An automatic flatness compensation device for the reflow soldering of optocoupler components

By designing a flatness automatic compensation device for reflow soldering of the optocoupler element, the flexible expansion block of the thermal expansion head is used to resist the optocoupler element, the problem of deformation during welding of the optocoupler element is solved, and stable compensation of flatness and high versatility are achieved.

CN113490345BActive Publication Date: 2025-06-10SUZHOU WUTONG INTELLIGENT ELECTRONICS CO LTD
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Patent Information

Application Number
CN202110670693.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-06-18
Publication Date
2025-06-10
Estimated Expiration
2041-06-18

AI Technical Summary

Technical Problem

Optocoupling components are deformed during reflow soldering. Existing compensation methods such as component grooves and adding steel mesh can only target single-weight defects and cannot cope with complex welding environments, resulting in unstable welding flatness, single compensation effect, and poor versatility.

Method used

An automatic flatness compensation device including a positioning plate, a sliding cross plate, a sliding block, a connecting rod and a thermal expansion head is designed. The thermal expansion head consists of a flat pressure plate and a flexible expansion block. The flexible expansion block expands after heating to resist the optocoupling element and avoid deformation. The design of the connecting rod and slider allows the position of the thermal expansion head to be adjusted on the positioning plate to accommodate the circuit boards of different layouts.

Benefits of technology

Through the thermal expansion of the flexible expansion block, the deformation of the optocoupler element during reflow soldering can be effectively avoided, and the stable compensation of planeness can be achieved. It is suitable for complex welding environments and has strong versatility.

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Abstract

The present invention discloses an automatic flatness compensation device for the reflow soldering of optocoupler components, belonging to a flatness compensation device, which includes a positioning plate, a plurality of sliding cross plates, sliding blocks, connecting rods and thermal expansion heads. The positioning plate is a rectangular plate, and both ends of the positioning plate have downward bending ends. The positioning plate is provided with clearance through holes. A plurality of the sliding cross plates are slidably connected to the positioning plate, and the sliding cross plates are located above the positioning plate. In the present invention, the circuit board is clamped on the C-shaped guide rail, and the serrations on the bending ends are clamped on the transmission chain of the reflow soldering machine, so that the positioning plate carries the circuit board to move together. After being heated in the reflow soldering machine, the flexible expansion block expands, and the flexible expansion block gently presses against the optocoupler component attached to the circuit board, thereby avoiding the deformation of the optocoupler component during reflow soldering, fundamentally compensating for the deviation of flatness, having a good effect and strong versatility.
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Description

Technical Field

[0001] The present invention belongs to a flatness compensation device, and particularly relates to an automatic flatness compensation device for the reflow soldering of optocoupler components. Background Art

[0002] Reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various circuit boards used in our computers are all soldered to the circuit board through this process. There is a heating circuit inside this device that heats air or nitrogen to a high enough temperature and then blows it onto the circuit board with the components already attached, causing the solder on both sides of the components to melt and bond with the main board. Due to the uneven surface of the circuit board, misalignment of component placement, and uneven application of solder paste, it will all lead to the failure of optocoupler component soldering, thus affecting subsequent use.

[0003] Chinese Patent (CN202022021832.5) discloses an FG stencil for SMT patch soldering, belonging to the technical field of stencils, including a main body frame, a fixing plate, and ventilation openings. Fixing plates are provided at the front and rear ends on both the left and right sides of the main body frame, and one end of the fixing plate is fixedly connected to the main body frame. Ventilation openings are provided at the front and rear ends and on both the left and right sides of the main body frame, and the ventilation openings are in through connection with the main body frame.

[0004] Chinese Patent (CN201621484857.6) discloses an integrated circuit component and its PCB patch component. The PCB patch component is used to be attached to a PCB board. The PCB patch component includes a main body, and the surface of the main body facing the PCB board is a bonding surface. Among them, grooves are provided on the bonding surface. During patching, the bonding surface is brought into contact with the PCB board, and solder paste is applied between the two. When the solder paste is heated, the solder paste will move along the side walls of the grooves through the tin climbing effect. Compared with traditional components, the contact between the solder paste and the above-mentioned PCB patch component changes from surface contact to three-dimensional contact, thereby increasing the contact area between the solder paste and the above-mentioned PCB patch component, and further making the soldering more firm. In addition, part of the solder paste will enter the grooves through the tin climbing effect.

[0005] Currently, to improve the soldering flatness of components, usually a stencil is set between the components and the circuit board to compensate for the deformation of the components during soldering, or grooves are provided on the components to hide the excess solder paste. However, these two compensation methods are relatively limited and can only be used to specifically improve single defects, and cannot cope with complex soldering environments, with poor versatility. Summary of the Invention

[0006] The purpose of the present invention is to: solve the problem that when optocoupler components are deformed during reflow soldering, the flatness can only be compensated by grooving the components and adding a stencil, resulting in unstable soldering flatness, single compensation effect, and poor versatility, and propose an automatic flatness compensation device for the reflow soldering of optocoupler components.

[0007] To achieve the above object, the present invention adopts the following technical solution: An automatic flatness compensation device for the reflow soldering of optocoupler components, which includes a positioning plate, several sliding cross plates, sliding blocks, connecting rods, and thermal expansion heads. The positioning plate is a rectangular plate, and both ends of the positioning plate have downward bending ends. The positioning plate is provided with clearance through holes. Several sliding cross plates are slidably connected to the positioning plate, and the sliding cross plates are located above the positioning plate. The sliding blocks are slidably connected to the sliding cross plates. The connecting rods are clamped on the sliding blocks, and the connecting rods pass through the clearance through holes and extend below the positioning plate. The thermal expansion heads are fixedly connected to the lower ends of the connecting rods;

[0008] The thermal expansion head includes a flat pressing plate and a flexible expansion block. The flat pressing plate is fixedly connected to the lower end of the connecting rod, and the flexible expansion block is fixedly connected to the flat pressing plate.

[0009] As a further description of the above technical solution:

[0010] One end of the positioning plate is provided with a limiting plate, and both ends of the limiting plate are respectively fixedly connected to the two bending ends.

[0011] As a further description of the above technical solution:

[0012] Several downward-facing sawteeth are provided on the bending ends, and the sawteeth are arranged at equal distances along a straight line.

[0013] As a further description of the above technical solution:

[0014] A conduit is provided on the flat pressing plate, and the conduit is sleeved on the flexible expansion block.

[0015] As a further description of the above technical solution:

[0016] C-shaped rails are provided on both bending ends, and the two C-shaped rails are arranged oppositely.

[0017] As a further description of the above technical solution:

[0018] The connecting rod includes a fixed rod and a sleeve rod. The fixed rod is fixedly connected to the sliding block, and the sleeve rod is sleeved on the fixed rod and is screwed to the fixed rod.

[0019] As a further description of the above technical solution:

[0020] Two parallel slide rails are provided on the top of the positioning plate, and both ends of the sliding cross plate are clamped in the slide rails.

[0021] As a further description of the above technical solution:

[0022] Magnetic strips are provided inside the sliding rail and at the end of the sliding cross plate, and the two magnetic strips are magnetically adsorbed to each other.

[0023] As a further description of the above technical solution:

[0024] A fixing knob is screwed onto the sliding block, and the fixing knob passes through the sliding block and abuts against the sliding cross plate.

[0025] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are as follows:

[0026] 1. In the present invention, by clamping the circuit board on the C-shaped guide rail and clamping the saw teeth on the bent end on the conveyor chain of the reflow soldering machine, the positioning plate carries the circuit board to move together. After being heated in the reflow soldering machine, the flexible expansion block expands, and the flexible expansion block gently abuts against the optocoupler element and fits on the circuit board, thereby avoiding the deformation of the optocoupler element during reflow soldering, fundamentally compensating for the flatness deviation, with good effect and strong versatility.

[0027] 2. In the present invention, by sliding the sliding cross plate along the sliding rail, sliding the sliding block on the sliding cross plate, and screwing the sleeve on the fixed rod in a spiral manner, the position of the thermal expansion head on the positioning plate is adjusted, so that the device is easy to adjust and can be quickly applied to circuit boards with different layouts, with strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of an automatic flatness compensation device for reflow soldering of optocoupler elements.

[0029] Figure 2 It is a cross-sectional view of an automatic flatness compensation device for reflow soldering of optocoupler elements.

[0030] Figure 3 For Figure 2 A partial enlarged view of part A in

[0031] Figure 4 It is a schematic diagram of the structure of the connecting rod with a thermal expansion head in an automatic flatness compensation device for reflow soldering of optocoupler elements.

[0032] Figure 5 It is a reference diagram of the usage state of an automatic flatness compensation device for reflow soldering of optocoupler elements.

[0033] LEGEND DESCRIPTION:

[0034] 1. Positioning plate; 2. Sliding cross plate; 3. Sliding block; 4. Connecting rod; 41. Fixed rod; 42. Sleeve rod; 5. Thermal expansion head; 6. Bent end; 7. Clearance through hole; 8. Flat pressing plate; 9. Flexible expansion block; 10. Limiting plate; 11. Saw teeth; 12. Conduit; 13. C-shaped guide rail; 14. Slide rail; 15. Magnetic strip; 16. Fixed knob. Detailed implementation manner

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] Please refer to Figures 1-5 , the present invention provides a technical solution: a flatness automatic compensation device for the reflow soldering of optocoupler components, including a positioning plate 1, several sliding cross plates 2, sliding blocks 3, connecting rods 4 and thermal expansion heads 5. The positioning plate 1 is a rectangular plate, and both ends of the positioning plate 1 have downward bent ends 6. A clearance through hole 7 is opened on the positioning plate 1. Several sliding cross plates 2 are slidably connected to the positioning plate 1, and the sliding cross plates 2 are located above the positioning plate 1. The sliding blocks 3 are slidably connected to the sliding cross plates 2. The connecting rods 4 are clamped on the sliding blocks 3, and the connecting rods 4 pass through the clearance through hole 7 and extend below the positioning plate 1. The thermal expansion heads 5 are fixedly connected to the lower ends of the connecting rods 4;

[0037] The thermal expansion head 5 includes a flat pressing plate 8 and a flexible expansion block 9. The flat pressing plate 8 is fixedly connected to the lower end of the connecting rod 4, and the flexible expansion block 9 is fixedly connected to the flat pressing plate 8;

[0038] A limiting plate 10 is provided at one end of the positioning plate 1. Both ends of the limiting plate 10 are fixedly connected to the two bent ends 6 respectively. The circuit board is clamped in the C-shaped guide rail 13, and the limiting plate 10 restricts the end of the C-shaped guide rail 13 to prevent the circuit board from slipping out of the slide rail 14;

[0039] Several downward-facing saw teeth 11 are provided on the bent end 6. The saw teeth 11 are arranged at equal distances along a straight line. The saw teeth 11 are clamped on the conveyor chain of the reflow soldering machine, so that the positioning plate 1 carries the circuit board and moves together;

[0040] A conduit 12 is provided on the flat pressing plate 8. The conduit 12 is sleeved on the flexible expansion block 9. The conduit 12 has a guiding effect on the expansion direction of the flexible expansion block 9. In addition, changing the specification of the conduit 12 can control the expansion distance of the flexible expansion block 9;

[0041] Both of the bending ends 6 are provided with C-shaped guide rails 13. The two C-shaped guide rails 13 are arranged oppositely, so that the circuit board can be clamped in the C-shaped guide rails 13 and in a suspended state, so that the circuit board moves together with the movement of the positioning plate 1;

[0042] The connecting rod 4 includes a fixed rod 41 and a sleeve rod 42. The fixed rod 41 is fixedly connected to the sliding block 3. The sleeve rod 42 is sleeved on the fixed rod 41 and is screwed to the fixed rod 41. By screwing the sleeve rod 42, the sleeve rod 42 rotates spirally along the fixed rod 41, thereby adjusting the lifting of the sleeve rod 42;

[0043] Two mutually parallel slide rails 14 are provided on the top of the positioning plate 1. Both ends of the sliding cross plate 2 are clamped in the slide rails 14;

[0044] Magnetic strips 15 are provided in the slide rails 14 and at the ends of the sliding cross plate 2. The two magnetic strips 15 are magnetically adsorbed to each other, so that the sliding cross plate 2 can slide in the slide rails 14 and can be fixed immediately in the slide rails 14, and the adjustment operation is simple and convenient;

[0045] A fixing knob 16 is screwed on the sliding block 3. The fixing knob 16 passes through the sliding block 3 and abuts against the sliding cross plate 2. By screwing the fixing knob 16, the sliding block 3 can be quickly fixed on the sliding cross plate 2, which is convenient for adjusting the position of the sliding block 3 on the sliding cross plate 2, so as to adapt to circuit boards with different layouts.

[0046] Working principle: First, insert the circuit board into the C-shaped guide rail 13, and place the positioning plate 1 and the circuit board together on the conveying chain of the reflow soldering machine. At this time, the saw teeth 11 on the bending end 6 are clamped on the chain, and the limiting plate 10 has a limiting effect on the circuit board in the C-shaped guide rail 13. Secondly, when the positioning plate 1 enters the reflow soldering machine, the flexible expansion block 9 expands due to heat. The expansion acts on the inner wall of the conduit 12. Under the guiding action of the conduit 12, the flexible expansion block 9 abuts against the surface of the optocoupler element, avoiding deformation during welding, so as to directly compensate for the flatness of the optocoupler element. Then, when the positioning plate 1 comes out of the reflow soldering, the flexible expansion block 9 cools and shrinks, and the flexible expansion block 9 leaves the optocoupler element, and the circuit board is taken out of the C-shaped guide rail 13. Finally, when processing circuit boards with different specifications of layouts, push the sliding cross plate 2 to slide along the slide rail 14. After the sliding stops, the sliding cross plate 2 is automatically magnetically adsorbed on the slide rail 14 through the magnetic strip 15. Push the sliding block 3 to slide on the sliding cross plate 2, and screw the fixing knob 16 to fix the sliding block 3 on the sliding cross plate 2. Screw the sleeve rod 42, and the sleeve rod 42 rotates spirally along the fixed rod 41, thereby adjusting the lifting of the sleeve rod 42, and place the flexible expansion block 9 above the optocoupler element.

[0047] The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes should be covered within the protection scope of the present invention.

Claims

1. An automatic flatness compensation device for the reflow soldering of optocoupler components, Characterized in that: It includes a positioning plate (1), several sliding cross plates (2), sliding blocks (3), connecting rods (4) and thermal expansion heads (5). The positioning plate (1) is a rectangular plate, and both ends of the positioning plate (1) have downward bending ends (6). An avoidance through hole (7) is provided on the positioning plate (1). Several sliding cross plates (2) are slidably connected to the positioning plate (1), and the sliding cross plates (2) are located above the positioning plate (1). The sliding blocks (3) are slidably connected to the sliding cross plates (2). The connecting rods (4) are clamped on the sliding blocks (3), and the connecting rods (4) pass through the avoidance through hole (7) and extend below the positioning plate (1). The thermal expansion heads (5) are fixedly connected to the lower ends of the connecting rods (4); The thermal expansion head (5) includes a flat pressing plate (8) and a flexible expansion block (9). The flat pressing plate (8) is fixedly connected to the lower end of the connecting rod (4), and the flexible expansion block (9) is fixedly connected to the flat pressing plate (8).

2. The automatic flatness compensation device for the reflow soldering of optocoupler components according to claim 1, Characterized in that, One end of the positioning plate (1) is provided with a limiting plate (10), and both ends of the limiting plate (10) are respectively fixedly connected to the two bending ends (6).

3. The automatic flatness compensation device for the reflow soldering of optocoupler components according to claim 1, Characterized in that, Several downward-facing sawteeth (11) are provided on the bending end (6), and the sawteeth (11) are arranged at equal distances along a straight line.

4. The automatic flatness compensation device for the reflow soldering of optocoupler components according to claim 1, Characterized in that, A conduit (12) is provided on the flat pressing plate (8), and the conduit (12) is sleeved on the flexible expansion block (9).

5. The automatic flatness compensation device for the reflow soldering of optocoupler components according to claim 1, Characterized in that, C-shaped guide rails (13) are provided on both bending ends (6), and the two C-shaped guide rails (13) are arranged oppositely.

6. The automatic flatness compensation device for the reflow soldering of optocoupler components according to claim 1, Characterized in that, The connecting rod (4) includes a fixed rod (41) and a sleeve rod (42). The fixed rod (41) is fixedly connected to the sliding block (3), and the sleeve rod (42) is sleeved on the fixed rod (41) and is screwed to the fixed rod (41).

7. The automatic flatness compensation device for the reflow soldering of optocoupler components according to claim 1, Characterized in that, Two mutually parallel slide rails (14) are provided on the top of the positioning plate (1), and both ends of the sliding cross plate (2) are clamped in the slide rails (14).

8. The automatic flatness compensation device for the reflow soldering of optocoupler components according to claim 7, Characterized in that, Magnetic strips (15) are provided both inside the sliding rail (14) and at the end of the sliding cross plate (2), and the two magnetic strips (15) are magnetically adsorbed to each other.

9. An automatic flatness compensation device for reflow soldering of optocoupler components according to claim 1, characterized in that, a fixing knob (16) is screwed onto the sliding block (3), and the fixing knob (16) passes through the sliding block (3) and abuts against the sliding cross plate (2).

Citation Information

Patent Citations

  • Integrated circuit component and PCB patch element thereof

    CN206323649U

  • FG steel mesh for SMT patch welding

    CN212851252U

  • Flatness automatic compensation device for reflow soldering of optocoupler element

    CN215872054U