Display panel, control circuit board and display device

By setting multiple pads and alignment marks on the drive backplane and control circuit board of the OLED display panel, the contact surface is enlarged, the fault problem caused by vibration is solved, and the reliability and impact resistance of the product are improved.

CN113130612BActive Publication Date: 2025-01-14BOE TECHNOLOGY GROUP CO LTD +1
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202110395564.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-04-13
Publication Date
2025-01-14
Estimated Expiration
2041-04-13

AI Technical Summary

Technical Problem

The existing OLED display panel is prone to failure when there is a large vibration, which affects normal use and leads to insufficient reliability.

Method used

A display panel is designed, including a driving backplate and a control circuit board. By setting multiple pads in the peripheral area, including a driving pad, a dummy pad and an isolation pad, the contact surface is increased and the resistance to impact is improved. , and optimize the binding structure through alignment marks and occlusion layers.

Benefits of technology

It effectively reduces the risk of loosening and falling off of the display panel and control circuit board, improves the reliability of the product, and can better resist harsh environments such as vibration and impact.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN113130612B_ABST
    Figure CN113130612B_ABST
Patent Text Reader

Abstract

The present disclosure relates to a display panel, a control circuit board and a display device, and relates to the field of display technology. The display panel of the present disclosure includes a driving backplane, the driving backplane has a display area and a peripheral area outside the display area, and the peripheral area has a binding area; the driving backplane includes a driving circuit, and the driving circuit is arranged in the display area and the peripheral area; the binding area is provided with a plurality of pads, each of which is used to bind with the control circuit board; each pad includes a driving pad and an empty dummy pad; the driving pad is connected to the driving circuit for transmitting a control signal from the control circuit board. The display panel of the present disclosure can reduce the risk of separation of the display panel and the control circuit board and improve reliability.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a control circuit board and a display device. Background Art

[0002] Display devices are key components in electronic devices such as mobile phones and tablet computers. Among them, electroluminescent organic light-emitting display panels using OLED (organic light-emitting diode) are widely used. However, existing display devices are prone to malfunction when a large vibration occurs, affecting normal use.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field.

[0004] Public Content

[0005] The purpose of the present disclosure is to provide a display panel, a control circuit board and a display device, which can reduce the risk of separation of the display panel and the control circuit board and improve reliability.

[0006] According to one aspect of the present disclosure, there is provided a display panel, comprising a driving backplane, the driving backplane having a display area and a peripheral area outside the display area, the peripheral area having a binding area;

[0007] The driving backplane includes a driving circuit, and the driving circuit is arranged in the display area and the peripheral area;

[0008] The binding area is provided with a plurality of pads, each of which is used for binding with a control circuit board; each of the pads comprises a driving pad and a vacant dummy pad; the driving pad is connected with the driving circuit for transmitting a control signal from the control circuit board.

[0009] In an exemplary embodiment of the present disclosure, the pad further includes an isolation pad, which is arranged adjacent to at least one of the driving pads; the isolation pad, the driving pad and the dummy pad are arranged at intervals along a first direction; and the isolation pad is used to receive a shielding signal.

[0010] In an exemplary embodiment of the present disclosure, the driving backplane includes a base substrate and a multi-layer conductive layer located on one side of the base substrate, and each of the conductive layers is distributed in sequence along a direction away from the base substrate; each of the soldering pads is arranged on the same layer as a conductive layer; and the binding area is provided with a binding hole exposing each of the soldering pads.

[0011] In an exemplary embodiment of the present disclosure, the conductive layer includes a first conductive layer and a second conductive layer; the driving backplane also includes a first flat layer, a second flat layer and a third flat layer;

[0012] The first flat layer is disposed on one side of the substrate; the first conductive layer is disposed on a surface of the first flat layer away from the substrate;

[0013] The second flat layer covers the first conductive layer and the first flat layer; the second conductive layer is arranged on a surface of the second flat layer away from the base substrate; the pad is arranged on the same layer as the second conductive layer;

[0014] The third planar layer covers the second conductive layer and the second planar layer, and the binding hole is provided in the third planar layer.

[0015] In an exemplary embodiment of the present disclosure, the number of the dummy pads and the isolation pads are both plural, and the dummy pads are divided into two groups, and the isolation pads are divided into two groups;

[0016] In the first direction, each of the driving pads is located between two groups of the isolation pads; and two groups of the isolation pads are located between two groups of the dummy pads.

[0017] In an exemplary embodiment of the present disclosure, the display panel further includes an alignment mark capable of being bound to the control circuit board, the alignment mark being disposed on one side of the driving backplane, and an orthographic projection of the alignment mark on the driving backplane being located in the binding area.

[0018] In an exemplary embodiment of the present disclosure, the display panel further includes a light-emitting layer, and the light-emitting layer includes:

[0019] A first electrode is disposed on a side of the driving backplane and is located in the display area; the alignment mark is disposed in the same layer as the first electrode;

[0020] A pixel definition layer, which is disposed on the same side of the driving backplane as the first electrode and is located in the display area, and has an opening exposing the first electrode;

[0021] A light-emitting functional layer, at least partially disposed in the opening, and stacked on a surface of the first electrode facing away from the driving backplane;

[0022] The second electrode covers the light-emitting functional layer.

[0023] In an exemplary embodiment of the present disclosure, the orthographic projection of the alignment mark on the driving backplane is spaced apart from each of the pads along the first direction.

[0024] In an exemplary embodiment of the present disclosure, the peripheral area further includes a protection area, the protection area is separated between the binding area and the display area, and the driving circuit part is located in the protection area;

[0025] The display panel further includes:

[0026] The shielding layer is arranged at the same layer as the first electrode, and the orthographic projection of the shielding layer on the driving backplane is located in the protection zone.

[0027] In an exemplary embodiment of the present disclosure, the shielding layer includes a plurality of shielding units; in the second direction, a shielding unit is provided on a side of each binding hole close to the display area, and the second direction is perpendicular to the first direction.

[0028] According to one aspect of the present disclosure, a control circuit board is provided, wherein the control circuit board has a circuit area and a connection area outside the circuit area, wherein the connection area is provided with a plurality of connection pads, each of the connection pads comprising a driving connection pad and a vacant dummy connection pad; the driving connection pad is used to bind to a driving pad of a display panel and transmit a control signal; and the dummy connection pad is used to bind to a dummy pad of the display panel.

[0029] In an exemplary embodiment of the present disclosure, the connection pad further includes an isolation connection pad, and the isolation connection pad is used to be bound to the isolation pad of the display panel and transmit a shielding signal to the isolation pad.

[0030] In an exemplary embodiment of the present disclosure, the connection disk further includes an alignment disk, and the alignment disk is used to be bound to the alignment mark of the display panel.

[0031] According to one aspect of the present disclosure, there is provided a display device, comprising:

[0032] The display panel as described in any one of the above items;

[0033] A control circuit board as described in any one of the above;

[0034] The driving pad is bound to the driving connection pad and transmits the control signal; the dummy pad is bound to the dummy connection pad.

[0035] The display panel, control circuit board and display device disclosed herein, when binding the control circuit board and the display panel, not only the driving pads and driving connection pads for transmitting control signals are bound, but also the dummy pads and dummy connection pads can be bound, so that the contact surface between the control circuit board and the display panel is increased, not easy to loosen or fall off, and can better resist impact, thereby improving the reliability of the product.

[0036] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0038] Figure 1 FIG. 1 is a top view of an embodiment of a display panel disclosed herein.

[0039] Figure 2 It is a partial cross-sectional view of an embodiment of the display panel disclosed in the present invention.

[0040] Figure 3 It is a partial cross-sectional view of an embodiment of the display panel disclosed in the present invention.

[0041] Figure 4 It is a top view of an embodiment of the control circuit board disclosed in the present invention.

[0042] Figure 5 It is a partial cross-sectional view of an embodiment of the display device disclosed herein.

[0043] Description of reference numerals:

[0044] 001. Display panel;

[0045] 1. driving backplane; 101. display area; 102. peripheral area; 1021. binding area; 1022. protection area; 100. substrate; 110. first flat layer; 120. first conductive layer; 130. second flat layer; 140. second conductive layer; 150. third flat layer; 151. binding hole; 11. pad; 111. driving pad; 112. dummy pad; 113. isolation pad;

[0046] 2. Light-emitting layer; 21. First electrode; 22. Pixel definition layer; 23. Light-emitting functional layer; 24. Second electrode;

[0047] 3. Alignment mark;

[0048] 4. Occlusion layer; 41. Occlusion unit;

[0049] 002. Control circuit board;

[0050] 201, circuit area; 202, connection area; 200, substrate; 210, connection pad; 211, drive connection pad; 212, dummy connection pad; 213, isolation connection pad; 214, alignment pad;

[0051] 003. Conductive adhesive. DETAILED DESCRIPTION

[0052] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0053] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first" and "second" are used merely as labels and are not intended to limit the quantity of their objects.

[0054] The present disclosure provides a display panel. Figure 1-Figure 3 and Figure 5 As shown, the display panel 001 may include a driving backplane 1, the driving backplane 1 has a display area 101 and a peripheral area 102 located outside the display area 101, and the peripheral area 102 has a binding area 1021; the driving backplane 1 includes a driving circuit, and the driving circuit is arranged in the display area 101 and the peripheral area 102; the binding area 1021 is provided with a plurality of pads 11, and each pad 11 is used to bind with the control circuit board 002; each pad 11 includes a driving pad 111 and a vacant dummy pad 112; the driving pad 111 is connected to the driving circuit for transmitting a control signal from the control circuit board 002.

[0055] The display panel 001 disclosed in the present invention, when binding the control circuit board 002 and the display panel 001, not only the driving pad 111 and the driving connection pad 211 for transmitting the control signal are bound, but also the dummy pad 112 and the dummy connection pad 212 are bound, so that the contact surface between the control circuit board 002 and the display panel 001 is increased, which is not easy to loosen or fall off, and can better resist impact, thereby improving the reliability of the product.

[0056] The display panel 001 of the present disclosure is described in detail below:

[0057] like Figure 1-Figure 3As shown, the display panel 001 of the present disclosure may include a driving backplane 1 and a light-emitting layer 2. The light-emitting layer 2 may include a plurality of light-emitting devices distributed in an array. The driving backplane 1 has a driving circuit connected to the light-emitting devices for driving each light-emitting device to emit light to display an image.

[0058] The driving backplane 1 can be divided into at least a display area 101 and a peripheral area 102, wherein the peripheral area 102 is located outside the display area 101, for example, the peripheral area 102 can be arranged around the display area 101. The driving circuit can include a pixel circuit and a peripheral circuit, wherein the number of pixel circuits is multiple and located in the display area 101, and each pixel circuit is connected to each light-emitting device in a one-to-one correspondence. The peripheral circuit can be connected to the pixel circuit to transmit a signal to the pixel circuit to control the light-emitting device to emit light; the peripheral circuit includes a gate driving circuit and a light-emitting control circuit, etc. The structure of the pixel circuit and the driving circuit is not specifically limited here.

[0059] In some embodiments of the present disclosure, Figure 2 and Figure 3 As shown, the driving backplane 1 may be a silicon-based driving backplane, which may include a substrate 100, which may be a silicon substrate, and the driving circuit may be formed on the silicon substrate by a semiconductor process. For example, the driving circuit includes a plurality of transistors, and an active layer, a first electrode, and a second electrode of the transistor may be formed in the silicon substrate by a doping process, and a gate of the transistor may be formed at a position corresponding to the active layer above the substrate 100, and the gate and the active layer are separated by a gate insulating layer.

[0060] The driving backplane 1 may also include a plurality of conductive layers located on one side of the base substrate, and each conductive layer may be distributed in sequence in a direction away from the base substrate 100. The conductive layer may be made of metal material, such as copper, and may form wirings of different patterns respectively. The conductive layer closest to the base substrate 100 is connected to the transistor on the base substrate 100, and two adjacent conductive layers are connected, so that a driving circuit is formed through the transistor and the conductive layer. Among them, the pattern of the conductive layer and the specific connection method are not specifically limited here. Of course, the driving circuit may also include capacitors or other components, which may be formed by forming specific patterns in one or more conductive layers.

[0061] like Figure 2 and Figure 3 As shown, based on the above silicon-based driving backplane 1, exemplarily, each conductive layer may include a first conductive layer 120 and a second conductive layer 140; the driving backplane 1 also includes a first flat layer 110, a second flat layer 130 and a third flat layer 150, wherein:

[0062] The first flat layer 110 is disposed on one side of the base substrate 100, and the first conductive layer 120 is disposed on the surface of the first flat layer 110 away from the base substrate 100. The second flat layer 130 covers the first conductive layer 120 and the area of ​​the first flat layer 110 not covered by the first conductive layer 120. The second conductive layer 140 is disposed on the surface of the second flat layer 130 away from the base substrate 100. The third flat layer 150 covers the second conductive layer 140 and the area of ​​the second flat layer 130 not covered by the second conductive layer 140. The materials of the first flat layer 110, the second flat layer 130 and the third flat layer 150 can be made of silicon nitride, silicon oxide and the like, and can be planarized by deposition and polishing processes.

[0063] The first conductive layer 120 can be connected to the transistor of the base substrate 100 through a contact hole penetrating the first flat layer 110, and the second conductive layer 140 can be connected to the first conductive layer 120 through a contact hole penetrating the second flat layer 130, so that a driving circuit can be formed by the first conductive layer 120 and the second conductive layer 140 and the transistor. The surface of the third flat layer 150 facing away from the base substrate 100 can be used to form the light-emitting layer 2.

[0064] In the embodiments of the present disclosure, the aforementioned silicon-based driving backplane 1 is mainly used as an example for explanation, so as to be used to drive Micro OLED (Micro Organic Light-Emitting Diode) or other light-emitting devices, so as to form a Micro OLED display panel 001. However, it is not excluded that the driving backplane 1 of the OLED display panel 001 can also be used. For example, in other embodiments of the present disclosure, the driving backplane 1 may not use the aforementioned silicon-based driving backplane, which may include a substrate and a plurality of thin film transistors on the substrate, and the substrate may be a material such as glass or polyimide. Taking a top-gate thin film transistor as an example, it may include an active layer, a first gate insulating layer, a gate, a second gate insulating layer, an interlayer dielectric layer, a source-drain layer and a flat layer, wherein the active layer may be stacked on the substrate, and the first gate insulating layer covers the active layer and the substrate. The gate is arranged on the surface of the first gate insulating layer away from the substrate, and is directly opposite to the active layer. The second gate insulating layer covers the gate and the second gate insulating layer. The interlayer dielectric layer covers the second gate insulating layer. The source-drain layer is disposed on the surface of the interlayer dielectric layer away from the substrate, and includes a source electrode and a drain electrode, which are connected to both ends of the active layer through contact holes. The flat layer covers the source-drain layer. The light-emitting layer 2 can be disposed on the side of the flat layer away from the substrate.

[0065] like Figure 2 and Figure 3 As shown, the light-emitting layer 2 may be disposed on one side of the driving backplane 1, for example, the light-emitting layer 2 is disposed on the surface of the third flat layer 150 away from the base substrate 100. At the same time, the light-emitting layer 2 may include a first electrode 21, a pixel definition layer 22, a light-emitting function layer 23 and a second electrode 24, wherein:

[0066] The first electrode 21 is disposed on a side of the driving backplane 1. For example, the first electrode 21 is disposed on a surface of the third flat layer 150 away from the base substrate 100. At the same time, there are multiple first electrodes 21, and they are located in the display area 101 of the driving backplane 1.

[0067] The pixel definition layer 22 and the first electrode 21 are disposed on the same side of the driving backplane 1 and are located in the display area 101 . The pixel definition layer 22 has openings that expose the first electrodes 21 , and each first electrode 21 is exposed by an opening.

[0068] The light-emitting functional layer 23 is at least partially disposed in the opening and is stacked on the surface of the first electrode 21 away from the driving backplane 1. The light-emitting functional layer 23 may be made of organic material, and may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, and an electron injection layer stacked in sequence in a direction away from the driving backplane 1.

[0069] The second electrode 24 can cover the light-emitting functional layer 23, and the second electrode 24 can also be connected to the peripheral circuit, so that the peripheral circuit can apply a signal to the first electrode 21 through the pixel circuit, and can also apply a signal to the second electrode 24 through the peripheral circuit. Under the action of the first electrode 21 and the second electrode 24, the light-emitting functional layer 23 emits light. The specific light-emitting principle of the electroluminescent organic light-emitting device will not be described in detail here.

[0070] A plurality of light-emitting devices can be defined by the pixel definition layer 22 . Specifically, one opening can define one light-emitting device. Each light-emitting device includes a first electrode 21 exposed by the opening and its corresponding light-emitting functional layer 23 and second electrode 24 .

[0071] It should be noted that each light-emitting functional layer 23 can be a different area of ​​the same light-emitting film layer, that is, the light-emitting film layer is located in the area within each opening, so that each light-emitting device shares the light-emitting film layer and has the same light-emitting color; in order to achieve color display, a color filter layer can be set on the side of the light-emitting layer 2 away from the driving backplane 1, and the color filter layer has a filter portion corresponding to each light-emitting device one by one, and each filter portion can only allow light of one color to pass through. By setting filter portions of multiple colors, color display can be achieved. Of course, the light-emitting functional layers 23 in two adjacent openings can be arranged at intervals and not connected to each other. The light-emitting colors of different light-emitting functional layers 23 can be different, so that color display can be directly achieved without necessarily using a color filter layer. At the same time, the second electrode 24 can be a continuous film layer that covers each light-emitting functional layer 23 at the same time, so that each light-emitting device can share the second electrode 24.

[0072] In addition, the display panel 001 of the present disclosure may further include an encapsulation layer, a touch layer, etc., wherein the encapsulation layer may be located on the side of the light-emitting layer 2 away from the driving backplane 1 , and the touch layer may be located on the side of the encapsulation layer away from the driving backplane 1 .

[0073] The pad 11 of the display panel 001 of the present disclosure is described in detail below:

[0074] like Figure 1-Figure 3 and Figure 5 As shown, based on the display panel 001 described above, its peripheral area 102 may have a binding area 1021, and a plurality of pads 11 are provided in the binding area 1021, each pad 11 is used to bind with the control circuit board 002, and the control circuit board 002 can input a control signal to the peripheral circuit to drive the light-emitting layer 2 to emit light. Each pad 11 can be made of copper or other metal materials. When binding the control circuit board 002 with the pad 11, the connection pad 210 on the control circuit board 002 can be welded to the pad 11 correspondingly, or bonded by conductive glue or other conductive media, and the specific implementation method of the binding process is not particularly limited here.

[0075] like Figure 1-Figure 3 As shown, each pad 11 includes at least a driving pad 111 and a dummy pad 112. The driving pad 111 is connected to the driving circuit in the display driving backplane 1, and is used to transmit the control signal from the control circuit board 002. The dummy pad 112 is in a vacant state, that is, the dummy pad 112 is not connected to any circuit. The dummy pad 112 is only used to bind with the control circuit board 002, but does not transmit electrical signals. By setting the dummy pad 112, the contact surface between the control circuit board 002 and the display panel 001 can be increased, so that the display panel 001 and the control circuit board 002 are not easy to loosen, thereby improving the ability to resist harsh environments such as vibration and impact, and improving the reliability of the product.

[0076] Further, such as Figure 1-Figure 3 As shown, each pad 11 may further include an isolation pad 113, which is arranged at intervals with the driving pad 111 and the dummy pad 112 along the first direction Y, but the number of each is not specifically limited here. The isolation pad 113 is arranged adjacent to at least one driving pad 111, that is, the driving pad 111 is arranged on at least one side of the isolation pad 113 along the first direction, and there is no other pad 11 between the two.

[0077] In some embodiments of the present disclosure, Figure 1-Figure 3As shown, the number of dummy pads 112 and isolation pads 113 are both multiple, and the dummy pads 112 are divided into two groups, and the isolation pads 113 are divided into two groups. In the first direction Y, each driving pad 111 is located between two groups of isolation pads 113; two groups of isolation pads 113 are located between two groups of dummy pads 112. For example, the number of isolation pads 113 is two, and each group has one isolation pad 113; the number of dummy pads 112 is four, and they are divided into two groups, and each group has two dummy pads 112; the number of driving pads 111 is not specifically limited, and each driving pad 111 is located between two isolation pads 113; two isolation pads 113 are located between two groups of dummy pads 112.

[0078] The isolation pad 113 can also be bound to the control circuit board 002 and can receive a shielding signal. Since the dummy pad 112 does not receive any electrical signal, while the drive pad 111 needs to receive a control signal, there is a potential difference between the dummy pad 112 and the drive pad 111 adjacent to it in the first direction Y, which can easily cause the charge of the drive pad 111 to escape, thereby interfering with the control signal. Therefore, an isolation pad 113 can be set between the dummy pad 112 and the drive pad 111, and an electrical signal identical to the control signal can be continuously input to the isolation pad 113 to eliminate the potential difference between the isolation pad 113 and the drive pad 111, thereby ensuring that the control signal is not affected. The shielding signal can be emitted by the control circuit board 002, as long as it can realize the shielding function.

[0079] In addition, in some embodiments of the present disclosure, if there is a signal difference between two adjacent driving pads 111 , an isolation pad 113 may be provided between the two adjacent driving pads 111 , and a shielding function may be achieved by inputting a shielding signal to the isolation pad 113 .

[0080] The pads 11 may have the same shape and size, for example, the pads 11 may be rectangular in shape and 50 μm in width. The pads 11 may be linearly spaced along the width direction of the rectangle, and the first direction Y may be the width direction of the rectangle.

[0081] In some embodiments of the present disclosure, Figure 2 , Figure 3 and Figure 5As shown, each pad 11 can be arranged on the same layer as a conductive layer. In order to facilitate binding with the control circuit board 002, a binding hole 151 exposing each pad 11 can be opened in the binding area 1021, and the control circuit board 002 can pass through the binding hole 151. For example, each pad 11 can be arranged on the same layer as the second conductive layer 140, so that it can be formed simultaneously through the same patterning process to simplify the process. The binding hole 151 can penetrate the third flat layer 150 to expose the pad 11. When binding, the control circuit board 002 can be overlapped on the surface of the third flat layer 150 away from the driving backplane 1, and the control circuit board 002 is electrically connected to the pad 11 through a medium such as a conductive glue 003 in the binding hole 151.

[0082] Of course, in other embodiments of the present disclosure, each pad 11 may also be arranged on the same layer as other conductive layers, or, the pad 11 may also be arranged on the surface of the third flat layer 150 away from the driving backplane 1, as long as it can be connected to the driving circuit and can be bound to the control circuit board 002.

[0083] like Figure 3 and Figure 5 As shown, in order to facilitate the provision of a positioning reference for the binding of the control circuit board 002 and the display panel 001, in some embodiments of the present disclosure, the display panel 001 further includes an alignment mark 3, which is disposed on one side of the drive backplane 1, and the orthographic projection of the alignment mark 3 on the drive backplane 1 is located within the binding area 1021. The alignment mark 3 can be used to provide a reference for the positioning of the control circuit board 002 when binding the control circuit board 002. Of course, those skilled in the art can imagine that, although the alignment mark 3 is used in the aforementioned binding process, it can also be used for other purposes, for example, it can provide a positioning reference for the mask when forming the light-emitting functional layer 23 by an evaporation process.

[0084] At the same time, the alignment mark 3 can also be bound to the control circuit board 002, further increasing the contact area between the control circuit board 002 and the display panel 001, making the combination of the two more secure. In order to facilitate alignment and prevent the alignment mark 3 from being blocked, the alignment mark 3 and the first electrode 21 can be arranged in the same layer, so that they can be formed simultaneously through a single patterning process. When binding, the control circuit board 002 can overlap the alignment mark 3 and be bound to the pad 11 through the binding hole 151.

[0085] like Figure 3 As shown, the orthographic projection of the alignment mark 3 on the driving backplane 1 is spaced apart from each pad 11 along the aforementioned first direction Y to avoid blocking the pad 11. For example, the number of the alignment marks 3 is two, and the orthographic projections of the two alignment marks 3 on the driving backplane 1 are spaced apart from each pad 11 in a straight line along the first direction Y, and each pad 11 is located between the two alignment marks 3.

[0086] The shape of the alignment mark 3 is not particularly limited here. For example, in some embodiments of the present disclosure, the alignment mark 3 may be in the shape of a "cross", including a first section and a second section that intersect each other, and the first section and the second section may be rectangular in shape, and the two are perpendicular to each other. The first section may be arranged parallel to each pad 11, and the length and width of the first section are the same as each pad 11. Of course, the alignment mark 3 may also be in other shapes, such as regular shapes such as triangles and ellipses, or irregular shapes, as long as it can be used to bind the control circuit board 002 to the display panel 001.

[0087] It should be noted that Figure 3 and Figure 1 shows different cross sections of the display panel 001, Figure 3 The alignment mark 3 is shown in FIG. Figure 1 The pad 11 is shown in FIG.

[0088] Further, such as Figure 1 , Figure 2 and Figure 5 As shown, when forming the binding hole 151, due to the existence of errors, part of the driving circuit on the side close to the display area 101 may be affected. Therefore, the shielding layer 4 can be provided to protect the side of the area close to the display area 101 where the binding hole 151 is to be opened. For example, in some embodiments of the present disclosure, the peripheral area 102 of the display panel 001 also includes a protection area 1022, the protection area 1022 is separated between the binding area 1021 and the display area 101, and the driving circuit part is located in the protection area 1022. The shielding layer 4 can be provided in the same layer as the first electrode 21, and the orthographic projection of the shielding layer 4 on the driving backplane 1 is located in the protection area 1022.

[0089] Further, such as Figure 1 , Figure 2 and Figure 5 As shown, the shielding layer 4 includes a plurality of shielding units 41. In the second direction X, each binding hole 151 is provided with a shielding unit 41 on one side close to the display area 101, that is, each binding hole 151 and a shielding unit 41 are arranged in a straight line along the second direction X. The shielding units 41 can be spaced apart along the first direction Y, and the shape of the orthographic projection of the shielding unit 41 on the driving backplane 1 can be rectangular, and its width in the first direction Y can be the same as the width of the pad 11 along the first direction Y, and its length in the second direction X can be 20μm. Of course, the shielding unit 41 can also be other shapes. The second direction X is perpendicular to the first direction Y.

[0090] It should be noted that Figure 1X and Y in the figure are merely exemplary descriptions of the first direction and the second direction, and do not constitute specific limitations thereto. Those skilled in the art will appreciate that, although the display panel rotates, the actual orientations of the first direction Y and the second direction X may change.

[0091] Based on the above display panel 001, accordingly, Figure 4 As shown, the present disclosure provides a control circuit board 002 that can be bound to the above-mentioned display panel 001. The control circuit board 002 of the present disclosure can be a flexible circuit board. The control circuit board 002 has a circuit area 201 and a connection area 202 located outside the circuit area 201. The connection area 202 is provided with a plurality of connection pads 210, wherein:

[0092] like Figure 4 and Figure 5 As shown, each connection pad 210 may include a driving connection pad 211 and an empty dummy connection pad 212; the shape and size of the driving connection pad 211 may be the same as the driving pad 111, and the driving connection pad 211 may be bound to the driving pad 111 and may transmit a control signal. The shape and size of the dummy connection pad 212 are used to be bound to the dummy pad 112 of the display panel 001, and the dummy connection pad 212 is not connected to the circuit and does not input an electrical signal.

[0093] Further, such as Figure 4 and Figure 5 As shown, the connection pad 210 may further include an isolation connection pad 213 , the shape and size of the isolation connection pad 213 may be the same as the isolation pad 113 , and may be bound to the isolation pad 113 , so that the control circuit board 002 may transmit a shielding signal to the isolation pad 113 .

[0094] Further, such as Figure 4 and Figure 5 As shown, the connection disk 210 may further include an alignment disk 214 . The shape and size of the alignment disk 214 may be the same as the alignment mark 3 , and may be bound to the alignment mark 3 of the display panel 001 .

[0095] The above-mentioned connection pads 11 can be located in the same conductive layer so as to be formed by the same patterning process. For example, Figure 4 and Figure 5 As shown, the control circuit board 002 may include a substrate 200 and a conductive layer located on the substrate 200, and the connection pad 11 is a local area of ​​the conductive layer.

[0096] like Figure 5 As shown, based on the display panel 001 and the control circuit board 002 of the above embodiment, the present disclosure further provides a display device, including the display panel 001 and the control circuit board 002, wherein:

[0097] The display panel 001 and the control circuit board 002 are the display panel 001 and the circuit board of any of the above-mentioned embodiments, and the structures of the two are not described in detail here. The control circuit board 002 and the display panel 001 are bound. Specifically, the binding area 1021 of the display panel 001 and the connection area 202 of the control circuit board 002 at least partially overlap, and the driving pad 111 is bound to the driving connection pad 211, and the control signal is transmitted. The dummy pad 112 is bound to the dummy connection pad 212. The isolation pad 113 is bound to the isolation connection pad 213. The alignment mark 3 is bound to the alignment disk 214.

[0098] In addition, the control circuit board 002 may be a flexible circuit board, and after being bound to the display panel 001 , it may be bent to the side of the driving backplane 1 away from the light emitting layer 2 , so as to reduce the width of the edge of the display device.

[0099] The display device disclosed in the present invention may be a mobile phone, a television, a tablet computer, or other electronic device with an image display function, which will not be listed one by one here.

[0100] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A display panel, characterized in that: The driving backplane comprises a display area and a peripheral area outside the display area, wherein the peripheral area has a binding area; The driving backplane includes a driving circuit, and the driving circuit is arranged in the display area and the peripheral area; The binding area is provided with a plurality of pads, each of which is used to bind to the control circuit board; each of the pads includes a driving pad, an isolation pad and a vacant dummy pad; the driving pad is connected to the driving circuit and is used to transmit a control signal from the control circuit board; the isolation pad is arranged adjacent to at least one of the driving pads; the isolation pad, the driving pad and the dummy pad are arranged at intervals along a first direction; the isolation pad is used to receive a shielding signal; The display panel further includes an alignment mark capable of being bound to the control circuit board. The alignment mark is arranged on one side of the driving backplane, and an orthographic projection of the alignment mark on the driving backplane is located in the binding area.

2. The display panel according to claim 1, characterized in that: The driving backplane includes a base substrate and a multi-layer conductive layer located on one side of the base substrate, and each of the conductive layers is distributed in sequence along a direction away from the base substrate; each of the pads is arranged on the same layer as a conductive layer; and the binding area is provided with a binding hole exposing each of the pads.

3. The display panel according to claim 2, characterized in that: The conductive layer includes a first conductive layer and a second conductive layer; the driving backplane also includes a first flat layer, a second flat layer and a third flat layer; The first flat layer is disposed on one side of the substrate; the first conductive layer is disposed on a surface of the first flat layer away from the substrate; The second flat layer covers the first conductive layer and the first flat layer; the second conductive layer is arranged on a surface of the second flat layer away from the base substrate; the pad is arranged on the same layer as the second conductive layer; The third planar layer covers the second conductive layer and the second planar layer, and the binding hole is provided in the third planar layer.

4. The display panel according to claim 1, characterized in that: The number of the dummy pads and the isolation pads are both multiple, and the dummy pads are divided into two groups, and the isolation pads are divided into two groups; In the first direction, each of the driving pads is located between two groups of the isolation pads; and two groups of the isolation pads are located between two groups of the dummy pads.

5. The display panel according to claim 2, characterized in that: The display panel further includes a light-emitting layer, and the light-emitting layer includes: A first electrode is disposed on a side of the driving backplane and is located in the display area; the alignment mark is disposed in the same layer as the first electrode; A pixel definition layer, which is disposed on the same side of the driving backplane as the first electrode and is located in the display area, and has an opening exposing the first electrode; A light-emitting functional layer, at least partially disposed in the opening, and stacked on a surface of the first electrode facing away from the driving backplane; The second electrode covers the light-emitting functional layer.

6. The display panel according to claim 1, characterized in that: The orthographic projection of the alignment mark on the driving backplane is spaced apart from each of the pads along the first direction.

7. The display panel according to claim 5, characterized in that: The peripheral area further includes a protection area, the protection area is separated between the binding area and the display area, and the driving circuit part is located in the protection area; The display panel further includes: The shielding layer is arranged at the same layer as the first electrode, and the orthographic projection of the shielding layer on the driving backplane is located in the protection zone.

8. The display panel according to claim 7, characterized in that: The shielding layer includes a plurality of shielding units; in the second direction, a shielding unit is provided on a side of each binding hole close to the display area, and the second direction is perpendicular to the first direction.

9. A control circuit board, characterized in that: The control circuit board has a circuit area and a connection area outside the circuit area, the connection area is provided with a plurality of connection pads, each of the connection pads includes a driving connection pad and an empty dummy connection pad; the driving connection pad is used to bind with the driving pad of the display panel and transmit a control signal; the dummy connection pad is used to bind with the dummy pad of the display panel; The connection pad also includes an isolation connection pad and an alignment pad. The isolation connection pad is used to bind to the isolation pad of the display panel and transmit a shielding signal to the isolation pad; the alignment pad is used to bind to the alignment mark of the display panel.

10. A display device, characterized in that: include: The display panel according to any one of claims 1 to 8; The control circuit board according to claim 9; The driving pad is bound to the driving connection pad and transmits the control signal; the dummy pad is bound to the dummy connection pad.

Citation Information

Patent Citations

  • Display Apparatus

    CN107039488A

  • Organic light emitting display device

    CN108461480A