or more source driver integrated circuits (ICs) SDIC. Figure 1 , a case where a data driver (DDR) is composed of a plurality of source driver ICs SDIC is shown.

[0047] In the case where the data driver (DDR) has a COF structure, source driver ICs DIC of the data driver (DDR) may be mounted on the source-side circuit films SF, respectively.

[0048] One side of each source-side circuit film SF may be electrically connected to a pad assembly (ie, an assembly of pads) present in the non-active area NA of the display panel 110 .

[0049] Wires may be provided on the source-side circuit film SF to electrically connect the source driver IC SDIC and the display panel 110 .

[0050] Electronic devices of the organic light emitting display apparatus 100 may include at least one source PCB SPCB and a control PCB CPCB on which control components and various electronic devices are mounted, such that a plurality of source driver ICs SDIC and other devices are circuit-connected.

[0051] The other side of each source side circuit film SF on which the source driver IC SDIC is mounted may be connected to at least one source PCB SPCB.

[0052] That is, one side of each source side circuit film SF on which the source driver IC SDIC is mounted may be electrically connected to the non-active area NA of the display panel 110 , and the other side thereof may be electrically connected to the source PCB SPCB.

[0053] A controller CTR controlling operations of a data driver (DDR), a gate driver (GDR), etc. may be provided on the control PCB CPCB.

[0054] In addition, a power management IC (PMIC) or the like may be provided on the control PCB CPCB to provide various forms of voltage or current to the display panel 110, the data driver (DDR), the gate driver (GDR), etc. or to control various forms of voltage or current to be provided thereto.

[0055] The source PCB SPCB and the control PCB CPCB may be connected to each other via at least one connector CBL. The connector CBL may be, for example, a flexible printed circuit (FPC), a flexible flat cable (FFC), or the like.

[0056] At least one source PCB SPCB and a control PCB CPCB may be combined into a single PCB.

[0057] In the case of implementing the gate driver (GDR) using the GIP structure, a plurality of gate driver circuits (GDC) of the gate driver (GDR) may be directly disposed on the non-active area NA of the display panel 110 .

[0058] Each of the plurality of gate driver circuits may output a scan signal (SCAN) to a corresponding gate line (GL) among a plurality of gate lines (GL) located in the active area AA of the display panel 110 .

[0059] Various signals required to generate scan signals (e.g., a clock signal, a high-level gate voltage (VGH), a low-level gate voltage (VGL), a start signal (VST), and a reset signal (RST)) can be provided to multiple gate driver circuits arranged on the display panel 110 through gate drive-related wires located in the non-active area NA.

[0060] The gate driving-related conductive lines located in the non-active area NA may be electrically connected to some of the source side circuit films SF disposed closest to the plurality of gate driver circuits (GDC) among the source side circuit films SF.

[0061] Figure 2 is a plan view schematically illustrating a display panel structure of an organic light emitting display device according to an embodiment.

[0062] Reference Figure 2 The display panel 110 of the organic light emitting display device according to the embodiment may include an active area AA in which a plurality of sub-pixels SP are disposed and a non-active area NA disposed around the active area AA.

[0063] Although not shown in the drawings, a single sub-pixel SP may include at least one light emitting region and a non-light emitting region surrounding the light emitting region.

[0064] At least one dam portion 295 surrounding the circumference of the active area AA may be provided in the non-active area NA of the display panel 110 .

[0065] For example, the dam portion 295 may include a first dam portion 296 surrounding the effective area AA while being spaced apart from the effective area AA, a second dam portion 297 surrounding the first dam portion 296 while being spaced apart from the first dam portion 296, and a third dam portion 298 surrounding the second dam portion 297 while being spaced apart from the second dam portion 297.

[0066] although Figure 2 , a structure of the dam portion 295 including three dam portions is shown in FIG, but embodiments of the present disclosure are not limited thereto. The display panel 110 according to an embodiment may include one or more dam portions.

[0067] In the active area AA of the display panel 110, an encapsulation member including first, second, and third encapsulation layers 292 and 293 may be provided on the substrate 210. The encapsulation member may be provided to extend to at least a portion of the non-active area NA.

[0068] That is, the encapsulation member including the first encapsulation layer, the second encapsulation layer 292 , and the third encapsulation layer 293 may be disposed to cover the active area AA of the display panel 110 .

[0069] The first encapsulation layer among these components of the encapsulation member may overlap with the third encapsulation layer 293. The first and third encapsulation layers 293 may overlap with the first to third dams 296 to 298. Here, at least one edge of the first encapsulation layer may overlap with one edge of the third encapsulation layer 293.

[0070] In addition, the second encapsulation layer 292 may overlap the first and third encapsulation layers 293. In a plan view, the area of the second encapsulation layer 292 may be smaller than the areas of each of the first and third encapsulation layers 293.

[0071] In addition, the second encapsulation layer 292 may be spaced apart from at least two dams among the first to third dams 296 to 298. Figure 2 As shown in FIG, the second encapsulation layer 292 may be spaced apart from the first to third dams 296 to 298.

[0072] In this case, one edge of the second encapsulation layer 292 may be disposed closer to the active area AA of the display panel 110 than one edge of each of the first to third dams 296 to 298 , the first encapsulation layer, and the third encapsulation layer 293 .

[0073] However, the structure of the second encapsulation layer 292 according to the embodiment is not limited thereto, and the second encapsulation layer 292 may be in contact with a portion of the first dam 296 while being spaced apart from the second dam 297 and the third dam 298 .

[0074] The structure of the panel will be discussed in detail below.

[0075] Figure 3 yes Figure 2 sectional view of region X (ie, a portion of the effective area) in FIG.

[0076] Reference Figure 3 , the active area AA of the display panel 110 of the organic light emitting display device according to the embodiment may include a plurality of light emitting areas EA and non-light emitting areas NEA surrounding the light emitting areas EA.

[0077] In the active area AA of the display panel 110 , at least one transistor 310 , at least one storage capacitor 320 , and at least one organic light emitting element or organic light emitting diode (OLED) 380 may be disposed on the substrate 210 .

[0078] The transistor 310 may include an active layer 311 , a gate electrode 312 , a source electrode 313 , and a drain electrode 314 .

[0079] The storage capacitor 320 may include a first storage capacitor electrode 321 and a second storage capacitor electrode 322 .

[0080] The organic light emitting diode 380 may include a first electrode 381 , an organic layer 382 , and a second electrode 383 .

[0081] Specifically, the buffer layer 301 may be disposed on the substrate 210 . The buffer layer 301 may include a first buffer layer 302 disposed on the substrate 210 and a second buffer layer 303 disposed on the first buffer layer 302 .

[0082] The first buffer layer 302 and the second buffer layer 303 may include different materials. For example, each of the first buffer layer 302 and the second buffer layer 303 may have a structure in which at least two inorganic insulating material layers made of silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON) are alternately formed. However, the buffer layer 301 according to the embodiment is not limited thereto.

[0083] In some cases, the buffer layer 301 may be omitted. The buffer layer 301 may have a single-layer structure or may have a multi-layer structure consisting of three or more layers.

[0084] The active layer 311 may be disposed on the substrate 210. The active layer 311 may include a silicon-based semiconductor material or an oxide-based semiconductor material, but the present disclosure is not limited thereto.

[0085] Although not shown in the drawings, a light shielding layer that shields the active layer 311 from external light may be further provided under the active layer 311 .

[0086] The gate insulating film 330 may be disposed on the active layer 311 .

[0087] The gate insulating film 330 may include an inorganic insulating material. For example, the gate insulating film 330 may be made of an inorganic material such as SiOx, SiNx, or SiON, but the embodiments of the present disclosure are not limited thereto.

[0088] The gate electrode 312 may be provided on the gate insulating film 330 .

[0089] The gate electrode 312 may include aluminum (Al), silver (Ag), gold (Au), copper (Cu), tungsten (W), molybdenum (Mo), chromium (Cr), nickel (Ni), neodymium (Nd), tantalum (Ta), titanium (Ti), etc. However, the embodiments of the present disclosure are not limited thereto, and any configuration may be used as long as the gate electrode 312 includes a conductive material.

[0090] although Figure 3 The gate electrode 312 is shown as having a single-layer structure, but the present disclosure is not limited thereto. For example, the gate electrode 312 may have a multi-layer structure consisting of two or more layers.

[0091] The first storage capacitor electrode 321 of the storage capacitor 320 may be disposed at the same layer as the gate electrode 312 . That is, the first storage capacitor electrode 321 may be disposed on the gate insulating film 330 .

[0092] The first storage capacitor electrode 321 may include the same material as the gate electrode 312 , but embodiments of the present disclosure are not limited thereto.

[0093] An interlayer insulating film 340 may be provided on the gate electrode 312. The interlayer insulating film 340 may be made of an inorganic material such as SiOx, SiNx, or SiON, but embodiments of the present disclosure are not limited thereto.

[0094] The source electrode 313 and the drain electrode 314 may be disposed on the interlayer insulating film 340 . The source electrode 313 and the drain electrode 314 may be electrically connected to the active layer 311 through the first and second contact holes CH1 and CH2 of the gate insulating film 330 and the interlayer insulating film 340 .

[0095] Each of the source electrode 313 and the drain electrode 314 may include Al, Ag, Au, Cu, W, Mo, Cr, Ni, Nd, Ta, Ti, etc. However, the embodiments of the present disclosure are not limited thereto, and any configuration may be used as long as the source electrode 313 and the drain electrode 314 include a conductive material.

[0096] although Figure 3 The source electrode 313 and the drain electrode 314 are shown as having a single-layer structure, but the present disclosure is not limited thereto. For example, each of the source electrode 313 and the drain electrode 314 may have a multi-layer structure consisting of two or more layers.

[0097] In addition, despite the Figure 3 In the structure shown, reference numeral 313 is a source electrode and reference numeral 314 is a drain electrode, but the embodiments of the present disclosure are not limited thereto. Reference numeral 313 may refer to a drain electrode and reference numeral 314 may refer to a source electrode.

[0098] The second storage capacitor electrode 322 of the storage capacitor 320 may be disposed at the same layer as the source electrode 313 and the drain electrode 314. That is, the second storage capacitor electrode 322 may be disposed on the interlayer insulating film 340.

[0099] Although the second storage capacitor electrode 322 may include the same material as the source electrode 313 and the drain electrode 314 , embodiments of the present disclosure are not limited thereto.

[0100] A passivation layer 350 may be disposed on the source electrode 313, the drain electrode 314, and the second storage capacitor electrode 322. Although the passivation layer 350 may include an inorganic material such as SiOx, SiNx, or SiON, embodiments of the present disclosure are not limited thereto.

[0101] The planarization layer 360 may be disposed on the passivation layer 350. The planarization layer 360 may include an organic insulating material. For example, the planarization layer 360 may include acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc., but the embodiments of the present disclosure are not limited thereto.

[0102] The organic light emitting diode 380 and the bank 384 may be disposed on the planarization layer 360 .

[0103] The organic light emitting diode 380 may include a first electrode 381, an organic layer 382, and a second electrode 383. Here, the first electrode 381 may be an anode, and the second electrode 383 may be a cathode. The organic layer 382 may include at least one light emitting layer.

[0104] The first electrode 381 of the organic light emitting diode 380 may be disposed on the planarization layer 360 . The first electrode 381 may be electrically connected to the drain electrode 314 via a third contact hole CH3 disposed in the planarization layer 360 and the passivation layer 350 .

[0105] although Figure 3 Although not shown, in the active area AA, a plurality of first electrodes 381 may be disposed on the planarization layer 360 and spaced apart from each other.

[0106] The first electrode 381 may include a transparent conductive material.

[0107] The first electrode 381 may include a metal oxide of a metal such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), or titanium (Ti); or a transparent conductive material composed of a combination of a metal such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), or titanium (Ti) and its oxide. For example, the first electrode 381 may include one of indium tin oxide (ITO), indium zinc oxide (IZO), and indium gallium zinc oxide (IGZO), or a combination thereof, but embodiments of the present disclosure are not limited thereto.

[0108] The bank 384 may be provided on the first electrode 381 and the planarization layer 360. The bank 384 may be provided to expose a portion of a top surface of the first electrode 381.

[0109] The bank 384 may define the emission area EA and the non-emission area NEA in the active area AA. Specifically, the portion of the active area AA where the bank 384 is provided may be the non-emission area NEA, and the rest of the active area AA may be the emission area EA.

[0110] The organic layer 382 including at least one light emitting layer may be disposed on the top surface of the first electrode 381 on which the bank 384 is not disposed. Figure 3 382 is shown in the structure in which the organic layer 382 is provided on the top surface of the first electrode 381 exposed by the bank 384, but the structure according to the embodiment of the present disclosure is not limited thereto. For example, the organic layer 382 may be provided on the entire surface of the active area AA.

[0111] The second electrode 383 may be disposed on the organic layer 382. The second electrode 383 may include a reflective material. For example, the second electrode 383 may include one selected from Al, Au, Cu, W, Ti, Mo, or a combination thereof, but the present disclosure is not limited thereto.

[0112] Although the second electrode 383 may be disposed on the entire surface of the substrate 210 in the active area AA, embodiments of the present disclosure are not limited thereto.

[0113] Since the first electrode 381 of the organic light emitting diode 380 includes a transparent conductive material and the second electrode 383 includes a reflective material as described above, the organic light emitting diode 380 having a bottom emission structure may be implemented.

[0114] However, embodiments of the present disclosure are not limited thereto, and any configuration may be used as long as at least one of the first electrode 381 , the second electrode 383 , or a combination thereof includes a transparent conductive material.

[0115] For example, the first electrode 381 may include a reflective metal and the second electrode 383 may include a transparent conductive material to implement an organic light emitting diode 380 having a top emission structure. Alternatively, each of the first electrode 381 and the second electrode 383 may include a transparent conductive material to implement an organic light emitting diode 380 having a double-sided emission structure.

[0116] The encapsulation member 390 may be disposed on the second electrode 383 of the organic light emitting diode 380 .

[0117] The encapsulation member 390 may include a first encapsulation layer 391 disposed on the second electrode 383 , a second encapsulation layer 292 disposed on the first encapsulation layer 391 , and a third encapsulation layer 293 disposed on the second encapsulation layer 292 .

[0118] Here, the first encapsulation layer 391 and the third encapsulation layer 293 may include an inorganic insulating material, and the second encapsulation layer 292 may include an organic insulating material. Here, the second encapsulation layer 292 may be thick enough to prevent particles from penetrating into the organic light emitting diode 380 through the first encapsulation layer 391.

[0119] like Figure 2 and Figure 3 As shown in , the encapsulation member 390 according to the embodiment may be provided on the entire active area AA. Figure 2 As shown in , the encapsulation member 390 may also be disposed on a portion of the non-active area NA.

[0120] The following will refer to Figure 4 and Figure 5 The structure of the encapsulation member 390 extending through a portion of the non-active area NA is discussed.

[0121] Figure 4 It is along Figure 2 The cross-sectional view taken along line AB in Figure 5 yes Figure 4 Magnified view of part K in FIG.

[0122] In the following, reference will be made to Figure 4 and Figure 5A cross-sectional structure of a portion of the active area AA and a portion of the non-active area NA of a display device according to an embodiment is described.

[0123] First, refer to Figure 4 , the buffer layer 301 may be disposed on the substrate 210 .

[0124] The gate insulating film 330 may be provided on the buffer layer 301 .

[0125] The buffer layer 301 and the gate insulating film 330 may be provided in the active area AA and the non-active area NA.

[0126] In the active area AA, the drain electrode 314 of the transistor may be provided on the gate insulating film 330 .

[0127] In the non-active area NA, the pad electrode 414 may be disposed on the gate insulating film 330. Although the pad electrode 414 may include the same material as the drain electrode 314 of the transistor located in the active area AA, embodiments of the present disclosure are not limited thereto.

[0128] An interlayer insulating film 340 may be provided on the drain electrode 314 and the pad electrode 414 of the transistor.

[0129] A passivation layer 350 may be disposed on the interlayer insulating film 340 .

[0130] An interlayer insulating film 340 and a passivation layer 350 may be provided in the active area AA and the non-active area NA.

[0131] The planarization layer 360 may be disposed on the passivation layer 350 .

[0132] The planarization layer 360 may be disposed in the active area AA to extend to a portion of the non-active area NA.

[0133] The planarization layer 360 may overlap a portion of the top surface of the pad electrode 414 in the non-active area NA, but embodiments of the present disclosure are not limited thereto. The planarization layer 360 may be disposed in a portion of the non-active area NA without overlapping the top surface of the pad electrode 414 .

[0134] Furthermore, the first layer 461 of the second dam 297 disposed in the non-active area NA is spaced apart from the planarization layer 360. The first layer 461 of the second dam 297 may be disposed at the same layer and include the same material as the planarization layer 360.

[0135] In the active area AA, a first electrode 381 of an organic light emitting element or an organic light emitting diode OLED may be disposed on the planarization layer 360 .

[0136] In addition, in the non-active area NA, the connection electrode 481 may be disposed on the planarization layer 360. The connection electrode 481 may be disposed in a portion of the non-active area NA.

[0137] Although the connection electrode 481 may include the same material as the first electrode 381 of the organic light emitting diode OLED, embodiments of the present disclosure are not limited thereto. In the non-active area NA, the connection electrode 481 may be electrically connected to the pad electrode 414 through a contact hole provided in the passivation layer 350 .

[0138] The bank 384 may be disposed on the planarization layer 360 on which the first electrode 381 of the organic light emitting diode OLED and the connection electrode 481 are disposed.

[0139] As mentioned above Figure 3 As described above, the bank 384 in the active area AA may be defined as a light emitting area and a non-light emitting area.

[0140] The bank 384 may be configured to extend to a portion of the non-active area NA. Figure 4 As shown in FIG, the bank 384 may be provided to extend to a portion of the non-active area NA where the planarization layer 360 is located. Figure 5 As shown in FIG, in the non-active area NA, one edge of the bank 384 may overlap with one edge of the planarization layer 360 .

[0141] Specifically, in the non-active area NA, the planarization layer 360 and the embankment 384 can be positioned so that the end portion of the side surface of the planarization layer 360 set closest to the first dam portion 296 and the end portion of the side surface of the embankment 384 set closest to the first dam portion 296 correspond to each other.

[0142] Reference Figure 4 The first layer 485 of the first dam portion 296, the second layer 486 of the second dam portion 297, and the first layer 487 of the third dam portion 298 located in the non-effective area NA can be separated from the embankment 384, and are arranged on the same layer as the embankment 384 and made of the same material as the embankment 384.

[0143] Although the first layer 485 of the first dam portion 296 may overlap one edge of the connection electrode 481, the structure according to the embodiment of the present disclosure is not limited thereto. For example, the embodiment of the present disclosure may include a structure in which one surface of the first layer 485 of the first dam portion 296 contacts one surface of the connection electrode 481 in the non-active area NA, or a structure in which the first layer 485 of the first dam portion 296 and the connection electrode 481 are spaced apart from each other in the non-active area NA.

[0144] In addition, in the non-effective area NA, the second layer 496 of the first dam portion 296 may be set on the first layer 485 of the first dam portion 296, the third layer 497 of the second dam portion 297 may be set on the second layer 486 of the second dam portion 297, and the second layer 498 of the third dam portion 298 may be set on the first layer 487 of the third dam portion 298.

[0145] Although the second layer 496 of the first dam 296 , the third layer 497 of the second dam 297 , and the second layer 498 of the third dam 298 may include the same material, embodiments of the present disclosure are not limited thereto.

[0146] although Figure 4 Although not shown, at least one spacer may be provided on a portion of the top surface of the bank 384 in the non-emission region of the active area AA. The spacer may be a member capable of supporting a mask in the step of manufacturing an organic layer of the organic light emitting diode OLED.

[0147] Although the second layer 496 of the first dam 296 , the third layer 497 of the second dam 297 , and the second layer 498 of the third dam 298 may include the same material as the spacer located in the active area AA, embodiments of the present disclosure are not limited thereto.

[0148] The organic layer 382 including at least one light emitting layer of the organic light emitting diode OLED may be positioned in a portion of the active area AA where the bank 384 is not positioned.

[0149] In addition, a second electrode 383 of the organic light emitting diode OLED may be disposed on the organic layer 382 and the bank 384 in the active area AA.

[0150] The second electrode 383 of the organic light emitting diode OLED may be disposed to extend to a portion of the non-active area NA. For example, the second electrode 383 may be disposed to extend to a portion of the top surface of the bank 384 located in the non-active area NA.

[0151] In the non-active area NA, the second electrode 383 of the organic light emitting diode OLED may make contact with the connection electrode 481 disposed on the planarization layer 360 through the contact hole of the bank 384 .

[0152] The first encapsulation layer 391 of the encapsulation member 390 is disposed on the second electrode 383 of the organic light emitting diode OLED.

[0153] The first encapsulation layer 391 may be disposed in the entire active area AA and may extend to the non-active area NA.

[0154] Specifically, in the non-active area NA, the first encapsulation layer 391 may be disposed to cover the second electrode 383 , the bank 384 , the connection electrode 481 , the first dam 296 , the second dam 297 , and the third dam 298 of the organic light emitting diode OLED.

[0155] The second encapsulation layer 292 may be disposed on the first encapsulation layer 391 .

[0156] The second encapsulation layer 292 may be disposed in the entire active area AA and may extend to the non-active area NA.

[0157] Specifically, the second encapsulation layer 292 may be provided to cover the second electrode 383, the dam 384, and the planarization layer 360 in the non-active area NA. In addition, in a structure in which a portion of the top surface of the connection electrode 481 overlaps with the first dam portion 296, the second encapsulation layer 292 may overlap with a portion of the top surface of the connection electrode 481.

[0158] The second encapsulation layer 292 may include an organic insulating material.

[0159] The second encapsulation layer 292 may be formed flat in the active area AA. In addition, the second encapsulation layer 292 may be configured such that a portion thereof disposed in a portion of the non-active area NA may be thinner than a portion thereof located in the active area AA.

[0160] The thickness of a specific portion of the second encapsulation layer 292 disposed in a portion of the non-active area NA may gradually decrease, so that at least one surface of the second encapsulation layer 292 may have a slope. The surface of the second encapsulation layer 292 having a slope may refract light, thereby reducing image quality. Therefore, the surface of the second encapsulation layer 292 having a slope may be located in the non-active area NA.

[0161] Second encapsulation layer 292 can cover foreign matter or particles that may be generated during processing. For example, defects such as fine cracks caused by foreign matter or particles may exist in first encapsulation layer 391. Second encapsulation layer 292 can cover and protect cracked areas of first encapsulation layer 391, that is, areas of first encapsulation layer 391 where fine cracks exist.

[0162] However, due to the high fluidity of the second encapsulation layer material, the second encapsulation layer 292 may exceed the actual design value.

[0163] On the other hand, for example, when the second encapsulation layer material is applied to the substrate 210 in a smaller amount considering its fluidity, the second encapsulation layer 292 may be formed to extend only to a portion of the top surface of the bank 384 in the non-active area NA.

[0164] In addition, the bank 384 including the organic insulating material may be configured such that the bank 384 has a protrusion in the non-active area NA (e.g., a protrusion on one edge of the bank 384). In this case, the second encapsulation layer material may be blocked by the protrusion of the bank 384 and prevented from flowing further, so that the second encapsulation layer 292 does not extend beyond the top surface of the bank 384.

[0165] In this case, the first and third encapsulation layers 391 and 293 including only the inorganic insulating material may be disposed on side surfaces of the bank 384 and the planarization layer 360 located in the non-active area NA.

[0166] Furthermore, if defects due to foreign matter or particles exist in the first encapsulation layer 391 located on the side surfaces of the bank 384 and the planarization layer 360 in the non-active area NA, the third encapsulation layer 293 may be disposed on the cracked region of the first encapsulation layer 391. That is, the third encapsulation layer 293 is too thin to properly cover the cracked region of the first encapsulation layer 391. Consequently, moisture, oxygen, and the like may penetrate into the third encapsulation layer 293 disposed in the region corresponding to the cracked region of the first encapsulation layer 391. The moisture or oxygen that penetrates into the third encapsulation layer 293 may diffuse through the planarization layer 360, ultimately reaching the organic layer 382 of the organic light-emitting diode OLED, thereby reducing the reliability of the organic light-emitting diode OLED.

[0167] In other words, since the second encapsulation layer 292 is not disposed on the side surfaces of the bank 384 or the planarization layer 360 in the non-active area NA, moisture or oxygen may penetrate through the first and third encapsulation layers 391 and 293 .

[0168] The embodiment of the present disclosure has a structure capable of preventing a phenomenon in which the second encapsulation layer 292 is not provided on the side surface of the bank 384 or the planarization layer 360 located in the non-active area NA in a process of manufacturing the second encapsulation layer 292 .

[0169] Specifically, the inclination of the first side surface 460 a of the planarization layer 360 in the non-active area NA relative to the top surface of the substrate 210 is smaller than the inclination of the second side surface 460 b of the planarization layer 360 located in the active area AA and surrounding the third contact hole CH3 of the planarization layer 360 .

[0170] Here, the first side surface 460 a of the planarization layer 360 may be a side surface located in the non-active area NA and disposed closest to the first dam portion 296 , among the side surfaces of the planarization layer 360 .

[0171] As described above, the first side surface 460a of the planarization layer 360 has a smaller inclination relative to the top surface of the substrate 210 than the second side surface 460b of the planarization layer 360 located in the active area AA and surrounding the third contact hole CH3 of the planarization layer 360. Therefore, the first side surface 484a of the bank 384 disposed on the first side surface 460a of the planarization layer 360 (i.e., the inclination relative to the top surface of the substrate 210) can also be gentle. Here, the first side surface 484a of the bank 384 can be the side surface of the bank 384 that is located in the non-active area NA and is disposed closest to the first dam portion 296.

[0172] Thus, the inclination of the first side surface 484a of the embankment 384 relative to the top surface of the substrate 210 may be smaller than the inclination of the second side surface 484b of the embankment 384 in the opening area surrounding the embankment 384 in the effective area AA (i.e., the area where the organic layer of the OLED is set).

[0173] In addition, the inclination of the first side surface 484a of the embankment 384 relative to the top surface of the substrate 210 may be smaller than the inclination of the third side surface 484c of the embankment 384 in the non-active area NA, which is an opening area surrounding the embankment 384 in which the connecting electrode 481 and the second electrode 383 contact each other.

[0174] Furthermore, the inclination of the first side surface 484 a of the bank 384 in the non-active area NA relative to the top surface of the substrate 210 may be equal to or greater than the inclination of the first side surface 460 a of the planarization layer 360 relative to the top surface of the substrate 210 .

[0175] Specifically, if Figure 4As shown in , in which the outermost portion 460d of the top surface of the planarization layer 360 in the non-active area NA (i.e., the edge of the top surface of the planarization layer closest to the first dam portion) is spaced farther from the first dam portion 296 than the outermost portion 484d of the top surface of the embankment 384 (i.e., the edge of the top surface of the embankment 384 closest to the first dam portion), and the end portion 460e of the first side surface 460a of the planarization layer 360 (i.e., the portion where the thickness of the planarization layer 360 in the non-active area NA is reduced to the minimum thickness (approximately 0)) and the end portion 484e of the first side surface 484a of the embankment 384 (i.e., the portion where the thickness of the embankment 384 in the non-active area NA is reduced to the minimum thickness (approximately 0)) are equally spaced from the first dam portion 296, the inclination of the first side surface 484a of the embankment 384 may be greater than the inclination of the first side surface 460a of the planarization layer 360. However, the present disclosure is not limited thereto, and the distance between the first dam 296 and the outermost portion 460 d of the top surface of the planarization layer 360 may be less than or equal to the distance between the first dam 296 and the outermost portion 484 d of the top surface of the bank 384 .

[0176] Here, the distance between the first dam portion 296 and the outermost portion 460d of the top surface of the planarization layer 360 and the distance between the first dam portion 296 and the outermost portion 484d of the top surface of the embankment 384 may represent the minimum distance from the point where a virtual vertical line intersects the top surface of the passivation layer 350 to the first dam portion 296, wherein the virtual vertical line extends vertically in a direction from the outermost portion 460d of the top surface of the planarization layer 360 and the outermost portion 484d of the top surface of the embankment 384 to the top surface of the substrate 210.

[0177] In addition, although not shown in the figures, in a case where the outermost portion 460d of the top surface of the planarization layer 360 in the non-effective area NA and the outermost portion 484d of the top surface of the embankment 384 are arranged to be equally spaced apart from the first dam portion 296, and the end portion 460e of the first side surface 460a of the planarization layer 360 and the end portion 484e of the first side surface 484a of the embankment 384 are arranged to be equally spaced apart from the first dam portion 296, the inclination of the first side surface 484a of the embankment 384 may be the same as the inclination of the first side surface 460a of the planarization layer 360.

[0178] Even in the case where, in the non-active area NA, the inclination of the first side surface 484a of the embankment 384 relative to the top surface of the substrate 210 is greater than the inclination of the first side surface 460a of the planarization layer 360 relative to the top surface of the substrate 210, the inclination of the first side surface 484a may still be less than the inclination of the second side surface 484b or the third side surface 484c of the embankment 384.

[0179] Reference Figure 4 and Figure 5 In the non-active area NA, the connection electrode 481 may be disposed on the first side surface 460a of the planarization layer 360 such that the inclination of the connection electrode 481 is the same as the inclination of the first side surface 460a of the planarization layer 360. The first encapsulation layer 391 may be disposed on the first side surface 484a of the bank 384 such that the inclination of the first encapsulation layer 391 is the same as the inclination of the first side surface 484a of the bank 384.

[0180] That is, due to the gentle slope of the first side surface 460a of the planarization layer 360 in the non-active area NA, each of the connection electrode 481, the bank 384, and the first encapsulation layer 391 provided on the first side surface 460a of the planarization layer 360 may also have a gentle slope in the area corresponding to the area where the first side surface 460a of the planarization layer 360 is provided. In particular, the slope of the first encapsulation layer 391 may correspond to the slope of the first side surface 484a of the bank 384 provided below the first encapsulation layer 391.

[0181] Therefore, in a portion of the non-effective area NA corresponding to the area where the first side surface 460a of the planarization layer 360 is set, the second encapsulation layer material with higher fluidity may flow along the top surface of the first encapsulation layer 391, thereby reaching a position adjacent to the first dam portion 296, so that the second encapsulation layer 292 may eventually be set to cover the first side surface 460a of the planarization layer 360 and the first side surface 484a of the embankment 384.

[0182] The second encapsulation layer material may flow to the first dam 296 , and the first dam 296 may be used to prevent over-application of the second encapsulation layer material.

[0183] Therefore, when the first encapsulation layer 391 has defects due to foreign matter or particles on the side surface of the embankment 384 or the planarization layer 360 located in the non-active area NA, the second encapsulation layer 292 provided to cover the first encapsulation layer 391 can improve the encapsulation effect of the encapsulation member 390.

[0184] That is, the angle a between the first side surface 460a of the planarization layer 360 and the top surface of the substrate 210 in the non-active area NA may be smaller than the angle b between the second side surface 460b of the planarization layer 360 surrounding the third contact hole CH3 of the planarization layer 360 and the top surface of the substrate 210 in the active area AA.

[0185] For example, the angle a between the first side surface 460a of the planarization layer 360 and the top surface of the substrate 210 in the non-active area NA may be in the range of 15° to 30°, while the angle b between the second side surface 460b of the planarization layer 360 surrounding the third contact hole CH3 of the planarization layer 360 and the top surface of the substrate 210 in the active area AA may be in the range of 50° or greater.

[0186] Here, when the angle a between the first side surface 460a of the planarization layer 360 in the non-active area NA and the top surface of the substrate 210 is less than 15°, the thickness of the planarization layer 360 may be too low, thereby reducing the ability of the planarization layer 360 to planarize the substrate 210. In addition, when the angle a between the first side surface 460a of the planarization layer 360 in the non-active area NA and the top surface of the substrate 210 exceeds 30°, the covering ability (i.e., the retention ability) of the second encapsulation layer material may be reduced, so that the second encapsulation layer 292 is disposed to expose the first side surface 460a of the planarization layer 360 in the non-active area NA and the first side surface 484a of the bank 384, thereby reducing the encapsulation effect of the encapsulation member 390.

[0187] The third encapsulation layer 293 may be disposed on the second encapsulation layer 292 .

[0188] In the non-active area NA, one edge of the third encapsulation layer 293 may overlap one edge of the first encapsulation layer 391. That is, the third encapsulation layer 293 may be provided on the entire surface of the active area AA and may be provided to cover the top surface and side surfaces of the second encapsulation layer 292 in the non-active area NA. In addition, the third encapsulation layer 293 may be provided to cover the first dam 296, the second dam 297, and the third dam 298 in the non-active area NA.

[0189] Although the reference Figure 4 and Figure 5 A structure in which one edge of the bank 384 and one edge of the planarization layer 360 overlap each other in the non-active area NA is described, but the structure according to the embodiment is not limited thereto.

[0190] Another arrangement structure of the bank 384 and the planarization layer 360 in the non-active area NA will be described below.

[0191] Figure 6 is a cross-sectional view illustrating a portion of an active area and a portion of a non-active area of a display device according to another embodiment, Figure 7 yes Figure 6 Magnified view of portion L in FIG.

[0192] Figure 6 and Figure 7 The structure shown in can be modified by Figure 4 The structure obtained by part K in Figure 4 In addition to the part K in Figure 6 The structure shown in Figure 4 The structure is the same as in . Figure 6 and Figure 7 The structure of the planarization layer 360 shown in FIG can be roughly the same as that of the above reference Figure 4 The structure of the planarization layer 360 is described to be the same.

[0193] Reference Figure 6 and Figure 7 The bank 684 is provided in the non-active area NA to cover the side surface and the top surface of the planarization layer 360. Here, the bank 684 may be provided to cover the first side surface 460a of the planarization layer 360. That is, in the non-active area NA, the end portion 684e of the first side surface 684a of the bank 684 may be provided closer to the first dam portion 296 than the end portion 460e of the first side surface 460a of the planarization layer 360.

[0194] In addition, the inclination of the first side surface 460 a of the planarization layer 360 in the non-active area NA relative to the top surface of the substrate 210 is smaller than the inclination of the second side surface 460 b of the planarization layer 360 surrounding the third contact hole CH3 of the planarization layer 360 in the active area AA.

[0195] As described above, the inclination of the first side surface 460a of the planarization layer 360 in the non-active area NA relative to the top surface of the substrate 210 is smaller than the inclination of the second side surface 460b of the planarization layer 360 in the active area AA surrounding the third contact hole CH3 of the planarization layer 360. Therefore, due to the area overlapping with the first side surface 460a of the planarization layer 360, the inclination of the first side surface 684a of the bank 684 (i.e., the inclination relative to the top surface of the substrate 210) can also be gentle.

[0196] Therefore, the inclination of the first side surface 684a of the embankment 684 relative to the top surface of the substrate 210 may be smaller than the inclination of the second side surface 684b of the embankment 684 in the opening area surrounding the embankment 684 in the effective area AA (i.e., the area where the organic layer of the OLED is set).

[0197] In addition, the inclination of the first side surface 684a of the embankment 684 relative to the top surface of the substrate 210 may be smaller than the inclination of the third side surface 684c of the embankment 684 in the non-active area NA, which is an opening area surrounding the embankment 684 and in which the connecting electrode 481 and the second electrode 383 contact each other.

[0198] In the non-active area NA, the inclination of the first side surface 684 a of the bank 684 relative to the top surface of the substrate 210 may be smaller than the inclination of the first side surface 460 a of the planarization layer 360 relative to the top surface of the substrate 210 .

[0199] Specifically, in the structure in which the bank 684 covers the planarization layer 360 in the non-active area NA, the outermost portion 460 d of the top surface of the planarization layer 360 is disposed closer to the first dam portion 296 than the outermost portion 684 d of the top surface of the bank 684, and the end portion 460 e of the first side surface 460 a of the planarization layer 360 is spaced farther from the first dam portion 296 than the end portion 684 e of the first side surface 684 a of the bank 684. Thus, the inclination of the first side surface 684 a of the bank 684 may be smaller than the inclination of the first side surface 460 a of the planarization layer 360.

[0200] Here, the distance between the first dam portion 296 and the outermost portion 460d of the top surface of the planarization layer 360 and the distance between the first dam portion 296 and the outermost portion 684d of the top surface of the embankment 684 may represent the minimum distance from the point where a virtual vertical line intersects the top surface of the passivation layer 350 to the first dam portion 296, wherein the virtual vertical line extends vertically in a direction from the outermost portion 460d of the top surface of the planarization layer 360 and the outermost portion 684d of the top surface of the embankment 684 to the top surface of the substrate 210.

[0201] In addition, the distance from the outermost portion 460d of the top surface of the planarization layer 360 to the end portion 460e of the first side surface 460a of the planarization layer 360 (i.e., the length of the first side surface 460a of the planarization layer 360 in the cross section) may be shorter than the distance from the outermost portion 684d of the top surface of the embankment 684 to the end portion 684e of the first side surface 684a of the embankment 684 (i.e., the length of the first side surface 684a of the embankment 684 in the cross section).

[0202] In this case, the inclination of the first side surface 684a of the bank 684 may be smaller than the inclination of each of the first side surface 460a of the planarization layer 360, the second side surface 684b of the bank 684, and the third side surface 684c of the bank 684.

[0203] That is, since the first side surface 460a of the planarization layer 360 and the first side surface 684a of the embankment 684 have gentle slopes in the non-effective area NA, respectively, the first encapsulation layer 391 may also have a gentle slope in the area corresponding to the area where the first side surface 460a of the planarization layer 360 and the first side surface 684a of the embankment 684 are set.

[0204] In particular, the shape of the first encapsulation layer 391 may be determined by the shape of the bank 684 provided below the first encapsulation layer 391. Thus, in the region where the first side surface 684a of the bank 684 is provided, the inclination of the first encapsulation layer 391 may correspond to the inclination of the first side surface 684a of the bank 684.

[0205] Therefore, in a portion of the non-effective area corresponding to the area in which the first side surface 460a of the planarization layer 360 and the first side surface 684a of the embankment 684 are set, the second encapsulation layer material with higher fluidity can flow along the top surface of the first encapsulation layer 391 to reach a position adjacent to the first dam portion 296, so that the second encapsulation layer 292 can be finally set to cover the first side surface 460a of the planarization layer 360 and the first side surface 684a of the embankment 684 in the non-effective area NA.

[0206] Figure 8 is a cross-sectional view illustrating a portion of an active area and a portion of a non-active area of a display device according to another embodiment, Figure 9 yes Figure 8 Magnified view of portion M in FIG.

[0207] Figure 8 and Figure 9 The structure shown in can be modified by Figure 4 The structure obtained by part K in Figure 4 In addition to the part K in Figure 8 The structure shown in Figure 4 The structure is the same as in . Figure 8 and Figure 9 The structure of the planarization layer 360 shown in FIG can be roughly the same as that of the above reference Figure 4 The structure of the planarization layer 360 is described to be the same.

[0208] Reference Figure 8 and Figure 9 In the non-active area NA, the bank 884 may be disposed to overlap with the top surface of the planarization layer 360 while exposing the first side surface 460a of the planarization layer 360. That is, the first side surface 884a of the bank 884 may be disposed on the top surface of the planarization layer 360.

[0209] The inclination of the first side surface 884a of the embankment 884 relative to the top surface of the substrate 210 may be smaller than the inclination of the second side surface 884b of the embankment 884 in the opening area surrounding the embankment 884 in the effective area AA (i.e., the area where the organic layer of the organic light-emitting diode is set).

[0210] In addition, the inclination of the first side surface 884a of the embankment 884 relative to the top surface of the substrate 210 may be smaller than the inclination of the third side surface 884c of the embankment 884 located in the non-active area NA, surrounding the embankment 884 in the opening area where the connecting electrode 481 and the second electrode 383 contact each other.

[0211] Furthermore, in the non-active area NA, the outermost portion 460 d of the top surface of the planarization layer 360 is positioned closer to the first dam portion 296 than the outermost portion 884 d of the top surface of the bank 884. The outermost portion 460 d of the top surface of the planarization layer 360 may also be positioned closer to the first dam portion 296 than the end portion 884 e of the first side surface 884 a of the bank 884.

[0212] A distance from an outermost portion 460d of the top surface of the planarization layer 360 to an end portion 460e of the first side surface 460a of the planarization layer 360 may be longer than a distance from an outermost portion 884d of the top surface of the embankment 884 to an end portion 884e of the first side surface 884a of the embankment 884.

[0213] Here, in the non-active area NA, the inclination of the first side surface 884 a of the bank 884 may be smaller than the inclination of the first side surface 460 a of the planarization layer 360 .

[0214] Therefore, the first encapsulation layer 391 arranged on the embankment 884 and the planarization layer 360 may have an inclination corresponding to the inclination of the first side surface 460a of the planarization layer 360 in the region where the first side surface 460a of the planarization layer 360 is located and may have an inclination corresponding to the inclination of the first side surface 884a of the embankment 884 in the region where the first side surface 884a of the embankment 884 is located.

[0215] That is, according to the present embodiment, the inclination of the first encapsulation layer 391 may vary in a region corresponding to a boundary between the first side surface 460 a of the planarization layer 360 and the first side surface 884 a of the bank 884 .

[0216] Therefore, in the process of manufacturing the second encapsulation layer 292 , the speed of the flow of the second encapsulation layer material may vary in a region corresponding to a boundary between the first side surface 460 a of the planarization layer 360 and the first side surface 884 a of the bank 884 .

[0217] For example, since the inclination of the first side surface 884a of the embankment 884 is smaller than the inclination of the first side surface 460a of the planarization layer 360, the second encapsulation layer material may flow at a lower speed in the area corresponding to the first side surface 884a of the embankment 884, and the speed of the flow of the second encapsulation layer material may increase in the area corresponding to the boundary between the first side surface 460a of the planarization layer 360 and the first side surface 884a of the embankment 884.

[0218] Here, the second encapsulation layer 292 may be provided to extend to a region where the first dam portion 296 is provided.

[0219] As described above, due to adjusting the position of the embankment 884 and the planarization layer 360 in the non-active area NA and the inclination of each component, the second encapsulation layer 292 can be set to cover the first side surface 460a of the planarization layer 360 and the first side surface 884a of the embankment 884 in the non-active area NA.

[0220] According to an embodiment of the present disclosure, the first side surface of the planarization layer located in the inactive region and closest to the dam portion has a first inclination relative to the top surface of the substrate that is smaller than the second side surface of the planarization layer surrounding the contact hole relative to the top surface of the substrate. Therefore, the second encapsulation layer can be provided to cover the surface of the planarization layer and the dam portion in the inactive region, thereby improving the encapsulation capability of the encapsulation component.

[0221] The above description and accompanying drawings provide examples of the technical ideas of the present disclosure for the purpose of illustration only. Those skilled in the art of the present disclosure will understand that various modifications and changes in form, such as combinations, separations, replacements and changes in structure, are possible without departing from the essential features of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are intended to illustrate the scope of the technical ideas of the present disclosure, and the scope of the present disclosure is not limited by the embodiments. The scope of the present disclosure should be interpreted in the following manner based on the appended claims, that is, all technical ideas included in the equivalent scope of the claims belong to the present disclosure.

Claims

1. An organic light-emitting panel having an active area and an inactive area located outside the active area, the organic light-emitting panel comprising: substrate; a planarization layer disposed on the substrate, wherein the planarization layer is provided with at least one contact hole in the active area; a first electrode disposed on the planarization layer; a bank portion provided on a portion of a top surface of the planarization layer and a portion of a top surface of the first electrode; an organic layer disposed on a top surface of the first electrode in a first opening region of the bank disposed in the active region; a second electrode disposed on the organic layer and the bank; at least one weir located in the non-active area to surround the active area; and a packaging member provided on the second electrode and the substrate on which the dam portion is provided, wherein, among the side surfaces of the planarization layer, a first side surface of the planarization layer located in the inactive region and closest to the dam portion has a first inclination relative to the top surface of the substrate that is smaller than a second inclination of a second side surface of the planarization layer surrounding the contact hole relative to the top surface of the substrate, and wherein the bank has at least one second opening region, the at least one second opening region exposing a connection electrode disposed on the planarization layer in the non-active region, wherein the connecting electrode is disposed on the first side surface of the planarization layer, and wherein the dam portion overlaps the connecting electrode, wherein an angle defined between the first side surface of the planarization layer and the top surface of the substrate is in a range of 15° to 30°, wherein, in the inactive region, the second encapsulation layer of the encapsulation member is arranged to cover the first side surface and the bank of the planarization layer, and The second encapsulation layer does not overlap with a side surface of a first dam portion closest to the active area among the at least one dam portion.

2. The organic light emitting panel according to claim 1, wherein: In the inactive region, a first side surface of the bank portion located in the inactive region and closest to the dam portion overlaps with the first side surface of the planarization layer, and one edge of the bank portion overlaps with one edge of the planarization layer.

3. The organic light emitting panel according to claim 2, wherein: In the inactive region, a third inclination of the first side surface of the bank relative to the top surface of the substrate is equal to or greater than the first inclination of the planarization layer.

4. The organic light emitting panel according to claim 3, wherein: In the inactive area, the outermost portion of the top surface of the planarization layer and the outermost portion of the top surface of the embankment are arranged to be equally spaced apart from the dam portion, and the end portion of the first side surface of the planarization layer and the end portion of the first side surface of the embankment are arranged to be equally spaced apart from the dam portion.

5. The organic light emitting panel according to claim 3, wherein: In the inactive area, the outermost portion of the top surface of the planarization layer is spaced farther from the dam portion than the outermost portion of the top surface of the embankment portion, and the end portion of the first side surface of the planarization layer and the end portion of the first side surface of the embankment portion are equally spaced from the dam portion.

6. The organic light emitting panel according to claim 1, wherein: In the inactive region, the bank is provided to cover the first side surface of the planarization layer.

7. The organic light emitting panel according to claim 6, wherein: In the inactive region, a third inclination of the first side surface of the bank relative to the top surface of the substrate is smaller than the first inclination of the planarization layer.

8. The organic light emitting panel according to claim 7, wherein: In the inactive area, the outermost portion of the top surface of the planarization layer is arranged closer to the dam portion than the outermost portion of the top surface of the embankment portion, and the end portion of the first side surface of the planarization layer is spaced farther from the dam portion than the end portion of the first side surface of the embankment portion.

9. An organic light-emitting panel according to claim 3 or 7, wherein the first encapsulation layer of the encapsulation member is provided on the first side surface of the embankment, and in an area corresponding to an area where the first side surface of the embankment is provided, the first encapsulation layer has an inclination corresponding to the third inclination.

10. The organic light emitting panel according to claim 1, wherein: In the inactive region, the bank is disposed to overlap the top surface of the planarization layer and expose the first side surface of the planarization layer. 11 . The organic light emitting panel according to claim 10 , wherein a third inclination of a first side surface of the bank portion located in the inactive area and closest to the dam portion relative to the top surface of the substrate is smaller than the first inclination of the planarization layer. 12 . The organic light-emitting panel according to claim 3 , wherein the third inclination is smaller than a fourth inclination of the second side surface of the bank surrounding the first opening area of the bank relative to the top surface of the substrate. 13 . The organic light emitting panel according to claim 11 , wherein an outermost portion of a top surface of the planarization layer is positioned closer to the dam portion than an end portion of the first side surface of the bank portion.

14. The organic light emitting panel according to claim 13 , wherein a first encapsulation layer of the encapsulation member is provided on the first side surface of the bank and the first side surface of the planarization layer, and An inclination of the first encapsulation layer relative to a top surface of the substrate changes at a boundary between the first side surface of the bank and the first side surface of the planarization layer. 15 . The organic light emitting panel according to claim 1 , wherein one edge of the second encapsulation layer of the encapsulation member is disposed closer to the dam portion than the planarization layer and the bank portion.

16. An organic light-emitting panel according to claim 1, wherein a third inclination of the first side surface of the embankment portion that is arranged closest to the dam portion relative to the top surface of the substrate is smaller than a fifth inclination of the third side surface of the embankment portion surrounding the second opening area relative to the top surface of the substrate. 17 . The organic light emitting panel according to claim 1 , wherein the connection electrode and the second electrode are in contact with each other in the second opening region of the bank. The organic light emitting panel according to claim 1 , wherein the connecting electrode comprises the same material as that of the first electrode.

19. An organic light-emitting display device, comprising: The organic light-emitting panel according to any one of claims 1 to 18; and A driver drives the organic light emitting panel.

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