Pattern forming device, pattern forming method and ejection data generating method

Abstract

The present invention provides a pattern forming device, a pattern forming method, and a spray data generating method for forming a solder resist film of appropriate thickness on a wiring substrate. The pattern forming device comprises: a holding portion for holding a wiring substrate; a head for spraying ink droplets of solder resist onto the surface of the wiring substrate in an inkjet manner; a moving mechanism for moving the head relative to the holding portion in a direction parallel to the surface of the wiring substrate; and a spray data generating portion for generating spray data representing the spray amount of ink per unit area based on solder resist pattern data representing the pattern of the solder resist film. In addition, the pattern forming device comprises a control portion for forming a pattern of the solder resist film on the wiring substrate by controlling the head and the moving mechanism based on the spray data. The spray data generating portion generates the spray data with different spray amounts set for each of the different types of patterns included in the solder resist pattern data.

Description

Technical Field

[0001] The present invention relates to a technique for forming a pattern of a solder resist film on a wiring substrate. Background Art

[0002] In order to protect the conductive pattern on the wiring substrate, a solder resist is sometimes formed on the wiring substrate. The solder resist has the function of preventing solder from adhering to areas such as conductor wiring during solder coating in the subsequent process, and is also called "solder resist". As a method for forming a solder resist, a method of spraying droplets of solder resist ink onto the wiring substrate in an inkjet manner is known. Such a technology is disclosed in, for example, Patent Documents 1 and 2.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 9-283893

[0004] Patent Document 2: Japanese Patent Application Publication No. 2008-4820

[0005] However, the pattern of the solder mask formed on the wiring substrate varies depending on its purpose or location. When a certain amount of ink is applied to each unit area of ​​the wiring substrate, the thickness of the solder mask (film thickness) may not be able to form the target film thickness due to the type of pattern. For example, in the case of a fine line pattern, the thinner the line width, the lower the height. In addition, in a cross-shaped pattern where the lines intersect, there is a trend that the film thickness increases due to the bulging of the solder mask. Therefore, a technology for forming a solder mask with an appropriate film thickness is required. Summary of the invention

[0006] An object of the present invention is to provide a technology for forming a solder resist film having an appropriate thickness on a wiring board.

[0007] In order to solve the above-mentioned problems, a first method is a pattern forming device for forming a pattern of a solder resist film on a wiring substrate. The pattern forming device comprises: a holding portion for holding a wiring substrate; a head for ejecting ink droplets of a solder resist onto the surface of the wiring substrate in an inkjet manner; a moving mechanism for moving the head relative to the holding portion in a direction parallel to the surface of the wiring substrate; a jetting data generating portion for generating jetting data representing the jetting amount of ink per unit area based on solder resist pattern data representing the pattern of the solder resist film; and a control portion for forming a pattern of the solder resist film on the wiring substrate by controlling the head and the moving mechanism based on the jetting data. The jetting data generating portion generates the jetting data with different jetting amounts set for each of the different types of patterns included in the solder resist pattern data.

[0008] The second aspect is a pattern forming device of the first aspect. The pattern of the solder resist film includes: a first linear pattern of a first line width; and a second linear pattern of a second line width smaller than the first line width. The ejection data generating unit generates ejection data in which an ejection amount relative to the second pattern is set to a value greater than an ejection amount relative to the first pattern.

[0009] A third aspect is the pattern forming device of the first aspect or the second aspect. The pattern of the solder resist film includes a third cross-shaped pattern. The ejection data generating unit generates ejection data in which an ejection amount with respect to the third pattern is set to a value smaller than a predetermined reference ejection amount.

[0010] A fourth aspect is the pattern forming device of the second aspect. The pattern of the solder resist film includes a third cross pattern. The ejection data generating unit generates ejection data in which an ejection amount for the third pattern is set to a value smaller than an ejection amount for the first pattern and the second pattern.

[0011] The fifth aspect is a pattern forming device of any one of the first aspect to the fourth aspect. The pattern forming device further includes a storage unit, the storage unit storing correction table information that specifies the ejection amount per unit area for a plurality of types of patterns. The ejection data generating unit includes: a pattern determining unit that determines the pattern registered in the correction table information in the solder resist pattern data; and an ejection amount setting unit that sets the ejection amount relative to the pattern determined by the pattern determining unit based on the correction table information.

[0012] The sixth method is a pattern forming method for forming a pattern of a solder resist film on a wiring substrate. The pattern forming method includes: step (a), ejecting ink droplets of a solder resist from a head onto the surface of the wiring substrate in an inkjet manner; step (b), in step (a), moving the head relative to the wiring substrate in a direction parallel to the surface of the wiring substrate; and step (c), in step (a), making the ejection amount of ink per unit area different according to the type of pattern of the solder resist film formed on the wiring substrate.

[0013] The seventh method is a method for generating ejection data for use when ejecting droplets of solder resist ink from a head to a wiring substrate in an inkjet manner. The ejection data generating method includes: a step (A) of preparing solder resist pattern data to be formed on a wiring substrate; and a step (B) of generating ejection data having different ejection amounts per unit area set for each of different types of patterns included in the solder resist pattern data.

[0014] According to the pattern forming apparatus of the first to fifth aspects, the ejection amount of ink per unit area is increased or decreased according to the type of pattern, thereby being able to form a solder resist film of appropriate thickness on the wiring substrate for each type of pattern.

[0015] According to the pattern forming apparatus of the second aspect, by making the discharge amount per unit area relatively large for the linear second pattern having a small line width, a solder resist film having an appropriate thickness can be formed on the wiring board for the second pattern.

[0016] According to the pattern forming apparatus of the third aspect, the discharge amount per unit area of ​​the third cross-shaped pattern whose film thickness tends to increase is made smaller than the reference discharge amount, thereby forming a solder resist film of appropriate thickness on the wiring board for the cross-shaped pattern.

[0017] According to the pattern forming device of the fourth embodiment, a solder resist film having a cross-shaped pattern with an appropriate film thickness can be formed on a wiring substrate by making the ejection amount per unit area of ​​the third cross-shaped pattern whose film thickness tends to increase smaller than that of the first and second linear patterns.

[0018] According to the pattern forming apparatus of the fifth aspect, the discharge amount per unit area for a plurality of types of patterns is defined by using correction table information, thereby being able to appropriately set the discharge amount for each pattern included in the solder resist pattern data. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a perspective view showing a pattern forming device according to an embodiment.

[0020] Figure 2 This is a diagram showing the configuration of a computer included in the control unit.

[0021] Figure 3 A diagram showing the functional structure implemented by a computer.

[0022] Figure 4 It is a diagram showing the flow of operations of the pattern forming device 1 .

[0023] Figure 5 It is a plan view schematically showing a portion of a wiring board on which a solder resist film having a plurality of types of patterns is formed.

[0024] Figure 6 It is a cross-sectional view schematically showing a part of a wiring board on which a solder resist film having a plurality of types of patterns is formed.

[0025] Figure 7 This is a diagram showing an example of correction table information.

[0026] Figure 8It is a cross-sectional view schematically showing a wiring board on which a solder resist film having a plurality of types of patterns is formed.

[0027] Description of reference numerals:

[0028] 1: Patterning device

[0029] 11: Device body

[0030] 12: Control Department

[0031] 2: Mobile mechanism

[0032] 21: Stage

[0033] 2a: Y-direction moving mechanism

[0034] 2b: X-direction moving mechanism

[0035] 3: Head

[0036] 61: Ejection data generation unit

[0037] 611: Pattern determination unit

[0038] 612: Discharge volume setting unit

[0039] 62: Storage

[0040] 71: Solder mask pattern data

[0041] 711: Confirm information

[0042] 73: Correction table information

[0043] 75: Spraying Data

[0044] 9: Wiring substrate

[0045] 911, 912, 913, 92, 93, 94: solder mask

[0046] 9a: Surface DETAILED DESCRIPTION

[0047] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the structural members described in the present embodiment are only exemplary and are not intended to limit the scope of the present invention thereto. In the accompanying drawings, the size and quantity of each part are sometimes exaggerated or simplified as needed for easy understanding.

[0048] exist Figure 1In the figure, for the convenience of explanation, arrows representing mutually orthogonal X, Y, and Z axes are marked. The Z axis is parallel to the vertical direction, and the X axis and Y axis are parallel to the horizontal direction. In addition, in the following description, the direction of the top of each arrow is set as the + (positive) direction, and the opposite direction is set as the - (negative) direction.

[0049] <1. Implementation Method>

[0050] Figure 1 : is a three-dimensional diagram of a pattern forming device 1 according to an embodiment. The pattern forming device 1 forms a pattern of a solder resist film on a surface 9a of a printed wiring substrate (hereinafter, simply referred to as a "wiring substrate") 9 using solder resist ink. The pattern forming device 1 forms the pattern by inkjet. The wiring substrate 9 is, for example, a plate-shaped component made of epoxy glass resin. However, the wiring substrate 9 may also be other shapes such as a flexible sheet component. The solder resist film protects the conductive pattern on the wiring substrate 9. The conductive pattern includes wiring, pads, and other patterns. The solder resist film may not be formed in areas where solder paste is applied in subsequent processes and other areas where the solder resist film should not be provided.

[0051] The pattern forming device 1 has a device body 11 and a control unit 12. The device body 11 has a moving mechanism 2, a head 3, and a tank 4. The moving mechanism 2 has a Y-direction moving mechanism 2a and an X-direction moving mechanism 2b. The Y-direction moving mechanism 2a moves the wiring substrate 9 in the Y direction parallel to the surface 9a of the wiring substrate 9. The X-direction moving mechanism 2b moves the head 3 in the X direction perpendicular to the Y direction and parallel to the surface 9a of the wiring substrate 9. As the Y-direction moving mechanism 2a and the X-direction moving mechanism 2b, various mechanisms can be used. For example, a ball screw mechanism equipped with a motor can be used, and a linear motor can also be used.

[0052] The head 3 ejects minute droplets of solder resist ink (hereinafter simply referred to as "ink") onto the moving wiring substrate 9. The tank 4 stores the ink supplied to the head 3. The control unit 12 controls the moving mechanism 2 and the head 3. The ink is supplied from the tank 4 to the head 3 via the tube 41.

[0053] The Y-direction moving mechanism 2a has a stage 21 for holding the wiring substrate 9. The stage 21 is an example of a holding portion. The wiring substrate 9 is held on the upper surface of the stage 21. A plurality of holes are formed on the surface of the stage 21, and the holes are connected to a suction device not shown in the figure. By sucking air from the holes, the wiring substrate 9 is adsorbed on the upper surface of the stage 21. In addition, the surface of the stage 21 may have grooves extending from the holes in a horizontal direction, and the area of ​​the wiring substrate 9 adsorbed is expanded by the grooves. In addition, the surface of the stage 21 is formed as a porous component, and the wiring substrate 9 can be adsorbed via the porous component. In addition, the stage 21 may have a mechanical structure for holding the wiring substrate 9.

[0054] In the pattern forming device 1, if the head 3 is a member that moves relative to the stage 21, the moving mechanism 2 can adopt various structures. For example, the stage 21 may be fixed, and the head 3 may move in the X direction and the Y direction. The head 3 may move in the Y direction, and the stage 21 may move in the X direction.

[0055] The head 3 is provided with a discharge unit having a plurality of discharge ports arranged at equal intervals in the X direction. Droplets of ink are discharged from each discharge port in an inkjet manner. The ink is discharged in a (-Z) direction toward the surface 9a of the wiring substrate 9. As the inkjet method, various structures can be used, and a structure using piezoelectricity and a structure using a heater can be used.

[0056] By ejecting ink droplets from a plurality of nozzles while moving the stage 21 along the Y direction parallel to the wiring substrate 9 through the Y direction moving mechanism 2a, ink is supplied to the area extending along the Y direction. Hereinafter, the movement of the wiring substrate 9 in the Y direction is referred to as "main scanning". In fact, in one main scan of the wiring substrate 9, a plurality of ink lines corresponding to the plurality of nozzles are formed on the wiring substrate 9. When one main scan is completed, the head 3 is slightly moved along the X direction parallel to the wiring substrate 9 through the X direction moving mechanism 2b, and the wiring substrate 9 is moved along the (-Y) direction through the Y direction moving mechanism 2a. Thus, the second main scan is performed to form ink lines adjacent to the ink lines formed by the previous main scan.

[0057] By repeatedly performing the main scan for a predetermined number of times, a solder resist is formed in an area with a width roughly equal to the arrangement width of multiple heads in the X direction. Since the solder resist is only formed in the required area, the pattern of the solder resist can be correctly formed. Hereinafter, the width roughly equal to the arrangement width of multiple heads in the X direction is referred to as "unit width", and the area in which the solder resist is formed with this width is referred to as "unit area". If a solder resist is formed in a unit area, the head 3 moves the unit width along the X direction through the X-direction moving mechanism 2b, and the above-mentioned main scan is repeatedly performed, so that a solder resist is formed in a unit area adjacent to the previous unit area. By repeatedly performing the formation of the solder resist in the unit area and the movement of the head 3 to the X direction, the pattern of the solder resist is formed in all the required areas on the wiring substrate 9. In addition, for the same unit area, multiple main scans can also be performed. Thus, the amount of ink given to the unit area can be increased.

[0058] Figure 21 is a diagram showing the structure of a computer 5 included in the control unit 12. The computer 5 includes a CPU 51 that performs various calculations, a ROM 52 that stores basic programs, and a RAM 53 that stores various information. In addition, the computer 5 includes a fixed disk 54 that stores information, a display 55 that displays various information such as images, an input unit 56 that receives input from an operator, a reading device 57 that reads information from a computer-readable storage medium 8, and a communication unit 58 that sends and receives signals to and from the device body 11. The input unit 56 includes a keyboard 56a and a mouse 56b. The storage medium 8 is, for example, an optical disk, a magnetic disk, a magneto-optical disk, or a memory card.

[0059] In the computer 5, the program 80 is read from the storage medium 8 by the reading device 57 in advance and stored in the fixed disk 54. The program 80 may also be stored in the fixed disk 54 via a network. The CPU 51 uses the RAM 53 or the fixed disk 54 to perform calculations according to the program 80. The CPU 51 functions as a calculation unit in the computer 5. In addition, the computer 5 may also include other processors (GPU, etc.) that function as calculation units other than the CPU 51.

[0060] Figure 3 : is a diagram showing the functional structure realized by the computer 5. The computer 5 functions as a discharge data generating unit 61 and a storage unit 62. The storage unit 62 corresponds to the RAM 53 and the fixed disk 54. The discharge data generating unit 61 includes a pattern determining unit 611 and a discharge amount setting unit 612. In addition, the discharge data generating unit 61 can be realized by a plurality of computers. In addition, all or part of the functions of the discharge data generating unit 61 can be realized in hardware by a dedicated circuit.

[0061] The storage unit 62 stores the solder resist pattern data 71, the correction table information 73, and the ejection data 75. The solder resist pattern data 71 and the correction table information 73 can be provided to the computer 5 via the reading device 57 or the communication unit 58, or can be generated using the computer 5. The functions of the pattern determination unit 611 and the ejection amount setting unit 612 will be described in detail in the operation description of the pattern forming device 1.

[0062] Figure 4 It is a diagram showing the flow of operations of the pattern forming device 1 . Figure 4 Steps S12 to S14 are calculation processes executed by the control unit 12 , and step S15 is an action of the device body 11 based on the control of the control unit 12 .

[0063] First, prepare solder resist pattern data 71 and correction table information 73 and store them in the storage unit 62 (step S11). The solder resist pattern data 71 is information indicating the pattern of a predetermined solder resist film formed on the surface 9a of the wiring substrate 9. At the stage where the solder resist pattern data 71 is stored in the storage unit 62, the solder resist pattern data 71 may be vector data, but can be appropriately converted into raster data. The correction table information 73 is information for setting the amount of ink per unit area ejected by the head 3 (hereinafter referred to as "ejection amount") according to the type of pattern predetermined in advance. In addition, in the present embodiment, the "pattern" is not the entire solder resist film formed on the wiring substrate 9, but refers to the shape of a portion of the solder resist film in the entire solder resist film.

[0064] Figure 5 It is a plan view schematically showing a portion of wiring board 9 on which solder resist films 911 , 913 , and 93 having a plurality of types of patterns are formed. Figure 6 1 is a cross-sectional view schematically showing a portion of wiring board 9 on which solder resist films 911, 913, and 93 of a plurality of patterns are formed. Solder resist films 911 and 913 are linear patterns, and solder resist film 93 is a pattern applied to the entire surface of a certain area or more.

[0065] A plurality of (four in this case) conductive patterns 81 are arranged at intervals on the surface 9a of the wiring substrate 9. Specifically, the conductive pattern 81 is a circuit pattern formed by etching a copper film having a predetermined thickness. The upper side of each conductive pattern 81 is covered with solder 85. A solder resist film 911 as a linear pattern is provided between adjacent conductive patterns 81, 81. Figure 6 As shown, each solder resist film 911 functions as a dam for insulating the solders 85 , 85 covering the adjacent conductive patterns 81 , 81 from each other so as not to contact each other.

[0066] The solder resist film 913 is also a linear pattern similar to the solder resist film 911. However, the solder resist film 913 has a line width L2 that is larger than the line width L1 of the solder resist film 911.

[0067] A conductive pattern 83 is formed on the surface 9a of the wiring substrate 9. The solder resist film 93 covers the portion other than the tip of the conductive pattern 83 and has a circular opening 931 that exposes the tip of the conductive pattern 83 to the outside.

[0068] In this way, the pattern forming device 1 forms, on the wiring substrate 9, the solder resist pattern data 71. Figure 5 as well as Figure 6 In addition to the solder resist films 911, 913, and 93 shown, patterns of various shapes and sizes are formed.

[0069] Return to Figure 4The pattern determination unit 611 determines the registration pattern ( Figure 4 : Step S12). As described later, the registered pattern is a pattern specified in the correction table information 73 (refer to Figure 7 The pattern determination unit 611 searches the solder resist pattern data 71 for a portion that matches each registered pattern, and when a registered pattern is found, provides the ejection amount setting unit 612 with determination information 711 indicating the size and position of the area occupied by the registered pattern.

[0070] Figure 7 73. In the correction table information 73, a plurality of "substrate types" are specified as processing conditions when forming a solder resist pattern. In addition, in the correction table information 73, one or more "copper thicknesses" are specified as conditions for each "substrate type". The copper thickness is the thickness of the conductive pattern made of copper on the wiring substrate 9 before the solder resist film is formed (for example, Figure 4 as well as Figure 5 Further, in the correction table information 73, one or more "surface treatments" are specified as conditions for each "copper thickness". "Surface treatment" is a condition indicating the processing state of the surface 9a of the wiring substrate 9, specifically, including polishing and grinding and base.

[0071] In addition, in the correction table information 73, for each "surface treatment", a plurality of "registered patterns" and "discharge amounts (dot area ratios)" are specified in a one-to-one correspondence. Specifically, as "registered patterns", "lines" representing linear patterns, "SRO intersections" representing cross patterns, and "SRO middle lines" representing patterns formed in the middle area connecting intersections formed between SROs are specified. In addition, for "lines", different line widths such as 70μm, 100μm, and 150μm are specified.

[0072] exist Figure 4 In step S12 shown, the pattern determination unit 611 first determines the processing conditions (substrate type, copper thickness, surface treatment) that the wiring substrate 9 as the processing object meets. In addition, the processing conditions of the wiring substrate 9 can be determined based on information provided in advance by the user to the control unit 12. The pattern determination unit 611 searches the solder resist pattern data 71 for a registered pattern corresponding to the processing conditions specified in the correction table information 73, and when the registered pattern is found, determines the size and position of the registered pattern.

[0073] The solder resist pattern data 71 is data representing an image of a pattern of a solder resist film, and for each pixel, a value "1" indicating that ink is applied or a value "0" indicating that ink is not applied is specified. Hereinafter, the value indicating whether ink is applied is referred to as a "application value". The ejection amount setting unit 612 sets an application value for each pixel represented by the solder resist pattern data 71. That is, the ejection amount setting unit 612 sets an application value of 1 for the pixel to which ink is applied, and further sets the ejection amount per unit area. The ejection amount is a value corresponding to the film thickness of the solder resist film. That is, basically, the larger the ejection amount, the larger the film thickness.

[0074] Basically, the ejection amount setting unit 612 sets a predetermined reference ejection amount for the pixel to which ink is applied. In addition, when a registered pattern is determined by the pattern determination unit 611 in the solder resist pattern data 71, the ejection amount setting unit 612 sets the ejection amount specified in the correction table information 73 for the pixel corresponding to the determined registered pattern. That is, the ejection amount setting unit 612 sets the ejection amount for the registered pattern determined by the pattern determination unit 611 based on the correction table information 73. Then, the ejection amount setting unit 612 generates ejection data 75 indicating the ejection amount set for each pixel and stores it in the storage unit 62 ( Figure 4 :Step S14).

[0075] The device body 11 receives the ejection data 75 from the control unit 12, and controls the head 3 and the moving mechanism 2 according to the ejection data 75. Specifically, the process of ejecting ink droplets from the head 3 to the wiring substrate 9 and the process of moving the head 3 relative to the wiring substrate 9 in a direction parallel to the wiring substrate 9 are performed in parallel. Thus, ink is applied to the wiring substrate 9 to form a pattern ( Figure 4 :Step S15).

[0076] As shown above, in Figure 7 In the correction table information 73 shown in FIG. 1 , the ejection amount is set for each registered pattern. In addition, in the pattern forming device 1 , the dot area ratio is used as the ejection amount. Therefore, in the correction table information 73 , the dot area ratio is used as the ejection amount. Figure 7 In the example shown, the reference discharge amount is set to 60% using the dot area ratio.

[0077] exist Figure 7In the correction table information 73 shown, if the focus is on the linear pattern (line), it is stipulated that the smaller the line width, the larger the ejection amount. This is because, the smaller the line width, the easier it is for the film thickness to become thinner. In addition, in the case of polishing and grinding the surface treatment of the wiring substrate 9, the ejection amount is set to be relatively large compared to the case of the substrate. This is because, in the case of polishing and grinding, the film thickness of the linear pattern is more likely to become thinner than the case of the substrate. In addition, the ejection amount relative to the cross-shaped pattern (RRO intersection) is stipulated to be a value (for example, 50%) less than the ejection amount relative to the linear pattern. This is because the film thickness of the cross-shaped pattern tends to become relatively large.

[0078] Figure 8 2 is a cross-sectional view schematically showing a wiring substrate 9 on which a solder resist film having a plurality of patterns is formed. Figure 8 The upper part shows the formation of each solder resist film at a certain reference ejection amount. Figure 8 The lower half shows the case where the discharge amount is changed based on the correction table information 73. The solder resist films 911, 912, and 913 are linear patterns, and the line widths are set to 70 μm, 100 μm, and 150 μm. The solder resist film 94 represents a cross pattern. In addition, the line width is formed to increase in the order of the solder resist films 911, 912, and 913. In addition, the dotted line LN1 represents the surface height (film thickness) of the designed solder resist film.

[0079] like Figure 8 As shown in the upper part, when each solder resist is formed with a certain reference ejection amount, the solder resist 913 with a relatively large line width has a sufficient thickness, while the solder resists 911 and 912 with a small line width do not reach the required thickness. In addition, the film thickness of the solder resist 94 is larger than the target film thickness. In contrast, in the correction table information 73, the linear pattern is set so that the smaller the line width, the greater the ejection amount. Therefore, for the solder resists 911 and 912 with a relatively small line width, it is also possible to set it as the target height. In addition, in the correction table information 73, for the cross pattern (SRO intersection), a ejection amount (50%) smaller than the reference ejection amount (60%) is set. Therefore, the film thickness of the solder resist 94 as a cross pattern can be matched with the designed film thickness.

[0080] In the pattern forming device 1 , since the ejection amount of ink per unit area can be set according to the type of pattern, a solder resist film having an appropriate film thickness can be formed on the wiring substrate 9 for each type of pattern.

[0081] <2. Modifications>

[0082] In the above-mentioned embodiment, the registration pattern specified in the correction table information 73 is not limited to Figure 7The registration patterns shown are contemplated to have patterns of other sizes or shapes (eg, curved patterns, broken line patterns, etc.).

[0083] In the above embodiment, the ejection amount is changed by changing the dot area ratio, but this is not essential. For example, the ejection amount may be changed by changing the size of ink droplets ejected by the head 3 or the ejection frequency per unit time.

[0084] The present invention has been described in detail, but the above description is illustrative in all aspects, and the present invention is not limited thereto. It should be understood that numerous unillustrated variations can be envisioned without departing from the scope of the present invention. The structures described in the above-mentioned embodiments and variations can be appropriately combined or omitted as long as they do not contradict each other.

Claims

1. A pattern forming device for forming a pattern of a solder resist film on a wiring substrate, wherein: The pattern forming device comprises: A holding portion that holds a wiring substrate; A head portion, which sprays ink droplets of solder resist onto the surface of the wiring substrate in an inkjet manner; a moving mechanism for moving the head relative to the holding portion in a direction parallel to the surface of the wiring substrate; a discharge data generating unit that generates discharge data indicating a discharge amount of ink per unit area based on solder resist pattern data indicating a pattern of the solder resist film; as well as a control unit that controls the head and the moving mechanism based on the ejection data to form a pattern of a solder resist film on the wiring substrate, The ejection data generating unit generates the ejection data in which different ejection amounts are set for each of different types of patterns included in the solder resist pattern data. The pattern of the solder resist film includes: a first linear pattern with a first line width; and a linear second pattern having a second line width smaller than the first line width, The ejection data generating unit generates ejection data in which the ejection amount per unit area of ​​the second pattern is set to a value greater than the ejection amount per unit area of ​​the first pattern and the ejection amount per unit area of ​​the first pattern is set to a value greater than zero.

2. A pattern forming device for forming a pattern of a solder resist film on a wiring substrate, wherein: The pattern forming device comprises: A holding portion that holds a wiring substrate; A head portion, which sprays ink droplets of solder resist onto the surface of the wiring substrate in an inkjet manner; a moving mechanism for moving the head relative to the holding portion in a direction parallel to the surface of the wiring substrate; a discharge data generating unit that generates discharge data indicating a discharge amount of ink per unit area based on solder resist pattern data indicating a pattern of the solder resist film; as well as a control unit that controls the head and the moving mechanism based on the ejection data to form a pattern of a solder resist film on the wiring substrate, The ejection data generating unit generates the ejection data in which different ejection amounts are set for each of different types of patterns included in the solder resist pattern data. The pattern of the solder resist film includes a third cross-shaped pattern, The discharge data generating unit generates discharge data in which a discharge amount with respect to the third pattern is set to a value smaller than a predetermined reference discharge amount.

3. A pattern forming device for forming a pattern of a solder resist film on a wiring substrate, wherein: The pattern forming device comprises: A holding portion that holds a wiring substrate; A head portion, which sprays ink droplets of solder resist onto the surface of the wiring substrate in an inkjet manner; a moving mechanism for moving the head relative to the holding portion in a direction parallel to the surface of the wiring substrate; a discharge data generating unit that generates discharge data indicating a discharge amount of ink per unit area based on solder resist pattern data indicating a pattern of the solder resist film; as well as a control unit that controls the head and the moving mechanism based on the ejection data to form a pattern of a solder resist film on the wiring substrate, The ejection data generating unit generates the ejection data in which different ejection amounts are set for each of different types of patterns included in the solder resist pattern data. The pattern of the solder resist film includes: a first linear pattern with a first line width; and a linear second pattern having a second line width smaller than the first line width, The ejection data generating unit generates ejection data in which an ejection amount with respect to the second pattern is set to a value larger than an ejection amount with respect to the first pattern. The pattern of the solder resist film includes a third cross-shaped pattern, The discharge data generation unit generates discharge data in which a discharge amount for the third pattern is set to a value smaller than discharge amounts for the first pattern and the second pattern.

4. The pattern forming device according to any one of claims 1 to 3, wherein: The pattern forming device further includes a storage unit storing correction table information defining discharge amounts per unit area for a plurality of types of patterns. The ejection data generating unit includes: a pattern determination unit that determines a pattern registered in the correction table information in the solder resist pattern data; and The discharge amount setting unit sets the discharge amount for the pattern determined by the pattern determining unit based on the correction table information.

5. A method for forming a pattern of a solder resist film on a wiring substrate, wherein: The pattern forming method comprises: Step (a), ejecting solder resist ink droplets from a head onto the surface of the wiring substrate by inkjet method; Step (b), in step (a), moving the head relative to the wiring substrate in a direction parallel to the surface of the wiring substrate; and Step (c), in the step (a), the amount of ink ejected per unit area is varied according to the type of pattern of the solder resist film formed on the wiring substrate, The pattern of the solder resist film includes: a first linear pattern with a first line width; and a second linear pattern with a second line width smaller than the first line width. In the step (c), the ejection amount per unit area of ​​the second pattern is set to a value greater than the ejection amount per unit area of ​​the first pattern, and the ejection amount per unit area of ​​the first pattern is set to a value greater than zero.

6. A method for generating ejection data for use when ejecting droplets of solder resist ink from a head onto a wiring substrate in an inkjet manner, wherein: The ejection data generating method comprises: Step (A), preparing solder resist pattern data to be formed on a wiring substrate; and Step (B) generates ejection data in which different ejection amounts per unit area are set for each of the different types of patterns included in the solder resist pattern data, The pattern of the solder resist film includes: a first linear pattern with a first line width; and a second linear pattern with a second line width smaller than the first line width. In the step (B), the ejection amount per unit area of ​​the second pattern is set to a value greater than the ejection amount per unit area of ​​the first pattern, and the ejection amount per unit area of ​​the first pattern is set to a value greater than zero.

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