An automatic loading and unloading mechanism for an electroplating fixture of a wafer-like product

Abstract

The present invention discloses an automatic loading and unloading mechanism for an electroplating fixture of a wafer-like product, which includes a Y-direction fixture socket, an electroplating fixture, an X-direction sliding assembly, a P-axis flipping drive assembly, a flipping support assembly, and a loading and unloading suction cup assembly; the electroplating fixture is inserted into the Y-direction fixture socket, and at least one side surface is provided with a material tank; the P-axis flipping drive assembly is located on the material tank side of the electroplating fixture and moves closer to or away from the electroplating fixture along the X-direction driven by the X-direction sliding assembly; the loading and unloading suction cup assembly is connected to the P-axis flipping drive assembly through the flipping support assembly, and when the P-axis flipping drive assembly drives the flipping support assembly to flip along the P-axis and move along the X-direction, it can drive the loading and unloading suction cup assembly to align with the material tank to complete the loading or unloading of the wafer-like product. The present invention can realize the automatic loading and unloading operation of the product, and the equipment operation and control are more flexible and efficient.

Description

Technical Field

[0001] The present invention relates to the technical field of automated equipment in the semiconductor industry, and more specifically, to an automatic loading and unloading mechanism for an electroplating fixture of wafer-like products. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. A conductive metal layer is electroplated on the wafer, and the conductive metal layer is processed to form conductive circuits. In the automated manufacturing process of the semiconductor industry, it is often necessary to turn the wafer up and down around its center. During the turning process, a high concentricity requirement is needed between the center of the wafer and the center of the rotating shaft, and there is also a high requirement for the accuracy of the turned angle. For example, the electroplating process is one of the key processes for fabricating these metal layers. In existing wafer electroplating equipment, especially in vertical wafer electroplating equipment, the loading and unloading operations of wafers are usually manual, resulting in low loading and unloading efficiency of wafers. At the same time, manual operations also affect the electroplating quality of wafers. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an automatic loading and unloading mechanism for an electroplating fixture of wafer-like products, which can automatically load and unload the material tank on the electroplating fixture.

[0004] To achieve the above purpose, the solution of the present invention is:

[0005] An automatic loading and unloading mechanism for an electroplating fixture of wafer-like products includes a Y-direction fixture socket, an electroplating fixture, an X-direction sliding component, a P-axis turning drive component, a turning support component, and a loading and unloading suction cup component;

[0006] The Y-direction fixture socket is arranged along the Y direction, the electroplating fixture is inserted into the Y-direction fixture socket, and at least one side surface is provided with a material tank; the X-direction sliding component is fixed along the X direction at the bottom of the Y-direction fixture socket; the P-axis turning drive component is located on the material tank side of the electroplating fixture and is driven by the X-direction sliding component to approach or move away from the electroplating fixture along the X direction; the loading and unloading suction cup component is connected to the P-axis turning drive component through the turning support component, and when the P-axis turning drive component drives the turning support component to turn along the P axis and move along the X direction, it can drive the loading and unloading suction cup component to align with the material tank to complete the loading or unloading of wafer-like products; wherein, the X direction is perpendicular to the Y direction, and the P axis is parallel to the Y direction.

[0007] Further, the Y-direction fixture socket includes a bottom frame, two side frames, a slot top cover, and a water accumulation tray; the bottom frame is provided with mounting holes; the two side frames are erected at both ends of the bottom frame, and guiding rollers are provided on the inner side surfaces; both ends of the slot top cover are connected to the tops of the side frames, and a slot is opened, and the size and shape of the slot are adapted to the size and shape of the electroplating fixture; the water accumulation tray is arranged above the bottom frame.

[0008] Further, the electroplating fixture includes a fixture body, a snap lock slot, guide bars, and an RFID; the snap lock slot is arranged on the front and / or back of the fixture body, and is distributed in a circular ring shape and can be cooperatively locked with the wafer fixture, and a material slot is formed in the middle position; the guide bars are arranged on both side surfaces of the fixture body, and the RFID is arranged on both sides of the top of the fixture body.

[0009] Further, the wafer fixture includes a fixture body, a snap lock, and a wafer empty slot; the fixture body is a ring structure, and a wafer empty slot is formed in the inner circle; the snap locks are distributed on the fixture body and can be cooperatively locked with the snap lock slots when rotated by a certain angle.

[0010] Further, the P-axis flipping drive assembly further includes a slide table, a fixed frame, a motor fixing plate, a lead screw motor, a floating plate, and guide columns; the slide table is connected to the X-direction sliding assembly and can slide along the X direction under the drive of the X-direction sliding assembly; the fixed frame is fixed on the slide table, and a P-direction flipping shaft is provided at the top; the motor fixing plate is fixedly connected to the fixed frame, the lead screw motor is arranged on the bottom surface of the motor fixing plate from bottom to top, and the floating plate is provided with a lead screw mating hole, a guide column hole, and a link pivot shaft, and is connected to the lead screw of the lead screw motor through the lead screw mating hole.

[0011] Further, the flipping support assembly further includes a support frame, a flipping drive link, a bearing pressure plate, a P-axis connecting piece, a rotating bearing, a W rotating shaft, a linear motor, and a pushing block; the support frame is used for supporting the bearing pressure plate; the bearing pressure plate is further connected to the P-direction flipping shaft through the P-axis connecting piece; both ends of the flipping drive link are respectively connected to the link pivot shaft and the support frame; the W rotating shaft is connected to the bearing pressure plate through the rotating bearing and is used for connecting the loading and unloading suction cup assembly; the linear motor is arranged on the bearing pressure plate and is connected to the pushing block; the pushing block is provided with a bearing push hole.

[0012] Further, the loading and unloading suction cup assembly further includes a rotating plate, an airbag, a Bernoulli suction cup body, a fixture suction cup, a material suction cup, a spring connector, a tracheal joint, a rotating support rod and a bearing; the rotating plate is sleeved on the W rotating shaft, the Bernoulli suction cup body is pressed on the rotating plate through the airbag, the fixture suction cup and the material suction cup are arranged on the Bernoulli suction cup body, and the material suction cup is located inside the fixture suction cup and connected to the tracheal joint; a plurality of through holes are annularly distributed on the fixture suction cup, and a plurality of through holes are distributed on the material suction cup; the number of the spring connectors is multiple, which are distributed on the lower surface of the material suction cup and the bottom ends are connected to the rotating plate; the upper end of the rotating support rod is connected to the edge of the Bernoulli suction cup body, and the lower end is connected to the bearing, and the bearing is inserted into the bearing push hole. The loading and unloading suction cup assembly uses the Bernoulli principle to suck the wafer fixture and the wafer material, and under the action of the airbag, it is lifted onto the electroplating fixture or separated from the electroplating fixture. The flipping support assembly drives the Bernoulli suction cup assembly to rotate a certain small angle around the W rotating shaft, so as to realize the installation and disassembly actions of the wafer fixture and the wafer material with the electroplating fixture, replacing the complex operation of manually loading and unloading the original electroplating fixture.

[0013] Further, the X-direction sliding assembly includes an X-direction linear slide rail and an X-direction screw motor. Both the X-direction linear slide rail and the X-direction screw motor are passed through the mounting holes of the bottom frame, and the X-direction screw motor is connected to and drives the slide table to slide on the X-direction linear slide rail.

[0014] Further, an R-axis rotation assembly is further included. The Y-direction fixture socket is arranged on the R-axis rotation assembly and can rotate 180 degrees around the R axis. Among them, the R axis is perpendicular to the X direction and the Y direction respectively;

[0015] Both the front and back sides of the electroplating fixture have a material groove; the P-axis flipping drive assembly includes a first P-axis flipping drive assembly and a second P-axis flipping drive assembly; the flipping support assembly includes a first flipping support assembly and a second flipping support assembly; the loading and unloading suction cup assembly includes a first loading and unloading suction cup assembly and a second loading and unloading suction cup assembly;

[0016] The first P-axis flipping drive assembly and the second P-axis flipping drive assembly are symmetrically arranged on the front and back sides of the electroplating fixture respectively; the first loading and unloading suction cup assembly is arranged on the first P-axis flipping drive assembly through the first flipping support assembly, and the second loading and unloading suction cup assembly is arranged on the second P-axis flipping drive assembly through the second flipping support assembly. When the first P-axis flipping drive assembly drives the first flipping support assembly to flip along the P-axis and slide along the X-axis, it can drive the first loading and unloading suction cup assembly to align with the material tank to complete the loading or unloading of wafer-like products; when the second P-axis flipping drive assembly drives the second flipping support assembly to flip along the P-axis and slide along the X-axis, it can drive the second loading and unloading suction cup assembly to align with the material tank to complete the loading or unloading of wafer-like products.

[0017] Further, the R-axis rotation assembly further includes a rotation motor module and an R-axis rotary base. The rotation motor module is connected to the R-axis rotary base and can drive the R-axis rotary base to rotate around the R-axis. The R-axis rotary base is used to carry the Y-direction fixture socket. Here, the R-axis is perpendicular to the X-axis and the Y-axis respectively.

[0018] After adopting the above scheme, the automatic loading and unloading equipment of the present invention has the following beneficial effects:

[0019] The automatic loading and unloading mechanism of the present invention includes a Y-direction fixture socket, an electroplating fixture, an X-axis sliding assembly, a P-axis flipping drive assembly, a flipping support assembly, and a loading and unloading suction cup assembly; the electroplating fixture is inserted into the Y-direction fixture socket; a P-axis flipping drive assembly is arranged beside it. The P-axis flipping drive assembly is connected to the Y-direction fixture socket through the X-axis sliding assembly, and can move closer to or away from the electroplating fixture along the X-axis under the drive of the X-axis sliding assembly; the loading and unloading suction cup assembly is connected to the P-axis flipping drive assembly through the flipping support assembly, so that when the P-axis flipping drive assembly drives the flipping support assembly to flip along the P-axis and move along the X-axis, it can drive the loading and unloading suction cup assembly to align with the material tank of the electroplating fixture to complete the loading or unloading of wafer-like products, thereby realizing automatic loading and unloading. The operation and control of the equipment are more flexible, with high efficiency. When equipped with an electroplating fixture with a double-sided material tank, the P-axis flipping drive assembly, the flipping support assembly, and the loading and unloading suction cup assembly of the present invention each further include two, which are respectively arranged on the double-sided material tank side of the electroplating fixture, and can also realize double-sided station loading and unloading of the electroplating fixture, with high efficiency. Description of the Drawings

[0020] Figure 1 It is a three-dimensional view of the automatic loading and unloading mechanism of the present invention.

[0021] Figure 2 It is a front view of the automatic loading and unloading mechanism of the present invention.

[0022] Figure 3This is the left side view of the automatic loading and unloading mechanism of the present invention.

[0023] Figure 4 This is the perspective view of the Y-direction fixture socket, X-direction sliding component and R-axis rotating component of the present invention.

[0024] Figure 5 This is the perspective view of the electroplating fixture of the present invention.

[0025] Figure 6 This is the perspective view of the wafer fixture of the present invention.

[0026] Figure 7 This is the perspective view of the assembled state of the P-axis flipping drive component, flipping support component and loading and unloading suction cup component of the present invention.

[0027] Figure 8 It is Figure 7 front view.

[0028] Figure 9 It is Figure 8 schematic diagram of the P-axis flipping drive component in the flipping state in

[0029] Figure 10 This is the perspective view of the P-axis flipping drive component of the present invention.

[0030] Figure 11 This is the perspective view of the flipping support component of the present invention.

[0031] Figure 12 This is the perspective view of the loading and unloading suction cup component of the present invention.

[0032] Figure 13 This is the exploded schematic diagram of the loading and unloading suction cup component of the present invention.

[0033] Figure 14 This is the usage state diagram of the automatic loading and unloading mechanism of the present invention. Detailed Description of the Invention

[0034] In order to further explain the technical solution of the present invention, the present invention will be elaborated in detail below through specific embodiments.

[0035] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "X", "Y", "Z", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0036] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0037] In the present invention, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0039] In the description of this specification, descriptions with reference to terms such as "an embodiment", "some embodiments", "an example", "a specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0040] As Figures 1 to 13 shown, an automatic loading and unloading mechanism 100 for an electroplating fixture of a wafer-like product includes a Y-direction fixture socket 1, an electroplating fixture 2, an X-direction sliding assembly 3, a P-axis flipping drive assembly 4, a flipping support assembly 5, and a loading and unloading suction cup assembly 6;

[0041] The Y-direction fixture socket 1 is arranged in the Y direction. The electroplating fixture 2 is inserted on the Y-direction fixture socket 1, and at least one side surface is provided with a material tank 21. The X-direction sliding component 3 is fixed to the bottom of the Y-direction fixture socket 1 in the X direction. The P-axis flipping drive component 4 is located on the material tank side of the electroplating fixture 2 and moves close to or away from the electroplating fixture 2 in the X direction driven by the X-direction sliding component 3. The loading and unloading suction cup component 6 is connected to the P-axis flipping drive component 4 through the flipping support component 5. When the P-axis flipping drive component 4 drives the flipping support component 5 to flip along the P axis and move along the X direction, it can drive the loading and unloading suction cup component 6 to align with the material tank 21 to complete the loading or unloading of wafer-like products. Wherein, the X direction is perpendicular to the Y direction, and the P axis is parallel to the Y direction.

[0042] As a more optimal or more specific implementation manner of this embodiment:

[0043] Mainly as Figure 4 shown, the Y-direction fixture socket 1 includes a bottom frame 11, two side frames 12, a slot top cover 13 and a water collecting tray 14. The bottom frame 11 is provided with mounting holes 112. The two side frames 12 are erected at both ends of the bottom frame 11, and the inner side surfaces are provided with guiding rollers 15. The two ends of the slot top cover 13 are connected to the tops of the side frames 12 and are provided with a slot 132. The size and shape of the slot 132 are adapted to the size and shape of the electroplating fixture 2, and the electroplating fixture 2 can be smoothly inserted into the slot 132. When inserted, the guiding rollers 15 on the two side frames 12 have the functions of guiding and reducing friction. The water collecting tray 14 is arranged above the bottom frame 11 to collect the liquid dripped from the electroplating fixture 2. The water collecting tray 14 can be connected to a drain pipe to lead out the collected liquid to prevent equipment damage.

[0044] Mainly as Figure 5 shown, the electroplating fixture 2 includes a fixture body 22, a snap lock slot 23, guide bars 24 and an RFID 25. The snap lock slot 23 is arranged on the front and / or back of the fixture body 22 and is distributed in a circular ring shape and can be locked with the wafer fixture 7. The material tank 21 is formed at the middle position. The guide bars 24 are arranged on both side surfaces of the fixture body 22 and can be inserted into the slot 132 under the guidance of the guiding rollers 15. The RFID 25 is arranged on both sides of the top of the fixture body 22 and is used for recording the identity information of the electroplating fixture 2, etc.

[0045] Mainly as Figure 6As shown, the wafer fixture 7 is used to carry wafer materials, including a fixture body 71, a fastening lock 72 and a wafer vacant slot 73. The fixture body 71 is an annular structure, and the inner circle forms the wafer vacant slot 73. The fastening lock 72 is distributed on the fixture body 71, and can be locked with the fastening lock slot 23 on the electroplating hanger 2 when rotated to a certain angle, thereby ensuring that the wafer material does not fall after loading, and then disengage from the fastening lock slot 23 on the electroplating hanger 2 when reversed to a certain angle, so that the material can be unloaded smoothly.

[0046] Mainly as Figures 7 to 10 As shown, the P-axis flipping drive assembly 4 further includes a slide 41, a fixed frame 42, a motor fixed plate 43, a screw motor 44, a floating plate 45 and a guide column 46; the slide 41 is connected to the X-direction sliding assembly 3, and can slide along the X-direction driven by the X-direction sliding assembly 3; the fixed frame 42 is fixed on the slide 41, and a P-direction flipping shaft 422 is provided on the top; the motor fixed plate 43 is fixedly connected to the fixed frame 42, and the screw motor 44 is arranged on the bottom surface of the motor fixed plate 43 from bottom to top, and the floating plate 45 is provided with a screw matching hole 451, a guide column hole 452 and a connecting rod pivot 453, and is matched and connected with the screw 441 of the screw motor 44 through the screw matching hole 451.

[0047] Mainly as Figure 11 As shown, the flip support assembly 5 further includes a support frame 51, a flip drive connecting rod 52, a bearing pressure plate 53, a P-axis connecting piece 54, a rotating bearing 55, a W rotating shaft 56, a linear motor 57 and a pushing block 58; the support frame 51 is used to support the bearing pressure plate 53; the bearing pressure plate 53 is also connected to the P-direction flip shaft 422 through the P-axis connecting piece 54, and the two ends of the flip drive connecting rod 52 are respectively connected to the connecting rod pivot 453 and the support frame 51; the W rotating shaft 56 is connected to the bearing pressure plate 53 through the rotating bearing 55, and is used to connect the loading and unloading suction cup assembly 6; the linear motor 57 is arranged on the bearing pressure plate 53 and connected to the pushing block 58; the pushing block 58 is provided with a bearing push hole 582.

[0048] Mainly as Figures 12 to 13As shown in the figure, the loading and unloading suction cup assembly 6 further includes a rotating plate 61, an airbag 62, a Bernoulli suction cup body 63, a fixture suction cup 64, a material suction cup 65, a spring connector 66, a tracheal joint 67, a rotating support rod 68 and a bearing 69; the rotating plate 61 is sleeved on the W rotating shaft 56, the Bernoulli suction cup body 63 is pressed on the rotating plate 61 through the airbag 62, the fixture suction cup 64 and the material suction cup 65 are arranged on the Bernoulli suction cup body 63, and the material suction cup 65 is located inside the fixture suction cup 64 and connected to the tracheal joint 67; a plurality of through holes are annularly distributed on the fixture suction cup 64, and a plurality of through holes are distributed on the material suction cup 65; the number of the spring connectors 66 is multiple, which are distributed on the lower surface of the material suction cup 65 and the bottom ends are connected to the rotating plate 61; the upper end of the rotating support rod 68 is connected to the edge of the Bernoulli suction cup body 63, the lower end is connected to the bearing 69, and the bearing 69 is inserted into the bearing push hole 582. According to Bernoulli's principle, when compressed air is connected to the tracheal joint 67 of the loading and unloading suction cup assembly 6, the through holes of the suction cups (including the fixture suction cup 64 and the material suction cup 65) will generate a uniform and thin strong air flow on the working surface. At this time, the gas flow rate between the workpiece (including the wafer fixture and the wafer material) placed on the suction cup and the suction cup is greater than the gas flow rate above the workpiece. Using the principle that the faster the Bernoulli fluid velocity, the smaller the pressure, a pressure difference will be generated between the upper and lower sides of the workpiece, so that the workpiece is adsorbed on the top of the suction cup. The loading and unloading suction cup assembly 6 uses Bernoulli's principle to hold the wafer fixture 7 and the wafer material, and under the action of the airbag 62, it is lifted onto the electroplating fixture 2 or separated from the electroplating fixture 2. The flipping support assembly 5 drives the loading and unloading suction cup assembly 6 to rotate a certain small angle around the W rotating shaft 56, realizing the installation and disassembly actions of the wafer fixture 7 and the wafer material with the electroplating fixture 2, replacing the complex operation of manually loading and unloading the original electroplating fixture 2.

[0049] Further, the X-direction sliding assembly 3 includes an X-direction linear slide rail 31 and an X-direction screw motor 32. The X-direction linear slide rail 31 and the X-direction screw motor 32 are both inserted into the mounting holes of the bottom frame 11, and the screw 322 of the X-direction screw motor 32 is connected to and drives the slide table 41 to slide on the X-direction linear slide rail 31.

[0050] Mainly as Figure 3 As shown in the figure, both the front and back sides of the electroplating fixture 2 have a material groove 21; the P-axis flipping drive assembly 4 includes a first P-axis flipping drive assembly and a second P-axis flipping drive assembly; the flipping support assembly 5 includes a first flipping support assembly and a second flipping support assembly; the loading and unloading suction cup assembly 6 includes a first loading and unloading suction cup assembly and a second loading and unloading suction cup assembly;

[0051] The first P-axis flipping drive assembly and the second P-axis flipping drive assembly are symmetrically arranged on the front and back sides of the electroplating fixture 2 respectively; the first loading and unloading suction cup assembly is arranged on the first P-axis flipping drive assembly through the first flipping support assembly, and the second loading and unloading suction cup assembly is arranged on the second P-axis flipping drive assembly through the second flipping support assembly. When the first P-axis flipping drive assembly drives the first flipping support assembly to flip along the P-axis and slide along the X-axis, it can drive the first loading and unloading suction cup assembly to align with the material tank to complete the loading or unloading of wafer-like products; when the second P-axis flipping drive assembly drives the second flipping support assembly to flip along the P-axis and slide along the X-axis, it can drive the second loading and unloading suction cup assembly to align with the material tank to complete the loading or unloading of wafer-like products.

[0052] It further includes an R-axis rotation assembly 8. The Y-direction fixture socket 1 is arranged on the R-axis rotation assembly 8 and can rotate 180 degrees around the R-axis. Here, the R-axis is perpendicular to the X-axis and the Y-axis respectively; the Y-direction fixture socket 1 is arranged on the R-axis rotation assembly and can rotate 180 degrees around the R-axis. It can rotate 180 degrees in both positive and negative directions, or rotate 180 degrees intermittently in the same direction. The R-axis rotation assembly 8 further includes a rotation motor module 81 and an R-axis rotary base 82. The rotation motor module 81 is connected to the R-axis rotary base 82 and can drive the R-axis rotary base 82 to rotate around the R-axis. The R-axis rotary base 82 is used to carry the Y-direction fixture socket 1, where the R-axis is perpendicular to the X-axis and the Y-axis respectively.

[0053] Combined Figures 1 to 14 As shown, taking the loading and unloading of wafer electroplating as an example, the working principle and process of the present invention are as follows:

[0054] (For the convenience of description, hereinafter, the assembly state of the first P-axis flipping drive assembly, the first flipping support assembly, and the first loading and unloading suction cup assembly is denoted as unit A, and the assembly state of the second flipping support assembly, the second flipping support assembly, and the second loading and unloading suction cup assembly is denoted as unit B. The compositions of unit A and unit B are exactly the same. Therefore, each component in unit A and unit B is still described with the same reference numerals.)

[0055] First, the process of loading the material tank 21 on the front side of the electroplating fixture 2 by unit A is described:

[0056] 1. When the flipping manipulator 300 rotates the wafer onto the material suction cup 65 of the loading and unloading suction cup assembly 6 in unit A, the outer ring of the wafer 200 is sleeved on the wafer fixture 7, and the flipping manipulator 300 resets;

[0057] 2. The fixture suction cup 64 of the loading and unloading suction cup assembly 6 sucks the wafer fixture 7, and the material suction cup 65 sucks the wafer;

[0058] 3. The lead screw motor 44 of the P-axis flipping drive assembly 4 drives the floating plate 45 to rise, driving the flipping drive connecting rod 52 upward, causing the flipping support assembly 5 and the loading and unloading suction cup assembly 6 thereon to flip 90 degrees around the P-axis flipping shaft 422 towards the electroplating fixture 2, as Figure 9 shown;

[0059] 4. The X-axis lead screw motor 32 of the X-axis sliding assembly 3 drives the P-axis flipping drive assembly 4 to move along the direction of the X-axis linear slide rail 31 to a preset position and lean towards the front of the electroplating fixture 2;

[0060] 5. The airbag 62 of the loading and unloading suction cup assembly 6 inflates, pushing the wafer fixture 7 against the electroplating fixture 2, and the buckle locks 72 of the wafer fixture 7 are respectively inserted into the corresponding buckle lock slots 23 of the electroplating fixture 2;

[0061] 6. The linear motor 57 of the flipping support assembly 5 drives the push block 58 to drive the bearing 69 and the rotating support rod 68 of the loading and unloading suction cup assembly 6 to move, causing the loading and unloading suction cup assembly 6 to rotate a certain distance around the W rotation axis 56, buckling the wafer fixture 7 onto the electroplating fixture 2, and at the same time loading the wafer 200 onto the electroplating fixture 2;

[0062] 7. The loading and unloading suction cup assembly 6 stops working, the airbag 62 stops inflating, and under the rebounding action of the spring connector 66, the fixture suction cup 64 is separated from the wafer fixture 7, and the material suction cup 65 is separated from the wafer 200. The flipping support assembly 5 drives the loading and unloading suction cup assembly 6 to rotate and reset around the W rotation axis 56;

[0063] 8. The rotary motor module 81 of the R-axis rotation assembly 8 drives the R-axis rotary base 82 to rotate 180° around the R axis.

[0064] At this time, the positions of the A unit and the B unit are swapped, and the flipping manipulator 300 delivers materials to the B unit. After the B unit receives the materials delivered by the flipping manipulator 300, it feeds the back material groove 21 of the electroplating fixture 2. The specific process is the same as the process of the A unit feeding the front material groove 21 of the electroplating fixture 2 and will not be elaborated. After the back material groove 21 of the electroplating fixture 2 is loaded, the rotary motor module 81 of the R-axis rotation assembly 8 drives the R-axis rotary base 82 to rotate 180° around the R axis to return the electroplating fixture 2 to its original position. (Note: The two sides of the electroplating fixture are not completely the same, one side has RFID and the other side does not.)

[0065] When both material grooves 21 of the electroplating fixture 2 are loaded, the overhead crane of the electroplating equipment clamps away the electroplating fixture 2; the following describes the unloading process:

[0066] 1. The overhead crane of the electroplating equipment inserts the electroplating fixture 2 with the electroplated wafers into the Y-axis fixture socket 1;

[0067] 2. First, the A unit feeds the front material tank 21 of the electroplating fixture 2. The loading and unloading suction cup assembly 6 is activated, the airbag 62 inflates, and the fixture suction cup 64 and the material suction cup 65 act simultaneously. The fixture suction cup 64 holds the wafer fixture 7, and the material suction cup 65 holds the wafer 200.

[0068] 3. The linear motor 57 of the flipping and supporting assembly 5 drives the pushing block 58 to drive the bearing 69 and the rotating rod 68 of the loading and unloading suction cup assembly 6 to move, so that the loading and unloading suction cup assembly 6 rotates a certain distance around the W rotation axis 56, and separates the wafer fixture 7 from the electroplating fixture 2.

[0069] 4. The airbag 62 of the loading and unloading suction cup assembly 6 stops inflating. Under the rebounding action of the spring connector 66, the fixture suction cup 64 holds the wafer fixture 7, and the material suction cup 65 holds the wafer and separates from the electroplating fixture 2. The flipping and supporting assembly 5 drives the loading and unloading suction cup assembly 6 to rotate and reset around the rotating W axis.

[0070] 5. The X-direction screw motor 32 of the R-axis rotation assembly 8 drives the P-axis flipping drive assembly 4 to retreat to the initial position along the X-direction linear slide rail 31.

[0071] 6. The screw motor 44 of the P-axis flipping drive assembly 4 drives the floating plate 45 to descend, driving the flipping drive link 52 to pull back, so that the loading and unloading suction cup assembly 6 flips 90 degrees and returns to its position around the P-direction flipping axis 422.

[0072] 7. Then, the flipped manipulator 300 takes away the electroplated wafer 200.

[0073] At this time, the positions of the A unit and the B unit are swapped, and the B unit feeds the back material tank 21 of the electroplating fixture 2. The specific process is the same as the process of the A unit feeding the back material tank 21 of the electroplating fixture 2, and will not be elaborated here.

[0074] After adopting the above scheme, the automatic loading and unloading equipment of the present invention has the following beneficial effects:

[0075] The automatic loading and unloading mechanism of the present invention includes a Y-direction hanger socket, an electroplating hanger, an X-direction sliding component, a P-axis flipping drive component, a flipping support component, and a loading and unloading suction cup component; the electroplating hanger is inserted into the Y-direction hanger socket; a P-axis flipping drive component is arranged on the side, and the P-axis flipping drive component is connected to the Y-direction hanger socket through the X-direction sliding component, so that it can move closer to or away from the electroplating hanger along the X-direction under the drive of the X-direction sliding component; the loading and unloading suction cup component is connected to the P-axis flipping drive component through the flipping support component, so that when the P-axis flipping drive component drives the flipping support component to flip along the P-axis and move along the X-direction, it can drive the loading and unloading suction cup component to align with the material slot of the electroplating hanger to complete the loading or unloading of wafer-like products, thereby realizing automatic loading and unloading, and the operation and control of the equipment are more flexible and efficient. When equipped with an electroplating hanger with double-sided material slots, the P-axis flipping drive component, the flipping support component, and the loading and unloading suction cup component of the present invention each further include two, which are respectively arranged on the double-sided material slot side of the electroplating hanger, and can also realize the double-sided station loading and unloading of the electroplating hanger, with high efficiency.

[0076] The above embodiments and drawings do not limit the product form and style of the present invention. Any appropriate changes or modifications made by those of ordinary skill in the art shall be regarded as not departing from the patent scope of the present invention.

Claims

1. An automatic loading and unloading mechanism for an electroplating fixture of a wafer-like product, characterized in that: it includes a Y-direction fixture socket, an electroplating fixture, an X-direction sliding component, a P-axis flipping drive component, a flipping support component, and a loading and unloading suction cup component; the Y-direction fixture socket is arranged along the Y direction, the electroplating fixture is inserted on the Y-direction fixture socket, and at least one side surface is provided with a material groove; the X-direction sliding component is fixed to the bottom of the Y-direction fixture socket along the X direction; the P-axis flipping drive component is located on the material groove side of the electroplating fixture and can move closer to or away from the electroplating fixture along the X direction driven by the X-direction sliding component; the loading and unloading suction cup component is connected to the P-axis flipping drive component through the flipping support component, and when the P-axis flipping drive component drives the flipping support component to flip along the P axis and move along the X direction, it can drive the loading and unloading suction cup component to align with the material groove to complete the loading or unloading of the wafer-like product; wherein, the X direction is perpendicular to the Y direction, and the P axis is parallel to the Y direction; the Y-direction fixture socket includes a bottom frame, two side frames, a slot top cover, and a water accumulation tray; the bottom frame is provided with mounting holes; the two side frames are erected at both ends of the bottom frame, and the inner side surfaces are provided with guiding rollers; both ends of the slot top cover are connected to the top ends of the side frames and are provided with a slot, and the size and shape of the slot are adapted to the size and shape of the electroplating fixture; the water accumulation tray is arranged above the bottom frame; the P-axis flipping drive component further includes a slide table, a fixed frame, a motor fixing plate, a lead screw motor, a floating plate, and a guide post; the slide table is connected to the X-direction sliding component and can slide along the X direction driven by the X-direction sliding component; the fixed frame is fixed to the slide table, and a P-direction flipping shaft is provided at the top; the motor fixing plate is fixedly connected to the fixed frame, the lead screw motor is arranged on the bottom surface of the motor fixing plate from bottom to top, and the floating plate is provided with a lead screw mating hole, a guide post hole, and a connecting rod pivot shaft and is connected to the lead screw of the lead screw motor through the lead screw mating hole; the X-direction sliding component includes an X-direction linear slide rail and an X-direction lead screw motor, both the X-direction linear slide rail and the X-direction lead screw motor are inserted into the mounting holes of the bottom frame, and the X-direction lead screw motor is connected to and drives the slide table to slide on the X-direction linear slide rail.

2. An automatic loading and unloading mechanism for an electroplating fixture of a wafer-like product as described in claim 1, characterized in that: the electroplating fixture includes a fixture body, a snap-lock slot, guide bars, and RFID; the snap-lock slot is arranged on the front and / or back of the fixture body and is distributed in a circular ring shape and can be locked with a wafer jig, and a material groove is formed in the middle position; the guide bars are arranged on both side surfaces of the fixture body, and the RFID is arranged on both sides of the top of the fixture body.

3. An automatic loading and unloading mechanism for an electroplating fixture of a wafer-like product as described in claim 2, characterized in that: The wafer fixture includes a fixture body, a snap lock, and a wafer empty slot. The fixture body is of an annular structure, and the inner circle forms the wafer empty slot. The snap locks are distributed on the fixture body and can be locked in cooperation with the snap lock card slots when rotated by a certain angle.

4. The automatic loading and unloading mechanism for an electroplating hanger of wafer products according to claim 3, characterized in that: The flipping support assembly further includes a support frame, a flipping drive link, a bearing pressing plate, a P-axis connecting piece, a rotating bearing, a W rotating shaft, a linear motor, and a pushing block; the support frame is used to support the bearing pressing plate; the bearing pressing plate is also connected to the P-axis flipping shaft through the P-axis connecting piece, and the two ends of the flipping drive link are respectively connected to the link pivot and the support frame; the W rotating shaft is connected to the bearing pressing plate through the rotating bearing and is used to connect the loading and unloading suction cup assembly; the linear motor is arranged on the bearing pressing plate and connected to the pushing block; a bearing push hole is provided on the pushing block.

5. The automatic loading and unloading mechanism for an electroplating hanger of wafer products according to claim 4, characterized in that: The loading and unloading suction cup assembly further includes a rotating plate, an airbag, a Bernoulli suction cup body, a fixture suction cup, a material suction cup, a spring connecting piece, a tracheal joint, a rotating support rod, and a bearing; the rotating plate is sleeved on the W rotating shaft, the Bernoulli suction cup body is pressed on the rotating plate through the airbag, the fixture suction cup and the material suction cup are arranged on the Bernoulli suction cup body, and the material suction cup is located inside the fixture suction cup and connected to the tracheal joint; a plurality of through holes are annularly distributed on the fixture suction cup, and a plurality of through holes are distributed on the material suction cup; the number of the spring connecting pieces is multiple, distributed on the lower surface of the material suction cup, and the bottom ends are connected to the rotating plate; the upper end of the rotating support rod is connected to the edge of the Bernoulli suction cup body, and the lower end is connected to the bearing, and the bearing is inserted into the bearing push hole.

6. The automatic loading and unloading mechanism for an electroplating hanger of wafer products according to any one of claims 1 to 5, characterized in that: It further includes an R-axis rotating assembly, and the Y-axis hanger socket is arranged on the R-axis rotating assembly and can rotate 180 degrees around the R axis, wherein the R axis is perpendicular to the X axis and the Y axis respectively; Both the front and back sides of the electroplating hanger have a material slot; the P-axis flipping drive assembly includes a first P-axis flipping drive assembly and a second P-axis flipping drive assembly; the flipping support assembly includes a first flipping support assembly and a second flipping support assembly; the loading and unloading suction cup assembly includes a first loading and unloading suction cup assembly and a second loading and unloading suction cup assembly. The first P-axis flipping drive assembly and the second P-axis flipping drive assembly are respectively symmetrically arranged on the front and back sides of the electroplating fixture; the first loading and unloading suction cup assembly is arranged on the first P-axis flipping drive assembly through the first flipping support assembly, and the second loading and unloading suction cup assembly is arranged on the second P-axis flipping drive assembly through the second flipping support assembly. Moreover, when the first P-axis flipping drive assembly drives the first flipping support assembly to flip along the P-axis and slide along the X-axis, it can drive the first loading and unloading suction cup assembly to align with the material tank to complete the loading or unloading of wafer-like products; when the second P-axis flipping drive assembly drives the second flipping support assembly to flip along the P-axis and slide along the X-axis, it can drive the second loading and unloading suction cup assembly to align with the material tank to complete the loading or unloading of wafer-like products.

7. An automatic loading and unloading mechanism for an electroplating fixture for wafer-like products according to claim 6, characterized in that: The R-axis rotation assembly further includes a rotation motor module and an R-axis rotary base. The rotation motor module is connected to the R-axis rotary base and can drive the R-axis rotary base to rotate around the R-axis. The R-axis rotary base is used to carry the Y-axis fixture socket, wherein the R-axis is perpendicular to the X-axis and the Y-axis respectively.

Images