Metal Card with Bidirectional Communication and Manufacturing Method Thereof

Abstract

The manufacturing method of the metal card according to the embodiment of the present invention includes the following steps: laminating a laminated sheet with multiple sheets to form a metal card, wherein the multiple sheets include: an adhesive sheet, centered on a metal sheet and having the same size as the metal sheet; an upper inlay sheet formed with a first antenna; and a lower inlay sheet formed with a second antenna; processing the metal card by computer numerical control operation to mill a certain area to form a COB accommodation space capable of accommodating a COB; milling the COB contact area of the COB accommodation space until the lower inlay sheet to form through holes exposing the first antenna and the second antenna; dispensing a conductive elastic liquid inside the through holes and processing to electrically connect the first antenna and the second antenna; and attaching the COB on the COB accommodation space to connect the COB contacts through the conductive elastic liquid, and performing a two-way connection process between the first antenna, the second antenna and the COB.

Description

Technical Field

[0001] The present invention relates to a metal card and a method for manufacturing the same, and more particularly, to a metal card capable of two-way communication and a method for manufacturing the same. Background Art

[0002] Generally, credit cards are used instead of cash, and recently, smart cards incorporating IC chips capable of storing a large amount of information have been developed and are actively used not only for settlement but also as various membership cards. In this smart card market, special cards made of various materials are being developed. In particular, credit cards made of different metal materials have been developed for VIP customers, and metal cards are provided to special customers as high-quality credit cards with a metallic luster.

[0003] However, existing metal cards have difficulty in operating the antenna during non-contact communication with a reader due to the characteristics of the metal, and there are many cases where the RF function, ATM use, etc. are restricted. Also, since they are manufactured by using a thin film of metal or thinly coating metal powder, it is difficult to form patterns and characters on the surface of the metal card, and in the case of being made of a too light material, there is a problem that the weight of the metal cannot be felt. Therefore, to overcome the limitations of such metal cards, there is a need to develop a metal card that exhibits the unique weight and aesthetic sense of metal.

[0004] For example, the prior art Korean Registered Utility Model No. 20-0382725 discloses a metal thin film plastic card in which metal thin films 12 smaller than a magnetic core card 13 are attached to the upper and lower surfaces of the magnetic core card 13 made of synthetic resin, and margins 13a are formed at the edges of the upper and lower surfaces of the magnetic core card 13, and an antenna coil 21 is provided along the margins 13a. However, in this prior art, in order to avoid contact between the antenna and the metal, metal is arranged in a part of the center of the card, which results in a problem of reducing the overall aesthetic sense and it is difficult to present a metallic texture throughout the card.

[0005] Therefore, recently, to solve this problem, a metal card made of SUS material and a front metal material connected to an antenna have been introduced.

[0006] However, in the front metal material card, the antenna coil is only provided in the front direction of the metal card, which has the inconvenience of only one-way non-contact settlement and the disadvantage of poor antenna sensitivity.

[0007] Therefore, research has been conducted to make the metal card capable of two-way communication, but so far, due to the increase in its thickness and the complexity of the antenna connection structure, it is not conducive to design. In particular, the increase in thickness leads to an increase in volume and area, thus there are problems of reducing usability and productivity. Summary of the Invention

[0008] Technical Problem

[0009] The present invention is developed to solve the above - mentioned problems, and its purpose is to provide a method for manufacturing a metal card and a metal card, which solve the problems of existing metal cards that can only perform one - way non - contact settlement, and constitute a metal card connecting the upper and lower antennas, so as to enable two - way non - contact settlement, minimize its thickness, and improve antenna sensitivity.

[0010] Technical solution

[0011] The manufacturing method of the metal card according to an embodiment of the present invention for solving the above - mentioned problems includes the following steps: laminating a laminated sheet with multiple sheets to form a metal card, wherein the multiple sheets include: an adhesive sheet, centered on a metal sheet and having the same size as the metal sheet; an upper inlay sheet, formed with a first antenna; and a lower inlay sheet, formed with a second antenna; processing the metal card by computerized numerical control (CNC) operation to mill a certain area to form a COB accommodation space capable of accommodating a COB; milling the COB contact area of the COB accommodation space until the lower inlay sheet to form through - holes exposing the first antenna and the second antenna; dispensing a conductive elastic liquid in the through - holes and processing to electrically connect the first antenna and the second antenna; and attaching the COB on the COB accommodation space to connect the COB contacts through the conductive elastic liquid, and performing a two - way connection process between the first antenna, the second antenna, and the COB.

[0012] The metal card according to an embodiment of the present invention for solving the above - mentioned problems includes: a metal card laminated with multiple layers, wherein the multiple layers include: a metal layer made of SUS material, heat - treated to improve strength and resilience; an adhesive layer, centered on the metal layer and having the same size as the metal layer; an upper inlay layer, formed with a first antenna; and a lower inlay layer, formed with a second antenna. In addition, the metal card is processed by computer numerical control (CNC) operation on the upper surface to mill a certain area to form a COB accommodation space capable of accommodating a COB, and by milling the COB contact area of the COB accommodation space until the lower inlay layer, through - holes exposing the first antenna and the second antenna are formed. A conductive elastic liquid is dispensed in the through - holes and processed to electrically connect the first antenna and the second antenna, and it includes the COB attached to the COB accommodation space to connect the COB contacts through the conductive elastic liquid. Thus, the first antenna, the second antenna, and the COB are manufactured by a two - way connection process.

[0013] Beneficial effects

[0014] According to an embodiment of the present invention, with a metal sheet as the center, an upper inlay layer of a first antenna and a lower inlay layer of a second antenna are stacked to achieve COB contact connection by distributing a conductive elastic liquid through a through-hole. Thus, a two-way metal card is manufactured with minimized thickness increase and capable of two-way communication.

[0015] Thus, a metal card is manufactured that retains the specificity of the metal material and is capable of two-way non-contact communication.

[0016] Moreover, according to an embodiment of the present invention, when distributing the conductive elastic liquid, perforation and PVC (polyvinyl chloride) insertion processing are performed in a manner that does not contact the metal sheet. Thus, in a state where contact between the antenna coil and the metal sheet is cut off, the process enables the insertion of COB, and the antenna coil is naturally connected to the contacts of the COB.

[0017] Thus, the productivity of the metal card is improved, and magnetic interference occurring between the layer of the metal material constituting the metal card and the antenna coil for performing non-contact communication is efficiently controlled. Thus, through the manufacturing method of the present invention, a metal card capable of two-way communication, with improved operation performance and easy to manufacture, can be economically and stably manufactured. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A perspective view of the two-way metal card showing an embodiment of the present invention;

[0019] Figure 2 A perspective view of the two-way metal card showing another embodiment of the present invention;

[0020] Figure 3 A drawing for explaining the connection between the COB inserted into the two-way metal card according to an embodiment of the present invention, its contacts, and the antenna;

[0021] Figure 4 A cross-sectional view of the metal card manufactured according to an embodiment of the present invention, Figure 5 For Figure 4 An enlarged view of the dashed-line part;

[0022] Figures 6 to 12 A cross-sectional view for explaining each process of the manufacturing method of the metal card according to an embodiment of the present invention;

[0023] Figure 13 A flowchart for explaining the manufacturing method of the metal card according to an embodiment of the present invention;

[0024] Figure 14 A flowchart for explaining the manufacturing method of the metal card according to another embodiment of the present invention.

[0025] DESCRIPTION OF THE REFERENCE NUMERALS

[0026] 100: Metal card 110: Metal layer

[0027] 120, 125: Adhesive layer 130, 135: Insulating layer

[0028] 140: First inlay layer 145: Second inlay layer

[0029] 150: Laser layer 160: First printing layer

[0030] 165: Second printing layer 170: Magnetic stripe covering layer

[0031] 147: Inlay combined printing layer 205: COB pad storage unit

[0032] 220: COB chip storage unit 230: Through-hole

[0033] 240: Conductive layer 300: COB

[0034] 305: COB pad 310: COB contact point

[0035] 320: COB chip Detailed implementation manner

[0036] The following content is only used to illustrate the principle of the present invention. Therefore, those skilled in the art can implement the principle of the present invention and invent various devices included in the concept and scope of the present invention even without being explicitly shown in this specification. And all the additional conditional terms and embodiments listed in this specification are generally only for the purpose of understanding the concept of the present invention and are obvious intentions, and should be understood as not being limited to the specifically listed embodiments and states.

[0037] For example, throughout the specification, when any part is said to be "connected" to another part, it includes the case of "direct connection" and also includes the case of "indirect connection" with other components interposed therebetween. And when any part "includes" any component, in the absence of special exclusive description, it does not exclude other components and also has other components.

[0038] And all the specific descriptions of the principle, concept and embodiments of the present invention and the listed specific embodiments are understood with the intention of including the structural and functional equivalents of that situation. And it should be understood that such equivalents include all elements of inventions that perform the same function regardless of structure, including currently known equivalents and equivalents developed in the future.

[0039] The above-mentioned objectives, features, and advantages are made clearer through the accompanying drawings and relevant specific descriptions. Thus, those skilled in the technical field to which the present invention pertains can easily implement the technical idea of the present invention. Moreover, when explaining the present invention, in cases where the specific description of well-known technologies related to the present invention confuses the gist of the present invention and is unnecessary, the specific description thereof is omitted.

[0040] Figure 1 To show a perspective view of the two-way communication metal card 100 according to an embodiment of the present invention, the metal card 100 includes one or more sheets or layers.

[0041] As an embodiment, the metal card 100 includes: a metal layer 110; a first insulating layer 130; one or more adhesive layers 120, 125; a first inlay layer 140, which is a first antenna ultrasonically embedded in the upper part with the metal layer 110 as the center; a second inlay layer 145, which is a second antenna ultrasonically embedded in the lower part; a laser layer 150; a first printing layer 160; a second printing layer 165; and a magnetic stripe overlay (MSO / L, Magnetic stripe Overlay), 170). In this drawing, only the above-mentioned components are shown, but it is not limited thereto. Other components such as coating layers and COBs (chips) for implementing the metal card are added, and additionally, a display, a biosensor, etc. are included for additional functions.

[0042] Moreover, the metal card 100 of the present invention is manufactured in a manner that conforms to the specification dimensions and thickness of a predefined standard. The dimensions and thickness of each sheet are determined by the most suitable thickness that conforms to the operation of the metal card and the wireless communication sensitivity, etc., and then combined.

[0043] Furthermore, the sheets constituting the metal card 100 of the present invention are not the sheets for manufacturing a single card, but are configured as large sheets including the size of multiple cards to enable mass production.

[0044] The metal layer 110 is a magnetic chip that presents the unique material and weight feeling of the metal card of the present invention, and is formed of SUS (steeluse stainless, stainless steel) material. The metal material constituting the metal layer 110 is selected based on the material and weight for presenting the characteristics of the metal, and the durability, wear resistance, metamorphic precision, etc. for undertaking the processing technology. As an embodiment, the metal layer 110 made of stainless steel is corrosion-resistant and can be heat-treated. Heat treatment refers to the operation process of heating the metal at any temperature and improving the properties or metal structure for any purpose according to the cooling rate. The metal layer 110 has unevenness on the local or entire surface for adhesion. Moreover, when manufacturing the metal card 100, the metal layer 110 is processed through a heat treatment process to improve the hardness and resilience.

[0045] As an embodiment, the metal layer 110 of the present invention is composed of a large sheet including a plurality of cards. After a lamination process in which several sheets are laminated and heat and pressure are applied to manufacture one sheet, it is produced into multiple cards by cutting. The cutting operation of the metal sheet including a plurality of cards uses special processing materials, coolant, and cutting tools with the characteristics of the metal material.

[0046] The processing layer 115 is configured as a sheet block made of plastic (PVC) in the processing layer insertion space of the metal layer 110. The processing layer 115 is a device used for connecting to COB in a state where the antennas of the first inlay layer 140 and the second inlay layer 145 on the characteristics of the metal card 100 are separated from the metal layer 110.

[0047] According to an embodiment of the present invention, the processing layer 115 of the plastic material is configured in a form inserted by locally perforating the metal layer 110. According to the processing of the contact connection in the form of inserting the conductive elastic member liquid of the embodiment of the present invention for the processing layer 115, direct contact between the metal layer 110 and the antenna is avoided, and the contacts of the COB are effectively connected simultaneously, and the first antenna and the second antenna ultrasonically embedded in the first inlay layer 140 and the second inlay layer 145 are connected.

[0048] In order to avoid contact between the antenna and the metal layer 110, existing metal cards adopt a method of arranging the antenna in the plastic layer and indirectly communicating with the COB located in the metal layer. Another existing metal card is implemented in a way of arranging and operating the antenna by cutting a part of the metal layer. However, the implementation methods of existing metal cards have problems of reducing the antenna sensitivity and affecting the aesthetics of the metal card.

[0049] In addition, an implementation method has also been developed in which the processing layer is only arranged at the front, and the antenna drawn out from the inside and the COB contacts are connected by spot welding. However, it is not easy to perform this operation in a dual-antenna inlay laminated structure for two-way communication.

[0050] Therefore, in order to overcome this problem, the present invention arranges the plastic processing layer 115 in the processing layer insertion space of the metal layer 110, and in a state separated from the metal layer through the plastic processing layer 115, the first antenna of the upper first inlay layer 140 and the second antenna of the lower second inlay layer 145 are connected through through-holes. Thus, the contact connection of the conductive elastic member liquid distribution method is realized in a way of directly contacting the contact parts of the COB respectively.

[0051] Therefore, for the case where the upper antenna and the lower antenna are directly connected to the COB, two-way non-contact wireless communication can be achieved. By means of the wireless connection between the antenna inside the card and the chip (COB), the sensitivity of the antenna can be improved. Moreover, the entire card surface is made of a metal material. Thus, it is possible to complete a metal card that maintains the advanced aesthetic feeling of a metal card and improves the two-way digital input (DI) wireless communication function.

[0052] In addition, there is no need to form an additional remaining space for two-way wireless communication. The COB is installed in a way that maintains the minimum thickness, which has the effect of further improving the durability and stability of the card.

[0053] The insulating layers 130 and 135 are used to cut off the interference with the metal layer 110 so that the antennas of the first inlay layer 140 and the second inlay layer 145 can operate respectively. For the operation of the near-field communication (NFC) antenna, communication with the opposite antenna reader is required. In this case, a magnetic field is generated in the antenna coil. Since the antenna is entirely attached to the upper and lower parts of the metal card, it is often close to the metal material. In this case, the metal material of the metal sheet changes the self-resonant frequency (SRF) of the antenna coil, resulting in deterioration of the loss, reducing the inductance coefficient of the antenna coil, and ultimately causing communication obstacles. The reason for this phenomenon is the eddy current (vortex current) generated in the metal due to the magnetic field. In order to remove the eddy current, a high-investment rate and high-resistance material must be placed between the metal and the antenna to adjust the magnetic line bidirectionally. The insulating layers 130 and 135 used for this purpose are also called ferrite sheets. Ferrite is made by oxidizing the surface after making iron into powder to make it insulating, and then it is formed by applying pressure.

[0054] The insulating layers 130 and 135 and the metal layer 110 are respectively adhered to the upper and lower parts by the adhesive layers 120 and 125. As an embodiment of the present invention, the adhesive layers 120 and 125 are hot melt sheets. In this drawing, the adhesive layers 120 and 125 are shown for one card, but during manufacturing, it can also be realized by a large-area adhesive sheet containing multiple cards. Hot melt means melting through heating. Materials such as thermoplastic resins have the characteristic of cooling after being heated and melted. Therefore, this material is used as a thin-film type hot melt adhesive. As an embodiment, the hot melt adhesive layers 120 and 125 are adhesive sheets based on the adhesive force between the metal layer 110 made of a metal material and the insulating layers 130 and 135, and different from the adhesives used for plastic sheets, they are made of substances suitable for the metal material to form hot melt sheets.

[0055] Also, as an embodiment, at least one of the insulating layers 130 and 135 of the metal card 100 is used in the form of being engraved into more than one piece. For example, the first insulating layer 130 can also be crushed and composed of non-uniform pieces, or can be made of several uniform pieces. Thus, when engraving at least one of the insulating layers 130 and 135 and using it, when attaching to the hot melt sheet, the hot melt sheet melts and flows into the gaps between the pieces, thereby having the advantage of improving the adhesion to the adhesive sheet.

[0056] Also, as an embodiment, at least one of the insulating layers 130 and 135 of the metal card 100 further includes ferrite in powder form. As a strongly magnetic insulator, for the case of being in powder form, it not only improves the adhesion, but also forms an insulating layer by lamination, thereby improving the insulation function between the metal layer 110 and other sheets. As an embodiment, an example where ferrite is in powder form is illustrated, but it is not limited thereto, and it can be manufactured in a mesh or amorphous powder form. In terms of ferrite being a strongly magnetic insulating substance, as it increases, the bidirectional insulation characteristics of the upper and lower parts of the metal sheet increase, thereby ensuring the normal operation of the bidirectional antenna inside the metal card.

[0057] The first inlay layer 140 and the second inlay layer 145 are sheets containing radio frequency (RF) antenna coils. The first antenna coil and the second antenna coil included in the first inlay layer 140 and the second inlay layer 145 are respectively determined the number of turns (Turn) of the coil to show the best sensitivity through RF communication (for example, NFC) sensitivity tests. And the antenna coil of the present invention is directly connected to the COB (Chip-On-Board) attached to the metal layer 110 through the processing layer 115.

[0058] The first printing layer 160 and the second printing layer 165 are sheets that are respectively printed with the information of each card and displayed, or printed with patterns such as the information, patterns, and styles of the card and displayed, and are attached to the front and back of the card.

[0059] Also, the laser layer 150 includes a coating layer in which a hologram foil is thermally stamped by transfer, or a plurality of decorations with laser patterns are laminated and formed, or decorations with laser patterns are laminated and configured, or the laser patterns are finely processed by UV resin coating, and the laser patterns printed on the metal card.

[0060] Also, the laser layer 150 is a non-conductive laser sheet. In this case, according to the NCVM (Non-Conductive Vacuum Metallizing) method, it is processed to give a metallic luster on the surface while coating a non-conductive film.

[0061] More specifically, the non-conductive film coated on the laser layer 150 by non-conductive vacuum plating shows that metal atoms are arranged at a certain distance on the surface, and can present the metallic texture between atoms, but has the property of no electrical conduction.

[0062] The non-conductive vacuum plating process treatment as shown above makes the coated object have a metallic appearance and no radio wave attenuation, and is applied in mobile phone cases, mobile phone packaging materials, automotive parts, electronic products, other household electrical appliances, etc. As the laser layer 150 in the embodiment of the present invention also applies the non-conductive vacuum plating process method as described above, the metallic texture of the metal card 100 is further increased.

[0063] The non-conductive vacuum plating process method uses various methods of coating the laser layer 150 through a non-conductive film, such as deposition methods such as evaporation method or sputtering method. And the materials of the laser layer 150 used in the construction method include at least one of indium (In), tin (Sn), or silicon (Si). In terms of cost and environment, preferably, tin (Sn) is mainly applied.

[0064] In addition, the magnetic stripe covering layer 170 is a sheet containing a magnetic stripe.

[0065] After the above components are inserted with the processing layer 115 through the first processing of the metal layer 110 (for example, CNC processing for forming a processing layer insertion space), all the sheets 160, 150, 140, 130, 120, 110, 125, 135, 145, 150, 160, 165, 170 are laminated, and then processed by lamination to form a card body.

[0066] Figure 2 To show the three-dimensional view of the metal card of another embodiment of the present invention. The metal card 100 of this embodiment includes one or more sheets or layers. And as Figure 1 shown in the description, the metal card 100 includes: a metal layer 110; a first insulating layer 130; one or more adhesive layers 120, 125; a first inlay layer 140, with a first antenna ultrasonically embedded above the metal layer 110; a second inlay layer 145, with a second antenna ultrasonically embedded below; a laser layer 150; a first printing layer 160; a second printing layer 165, and a magnetic stripe covering layer (MSO / L (Magnetic stripe Overlay), 170). It is not limited thereto, and also includes components such as a display and a biosensor for realizing the metal card.

[0067] Here, the printing direction of the first printing layer 160 of the metal card 100 according to an embodiment of the present invention is not processed in the upward but the back direction (A direction). In this case, by pressing the printing surface, the thickness of the first printing layer 160 can be further reduced. For example, in the case of upward printing, it only occupies a thickness of 0.14 mm, but in the case of printing in the back direction according to an embodiment of the present invention, the printing layer is compressed to a thickness of 0.10 mm.

[0068] Moreover, in the case of the lower second inlay layer 145, it is composed of an inlay combined printing layer 147 combined with the second printing layer 165. For this purpose, the inlay combined printing layer 147 ultrasonically embeds the second antenna on the upper surface, and then, on the lower surface, it is composed of a double-sided layer in the way of printing the printing information of the second printing layer 165. Thus, the laminated thickness of the two layers of about 0.23 mm is reduced to 0.15 mm, minimizing the problem of increased thickness when realizing a metal card capable of two-way communication.

[0069] Figure 3 The attached drawing is for explaining the connection between the COB, its contacts, and the antenna when the two-way metal card according to an embodiment of the present invention is inserted.

[0070] As Figure 3 shown in the display of (A), a COB chip 320 and a COB contact 310 are respectively arranged on a COB pad 305 in the COB 300. As Figure 3 shown in the display of (B), a first antenna and a second antenna formed by coiling or etching are respectively arranged in the first inlay layer 140 and the second inlay layer 145, so that one end is connected to the COB contact 310 through a conductive elastic member liquid.

[0071] Moreover, Figure 4 The attached drawing is a cross-sectional view of a metal card manufactured according to an embodiment of the present invention, Figure 5 and is Figure 4 an enlarged view of the dashed part of

[0072] Referring to Figure 4 and Figure 5 , for the metal card 100 laminated for the first time, the COB contact 310 is electrically connected to the first antenna 141 and the second antenna 142 through a conductive layer 240 formed by penetrating and forming in a way that the first antenna 141 of the first inlay layer 140 and the second antenna 142 of the second inlay layer 145 are electrically connected up and down.

[0073] For this purpose, in the metal card 100 according to an embodiment of the present invention, a COB pad 305 and a COB chip 320 are accommodated, and a CNC and a dispensing process of a conductive elastic member liquid for fixedly connecting the COB contact 310 to the conductive layer 240 are performed. For this, refer to Figures 6 to 12For a more specific description.

[0074] First, Figure 6 To show a cross-sectional view of the dashed part in the main body of the metal card 100, the metal card 100 is formed by a first processing method in which after laminating all the sheets 160, 150, 140, 130, 120, 110, 125, 135, 145, 150, 160, 165, 170 and laminating them together, a card main body is formed by lamination. Figure 5 The card main body is formed into a plate through a lamination process of heat and pressure and is as shown. In this state, through successive CNC processing, a second processing is performed to form through holes for connecting the COB pad receiving unit, the COB chip receiving unit, and the COB contact points in the metal sheet.

[0075] The card main body is formed into a plate through a lamination process of heat and pressure and is as shown. In this state, through successive CNC processing, a second processing is performed to form through holes for connecting the COB pad receiving unit, the COB chip receiving unit, and the COB contact points in the metal sheet. Figure 6 First, referring to, corresponding to the COB pad receiving unit 205 corresponding to the COB pad 305 area, when the upper first inlay layer 140 is exposed, it is cut to a depth of D1. Through this first milling process, a COB pad receiving unit 205 with a width corresponding to the width of the COB pad and a depth of the recess D1 is formed.

[0076] First, referring to Figure 7 , corresponding to the COB pad receiving unit 205 corresponding to the COB pad 305 area, when the upper first inlay layer 140 is exposed, it is cut to a depth of D1. Through this first milling process, a COB pad receiving unit 205 with a width corresponding to the width of the COB pad and a depth of the recess D1 is formed.

[0077] For example, successively, when the upper first printing layer 160 is laminated to 0.10 mm, the laser layer 150 is laminated to 0.06 mm, the first inlay layer 140 is laminated to 0.12 mm, the first insulating layer 130 is laminated to 0.06 mm, the metal layer 110 is laminated to 0.20 mm, the lower insulating layer 135 is laminated to 0.06 mm, the second inlay layer 145 is laminated to 0.15 mm, and the magnetic stripe covering layer 170 is laminated to 0.04 mm, preferably, the D1 depth is set to 0.22 mm.

[0078] Next, referring to Figure 8 , corresponding to the COB chip receiving unit 220 corresponding to the COB chip 320 protruding from the back of the COB, it is cut to a depth of D2 corresponding to the depth of the metal layer 110. This ensures a space for receiving the area of the chip 320 protruding from the back of the COB, for smoothing the front part of the card, and at least a part of the first inlay layer 140, the first insulating layer 130, and the metal layer 110 is milled in a certain width in a way that inserts the protruding unit from the back of the COB. The milling width of the COB chip receiving unit 220 is smaller than the COB pad 305 area, and the inner area is subjected to a second milling process compared to the first antenna 141 area.

[0079] Thus, a chip receiving unit 220 with a width corresponding to the width of the COB chip protruding unit and a depth of the recess D2 is formed.

[0080] For example, successively, the upper first printing layer 160 is stacked to a thickness of 0.10 mm, the laser layer 150 is stacked to a thickness of 0.06 mm, the first inlay layer 140 is stacked to a thickness of 0.12 mm, the first insulating layer 130 is stacked to a thickness of 0.06 mm, the metal layer 110 is stacked to a thickness of 0.20 mm, the lower insulating layer 135 is stacked to a thickness of 0.06 mm, the second inlay layer 145 is stacked to a thickness of 0.15 mm, the magnetic stripe covering layer 170 is stacked to a thickness of 0.04 mm, and in a state where the D1 depth is 0.22 mm, preferably, the D2 depth is set to 0.31 mm.

[0081] In addition, referring to Figure 9 , through another third milling process adjusted until a part of the first antenna 141 is exposed, it is further cut by the D3 depth. The exposed first antenna 141 is electrically connected to the COB contact 310 to be inserted through a conductive elastic member liquid in a subsequent step. Therefore, preferably, it is exposed at a position adjacent to the COB contact 310.

[0082] Thereby, a smoothed contact attachment area with a D3 depth corresponding to the width of the area in contact with the COB contact 310 and a depth corresponding to the contact attachment is formed.

[0083] For example, successively, the upper first printing layer 160 is stacked to a thickness of 0.10 mm, the laser layer 150 is stacked to a thickness of 0.06 mm, the first inlay layer 140 is stacked to a thickness of 0.12 mm, the first insulating layer 130 is stacked to a thickness of 0.06 mm, the metal layer 110 is stacked to a thickness of 0.20 mm, the lower insulating layer 135 is stacked to a thickness of 0.06 mm, the second inlay layer 145 is stacked to a thickness of 0.15 mm, the magnetic stripe covering layer 170 is stacked to a thickness of 0.04 mm, the D1 depth is 0.22 mm, and the D2 depth is 0.31 mm. In this state, preferably, the D3 depth is set to 0.02 mm.

[0084] Next, referring to Figure 10 , at a specified position corresponding to the COB contact area, a fourth milling process for processing a through-hole 230 with a D4 depth is performed until the second antenna 142 is exposed. Thereby, the first antenna 141 of the first inlay layer 140 and the second antenna 142 of the second inlay layer 145 are both in a state of being exposed through the through-hole 230.

[0085] Thereby, a through-hole 230 with a width corresponding to the width of the contact attachment area and a depth equal to the depth of the second antenna 142 of the exposed second inlay layer 145 is formed.

[0086] For example, successively, the upper first printing layer 160 is stacked to 0.10 mm, the laser layer 150 is stacked to 0.06 mm, the first inlay layer 140 is stacked to 0.12 mm, the first insulating layer 130 is stacked to 0.06 mm, the metal layer 110 is stacked to 0.20 mm, the lower insulating layer 135 is stacked to 0.06 mm, the second inlay layer 145 is stacked to 0.15 mm, the magnetic stripe covering layer 170 is stacked to 0.04 mm, at a D1 depth of 0.22 mm, a D2 depth of 0.31 mm, and a D3 depth of 0.02 mm, preferably, the D4 depth is set to 0.04 mm.

[0087] In the case where this processing is completed, as Figure 11 shown in the display, when the COB contact 310 is inserted, the conductive elastic member liquid for bonding and conducting electricity is dispensed to the through-hole 230 and its upper part. In order to easily connect with the COB contact 310, the conductive elastic member liquid is dispensed until an arch shape with a specified depth is maintained on the through-hole 230.

[0088] Here, the conductive elastic member liquid is a conductive curing agent mixed with metal powder, or an elastic polymer for flexible electronic materials. For example, it is a plasticizer containing at least one of silicon, polyurethane, fluoropolymer, styrene-butadiene, chloroprene, acrylonitrile copolymer, and acrylate rubber containing conductive fillers.

[0089] For this conductive elastic member liquid, like conductive silica gel, etc., it has the property of hardening after a certain temperature or time, and is coated through the through-hole 230. Thus, the first antenna 141 and the second antenna 142 are electrically connected, and then a fixing and electrical connection channel for the inlaid COB 300 is formed.

[0090] Thus, as Figure 12 shown in the display, the process of installing the COB 300 is performed, the COB pad 305 and the chip 320 protruding unit are appropriately inlaid, and the arch-shaped part of the conductive elastic member liquid spreads and is appropriately coated between the first antenna 141 and the COB contact 310. Thus, the electrical connection between the COB contact 310 and the first antenna 141 can be strengthened.

[0091] After that, through the conductive layer 240 formed as the conductive elastic member liquid hardens, even without an additional adhesive, the connection between the second antenna 142 at the lower end, the first antenna 141, and the COB contact 310 can be fixed. At this time, an adhesive can also be applied to the back of the COB 300 and the milling treatment area for treatment to fix the COB 300.

[0092] After attaching the COB, the adjustment of the resonance frequency corresponding to the bi-directional antenna can be additionally processed. Preferably, the resonance frequency is set to 14.5 - 16 mhz.

[0093] As a result, the thickness is minimized, and it is easy to connect to the COB contact 310 of the bi-directional antenna. Thus, it is beneficial to manufacture the metal card 100 capable of bi-directional communication.

[0094] Moreover, according to an embodiment of the present invention, the first antenna 141 and the second antenna 142 are mutually connected in common, enabling bi-directional communication using the same communication protocol. In addition, it is possible to provide various functions such as using each antenna as a dual antenna to increase the power received by the reader or improve radio frequency (RF) stability, which also has the effect of enhancing user convenience.

[0095] And, as an embodiment, the COB inserting process is implemented after the printing and coating processes at the front of the card. In this drawing, the COB 300 is shown as a quadrilateral, but it is not limited thereto. Corresponding to the shape of the protruding unit at the back of the COB, each receiving unit and through-hole are manufactured by a milling process to minimize the blank space outside the space required for antenna connection.

[0096] In this drawing, for the purpose of illustrating each layer, it is shown thicker than the actual layer, but the actual layer is in a very thin form. Also, in the present invention, an embodiment of generating the COB insertion area by a milling process is described, but it is not limited thereto. It is also possible to use a method in which an acid-resistant corrosion inhibitor is applied to parts other than the position where the COB 300 is to be attached, and the metal layer 110 is immersed in diluted acid, and after perforating a hole of the size of the COB pad by etching, the COB 300 is attached to the hole. Specifically, an acid-resistant corrosion inhibitor is applied to the metal layer 110 made of SUS material, and the acid-resistant corrosion inhibitor is coated on parts other than the position where the COB pad is to be inserted. Here, the acid-resistant corrosion inhibitor uses an "etching ground" such as a mixture of beeswax, asphalt, and rosin. The metal layer 110 coated with the acid-resistant corrosion inhibitor is immersed in a bucket filled with diluted acid, and is corroded by an etching construction method to perforate and form an insertion space of the COB size. At this time, in order to generate fine irregularities during the process of corroding the generated space, when the COB pad is attached to the space, a very strong attachment characteristic can be achieved. This etching construction method is also applicable in the case of forming the COB pad insertion space or forming a through-hole.

[0097] Figure 13 It is a flowchart of a manufacturing method of a metal card for illustrating an embodiment of the present invention.

[0098] Figure 13A sequence diagram of a method for manufacturing a metal card for explaining an embodiment of the present invention. In the embodiment described with reference to the accompanying drawings, in the method for manufacturing a metal card, the antenna bidirectional connection process based on the liquid distribution of the conductive elastic member is mainly described. As described above, in the present embodiment, the laminated structure of individual cards is mainly described, but in the manufacturing process, metal sheets, adhesive sheets, insulating sheets, inlay sheets, etc. can also be realized as large-area sheets and laminated.

[0099] First, a metal layer 110 centered on a metal sheet is formed, and an upper inlay sheet formed by ultrasonically embedding a first antenna and a lower inlay sheet formed by ultrasonically embedding a second antenna are laminated on top and bottom (S101).

[0100] The metal layer 110 undergoes a heat treatment process due to the characteristics of stainless steel (SUS). In the case of heat-treating the metal layer 110, the resilience (tension) is increased, and the strength is increased to effectively process the card. When SUS is used as the metal layer 110, there are slightly uneven surfaces on the entire surface of the raw material, and the adhesiveness is excellent. In the case of using materials such as aluminum, in order to improve the adhesion, the aluminum sheet is ground into aluminum oxide, or the oxide treatment layer can also be formed by a relatively rough treatment using the sand blast method.

[0101] As an embodiment, a process of coating a color on the metal layer 110 is implemented. For example, in the case of directly using the raw material color (silver color) of the metal layer 110, the color treatment process can be omitted. However, when a color is applied to the metal layer 110, a lamination technique that adheres particles using a magnetic field is applied. That is, the process is performed such that particles that present a color on the surface of the metal sheet form a thin-film-like laminated layer, and the color is applied to the metal sheet.

[0102] Furthermore, the metal layer 110 is laminated with other sheets and heat and pressure are applied to perform a lamination process. After the lamination process, the metal layer 110, the first insulating layer 130, one or more adhesive layers 120, 125, the first inlay layer 140, the second inlay layer 145, the laser layer 150, the first printing layer 160, the second printing layer 165, and the magnetic stripe overlay (MSO / L (Magnetic stripe Overlay), 170) are all laminated to form a form of a single card body.

[0103] Compared with plastics, the lamination process of the present invention can be processed at low temperature and low pressure, and the processing time is also shorter compared with that of plastic materials. As an embodiment, the lamination process time and heat treatment conditions such as temperature and pressure are determined based on the adhesive force, the thickness of the metal sheet, the degree of deformation of the processed layer, etc. For example, when the thickness of the metal sheet is relatively thick, the lamination temperature needs to be increased. And for the case where there is a processed layer composed of PVC, compared with the metal sheet, the possibility of shrinkage or relaxation is high. During the lamination process, the lamination time and temperature are determined based on the degree of deformation (shrinkage or relaxation) of PVC.

[0104] After that, the laminated sheet is processed by the first milling process to cut a depth of D1, so as to expose the COB pad receiving unit 205 of the upper inlay sheet corresponding to the COB pad 305 area (S103).

[0105] After that, through the second milling process, it corresponds to the COB chip receiving unit 220 corresponding to the COB chip 320 protruding from the back of the COB, and milling is performed at a depth of D2 corresponding to the depth of the metal layer 110 (S105).

[0106] It ensures the space for accommodating the area of the chip 320 protruding to the back part of the COB, and is used for the smoothing of the front part of the card. In order to insert the protruding unit at the back of the COB, at least a part of the first inlay layer 140, the first insulating layer 130 and the metal layer 110 is milled with a certain width. The milling width of the COB chip receiving unit 220 is smaller than the area of the COB pad 305, and the second milling process is performed on the internal area compared with the area of the first antenna 141.

[0107] And, through the third milling process, through the increased third milling process adjusted until a part of the first antenna 141 is exposed, a further depth of D3 is cut (S107).

[0108] The exposed first antenna 141 is electrically connected to the COB contact 310 to be inserted through the conductive elastic liquid in the subsequent steps. Therefore, preferably, it is exposed at a position adjacent to the COB contact 310.

[0109] After that, at a specified position corresponding to the COB contact 310 area, until the second antenna 142 is exposed, the fourth milling process of processing the through hole 230 with a depth of D4 is performed (S109).

[0110] Thus, the first antenna 141 of the first inlay layer 140 and the second antenna 142 of the second inlay layer 145 are both in an externally exposed state through the through hole.

[0111] When this processing is completed, when the COB contact 310 is inserted, the conductive elastic member liquid for adhesion fixation and conduction is dispensed to the through hole 230 and its upper part (S111).

[0112] To facilitate connection with the COB contact 310, the conductive elastic member liquid is dispensed onto the through hole 230 until it forms an arch that maintains a specified height.

[0113] Here, the conductive elastic member liquid is a conductive curing agent mixed with metal powder or an elastic polymer for flexible electronic materials. For example, it is a plasticizer containing at least one of silicon, polyurethane, fluoropolymer, styrene-butadiene, chloroprene, acrylonitrile copolymer, and acrylate rubber containing conductive fillers.

[0114] For this conductive elastic member liquid, like conductive silicone rubber, it has the property of hardening through a certain temperature or time. It is coated through the through hole 230 to electrically connect the first antenna 141 and the second antenna 142, and then a fixed and electrical connection channel for the embedded COB 300 is formed.

[0115] Here, the COB attaches a semiconductor for a smart card and is assembled into an information transmission and short-range wireless communication package.

[0116] Thereby, the process of installing the COB 300 is performed (S113). The COB pad 305 and the protruding unit of the chip 320 are properly embedded, and the arched part of the conductive elastic member liquid spreads and is properly coated between the first antenna 141 and the COB contact 310, thereby strengthening the electrical connection between the COB contact 310 and the first antenna 141.

[0117] After that, by forming the conductive layer 240 as the conductive elastic member liquid cures, even without an additional adhesive, the connection between the second antenna 142 at the lower end, the first antenna 141, and the COB contact 310 can be fixed. At this time, it is also possible to process so that an adhesive is applied to the back surface of the COB 300 and the milled area to fix the COB 300.

[0118] In addition, although not shown in the metal card 100 of the embodiment of the present invention, a primer, 3D printing, and coating processes are added to the main body. Additionally, a C-Cut process for trimming the card edge part, and a stamping process such as attaching a signature panel and a hologram to the back surface of the card are implemented.

[0119] Moreover, the sheet forming the metal card 100 of the present invention is not a sheet for manufacturing one card, but is composed of a large sheet including the size of multiple cards, so as to enable mass production, and can be produced into several cards through cutting after a lamination process. The cutting operation of the metal layer 110 utilizes processing materials, coolant, and cutting tools with the characteristics of the metal material.

[0120] Figure 14 A flowchart of a method for manufacturing a metal card for explaining another embodiment of the present invention.

[0121] Referring to Figure 14 , a processing layer insertion space is formed in the metal layer 110 by forming a perforated area (S201). The processing layer insertion space is used to insert the processing layer 105 of the PVC material, and is also called the PVC insertion space.

[0122] As an embodiment, the processing layer insertion space is formed by perforating the metal sheet. After the insertion space is formed, the PVC of the processing layer 115 is inserted into the insertion space.

[0123] After that, the above-mentioned Figure 13 through-hole processing and COB contact connection processing using a conductive elastic member liquid are performed on the laminated sheet with the processed PVC (S205). Thus, the situation where the through-hole processed in the processing layer 115 is connected to the metal layer 110 to cause a short circuit or electrical interference is prevented in advance.

[0124] For example, the metal layer 110 is perforated to insert the processing layer 115, and the perforation for the processing layer insertion space is formed by CNC (Computerized Numerical Control) operation processing. At this time, the processing layer 115 is fixed by using another adhesive or the like. After that, the first to fourth milling processes of the second CNC processing of the entire laminated body are performed. Only the processing layer 115 and the conductive layer 260 of the antenna coil are exposed and do not directly contact the metal layer 110. According to this processing technology, the antenna coil does not contact the metal material during processing.

[0125] In summary, the preferred embodiments of the present invention have been described, but the present invention is not limited by the above specific embodiments. Without departing from the gist of the present invention within the scope of the claims, those of ordinary skill in the technical field to which the present invention pertains can perform various deformation implementations, and such deformation implementations cannot be understood separately from the technical idea or prospect of the present invention.

Claims

1. A method for manufacturing a metal card, characterized in that: It includes the following steps: Laminating a stacked sheet with multiple sheets to form a metal card, wherein the multiple sheets include an adhesive sheet, an upper inlay sheet, and a lower inlay sheet. The adhesive sheet is centered on the metal sheet and has the same size as the metal sheet. A first antenna is formed on the upper inlay sheet; a second antenna is formed on the lower inlay sheet; The metal card is processed by computer numerical control operation, and a milling process is performed on a certain area to form a COB accommodation space, and a COB including a COB pad, a COB chip and a COB contact arranged on the COB pad is accommodated in the COB accommodation space; A through hole exposing the first antenna and the second antenna is formed in the COB accommodation space; Distribute a conductive elastic member liquid in the through hole and process to electrically connect the first antenna and the second antenna; and Insert the COB into the COB accommodation space to connect the first antenna and the second antenna to the COB contact through the conductive elastic member liquid, wherein the COB accommodation space is formed in the following manner: perform a first milling process to a depth of D1 in a manner that exposes the area of the upper inlay sheet corresponding to the COB board, and perform a second milling process to a depth of D2 on the area corresponding to the COB chip area, The step of forming the through hole includes the following steps: For COB contact connection, perform a third milling process adjusted until a part of the first antenna in the COB contact area is exposed, and cut to a depth of D3; Perform a fourth milling process on the area of the third milling process until the second antenna of the lower inlay sheet is exposed, so as to process to form the through hole.

2. The method for manufacturing a metal card according to claim 1, characterized in that: A PVC material processing layer insertion space is formed in the metal sheet by perforation, and the metal card is laminated in a state where the processing layer is inserted.

3. The method for manufacturing a metal card according to claim 2, characterized in that: The through hole passes through the processing layer and connects the COB contacts to avoid electrical interference with the metal sheet in advance.

4. The method for manufacturing a metal card according to claim 1, characterized in that: The conductive elastic member liquid is coated through the through hole, thereby electrically connecting the first antenna and the second antenna, and forming a fixing and electrical connection channel for the inlaid COB, and it includes: mixing at least one of a conductive curing agent containing metal powder, silicon, polyurethane, fluoropolymer, styrene-butadiene, chloroprene, acrylonitrile copolymer, and acrylate rubber containing a conductive filler.

5. The method for manufacturing a metal card according to claim 1, characterized in that: The metal sheet is a heat-treated SUS material in a manner to improve strength and resilience.

6. A metal card, characterized in that, Stack multiple layers and laminate them, wherein the multiple layers include: A metal layer of SUS material, heat-treated to improve strength and resilience; An upper inlay sheet, laminated on the upper part of the metal layer, and forming a first antenna; The lower inlay is laminated under the metal layer and forms a second antenna, and The adhesive layer is centered on the metal layer and has the same size as the metal layer; The metal card is processed by computer numerical control operation above to mill a certain area to form a COB accommodation space, and the COB accommodation space accommodates a COB including a COB pad, a COB chip provided on the COB pad, and a COB contact; A through hole exposing the first antenna and the second antenna is formed in the COB accommodation space; A conductive elastic member liquid is dispensed in the through hole, so that the first antenna and the second antenna are electrically connected; and The COB is inserted into the COB accommodation space to connect the first antenna and the second antenna to the COB contact through the conductive elastic member liquid, wherein, the COB accommodation space is formed in the following manner: the first milling process is performed at a depth of D1 in such a way as to expose the area of the upper inlay corresponding to the COB board, and the second milling process is performed at a depth of D2 in the area corresponding to the COB chip area, The through hole is formed in the following manner: For COB contact connection, the third milling process is adjusted until a part of the first antenna in the COB contact area is exposed, and then cut at a depth of D3, and the fourth milling process is performed on the area of the third milling process until the second antenna of the lower inlay is exposed, so as to process and form the through hole.

7. The metal card according to claim 6, wherein A processing layer insertion space for PVC material is formed in the metal layer through perforation, and the metal card is laminated in a state where the processing layer is inserted.

8. The metal card according to claim 7, wherein The through hole penetrates the processing layer and connects the COB contact, thereby avoiding electrical interference with the metal layer in advance.

9. The metal card according to claim 6, wherein The conductive elastic member liquid is coated through the through hole, thereby electrically connecting the first antenna and the second antenna, and forming a fixing and electrical connection channel for the inlaid COB, and includes: a conductive curing agent mixed with metal powder, and at least one of silicon, polyurethane, fluoropolymer, styrene-butadiene, chloroprene, acrylonitrile copolymer, and acrylate rubber containing a conductive filler.

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