Information processing method, information processing apparatus, and computer-readable storage medium

Abstract

The present invention describes an information processing method, an information processing apparatus, and a computer-readable storage medium that are effective for evaluating a processing state of a surface of a substrate with high reliability based on a surface image of the substrate. One example of the information processing method can include: a step of acquiring information of a deformation factor of a surface of a target substrate; a step of acquiring a surface image of the target substrate; a step of calculating a correction coefficient that compensates for a change in the image due to deformation of the surface based on the information of the deformation factor of the surface; and a step of correcting the surface image of the target substrate using the correction coefficient to generate a corrected image of the target substrate.

Description

Technical Field

[0001] This invention relates to information processing methods, information processing apparatus, and computer-readable storage media. Background Technology

[0002] Patent document 1 discloses an apparatus for calculating the film thickness of a film formed on a substrate based on an image captured on the substrate surface.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-215193 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This invention describes an effective information processing method, information processing apparatus, and computer-readable storage medium for evaluating the surface processing status of a substrate with high reliability based on a surface image of the substrate.

[0008] Technical solutions for solving technical problems

[0009] An example of an information processing method may include: a step of acquiring information about the deformation factor of the surface of an object substrate; a step of acquiring a surface image of the object substrate; a step of calculating a correction coefficient based on the surface deformation factor information to compensate for image changes caused by surface deformation; and a step of correcting the surface image of the object substrate using the correction coefficient to generate a corrected image of the object substrate.

[0010] Invention Effects

[0011] The information processing method, information processing apparatus, and computer-readable storage medium of the present invention are effective for evaluating the surface processing status of a substrate with high reliability based on a substrate surface image. Attached Figure Description

[0012] Figure 1 This is a three-dimensional diagram representing an example of a substrate processing system.

[0013] Figure 2 yes Figure 1 Sectional view of line II-II.

[0014] Figure 3 This is a top view showing an example of a processing module.

[0015] Figure 4 This is a cross-sectional view showing an example of an inspection unit viewed from above.

[0016] Figure 5This is a cross-sectional view showing an example of an inspection unit viewed from the side.

[0017] Figure 6 This is a three-dimensional diagram representing an example of an inspection unit.

[0018] Figure 7 This is a stereoscopic view showing an example of a peripheral sub-unit photographed from the front.

[0019] Figure 8 This is a stereoscopic diagram showing an example of a peripheral sub-unit photographed from the rear.

[0020] Figure 9 This is a top view showing an example of a peripheral shooting sub-unit.

[0021] Figure 10 This is a side view showing an example of a peripheral shooting sub-unit.

[0022] Figure 11 This is a perspective view showing an example of a reflective component.

[0023] Figure 12 This is a side view showing an example of a reflective component.

[0024] Figure 13 (a) is a diagram illustrating the reflection of light from the lighting component by the reflective element. Figure 13 (b) is a diagram illustrating the reflection of light from the substrate in the reflective component.

[0025] Figure 14 This is a block diagram representing an example of the main components of a substrate processing system.

[0026] Figure 15 This is a schematic diagram illustrating an example of the hardware structure of the controller.

[0027] Figure 16 This is a flowchart illustrating an example of the process for calculating the warpage factor.

[0028] Figure 17 (a) is a three-dimensional diagram representing a substrate with an upwardly convex paraboloid shape. Figure 17 (b) is a three-dimensional view of a substrate with a downwardly convex parabolic shape.

[0029] Figure 18 This is an example diagram showing a surface image of a reference substrate in the shape of a dome.

[0030] Figure 19 This is a diagram showing an example of the outline of a reference substrate.

[0031] Figure 20This is a flowchart illustrating an example of the steps for correcting substrate warping.

[0032] Figure 21 This is a schematic diagram showing the tilted holding stage and substrate.

[0033] Figure 22 This is a cross-sectional view of an example of an inspection unit viewed from above.

[0034] Figure 23 This is a flowchart illustrating an example of the process for calculating coefficient models.

[0035] Figure 24 This is a flowchart illustrating an example of the process for generating a corrected image.

[0036] Explanation of reference numerals in the attached figures

[0037] 1…Substrate processing system; 2…Coating and developing apparatus; 100…Housing; 200…Rotation holding unit (substrate holding section); 300…Surface imaging unit; 400…Peripheral imaging unit; Ctr…Controller (information processing device); Ctr2…Processor (computing unit, generation unit); Ctr3…Memory (storage unit); Ctr4…Memory (storage unit); M2…Storage unit; M3…Processing unit; M31…Computing unit; M32…Generation unit; RM…Storage medium; U3…Inspection unit; W, W A W P ...substrate; W S W SF W SW ...reference substrate; Wa...surface Detailed Implementation

[0038] In the following description, the same reference numerals are used to mark the same elements or elements with the same function, and repeated descriptions are omitted.

[0039] 1. First Implementation Method

[0040] [Substrate Processing System]

[0041] like Figure 1 and Figure 2 As shown, the substrate processing system 1 includes a coating and developing device 2 (substrate processing device), an exposure device 3, and a controller Ctr (information processing device).

[0042] Exposure apparatus 3 transfers substrate W between itself and coating and developing apparatus 2, and forms Wa (refer to) on the surface of substrate W. Figure 4Exposure treatment (pattern exposure) of a resist film (photosensitive coating), etc. The exposure apparatus 3 selectively irradiates energy lines onto the exposed portion of the resist film by methods such as immersion exposure.

[0043] Energy lines can be categorized as either ionizing or non-ionizing radiation. Ionizing radiation possesses sufficient energy to ionize atoms or molecules. Examples of ionizing radiation include extreme ultraviolet (EUV), electron beams, ion beams, X-rays, alpha rays, beta rays, gamma rays, heavy particle rays, and proton rays. Non-ionizing radiation lacks sufficient energy to ionize atoms or molecules. Examples of non-ionizing radiation include gamma rays, i-rays, KrF stimulated excimer lasers, ArF stimulated excimer lasers, and F2 stimulated excimer lasers.

[0044] The coating and developing apparatus 2 forms a resist film on the surface Wa of the substrate W before the exposure process performed by the exposure apparatus 3. The coating and developing apparatus 2 then performs a development process on the resist film after the exposure process.

[0045] The substrate W can be in the shape of a circular plate, but it can also be in a shape other than a circle, such as a polygon. The substrate W may have a notch. The notch can be, for example, a notch (U-shaped, V-shaped, etc.) or a straight section extending in a straight line (i.e., an orientation flat). The substrate W can be, for example, a semiconductor substrate, a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, and various other substrates. The diameter of the substrate W can be, for example, between 200 mm and 450 mm.

[0046] like Figures 1-3 As shown, the coating and developing apparatus 2 has a carrier block 4, a processing block 5, and an interface block 6. The carrier block 4, processing block 5, and interface block 6 are arranged side by side in the horizontal direction.

[0047] like Figure 1 and Figure 3 As shown, the carrier block 4 has a carrier platform 12 and a feed / discharge section 13. The carrier platform 12 supports a plurality of carriers 11. Each carrier 11 houses at least one substrate W in a sealed state. An opening / closing door (not shown) for allowing the substrate W to enter or exit is provided on the side 11a of the carrier 11. The carrier 11 is detachably mounted on the carrier platform 12 with its side 11a facing the feed / discharge section 13.

[0048] The feed-in / feed-out section 13 is located between the carrier stage 12 and the processing block 5. The feed-in / feed-out section 13 has multiple opening / closing doors 13a. When the carrier 11 is placed on the carrier stage 12, the opening / closing doors of the carrier 11 face the opening / closing doors 13a. By simultaneously opening the opening / closing doors 13a and the side doors 11a, communication is established between the carrier 11 and the feed-in / feed-out section 13. The feed-in / feed-out section 13 has a built-in conveyor arm A1. The conveyor arm A1 can remove the substrate W from the carrier 11 and transfer it to the processing block 5, and receive the substrate W from the processing block 5 and return it to the carrier 11.

[0049] like Figures 1-3 As shown, processing block 5 includes processing modules PM1 to PM4. These processing modules are arranged sequentially from the bottom surface in the order of processing module PM4, processing module PM1, processing module PM2, and processing module PM3. Figure 3 As shown, the processing modules PM1 to PM4 include a liquid treatment unit U1, a heat treatment unit U2, and an inspection unit U3. Details of the inspection unit U3 will be explained later.

[0050] The processing module PM1 is constructed by forming a lower layer film on the surface of the substrate W, and is also known as the BCT module. For example... Figure 2 and Figure 3 As shown, the processing module PM1 includes units U1 to U3 and a transport arm A2 for transporting the substrate W to each unit U1 to U3. The liquid treatment unit U1 of the processing module PM1 can, for example, apply a coating liquid for forming a lower layer film onto the substrate W. The heat treatment unit U2 of the processing module PM1 can, for example, perform a heat treatment to cure the coating film formed on the substrate W by the liquid treatment unit U1 into a lower layer film. An anti-reflective (SiARC) film can be cited as an example of a lower layer film.

[0051] The PM2 processing module can form an intermediate film (hard mask) on the lower film, and is also known as the HMCT module. For example... Figure 2 and Figure 3 As shown, the processing module PM2 includes units U1 to U3 and a transport arm A3 for transporting the substrate W to each unit U1 to U3. The liquid treatment unit U1 of the processing module PM2 can, for example, apply a coating liquid for intermediate film formation to the substrate W. The heat treatment unit U2 of the processing module PM2 can, for example, perform a heat treatment to cure the coating film formed on the substrate W by the liquid treatment unit U1 into an intermediate film. Examples of intermediate films include SOC (Spin On Carbon) films and amorphous carbon films.

[0052] The PM3 processing module can form a thermosetting and photosensitive resist film on the intermediate film, also known as a COT module. For example... Figure 2 and Figure 3As shown, the processing module PM3 includes units U1 to U3 and a transport arm A4 for transporting substrates W to each unit U1 to U3. The liquid treatment unit U1 of the processing module PM3, for example, can apply a coating liquid for forming a resist film onto the substrate W. The heat treatment unit U2 of the processing module PM3, for example, can perform a heat treatment (PAB: Pre-Applied Bake) to cure the coating film formed on the substrate W by the liquid treatment unit U1 into a resist film.

[0053] The PM4 processing module, also known as the DEV module, is responsible for developing the resist film after exposure. Figure 2 and Figure 3 As shown, the processing module PM4 includes units U1 to U3 and a transport arm A5 for transporting substrates W to each unit U1 to U3. The processing module PM4 also includes a transport arm A6 that directly transports substrates W between shelf units 14 and 15 without passing through units U1 to U3. The liquid treatment unit U1 of the processing module PM4, for example, can partially remove the resist film to form a resist pattern. The heat treatment unit U2 of the processing module PM4 can perform heat treatment before development (PEB: Post Exposure Bake) and heat treatment after development (PB: Post Bake), etc.

[0054] like Figure 2 and Figure 3 As shown, processing block 5 includes a shelf unit 14 located on the side of carrier block 4. The shelf unit 14 is arranged across processing module PM3 from the bottom surface and is divided into multiple small chambers arranged side by side in the vertical direction. A conveyor arm A7 is arranged near the shelf unit 14. The conveyor arm A7 causes the substrate W to move up and down between the small chambers of the shelf unit 14.

[0055] Processing block 5 includes a shelf unit 15 located in interface block 6. The shelf unit 15 is arranged from the bottom surface across the upper part of processing module PM4 and is divided into multiple small compartments arranged side by side in the vertical direction.

[0056] Interface block 6 has a built-in conveyor arm A8, which is connected to the exposure device 3. The conveyor arm A8 takes out the substrate W from the shelf unit 15 and delivers it to the exposure device 3, and receives the substrate W from the exposure device 3 and sends it back to the shelf unit 15.

[0057] The controller Ctr can partially or entirely control the coating and developing apparatus 2. Details of the controller Ctr will be described later. The controller Ctr sends and receives signals between itself and the controller of the exposure apparatus 3, and can control the substrate processing system 1 as a whole through linkage with the controller of the exposure apparatus 3.

[0058] [Structure of the inspection unit]

[0059] Below, refer to Figures 4 to 13 The inspection unit U3 will be described in further detail. For example... Figures 4-6 As shown, the inspection unit U3 includes a housing 100, a rotation holding unit 200 (substrate holding part), a surface imaging unit 300, and a peripheral imaging unit 400. Each unit 200 to 400 is disposed within the housing 100. Figure 4 and Figure 5 As shown, an inlet / outlet 101 is formed on one end wall of the housing 100 for feeding the substrate W into the interior of the housing 100 or feeding the substrate W out to the exterior of the housing 100.

[0060] like Figure 5 and Figure 6 As shown, the rotary holding unit 200 includes a holding stage 201, actuators 202 and 203, and a guide rail 204. The holding stage 201 is, for example, an adsorption chuck that holds the substrate W in a generally horizontal position by adsorption. The shape of the holding stage 201 (adsorption chuck) is not particularly limited, but it can be, for example, circular. The size of the holding stage 201 can be smaller than that of the substrate W. When the holding stage 201 is circular, its size is, for example, a diameter of about 80 mm.

[0061] The actuator 202, for example, is an electric motor that drives the holding stage 201 to rotate. The actuator 202 is capable of rotating the substrate W held on the holding stage 201. The actuator 202 may include an encoder for detecting the rotational position of the holding stage 201. In this case, it is possible to correlate the imaging position and rotational position of each facet of the substrate W based on each unit 300, 400. If the substrate W has a notch, the orientation of the substrate W can be determined based on the notch identified by each unit 300, 400 and the rotational position detected by the encoder.

[0062] Actuator 203, for example, is a linear actuator that moves stage 201 along guide rail 204. Actuator 203 is capable of conveying the substrate W held on stage 201 between one end and the other end of guide rail 204. Therefore, the substrate W held on stage 201 can move between a first position near feed outlet 101 and a second position near peripheral imaging unit 400. Guide rail 204 extends linearly (e.g., straight, curved, etc.) within housing 100.

[0063] like Figure 5 and Figure 6As shown, the surface imaging unit 300 includes a camera 310 and an illumination assembly 320. The camera 310 and the illumination assembly 320 constitute an imaging mechanism. The camera 310 includes a lens and an imaging element (e.g., a CCD image sensor, a CMOS image sensor, etc.). The camera 310 is positioned opposite the illumination assembly 320.

[0064] The lighting assembly 320 includes a half mirror 321 and a light source 322. The half mirror 321 is disposed within the housing 100 at approximately a 45° angle relative to the horizontal direction. The half mirror 321 is positioned above the middle portion of the guide rail 204, intersecting the extending direction of the guide rail 204 when viewed from above. The half mirror 321 is rectangular in shape. The length of the half mirror 321 is greater than the diameter of the substrate W.

[0065] Light source 322 is located above semi-transparent mirror 321. Light source 322 is longer than semi-transparent mirror 321. All light emitted from light source 322 passes through semi-transparent mirror 321 and shines downwards (towards guide rail 204). The light passing through semi-transparent mirror 321 is reflected by an object located below semi-transparent mirror 321, and then reflected again by semi-transparent mirror 321, passing through the lens of camera 310 and entering the imaging element of camera 310. That is, camera 310 can capture images of objects existing in the illumination area of ​​light source 322 using semi-transparent mirror 321. For example, when the holding stage 201 holding substrate W moves along guide rail 204 via actuator 203, camera 310 can capture images of the surface Wa of substrate W in the illumination area of ​​light source 322. The data of the captured image by camera 310 is sent to controller Ctr.

[0066] like Figures 7-10 As shown, the peripheral imaging unit 400 includes a camera 410, an illumination assembly 420, and a reflective component 430. The camera 410, illumination assembly 420, and reflective component 430 constitute an imaging mechanism. The camera 410 includes a lens 411 and an imaging element 412 (e.g., a CCD image sensor, a CMOS image sensor, etc.). The camera 410 is opposite to the illumination assembly 420.

[0067] like Figures 7-10 As shown, the lighting assembly 420 is positioned above the substrate W held by the holding stage 201. The lighting assembly 420 includes a light source 421, a light scattering component 422, and a holding component 423. The light source 421 is, for example, composed of multiple LED point light sources 421b (see reference). Figure 10 )constitute.

[0068] The retaining component 423 internally holds a semi-transparent, semi-reflective mirror 424, a cylindrical lens 425, a light-diffusing component 426, and a focusing lens 427. For example... Figure 8 and Figure 10 As shown, a semi-transparent, semi-reflective mirror 424 is disposed at the intersection of the through-hole 423a and the cross-hole 423b at an angle of approximately 45° relative to the horizontal direction. The semi-transparent, semi-reflective mirror 424 is rectangular.

[0069] A focusing lens 427 is disposed within the cross aperture 423b. The focusing lens 427 is not particularly limited to any lens that functions to change the combined focal length of the lens 411. For example, the focusing lens 427 may be a rectangular parallelepiped-shaped lens.

[0070] like Figure 7 and Figure 10 As shown, the reflective component 430 is positioned below the lighting assembly 420. Figure 7 and Figures 10-12 As shown, the reflective component 430 includes a main body 431 and a reflective surface 432. The main body 431 is made of an aluminum block.

[0071] like Figure 12 As shown, when the substrate W held by the holding stage 201 is in the second position within the housing 100, the reflective surface 432 is opposite to the peripheral region Wd of the end face Wc and the back face Wb of the substrate W held by the holding stage 201. The reflective surface 432 is inclined relative to the rotation axis of the holding stage 201. The reflective surface 432 is mirror-finished. For example, a reflective lens can be attached to the reflective surface 432, or it can be aluminum-plated, which can be done by vapor deposition of aluminum material.

[0072] The reflecting surface 432 is a curved surface recessed towards the side of the substrate W held by the holding stage 201, away from the end face Wc. That is, the reflecting component 430 is a concave mirror. Therefore, when the end face Wc of the substrate W is reflected by the reflecting surface 432, the image is magnified compared to the real image. The radius of curvature of the reflecting surface 432 can be, for example, between 10 mm and 30 mm. The angle θ of the reflecting surface 432 (refer to...) Figure 12 The angle can be between 100° and 150°. In addition, the angle θ of the reflecting surface 432 is the angle formed by the two planes that are externally tangent to the reflecting surface 432.

[0073] In the illumination assembly 420, light emitted from the light source 421 is scattered by the light scattering component 422, amplified by the cylindrical lens 425, and then diffused by the light diffusion component 426 before being entirely reflected downwards through the semi-transparent mirror 424. The diffused light passing through the semi-transparent mirror 424 is reflected at the reflecting surface 432 of the reflecting component 430 located below the semi-transparent mirror 424. With the substrate W held by the holding stage 201 in the second position, the reflected light obtained by the reflection of the diffused light at the reflecting surface 432 is as follows: Figure 13 As shown in (a), the irradiation mainly targets the end face Wc of the substrate W and the peripheral area Wd of the surface Wa.

[0074] The reflected light from the peripheral region Wd of the surface Wa of the substrate W does not go to the reflecting surface 432 of the reflecting component 430, but is reflected again by the semi-transparent mirror 424 (see reference). Figure 13 (b) The light, without passing through the focusing lens 427, passes through the lens 411 of the camera 410 and enters the imaging element 412 of the camera 410. On the other hand, the reflected light from the end face Wc of the substrate W is reflected sequentially by the reflecting surface 432 of the reflecting member 430 and the semi-transparent mirror 424, and then passes through the focusing lens 427 and the lens 411 of the camera 410 before entering the imaging element 412 of the camera 410. Therefore, the optical path length of the light from the end face Wc of the substrate W to the imaging element 412 of the camera 410 is longer than the optical path length of the light from the peripheral region Wd of the surface Wa of the substrate W to the imaging element 412 of the camera 410. The optical path difference described above can be, for example, between 1 mm and 10 mm. As described above, the imaging element 412 of the camera 410 receives both the light from the peripheral region Wd of the surface Wa of the substrate W and the light from the end face Wc of the substrate W. That is, when the substrate W held by the stage 201 is in the second position within the housing 100, the camera 410 is able to capture images of both the peripheral region Wd of the surface Wa of the substrate W and the end face Wc of the substrate W. The data of the captured image by the camera 410 is sent to the controller Ctr.

[0075] [Controller Structure]

[0076] The controller Ctr controls the inspection unit U3 to acquire image information of the surface Wa of the substrate W as information representing the processing state of the surface Wa of the substrate W. Here, the image information of the surface Wa of the substrate W can change according to the processing state of the surface Wa of the substrate W, thus the processing state of the surface Wa of the substrate W can be understood based on the image information of the surface Wa of the substrate W. However, the image information of the surface Wa of the substrate W may also be affected by the deformation of the surface Wa of the substrate W. Therefore, the controller Ctr can execute an information processing method, which includes: acquiring information about the deformation factor of the surface of the target substrate; acquiring an image of the surface of the target substrate; calculating a correction coefficient based on the deformation factor information to compensate for image changes caused by surface deformation; and correcting the surface image of the target substrate using the correction coefficient to generate a corrected image of the target substrate.

[0077] According to this information processing method, correction coefficients are calculated based on information about the surface deformation factor. These correction coefficients are then used to correct the surface image of the substrate, thereby easily removing the influence of image changes caused by surface deformation of the substrate. Therefore, it is effective to evaluate the surface processing state of the substrate with higher accuracy based on the surface image. The deformation of the surface Wa of the substrate W includes surface distortion and overall tilting of the surface Wa. Specific examples of the deformation factor of the surface Wa of the substrate W include warping of the substrate W, deformation of the substrate W due to the unevenness of the surface of the holding stage 201, and tilting of the substrate W due to the tilting of the holding stage 201.

[0078] like Figure 14 As shown, the controller Ctr has a read unit M1, a storage unit M2, a processing unit M3, and an indicator unit M4 as functional modules. These functional modules are merely simplified representations of the controller Ctr's functionality and do not necessarily imply that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to implementation through program execution; it can also be implemented using dedicated circuits (e.g., logic circuits) or integrated circuits (ASICs).

[0079] The reading unit M1 reads the program from the computer-readable storage medium RM. The storage medium RM stores the program for operating the various parts of the coating and developing apparatus 2. The storage medium RM can be, for example, a semiconductor memory, an optical disk, a magnetic disk, or a magneto-optical disk.

[0080] Storage unit M2 stores various types of data. Storage unit M2 stores, for example, programs read from storage medium RM in read unit M1, images (surface images) of the surface Wa of substrate W captured by cameras 310 and 410, and various information about substrate W (details will be explained later, such as warpage amount, warpage coefficient, correction coefficient, correction image, etc.), setting data input by the operator using an external input device (not shown), etc.

[0081] The processing unit M3 processes various data. For example, based on various data stored in the storage unit M2, the processing unit M3 can generate operating signals for operating the liquid processing unit U1, the heat treatment unit U2, the holding stage 201, the actuator 203, the cameras 310 and 410, the light sources 322 and 421, etc. The processing unit M3 includes a calculation unit M31 and a generation unit M32 (details will be explained later).

[0082] The instruction unit M4 sends the action signals generated in the processing unit M3 to various devices.

[0083] The hardware of the controller Ctr may consist of, for example, one or more control computers. As a hardware structure, the controller Ctr has, for example… Figure 15 The circuit shown is Ctr1. Circuit Ctr1 can be composed of circuit elements. Specifically, circuit Ctr1 includes a processor Ctr2 (computation unit, generation unit), a memory Ctr3 (storage unit), a storage unit Ctr4 (memory unit), a driver Ctr5, and an input / output port Ctr6.

[0084] The processor Ctr2, in cooperation with at least one of the memory Ctr3 and storage Ctr4, executes the program and performs input / output of signals via the input / output port Ctr6, thereby constituting the aforementioned functional modules. The memory Ctr3 and storage Ctr4 function as the storage unit M2. The driver Ctr5 is a circuit that drives the various devices of the coating and developing apparatus 2. The input / output port Ctr6 performs signal input / output between the driver Ctr5 and the various devices of the coating and developing apparatus 2 (e.g., liquid processing unit U1, heat treatment unit U2, holding stage 201, actuator 203, cameras 310, 410, light sources 322, 421, etc.).

[0085] The substrate processing system 1 may have one controller Ctr or a controller group (control unit) consisting of multiple controller Ctrs. When the substrate processing system 1 has a controller group, the aforementioned functional modules may be implemented by one controller Ctr or by a combination of two or more controller Ctrs. When the controller Ctr consists of multiple computers (circuit Ctr1), the aforementioned functional modules may be implemented by one computer (circuit Ctr1) or by a combination of two or more computers (circuit Ctr1). The controller Ctr may also have multiple processors Ctr2. In this case, the aforementioned functional modules may be implemented by one processor Ctr2 or by a combination of two or more processor Ctr2s.

[0086] The following describes an information processing method based on the controller Ctr, focusing primarily on the case of warpage of the substrate W, using the aforementioned deformation factor of the surface Wa as an example. In this case, the step of obtaining information about the deformation factor of the surface Wa in the aforementioned information processing method based on the controller Ctr includes obtaining the warpage amount of the target substrate, and the step of calculating the correction coefficient based on the deformation factor of the surface Wa includes calculating the correction coefficient based on the warpage coefficient of a reference substrate with known warpage amount and the warpage amount of the target substrate. The following will describe this information processing method in detail, dividing it into a method for calculating the warpage coefficient and a correction method.

[0087] [Method for calculating the warpage factor]

[0088] Below, refer to Figure 16 The method for obtaining the warpage coefficient based on the reference substrate using the inspection unit U3 is explained.

[0089] Here, the reference substrate refers to a substrate W whose flatness is known, and will be labeled "W" in the following figures. S "Reference substrate W" S It can contain a flat reference substrate W SF Non-flat reference substrate W SW Reference substrate W SW This includes, for example Figure 17 The reference substrate W shown in (a) has an upwardly convex parabolic shape. S (A dome shape that curves lower towards the periphery), and like Figure 17 The reference substrate W shown in (b) has a downward-convex parabolic shape (a bowl-shaped shape that warps upwards towards the periphery). S .

[0090] As a reference substrate W S Flatness evaluation metrics include, for example, GBIR (Global Backside Ideal Focal Plane Range), SFQR (Site Frontside Least Squares Focal Plane Range), SBIR (Site Backside Ideal Focal Plane Range), ROA (Roll Off Amount), ESFQR (Site Frontside Least Squares Focal Plane Range), and ZDD (Z-height Double Differentiation), all defined by SEMI (Semiconductor Equipment and Materials International) standards. The reference substrate W... SF For example, it can have a flatness of 100nm with a maximum SFQR value, it can have a flatness of 42nm with a maximum SFQR value, it can have a flatness of 32nm with a maximum SFQR value, and it can have a flatness of 16nm with a maximum SFQR value.

[0091] First, the controller Ctr controls each part of the coating and developing unit 2 to place the reference substrate WS The sample is transported to inspection unit U3 (step S11). Next, controller Ctr controls the rotation holding unit 200 to hold the reference substrate W on the holding stage 201. S Next, the controller Ctr controls the rotary holding unit 200, which moves the holding stage 201 from the first position to the second position along the guide rail 204 via the actuator 203.

[0092] At this time, the controller Ctr controls the surface imaging unit 300 to turn on the light source 322, and the camera 310 takes pictures (step S12). Reference substrate W S Upon reaching the second position, when the imaging by camera 310 is complete, the data of the captured image (surface image) is sent to the storage unit M2. When the imaging by camera 310 is complete, the reference substrate W... S It is located between the lighting component 420 and the reflector 430.

[0093] Here, Figure 18 The reference substrate W representing the dome shape SW An example of a surface image. For example... Figure 18 As shown, the brightness values ​​of the surface image are based on the reference substrate W. SW The brightness varies depending on the warping state. In the following text, the brightness value at any coordinate (x, y) of a pixel in the surface image is sometimes denoted as I(x, y).

[0094] Next, the controller Ctr controls the rotary holding unit 200, which in turn rotates the holding stage 201 via the actuator 202. This causes the reference substrate W... S Rotation. In this state, the controller Ctr controls the peripheral imaging unit 400 to turn on the light source 421, and the camera 410 takes pictures (step S13). This allows the reference substrate W to be photographed. S The end face. The reference substrate W obtained by camera 410. S The captured image of the end face (end face image) is stored in storage unit M2.

[0095] Next, the calculation unit M31 calculates the reference substrate W based on the end face image obtained in step S12. S The contour line (warping amount) (step S14). The calculation unit M31, for example, identifies the reference substrate W based on the contrast difference of the end face image. S The upper and lower edges of the end face are then calculated. The calculation unit M31 then calculates a line passing through the midpoint between these upper and lower edges as the contour line. In this way, the reference substrate W can be obtained. S The shape of the end face. Furthermore, as an example, Figure 19 Indicates the reference substrate W S The outlines are P0, P1, and P2.

[0096] Contour line P0 is the reference substrate W SF Examples of contour lines. Contour lines P1 and P2 are respectively the reference substrate W. SW Examples of outlines.

[0097] Contour line P1 is the dome-shaped reference substrate W SW (Refer to Figure 17 Example of the contour line of (a)). In the case of the reference substrate W S With the central part as the reference, the dome-shaped reference substrate W SW The height of its perimeter is greater than that of the reference substrate W SF The periphery is low in height, so the outline P1 tends to extend along the outline P0 without exceeding the outline P0 (see same figure).

[0098] Contour line P2 is the reference substrate W in a bowl shape. SW (Refer to Figure 17 Example of the contour line in (b)). On the reference substrate W S With the central part as the reference, the bowl-shaped reference substrate W SW The height of its perimeter is greater than that of the reference substrate W SF The perimeter is high, so the outline P2 tends to extend along the outline P0 at a height no lower than the outline P0 (see the same figure).

[0099] Next, the computing unit M31 is based on the reference substrate W SF The contour line P0 and the reference substrate W SW The contour lines P1 and P2 are used to calculate the reference substrate W. SW Relative to the reference substrate W SF The relative warpage (warpage amount) (step S15). For example, on the reference substrate W SW In the case of a dome shape, the computing unit M31 can also be connected to the reference substrate W. SW The value of the contour line P1 at the specified coordinates (angles) minus the value of the reference substrate W at that coordinate. SF The relative warpage ΔP (μm) is calculated using the value of the contour line P0. For example, the calculation unit M31 can calculate the relative warpage ΔP at the 90° position using the following formula.

[0100] ΔP = P1(90°) - P0(90°)

[0101] The calculation unit M31 can also be based on the average value P1 of the contour line P1. M The average value of the contour line P2 M The difference is used to calculate the relative warpage ΔP. The calculation unit M31 can calculate the relative warpage ΔP, for example, using the following formula.

[0102] ΔP=P1 M -P2 M

[0103] Next, the calculation unit M31 calculates based on the relative warpage ΔP and the reference substrate W. SW The surface image is used to calculate the warpage coefficient A(x, y) (step S16). The calculation unit M31 can, for example, calculate the warpage coefficient A(x, y) based on the relative warpage ΔP and the reference substrate W. SW The brightness value I of the surface image W (x, y), calculate the reference substrate W for each pixel. SW The intensity change of the brightness value for every 1 μm of warping is calculated and used as the warping coefficient A(x, y).

[0104] At this point, it can also replace the brightness value I. W (x, y), using the brightness value I W (x, y) divided by the reference substrate W SF The brightness value I of the surface image F (x, y) divided by the obtained standardized data I N The warping coefficient A(x, y) is calculated using the formula (x, y). The calculation unit M31 can calculate the warping coefficient A(x, y) using, for example, the following formula.

[0105] A(x, y) = |1 - I N (x, y)| / |ΔP|

[0106] Alternatively, the reference substrate W can be used. SW The brightness value of the central part of the surface image is taken as the reference substrate W. SF The brightness value obtained from the surface image is considered as the brightness value I. F '(x, y)' is used to calculate the standardized data I. N (x, y). Considered as luminance value I F '(x, y) could, for example, be on a reference substrate W SW In the surface image, the pixels arranged in the Y direction of the central part are averaged, and this value is used as the brightness value of all pixels in the Y direction. The same operation is performed on all pixels in the X direction to obtain the brightness value.

[0107] [Correction Method]

[0108] Below, refer to Figure 20 The substrate W (hereinafter referred to as substrate W) used for calibrating products using the inspection unit U3. P The method of explaining how the warping of ( ) affects the captured image is explained.

[0109] First, the controller Ctr controls each part of the coating and developing unit 2 to coat the substrate W. P The substrate is then transported to inspection unit U3 (step S21). Next, controller Ctr controls the rotary holding unit 200 to hold the substrate W on the holding stage 201. Then, controller Ctr controls the rotary holding unit 200 to move the holding stage 201 from the first position to the second position along the guide rail 204 via actuator 203.

[0110] At this time, the controller Ctr controls the surface imaging unit 300 to turn on the light source 322, and the camera 310 takes pictures (step S22). Substrate W P Upon reaching the second position, when the shooting by camera 310 is completed, the substrate W captured by camera 310 will be... P The captured image (surface image) data of the surface is sent to the storage unit M2. When the shooting by the camera 310 is completed, the substrate W... P It is located between the lighting component 420 and the reflector 430.

[0111] Next, the controller Ctr controls the rotary holding unit 200, which in turn rotates the holding stage 201 via the actuator 202. This causes the substrate W... P Rotation. In this state, the controller Ctr controls the peripheral imaging unit 400 to turn on the light source 421, and the camera 410 takes pictures (step S23). This allows the substrate W to be captured. P The end face. The substrate W obtained by camera 410 P The captured image of the end face (end face image) is stored in storage unit M2.

[0112] Next, the computing unit M31 calculates the substrate W based on the end face image obtained in step S12. P The contour line (warping amount) (step S24). The calculation unit M31, for example, identifies the substrate W based on the contrast difference of the end face image. P The upper and lower edges of the end face are then calculated. The calculation unit M31 then calculates the line passing through the midpoint between these upper and lower edges as the contour line PX. In this way, the substrate W can be obtained. P The shape of the end face.

[0113] Next, the computing unit M31 is based on the reference substrate W SF The outline P0 and the substrate W P The contour line PX is used to calculate the substrate W. P Relative to the reference substrate W SF The relative warpage amount (warpage amount) (step S25). For example, the calculation unit M31 can also obtain the relative warpage amount from the reference substrate W. SF The value of the contour line P1 at the specified coordinates (angles) minus the value of the substrate W at that coordinate. PThe relative warpage ΔQ (μm) is calculated using the value of the contour line PX. For example, the calculation unit M31 can calculate the relative warpage ΔQ at the 90° position using the following formula.

[0114] ΔQ=PX(90°)-P0(90°)

[0115] Next, the calculation unit M31 calculates the correction coefficient B(x, y) based on the relative warpage Q and the warpage coefficient A(x, y) calculated in step S16 (step S26). The calculation unit M31 can calculate the correction coefficient B(x, y) for example using the following formula.

[0116] B(x, y) = A(x, y) × ΔQ + 1

[0117] Next, the generation unit M32 is based on the substrate W P The brightness value I(x, y) of the surface image and the correction coefficient B(x, y) calculated in step S26 are used to calculate the value from the substrate W. P The brightness value J(x, y) of the corrected image obtained by removing the warping effect from the surface image is calculated by the generation unit M32, for example, by dividing the brightness value I(x, y) by the correction coefficient B(x, y). Thus, it is possible to generate a corrected image of the substrate W. P Corrected image of the effect caused by warping (step S27).

[0118] [effect]

[0119] Following the examples above, it is possible to determine the basis for the warpage of a reference substrate W based on the known warpage amount. S The warpage coefficient A(x, y) and the substrate W from which the correction coefficient B(x, y) is to be calculated. P The correction coefficient B(x, y) is obtained by using the relative warp amount ΔQ of the substrate itself. Therefore, the substrate W can be appropriately corrected based on the relative warp amount ΔQ, which includes its own parameters. P Surface image of the substrate W. Therefore, on the substrate W... P Even in the presence of warping, it is possible to obtain a corrected image with high precision that corrects for the effects of warping.

[0120] Based on the above examples, it is possible to analyze the reference substrate W. SW The warping coefficient A(x, y) is calculated for each pixel of the surface image. In this case, the correction coefficient B(x, y) also becomes related to the substrate W. P The values ​​corresponding to each pixel of the surface image are given. Therefore, by using the warp coefficient A(x, y), it is possible to more easily calculate the warp values ​​relative to the substrate W. P The surface image has corresponding correction coefficients B(x, y) for each pixel. Furthermore, on the substrate W... PIn the presence of warpage, the effects of warpage can be corrected more effectively by using a correction factor B(x,y).

[0121] Following the above example, based on the reference substrate W SW The brightness value I of the surface image W (x, y) can be used on the reference substrate W SW The warpage coefficient A(x, y) is calculated for each pixel of the surface image. In this case, the substrate W is corrected by using the correction coefficient B(x, y) obtained from the warpage coefficient A(x, y). P The brightness values ​​of each pixel in the surface image can be used to generate a corrected image. Therefore, the warping coefficient A(x, y) and the corrected image can be obtained through such a simple method as calculating the brightness values.

[0122] Based on the examples above, standardized data I can be used. N Calculate the warping coefficient A(x,y) from (x,y). In this case, using the warping coefficient A(x,y) simplifies subsequent calculations.

[0123] Following the example above, the reference substrate W SW The warpage amount can be used as a reference substrate W SF The contour line P0 and the reference substrate W SW The relative warpage ΔP of the contour lines P1 and P2 is used for calculation. In this case, the warpage caused by the reference substrate W can be removed. SF The warping effect caused by the weight of the object is considered. Therefore, the warping coefficient A(x, y) can be calculated with high accuracy.

[0124] Following the examples above, substrate W P The warpage amount can be used as a reference substrate W SF The outline P0 and the substrate W P The relative warpage ΔQ of the contour line PX is used for calculation. In this case, it is possible to remove the substrate W. P The warping effect caused by the substrate's own weight. Therefore, a high-precision correction coefficient B(x, y) can be calculated. Therefore, on the substrate W... P In the presence of warpage, it can also more effectively correct the effects of warpage.

[0125] However, generally speaking, the color information of each pixel changes depending on the amount of warpage of the substrate W. Therefore, as in the example above, based on the reference substrate W... SW Warpage amount and reference substrate W SW Based on the correspondence between the surface images, the warpage coefficient A(x, y) is modeled. Therefore, based on the warpage coefficient A(x, y) and the substrate W... PThe correlation of warpage can be used to calculate the substrate W simply and directly. P Correction coefficients for the surface image.

[0126] Following the example above, the reference substrate W S Measurement of warpage and reference substrate W S The surface imaging was performed within the same housing 100. Similarly, the substrate W... P Measurement of warpage and substrate W P The surface imaging was performed within the same housing 100. Therefore, the substrate W... P Or reference substrate W S The transmission is minimized, thus enabling high-speed acquisition of the warp coefficient A(x,y) or the corrected image.

[0127] [Variation Example]

[0128] The disclosure in this specification is illustrative in all respects and should not be construed as restrictive. Various omissions, substitutions, and modifications can be made to the above examples without departing from the scope and spirit of the claims.

[0129] (1) The reflective surface 432 can be in other shapes than a curved surface (e.g., a flat surface).

[0130] (2) It can be that the peripheral shooting unit 400 does not include the focusing lens 427.

[0131] (3) The peripheral imaging unit 400 may not include any of the light scattering component 422, cylindrical lens 425 and light diffusion component 426.

[0132] (4) The inspection unit U3 can be configured in the shelf units 14 and 15.

[0133] (5) can be that each time the reference substrate W is calculated, S Or substrate W P When considering the warp amount (relative warp amounts ΔP, ΔQ), only a reference substrate W can be photographed. S Or substrate W P The shooting agency for the end face Wc.

[0134] (6) The substrate W rotates eccentrically or tilted about its central axis by holding the stage 201 to rotate. This is because there is axial vibration of the rotation axis of the stage 201 itself, vibration caused by the mechanical assembly tolerance of the stage 201, vibration caused by the tolerance of the adsorption surface of the stage 201, etc. As a result, the periphery of the substrate W vibrates up and down. Therefore, an adjustment substrate W (hereinafter referred to as substrate W) can also be used. AThis suppresses the effects of rotational wobbling caused by the holding stage 201, thereby correcting the warping of the substrate W with higher precision.

[0135] For example, the substrate W can be changed before calculating the warpage factor. A Compared to maintaining the angle of stage 201, and acquiring multiple substrates W A The amount of warpage (profile). The obtained profile includes the substrate W caused by the rotation holding unit 200. A The rotating and shaking components and substrate W A The warped components. Therefore, it is possible to base it on substrate W. A The multiple contour lines are used to calculate the component of rotational wobbling caused by the holding stage 201 (the tilt component of the holding stage 201).

[0136] (7) Reference substrate W can be obtained separately. SW The warpage amounts (first warpage amount and second warpage amount) of two different regions (e.g., the upper half region and the lower half region) are calculated. The reference substrate W can be calculated based on the first warpage amount and a surface image of one region. SW The first warpage coefficient of this region. The reference substrate W can be calculated based on the second warpage amount and a surface image of another region. SW The second warping coefficient of that other region.

[0137] It is possible to obtain the reference substrate W separately. SW The substrate W is set in two different regions. P The warpage amounts (third warpage and fourth warpage) are calculated for two different regions (e.g., the upper region and the lower region). The substrate W can be calculated based on the third warpage amount and the first warpage coefficient. P The first correction coefficient for a region. The substrate W can be calculated based on the fourth warp amount and the second warp coefficient. P The second correction coefficient for another region.

[0138] The substrate W can be generated using the first correction factor. P The first corrected image of a region. The substrate W can be generated using a second correction coefficient. P The second corrected image is taken from another region. The first and second corrected images described above can be combined to generate the entire substrate W. P The corrected image. Based on the above, on the reference substrate W... SW Warpage of a region and reference substrate W SW In another region with different warping amounts, and the substrate W P The warpage of a region and the substrate W PEven when the warp amount differs in another region, it is possible to obtain substrate W with higher precision. P The corrected image.

[0139] (8) It can be used to calculate warping coefficients, correction coefficients, etc. based on the color information (hue, saturation, brightness, etc.) contained in each pixel.

[0140] (9) Only the very first substrate W delivered from the carrier can be used. P Calculate the correction coefficient B(x, y). In this case, it can be based on the second or subsequent substrate W. P The brightness values ​​I(x, y) of the surface image and from the first substrate W P The obtained correction coefficients B(x, y) are used to refine the corrected image.

[0141] (10) Multiple substrates can also be acquired at other times. P The processing of the brightness value I(x, y) of the surface image (step S22) and the processing of the brightness value I(x, y) of the multiple substrates W P The process of calculating the correction coefficient B(x, y) by at least one of the following steps (steps S23 to S26). For example, this can be done when acquiring the substrate W. P After the processing of the brightness value I(x, y) of the surface image is completed (step S22), the process based on the multiple substrates W is executed. P The process of calculating the correction coefficient B(x, y) for at least one of the substrates (steps S23-S26). The correction coefficient B(x, y) can also be used to apply the correction coefficient B(x, y) to multiple already obtained substrates W. P The brightness values ​​I(x, y) of the surface image are corrected together (batch correction).

[0142] (11) The above-mentioned calculation or correction of the warping coefficient may be performed by the inspection unit U3, which is independent of the coating and developing device 2.

[0143] [Other examples]

[0144] Example 1. Another example of an information processing method includes: a step of obtaining the warp amount of an object substrate; a step of obtaining a surface image of the object substrate; a step of calculating a correction coefficient for the surface image of the object substrate based on a warp coefficient generated from a reference substrate with known warp amount and the warp amount of the object substrate; and a step of correcting the surface image of the object substrate using the correction coefficient to generate a corrected image of the object substrate. In this case, the correction coefficient can be obtained based on the warp coefficient from the reference substrate with known warp amount and the warp amount of the object substrate from which the correction coefficient is to be calculated. Therefore, the surface image of the object substrate can be appropriately corrected based on the warp amount derived from its own parameters. Thus, even when the object substrate has warp, a corrected image that corrects the effects of the warp can be obtained with higher precision.

[0145] Example 2. Alternatively, in the method of Example 1, the step of calculating the correction coefficients includes calculating the correction coefficients corresponding to each pixel of the surface image of the object substrate. In this case, the surface image of the object substrate is corrected pixel by pixel. Therefore, in the case of warping of the object substrate, the effects of warping can be corrected more effectively.

[0146] Example 3. Alternatively, in the method of Example 1 or Example 2, the step of generating the corrected image includes: correcting the brightness values ​​of each pixel in the surface image of the object substrate using correction coefficients, thereby generating the corrected image. In this case, the corrected image can be obtained by a simple method such as calculating the brightness values.

[0147] Example 4. Alternatively, in any of Examples 1 to 3, the step of obtaining the warpage amount of the object substrate includes: calculating the warpage amount of the object substrate based on the contour data in the end face of a generally flat reference substrate and the contour data in the end face of the object substrate. In this case, the effect of warpage caused by the self-weight of the object substrate can be eliminated. Therefore, when warpage exists in the object substrate, the effect of warpage can be corrected more effectively.

[0148] Example 5. Alternatively, any method from Examples 1 to 4 may further include: the step of obtaining the warpage amount of a reference substrate; the step of obtaining a surface image of the reference substrate; and the step of calculating a warpage coefficient based on the warpage amount of the reference substrate and the surface image of the reference substrate. In this case, the warpage coefficient is modeled through the correspondence between the warpage amount of the reference substrate and the surface image of the reference substrate. Generally, the color information of each pixel in the surface image of the substrate changes according to the warpage amount of the substrate. Therefore, the correction coefficient of the surface image of the target substrate can be calculated simply and directly based on the correlation between the warpage coefficient specified in Example 5 and the warpage amount of the target substrate.

[0149] Example 6. Alternatively, in the method of Example 5, the step of calculating the warpage coefficient includes: calculating the warpage coefficient for each pixel of the surface image of the reference substrate. In this case, by using the warpage coefficient corresponding to each pixel of the surface image of the reference substrate, it is easier to calculate the correction coefficient corresponding to each pixel of the surface image of the target substrate.

[0150] Example 7. Alternatively, in the method of Example 6, the step of calculating the warpage coefficient includes: calculating the warpage coefficient for each pixel of the surface image of the reference substrate based on the warpage amount of the reference substrate and the brightness value of each pixel in the surface image of the reference substrate. In this case, the warpage coefficient can be obtained by calculating the brightness value using such a simple method.

[0151] Example 8. Alternatively, in the method of Example 7, the step of calculating the warpage coefficient includes: generating normalized data that normalizes the brightness values ​​of each pixel of the surface image using the brightness values ​​in the central region of the surface image of the reference substrate; and calculating the warpage coefficient based on the warpage of the reference substrate and the normalized data. In this case, the warpage coefficient can be used to simplify subsequent calculations.

[0152] Example 9. Alternatively, in any of Examples 5 to 8, the step of obtaining the warpage amount of the reference substrate includes: calculating the warpage amount of the reference substrate based on data of the contour lines of the end faces of a generally flat reference substrate and data of the contour lines of the end faces of a non-flat reference substrate. In this case, the effect of warpage caused by the weight of the reference substrate can be eliminated. Therefore, a warpage coefficient with high accuracy can be calculated.

[0153] Example 10. Alternatively, in the method of Example 9, the non-flat reference substrate can be a reference substrate with an upwardly convex paraboloid shape or a reference substrate with a downwardly convex paraboloid shape.

[0154] Example 11. Alternatively, any of the methods in Examples 5 to 10 may further include: the step of acquiring the warp amounts of two different regions of the reference substrate; and the step of calculating the warp coefficients of the two regions based on the warp amounts of the two regions and the surface image of the reference substrate. In this case, even if the warp amount of one region of the reference substrate is different from the warp amount of the other region of the reference substrate, the corrected image of the target substrate can be acquired with high accuracy.

[0155] Example 12. Alternatively, any of the methods in Examples 1 to 11 may further include: calculating the tilt component of the substrate holding portion based on two warpage amounts of the adjustment substrate obtained by changing the angle of the adjustment substrate relative to the substrate holding portion. In this case, the influence of the tilt of the substrate holding portion holding the substrate can be removed from the warpage amount of the substrate.

[0156] Example 13. Alternatively, in any of the methods in Examples 1 to 12, the measurement of the warpage of the object substrate and the imaging of the surface of the object substrate are performed within the same housing. In this case, the transport of the object substrate is minimized, thus enabling high-speed acquisition of the corrected image.

[0157] Example 14.. Alternatively, an example of an information processing apparatus may include: a storage unit capable of storing a warpage coefficient generated based on a reference substrate with known warpage, the warpage of an object substrate, and a surface image of the object substrate; a calculation unit capable of calculating a correction coefficient for the surface image of the object substrate based on the warpage coefficient and the warpage of the object substrate; and a generation unit capable of correcting the surface image of the object substrate using the correction coefficient to generate a corrected image of the object substrate. In this case, the same effect as in Example 1 can be obtained.

[0158] Example 15. Alternatively, the computer-readable storage medium may store a program for causing the information processing device to execute any of the methods in Examples 1 to 13. In this case, the same effect as the method in Example 1 can be obtained. In this specification, the computer-readable storage medium may include non-transitory computer recording medium (e.g., various primary or secondary storage devices) and transitory computer recording medium (e.g., data signals that can be provided via a network).

[0159] 2. Second Implementation Method

[0160] In the first embodiment described above, an information processing method performed by the controller Ctr is illustrated as the deformation factor of the surface Wa, primarily considering the case of warping of the substrate W. In the second embodiment, an information processing method is illustrated as the deformation factor of the surface Wa, primarily considering the deformation of the substrate W caused by the unevenness of the surface of the holding stage 201 and the tilting of the substrate W caused by the tilting of the holding stage 201 (see reference). Figure 21 The composition under the condition of ).

[0161] [Substrate Processing System]

[0162] When using the same holding stage 201, the impact of the surface irregularities of the holding stage 201 on the shape of the substrate W for high reproducibility must be considered. However, as mentioned above, the holding stage 201 is rotatable. Therefore, the influence of the deformation factor associated with the holding stage 201 on the image information of the surface Wa of the substrate W and the influence of the holding stage 201 on the shape of the substrate W may change depending on the rotation angle of the holding stage 201. Therefore, in the second embodiment, it is necessary to know the tilt of the holding stage 201 in the image acquired by the surface imaging unit 300. Therefore, in the second embodiment, as Figure 22 As shown, a mark 211 is provided on the holding table 201 (the inspection unit U3 also includes a mark 211). As a specific example of the mark 211, a mark hole, etc. can be cited.

[0163] In considering the deformation factor related to the holding stage 201, in the information processing method performed by the controller Ctr, the step of acquiring the surface image of the object substrate includes the step of acquiring the surface image of the object substrate held by the rotatable holding stage 201, the step of acquiring information on the deformation factor of the surface includes the step of acquiring the rotation angle information of the holding stage 201 when the surface image of the object substrate is obtained, and the step of calculating the correction coefficient based on the deformation factor information of the surface Wa includes the step of calculating the correction coefficient based on the rotation angle information of the holding stage 201.

[0164] The step of calculating the correction coefficient based on the deformation factor information of surface Wa may also include: the step of calculating the correction coefficient based on the coefficient model representing the relationship between the rotation angle of the holding stage 201 and the correction coefficient and the rotation angle information of the holding stage 201.

[0165] The following section will explain in detail the information processing method, which is divided into the calculation method of the coefficient model and the generation method of the corrected image.

[0166] [Calculation method of coefficient model]

[0167] like Figure 23 As shown, firstly, the controller Ctr controls the rotary holding unit 200, which moves the holding stage 201 from the first position to the second position along the guide rail 204 via the actuator 203. At this time, the controller Ctr controls the surface imaging unit 300 to turn on the light source 322, and the camera 310 takes a picture (step S31). When the holding stage 201 reaches the second position and the picture taken by the camera 310 is completed, the data of the captured image (chuck surface image) taken by the camera 310 is sent to the storage unit M2.

[0168] Next, the calculation unit M31 obtains the rotation angle information of the holding stage 201 from the rotation holding unit 200 (step S32). As an example, the rotation holding unit 200 sends the detection value of the rotation angle of the holding stage 201 detected by the rotation angle sensor (e.g., a rotary encoder) of the actuator 202 to the storage unit M2. The calculation unit M31 obtains the detection value of the rotation angle of the holding stage 201 detected by the rotation angle sensor from the storage unit M2. Hereinafter, the detection value of the rotation angle of the holding stage 201 detected by the rotation angle sensor will be referred to as the "sensor angle".

[0169] Next, the calculation unit M31 calculates the rotation angle of the holding stage 201 within the chuck surface image based on the position of the mark 211 obtained in step S31. Hereinafter, the rotation angle of the holding stage 201 within the chuck surface image will be referred to as the "chuck angle within the image". The calculation unit M31 calculates the angle conversion value used to convert the sensor angle into the chuck angle within the image and stores it in the storage unit M2 (step S33).

[0170] Next, the controller Ctr controls each part of the coating and developing apparatus 2 to place the reference substrate W S The sample is transported to inspection unit U3 (step S34). Next, controller Ctr controls the rotary holding unit 200 to hold the reference substrate W on the holding stage 201. S .

[0171] Next, the controller Ctr uses actuator 202 to make the holding stage 201 and the reference substrate W S Rotating together, at multiple rotation angles, the surface imaging unit 300 acquires the reference substrate W. S The surface images obtained therefrom are referred to as "reference images".

[0172] As an example, the controller Ctr moves the holding stage 201 from a first position to a second position along the guide rail 204 via the actuator 203 at multiple rotation angles. At this time, the controller Ctr controls the surface imaging unit 300 to turn on the light source 322, and the camera 310 takes pictures. Reference substrate W S Upon reaching the second position, when the shooting by camera 310 is completed, the data of the reference image captured by camera 310 is sent to storage unit M2 (step S35).

[0173] When the images taken at multiple rotation angles and the data accumulation are completed in step S35, the calculation unit M31 generates a coefficient model representing the relationship between the rotation angle of the holding stage 201 (e.g., the chuck angle in the image mentioned above) and the correction coefficient based on all reference images, and stores it in the storage unit M2. For example, for each of all reference images, the controller Ctr generates an angle-coefficient function representing the relationship between the rotation angle of the holding stage 201 (e.g., the chuck angle in the image mentioned above) and the pixel value (e.g., brightness value or color information) for each pixel in the reference image (step S38). The set of multiple angle-coefficient functions generated for each pixel corresponds to an example of the coefficient model. Furthermore, the pixel value of each pixel derived based on the rotation angle of the holding stage 201 and the angle-coefficient function corresponds to an example of the correction coefficient. Hereinafter, this pixel value will be referred to as the "correction pixel value". In this way, the generation of the coefficient model is completed.

[0174] [Methods for generating corrected images]

[0175] like Figure 24 As shown, the controller Ctr controls each part of the coating and developing unit 2, and applies the substrate W... P The substrate is conveyed to the inspection unit U3 (step S41). Next, the controller Ctr controls the rotation holding unit 200, causing the holding stage 201 to hold the substrate W. P .

[0176] Next, the calculation unit M31 obtains the detection value of the rotation angle of the holding stage 201 detected by the rotation angle sensor (the sensor angle) from the storage unit M2, and calculates the chuck angle in the image based on the angle conversion value stored in the storage unit M2 and the sensor angle (step S42).

[0177] Next, the controller Ctr controls the rotary holding unit 200, which moves from the holding stage 201 from the first position to the second position along the guide rail 204 via the actuator 203. At this time, the controller Ctr controls the surface imaging unit 300 to turn on the light source 322, and the camera 310 takes an image (step S43). Substrate W P Upon reaching the second position, when the shooting by camera 310 is completed, the data of the captured image (surface image) by camera 310 is sent to storage unit M2.

[0178] Next, the calculation unit M31 calculates the correction coefficient based on the chuck angle in the image calculated in step S42 and the coefficient model stored in the storage unit M2 (step S44). For example, the calculation unit M31 calculates the correction pixel value for each pixel of the surface image based on the angle-coefficient function and the chuck angle in the image.

[0179] Next, the generation unit M32 is based on the substrate W PThe surface image and the correction coefficients calculated in step S42 are used to generate the image from the substrate W. P The surface image is a corrected image that removes the influence of the deformation factor related to the holding stage 201. For example, the generating unit M32 obtains the image from the substrate W. P The pixel value of each pixel in the surface image is subtracted from the correction pixel value. This generates a corrected image that removes the influence of the deformation factor related to the holding stage 201 (step S45).

[0180] [effect]

[0181] Following the example above, by using a correction coefficient that increases the influence of the attitude of the holding stage 201 on the surface Wa, the effects of image changes caused by the deformation of the surface Wa of the object substrate can be removed from the surface image of the object substrate more reliably. Therefore, it is effective to evaluate the surface state of the substrate W with higher accuracy based on the surface image of the substrate W.

[0182] Based on the above example, by using a coefficient model that represents the relationship between the correction coefficient and the rotation angle of the holding stage 201, the correction coefficient can be calculated more simply and appropriately.

[0183] The above example illustrates a method for generating a coefficient model that considers both the deformation of the substrate W caused by the unevenness of the surface of the holding stage 201 and the tilt of the substrate W caused by the tilt of the holding stage 201. However, it is also possible to generate a coefficient model considering only either one. For example, if the tilt of the holding stage 201 is negligible, a coefficient model can be generated considering only the deformation of the substrate W caused by the unevenness of the surface of the holding stage 201.

[0184] The information processing method of the first embodiment, which focuses on the amount of warpage of the substrate W, can be combined with the information processing method of the second embodiment, which focuses on the deformation factor related to the holding stage 201.

Claims

1. An information processing method characterized by comprising: comprises: a step of acquiring information of a deformation factor of a surface of an object substrate; a step of acquiring a surface image representing a processing state of the surface of the object substrate; a step of calculating, based on the information of the deformation factor of the surface, a correction coefficient for compensating for an image change due to a deformation of the surface for each pixel of the surface image; and a step of correcting a luminance value of each pixel in the surface image using the correction coefficient to generate a corrected image of the object substrate.

2. The information processing method according to claim 1, wherein: the step of acquiring the information of the deformation factor of the surface comprises a step of acquiring a warping amount of the object substrate, the step of calculating the correction coefficient based on the information of the deformation factor of the surface comprises a step of calculating the correction coefficient based on a warping coefficient obtained from a reference substrate whose warping amount is known and the warping amount of the object substrate.

3. The information processing method according to claim 2, wherein: the step of acquiring the warping amount of the object substrate comprises a step of calculating the warping amount of the object substrate based on data of a profile line of an end surface of a substantially flat reference substrate and data of a profile line of an end surface of the object substrate. further comprising:

4. The information processing method according to claim 2, wherein a step of acquiring a warping amount of the reference substrate; a step of acquiring a surface image of the reference substrate; and a step of calculating the warping coefficient based on the warping amount of the reference substrate and the surface image of the reference substrate.

5. The information processing method according to claim 4, wherein: the step of calculating the warping coefficient comprises a step of calculating the warping coefficient for each pixel of the surface image of the reference substrate separately.

6. The information processing method according to claim 5, wherein: the step of calculating the warping coefficient comprises a step of calculating the warping coefficient for each pixel of the surface image of the reference substrate separately based on the warping amount of the reference substrate and a luminance value of each pixel of the surface image of the reference substrate.

7. The information processing method according to claim 6, wherein: the step of calculating the warping coefficient comprises: a step of generating normalization data in which luminance values of each pixel of the surface image of the reference substrate are normalized using a luminance value of a central region of the surface image of the reference substrate; and a step of calculating the warping coefficient based on the warping amount of the reference substrate and the normalization data.

8. The information processing method according to claim 4, wherein: the step of acquiring the warping amount of the reference substrate comprises a step of calculating the warping amount of the reference substrate based on data of a profile line of an end surface of a substantially flat reference substrate and data of a profile line of an end surface of a non-flat reference substrate.

9. The information processing method according to claim 8, wherein: the non-flat reference substrate is a reference substrate in a shape of a rotation paraboloid that is convex upward or a reference substrate in a shape of a rotation paraboloid that is convex downward. further comprising: a step of acquiring a warping amount of each of two different regions of the reference substrate separately; and 10. The information processing method according to any one of claims 4 to 9, characterized by, a step of calculating the warping coefficient based on the warping amount of each of the two different regions of the reference substrate. ​ ​ calculating the warping coefficient of the two regions based on the warping amounts of the two regions and the surface image of the reference substrate.

11. The information processing method according to any one of claims 2 to 9, wherein the step of calculating the tilt component of the substrate holding portion based on the two warping amounts of the adjustment substrate obtained by changing the angle of the adjustment substrate with respect to the substrate holding portion.

12. The information processing method according to any one of claims 2 to 9, wherein the measurement of the warping amount of the target substrate and the photographing of the surface of the target substrate are performed in the same housing.

13. The information processing method according to any one of claims 1 to 9, wherein the step of acquiring the surface image of the target substrate includes the step of acquiring the surface image of the target substrate held by a rotatable chuck, the step of acquiring the information of the deformation factor of the surface includes the step of acquiring the rotation angle information of the chuck at the time of acquiring the surface image of the target substrate, the step of calculating the correction coefficient based on the information of the deformation factor of the surface includes the step of calculating the correction coefficient based on the rotation angle information of the chuck.

14. The information processing method according to claim 13, wherein the step of calculating the correction coefficient based on the information of the deformation factor of the surface includes the step of calculating the correction coefficient based on a coefficient model representing the relationship between the rotation angle of the chuck and the correction coefficient and the rotation angle information of the chuck.

15. An information processing apparatus, comprising: including: a storage portion capable of storing the information of the deformation factor of the surface of the target substrate and a surface image representing the processing state of the surface of the target substrate, a calculation portion capable of calculating, based on the information of the deformation factor of the surface, a correction coefficient compensating for the image change due to the deformation of the surface for each pixel of the surface image, and a generation portion capable of generating a correction image of the target substrate by correcting the luminance value of each pixel in the surface image using the correction coefficient.

16. A computer-readable storage medium, wherein a program for causing an information processing apparatus to execute the information processing method according to any one of claims 1 to 14 is stored. ​

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