A camera module and an electronic device

Abstract

The present invention relates to the field of imaging technologies, and discloses a camera module and an electronic device. In the camera module, a lens is disposed opposite to a hollowed-out portion; the movable circuit assembly includes a movable circuit board, and the movable circuit board includes a first surface; the image sensor includes an imaging surface, and the imaging surface has an imaging area; both the imaging surface and the first surface face the lens, and the plane where the imaging surface is located is on the side of the reference surface away from the lens, so as to make full use of the space in the optical axis direction of the camera module on the premise of keeping the imaging surface from the lens unchanged, and reduce the size of the camera module in the optical axis direction, where the reference surface is the plane where the first surface is located; the orthographic projection of the imaging area on the reference surface is within the area range corresponding to the hollowed-out portion surrounded by the orthographic projection of the movable circuit assembly on the reference surface, ensuring that the light entering the lens can smoothly irradiate the imaging surface for imaging.

Description

Technical Field

[0001] The present invention relates to the field of imaging technology, and in particular to a camera module and electronic equipment. Background Art

[0002] With the rapid development of mobile terminals such as smart phones, users have higher and higher requirements for their imaging quality. In order to achieve an anti-shake effect, it is necessary to set up a flexible connector with two parts: an active circuit board and a fixed circuit board. The active circuit board carries an image sensor so that the active circuit board can carry the fixed circuit board and move horizontally (perpendicular to the optical axis). However, in the existing camera module, the image sensor rests on the active circuit board. When the distance from the image sensor to the camera module lens is constant, the size of the camera module in the optical axis direction is large, which is not conducive to miniaturization. Summary of the invention

[0003] The invention discloses a camera module and electronic equipment, which are used for improving image distance.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] In a first aspect, a camera module is provided, which includes: a lens, a movable circuit assembly, a fixed circuit assembly, a driving assembly and an image sensor, wherein the image sensor is fixed to the movable circuit assembly, and the movable circuit assembly includes a hollow portion and a holder; the lens is arranged opposite to the hollow portion; the movable circuit assembly includes a movable circuit board, and the movable circuit board includes a first surface; the image sensor includes an imaging surface, and the imaging surface has an imaging area; the imaging surface and the first surface are both facing the lens, and the plane where the imaging surface is located is located on the side of the reference surface away from the lens, so as to keep the imaging surface from the lens to the sensor unchanged. The space in the optical axis direction of the camera module is fully utilized to reduce the size of the camera module in the optical axis direction, wherein the reference plane is the plane where the first surface is located; the orthographic projection of the imaging area on the reference plane is located within the area corresponding to the hollow portion and enclosed by the orthographic projection of the active circuit component on the reference plane, so as to prevent the active circuit component from blocking the imaging surface and ensure that the light entering the lens can be smoothly irradiated to the imaging surface for imaging; in the optical axis direction of the lens, the image sensor is fixedly connected to the active circuit board by the holder to fix the image sensor to the active circuit board, and the image sensor is electrically connected to the active circuit board.

[0006] Optionally, the hollowed-out portion includes a first hollowed-out structure disposed in the area of the movable circuit board opposite to the lens. The form of the holding object can be various as long as it can hold the image sensor and the movable circuit component. Specifically, it can include at least one of an adhesive and a package. The adhesive can be used to fix the movable image sensor with its viscosity, or the image sensor can be bonded when the package encapsulates the components or circuits of the movable circuit board.

[0007] Optionally, the holding object is only an adhesive, and the image sensor is at least partially fixed in the first hollowed-out structure in the optical axis direction of the lens by the adhesive. The adhesive is located between the outer peripheral wall of the image sensor and the inner peripheral wall of the movable circuit board that encloses the first hollowed-out structure, so as to fully utilize the longitudinal space of the camera module while keeping the distance between the lens and the imaging surface of the image sensor constant, and at least part of the image sensor is hidden in the first hollowed-out structure.

[0008] In another specific feasible implementation, the holding object includes a package. Using the package as at least part of the holding object, the package can play two roles of holding and encapsulating at the same time.

[0009] Optionally, the package includes a first package layer on the first surface. The image sensor is at least partially fixed in the first hollowed-out structure in the optical axis direction of the lens by the first package layer. When forming the first package layer, the first package layer can be directly used to hold the image sensor without separately applying glue to fix the image sensor.

[0010] Optionally, the first package layer extends to the imaging surface and is connected to the part of the imaging surface outside the imaging area, so as to fix the image sensor in the optical axis direction through the part of the imaging surface outside the imaging area.

[0011] Optionally, the first package layer extends between the outer peripheral wall of the image sensor and the inner peripheral wall of the movable circuit board that encloses the first hollowed-out structure, so as to fix the image sensor in the optical axis direction.

[0012] Optionally, the movable circuit board has a second surface disposed opposite to the first surface, the package includes a second encapsulation layer located on the second surface, and the second encapsulation layer has a second hollow structure corresponding to the first hollow structure; at least a part of the image sensor is located within the second hollow structure along the optical axis direction of the lens; the inner peripheral wall surrounding the second hollow structure is connected to the image sensor, or the package further includes an adhesive located between the outer peripheral wall of the image sensor and the inner peripheral wall surrounding the second hollow structure in the movable circuit board, so as to have a larger avoidance design space on one side of the first surface of the movable circuit board.

[0013] Optionally, the movable circuit component includes components disposed on the second surface, and the second encapsulation layer covers the components, and the second encapsulation layer has the functions of encapsulating and supporting the image sensor at the same time.

[0014] Optionally, the package further includes a first encapsulation layer disposed on the first surface, and the first encapsulation layer extends to the imaging surface and is connected to the part outside the imaging area in the imaging surface to further fix the image sensor.

[0015] Optionally, the camera module further includes a filter holder and an infrared cut-off filter, the infrared cut-off filter is located between the lens and the image sensor, and the filter holder supports the infrared cut-off filter on the side of the first encapsulation layer away from the first surface, and the filter holder does not directly contact the movable circuit board, further saving the surface area of the movable circuit board, which is beneficial to arranging other components or setting a larger-sized image sensor, and is also beneficial to simplifying the structure of the filter holder.

[0016] Optionally, the camera module further includes a filter holder and an infrared cut-off filter, the infrared cut-off filter is located between the lens and the image sensor; the package only includes the second encapsulation layer located on the second surface, the filter holder supports the infrared cut-off filter on one side of the first surface, and the filter holder is connected to the first surface, so as to support the infrared cut-off filter by using the filter holder, and not setting the first encapsulation layer is beneficial to simplifying the process.

[0017] Optionally, the image sensor has a non-imaging surface disposed opposite to the imaging surface, and a heat-conducting material is provided on the non-imaging surface to facilitate sufficient heat dissipation of the image sensor.

[0018] Optionally, the fixed circuit component includes a fixed circuit board having a third hollow structure, at least a part of the movable circuit board is located within the third hollow structure to reduce the longitudinal dimension, and the movable circuit board is electrically connected to the fixed circuit board through a flexible connection component, so that the movable circuit board has a degree of freedom of lateral movement; the driving component is used to support the movable circuit board on the side of the lens close to the image sensor and to drive the movable circuit board to move relative to the fixed circuit board in a direction perpendicular to the optical axis of the lens, so as to achieve the anti-shake function.

[0019] Optionally, the driving component includes: a supporting component and a lateral driving component. The lateral driving component is connected to the side of the lens close to the image sensor and is used to move the supporting component relative to the fixed circuit board in a direction parallel to the reference plane. The supporting component is used to support the movable circuit board on the lateral driving component. The lateral driving component and the supporting component have a high degree of integration, which is convenient for installation.

[0020] Optionally, the driving component includes: a supporting component and a lateral driving component; wherein, the supporting component is used to support the movable circuit board on the side of the lens close to the image sensor; the lateral driving component is used to drive the movable circuit board to move relative to the fixed circuit board in a direction perpendicular to the optical axis of the lens. The supporting component and the lateral driving component are separately and independently arranged, which is beneficial to reducing the cost of components.

[0021] Optionally, the lateral driving component includes a coil and a magnet. Among them, the coil is arranged on the movable circuit board and the magnet is arranged on the fixed circuit board; or, the magnet is arranged on the movable circuit board and the coil is arranged on the fixed circuit board; the coil is used to attract or repel the magnet to drive the lateral movement of the movable circuit board, and this lateral driving component has a low cost.

[0022] Optionally, the lateral driving component includes an optical image stabilization motor, which has a good anti-shake function, and the supporting component includes a suspension wire, which has a good supporting effect.

[0023] Optionally, the camera module further includes a gold wire, and the image sensor is electrically connected to the movable circuit board through the gold wire to achieve conduction.

[0024] Optionally, the camera module further includes a strength protection board, which is arranged on the surface of the fixed circuit board facing away from the lens, and the strength protection board covers the third hollow structure to prevent dust from entering the camera module through the third hollow structure.

[0025] Optionally, the fixed circuit component includes a fixed circuit board having a third hollow structure, at least a part of the movable circuit board is located within the third hollow structure, and the movable circuit board is electrically connected to the fixed circuit board through a flexible connection component; wherein, an edge of the movable circuit board has a first stepped structure with a part of the opening located on the first surface, and one end of the flexible connection component is connected to a wall surface of the first stepped structure; or, an edge of the movable circuit board has a second stepped structure with a part of the opening located on the second surface, and one end of the flexible connection component is connected to a wall surface of the second stepped structure; or, a first encapsulation layer is provided on the first surface, and an edge of the first encapsulation layer is retracted relative to an outer peripheral surface of the movable circuit board to form a third stepped structure, and one end of the flexible connection component is connected to a wall surface of the third stepped structure; or, a second encapsulation layer is provided on the second surface, and an edge of the second encapsulation layer is retracted relative to an outer peripheral surface of the movable circuit board to form a fourth stepped structure, and one end of the flexible connection component is connected to a wall surface of the fourth stepped structure. By accommodating the flexible connection component through the first stepped structure, the second stepped structure, the third stepped structure, and the fourth stepped structure, it is convenient to set a flexible connection component with a longer size, increase its softness, and reduce the lateral movement resistance.

[0026] In a second aspect, an electronic device is provided, which includes a housing and the camera module according to any one of the above technical solutions, and the camera module is located within the housing.

[0027] The advantages of the above-mentioned electronic device and the above-mentioned camera module over the prior art are the same, and will not be elaborated herein. Description of the Drawings

[0028] Figure 1a It is a schematic structural diagram of the first camera module provided by an embodiment of the present application;

[0029] Figure 1b It is a schematic structural diagram of the second camera module provided by an embodiment of the present application;

[0030] Figure 1c It is a schematic structural diagram of the third camera module provided by an embodiment of the present application;

[0031] Figure 2a It is a schematic structural diagram of the fourth camera module provided by an embodiment of the present application;

[0032] Figure 2b It is a schematic structural diagram of the fifth camera module provided by an embodiment of the present application;

[0033] Figure 3 It is a schematic structural diagram of the sixth camera module provided by an embodiment of the present application;

[0034] Figure 4a Schematic diagram of the structure of the seventh camera module provided by the embodiment of the present application;

[0035] Figure 4b Schematic diagram of the structure of the eighth camera module provided by the embodiment of the present application. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. In the following text, words indicating orientation relationships such as "vertical" and "parallel" allow engineering tolerances.

[0037] The camera module provided by the embodiment of the present application can be applied to mobile terminals such as mobile phones and tablet computers.

[0038] Refer to Figure 1a , the camera module includes a fixed circuit component, a movable circuit component, and a driving component. Among them, the fixed circuit component includes a fixed circuit board 3, a lens 15, a lens holder 13, a reinforcement plate 1, and a connector 18; the movable circuit component includes: a movable circuit board 12, a filter holder 16, an infrared cut-off filter 7, and an image sensor 2. The driving component includes a lateral driving member, a longitudinal driving member, and a supporting member. The lateral driving member is used to drive the movable circuit component to move laterally (in a direction perpendicular to the optical axis L of the lens 15), and the longitudinal driving member is used to drive the lens 15 to move along the optical axis L to achieve focusing of the lens 15. The supporting member supports the movable circuit component so that it can have a degree of freedom of movement in the lateral direction.

[0039] Specifically, in Figure 1a , the longitudinal driving member includes an autofocus motor 14, the lateral driving member includes an optical image stabilization motor 11, and the supporting member includes a suspension wire, which is not shown in Figure 1a .

[0040] The fixed circuit board 3 has a third hollow structure U3, and a reinforcing plate 1 is also provided on the bottom surface of the fixed circuit board 3. The reinforcing plate 1 covers the third hollow structure U3 at the same time. The reinforcing plate 1 is connected to the bottom surface of the fixed circuit board 3 by adhesive bonding or hot pressing process. The main function is to seal and protect the entire camera module to prevent dust and the like from entering. Among them, the connector 18 is used to electrically connect the fixed circuit board 3 to the motherboard of the electronic device. In addition, a certain gap is maintained between the reinforcing plate 1 and the movable circuit board 12 and the image sensor 2 to avoid friction with the reinforcing plate 1 during lateral movement, thereby generating lateral resistance.

[0041] The movable circuit board 12 is placed in parallel with the fixed circuit board 3 and can be perpendicular to the direction of the optical axis L. In addition, the movable circuit board 12 is square in shape so as to roughly fit the outline of the image sensor 2. Figure 1a In the figure, the movable circuit board 12 is completely located in the third hollow structure U3, but this is only exemplary, mainly to make the movable circuit board 12 overlap with the fixed circuit board 3 in the thickness direction, so as to reduce the size of the entire camera module in the direction of the optical axis L. It should be understood that as long as the movable circuit board 12 partially overlaps with the fixed circuit board 3 in the thickness direction, that is, the movable circuit board 12 is at least partially located in the third hollow structure U3, the size of the camera module in the direction of the optical axis L can be reduced; wherein, the third hollow structure U3 is square, which is convenient for adapting to the shape of the movable circuit board 12. At the same time, when the third hollow structure U3 is formed by cutting, the cutting equipment only needs to go straight in two vertical directions without going in a curve, which reduces the process difficulty and improves the product yield. A flexible connecting component 4 is set between the fixed circuit board 3 and the movable circuit board 12. The flexible connecting component 4 electrically connects the fixed circuit board 3 and the movable circuit board 12 to achieve conduction and realize flexible connection, so that the movable circuit board 12 can move horizontally in the third hollow structure U3 relative to the fixed circuit board 3, providing basic conditions for realizing the function of optical image stabilization, thereby improving the imaging quality. The specific connection method and connection position of the flexible connection component 4 will be described in detail later.

[0042] The lens 15 is supported on the side of the fixed circuit board 3 away from the reinforcement plate 1, and the lens holder 13 is bonded to the fixed circuit board 3 by glue, so that the lens 15 is arranged relative to the middle position of the third hollow structure U3. The lens holder 13 is an inverted cover structure, specifically including a vertically connected top cover and side walls. The top cover has an opening to allow the lens 15 to extend out. The autofocus motor 14 is located on the inner side of the lens holder 13 and is fixedly connected to the lens holder 13. The autofocus motor 14 is transmission-connected to the lens 15 to realize the movement of the lens 15 in the direction of the optical axis L for focusing.

[0043] The movable circuit board 12 includes a first surface S1 and a second surface S2 which are arranged along the optical axis L direction and are oppositely disposed, and an outer peripheral surface connecting the first surface S1 and the second surface S2. The first surface S1 and the second surface S2 are both flat and parallel to each other. Among them, the first surface S1 is close to the lens 15, and the second surface S2 is close to the light protection plate 1. The movable circuit board 12 is further formed with a first hollow structure U1 that vertically penetrates the first surface S1 and the second surface S2 along the optical axis L direction. The first hollow structure U1 is square, so as to be adapted to the square image sensor 2 and facilitate cutting and forming. At this time, the first hollow structure U1 forms the hollow part of the movable circuit assembly. The image sensor 2 is completely disposed within the first hollow structure U1. The image sensor 2 includes an imaging surface P1 and a non-imaging surface P2 which are oppositely disposed. The imaging surface P1 faces the same direction as the first surface S1, and the non-imaging surface P2 faces the light protection plate 1. There is an imaging area M1 in the middle of the imaging surface P1. The area of the imaging surface P1 is generally larger than the area of the imaging area M1. The term "imaging surface" only refers to the surface with imaging function and does not mean that the entire surface can image. When ambient light passes through the lens 15 and reaches the imaging area M1, the imaging area M1 senses the above light and generates a corresponding signal to form an image. There is an adhesive 8 filled between the outer peripheral surface connecting the imaging surface P1 and the non-imaging surface P2 of the image sensor 2 and the inner peripheral surface surrounding the first hollow structure U1, which can fix the image sensor 2 and the movable circuit board 12 in the direction of the optical axis L. The adhesive 8 can be at least one of epoxy resin glue and thermal conductive glue, etc., or other substances for bonding and fixing. Here, the adhesive 8 exemplarily serves as a holding object to fixedly connect the image sensor 2 and the movable circuit board 12, preventing the image sensor 2 from moving or falling off relative to the movable circuit board 12, resulting in a reduction in imaging quality. The so-called "holding object" here refers to a structure that is connected between the image sensor 2 and the movable circuit board 12 and fixedly connects the two. It should be understood that the method of fixing the image sensor 2 and the movable circuit board 12 is not limited to the form of the above adhesive 8. A metal wire can also be used as a bracket, and the image sensor 2 and the movable circuit board 12 can be relatively fixed by welding or thermocompression bonding, as long as the image sensor 2 is fixed in the corresponding position. The image sensor 2 and the movable circuit board 12 are electrically connected and conducted through a gold wire 6. In other embodiments, the adhesive 8 can also be changed to an anisotropic conductive adhesive to keep the image sensor 2 and the movable circuit board 12 electrically connected, thus saving the step of bonding the gold wire 6, reducing the cost and avoiding problems such as high-temperature operation. There are also components 5 provided on the first surface S1. The components are fixed and electrically connected to the movable circuit board 12. These components 5 can be capacitors and inductors that form a circuit, etc.

[0044] The filter holder 16 includes a horizontally supporting wall and a vertically supporting wall connected perpendicularly. The vertically supporting wall supports the edge of the horizontally supporting wall at the edge of the first surface S1 of the movable circuit board 12. One end of the horizontally supporting wall away from the vertically supporting wall is connected to the infrared cut-off filter 7, and the infrared cut-off filter 7 is supported between the imaging surface P1 and the lens 15 to filter out the infrared light in the light incident from the lens 15 before it enters the image sensor 2, thereby improving the imaging quality. The filter holder 16, the movable circuit board 12, the infrared cut-off filter 7, and the image sensor 2 together enclose a closed box. Among them, the optical image stabilization motor 11 is disposed between the autofocus motor 14 and the filter holder 16, and the optical image stabilization motor 11 is fixedly connected to the autofocus motor 14. The suspension wire is integrated in the optical image stabilization motor 11, with a high degree of integration, convenient for installation, and small in occupied volume. The optical image stabilization motor 11 can drive the suspension wire to move horizontally, and the suspension wire drives the filter holder 16, thereby driving the entire movable circuit assembly to move horizontally. At this time, it is equivalent to the support member supporting (indirectly supporting) the movable circuit assembly on the horizontal driving member, and the movable circuit assembly is located on the side of the lens 15 facing the image sensor 2. It should be understood that the horizontal driving member is not limited to the form of the optical image stabilization motor 11, and the support member is not limited to the form of the suspension wire. As long as the horizontal driving member has a horizontal driving function, for example, SMA (shape memory alloys) or Piezo Motor can also be used as the horizontal driving member, which is not limited here. The optical image stabilization motor 11 is not directly connected to the movable circuit board 12 through the suspension wire, but is connected to the filter holder 16, which can save the area of the first surface S1 and save the length of the suspension wire, making the horizontal driving more stable. The Pin pins of the optical image stabilization motor 11 are electrically connected to the movable circuit board 12.

[0045] In addition to driving the movable circuit assembly in this way, magnets and coils can also be provided on the movable circuit assembly and the fixed circuit assembly. By controlling the on / off of the coil or the current direction of the coil, the magnets and coils can attract or repel each other, serving as the horizontal driving member. And the filter holder 16 is directly supported on the autofocus motor 14 through the suspension wire, as described later Figure 3Corresponding embodiments. At this time, it is equivalent to that the lateral driving component is only used to drive the movable circuit board 12 laterally, and the supporting component supports the movable circuit board 12 on the side of the lens 15 facing the image sensor 2. In addition, the suspension wire can also be supported only between the filter holder 16 and the autofocus motor 14, and the optical image stabilization motor 11 only has the function of driving the movable circuit board 12 laterally. At this time, the lateral driving component is used to drive the movable circuit board 12 laterally, and the supporting component is used to support the movable circuit board 12 on the side of the lens 15 facing the image sensor 2. In short, the driving component can be used to support the movable circuit board 12 on the side of the lens 15 close to the image sensor 2, and to drive the movable circuit board 12 to move relative to the fixed circuit board 3 in a direction perpendicular to the optical axis L of the lens 15, so as to realize the anti-shake function.

[0046] During the lateral movement of the movable circuit assembly, the lens 15 can always be arranged relative to the first hollow structure U1, and then relative to the imaging area M1, so that the light entering the lens 15 can be filtered by the infrared cutoff filter 7 and then imaged on the imaging area M1.

[0047] exist Figure 1a In the corresponding embodiment, the thickness of the movable circuit board 12 in the direction of the optical axis L is greater than the thickness of the image sensor 2 in the direction of the optical axis L, and the imaging plane P1 is lower than the first surface S1. Taking the plane where the first surface S1 is located as the reference plane, the imaging plane P1 is located on the side of the reference plane facing the plane where the second surface S2 is located, that is, on the side of the reference plane away from the lens 15. Compared with the case where the image sensor 2 is arranged on the first surface S1, and the image sensor 2 does not occupy additional space outside the movable circuit board 12 in the direction of the optical axis L, when the distance between the lens 15 and the image sensor 2 remains unchanged, it is conducive to reducing the size of the camera module in the direction of the optical axis L.

[0048] It should be understood that in Figure 1aIn this case, the non-imaging surface P2 is flush with the second surface S2. The image sensor 2 is completely located within the first hollow structure U1 described above, so that the imaging surface of the lens 15 coincides with the imaging surface of the image sensor 2 to achieve image sensing. Moreover, the outer peripheral surface of the image sensor 2 and the flexible circuit board 12 have the maximum overlap in the optical axis L direction, so as to avoid increasing the size of the box formed by the filter holder 16, the flexible circuit board 12, the infrared cut-off filter 7, and the image sensor 2 in the optical axis L direction, and the filling area of the adhesive 8 can be increased to improve stability. However, this is only exemplary. In order to reduce the longitudinal size of the camera module, the lower half of the image sensor 2 can also be exposed outside the first hollow structure U1, that is to say, the non-imaging surface P2 is higher than the second surface S2 in the direction away from the lens 15. As long as it is ensured that in the direction perpendicular to the first surface S1 (here it is the optical axis L direction), the image sensor 2 at least partially extends into the first hollow structure U1 of the flexible circuit board 12, it can be ensured that in the direction perpendicular to the optical axis L, the projection of the outer peripheral surface of the image sensor 2 coincides with the projection of the inner peripheral surface surrounding the first hollow structure U1, so that the adhesive 8 can be filled between the two.

[0049] In Figure 1a In the corresponding embodiment, since the image sensor 2 is completely located within the first hollow structure U1, the positive projection of the imaging area M1 on the reference plane (i.e., the plane where the first surface S1 described above is located) is within the range of the area corresponding to the first hollow structure U1 surrounded by the positive projection of the flexible circuit board 12 on the reference plane. Thus, when the imaging light beam is incident from the lens 15 along the optical axis L direction, it can pass through the first hollow structure U1 and reach the imaging area M1 for imaging.

[0050] In Figure 1a In this case, the flexible connection component 4 includes a flexible connection part 41 and a fixing part 42 that are electrically connected to each other. One end of the flexible connection part 41 away from the fixing part 42 is electrically connected to the first surface S1 of the flexible circuit board 12 by means such as welding, conductive adhesive, or ACF (anisotropic conductive film) process. However, this is only exemplary. In some other cases, the flexible connection part 41 can also be electrically connected to the outer peripheral surface or the second surface S2 of the flexible circuit board 12; the flexible connection part 41 and the flexible circuit board 12 can also be an integral structure. The so-called "integral structure" means that the insulating layer in the flexible connection part 41 and the insulating layer of the flexible circuit board 12 are formed simultaneously, rather than formed separately and then spliced together; the insulating layer in the flexible connection part 41 and the metal layer of the flexible circuit board 12 are also formed by etching or cutting a whole layer of metal formed simultaneously, and there is no later splicing of the metal layers of the two; and the fixing part 42 is a hard block structure and can have a gold finger. Along the inner peripheral surface of the third hollow structure U3 formed in the fixing circuit board 3 ( Figure 1aAn upper edge position thereof forms a stepped structure T with an opening facing the upper surface of the fixed circuit board 3 on the inner peripheral surface. A notch formed by the stepped structure T matches the fixing portion 42, and the fixing portion 42 is electrically connected to the inner wall of the stepped structure T. In this way, the fixing portion 42 does not need to occupy the space of the third hollow structure U3 or the space on the side of the fixed circuit board 3 away from the reinforcement plate 1. The fixing portion 42 is bonded to the inner peripheral surface of the notch formed by the stepped structure T (the inner peripheral surface may be provided with structures such as pads that can achieve electrical conduction) through a conductive adhesive to realize the conduction between the fixing portion 42 and the fixed circuit board 3. Since the first surface S1 is substantially flush with the surface of the fixed circuit board 3 away from the reinforcement plate 1, the flexible connection portion 41 can be substantially parallel to the reference plane and is not easily damaged by friction with the movable circuit board 12 or the fixed circuit board 3 during lateral deformation. In addition, compared with the case where one surface of the fixing portion 42 contacts the fixed circuit board 3, here two surfaces of the fixing portion 42 contact the inner peripheral surface of the notch formed by the stepped structure T, increasing the bonding area and improving the stability; the fixing portion 42 can also be directly electrically connected to the inner peripheral surface surrounding the third hollow structure U3. In addition, the connection mode between the flexible connection portion 41 and the movable circuit board 12 can also be that one end of the flexible connection portion 41 close to the movable circuit board 12 is connected to another fixing portion, and the fixing portion cooperates with the movable circuit board 12 by referring to the connection mode between the fixing portion 42 and the fixed circuit board 3. The flexible connection portion 41 and the fixed circuit board 3 can also be of an integral structure, which is convenient for direct integral cutting or injection molding and has a more stable structure.

[0051] Reference Figure 1b , and Figure 1a The difference is that at the edge formed by the outer peripheral surface of the movable circuit board 12 and the second surface S2, a second stepped structure T2 with an opening located at the second surface S2 and the outer peripheral surface of the movable circuit board 12 is formed. It can also be said that part of the opening of the second stepped structure T2 is located at the second surface S2. In Figure 1b , one end of the flexible connection portion 41 away from the fixing portion 42 is fixed and electrically connected to the wall surface of the second stepped structure T2 facing the fixed circuit board 3, and the fixing portion 42 is arranged in the notch of the stepped structure T formed at the edge of the fixed circuit board 3 surrounding the third hollow structure U3 close to the reinforcement plate 1, and its cooperation mode refers to Figure 1a , so that the flexible connection portion 41 can also be substantially parallel to the reference plane. In this way, it can be ensured that the flexible connection portion 41 does not generate stress in the optical axis L direction to cause the chip to tilt, and unnecessary wear during the displacement of the flexible connection portion 41 can also be reduced. In the above structure, since the flexible connection portion 41 can be partially accommodated in the space surrounded by the first stepped structure, on the premise of keeping the movable circuit board 12 and the fixed circuit board 3 conducting and flexibly connected, the lateral size of the camera module (in the direction perpendicular to the optical axis L) is reduced.

[0052] Similarly, a first stepped structure can also be formed at the connection between the first surface S1 and the outer peripheral surface of the movable circuit board 12, that is, the opening of the first stepped structure is located at the first surface S1 and the outer peripheral surface of the movable circuit board 12, or rather, a part of the opening of the first stepped structure is located at the first surface S1. The connection position and method of the fixing portion 42 shall refer to Figure 1a . In this way, the area of the second surface S2 is larger than that of the first surface S1, and the second surface S2 is more convenient for arranging the components 5. The filter holder 16 includes a transverse support wall and a longitudinal support wall, and the opening width of the first stepped structure on the first surface S1 can be controlled within a certain range. The longitudinal support wall can span the opening of the first stepped structure on the first surface S1 and be connected to the first surface S1.

[0053] Refer to Figure 1c , and the difference from Figure 1b is that the non-imaging surface P2 of the image sensor 2 is covered with a heat-conducting material k1, and the heat-conducting material k1 can be a heat-conducting adhesive, copper, or other materials with a high heat-conductivity coefficient.

[0054] Refer to Figure 2a , the movable circuit assembly may further include a package, such as a first package layer 17 on the first surface S1. The first package layer 17 can be resin, and in this figure, the first package layer 17 covers the first surface S1, but it can also only cover a part of the first surface S1. Herein, the "package" refers to an insulating layer that packages electronic devices such as components 5 or gold wires 6, and the "adhesive" refers to a colloidal substance with a bonding function, which is a different substance from the package. When the two are adjacent, there will be a demarcation line between them. And the components 5 and gold wires 6 thereon are bonded and packaged to protect the components 5 from moisture or oxidation. In addition to the above functions, the first package layer 17 can also hold the image sensor 2 to stably reinforce it on the movable circuit board 12. Specifically, the first package layer 17 can be extended to the area outside the imaging area M1 in the imaging surface P1 of the image sensor 2 (referred to as the non-imaging area, in Figure 2aIn the embodiment of the present invention, the first packaging layer 17 may be annular in shape, wherein the first packaging layer 17 may fully or partially cover the above-mentioned non-imaging area. However, the first packaging layer 17 is not limited to being connected to the portion outside the imaging area M1 in the above-mentioned imaging surface P1. For example, the image sensor 2 may also have an auxiliary connecting frame arranged in the area outside the imaging area M1 in the imaging surface P1, and the first packaging layer 17 may be connected to the auxiliary connecting frame. When forming the first packaging layer 17, the resin material is directly poured between the outer peripheral surface of the image sensor 2 and the inner peripheral surface surrounding the first hollow structure U1 to bond and fix the image sensor 2 to the movable circuit board 12, which is conducive to simplifying the process. Alternatively, the image sensor 2 may be fixed in the first hollow structure U1 by first dispensing to form the adhesive 8, and then the above-mentioned first packaging layer 17 is formed. In this case, there is no need to additionally fix the image sensor 2 before forming the adhesive 8.

[0055] And, in Figure 2a In the embodiment, the filter holder 16 only retains the transverse support wall and cancels the longitudinal support wall, which can simplify the structure of the filter holder 16 and improve the production yield of the filter holder 16. The transverse support wall is fixed to the side of the first packaging layer 17 away from the first surface S1. Specifically, when the first packaging layer 17 is not solidified, the transverse support wall can be placed on the surface of the first packaging layer 17, and can be fixed to the transverse support wall after solidification. In this way, the area occupied by the first surface S1 can be further reduced, which is convenient for arranging more components 5 or enlarging the size of the image sensor 2.

[0056] exist Figure 2a In the embodiment, the first encapsulation layer 17 also covers the non-imaging area portion outside the imaging area M1 in the imaging surface P1 of the image sensor 2 to further increase the bonding strength with the image sensor 2 .

[0057] The first packaging layer 17 forms a bell mouth corresponding to the imaging area M1 and opening toward the lens 15. The wall surface of the bell mouth formed by the first packaging layer 17 is a slope surface, forming an open space as much as possible, which can prevent the light directed to the imaging area M1 from being blocked and can fully utilize the contact area with the image sensor 2. At this time, the first hollow portion U1 and the bell mouth form a hollow portion of the active circuit component.

[0058] exist Figure 2a In a corresponding embodiment, the first packaging layer 17 constitutes a holder for fixedly connecting the image sensor 2 to the movable circuit board 12 .

[0059] refer to Figure 2b ,and Figure 2a The difference is that a second stepped structure T2 is added, and the position, structure, and matching relationship of the second stepped structure T2 with the flexible connecting component 4, and the matching relationship of the flexible connecting component 4 with the fixed circuit board 3 are all referred to Figure 1b .

[0060] refer to Figure 3 ,and Figure 1a The difference between the corresponding embodiments is that the movable circuit board 12 is a double-sided printed circuit board, a solder pad is provided on the first surface S1, and the component 5 is located on the second surface S2, which is conducive to having more avoidable space on the side of the first surface S1 of the movable circuit board 12, and the gold wire 6 is connected and conductive with the solder pad on the first surface S1 and the image sensor 2, and the package body can also only include a second packaging layer 19 provided on the second surface S2, and the second packaging layer 19 encapsulates the component 5. The material of the second packaging layer 19 and the effect of the packaging refer to the first packaging layer 17 mentioned above; since the first packaging layer 17 is not provided, the form of the filter holder 16 can refer to Figures 1a to 1c The corresponding embodiment, that is, the filter holder 16 includes a transverse support wall and a longitudinal support wall. The plane where the imaging surface P1 is located is located on the side of the plane where the second surface S2 is located away from the plane where the first surface S1 is located. In this way, the image sensor 2 is completely located on the side of the movable circuit board 12 away from the lens 15, that is, outside the first hollow structure U1 in the direction of the optical axis L. While keeping the distance between the image sensor 2 and the lens 15 constant, the size of the camera module in the direction of the optical axis L can be further fully utilized to reduce the longitudinal size of the camera module. Since the image sensor 2 and the component 5 are both arranged on the same side of the movable circuit board 12, only the second packaging layer 19 needs to be arranged, which simplifies the shape of the package. The second packaging layer 19 has a second hollow structure U2 corresponding to the position of the first hollow structure U1. The "corresponding" here should be understood as the first hollow structure U1 and the second hollow structure U2 are connected, and the aperture of the second hollow structure U2 is greater than or equal to the aperture of the first hollow structure U1. Specifically, the inner wall of the first hollow structure U1 and the inner wall of the second hollow structure U2 can be flush. The image sensor 2 is disposed in the second hollow structure U2 , and adhesive 8 is filled between the outer circumference of the image sensor 2 and the inner circumference of the second packaging layer 19 that surrounds the second hollow structure U2 . The adhesive 8 bonds and fixes the image sensor 2 to the second packaging layer 19 in the direction of the optical axis L.

[0061] In addition, although the optical image stabilization motor 11 saves space, it has a complex structure and high cost. Figure 3 There is no optical image stabilization motor 11, but a magnet is set on the inner side of the lens holder 13 on the fixed circuit board 3, and a coil is set on the inner side of the filter holder 16 on the movable circuit board 12. By energizing the coil, the magnetic force between the coil magnet is used to drive the movable circuit board 12 to move horizontally. The coil magnet has a simple structure and low cost. The coil and the magnet are not shown in the figure. And it should be understood that the positions of the coil and the magnet can be interchanged. The lateral support wall and the autofocus motor 14 are supported by a suspension wire 21.

[0062] butFigure 3 Merely exemplary, a part of the image sensor 2 may also be retained within the first hollow structure U1, that is, a part of the outer peripheral surface of the image sensor 2 is disposed opposite to the inner wall of the first hollow structure U1, and another part is disposed opposite to the inner wall of the second hollow structure U2. The image sensor 2 is bonded to the inner wall of the first hollow structure U1 and the inner wall of the second hollow structure U2 through an adhesive 8 respectively. As long as the non-imaging surface P2 is located on the side of the plane where the second surface S2 is located away from the plane where the first surface S1 is located.

[0063] Wherein, the adhesive 8 and the second encapsulation layer 19 may be of a split structure or integrally formed. When forming the second encapsulation layer 19 by encapsulation, it may be poured into the gap around the image sensor 2 to form the adhesive 8.

[0064] In Figure 3 the corresponding embodiment, the adhesive 8 and the second encapsulation layer 19 constitute a holding member for fixing the image sensor 2 to the flexible circuit board 12. The first hollow structure U1 and the second hollow structure U2 together form the hollow part of the flexible circuit assembly.

[0065] It should be understood that in Figure 3 , the inner walls of the first hollow structure U1 and the second hollow structure U2 are flush. The orthographic projection of the image sensor 2 on the reference plane is located within the area corresponding to the first hollow structure U1 surrounded by the orthographic projection of the flexible circuit board 12 on the reference plane. However, this is merely an example. The area of the orthographic projection of the image sensor 2 on the reference plane may be larger than the area of the region corresponding to the first hollow structure U1 surrounded by the orthographic projection of the flexible circuit board 12 on the reference plane, as long as it is ensured that the orthographic projection of the imaging area M1 on the reference plane is located within the area of the region corresponding to the hollow part (the first hollow structure U1 and the second hollow structure U2) surrounded by the orthographic projections of the flexible circuit board 12 and the second encapsulation layer 19 on the reference plane, and the light incident from the lens 15 is not blocked when it shoots towards the imaging area M1. And, ensure that there is no interference between the image sensor 2 and the component 5 in the lateral direction. In this way, a larger-sized image sensor 2 can be used.

[0066] Referring to Figure 4a , the difference from Figure 3 is that the holding member further includes a first encapsulation layer 17 disposed on the first surface S1. The first encapsulation layer 17 extends to the part outside the imaging area M1 in the imaging surface P1 and is fixedly connected to the image sensor 2 to further reinforce the image sensor 2. At this time, the encapsulation body includes the second encapsulation layer 19 and the first encapsulation layer 17, and this encapsulation body constitutes the holding member. The structure and installation method of the filter holder 16 may refer to Figures 2a to 2b the corresponding embodiment.

[0067] Referring to Figure 4b , the difference from Figure 4aThe difference is that the first encapsulation layer 17 does not cover the outer peripheral edge portion of the first surface S1, such that the edge of the first encapsulation layer 17 is retracted inwardly with respect to the edge of the active circuit board 12 towards the optical axis L, forming a third stepped structure T3. The space enclosed by the third stepped structure T3 can accommodate a part of the flexible connection portion 41. The flexible connection portion 41 can be electrically connected to the wall surface formed by the first surface S1 in the third stepped structure T3, or can extend through the wall surface formed by the first encapsulation layer 17 into the first encapsulation layer 17 and then be electrically connected to the first surface S1. At this time, the flexible connection portion 41 also forms a physical connection relationship with the wall surface formed by the first encapsulation layer 17. A part of the flexible connection portion 41 can be accommodated in the space enclosed by the third stepped structure T3, which can achieve the purpose of reducing the lateral size of the camera module. Moreover, the flexible connection portion 41 can be suspended on the side of the first surface S1 of the active circuit board 12 facing away from the second surface S2, which is beneficial to increasing the length and reducing the resistance during lateral movement.

[0068] Similarly, the edge of the second encapsulation layer 19 can also be retracted with respect to the edge of the active circuit board 12 to form a fourth stepped structure T4. The opening of the fourth stepped structure T4 is located on the outer peripheral surface of the second encapsulation layer 19 and the surface of the second encapsulation layer 19 away from the active circuit board 12. One end of the flexible connection portion 41 is connected to a wall surface of the fourth stepped structure T4. The embodiment having the fourth stepped structure T4 is not shown in the figure.

[0069] The image sensor 2 can also not be located within the second hollow structure U2. For example, it is located on the side of the second encapsulation layer 19 facing away from the active circuit board 12 and is connected to a part of the imaging surface P1 of the image sensor 2 other than the imaging region M1. At this time, the second encapsulation layer 19 constitutes a holder. The flare formed by the first encapsulation layer 17 and the second hollow structure U2 of the second encapsulation layer 19 form the hollow portion of the active circuit assembly.

[0070] As long as it satisfies that the second encapsulation layer 19 is fixed to the image sensor 2; and the orthographic projection of the imaging region M1 on the plane where the first surface S1 is located is within the region corresponding to the second hollow structure U2 enclosed by the orthographic projection of the second encapsulation layer 19 on the plane where the first surface S1 is located, ensuring that the second encapsulation layer 19 does not block the imaging region M1. However, it should be understood that the holder and the hollow portion are not limited to the above specific forms. As long as the holder can hold the image sensor 2 and the active circuit board 12, in the direction of the optical axis L of the lens 15, the holder has the function of connecting the image sensor 2 to the active circuit board 12; in the above embodiments, the holder can be an adhesive, an encapsulation body or both. The hollow portion can penetrate the active circuit board 12 in the direction of the optical axis L. When there is an encapsulation body, the hollow portion can penetrate the encapsulation body.

[0071] In summary, as long as the orthographic projection of the imaging area M1 on the reference plane is located within the area corresponding to the hollowed-out part surrounded by the orthographic projection of the active circuit component on the reference plane, it can be ensured that light can irradiate the imaging area M1.

[0072] In a second aspect, based on the same inventive concept, an embodiment of the present application further provides an electronic device, which may be a mobile terminal such as a mobile phone or a tablet computer. The electronic device includes the camera module provided by the above technical solution.

[0073] The electronic device includes a housing and the camera module provided by the above embodiment. The camera module is located within the housing and is used for imaging. The effects of the electronic device can refer to the embodiments of the camera module.

[0074] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. An imaging module, comprising: A lens, a movable circuit assembly, a fixed circuit assembly, a driving assembly and an image sensor, wherein the image sensor is fixed to the movable circuit assembly, wherein the movable circuit assembly includes a hollow portion and a fixing object; The lens is arranged opposite to the hollow portion; The active circuit assembly includes an active circuit board, the active circuit board including a first surface; The image sensor comprises an imaging surface, wherein the imaging surface has an imaging area; The imaging surface and the first surface both face the lens, and the plane where the imaging surface is located is located on a side of a reference surface away from the lens, wherein the reference surface is the plane where the first surface is located; The orthographic projection of the imaging area on the reference plane is located within the area corresponding to the hollow portion and enclosed by the orthographic projection of the movable circuit component on the reference plane; In the optical axis direction of the lens, the image sensor is fixedly connected to the movable circuit board by the holder, and the image sensor is electrically connected to the movable circuit board; The hollow portion includes a first hollow structure, the first hollow structure is arranged in a region of the movable circuit board opposite to the lens, and the image sensor is at least partially fixed in the first hollow structure along the optical axis direction of the lens; The fixed circuit assembly includes a fixed circuit board, the fixed circuit board has a third hollow structure, the movable circuit board is at least partially located in the third hollow structure, and the movable circuit board is electrically connected to the fixed circuit board through a flexible connecting component; The driving assembly is used to support the movable circuit board on a side of the lens close to the image sensor, and to drive the movable circuit board to move relative to the fixed circuit board along a direction perpendicular to the optical axis of the lens, so as to achieve an anti-shake function.

2. The camera module according to claim 1, characterized in that The holder includes at least one of adhesive and a packaging body.

3. The camera module according to claim 2, characterized in that, The retaining material is only adhesive, and the image sensor is at least partially fixed in the first hollow structure in the optical axis direction of the lens by the adhesive. The adhesive is located between the outer peripheral wall of the image sensor and the inner peripheral wall of the movable circuit board that surrounds the first hollow structure.

4. The camera module according to claim 2, characterized in that, The packaging body includes a first packaging layer located on the first surface, and the image sensor is at least partially fixed in the first hollow structure in the optical axis direction of the lens through the first packaging layer.

5. The camera module according to claim 4, characterized in that, The first encapsulation layer extends to the imaging surface and is connected to a portion of the imaging surface outside the imaging area.

6. The camera module according to claim 4, wherein The first packaging layer extends between an outer peripheral wall of the image sensor and an inner peripheral wall of the movable circuit board that encloses the first hollow structure.

7. The camera module according to claim 2, wherein The movable circuit board has a second surface arranged opposite to the first surface, the packaging body includes a second packaging layer located on the second surface, and the second packaging layer has a second hollow structure corresponding to the first hollow structure; The image sensor is at least partially located in the second hollow structure along the optical axis direction of the lens; The inner peripheral wall enclosing the second hollow structure is connected to the image sensor, or the encapsulation body further includes an adhesive located between the outer peripheral wall of the image sensor and the inner peripheral wall enclosing the second hollow structure in the movable circuit board.

8. The camera module according to claim 7, wherein The movable circuit assembly includes components disposed on the second surface, and the second encapsulation layer covers the components.

9. The camera module according to claim 8, wherein The encapsulation body further includes a first encapsulation layer disposed on the first surface, and the first encapsulation layer extends to the imaging surface and is connected to a portion of the imaging surface other than the imaging region.

10. The camera module according to any one of claims 4, 5, 6, and 9, characterized in that, The camera module further includes a filter holder and an infrared cut-off filter, the infrared cut-off filter is located between the lens and the image sensor, and the filter holder supports the infrared cut-off filter on a side of the first encapsulation layer facing away from the first surface.

11. The imaging module according to claim 7, wherein, The camera module further includes a filter holder and an infrared cut-off filter, the infrared cut-off filter is located between the lens and the image sensor; The encapsulation body only includes a second encapsulation layer located on the second surface, the filter holder supports the infrared cut-off filter on one side of the first surface, and the filter holder is connected to the first surface.

12. The camera module according to claim 1, wherein, The image sensor has a non-imaging surface disposed opposite to the imaging surface, and a heat-conducting material is provided on the non-imaging surface.

13. The imaging module according to claim 1, wherein The driving assembly includes: a supporting member and a lateral driving member, the lateral driving member is connected to a side of the lens close to the image sensor and is used to move the supporting member relative to the fixed circuit board in a direction parallel to the reference surface, and the supporting member is used to support the movable circuit board on the lateral driving member.

14. The imaging module according to claim 12, wherein The driving assembly includes: a supporting member and a lateral driving member; wherein, The supporting member is used to support the movable circuit board on a side of the lens close to the image sensor; The lateral driving member is used to drive the movable circuit board to move relative to the fixed circuit board in a direction perpendicular to the optical axis of the lens.

15. The imaging module according to claim 14, wherein The lateral driving member includes a coil and a magnet, wherein, The coil is disposed on the movable circuit board, and the magnet is disposed on the fixed circuit board; or the magnet is disposed on the movable circuit board, and the coil is disposed on the fixed circuit board; The coil is used to attract or repel the magnet.

16. The imaging module according to claim 13 or 14, characterized in that, The lateral driving member includes an optical image stabilization motor, and the supporting member includes a suspension wire.

17. The camera module according to claim 1, wherein The camera module further includes a gold wire, and the image sensor is electrically connected to the movable circuit board through the gold wire.

18. The camera module according to claim 1, wherein, The camera module further includes a reinforcement plate, the reinforcement plate is disposed on a surface of the fixed circuit board facing away from the lens, and the reinforcement plate covers the third hollow structure.

19. The imaging module according to claim 1, wherein The fixed circuit assembly includes a fixed circuit board, the fixed circuit board has a third hollow structure, at least a part of the movable circuit board is located in the third hollow structure, and the movable circuit board is electrically connected to the fixed circuit board through a flexible connecting member; wherein, The edge of the movable circuit board has a first stepped structure with a partial opening on the first surface, and one end of the flexible connection component is connected to a wall surface of the first stepped structure; or, The edge of the movable circuit board has a second stepped structure with a partial opening on the second surface, and one end of the flexible connection component is connected to a wall surface of the second stepped structure; or, The first surface is provided with a first encapsulation layer, and the edge of the first encapsulation layer is retracted relative to the outer peripheral surface of the movable circuit board to form a third stepped structure, and one end of the flexible connection component is connected to a wall surface of the third stepped structure; or, The second surface is provided with a second encapsulation layer, and the edge of the second encapsulation layer is retracted relative to the outer peripheral surface of the movable circuit board to form a fourth stepped structure, and one end of the flexible connection component is connected to a wall surface of the fourth stepped structure.

20. An electronic device, characterized in that, The electronic device includes a housing and the camera module according to any one of claims 1 to 19, and the camera module is located in the housing.

Images