Ultrasound probe

Abstract

Disclosed is an ultrasound probe for obtaining ultrasound images. The ultrasound probe includes: piezoelectric elements arranged in a plurality of rows along a transverse direction, the plurality of rows being arranged to form pairs of rows; a notch formed between the piezoelectric elements along the transverse direction; a first circuit layer disposed below the piezoelectric elements; a second circuit layer disposed spaced apart from a lower side of the first circuit layer and including a plurality of wirings extending along the rows, the second circuit layer being provided with a first region selectively contacting the piezoelectric elements and a second region disposed at an opposite end of the first region and folded back without contacting the piezoelectric elements; and a first connecting portion electrically connecting the first circuit layer and the second circuit layer, wherein when the plurality of wirings extending along one of the pair of rows extend from the first region to the second region, the first region is disposed such that the plurality of wirings are distributed to another adjacent row.

Description

[0001] This application is based on and claims the benefit of priority under 35 U.S.C. §119 from Korean Patent Application No. 10-2020-0048630 filed on April 22, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to an ultrasound probe for obtaining ultrasound images. Background Art

[0003] An ultrasonic imaging apparatus is an apparatus that transmits ultrasonic signals from a target body surface toward a target site in the body and noninvasively obtains a single-layer image of soft tissue or a blood flow image by using information of reflected ultrasonic signals (ultrasonic echo signals).

[0004] Compared to other imaging devices such as X-ray diagnostic equipment, X-ray CT scanners (computed tomography), magnetic resonance imaging (MRI) equipment, and nuclear medicine diagnostic equipment, ultrasound imaging equipment is small, inexpensive, can display in real time, is easy to use, and has a high level of safety because there is no radiation exposure.

[0005] Therefore, ultrasound imaging equipment has been widely used in the diagnosis of heart, abdomen, urinary system and obstetrics.

[0006] Generally, an ultrasonic imaging apparatus may include a main body and an ultrasonic probe for transmitting ultrasonic signals to an object to be diagnosed and receiving signals reflected from the object.

[0007] The ultrasound probe may have a structure in which an ultrasound signal transmitted from a piezoelectric layer inside the ultrasound probe passes through a lens provided in contact with an object and is transmitted to the object, and an ultrasound signal reflected and returned from the object passes through the lens again and is received.

[0008] In recent years, 1D (1-row) probes have been replaced by multi-row probes with 1.25D (3-row) or more rows. Multi-row probes allow for physically or electrically adjustable focus areas, enabling high-resolution images over a wider area.

[0009] To implement a multi-row probe, a stacked circuit structure can be provided beneath the piezoelectric layer. This stacked circuit structure can be implemented as a flexible printed circuit board (FPCB). When the stacked circuit structure is folded along the probe's axial direction at opposite ends of the piezoelectric layer, the circuit pattern on the stacked circuit structure may become disconnected (open). Summary of the Invention

[0010] An aspect of the present disclosure is to provide an ultrasound probe including a plurality of piezoelectric elements forming a plurality of rows along a height direction.

[0011] Another aspect of the present disclosure is to provide an ultrasound probe that is capable of preventing disconnection (open circuit) caused by folding of multiple wirings corresponding to multiple piezoelectric elements, and is capable of forming a circuit pattern on a stacked circuit structure included in a flexible printed circuit board (FPCB) provided under the piezoelectric elements.

[0012] Additional aspects of the disclosure will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosure.

[0013] According to one aspect of the present disclosure, an ultrasound probe includes: piezoelectric elements forming a plurality of rows along a transverse direction, the plurality of rows being arranged to form pairs of rows; cutouts formed between the piezoelectric elements along the transverse direction; a first circuit layer disposed below the piezoelectric elements; a second circuit layer disposed to be spaced apart from below the first circuit layer and including a plurality of wirings extending along the paired rows, the second circuit layer being provided with a first area and a second area, the first area selectively contacting the piezoelectric elements, the second area being disposed at opposite ends of the first area and folded over without contacting the piezoelectric elements; and a first connecting portion for electrically connecting the first circuit layer and the second circuit layer, wherein, when the plurality of wirings extending along one row of the paired rows extend from the first area to the second area, the first area is configured so that the plurality of wirings are distributed to another adjacent row.

[0014] The second circuit layer may be arranged such that a plurality of the wirings are parallel in a single layer.

[0015] The piezoelectric elements may form a plurality of columns along a height direction, and the plurality of wirings may respectively correspond to the pairs of rows.

[0016] The first region of the second circuit layer may include a plurality of sub-circuit layers stacked in an axial direction, and each of the plurality of wirings may be formed in each of the plurality of sub-circuit layers.

[0017] The second circuit layer may further include a collection layer in which a plurality of the wirings are collected into a layer in the second region and extend from the second region.

[0018] The ultrasound probe may further include: a second connecting portion for connecting each of the plurality of sub-circuit layers to the collection layer.

[0019] A plurality of the wirings may be distributed from the second region, and the second connection portion may be formed in the folded second region.

[0020] The first region may include a first edge region and a second edge region, the first edge region is formed at one end of the first region adjacent to the second region, the second edge region is formed at the other end of the first region adjacent to the second region, and the plurality of wirings may be distributed from at least one of the first edge region and the second edge region.

[0021] The second connection portion may be formed in at least one of the first edge region and the second edge region.

[0022] The plurality of wirings extending along one row of the pair of rows may be distributed along a first direction from the first edge area, and the plurality of wirings extending along the other row of the pair of rows may be distributed along a second direction from the second edge area, and the first direction and the second direction may be parallel to the direction along which the second circuit layer is folded.

[0023] The first direction and the second direction may be opposite to each other.

[0024] A circuit pattern formed by the plurality of wirings may be formed in point symmetry with respect to a center of the first region.

[0025] The distance between the plurality of wirings widens while the plurality of wirings are distributed to the first edge region or the second edge region, and the distance between the plurality of wirings in the second region is greater than the distance between the plurality of wirings in the first region.

[0026] At least one of the first connection portion and the second connection portion may include a conductive hole, and the conductive hole is filled with a conductive material and connects the plurality of wirings formed in the second circuit layer with wirings formed in the first circuit layer.

[0027] The ultrasound probe may further include a reinforcement layer disposed between the piezoelectric element and the first circuit layer.

[0028] At least one of the first connection portion and the second connection portion may electrically connect the first circuit layer with the second circuit layer or the second circuit layer with the collection layer through at least one of conductive paste, conductive plating, sputtering, or printing.

[0029] According to another aspect of the present disclosure, an ultrasound probe includes a piezoelectric element and a second circuit layer, wherein the piezoelectric element forms a plurality of rows along a lateral direction and a plurality of columns along a height direction, the plurality of rows being arranged to form pairs of rows, the second circuit layer being arranged below the piezoelectric element and including a plurality of wirings corresponding to the plurality of columns and extending from the plurality of columns along the rows, the second circuit layer being provided with a first area and a second area, the first area selectively contacting the piezoelectric element, the second area being provided at opposite ends of the first area and folded up without contacting the piezoelectric element, wherein when the plurality of wirings extending along one row of the pair of rows extend from the first area to the second area, the first area is provided so that the plurality of wirings are distributed to another adjacent row.

[0030] The second circuit layer may further include a collection layer in which a plurality of the wirings are collected into a layer in the second region and extend from the second region.

[0031] The ultrasonic probe may further include a connection portion for connecting each of the plurality of sub-circuit layers to the collection layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] These and / or other aspects of the present disclosure will become more apparent and easier to understand through the following description of embodiments with reference to the accompanying drawings, in which:

[0033] Figure 1 is a perspective view of an ultrasonic imaging apparatus according to an embodiment;

[0034] Figure 2 is an external view of an ultrasound probe including a multi-dimensional array transducer according to an embodiment;

[0035] Figure 3 is a perspective view showing a schematic structure of an ultrasound probe according to an embodiment;

[0036] Figure 4 is a cross-sectional view of a plane along an axial direction and a transverse direction of an ultrasonic probe according to an embodiment;

[0037] Figure 5 is a cross-sectional view of a plane along an axial direction and a height direction of an ultrasonic probe according to an embodiment;

[0038] Figure 6 is a diagram for explaining an arrangement relationship of a first connection portion between a first circuit layer and a second circuit layer according to an embodiment;

[0039] Figure 7 is a diagram for explaining a first connection portion and a second connection portion according to an embodiment;

[0040] Figure 8 and Figure 9 is a diagram showing the interior of the ultrasonic probe according to the embodiment as viewed from the axial direction;

[0041] Figure 10 and Figure 11 is a diagram showing the interior of an ultrasonic probe according to another embodiment, viewed from the axial direction; and

[0042] Figure 12 and Figure 13 They are schematically shown according to Figure 10 and Figure 11 Schematic diagram of a cross section of an odd element X of an ultrasound probe. DETAILED DESCRIPTION

[0043] The embodiments described in this specification and the configurations shown in the drawings are merely preferred embodiments of the present disclosure, and therefore it should be understood that various modified examples that can replace the embodiments described in this specification and the drawings are possible when the present application is filed.

[0044] The same reference numerals or symbols in the various drawings of this application represent parts or components that perform substantially the same function.

[0045] The terms used herein are for the purpose of describing the embodiments and are not intended to constrain and / or limit the present disclosure. For example, unless the context clearly indicates otherwise, singular expressions herein may include plural expressions. In addition, the terms "including" and "having" are intended to indicate the presence of the features, quantities, steps, operations, elements, parts, or combinations thereof described in the specification, and do not exclude the presence or addition of one or more other features, quantities, steps, operations, elements, parts, or combinations thereof.

[0046] Throughout the specification, when a member is described as being "on" another member, this includes not only a case where the one member is adjacent to the other member but also a case where another member is placed between the two members.

[0047] It should be understood that although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms, and these terms are only used to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of this disclosure. The term "and / or" includes any combination of multiple related items or any one of the multiple related items.

[0048] The terms “front end,” “rear end,” “upper,” “lower,” “upper end,” and “lower end” used in the following description are defined with reference to the drawings, and the shape and position of each component are not limited by these terms.

[0049] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0050] Figure 1 is a perspective view of an ultrasonic imaging apparatus according to an embodiment.

[0051] Reference Figure 1 The ultrasonic imaging apparatus 10 includes an ultrasonic probe 100 configured to transmit an ultrasonic signal to a subject, receive an echo ultrasonic signal from the subject, and convert the echo ultrasonic signal into an electrical signal; and a main body 200 configured to generate an ultrasonic image based on the echo ultrasonic signal. The main body 200 may be connected to the ultrasonic probe 100 via a wired communication network or a wireless communication network. The main body 200 may be a workstation including a display 300 and an input device 400.

[0052] The ultrasound probe 100 includes: a transducer module 110, which is arranged in the housing h to radiate ultrasonic waves onto the object ob, receive echo ultrasonic waves reflected from the object ob, and convert electrical signals and ultrasonic waves into each other; an insert connector 160, which is physically coupled to the female connector 201 of the main body 200 to send signals to the main body 200 and receive signals from the main body 200; and a cable 170 for connecting the insert connector 160 and the transducer module 110.

[0053] The object ob may be a living body of a human or animal, or in vivo tissues such as blood vessels, bones, muscles, etc., but is not limited thereto, and any object may become the object ob as long as its internal structure can be imaged by the ultrasonic imaging apparatus 10 .

[0054] The ultrasound probe 100 may be connected to the main body 200 through a wireless communication network to receive various signals required to control the ultrasound probe 100 or transmit an analog signal or a digital signal corresponding to an echo ultrasound signal received by the ultrasound probe 100 to the main body 200. A wireless communication network refers to a communication network that can wirelessly transmit and receive signals.

[0055] The echo ultrasonic wave is an ultrasonic wave reflected from the object ob irradiated with ultrasonic waves, and has various frequency bands or energy intensities for generating various ultrasonic images according to a diagnosis mode.

[0056] The transducer module 110 can generate ultrasonic waves based on the applied AC power. Specifically, the transducer module 110 can receive AC power from an external power supply device or an internal power storage device (such as a battery). The vibrator of the transducer module 110 can generate ultrasonic waves by vibrating based on the received AC power.

[0057] Three directions perpendicular to each other relative to the center of the transducer module 110 may be defined as an axial direction A, a lateral direction L, and a height direction E. Specifically, the direction along which ultrasonic waves are radiated may be defined as the axial direction A, the direction along which the transducer modules 110 form a horizontal row may be defined as the lateral direction L, and the remaining direction perpendicular to the axial direction A and the lateral direction L may be defined as the height direction E. The transducer modules 110 may also form a plurality of rows in the height direction E, and in this case, a multi-row array layout may be formed.

[0058] One end of the cable 170 is connected to the transducer module 110 , and the other end of the cable 170 is connected to the inserting connector 160 , thereby connecting the transducer module 110 and the inserting connector 160 .

[0059] The male connector 160 may be physically coupled to the female connector 201 of the body 200 by being connected to the other end of the cable 170 .

[0060] The insert connector 160 transmits an electrical signal generated by the transducer module 110 to the physically coupled female connector 201 , or receives a control signal generated by the main body 200 from the female connector 201 .

[0061] Hereinafter, the configuration of the ultrasound probe will be described in more detail.

[0062] Figure 2 is an external view of an ultrasound probe including a multi-dimensional array transducer according to an embodiment.

[0063] The ultrasound probe 100, as a portion in contact with the surface of an object, can transmit and receive ultrasound signals. Specifically, the ultrasound probe 100 can be used to transmit an ultrasound signal to a specific portion inside the object based on a transmission signal received from the main body 200, and receive an echo ultrasound signal reflected from the specific portion inside the object and transmit the echo ultrasound signal to the main body 200. The echo ultrasound signal may be an ultrasound signal that is a radio frequency (RF) signal reflected from the object, but is not limited thereto. The echo ultrasound signal may include any signal resulting from the reflection of the ultrasound signal transmitted to the object.

[0064] The subject may be a living body of a human or an animal, but is not particularly limited thereto, and any subject may be the subject as long as its internal structure can be imaged by an ultrasonic signal.

[0065] The ultrasound probe 100 may include a transducer array for converting electrical signals and ultrasound signals into each other to transmit the ultrasound signals to the interior of an object. The transducer array may be composed of a single transducer element or a plurality of transducer elements.

[0066] The ultrasound probe 100 may generate an ultrasound signal through the transducer array to transmit the ultrasound signal to a target portion as a focus inside the object, and may receive an echo ultrasound signal reflected from the target portion inside the object through the transducer array.

[0067] When the echoed ultrasonic signal reaches the transducer array, the transducer array may vibrate at a predetermined frequency corresponding to the frequency of the echoed ultrasonic signal, thereby outputting an AC current having a frequency corresponding to the vibration frequency of the transducer array. Thus, the transducer array may convert the received echoed ultrasonic signal into an echo signal (as a predetermined electrical signal).

[0068] Each of the transducer elements that make up the transducer array can convert ultrasonic signals into electrical signals. To this end, the transducer elements can be implemented as magnetostrictive ultrasonic transducers that use the magnetostrictive effect of a magnetic body, or capacitive micromachined ultrasonic transducers (hereinafter abbreviated as cMUTs) that transmit and receive ultrasonic waves using the vibration of hundreds or thousands of finely processed thin films.

[0069] The transducer modules 110 of the ultrasound probe 100 may be arranged linearly or as Figure 2 Although the basic operating principle of the ultrasound probe 100 is the same in the above two cases, in the ultrasound probe 100 in which the transducer module 110 is arranged as a curved surface, the ultrasound signal radiated from the transducer module has a fan-shaped shape, so that the generated ultrasound image may also have a fan-shaped shape.

[0070] The transducer module 110 according to the embodiment may be configured as a matrix probe. In this case, the transducer module 110 may include a multi-row multi-dimensional transducer array having a plurality of rows.

[0071] For example, when the transducer module 110 includes a two-dimensional transducer array, the interior of the object can be imaged in three dimensions. However, the present disclosure is not limited thereto, and the ultrasound probe 100 may be configured in accordance with a plurality of other configurations except for the configuration of the transducer module 110. Figure 2 Other forms of arrangement than those shown in FIG. 1 are known in the art.

[0072] In the following, reference will be made to Figure 3 An internal configuration of a transducer module implemented using a piezoelectric ultrasonic transducer element according to an embodiment is described in more detail.

[0073] Figure 3 is a perspective view showing a schematic structure of an ultrasound probe according to the embodiment.

[0074] Reference Figure 3The ultrasound probe 100 according to the embodiment includes: a piezoelectric layer 111; a sound absorbing layer 112 disposed below the piezoelectric layer 111; a matching layer 113 disposed above the piezoelectric layer 111; and a lens layer 101 disposed above the matching layer 113. The ultrasound probe 100 also includes one or more cutouts 118a and 118b formed in the piezoelectric layer 111 to separate the piezoelectric layer 111 into a plurality of piezoelectric elements 111a and 111b.

[0075] In this case, the cutouts 118 a and 118 b refer to spaces that are formed by a cutting process and divide the piezoelectric layer 111 into the plurality of piezoelectric elements 111 a and 111 b .

[0076] like Figure 3 As shown in FIG, a first notch 118a may be formed between the plurality of piezoelectric elements 111a and 111b along the lateral direction L of the ultrasound probe 100. A second notch 118b may be formed between the plurality of piezoelectric elements 111a and 111b along the height direction E of the transducer module 110. In the following description, the notches are generally defined with reference to the first notch 118a.

[0077] When the second cutouts 118 b are formed between the plurality of piezoelectric elements 111 a and 111 b along the height direction E of the ultrasound probe 100 , the ultrasound probe 100 may form an array layout of multiple rows and columns.

[0078] When the first cutout 118a is formed between the plurality of piezoelectric elements 111a and 111b along the transverse direction L of the ultrasonic probe 100 and the second cutout 118b is formed between the plurality of piezoelectric elements 111a and 111b along the height direction E of the ultrasonic probe 100, as described above with reference to Figure 2 As described, the ultrasound probe 100 may form a multi-dimensional transducer array layout, and may form a two-dimensional M×N matrix layout.

[0079] In addition, each cross section of the ultrasound probe 100 may be described based on three directions at right angles with respect to the inner center of the ultrasound probe 100 .

[0080] Figure 4 is a cross-sectional view of a plane along the axial direction and the transverse direction of the ultrasound probe according to the embodiment, and Figure 5 is a cross-sectional view of a plane along the axial direction and the height direction of the ultrasonic probe according to the embodiment.

[0081] Reference Figure 4 and Figure 5 , the ultrasonic transducer module 110 according to the embodiment includes a piezoelectric layer 111 , a sound absorbing layer 112 disposed below the piezoelectric layer 111 , and a matching layer 113 disposed above the piezoelectric layer 111 .

[0082] The piezoelectric layer 111 is made of a piezoelectric body (piezoelectric material). When an electric signal is applied to generate ultrasonic waves, the piezoelectric body converts the electric signal into mechanical vibration. The piezoelectric body can be stacked in a single layer structure or a multi-layer structure.

[0083] The effects of generating voltage when mechanical pressure is applied to a predetermined material and causing mechanical deformation when voltage is applied are respectively called piezoelectric effect and inverse piezoelectric effect, and materials having the piezoelectric effect and inverse piezoelectric effect are called piezoelectric bodies (piezoelectric materials).

[0084] That is, a piezoelectric body (piezoelectric material) refers to a material that converts electrical energy into mechanical vibration energy and converts mechanical vibration energy into electrical energy.

[0085] The piezoelectric body (piezoelectric material) may include lead zirconate titanate (PZT) ceramics, PZNT single crystals made from a solid solution of lead magnesium niobate and lead titanate, etc. The piezoelectric layer 111 can also radiate mechanical vibration energy as ultrasonic waves in the direction along which the lens is provided (hereinafter referred to as the "front") and in the direction along which the sound absorbing layer 112 is provided (hereinafter referred to as the "and").

[0086] The piezoelectric layer 111 may be processed into a multi-dimensional array in a matrix form with a plurality of rows through a cutting process. In this case, the piezoelectric layer 111 may be divided into a plurality of piezoelectric elements 111a through the cuts 118a and 118b.

[0087] The sound absorbing layer 112 is disposed below the piezoelectric layer 111 and absorbs ultrasonic waves generated in the piezoelectric layer 111 and traveling backward, thereby preventing the ultrasonic waves from propagating to the rear of the piezoelectric layer 111. Therefore, the sound absorbing layer 112 can prevent image distortion. Furthermore, the sound absorbing layer 112 can have an acoustic impedance lower than that of the piezoelectric layer 111. For example, the sound absorbing layer 112 can be made of a material having an acoustic impedance of 2MRay1 to 5MRay1. Furthermore, the sound absorbing layer 112 can be formed using multiple layers to improve the attenuation or blocking effect of ultrasonic waves.

[0088] Matching layer 113 is disposed above piezoelectric layer 111. Matching layer 113 may include a first matching layer 113a and a second matching layer 113b. First matching layer 113a and second matching layer 113b are layers that transmit ultrasonic waves to an object or reduce the loss of ultrasonic waves received from the object by appropriately matching the acoustic impedance of piezoelectric layer 111 with the acoustic impedance of the object. The acoustic impedance of the object and the acoustic impedance of piezoelectric layer 111 can be matched by adjusting physical parameters of first matching layer 113a and second matching layer 113b, such as acoustic velocity, thickness, and acoustic impedance. In other words, first matching layer 113a and second matching layer 113b suppress reflection of ultrasonic waves caused by the difference between the acoustic impedance of the object and the acoustic impedance of piezoelectric layer 111. Figure 5The matching layer is shown as being formed of two layers, but is not limited thereto. A matching layer formed of one layer or three or more layers may be used instead of the first matching layer 113a and the second matching layer 113b. The first matching layer 113a and the second matching layer 113b are divided into a plurality of elements and may be provided on top of the piezoelectric layer 111.

[0089] The matching layer 113 reduces a difference in acoustic impedance between the piezoelectric layer 111 and the object ob to match the acoustic impedance of the piezoelectric layer 111 with that of the object ob, so that ultrasonic waves generated in the piezoelectric layer 111 are effectively transmitted to the object ob.

[0090] To this end, the matching layer 113 may be formed using a material having an acoustic impedance smaller than that of the piezoelectric layer 111 and larger than that of the object ob.

[0091] The matching layer 113 may be formed of glass or resin material.

[0092] In addition, a plurality of matching layers 113 may be provided so that the acoustic impedance may change stepwise from the piezoelectric layer 111 toward the object ob, and materials of the plurality of matching layers 113 may be different from each other.

[0093] Similar to the piezoelectric layer 111 , the matching layer 113 can be processed into a multi-dimensional array in a matrix form through a cutting process, and can also be processed into a one-dimensional array form.

[0094] The lens layer 101 may be provided to cover the top of the matching layer 113. The lens layer 101 focuses ultrasonic waves traveling forward from the layers of the transducer module 110 to a specific point.

[0095] The lens layer 101 may be formed of a material having strong wear resistance and high ultrasonic propagation speed to focus ultrasonic waves and protect the acoustic module (specifically, the piezoelectric layer 111). The lens layer 101 may have a convex shape in the direction of ultrasonic radiation to focus ultrasonic waves, and may be implemented in a concave shape when the sound speed is slower than that of the object ob.

[0096] In the disclosed embodiments, the case where one of the lens layers 101 is formed below the matching layer 113 is described as an example, but a plurality of lens layers 101 having different physical properties may be formed.

[0097] The ultrasonic transducer module 110 according to the embodiment may further include a first circuit layer 114 and a second circuit layer 115 disposed between the piezoelectric layer 111 and the sound absorbing layer 112 .

[0098] The first and second circuit layers 114 and 115 may include electrodes to which electrical signals may be applied. In this case, the first and second circuit layers 114 and 115 may include at least one of a signal electrode (not shown) for receiving current and a ground electrode (not shown) for transmitting current.

[0099] To this end, at least one of the first circuit layer 114 and the second circuit layer 115 may be implemented as a printed circuit board (PCB).

[0100] In addition, at least one of the first circuit layer 114 and the second circuit layer 115 may be implemented as a flexible printed circuit board (FPCB).

[0101] The second circuit layer 115 may be formed to be spaced apart from the first circuit layer 114 , and may be formed to be spaced apart from the first circuit layer 114 based on a predetermined interval.

[0102] Various configurations may be provided between the first circuit layer 114 and the second circuit layer 115. For example, an insulating layer 119 may be provided between the first circuit layer 114 and the second circuit layer 115.

[0103] The insulating layer 119 may prevent the first circuit layer 114 and the second circuit layer 115 from directly contacting each other. To this end, the insulating layer 119 may be made of a non-conductive material.

[0104] For example, the insulating layer 119 may be formed using epoxy resin. Since epoxy resin can provide an adhesive function, the first circuit layer 114 and the second circuit layer 115 may be bonded to each other through the insulating layer 119 made of epoxy resin.

[0105] As an example, the disclosed embodiment describes a case where the insulating layer 119 is disposed between the first circuit layer 114 and the second circuit layer 115 , but the positions of the first circuit layer 114 , the second circuit layer 115 , and the insulating layer 119 are not limited to the above example and may be disposed at various positions.

[0106] Furthermore, in addition to the insulating layer 119 , one or more circuit layers may be disposed between the first circuit layer 114 and the second circuit layer 115 .

[0107] Electrodes may be formed on the top and bottom of the piezoelectric layer 111 so that an electrical signal transmitted from the first circuit layer 114 is transmitted to the piezoelectric layer 111. The electrodes formed on the top and bottom may be provided as ceramic electrodes.

[0108] The electrodes can be arranged in a round type method (see Figure 12 and 13 ) is formed, provided with a lower electrode of the piezoelectric body 111 electrically connected to the first circuit layer 114, and an upper electrode of the piezoelectric layer 111 formed to surround the top of the piezoelectric layer 111 and the side surface of the piezoelectric layer 111. In this case, the upper electrode can be electrically connected to a ground electrode (GND) provided on the PCB.

[0109] Optionally, although not shown in the drawings, the upper electrode does not need to be provided as a ground electrode (GND) on the PCB as in the above-mentioned circular method, and can be formed according to a one-step bonding type method (not shown) in which the upper electrode formed on top of the piezoelectric layer 111 is extended to form a ground electrode (GND).

[0110] The ultrasound probe 100 according to an embodiment may further include a reinforcement layer 117. The reinforcement layer 117 may reflect ultrasonic waves generated by the piezoelectric layer 111. The reinforcement layer 117 may be disposed below the piezoelectric layer 111 and above the first circuit layer 114, and may be formed to be in direct contact with or spaced apart from the piezoelectric layer 111. In other words, the reinforcement layer 117 may be disposed between the piezoelectric layer 111 and the first circuit layer 114, and may be configured such that an electrical signal transmitted from the first circuit layer 114 is transmitted to the piezoelectric layer 111. The reinforcement layer 117 may be made of a conductive material.

[0111] The transducer module 110 may be formed with one or more cutouts 118 a and 118 b through a cutting process, and may include a plurality of piezoelectric elements 111 a .

[0112] like Figure 4 As shown in FIG, the transducer module 110 may include first cutouts 118a formed between the piezoelectric elements 111a along the transverse direction L. The first cutouts 118a may be regularly formed at predetermined intervals. However, the first cutouts 118a are not limited thereto and may be formed at different intervals.

[0113] The Mth row in the two-dimensional M×N matrix layout can be defined as a pair of rows with two matrices. In the following, the transducer elements consisting of a pair of rows are defined as a basic element pair. Details related to the basic element pair will be described later.

[0114] In the case of the first cutout 118 a , the formation depth of the first cutout 118 a may vary depending on the formation position based on transducer elements (base element pairs) formed by paired rows to be described later.

[0115] The first cutout 118a can be divided into a first cutout 118a-1 ( Figures 8 to 11 ) is formed between the pair of base elements and the second cutout 118a-2 ( Figures 8 to 11 ) is formed between two basic element pairs that are to be formed in different forms.

[0116] In the case where the first cutout 118a - 1 is formed between the base element pair, the first cutout 118a - 1 may be formed to separate at least one of the matching layer 113 , the reinforcement layer 117 , the first circuit layer 114 , the second circuit layer 115 , the insulating layer 119 , and the piezoelectric layer 111 .

[0117] When the cutouts 118a and 118b are formed to have a width smaller than the diameter of the connection portion 116, the cutouts 118a and 118b may pass through the connection portion 116. Therefore, when the first cutout 118b-1 is formed between the pair of base elements, the first cutout 118b-1 may be formed to separate the second circuit layer 115 because there is no risk of disconnection of the first circuit layer 115.

[0118] To this end, the first cutout 118 a - 1 may be formed to extend from the top surface of the piezoelectric element 111 a to a specific position of any one of the matching layer 113 , the reinforcement layer 117 , the first circuit layer 114 , the second circuit layer 115 , and the insulating layer 119 .

[0119] In the second incision 118a-2 ( Figures 8 to 11 ) is formed between two rows of basic element pairs, the second cutout 118a-2 may be formed to separate at least one of the matching layer 113, the reinforcement layer 117, the first circuit layer 114, the insulating layer 119, and the piezoelectric layer 111. That is, the second cutout 118a-2 may not be formed on the second circuit layer 115.

[0120] like Figure 5 As shown in FIG, the transducer module 110 may include second cutouts 118b formed between the piezoelectric elements along the height direction E. The second cutouts 118b may be regularly formed at predetermined intervals. However, the second cutouts 118b are not limited thereto and may be formed at different intervals.

[0121] In this case, the second cutout 118b may be formed to separate at least one of the matching layer 113, the reinforcement layer 117, the first circuit layer 114, the insulating layer 119, and the piezoelectric layer 111. To this end, the second cutout 118b may be formed to extend from the top surface of the piezoelectric element 111a to a specific position of any one of the matching layer 113, the reinforcement layer 117, the first circuit layer 114, and the insulating layer 119. In this case, since the second cutout 118b may not be formed to pass through the second circuit layer 115, the second cutout 118b may prevent the second circuit layer 115 from being electrically disconnected.

[0122] Figure 6 is a diagram for explaining an arrangement relationship of a first connection portion between a first circuit layer and a second circuit layer according to an embodiment, and Figure 7 1 is a diagram for explaining a first connection portion and a second connection portion according to an embodiment.

[0123] The connection portion 116 according to an embodiment of the present disclosure may include a first connection portion 116a and a second connection portion 116b (see FIG. Figures 8 to 11 ). The first connection portion 116a and the second connection portion 116b electrically connect the layers in the same manner. Figure 6 and Figure 7 The first connection portion 116a connecting the first circuit layer 114 and the second circuit layer 115 shown in FIG. 1 is described.

[0124] Reference Figure 6 and Figure 7 The ultrasound probe 100 according to the embodiment includes a piezoelectric layer 111, a sound absorbing layer 112 provided below the piezoelectric layer 111, a matching layer 113 provided above the piezoelectric layer 111, a first circuit layer 114 and a second circuit layer 115, a reinforcement layer 117, an insulating layer 119, and a second cutout 118b formed between the piezoelectric elements along the height direction E, and further includes a connecting portion 116 connecting the first circuit layer 114 and the second circuit layer 115.

[0125] The connection portion 116 may include a via hole 116-3. The connection portion 116 may be formed by a process for forming the via hole 116-3, and the via hole 116-3 may be formed by various processes including a laser hole drilling process or an etching process.

[0126] The connection portion 116 can electrically connect the first circuit layer 114 and the second circuit layer 115 by at least one of conductive paste, conductive plating, sputtering, and printing. However, the present disclosure is not limited to the above example, and the first circuit layer 114 and the second circuit layer 115 can be electrically connected by various connection methods. In this case, the via hole 116-3 can be implemented as a conductive hole. For example, the via hole 116-3 can be implemented as a conductive hole formed by plating or processing with a conductive material such as gold, silver, and copper, but is not limited to the above example.

[0127] The connection portion 116 may be formed to extend from the first circuit layer 114 to the second circuit layer 115. The connection portion 116 may be formed to pass through the first circuit layer 114 and the second circuit layer 115. In this case, the via hole 116-3 may be implemented in the form of a through hole.

[0128] The connection portion 116 may also be formed to pass through only one of the first circuit layer 114 and the second circuit layer 115. In this case, the via hole 116-3 may be implemented in the form of a blind hole.

[0129] The connection portion 116 may also be formed such that the interior of the via hole is filled with a predetermined amount of conductive material. In this case, the via hole 116-3 may be implemented in the form of a filled-type via hole.

[0130] like Figure 7 As shown in FIG, the connection portion 116 may be formed to connect the circuit patterns P1 and P2, which are formed using conductive wiring formed on the first circuit layer 114 and the second circuit layer 115. As will be described later, each of the circuit patterns P1 and P2 may include multiple wirings. Therefore, connecting the circuit patterns P1 and P2 means connecting each wiring. The connection portion 116 may include a via hole 116-3 that connects the first circuit layer 114 and the second circuit layer 115.

[0131] The connection portion 116 may electrically connect the first circuit layer 114 and the second circuit layer 115. To this end, the connection portion 116 may contact the first circuit layer 114 and the second circuit layer 115 at opposite ends thereof.

[0132] Specifically, the connection portion 116 may contact the first circuit layer 114 and the second circuit layer 115 at opposite ends of the connection portion 116 by being connected to the first circuit pattern P1 formed on the first circuit layer 114 and the second circuit pattern P2 formed on the second circuit layer 115. That is, the connection portion 116 may be connected to both ends of the wiring of the first circuit pattern P1 and the wiring of the second circuit pattern P2 formed on the second circuit layer 115, which correspond thereto.

[0133] In this case, each of the first circuit pattern P1 and the second circuit pattern P2 may include an electrode and may be implemented as a conductive material such as copper. Figure 8 In addition to the embodiment shown in FIG. 1 , the first circuit pattern P1 and the second circuit pattern P2 may have wirings in various forms or shapes.

[0134] The connection portion 116 may include a first substrate connection portion 116-1 located on the first circuit pattern P1 and a second substrate connection portion 116-2 located on the second circuit pattern P2. The connection portion 116 may contact the first circuit layer 114 through the first substrate connection portion 116-1 and may contact the second circuit layer 115 through the second substrate connection portion 116-2.

[0135] The first substrate connection portion 116-1 may be formed to have the same size as the via hole 116-3. However, the first substrate connection portion 116-1 is not limited thereto and may be formed to have a size larger or smaller than the via hole 116-3.

[0136] The first substrate connection portion 116-1 may have a circular shape when viewed from vertically above the first circuit layer 114. Depending on the embodiment, the first substrate connection portion 116-1 may have a polygonal shape such as a triangle and a square, or may have a shape such as an ellipse. The first substrate connection portion 116-1 may be formed on the first circuit layer 114 by perforating the first circuit layer 114 using a perforating device such as a drilling tool.

[0137] The second substrate connection portion 116-2 may be formed to have a larger size than the via hole 116-3. That is, the diameter of the second substrate connection portion 116-2 may be larger than the diameter of the via hole 116-3. In this case, when the first substrate connection portion 116-1 has the same size as the via hole 116-3, the diameter of the second substrate connection portion 116-2 may be larger than the diameter of the first substrate connection portion 116-1. However, the size of the second substrate connection portion 116-2 is not limited to the above example and may be formed to have the same size as the via hole 116-3, or may be formed to have a smaller size than the via hole 116-3.

[0138] The second substrate connection portion 116-2 may have a circular shape when viewed from vertically above the second circuit layer 115. Depending on the embodiment, the second substrate connection portion 116-2 may have a polygonal shape such as a triangle and a square, or may have a shape such as an ellipse. The second substrate connection portion 116-2 may be formed on the second circuit layer 115 by perforating the second circuit layer 115 using a perforating device such as a drilling tool.

[0139] Figure 8 and Figure 9 is a diagram showing the interior of the ultrasonic probe according to the embodiment viewed from the axial direction, Figure 10 and Figure 11 is a diagram showing the interior of an ultrasonic probe according to another embodiment viewed from the axial direction, and Figure 12 and Figure 13 They are schematically shown according to Figure 10 and Figure 11 Hereinafter, the plurality of piezoelectric elements 111a and 111b formed in a two-dimensional M×N matrix layout will be described in detail.

[0140] As described above, when the first cutout 118a is formed between the plurality of piezoelectric elements 111a and 111b along the transverse direction L of the ultrasonic probe 100 and the second cutout 118b is formed between the plurality of piezoelectric elements 111a and 111b along the height direction E of the ultrasonic probe 100, as described above with reference to Figure 2As described, the ultrasound probe 100 may form a multi-dimensional transducer array layout, and may form a two-dimensional M×N matrix layout. Hereinafter, one of the Mth row is defined as a transducer element.

[0141] The Mth row in a two-dimensional M×N matrix layout can be defined as a pair of two matrices. Hereinafter, the transducer elements consisting of a pair of rows are defined as a basis element pair. Furthermore, the transducer elements in one row of a basis element pair are defined as odd elements X, and the transducer elements in the other row are defined as even elements Y.

[0142] Reference Figures 8 to 11 In the ultrasound probe 100 according to the embodiment of the present disclosure, the first slit 118 a and the second slit 118 b are formed along the transverse direction L between the plurality of piezoelectric elements (described as 111 a and 111 b for convenience).

[0143] The plurality of piezoelectric elements 111a and 111b may be arranged in a multi-dimensional transducer array layout (ie, a two-dimensional M×N matrix layout). Thus, the plurality of piezoelectric elements may be defined based on the basic element pairs, odd elements X, and even elements Y defined above.

[0144] The plurality of piezoelectric elements 111 a included in the odd element X may be defined as odd-numbered rows of piezoelectric elements 111 a , and the plurality of piezoelectric elements 111 b included in the even element Y may be defined as even-numbered rows of piezoelectric elements 111 b .

[0145] In the following, reference will be made to Figures 8 to 11 The second circuit layer 115 electrically connected to the plurality of piezoelectric elements 111 a and 111 b is described in detail.

[0146] Reference Figure 8 , the second circuit layer 115 may be provided at the lower ends of the plurality of piezoelectric elements 111a and 111b indicated by dotted lines. Figures 4 to 6 As shown in FIG, the second circuit layer 115 may be provided below the first circuit layer 114 to be spaced apart from each other. An insulating layer 119 may be additionally provided between the first circuit layer 114 and the second circuit layer 115. However, in describing FIG showing the interior of the ultrasound probe 100 viewed from the axial direction, Figure 8 and Figure 11 When describing the structure other than the plurality of piezoelectric elements 111 a and 111 b , the second circuit layer 115 , and the connection portion 116 , descriptions thereof will be omitted.

[0147] In addition, in the description Figure 12 and Figure 13 When the structure other than the plurality of piezoelectric elements 111a, the first circuit layer 114, the second circuit layer 115 and the connection portion 116 is omitted (see FIG. Figure 12 and Figure 13Description of the figure mark C).

[0148] Reference Figures 8 to 11 , a plurality of circuit patterns may be formed on the second circuit layer 115. The circuit pattern may include the second circuit pattern P2 formed on the second circuit layer 115. The second circuit pattern P2 may include a plurality of wirings. The specific structure of the plurality of wirings will be described later.

[0149] The second circuit layer 115 may be divided into a first region 600 and a second region 700 .

[0150] The first region 600 may be disposed to selectively contact the plurality of piezoelectric elements 111a and 111b. That is, the first region 600 may be defined as a region in which electrical energy is converted into mechanical vibration energy and mechanical vibration energy is converted into electrical energy.

[0151] When viewed from vertically above piezoelectric elements 111a and 111b, first region 600 of second circuit layer 115 may be formed on second substrate connection portion 116-2 through which via hole 116-3 of connection portion 116 is connected to second pattern P2 of second circuit layer 115.

[0152] The second pattern P2 of the second circuit layer 115 may be formed to have various shapes, and may be formed to have a wiring structure for at least one piezoelectric element through the via hole 116 - 3 .

[0153] Hereinafter, a specific shape of the second circuit pattern P2 formed in the first region 600 of the second circuit layer 115 will be described.

[0154] like Figure 8 and Figure 11 As shown in , when the transducer module 110 forms an ultrasonic 5×4 array in the EL plane, the second pattern P2 can be formed to connect the piezoelectric elements located in the second and fourth columns and the piezoelectric elements located in the first and fifth columns, and the piezoelectric elements located in the third column can be formed to have separate wiring. When the transducer module 110 forms an ultrasonic 5×4 array in the EL plane in the manner described above, three wirings can be formed in a single row of transducer elements. However, the second pattern P2 is not limited to a 5×4 layout and can be modified to an M×N layout in various ways according to design specifications. Therefore, the wiring structure for the piezoelectric elements is not limited to three wirings and can be changed to various numbers of wirings.

[0155] like Figure 8As shown in , when the second pattern P2 is formed on the second circuit layer 115 of the ultrasound probe 100 according to an embodiment of the present disclosure, the plurality of wirings 500 are arranged to be formed on a single layer. In this context, being formed on a single layer means that the plurality of wirings 500 of the second pattern P2 are formed in one layer based on the axial direction A. Therefore, the plurality of wirings 500 can be formed in parallel on a single layer, that is, the plurality of wirings 500 can be formed on the same surface along the extending direction of the odd element X or the even element Y.

[0156] Alternatively, as a method of arranging a plurality of wirings 500 in parallel, as Figure 8 As shown in , by forming a bend in the wiring, the connection portion 116 can be efficiently provided, and the width of the transducer elements in one row can be reduced.

[0157] Or, as Figure 10 and Figure 13 As shown in , according to another embodiment of the present disclosure, the second circuit layer 115 may include a plurality of sub-circuit layers 115 - 1 , 115 - 2 , and 115 - 3 stacked in the axial direction A. When the second pattern P2 is formed on the second circuit layer 115 of the ultrasound probe 100 , each of the plurality of wirings 500 may be formed in each of the plurality of sub-circuit layers 115 - 1 , 115 - 2 , and 115 - 3 .

[0158] For example, when the transducer module 110 forms an ultrasonic 5×4 array in the EL plane, three wirings corresponding to the transducer elements formed in one row need to be formed in the second circuit layer 115. Therefore, in order to form the three wirings, the second circuit layer 115 may include three sub-circuit layers 115-1, 115-2, and 115-3 (see FIG. Figure 12 and Figure 13 ).

[0159] The plurality of wirings 500 formed on each of the plurality of sub-circuit layers 115-1, 115-2, and 115-3 may be connected to the second circuit layer 115 through the first connection portion 116a. Since the plurality of wirings 500 are formed in a plurality of layers based on the axial direction A, the heights of the first connection portions 116a provided on the respective wirings may be different from each other.

[0160] Specifically, the height of the first connection portion 116a connecting the first circuit layer 114 and the sub-circuit layer 115-1 closest to the first circuit layer 114 can be the smallest, and the height of the first connection portion 116a connecting the first circuit layer 114 and the sub-circuit layer 115-3 farthest from the first circuit layer 114 can be the largest.

[0161] Unlike the case where a plurality of wirings 500 are formed on a single layer, referring to Figures 10 to 13When the second pattern P2 is formed on the second circuit layer 115, the plurality of wirings 500 may be formed to be stacked in the axial direction A by forming each of the plurality of wirings 500 on each of the plurality of sub-circuit layers 115-1, 115-2, and 115-3 via the above-mentioned first connection portion 116a.

[0162] In other words, if Figures 10 to 13 As shown in , a plurality of wirings 500 may be formed to overlap in the vertical direction based on the inner shape of the ultrasound probe 100 viewed from the axial direction A. Because the first connection portion 116 a is provided so that the plurality of wirings 500 overlap in the vertical direction, bypass areas A and B may be required.

[0163] For example, when the transducer module 110 forms an ultrasonic 5×4 array in the EL plane, three wirings are required in the second circuit layer 115 corresponding to one row of transducer elements, and three sub-circuit layers 115-1, 115-2, and 115-3 may be provided (see FIG. Figure 11 In this case, bypass regions A and B for the remaining first connection portions 116 a except for the first connection portion 116 a connecting the sub-circuit layer 115 - 1 closest to the second circuit layer 115 and the second circuit layer 115 may be required.

[0164] Therefore, if Figure 10 As shown in FIG, each of the plurality of wirings 500 formed on the remaining circuit layers except the sub-circuit layer 115-3 farthest from the second circuit layer 115 may be formed to overlap in the axial direction A, and at the same time may be formed to bypass the first connection portion 116a of the wiring located in a relatively lower layer. The bypass shape of the wiring may be as follows: Figure 10 , it is shown to be formed in a shape that maintains a straight line and bends, but is not limited thereto, and may be formed in various shapes including a curve.

[0165] The second region 700 of the second circuit layer 115 may be disposed at an opposite end of the first region 600 of the second circuit layer 115. The second region 700 of the second circuit layer 115 may be defined as a middle region where the cable 170 and the plurality of wirings 500 in the first region 600 of the second circuit layer 115 are connected.

[0166] That is, the second area 700 of the second circuit layer 115 is defined as an intermediate area where the cable 170 and multiple wirings 500 in the first area 600 of the second circuit layer 115 are connected, and the multiple wirings 500 are configured to send signals received from the piezoelectric layer 111 of the ultrasound probe 100 to the system controller of the main body 200 or to send control signals from the system controller to the piezoelectric layer 111 of the ultrasound probe 100.

[0167] The surface forming the transducer module 110 and the axial direction of the ultrasound probe 100 may be arranged to be substantially perpendicular (see FIG. Figure 2 That is, the second circuit layer 115 provided at the lower ends of the plurality of piezoelectric elements 111 a and 111 b and the axial direction of the ultrasound probe 100 may also be set to be substantially perpendicular.

[0168] Therefore, during the manufacturing process of the ultrasound probe 100 , the second region 700 of the second circuit layer 115 may inevitably be folded toward the main body of the ultrasound probe 100 connected to the cable 170 .

[0169] In the conventional case of a multi-row ultrasound probe 100, a plurality of wirings 500 disposed on a row of transducer elements may be configured so as not to deviate from the row through which the wirings 500 extend when extending to the second region 700 of the second circuit layer 115. Odd elements X or even elements Y may correspond to a row of transducer elements.

[0170] In other words, the plurality of wirings 500 disposed on the odd element X may be configured so as not to intrude upon the rows of the even element Y when extending to the second region 700 of the second circuit layer 115. Similarly, the plurality of wirings 500 disposed on the even element Y may be configured so as not to intrude upon the rows of the odd element X when extending to the second region 700 of the second circuit layer 115.

[0171] In addition, when the plurality of wirings 500 provided on the Hall element X are configured to extend to one side of the second region 700 of the second circuit layer 115, the plurality of wirings 500 provided on the even element Y may be configured to extend to the other side of the second region 700 of the second circuit layer 115. That is, the plurality of wirings 500 provided on the first region 600 of the second circuit layer 115 may be arranged to extend alternately through the second region 700 of the second circuit layer 115 along the rows of the odd element X or the rows of the even element Y.

[0172] According to the above structure, when the plurality of wirings 500 of the second circuit pattern P2 are arranged on a single layer, the need to ensure the thickness of the wirings and the gaps between the wirings may lead to restrictions on designing the pitch of the transducer elements located in a row.

[0173] In addition, when the second pattern P2 is formed on the second circuit layer 115 to solve the above-mentioned problem when the plurality of wirings 500 of the second circuit pattern P2 are arranged on a single layer, each of the plurality of wirings 500 may be formed on each of the plurality of sub-circuit layers 115-1, 115-2 and 115-3.

[0174] That is, by forming each of the wirings 500 in the plurality of sub-circuit layers 115-1, 115-2, and 115-3 provided as different layers of the second circuit layer 115, the need to ensure the thickness of the wirings and the gaps between the wirings is reduced, making it possible to reduce the restrictions on the pitch of designing a row of transducer elements ( Figure 10 The transducer elements in a row may be formed to have a ratio Figure 8 The pitch of the transducer elements in a row is a narrow pitch).

[0175] However, even in the structure of the second circuit layer 115 having multiple sub-circuit layers 115-1, 115-2 and 115-3, when the wiring formed in the second circuit layer 115 is folded in the second area 700 of the second circuit layer 115 without any other structure, the wiring may be disconnected (open) due to the thickness of the second circuit layer 115 itself.

[0176] Therefore, two structures to be described below can be applied to prevent disconnection (opening) of wiring formed in the second circuit layer 115 and to effectively design the pitch of transducer elements positioned in one row.

[0177] The first of the two structures is a structure in which a plurality of wirings 500 extending along a row extend through other adjacent rows and are distributed. The second of the two structures is a structure in which a plurality of wirings 500 respectively formed in a plurality of sub-circuit layers in the first region 600 of the second circuit layer 115 are formed in a single layer in the second region 700 of the second circuit layer 115.

[0178] Hereinafter, a structure in which a plurality of wirings 500 extending along one row passes through other adjacent rows and is distributed will be described in detail.

[0179] Reference Figure 8 and Figure 11 , the first region 600 of the second circuit layer 115 may be configured such that a plurality of wirings 500 extending along rows of odd elements X in transducer elements consisting of paired rows (ie, basic element pairs) pass through rows of even elements Y and are distributed.

[0180] That is, when the plurality of wirings 500 of the second circuit pattern P2 formed along the rows of odd elements X in the first region 600 of the second circuit layer 115 extend to the second region 700 of the second circuit layer 115, the wirings 500 can extend not only to the rows of odd elements X but also to the rows of even elements Y.

[0181] Hereinafter, the positions and directions in which the plurality of wirings 500 are distributed will be described in detail.

[0182] Reference Figure 8 and Figure 10, where a plurality of wirings 500 extending along a row are distributed to other adjacent rows can be defined as an edge region. The edge region may include a first edge region 610 and a second edge region 620. The first edge region 610 may be disposed at one end of the first region 600 of the second circuit layer 115 that is adjacent to the second region 700 of the second circuit layer 115. The second edge region 620 may be disposed at the other end of the first region 600 of the second circuit layer 115 that is adjacent to the second region 700 of the second circuit layer 115. That is, in the first region 600 of the second circuit layer 115, the opposite ends of the first region 600 of the second circuit layer 115 that are adjacent to the second region 700 of the second circuit layer 115 may be defined as the first edge region 610 and the second edge region 620, respectively.

[0183] Specifically, when the plurality of wirings 500 formed along the rows of the odd elements X of the second circuit pattern P2 extend to the second region 700 of the second circuit layer 115, the wirings 500 may pass through the rows of the even elements Y from the first edge region 610 and be distributed. Figure 8 and Figure 10 As shown in , the direction of distribution may be a first direction 610 - 1 .

[0184] Furthermore, when the plurality of wirings 500 formed along the rows of the even elements Y of the second circuit pattern P2 extend to the second region 700 of the second circuit layer 115, the wirings 500 may pass through the rows of the odd elements X from the second edge region 620 and be distributed. Figure 8 and Figure 10 As shown in , the direction of distribution may be a second direction 620 - 1 .

[0185] The first direction 610-1 and the second direction 620-1 may be parallel to a direction in which the second circuit layer 115 is folded. The first direction 610-1 and the second direction 620-1 may be opposite to each other.

[0186] That is, the first direction 610 - 1 may be a direction pointing from the odd element X to the even element Y. The second direction 620 - 1 may be a direction pointing from the even element Y to the odd element X.

[0187] like Figure 8 and Figure 10 As shown in FIG, when the wirings 500 are distributed along the first direction 610-1 and the second direction 620-1, the circuit pattern formed by the plurality of wirings 500 may be formed to be point-symmetrical based on the center of the first region 600. That is, referring to FIG. Figure 8 and Figure 10 , when rotated 180 degrees relative to the center O of the base element pair, the circuit patterns may overlap.

[0188] However, the first direction 610 - 1 and the second direction 620 - 1 are not limited to the above directions, but as long as the plurality of wirings 500 extending along one row can pass through other adjacent rows and be distributed, the distribution direction may be diverse and various pattern shapes may be formed accordingly.

[0189] In addition, when a plurality of wirings 500 extend from the first area 600 to the second area 700, the distance D between the plurality of wirings 500 may be increased. For example, the distance D2 between the plurality of wirings 500 in the second area 700 may be wider than the distance D1 of the plurality of wirings in the first area 600. The plurality of wirings 500 may be distributed in the first edge area 610 and / or the second edge area 620 so that the distance D between the plurality of wirings 500 can be widened. Specifically, when the plurality of wirings 500 are distributed along the first direction 610-1 and the second direction 620-1, the plurality of wirings (500) may be dispersed. The distance D2 of the plurality of wirings distributed along the first direction 610-1 and the distance D2 of the plurality of wirings 500 distributed along the second direction 620-1 are shown as being the same, but are not limited thereto. Different distances may be formed between the plurality of wires 500.

[0190] like Figure 9 and Figure 11 As shown in FIG, the structure of the distributed wiring 500 may be formed in the second region 700, but not in the first edge region 610 or the second edge region 620. A detailed description of the above will be described later.

[0191] Hereinafter, a structure will be described in which the plurality of wirings 500 respectively formed in the plurality of sub-circuit layers 115 - 1 , 115 - 2 , and 115 - 3 in the first region 600 of the second circuit layer 115 are formed in a single layer in the second region 700 of the second circuit layer 115 .

[0192] The structure in which the first region 600 of the second circuit layer 115 includes a plurality of sub-circuit layers 115-1, 115-2, and 115-3 stacked in the axial direction A and each of the plurality of wirings 500 is formed in each of the plurality of sub-circuit layers 115-1, 115-2, and 115-3 is the same as the above structure.

[0193] However, when the multiple sub-circuit layers 115-1, 115-2 and 115-3 stacked along the axial direction A in the first area 600 of the second circuit layer 115 are folded in the second area 700 of the second circuit layer 115 without having a separate structure, the multiple wirings 500 may be disconnected (open).

[0194] In order to solve this problem, a structure as described above in which multiple wirings 500 extending along a row pass through other adjacent rows can be applied, and a structure to be described later in which multiple wirings 500 respectively formed in multiple sub-circuit layers 115-1, 115-2 and 115-3 in the first area 600 of the second circuit layer 115 are formed in a single layer in the second area 700 of the second circuit layer 115 can be applied.

[0195] A collection layer 115-4 may be provided on the second circuit layer 115, in which the plurality of wirings 500 are gathered into one layer in the second region 700 and extend from the layer. The collection layer 115-4 in the first region 600 of the second circuit layer 115 is a single layer in which the plurality of wirings 500 formed in the plurality of sub-circuit layers 115-1, 115-2, and 115-3, respectively, are gathered, and being formed in a single layer means that the plurality of wirings 500 of the second circuit pattern P2 are formed in one layer based on the axial direction A.

[0196] The collection layer 115 - 4 as a component of the second circuit layer 115 is provided between the lower surface of the second circuit layer 114 and the sound absorbing layer 112 based on the axial direction A. In addition, the collection layer 115 - 4 is formed in the first edge region 610 or the second edge region 620 such that the plurality of wirings 500 extend to the second region 700 of the second circuit layer 115 .

[0197] The plurality of sub-circuit layers 115 - 1 , 115 - 2 , and 115 - 3 and the collection layer 115 - 4 in the first region 600 of the second circuit layer 115 are formed in different layers based on the axial direction A, and second connection portions 116 b capable of electrically connecting the layers may be provided.

[0198] That is, the second connection portion 116b may be provided as a connection portion 116 that connects each of the plurality of wirings 500 of the plurality of sub-circuit layers 115-1, 115-2, and 115-3 in the first region 600 of the second circuit layer 115 to each of the plurality of wirings 500 of the collection layer 115-4. The shape and structure of the second connection portion 116b are the same as those of the first connection portion 116a described above, and only the connection objects are different, so a detailed description thereof will be omitted.

[0199] The number of the second connection portions 116 b may correspond to the number of the plurality of wirings 500 provided in the plurality of sub-circuit layers 115 - 1 , 115 - 2 , and 115 - 3 in the first region 600 of the second circuit layer 115 .

[0200] For example, when the transducer module 110 forms an ultrasonic 5×4 array in the EL plane, three wirings are required in the second circuit layer 115 corresponding to transducer elements consisting of one row, and thus three second connection portions 116 b may be provided to correspond thereto.

[0201] The second connection portion 116b may be formed in the first edge region 610 or the second edge region 620 corresponding to the location where the collection layer 115-4 is provided. The second connection portion 116b may be formed in a direction along the first direction 610-1 and the second direction 620-1. The definition of the first direction 610-1 and the definition of the second direction 620-1 are the same as those described above.

[0202] Since the plurality of wirings 500 are dispersed in the second region 700 and formed in a single layer by the above-described structure, even when the second circuit layer is folded, disconnection (opening) of the plurality of wirings 500 can be prevented.

[0203] In addition, through a structure in which corresponding wirings are formed on multiple sub-circuit layers 115-1, 115-2 and 115-3 provided with different layers in the second circuit layer 115 and a structure in which multiple wirings 500 extending along a row pass through other adjacent rows and are distributed, the need to ensure the thickness of the wirings and the gaps between the wirings is reduced, so that the restrictions on the pitch of the transducer elements designed to be located in a row can be reduced.

[0204] like Figure 9 、 Figure 11 and Figure 13 As shown in , a structure in which a plurality of wirings 500 extending along one row passes through other adjacent rows and is distributed may be formed in the second region 700 , but not in the first edge region 610 or the second edge region 620 .

[0205] Since the distribution structure is formed in the second region 700 , an advantage in the cutting process can be achieved.

[0206] As described above, the piezoelectric layer 111 may be processed into a multi-dimensional array in a matrix form with a plurality of rows through a cutting process. In this case, the piezoelectric layer 111 may be divided into a plurality of piezoelectric elements 111a through the cuts 118a and 118b.

[0207] As described above, specifically, the first cutout 118a can be divided into the first cutout 118a-1 ( Figures 8 to 11 ) is formed between the pair of base elements and the second cutout 118a-2 ( Figures 8 to 11 ) is formed between two basic element pairs that are to be formed in different forms.

[0208] However, if Figure 9 and Figure 11As shown in FIG, when a structure in which a plurality of wirings 500 extending along a row pass through other adjacent rows and are distributed is formed in the second region 700, efficiency can be achieved in the cutting process of forming the second kerf 118a-2.

[0209] Specifically, if Figure 8 and Figure 10 As shown in FIG, when a structure is formed in which a plurality of wirings 500 extending along a row pass through other adjacent rows and are distributed in the first edge region 610 or the second edge region 620 of the first region 600, the second cutout 118a-2 formed between the two base element pairs may be formed to separate at least one of the matching layer 113, the reinforcement layer 117, the first circuit layer 114, the insulation layer 119, and the piezoelectric layer 111. In other words, the second cutout 118a-2 may not be formed on the second circuit layer 115.

[0210] This is because when the piezoelectric body 111 is cut in the first area 600 which is set to selectively contact the plurality of piezoelectric elements 111a and 111b, when the cutting process is applied to the second cut 118a-2 and the second circuit layer 115 like the first cut 118a-1, some of the plurality of wirings 500 may be disconnected (open).

[0211] Therefore, although the cutting process has the same direction, there may be difficulties in the process of forming the first cut 118a-1 and the second cut 118a-2 with different cut depths.

[0212] like Figure 9 、 Figure 11 and Figure 13 As shown in , when a structure is formed in which a plurality of wirings 500 extending along a row pass through other adjacent rows and are distributed in the second region 700, the possibility of disconnection (open circuit) is reduced, so that, like the first cutout 118a-1, the second cutout 118a-2 can also be formed in a specific region of the second circuit layer 115. Therefore, the cutting process can be performed so that the first cutout 118a-1 and the second cutout 118a-2 can have the same direction and the same cut depth at the same time, thereby improving the efficiency of the manufacturing process.

[0213] As is apparent from the above, in the structure of the multi-row probe, even when a plurality of circuit patterns are provided in a stacked structure, the plurality of circuit patterns can be formed to converge into a single layer at opposite sides of the lower portion of the piezoelectric element, so that disconnection (open circuit) of the plurality of circuit patterns can be prevented.

[0214] Furthermore, constraints in the design specifications of the circuit pattern may be reduced on a per-transducer element basis by utilizing empty areas of adjacent rows.

[0215] Although some embodiments of the present disclosure have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. An ultrasound probe, comprising: piezoelectric elements formed into a plurality of rows along a lateral direction, a plurality of said rows being arranged to form pairs of rows; a cutout formed between the piezoelectric elements along the transverse direction; a first circuit layer, disposed below the piezoelectric element; a second circuit layer, spaced apart from below the first circuit layer and comprising a plurality of wirings extending along the row, the second circuit layer being provided with a first region and a second region, the first region selectively contacting the piezoelectric element, the second region being provided at an opposite end of the first region and folded up without contacting the piezoelectric element; as well as a first connecting portion, configured to electrically connect the first circuit layer and the second circuit layer; Here, when the plurality of wirings extending along one of the paired rows extend from the first region to the second region, the first region is configured such that the plurality of wirings are distributed to another adjacent row.

2. The ultrasound probe according to claim 1, wherein The second circuit layer is arranged so that a plurality of the wirings are parallel in a single layer.

3. The ultrasound probe according to claim 1, wherein The piezoelectric elements form a plurality of columns along a height direction, and the plurality of wirings correspond to the plurality of rows, respectively.

4. The ultrasound probe according to claim 3, wherein The first region of the second circuit layer includes a plurality of sub-circuit layers stacked in an axial direction, and Each of the plurality of wirings is formed in each of the plurality of sub-circuit layers.

5. The ultrasound probe according to claim 4, wherein The second circuit layer further includes a collection layer in which a plurality of the wirings are collected into a layer in the second region and extend from the second region.

6. The ultrasound probe according to claim 5, further comprising: The second connecting portion is used to connect each of the plurality of sub-circuit layers to the collection layer.

7. The ultrasound probe according to claim 6, wherein A plurality of the wirings are distributed from the second region, and The second connecting portion is formed in the folded second area.

8. The ultrasound probe according to claim 6, wherein The first region includes a first edge region and a second edge region, the first edge region is formed at one end of the first region adjacent to the second region, and the second edge region is formed at the other end of the first region adjacent to the second region, and A plurality of the wirings are distributed from at least one of the first edge region and the second edge region.

9. The ultrasound probe according to claim 8, wherein The second connection portion is formed in at least one of the first edge region and the second edge region.

10. The ultrasound probe according to claim 8, wherein The plurality of wirings extending along one row of the paired rows are distributed along a first direction from the first edge region, and the plurality of wirings extending along the other row of the paired rows are distributed along a second direction from the second edge region, and The first direction and the second direction are parallel to a direction along which the second circuit layer is folded.

11. The ultrasound probe according to claim 10, wherein The first direction and the second direction are opposite to each other.

12. The ultrasound probe according to claim 11, wherein A circuit pattern formed by the plurality of wirings is formed point-symmetrically with respect to the center of the first region.

13. The ultrasound probe according to claim 8, wherein The distance between the plurality of wirings becomes wider while the plurality of wirings are distributed to the first edge region or the second edge region, and A distance between the plurality of wirings in the second region is greater than a distance between the plurality of wirings in the first region.

14. The ultrasound probe according to claim 6, wherein At least one of the first connection portion and the second connection portion includes a conductive hole, and The conductive via is filled with a conductive material and connects the plurality of wirings formed in the second circuit layer with the wirings formed in the first circuit layer.

15. The ultrasound probe according to claim 6, wherein At least one of the first connection portion and the second connection portion electrically connects the first circuit layer and the second circuit layer or electrically connects the second circuit layer and the collection layer by at least one of conductive paste, conductive plating, sputtering, or printing.

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