A device that mixes or multiplies frequencies

Abstract

Disclosed is a device for mixing or multiplying frequencies, comprising: a metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body being buckled together to define a metal cavity; at least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel, and a signal output channel passing through the metal shell and coupled with the microstrip line respectively, at least two of the plane where the radio frequency signal input channel is located, the plane where the local oscillator signal input channel is located, and the plane where the signal output channel is located are not coplanar. The device can avoid the problem of poor integration caused by the radio frequency signal input channel, the local oscillator signal input channel, and the signal output channel existing in the same plane.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to a device for mixing or multiplying frequencies. Background Art

[0002] In recent years, terahertz wave technology, as an important research field, has received more and more attention at home and abroad. No matter in which aspect and which frequency band terahertz waves are applied, they are inseparable from the reception of terahertz waves. For the most commonly used receiver based on superheterodyne system, the mixer that realizes frequency down-conversion is one of the key components. In solid-state terahertz radar and communication systems, since low-noise amplifiers are difficult to implement, mixers become the first stage of the receiving end, so the performance of the mixer is directly related to the performance of the entire receiver system. At the same time, since it is difficult to implement high-performance local oscillators in the same frequency band, the use of subharmonic mixing technology is an effective way to solve this problem.

[0003] As system performance requirements increase, the requirements for receiver indicators are also increasing. In order to improve integration or imaging resolution, multi-channel integration of receivers is a key issue. Since the current mainstream terahertz mixers use metal cavity materials such as copper or aluminum, which can achieve a good channel spacing distance, they are still spliced ​​in a single-channel independent form. However, due to the limitations of metal cavity machining requirements, it is difficult to reduce the multi-channel spacing to improve the overall integration. Summary of the invention

[0004] An object of the present disclosure is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0005] According to an embodiment of the present disclosure, a device for mixing or multiplying frequencies is provided, comprising:

[0006] A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity;

[0007] At least one frequency conversion unit, the at least one frequency conversion unit comprising:

[0008] a microstrip line, the microstrip line being located in the metal cavity; and

[0009] A channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel which pass through the metal shell and are respectively coupled to the microstrip line, and at least two of the planes where the radio frequency signal input channel is located, the plane where the local oscillator signal input channel is located and the plane where the signal output channel is located are not coplanar.

[0010] In some exemplary embodiments, the signal output channel is led out perpendicularly to the plane where the microstrip line is located.

[0011] In some exemplary embodiments, the radio frequency signal input channel and the local oscillator signal input channel are both introduced parallel to the plane where the microstrip line is located.

[0012] In some exemplary embodiments, the radio frequency signal input channel and the local oscillator signal input channel are both introduced perpendicular to the length direction of the microstrip line.

[0013] In some exemplary embodiments, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along the length direction of the microstrip line.

[0014] In some exemplary embodiments, when the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively disposed in the box body and the cover body, and are arranged in a mirror-symmetrical manner.

[0015] In some exemplary embodiments, the radio frequency signal input channels of each row of the frequency conversion units are parallel to each other and their ports are aligned, and the local oscillator signal input channels of each row of the frequency conversion units are parallel to each other and their ports are aligned.

[0016] In some exemplary embodiments, the signal output channels of the frequency conversion units in each row are parallel to each other, and the output directions of two adjacent signal output channels in each row are opposite.

[0017] In some exemplary embodiments, the radio frequency signal input channel and the local oscillator signal input channel are both parallel to the length direction of the microstrip line and are coupled to the microstrip line through a turn.

[0018] In some exemplary embodiments, the signal output channel is led out parallel to the plane where the microstrip line is located.

[0019] In some exemplary embodiments, the radio frequency signal input channel and the local oscillator signal input channel are both introduced perpendicular to the plane where the microstrip line is located.

[0020] In some exemplary embodiments, the introduction directions of the radio frequency signal input channel and the local oscillator signal input channel are opposite.

[0021] In some exemplary embodiments, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along a direction perpendicular to the length direction of the microstrip line.

[0022] In some exemplary embodiments, when the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively disposed in the box body and the cover body, and are arranged in a mirror-symmetrical manner.

[0023] In some exemplary embodiments, the radio frequency signal input channels of each row of the frequency conversion units are parallel to each other and their ports are aligned, and the local oscillator signal input channels of each row of the frequency conversion units are parallel to each other and their ports are aligned.

[0024] In some exemplary embodiments, one of the RF signal input channel and the local oscillator input channel is introduced parallel to the plane where the microstrip line is located and is coupled to the microstrip line through a turn, and the other of the RF signal input channel and the local oscillator input channel is introduced perpendicular to the plane where the microstrip line is located.

[0025] In some exemplary embodiments, the introduction direction of the RF signal input channel and the lead-out direction of the signal output channel are the same.

[0026] In some exemplary embodiments, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along a direction perpendicular to the length direction of the microstrip line.

[0027] In some exemplary embodiments, when the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively disposed in the box body and the cover body, and are arranged in a mirror-symmetrical manner.

[0028] In some exemplary embodiments, when there are multiple channel structures, the local oscillator signal input channels of the multiple channel structures are aggregated into one port through a power divider.

[0029] According to the device for mixing or multiplying frequencies described in the various embodiments of the present disclosure, by making at least two of the plane where the RF signal input channel is located, the plane where the local oscillator signal input channel is located, and the plane where the signal output channel is located non-coplanar, the problem of poor integration caused by the RF signal input channel, the local oscillator signal input channel, and the signal output channel being in the same plane is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown.

[0031] Figure 2 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to another exemplary embodiment of the present disclosure is shown.

[0032] Figure 3A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure.

[0033] Figure 4 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0034] Figure 5 A schematic diagram of a glass insulator according to an exemplary embodiment of the present disclosure.

[0035] Figure 6 A schematic diagram of a terahertz mixer having a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure is shown.

[0036] Figure 7 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0037] Figure 8 Schematic diagram of a coaxial metal pillar structure according to an exemplary embodiment of the present disclosure.

[0038] Fig. 9 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown.

[0039] Fig.10 Show Fig. 9 Another schematic diagram of a terahertz mixer with a single frequency conversion unit is shown.

[0040] Fig.11 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0041] Fig.12 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure is shown.

[0042] Fig.13 Show Fig.12 Another schematic diagram of a terahertz mixer with a single frequency conversion unit is shown.

[0043] Fig.14 The purpose of illustrating a terahertz mixer having a plurality of frequency conversion units according to yet another exemplary embodiment of the present disclosure.

[0044] Fig.15 A schematic diagram of a terahertz mixer having a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure is shown.

[0045] Fig.16The purpose of illustrating a terahertz mixer having a plurality of frequency conversion units according to yet another exemplary embodiment of the present disclosure.

[0046] Fig.17 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown.

[0047] Fig.18 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to another exemplary embodiment of the present disclosure is shown.

[0048] Fig.19 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0049] Fig. 20 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0050] Fig.21 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to another exemplary embodiment of the present disclosure is shown.

[0051] Fig. 22 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0052] Fig.23 A schematic diagram showing the distribution of multiple frequency conversion units of a terahertz mixer on a box body according to yet another exemplary embodiment of the present disclosure is shown.

[0053] Fig.24 A schematic diagram showing the distribution of multiple frequency conversion units of a terahertz mixer on a cover according to yet another exemplary embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0054] Although the present disclosure will be fully described with reference to the accompanying drawings containing preferred embodiments of the present disclosure, it should be understood before this description that a person of ordinary skill in the art can modify the invention described herein while obtaining the technical effects of the present disclosure. Therefore, it should be understood that the above description is a broad disclosure to a person of ordinary skill in the art, and its content is not intended to limit the exemplary embodiments described in the present disclosure.

[0055] In addition, in the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments may be implemented without these specific details. In other cases, known structures and devices are embodied in a schematic manner to simplify the accompanying drawings.

[0056] According to the overall inventive concept of the present disclosure, there is provided a device for mixing or multiplying frequencies, comprising: a metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body being buckled together to define a metal cavity; at least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel, and a signal output channel that pass through the metal shell and are respectively coupled to the microstrip line, at least two of the plane where the radio frequency signal input channel is located, the plane where the local oscillator signal input channel is located, and the plane where the signal output channel is located are not coplanar.

[0057] Figure 1 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown. Figure 2 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to another exemplary embodiment of the present disclosure is shown.

[0058] like Figure 1 and Figure 2 As shown, the frequency conversion unit of the terahertz mixer includes a microstrip line 107 and a channel structure, and the microstrip line 107 is located in a metal cavity. The channel structure includes a radio frequency signal input channel 101, a local oscillator signal input channel 102 and a signal output channel that pass through the metal shell and are respectively coupled to the microstrip line 107. A portion of the microstrip line 107 extends into the metal cavity where the radio frequency signal input channel 101 and the local oscillator signal input channel 102 are located, so as to form an antenna 104 for receiving the radio frequency input signal and the local oscillator input signal. Among them, the composition and size parameters of other parts in the mixer can refer to the prior art, or other documents or patents.

[0059] The specific contents of this solution are described below in conjunction with more specific examples. It should be understood that the dimensions and proportions in the figures are only for illustration and have nothing to do with the actual structure.

[0060] like Figure 1 and Figure 2As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the mixer according to the present disclosure are respectively formed in a box body (or cover body) defining a metal cavity, and are parallel to the plane where the microstrip line 107 is located, while the signal output channel (in this embodiment, the intermediate frequency signal output channel) is perpendicular to the plane where the microstrip line 107 is located, and is led out from the cover body or the box body through the SMA connector 112. The terahertz mixer changes the direction of the intermediate frequency signal lead-out of the mixer from a direction parallel to the plane where the microstrip line 107 is located to a direction perpendicular to the plane where the microstrip line 107 is located through the SMA connector 112, thereby avoiding the problem of poor integration caused by the RF signal input channel, the local oscillator signal input channel and the signal output channel existing in the same plane, and while ensuring the basic high-frequency characteristics of the mixer, reduces the complexity and processing cost of multi-channel integration, improves the flexibility of the mixer integration method, and provides favorable conditions for further system integration.

[0061] exist Figure 1 and Figure 2 In the illustrated embodiment, the SMA connector 112 is a through-wall structure and has a metal needle, which points outward perpendicular to the paper plane, and one end of which is flush with the microstrip line 107 and is connected to the intermediate frequency signal output port 103 of the microstrip line 107 through gold wire binding, thereby realizing vertical extraction of the intermediate frequency signal. It should be noted that those skilled in the art should understand that the SMA connector 112 can also use other connectors, such as a 2.92 mm connector.

[0062] Figure 3 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure. Figure 4 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown. Figure 5 A schematic diagram of a glass insulator according to an exemplary embodiment of the present disclosure.

[0063] In some embodiments of the present disclosure, Figure 3 and Figure 4 As shown in FIG. 1 , the signal output channel is led out vertically through a glass insulator. Specifically, as Figure 5 As shown, the glass insulator includes a metal needle 212 and a first columnar portion 213 sleeved on the middle of the metal needle 212. The metal needle 212 points outward perpendicular to the paper plane, and its first end is flush with the microstrip line 107 and connected to the intermediate frequency signal output port 103 of the microstrip line 107 through gold wire binding. The first columnar portion 213 is made of insulating glass medium, and a metal layer 214 is provided on the outer surface of the first columnar portion 213. The first columnar portion 213 is connected to a cover or box body defining a metal shell, for example, located in a hole formed in the cover or box body.

[0064] In some embodiments of the present disclosure, a second end of the metal pin 212 of the glass insulator, which is opposite to the first end, is connected with an SMA connector so as to be connected with an external component.

[0065] Figure 6 It is an intention to illustrate a terahertz mixer having a single frequency conversion unit according to still another exemplary embodiment of the present disclosure. Figure 7 is a schematic diagram showing a terahertz mixer having a plurality of frequency conversion units according to yet another exemplary embodiment of the present disclosure. Figure 8 is a schematic diagram of a coaxial metal pillar structure according to an exemplary embodiment of the present disclosure.

[0066] In some embodiments of the present disclosure, Figure 6 and Figure 7 As shown, the signal output channel is led out vertically through the coaxial metal column. Figure 8 As shown, the coaxial metal column includes a metal needle 312 and a plurality of second columnar portions 313A, 313B, and 313C spaced apart and sleeved on the metal needle 312 along the axial direction of the metal needle 312. One of the second columnar portions 313A, 313B, and 313C (preferably the one away from the intermediate frequency signal output port 103) is connected to the metal shell, and a metal layer 314 is provided on the outer surface of the second columnar portions 313A, 313B, and 313C. The metal needle 312 points outward perpendicular to the paper plane, and its first end is flush with the microstrip line 107, and is connected to the intermediate frequency signal output port 103 of the microstrip line by gold wire binding.

[0067] In an exemplary embodiment of the present disclosure, Figure 8 As shown, the diameters of two adjacent second columnar portions 313A, 313B, and 313C are different. The coaxial metal column uses second columnar portions of different thicknesses to form effective filter characteristics, thereby filtering the radio frequency signal and the local oscillator signal to ensure the output of the intermediate frequency signal. Since the coaxial metal column integrates a low-pass filter, the overall length of the quartz microstrip line is shortened, thereby improving the integration of the multi-channel mixer.

[0068] In some embodiments of the present disclosure, a second end of the metal needle 312 of the coaxial metal column opposite to the first end is connected to an SMA connector for connection with an external component.

[0069] Fig. 9 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown. Fig.10 Show Fig. 9 Another schematic diagram of a terahertz mixer with a single frequency conversion unit is shown. Fig.11 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown. Fig.12 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure is shown. Fig.13 Show Fig.12 Another schematic diagram of a terahertz mixer with a single frequency conversion unit is shown. Fig.14 The purpose of illustrating a terahertz mixer having a plurality of frequency conversion units according to yet another exemplary embodiment of the present disclosure.

[0070] In an exemplary embodiment, Fig. 9 and Fig.10 As shown, the terahertz mixer changes the direction of the intermediate frequency signal of the mixer from a direction parallel to the plane where the microstrip line 107 is located to a direction perpendicular to the plane where the microstrip line 107 is located through the Rogers plate 413, thereby avoiding the problem of poor integration caused by the RF signal input channel, the local oscillator signal input channel and the signal output channel existing in the same plane.

[0071] In an exemplary embodiment, Fig. 9 and Fig.10 As shown, the Rogers board 413 includes a Rogers dielectric material 413A and metal strip lines 413B located on both sides of the Rogers dielectric material 413A. The first end of the Rogers board 413 is flush with the microstrip line 107 and is connected to the intermediate frequency lead-out structure 414 of the microstrip line 107 through gold wire binding, thereby realizing vertical lead-out of the intermediate frequency signal.

[0072] In an exemplary embodiment, Fig. 9 and Fig.10 As shown, the second end of the Rogers board 413 opposite to the first end is connected with an SMA connector 415 for connection with external components. It should be noted that those skilled in the art should understand that the SMA connector 415 may also use other connectors, such as a 2.92 mm connector.

[0073] In some other embodiments of the present disclosure, Fig.12 and Fig.13 As shown, the Rogers board 413' adopts a high-low impedance stripline structure to simultaneously serve as an intermediate frequency low-pass filter, thereby filtering the radio frequency local oscillator signal while allowing the intermediate frequency signal to be transmitted.

[0074] In an exemplary embodiment of the present disclosure, the characteristic impedance of the Rogers board 413 ′ may include but is not limited to 50 ohms, so as to match the SMA connector 415 (or other connectors such as 2.92 mm).

[0075] In an exemplary embodiment of the present disclosure, Figure 1-Figure 4 , Figure 6 , Figure 7 , Fig. 9 and Fig.11 , Fig.12 and Fig.14 As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are both introduced perpendicular to the length direction of the microstrip line 107 and coupled to the microstrip line 107. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit can also be introduced in other directions, for example, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are both introduced parallel to the length direction of the microstrip line 107 and coupled to the microstrip line through a 90° turn.

[0076] Fig.15 A schematic diagram of a terahertz mixer having a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure is shown. Fig.16 The purpose of illustrating a terahertz mixer having a plurality of frequency conversion units according to yet another exemplary embodiment of the present disclosure.

[0077] In an exemplary embodiment of the present disclosure, Fig.15 and Fig.16 As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are introduced in parallel to the length direction of the microstrip line 107, and are coupled to the microstrip line 107 through a 90° turn. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit can also be introduced in other directions, and the turning angle can also be other angles, such as 45°, 60°, etc.

[0078] In an exemplary embodiment of the present disclosure, Figure 1-Figure 4 , Figure 6 , Figure 7 , Fig. 9 , Fig.11 , Figures 14 to 16 As shown, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are opposite to avoid interference between the RF signal input channel 101 and the local oscillator signal input channel 102 and the components associated therewith in spatial position, and at the same time, the overall length of the microstrip line 107 can be shortened to improve the integration of the mixer. However, it should be noted that in some other embodiments of the present disclosure, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit may also be the same. In addition, in some other embodiments of the present disclosure, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit may also be non-parallel.

[0079] In an exemplary embodiment, Figure 1-Figure 4 , Figure 6 , Figure 7 , Fig. 9 and Fig.11 As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are both introduced perpendicularly to the length direction of the microstrip line 107 and coupled to the microstrip line. In this case, when there are multiple frequency conversion units, the multiple frequency conversion units are arranged in a row along the length direction of the microstrip line 107. However, it should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, other arrangements may also be adopted, and the specific arrangements may be adjusted according to requirements.

[0080] In an exemplary embodiment, Fig.15 and Fig.16 As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are both introduced in parallel to the length direction of the microstrip line, and are coupled to the microstrip line 107 through a 90° turn. In this case, when there are multiple frequency conversion units, the microstrip lines of the multiple frequency conversion units are arranged in a row along a direction perpendicular to the length direction of the microstrip line 107. However, it should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, other arrangements may also be used, and the specific arrangement may be adjusted according to requirements.

[0081] In actual use, it is necessary to optimize the design of the vertical lead-out part of the intermediate frequency signal to reduce the return loss and optimize the output characteristics of the intermediate frequency signal.

[0082] In an exemplary embodiment, Figure 1-Figure 4 , Figure 6 , Figure 7 , Fig. 9 , Fig.11 , Figures 14 to 16 As shown, the RF signal input channels 101 of each row of frequency conversion units are parallel to each other and their ports are aligned, and the local oscillator signal input channels 102 are parallel to each other and their ports are aligned, so as to ensure the consistency of signal reception and input local oscillator signals of the multi-channel receiver.

[0083] It should be noted that, although in the above embodiments, the direction of the intermediate frequency signal lead-out of the mixer is changed from a direction parallel to the plane where the microstrip line 107 is located to a direction perpendicular to the plane where the microstrip line 107 is located through an SMA connector or a glass insulator or a coaxial metal column or a Rogers plate, however, those skilled in the art should understand that in some other embodiments of the present disclosure, the direction of the intermediate frequency signal lead-out may also be at an angle to the plane where the microstrip line 107 is located, and the angle is not equal to zero.

[0084] Fig.17A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown. Fig.18 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to another exemplary embodiment of the present disclosure is shown. Fig.19 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown. Fig. 20 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0085] like Figures 17 to 20 As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the mixer according to the present disclosure are both introduced perpendicular to the plane where the microstrip line 107 is located. Here, the RF signal input channel 101 is transmitted perpendicular to the paper surface and inward, and the local oscillator signal input channel 102 is transmitted perpendicular to the paper surface and outward, and the signal output channel (in this embodiment, the intermediate frequency signal output channel) is led out parallel to the plane where the microstrip line 107 is located. The terahertz mixer changes the leading direction of the RF signal input channel 101 and the local oscillator signal input channel 102 from the direction parallel to the plane where the microstrip line 107 is located to the direction perpendicular to the plane where the microstrip line 107 is located, thereby avoiding the problem of poor integration caused by the RF signal input channel 101, the local oscillator signal input channel 102 and the signal output channel existing in the same plane, and while ensuring the basic high-frequency characteristics of the mixer, reduces the complexity and processing cost of multi-channel integration, improves the flexibility of the mixer integration method, and provides favorable conditions for further system integration.

[0086] In such Figures 17 to 20 In the exemplary embodiment, the RF signal input channel 101 and the local oscillator signal input channel 102 are perpendicular to the plane where the microstrip line 107 is located, and can be machined by wire cutting in the cover or box of the metal cavity. The SMA connector 201 (or other connectors such as 2.92mm) is a through-wall structure, and the extension direction of its metal needle is parallel to the microstrip line 107, and can be welded to the intermediate frequency output port 103 of the microstrip line 107 through conductive glue, or a Rogers board can be used to achieve intermediate frequency transition welding.

[0087] In an exemplary embodiment of the present disclosure, Figures 17 to 20As shown, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are opposite to avoid interference between the RF signal input channel 101 and the local oscillator signal input channel 102 and the components associated therewith in spatial position, and at the same time, the overall length of the microstrip line 107 can be shortened to improve the integration of the mixer. However, it should be noted that in some other embodiments of the present disclosure, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit may also be the same. In addition, in some other embodiments of the present disclosure, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit may also be non-parallel.

[0088] In an exemplary embodiment, Figures 18 to 20 As shown, when there are multiple frequency conversion units, the multiple frequency conversion units are arranged in a row along a direction perpendicular to the length direction of the microstrip line 107 (such as Fig.18 as shown) or two rows (as Fig.19 and Fig. 20 shown).

[0089] In an exemplary embodiment, Fig.19 As shown, a plurality of frequency conversion units are arranged in two rows along a direction perpendicular to the length direction of the microstrip line 107 , and the frequency conversion units in the two rows are aligned one by one in the length direction of the microstrip line 107 .

[0090] In an exemplary embodiment, Fig. 20 As shown, a plurality of frequency conversion units are arranged in two rows along a direction perpendicular to the length direction of the microstrip line 107 , and the frequency conversion units in the two rows are staggered one by one in the length direction of the microstrip line 107 .

[0091] In an exemplary embodiment, Figures 17 to 20 As shown, the RF signal input channel 101 adopts an H-plane probe transition structure, and the local oscillator signal input channel 102 adopts an H-plane probe transition structure. In actual use, the H-plane probe transition structure needs to be optimized to reduce return loss and optimize the output characteristics of the intermediate frequency signal.

[0092] In an exemplary embodiment, Figures 18 to 20 As shown, the RF signal input channels 101 of each row of frequency conversion units are parallel to each other and their ports are aligned, and the local oscillator signal input channels 102 are parallel to each other and their ports are aligned, so as to ensure the consistency of the signal received by the receiver and the input local oscillator signal.

[0093] exist Figures 17 to 20In the exemplary embodiment shown, since the RF signal input channel 101 and the local oscillator signal input channel 102 are introduced into the plane where the microstrip line 107 is located, the spacing between the channels is shortened and the integration is improved. In actual use, the size of the connector may be too large to be further shortened, and a customized connector at the intermediate frequency output end may be used to achieve the purpose of small size.

[0094] Figures 17 to 20 The working process of the mixer shown includes: the terahertz signal to be received is transmitted to the antenna 104 of the microstrip line 107 through the RF signal input channel 101 in the waveguide-transition-microstrip line structure of the H-plane probe; the local oscillator signal entering from the local oscillator signal input channel 102 is mixed with the RF signal in the gallium arsenide Schottky diode 109 after passing through the microstrip transition structure 107 of the duplexer and the local oscillator low-pass filter 106, and the RF signal is mixed with the second harmonic of the local oscillator, and the intermediate frequency signal after difference is reached through the intermediate frequency filter 108. The intermediate frequency signal output port 103 is then transmitted to the load through the SMA connector or other connectors such as 2.92mm. In order to avoid the DC bias caused by the inconsistency of the Schottky diode 109 pair, the ground wire 105 connected to the metal cavity is led out from the microstrip line 107, which can be applied to the nearest metal cavity through conductive silver glue, or can be welded to the nearest metal cavity through gold wire binding.

[0095] Fig.21 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to another exemplary embodiment of the present disclosure is shown. Fig. 22 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0096] In an exemplary embodiment of the present disclosure, Fig.21 and Fig. 22 As shown, the RF signal input channel 101 of the frequency conversion unit is introduced parallel to the length direction of the microstrip line 107, and is coupled to the microstrip line 107 through a 90° turn. The local oscillator signal input channel 102 of the frequency conversion unit is introduced perpendicular to the plane where the microstrip line 107 is located, and the signal output channel is led out parallel to the plane where the microstrip line 107 is located. In this way, the problem of poor integration caused by the RF signal input channel 101, the local oscillator signal input channel 102 and the signal output channel existing in the same plane is avoided, and while ensuring the basic high-frequency characteristics of the mixer, the complexity and processing cost of multi-channel integration are reduced, the flexibility of the mixer integration method is improved, and favorable conditions are provided for further system integration.

[0097] In such Fig.21 and Fig. 22In the exemplary embodiment, the RF signal input channel 101 is parallel to the length direction of the microstrip line 107, and the local oscillator signal input channel 102 is perpendicular to the plane where the microstrip line 107 is located. Both the RF signal input channel 101 and the local oscillator signal input channel 102 can be machined by wire cutting in the cover or box body forming the metal cavity. The SMA connector 201 (or other connectors such as 2.92mm) is a through-wall structure, and the extension direction of its metal needle is parallel to the microstrip line, and can be welded to the intermediate frequency output port 103 of the microstrip line 107 through conductive glue, or a Rogers board can be used to achieve intermediate frequency transition welding.

[0098] It should be noted that, those skilled in the art should understand that in some other embodiments of the present disclosure, the local oscillator signal input channel 102 of the frequency conversion unit can also be introduced parallel to the length direction of the microstrip line 107 and coupled to the microstrip line through a 90° turn, and the RF signal input channel 101 of the frequency conversion unit can be introduced perpendicular to the plane where the microstrip line 107 is located, and the signal output channel can be led out parallel to the plane where the microstrip line 107 is located.

[0099] In an exemplary embodiment of the present disclosure, Fig.21 and Fig. 22 As shown, the RF signal input channel 101 of the frequency conversion unit is introduced in parallel to the length direction of the microstrip line 107, and is coupled to the microstrip line 107 through a 90° turn to reduce the overall arrangement direction size of the single frequency conversion unit. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the RF signal input channel 101 of the frequency conversion unit can also be introduced in other directions, and the turning angle can also be other angles, such as 45°, 60°, etc.

[0100] In an exemplary embodiment, Fig.21 As shown, when there are multiple frequency conversion units, the multiple frequency conversion units are arranged in a row along a direction perpendicular to the length direction of the microstrip line 107.

[0101] In an exemplary embodiment, the RF signal input channel 101 adopts an E-plane probe transition structure, and the local oscillator signal input channel 102 adopts an H-plane probe transition structure; in some other embodiments of the present disclosure, the RF signal input channel 101 adopts an H-plane probe transition structure, and the local oscillator signal input channel 102 adopts an E-plane probe transition structure. In actual use, it is necessary to optimize the design of the probe transition structure to reduce the return loss and optimize the output characteristics of the intermediate frequency signal.

[0102] Figure 21 to Figure 22The working process of the mixer shown includes: the terahertz signal to be received is transmitted to the antenna 104 of the microstrip line 107 through the RF signal input channel 101 in the waveguide-transition-microstrip line structure of the E-plane probe; the local oscillator signal entering from the local oscillator signal input channel 102 is mixed with the RF signal in the gallium arsenide Schottky diode 109 after passing through the microstrip transition structure 107 of the duplexer and the local oscillator low-pass filter 106, and the RF signal is mixed with the second harmonic of the local oscillator, and the intermediate frequency signal after difference is reached through the intermediate frequency filter 108. The intermediate frequency signal output port 103 is then transmitted to the load. In order to avoid the DC bias caused by the inconsistency of the Schottky diode 109 pair, the ground wire 105 connected to the metal cavity is led out from the microstrip line 107, which can be applied to the nearest metal cavity through conductive silver glue, or can be welded to the nearest metal cavity through gold wire binding.

[0103] Fig.23 A schematic diagram showing the distribution of multiple frequency conversion units of a terahertz mixer on a box body according to yet another exemplary embodiment of the present disclosure is shown. Fig.24 A schematic diagram showing the distribution of multiple frequency conversion units of a terahertz mixer on a cover according to yet another exemplary embodiment of the present disclosure is shown.

[0104] In an exemplary embodiment, Fig.23 and Fig.24 As shown, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into two groups, and the two groups of frequency conversion units are respectively arranged in the box body (see Fig.23 ) and cover (see Fig.24 ), and are mirror-symmetrical. Specifically, the microstrip line assembly position I of the frequency conversion unit located in the cover body corresponds to the air cavity position II on the microstrip line of the frequency conversion unit located in the box body; the air cavity position II on the microstrip line of the frequency conversion unit located in the cover body corresponds to the microstrip line assembly position I of the frequency conversion unit located in the box body. In this way, the intermediate frequency signals of the upper and lower adjacent channels are led out in opposite directions, so as to be led out from the box body and the cover body respectively, thereby reserving a large space for SMA connectors or glass insulators or coaxial metal columns. If the maximum outer diameter of the SMA connector or glass insulator or coaxial metal column is a, it is sufficient to ensure that the spacing between channels is not less than a / 2. If you want to further reduce the spacing between channels, you can use a customized small-size connector at the intermediate frequency output end.

[0105] In an exemplary embodiment, Fig.23 and Fig.24 As shown, the signal output channels of each row of frequency conversion units are parallel to each other and the lead-out directions of two adjacent signal output channels are opposite, so as to further reserve a larger space for SMA connectors or glass insulators or coaxial metal columns.

[0106] In an exemplary embodiment, Fig.23 and Fig.24 As shown, the corresponding positions of the box body and the cover body are marked A-A'-B'-B to avoid incorrect fastening.

[0107] It should be noted that, when there are multiple frequency conversion units, the multiple frequency conversion units may form a group, and the frequency conversion units in the group may all be arranged on the box body, or may all be arranged on the cover body.

[0108] In an exemplary embodiment, the local oscillator signal input channels 102 of multiple frequency conversion units can be gathered into one port through a power divider (one to four, one to eight, etc.), and then the signal is input through the local oscillator source to achieve simultaneous operation of the mixer.

[0109] It should be noted that the microstrip line 107 can be a microstrip line structure based on a quartz substrate, a microstrip line structure based on sapphire, a common microstrip line structure, a suspended microstrip line structure, a monolithic integrated microstrip line circuit based on gallium arsenide (GaAs), or a monolithic integrated microstrip line circuit based on indium phosphide (InP). In addition, the material of the metal shell includes but is not limited to alloy metals such as aluminum or brass, and semiconductor materials such as silicon, gallium arsenide, and indium phosphide. The metal cavity defined by the metal shell can be a shielded cavity structure with a metal inner wall processed by a micro-machining (MEMS) process, or a shielded cavity structure with a metal inner wall processed by a micro-coaxial process.

[0110] In addition, in an exemplary embodiment of the present disclosure, the antenna 104 can be integrated with the RF signal input channel 101 and processed together, and the size of the antenna 104 can be optimized according to the channel spacing to ensure the system's requirements for receiver parameters.

[0111] In addition, those skilled in the art should understand that the harmonic type of the mixer is not limited, and can be a single-ended, single-balanced, double-balanced, triple-balanced or I / Q passive mixer. Multiple local oscillator signal input channels of the mixer can be collected into one channel through a power divider (one to four, or one to eight, etc.), and then through the local oscillator source input signal, the mixer can work simultaneously.

[0112] The terahertz mixer avoids the problem of poor integration caused by the existence of the RF signal input channel, the local oscillator signal input channel and the signal output channel in the same plane by making at least two of the planes where the RF signal input channel is located, the plane where the local oscillator signal input channel is located and the plane where the signal output channel is located non-coplanar, and reduces the complexity and processing cost of multi-channel integration while ensuring the basic high-frequency characteristics of the mixer, thereby improving the flexibility of the mixer integration method and providing favorable conditions for further system integration. In addition, although the above embodiments are all described by taking the mixer as an example, those skilled in the art should understand that in some other embodiments of the present disclosure, the device can also be applied to the frequency multiplier.

[0113] Those skilled in the art can understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing conflicts in structure or principle.

[0114] After describing the preferred embodiments of the present disclosure in detail, those skilled in the art can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the appended claims, and the present disclosure is not limited to the implementation methods of the exemplary embodiments listed in the specification.

Claims

1. A device for mixing or multiplying frequencies, comprising: A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity; At least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel passing through the metal shell and respectively coupled to the microstrip line, at least two of the plane where the radio frequency signal input channel is located, the plane where the local oscillator signal input channel is located and the plane where the signal output channel is located are not coplanar, Wherein, the signal output channel is led out perpendicularly to the plane where the microstrip line is located. Each of the radio frequency signal input channel and the local oscillator signal input channel is located in a plane parallel to the plane where the microstrip line is located, and extends in a direction parallel to the length direction of the microstrip line. Wherein, each of the radio frequency signal input channel and the local oscillator signal input channel is coupled to the microstrip line through a turn.

2. The device according to claim 1, wherein: When there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along the length direction of the microstrip line.

3. The device according to claim 1, wherein: When the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively arranged in the box body and the cover body, and are arranged in a mirror-symmetrical manner.

4. The device according to claim 3, wherein: The radio frequency signal input channels of each row of the frequency conversion units are parallel to each other and the ports are aligned, and the local oscillator signal input channels of each row of the frequency conversion units are parallel to each other and the ports are aligned.

5. The device according to claim 4, wherein: The signal output channels of the frequency conversion units in each row are parallel to each other, and the lead-out directions of two adjacent signal output channels in the frequency conversion units in each row are opposite.

6. The device according to claim 1, wherein: The introduction directions of the radio frequency signal input channel and the local oscillator signal input channel are opposite.

7. The device according to claim 6, wherein: When there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along a direction perpendicular to the length direction of the microstrip line.

8. The device according to claim 7, wherein: When the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively arranged in the box body and the cover body, and are arranged in a mirror-symmetrical manner.

9. The device according to claim 8, wherein: The radio frequency signal input channels of each row of the frequency conversion units are parallel to each other and the ports are aligned, and the local oscillator signal input channels of each row of the frequency conversion units are parallel to each other and the ports are aligned.

10. The device according to claim 1, wherein: When there are multiple channel structures, the local oscillator signal input channels of the multiple channel structures are collected into one port through a power divider.

11. A device for mixing or multiplying frequencies, comprising: A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity; At least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel passing through the metal shell and respectively coupled to the microstrip line, at least two of the plane where the radio frequency signal input channel is located, the plane where the local oscillator signal input channel is located and the plane where the signal output channel is located are not coplanar, Wherein, the signal output channel is led out parallel to the plane where the microstrip line is located. Among them, one of the RF signal input channel and the local oscillator input channel is introduced parallel to the plane where the microstrip line is located, and is coupled to the microstrip line through a turn, and the other of the RF signal input channel and the local oscillator input channel is introduced perpendicular to the plane where the microstrip line is located.

12. The device according to claim 11, wherein The introduction direction of the radio frequency signal input channel and the lead-out direction of the signal output channel are the same.

13. The device according to claim 12, wherein: When there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along a direction perpendicular to the length direction of the microstrip line.

14. The device according to claim 10, wherein: When the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively arranged in the box body and the cover body, and are arranged in a mirror-symmetrical manner.

15. The device according to claim 11, wherein When there are multiple channel structures, the local oscillator signal input channels of the multiple channel structures are collected into one port through a power divider.

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