Display device and method of manufacturing the same

Abstract

An embodiment relates to a display device and a method for manufacturing a display device, wherein the display device includes a display area and a non-display area, the non-display area surrounding at least a portion of the display area, and the display device further includes: a first substrate including a first through hole, the display area surrounding the first through hole; an inorganic insulating layer arranged in the display area; a display element layer including a display element and arranged on the inorganic insulating layer; a second substrate including a second through hole and arranged on the display element layer, the second through hole being connected to the first through hole; and a blocking member arranged along an inner surface of the first through hole and an inner surface of the second through hole, and extending from the first substrate to the second substrate, wherein the inorganic insulating layer extends from the display area to the inner surface of the first through hole.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 10-2020-0021763 filed on February 21, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] One or more embodiments relate to a display device and a method of manufacturing the display device, and more particularly, to a display device including a transmissive region inside a display region and a method of manufacturing the display device. Background Art

[0004] In recent years, the use of display devices has been diversified. In addition, as display devices have become thinner and lighter, their scope of use has gradually expanded.

[0005] As the area occupied by the display region in a display device expands, various functions combined with or associated with the display device have been added. In order to add various functions while expanding the area, the display device may include an area for adding various functions as well as a function of displaying an image within the display region.

[0006] In particular, the display device may include a transmissive region inside the display region through which light can pass, and components may be arranged under the transmissive region.Research has been conducted on display devices that prevent distortion of light incident on components, etc. Summary of the Invention

[0007] One or more embodiments include a display device and a method of manufacturing the display device, which improve transmittance of a transmission area and prevent distortion of light, etc., incident to a component.

[0008] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0009] According to one or more embodiments, a display device includes a display area and a non-display area, the non-display area surrounding at least a portion of the display area, and the display device further includes: a first substrate including a first through hole, the display area surrounding the first through hole; an inorganic insulating layer arranged in the display area; a display element layer including a display element and arranged on the inorganic insulating layer; a second substrate including a second through hole and arranged on the display element layer, the second through hole being connected to the first through hole; and a blocking member arranged along an inner surface of the first through hole and an inner surface of the second through hole, and extending from the first substrate to the second substrate, wherein the inorganic insulating layer extends from the display area to the inner surface of the first through hole.

[0010] The display element may include a pixel electrode and an opposing electrode, and the opposing electrode may extend from the display area to the inner surface of the first through hole.

[0011] The display element layer may further include an organic insulating layer disposed between the inorganic insulating layer and the opposite electrode, and the inorganic insulating layer may contact the opposite electrode on the inner surface of the first through hole.

[0012] The display element layer may further include an inorganic encapsulation layer covering the display element, wherein the inorganic encapsulation layer may extend from the display area to the inner surface of the first through hole.

[0013] The display device may further include an optical function layer disposed on the second substrate and including a third through hole connected to the second through hole, wherein the blocking member may extend from the second substrate to the optical function layer.

[0014] The display device may further include: a cover window provided on the optical function layer, arranged in the display area, and covering the third through hole; and an adhesive layer arranged between the optical function layer and the cover window and including a fourth through hole connected to the third through hole.

[0015] A size of the fourth through hole may be greater than a size of the third through hole, and the blocking member may extend to an upper surface of the optical function layer.

[0016] The blocking member may include a black pigment.

[0017] The barrier member may comprise a moisture-proof insulating material.

[0018] The blocking member may cover the inorganic insulating layer extending to the inner surface of the first through hole.

[0019] At least one of the first substrate and the second substrate may include glass.

[0020] The display device may further include: a component arranged to pass through the first through hole and the second through hole.

[0021] The display device may further include: an optically functional layer disposed on the second substrate and including a third through hole connected to the second through hole; and a cover window disposed on the optically functional layer, arranged in the display area, and covering the third through hole, wherein the component may be arranged to pass through the third through hole.

[0022] According to one or more embodiments, a method for manufacturing a display device, wherein the display device includes a display area and a non-display area, the non-display area surrounding at least a portion of the display area, and the method includes: preparing a first substrate having a first through hole formed therein; forming an inorganic insulating layer on the first substrate; forming a display element layer on the inorganic insulating layer, the display element layer including a display element; preparing a second substrate having a second through hole formed therein; aligning the first substrate with the second substrate so that the first through hole corresponds to the second through hole; and forming a blocking member along an inner surface of the first through hole and an inner surface of the second through hole.

[0023] The inorganic insulating layer may extend from the display area to the inner surface of the first through hole.

[0024] The blocking member may cover the inorganic insulating layer extending to the inner surface of the first through hole.

[0025] The forming of the display element layer may include forming an inorganic encapsulation layer on the display element, wherein the inorganic encapsulation layer may extend from the display region to the inner surface of the first through hole.

[0026] The method may further include: forming an optically functional layer on the second substrate, the optically functional layer including a third through hole connected to the second through hole; forming an adhesive layer on the optically functional layer, the adhesive layer including a fourth through hole connected to the third through hole; and arranging a cover window on the adhesive layer, the cover window being arranged in the display area and covering the fourth through hole.

[0027] A size of the fourth through hole may be greater than a size of the third through hole, and the blocking member may extend from the inner surface of the second through hole to an upper surface of the optical function layer.

[0028] The method may further include arranging a component so that the component passes through the first through-hole and the second through-hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0030] Figure 1 is a perspective view of a display device according to an embodiment;

[0031] Figure 2A According to the embodiment of the invention Figure 1 A cross-sectional view of the display device taken along line AA';

[0032] Figure 2B is a cross-sectional view of a display device according to another embodiment;

[0033] Figure 2C is a cross-sectional view of a display device according to another embodiment;

[0034] Figure 2D is a cross-sectional view of a display device according to another embodiment;

[0035] Figure 3 is a plan view of a first substrate according to an embodiment;

[0036] Figure 4 is an equivalent circuit diagram of a pixel applicable to the first substrate;

[0037] Figure 5 It is along Figure 3 A cross-sectional view of the first substrate taken along line BB', line CC', and line DD';

[0038] Figure 6 is a cross-sectional view of a display device according to another embodiment;

[0039] Figure 7 and Figure 8 is a cross-sectional view of a method for manufacturing a display device according to an embodiment;

[0040] Figure 9A is a cross-sectional view of a method for manufacturing a display device according to an embodiment;

[0041] Figure 9B In the method for manufacturing a display device according to an embodiment Figure 9A An enlarged cross-sectional view of region D;

[0042] Figure 10 、 Figure 11 and Figure 12 is a cross-sectional view of a method of manufacturing a display device according to an embodiment; and

[0043] Figure 13A and Figure 13Bis a cross-sectional view of a method of manufacturing a display device according to another embodiment. DETAILED DESCRIPTION

[0044] With reference now to embodiment in detail, examples of embodiment are shown in the accompanying drawings, and similar reference numerals in the accompanying drawings always indicate similar elements. In this respect, the present embodiment can have different forms and should not be construed as being limited to the description set forth herein. Therefore, the embodiments are described below only by reference to the accompanying drawings to explain the various aspects of this specification. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Throughout the disclosure, the expression "at least one of a, b, and c" indicates only a, only b, only c, both a and b, both a and c, both b and c, all a, b, and c, or their variations.

[0045] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, like reference numerals are used for like or corresponding elements, and repeated description thereof is omitted.

[0046] It will be understood that although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another.

[0047] As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0048] It will also be understood that the terms “comprises and / or comprising” as used herein indicate the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0049] It will be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, the layer, region, or component can be directly or indirectly formed on the other layer, region, or component. That is, for example, intervening layers, regions, or components may be present.

[0050] For the convenience of explanation, the sizes of the elements in the drawings may be exaggerated or reduced. In other words, since the sizes and thicknesses of the components in the drawings are arbitrarily shown for the convenience of explanation, the following embodiments are not limited thereto.

[0051] When a certain embodiment can be implemented differently, the specific process order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in a reverse order to the described order.

[0052] It will be understood that when a layer, region, or component is referred to as being “connected” to another layer, region, or component, the layer, region, or component may be “directly connected” to the other layer, region, or component and / or may be “indirectly connected” to the other layer, region, or component with the other layer, region, or component interposed therebetween. For example, it will be understood that when a layer, region, or component is referred to as being “electrically connected” to another layer, region, or component, the layer, region, or component may be “directly electrically connected” to the other layer, region, or component and / or may be “indirectly electrically connected” to the other layer, region, or component with the other layer, region, or component interposed therebetween.

[0053] Figure 1 is a perspective view of the display device 1 according to the embodiment.

[0054] Reference Figure 1 , the display device 1 can be various electronic devices such as mobile phones, tablet personal computers, notebook computers, and smart watches. The display device 1 may include a first area A1 and a second area A2, and the second area A2 surrounds the first area A1. For example, a plurality of pixels of a pixel array can be arranged in the second area A2. The second area A2 can display an image using the pixel array. Therefore, the second area A2 corresponds to a display area on which an image can be displayed. The first area A1 can be completely surrounded by the second area A2. The first area A1 may include an area in which components that provide various functions to the display device 1 are arranged. For example, in the case where the component includes a sensor, a camera, etc. that uses light, the first area A1 corresponds to a transmission area through which the light of the sensor or the light traveling to the camera can pass. In this case, the substrate of the display device 1 may include a through hole corresponding to the first area A1 to improve the transmittance of the light traveling to the component.

[0055] In one embodiment, the first area A1 may have a circular shape. In another embodiment, the first area A1 may have a polygonal shape. In another embodiment, the first area A1 may have an elliptical shape. Hereinafter, the case where the first area A1 has a circular shape will be mainly described in detail.

[0056] The third area A3 may be arranged between the first area A1 and the second area A2. The third area A3 may include a non-display area. Wiring that bypasses the first area A1 may be arranged in the third area A3. Similar to the third area A3, the fourth area A4 surrounding the second area A2 may include a non-display area in which pixels are not arranged. Various wiring and built-in circuits may be arranged in the fourth area A4.

[0057] Each pixel of the display device 1 may include a light-emitting diode as a display element that can emit light of a predetermined color. The light-emitting diode may include an organic light-emitting diode containing an organic material as an emission layer. Alternatively, the light-emitting diode may include an inorganic light-emitting diode. Alternatively, the light-emitting diode may include quantum dots as an emission layer. Hereinafter, for ease of description, the light-emitting diode is described as an organic light-emitting diode.

[0058] Despite Figure 1 , the first area A1 is shown as being arranged in the center of the second area A2 in the width direction (e.g., ±x direction) of the display device 1. However, in another embodiment, the first area A1 may be arranged to be offset to the left or right in the width direction of the display device 1. In addition, the first area A1 may be arranged on the top side, in the center, or on the bottom side in the length direction (e.g., ±y direction) of the display device 1. The first area A1 may be arranged in various positions.

[0059] Despite Figure 1 , the display device 1 includes one first area A1 . However, in another embodiment, the display device 1 may include a plurality of first areas A1 .

[0060] Figure 2A According to the embodiment of the invention Figure 1 1 is a cross-sectional view of the display device 1 taken along line AA′.

[0061] Reference Figure 2A The display device 1 may include a first substrate 10 , an inorganic insulating layer IL, a display element layer DEL, a sealing member SP, a second substrate 20 , an optical function layer 30 , an adhesive layer 40 , a cover window 50 , a blocking member SHP, and an assembly COMP.

[0062] The first substrate 10 may be arranged in the second, third, and fourth regions A2, A3, and A4 of the display device 1, with the second region A2 surrounding the first through-hole 10H, and the fourth region A4 surrounding at least a portion of the second region A2. In this case, the first through-hole 10H may be formed corresponding to the first region A1. Furthermore, a plurality of organic light-emitting diodes (OLEDs) serving as display elements may be arranged in the second region A2 of the display device 1.

[0063] The inorganic insulating layer IL may be disposed on the first substrate 10. Specifically, the inorganic insulating layer IL may extend from the second area A2 to the inner surface 10S of the first through hole 10H. Here, the inner surface 10S of the first through hole 10H may include a surface of the first substrate 10 exposed by the first through hole 10H. The inorganic insulating layer IL may include an inorganic insulating material.

[0064] The display element layer DEL may include a display element and may be disposed on the inorganic insulating layer IL. The display element layer DEL may include a plurality of display elements that display an image. The display element layer DEL may also include an organic insulating layer.

[0065] The second substrate 20 may be arranged above the first substrate 10 and may include a second through hole 20H connected to the first through hole 10H. In this case, in a plan view, the second through hole 20H may be formed in a region corresponding to the first through hole 10H. In an embodiment, the size of the second through hole 20H may be equal to the size of the first through hole 10H. In this case, the size of the first through hole 10H may be the area of the cross section of the first through hole 10H perpendicular to the z direction. The size of the second through hole 20H may be the area of the cross section of the second through hole 20H perpendicular to the z direction. Figure 2A In the embodiment, for ease of description, the size of the first through hole 10H and the size of the second through hole 20H are shown as the diameter 10D of the first through hole 10H and the diameter 20D of the second through hole 20H, respectively. In this case, the diameter 10D of the first through hole 10H may be equal to the diameter 20D of the second through hole 20H. In an embodiment, the diameter 10D of the first through hole 10H may be smaller than the diameter 20D of the second through hole 20H.

[0066] The second substrate 20 may include a transparent member to display an image from the second area A2 and prevent oxygen and moisture from penetrating into the second area A2. In an embodiment, the second substrate 20 may include a touch screen panel including an input sensing portion to function as a touch panel.

[0067] The second substrate 20 may be coupled to the first substrate 10 by using a sealing member SP disposed on an edge of the first substrate 10 .

[0068] The sealing member SP may be arranged in the fourth area A4 while surrounding the second area A2. The sealing member SP may attach the first substrate 10 to the second substrate 20 and prevent oxygen, moisture, etc. from being introduced into the second area A2. In addition, the sealing member SP may attach the first substrate 10 to the second substrate 20 to improve mechanical strength.

[0069] In an embodiment, the sealing member SP may include a sealant. In another embodiment, the sealing member SP may include a material that can be hardened by laser. For example, the sealing member SP may include glass frit. Specifically, the sealing member SP may include a polyurethane-based resin, an epoxy-based resin, and an acrylic-based resin as an organic sealant, or silicon as an inorganic sealant. For example, polyurethane acrylate may be used as the polyurethane-based resin. For example, butyl acrylate, ethylhexyl acrylate, etc. may be used as the acrylic-based resin. The sealing member SP may include a material that can be hardened by heat.

[0070] The optical function layer 30 may be disposed on the second substrate 20 and may include a third through hole 30H connected to the second through hole 20H. In this case, the third through hole 30H may be formed in a region corresponding to the second through hole 20H and the first through hole 10H in a plan view.

[0071] The optical function layer 30 may include an anti-reflection layer. The anti-reflection layer may reduce the reflectivity of light (external light) incident from the outside toward the first substrate 10 through the cover window 50. The anti-reflection layer may include a retarder and / or a polarizer. The retarder may include a film-type retarder or a liquid crystal retarder. The retarder may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may include a film-type polarizer or a liquid crystal polarizer. The film-type polarizer may include a stretchable synthetic resin film, and the liquid crystal polarizer may include liquid crystals arranged in a predetermined arrangement. The retarder and the polarizer may further include a protective film.

[0072] In another embodiment, the optical function layer 30 may include a black matrix and a color filter. The color filters may be arranged by considering the color of light emitted from each pixel of the display device 1. Each of the color filters may include a red, green, or blue pigment or dye. Alternatively, each of the color filters may not include the pigment or dye as described above, and may include scattering particles such as titanium oxide.

[0073] In an embodiment, the optical function layer 30 may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer arranged on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, may destructively interfere with each other, thereby reducing the reflectivity of external light.

[0074] The adhesive layer 40 may be arranged on the optical function layer 30 and may include a fourth through hole 40H connected to the third through hole 30H. In this case, in a plan view, the fourth through hole 40H may be formed in a region corresponding to the third through hole 30H. The adhesive layer 40 may include an optically clear adhesive (OCA). Alternatively, the adhesive layer 40 may be made of a general material known in the art without limitation.

[0075] The cover window 50 may be arranged on the optical function layer 30. The cover window 50 may be arranged in the second area A2 and the third area A3 and may cover the third through hole 30H in the first area A1. In particular, the cover window 50 may be arranged on the adhesive layer 40 and may cover the fourth through hole 40H. The cover window 50 may include glass, sapphire, or plastic. For example, the cover window 50 may include ultra-thin glass (UTG) or colorless polyimide (CPI).

[0076] The blocking member SHP may be arranged along the inner surface 10S of the first through hole 10H. For example, in the case where the first through hole 10H has a circular shape, the blocking member SHP may be arranged in a ring shape in a plan view.

[0077] The blocking member SHP may extend from the first substrate 10 to the second substrate 20. Specifically, the blocking member SHP may be arranged along the inner surface 10S of the first through hole 10H and the inner surface 20S of the second through hole 20H. Here, the inner surface 20S of the second through hole 20H may include a surface of the second substrate 20 that defines the second through hole 20H. Furthermore, the blocking member SHP may extend from the first substrate 10 to the cover window 50. In embodiments, the blocking member SHP may contact the adhesive layer 40.

[0078] The blocking member SHP may include a black pigment. In this case, the black pigment can absorb visible light. Therefore, the blocking member SHP can prevent light generated from the second area A2 from entering the component COMP. The blocking member SHP may include, for example, carbon black formed by incomplete combustion of hydrocarbons such as methane and acetylene. For another example, the blocking member SHP may include natural graphite.

[0079] The barrier member SHP may be a moisture-proof insulating material. Thus, the barrier member SHP can prevent foreign matter or moisture from penetrating from the first area A1 to the second area A2 through the third area A3. The moisture-proof insulating material may include, for example, an ultraviolet (UV) resin. In this case, if at least one of the first substrate 10 and the second substrate 20 comprises glass, the adhesion between the barrier member SHP and at least one of the first substrate 10 and the second substrate 20 may be enhanced.

[0080] The component COMP may be arranged in the first area A1. In particular, the component COMP may be arranged in the first through hole 10H. In an embodiment, the component COMP may be formed across the first through hole 10H and the second through hole 20H. In an embodiment, the component COMP may be arranged to pass through the third through hole 30H to be adjacent to the cover window 50. In an embodiment, the component COMP may contact the cover window 50.

[0081] The component COMP may include electronic components. For example, the component COMP may include electronic components that utilize light or sound. The electronic components may include sensors such as infrared sensors that emit and / or receive light, cameras that receive light to capture images, sensors that output and detect light or sound to measure distance or identify fingerprints, micro lamps that output light, and speakers that output sound. Electronic components that utilize light may use light in various wavelength bands including visible light, infrared light, and ultraviolet light. In an embodiment, the first area A1 may include a transmissive area through which light output from the component COMP or light from the outside can pass.

[0082] In another embodiment, when the display device 1 is used as a smartwatch or a dashboard for a car, the component COMP may include a member such as a clock hand or a pointer indicating predetermined information (e.g., the speed of the vehicle, etc.). When the display device 1 includes a clock hand or a dashboard for a car, the component COMP may pass through the cover window 50 and be exposed to the outside. The cover window 50 may include a fifth through hole (not shown) connected to the fourth through hole 40H.

[0083] As described above, the component COMP may include element(s) that may add a predetermined function to the display apparatus 1 , or may include an element such as an accessory that increases the aesthetics of the display apparatus 1 .

[0084] An embodiment may include a first substrate 10 and a second substrate 20, the first substrate 10 including a first through hole 10H, and the second substrate 20 including a second through hole 20H. In addition, the component COMP may be arranged across the first through hole 10H and the second through hole 20H. In an embodiment, distortion of light, etc. incident on the component COMP may be prevented or minimized. Unlike this embodiment, in the case where the first substrate 10 and the second substrate 20 do not include through holes, the component COMP may be arranged under the first substrate 10 to correspond to the first area A1. In this case, light incident from the outside may be refracted while passing through the first substrate 10 and the second substrate 20. Therefore, distortion of the light received by the component COMP may occur. According to an embodiment, the component COMP may be arranged adjacent to the cover window 50 to prevent or minimize distortion of light, etc. incident on the component COMP.

[0085] In addition, when the first substrate 10 and the second substrate 20 do not include through holes, foreign matter may be disposed between the first substrate 10 and the second substrate 20, or scratches may be formed during the manufacture of the display device 1. Foreign matter or scratches may cause distortion of the light received by the component COMP. Therefore, a polishing process for removing foreign matter or scratches may be added during the process of manufacturing the display device 1. According to an embodiment, since the first substrate 10 includes the first through hole 10H and the second substrate 20 includes the second through hole 20H, foreign matter can be prevented from being disposed in the first area A1, and the light received by the component COMP can be prevented from being distorted by foreign matter or scratches.

[0086] Figure 2B is a cross-sectional view of a display device 1 according to another embodiment. Figure 2B In, due to Figure 2A The same reference numerals as those in the accompanying drawings denote the same elements, and thus their repeated descriptions are omitted.

[0087] Reference Figure 2BThe display device 1 may include a first substrate 10 , an inorganic insulating layer IL, a display element layer DEL, a sealing member SP, a second substrate 20 , an optical function layer 30 , an adhesive layer 40 , a cover window 50 , a blocking member SHP, and an assembly COMP.

[0088] In this embodiment, the size of the second through hole 20H may be smaller than that of the first through hole 10H. In this case, the diameter 20D of the second through hole 20H may be equal to the distance ILD between the surfaces of the inorganic insulating layer IL facing each other in the first area A1. In this case, the blocking member SHP may extend from the first substrate 10 in the z direction.

[0089] Figure 2C is a cross-sectional view of a display device 1 according to another embodiment. Figure 2C In, due to Figure 2B The same reference numerals as those in the accompanying drawings denote the same elements, and thus their repeated descriptions are omitted.

[0090] Reference Figure 2C The display device 1 may include a first substrate 10 , an inorganic insulating layer IL, a display element layer DEL, a sealing member SP, a second substrate 20 , an optical function layer 30 , an adhesive layer 40 , a cover window 50 , a blocking member SHP, and an assembly COMP.

[0091] In this embodiment, the size of the second through hole 20H may be smaller than that of the first through hole 10H. In this case, the diameter 20D of the second through hole 20H may be smaller than the distance ILD between the surfaces of the inorganic insulating layer IL facing each other in the first area A1.

[0092] Figure 2D is a cross-sectional view of a display device 1 according to another embodiment. Figure 2D In, due to Figure 2C The same reference numerals as those in the accompanying drawings denote the same elements, and thus their repeated descriptions are omitted.

[0093] Reference Figure 2D The display device 1 may include a first substrate 10 , an inorganic insulating layer IL, a display element layer DEL, a sealing member SP, a second substrate 20 , an optical function layer 30 , an adhesive layer 40 , a cover window 50 , a blocking member SHP, and an assembly COMP.

[0094] In this embodiment, the size of the third through hole 30H may be larger than that of the second through hole 20H. In this case, the size of the third through hole 30H may be the area of a cross section of the third through hole 30H perpendicular to the z direction. Figure 2DThe dimension of the third through hole 30H is shown to be the diameter 30D of the third through hole 30H. In this case, the diameter 30D of the third through hole 30H may be greater than the diameter 20D of the second through hole 20H.

[0095] In this embodiment, the component COMP can be arranged to pass through the first through-hole 10H and the second through-hole 20H. In this case, the component COMP can be spaced apart from the cover window 50. In the case where the component COMP includes a camera, for example, the optical function layer 30 can prevent the camera's viewing angle from being restricted by making the diameter 30D of the third through-hole 30H larger than the diameter 20D of the second through-hole 20H. Therefore, the optical function layer 30 can prevent the camera from capturing images.

[0096] Hereinafter, for convenience of description, a case where the diameter 10D of the first through hole 10H is equal to the diameter 20D of the second through hole 20H is mainly described in detail.

[0097] Figure 3 is a plan view of a first substrate 10 according to an embodiment, and Figure 4 1 is an equivalent circuit diagram of a pixel P applied to the first substrate 10 .

[0098] Reference Figure 3 The first substrate 10 may be arranged in the second, third, and fourth regions A2, A3, and A4 of the display device 1, with the second region A2 surrounding the first region A1, the third region A3 disposed between the first and second regions A1, and the fourth region A4 surrounding at least a portion of the second region A2. Furthermore, the first substrate 10 may include a first through hole 10H corresponding to the first region A1 and a blocking member SHP disposed along an inner surface 10S of the first through hole 10H. A plurality of pixels P may be arranged in the second region A2. The plurality of pixels P may not be disposed in the first, third, and fourth regions A1, A3, and A4.

[0099] Reference Figure 4 Each pixel P may include a pixel circuit PC and a display element, such as an organic light-emitting diode (OLED), connected to the pixel circuit PC. The pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cst. Each pixel P may emit red, green, blue, or white light.

[0100] The second thin film transistor T2 functions as a switching thin film transistor, is connected to the scan line SL and the data line DL, and can transmit a data voltage input from the data line DL to the first thin film transistor T1 in response to a switching voltage input from the scan line SL. A storage capacitor Cst can be connected to the second thin film transistor T2 and the driving voltage line PL, and can store a voltage corresponding to a difference between a voltage transmitted from the second thin film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0101] The first thin film transistor T1 functions as a driving thin film transistor and can be connected to a driving voltage line PL and a storage capacitor Cst. The first thin film transistor T1 can control a driving current flowing from the driving voltage line PL through the organic light emitting diode OLED in response to a voltage stored in the storage capacitor Cst. The organic light emitting diode OLED can emit light having a predetermined brightness according to the driving current flowing through the organic light emitting diode OLED. An opposing electrode (e.g., a cathode) of the organic light emitting diode OLED can receive a second power supply voltage ELVSS.

[0102] Despite Figure 4 7. It is described in FIG. 8 that the pixel circuit PC includes two thin film transistors and one storage capacitor, but in another embodiment, the number of thin film transistors and the number of storage capacitors may be variously changed depending on the design of the pixel circuit PC.

[0103] Refer again Figure 3 The third region A3 may surround the first region A1. The third region A3 includes a region where no display element such as an organic light emitting diode emitting light is arranged. Wiring for supplying signals to pixels P arranged around the first region A1 may be arranged in the third region A3.

[0104] This embodiment may include a blocking member SHP disposed along the inner surface 10S of the first through hole 10H. Since the blocking member SHP includes a black pigment, the blocking member SHP can prevent diffuse reflection caused by the display element or wiring disposed around the first through hole 10H. In addition, since the blocking member SHP includes a moisture-proof insulating material, the blocking member SHP can prevent air or moisture from penetrating from the first area A1 to the second area A2.

[0105] The first scan driver 1100, the second scan driver 1200, the data driver 1300, and the main power wiring (not shown) may be arranged in the fourth area A4. The first scan driver 1100 and the second scan driver 1200 each provide a scan signal to each pixel P via a corresponding scan line SL. The data driver 1300 provides a data signal to each pixel P via a corresponding data line DL. The main power wiring provides a first power supply voltage ELVDD and a second power supply voltage ELVSS to each pixel P. The first scan driver 1100 and the second scan driver 1200 may be arranged in the fourth area A4 and respectively on two opposite sides of the second area A2, with the second area A2 interposed between the first scan driver 1100 and the second scan driver 1200.

[0106] Despite Figure 3 , the data driver 1300 is shown to be located on a side close to the first substrate 10 , but in another embodiment, the data driver 1300 may be disposed on a flexible printed circuit board (FPCB) electrically connected to pads disposed on one side of the first substrate 10 .

[0107] Figure 5 It is along Figure 3 The cross-sectional view of the first substrate 10 taken along line BB', line CC' and line DD'. Figure 5 In, due to Figure 3 The same reference numerals as those in the accompanying drawings denote the same elements, and thus their repeated descriptions are omitted.

[0108] Reference Figure 5 The first substrate 10 may be arranged in the second, third, and fourth regions A2, A3, and A4 of the display device 1. The second region A2 surrounds the first through-hole 10H, and the fourth region A4 surrounds at least a portion of the second region A2. The inorganic insulating layer IL and the display element layer DEL may be arranged in the second region A2. The display element layer DEL, including the organic light-emitting diode OLED, may be provided on the inorganic insulating layer IL in the second region A2. The component COMP is arranged to correspond to the first region A1 in a plan view and is provided across the first and second through-holes 10H, 20H. In addition, the blocking member SHP may be arranged along the inner surface 10S of the first through-hole 10H and may extend from the first substrate 10 to the second substrate 20.

[0109] The first substrate 10 may include glass, plastic, or metal.

[0110] The buffer layer 101 can reduce or block the penetration of foreign matter, moisture or external air from under the first substrate 10 and provide a flat surface on the first substrate 10. The buffer layer 101 may include an inorganic material such as an oxide or a nitride, an organic material, or an organic / inorganic composite material, and have a single-layer structure or a multi-layer structure of an inorganic material or an organic material. A barrier layer (not shown) may also be provided between the first substrate 10 and the buffer layer 101. The barrier layer blocks the penetration of external air. In an embodiment, the buffer layer 101 may include silicon oxide or silicon nitride.

[0111] An inorganic insulating layer IL and a thin film transistor TFT may be disposed on the buffer layer 101. The inorganic insulating layer IL may include a first gate insulating layer 103, a second gate insulating layer 105, and an interlayer insulating layer 107. The thin film transistor TFT may include a driving thin film transistor. The thin film transistor TFT may include a semiconductor layer Act, a gate electrode G, a source electrode SE, and a drain electrode DE.

[0112] The semiconductor layer Act is disposed on the buffer layer 101 and may include polycrystalline silicon. In another embodiment, the semiconductor layer Act may include amorphous silicon. In another embodiment, the semiconductor layer Act may include an oxide of at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layer Act may include a channel region, a source region, and a drain region. The source region and the drain region may be doped with impurities.

[0113] The first gate insulating layer 103 may cover the semiconductor layer Act. The first gate insulating layer 103 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, silicon nitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, or zinc oxide. The first gate insulating layer 103 may include a single layer or multiple layers including the above inorganic insulating materials.

[0114] The gate electrode G may be arranged on the first gate insulating layer 103 to overlap with the semiconductor layer Act. The gate electrode G may include at least one of molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and may include a single layer or multiple layers. In an embodiment, the gate electrode G may include a single Mo layer.

[0115] The second gate insulating layer 105 may cover the gate electrode G. The second gate insulating layer 105 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, silicon nitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, or zinc oxide. The second gate insulating layer 105 may include a single layer or multiple layers including the above inorganic insulating materials.

[0116] A top electrode CE2 of the storage capacitor Cst may be disposed on the second gate insulating layer 105 .

[0117] In a plan view, the top electrode CE2 may overlap the gate electrode G. The gate electrode G and the top electrode CE2 overlapping each other may constitute a storage capacitor Cst with the second gate insulating layer 105 disposed therebetween. The gate electrode G may function as a bottom electrode CE1 of the storage capacitor Cst.

[0118] The top electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may have a single-layer structure or a multi-layer structure including the above materials.

[0119] The top electrode CE2 may be covered by an interlayer insulating layer 107. The interlayer insulating layer 107 may include silicon oxide, silicon oxynitride, silicon nitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, or zinc oxide.

[0120] The source electrode SE and the drain electrode DE may be disposed on the interlayer insulating layer 107. The source electrode SE and the drain electrode DE may include a conductive material including at least one of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may include a single layer or multiple layers including the above materials. For example, the source electrode SE and the drain electrode DE may have a multilayer structure of Ti / Al / Ti.

[0121] The display element layer DEL may be disposed on the inorganic insulating layer IL. The display element layer DEL may include an organic light-emitting diode OLED, an organic insulating layer OL, and an inorganic encapsulation layer 300. The organic light-emitting diode OLED may serve as a display element. The organic light-emitting diode OLED may include a pixel electrode 210, an intermediate layer 220, and an opposing electrode 230.

[0122] The organic insulating layer OL may be disposed on the inorganic insulating layer IL. In an embodiment, the organic insulating layer OL may include a first planarization layer 109, a second planarization layer 111, and a pixel defining layer 113. In another embodiment, the second planarization layer 111 may be omitted. In another embodiment, the organic insulating layer OL may further include a third planarization layer (not shown) disposed between the second planarization layer 111 and the pixel defining layer 113.

[0123] The first planarization layer 109 may cover the source electrode SE and the drain electrode DE. The first planarization layer 109 may have a flat upper surface.

[0124] The first planarization layer 109 may include a single layer or multiple layers containing an organic material. The first planarization layer 109 may include a general polymer such as benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate or polystyrene, a polymer derivative with a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer or a mixture thereof. In an embodiment, the first planarization layer 109 may include a single layer or multiple layers containing an inorganic material. In this case, the first planarization layer 109 may include silicon oxide, silicon oxynitride, silicon nitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide or zinc oxide. After forming the first planarization layer 109, chemical mechanical polishing may be performed to provide a flat upper surface.

[0125] The connection metal CM may be disposed on the first planarization layer 109 . The connection metal CM may be electrically connected to the thin film transistor TFT by contacting the source electrode SE or the drain electrode DE of the thin film transistor TFT through the opening formed in the first planarization layer 109 .

[0126] Wiring (not shown) may also be disposed on the first planarization layer 109 , the wiring being spaced apart from the connection metal CM and including the same material as that of the connection metal CM.

[0127] The second planarization layer 111 may be disposed on the connection metal CM. The second planarization layer 111 may have a flat upper surface so that the pixel electrode 210 disposed thereon is formed to be flat.

[0128] The second planarization layer 111 may include a single layer or multiple layers containing an organic material. In this case, the second planarization layer 111 may include a general polymer such as benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate or polystyrene, a polymer derivative with a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer or a mixture thereof. In another embodiment, the second planarization layer 111 may include a single layer or multiple layers containing an inorganic material. In this case, the second planarization layer 111 may include silicon oxide, silicon oxynitride, silicon nitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide or zinc oxide. After forming the second planarization layer 111, chemical mechanical polishing may be performed to provide a flat upper surface.

[0129] An opening exposing the connection metal CM may be formed in the second planarization layer 111. The pixel electrode 210 may be electrically connected to the thin film transistor TFT by contacting the connection metal CM through the opening.

[0130] The pixel electrode 210 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 210 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or a mixture thereof. In another embodiment, the pixel electrode 210 may also include a layer comprising ITO, IZO, ZnO or In2O3 above / below the reflective layer. In an embodiment, the pixel electrode 210 may have a stacked ITO / Ag / ITO structure.

[0131] A pixel-defining layer 113 may be formed on the pixel electrode 210. The pixel-defining layer 113 includes an opening that exposes the upper surface of the pixel electrode 210 and may cover the edge of the pixel electrode 210. In an embodiment, the pixel-defining layer 113 may include an organic insulating material. In another embodiment, the pixel-defining layer 113 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, or silicon nitride. Alternatively, the pixel-defining layer 113 may include both an organic insulating material and an inorganic insulating material.

[0132] Hereinafter, for the convenience of description, a case where the first planarization layer 109 , the second planarization layer 111 , and the pixel defining layer 113 include an organic insulating material will be mainly described in detail.

[0133] The intermediate layer 220 may include an emissive layer 220b. The emissive layer 220b may include, for example, an organic material. The emissive layer 220b may include a polymer organic material or a low molecular weight organic material that emits light of a predetermined color. The intermediate layer 220 may include a first functional layer 220a and / or a second functional layer 220c. The first functional layer 220a is disposed below the emissive layer 220b, and the second functional layer 220c is disposed above the emissive layer 220b.

[0134] The first functional layer 220a may include a single layer or multiple layers. For example, when the first functional layer 220a includes a polymer material, the first functional layer 220a may include a hole transport layer (HTL) having a single layer structure, and may include poly (3,4-ethylenedioxythiophene) (PEDOT) or polyaniline (PANI). When the first functional layer 220a includes a low molecular weight material, the first functional layer 220a may include a hole injection layer (HIL) and a hole transport layer (HTL).

[0135] The second functional layer 220c may be omitted. For example, when the first functional layer 220a and the emission layer 220b include polymer materials, the second functional layer 220c may be formed. The second functional layer 220c may include a single layer or multiple layers. The second functional layer 220c may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0136] The emission layer 220 b of the intermediate layer 220 may be arranged for each pixel in the second area A2 , and the emission layer 220 b may overlap with the opening of the pixel defining layer 113 and / or the pixel electrode 210 .

[0137] The opposing electrode 230 may include a conductive material having a low work function. For example, the opposing electrode 230 may include a (semi) transparent layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof. Alternatively, the opposing electrode 230 may also include a layer containing ITO, IZO, ZnO, or In2O3 on the (semi) transparent layer. The opposing electrode 230 is provided as a single body to cover the plurality of pixel electrodes 210 in the second area A2. The intermediate layer 220 and the opposing electrode 230 may be formed by thermal deposition.

[0138] In an embodiment, an inorganic encapsulation layer 300 may be arranged on the opposing electrode 230, the inorganic encapsulation layer 300 covering the organic light emitting diode OLED. The inorganic encapsulation layer 300 may be arranged along the shape of the upper surface of the opposing electrode 230. Therefore, the inorganic encapsulation layer 300 can prevent moisture from penetrating into the organic light emitting diode OLED. The inorganic encapsulation layer 300 may include one or more inorganic insulating materials. The inorganic insulating material may include aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon oxynitride and / or silicon nitride. The inorganic encapsulation layer 300 may be formed by using chemical vapor deposition. In an embodiment, the inorganic encapsulation layer 300 may be omitted.

[0139] The second substrate 20 may be disposed above the opposite electrode 230 and may include a transparent material. For example, the second substrate 20 may include glass or plastic material.

[0140] The sealing member SP disposed in the fourth area A4 may attach the first substrate 10 to the second substrate 20. In this case, the sealing member SP may be disposed on the inorganic insulating layer IL in the fourth area A4.

[0141] In this embodiment, the buffer layer 101 and the inorganic insulating layer IL can extend from the second area A2 to the first area A1. In addition, the buffer layer 101 and the inorganic insulating layer IL can extend to the inner surface 10S of the first through hole 10H. The buffer layer 101 and the inorganic insulating layer IL can surround the upper surface US of the first substrate 10 and the inner surface 10S of the first through hole 10H, and the upper surface US of the first substrate 10 includes the upper surface US adjacent to the first through hole 10H. Therefore, foreign matter or moisture can be prevented from penetrating into the thin film transistor TFT. The buffer layer 101 and the inorganic insulating layer IL can be formed on the first substrate 10 including the first through hole 10H, and thus can be arranged on the inner surface 10S of the first through hole 10H.

[0142] In this embodiment, the organic insulating layer OL may extend to the third region A3. The functional layer 220-1 including the first functional layer 220a and the second functional layer 220c may also extend to the third region A3.

[0143] In this embodiment, the relative electrode 230 and the inorganic encapsulation layer 300 may extend from the second area A2 to the first area A1. In addition, the relative electrode 230 and the inorganic encapsulation layer 300 may extend to the inner surface 10S of the first through hole 10H. The relative electrode 230 and the inorganic encapsulation layer 300 may surround the upper surface US of the first substrate 10 and the inner surface 10S of the first through hole 10H, and the upper surface US of the first substrate 10 includes the upper surface US adjacent to the first through hole 10H. In this case, the relative electrode 230 may contact the inorganic insulating layer IL on the inner surface 10S of the first through hole 10H. Therefore, the inorganic insulating layer IL and the relative electrode 230 can prevent foreign matter or moisture from penetrating from the first area A1 to the second area A2.

[0144] In this embodiment, a barrier member SHP including a moisture-proof insulating material may be disposed on the inner surface 10S of the first through hole 10H and may be disposed to cover the inorganic encapsulation layer 300 and / or the inorganic insulating layer IL. The barrier member SHP may prevent foreign matter or moisture from penetrating from the first area A1 to the second area A2. Therefore, the sealing member SP may not be disposed in the third area A3.

[0145] Figure 6 is a cross-sectional view of a display device 1 according to another embodiment. Figure 6 In, due to Figure 2A The same reference numerals as those in the accompanying drawings denote the same elements, and thus their repeated descriptions are omitted.

[0146] Reference Figure 6The display device 1 may include a first substrate 10 , an inorganic insulating layer IL, a display element layer DEL, a sealing member SP, a second substrate 20 , an optical function layer 30 , an adhesive layer 40 , a cover window 50 , a blocking member SHP, and an assembly COMP.

[0147] The first substrate 10 may be arranged in the second, third, and fourth areas A2, A3, and A4 of the display device 1. The second area A2 surrounds the first through-hole 10H, and the fourth area A4 surrounds at least a portion of the second area A2. In this case, in a plan view, the first through-hole 10H may be arranged to correspond to the first area A1. Furthermore, a plurality of organic light-emitting diodes serving as display elements may be arranged in the display element layer DEL in the second area A2 of the display device 1. In this case, the inorganic insulating layer IL arranged between the first substrate 10 and the display element layer DEL may extend from the second area A2 to the inner surface 10S of the first through-hole 10H.

[0148] The second substrate 20 including the second through-hole 20H may be disposed above the first substrate 10. The second through-hole 20H may be connected to the first through-hole 10H. In this case, the second through-hole 20H may be disposed to correspond to the first through-hole 10H in a plan view.

[0149] The optical function layer 30 may be disposed on the second substrate 20 and may include a third through hole 30H connected to the second through hole 20H. In this case, the third through hole 30H may be disposed to correspond to the second through hole 20H in a plan view.

[0150] The adhesive layer 40 may be disposed on the third optical function layer 30 and may include a fourth through hole 40H connected to the third through hole 30H. In this case, the fourth through hole 40H may be disposed to correspond to the third through hole 30H in a plan view.

[0151] In this embodiment, the size of the fourth through hole 40H may be larger than that of the third through hole 30H. In this case, the size of the third through hole 30H may be defined as the area of the cross section of the third through hole 30H perpendicular to the z direction. The size of the fourth through hole 40H may be the area of the cross section of the fourth through hole 40H perpendicular to the z direction. For ease of description, Figure 6 , the size of the fourth through hole 40H and the size of the third through hole 30H are respectively shown as the diameter 40D of the fourth through hole 40H and the diameter 30D of the third through hole 30H. In this case, the diameter 40D of the fourth through hole 40H may be greater than the diameter 30D of the third through hole 30H.

[0152] In this embodiment, the blocking member SHP may extend from the first through hole 10H of the first substrate 10 to the upper surface 30US of the optical function layer 30. Therefore, at least a portion of the blocking member SHP may be disposed on the upper surface 30US of the optical function layer 30. In this case, the blocking member SHP may fill the area defined by the upper surface 30US of the optical function layer 30, the bottom surface 50US of the cover window 50 facing the upper surface 30US of the optical function layer 30, and the fourth through hole 40H of the adhesive layer 40. Therefore, the blocking effect of the blocking member SHP may be enhanced.

[0153] Figure 7 and Figure 8 is a cross-sectional view of a method of manufacturing the display device 1 according to the embodiment. Figure 9A is a cross-sectional view of a method of manufacturing the display device 1 according to the embodiment. Figure 9B In the method for manufacturing the display device 1 according to the embodiment Figure 9A An enlarged cross-sectional view of region D. Figure 10 、 Figure 11 and Figure 12 is a cross-sectional view of a method for manufacturing the display device 1 according to an embodiment. Figure 7 、 Figure 8 、 Figure 9A 、 Figure 9B 、 Figure 10 、 Figure 11 and Figure 12 In the drawings, since the same reference numerals as those in the above-mentioned figures denote the same elements, their repeated descriptions are omitted.

[0154] Reference Figure 7 , a first substrate 10 having a first through hole 10H including an inner surface 10S may be prepared. In an embodiment, the first through hole 10H may be formed by using a laser. In another embodiment, the first through hole 10H may be formed by using mechanical polishing. In this case, the first through hole 10H may be formed to correspond to the first area A1. Although in Figure 7 , one first through hole 10H is shown to be formed, but in another embodiment, a plurality of first through holes 10H may be formed in the first substrate 10 .

[0155] Reference Figure 8, the inorganic insulating layer IL may be formed in the second area A2 surrounding the first through hole 10H. In an embodiment, the inorganic insulating layer IL may be formed by using chemical vapor deposition. The inorganic insulating layer IL may be formed along the shape of the layer arranged below the inorganic insulating layer IL. For example, in the case where the inorganic insulating layer IL is formed on the upper surface US of the first substrate 10 including the first through hole 10H, the inorganic insulating layer IL may be formed on the inner surface 10S of the first through hole 10H and the upper surface US of the first substrate 10. Therefore, the inorganic insulating layer IL may extend from the second area A2 to the inner surface 10S of the first through hole 10H. That is, the inorganic insulating layer IL may surround the upper surface US of the first substrate 10 and the inner surface 10S of the first through hole 10H, and the upper surface US of the first substrate 10 includes the upper surface US adjacent to the first through hole 10H. Therefore, the inorganic insulating layer IL can prevent foreign matter or moisture from penetrating from the first area A1 to the second area A2.

[0156] Next, refer to Figure 9A and Figure 9B , a display element layer DEL including a display element may be formed in the second region A2. Specifically, an organic insulating layer OL and an organic light emitting diode OLED (refer to FIG. 1 ) of the display element layer DEL may be formed. Figure 5 ). In addition, a sealing member SP may be formed in the fourth area A4.

[0157] In this embodiment, the inorganic encapsulation layer 300 may also be formed on the organic light emitting diode OLED. The inorganic encapsulation layer 300 may be formed by using chemical vapor deposition. Therefore, similar to the inorganic insulating layer IL, the inorganic encapsulation layer 300 may extend from the second area A2 to the inner surface 10S of the first through hole 10H. That is, the inorganic encapsulation layer 300 may surround the upper surface US of the first substrate 10 and the inner surface 10S of the first through hole 10H, and the upper surface US of the first substrate 10 includes the upper surface US adjacent to the first through hole 10H. Therefore, the inorganic encapsulation layer 300 may prevent foreign matter or moisture from penetrating from the first area A1 to the second area A2.

[0158] In addition, a second substrate 20 having a second through hole 20H formed therein may be prepared. In an embodiment, similar to the first through hole 10H, the second through hole 20H may be formed by using a laser. In another embodiment, the second through hole 20H may be formed by using mechanical polishing.

[0159] Next, the second substrate 20 may be arranged above the first substrate 10 so that the second through-hole 20H corresponds to the first through-hole 10H in a plan view. Thus, the second through-hole 20H may be connected to the first through-hole 10H. In this case, the first through-hole 10H and the second through-hole 20H may serve as alignment marks configured to align the first substrate 10 and the second substrate 20.

[0160] The first substrate 10 may be coupled to the second substrate 20 by using a sealing member SP. Thus, an inner space between the first substrate 10 and the second substrate 20 may be sealed.

[0161] Next, refer to Figure 10 , an optical function layer 30 may be formed on the second substrate 20, the optical function layer 30 including a third through hole 30H connected to the second through hole 20H. In a plan view, the third through hole 30H may be formed to correspond to the second through hole 20H.

[0162] Next, the adhesive layer 40 including the fourth through hole 40H connected to the third through hole 30H may be formed on the optical function layer 30. The fourth through hole 40H may be formed to correspond to the third through hole 30H in a plan view.

[0163] Next, a cover window 50 may be formed on the adhesive layer 40, the cover window 50 being arranged in the second area A2 and covering the fourth through hole 40H. Specifically, the cover window 50 may completely cover the adhesive layer 40 and the fourth through hole 40H. In this case, the optical function layer 30 may be attached to the cover window 50 using the adhesive layer 40.

[0164] Next, refer to Figure 11 The blocking member SHP may be formed along the inner surface 10S of the first through hole 10H, the inner surface 20S of the second through hole 20H, the inner surface 30S of the third through hole 30H, and the inner surface 40S of the fourth through hole 40H. The blocking member SHP may extend from the first substrate 10 to the second substrate 20. In addition, the blocking member SHP may extend from the first substrate 10 to the cover window 50. In embodiments, the blocking member SHP may contact the adhesive layer 40.

[0165] In the present embodiment, the barrier member SHP may cover the inorganic insulating layer IL extending to the inner surface 10S of the first through hole 10H. Therefore, the barrier member SHP may prevent foreign matter or moisture from penetrating from the first area A1 to the second area A2.

[0166] In an embodiment, the blocking member (SHP) can be formed using the following method. First, a black pigment and a moisture-proof insulating material are applied to the outer peripheral surface of a rotatable rotor. In this case, the rotor may include rollers. Furthermore, when the rotor is inserted into the first area (A1) and then rotated, the blocking member (SHP) can be formed along the inner surface (10S) of the first through-hole (10H) and the inner surface (20S) of the second through-hole (20H).

[0167] Next, refer to Figure 12, the component COMP may be arranged across the first through hole 10H and the second through hole 20H. Specifically, the component COMP may be arranged in the first area A1. In addition, the component COMP may be arranged across the first through hole 10H, the second through hole 20H, and the third through hole 30H, and adjacent to the cover window 50. In an embodiment, the component COMP may be arranged across the first through hole 10H, the second through hole 20H, the third through hole 30H, and the fourth through hole 40H to contact the cover window 50.

[0168] In this embodiment, an inorganic insulating layer IL and a display element layer DEL are formed on a first substrate 10 having first through-holes 10H formed therein. A second substrate 20 having second through-holes 20H formed therein can be attached to the first substrate 10. Unlike the embodiment described above, if the first and second through-holes 10H, 20H are formed in the first and second substrates 10, 20, respectively, after the first and second substrates 10, 20, including the inorganic insulating layer IL and the display element layer DEL, are attached to each other, there is a possibility that foreign matter or moisture may penetrate into the display elements of the display element layer DEL. Furthermore, after forming the first and second through-holes 10H, 20H, an additional subsequent process may be required to polish the bottom surface of the first substrate 10 and the top surface of the second substrate 20. Since the display device 1 is manufactured using the first substrate 10 having the first through-holes 10H formed therein and the second substrate 20 having the second through-holes 20H formed therein, the reliability of the display device 1 can be improved. Furthermore, since no additional subsequent process is required in the method for manufacturing the display device 1, the efficiency of the method for manufacturing the display device 1 can be improved.

[0169] Figure 13A and Figure 13B is a cross-sectional view of a method for manufacturing a display device 1 according to another embodiment. Figure 13A and Figure 13B In, due to Figure 11 The same reference numerals as in the figures denote the same components, and thus repeated descriptions thereof are omitted.

[0170] Reference Figure 13A , the size of the fourth through hole 40H may be larger than the size of the third through hole 30H. Figure 13A , the size of the fourth through hole 40H and the size of the third through hole 30H are respectively shown as the diameter 40D of the fourth through hole 40H and the diameter 30D of the third through hole 30H. In this case, the diameter 40D of the fourth through hole 40H can be larger than the diameter 30D of the third through hole 30H. Therefore, the upper surface 30US of the optical function layer 30 can be exposed through the adhesive layer 40.

[0171] Reference Figure 13B, the blocking member SHP may extend from the inner surface 10S of the first through hole 10H to the upper surface 30US of the optical function layer 30. At least a portion of the blocking member SHP may be formed on the upper surface 30US of the optical function layer 30. In this case, the blocking member SHP may fill the area defined by the upper surface 30US of the optical function layer 30, the bottom surface 50US of the cover window 50 facing the upper surface 30US of the optical function layer 30, and the fourth through hole 40H of the adhesive layer 40. Therefore, the blocking effect of the blocking member SHP can be enhanced.

[0172] As described above, since the embodiment includes the first substrate 10 including the first through hole 10H and the second substrate 20 including the second through hole 20H connected to the first through hole 10H, transmittance of the transmission area can be improved and distortion of light incident to the component can be prevented.

[0173] In addition, since the embodiment includes the blocking member SHP disposed on the inner surface 10S of the first through hole 10H, diffuse reflection caused by the display element or wiring disposed around the first through hole 10H can be prevented, and moisture can be prevented from penetrating from the first through hole 10H to the display element.

[0174] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made herein without departing from the spirit and scope defined by the following claims.

Claims

1. A display device, wherein: The display device includes a display area and a non-display area, the non-display area surrounding at least a portion of the display area, and the display device further includes: A first substrate comprising a first through hole, wherein the display area surrounds the first through hole; an inorganic insulating layer, arranged in the display area; a display element layer including a display element and arranged on the inorganic insulating layer; a second substrate including a second through hole and disposed on the display element layer, the second through hole being connected to the first through hole; and a blocking member arranged along an inner surface of the first through hole and an inner surface of the second through hole and extending from the first substrate to the second substrate, The inorganic insulating layer extends from the display area to the inner surface of the first through hole and covers the inner surface of the first through hole. The blocking member covers a portion of the inorganic insulating layer covering the inner surface of the first through hole, and the blocking member includes a black pigment and a moisture-proof insulating material.

2. The display device according to claim 1, wherein The display element includes a pixel electrode and an opposing electrode, and The opposing electrode extends from the display area to the inner surface of the first through hole.

3. The display device according to claim 2, wherein: The display element layer further includes an organic insulating layer disposed between the inorganic insulating layer and the opposing electrode, and The inorganic insulating layer contacts the opposing electrode on the inner surface of the first through hole.

4. The display device according to claim 1, wherein The display element layer further includes: an inorganic encapsulation layer covering the display element, The inorganic encapsulation layer extends from the display area to the inner surface of the first through hole.

5. The display device according to claim 1, wherein The display device further includes an optical function layer disposed on the second substrate and including a third through hole connected to the second through hole. The blocking member extends from the second substrate to the optical function layer. The display device according to claim 5 , wherein: The display device further includes: a cover window provided on the optical function layer, arranged in the display area, and covering the third through hole; and An adhesive layer is disposed between the optical function layer and the cover window and includes a fourth through hole connected to the third through hole.

7. The display device according to claim 6, wherein: The size of the fourth through hole is larger than that of the third through hole, and The blocking member extends to an upper surface of the optical function layer.

8. The display device according to claim 1, wherein At least one of the first substrate and the second substrate comprises glass.

9. The display device according to claim 1, wherein The display device further includes a component arranged to pass through the first through hole and the second through hole.

10. The display device according to claim 9, wherein The display device further includes: an optical functional layer disposed on the second substrate and including a third through hole connected to the second through hole; and a cover window, provided on the optical function layer, arranged in the display area, and covering the third through hole, Wherein, the component is arranged to pass through the third through hole.

11. A method for manufacturing a display device, wherein: The display device includes a display area and a non-display area, the non-display area surrounding at least a portion of the display area, and the method includes: preparing a first substrate having a first through hole surrounded by the display area; forming an inorganic insulating layer on the first substrate so that the inorganic insulating layer extends from the display area to the inner surface of the first through hole and covers the inner surface of the first through hole; forming a display element layer on the inorganic insulating layer, wherein the display element layer includes a display element; preparing a second substrate having a second through hole formed therein; aligning the first substrate with the second substrate so that the first through-hole corresponds to the second through-hole; and forming a blocking member along the inner surface of the first through hole and the inner surface of the second through hole such that the blocking member extends from the first substrate to the second substrate, The blocking member covers a portion of the inorganic insulating layer covering the inner surface of the first through hole, and the blocking member includes a black pigment and a moisture-proof insulating material.

12. The method according to claim 11, wherein The forming of the display element layer includes: forming an inorganic encapsulation layer on the display element, The inorganic encapsulation layer extends from the display area to the inner surface of the first through hole.

13. The method according to claim 11, wherein The method further comprises: forming an optical function layer on the second substrate, the optical function layer comprising a third through hole connected to the second through hole; forming an adhesive layer on the optical function layer, the adhesive layer including a fourth through hole connected to the third through hole; and A cover window is disposed on the adhesive layer, the cover window being disposed in the display area and covering the fourth through hole.

14. The method according to claim 13, wherein The size of the fourth through hole is larger than that of the third through hole, and The blocking member extends from the inner surface of the second through hole to an upper surface of the optical function layer.

15. The method according to claim 11, wherein The method further includes arranging a component so that the component passes through the first through-hole and the second through-hole.

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