Resin composition, cured film, and black matrix

Abstract

The present invention provides a resin composition, a hardened film and a black matrix. The resin composition includes an epoxy resin (A), a black colorant (B), a photoinitiator (C), a thermal acid generator (D), a polymerizable monomer (E) and a solvent (F). The thermal acid generator (D) includes a hexafluoro onium salt. The polymerizable monomer (E) includes a photopolymerizable monomer (E-1), an epoxy resin monomer (E-2) or a combination thereof. Based on the total amount of the polymerizable monomer (E) being 100 parts by weight, the amount of the epoxy resin monomer (E-2) is 15 to 70 parts by weight.

Description

Technical Field

[0001] The present invention relates to a resin composition, and in particular to a resin composition suitable for a black matrix, a hardened film and a black matrix. Background Art

[0002] With the rapid development of liquid crystal display device technology, in order to improve the contrast and display quality of liquid crystal display devices, a black matrix is ​​usually placed in the liquid crystal display device to prevent problems such as reduced contrast and reduced color purity caused by light leakage between pixels, or to prevent problems such as noise and poor image quality. However, the black matrix currently used has problems such as insufficient hardness, poor developability, poor patterning or poor light shielding. For example, the current black matrix may cause damage such as scratches on its surface or may cause light leakage between pixels, thereby affecting the performance of the device using the black matrix. Summary of the invention

[0003] In view of this, the present invention provides a resin composition, a cured film and a black matrix that can form a film having good light-shielding properties, hardness, resolution and reactivity.

[0004] A resin composition of the present invention comprises an epoxy resin (A), a black colorant (B), a photoinitiator (C), a thermal acid generator (D), a polymerizable monomer (E) and a solvent (F). The thermal acid generator (D) comprises a hexafluoro onium salt. The polymerizable monomer (E) comprises a photopolymerizable monomer (E-1), an epoxy resin monomer (E-2) or a combination thereof. Based on the total amount of the polymerizable monomer (E) being 100 parts by weight, the amount of the epoxy resin monomer (E-2) is 15 to 70 parts by weight.

[0005] In one embodiment of the present invention, the structural unit contained in the epoxy resin (A) includes a structural unit containing an epoxy group, and the structural unit containing an epoxy group has a double bond.

[0006] In one embodiment of the present invention, the epoxy-containing structural unit comprises a structural unit represented by the following formula (a-1):

[0007] *Indicates the bonding position.

[0008] In one embodiment of the present invention, the structural units contained in the epoxy resin (A) further include structural units having ethylenically unsaturated groups and structural units having aromatic groups.

[0009] In one embodiment of the present invention, the structural unit having an ethylenically unsaturated group comprises at least one of the structural units represented by the following formula (a-2) and formula (a-3):

[0010]

[0011] *Indicates the bonding position.

[0012] In one embodiment of the present invention, the above-mentioned structural unit having an aromatic group includes at least one of the structural units represented by the following formula (a-4), formula (a-5) and formula (a-6):

[0013]

[0014] *Indicates the bonding position.

[0015] In one embodiment of the present invention, the photoinitiator (C) includes at least one selected from the group consisting of oxime ester derivatives, halogenated hydrocarbon derivatives and alkyl acetophenones.

[0016] In one embodiment of the present invention, the photopolymerizable monomer (E-1) has an ethylenically unsaturated group.

[0017] In one embodiment of the present invention, the polymerizable monomer (E) further includes a silane monomer (E-3) having an epoxy group.

[0018] In one embodiment of the present invention, the solvent (F) includes at least one selected from the group consisting of propylene glycol monomethyl ether acetate, ethyl 3-ethoxypropionate, and dipropylene glycol methyl ether acetate.

[0019] In one embodiment of the present invention, based on 100 parts by weight of the epoxy resin (A), the amount of the thermal acid generator (D) is 80 parts by weight to 100 parts by weight.

[0020] In one embodiment of the present invention, based on the usage of epoxy resin (A) being 100 parts by weight, the usage of black colorant (B) is 230 parts by weight to 250 parts by weight, the usage of photoinitiator (C) is 80 parts by weight to 100 parts by weight, the usage of polymerizable monomer (E) is 305 parts by weight to 325 parts by weight, and the usage of solvent (F) is 1945 parts by weight to 1965 parts by weight.

[0021] A cured film of the present invention is formed from the above-mentioned resin composition.

[0022] A black matrix of the present invention is the above-mentioned hardened film.

[0023] Based on the above, the resin composition of the present invention uses a specific thermal acid generator (D) and an epoxy resin monomer (E-2), and the total amount of the polymerizable monomer (E) used is 100 parts by weight, and the amount of the epoxy resin monomer (E-2) used is 15 to 70 parts by weight. Thus, when the resin composition is used to form a hardened film, the hardened film can have good light-shielding properties, hardness, resolution and reactivity, and is suitable for a black matrix.

[0024] In order to make the above features and advantages of the present invention more obvious and easy to understand, embodiments are specifically described in detail below. DETAILED DESCRIPTION

[0025] <Resin composition>

[0026] The present invention provides a resin composition, comprising an epoxy resin (A), a black colorant (B), a photoinitiator (C), a thermal acid generator (D), a polymerizable monomer (E) and a solvent (F). In addition, the resin composition of the present invention may further include additives (G) such as a leveling agent as needed. The above-mentioned various components will be described in detail below.

[0027] It should be noted that, hereinafter, (meth)acrylic acid refers to acrylic acid and / or methacrylic acid, and (meth)acrylate refers to acrylate and / or methacrylate.

[0028] Epoxy resin (A)

[0029] The structural unit contained in the epoxy resin (A) includes an epoxy group-containing structural unit, and the epoxy group-containing structural unit has a double bond.

[0030] For example, the epoxy group-containing structural unit may be derived from a monomer of glycidyl (meth)acrylate, 3,4-epoxycyclohexane (meth)acrylate, 3,4-epoxycyclohexanemethyl (meth)acrylate, or other suitable compounds. The epoxy group-containing structural unit is preferably derived from glycidyl (meth)acrylate, and the epoxy group-containing structural unit generated therefrom may include a structural unit represented by the following formula (a-1).

[0031]

[0032] In formula (a-1), * represents a bonding position.

[0033] The structural units contained in the epoxy resin (A) may further include a structural unit having an ethylenically unsaturated group and a structural unit having an aromatic group.

[0034] For example, the structural unit having an ethylenically unsaturated group may be derived from a monomer of (meth)acrylic acid, methyl (meth)acrylate, n-alkyl (meth)acrylate or other suitable compounds. The structural unit having an ethylenically unsaturated group is preferably derived from at least one of (meth)acrylic acid and methyl (meth)acrylate, and the structural unit having an ethylenically unsaturated group produced therefrom may include at least one of the structural units represented by the following formula (a-2) and formula (a-3).

[0035]

[0036] In formula (a-2) and formula (a-3), * represents a bonding position.

[0037] For example, the structural unit having an aromatic group may be derived from a monomer of benzyl (meth)acrylate, styrene, N-phenylmaleimide or other suitable compounds. The structural unit having an aromatic group is preferably derived from at least one of benzyl methacrylate, styrene and N-phenylmaleimide, and the structural unit having an aromatic group produced therefrom may include at least one of the structural units represented by the following formula (a-4), formula (a-5) and formula (a-6).

[0038]

[0039] In formula (a-4), formula (a-5) and formula (a-6), * represents a bonding position.

[0040] In addition, without affecting the efficacy of the present invention, the structural units contained in the epoxy resin (A) may further include other structural units. There is no particular limitation on the other structural units, as long as they are different from the structural units containing epoxy groups, the structural units having ethylenically unsaturated groups, and the structural units having aromatic groups.

[0041] For example, the epoxy resin (A) may be one epoxy resin or a combination of multiple epoxy resins. For example, the epoxy resin (A) may be the following epoxy resin (A-1), the following epoxy resin (A-2) or a combination thereof.

[0042] The structural units contained in the epoxy resin (A-1) are the structural units represented by the formula (a-1), the structural units represented by the formula (a-2), the structural units represented by the formula (a-4), and the structural units represented by the formula (a-5). In addition, the structural units contained in the epoxy resin (A-2) are the structural units represented by the formula (a-1), the structural units represented by the formula (a-2), the structural units represented by the formula (a-3), the structural units represented by the formula (a-5), and the structural units represented by the formula (a-6).

[0043] The weight average molecular weight of the epoxy resin (A) can be measured by Gel Permeation Chromatography (GPC). The weight average molecular weight of the epoxy resin (A) can be 5,000 to 25,000, preferably 7,000 to 23,000, and more preferably 10,000 to 20,000.

[0044] Black colorant (B)

[0045] There is no particular limitation on the black colorant (B), and an appropriate black colorant can be selected according to the requirements. For example, the black colorant (B) can be composed of one or more organic black pigments, inorganic black pigments or a combination thereof through grinding and dispersion. The organic black pigment may include lactam organic black, RGB black, RVB black, etc. The inorganic black pigment may include aniline black, perylene black, titanium black, cyanine black, lignin black, carbon black or a combination thereof. RGB black, RVB black, etc. represent pigments that are black by mixing at least two color pigments of red pigment, green pigment, blue pigment, violet pigment, yellow pigment, purple pigment, etc. The black colorant (B) preferably includes carbon black.

[0046] Based on 100 parts by weight of the epoxy resin (A), the amount of the black colorant (B) is 200 to 300 parts by weight, preferably 210 to 290 parts by weight, and more preferably 220 to 280 parts by weight.

[0047] When the resin composition contains a black colorant (B), the cured film formed by the resin composition can have light-shielding properties and is suitable for a black matrix. At the same time, when the amount of the black colorant (B) used falls within the above range, the cured film formed by the resin composition can have good light-shielding properties (for example, an optical density (OD) greater than 2.5).

[0048] Photoinitiator (C)

[0049] The photoinitiator (C) includes at least one selected from the group consisting of oxime ester derivatives, halogenated hydrocarbon derivatives and alkyl acetophenones, and preferably includes oxime ester derivatives.

[0050] The oxime ester derivative may include a compound represented by the following formula (c-1), a compound represented by the formula (c-2), 1-[9-ethyl-6-[2-methyl-4-[(tetrahydro-2-furanyl)methoxy]benzoyl]-9H-carbazole-3-yl]-1-(O-acetoximo)ethanone or other suitable oxime ester derivatives. The oxime ester derivative preferably includes a compound represented by the following formula (c-2). The oxime ester derivative may be used alone or in combination.

[0051]

[0052] The halogenated hydrocarbon derivative may include methyl chloride, vinyl chloride, chlorobenzene or other suitable halogenated hydrocarbon derivatives. The halogenated hydrocarbon derivatives may be used alone or in combination of multiple types.

[0053] The alkyl acetophenone may include p-alkyl acetophenone, o-alkyl acetophenone or other suitable alkyl acetophenones. The alkyl acetophenones may be used alone or in combination.

[0054] Based on 100 parts by weight of the epoxy resin (A), the amount of the photoinitiator (C) is 20 to 140 parts by weight, preferably 40 to 120 parts by weight, and more preferably 60 to 100 parts by weight.

[0055] When the resin composition includes a photoinitiator (C), the resin composition can have good patterning ability. At the same time, when the amount of the photoinitiator (C) used falls within the above range, a resin composition with better patterning ability can be obtained. In addition, if the resin composition does not include the photoinitiator (C), the resin composition cannot form a hardened film.

[0056] Thermal acid generator (D)

[0057] The thermal acid generator (D) includes hexafluoroonium salt or other suitable thermal acid generators, preferably includes hexafluoroonium salt.

[0058] The hexafluoro onium salt may include a compound represented by the following formula (d-1), a triarylsulfonium hexafluoroantimonium salt, 4,4'-diphenyliodonium hexafluorophosphate, bis(4-tert-butylbenzene)iodonium hexafluorophosphate, 4-isobutylphenyl-4'-methylphenyliodonium hexafluorophosphate, a diaryliodonium hexafluorophosphate (e.g., diphenyliodonium hexafluorophosphate), 4-isopropyl-4'-methyldiphenyliodonium tetrakis(pentafluorophenyl)borate, 4,4'-diphenyliodonium hexafluorophosphate, (thio-di-4,1-phenylene)dibiphenylsulfonium hexafluorophosphate, hexafluorophosphate (1-)diphenyl[(phenylthio)phenyl]sulfonium, diphenyl[4-(phenylthio)phenyl]-sulfonium hexafluoroantimonate, or other suitable hexafluoro onium salts. The hexafluoro onium salt preferably includes a compound represented by the following formula (d-1). The hexafluoroonium salts may be used alone or in combination of two or more.

[0059]

[0060] When the resin composition includes the thermal acid generator (D), the thermal acid generator (D) can function as, for example, a crosslinking accelerator, and a resin composition having good hardness and a hardened film formed therefrom having good hardness, resolution, and reactivity can be obtained.

[0061] Based on 100 parts by weight of the epoxy resin (A), the amount of the thermal acid generator (D) is 20 to 140 parts by weight, preferably 40 to 120 parts by weight, and more preferably 60 to 100 parts by weight.

[0062] Polymerizable monomer (E)

[0063] The polymerizable monomer (E) includes a photopolymerizable monomer (E-1), an epoxy resin monomer (E-2), or a combination thereof.

[0064] For example, the photopolymerizable monomer (E-1) may have an ethylenically unsaturated group. The photopolymerizable monomer (E-1) having an ethylenically unsaturated group may include a multifunctional monomer having at least one ethylenically unsaturated group, for example, an ester formed by an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, an ester formed by an aromatic polyhydroxy compound and an unsaturated carboxylic acid, or an ester formed by an esterification reaction of a polyhydroxy compound (e.g., an aliphatic polyhydroxy compound, an aromatic polyhydroxy compound, etc.) with an unsaturated carboxylic acid and a polybasic carboxylic acid. However, the present invention is not limited thereto, and the photopolymerizable monomer (E-1) may also include other suitable monomers.

[0065] The ester formed by the aliphatic polyhydroxy compound and the unsaturated carboxylic acid may include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, glycerol acrylate or other aliphatic polyhydroxy compound acrylates, preferably dipentaerythritol pentaacrylate or dipentaerythritol hexaacrylate. The ester formed by the aromatic polyhydroxy compound and the unsaturated carboxylic acid may include hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethacrylate, pyrogallol triacrylate or other aromatic polyhydroxy compound (meth) acrylates. The photopolymerizable monomer (E-1) may be used alone or in combination of multiple monomers.

[0066] Based on 100 parts by weight of the total amount of the polymerizable monomer (E), the amount of the photopolymerizable monomer (E-1) is 20 to 100 parts by weight, preferably 30 to 90 parts by weight, and more preferably 40 to 80 parts by weight.

[0067] The epoxy resin monomer (E-2) may include chloromethyl oxirane, glycidyl-terminated bisphenol A epichlorohydrin, 4,4-(1-methylethylindenyl) dicycloethyl diglyceryl ether, 1,1-bis(2,3-epoxypropoxy)phenylethane, 2,2-bis[4-(2-hydroxy-3-methacryloyl)phenyl]propane, 4,6-bis(1-adamantane)-1,3-epoxypropaneoxybenzene, 4-epoxypropaneoxycarbazole, 3-[(p-acetamido)phenoxy]-1,2-epoxypropane, bisphenol A diglycidyl ether, 1-(4-benzyloxyphenoxy)-2,3-epoxypropane or other epoxy resin monomers, preferably including bisphenol A diglycidyl ether. The epoxy equivalent of the epoxy resin monomer (E-2) is 100 g / eq to 300 g / eq, preferably 120 g / eq to 280 g / eq, and more preferably 140 g / eq to 260 g / eq. The epoxy resin monomer (E-2) may be used alone or in combination of multiple monomers.

[0068] Based on 100 parts by weight of the total amount of the polymerizable monomer (E), the amount of the epoxy resin monomer (E-2) is 15 to 70 parts by weight, preferably 20 to 65 parts by weight, and more preferably 25 to 60 parts by weight.

[0069] When the resin composition includes the epoxy resin monomer (E-2) and the usage amount thereof falls within the above range, the epoxy resin monomer (E-2) can make the resin composition have good hardness and can form a hardened film having good hardness, resolution and reactivity.

[0070] In this embodiment, the polymerizable monomer (E) may further include a silane monomer (E-3) having an epoxy group. The epoxy resin monomer (E-2) is a monomer other than the silane monomer (E-3) having an epoxy group. In addition, in other embodiments, the polymerizable monomer (E) may also include other suitable monomers.

[0071] The silane monomer (E-3) having an epoxy group may include glycidyl trimethoxysilane, 3-glycidyloxypropyl trimethoxysilane, 3-glycidyloxypropyl triethoxysilane, 3-glycidyloxypropyl dimethylmethoxysilane, 1-(3-glycidyl propyl)-1,1,3,3,3-pentaethoxy-1,3-disilpropane, 3-glycidyl propyl heptamethylcyclotetrasiloxane, (3-glycidyloxypropyl)methyl-dimethylcopolysiloxane, monoglycidyl ether end-capped polydimethylsiloxane, tert-butyl dimethylsilyl glycidyl ether, mono(2,3-epoxy)propyl ether end-capped polydimethylsiloxane or other suitable monomers, preferably including glycidyl trimethoxysilane. The silane monomer (E-3) having an epoxy group may be used alone or in combination of multiple monomers.

[0072] Based on 100 parts by weight of the epoxy resin (A), the amount of the polymerizable monomer (E) is 200 to 400 parts by weight, preferably 220 to 380 parts by weight, and more preferably 240 to 360 parts by weight.

[0073] Solvent (F)

[0074] The solvent (F) is not particularly limited, and an appropriate solvent can be selected according to the requirements. The solvent (F) preferably includes at least one selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA), ethyl 3-ethoxypropionate (EEP) and dipropylene glycol methyl ether acetate (DPMA), and more preferably includes propylene glycol monomethyl ether acetate. The solvent (F) can be used alone or in combination.

[0075] Based on 100 parts by weight of the epoxy resin (A), the amount of the solvent (F) is 1500 to 2500 parts by weight, preferably 1600 to 2400 parts by weight, and more preferably 1700 to 2300 parts by weight.

[0076] Additives (G)

[0077] The resin composition may further include an additive (G). In the present embodiment, the additive (G) may include a leveling agent. There is no particular limitation on the leveling agent, and an appropriate leveling agent may be selected according to the requirements. For example, the leveling agent may include an alkoxysilane compound or other suitable leveling agent. The alkoxysilane compound may include 3-glycidyloxypropyltrimethoxysilane ((3-glycidyloxypropyl)trimethoxysilane), 1,1,3,3-tetramethyldisiloxane, dimethylpolysiloxane, dimethylaminomethylpropylsiloxane, polyether-modified polysiloxane, polydimethylsiloxane, hexamethylcyclotrisiloxane, hexaethyldisiloxane, propynyloxytrimethylsilane or hexamethyldisiloxane. The leveling agent may be used alone or in combination. The additive (G) may be used alone or in combination.

[0078] Based on 100 parts by weight of the epoxy resin (A), the additive (G) is used in an amount of 0.1 to 3 parts by weight, preferably 0.3 to 2.7 parts by weight, and more preferably 0.5 to 2.5 parts by weight.

[0079] <Method for preparing resin composition>

[0080] The preparation method of the resin composition is not particularly limited. For example, epoxy resin (A), black colorant (B), photoinitiator (C), thermal acid generator (D), polymerizable monomer (E) and solvent (F) are placed in a stirrer and stirred to uniformly mix into a solution state. If necessary, an additive (G) may also be added. After uniform mixing, a liquid resin composition can be obtained.

[0081] <Method for producing cured film>

[0082] An exemplary embodiment of the present invention provides a cured film formed using the resin composition.

[0083] The hardened film can be formed by coating the above resin composition on a substrate to form a coating film, and pre-baking, exposing, developing, and post-baking the coating film. For example, after the resin composition is coated on a substrate to form a coating film, a pre-exposure baking step (i.e., pre-baking) step is performed at a temperature of 90° C. for 2 minutes. Then, the coating film is exposed to light at 250 mJ / cm 2 The pre-baked coating film was exposed to light. Then, the exposed coating film was subjected to a development step for 60 seconds. Next, post-baking was performed at 220° C. for 20 minutes to form a cured film on the substrate.

[0084] The substrate may be a glass substrate, a silicon wafer substrate, or a plastic substrate material such as a polyethersulfone (PES) board or a polycarbonate (PC) board, and the type thereof is not particularly limited.

[0085] The coating method is not particularly limited, but spray coating, roll coating, spin coating or the like may be used, and generally, spin coating is widely used. In addition, a coating film is formed, and then in some cases, the residual solvent may be partially removed under reduced pressure.

[0086] <Method for Manufacturing Black Matrix>

[0087] An exemplary embodiment of the present invention provides a black matrix, which is the above-mentioned hardened film.

[0088] The method for manufacturing the black matrix may be the same as the method for manufacturing the above-mentioned cured film, and will not be further described herein.

[0089] Hereinafter, the present invention will be described in detail with reference to examples. The following examples are provided for describing the present invention, and the scope of the present invention includes the scope described in the claims and its substitutes and modifications, and is not limited to the scope of the examples.

[0090] Examples of resin composition and cured film

[0091] Examples 1 to 5 and Comparative Examples 1 to 3 of the resin composition and the cured film are described below:

[0092] Example 1

[0093] a. Resin composition

[0094] 80 parts by weight of epoxy resin (A-1) (purchased from Miwon Specialty Chemical Co., Ltd., wherein the structural units thereof are the structural units represented by formula (a-1), the structural units represented by formula (a-2), the structural units represented by formula (a-4), and the structural units represented by formula (a-5)), 20 parts by weight of epoxy resin (A-2) (purchased from Daito Resin Chemical Co., Ltd., wherein the structural units thereof are the structural units represented by formula (a-1), the structural units represented by formula (a-2), the structural units represented by formula (a-3), the structural units represented by formula (a-5), and the structural units represented by formula (a-6) The resin composition of Example 1 is prepared by adding 241 parts by weight of carbon black, 91 parts by weight of the compound represented by formula (c-2), 91 parts by weight of the compound represented by formula (d-1), 151 parts by weight of dipentaerythritol hexaacrylate, 109 parts by weight of bisphenol A diglycidyl ether, 53 parts by weight of glycidyl trimethoxy silane and 1 part by weight of 3-glycidyloxypropyl trimethoxy silane to 1955 parts by weight of propylene glycol monomethyl ether acetate and stirring evenly with a stirrer.

[0095] b. Hardening film

[0096] The resin compositions prepared in the examples were coated on the substrate by spin coating (spin coater model MS-A150, manufactured by Mikasa Co., Ltd., with a rotation speed of 300 rpm). Then, a pre-exposure baking step (i.e., pre-baking) was performed at 90° C. for 2 minutes. Then, a 250 mJ / cm 2 The semi-finished product was exposed to light (exposure machine model UX-1000SM, manufactured by Ushio, Inc.) to form a semi-finished product. Next, the exposed coating film was developed for 60 seconds. Then, post-baking was performed at 220°C for 20 minutes to obtain a hardened film. The hardened film obtained was evaluated in the following evaluation methods, and the results are shown in Table 1.

[0097] Examples 2 to 5 and Comparative Examples 1 to 3

[0098] The resin compositions of Examples 2 to 5 and Comparative Examples 1 to 3 were prepared in the same steps as Example 1, except that the types of components and the amounts used in the resin compositions were changed (as shown in Table 1). The prepared resin compositions were made into hardened films and evaluated in the following evaluation methods, and the results are shown in Table 1.

[0099] [Table 1]

[0100]

[0101] In Table 1, the sulfonium salt is a compound represented by the following formula (d-2).

[0102]

[0103] <Evaluation method>

[0104] a. Pencil hardness

[0105] The pencil hardness of the 1.5 μm hardened films prepared in the examples and comparative examples was measured according to ASTM D3363.

[0106] b. Resolution

[0107] The prepared cured film (thickness: 1.5 μm) was observed under an electron microscope (model: MX-50) at a magnification of 500 times to observe whether the line width patterns of different sizes were neat and whether the patterns were peeled off from the substrate to evaluate the resolution.

[0108] The evaluation criteria for resolution are as follows:

[0109] ◎: Line width ≤ 10 μm and not peeled off from the substrate;

[0110] ○: Line width ≤ 10 μm, and peeled off from the substrate;

[0111] △: 10μm<line width ≤ 20μm, and peeled off from the substrate;

[0112] ╳: 20 μm<line width ≤ 50 μm, and peeled off from the substrate.

[0113] c. Reactivity

[0114] In the process of preparing the resin composition into a hardened film, the film thickness after exposure, development, and post-baking was measured using a Dektak8 film thickness meter from Veeco Instruments, Inc., and the residual value was calculated according to the following formula:

[0115]

[0116] The evaluation criteria for responsiveness are as follows:

[0117] ◎: 90% ≦ residual value < 100%;

[0118] ○: 80% ≦ residual value < 90%;

[0119] △: 70% ≦ residual value < 80%;

[0120] ╳: 70%≦residual value.

[0121] d. Light blocking

[0122] The light shielding value of the prepared hardened film (thickness: 1.5 μm) was measured by a transmission densitometer (model: X-rite 341C).

[0123] The evaluation criteria for light blocking properties are as follows:

[0124] ◎: 2.5<optical density;

[0125] ○: 2.0<optical density ≦2.5;

[0126] △: 1.5<optical density ≦2.0;

[0127] ╳: 1.0<optical density≦1.5.

[0128] <Evaluation Results>

[0129] As can be seen from Table 1, the resin composition includes a thermal acid generator (D) and an epoxy resin monomer (E-2), and based on the total amount of the polymerizable monomer (E) used being 100 parts by weight, the cured films formed in Examples 1-5 in which the amount of the epoxy resin monomer (E-2) used is 15 parts by weight to 70 parts by weight have good hardness (pencil hardness of 4H or more), resolution and developability. In contrast, the hardened film formed in Comparative Example 1 in which the resin composition does not include the epoxy resin monomer (E-2) has poor hardness, resolution and developability. In addition, the cured films formed in Comparative Examples 2 and 3 in which the resin composition does not include the thermal acid generator (D) have poor resolution or developability.

[0130] In addition, the line width pattern of the cured film (Example 3) prepared by the resin composition including the thermal acid generator (D) is less than 10 μm and does not peel off from the substrate, the residual value is less than 10%, and the pencil hardness is 6H. In comparison, the line width pattern of the cured film (Comparative Example 3) prepared by the resin composition in which the thermal acid generator (D) is replaced by a photoacid generator is peeled off from the substrate, the residual value is between 20% and 30%, and the pencil hardness is 4H. It can be seen that the cured film prepared by the resin composition including the thermal acid generator (D) has good hardness, resolution and developability, while the hardened film prepared by the resin composition in which the thermal acid generator (D) is replaced by a photoacid generator has poor hardness, resolution and developability.

[0131] In addition, the resin composition includes a thermal acid generator (D) and is based on an epoxy resin (A) in an amount of 100 parts by weight, and the amount of the photoinitiator (C) is 80 to 100 parts by weight. The width of the line width pattern of the hardened film (Example 1) prepared by the resin composition is 10 μm or less and is not peeled off from the substrate, the residual value is less than 10%, and the pencil hardness is 6H. In contrast, the line width pattern of the hardened film (Comparative Example 2) prepared without including the thermal acid generator (D) and the amount of the photoinitiator (C) not being within the aforementioned range is 20 μm to 50 μm and peeled off from the substrate, and the pencil hardness is 4H. It can be seen from this that the resin composition includes a thermal acid generator (D) and the amount of the photoinitiator (C) falls within the aforementioned range. The hardened film prepared has good hardness, resolution and developability, while the hardened film prepared by the resin composition that does not include the thermal acid generator (D) and the amount of the photoinitiator (C) is not within the aforementioned range has poor hardness and resolution. It can be seen that when the usage amount of epoxy resin (A) is 100 parts by weight and the usage amount of photoinitiator (C) is 80 parts by weight to 100 parts by weight, the resin composition can have better patterning ability, thereby making the formed hardened film have better resolution.

[0132] In summary, the resin composition of the present invention contains a thermal acid generator (D) and an epoxy resin monomer (E-2), and when the total amount of the polymerizable monomer (E) used is 100 parts by weight and the amount of the epoxy resin monomer (E-2) used is 15 parts by weight to 70 parts by weight, the resin composition has good hardness and light-shielding properties, and the cured film formed therefrom has good light-shielding properties, hardness, resolution and developability, and can be applied to a black matrix, thereby improving the performance of a device using a black matrix.

[0133] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. A resin composition comprising: Epoxy resin; Black colorant; Photoinitiator; a thermal acid generator, the thermal acid generator comprising a hexafluoroonium salt; polymerizable monomers; as well as Solvents, The polymerizable monomers include photopolymerizable monomers, epoxy resin monomers or a combination thereof, and the epoxy resin monomers are used in an amount of 15 to 70 parts by weight based on 100 parts by weight of the total amount of the polymerizable monomers used. Based on 100 parts by weight of the epoxy resin, 200 to 300 parts by weight of the black colorant, and 200 to 400 parts by weight of the polymerizable monomer. 2 . The resin composition according to claim 1 , wherein the structural unit contained in the epoxy resin includes an epoxy group-containing structural unit, and the epoxy group-containing structural unit has a double bond.

3. The resin composition according to claim 2, wherein the epoxy-containing structural unit comprises a structural unit represented by the following formula (a-1): *Indicates the bonding position. 4 . The resin composition according to claim 2 , wherein the structural units contained in the epoxy resin further include structural units having ethylenically unsaturated groups and structural units having aromatic groups.

5. The resin composition according to claim 4, wherein the structural unit having an ethylenically unsaturated group comprises at least one of the structural units represented by the following formula (a-2) and formula (a-3): *Indicates the bonding position.

6. The resin composition according to claim 4, wherein the structural unit having an aromatic group comprises at least one of the structural units represented by the following formula (a-4), formula (a-5) and formula (a-6): *Indicates the bonding position. 7 . The resin composition according to claim 1 , wherein the photoinitiator comprises at least one selected from the group consisting of oxime ester derivatives, halogenated hydrocarbon derivatives, and alkyl acetophenones. The resin composition according to claim 1 , wherein the photopolymerizable monomer has an ethylenically unsaturated group. 9 . The resin composition according to claim 1 , wherein the polymerizable monomer further comprises a silane monomer having an epoxy group. 10 . The resin composition according to claim 1 , wherein the solvent comprises at least one selected from the group consisting of propylene glycol monomethyl ether acetate, ethyl 3-ethoxypropionate, and dipropylene glycol methyl ether acetate. 11 . The resin composition according to claim 1 , wherein the thermal acid generator is used in an amount of 20 to 140 parts by weight based on 100 parts by weight of the epoxy resin. 12 . The resin composition according to claim 1 , wherein based on 100 parts by weight of the epoxy resin, the photoinitiator is used in an amount of 20 to 140 parts by weight, and the solvent is used in an amount of 1500 to 2500 parts by weight. 13 . A cured film formed from the resin composition according to claim 1 . A black matrix, which is the hardened film according to claim 13.

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