A wafer product electroplating loading and unloading equipment

Abstract

The present invention discloses a wafer product electroplating loading and unloading equipment, including a workbench, a wafer box loading device, a wafer robot, a wafer calibrator, a flip manipulator, an installation and disassembly mechanism, an electroplating hanger and a wafer fixture; the wafer robot, the wafer calibrator, the flip manipulator and the installation and disassembly mechanism are all arranged on the workbench, and the electroplating hanger is arranged on the installation and disassembly mechanism; the wafer box loading device, the wafer calibrator and the flip manipulator are within the operating range of the wafer picking arm of the wafer robot; the installation and disassembly mechanism is within the operating range of the flip manipulator, and during the loading operation, the wafer product together with the wafer fixture is locked on the electroplating hanger, and during the unloading operation, the wafer product together with the wafer fixture is unlocked and removed from the electroplating hanger. The present invention can realize the automatic loading and unloading operation of the product, and the equipment operation and control are more flexible and efficient.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment in the semiconductor industry, and more specifically, to a wafer product electroplating loading and unloading equipment. Background Art

[0002] Wafer refers to the silicon chip made of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. A layer of conductive metal is electroplated on the wafer, and the conductive metal layer is processed to make a conductive circuit. In the automated process of the semiconductor industry, it is often necessary to flip the wafer up and down around its center. During the flipping process, there is a high concentricity requirement between the center of the wafer and the center of the rotation axis, and there are also high requirements for the accuracy of the flipping angle. For example, the electroplating process is one of the key processes for making these metal layers, and the existing wafer electroplating equipment, especially the vertical wafer electroplating equipment, usually uses manual operation for wafer electroplating loading and unloading operations, resulting in low wafer loading and unloading efficiency. At the same time, manual operation also affects the quality of wafer electroplating. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a wafer product electroplating loading and unloading device that can automatically load and unload the material trough on the electroplating hanger.

[0004] In order to achieve the above object, the solution of the present invention is:

[0005] A wafer product electroplating loading and unloading equipment, characterized in that it includes a workbench, a wafer box loading device, a wafer robot, a wafer calibrator, a flip manipulator, an installation and disassembly mechanism, an electroplating hanger and a wafer fixture; the wafer box loading device is arranged beside the workbench; the wafer robot, the wafer calibrator, the flip manipulator and the installation and disassembly mechanism are all arranged on the workbench, and the electroplating hanger is arranged on the installation and disassembly mechanism; the wafer box loading device, the wafer calibrator and the flip manipulator are within the operating range of the wafer picking arm of the wafer robot; and the installation and disassembly mechanism is within the operating range of the flip manipulator and can perform loading and unloading operations for the electroplating hanger, and the installation and disassembly mechanism locks the wafer product together with the wafer fixture on the electroplating hanger during the loading operation, and unlocks and removes the wafer product together with the wafer fixture from the electroplating hanger during the unloading operation.

[0006] Further, the electroplating rack includes a rack body, a fastening lock slot, a guide bar and an RFID; the fastening lock slot is arranged on the front and / or back of the rack body, and is distributed in a circular ring shape and can be locked with the wafer fixture, and the material trough is formed in the middle; the guide bar is arranged on the two sides of the rack body and can be inserted into the slot under the guidance of the guide roller, and the RFID is arranged on both sides of the top of the rack body;

[0007] The wafer fixture includes a fixture body, a fastening lock and a wafer vacant slot. The fixture body is a ring structure, and the inner circle forms the wafer vacant slot. The fastening lock is distributed on the fixture body and can be locked with the fastening lock slot when rotated at a certain angle.

[0008] Furthermore, the installation and disassembly mechanism includes a Y-axis hanger socket, an X-axis sliding assembly, a P-axis flip drive assembly, a flip support assembly, and a loading and unloading suction cup assembly;

[0009] The Y-axis hanger socket is arranged along the Y-axis, the electroplating hanger is inserted into the Y-axis hanger socket, and a material trough is provided on at least one side; the X-axis sliding component is fixed to the bottom of the Y-axis hanger socket along the X-axis; the P-axis flipping drive component is located on the material trough side of the electroplating hanger, and is driven by the X-axis sliding component to approach or move away from the electroplating hanger along the X-axis; the loading and unloading suction cup component is connected to the P-axis flipping drive component through the flipping support component, and the P-axis flipping drive component drives the flipping support component to flip along the P-axis and move along the X-axis, so as to drive the loading and unloading suction cup component to align with the material trough to complete the loading or unloading of wafer products; wherein, the X-axis is perpendicular to the Y-axis, and the P-axis is parallel to the Y-axis.

[0010] Furthermore, the Y-axis hanger socket includes a bottom frame, two side frames, a slot top cover and a water collection tray; the bottom frame is provided with a mounting hole; the two side frames are vertically arranged at the two ends of the bottom frame, and the inner side surfaces are provided with guide rollers; the two ends of the slot top cover are connected to the top of the side frame, and a slot is provided, and the size and shape of the slot are adapted to the size and shape of the electroplating hanger; the water collection tray is provided above the bottom frame;

[0011] The X-direction sliding assembly comprises an X-direction linear slide rail and an X-direction screw motor, the X-direction linear slide rail and the X-direction screw motor are both inserted into the mounting hole of the bottom frame, and the X-direction screw motor is connected to and drives the slide table to slide on the X-direction linear slide rail;

[0012] The P-axis flipping drive assembly further includes a slide, a fixed frame, a motor fixing plate, a screw motor, a floating plate and a guide column; the slide is connected to the X-axis linear slide rail and can slide along the X-axis driven by the X-axis screw motor; the fixed frame is fixed to the slide, and a P-axis flipping axis is provided on the top; the motor fixing plate is fixedly connected to the fixed frame, the screw motor is arranged on the bottom surface of the motor fixing plate from bottom to top, and the floating plate is provided with a screw matching hole, a guide column hole and a connecting rod pivot, and is connected to the screw of the screw motor through the screw matching hole.

[0013] Furthermore, the flip support assembly further includes a support frame, a flip drive connecting rod, a bearing pressure plate, a P-axis connecting piece, a rotating bearing, a W rotating axis, a linear motor and a pushing block; the support frame is used to support the bearing pressure plate; the bearing pressure plate is also connected to the P-direction flip axis through the P-axis connecting piece, and the two ends of the flip drive connecting rod are respectively connected to the connecting rod pivot and the support frame; the W rotating axis is connected to the bearing pressure plate through the rotating bearing, and is used to connect the loading and unloading suction cup assembly; the linear motor is arranged on the bearing pressure plate and connected to the pushing block; the pushing block is provided with a bearing push hole.

[0014] Furthermore, the loading and unloading suction cup assembly further includes a rotating plate, an airbag, a Bernoulli suction cup body, a jig suction cup, a material suction cup, a spring connector, an air pipe joint, a rotating support rod and a pushing bearing; the rotating plate is sleeved on the W rotating shaft, the Bernoulli suction cup body is pressed onto the rotating plate through the airbag, the jig suction cup and the material suction cup are arranged on the Bernoulli suction cup body, and the material suction cup is located on the inner ring of the jig suction cup and connected to the air pipe joint; a plurality of through holes are distributed in a circular shape on the jig suction cup, and a plurality of through holes are distributed on the material suction cup; the number of the spring connectors is plural, distributed on the lower surface of the material suction cup, and the bottom end is connected to the rotating plate; the upper end of the rotating support rod is connected to the edge of the Bernoulli suction cup body, and the lower end is connected to the bearing, and the pushing bearing is inserted into the bearing push hole.

[0015] Furthermore, the installation and disassembly mechanism further includes an R-axis rotation assembly, and the Y-axis hanger socket is arranged on the R-axis rotation assembly and can rotate 180 degrees around the R-axis, wherein the R-axis is perpendicular to the X-axis and the Y-axis respectively;

[0016] The electroplating rack has a material trough on both sides; the P-axis flip drive assembly includes a first P-axis flip drive assembly and a second P-axis flip drive assembly; the flip support assembly includes a first flip support assembly and a second flip support assembly; the loading and unloading suction cup assembly includes a first loading and unloading suction cup assembly and a second loading and unloading suction cup assembly;

[0017] The first P-axis flip drive assembly and the second P-axis flip drive assembly are symmetrically arranged on the front and back sides of the electroplating hanger respectively; the first loading and unloading suction cup assembly is arranged on the first P-axis flip drive assembly through the first flip support assembly, and the second loading and unloading suction cup assembly is arranged on the second P-axis flip drive assembly through the second flip support assembly, and the first P-axis flip drive assembly drives the first flip support assembly to flip along the P axis and slide along the X direction, which can drive the first loading and unloading suction cup assembly to align with the material trough to complete the loading or unloading of wafer products; the second P-axis flip drive assembly drives the second flip support assembly to flip along the P axis and slide along the X direction, which can drive the second loading and unloading suction cup assembly to align with the material trough to complete the loading or unloading of wafer products;

[0018] The R-axis rotation assembly further includes a rotating motor module and an R-axis rotating base, wherein the rotating motor module is connected to the R-axis rotating base and can drive the R-axis rotating base to rotate around the R-axis, and the R-axis rotating base is used to carry the Y-axis hanger socket, wherein the R-axis is perpendicular to the X-axis and the Y-axis respectively.

[0019] Furthermore, the flip robot includes a mounting seat, a Z-axis linear module, a lifting and fixing frame, a U-axis rotating module, a rotating frame, a V-axis rotating module, a rotating arm and a flip suction cup;

[0020] The Z-axis linear module is arranged on the mounting seat; the lifting and fixing frame is connected to the Z-axis linear module, and can be lifted and lowered along the Z-axis under the drive of the Z-axis linear module; the U-axis rotation module is arranged on the lifting and fixing frame; the rotating frame is connected to the U-axis rotation module, and can rotate at least 90 degrees around the U-axis under the drive of the U-axis rotation module; the V-axis rotation module is arranged on the rotating frame; the rotating arm is connected to the V-axis rotation module, and can flip 180 degrees around the V-axis periodically under the drive of the V-axis rotation module; the flip suction cup is connected to the rotating arm, and is used to adsorb wafer-type products; wherein, the Z-axis and the U-axis are parallel, and the V-axis is perpendicular to the Z-axis and the U-axis.

[0021] Furthermore, the flip suction cup includes a first flip suction cup and a second flip suction cup, and the first flip suction cup and the second flip suction cup are respectively connected to the front side and the back side of the rotating arm.

[0022] The Z-axis linear module further includes a linear motor, a slider and a Z-direction slide rail. The output shaft of the linear motor is connected to the slider and drives the slider to rise and fall along the Z-direction slide rail.

[0023] Furthermore, it also includes a transfer wafer box device, which is arranged on the workbench and is within the operating range of the wafer picking arm of the wafer robot. The transfer wafer box device is used to store electroplated wafers or electroplated wafers that have been detected as NG.

[0024] After adopting the above scheme, the automatic loading and unloading equipment of the present invention has the following beneficial effects: the loading and unloading equipment of the present invention replaces the original manual loading and unloading operation with automatic loading and unloading of the equipment, realizes automated operation, improves production efficiency, and replaces manual operation with the equipment, which can improve the electroplating quality of wafer products; wherein the mounting and disassembly mechanism comprises a Y-axis hanger socket, an X-axis sliding assembly, a P-axis flip drive assembly, a flip support assembly, and a loading and unloading suction cup assembly; the electroplating hanger is inserted into the Y-axis hanger socket; a P-axis flip drive assembly is arranged on the side, and the P-axis flip drive assembly is connected to the Y-axis hanger socket through the X-axis sliding assembly, and the X-axis flip drive assembly can be mounted on the Y-axis hanger socket. Driven by the sliding assembly, the loading and unloading suction cup assembly approaches or moves away from the electroplating hanger along the X direction; the loading and unloading suction cup assembly is connected to the P-axis flip drive assembly through the flip support assembly, so that when the P-axis flip drive assembly drives the flip support assembly to flip along the P axis and move along the X direction, it can drive the loading and unloading suction cup assembly to align with the material slot of the electroplating hanger to complete the loading or unloading of wafer products, thereby realizing automatic loading and unloading, and the equipment operation and control are more flexible. When equipped with an electroplating hanger with a double-sided slot, the P-axis flip drive assembly, flip support assembly and loading and unloading suction cup assembly of the installation and disassembly mechanism further include two each, which are respectively arranged on the double-sided slot side of the electroplating hanger, and can also realize the loading and unloading of double-sided stations of the electroplating hanger, with high efficiency. The flip robot can automatically realize the flipping and transportation of wafer products at two stations. After two suction cups are set, a single swing of the rotating arm can complete the material replacement operation of the wafer to be electroplated and the electroplated wafer at the same station, saving material replacement time and improving production efficiency. The loading and unloading suction cup assembly adopts the Bernoulli principle to suck the wafer fixture and wafer, and puts them onto the electroplating rack or separates them from the electroplating rack under the action of the airbag. The flip support assembly drives the Bernoulli suction cup assembly to rotate slightly around the rotating W axis, realizing the installation and removal of the wafer fixture and wafer from the electroplating rack, replacing the complex operation of manual loading and unloading of the original electroplating rack. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a front stereoscopic view of the automatic loading and unloading equipment of the present invention.

[0026] Figure 2 It is a rear perspective view of the automatic loading and unloading equipment of the present invention.

[0027] Figure 3 It is a top and side view of the automatic loading and unloading equipment of the present invention.

[0028] Figure 4 It is a three-dimensional diagram of the flipping robot of the present invention.

[0029] Figure 5 It is a side view of the flipping robot of the present invention.

[0030] Figure 6 It is a three-dimensional diagram of the installation and disassembly mechanism of the present invention.

[0031] Figure 7 It is a front view of the installation and disassembly mechanism of the present invention.

[0032] Figure 8 It is a side view of the installation and disassembly mechanism of the present invention.

[0033] Fig. 9 It is a stereoscopic diagram of the Y-axis hanger socket, the X-axis sliding assembly and the R-axis rotating assembly of the present invention.

[0034] Fig.10 It is a three-dimensional diagram of the electroplating rack of the present invention.

[0035] Fig.11 It is a three-dimensional diagram of the wafer fixture of the present invention.

[0036] Fig.12 It is a three-dimensional diagram of the assembly state of the P-axis flip drive assembly, the flip support assembly and the loading and unloading suction cup assembly of the present invention.

[0037] Fig.13 for Fig.12 Side view of.

[0038] Fig.14 for Fig.12 A side view of the vehicle body, in which the left P-axis flip drive assembly is in a flipped state.

[0039] Fig.15 It is a three-dimensional diagram of the P-axis flip drive assembly of the present invention.

[0040] Fig.16 It is a three-dimensional diagram of the flip support assembly of the present invention.

[0041] Fig.17 It is a stereoscopic view of the loading and unloading suction cup assembly of the present invention.

[0042] Fig.18 It is a schematic diagram of the exploded view of the loading and unloading suction cup assembly of the present invention. DETAILED DESCRIPTION

[0043] In order to further explain the technical solution of the present invention, the present invention is described in detail below through specific embodiments.

[0044] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “X”, “Y”, “Z”, etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0046] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0048] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0049] like Figures 1 to 18 As shown, a wafer product electroplating loading and unloading equipment 100 includes a workbench 1, a wafer box loading device 2, a wafer robot 3, a wafer aligner 4, a flipping manipulator 5, an installation and disassembly mechanism 6, an electroplating hanger 7 and a wafer fixture 8; the wafer box loading device 2 is arranged beside the workbench 1; the wafer robot 3, the wafer aligner 4, the flipping manipulator 5 and the installation and disassembly mechanism 6 are all arranged on the workbench, and the electroplating hanger 7 is arranged on the installation and disassembly mechanism 6; the wafer box loading device 2, the wafer aligner 4 and the flipping manipulator 5 are located in the wafer picking arm 31 of the wafer robot 3 and the mounting and disassembly mechanism 6 is within the operating range of the flip robot 5, and can perform loading and unloading operations for the electroplating hanger 7, and the mounting and disassembly mechanism 6 locks the wafer product together with the wafer fixture 8 on the electroplating hanger 7 during the loading operation, and unlocks and removes the wafer product together with the wafer fixture 8 from the electroplating hanger 7 during the unloading operation.

[0050] As a better or more specific implementation of this embodiment:

[0051] like Figures 1 to 3 As shown, the wafer box loading device 2 is provided with a wafer box carrier 21. The wafer robot 3 is provided with a wafer picking arm 31. The wafer aligner 4 is provided with a wafer alignment carrier 41.

[0052] The wafer box loading device (Loadport) 2, the wafer robot (robot) 3, and the wafer aligner (Aligner) 4 are all structures already available on the market.

[0053] Mainly as Figures 4 to 5As shown, the flip robot 5 includes a mounting seat 51, a Z-axis linear module 52, a lifting and fixing frame 53, a U-axis rotating module 54, a rotating frame 55, a V-axis rotating module 56, a rotating arm 57 and a flip suction cup 58; the Z-axis linear module 52 is arranged on the mounting seat 51; the lifting and fixing frame 53 is connected to the Z-axis linear module 52, and can be lifted and lowered along the Z-axis under the drive of the Z-axis linear module 52; the U-axis rotating module 54 is arranged on the lifting and fixing frame 53; the rotating frame 55 is connected to the U-axis rotating module 54, and can be rotated at least 90 degrees around the U-axis under the drive of the U-axis rotating module 54; the V-axis rotating module 56 is arranged on the rotating frame 55; the rotating arm 57 is connected to the V-axis rotating module 56, and can be flipped 180 degrees around the V-axis periodically under the drive of the V-axis rotating module 56; the flip suction cup 58 is connected to the rotating arm 57 for adsorbing wafer products. Thus, wafer products can be lifted, displaced and flipped during the manufacturing process. The Z axis is parallel to the U axis, and the V axis is perpendicular to the Z axis and the U axis. When the flipping robot of the present invention is used in conjunction with the wafer electroplating loading and unloading equipment, the Z axis and the U axis are both in the vertical direction.

[0054] In order to improve the working efficiency, the flip suction cup 58 includes a first flip suction cup 581 and a second flip suction cup 582, and the first flip suction cup 581 and the second flip suction cup 582 are respectively connected to the front and back sides of the rotating arm 57. The Z-axis linear module 52 further includes a linear motor 521, a slider 522 and a Z-direction slide rail 523. The output shaft of the linear motor 521 is connected to the slider 522, and drives the slider 522 to rise and fall along the Z-axis on the Z-direction slide rail 523.

[0055] The working principle of the flip robot 5 is: first, the Z-axis linear module 52 adjusts the lifting frame 53 to the starting height, and at the same time, the U-axis rotating module 54 adjusts the rotating frame 55 to the starting angle. At the first station, the flip suction cup 58 receives the wafer to be electroplated transferred from the wafer robot 3 with its front side facing upward, and generates negative pressure adsorption to complete the material removal; the Z-axis linear module 52 drives the lifting frame 53 to rise to a certain height, so that the wafer to be electroplated on the flip suction cup 58 is raised; the V-axis rotating module 56 drives the rotating arm 57 to rotate 180°, so that the flip suction cup 58 The front side faces downward; the U-axis rotating module 54 drives the rotating frame 53 to rotate, so that the rotating arm 57 swings to the target angle, so that the flip suction cup 58 brings the wafer to be electroplated to the top of the second station; the Z-axis linear module 52 drives the lifting and fixing frame 53 to descend to the target height, and the flip suction cup 58 drives the wafer to be electroplated to descend to the height of the second station, and releases the air pressure to lose adsorption, so that the wafer to be electroplated is transferred to the front surface groove 71 of the electroplating hanger 7 by the installation and disassembly mechanism 6; let the Z-axis linear module 52 and the U-axis rotating module 54 perform the above process in reverse, so that the rotating arm 57 is reset to the first station, and the next wafer to be electroplated is transferred to the installation and disassembly mechanism 6.

[0056] Mainly as Fig.10 As shown, the electroplating hanger 7 includes a hanger body 72, a fastening lock slot 73, a guide bar 74 and an RFID 75; the fastening lock slot 73 is arranged on the front and / or back of the hanger body 72, and is distributed in a circular ring shape and can be locked with the wafer fixture 8, and the material trough 71 is formed in the middle position; the guide bar 74 is arranged on both sides of the hanger body 72 and can be inserted into the slot 6132 under the guidance of the guide roller 615, and the RFID 75 is arranged on both sides of the top of the hanger body 72, and is used to record the identity information of the electroplating hanger 7.

[0057] Mainly as Fig.11 As shown, the wafer fixture 8 is used to carry wafer materials, including a fixture body 81, a fastening lock 82 and a wafer vacant slot 83. The fixture body 81 is an annular structure, and the inner circle forms the wafer vacant slot 83. The fastening lock 82 is distributed on the fixture body 81, and can be locked with the fastening lock slot 73 on the electroplating hanger 7 when rotated to a certain angle, thereby ensuring that the wafer material does not fall after loading, and then disengage from the fastening lock slot 73 on the electroplating hanger 7 when reversed to a certain angle, so that the material can be unloaded smoothly.

[0058] The installation and disassembly mechanism 6 includes a Y-axis hanger socket 61, an X-axis sliding assembly 63, a P-axis flip drive assembly 64, a flip support assembly 65, and a loading and unloading suction cup assembly 66;

[0059] Mainly as Figures 6 to 9As shown, the Y-axis hanger socket 61 is arranged along the Y-axis, the electroplating hanger 7 is inserted into the Y-axis hanger socket 61, and a material trough 71 is provided on at least one side; the X-axis sliding component 63 is fixed to the bottom of the Y-axis hanger socket 61 along the X-axis; the P-axis flipping drive component 64 is located on the material trough side of the electroplating hanger 7, and is driven by the X-axis sliding component 63 to approach or move away from the electroplating hanger 7 along the X-axis; the loading and unloading suction cup component 66 is connected to the P-axis flipping drive component 64 through the flipping support component 65, and the P-axis flipping drive component 64 drives the flipping support component 65 to flip along the P-axis and move along the X-axis, and can drive the loading and unloading suction cup component 66 to align with the material trough 71 to complete the loading or unloading of wafer products; wherein, the X-axis is perpendicular to the Y-axis, and the P-axis is parallel to the Y-axis.

[0060] Mainly as Fig. 9 As shown, the Y-axis hanger socket 61 includes a bottom frame 611, two side frames 612, a slot cover 613 and a water collection tray 614; the bottom frame 611 is provided with a mounting hole 6112; the two side frames 612 are vertically arranged at the two ends of the bottom frame 611, and the inner side surfaces are provided with guide rollers 615; the two ends of the slot cover 613 are connected to the top of the side frame 612, and a slot 6132 is provided, and the size and shape of the slot 6132 are adapted to the size and shape of the electroplating hanger 7, so that the electroplating hanger 7 can be smoothly inserted into the slot 6132, and when inserted, the guide rollers 615 on the two side frames 612 have the function of guiding and reducing friction; the water collection tray 614 is arranged above the bottom frame 611 to collect the liquid dripping from the electroplating hanger 7, and the water collection tray 614 can be connected to a drain pipe to lead out the collected liquid to prevent equipment damage.

[0061] The X-axis sliding assembly 63 includes an X-axis linear slide rail 631 and an X-axis screw motor 632. The X-axis linear slide rail 631 and the X-axis screw motor 632 are both inserted into the mounting hole of the bottom frame 611, and the screw 6322 of the X-axis screw motor 632 is connected to and drives the slide 641 to slide on the X-axis linear slide rail 631.

[0062] Mainly as Figures 12 to 15As shown, the P-axis flip drive assembly 64 further includes a slide 641, a fixed frame 642, a motor fixed plate 643, a screw motor 644, a floating plate 645 and a guide column 646; the slide 641 is connected to the X-axis linear slide rail 631, and can slide along the X-axis driven by the X-axis screw motor 632; the fixed frame 642 is fixed on the slide 641, and a P-axis flip shaft 6422 is provided on the top; the motor fixed plate 643 is fixedly connected to the fixed frame 642, and the screw motor 644 is arranged on the bottom surface of the motor fixed plate 643 from bottom to top, and the floating plate 645 is provided with a screw matching hole 6451, a guide column hole 6452 and a connecting rod pivot 6453, and is matched and connected with the screw 6441 of the screw motor 644 through the screw matching hole 6451.

[0063] Mainly as Fig.16 As shown, the flip support assembly 65 further includes a support frame 651, a flip drive connecting rod 652, a bearing pressure plate 653, a P-axis connecting piece 654, a rotating bearing 655, a W rotating shaft 656, a linear motor 657 and a pushing block 658; the support frame 651 is used to support the bearing pressure plate 653; the bearing pressure plate 653 is also connected to the P-direction flip shaft 6422 through the P-axis connecting piece 654, and the two ends of the flip drive connecting rod 652 are respectively connected to the connecting rod pivot 6453 and the support frame 651; the W rotating shaft 656 is connected to the bearing pressure plate 653 through the rotating bearing 655, and is used to connect the loading and unloading suction cup assembly 66; the linear motor 657 is arranged on the bearing pressure plate 653 and connected to the pushing block 658; the pushing block 658 is provided with a bearing push hole 6582.

[0064] Mainly as Figure 17 to Figure 18As shown, the loading and unloading suction cup assembly 66 further includes a rotating plate 661, an air bag 662, a Bernoulli suction cup body 663, a fixture suction cup 664, a material suction cup 665, a spring connector 666, an air pipe joint 667, a rotating support rod 668 and a push bearing 669; the rotating plate 661 is sleeved on the W rotating shaft 656, the Bernoulli suction cup body 663 is pressed on the rotating plate 661 through the air bag 662, the fixture suction cup 664 and the material suction cup 665 are arranged on the Bernoulli suction cup body 663, and the material suction cup 665 Located in the inner circle of the jig suction cup 664 and connected to the air pipe joint 667; a plurality of through holes are distributed in a circular shape on the jig suction cup 664, and a plurality of through holes are distributed on the material suction cup 665; the number of the spring connectors 666 is multiple, distributed on the lower surface of the material suction cup 665, and the bottom end is connected to the rotating plate 661; the upper end of the rotating support rod 668 is connected to the edge of the Bernoulli suction cup body 663, and the lower end is connected to the push bearing 669, and the push bearing 669 is inserted in the bearing push hole 6582. According to the Bernoulli principle, when the loading and unloading suction cup assembly 66 is connected to compressed air at the air pipe joint 667, the through holes of the Bernoulli suction cup (including the fixture suction cup 664 and the material suction cup 665) will generate a uniform, thin and strong airflow on the working surface. At this time, the gas flow rate between the workpiece (including the wafer fixture 8 and the wafer material) placed on the Bernoulli suction cup and the Bernoulli suction cup is greater than the gas flow rate on the top of the workpiece. Utilizing the principle that the faster the speed of Bernoulli fluid, the lower the pressure, a pressure difference will be generated between the upper and lower sides of the workpiece, so that the workpiece is adsorbed on the top of the Bernoulli suction cup. The loading and unloading suction cup assembly 66 adopts the Bernoulli principle to suck the wafer fixture 8 and the wafer material, and under the action of the airbag 662, it is placed on the electroplating hanger 7 or separated from the electroplating hanger 7. The flip support assembly 65 drives the loading and unloading suction cup assembly 66 to rotate around the W rotation axis 656 by a certain small angle, thereby realizing the installation and removal of the wafer fixture 8 and the wafer material from the electroplating hanger 7, replacing the complex operation of manual loading and unloading of the original electroplating hanger 7.

[0065] Combination Figures 1 to 18 As shown, the front and back sides of the electroplating rack 7 each have a material trough 71; the P-axis flip drive assembly 64 includes a first P-axis flip drive assembly and a second P-axis flip drive assembly; the flip support assembly 65 includes a first flip support assembly and a second flip support assembly; the loading and unloading suction cup assembly 66 includes a first loading and unloading suction cup assembly and a second loading and unloading suction cup assembly;

[0066] The first P-axis flip drive assembly and the second P-axis flip drive assembly are symmetrically arranged on the front and back sides of the electroplating hanger 7 respectively; the first loading and unloading suction cup assembly is arranged on the first P-axis flip drive assembly through the first flip support assembly, and the second loading and unloading suction cup assembly is arranged on the second P-axis flip drive assembly through the second flip support assembly, and the first P-axis flip drive assembly drives the first flip support assembly to flip along the P axis and slide along the X direction, which can drive the first loading and unloading suction cup assembly to align with the material trough to complete the loading or unloading of wafer products; the second P-axis flip drive assembly drives the second flip support assembly to flip along the P axis and slide along the X direction, which can drive the second loading and unloading suction cup assembly to align with the material trough to complete the loading or unloading of wafer products.

[0067] The mounting and disassembly mechanism also includes an R-axis rotation component 68, and the Y-axis hanger socket 61 is arranged on the R-axis rotation component 68 and can rotate 180 degrees around the R-axis, wherein the R-axis is perpendicular to the X-axis and the Y-axis respectively; the Y-axis hanger socket 61 is arranged on the R-axis rotation component 68 and can rotate 180 degrees around the R-axis, which can be 180 degrees in both directions, or intermittently 180 degrees in the same direction. The R-axis rotation component 68 further includes a rotating motor module 681 and an R-axis rotating base 682, and the rotating motor module 681 is connected to the R-axis rotating base 682, and can drive the R-axis rotating base 682 to rotate around the R-axis, and the R-axis rotating base 682 is used to carry the Y-axis hanger socket 61, wherein the R-axis is perpendicular to the X-axis and the Y-axis respectively.

[0068] Mainly as Figures 1 to 3 As shown, further, it also includes a transfer wafer box device 9, which is arranged on the workbench 1 and is within the operating range of the wafer picking arm of the wafer robot. The transfer wafer box device 9 is used to store electroplated wafers or electroplated wafers that have been detected as NG.

[0069] Combination Figures 1 to 18 As shown, taking the loading and unloading of wafer electroplating as an example, the working principle and process of the present invention are as follows:

[0070] (For the convenience of description, the assembly state of the first P-axis flip drive assembly, the first flip support assembly, and the first loading and unloading suction cup assembly is recorded as unit A, and the assembly state of the second flip support assembly, the second flip support assembly, and the second loading and unloading suction cup assembly is recorded as unit B. The structures of unit A and unit B are exactly the same, so the components in unit A and unit B are still described with the same reference numerals.)

[0071] First, the process of loading material from the A unit to the front surface slot 71 of the electroplating rack 7 is described:

[0072] 1. The wafer picking arm 31 of the wafer robot 3 takes out a wafer 200 from the wafer box of the wafer box carrier 21 of the wafer box loading device 2 and moves it to the wafer calibration carrier 41 of the wafer aligner 4;

[0073] 2. The wafer aligner 4 performs positioning and edge finding on the wafer 200;

[0074] 3. The wafer picking arm 31 of the wafer robot 3 moves the wafer on the wafer calibration stage 41 to the first flip suction cup 581 of the flip robot 5;

[0075] 4. When the Z-axis linear module 52 of the flip robot 5 drives the wafer 200 on the first flip suction cup 581 to rise, the V-axis rotation module 56 drives the wafer 200 on the first suction cup 581 to rotate 180°, and the U-axis rotation module 54 drives the wafer 200 on the first suction cup 581 to rotate above the loading and unloading suction cup assembly 66 of the A unit of the installation and disassembly mechanism 6, the Z-axis linear module 52 drives the wafer 200 on the first suction cup 581 to descend, and the wafer 200 is placed on the material suction cup 665 of the loading and unloading suction cup assembly 66 of the A unit, and the outer ring of the wafer 200 is placed on the wafer fixture 8, and the flip robot 5 is reset;

[0076] 5. The fixture suction cup 664 of the loading and unloading suction cup assembly 66 sucks the wafer fixture 8, and the material suction cup 665 sucks the wafer;

[0077] 6. The screw motor 644 of the P-axis flip drive assembly 64 drives the floating plate 645 to rise, driving the flip drive connecting rod 652 to push up, so that the flip support assembly 65 and the loading and unloading suction cup assembly 66 thereon flip 90 degrees around the P-axis flip axis 6422 toward the electroplating hanger 7, as shown in FIG. Figure 8 As shown;

[0078] 7. The X-axis screw motor 632 of the X-axis sliding assembly 63 drives the P-axis flip driving assembly 64 to move along the X-axis linear guide rail 631 to a preset position close to the front of the electroplating rack 7;

[0079] 8. The airbag 662 of the loading and unloading suction cup assembly 66 inflates to push the wafer fixture 8 onto the electroplating hanger 7, and the fastening locks 82 of the wafer fixture 8 are inserted into the fastening lock slots 73 of the corresponding electroplating hanger 7 one by one;

[0080] 9. The linear motor 657 of the flip support assembly 65 drives the push block 658 to drive the push bearing 669 and the rotating support rod 668 of the loading and unloading suction cup assembly 66 to move, so that the loading and unloading suction cup assembly 66 rotates a certain distance around the W rotation axis 656, and the wafer fixture 8 is buckled on the electroplating hanger 7, and the wafer 200 is placed on the electroplating hanger 7;

[0081] 10. The loading and unloading suction cup assembly 66 stops working, the airbag 662 stops taking in air, and under the rebound effect of the spring connector 666, the fixture suction cup 664 is separated from the wafer fixture 8, the material suction cup 665 is separated from the wafer 200, and the flip support assembly 65 drives the loading and unloading suction cup assembly 66 to rotate around the W rotation axis 656 to reset;

[0082] 11. The rotating motor module 681 of the R-axis rotating assembly 68 drives the R-axis rotating base 682 to rotate 180° around the R-axis.

[0083] At this time, the positions of unit A and unit B are swapped, and the flip robot 5 transfers materials to unit B. After unit B receives the materials transferred by the flip robot 5, it feeds the materials to the back trough 71 of the electroplating rack 7. The specific process is the same as the process of unit A feeding the front trough 71 of the electroplating rack 7, and will not be repeated. After the back trough 71 of the electroplating rack 7 is loaded, the rotating motor module 681 of the R-axis rotating assembly 68 drives the R-axis rotating base 682 to rotate 180° around the R-axis to return the electroplating rack 7 to its original position. (Note: The two sides of the electroplating rack are not exactly the same, one side has RFID and the other side does not.)

[0084] When both surface grooves 71 of the electroplating rack 7 are loaded with materials, the overhead crane of the electroplating equipment clamps the electroplating rack 7 away; the unloading process is described below:

[0085] 1. The overhead crane of the electroplating equipment inserts the electroplating hanger 7 with the electroplated wafer into the Y-axis hanger socket 61;

[0086] 2. First, the A unit unloads the material from the front surface slot 71 of the electroplating hanger 7, the unloading and loading suction cup assembly 66 is started, the air bag 662 is inflated, the fixture suction cup 664 and the material suction cup 665 are moved at the same time, the fixture suction cup 664 sucks the wafer fixture 8, and the material suction cup 665 sucks the wafer 200;

[0087] 3. The linear motor 657 of the flip support assembly 65 drives the push block 658 to drive the push bearing 669 and the rotating support rod 668 of the loading and unloading suction cup assembly 66 to move, so that the loading and unloading suction cup assembly 66 rotates a certain distance around the W rotation axis 656, and the wafer fixture 8 is separated from the electroplating hanger 7;

[0088] 4. The airbag 662 of the loading and unloading suction cup assembly 66 stops taking in air. Under the rebound effect of the spring connector 666, the fixture suction cup 664 sucks the wafer fixture 8, and the material suction cup 665 sucks the wafer and separates it from the electroplating hanger 7. The flip support assembly 65 drives the loading and unloading suction cup assembly 66 to rotate around the rotation axis W to reset.

[0089] 5. The X-axis screw motor 632 of the R-axis rotating assembly 68 drives the P-axis flip driving assembly 64 to return to the initial position along the X-axis linear guide rail 631;

[0090] 6. The screw motor 644 of the P-axis flip drive assembly 64 drives the floating plate 645 to descend, driving the flip drive connecting rod 652 to pull back, so that the loading and unloading suction cup assembly 66 flips 90 degrees around the P-axis flip axis 6422 and returns to its original position;

[0091] To improve work efficiency, during the unloading period of unit A or unit B, steps 1 to 3 are repeated so that the transfer of the wafer 200 between every two adjacent workstations can be carried out continuously.

[0092] 7. The Z-axis linear module 52 of the flip robot 5 drives the rotating arm 57 to rise, and the U-axis rotating module 54 drives the rotating arm 57 to rotate to above the loading and unloading suction cup assembly 66 of the A unit, and the Z-axis linear module 52 drives the rotating arm 57 to descend, and the second flip suction cup 582 sucks the plated wafer on the loading and unloading suction cup assembly 66, and the Z-axis linear module 52 drives the rotating arm 57 to rise, and the U-axis rotating module 54 drives the rotating arm 57 to rotate back to its original position, and the V-axis rotating module 56 drives the rotating arm 57 to rotate 180°, and the wafer to be plated and the plated wafer are flipped and exchanged, and the U-axis rotating module 54 drives the rotating arm 57 to rotate back to above the loading and unloading suction cup assembly 66, and the Z-axis linear module 52 drives the rotating arm 57 to descend, and the wafer to be plated on the first flip suction cup 581 is placed on the material suction cup 665, and the outer ring of the wafer to be plated is placed on the upper wafer fixture 8;

[0093] 8. When the wafer fixture 8 and the wafer are placed on the electroplating hanger 7 by the A unit, the flipping manipulator 5 is reset, and the wafer picking arm 31 of the wafer robot 3 moves the electroplated wafer on the second flipping suction cup 582 of the flipping manipulator 5 into the wafer box of the wafer box loading device 2;

[0094] 9. The rotary motor module 681 of the R-axis rotating assembly 68 drives the R-axis rotary base 682 to rotate 180° around the R-axis, so that the positions of the A unit and the B unit are swapped, and the B unit unloads the material from the back station of the electroplating rack 7. The unloading process refers to the unloading process of the A unit. Since the unloading processes of the two are the same, they will not be repeated here;

[0095] 10. The wafer picking arm 31 of the wafer robot 3 moves the plated wafer from the second flip suction cup 582 of the flip robot 5 into the wafer box of the wafer box loading device 2;

[0096] At this point, one cycle of material replacement is completed, and the above steps are repeated until the wafers to be electroplated in the wafer box of the wafer box loading device 2 are processed.

[0097] In addition, the present invention may also include a transfer wafer box device 9. When the wafer robot 3 performs the wafer receiving action, the plated wafer can be transported to the wafer box of the wafer box loading device 2 or the wafer box of the transfer wafer box device 9 through the wafer picking arm 31, which can be selected according to actual needs; in particular, when the wafer vertical electroplating equipment matched with the present invention has the function of detecting plated wafers, when the wafer robot 3 performs the wafer receiving action, the wafer picking arm 31 can transport the plated wafers that have been detected OK to the wafer box of the wafer box loading device 2, and transport the plated wafers that have been detected NG to the wafer box of the transfer wafer box device 9.

[0098] After adopting the above scheme, the automatic loading and unloading equipment of the present invention has the following beneficial effects:

[0099] The loading and unloading equipment of the present invention replaces the original manual loading and unloading operation with automatic loading and unloading of the equipment, realizes automated operation, improves production efficiency, and replaces manual operation to improve the electroplating quality of wafer products; wherein the mounting and disassembly mechanism comprises a Y-axis hanger socket, an X-axis sliding assembly, a P-axis flip drive assembly, a flip support assembly, and a loading and unloading suction cup assembly; the electroplating hanger is inserted into the Y-axis hanger socket; a P-axis flip drive assembly is arranged on the side, and the P-axis flip drive assembly is connected to the Y-axis hanger socket through the X-axis sliding assembly, so that the P-axis flip drive assembly can be driven by the X-axis sliding assembly to move closer to or away from the electroplating hanger along the X direction; the loading and unloading The material suction cup assembly is connected to the P-axis flip drive assembly through the flip support assembly, so that when the P-axis flip drive assembly drives the flip support assembly to flip along the P-axis and move along the X-direction, it can drive the loading and unloading suction cup assembly to align with the material slot of the electroplating rack to complete the loading or unloading of wafer products, thereby realizing automatic loading and unloading, and the equipment operation and control are more flexible. When equipped with an electroplating rack with a double-sided slot, the P-axis flip drive assembly, flip support assembly and loading and unloading suction cup assembly of the installation and disassembly mechanism further include two each, which are respectively arranged on the double-sided slot side of the electroplating rack, and can also realize the loading and unloading of double-sided stations of the electroplating rack, with high efficiency. The flip robot can automatically realize the flipping and transportation of wafer products at two stations. After two suction cups are set, a single swing of the rotating arm can complete the material replacement operation of the wafer to be electroplated and the electroplated wafer at the same station, saving material replacement time and improving production efficiency. The loading and unloading suction cup assembly adopts the Bernoulli principle to suck the wafer fixture and wafer, and puts them onto the electroplating rack or separates them from the electroplating rack under the action of the airbag. The flip support assembly drives the Bernoulli suction cup assembly to rotate slightly around the rotating W axis, realizing the installation and removal of the wafer fixture and wafer from the electroplating rack, replacing the complex operation of manual loading and unloading of the original electroplating rack.

[0100] The above embodiments and drawings do not limit the product form and style of the present invention. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present invention.

Claims

1. A wafer product electroplating loading and unloading equipment, characterized by: It includes a workbench, a wafer box loading device, a wafer robot, a wafer calibrator, a flip manipulator, an installation and disassembly mechanism, an electroplating hanger and a wafer fixture; the wafer box loading device is arranged beside the workbench; the wafer robot, the wafer calibrator, the flip manipulator and the installation and disassembly mechanism are all arranged on the workbench, and the electroplating hanger is arranged on the installation and disassembly mechanism; the wafer robot is provided with a wafer picking arm, the wafer calibrator is provided with a wafer calibration carrier, the wafer box loading device, the wafer calibrator and the flip manipulator are within the operating range of the wafer picking arm of the wafer robot; and the installation and disassembly mechanism is within the operating range of the flip manipulator, and can perform loading and unloading operations for the electroplating hanger, and the installation and disassembly mechanism is used to lock the wafer product together with the wafer fixture on the electroplating hanger during the loading operation, and to unlock and remove the wafer product together with the wafer fixture from the electroplating hanger during the unloading operation; The electroplating rack comprises a rack body, a material trough, a fastening lock slot, a guide bar and an RFID; the fastening lock slot is arranged on the front and / or back of the rack body, and is distributed in a circular ring shape and can be locked with the wafer fixture, and the material trough is formed in the middle; the guide bar is arranged on both sides of the rack body and can be inserted into the slot under the guidance of the guide roller, and the RFID is arranged on both sides of the top of the rack body; The wafer fixture comprises a fixture body, a fastening lock and a wafer vacant slot. The fixture body is an annular structure, and the inner ring forms the wafer vacant slot. The fastening lock is distributed on the fixture body and can be locked with the fastening lock slot when rotated at a certain angle. The installation and disassembly mechanism includes a Y-axis hanger socket, an X-axis sliding assembly, a P-axis flip drive assembly, a flip support assembly, and a loading and unloading suction cup assembly; The Y-axis hanger socket is arranged along the Y-axis, and the electroplating hanger is inserted into the Y-axis hanger socket; the X-axis sliding component is fixed to the bottom of the Y-axis hanger socket along the X-axis; the P-axis flip driving component is located on the material trough side of the electroplating hanger, and is driven by the X-axis sliding component to approach or move away from the electroplating hanger along the X-axis; the loading and unloading suction cup component is connected to the P-axis flip driving component through the flip support component, and the P-axis flip driving component drives the flip support component to flip along the P-axis and move along the X-axis, so as to drive the loading and unloading suction cup component to align with the material trough to complete the loading or unloading of wafer products; wherein, the X-axis is perpendicular to the Y-axis, and the P-axis is parallel to the Y-axis; The flip robot comprises a mounting seat, a Z-axis linear module, a lifting and fixing frame, a U-axis rotating module, a rotating frame, a V-axis rotating module, a rotating arm and a flip suction cup; The Z-axis linear module is arranged on the mounting seat; the lifting and fixing frame is connected to the Z-axis linear module, and can be lifted and lowered along the Z-axis under the drive of the Z-axis linear module; the U-axis rotation module is arranged on the lifting and fixing frame; the rotating frame is connected to the U-axis rotation module, and can rotate at least 90 degrees around the U-axis under the drive of the U-axis rotation module; the V-axis rotation module is arranged on the rotating frame; the rotating arm is connected to the V-axis rotation module, and can flip 180 degrees around the V-axis periodically under the drive of the V-axis rotation module; the flip suction cup is connected to the rotating arm, and is used to adsorb wafer-type products; wherein, the Z-axis and the U-axis are parallel, and the V-axis is perpendicular to the Z-axis and the U-axis.

2. The wafer product electroplating loading and unloading equipment according to claim 1, characterized in that: The Y-axis hanger socket includes a bottom frame, two side frames, a slot cover and a water collection tray; the bottom frame is provided with a mounting hole; the two side frames are vertically arranged at the two ends of the bottom frame, and the inner side surfaces are provided with guide rollers; the two ends of the slot cover are connected to the top of the side frame, and a slot is provided, and the size and shape of the slot are adapted to the size and shape of the electroplating hanger; the water collection tray is provided above the bottom frame; The X-direction sliding assembly comprises an X-direction linear slide rail and an X-direction screw motor, the X-direction linear slide rail and the X-direction screw motor are both inserted into the mounting hole of the bottom frame, and the X-direction screw motor is connected to and drives the slide table of the P-axis flipping drive assembly to slide on the X-direction linear slide rail; The P-axis flipping drive assembly further includes a slide, a fixed frame, a motor fixing plate, a screw motor, a floating plate and a guide column; the slide is connected to the X-axis linear slide rail and can slide along the X-axis driven by the X-axis screw motor; the fixed frame is fixed to the slide, and a P-axis flipping axis is provided on the top; the motor fixing plate is fixedly connected to the fixed frame, the screw motor is arranged on the bottom surface of the motor fixing plate from bottom to top, and the floating plate is provided with a screw matching hole, a guide column hole and a connecting rod pivot, and is connected to the screw of the screw motor through the screw matching hole.

3. The wafer electroplating loading and unloading equipment according to claim 2, characterized in that: The flip support assembly further includes a support frame, a flip drive connecting rod, a bearing pressure plate, a P-axis connecting piece, a rotating bearing, a W rotating shaft, a linear motor and a pushing block; the support frame is used to support the bearing pressure plate; the bearing pressure plate is also connected to the P-direction flip shaft through the P-axis connecting piece, and the two ends of the flip drive connecting rod are respectively connected to the connecting rod pivot and the support frame; the W rotating shaft is connected to the bearing pressure plate through the rotating bearing, and is used to connect the loading and unloading suction cup assembly; the linear motor is arranged on the bearing pressure plate and connected to the pushing block; the pushing block is provided with a bearing push hole.

4. The wafer electroplating loading and unloading equipment according to claim 3, characterized in that: The loading and unloading suction cup assembly further includes a rotating plate, an airbag, a Bernoulli suction cup body, a jig suction cup, a material suction cup, a spring connector, an air pipe joint, a rotating support rod and a pushing bearing; the rotating plate is sleeved on the W rotating shaft, the Bernoulli suction cup body is pressed onto the rotating plate through the airbag, the jig suction cup and the material suction cup are arranged on the Bernoulli suction cup body, and the material suction cup is located at the inner ring of the jig suction cup and connected to the air pipe joint; a plurality of through holes are distributed in a circular shape on the jig suction cup, and a plurality of through holes are distributed on the material suction cup; the number of the spring connectors is plural, distributed on the lower surface of the material suction cup, and the bottom end is connected to the rotating plate; the upper end of the rotating support rod is connected to the edge of the Bernoulli suction cup body, and the lower end is connected to the bearing, and the pushing bearing is inserted into the bearing push hole.

5. The wafer product electroplating loading and unloading equipment according to any one of claims 1 to 4, characterized in that: The installation and disassembly mechanism also includes an R-axis rotation assembly, and the Y-axis hanger socket is arranged on the R-axis rotation assembly and can rotate 180 degrees around the R-axis, wherein the R-axis is perpendicular to the X-axis and the Y-axis respectively; The electroplating rack has a material trough on both sides; the P-axis flip drive assembly includes a first P-axis flip drive assembly and a second P-axis flip drive assembly; the flip support assembly includes a first flip support assembly and a second flip support assembly; the loading and unloading suction cup assembly includes a first loading and unloading suction cup assembly and a second loading and unloading suction cup assembly; The first P-axis flip drive assembly and the second P-axis flip drive assembly are symmetrically arranged on the front and back sides of the electroplating hanger respectively; the first loading and unloading suction cup assembly is arranged on the first P-axis flip drive assembly through the first flip support assembly, and the second loading and unloading suction cup assembly is arranged on the second P-axis flip drive assembly through the second flip support assembly, and the first P-axis flip drive assembly drives the first flip support assembly to flip along the P axis and slide along the X direction, which can drive the first loading and unloading suction cup assembly to align with the material trough to complete the loading or unloading of wafer products; the second P-axis flip drive assembly drives the second flip support assembly to flip along the P axis and slide along the X direction, which can drive the second loading and unloading suction cup assembly to align with the material trough to complete the loading or unloading of wafer products; The R-axis rotation assembly further includes a rotating motor module and an R-axis rotating base, wherein the rotating motor module is connected to the R-axis rotating base and can drive the R-axis rotating base to rotate around the R-axis, and the R-axis rotating base is used to carry the Y-axis hanger socket, wherein the R-axis is perpendicular to the X-axis and the Y-axis respectively.

6. The wafer product electroplating loading and unloading equipment according to claim 5, characterized in that: The flip suction cup comprises a first flip suction cup and a second flip suction cup, wherein the first flip suction cup and the second flip suction cup are respectively connected to the front side and the back side of the rotating arm; The Z-axis linear module further includes a linear motor, a slider and a Z-direction slide rail. The output shaft of the linear motor is connected to the slider and drives the slider to rise and fall along the Z-direction slide rail.

7. The wafer electroplating loading and unloading equipment according to any one of claims 1 to 4, characterized in that: It also includes a transfer wafer box device, which is arranged on the workbench and is within the operating range of the wafer picking arm of the wafer robot.

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