A chip cleaving apparatus

Abstract

The chip cleaving device provided by the application belongs to the technical field of chip cleaving and comprises a film stretching frame for placing chips, the film stretching frame is connected with a film stretching frame driving device, a cutting head device has a cutting knife for cutting chips, a cleaving head device has a roller for cleaving chips, the cutting head device and the cleaving head device are connected with a cutting driving device, a cleaving support device has a cleaving beam for supporting chips, the cleaving support device is connected with a cleaving driving device, the cleaving support device is driven by the cleaving driving device to adjust in the X direction and the Z direction, the chip cleaving device of the application realizes the process of cleaving from the cutting knife through the cooperation of the devices, has high position adjustment precision, can be accurately positioned, and has high cleaving precision.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, and more specifically to a chip processing device. Background Technology

[0002] When a crystalline mineral is subjected to stress, its own structure causes the crystal to split along a certain crystallographic direction into smooth planes, a property known as cleavage; these smooth planes are called cleavage planes. Because cleavage planes are very smooth, cleavage technology is widely used in fields such as semiconductor lasers and optical communications.

[0003] In cleavage engineering, a cleaving device is used to make scratches of a certain depth on the wafer. Then, using the specific orientation cleavage plane of the wafer, the wafer is cracked along the scratches to obtain the desired cross-section.

[0004] However, existing equipment cannot pinpoint the location precisely, resulting in very low precision in dicing. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defects of existing equipment, which cannot accurately pinpoint and has very low chip splitting accuracy, thereby providing a chip splitting device.

[0006] To solve the above-mentioned technical problems, the present invention provides a chip parsing device, comprising:

[0007] A film holder is used to place chips; the film holder is connected to a film holder drive device; the film holder moves and rotates in the X direction under the drive of the film holder drive device.

[0008] A dicing head device having a dicing blade for dicing chips;

[0009] A chip-breaking head device having rollers for chip splitting;

[0010] The slicing head device and the dicing head device are connected to the slicing drive device; the slicing head device and the dicing head device move in the Y direction under the drive of the slicing drive device.

[0011] A chip support device has a chip beam for supporting the chip; the chip support device is connected to a chip driving device; the chip support device is adjusted in the X and Z directions under the drive of the chip driving device.

[0012] As a preferred embodiment, the bandage frame includes:

[0013] A membrane tube assembly, comprising four membrane tubes arranged in a rectangular shape; each membrane tube has an internal cavity.

[0014] Tension angle, having an insertion end that slides into the cavity of the membrane tube;

[0015] Multiple elastic elements are disposed within the cavity of the tensioning tube; one end of each elastic element is connected to the inner wall of the cavity of the tensioning tube, and the other end abuts against the end of the insertion end of the tensioning angle; the elastic element has a biasing force that drives the tensioning angle to move outward toward the cavity.

[0016] As a preferred embodiment, the membrane frame driving device includes:

[0017] A fixed bracket has at least one set of opposing placement grooves; the placement grooves are disposed on a rotating plate; the stretching tube is placed in the placement groove.

[0018] A rotating assembly has a driving wheel and a driven wheel connected to the driving wheel via a belt; the driving wheel is connected to a motor, and the driven wheel is connected to a rotating plate.

[0019] A film stretcher drive assembly includes a film stretcher drive motor and a sliding plate connected to the film stretcher drive motor; the rotating assembly is disposed on the sliding plate.

[0020] As a preferred embodiment, the fracturing head device includes:

[0021] A base suitable for connection to chip processing equipment;

[0022] The lifting arm has one end rotatably connected to the base via a pivot, and the other end extends toward the end away from the base and is rotatably connected to a roller.

[0023] The drive rod has one end rotatably mounted on the rotating shaft and connected to the lifting arm, and the other end connected to the drive device.

[0024] As a preferred embodiment, the slicing head device includes:

[0025] Fixed base;

[0026] The slicing blade is mounted on a fixed base via a position control structure and a pressure control structure;

[0027] The position control structure is slidably disposed on the fixed base; the position control structure has a first driving component, which drives the slicing blade to reach and move away from the slicing position;

[0028] The pressure control structure is disposed on the position control structure; the pressure control structure has a second drive component, which provides the application and release of the cutting force of the slicing blade.

[0029] As a preferred embodiment, the cutting drive device includes:

[0030] Slice the base;

[0031] The second mounting plate has the slicing head device and the dicing head device at one end; the second mounting plate is slidably connected to the slicing base via a sliding platform.

[0032] A slicing drive cylinder is located at the lower end of the slicing base; the drive end of the slicing drive cylinder is connected to the other end of the second mounting plate.

[0033] As a preferred embodiment, the fragment support device includes:

[0034] The chip beam is made of a magnetically conductive material; the chip beam has a chip support surface for supporting the chip.

[0035] The fixing frame contains magnetic material; the fixing frame has at least two mutually perpendicular fixing surfaces for fixing the split beam.

[0036] As a preferred embodiment, the cleaving drive device includes:

[0037] A shard base, on which the shard support device is connected via a shard connector; the connector is connected to the shard base via a height adjustment bolt;

[0038] The shard support frame has a placement slot for placing the shard base; the shard base is connected to the shard support frame by a horizontal adjusting bolt.

[0039] As a preferred embodiment, the alignment observation device has an observation lens for observing the chip; the alignment observation device is connected to an alignment drive device; the alignment observation device moves in the Y direction under the drive of the alignment drive device.

[0040] As a preferred embodiment, the observation device includes:

[0041] The base has a fixed end and a sliding bracket spaced at intervals on the other end.

[0042] The observation lens is slidably mounted on the sliding bracket via a sliding platform; the sliding platform is connected to the drive end of the alignment drive device.

[0043] The fine-tuning knob is connected to the observation lens.

[0044] The technical solution of this invention has the following advantages:

[0045] 1. The chip cleaving device provided by the present invention includes: a stretching frame, a dicing head device, a dicing head device, and a dicing support device; the device realizes the dicing process from the dicing blade through the cooperative arrangement of each device, and has high position adjustment accuracy, which can accurately pinpoint the location, thus making the dicing accuracy high.

[0046] 2. The chip cleaving device provided by the present invention includes a stretching frame comprising: a stretching tube assembly, a tensioning angle, and an elastic element; in the initial state, the stretching frame is at its natural length, and the top block of the tensioning mechanism is in the second state, and the stretching frame is placed on the tensioning mechanism; the top block is adjusted to the first state to compress the stretching frame, making the perimeter of the stretching frame smaller, and the dicing membrane is fixed to the stretching frame; under the drive of the elastic element, the perimeter of the stretching frame increases, thereby achieving tension on the dicing membrane; since the perimeter of the stretching frame increases uniformly, the tension force on the dicing membrane is evenly distributed; the magnitude of the tension force on the dicing membrane can be controlled by controlling the magnitude of the driving force of the elastic element; the use of this stretching assembly will not cause the dicing membrane to loosen or wrinkle, and can play a good supporting role for subsequent cutting.

[0047] 3. The chip cleaving device provided by the present invention includes a cleaving head device comprising: a base, a lifting arm, and a drive rod; the lifting arm presses against the chip with a scribe line by means of rollers on the lifting arm, and the driving device drives the lifting arm to rotate so that the lifting arm provides a force that causes the rollers to press down, thereby achieving chip cleaving along the scribe line position, which can ensure that the chip cleavage is intact and will not be damaged, and ensure the accuracy and stability of wafer cleaving.

[0048] 4. The chip cleaving apparatus provided by the present invention includes a dicing head device comprising: a fixed base and a dicing blade; the dicing blade is mounted on the fixed base via a position control structure and a pressure control structure; the position control structure is slidably mounted on the fixed base, enabling adjustment of the horizontal position of the dicing blade; a first driving component drives the dicing blade to and from the dicing position; the pressure control structure provides dicing pressure to the dicing blade via a second driving component; this apparatus can adjust the dicing position and dicing force of the dicing blade for the wafer to be cleaved, achieving precise dicing, increasing the probability of successful dicing, and reducing losses.

[0049] 5. The chip cleaving device provided by the present invention can accurately observe the chip by aligning with the observation device, thereby achieving more precise positioning of the dicing blade and roller and improving the accuracy of cleaving. Attached Figure Description

[0050] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0051] Figure 1 This is a three-dimensional structural diagram of the chip cleaving device of the present invention.

[0052] Figure 2This is a three-dimensional structural diagram of the membrane frame of the present invention.

[0053] Figure 3 This is a three-dimensional structural diagram of the tension angle of the present invention.

[0054] Figure 4 This is a schematic diagram of the connection relationship between the membrane tube and the tension angle of the present invention.

[0055] Figure 5 for Figure 4 A magnified view of a portion at point A shown.

[0056] Figure 6 This is a cross-sectional view of the membrane tube of the present invention.

[0057] Figure 7 This is a three-dimensional structural diagram of the slicing blade of the present invention.

[0058] Figure 8 This is a three-dimensional structural diagram of the first angle of the position control structure of the present invention.

[0059] Figure 9 This is a three-dimensional structural diagram of the second angle of the position control structure of the present invention.

[0060] Figure 10 This is a three-dimensional structural diagram of the position control structure of the present invention from a third angle.

[0061] Figure 11 This is a three-dimensional structural diagram of the fourth angle of the position control structure of the present invention.

[0062] Figure 12 This is a schematic diagram showing the connection relationship between the rotating bracket and the pressure control structure of the present invention.

[0063] Figure 13 This is a three-dimensional structural diagram of the pressure control structure of the present invention from a first angle.

[0064] Figure 14 This is a three-dimensional structural diagram of the pressure control structure of the present invention from a second angle.

[0065] Figure 15 This is a three-dimensional structural diagram of the tool holder of the present invention.

[0066] Figure 16 This is a three-dimensional structural diagram of the slicing blade of the present invention.

[0067] Figure 17 This is a schematic diagram showing the connection relationship between the slicing blade and the blade holder of the present invention.

[0068] Figure 18 This is a three-dimensional structural diagram of the sharding head of the present invention.

[0069] Figure 19 This is a three-dimensional structural diagram of the base of the present invention.

[0070] Figure 20 This is a three-dimensional structural diagram of the lifting arm of the present invention.

[0071] Figure 21 This is a top view of the sharding head of the present invention.

[0072] Figure 22 for Figure 21 The AA-direction sectional view shown.

[0073] Figure 23 for Figure 21 The BB-directed sectional view shown.

[0074] Figure 24 This is a schematic diagram of the roller and its usage state according to the present invention.

[0075] Figure 25 This is a three-dimensional structural diagram of the film stretching frame and film stretching frame driving device of the present invention.

[0076] Figure 26 This is a three-dimensional structural schematic diagram of the membrane frame driving device of the present invention.

[0077] Figure 27 This is a schematic diagram of the slicing drive device of the present invention.

[0078] Figure 28 This is a schematic diagram of the first angle of the shard support device of the present invention.

[0079] Figure 29 This is a schematic diagram of the second angle structure of the shard support device of the present invention.

[0080] Figure 30 This is a schematic diagram of the front view of the split beam structure of the present invention.

[0081] Figure 31 This is a schematic diagram of the first angle structure of the alignment and observation device of the present invention.

[0082] Figure 32 This is a schematic diagram of the second angle structure of the alignment and observation device of the present invention.

[0083] Explanation of reference numerals in the attached figures:

[0084] 100. Film stretching frame; 101. Film stretching tube; 102. Tension angle; 103. Limiting groove; 104. Limiting protrusion; 105. Insertion end; 106. Cutting film; 107. Elastic element;

[0085] 200. Film stretcher drive device; 201. Fixed bracket; 202. Rotating plate; 203. Placement groove; 204. Abutment screw; 205. Drive wheel; 206. Driven wheel; 207. First mounting plate; 208. Film stretcher drive motor; 209. Position sensor;

[0086] 340. Cutting head device; 300. Position control structure; 301. Fixed base; 302. First base; 303. Adjustment knob; 304. Mounting slot; 305. Third elastic element; 306. Rotating bracket; 307. Arc-shaped slide groove; 308. Drive linkage; 309. First cylinder; 310. First elastic element; 311. Limiting linkage; 312. Limiting knob;

[0087] 400. Pressure control structure; 401. Positioning support; 402. Mounting hole; 403. Second cylinder; 404. Transmission shaft; 405. Contact piece; 406. Contact post; 407. Rotating plate; 408. Tool holder; 409. Mounting bracket; 410. Placement hole; 411. Mounting slope; 412. Magnetic component; 413. Second elastic component; 414. Tool body; 415. Tool holder; 416. Mounting base;

[0088] 500. Slicing drive device; 501. Second mounting plate; 502. Slicing base; 503. Slicing drive cylinder;

[0089] 600. Fracturing head device; 601. Second base; 602. Rotating shaft; 603. Lifting arm; 604. Abutment plate; 605. Locking screw; 606. Locking nut; 607. Drive rod; 608. Drive cylinder; 609. Fourth elastic element; 610. Long hole; 611. Roller; 612. Shock-absorbing nut; 613. Limiting element; 615. Connecting rod; 616. Adjusting nut; 617. Fifth elastic element; 618. Adhesive film; 619. Chip; 620. Annular flange;

[0090] 700. Flake support device; 701. Flake beam; 702. Fixing frame; 703. Flake base; 704. Flake connector; 705. Height adjustment bolt; 706. Placement slot; 707. Horizontal adjustment bolt; 708. Flake support frame;

[0091] 800. Alignment observation device; 801. Observation lens; 802. Observation base; 803. Observation support frame; 804. Sliding bracket; 805. Horizontal fine adjustment knob; 806. Vertical fine adjustment knob; 807. Alignment drive device;

[0092] 1000, Support base. Detailed Implementation

[0093] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0094] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0095] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0096] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0097] like Figure 1 As shown, a chip processing device is provided, and the structure is described below through different embodiments.

[0098] Example 1

[0099] like Figure 2 As shown, the bandage frame 100 is rectangular and has four bandage tubes 101. The four bandage tubes 101 form the four sides of the bandage frame 100, and the inside of the bandage tubes 101 has a cavity.

[0100] like Figure 3 As shown, the near ends of two adjacent bandage tubes 101 are slidably inserted with a tension angle 102, which is "L" shaped, and the two ends are insertion ends 105 suitable for sliding insertion into the cavity of the bandage tube 101.

[0101] like Figure 4 , 5As shown, a limiting device is provided between the tension angle 102 and the membrane tube 101; the limiting device includes a limiting groove 103 provided on the side wall of the membrane tube 101, and a limiting protrusion 104 provided on the tension angle 102 in cooperation with the limiting groove 103.

[0102] The specific structure can be that a through hole is provided at the insertion end 105 of the tension angle 102, and two limiting grooves 103 are provided at the corresponding positions of the membrane tube 101. First, the tension angle 102 is inserted into the cavity of the membrane tube 101, and a pin is inserted into the through hole. The two ends of the pin extend into the limiting grooves 103 respectively, and the part of the pin that extends out serves as a limiting protrusion 104 to achieve limiting.

[0103] As an alternative implementation, the limiting protrusion 104 can be a telescopic protrusion. During installation, the protrusion can be pressed into the tension angle 102 and popped out after reaching the position of the limiting groove 103 to achieve the limiting function.

[0104] like Figure 6 As shown, an elastic element 107 is provided in the cavity of the membrane tube 101, preferably a spring; elastic elements 107 are respectively provided at both ends of the cavity of each membrane tube 101, one end of the elastic element 107 is fixedly connected to the inner wall of the cavity, and the other end is adapted to abut against the insertion end 105 of the tension angle 102, and has a driving force to push the tension angle 102 out of the cavity; the driving force of the elastic element 107 can provide tension for the dicing membrane 106, so that the dicing membrane 106 will not loosen or wrinkle;

[0105] The same elastic element 107 is provided at the same position on each stretching tube 101, so that the tension on the dicing film 106 is the same at each position and angle, which can provide a good load-bearing effect for the subsequent wafer cutting.

[0106] Example 2

[0107] This embodiment provides a slicing head device 340, such as Figure 7 As shown, it includes a mounting base 301, which is fixed on a chip cleaving device. A cleaving blade is provided on the mounting base 301 through a position control structure 300 and a pressure control structure 400. The cleaving blade has a tip for cleaving, which is used to cleave on the wafer to facilitate subsequent cleaving.

[0108] like Figure 8 As shown, the position control structure 300 includes a first base 302, which is slidably mounted on a fixed base 301 via a sliding platform; an adjustment knob 303 is horizontally rotatably mounted on the fixed base 301, and the adjustment knob 303 has an abutting end extending toward the first base 302.

[0109] like Figure 9As shown, a mounting groove 304 is provided at the bottom of the fixed base 301, and a third elastic member 305 is installed in the mounting groove 304. One end of the third elastic member 305 is connected to the fixed base 301, and the other end is connected to the first base 302. The third elastic member 305 has a driving force to drive the first base 302 toward the direction of the adjustment knob 303.

[0110] In use, by rotating the adjustment knob 303, the abutting end of the adjustment knob 303 abuts against one side of the first base 302, causing the first base 302 to move horizontally to the right as shown in the figure. When it is necessary to move to the left as shown in the figure, the adjustment knob 303 is rotated in the opposite direction, and the first base 302 moves to the left under the action of the third elastic element 305 until the first base 302 abuts against the adjustment knob 303, thus fixing its position. Therefore, by rotating the adjustment knob 303, the first base 302 can be moved horizontally, thereby enabling the slicing blade to move horizontally.

[0111] like Figure 10 As shown, a rotating bracket 306 is rotatably mounted on the first base 302. An arc-shaped groove 307 is provided at one end of the rotating bracket 306 extending out of the first base 302, and a pressure control structure 400 is slidably mounted in the arc-shaped groove 307. The other end of the rotating bracket 306 has a "U"-shaped structure, and both ends are rotatably connected to the first base 302 through bearings. The "U"-shaped opening of the rotating bracket 306 is fixedly connected to the drive rod 308 through a connecting rod. One end of the drive rod 308 is connected to the rotating bracket 306, and the other end is connected to the drive end of the first cylinder 309. The first cylinder 309 is mounted on the first base 302. The first cylinder 309 drives one end of the drive rod 308 to move, causing the rotating bracket 306 and the first base 302 to rotate, so that the rotating bracket 306 drives the dicing blade to the dicing position.

[0112] like Figure 11 As shown, a first elastic element 310 is provided between the first base 302 and the rotating bracket 306; the first elastic element 310 has a driving force to drive the slicing blade away from the slicing position.

[0113] In use, the first cylinder 309 pushes the drive linkage 308 to move upward. The drive linkage 308 is fixedly connected to the rotating bracket 306. The rotating bracket 306 is rotatably connected to the first base 302 through a rotating shaft. Therefore, under the drive of the first cylinder 309, the rotating bracket 306 will rotate downward (counterclockwise) around the rotating shaft, driving the slicing blade to the slicing position. When the slicing blade needs to leave the slicing position, the first cylinder 309 is closed. Under the drive of the first elastic element 310, the rotating bracket 306 rotates around the rotating shaft, so that the slicing blade moves away from the slicing position.

[0114] like Figure 8 , 10 As shown, a limiting link 311 is connected to one end of the drive link 308 near the first cylinder 309. The other end of the limiting link 311 is bent in a stepped shape and extends to one side. The extended end abuts against the limiting knob 312. The limiting knob 312 is vertically set and rotatably connected to the first base 302. The lower end of the limiting knob 312 has a blocking end, which abuts against the extended end of the limiting link 311.

[0115] When the first cylinder 309 drives the drive linkage 308 to rotate, it simultaneously drives the limit linkage 311 to move upward. The extended end of the limit linkage 311 contacts and abuts against the blocking end of the limit knob 312, preventing the limit linkage 311 from moving and thus limiting the movement of the drive linkage 308, thereby limiting the cutting position of the dicing blade. If it is necessary to change the cutting position of the dicing blade, the limit knob 312 is rotated, thereby changing the position of the blocking end of the limit knob 312, changing the distance that the drive linkage 308 can move, and changing the cutting position of the dicing blade.

[0116] like Figure 12 As shown, a mounting base 416 is provided in the arc-shaped slide groove 307 of the rotating bracket 306. Two spaced positioning supports 401 are provided on one side of the mounting base 416. The two positioning supports 401 are slidably disposed in the slide groove, so that the mounting base 416 can move along the shape of the arc-shaped slide groove 307. A mounting hole 402 is provided on the mounting base 416. The mounting hole 402 is located between the two positioning supports 401 and corresponds to the arc-shaped slide groove 307. A screw passes through the arc-shaped slide groove 307 and the mounting hole 402, and a nut is screwed on the other end to fix the mounting base 416 and the rotating bracket 306.

[0117] like Figure 13 As shown, a second cylinder 403 is provided on the other side of the mounting base 416. The driving end of the second cylinder 403 abuts against the upper surface of one end of the contact piece 405, and the other end of the contact piece 405 is connected to the transmission shaft 404. A contact post 406 is provided on the lower surface of the end of the contact piece 405 near the second cylinder 403. The contact post 406 has a trigger end for a pressure sensor, which is located on the moving path of the contact piece 405. The contact piece 405 contacts the contact post 406 to determine whether pressure is applied. The other end of the contact post 406 is fixed to the mounting base 416.

[0118] like Figure 14As shown, the transmission shaft 404 passes through the mounting base 416 and is rotatably connected to the mounting base 416. A rotating plate 407 is provided at the other end of the transmission shaft 404, and the rotating plate 407 is connected to the tool holder 408. A second elastic element 413 is provided on the transmission shaft 404 near the tool holder 408. The second elastic element 413 is preferably a torsion spring. One end of the second elastic element 413 abuts against the mounting base 416, and the other end is connected to the transmission shaft 404. The second elastic element 413 has a driving force to drive the rotating plate 407 to reset.

[0119] like Figure 15 As shown, the blade holder 408 has a placement hole 410 at its center for placing the slicing blade. The upper end of the blade holder 408 is a mounting bracket 409. The mounting bracket 409 has four evenly spaced mounting inclined surfaces 411. Every two mounting inclined surfaces 411 form a group, and the two mounting inclined surfaces 411 are inclined in the same direction. A magnetic element 412 is provided on the side of each mounting inclined surface 411 that is close to the placement hole 410. The magnetic element 412 is preferably an adsorption magnet. Specifically, the end of the mounting plate away from the transmission shaft 404 is located close to the placement hole 410.

[0120] like Figure 16 As shown, the slicing blade has a blade body 414 and a handle 415. The blade body 414 and the handle 415 are arranged vertically and have a "T" shape. The handle 415 is made of magnetic material. The blade tip of the blade body 414 is made of diamond and has four mutually perpendicular slicing edges.

[0121] like Figure 17 As shown, during use, the knife handle 415 is placed on an inclined mounting surface. The magnetic attraction between the magnetic magnet and the knife handle 415 secures and limits the slicing blade and the knife holder 408. The four mounting surfaces allow for rotation of the slicing blade's mounting position, switching between different slicing blades. Specifically, the slicing blade is mounted on a set of opposite mounting surfaces to use the first slicing blade. Then, the slicing blade is rotated 180 degrees to use the second slicing blade, which is opposite to the first. The slicing blade is then mounted on another set of opposite mounting surfaces to use the third slicing blade. Finally, the slicing blade is rotated 180 degrees to use the fourth slicing blade, which is opposite to the third. This allows one knife to be used four times, increasing its lifespan and reducing production costs.

[0122] When the second cylinder 403 is activated, it presses one end of the contact piece 405. The contact piece 405 drives the transmission shaft 404 to rotate against the bias force of the second elastic element 413. The rotation of the transmission shaft 404 drives the rotating plate 407 to rotate. The rotating plate 407 rotates around the transmission shaft 404. The end of the rotating plate 407 away from the transmission shaft 404 drives the slicing blade set in the mounting hole 402 to move. That is, when the second cylinder 403 is activated to drive the contact piece 405, the rotation of the rotating plate 407 drives the slicing blade to move downward, thus determining the slicing force of the slicing blade. When it is necessary to cancel the slicing force, the driving force of the second cylinder 403 is removed, and the slicing blade is reset by the second elastic element 413.

[0123] Usage and Principles

[0124] Turning the adjustment knob 303 causes the first base 302 to move on the fixed base 301, which in turn moves the dicing blade horizontally, thus adjusting the horizontal position of the dicing blade. Activating the first cylinder 309 causes the rotating bracket 306 to rotate, which in turn causes the dicing blade to rotate downwards and reach the dicing position. Activating the second cylinder 403 causes the dicing blade to press downwards and abut against the wafer, providing dicing force to the dicing blade.

[0125] Example 3

[0126] This embodiment provides a cleaving head device 600 for chip 619 cleaving, which is disposed on a chip 619 cleaving device; such as Figure 18 As shown, it includes: a second base 601, a lifting arm 603 and a drive rod 607; the lifting arm 603 presses the roller 611 on the chip 619 with the scribing line, and the lifting arm 603 is driven to rotate by the drive device so that the lifting arm 603 provides a force that makes the roller 611 press down, so that the chip 619 is broken along the scribing line.

[0127] like Figure 19 , 20 As shown, the front end of the second base 601 is provided with a "U"-shaped opening, and a rotating shaft 602 is rotatably installed inside the opening. A lifting arm 603 is sleeved and connected on the rotating shaft 602, so that the lifting arm 603 is rotatably connected to the second base 601.

[0128] like Figure 21 , 22 As shown, an abutment plate 604 is provided on one end of the lifting arm 603 near the second base 601, and the upper end of the abutment plate 604 has a locking screw 605 extending upward; a roller 611 is rotatably connected to the other end of the lifting arm 603.

[0129] A drive rod 607 is connected to the rotating shaft 602. A first elongated hole 610 is provided on the drive rod 607. The first elongated hole 610 is sleeved on the locking screw 605. A locking nut 606 is sleeved on the locking screw 605. By tightening the locking nut 606, the drive rod 607 and the lifting arm 603 are fixedly connected.

[0130] A drive cylinder 608 is mounted on the second base 601. The drive end of the drive cylinder 608 is connected to the middle of the drive rod 607. A fourth elastic element 609 is provided between the second base 601 and the lifting arm 603, and the fourth elastic element 609 is in a stretched state. In use, by activating the drive cylinder 608, the drive cylinder 608 drives the drive rod 607 as follows: Figure 5 The roller 611 rotates counterclockwise around the pivot 602. The drive rod 607 is fixedly set with the lifting arm 603, which also rotates counterclockwise, so that the roller 611 comes into contact with the chip 619 to be processed. When the roller 611 does not need to come into contact with the chip 619 to be processed, the drive cylinder 608 is closed, and the driving force of the fifth elastic element 617 pulls the lifting arm 603 to rotate clockwise, so that the roller 611 moves away from the chip 619.

[0131] When it is necessary to remove the roller 611 from the lifting arm 603, loosen the locking nut to release the lifting arm 603 and the drive rod 607 from their fixed state, so that the lifting arm 603 can rotate freely along the second base 601 without being restricted by the drive rod 607 and the drive cylinder 608. At the same time, the drive rod 607 has a first elongated hole 610, and the locking screw 605 can move within the first elongated hole 610.

[0132] As an alternative implementation, threaded holes are provided on the abutment plate 604 and the drive rod 607, and the abutment plate 604 and the drive rod 607 can also be fixed by tightening the bolts into the threaded holes.

[0133] A damping nut 612 is screwed onto the end of the drive rod 607 away from the rotating shaft 602, with one end of the damping nut 612 extending toward the second base 601. When the fourth elastic element 609 drives the lifting arm 603 to rotate, the drive rod 607 also rotates. To prevent the end of the drive rod 607 from contacting the second base 601 and vibrating, a damping nut 612 is provided. When the fourth elastic element 609 drives the drive rod 607 to rotate, the end of the damping nut 612 contacts the second base 601, reducing the contact area and thus reducing vibration.

[0134] like Figure 23As shown, a threaded hole is inclinedly provided inside the second base 601. A limiting member 613 is threadedly connected inside the threaded hole. The limiting member 613 has an abutting end that abuts against the abutting plate 604. By rotating the limiting member 613, the position of the abutting end can be adjusted, thereby limiting the position of the abutting plate 604, thus limiting the height of the lifting arm 603 when it falls around the rotating shaft 602, and further limiting the height of the roller 611 when the chip is cracked, thus adjusting the pressure applied by the roller 611 to the chip 619.

[0135] A connecting rod 615 is vertically arranged at the end of the lifting arm 603 away from the second base 601. A bearing is slidably arranged on the connecting rod 615. Specifically, the inner ring of the bearing is slidably connected to the connecting rod 615, and a roller 611 is connected to the outer ring of the bearing. A thread is provided at the end of the connecting rod 615 away from the lifting arm 603, and an adjusting nut 616 is rotatably arranged thereon. The adjusting nut 616 abuts against the inner ring of the bearing. By turning the adjusting nut 616, the position of the bearing on the connecting rod 615 can be adjusted, and the position of the pressure applied to the chip 619 can be adjusted. A fifth elastic element 617 is arranged between the roller 611 and the lifting arm 603. The fifth elastic element 617 is sleeved on the connecting rod 615, with one end abutting against the inner shaft of the bearing and the other end abutting against the lifting arm 603. The fifth elastic element 617 has a driving force to drive the roller 611 away from the lifting arm 603.

[0136] Roller 611 can be a regular cylindrical shape;

[0137] As an alternative implementation method, such as Figure 24 As shown, two annular flanges 620 are spaced apart on the outer surface of the roller 611, and the two annular flanges 620 abut against the two ends of the scribe line of the chip 619.

[0138] In use, the chip 619, which has been cut and pasted onto the adhesive film 618, is placed on the cleaving beam 701, so that the cut line is directly opposite the edge of the cleaving beam 701. The two annular flanges 620 of the roller 611 are respectively straddled on both sides of the edge of the cleaving beam 701. Cleaving pressure is applied and the roller rolls over the chip 619 to complete the cleaving of the chip 619.

[0139] Example 4

[0140] This embodiment provides a chip cleaving device, including the film stretching frame described in Embodiment 1, the slicing head device described in Embodiment 2, and the chip splitting head device described in Embodiment 23; the chip cleaving device has a support base for support; the film stretching frame, the slicing head device, and the chip splitting head device are all disposed on the support base 1000;

[0141] like Figure 25 As shown, the film stretcher is mounted on the film stretcher drive device 200.

[0142] like Figure 26 As shown, a fixed bracket 201 is mounted on a rotating plate 202. The fixed bracket 201 has a set of oppositely arranged placement grooves 203, and an abutment screw 204 is provided in the placement groove 203 to fix the film stretching frame. A driven wheel 206 is connected to the lower end of the film stretching frame. The driven wheel 206 is connected to a driving wheel 205 via a belt. The driving wheel 205 is connected to a motor. When the motor is turned on, the driving wheel 205 drives the driven wheel 206 to rotate via the belt, which in turn drives the rotating plate 202 to rotate, thereby realizing the rotation of the chip and the adjustment of its angle.

[0143] Both the driving wheel 205 and the driven wheel 206 are mounted on a first mounting plate 207. The first mounting plate 207 is connected to the drive end of the stretching frame drive motor 208 via a slider and a transmission assembly. The stretching frame drive motor 208 drives the first mounting plate 207, which is equipped with the driving wheel 205 and the driven wheel 206, to move along the X direction, thereby ultimately enabling the chip to move along the X direction.

[0144] The bandage frame drive motor 208 is mounted on the base of the bandage frame, and position sensors 209 are mounted at both ends of the base of the bandage frame to limit the range of movement of the chip.

[0145] like Figure 27 As shown, the slicing head device described in Embodiment 2 and the dicing head device described in Embodiment 3 are both disposed at one end of the second mounting plate 501. The second mounting plate 501 is slidably disposed on the slicing base 502 via a sliding platform. The other end of the second mounting plate 501 is connected to the driving end of the slicing driving device 500. The slicing driving device 500 is a slicing driving cylinder 503, which is disposed at the lower end of the slicing base 502.

[0146] like Figure 28 , 29 As shown, a dicing support device 700 for supporting the chip during the dicing and dicing process is provided at the lower end of the chip.

[0147] Specifically, a dicing beam 701 is provided at the lower end of the dicing film, and the dicing beam 701 has a dicing support surface for supporting the chip; for example Figure 30 As shown, the supporting surface is an inclined plane, and the angle between the supporting surface and the horizontal plane is α, where α ranges from 2° to 15°.

[0148] The split beam 701 is made of magnetic material. A fixing frame 702 is provided at the lower end of the split beam 701. The fixing frame 702 has two fixing surfaces that are perpendicular to each other. The fixing frame 702 contains magnetic material. In use, the split beam 701 is attached to the fixing surface of the fixing frame 702 to fix the split beam 701 and facilitate the replacement of the split beam 701. Fractal connectors 704 are fixedly connected to both ends of the slit beam 701. Fixing holes are provided on both sides of the slit connectors 704 to secure them to the slit beam 701. Both sides of the slit connectors 704 have downward-extending plates with elongated holes for fixing to the slit base 703. Simultaneously, a threaded hole is provided at the end of the slit connectors 704, and a height adjustment bolt 705 is screwed into the threaded hole. The end of the height adjustment bolt 705 abuts against the slit base 703. By turning the height adjustment bolt 705, the slit beam 701 can be adjusted in the Z-direction, i.e., the height direction. A slit support frame 708 is provided at the lower end of the slit base 703, and the slit support frame 708 has a placement groove 706.

[0149] The cleavage base 703 is placed in the placement groove 706, the length of which is greater than the width of the cleavage base 703. The cleavage base 703 can move along the Y direction within the placement groove 706, thereby enabling the cleavage beam 701 to move in the Y direction. The placement groove 706 has threaded holes at both ends, and horizontal adjusting bolts 707 are screwed into the threaded holes. The ends of the horizontal adjusting bolts 707 abut against the cleavage base 703, thereby fixing the position of the cleavage base 703. At the same time, an elongated hole is provided on the cleavage base 703, and a threaded hole is provided at the bottom of the placement groove 706, thereby fixing the cleavage base 703 and the cleavage support frame 708.

[0150] like Figure 31 , 32 An alignment and observation device 800 is provided at the upper end of the slicing head device and the dicing head device. The alignment and observation device 800 has an observation lens 801, which is slidably mounted on the observation base 802. Due to the height requirements, the observation base 802 is located at the upper end of the dicing head device and the slicing head device. The observation base 802 is fixed on the dicing support frame 708 by the observation support frame 803.

[0151] The observation lens 801 is connected to the drive end of the alignment drive device 807, and the body of the alignment drive device 807 is fixedly connected to the observation base 802, so that the observation lens 801 is slidably mounted on the sliding bracket 804 of the observation base 802; a horizontal fine adjustment knob 805 and a vertical fine adjustment knob 806 are also provided on the observation lens 801 to realize the fine adjustment of the observation lens 801 in the Y and Z directions.

[0152] Usage and Principles

[0153] The chip to be cleaved is attached to the cleaving film, and then the chip is cleaved along the natural cleavage direction using a cleaving blade to form cleavage marks with a depth of 10%-40% of the chip thickness.

[0154] The diced chip, along with the dicing film, is placed on the dicing beam 701, with the dicing marks aligned with the edge of the dicing beam 701. Then, a dicing wheel is used to apply pressure and roll over the chip, causing the chip to cleave along the natural cleavage direction starting from the dicing marks, thus completing the cleavage.

[0155] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A chip parsing device, characterized in that, include: A film holder is used to place chips; the film holder is connected to a film holder drive device; the film holder moves and rotates in the X direction under the drive of the film holder drive device. A dicing head device having a dicing blade for dicing chips; A chip-breaking head device having rollers for chip splitting; The slicing head device and the dicing head device are connected to the slicing drive device; The slicing head device and the dicing head device move in the Y direction under the drive of the slicing drive device; A chip support device has a chip beam for supporting the chip; the chip support device is connected to a chip driving device; The chip support device is adjusted in the X and Z directions under the drive of the chip driving device, and the chip beam 701 has a chip support surface for supporting the chip. The supporting surface is an inclined plane, and the angle between the supporting surface and the horizontal plane is α, where α ranges from 2° to 15°. The bandage frame includes: A membrane tube assembly, comprising four membrane tubes arranged in a rectangular shape; each membrane tube has an internal cavity. Tension angle, having an insertion end that slides into the cavity of the membrane tube; Multiple elastic elements are disposed within the cavity of the tensioning tube; one end of each elastic element is connected to the inner wall of the cavity of the tensioning tube, and the other end abuts against the end of the insertion end of the tensioning angle; the elastic element has a biasing force that drives the tensioning angle to move outward toward the cavity. The dicing head device includes: The second base is suitable for connection to chip processing equipment; The lifting arm has one end rotatably connected to the second base via a pivot, and the other end extends toward the end away from the second base and is rotatably connected to a roller. The drive rod has one end rotatably mounted on the rotating shaft and connected to the lifting arm, and the other end connected to the drive device; The slicing head device includes: Fixed base; The slicing blade is mounted on a fixed base via a position control structure and a pressure control structure; The position control structure is slidably disposed on the fixed base; the position control structure has a first driving component, which drives the slicing blade to reach and move away from the slicing position; The pressure control structure is disposed on the position control structure; the pressure control structure has a second drive component, the second drive component providing the application and release of the cutting force of the slicing blade; The bandage frame drive device includes: A fixed bracket has at least one set of opposing placement grooves; the placement grooves are disposed on a rotating plate; the stretching tube is placed in the placement groove. A rotating assembly has a driving wheel and a driven wheel connected to the driving wheel via a belt; the driving wheel is connected to a motor, and the driven wheel is connected to a rotating plate. A film stretcher drive assembly includes a film stretcher drive motor and a sliding plate connected to the film stretcher drive motor; the rotating assembly is disposed on the sliding plate.

2. The chip cleaving apparatus according to claim 1, characterized in that, The cutting drive device includes: Slice the base; The second mounting plate has the slicing head device and the dicing head device at one end; the second mounting plate is slidably connected to the slicing base via a sliding platform. A slicing drive cylinder is located at the lower end of the slicing base; the drive end of the slicing drive cylinder is connected to the other end of the second mounting plate.

3. The chip cleaving apparatus according to claim 1, characterized in that, The fragment support device includes: The chip beam is made of a magnetically conductive material; the chip beam has a chip support surface for supporting the chip. The fixing frame contains magnetic material; the fixing frame has at least two mutually perpendicular fixing surfaces for fixing the split beam.

4. The chip cleaving apparatus according to claim 3, characterized in that, The cleaving drive device includes: A shard base, on which the shard support device is connected via a shard connector; the connector is connected to the shard base via a height adjustment bolt; The shard support frame has a placement slot for placing the shard base; the shard base is connected to the shard support frame by a horizontal adjusting bolt.

5. The chip cleaving apparatus according to any one of claims 1-4, characterized in that, Also includes: An alignment observation device is provided, which has an observation lens for observing a chip; the alignment observation device is connected to an alignment drive device; the alignment observation device moves in the Y direction under the drive of the alignment drive device.

6. The chip cleaving apparatus according to claim 5, characterized in that, The observation device includes: The base has a fixed end and a sliding bracket spaced at intervals on the other end. The observation lens is slidably mounted on the sliding bracket via a sliding platform; the sliding platform is connected to the drive end of the alignment drive device. The fine-tuning knob is connected to the observation lens.

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