Information processing apparatus and information processing method

Abstract

An information processing apparatus and an information processing method are disclosed. An information processing apparatus includes an acquisition unit configured to acquire information containing first processing data and second processing data, the first processing data indicating a result of substrate processing in a first processing condition, the second processing data indicating a result of substrate processing in a second processing condition different from the first processing condition, and a display control unit configured to control display on a display device based on the information acquired by the acquisition unit, wherein the display control unit is configured to display a first screen on the display device, the first screen displaying a first data group in which the first processing data is arranged in time series and a second data group in which the second processing data is arranged in time series, the first screen displaying the first data group in one region and the second data group in another region.

Description

Technical Field

[0001] This invention relates to information processing apparatus and information processing method. Background Technology

[0002] In semiconductor manufacturing plants, semiconductor manufacturing equipment, such as substrate processing units, is typically installed to process substrates. The substrates are processed efficiently while the operational status of each unit is checked. Furthermore, in the event of a malfunction in the semiconductor manufacturing equipment, operations to overcome the malfunction are quickly executed.

[0003] Japanese Patent Application Publication No. 2009-170612 discusses a technique for detecting faults in a semiconductor manufacturing apparatus. Specifically, the processing results of the semiconductor manufacturing apparatus are statistically processed on a batch basis, each comprising multiple substrates, and the results of the statistical processing are displayed as a graph. This allows the user to easily and immediately identify batches that have experienced faults.

[0004] However, even when charts are displayed by batch, each comprising multiple substrates, it is difficult to immediately determine the trends based on the differences in each recipe, which represents the processing conditions of the semiconductor manufacturing apparatus. In the event of a failure due to a recipe, determining the cause of the failure requires compiling information about each recipe and comparing their trends. Unless the user collects and analyzes the data, they cannot determine the trends for each recipe, and overcoming the failure takes a significant amount of time. Summary of the Invention

[0005] According to one aspect of the present invention, an information processing apparatus includes: an acquisition unit configured to acquire information comprising first processing data and second processing data, the first processing data indicating the result of substrate processing under first processing conditions, and the second processing data indicating the result of substrate processing under second processing conditions different from the first processing conditions; and a display control unit configured to control a display on a display device based on the information acquired by the acquisition unit, wherein the display control unit is configured to display a first screen on the display device, the first screen displaying a first data group of the first processing data arranged in chronological order and a second data group of the second processing data arranged in chronological order, the first screen displaying the first data group in one area and the second data group in another area.

[0006] Other features of the invention will become clear from the following description of embodiments with reference to the accompanying drawings. Attached Figure Description

[0007] Figure 1 This is a diagram illustrating the item manufacturing system.

[0008] Figure 2This is a diagram illustrating an exposure apparatus as an example of a pattern forming device.

[0009] Figure 3 This is a diagram illustrating the hardware configuration of an information processing device.

[0010] Figure 4 This is a diagram illustrating the configuration of the central processing unit (CPU) of the management device.

[0011] Figure 5 This is a flowchart of the display processing of the illustrated display device.

[0012] Figure 6 It is a graph that shows batch data of different formulations superimposed and displayed on the same chart.

[0013] Figure 7 These are charts showing batch data for the recipes displayed in different graphs.

[0014] Figure 8 It is a chart that illustrates different timelines.

[0015] Figure 9 This is a diagram illustrating how historical information is displayed.

[0016] Figure 10 This is a diagram showing the processing conditions for the selected batch. Detailed Implementation

[0017] Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0018] In the first embodiment, an article manufacturing system comprising multiple devices and a management device for managing the multiple devices will be described. Figure 1 This diagram illustrates an article manufacturing system. According to this embodiment, the article manufacturing system 100 includes a pattern forming apparatus 200, a processing apparatus 201, an inspection apparatus 202, and a management apparatus 300. The pattern forming apparatus 200 forms a pattern on a wafer (substrate). The management apparatus 300 manages the pattern forming apparatus 200, the processing apparatus 201, and the inspection apparatus 202. Furthermore, each of the pattern forming apparatus 200, the processing apparatus 201, and the inspection apparatus 202 in the article manufacturing system 100 includes one or more devices.

[0019] The pattern forming apparatus 200 includes an exposure unit that illuminates a reticle (mask, original) on which a pattern is formed, and projects the pattern onto a shot region on a wafer using light from the mask. Additionally, the pattern forming apparatus 200 includes an imprinting unit that forms a composition with a cast shape transferred thereon by, for example, contacting an imprinting material fed onto the wafer with a cast (original, mold) and applying energy for curing the imprinting material. Furthermore, the pattern forming apparatus 200 includes a drawing unit that performs drawing on a substrate using a charged particle beam, such as an electron beam or an ion beam, via a charged particle optical system to form a pattern on the substrate. The pattern forming apparatus 200 performs substrate processing using the methods described above.

[0020] Processing apparatus 201 includes a manufacturing apparatus that performs processes other than those performed by apparatus such as an exposure apparatus when manufacturing articles such as devices. Examples of manufacturing apparatus are an application apparatus that applies a photosensitive medium to the surface of a substrate and a developing apparatus that develops a substrate on which a pattern has been transferred. Processing apparatus 201 also includes other apparatus such as an etching apparatus and a film forming apparatus.

[0021] Inspection apparatus 202 includes, for example, a cover inspection apparatus, a linewidth inspection apparatus, a pattern inspection apparatus, and an electrical characteristic inspection apparatus. The cover inspection apparatus is used to inspect the accuracy of the displacement between the patterns of the upper and lower layers of a substrate comprising multiple layers on which patterns are formed. The linewidth inspection apparatus is used to inspect the accuracy of dimensions such as linewidth of the patterns formed on the substrate. The pattern inspection apparatus is used to inspect for the presence or absence of patterns that do not meet accuracy requirements due to foreign particles on the substrate on which the patterns are formed, or due to a lack of imprinting material. The electrical characteristic inspection apparatus is used to inspect the accuracy of the electrical characteristics of a semiconductor device manufactured based on a substrate on which patterns are formed.

[0022] The following describes an exposure apparatus for exposing a wafer to light from a mask on which a pattern has been formed, as an example of a pattern forming apparatus 200. Figure 2 This diagram illustrates an exposure apparatus as an example of a pattern forming apparatus 200. The following description uses an exposure apparatus 204 according to this embodiment, which performs a step-scan method of exposure while simultaneously driving the mask stage and the wafer stage. Furthermore, the exposure apparatus 204 is not limited to a scanner, and can also be an exposure apparatus that performs a step-by-step repeating method of exposure while the wafer stage is stationary. Figure 2In the example shown in the diagram, the exposure apparatus 204 includes a light source 7, an illumination optics system 8, a mask stage 2, a projection optics system 3, a wafer stage 6, a wafer chuck 5, and a control unit 13. The exposure apparatus 204 also includes laser interferometers 9 and 10, a focus sensor, a wafer transport unit 12, a mask transport unit 14, and an alignment scope 15. Additionally, in Figure 2 In the projection optical system 3, the direction parallel to the optical axis is the Z-axis direction, and the two directions perpendicular to the Z-axis direction and orthogonal to each other are the X-axis direction and the Y-axis direction.

[0023] The light source 7 is, for example, a high-pressure mercury lamp, an argon fluoride (ArF) excimer laser, or a krypton fluoride (KrF) excimer laser. Furthermore, the light source 7 need not be located inside the cavity of the exposure apparatus 204 and can be an external light source. Light emitted from the light source 7 illuminates the mask 1 via an illumination optics system 8. A pattern to be transferred onto the wafer 4, on which a photosensitive material has been applied, is drawn on the mask 1, and the mask 1 is placed on a mask stage 2. The mask stage 2 holds the mask 1 by suction via a mask chuck and is movable, for example, by means of a linear motor.

[0024] The projection optics system 3 projects an image of a pattern drawn on the mask 1 onto the wafer 4 placed on the wafer chuck 5. When projecting the pattern image onto the wafer 4, an inverted and reduced image is projected onto the wafer 4 via the projection optics system 3 at a projection magnification (e.g., one-quarter). The area where the patterned image is projected is called an injection region, and multiple injection regions are provided on the wafer 4. Projection is sequentially repeated on the injection regions.

[0025] The wafer stage 6 is driven by a linear motor actuator to move in the X and Y directions. A wafer chuck 5 is placed on the wafer stage 6 and holds the wafer 4. The wafer stage 6 positions the wafer chuck 5 in the Z, θ, ωX, and ωY directions. Therefore, the wafer 4 held by the wafer chuck 5 is moved by the drive of the wafer stage 6 and the wafer chuck 5.

[0026] Laser interferometer 9 measures the position of mask stage 2 in the Y direction and its orientation. Laser interferometer 9 includes a laser interferometer that similarly measures the position of mask stage 2 in the X direction. Laser interferometer 10 measures the position of wafer stage 6, on which wafer 4 is placed, in the Y direction and its orientation. Furthermore, laser interferometer 10 includes a laser interferometer that similarly measures the position of wafer stage 6 in the X direction. The positions of mask stage 2 and wafer stage 6 are controlled by control unit 13, as described below, based on the positions measured by laser interferometers 9 and 10.

[0027] The focusing sensor includes a light projection system 11a that projects light onto the wafer 4, a light receiving system 11b that receives reflected light from the wafer 4, and a detection unit that detects light from the light receiving system 11b and outputs a detection signal to the control unit 13. The light projection system 11a and the light receiving system 11b are positioned to sandwich the emitting part of the projection optics system 3 in between. The light projection system 11a projects obliquely incident light onto the wafer 4, and the light receiving system 11b captures the light reflected from the opposite side. The control unit 13, described below, measures the position of the wafer 4 in the Z direction based on the detection signal detected by the focusing sensor, and controls the movement of the wafer 4 via the wafer stage 6.

[0028] The wafer transport unit 12 transports the wafer 4. The wafer transport unit 12 transports the wafer 4 from the wafer storage container used to store the wafer 4 to the wafer stage 6. Additionally, the wafer transport unit 12 transports the wafer 4 from the wafer stage 6 to the wafer storage container.

[0029] Mask transport unit 14 transports mask 1. Mask transport unit 14 transports mask 1 from mask storage container for storing mask 1 to mask stage 2. In addition, mask transport unit 14 transports mask 1 from mask stage 2 to mask storage container.

[0030] Alignment observer 15 acquires a digital image signal of a captured image of a mark formed on wafer 4 to position (align) wafer 4 held on wafer chuck 5. Alignment observer 15 includes an image sensor and an analog-to-digital (A / D) converter. The image sensor outputs an intensity image signal based on the brightness—that is, the intensity—of the reflected light from wafer 4. The A / D converter converts the intensity image signal acquired from the image sensor into a digital image signal. Control unit 13, described below, uses the acquired digital image signal to detect the position of the mark formed on wafer 4, controls wafer stage 6 based on the detected mark position, and positions wafer 4.

[0031] Control unit 13 controls the exposure process on wafer 4 by controlling the operation and adjustment of components of exposure apparatus 204. Control unit 13 includes, for example, a programmable logic device (PLD) such as a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), a computer with embedded programs, or a combination of all or some of the above components. Furthermore, control unit 13 can be integrated with other parts of exposure apparatus 204 (control unit 13 and other parts can be housed in the same housing) or can be separately housed from other parts of exposure apparatus 204 (control unit 13 and other parts can be housed in different housings). Additionally, control unit 13 uses information obtained from a storage device described below to control the execution of the exposure process (patterning process) on wafer 4.

[0032] Next, the management device 300 will be described. Figure 3 This diagram illustrates the hardware configuration of an information processing device. The information processing device includes a central processing unit (CPU) 301, a read-only memory (ROM) 302, a random access memory (RAM) 303, a storage device 304, an input device 305, a display device 306, and a communication device 307. Each piece of hardware in the information processing device operates based on a program. Figure 3 In the example illustrated, CPU 301 is a processing device that performs calculations for control based on a program and controls each component connected to bus 308. ROM 302 is a dedicated memory for reading data and storing programs and data. RAM 303 is a memory for reading and writing data and storing programs and data. RAM 303 is used for temporary storage of data such as the results of calculations performed by CPU 301. Storage device 304 is used to store programs and data. Storage device 304 also serves as an area for temporarily storing programs and data of the operating system (OS) of the information processing device.

[0033] Storage device 304 is slower than RAM 303 in terms of data input and output, but it is capable of storing large amounts of data. Storage device 304 is intended to be a non-volatile storage device that stores data as permanent data for long-term reference. Storage device 304 may include, for example, magnetic storage devices (hard disk drives (HDDs)) or solid-state drives (SSDs), but may be a device in which external media such as optical discs (CDs), digital versatile discs (DVDs), memory cards, etc., are attached to read and write data.

[0034] Input device 305 is a device for inputting characters and data into the information processing device. Input device 305 is various keyboards and mice. Display device 306 is a device that acts as the user interface of management device 300 and displays the information and processing results required for the operation of information processing device. Display device 306 is a cathode ray tube (CRT) or liquid crystal monitor. Display device 306 that can be operated by touching a screen such as a touch panel also acts as input device 305. Although input device 305 and display device 306 are described as part of management device 300, input device 305 and display device 306 are not limited to those described and may, for example, be part of pattern forming apparatus 200.

[0035] The communication device 307 is used to communicate with other devices by connecting to a network and performing data communication based on a communication protocol such as Transmission Control Protocol / IP (TCP / IP). Additionally, the information processing device may include a graphics processing unit (GPU) to enable high-speed computational processing. The management device 300 is an information processing device and is connected to the plurality of exposure devices 204 via the communication device 307 to communicate data with the plurality of exposure devices 204.

[0036] Figure 4 This diagram illustrates the configuration of the CPU 301 in the management device 300. The CPU 301 includes an acquisition unit 401, an accumulation unit 402, a calculation unit 403, and a display control unit 404. Figure 5 This is a flowchart illustrating the user interface display process for analyzing faults that have occurred in the exposure apparatus.

[0037] Reference Figure 4 and Figure 5 The display processing of the display device 306 of the management device 300 according to this embodiment is described. In this embodiment, the display of the display device 306 reduces the time required to analyze the cause of a fault in the exposure apparatus 204. In this embodiment, the term "fault" refers to a fault sufficient to stop the exposure apparatus 204, and also refers to a fault that reduces the accuracy of the exposure apparatus 204 and affects productivity.

[0038] will describe Figure 5 The flowchart shown in the figure illustrates this. In step S501, the acquisition unit 401 acquires processing information about the exposure apparatus 204. The processing information about the exposure apparatus 204 includes processing data of the exposure apparatus 204 and processing conditions applied in the exposure process. The processing data of the exposure apparatus 204 includes information on the operation results of the exposure apparatus 204 and the state of the wafer 4 exposed by the exposure apparatus 204. Specifically, the content of the processing data includes synchronization accuracy data and alignment accuracy data. The synchronization accuracy data is data representing the error in the relative position of the mask stage 2 and the wafer stage 6 during the period when, for example, the mask stage 2 and the wafer stage 6 are driven synchronously in the Y-axis direction to expose the target injection region. In addition, the alignment accuracy data is data representing the waveform data of the digital image signal acquired by capturing an image of a mark formed on the target wafer 4 and the evaluation of the digital image signal (symmetry of the waveform data, contrast of the digital image signal).

[0039] The processing conditions applied in the exposure process refer to the recipe determined for each wafer to be manufactured and the apparatus parameters determined for each exposure apparatus 204. The recipe is a processing condition shared and used by multiple exposure apparatuses 204. The apparatus parameters are processing conditions not shared by multiple exposure apparatuses 204. For example, the recipe includes the exposure amount during wafer exposure and the selection of individual correction values ​​and correction algorithms to follow the exposure pattern. Apparatus parameters include, for example, correction values ​​for the projection optics system 3, methods for controlling the wafer stage 6, and control parameters. Furthermore, the processing conditions are not limited to those described above, and parameters defining other processing conditions may be shown.

[0040] Next, in step S502, the processing data and processing conditions of the exposure apparatus 204 obtained in step S501 are accumulated in the accumulation unit 402. Regarding the processing data, for example, wafer-based (substrate-by-substrate) processing data is accumulated in the accumulation unit 402.

[0041] In step S503, the calculation unit 403 calculates batch data as batch-based processing data based on the wafer-based processing data accumulated in the accumulation unit 402. The batch data is calculated based on statistical values ​​(e.g., maximum, minimum, average, median, standard deviation) of the wafer-based processing data. Alternatively, the exposure apparatus 204 can be used instead of the calculation unit 403 to calculate the batch data. For example, the acquisition unit 401 can acquire the batch data calculated by the exposure apparatus 204 and proceed to step S504.

[0042] In step S504, the display control unit 404 outputs the batch data calculated in step S503 to the display device 306, and controls the display device 306 to display the data as shown in step S503. Figure 6 The chart in Figure 601 shows batch data with different formulations applied, displayed in an overlay on the same area of ​​a single chart. Figure 601 is shown in chronological order. The horizontal axis of Figure 601 represents the time taken to execute the exposure process. The vertical axis of Figure 601 represents the batch data values ​​as batch-based processing data values.

[0043] Select buttons 602 and 603 to change the display method of chart 601. Figure 6 The illustration shows the selected state of selection button 602. Users can change the display method of chart 601 by selecting selection button 603. Selection buttons 602 and 603 can be combined into a single button.

[0044] In step S505, the display control unit 404 determines whether the display method of the chart has been changed. Specifically, the display control unit 404 determines whether the user has selected the selection button 603. If the selection button 603 is selected ("Yes" in step S505), the process proceeds to step S506. The method of selecting the selection button 603 is achieved through a computer input device such as a mouse, keyboard, or touch panel, and a program that controls the input device.

[0045] In step S506, the display control unit 404 outputs the batch data calculated in step S503 to the display device 306 and controls the display device 306 to display the data as shown in step S503. Figure 7 The chart 701 shows the batch data. It is a chart with a separate display area for each recipe, and each batch of data is displayed in a separate chart. Chart 701 is displayed in chronological order. The horizontal axis of Chart 701 represents the execution time of the exposure process and is divided by recipe. The vertical axis of Chart 701 represents the batch data values. The batch data values ​​are based on the batch's processing data values. Scroll bar 705 is used to change the display position of Chart 701. Scroll bar 705 can be used to display the data on display device 306. Figure 7 The range of batch data not shown in the table. Additionally, by using... Figure 7 In the diagram, when batch data for each recipe is displayed in different charts, selecting button 602 allows the user to return to the previous screen. Figure 6 The diagram shows batch data for different formulations being overlaid and displayed on a single chart.

[0046] Setting button 704 is used to select whether to display recipes within the same time range in the chart. For example... Figure 7 As shown in the diagram, with the setting button 704 active, recipes within the same time range are displayed in a chart similar to that in Figure 701. In contrast, Figure 8 This is a diagram showing the setting button 704 in the off state. Figure 8 Is it like this? Figure 7 The batch data for each recipe is displayed in different charts, similar to the previous chart, but the time range for each recipe shown in chart 711 is different. Therefore, in cases where a particular recipe exhibits changes over time, the overall trend of that individual recipe can be observed, making it easy to determine the trend based on the display. Additionally, the scroll bar 705 can be used to change the recipes to be displayed and the time range for each recipe.

[0047] In step S507, if the user determines that the screen needs to be ended, the display on the display device 306 ends.

[0048] As mentioned above, users can selectively choose the most appropriate chart display for identifying the cause of the fault. For example, when batch data is displayed in an overlay, it can be viewed from... Figure 6 The charts shown in the diagram can identify trends in a formula, but when batch data is overlaid, it becomes difficult to determine the trend for each formula. Furthermore, because the time range displayed is small due to the presence of multiple charts, it is difficult to... Figure 7 The chart shown in the middle immediately identifies the overall trend for each recipe, but the trend for each recipe can be determined by moving the scroll bar 705. According to Figure 7 Users can immediately determine that the batch data value of formula D is greater than the batch data values ​​of formulas A and B, allowing them to immediately perform operations to overcome the fault. It can be seen that during the time period shown in Figure 701, wafer processing according to formula C is not performed. Additionally, Figure 6 , Figure 7 and Figure 8 Charts 601, 701, and 711 can be displayed together on display device 306, rather than switching the display of charts 601, 701, and 711.

[0049] Furthermore, although batch data is described as statistical values ​​of processing data for a single batch, batch data is not limited to the batch data described above, and can be statistical values ​​of processing data from multiple batches applying the same formula. Additionally, although according to the description in this embodiment, in Figure 7 and Figure 8 The batch data for each formulation is displayed in different charts, but this embodiment is not limited to the above situation, and the batch data for each exposure device 204 can be displayed in different charts.

[0050] While the above embodiment describes examples of analyzing the causes of malfunctions in a pattern forming apparatus 200, such as an exposure apparatus 204, the embodiment is also applicable to analyzing the causes of malfunctions in semiconductor manufacturing apparatuses other than the pattern forming apparatus 200. For example, the information processing apparatus according to this embodiment is applicable to analyzing the causes of malfunctions in a processing apparatus 201 or an inspection apparatus 202.

[0051] As described above, according to this embodiment, the display device 306 can display batch data for each recipe in different charts. This reduces the time required to overcome failures caused by the recipe.

[0052] In the second embodiment, an example of displaying change history information together with batch data will be described below. Change history information pertains to changes in exposure processing conditions. Content not described in this embodiment is as described in the first embodiment.

[0053] Figure 9 It is illustrated with Figure 8 The diagram in the middle shows a graph displaying the change history information. The change history information pertains to the processing conditions and the time when those conditions were applied. Lines 712a and 712b on graph 711 each specify the time when the formula parameters were changed, indicating that the formula parameters before line 712a are different from those after line 712a, and the formula parameters before line 712b are different from those after line 712b. Lines 713a and 713b on graph 711 each specify the time when the device parameters were changed, indicating that the formula parameters before line 713a are different from those after line 713a, and the formula parameters before line 713b are different from those after line 713b.

[0054] Processing condition 714 displays details of the changes to the formula parameters corresponding to lines 712a and 712b. Setting values ​​1 and 3 change at the time specified by line 712a and return to the initial formula parameters at the time specified by line 712b. Setting value 2 remains unchanged. Processing condition 715 displays details of the changes to the device parameters corresponding to lines 713a and 713b. Setting values ​​5 and 6 change at the time specified by line 713a and return to the initial device parameters at the time specified by line 713b. Setting value 4 remains unchanged.

[0055] Lines 712a, 712b, 713a, and 713b are useful for users to visually determine whether the trend of batch data before the time of changing processing conditions differs from the trend after that time. Users can check whether the trend of batch data before the time specified by lines 712a, 712b, 713a, and 713b differs from the trend after that time, and if the trends differ, users can immediately take action.

[0056] exist Figure 9 In the example shown in the diagram, the user first checks lines 712a, 712b, 713a, and 713b. At this point, it is determined that the batch data has changed at the setting change point on line 713a. Therefore, the user changes setting values ​​5 and 6 back to the original device parameters at the setting change point on line 713b. As a result, the batch data at and after the time specified by line 713b is corrected to reflect the trend of the batch data at and before the time specified by line 713a.

[0057] Furthermore, although information regarding the application time of each processing condition is specified by lines 712a, 712b, 713a, and 713b, the method of specifying the information is not limited to the methods described above, and arrows or markers that can specify the time on graph 711 can be used. Additionally, parameters defining the processing conditions, besides the formula parameters and apparatus parameters of processing conditions 714 and 715, can also be displayed as processing conditions.

[0058] As described above, according to this embodiment, a change history is displayed as information about changes in exposure processing conditions. This helps in the analysis of faults in the exposure apparatus 204 and reduces the time required to overcome faults.

[0059] In the third embodiment, an example of displaying the processing conditions for a user-specified batch will be described below. Content not described in this embodiment is as described in the first embodiment.

[0060] Figure 10 It is illustrated with Figure 8 The diagram in the middle displays a graph showing the processing conditions for user-specified batches. Additionally, the user specifies a batch by selecting batch data plotted on graph 711 or by entering a batch name. Batch specification is achieved through computer input devices such as a mouse, keyboard, or touch panel, and the program controlling the input device.

[0061] Processing condition 724 displays the formulation parameters applied to batch data 722a to batch data 722c. Processing condition 725 displays the apparatus parameters applied to batch data 722a to batch data 722c. To make it easier for users to compare batch data 722a to batch data 722c, parameters that differ in processing conditions 724 and 725 can be highlighted, or only parameters that differ in processing conditions 724 and 725 can be displayed. Additionally, parameters can be displayed based on a preset priority order, or parameters that are determined to be unnecessary based on preset information can be omitted.

[0062] exist Figure 10 In the example illustrated in the diagram, the user first searches for characteristic points of change in the batch data from chart 711. The user specifies the characteristic points and the batch data 722a to 722c in their vicinity. The display device 306 displays processing conditions 724 and 725 applied to the batch data 722a to 722c. Based on the displayed processing conditions 724 and 725, the user can determine that changes in setpoints 1, 3, 5, and 6 are related to changes in the trend of the batch data. Therefore, the user can correct the settings of setpoints 1, 3, 5, and 6 to overcome the fault.

[0063] Furthermore, in a variation combining the second embodiment and this embodiment, the user-specified batch data processing conditions 724 and 725 can be mapped to Figure 711. Figure 9 The lines 712a, 712b, 713a, and 713b in the diagram are shown together.

[0064] As described above, according to this embodiment, the processing conditions of the user-specified batch are displayed to make it easier to identify the processing conditions that have malfunctioned. This reduces the time required to overcome the malfunction.

[0065] <Example of Article Manufacturing Method>

[0066] The article manufacturing method according to embodiments of the present invention is suitable for manufacturing articles such as microdevices—i.e., semiconductor devices and components with fine structures. The article manufacturing method according to this embodiment may include forming a patterned original on a substrate using an article manufacturing system and processing the substrate on which the pattern is formed. The article manufacturing method may also include other known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist removal, slicing, bonding, encapsulation). The article manufacturing method according to this embodiment is more advantageous than conventional methods in at least one aspect of article performance, quality, productivity, and production cost.

[0067] This invention relates to a technique that helps reduce the time spent analyzing the causes of failures in semiconductor manufacturing equipment.

[0068] Other embodiments

[0069] One or more embodiments of the present invention can also be implemented by a computer that reads and executes computer-executable instructions (e.g., one or more programs) recorded on a storage medium (which may also be more fully referred to as a "non-transient computer-readable storage medium") to perform the functions of one or more embodiments described above and / or includes one or more circuits (e.g., application-specific integrated circuits (ASICs)) for performing the functions of one or more embodiments described above, and by a method executed by a computer of a system or device, for example, by reading and executing computer-executable instructions from a storage medium to perform the functions of one or more embodiments described above and / or controlling one or more circuits to perform the functions of one or more embodiments described above. The computer may include one or more processors (e.g., a central processing unit (CPU), a microprocessor unit (MPU)) and may include a network of separate computers or separate processors to read and execute the computer-executable instructions. The computer-executable instructions may be provided to the computer, for example, from a network or storage medium. Storage media may include, for example, hard disks, solid-state drives (SSDs), random access memory (RAM), read-only memory (ROM), storage devices for distributed computing systems, and optical discs (such as CDs, DVDs, or Blu-ray discs). TM One or more of the following: flash memory devices, memory cards, etc.

[0070] Other embodiments

[0071] The embodiments of the present invention can also be implemented by providing software (programs) that perform the functions of the above embodiments to a system or device via a network or various storage media, and the computer or central processing unit (CPU) or microprocessor unit (MPU) of the system or device reads out and executes the program.

[0072] Although the invention has been described with reference to embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but is defined by the scope of the appended claims.

Claims

1. An information processing apparatus comprising: an acquisition unit configured to acquire information containing first processing data and second processing data, the first processing data indicating a result of substrate processing using a first recipe, the second processing data indicating a result of substrate processing using a second recipe different from the first recipe; and a display control unit configured to control display on a display device based on the information acquired by the acquisition unit, wherein the display control unit is configured to selectively display on the display device a first screen or a second screen, wherein the first screen displays a first data group of the first processing data arranged in a time order on a graph and a second data group of the second processing data arranged in a time order on a graph, the first screen displaying the first data group in one region and the second data group in another region, wherein the second screen displays the first data group and the second data group in the same region superimposed on each other, and wherein the first processing data and the second processing data are processed using different respective recipes in the same processing.

2. The information processing apparatus according to claim 1, wherein The display control unit is configured to display on the display device change history information of a recipe that has been changed. 3.The information processing apparatus according to claim 1, further comprising a calculation unit configured to calculate batch-based processing data based on substrate-based processing data acquired by the acquisition unit, the batch including a plurality of substrates.

4. The information processing apparatus according to claim 3, wherein The calculation unit is configured to calculate the batch-based processing data based on one of a maximum value, a minimum value, an average value, a median value, and a standard deviation from the substrate-based processing data acquired by the acquisition unit, the batch including the plurality of substrates.

5. The information processing apparatus according to claim 1, wherein The display control unit is configured to display on the display device a recipe for a batch of substrates specified by a user. 6.An information processing method comprising: acquiring information containing first processing data and second processing data, the first processing data indicating a result of substrate processing using a first recipe, the second processing data indicating a result of substrate processing using a second recipe different from the first recipe; and controlling display on a display device based on the acquired information, wherein the control is performed to selectively display on the display device a first screen or a second screen, wherein the first screen displays a first data group of the first processing data arranged in a time order on a graph and a second data group of the second processing data arranged in a time order on a graph, the first screen displaying the first data group in one region and the second data group in another region, wherein the second screen displays the first data group and the second data group in the same region superimposed on each other, and wherein the first processing data and the second processing data are processed using different respective recipes in the same processing. 7.A computer-readable storage medium storing a program for causing a computer to execute an information processing method including acquisition and control of display, wherein In the acquisition, information including first processing data and second processing data is acquired, the first processing data indicating a result of substrate processing using a first recipe, the second processing data indicating a result of substrate processing using a second recipe different from the first recipe, and wherein in the control display, display on the display device is controlled based on the acquired information, and a first screen or a second screen is selectively displayed, wherein the first screen displays a first data group in which the first processing data is arranged in chronological order on a graph and a second data group in which the second processing data is arranged in chronological order on a graph, the first screen displaying the first data group in one region and the second data group in another region, wherein the second screen displays the first data group and the second data group superimposed on each other in the same region, and wherein the first processing data and the second processing data are processed using different respective recipes in the same processing.

8. An article manufacturing system, comprising: the information processing apparatus according to any one of claims 1 to 5; and a pattern forming apparatus configured to form a pattern on a substrate, wherein the information processing apparatus manages a plurality of apparatuses including the pattern forming apparatus.

9. An article manufacturing method, comprising: forming a pattern on a substrate using the article manufacturing system according to claim 8; and performing at least one processing from oxidation, film formation, vapor deposition, doping, planarization, etching, resist removal, dicing, bonding, and packaging on the substrate on which the pattern is formed, wherein an article is manufactured from the processed substrate.

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