Film thickness correction plate and optical direct monitoring coating equipment
By designing a film thickness correction plate with exposed holes and an optical direct monitoring coating equipment that deviates from the central axis, the problem of the uniformity of the center wavelength and the film forming area of the optical film filter in the prior art is solved, and a film filter production with high output rate, good uniformity and cost-effectiveness is achieved.
Patent Information
- Application Number
- CN202110609142.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-06-01
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2041-06-01
AI Technical Summary
While ensuring high output rate and large film forming area, existing optical film filter production equipment is difficult to take into account the uniformity of the film center wavelength, resulting in poor central wavelength uniformity of the narrowband filter and small effective film forming area.
A film thickness correction plate is designed, and by providing a film thickness correction plate with exposed holes in front of the glass substrate, partial edges of the glass substrate are exposed, thereby performing direct central monitoring. At the same time, the optically directly monitors the rotation axis of the coating equipment to deviate from the central axis of the vacuum chamber, and combined with the design of the film thickness correction plate, it realizes direct center monitoring and direct edge monitoring on the same glass substrate at the same time.
Effectively reduce the central wavelength change of the optical film filter, improve the uniformity of the central wavelength distribution, achieve high output rate and large film formation area, and reduce production costs and meet the requirements of high wavelength uniformity.
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Figure CN113512712B_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of optical thin film filters, and relates to a production device for optical thin film filters, in particular to a film thickness correction plate and optical direct monitoring coating equipment. Background Art
[0002] Optical thin film filters have a wide range of applications, such as in life science fluorescence detection, fiber optic communication wavelength division multiplexing system, laser radar, face 3D recognition and other high-tech fields. Optical thin film filters are core components, and their role is to extract information and improve the system signal-to-noise ratio. The production method of optical thin film filters is to alternately combine materials of different thicknesses and high and low refractive indices in a vacuum environment by electron beam heating, ion beam sputtering, or magnetron sputtering, and use the principle of optical interference to achieve the effect of transmission or reflection of a certain optical wavelength. The production equipment for producing optical thin film sheets is an optical vacuum coating machine, which is mainly composed of the following parts: ① vacuum generation and maintenance system; ② material heating evaporation or sputtering system; ③ film uniformity correction system; ④ ion beam auxiliary system to increase film quality.
[0003] High-end thin film filters are currently mostly produced by imported equipment. Direct optical monitoring is the only way to produce high-end narrow-band filters, that is, to monitor the collimated light directly projected onto the glass substrate, which is received by the photodetector through the glass substrate and converted into an electrical signal related to the film thickness. After computer processing, precise film thickness control can be achieved. Improving the consistency of the central wavelength distribution of optical thin film filters in the glass substrate area is a technical challenge in this field. There are currently two main methods of direct optical monitoring in conventional equipment for producing optical thin film filters:
[0004] (1) Edge transmission direct monitoring method:
[0005] like Figure 1 As shown, the glass substrate is placed on the workpiece rack 1, and the workpiece rack 1 rotates around the rotating shaft 9 located at the central axis of the equipment. The electron guns 2 and 3 work alternately, evaporating the materials with high and low refractive indexes to be deposited on the glass substrate, and the ion source 4 works to generate an ion beam, bombarding the film material deposited on the glass substrate to improve the film quality. The film thickness correction plates 5 and 6 are arranged below the workpiece rack 1; the bracket for installing the correction plates is generally placed on the side wall of the vacuum chamber 7, and there are two types: fixed or movable, and the movable type has a good correction effect; the monitoring light source 8 (which can be a light bulb or a light source introduced from the outside) is installed on the back of a certain film thickness correction plate, and it is powered on to emit light, which is received by the optical fiber probe 10 through the glass substrate, and information processing can be performed through the form of photoelectric conversion, and the optical signal is converted into an electrical signal related to the film thickness. After software calculation, the equipment automatically judges to achieve the purpose of precise control. The representative equipment of this structure is the OTFC-1300 equipment with direct control of Japan's Optoelectronics.
[0006] When the glass substrate is large, electron beam evaporation or ion beam sputtering edge transmission direct monitoring method is used for film formation, such as Figure 2 and 3 The form shown. Figure 3 As shown, the film-forming method of ion beam sputtering is to bombard the surface of the target material 11 with high-energy ions or atoms generated by an ion source 4, sputter out the target material in the form of single atoms or multi-atom clusters, and deposit it on the glass substrate 12, assisted by correction with a film thickness correction plate to achieve consistent wavelength within a certain area of the monitoring point, wherein the film thickness correction plates 5 and 6 are arranged below the glass substrate 12. Figure 3 In the process, the laser passes through the optical fiber probe 10 and is projected onto the glass substrate 12, then penetrates out of the vacuum chamber 7, is reflected by the reflector 13, and is received by the detector 14, and is converted into an electrical signal related to the optical film thickness. The purpose of monitoring the film thickness can be achieved through the change of the electrical signal.
[0007] From the above, it can be seen that the current edge transmission direct monitoring method has the following characteristics:
[0008] 1. The rotation axis 9 of the glass substrate 12 coincides with the geometric center axis of the device;
[0009] 2. The glass substrate 12 rotates around the geometric center axis of the device;
[0010] 3. Since the positions of high and low refractive index materials are different at different times, the film thickness deposited at different times is different, and it is necessary to rely on the film thickness correction plate to correct the uniformity of the film thickness distribution;
[0011] 4. The film thickness correction plate is generally a sheet type with different sizes at different positions. The uniformity of the film is calibrated by adjusting the size of the correction plate, which is difficult to adjust and easy to change;
[0012] 5. Film formation is a large-area deposition;
[0013] 6. Optical monitoring position, that is, the optical fiber probe 10 is not at the geometric center of the device, but at the edge, so it is called direct edge monitoring.
[0014] (2) Center direct monitoring method:
[0015] like Figure 4As shown, the center of the glass substrate 12 is substantially coincident with the rotation center of the device, and the electron guns (or ion beam sputtering) 2 and 3 deposit the film material atoms / molecules onto the glass substrate 12, and the ion source 4 is used to improve the film quality and fine-tune the film thickness. In its optical monitoring system, the light emitted by the light source is coupled into the optical fiber, and becomes collimated light after passing through the optical fiber collimator 15, and is projected onto the glass substrate 12, and then penetrates out of the vacuum chamber 7, and is received by the detector 14 after being reflected by the reflector 13, and is converted into an electrical signal related to the optical film thickness. The purpose of monitoring the film thickness can be achieved through the change of the electrical signal.
[0016] In this monitoring method, the optical monitoring position (i.e., the optical fiber probe 10) and the glass substrate 12 are both located in the center. The advantage is that after the two materials are rotated and averaged, it is easy to obtain a thin film filter with a small central wavelength change and a high film thickness uniformity in the middle; however, the film-forming effective area is small, and the filter characteristics away from the center area decay quickly, resulting in low yield and high cost. Currently, optical communication DWDM films that have high requirements for wavelength uniformity generally adopt this structural production method.
[0017] By comparing the above two direct monitoring methods, it can be found that the edge direct control method has a large film forming area, high production efficiency, large central wavelength variation, poor stability, and the film thickness uniformity is corrected by the correction plate; while the center direct control method has a small film forming area, low production efficiency, small central wavelength variation, good stability, no correction plate, and the film thickness uniformity is fine-tuned by the ion source. Therefore, the advantages and disadvantages of the existing edge direct control method and the center direct control method are mutually contradictory and incompatible. Therefore, how to propose a solution that can not only ensure the high output rate and large film forming area of thin film optical filters, but also take into account good wavelength uniformity is a difficult problem that needs to be solved urgently in this field. Summary of the invention
[0018] One of the objects of the present invention is to provide a film thickness correction plate to reduce the central wavelength variation of an optical thin film filter.
[0019] To achieve the above object, the present invention provides the following solutions:
[0020] The present invention provides a film thickness correction plate, which is used to be installed in front of a glass substrate, and the film thickness correction plate is spaced apart from the glass substrate; at least one exposure hole is opened on the film thickness correction plate, and the exposure hole is used to expose the edge portion of the glass substrate so that the exposed edge portion can be directly monitored from the center; the non-exposed hole portion of the film thickness correction plate can completely cover the glass substrate in the radial direction of the glass substrate.
[0021] Optionally, any of the exposure holes are fan-shaped exposure holes with an opening angle of 0° to 360°. And any exposure hole is not a notch, that is, the outer circle of the film thickness correction plate is continuous, which can ensure the strength of the correction plate and ensure that it does not deform during use.
[0022] Optionally, the film thickness correction plate is a circular correction plate, and the center of the circular correction plate and the vertices of any of the fan-shaped exposure holes are located on a straight line where the rotation axis of the glass substrate is located.
[0023] Optionally, two side edges of the fan-shaped exposure hole are curves of arbitrary shapes.
[0024] Another object of the present invention is to provide an optical direct monitoring coating device to overcome the problem that the uniformity of the central wavelength and the effective film forming area of the existing thin film optical filter cannot be taken into account at the same time. The specific scheme is as follows:
[0025] An optical direct monitoring coating device including the above-mentioned film thickness correction plate includes a vacuum chamber and an optical monitoring system, wherein the rotation axis of the glass substrate is set to deviate from the central axis of the vacuum chamber; the film thickness correction plate is installed in front of the glass substrate, and the exposure hole exposes the edge portion of the glass substrate; the collimated light formed in the optical monitoring system passes through the exposure hole and coincides with the central axis, so that the edge portion of the glass substrate exposed to the exposure hole is directly monitored by the optical monitoring system; the glass substrate blocked by the film thickness correction plate deviates from the collimated light so as to be directly monitored by the edge of the optical monitoring system.
[0026] Optionally, the film thickness correction plate is mounted on an inner top wall or an inner side wall of the vacuum chamber via a bracket.
[0027] Optionally, the glass substrate rotates around the rotation axis at a speed of 10 to 1200 rpm.
[0028] Optionally, the optical monitoring system includes a light source, an optical fiber, a fiber collimator connected to the optical fiber, and a detector; the light source and the detector are respectively located at two ends of the vacuum chamber in the axial direction, the light emitted by the light source is coupled into the optical fiber, and is converted into collimated light by the fiber collimator, and sequentially penetrates the glass substrate and the vacuum chamber; the detector is used to receive the collimated light that penetrates out of the vacuum chamber.
[0029] Optionally, the collimated light emission direction of the fiber collimator is perpendicular to the collimated light receiving direction of the detector, and a reflector for changing the collimated light emission path is arranged in front of the detector. The light emitted by the light source is coupled into the optical fiber, becomes collimated light after passing through the fiber collimator, is projected onto the glass substrate, and then passes through the vacuum chamber; the collimated light that passes through the vacuum chamber is reflected by the reflector and then received by the detector.
[0030] Optionally, the collimated light emission direction of the fiber optic collimator coincides with the collimated light receiving direction of the detector, and the light emitted by the light source is coupled into the optical fiber, becomes collimated light after passing through the fiber optic collimator, is projected onto the glass substrate, and then passes through the vacuum chamber; the collimated light that passes through the vacuum chamber is directly received by the detector.
[0031] Compared with the prior art, the present invention has achieved the following technical effects:
[0032] The film thickness correction plate proposed in the present invention exposes part of the edge of the glass substrate by setting an exposure hole, so that the center of the exposed edge can be directly monitored to reduce the center wavelength variation of the optical thin film filter, which is beneficial to improving the uniformity of the overall center wavelength distribution of the optical thin film filter.
[0033] The optical direct monitoring coating equipment proposed in the present invention has a reasonable structural arrangement. By setting the rotating axis at a position deviating from the central axis of the vacuum chamber and setting the optical direct monitoring point at or near the central axis of the vacuum chamber, and supplemented by a film thickness correction plate with an exposure hole, the center direct monitoring and edge direct monitoring can be performed on the same glass substrate at the same time, and finally the center wavelength of the thin film filter in the monitored area has a small change and a large film forming area is achieved. It can not only ensure the high output rate of thin film optical filters and reduce production costs, but also ensure the consistency of the center wavelength distribution of optical thin film filters, effectively overcome the current industry pain points of poor uniformity of the center wavelength of narrow-band filters and small effective film forming area, and can meet the higher wavelength uniformity requirements of existing optical systems for optical thin film filters, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0035] Figure 1 It is a schematic diagram of an optical direct monitoring coating device using an edge transmission direct monitoring method in the prior art;
[0036] Figure 2 It is a schematic diagram of another optical direct monitoring coating device using edge transmission direct monitoring method in the prior art;
[0037] Figure 3 It is a schematic diagram of another optical direct monitoring coating device using edge transmission direct monitoring method in the prior art;
[0038] Figure 4 It is a schematic diagram of an optical direct monitoring coating device using a central direct monitoring method in the prior art;
[0039] Figure 5 It is a front view of the optical direct monitoring coating device disclosed in an embodiment of the present invention;
[0040] Figure 6 A top view of an optical direct monitoring coating device disclosed in an embodiment of the present invention;
[0041] Figure 7 It is a top view of the assembly of the circular correction plate disclosed in the embodiment of the present invention;
[0042] Figure 8 A bottom view of the circular correction plate according to an embodiment of the present invention;
[0043] Wherein, the accompanying drawings are marked as follows:
[0044] 1-workpiece holder; 2, 3-electron gun; 4-ion source; 5, 6-film thickness correction plate; 7-vacuum chamber; 8-light source; 9-rotation axis; 10-fiber probe; 11-target material; 12-glass substrate; 13-reflector; 14-detector; 15-fiber collimator;
[0045] 16-circular correction plate; 17-fan-shaped exposure hole; 18-monitoring point; 19-fixed hole; 20-collimated light; 21-central axis. DETAILED DESCRIPTION
[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0047] One of the objects of the present invention is to provide a film thickness correction plate to reduce the central wavelength variation of an optical thin film filter.
[0048] Another object of the present invention is to provide an optical direct monitoring coating device including the above-mentioned film thickness correction plate, so as to completely overcome the problem that the central wavelength uniformity and the effective film forming area of the existing thin film optical filter cannot be taken into account at the same time.
[0049] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
[0050] Embodiment 1
[0051] like Figure 7-8 As shown, this embodiment provides a film thickness correction plate, which can be a regular shape including a circle, a square, etc., or an irregular polygon or other shape. The film thickness correction plate is used to be installed in front of the glass substrate 12, and the film thickness correction plate is spaced apart from the glass substrate 12; at least one exposure hole is opened on the film thickness correction plate, and the exposure hole is used to expose the edge portion of the glass substrate 12, so that the exposed edge portion forms a similar coaxial with the collimated light emitted by the optical monitoring system in the optical direct monitoring coating equipment, so that the exposed edge portion can be directly monitored in the center. The central direct monitoring method can reduce the change of the central wavelength of the edge portion of the optical thin film filter, which is conducive to improving the uniformity of the central wavelength distribution of the entire optical thin film filter. The non-exposed hole portion of the film thickness correction plate can completely block the glass substrate 12 in the radial direction of the glass substrate 12 to avoid causing uneven distribution of the central wavelength of the edge portion of the optical thin film filter. The above-mentioned "front" means that the film thickness correction plate is arranged between the glass substrate 12 and the electron gun (or ion source).
[0052] In this embodiment, the exposure hole may be in a fan shape or other shapes including a long strip shape. Figure 7-8 As shown, as a preferred mode, in this embodiment, it is preferred that any exposure hole is a fan-shaped exposure hole 17 with an opening angle of 0° to 360°. Among them, the opening angle λ can be changed within the range of 0° to 360°. In addition, any exposure hole is not a notch, that is, Figure 7-8 As shown, the outer circle of the film thickness correction plate is continuous, which can ensure the strength of the correction plate and ensure that it does not deform during use.
[0053] In this embodiment, Figure 7-8As shown, as a preferred embodiment, the glass substrate 12 is set as a circular glass substrate, the film thickness correction plate is set as a circular correction plate 16, at least one fan-shaped exposure hole 17 is provided on the circular correction plate 16, and the center of the circular correction plate 16 and the vertex of any fan-shaped exposure hole 17 are both located on the straight line where the rotation axis 9 of the glass substrate 12 is located, and the arc line of any fan-shaped exposure hole 17 is all located within the edge of the circular correction plate 16 to ensure that the edge of the circular correction plate 16 remains continuous. Of course, the center of the circular correction plate 16 can also be set away from the straight line where the rotation axis 9 is located, and the vertex of any fan-shaped exposure hole 17 can also be set away from the center of the circular correction plate 16. In actual operation, when only one fan-shaped exposure hole 17 is provided on the circular correction plate 16, its opening angle can be set larger; and when more than two fan-shaped exposure holes 17 are provided on the circular correction plate 16, the opening angle of any fan-shaped exposure hole 17 can be set relatively smaller, and the opening angles of any two fan-shaped exposure holes 17 can be the same or different, and the two or more fan-shaped exposure holes 17 can be uniformly distributed in the circumferential direction or non-uniformly distributed. In this embodiment, as a preferred method, when more than two fan-shaped exposure holes 17 are provided on the circular correction plate 16, the central wavelength distribution of the filter can be finely adjusted; and the opening angles of any two fan-shaped exposure holes 17 are the same, and are uniformly distributed in the circumferential direction on the circular correction plate 16. In addition, when the exposure hole is a shape other than a fan, the number of exposure holes provided on the circular correction plate 16, the opening position, and the distribution method of multiple exposure holes can all refer to but not be limited to the above-mentioned fan-shaped exposure holes 17.
[0054] In this embodiment, Figure 7-8 As shown, the two sides of the sector-shaped exposure hole 17 can be curves of any shape, such as straight lines, sawtooth lines or wavy lines, etc. By setting the two sides of the sector-shaped exposure hole 17 to curve shapes, the purpose of correcting the film thickness can be fully achieved, so that the center wavelength of the thin film filter changes little and the center wavelength consistency is high.
[0055] This embodiment also provides an optical direct monitoring coating device including the above-mentioned film thickness correction plate, wherein:
[0056] like Figure 6 As shown, the rotation axis 9 of the glass substrate 12 is set away from the central axis 21 of the vacuum chamber 7; however, the central axis 21 is not limited to the axis at the most central position of the vacuum chamber 7 in a strict sense, and it can be offset from the most central position of the vacuum chamber 7. The "center" in the central axis 21 is relative, not an absolute position; the film thickness correction plate is installed in front of the glass substrate 12, and the exposure hole exposes the edge portion of the glass substrate 12;
[0057] Here, "front" means that the film thickness correction plate is set between the glass substrate 12 and the electron gun (or ion source). Figure 5In the vertical structure shown in FIG. 1 , the film thickness correction plate is disposed below the glass substrate 12; and when the optical coating device is directly monitored from the Figure 5 When the vertical structure shown is rotated 90 degrees counterclockwise to a horizontal structure, the film thickness correction plate can also be said to be disposed on the right side of the glass substrate 12;
[0058] The collimated light 20 formed in the optical monitoring system, that is, the monitoring point 18 coincides with the central axis 21, and deviation is allowed.
[0059] In this embodiment, the film thickness correction plate is mounted on the inner side wall of the vacuum chamber 7 through a bracket, or is suspended on the inner top wall of the vacuum chamber 7. The film thickness correction plate is provided with a fixing hole 19 for fixing with the bracket through bolts or screws. The film thickness correction plate can also be mounted on the inner side wall or the inner top wall of the vacuum chamber 7 in a movable manner.
[0060] In this embodiment, the edge portion of the glass substrate 12 exposed by the exposure hole is passed through by the collimated light 20 of the optical monitoring system, forming a similar coaxial structure, so that the optical monitoring system can directly monitor the center of the exposed portion; while the non-exposed hole portion of the film thickness correction plate retains the normal film thickness correction function of the existing film thickness correction plate, and the glass substrate 12 blocked by the film thickness correction plate is deviated from the setting of the optical monitoring system, that is, the glass substrate 12 blocked by the film thickness correction plate is not currently penetrated by the collimated light 20, and the portion of the glass substrate blocked by the film thickness correction plate is eccentrically set relative to the optical monitoring system, so that the optical monitoring system can directly monitor the edge of the blocked portion, and at the same time, the film thickness of the portion is corrected with the aid of the film thickness correction plate.
[0061] In this embodiment, the glass substrate 12 preferably rotates around the rotation axis 9 at a speed of 10 to 1200 rpm.
[0062] In this embodiment, the light emitted by the light source 8 of the optical monitoring system is coupled into the optical fiber, and becomes the collimated light 20 after passing through the optical fiber collimator 15, and is projected onto the glass substrate 12, and then penetrates the bottom plate of the vacuum chamber 7; the collimated light 20 penetrating the vacuum chamber 7 is reflected by the reflector 13 and then received by the detector 14. As an optimization and simplified setting, the reflector 13 can also be omitted, and the detector 14 can be moved to be coaxial with the collimated light 20, so that the detector 14 directly receives the collimated light 20 penetrating the vacuum chamber 7.
[0063] It should be noted that the attached Figure 5 The "20(21)" in the figure indicates that the part pointed by the guide line is the collimated light 20 or the central axis 21. Since the collimated light 20 and the central axis 21 are arranged in a manner that overlaps, the two are viewed as the same straight line from the figure. Figure 6The “21(18)” in the figure indicates that the position indicated by the guide line is the central axis 21 or the monitoring point 18. Since the figure shows that the monitoring point 18 is set on the central axis 21, the two are the same point in the figure.
[0064] The film thickness correction plate proposed in this embodiment exposes part of the edge of the glass substrate by setting an exposure hole, so that the center of the exposed edge can be directly monitored to reduce the center wavelength variation of the optical thin film filter, which is beneficial to improving the uniformity of the overall center wavelength distribution of the optical thin film filter.
[0065] At the same time, the optical direct monitoring coating equipment proposed in this embodiment has a reasonable structural arrangement. By setting the rotating axis at a position deviating from the central axis of the vacuum chamber and setting the optical direct monitoring point at or near the central axis of the vacuum chamber, and supplemented by a film thickness correction plate with an exposure hole, the same glass substrate can be simultaneously subjected to center direct monitoring and edge direct monitoring, ultimately achieving the purpose of small change in the center wavelength of the thin film filter in the monitored area and a large film forming area. It can not only ensure the high output rate of thin film optical filters and reduce production costs, but also ensure the consistency of the center wavelength distribution of optical thin film filters, effectively overcoming the current industry pain points of poor uniformity of the center wavelength of narrow-band filters and small effective film forming area, and can meet the higher wavelength uniformity requirements of existing optical systems for optical thin film filters, and has strong practicality.
[0066] It should be noted that it is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any figure mark in the claims should not be regarded as limiting the claims involved.
[0067] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.
Claims
1. An optical direct monitoring coating device, comprising a film thickness correction plate, a vacuum chamber and an optical monitoring system, characterized in that: The film thickness correction plate is used to be installed in front of the glass substrate. The film thickness correction plate is a circular correction plate. The film thickness correction plate is spaced apart from the glass substrate. The film thickness correction plate is provided with at least one exposure hole, and the exposure hole is used to expose the edge portion of the glass substrate so that the exposed edge portion can be directly monitored from the center. The non-exposed hole portion of the film thickness correction plate can completely cover the glass substrate in the radial direction of the glass substrate, wherein any of the exposed holes is a fan-shaped exposed hole with an opening angle of 0° to 360°, and the arc line of any of the fan-shaped exposed holes is located within the edge of the circular correction plate to ensure that the edge of the circular correction plate remains continuous; the center of the circular correction plate and the vertex of any of the fan-shaped exposed holes are located on the straight line where the rotation axis of the glass substrate is located, and the two side edges of the fan-shaped exposed hole are sawtooth lines or wavy lines; the rotation axis of the glass substrate deviates from the true The central axis of the empty chamber is set; the film thickness correction plate is installed in front of the glass substrate, and the exposure hole exposes the edge portion of the glass substrate; the collimated light formed in the optical monitoring system passes through the exposure hole and coincides with the central axis, so that the edge portion of the glass substrate exposed to the exposure hole is directly monitored by the optical monitoring system; the glass substrate blocked by the film thickness correction plate deviates from the collimated light so as to be directly monitored by the edge of the optical monitoring system; the glass substrate rotates around the rotation axis at a speed of 10 to 1200 rpm.
2. The optical direct monitoring coating device according to claim 1, characterized in that: The film thickness correction plate is installed on the inner top wall or inner side wall of the vacuum chamber through a bracket.
3. The optical direct monitoring coating device according to claim 1, characterized in that: The optical monitoring system includes a light source, an optical fiber, a fiber collimator connected to the optical fiber, and a detector; the light source and the detector are respectively located at two ends of the vacuum chamber in the axial direction, the light emitted by the light source is coupled into the optical fiber, and is converted into collimated light by the fiber collimator, and sequentially penetrates the glass substrate and the vacuum chamber; the detector is used to receive the collimated light that penetrates out of the vacuum chamber.
4. The optical direct monitoring coating device according to claim 3, characterized in that: The collimated light emission direction of the optical fiber collimator is perpendicular to the collimated light receiving direction of the detector, and a reflector for changing the collimated light emission path is arranged in front of the detector.
5. The optical direct monitoring coating device according to claim 3, characterized in that: The collimated light emission direction of the optical fiber collimator coincides with the collimated light receiving direction of the detector, and the detector can directly receive the collimated light penetrating out of the vacuum chamber.
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