Device and method for automated wafer carrier handling

Abstract

An apparatus and method for operating an automated wafer carrier handling are provided. The apparatus includes a base frame and an engagement mechanism disposed on the base frame. The engagement mechanism includes a controller and an active extension assembly, the active extension assembly being movably coupled to the base frame and controlled by the controller to reciprocate relative to the base frame. The active extension assembly is driven by the controller through the base frame to engage with a top flange mounted on a wafer carrier.

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor device and method, and more particularly, to a device and method for automated wafer carrier handling. Background Art

[0002] A typical semiconductor manufacturing facility includes a plurality of processing areas, including semiconductor processing tools and wafer staging equipment. Each processing area may include a stocker that temporarily holds a plurality of wafer carriers or prepares to transport the wafer carriers to the loading port of the semiconductor processing tool. Several semiconductor wafers are usually stored in a wafer carrier (e.g., a wafer box (pod)), and the wafer carrier is used to move the semiconductor wafer to different semiconductor processing tools throughout the manufacturing facility. Traditionally, the wafer carrier is transported to the semiconductor processing tool and / or loaded onto the loading port by an operator. In modern manufacturing facilities, it is emphasized to limit the presence of operators in the processing area and to improve the efficiency of semiconductor manufacturing. Therefore, a manufacturing facility that can automatically load wafer carriers into the loading port in any orientation and unload wafer carriers from the loading port to minimize labor requirements and improve manufacturing efficiency is needed. Summary of the invention

[0003] According to some embodiments, an apparatus for automated wafer carrier handling is provided, the apparatus being adapted to transport a wafer carrier. The apparatus comprises a base frame and an engagement mechanism disposed on the base frame. The engagement mechanism comprises a controller and an active extension assembly, the active extension assembly being movably coupled to the base frame and controlled by the controller to reciprocate relative to the base frame. The active extension assembly is driven by the controller through the base frame to engage with a top flange mounted on the wafer carrier.

[0004] According to some alternative embodiments, an operating method for automated wafer carrier handling includes at least the following steps: bringing a base frame and an engagement mechanism of an automated wafer carrier handling device into abutment contact with a top flange mounted on a wafer carrier to restrict at least one degree of freedom of movement of the top flange, wherein the engagement mechanism is disposed on the base frame. The automated wafer carrier handling device transports the wafer carrier to a destination location. The top flange mounted on the wafer carrier is released from the automated wafer carrier handling device at the destination location.

[0005] According to some alternative embodiments, an operating method for automated wafer carrier handling includes at least the following steps: moving a base frame of an apparatus in a gap between a top flange and a wafer carrier to contact the top flange, wherein the top flange is mounted on the wafer carrier; lowering an active expansion assembly of the apparatus to engage with a hole of the top flange, wherein the active expansion assembly is disposed on the base frame; and moving the top flange mounted on the wafer carrier by the apparatus to transport the wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The various aspects of the present disclosure will be best understood by reading the following detailed description in conjunction with the accompanying drawings. Note that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the size of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1A is a schematic perspective view showing an automated wafer carrier handling apparatus carrying a wafer carrier according to some embodiments of the present disclosure.

[0008] Figure 1B is a schematic front view showing an automated wafer carrier handling apparatus according to some embodiments of the present disclosure.

[0009] Figure 1C is a schematic bottom view showing an automated wafer carrier handling apparatus according to some embodiments of the present disclosure.

[0010] Figure 1D According to some embodiments of the present disclosure Figure 1A A schematic cross-sectional view taken along line AA' in FIG.

[0011] Figure 2A is an enlarged perspective view of an engagement mechanism in an expanded state according to some embodiments of the present disclosure.

[0012] Figure 2B is an enlarged side view of an engagement mechanism in an expanded state according to some embodiments of the present disclosure.

[0013] Figure 2C is an enlarged top view of the engagement mechanism in an expanded state according to some embodiments of the present disclosure.

[0014] Figure 2D is an enlarged bottom view of the engagement mechanism in an expanded state according to some embodiments of the present disclosure.

[0015] Figure 3A is a cross-sectional view of an automated wafer carrier handling apparatus showing an unbonded wafer carrier according to some embodiments of the present disclosure.

[0016] Figure 3Bis an enlarged perspective view of an engagement mechanism in a retracted state according to some embodiments of the present disclosure.

[0017] Figure 3C is an enlarged side view of an engagement mechanism in a retracted state according to some embodiments of the present disclosure.

[0018] Figure 3D is an enlarged top view of a coupling mechanism in a retracted state according to some embodiments of the present disclosure.

[0019] Figure 3E is an enlarged bottom view of the engagement mechanism in a retracted state according to some embodiments of the present disclosure.

[0020] Figure 4 is a schematic diagram showing a load port and an automated wafer carrier handling device carrying a wafer carrier according to some embodiments of the present disclosure.

[0021] Figure 5 is a schematic diagram showing an automated wafer carrier handling apparatus for inspecting wafer carriers according to some embodiments of the present disclosure.

[0022] FIG. 6A to FIG. 6E is a schematic diagram showing an automated wafer carrier handling apparatus at various stages of performing an operating method according to some embodiments of the present disclosure.

[0023] FIG. 7A to FIG. 7E is a schematic diagram showing an automated wafer carrier handling apparatus at various stages of performing an operating method according to some embodiments of the present disclosure.

[0024] Figure 7F is a schematic perspective view showing an automated wafer carrier handling apparatus carrying a wafer carrier according to some embodiments of the present disclosure.

[0025] Figure 8 is a flow chart illustrating a method of operating an automated wafer carrier handling apparatus according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0026] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature on or on a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may reuse reference numbers and / or letters in various examples. This repetition is for simplicity and clarity, and does not itself represent the relationship between the various embodiments and / or configurations discussed.

[0027] Additionally, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," and "upper" may be used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.

[0028] Semiconductor fabrication facilities (e.g., semiconductor fabs (FABs)) may typically utilize manual movement of semiconductor wafers or semiconductor products in wafer carriers (e.g., wafer boxes, wafer containers, etc.) between different wafer processing or storage stations around the semiconductor fab. However, typical manual movement may be resource intensive and prone to inefficiencies due to the need for manual movement and control. The present disclosure provides embodiments of automated wafer carrier handling devices and methods of operating the same for movement of wafer carriers to various stations or load ports, thereby minimizing labor requirements and improving manufacturing efficiency.

[0029] Figure 1A is a schematic perspective view showing an automated wafer carrier handling device carrying a wafer carrier according to some embodiments of the present disclosure, Figure 1B is a schematic front view showing an automated wafer carrier handling device according to some embodiments of the present disclosure, Figure 1C is a schematic bottom view showing an automated wafer carrier handling device according to some embodiments of the present disclosure, Figure 1D According to some embodiments of the present disclosure Figure 1A It should be noted that for ease of explanation, some components of the automated wafer carrier handling device and the wafer carrier are omitted in the above figures.

[0030] refer to Figures 1A to 1D , the automated wafer carrier handling device 100 is configured to carry a wafer carrier 10. The wafer carrier 10 may be or may include a storage bin that carries a wafer box (e.g., a frame cassette, a tray cassette, etc.) that holds one or more semiconductor products (not shown). For example, the semiconductor product is a device wafer waiting to be transferred to a semiconductor processing tool (not shown) for further processing. In some embodiments, the semiconductor product is a final package waiting to be shipped to a client. The wafer carrier 10 may have a rectangular shape or other suitable shape. In some embodiments, a top flange 20 is mounted on the top of the wafer carrier 10 and is configured to be fastened by the automated wafer carrier handling device 100. In some embodiments, the top flange 20 is configured to be mushroom-shaped, but other shapes may also be used. For example, as Figure 1D As shown, the top flange 20 includes a first portion 22 and a second portion 24 connected to the first portion 22 and the wafer carrier 10. The automated wafer carrier handling device 100 is adapted to contact at least the first portion 22 of the top flange 20. In some embodiments, the automated wafer carrier handling device 100 is configured to lift the top flange 20 along the short side of the wafer carrier 10, such as Figure 1A In other embodiments, the automated wafer carrier handling device 100 is configured to carry the top flange 20 along the long side of the wafer carrier 10, such as Figure 7F shown.

[0031] The automated wafer carrier handling device 100 may include a base portion BP and a connection portion CP that connects the base portion BP to a transport means (not shown). The connection portion CP may be designed to fit on various types of transport means, thereby opening up possibilities for various transport machinery designs. The term "transport means" used herein may refer to any machine (e.g., an autonomous cart that moves on the ground, a robotic arm connected to, for example, an overhead hoist transfer (OHT) system, an overhead shuttle (OHS), a rail guided vehicle (RGV), etc.) that includes functions such as control, transportation, and carrying.

[0032] In some embodiments, the base portion BP of the automated wafer carrier handling device 100 includes a base frame 110 and a coupling mechanism 120 disposed on the base frame 110. For example, the base frame 110 includes a base plate 112 having a top surface 112a and a bottom surface 112b opposite to each other and a pair of support members 114 connected to the bottom surface 112b of the base plate 112. In some embodiments, the size of the top flange 20 is smaller than the size of the wafer carrier 10, and the size of the base frame 110 can be designed based on the size of the top flange 20 to minimize the size of the automated wafer carrier handling device 100. The minimization of the automated wafer carrier handling device 100 allows itself to fit on various types of transport vehicles.

[0033] The bottom surface 112b of the base plate 112 and the support member 114 may form a space for accommodating the top flange 20 mounted on the wafer carrier 10. In some embodiments, the space defined by the base plate 112 and the support member 114 is suitable for accommodating at least the first portion 22 of the top flange 20. In some embodiments, the support member 114 of the base frame 110 is provided as a fork-shaped structure. In some embodiments, the support member 114 is designed to move the top flange 20 from the front side FS of the base frame 110 or the back side BS of the base frame 110 to the space under the base plate 112. With this configuration, the top flange 20 mounted on the wafer carrier 10 can be moved to the space under the base plate 112 in different directions, thereby improving the efficiency and flexibility of the automated wafer carrier handling device 100.

[0034] In some embodiments, the support member 114 of the base frame 110 includes two L-shaped brackets disposed on opposite sides of the bottom surface 112b of the base plate 112. For example, each L-shaped bracket includes a first portion 114a extending along the side wall of the base plate 112 and a second portion 114b connected to the first portion 114a and extending parallel to the bottom surface 112b. In some embodiments, the corresponding first portion 114a of the support member 114 extends from the bottom surface 112b of the base plate 112 in a substantially vertical direction, and the second portion 114b extends from the end of the first portion 114a opposite to the base plate 112 in a substantially horizontal direction. The first portion 114a and the second portion 114b may be connected at a right angle or an acute angle. The second portions 114b of the two L-shaped brackets may be spatially separated from the bottom surface 112b of the base plate 112 and extend toward each other, but not connected together.

[0035] In some embodiments, the corresponding second portion 114b is spaced apart from the bottom surface 112b of the base plate 112 by a minimum vertical distance Dt for accommodating the top flange 20 mounted on the wafer carrier 10. For example, the minimum vertical distance Dt between the corresponding second portion 114b and the bottom surface 112b of the base plate 112 is substantially greater than the thickness Tt of the first portion 22 of the top flange 20. In some embodiments, each support member 114 includes a protrusion (not labeled) mounted thereon for preventing the top flange 20 from sliding beyond the support member 114. In some embodiments, when the base plate 112 of the base frame 110 is driven to move over the top flange 20, the second portion 24 of the top flange 20 may be located between the pair of support members 114 of the base frame 110. When the base plate 112 is driven to move over the top flange 20, the second portion 24 of the top flange 20 may or may not contact the second portion 114b of the support member 114. In some embodiments, during transport, an edge of the bottom surface of the first portion 22 of the top flange 20 rests against the second portion 114b of the support member 114 .

[0036] It should be noted that for ease of explanation and without intending to limit the structures disclosed herein to any particular orientation, for convenience, the direction substantially perpendicular to the plane of the bottom surface 112b of the base plate 112 is referred to herein as the "vertical direction", and for convenience, the direction substantially parallel to the plane of the bottom surface 112b of the base plate 112 is referred to herein as the "horizontal direction". It should be noted that the support member 114 may take various forms or include other fixing components, as long as the top flange 20 and / or the wafer carrier 10 can be stably supported by the base frame 110 during transfer.

[0037] In some embodiments, the engagement mechanism 120 of the automated wafer carrier handling device 100 is disposed on the base plate 112. For example, the engagement mechanism 120 includes an active expansion component 122, a controller 124, and a stabilizer 126, the stabilizer 126 being disposed on the active expansion component 122 and operably against the active expansion component 122. In some embodiments, a transport vehicle is used to perform handling and / or transport operations under automatic control, and the controller 124 can interface with the transport vehicle to execute a set of programmable instructions stored in the transport vehicle. The controller 124 can issue control signals to operate the movement of the stabilizer 126 and / or the active expansion component 122. For example, the controller 124 includes a motor drive, an electric motor, a gear motor, a drive shaft, an actuator, or other suitable drive mechanisms configured to move the stabilizer 126 and / or the active expansion component 122 relative to the base plate 112. For example, the motor driver of the controller 124 provides a signal to drive the motor to operate, the motor rotates the shaft to drive the stabilizer 126 to move, and the active expansion component 122 can be moved by the movement of the stabilizer 126 .

[0038] In some embodiments, Figure 1B As shown, the active expansion component 122 driven by the controller 124 is made to reciprocate along the axis AX. The active expansion component 122 can be configured to reciprocate linearly along the axis AX, wherein the axis AX can be parallel to the thickness direction of the base plate 112. For example, the active expansion component 122 includes a rod portion 122a that penetrates the base plate 112 and an engaging portion 122b connected to the rod portion 122a. The rod portion 122a of the active expansion component 122 may have one side connected to the engaging portion 122b, and the other side of the rod portion 122a may abut against the stabilizer 126 during operation. In some embodiments, the stabilizer 126 is driven by the controller 124 to move to press the rod portion 122a of the active expansion component 122 downward.

[0039] For example, the stabilizer 126 is configured to rotate in the direction indicated by the arrow A1 to contact the active expansion component 122. It should be understood that the counterclockwise rotation indicated by the arrow A1 is only an example, and the stabilizer 126 can perform other rotations or movements to abut against the active expansion component 122 according to the configuration. In some embodiments, the stabilizer 126 includes a bar portion 126a pivotally coupled to the controller 124 and a wheel portion 126b coupled to the bottom of the bar portion 126a. For example, when the stabilizer 126 moves toward the active expansion component 122, the wheel portion 126b can physically contact the rod portion 122a of the active expansion component 122 before the bar portion 126a. During the operation of transferring the wafer carrier 10, the contact area of ​​the bar portion 126a abutting against the rod portion 122a of the active expansion component 122 can be greater than the contact area of ​​the wheel portion 126b abutting against the rod portion 122a of the active expansion component 122.

[0040] The rod portion 122a of the active expansion assembly 122 may be configured to perform up and down linear motion driven by the controller 124 via the stabilizer 126. The joint portion 122b of the active expansion assembly 122 connected to the rod portion 122a may move up and down together with the rod portion 122a. Figure 1B As shown, the joint portion 122b is provided with an elastic member 122bm and can be configured to perform telescopic movement. For example, in the standby mode, the joint portion 122b is retracted into the groove 112r (eg, Figure 1D During operation, the engaging portion 122b may be moved out of the groove 112r of the base plate 112 to be inserted into the hole 20a of the top flange 20 on the wafer carrier 10. For example, the top flange 20 is provided with a hole 20a that penetrates through the first portion 22. In some embodiments, the hole 20a of the top flange 20 is deep enough to penetrate through the first portion 22 and the second portion 24. Once the engaging portion 122b is moved out of the groove 112r of the base plate 112, the engaging portion 122b may be unfolded and engaged with the top flange 20 on the wafer carrier 10. The details of the operation method will be described later in other embodiments.

[0041] Return to reference Figure 1AIn some embodiments, the automated wafer carrier handling device 100 includes a sensing unit 130 mounted on the base frame 110. The sensing unit 130 may communicate with the transport means and / or the controller 124 of the engagement mechanism 120 for operation. The sensing unit 130 may include a plurality of sensors to perform various functions. For example, the first sensor 132 of the sensing unit 130 is configured to detect the distance between the automated wafer carrier handling device 100 and surrounding objects. The first sensor 132 may be referred to as an anti-collision sensor mounted on the front edge of the top surface 112a of the base plate 112. In some embodiments, the first sensor 132 is a non-contact sensor, such as an ultrasonic sensor, an optical sensor, etc. This will be described later in conjunction with Figure 4 The operation details of the first sensor 132 are explained.

[0042] refer to Figure 1D And refer to Figure 1A , the sensing unit 130 may include a second sensor 134, which is mounted on the base frame 110 and faces the wafer carrier 10 without shielding. In some embodiments, the second sensor 134 is configured as a placement sensor that detects the placement state of the wafer carrier 10 by sensing, for example, both the force and the proximity of the wafer carrier 10. For example, the position of the wafer carrier 10 and / or the presence or absence of the semiconductor product in the wafer carrier 10 can be confirmed by using the second sensor 134. In some embodiments, the base frame 110 is equipped with a plurality of second sensors 134. For example, the second sensor 134 is mounted on the bottom surface of the second portion 114b of the corresponding support member 114 so that the second sensor 134 can face the wafer carrier 10 without shielding. In some embodiments, the second sensor 134 is diagonally arranged on the corresponding support member 114 to ensure that the wafer carrier 10 is in the correct position. In other embodiments, the second sensor 134 is mounted on the bottom surface 112b of the base plate 112 without being shielded by the support member 114. For example, the second sensor 134 includes various types of proximity sensors, such as but not limited to capacitive proximity sensors, inductive proximity sensors, acoustic / sound wave proximity sensors, magnetic proximity sensors, optical / photoelectric proximity sensors, and / or radar-based proximity sensors. Other types of sensors may be used to implement various functions. By using multiple sensors to detect the wafer carrier before performing related actions and transporting the wafer carrier 10, combined detection (such as force sensing, proximity sensing, etc.) can increase the detection of expected contact on the wafer carrier and reduce accidental contact with the wafer carrier. It should be understood that the type, number, and arrangement of the sensing unit 130 shown herein are only exemplary and can be adjusted as required, and the present disclosure is not limited thereto.

[0043] In some embodiments, the sensing unit 130 optionally includes other sensors, which may be different types of sensors suitable for detecting the presence of an object in a sensing area (e.g., an area under the base frame 110). For example, the sensing unit 130 includes a presence sensor configured to detect the presence of a wafer carrier in a target area. In some embodiments, the sensing unit 130 includes a photoelectric sensor that projects a light beam to a specific detection area under the base plate 112 where the wafer carrier 10 is expected to be present, and detects the wafer carrier 10 in the specific detection area based on a value related to the light beam reflected by the wafer carrier. In some embodiments, the sensing unit 130 includes a reflective photoelectric sensor and a proximity sensor. Alternatively, the sensing unit 130 includes sensors of the same or similar type and performs detection simultaneously. It should be noted that the illustration of the sensing unit 130 is only exemplary and the present disclosure does not limit the number and type of sensors.

[0044] Return to reference Figure 1A In some embodiments, the automated wafer carrier handling device 100 includes an image alignment system 140, which is suitable for increasing the certainty of target position identification and position measurement accuracy. The image alignment system 140 may include a light source 142 and an optical detection device 144 optically coupled to the light source 142. For example, the light source 142 of the image alignment system 140 includes a light emitting diode configured to illuminate the surface of the target object, and the optical detection device 144 includes a camera lens, an image sensor (e.g., a charge-coupled device (CCD) image sensor, a complementary metal-oxide semiconductor (CMOS) image sensor, etc.) and / or other suitable components for identifying and locating the target wafer carrier. In some embodiments, the light source 142 and the optical detection device 144 are disposed side by side on the base frame 110. For example, the camera lens and the light source 142 of the optical detection device 144 are exposed by the bottom surface 112b of the base plate 112 to image / scan the object directly below the base frame 110. In some embodiments, the light source 142 of the image alignment system 140 may be off-axis relative to the camera lens and image sensor of the optical detection device 144 that detects light reflected from the scanned target wafer carrier 10. It should be noted that other types of components may be used in the image alignment system 140 to perform various detection / imaging functions. Figure 5 The operational details of the image alignment system 140 are described.

[0045] Figure 2A is an enlarged perspective view of a coupling mechanism in an expanded state according to some embodiments of the present disclosure, Figure 2B is an enlarged side view of a coupling mechanism in an expanded state according to some embodiments of the present disclosure, Figure 2C is an enlarged top view of the engagement mechanism in an expanded state according to some embodiments of the present disclosure, and Figure 2D is an enlarged bottom view of the engagement mechanism in an expanded state according to some embodiments of the present disclosure. Figure 3A is a cross-sectional view of an automated wafer carrier handling apparatus showing an unbonded wafer carrier according to some embodiments of the present disclosure, Figure 3B is an enlarged perspective view of a coupling mechanism in a retracted state according to some embodiments of the present disclosure, Figure 3C is an enlarged side view of a coupling mechanism in a retracted state according to some embodiments of the present disclosure, Figure 3D is an enlarged top view of a coupling mechanism in a retracted state according to some embodiments of the present disclosure, Figure 3E is an enlarged bottom view of the engagement mechanism in a retracted state according to some embodiments of the present disclosure.

[0046] refer to Figures 2A to 2D And refer to Figure 1D , in the operation mode, the joint portion 122b of the active expansion component 122 is in an extended state. The controller 124 of the joint mechanism 120 may control the movement direction of the active expansion component 122 via the stabilizer 126. For example, in the operation mode, the controller 124 applies a force to the stabilizer 126 so that the stabilizer 126 is driven to press down the rod portion 122a of the active expansion component 122. The active expansion component 122 driven by the controller 124 via the stabilizer 126 may drop vertically relative to the base plate 112. The joint portion 122b of the active expansion component 122 may drop accordingly together with the rod portion 122a of the active expansion component 122.

[0047] In some embodiments, once the joint 122b moves downward out of the groove 112r of the base plate 112, the extension 122bd of the joint 122b can extend a distance outward from the center of the structure. The distance is limited by the extension 122bc and / or the elastic member 122bm, for example. Each extension 122bd is connected to one of the extensions 122bc, and the extension 122bc is movably coupled to the rod 122a. The elastic member 122bm can be sleeved on the rod 122a and is configured to drive the extension 122bc to move. For example, the extension 122bc moves along the groove GV on the bottom of the rod 122a and below the elastic member 122bm. In some embodiments, the corresponding groove GV extends in an inclined direction relative to the length direction of the rod 122a.

[0048] In some embodiments, reference Figure 2B and Figure 1D, in the operating mode, the elastic member 122bm is compressed by the stabilizer 126 in the direction DN1. During the compression of the elastic member 122bm, the extension 122bc can move along the groove GV in the direction DN2. The extension 122bd can move together with the extension 122bc and can be separated from each other by the above distance. Due to this movement of the extension 122bd and the elastic member 122bm, the extension 122bc abuts against the upper end of the groove GV. For example, the direction DN1 is parallel to the normal direction of the top surface 122bt of the extension 122bd, and the direction DN2 is an inclined direction relative to the direction DN1. In some embodiments, an acute angle is formed between the direction DN1 and the direction DN2. In other embodiments, a right angle or an obtuse angle may be formed between the direction DN1 and the direction DN2. In some embodiments, the elastic member 122bm is as follows Figure 2A to Figure 2B In other embodiments, the elastic member 122bm includes a torsion spring, a coil spring, or other types of elastic members.

[0049] In some embodiments, the joint 122b may taper from top to bottom. For example, the corresponding extension 122bd of the joint 122b is in the shape of a truncated cone. For example, the corresponding extension 122bd has a bottom surface 122bs, a top surface 122bt wider than the bottom surface 122bs, and an inclined sidewall 122bw connecting the top surface 122bt and the bottom surface 122bs. It should be noted that the joint 122b shown in the shape of a circular truncated cone is only an example, and the joint 122b can take various forms (such as a cube, a prism, a sphere, a polygonal truncated cone, etc.), as long as the joint 122b can be engaged with the top flange 20 mounted on the wafer carrier 10. In some embodiments in which the joint 122b is in the shape of a truncated cone, the extension 122bd of the joint 122b moves away from the radial direction of the center of the structure. In some embodiments, the extension portion 122bd is expanded outwardly so that the engagement portion 122b is engaged with the top flange 20 mounted on the wafer carrier 10. The engagement portion 122b of the active expansion component 122 may be composed of a plurality of extension portions 122bd, which are combined together via the elastic member 122bm. For example, the extension portion 122bd may be a telescopic blade-shaped structure limited by the elastic member 122bm and / or the groove 112r of the base plate 112. It should be noted that the illustration of three extension portions 122bd is only an example, and the present disclosure does not limit the number and form of the extension portions 122bd.

[0050] refer to FIG. 3A to FIG. 3EIn the standby mode, the joint portion 122b of the active expansion component 122 is in a retracted state and can be accommodated in the groove 112r of the base plate 112. In some embodiments, the second portion 24 of the top flange 20 connected to the first portion 22 and the top of the wafer carrier 10 defines a gap G between the first portion 22 of the top flange 20 and the top surface of the wafer carrier 10. During the operation of moving the base frame 110 into the gap G between the top flange 20 and the wafer carrier 10, the joint portion 122b of the active expansion component 122 is in a retracted state and accommodated in the groove 112r to avoid collision and damage to the top flange 20. In some embodiments, the thickness of the joint portion 122b is substantially equal to the depth of the groove 112r of the base plate 112, so that the joint portion 122b of the active expansion component 122 may not protrude from the base plate 112. In other embodiments, the thickness of the joint portion 122b is slightly greater than or less than the depth of the groove 112r of the base plate 112. It should be noted that the present disclosure does not limit the thickness of the joint portion 122 b as long as the joint portion 122 b does not interfere with the movement of the top flange 20 and the wafer carrier 10 when the automated wafer carrier handling device 100 moves over the wafer carrier 10 .

[0051] In some embodiments, Figure 3A As shown, in the standby mode, the stabilizer 126 is driven by the controller 124 to rotate in the direction indicated by the arrow A2, thereby releasing the rod portion 122a of the active expansion component 122. It should be understood that the clockwise rotation indicated by the arrow A2 is only an example, and the stabilizer 126 can perform other rotations or movements to release the active expansion component 122 according to the configuration. For example, referring to Figure 1B In the standby mode, the strip portion 126a and the wheel portion 126b move together away from the rod portion 122a of the active expansion component 122, thereby releasing the active expansion component 122. For example, the extension portion 122bc and the expansion portion 122bd can obtain a return force based on the elastic restoring force of the compressed elastic member 122bm. Since the pressing force is no longer applied to the rod portion 122a of the active expansion component 122, the elastic member 122bm that is compressed and deformed is elastically restored, so the rod portion 122a can move upward due to the elastic restoring force.

[0052] In some embodiments, Figure 3C As shown, in the standby mode, the elastic member 122bm elastically recovers along the direction DN3, wherein the direction DN3 is parallel to the direction DN3. Figure 2BThe elastic member 122bm that elastically recovers can move the extension portion 122bc along the groove GV in the direction DN4 to abut against the lower end of the groove GV. The restoring force due to the displacement of the elastic member 122bm can generate a force that returns the extension portion 122bc and the expansion portion 122bd. Therefore, the expansion portion 122bd is pulled back to the contracted state. In the contracted state, the expansion portions 122bd are connected to each other. In some embodiments, due to the elastic recovery force, the expansion portion 122bd is retracted in the standby mode to form a ring, such as Figure 3D to Figure 3E As shown in the top view and bottom view.

[0053] Figure 4 is a schematic diagram showing a load port and an automated wafer carrier handling device carrying a wafer carrier according to some embodiments of the present disclosure. It should be noted that the receiving location, wafer carrier, and automated wafer carrier handling device may not be drawn to scale and are for illustration purposes only. Figure 4 In some embodiments, the automated wafer carrier handling device 100 carrying the wafer carrier 10 is approaching a receiving location RP for loading. For example, the receiving location RP is configured to accommodate the wafer carrier 10. In some embodiments, the receiving location RP is a loadport fixed to the front end of a semiconductor processing tool or semiconductor manufacturing equipment (not shown). In other embodiments, the receiving location RP is a platform or storage rack located in, for example, a buffer area waiting to be transferred to the next station or waiting to be transported. In some embodiments, the first sensor 132 of the sensing unit 130 is configured to detect obstacles during transportation. For example, the first sensor 132 is configured to emit a light beam, an ultrasonic wave, etc., and receive reflected light or sound waves to calculate the time it takes for the light or sound waves to be reflected back to the first sensor 132, thereby determining the distance between the surrounding objects and the automated wafer carrier handling device 100.

[0054] In some embodiments, the first sensor 132 detects an object (e.g., another wafer carrier 10') at the receiving location RP and the first sensor 132 is configured to receive a condition and report it to a controller mounted on the automated wafer carrier handling device 100 or mounted on a transport vehicle to determine whether and / or when to stop the movement of the automated wafer carrier handling device 100. For example, the automated wafer carrier handling device 100 stops moving at the stop line SL or slows down before reaching the stop line SL to avoid a collision, thereby protecting the wafer carrier 10 from damage and reducing scrap. In some embodiments where the automated wafer carrier handling device 100 attempts to grab a target wafer carrier from an expected location (e.g., a loading port, a storage rack, a platform, etc.), the first sensor 132 of the sensing unit 130 is configured to avoid known stationary obstacles while traveling and detect the position of the target wafer carrier. For example, the first sensor 132 can detect the distance between the target wafer carrier and the automated wafer carrier handling device 100, so that the automated wafer carrier handling device 100 controlled by the transport vehicle is positioned to the target wafer carrier with a specific clearance without collision. In some embodiments, when the first sensor 132 detects an obstacle or object at the receiving location RP, the automated wafer carrier handling device 100 carrying the wafer carrier 10 may change the predetermined route to move to another receiving location or turn to a buffer area for placement.

[0055] Figure 5 is a schematic diagram showing an automated wafer carrier handling apparatus for inspecting wafer carriers according to some embodiments of the present disclosure. It should be noted that the wafer carrier, top flange, and automated wafer carrier handling apparatus may not be drawn to scale and are for illustration purposes only. Figure 5 , the image alignment system 140 of the automated wafer carrier handling device 100 is configured to read or detect the optical feature 30 for positioning and / or identification. The optical feature 30 may be disposed at the receiving location RP. In some embodiments, the optical feature 30 is positioned at a predetermined position of the receiving location RP, so that when the automated wafer carrier handling device 100 is driven along a predetermined route (not shown) and moves toward the wafer carrier 10 to couple the top flange 20, the optical feature 30 is detected by the image alignment system 140. Based on the detection and / or scanning of the optical feature 30 positioned at the predetermined position along the predetermined route of the automated wafer carrier handling device 100, the image alignment system 140 of the automated wafer carrier handling device 100 may read position information (e.g., coordinate position) from the optical feature 30.

[0056] In some embodiments, the optical feature 30 is disposed on the wafer carrier 10, and the image alignment system 140 is configured to detect / scan the optical feature 30 to read information of the wafer carrier 10. For example, the optical detection device 144 of the image alignment system 140 is configured to respond to the light source 142 (e.g., visible light, infrared light, ultraviolet light, or any combination thereof), and receive directly from the light source 142 or receive by reflection. In some embodiments, the optical feature 30 includes a machine-readable identification code (e.g., a barcode, a QR code, or a data matrix), a document, a graphic, or a combination thereof. For example, the optical feature 30 includes a barcode, and the image alignment system 140 includes a barcode reader for detecting the barcode on the optical feature 30. By reading / scanning the optical feature 30, the automated wafer carrier handling device 100 can increase the positional certainty and identification accuracy of the wafer carrier 10.

[0057] FIG. 6A to FIG. 6E 1 is a schematic diagram showing an automated wafer carrier handling device at various stages of implementing an operating method according to some embodiments of the present disclosure. The automated wafer carrier handling device 100 can be used to automatically handle a wafer carrier 10 and transport the wafer carrier 10 from a starting position to a destination position in various stations of a FAB without having to wait for an operator to load / unload the wafer carrier 10. The automated wafer carrier handling device 100 can be configured to grasp the top flange 20 mounted on the wafer carrier 10 in various orientations. FIG. 6A to FIG. 6E The automated wafer carrier handling device 100 is shown to be configured to lift the top flange 20 along the short side of the wafer carrier 10. The method of operation of the automated wafer carrier handling system includes at least the following steps. Although the method of operation is shown and described below as a series of actions or events, it will be understood that the order of these actions or events shown should not be interpreted as having a limiting meaning.

[0058] refer to FIG. 6A to FIG. 6B, wherein a wafer carrier 10 accommodating a plurality of semiconductor products is disposed on a receiving surface RPs of a receiving location RP. In some embodiments, the receiving location RP is regarded as a starting position. An automated wafer carrier handling device 100 controlled by a transport tool can be moved to a starting position and approach the wafer carrier 10. Then, the automated wafer carrier handling device 100 can be positioned at a certain height above the top surface of the wafer carrier 10. Next, the automated wafer carrier handling device 100 can be driven to perform linear motion in the direction indicated by the arrow AR1. For example, the automated wafer carrier handling device 100 is moved in a horizontal direction from the left side LS of the wafer carrier 10 to the right side RS of the wafer carrier 10. For example, the support member 114 of the base frame 110 slides into the gap G between the top flange 20 and the wafer carrier 10 until the automated wafer carrier handling device 100 is positioned on the top flange 20. Reference Figure 3A , the active extension assembly 122 of the automated wafer carrier handling apparatus 100 may be positioned above the hole 20 a of the top flange 20 . At this stage, the base frame 110 of the automated wafer carrier handling apparatus 100 is not in physical contact with the top flange 20 .

[0059] In some embodiments, during movement close to the wafer carrier 10, the first sensor 132 of the sensing unit 130 may sense the presence of obstacles and / or the wafer carrier 10 in the target area, thereby avoiding collision and / or detecting the position. Figure 5 In some embodiments, during movement in proximity to the wafer carrier 10, the image alignment system 140 may detect the optical features 30 near / on the wafer carrier 10 to identify the position along the predetermined route. Figure 1C In some embodiments, during the movement of sliding the support member 114 into the gap G, the second sensor 134 may be configured to sense whether the wafer carrier 10 is present in the detection area (e.g., the area below the base frame 110), and detect the relative position of the wafer carrier 10 so that the automated wafer carrier handling device 100 is positioned at a predetermined position above the wafer carrier 10, thereby performing the next action.

[0060] refer to Figure 6C When transporting the wafer carrier 10, the automated wafer carrier handling device 100 restricts at least one degree of freedom of movement of the top flange 20. For example, after the automated wafer carrier handling device 100 is positioned on the wafer carrier 10, the automated wafer carrier handling device 100 is driven by the transport tool to perform linear motion along the direction indicated by the arrow AR2. For example, the automated wafer carrier handling device 100 moves upward in the vertical direction. Figure 1D, the base frame 110 of the automated wafer carrier handling device 100 is lifted until the second portion 114b of the support member 114 abuts against the first portion 22 of the top flange 20. For example, the top flange 20 mounted on the wafer carrier 10 leans against the support member 114 of the base frame 110 to limit the freedom of movement in the vertical direction (i.e., the Z direction). It should be noted that for ease of explanation and not intended to limit the structure disclosed herein to any particular orientation, for convenience, the direction perpendicular to the plane of the receiving surface RPs of the receiving location RP is referred to herein as the "vertical direction".

[0061] refer to Fig.6D And refer to Figure 1D and Figure 2A , after the wafer carrier 10 is in place and the support member 114 of the base frame 110 is abutted against the top flange 20, the active expansion component 122 of the engagement mechanism 120 controlled by the controller 124 is moved in the direction indicated by the arrow AR3 to engage with the top flange 20. The directions indicated by the arrows AR2 and AR3 may be opposite to each other. For example, during the movement of lowering the active expansion component 122, the controller 124 applies a force to the stabilizer 126 to move the active expansion component 122 downward, so that the rod portion 122a and the engagement portion 122b of the active expansion component 122 driven by the controller 124 via the stabilizer 126 are pressed down relative to the base plate 112. In some embodiments, when the engagement portion 122b moves downward out of the groove 112r of the base plate 112, the expansion portion 122bd expands outward, as shown in FIG. Figure 2A As the movement of lowering the active expansion assembly 122 continues, the expansion portion 122bd of the engagement portion 122b may be inserted into the hole 20a of the top flange 20.

[0062] In some embodiments, the extension 122bd of the engagement portion 122b is complementary in shape to the hole 20a of the top flange 20. For example, the extension 122bd in the expanded state tapers from top to bottom relative to the receiving surface RPs of the receiving location RP, and the profile of the hole 20a also tapers from top to bottom relative to the receiving surface RPs of the receiving location RP. The hole 20a of the top flange 20 may or may not be completely blocked by the engagement portion 122b of the active expansion component 122. In some embodiments, the deeper the engagement, the greater the engagement force. In some embodiments, the extension 122bd abuts against the inner side wall of the top flange 20 by elastic force, and the inner side wall defines the hole 20a of the top flange 20. For example, the extension 122bd of the engagement portion 122b coupled to the extension 122bc can be elastically moved via the elastic member 122bm, so that the extension 122bd engages with the inner side wall of the top flange 20 in the hole 20a. In other embodiments where the hole 20a is a threaded hole, the expansion portion 122bd is threadedly engaged with the top flange 20. It should be understood that other suitable engagement methods may be used as long as the engagement mechanism 120 can be stably engaged with the top flange 20 during transportation.

[0063] In some embodiments, once the extension portion 122bd is securely inserted into the hole 20a of the top flange 20, the wafer carrier 10 can be transferred by the automated wafer carrier handling device 100 without swinging, and then the wafer carrier 10 can be transported to a destination location. In some embodiments, the engagement portion 122b of the active extension component 122 engages with the hole 20a of the top flange 20 mounted on the wafer carrier 10 to limit the freedom of movement of the wafer carrier 10 in both the X direction and the Y direction. The automated wafer carrier handling device 100 is configured to control the displacement of the wafer carrier 10 by limiting the multiple degrees of freedom of movement of the top flange 20 on the wafer carrier 10 to ensure stability during the transportation of the wafer carrier 10 from the starting position to the destination position.

[0064] In some embodiments, the operations of abutting the support member 114 of the base frame 110 against the top flange 20, inserting the engaging portion 122b of the active expansion component 122 into the hole 20a of the top flange 20, and lifting the top flange 20 are sequentially performed. In some embodiments, the operations of abutting the support member 114 of the base frame 110 against the top flange 20 and inserting the engaging portion 122b into the hole 20a of the top flange 20 are performed during the same step. The operation of inserting the engaging portion 122b of the active expansion component 122 into the hole 20a of the top flange 20 may be performed before the operation of abutting the support member 114 of the base frame 110 against the top flange 20. Alternatively, the operation of inserting the engaging portion 122b of the active expansion component 122 into the hole 20a of the top flange 20 may be performed after abutting the support member 114 against the top flange 20. In some other embodiments, after the engaging portion 122 b of the active expansion component 122 is inserted into the hole 20 a of the top flange 20 , the operations of placing the supporting member 114 of the base frame 110 against the top flange 20 and lifting the top flange 20 are performed simultaneously.

[0065] refer to Fig. 6E When the destination location is reached, the wafer carrier 10 is loaded onto the receiving surface RPs' of the receiving location RP'. In some embodiments, the receiving location RP' is considered the destination location. The reverse sequence of operations may be performed to release the automated wafer carrier handling device 100 from the top flange 20, thereby unloading the wafer carrier 10. For example, referring to FIG. 3A to FIG. 3B , the stabilizer 126 is removed from the top of the rod portion 122a. Since the pressing force applied to the rod portion 122a is removed, the active expansion component 122 can move upward by the restoring force. For example, the elastic member 122bm provides an elastic force that enables the expansion portion 122bd of the joint portion 122b to move back to the retracted state. For example, the expansion portion 122bd of the joint portion 122b is retracted from the hole 20a of the top flange 20 and then accommodated in the groove 112r of the base plate 112.

[0066] After loading the wafer carrier 10 on the receiving surface RPs' of the receiving location RP', the automated wafer carrier handling device 100 controlled by the transport tool may move downward. When the automated wafer carrier handling device 100 is lowered, the support member 114 of the base frame 110 is no longer in physical contact with the top flange 20, so that the top flange 20 is released from the support member 114. For example, the second portion 114b of the support member 114 is not in abutting contact with the first portion 22 of the top flange 20 and may be suspended in the gap G without contacting the top flange 20 and the wafer carrier 10 (e.g., as shown in FIG. 1 ). Figure 6B). In some embodiments, the operations of retracting the engaging portion 122b from the hole 20a of the top flange 20 and lowering the automated wafer carrier handling device 100 are performed sequentially. In other embodiments, the operation of lowering the automated wafer carrier handling device 100 is performed before the operation of restoring the engaging portion 122b from the hole 20a of the top flange 20. Alternatively, after the wafer carrier 10 is loaded on the receiving surface RPs' of the receiving site RP', the operations of restoring the engaging portion 122b from the hole 20a of the top flange 20 and lowering the automated wafer carrier handling device 100 are performed simultaneously.

[0067] After releasing the engagement portion 122b of the active expansion assembly 122 and the support member 114 of the base frame 110 from the top flange 20, the automated wafer carrier handling device 100 can be moved away from the wafer carrier 10 in a direction from the left side LS to the right side as indicated by arrow AR1. In some embodiments, after loading the wafer carrier 10, the automated wafer carrier handling device 100 is driven to slide from the right side RS to the left side LS as indicated by arrow AR4.

[0068] It should be noted that although FIG. 6A to FIG. 6D The illustrated operating method begins with moving the automated wafer carrier handling device 100 in the direction indicated by arrow AR1, but in other embodiments, the operating method may begin with moving the automated wafer carrier handling device 100 in the direction indicated by arrow AR4 into the gap G. The automated wafer carrier handling device 100 may be driven to slide out of the gap G in the direction indicated by arrow AR1 or arrow AR4. For example, the direction indicated by arrow AR1 (or AR4) is substantially parallel to the short side 10w of the wafer carrier 10. It should also be noted that the illustration of a single automated wafer carrier handling device 100 is merely an example, and multiple automated wafer carrier handling devices may be connected to a transport tool to simultaneously transport multiple wafer carriers to increase productivity.

[0069] FIG. 7A to FIG. 7E is a schematic diagram showing an automated wafer carrier handling device at various stages of implementing an operation method according to some embodiments of the present disclosure, Figure 7F is a schematic perspective view showing an automated wafer carrier handling apparatus carrying a wafer carrier according to some embodiments of the present disclosure. FIG. 7A to FIG. 7F The automated wafer carrier handling device 100 is shown configured to lift the top flange 20 along the long side of the wafer carrier 10. The method of operation of the automated wafer carrier handling system may be similar to the method of operation described above, so the detailed description may be simplified for the sake of brevity. Although the method of operation is shown and described below as a series of actions or events, it will be understood that the order of these actions or events shown should not be interpreted as having a limiting meaning.

[0070] refer to FIG. 7A to FIG. 7B and Figure 7F , the automated wafer carrier handling device 100 may be positioned at the front side FS' of the wafer carrier 10 and then moved into the gap G along the direction indicated by the arrow AR5. For example, the moving direction of the automated wafer carrier handling device 100 is substantially parallel to the long side 10s of the wafer carrier 10. For example, the automated wafer carrier handling device 100 slides along the horizontal direction from the front side FS' of the wafer carrier 10 to the back side BS' of the wafer carrier 10 until the base frame 110 is positioned above the top flange 20. In some embodiments, the active expansion component is aligned with the hole of the top flange 20. As shown in FIG. Figure 7B As shown, at this stage, the base frame 110 of the automated wafer carrier handling apparatus 100 may not be in physical contact with the top flange 20 and the wafer carrier 10 .

[0071] refer to Figure 7C After the automated wafer carrier handling device 100 is positioned above the top flange 20, the automated wafer carrier handling device 100 is moved in the direction indicated by the arrow AR2. For example, the automated wafer carrier handling device 100 is lifted until the support member 114 is in abutment contact with the top flange 20. The top flange 20 mounted on the wafer carrier 10 may lean against the support member 114 to limit the freedom of movement in the vertical direction.

[0072] refer to Fig.7D , the engagement mechanism 120 moves in the direction indicated by the arrow AR3 to engage with the top flange 20. Figure 1D For example, during the movement of lowering the active expansion component 122, the stabilizer 126 rotates to press the active expansion component 122 downward relative to the base plate 112, so that the engaging portion 122b of the active expansion component 122 moves out of the groove 112r of the base plate 112 and unfolds in an expanded state, and then the expanded portion 122bd of the engaging portion 122b can be inserted into the hole 20a of the top flange 20. In some embodiments, after the support member 114 abuts against the top flange 20, the active expansion component 122 is inserted into the top flange 20. In other embodiments, FIG. 7C to FIG. 7D The illustrated operation steps may be performed simultaneously in the same step. After the active expansion assembly 122 is securely inserted into the hole 20 a of the top flange 20 , the wafer carrier 10 may be lifted and transported to a destination location via the automated wafer carrier handling device 100 .

[0073] refer to Fig. 7E, the wafer carrier 10 may be loaded on the receiving surface RPs' of the receiving location RP' by the automated wafer carrier handling device 100. After loading the wafer carrier 10, the top flange 20 on the wafer carrier 10 may be released from the automated wafer carrier handling device 100, and then the automated wafer carrier handling device 100 may be moved away from the wafer carrier 10 for the next round. For example, after the wafer carrier 10 is set on the receiving surface RPs' of the receiving location RP', the engagement mechanism 120 is retracted from the hole of the top flange 20, and the base frame 110 is slightly lowered so that the automated wafer carrier handling device 100 is no longer in contact with the top flange 20. Subsequently, the automated wafer carrier handling device 100 is moved away from the wafer carrier 10 in the direction indicated by the arrow AR5. In other embodiments, the automated wafer carrier handling device 100 is driven to slide out of the gap G from the rear side BS' to the front side FS' in the direction indicated by the arrow AR6. In some embodiments, the operation steps begin by moving the automated wafer carrier handling device 100 in the direction indicated by arrow AR6 to slide into the gap G at the starting position, thereby transporting the wafer carrier 10 to the destination position. The automated wafer carrier handling device 100 can move into / out of the gap G from any orientation of the wafer carrier 10 (e.g., from the front side FS', the back side BS', the right side RS, or the left side LS), thereby improving the efficiency and flexibility of the automated wafer carrier handling device 100.

[0074] Figure 8 is a flow chart illustrating an operating method of an automated wafer carrier handling device according to some embodiments of the present disclosure. An operating method may be used to transport a target wafer carrier from a starting location to a destination location between stations in a FAB without having to wait for an operator to load / unload the wafer carrier. Note that the operating method including the following operations is merely an example and is not to be construed as limiting in the present disclosure. Although the operating method is shown and described below as a series of actions or operations, it should be understood that additional operations may be provided before, during, and after the operating method, certain operations may be performed simultaneously with other operations, and certain operations may be omitted.

[0075] In operation 202, a base frame and a bonding mechanism of an automated wafer carrier handling device are brought into contact with a top flange mounted on a wafer carrier to limit the freedom of movement of the top flange, wherein the bonding mechanism is disposed on the base frame. For example, operation 202 includes the following actions.

[0076] In action 2022, the base frame of the automated wafer carrier handling device is moved in a first direction (e.g., as indicated by arrow ( Fig. 6E AR1 / AR4 or Fig. 7E Move in the gap between the top flange and the wafer carrier in one of the directions shown in AR5 / AR6) shown in FIG. FIG. 6A to FIG. 6Bor FIG. 7A to FIG. 7B The view corresponding to the action is shown.

[0077] In action 2024, the base frame of the automated wafer carrier handling device is moved in a second direction (e.g., by Figure 6C or Figure 7C The device moves in a direction indicated by an arrow AR2 as shown in the figure) to contact the top flange, wherein the second direction is perpendicular to the first direction, Figure 6C or Figure 7C A front view corresponding to the described action is shown.

[0078] In action 2026, the engagement mechanism of the automated wafer carrier handling device may be moved in a third direction (e.g., by Fig.6D or Fig.7D The third direction is opposite to the second direction, Fig.6D or Fig.7D A front view corresponding to the actions is shown. In some embodiments, actions 2024 and 2026 may be performed simultaneously, rather than one after another.

[0079] In operation 204, the automated wafer carrier handling device transports the wafer carrier from the starting position to the destination position. For example, after the automated wafer carrier handling device is brought into contact with the top flange, the wafer carrier is lifted and then transported to the destination position. When the automated wafer carrier handling device carrying the wafer carrier arrives at the destination position, the wafer carrier is loaded at a predetermined position. Fig. 6E or Fig. 7E Views corresponding to the steps of loading a wafer carrier onto a receiving site at a destination location are shown.

[0080] In operation 206, the top flange mounted on the wafer carrier is released from the automated wafer carrier handling device at the destination location. For example, operation 206 includes the following actions.

[0081] In act 2062, the engagement mechanism is recovered from the hole of the top flange in the second direction. In act 2064, the base frame of the automated wafer carrier handling device is moved along the third direction to be suspended in the gap between the top flange and the wafer carrier. In some embodiments, acts 2062 and 2064 may be performed simultaneously, rather than one after the other. In act 2066, the base frame of the automated wafer carrier handling device is moved away from the wafer carrier. Fig. 6E or Fig. 7E Views corresponding to the steps of moving the automated wafer carrier handling device away from the wafer carrier are shown.

[0082] According to some embodiments, an apparatus for automated wafer carrier handling is provided, the apparatus being adapted to transport a wafer carrier. The apparatus comprises a base frame and an engagement mechanism disposed on the base frame. The engagement mechanism comprises a controller and an active extension assembly, the active extension assembly being movably coupled to the base frame and controlled by the controller to reciprocate relative to the base frame. The active extension assembly is driven by the controller through the base frame to engage with a top flange mounted on the wafer carrier.

[0083] In some embodiments, the active expansion assembly includes an engagement portion adapted to be received in a groove of the base frame in a retracted state and to be expanded in an expanded state to be inserted into a hole of the top flange. In some embodiments, the active expansion assembly includes an elastic member that allows the engagement portion to be elastically movable. In some embodiments, the base frame includes a base plate and a pair of support members, the support members are connected to the base plate, each of the pair of support members includes a portion spaced a vertical distance from the base plate, and the top flange is adapted to abut against the portion of the pair of support members. In some embodiments, the vertical distance between the portion of the pair of support members and the base plate is substantially greater than the thickness of the top flange mounted on the wafer carrier. In some embodiments, at least one degree of freedom of movement of the top flange mounted on the wafer carrier is limited by the pair of support members abutting against the top flange. In some embodiments, the device for automated wafer carrier handling further includes a sensor disposed on the base frame and adapted to perform at least one of the following functions: detecting a distance between the automated wafer carrier handling device and surrounding objects to avoid collision, detecting the presence or absence of the wafer carrier, and detecting the placement state of the wafer carrier. In some embodiments, the apparatus for automated wafer carrier handling further includes an image alignment system disposed on the base frame and including a light source and an optical detection device optically coupled to the light source for identifying and locating the wafer carrier.

[0084] According to some alternative embodiments, an operating method for automated wafer carrier handling includes at least the following steps: bringing a base frame and an engagement mechanism of an automated wafer carrier handling device into abutment contact with a top flange mounted on a wafer carrier to restrict at least one degree of freedom of movement of the top flange, wherein the engagement mechanism is disposed on the base frame. The automated wafer carrier handling device transports the wafer carrier to a destination location. The top flange mounted on the wafer carrier is released from the automated wafer carrier handling device at the destination location.

[0085] In some embodiments, bringing the automated wafer carrier handling device into abutting contact with the top flange includes moving the base frame of the automated wafer carrier handling device in a first direction in a gap between the top flange and the wafer carrier, and moving the base frame of the automated wafer carrier handling device in a second direction to contact the top flange, wherein the second direction is perpendicular to the first direction. In some embodiments, bringing the automated wafer carrier handling device into abutting contact with the top flange includes moving the engagement mechanism of the automated wafer carrier handling device in a third direction to engage with a hole of the top flange, wherein the third direction is opposite to the second direction. In some embodiments, releasing the top flange from the automated wafer carrier handling device includes recovering the engagement mechanism of the automated wafer carrier handling device in the second direction from the hole of the top flange. In some embodiments, releasing the top flange from the automated wafer carrier handling device includes moving the base frame of the automated wafer carrier handling device in a third direction to hang in the gap between the top flange and the wafer carrier, wherein the third direction is opposite to the second direction. In some embodiments, releasing the top flange from the automated wafer carrier handling device further comprises moving the base frame of the automated wafer carrier handling device in a fourth direction away from the wafer carrier after moving the base frame of the automated wafer carrier handling device in the third direction, wherein the fourth direction is opposite to the first direction. In some embodiments, the method of operating for automated wafer carrier handling further comprises detecting a distance between the automated wafer carrier handling device and surrounding objects during transporting the wafer carrier to the destination location.

[0086] According to some alternative embodiments, an operating method for automated wafer carrier handling includes at least the following steps: moving a base frame of an apparatus in a gap between a top flange and a wafer carrier to contact the top flange, wherein the top flange is mounted on the wafer carrier; lowering an active expansion assembly of the apparatus to engage with a hole of the top flange, wherein the active expansion assembly is disposed on the base frame; and moving the top flange mounted on the wafer carrier by the apparatus to transport the wafer carrier.

[0087] In some embodiments, moving the base frame of the device to contact the top flange includes moving the base frame in a first direction along a side of the wafer carrier, and moving the base frame in a second direction perpendicular to the first direction to abut against the top flange. In some embodiments, when the base frame of the device is moved to contact the top flange, the engagement portion of the active expansion component is accommodated in a groove of the base frame. In some embodiments, when the active expansion component of the device is lowered to engage with the hole of the top flange, the engagement portion of the active expansion component is moved out of the groove of the base frame and expanded to be inserted into the hole of the top flange. In some embodiments, the operating method for automated wafer carrier handling also includes loading the wafer carrier at a predetermined position, recovering the active expansion component of the device from the hole of the top flange, and releasing the base frame from the top flange. The features of several embodiments are summarized above so that technicians in the field can better understand various aspects of the present disclosure. Those skilled in the art will appreciate that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to implement the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art will also recognize that these equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions, and modifications thereto without departing from the spirit and scope of the present disclosure.

[0088] [Explanation of Symbols]

[0089] 10, 10': Wafer carrier

[0090] 10s: long side

[0091] 10w: Short side

[0092] 20: Top flange

[0093] 20a: Hole

[0094] 22, 114a: Part I

[0095] 24, 114b: Part 2

[0096] 30: Optical characteristics

[0097] 100: Automated wafer carrier handling device

[0098] 110: Base frame

[0099] 112: Base plate

[0100] 112a, 122bt: Top surface

[0101] 112b, 122bs: bottom surface

[0102] 112r: Groove

[0103] 114: Supporting member

[0104] 120: Joint mechanism

[0105] 122: Active extension component

[0106] 122a: Rod

[0107] 122b: Joint

[0108] 122bc: Extension

[0109] 122bd: Extension

[0110] 122bm: Elastic member

[0111] 122bw: Sloped sidewalls

[0112] 124: Controller

[0113] 126: Stabilizer

[0114] 126a: Strip

[0115] 126b: Wheel

[0116] 130: Sensing unit

[0117] 132: First sensor

[0118] 134: Second sensor

[0119] 140: Image alignment system

[0120] 142: Light Source

[0121] 144: Optical detection devices

[0122] 202, 204, 206: Operation

[0123] 2022, 2024, 2026, 2062, 2064, 2066: Action

[0124] A-A': line

[0125] A1, A2, AR1, AR2, AR3, AR4, AR5, AR6: Arrow

[0126] AX: axis line

[0127] BP: Basal part

[0128] BS, BS': rear side

[0129] CP: Connecting part

[0130] DN1, DN2, DN3, DN4: Direction

[0131] Dt: Minimum vertical distance

[0132] FS, FS': front side

[0133] G: Gap

[0134] GV: Groove

[0135] LS: Left side

[0136] RP, RP': Receiving place

[0137] RPs, RPs': receiving surface

[0138] RS: Right side

[0139] SL: Stop Line

[0140] Tt: thickness

Claims

1. An apparatus for automated wafer carrier handling, the apparatus being adapted to transport a wafer carrier, the apparatus comprising: a base frame including a base plate and a pair of support members connected to the base plate, each of the pair of support members including a portion spaced a vertical distance from the base plate and parallel to the base plate; and A coupling mechanism is disposed on the base frame and comprises: Controller; and an active extension assembly movably coupled to the base frame and controlled by the controller to perform reciprocating movement relative to the base frame, wherein the active extension assembly is driven by the controller to pass through the base frame to engage with a top flange mounted on the wafer carrier, and the top flange is adapted to abut against the portion of the pair of support members.

2. The apparatus for automated wafer carrier handling according to claim 1, wherein the active extension component comprises: The engaging portion is adapted to be received in the groove of the base frame in a contracted state and to be unfolded to be inserted into the hole of the top flange in an expanded state.

3. The apparatus for automated wafer carrier handling according to claim 2, wherein the active expansion assembly comprises an elastic member that allows the engagement portion to be elastically movable.

4. The apparatus for automated wafer carrier handling of claim 1, wherein the active extension assembly includes an engagement portion that is complementary in shape to the aperture of the top flange.

5. The apparatus for automated wafer carrier handling of claim 1, wherein a vertical distance between the portions of the pair of support members and the base plate is substantially greater than a thickness of the top flange mounted on the wafer carrier.

6. The apparatus for automated wafer carrier handling of claim 1, wherein at least one degree of freedom of movement of the top flange mounted on the wafer carrier is limited by the pair of support members abutting the top flange.

7. The apparatus for automated wafer carrier handling according to claim 1, further comprising: A sensor is disposed on the base frame and is adapted to perform at least one of the following functions: detecting a distance between the automated wafer carrier handling device and surrounding objects to avoid collision, detecting the presence or absence of the wafer carrier, and detecting a placement status of the wafer carrier.

8. The apparatus for automated wafer carrier handling according to claim 1, further comprising: An image alignment system is disposed on the base frame and includes a light source and an optical detection device optically coupled to the light source for identifying and locating the wafer carrier.

9. A method for automated wafer carrier handling, comprising: Bringing a base frame and an engagement mechanism of an automated wafer carrier handling device into abutting contact with a top flange mounted on a wafer carrier to restrict at least one degree of freedom of movement of the top flange, wherein the engagement mechanism is disposed on the base frame, the base frame comprising a base plate and a pair of support members connected to the base plate, each of the pair of support members comprising a portion spaced a vertical distance from the base plate and parallel to the base plate, and the top flange abuts against the portions of the pair of support members; transporting the wafer carrier to a destination location by the automated wafer carrier handling device; and The top flange mounted on the wafer carrier is released from the automated wafer carrier handling device at the destination location.

10. The method of claim 9, wherein bringing the automated wafer carrier handling device into abutting contact with the top flange comprises: moving the base frame of the automated wafer carrier handling device in a first direction within a gap between the top flange and the wafer carrier; and The base frame of the automated wafer carrier handling device is moved in a second direction to contact the top flange, wherein the second direction is perpendicular to the first direction.

11. The method of claim 10, wherein bringing the automated wafer carrier handling device into abutting contact with the top flange comprises: The engagement mechanism of the automated wafer carrier handling device is moved in a third direction to engage with the aperture of the top flange, wherein the third direction is opposite to the second direction.

12. The method of claim 11, wherein releasing the top flange from the automated wafer carrier handling device comprises: The engagement mechanism of the automated wafer carrier handling device is recovered in the second direction from the hole of the top flange.

13. The method of claim 10, wherein releasing the top flange from the automated wafer carrier handling device comprises: The base frame of the automated wafer carrier handling device is moved in a third direction to be suspended in a gap between the top flange and the wafer carrier, wherein the third direction is opposite to the second direction.

14. The method of claim 13, wherein releasing the top flange from the automated wafer carrier handling device further comprises: After moving the base frame of the automated wafer carrier handling device in the third direction, the base frame of the automated wafer carrier handling device is moved in a fourth direction away from the wafer carrier, wherein the fourth direction is opposite to the first direction.

15. The method for automated wafer carrier handling according to claim 10, further comprising: During transport of the wafer carrier to the destination location, the distance between the automated wafer carrier handling device and surrounding objects is detected.

16. A method for automated wafer carrier handling, comprising: moving a base frame of the device in a gap between the top flange and a wafer carrier to contact the top flange, wherein the top flange is mounted on the wafer carrier, the base frame comprising a base plate and a pair of support members connected to the base plate, each of the pair of support members comprising a portion spaced a vertical distance from the base plate and parallel to the base plate, and the top flange abuts against the portions of the pair of support members; lowering an active expansion assembly of the device to engage the aperture of the top flange, wherein the active expansion assembly is disposed on the base frame; and The top flange mounted on the wafer carrier is moved via the apparatus to transport the wafer carrier.

17. The method of claim 16, wherein moving the base frame of the apparatus to contact the top flange comprises: moving the base frame in a first direction along a side of the wafer carrier; and The base frame is moved in a second direction perpendicular to the first direction to abut against the top flange.

18. The operating method for automated wafer carrier handling according to claim 16, wherein when the base frame of the apparatus is moved to contact the top flange, the engaging portion of the active expansion member is received in a groove of the base frame.

19. An operating method for automated wafer carrier handling according to claim 16, wherein when the active extension component of the device is lowered to engage with the hole of the top flange, the engaging portion of the active extension component is moved out of the groove of the base frame and unfolded to be inserted into the hole of the top flange.

20. The method for automated wafer carrier handling according to claim 16, further comprising: loading the wafer carrier at a predetermined position; recovering the active expansion assembly of the device from the hole of the top flange; and The base frame is released from the top flange.

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