Smart Window Panel and Smart Window Motherboard

Abstract

The present invention provides an intelligent window panel and an intelligent window mother board, belonging to the field of liquid crystal technology. The intelligent window mother board includes a rectangular middle area and a peripheral area, a rectangular first substrate mother board and a rectangular second substrate mother board which are oppositely arranged; the first substrate mother board is provided with a first conductive film layer on one side; one side of the second substrate mother board is provided with a planar second conductive film layer, and at least one second PAD is arranged on each edge of the second substrate mother board; in the 2m areas of the middle partition that can equally divide the middle area of the intelligent window mother board into 2×m rectangular middle partitions, at least one first PAD and at least one second PAD are arranged on the peripheral area part of the intelligent window mother board corresponding to each middle partition. The present invention can improve the production efficiency of multi-size intelligent window panels.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid crystals, and particularly to an intelligent window panel and an intelligent window mother board. Background Art

[0002] The intelligent window panel includes two substrates arranged oppositely and liquid crystals located between the substrates. By driving the deflection of the liquid crystals, the light passing through the intelligent window panel can be controlled, thereby realizing light dimming. The intelligent window panel products have advantages such as second-level response, stepless dimming, uniform transparency, and extra-large size, and can be widely applied to fields such as high-speed rail side windows, passenger car sunroofs and side windows, ship portholes, building facades and daylighting roofs. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an intelligent window panel and an intelligent window mother board, which can improve the production efficiency of intelligent window panels of multiple sizes.

[0004] To solve the above technical problem, the embodiments of the present invention provide the following technical solutions:

[0005] On the one hand, there is provided an intelligent window panel obtained by cutting, including a rectangular middle region and a peripheral region surrounding the middle region, including:

[0006] A rectangular first substrate mother board and a rectangular second substrate mother board arranged oppositely, and a liquid crystal layer located between the first substrate mother board and the second substrate mother board;

[0007] On one side of the first substrate mother board facing the second substrate mother board, a planar first conductive film layer is provided, and at least one first PAD is provided at each edge of the first substrate mother board, and the first PADs are all electrically connected to the first conductive film layer;

[0008] On one side of the second substrate mother board facing the first substrate mother board, a planar second conductive film layer is provided, and at least one second PAD is provided at each edge of the second substrate mother board, and the second PADs are all electrically connected to the second conductive film layer, and the orthographic projection of the first PAD on the second substrate mother board does not overlap with the second PAD;

[0009] In 2m regions where the middle region of the intelligent window mother board can be equally divided into 2×m rectangular middle sub-regions, at least one first PAD and at least one second PAD are provided in the peripheral region part corresponding to each middle sub-region of the intelligent window mother board; for a first PAD and a second PAD corresponding to the same intelligent window panel, they can cooperate and be electrically connected to an external drive circuit to provide a drive signal for the intelligent window panel; where m is an integer greater than or equal to 1.

[0010] In some embodiments, m is equal to 2.

[0011] In some embodiments, the cutting line of the first substrate motherboard is a cutting line along which the first substrate motherboard is cut to expose the second PAD, and the cutting line of the second substrate motherboard is a cutting line along which the second substrate motherboard is cut to expose the first PAD.

[0012] In some embodiments, each edge of the first substrate motherboard is also provided with at least one anti-fool mark, and the anti-fool mark is different in shape and / or size from the first PAD, and the cutting line of the second substrate motherboard also includes a line along which the second substrate motherboard is cut to expose the anti-fool mark.

[0013] In some embodiments, the fool-proof marks correspond to the first PADs one-to-one, and each of the fool-proof marks is adjacent to the corresponding first PAD and is separated by a predetermined distance.

[0014] In some embodiments, each edge of the first substrate motherboard is provided with a plurality of the first PADs and a plurality of the fool-proof marks, and each edge of the second substrate motherboard is provided with a plurality of the second PADs;

[0015] The first orthographic projection of each first PAD on the second substrate motherboard and the third orthographic projection of the corresponding fool-proof mark on the second substrate motherboard form a projection group, and on each edge of the second substrate motherboard, the projection group and the second PAD are alternately arranged.

[0016] In some embodiments, the minimum spacing between the first orthographic projection and the adjacent second PAD is 4-102 mm.

[0017] In some embodiments, the projection groups correspond to the second PADs one-to-one, each projection group is adjacent to the corresponding second PAD and separated by a predetermined distance, each projection group and the corresponding second PAD form a PAD group, and the spacing between adjacent PAD groups is greater than 50 mm.

[0018] In some embodiments, four groups of PAD groups are disposed on each edge of the second display substrate motherboard.

[0019] In some embodiments, the minimum length of the first PAD in a first direction is 40-60 mm, the first direction is the extension direction of the edge where the first PAD is located, and the width in a second direction is 2.5-4.5 mm, the second direction is perpendicular to the first direction; and / or

[0020] The minimum length of the second PAD in the first direction is 40-60 mm, the first direction is the extension direction of its corresponding edge, and the width in the second direction is 2.5-4.5 mm, where the second direction is perpendicular to the first direction.

[0021] In some embodiments, the first conductive film layer extends to the edge of the first display substrate mother board to form the first PAD. At the first PAD, the thickness of the first conductive film layer is greater than a preset first threshold, and the step difference is not greater than a preset second threshold; and / or

[0022] The second conductive film layer extends to the edge of the second display substrate mother board to form the second PAD. At the second PAD, the thickness of the second conductive film layer is greater than a preset first threshold, and the step difference is not greater than a preset second threshold.

[0023] Embodiments of the present invention also provide an intelligent window panel, which is cut from the above-mentioned intelligent window mother board. The intelligent window panel includes at least one of the first PADs and at least one of the second PADs.

[0024] In some embodiments, the intelligent window panel includes a plurality of the first PADs and a plurality of the second PADs.

[0025] Embodiments of the present invention have the following beneficial effects:

[0026] In the above solution, a normalization design is carried out on the intelligent window mother board. At least one first PAD is provided on each edge of the first substrate mother board, and at least one second PAD is provided on each edge of the second substrate mother board. The positions and numbers of the PADs are fixed, replacing the differential design in which the positions of the PADs change with the size of the intelligent window panel. This can greatly improve the production efficiency of intelligent window panels of multiple sizes, and solve problems such as long debugging time, serious occupation of production line equipment, and high personnel requirements, long duration, and low efficiency during the production of intelligent window panels of multiple sizes. Description of the Drawings

[0027] Figure 1 Schematic diagram of manufacturing an intelligent window panel for the prior art;

[0028] Figures 2a - 2d Schematic diagram of the intelligent window mother board according to an embodiment of the present invention;

[0029] Figure 3 Schematic diagram of the first substrate mother board according to an embodiment of the present invention;

[0030] Figure 4 Schematic diagram of the second substrate mother board according to an embodiment of the present invention;

[0031] Figure 5 Schematic diagram of manufacturing an intelligent window panel according to an embodiment of the present invention;

[0032] Figure 6 and Figure 7 is a schematic diagram of the size of the PAD in the embodiment of the present invention.

[0033] Reference numeral

[0034] 01 Mother board of intelligent window

[0035] 06 Intelligent window panel

[0036] 02 Conductive film layer

[0037] 03 First PAD

[0038] 04 Anti-fooling mark

[0039] 05 Second PAD

[0040] 011 First substrate mother board

[0041] 012 Second substrate mother board Detailed implementation manners

[0042] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will be described in detail with reference to the drawings and specific embodiments.

[0043] In the related art, when manufacturing intelligent window panels of multiple sizes, after cutting the mother board of the intelligent window into one or more intelligent window panels, the sizes of the PADs are customized for the intelligent window panels of different sizes.

[0044] As Figure 1 shown, after cutting the mother board of the intelligent window into one intelligent window panel by the first cutting method or the second cutting method, cutting the mother board of an intelligent window into two intelligent window panels by the third cutting method or the fourth cutting method, cutting the mother board of an intelligent window into three intelligent window panels by the fifth cutting method, and cutting the mother board of the intelligent window into four intelligent window panels by the sixth cutting method, a corresponding set of PADs (shown within the dotted line box) is designed for each intelligent window panel. This method poses great challenges to the debugging of production line equipment and personnel correspondence. There are problems such as long debugging time during the production of intelligent window panels of multiple sizes, serious occupation of production line equipment, large personnel requirements, long time consumption and low efficiency.

[0045] The embodiments of the present invention provide an intelligent window panel and a mother board of an intelligent window, which can improve the production efficiency of intelligent window panels of multiple sizes.

[0046] The embodiment of the present invention provides a mother board of an intelligent window for cutting to obtain an intelligent window panel, including a rectangular middle area and a peripheral area surrounding the functional area, asFigure 2a , Figure 2b , Figure 3 and Figure 4 as shown in, including:

[0047] Relatively arranged rectangular first substrate mother board 011 and rectangular second substrate mother board 012, and a liquid crystal layer located between the first substrate mother board 011 and the second substrate mother board 012;

[0048] On one side of the first substrate mother board facing the second substrate mother board, a planar first conductive film layer is provided, and at least one first PAD 03 is provided at each edge of the first substrate mother board 011, and the first PADs are all electrically connected to the first conductive film layer;

[0049] On one side of the second substrate mother board facing the first substrate mother board, a planar second conductive film layer is provided, and at least one second PAD 05 is provided at each edge of the second substrate mother board, and the second PADs are all electrically connected to the second conductive film layer, and the orthographic projection of the first PAD on the second substrate mother board does not overlap with the second PAD;

[0050] Wherein, the orthographic projection of the first PAD 03 on the second substrate mother board 012 does not overlap with the second PAD 05;

[0051] In the 2m regions that can equally divide the middle region of the intelligent window mother board into 2×m rectangular middle partitions, at least one first PAD and at least one second PAD are provided in the peripheral region part corresponding to each middle partition of the intelligent window mother board; for one first PAD and one second PAD corresponding to the same intelligent window panel, they can cooperate and be electrically connected to an external driving circuit to provide a driving signal for the intelligent window panel; wherein, m is an integer greater than or equal to 1.

[0052] Wherein, in the rectangular first substrate mother board 011 and the rectangular second substrate mother board 012, the corners of the rectangle can be rounded or chamfered.

[0053] Wherein, the above-mentioned middle region and peripheral region of the rectangle are distinctions made for description, and there may not be exactly the same structural boundaries in reality. The above-mentioned middle partitions are middle partitions made for description, and the middle partitions in the intelligent window mother board product may not be cut in this way.

[0054] In the manufacturing process of the intelligent window panel, it is necessary to cut a large integral intelligent window mother board formed by the alignment of the first substrate mother board and the second substrate mother board, so as to form individual intelligent window panels. To expose the PAD on the first substrate mother board, the corresponding part of the second substrate mother board needs to be cut off; to expose the PAD on the second substrate mother board, the corresponding part of the first substrate mother board needs to be cut off.

[0055] The cutting line of the first substrate mother board 011 is the cutting line along which the first substrate mother board 011 is cut to expose the second PAD 05, and the cutting line of the second substrate mother board 012 is the cutting line along which the second substrate mother board 012 is cut to expose the first PAD 03.

[0056] In this embodiment, a normalization design is carried out on the intelligent window mother board. At least one first PAD is arranged on each edge of the first substrate mother board, and at least one second PAD is arranged on each edge of the second substrate mother board. The positions and quantities of the PADs are fixed, replacing the differential design in which the positions of the PADs change with the size of the intelligent window panel, which can greatly improve the production efficiency of multi-size intelligent window panels and solve problems such as long debugging time, serious occupation of production line equipment, large number of personnel requirements, long time consumption and low efficiency during the production of multi-size intelligent window panels.

[0057] In some embodiments, m is equal to 2. As Figure 2c shown, each dotted-line frame is a middle partition area, and it can be seen that at least one first PAD and at least one second PAD are arranged in the peripheral area corresponding to each middle partition area.

[0058] In a specific example, m is 3. As Figure 2d shown, each dotted-line frame is a middle partition area, and it can be seen that at least one first PAD and at least one second PAD are arranged in the peripheral area part corresponding to each middle partition area.

[0059] Among them, as Figure 2a and Figure 2b shown, a planar conductive film layer 02 (i.e., the first conductive film layer) is arranged on the first substrate mother board 011, and the planar conductive film layer 02 extends to the edge of the first substrate mother board 011 to form the first PAD; a planar conductive film layer 02 (i.e., the second conductive film layer) is arranged on the second substrate mother board 012, and the planar conductive film layer 02 extends to the edge of the second substrate mother board 012 to form the second PAD; the planar conductive film layer 02 serves as an electrode.

[0060] To ensure the reliability of electrical connection, the first PAD and the second PAD need to be arranged in the stable area of the conductive film layer. As Figure 2a and Figure 2bAs shown, a uniform conductive film layer 02, such as a metal film layer, is provided in the stable region of the conductive film layer, and the film thickness of the conductive film layer 02 meets the requirements and has good uniformity.

[0061] In some embodiments, at the first PAD, the thickness of the first conductive film layer is greater than a preset first threshold, and the step difference is not greater than a preset second threshold; and / or

[0062] At the second PAD, the thickness of the second conductive film layer is greater than a preset first threshold, and the step difference is not greater than a preset second threshold.

[0063] Among them, the values of the first threshold and the second threshold can be set according to actual applications to ensure that the thickness and uniformity of the first conductive film layer at the first PAD meet the requirements, and the thickness and uniformity of the second conductive film layer at the second PAD meet the requirements.

[0064] After the first substrate mother board 011 and the second substrate mother board 012 are aligned, the second substrate mother board 012 is cut along the cutting line of the second substrate mother board 012 to expose the first PAD, and the first substrate mother board 011 is cut along the cutting line of the first substrate mother board 011 to expose the second PAD, forming a smart window panel. Bind the flexible printed circuit (FPC) to the first PAD, and input an electrical signal to the conductive film layer 02 as an electrode through the first PAD; bind the flexible printed circuit to the second PAD, and input an electrical signal to the conductive film layer 02 as an electrode through the second PAD. In this way, an electric field is generated between the conductive film layer 02 of the first substrate mother board 011 and the conductive film layer 02 of the second substrate mother board 012, driving the liquid crystals in the liquid crystal layer to deflect, thereby changing the transmittance of the smart window panel.

[0065] In some embodiments, a plurality of the first PADs are provided at each edge of the first substrate mother board, and the plurality of the first PADs provided on each edge are arranged at equal intervals; and / or

[0066] A plurality of the second PADs are provided at each edge of the second substrate mother board, and the plurality of the second PADs provided on each edge are arranged at equal intervals.

[0067] In this embodiment, a plurality of first PADs are provided at each edge of the first substrate mother board, and a plurality of second PADs are provided at each edge of the second substrate mother board. By controlling the number of the first PADs and the second PADs, after the smart window mother board is cut, each smart window panel corresponds to a plurality of first PADs and a plurality of second PADs. In the later stage of FPC binding, selective binding or all binding of the plurality of first PADs and the plurality of second PADs can be performed. If the FPCs are bound to the plurality of first PADs and the plurality of second PADs, if the FPCs fall off in the subsequent process, the risk of failure of the smart window panel can also be reduced.

[0068] The shape of the first PAD is generally substantially the same as that of the second PAD, and the sizes are also substantially the same. In order to distinguish the first display substrate mother board and the second display substrate mother board in the manufacturing process, in some embodiments, such as Figures 2a - 3 As shown, at least one anti-fooling mark 04 is further provided on each edge of the first substrate mother board 011. The anti-fooling mark 04 is different in shape and / or size from the first PAD 03. The cutting line of the second substrate mother board further includes a line along which the second substrate mother board is cut to expose the anti-fooling mark. The first display substrate mother board and the second display substrate mother board can be distinguished by the anti-fooling mark in the subsequent bonding and laminating processes.

[0069] In this embodiment, the number of the anti-fooling marks 04 and the first PADs 03 may be the same or different, as long as the first display substrate mother board 011 and the second display substrate mother board 012 can be distinguished.

[0070] In some embodiments, such as Figures 2a - 3 As described, the anti-fooling marks 04 and the first PADs 03 are in one-to-one correspondence, and each anti-fooling mark 04 is adjacent to and spaced a predetermined distance from the corresponding first PAD 03. The size of the anti-fooling mark 04 may be slightly smaller than the size of the first PAD 03.

[0071] In some embodiments, such as Figure 2a As shown, a plurality of the first PADs 03 and a plurality of the anti-fooling marks 04 are provided on each edge of the first substrate mother board 011, and a plurality of the second PADs 05 are provided on each edge of the second substrate mother board 012;

[0072] The first orthographic projection of each first PAD 03 on the second substrate mother board 012 and the third orthographic projection of the corresponding anti-fooling mark 04 on the second substrate mother board 012 form a projection group. On each edge of the second substrate mother board 012, the projection group and the second PADs 05 are alternately arranged.

[0073] In some embodiments, the second PAD 05 may also be located between the first orthographic projection and the third orthographic projection.

[0074] In some embodiments, the minimum distance between the first orthographic projection and the adjacent second PAD 05 may be 4 - 102 mm. Of course, the minimum distance between the first orthographic projection and the adjacent second PAD 05 is not limited to 4 - 102 mm and can also be adjusted according to the size of the intelligent window panel.

[0075] In some embodiments, such as Figure 2aAs shown, the projection groups correspond one-to-one with the second PADs 05. Each projection group is adjacent to the corresponding second PAD 05 and spaced a predetermined distance apart. The first PAD 03 and the anti-fooling mark 04 corresponding to each projection group and the corresponding second PAD form a PAD group. The distance between adjacent PAD groups can be greater than 50 mm. Of course, the distance between adjacent PAD groups is not limited to being greater than 50 mm and can also be adjusted according to the size of the intelligent window mother board.

[0076] After cutting the intelligent window mother board, each intelligent window panel corresponds to at least one PAD group. Each PAD group includes a first PAD and a second PAD, and may also include an anti-fooling mark.

[0077] As Figure 5 shown, the intelligent window mother board can be cut into an intelligent window panel 06 by the first cutting method or the second cutting method. The intelligent window panel 06 includes multiple PAD groups.

[0078] As Figure 5 shown, the intelligent window mother board can also be cut into two intelligent window panels 06 by the third cutting method or the fourth cutting method. It can be seen that each intelligent window panel 06 includes multiple PAD groups.

[0079] As Figure 5 shown, the intelligent window mother board can also be cut into three intelligent window panels 06 by the fifth cutting method. Each intelligent window panel 06 includes one or two PAD groups.

[0080] As Figure 5 shown, the intelligent window mother board can also be cut into four intelligent window panels 06 by the sixth cutting method. Each intelligent window panel 06 includes one PAD group.

[0081] As Figure 5 shown, the intelligent window mother board can also be cut into six intelligent window panels 06 by the seventh cutting method. Each intelligent window panel 06 includes one PAD group.

[0082] It can be seen from Figure 5 that the intelligent window mother board of this embodiment is applicable to a variety of different cutting methods and can obtain intelligent window panels of a variety of different specifications and sizes.

[0083] In this way, through the normalization design of the PADs of the intelligent window mother board, it can be ensured that the same mother board can adapt to a variety of different cutting methods to obtain functional panels of different specifications and sizes, thereby facilitating production management, improving the production efficiency of multi-size intelligent window panels, and solving problems such as long debugging time, serious occupation of production line equipment, and high personnel requirements, long time consumption, and low efficiency during the production of multi-size intelligent window panels.

[0084] In addition, if the intelligent window panel includes multiple groups of PAD groups, during the later FPC binding process, selective binding or full binding can be performed on multiple PAD groups. If FPC binding is performed on multiple PAD groups and the FPC detaches during the subsequent process, the risk of failure of the intelligent window panel can also be reduced.

[0085] In some embodiments, 4 groups of the PAD groups can be provided at each edge of the second display substrate mother board. Of course, the number of PAD groups provided at each edge of the second display substrate mother board is not limited to 4 groups, and other numbers of PAD groups can also be provided.

[0086] In this embodiment, the size of the PAD mainly considers the FPC binding area, binding accuracy, and process equipment limitations. The FPC binding area is mainly to ensure the reliability of the binding. In the related art, the width of the FPC for binding is about 21.5 mm; the process equipment limitation depends on the size of the press head of the binding equipment. The size of the press head used in the related art is about 40 mm; in summary, the minimum length of the first PAD03 in the first direction can be 40 - 60 mm, specifically 50 mm. The first direction is the extending direction of its corresponding edge. The width in the second direction can be 2.5 - 4.5 mm, specifically 3.5 mm. The second direction is perpendicular to the first direction; and / or, the minimum length of the second PAD05 in the first direction can be 40 - 60 mm, specifically 50 mm. The first direction is the extending direction of its corresponding edge. The width in the second direction can be 2.5 - 4.5 mm, specifically 3.5 mm. The second direction is perpendicular to the first direction.

[0087] In a specific example, the size of the binding part of the PAD can be 3.5 mm * 50 mm. The first PAD03 can be rectangular, and the second PAD05 can also be rectangular; due to process limit constraints and usage requirements, the process difficulty of the rectangular PAD is relatively high. To achieve binding, on the basis of ensuring the length of the PAD, arc angle cutting lines can be added on both sides of the PAD to facilitate the cutting tool of the cutting equipment and ensure a binding area of 50 mm * 3.5 mm.

[0088] In some embodiments, such as Figure 6 and Figure 7 shown, the obtuse angle of the first PAD03 can be an arc angle; and / or, the obtuse angle of the second PAD05 can be an arc angle.

[0089] Such as Figure 6 and Figure 7As shown, the minimum length of the first PAD is S1, the minimum length of the second PAD is S2, the minimum distance between the anti-fooling mark 04 and the first PAD 03 is d1, the minimum distance between the first PAD 03 and the second PAD 05 is d2, the widths of the first PAD 03, the second PAD 05 and the anti-fooling mark 04 are H, and the total length of the PAD group composed of the first PAD 03, the second PAD 05 and the anti-fooling mark 04 is d3. In a specific example, the value of d1 can be 25.34 mm, the value of d2 is 4 mm, the value of d3 is 197.26 mm, and the values of S1 and S2 are both 50 mm. In another specific example, the value of d1 can be 25.53 mm, the value of d2 is 102.13 mm, the value of d3 is 295.19 mm, the values of S1 and S2 are both 50 mm, and the value of H is 3.5 mm.

[0090] After the intelligent window mother board of this embodiment is prepared, it can be cut along the cutting line of the first substrate mother board and the cutting line of the second substrate mother board to expose the second PAD and the first PAD. Since the PADs on the intelligent window mother board are normalized design, it is applicable to intelligent window panels of any size. After the PADs are bonded, the intelligent window mother board is cut again according to the size requirements of the intelligent window panel to complete the manufacturing process of the intelligent window panel.

[0091] An embodiment of the present invention also provides an intelligent window panel, which is cut from the above-mentioned intelligent window mother board, and the intelligent window panel includes at least one of the first PADs and at least one of the second PADs.

[0092] In this embodiment, the intelligent window mother board is normalized designed. At least one first PAD is provided on each edge of the first substrate mother board, and at least one second PAD is provided on each edge of the second substrate mother board. The positions and numbers of the PADs are fixed. After the intelligent window mother board is cut, the intelligent window panel includes at least one of the first PADs and at least one of the second PADs, which can meet the bonding requirements. This embodiment replaces the differential design in which the positions of the PADs change with the size of the intelligent window panel, which can greatly improve the production efficiency of multi-size intelligent window panels, and solve the problems such as long debugging time, serious occupation of production line equipment, large number of personnel requirements, long time consumption and low efficiency during the production of multi-size intelligent window panels.

[0093] The intelligent window panel of this embodiment can be applied in the field of dimming. A whole-surface conductive film layer is respectively arranged on the first substrate mother board and the second substrate mother board. After the liquid crystal display panel mother board is cut to form the intelligent window panel, a whole-surface conductive film layer is also respectively arranged on the first substrate and the second substrate of the intelligent window panel as electrodes. The first PAD is connected to the whole-surface conductive film layer on the first substrate. Specifically, the first PAD and the conductive film layer on the first substrate can be an integral structure; the second PAD is connected to the whole-surface conductive film layer on the second substrate. Specifically, the second PAD and the conductive film layer on the second substrate can be an integral structure.

[0094] After the first substrate mother board 011 and the second substrate mother board 012 are aligned, the second substrate mother board 012 is cut along the cutting line of the second substrate mother board 012 to expose the first PAD, and the first substrate mother board 011 is cut along the cutting line of the first substrate mother board 011 to expose the second PAD, forming the intelligent window panel. The flexible printed circuit (FPC) is bonded to the first PAD, and an electrical signal is input to the conductive film layer 02 serving as an electrode through the first PAD; the flexible printed circuit is bonded to the second PAD, and an electrical signal is input to the conductive film layer 02 serving as an electrode through the second PAD. In this way, an electric field is generated between the conductive film layer 02 of the first substrate mother board 011 and the conductive film layer 02 of the second substrate mother board 012, driving the liquid crystals in the liquid crystal layer to deflect, thereby changing the transmittance of the intelligent window panel and adjusting the light passing through the intelligent window panel.

[0095] In some embodiments, the intelligent window panel includes a plurality of the first PADs and a plurality of the second PADs.

[0096] In the later stage of FPC (flexible printed circuit) bonding, selective bonding or full bonding can be performed on the plurality of first PADs and the plurality of second PADs. If FPC bonding is performed on the plurality of first PADs and the plurality of second PADs, the risk of failure of the intelligent window panel can also be reduced in case of FPC detachment in the subsequent process.

[0097] It should be noted that the various embodiments in this specification are described in a progressive manner. The same or similar parts among the various embodiments can be referred to each other, and the key points of each embodiment are the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0098] Unless otherwise defined, the technical terms or scientific terms used in this disclosure shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second" and similar words used in this disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. Words such as "comprising" or "including" mean that the elements or items appearing before the word cover the elements or items listed after the word and their equivalents, without excluding other elements or items. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Words such as "upper", "lower", "left" and "right" are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0099] It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element, or intervening elements may be present.

[0100] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner.

[0101] The above is only the specific embodiment of this disclosure, but the protection scope of this disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by this disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of this disclosure. Therefore, the protection scope of this disclosure shall be subject to the protection scope of the claims.

Claims

1. A smart window motherboard for cutting to obtain a smart window panel, comprising a rectangular central area and a peripheral area surrounding the central area, characterized in that, Comprising: A relatively arranged rectangular first substrate mother board, a rectangular second substrate mother board, and a liquid crystal layer located between the first substrate mother board and the second substrate mother board; On one side of the first substrate mother board facing the second substrate mother board, a planar first conductive film layer is provided. At least one first PAD is provided at each edge of the first substrate mother board. The first PADs are all electrically connected to the first conductive film layer, and the first PADs include a metal film layer; On one side of the second substrate mother board facing the first substrate mother board, a planar second conductive film layer is provided. At least one second PAD is provided at each edge of the second substrate mother board. The second PADs are all electrically connected to the second conductive film layer. The orthographic projection of the first PAD on the second substrate mother board does not overlap with the second PAD; In the 2m regions that can equally divide the middle region of the smart window mother board into 2×m rectangular middle partitions, at least one first PAD and at least one second PAD are provided in the peripheral region part corresponding to each middle partition of the smart window mother board; For one first PAD and one second PAD corresponding to the same smart window panel, they can cooperate and be electrically connected to an external driving circuit to provide a driving signal for the smart window panel; where m is an integer greater than or equal to 1; The cutting line of the first substrate mother board is a cutting line for cutting the first substrate mother board along it to expose the second PAD, and the cutting line of the second substrate mother board is a cutting line for cutting the second substrate mother board along it to expose the first PAD.

2. The intelligent window master plate according to claim 1, wherein m is equal to 2.

3. The smart window mother board according to claim 1, wherein At least one anti-false marking is further provided at each edge of the first substrate mother board. The anti-false marking is different in shape and / or size from the first PAD. The cutting line of the second substrate mother board further includes a cutting line for cutting the second substrate mother board along it to expose the anti-false marking.

4. The intelligent window master plate according to claim 3, characterized in that, The anti-false markings correspond to the first PADs one by one. Each anti-false marking is adjacent to the corresponding first PAD and spaced by a predetermined distance.

5. The smart window mother board according to claim 4, wherein A plurality of the first PADs and a plurality of the anti-false markings are provided at each edge of the first substrate mother board, and a plurality of the second PADs are provided at each edge of the second substrate mother board; The first orthographic projection of each first PAD on the second substrate mother board and the third orthographic projection of the corresponding anti-false marking on the second substrate mother board form a projection group. On each edge of the second substrate mother board, the projection groups and the second PADs are alternately arranged.

6. The intelligent window master plate according to claim 5, wherein, The minimum distance between the first orthographic projection and the adjacent second PAD is 4 - 102 mm.

7. The intelligent window motherboard according to claim 5, wherein The projection groups correspond to the second PADs one by one. Each projection group is adjacent to the corresponding second PAD and spaced by a predetermined distance. Each projection group and the corresponding second PAD form a PAD group. The distance between adjacent PAD groups is greater than 50 mm.

8. The intelligent window motherboard according to claim 7, wherein Four sets of the PAD groups are provided at each edge of the second substrate mother board.

9. The intelligent window mother board according to claim 1, wherein the minimum length of the first PAD in the first direction, which is the extending direction of the edge where it is located, is 40-60 mm, and the width in the second direction, which is perpendicular to the first direction, is 2.5-4.5 mm; and / or the minimum length of the second PAD in the first direction, which is the extending direction of the edge where it is located, is 40-60 mm, and the width in the second direction, which is perpendicular to the first direction, is 2.5-4.5 mm.

10. The intelligent window mother board according to any one of claims 1-9, wherein the first conductive film layer extends to the edge of the first substrate mother board to form the first PAD. At the first PAD, the thickness of the first conductive film layer is greater than a preset first threshold, and the step difference is not greater than a preset second threshold; and / or the second conductive film layer extends to the edge of the second substrate mother board to form the second PAD. At the second PAD, the thickness of the second conductive film layer is greater than a preset first threshold, and the step difference is not greater than a preset second threshold.

11. A smart window panel, characterized in that, Cut from the intelligent window mother board according to any one of claims 1-10, the intelligent window panel includes at least one of the first PADs and at least one of the second PADs.

12. The intelligent window panel according to claim 11, wherein The intelligent window panel includes a plurality of the first PADs and a plurality of the second PADs.

Images