LED chips, backlight modules and electronic devices

Abstract

This invention relates to the field of multimedia technology and discloses a light-emitting diode (LED) chip, a backlight module, and an electronic device. The LED chip includes a chip holder, a light guide sheet, and an LED chip. The chip holder has a first side surface with a recessed mounting cavity. The light guide sheet is embedded in the mounting cavity and has a light-incident surface, a light-emitting surface adjacent to the light-incident surface, and a reflective surface. The light-emitting surface and the reflective surface are arranged opposite to each other, with the reflective surface facing the bottom surface of the mounting cavity. The LED chip is mounted on the side wall of the mounting cavity and is sandwiched between the light-incident surface and the side wall of the mounting cavity. The backlight module disclosed in this invention includes the aforementioned LED chip. The electronic device disclosed in this invention includes the aforementioned backlight module. The LED chip, backlight module, and electronic device disclosed in this invention have a large emission angle and uniform light energy distribution.

Description

Technical Field

[0001] This invention relates to the field of light-emitting diode technology, and particularly to light-emitting diode chips, backlight modules, and electronic devices. Background Technology

[0002] A light-emitting diode (LED) is a semiconductor component commonly used as a light source. It emits light by fixing LED chips within a light-emitting module. Existing LED chips consist of a chip holder and an LED chip. The LED chip is fixed to the bottom surface of the chip holder using an adhesive mixed with phosphor, which then coats the LED chip. Current LED chips suffer from technical problems such as a narrow beam angle and uneven light distribution.

[0003] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Summary of the Invention

[0004] The main objective of this invention is to provide light-emitting diode (LED) chips, backlight modules, and electronic devices, aiming to solve the technical problems of small light emission angle and uneven light energy distribution in the prior art.

[0005] To achieve the above objectives, the present invention provides a light-emitting diode (LED) lamp bead comprising: a chip holder, a light guide sheet, and an LED chip; the chip holder has a first side surface with a recessed mounting cavity; the light guide sheet is embedded in the mounting cavity and has a light-incident surface, a light-emitting surface adjacent to the light-incident surface, and a reflective surface, the light-emitting surface and the reflective surface being arranged opposite to each other, the reflective surface facing the bottom surface of the mounting cavity; the LED chip is mounted on the side wall of the mounting cavity and sandwiched between the light-incident surface and the side wall of the mounting cavity.

[0006] Optionally, the light-emitting diode (LED) chip also includes a phosphor layer, which is attached to the light-emitting surface.

[0007] Optionally, the side of the phosphor layer facing away from the light-emitting surface is flush with the first side of the wafer mount.

[0008] Optionally, the reflective surface has multiple light-guiding structures.

[0009] Optionally, the reflective surface includes a first region and a second region. The light intensity of the light-emitting diode chip illuminating the first region is less than the light intensity of the light-emitting diode chip illuminating the second region. Light guide structures are provided in both the first and second regions, and the density of the light guide structures in the first region is greater than the density of the light guide structures in the second region.

[0010] Optionally, the density of the light guide structure distribution gradually decreases from the region where the light intensity of the light emitted by the LED chip on the reflective surface is weakest to the region where the light intensity of the light emitted by the LED chip on the reflective surface is strongest.

[0011] Optionally, the light-emitting diode (LED) chip further includes: a reflective film disposed between the reflective surface and the bottom surface of the mounting cavity and / or the reflective film disposed between the LED chip and the bottom surface of the mounting cavity.

[0012] Optionally, the sidewall of the mounting cavity has a wafer mounting groove, in which the light-emitting diode wafer is mounted.

[0013] The backlight module proposed in this invention includes the aforementioned light-emitting diode (LED) beads.

[0014] The electronic device proposed in this invention includes the aforementioned backlight module.

[0015] In the technical solution of the present invention, the light guide sheet is embedded in the chip holder, and the light-emitting diode chip is mounted on the side wall of the chip holder and sandwiched between the light-incident surface of the light guide sheet and the side wall of the chip holder. The light emitted by the light-emitting diode chip enters the light guide sheet and is emitted from the light-emitting surface of the light guide sheet. After secondary light distribution by the light guide sheet, the light-emitting diode chip has a large emission angle and uniform light energy distribution. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the light-emitting diode lamp bead proposed in this invention;

[0018] Figure 2 This is a schematic diagram of the light distribution curve of an embodiment of the light-emitting diode lamp bead proposed in this invention;

[0019] Explanation of icon numbers:

[0020]

[0021]

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0025] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0026] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0027] In the prior art, the light-emitting diode chip 200 of the existing light-emitting diode lamp bead is fixed to the inner bottom surface of the chip holder 100 by adhesive mixed with phosphor. The adhesive mixed with phosphor forms a phosphor layer 400 on the surface of the light-emitting diode, and light is emitted from the phosphor layer 400.

[0028] The phosphor layer 400 is inside the chip holder 100. Due to the shape of the chip holder 100, the light emission angle of the LED beads is small and the light energy distribution is uneven. When applied to the backlight module, problems such as light shadow, dark corners, bright edges, and dark frames will occur. Therefore, in the backlight module, a high-cost film structure is required for shielding.

[0029] Furthermore, the LED chip 200 generates heat when emitting light, and the phosphor layer 400 also generates heat when excited. The combined heat from the LED chip and the phosphor layer 400 directly affects the lifespan of both. The heat from these two sources accumulates within the chip holder 100, resulting in high heat in the phosphor layer 400, which affects its excitation efficiency and leads to low light conversion efficiency. Because the combined heat from the LED chip 200 and the phosphor layer 400 within the LED chip is significant, a wider and thicker PCB board or heat sink aluminum strip is required to mount the LED chips in a backlight module with LED chips, ensuring reliable heat dissipation. This process is costly.

[0030] In edge-lit backlight modules equipped with existing LED chips, the light emission angle of the existing LED chips is only about 120° due to the limitation of the chip holder 100 shape. The light energy distribution is strong and concentrated in the middle and gradually weakens and disperses at both sides. Light energy loss areas, i.e., shadow areas, will be formed between each LED chip and between the LED chip and the edge of the light guide plate. When assembling the edge-lit backlight module, the dot pattern of the light guide plate needs to be adjusted accordingly, which will increase additional development costs and time. The LED chips in the edge-lit backlight module have a high design density. When the LED chips generate a lot of heat, a wider and thicker heat dissipation aluminum strip is needed as a carrier to install the LED chips.

[0031] In a direct-lit backlight module equipped with existing LED chips, in order to open up the light emission angle, reduce the number of LED chips used, and ultimately obtain a uniform surface light source, an optical lens needs to be set outside the LED chips, which increases the cost. Moreover, the light energy after passing through the optical lens is unevenly distributed in the diffuser plate, which will produce undesirable phenomena such as light shadows, dark corners, and bright edges. When the LED chips are hot, a wider and thicker PCB board is required as a carrier to install the LED chips.

[0032] The light-emitting diode (LED) beads, backlight modules, and electronic devices proposed in this invention have a large light-emitting angle and uniform light energy distribution.

[0033] like Figure 1 , Figure 2As shown, in an embodiment of the LED lamp bead proposed in this invention, the LED lamp bead includes: a chip holder 100, a light guide sheet 300, and an LED chip 200; the chip holder 100 has a first side surface, and the first side surface has a recessed mounting cavity; the light guide sheet 300 is embedded in the mounting cavity, and the light guide sheet 300 has a light-incident surface and a light-emitting surface and a reflective surface adjacent to the light-incident surface, the light-emitting surface and the reflective surface are arranged opposite to each other, and the reflective surface faces the bottom surface of the mounting cavity; the LED chip 200 is mounted on the side wall of the mounting cavity, and the LED chip 200 is sandwiched between the light-incident surface and the side wall of the mounting cavity.

[0034] The light guide sheet 300 can be made of glass or optical-grade acrylic sheet. The refractive index of the light guide sheet 300 is much greater than that of air.

[0035] The sidewall of the light guide 300 serves as the light incident surface of the light guide 300, and the light emitted by the light-emitting diode chip 200 enters the light guide 300 through the sidewall of the light guide 300.

[0036] The light-emitting diode chip 200 can be a blue light chip, but in specific applications, it can also be a chip for other colors of light such as red or green.

[0037] In the above embodiment, the light guide 300 is embedded in the chip holder 100, and the light-emitting diode chip 200 is mounted on the side wall of the chip holder 100 and sandwiched between the light-incident surface of the light guide 300 and the side wall of the chip holder 100. The light emitted by the light-emitting diode chip 200 enters the light guide 300 and is emitted from the light-emitting surface of the light guide 300. After secondary light distribution by the light guide 300, the light-emitting diode chip has a large emission angle and uniform light energy distribution.

[0038] The light-emitting diode chip 200 and the light guide sheet 300 form a small light control module. The above-described embodiment of the light-emitting diode chip can be assembled into an edge-lit backlight module or a direct-lit backlight module. When assembled into an edge-lit backlight module, the cost and time of adjusting the light shadow using a light guide plate within the edge-lit backlight module can be eliminated; when assembled into a direct-lit backlight module, there is no need to install optical lenses, saving on optical lens components and lens mounting processes.

[0039] As a further embodiment of the above, the light-emitting diode (LED) chip also includes a phosphor layer 400, which is attached to the light-emitting surface.

[0040] The phosphor layer 400 can be formed by coating with an adhesive mixed with phosphor, and the adhesive can be a resin adhesive.

[0041] In a further embodiment of the above, a phosphor layer 400 is attached to the light-emitting surface of the light guide 300. The light emitted from the light-emitting surface of the light guide 300 excites the phosphor layer 400 to emit light. The light-emitting diode chip 200 and the phosphor layer 400 are separated by the light guide 300. The light-emitting diode chip 200 and the phosphor layer 400 dissipate heat separately. The heat emitted by the light-emitting diode chip 200 and the heat emitted by the phosphor layer 400 will not be superimposed, which is beneficial for heat dissipation and improving the lifespan of the light-emitting diode chip 200 and the phosphor layer 400. Furthermore, since the heat accumulation at the phosphor layer 400 is reduced, the excitation efficiency of the phosphor layer 400 can be improved, the light energy conversion efficiency can be improved, and the luminous brightness can be improved. In addition, when the light-emitting diode lamp beads proposed in this application are assembled on the backlight module, since the heat dissipation performance of the light-emitting diode lamp beads proposed in this application is better, the width and thickness of the aluminum strips, PCB boards and other components used for heat dissipation in the backlight module can be reduced, which saves costs and reduces the size of the backlight module.

[0042] As a further embodiment of the above, the side of the phosphor layer 400 facing away from the light-emitting surface is flush with the first side surface of the wafer holder 100.

[0043] In a further embodiment of the above, the light emission angle of the light excited by the phosphor layer 400 is not limited by the shape of the chip holder 100 and the mounting cavity thereon, and can achieve an ultra-wide angle of about 170°. It can form an ultra-wide angle and uniformly diffused emitted light energy in all directions, which has obvious performance advantages when used in ultra-narrow bezel and ultra-thin shaped modules.

[0044] As a further embodiment of the above, the reflective surface has a plurality of light guiding structures 310, which are used to guide the light rays incident on themselves out of the light surface.

[0045] In a further embodiment of the above, the reflective surface has a good light guiding effect, and more light rays are emitted from the light-emitting surface.

[0046] As a further embodiment of the above, the reflective surface includes a first region and a second region. The light intensity of the LED chip 200 illuminating the first region is less than the light intensity of the LED chip 200 illuminating the second region. Light guide structures 310 are provided in both the first and second regions, with the density of the light guide structures 310 in the first region being greater than the density of the light guide structures 310 in the second region. This arrangement facilitates the conversion of light of different intensities received by each part of the light guide sheet 300 into uniform light and its emission.

[0047] It is understandable that the first and second areas can be adjacent or spaced apart.

[0048] As a further embodiment of the above, the density of the light guide structure 310 gradually decreases from the region where the light intensity of the light emitted by the LED chip 200 on the reflective surface is weakest to the region where the light intensity of the light emitted by the LED chip 200 on the reflective surface is strongest.

[0049] The density of the light guide structure 310 distribution changes in the opposite direction to the light intensity of the light emitted by the LED chip 200 on the reflective surface.

[0050] In a further embodiment of the above, after the light is guided by the light guide sheet 300, the light energy of the emitted light is uniform; when there is a phosphor layer 400, the light energy reaching all parts of the phosphor layer 400 is uniform, which is beneficial for the phosphor layer 400 to excite uniform light.

[0051] The light guide structure 310 can be a hemispherical dot pattern protruding towards the light-emitting surface, and the reflecting surface is a hemispherical dot pattern surface. When the light guide structure 310 is a hemispherical dot pattern, it can be injection molded, and the diameter of the hemispherical dot pattern can range from 0.01mm to 0.1mm.

[0052] The light guide structure 310 can also be a rhomboid or prismatic structure that protrudes towards the light-emitting surface.

[0053] When only one light-emitting diode chip 200 is provided, the light intensity of the light emitted by the light-emitting diode chip 200 on the reflective surface is weaker the farther away from the light-emitting diode chip 200. The density of the light guiding structure 310 on the reflective surface gradually increases from the side closer to the light-emitting diode chip 200 to the side farther away from the light-emitting diode chip 200.

[0054] As a further embodiment of the above, light-emitting diode chips 200 are provided on both sides of the light guide sheet 300. The light intensity emitted by the light-emitting diode chips 200 on both sides of the light guide sheet 300 is the same, and the light-emitting diode chips 200 on both sides of the light guide sheet 300 are arranged opposite to each other. The density of the light guide structure 310 gradually decreases from the middle area of ​​the reflective surface to the two sides where the light-emitting diode chips 200 are provided. The light guide structure 310 is symmetrically distributed with respect to the middle area.

[0055] In a further embodiment of the above, the light emitted from the light-emitting surface is uniform and has a strong intensity.

[0056] When the light-emitting diode chip 200 is evenly arranged around the light guide plate 300 and the light intensity emitted from each side of the light guide plate 300 is the same, the light intensity of the light emitted by the light-emitting diode chip 200 on the reflective surface gradually increases from the middle area of ​​the reflective surface to the surrounding areas, and the density of the light guide structure 310 distribution gradually decreases from the middle area of ​​the reflective surface to the surrounding areas.

[0057] When the light intensity emitted by the light-emitting diode chips 200 disposed on opposite sides of the light guide sheet 300 is inconsistent, the density of the light guide structure 310 is smaller on the sides near where the light-emitting diode chips 200 are disposed, and the area with the highest density of the light guide structure 310 is farther away from the light-emitting diode chip 200 with strong light intensity than from the light-emitting diode chip 200 with weak light intensity.

[0058] The density of the light guide structure 310 is determined by the position of the light-emitting diode chip 200.

[0059] As the light emitted by the LED chip 200 gradually weakens during propagation, the light intensity on the reflective surface also gradually weakens along the propagation path of the light. If the light guide structure 310 is evenly distributed on the reflective surface, the light energy of the light emitted after being guided by the light guide sheet 300 will be uneven.

[0060] As a further embodiment of the above, the light-emitting diode chip further includes: a reflective film 500, which is disposed between the reflective surface and the ground of the mounting cavity and / or between the light-emitting diode chip 200 and the ground of the mounting cavity.

[0061] The light guide 300 and the reflective film 500, or the bottom surface of the mounting cavity and the reflective film 500, can be bonded together with adhesive.

[0062] The reflective film 500 has a multi-layer stretched bubble structure inside, resulting in high light reflectivity.

[0063] The reflective film 500, the light-emitting diode chip 200, and the light guide sheet 300 constitute a small light control module.

[0064] In a further embodiment of the above, the reflective film 500 can reflect light into the light guide sheet 300, thereby improving the utilization rate of light energy.

[0065] As a further embodiment of the above, the bottom surface of the mounting cavity is a plane, and the sidewalls of the mounting cavity are perpendicular to its bottom surface.

[0066] In a further embodiment of the above, when a reflective film 500 is provided, the reflective film 500 is flatly attached to the bottom surface of the mounting cavity, and the reflection and light guiding are uniform; when there is no reflective film 500, the reflective surface of the light guide sheet 300 is flatly attached to the bottom surface of the mounting cavity, and the light guiding is uniform.

[0067] As a further embodiment of the above, the sidewall of the mounting cavity has a wafer mounting groove 110, and the light-emitting diode wafer 200 is mounted in the wafer mounting groove 110.

[0068] In a further embodiment of the above, it is convenient to install the light-emitting diode chip 200. After the light-emitting diode chip 200 is installed in the chip mounting groove 110, the sidewall of the light guide sheet 300 is attached to the sidewall of the mounting cavity except for the rest of the chip mounting groove 110, which is conducive to completely separating the outside of the light-emitting diode chip 200. In particular, when there is a phosphor layer 400, it is conducive to completely isolating the light-emitting diode chip 200 from the phosphor layer 400.

[0069] The sidewall of the light guide 300 is bonded to the sidewall of the mounting cavity, except for the chip mounting groove 110, by adhesive. Gaps are left between the light-emitting diode chip 200, the light guide 300, and the adhesive.

[0070] One side of the wafer mounting groove 110 extends to the bottom surface of the mounting cavity and is flush with the bottom surface of the mounting cavity. The reflective film on the bottom surface of the mounting cavity extends into the wafer mounting groove 110, which can further improve the light utilization rate. The portion of the side wall of the light guide 300 away from the reflective film is bonded to the side wall of the mounting cavity.

[0071] The sidewalls of the light guide 300 and the light-emitting diode chip 200 are both perpendicular to the bottom surface of the mounting cavity, and the light-emitting diode chip 200 emits light directly towards the light-incident surface of the light guide 300.

[0072] Of course, the chip mounting groove 110 may not be opened on the side wall of the mounting cavity. The mounting cavity is a columnar structure. In this case, lugs can be provided at both ends of the light-emitting diode chip to fix the light-emitting diode chip 200 to the side wall of the mounting cavity through the lugs.

[0073] As a further embodiment of the above, the light-incident surface is a polished surface.

[0074] In a further embodiment of the above-described solution, the light incident effect of the light incident surface can be improved.

[0075] As a further embodiment of the above, the light-emitting diode chip 200 is evenly arranged around the light guide sheet 300.

[0076] Multiple light-emitting diode chips 200 can be set, and all the light-emitting diode chips 200 are evenly mounted on the side wall of the mounting cavity around the light guide plate 300.

[0077] One light-emitting diode chip 200 can be set on each of the side walls on opposite sides of the mounting cavity, or three, four or more light-emitting diode chips 200 can be evenly distributed along the circumference of the light guide plate 300 on the side wall of the mounting cavity.

[0078] Alternatively, a ring-shaped light-emitting diode chip 200 can be arranged on the side wall of the mounting cavity, with the ring-shaped light-emitting diode chip 200 surrounding the light guide plate 300.

[0079] In a further embodiment of the above, the light intensity and uniformity entering the light guide sheet 300 can be improved, so that the light emitted by the light-emitting diode lamp bead is strong and uniform.

[0080] exist Figure 2 In the diagram, the origin point is where the LED chip proposed in this invention is located. The solid arc line in the diagram represents the light distribution curve. Figure 2 It can be seen that the light-emitting diode proposed in this invention has uniform light distribution and a large light emission angle.

[0081] In an embodiment of the backlight module proposed in this invention, the backlight module includes the aforementioned light-emitting diode (LED) beads.

[0082] The backlight module can be a side-lit backlight module or a direct-lit backlight module.

[0083] Since the backlight module proposed in this invention adopts all the technical features of the above-described embodiments of the light-emitting diode (LED) chips, it has at least all the beneficial effects brought about by the technical solutions of the above-described embodiments of the LED chips, which will not be repeated here.

[0084] In an embodiment of the electronic device proposed in this invention, the electronic device includes the backlight module described above.

[0085] Electronic devices can include televisions, monitors, flat panel lights, etc.

[0086] Since the electronic device proposed in this invention adopts all the technical features of the above-described backlight module embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-described backlight module embodiments, which will not be repeated here.

[0087] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A light emitting diode lamp, characterized in that, The LED lamp bead comprises: a wafer seat having a first side surface, the first side surface having a concave mounting cavity; a light guide plate embedded in the mounting cavity, the light guide plate having an incident light surface, an emitting light surface adjacent to the incident light surface, and a reflecting surface, the emitting light surface and the reflecting surface being oppositely arranged, and the reflecting surface facing a bottom surface of the mounting cavity; and a light emitting diode wafer mounted on a side wall of the mounting cavity, and the light emitting diode wafer being clamped between the incident light surface and the side wall of the mounting cavity. The LED lamp bead further comprises a phosphor layer attached to the emitting light surface, a surface of the phosphor layer away from the emitting light surface being flush with the first side surface of the wafer seat. The reflecting surface has a plurality of light guide structures, the reflecting surface comprising a first region and a second region, an intensity of light from the light emitting diode wafer on the first region being less than an intensity of light from the light emitting diode wafer on the second region, the light guide structures being arranged in both the first region and the second region, and a density of the light guide structures arranged in the first region being greater than a density of the light guide structures arranged in the second region.

2. The light emitting diode lamp of claim 1, wherein, The density of the light guide structures gradually decreases from a region on the reflecting surface having the weakest intensity of light from the light emitting diode wafer to a region on the reflecting surface having the strongest intensity of light from the light emitting diode wafer.

3. The light emitting diode lamp of claim 1 or 2, wherein the light emitting diode lamp is a light emitting diode chip. The LED lamp bead further comprises: a reflecting film arranged between the reflecting surface and the bottom surface of the mounting cavity, and / or arranged between the light emitting diode wafer and the bottom surface of the mounting cavity.

4. The light emitting diode lamp of claim 1 or 2, wherein the light emitting diode lamp is a light emitting diode chip. The side wall of the mounting cavity has a wafer mounting groove, and the light emitting diode wafer is mounted in the wafer mounting groove.

5. A backlight module, characterized in that, The LED lamp bead comprises any one of claims 1-4.

6. An electronic device, comprising: The backlight module comprises claim 5.

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