Pressure measurement system, method, foot structure, robot and storage medium

Abstract

The present application is applicable to the field of robotics technology, and provides a pressure measurement system, method, foot structure, robot and storage medium, including a processor, multiple signal amplification circuits and multiple thin film pressure sensors; the multiple thin film pressure sensors are evenly distributed on the sole of the robot; the thin film pressure sensor is configured to change its own resistance in response to the pressure applied to the sole of the foot; the signal amplification circuit is configured to output a corresponding voltage signal to the processor in response to the resistance change of the corresponding thin film pressure sensor; the processor is configured to obtain the conductance of the corresponding thin film pressure sensor according to the voltage signal output by each signal amplifier, and obtain the pressure of the sole of the foot according to the average value of the conductance of the multiple thin film pressure sensors and a preset correlation relationship. The application has a small size, low cost, a large resistance change range, high resolution, a simple and reliable measurement circuit, and improves the measurement accuracy of the sole pressure of the robot.

Description

Technical Field

[0001] The present application belongs to the field of robotics technology, and in particular relates to a pressure measurement system, method, foot structure, robot and storage medium. Background Art

[0002] Thin-film pressure sensors on the soles of robots' feet can effectively measure the forces acting on the soles of their feet, accurately determining the robot's motion state (for example, standing, walking, or running). This provides reference data for the robot's posture and motion control, helping it achieve excellent motion control performance. Existing six-axis force sensors are bulky and costly, making them unsuitable for use in small robots. Strain-gauge pressure sensors have a narrow resistance range, poor resolution, and complex measurement circuits, making them difficult to adapt to applications with wide stress ranges. Summary of the Invention

[0003] The embodiments of the present application provide a pressure measurement system, method, foot structure, robot and storage medium to solve the problems that existing six-dimensional force sensors have shortcomings such as large size and high cost, which make them inapplicable to small robot products; strain gauge pressure sensors have a small resistance value variation range, poor resolution, and complex measurement circuits, making them difficult to adapt to applications with a wide stress range.

[0004] A first aspect of an embodiment of the present application provides a pressure measurement system, comprising a processor, a plurality of signal amplification circuits, and a plurality of thin film pressure sensors;

[0005] The processor is electrically connected to the plurality of signal amplifying circuits respectively, each of the signal amplifying circuits is electrically connected to a corresponding thin film pressure sensor, and the plurality of thin film pressure sensors are evenly distributed on the sole of the robot;

[0006] The thin film pressure sensor is configured to change its resistance in response to pressure changes on the sole of the foot;

[0007] The signal amplification circuit is configured to output a corresponding voltage signal to the processor in response to a change in the resistance of the corresponding thin film pressure sensor;

[0008] The processor is specifically configured to:

[0009] Obtaining the conductance of the corresponding thin film pressure sensor according to the voltage signal output by each signal amplifier;

[0010] The pressure of the sole of the foot is obtained according to the average value of the conductance of the multiple thin film pressure sensors and a preset correlation relationship, where the preset correlation relationship is the correlation relationship between the pressure of the sole of the foot and the average value of the conductance of the multiple thin film pressure sensors.

[0011] A second aspect of the embodiments of the present application provides a foot structure, including a plantar plate, a board, and a pressure measurement system as described in the first aspect of the embodiments of the present application;

[0012] The board is arranged on the sole of the foot, the processor and the signal amplification circuit are arranged on the board, the multiple thin film pressure sensors are evenly distributed on the sole of the foot, and each thin film pressure sensor is electrically connected to the board via a flat cable.

[0013] A third aspect of the embodiments of the present application provides a robot comprising a plurality of foot structures as described in the second aspect of the embodiments of the present application.

[0014] A fourth aspect of the embodiments of the present application provides a pressure measurement method, which is implemented based on the pressure measurement system according to the first aspect of the embodiments of the present application, or based on the foot structure according to the second aspect of the embodiments of the present application, or based on the robot according to the third aspect of the embodiments of the present application. The method includes:

[0015] Obtaining the conductance of the corresponding thin film pressure sensor according to the voltage signal output by each signal amplifier;

[0016] The pressure of the sole of the foot is obtained according to the average value of the conductance of the multiple thin film pressure sensors and a preset correlation relationship, where the preset correlation relationship is the correlation relationship between the pressure of the sole of the foot and the average value of the conductance of the multiple thin film pressure sensors.

[0017] A fifth aspect of the embodiments of the present application provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the steps of the pressure measurement method described in the fourth aspect of the embodiments of the present application.

[0018] The first aspect of the embodiment of the present application provides a pressure measurement system, including a processor, multiple signal amplification circuits and multiple thin film pressure sensors; the processor is electrically connected to the multiple signal amplification circuits respectively, each signal amplification circuit is electrically connected to a corresponding thin film pressure sensor, and the multiple thin film pressure sensors are evenly distributed on the sole of the robot; the thin film pressure sensor is configured to change its own resistance in response to the pressure applied to the sole of the foot; the signal amplification circuit is configured to output a corresponding voltage signal to the processor in response to the change in the resistance of the corresponding thin film pressure sensor; the processor is configured to obtain the conductance of the corresponding thin film pressure sensor based on the voltage signal output by each signal amplifier, and obtain the pressure of the sole of the foot based on the average value of the conductance of the multiple thin film pressure sensors and a preset correlation relationship, the preset correlation relationship being the correlation between the pressure of the sole of the foot and the average value of the conductance of the multiple thin film pressure sensors. The system has a small size and low cost, and can be applied to small robot products. It has a large resistance variation range and high resolution. The measurement circuit is simple and reliable, and can adapt to applications with a wide stress range, thereby improving the measurement accuracy of the robot's sole pressure.

[0019] It can be understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0021] Figure 1 is a schematic structural diagram of a pressure measurement system provided in an embodiment of the present application;

[0022] Figure 2 Schematic diagram of the correlation between the conductance of the thin film pressure sensor provided by an embodiment of the present application and the pressure applied to the thin film pressure sensor;

[0023] Figure 3 1 is a schematic diagram of the circuit structure of the signal amplification circuit provided in an embodiment of the present application;

[0024] Figure 4 is a cross-sectional view of a foot structure provided by an embodiment of the present application;

[0025] Figure 5 is a perspective view of a foot structure provided by an embodiment of the present application;

[0026] Figure 6This is a schematic diagram of the first flow chart of the pressure measurement method provided in the embodiment of the present application;

[0027] Figure 7 This is a second flow chart of the pressure measurement method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0029] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0030] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0031] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0032] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0033] References to "one embodiment" or "some embodiments" in the present specification mean that one or more embodiments of the present application include a particular feature, structure or characteristic described in conjunction with the embodiment. Therefore, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized. "Multiple" means "two or more"

[0034] An embodiment of the present application provides a pressure measurement system that is applied to any type of robot with walking function. It is used to measure the pressure on the soles of the robot's feet through multiple thin film pressure sensors evenly distributed on the soles of the robot's feet. It is small in size and low in cost, can be used on small robot products, has a large resistance value variation range, high resolution, and a simple and reliable measurement circuit. It can adapt to applications with a wide stress range, thereby improving the measurement accuracy of the robot's sole pressure.

[0035] In applications, there are various types of robots with walking functions, such as service robots, entertainment robots, production robots, agricultural robots, etc., such as bionic educational robots, bionic welcoming robots, bionic dancing robots, bionic nanny robots, etc.

[0036] like Figure 1 As shown, the pressure measurement system provided by the embodiment of the present application includes a processor 1, multiple signal amplification circuits 2 and multiple thin film pressure sensors 3;

[0037] The processor 1 is electrically connected to a plurality of signal amplifying circuits 2, each signal amplifying circuit 2 is electrically connected to a corresponding thin film pressure sensor 3, and the plurality of thin film pressure sensors 3 are evenly distributed on the sole of the robot ( Figure 1 not shown);

[0038] The thin film pressure sensor 3 is configured to change its resistance in response to changes in the pressure on the sole of the foot;

[0039] The signal amplifying circuit 2 is configured to output a corresponding voltage signal to the processor 1 in response to a change in the resistance value of the corresponding thin film pressure sensor 2;

[0040] The processor 1 is configured to obtain the pressure level of the sole of the foot according to the voltage signals output by the plurality of signal amplifying circuits 2 .

[0041] In applications, the processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0042] In applications, the signal amplification circuit can be implemented by an operational amplifier and its peripheral electronic components. The operational amplifier can be a high-precision precision operational amplifier.

[0043] In application, a thin film pressure sensor with a corresponding pressure sensing range and resistance range can be selected based on the range of pressure changes on the sole of the robot during actual movement. For example, the resistance range of the thin film pressure sensor can be 0 ohm (Ω) to 10 megaohms (MΩ). The number of thin film pressure sensors can be set according to actual needs, and can be set according to the area or shape of the sole of the robot. For example, the number of thin film pressure sensors can be positively correlated with the area of ​​the sole of the robot. Alternatively, when the shape of the sole of the robot is rectangular or quasi-rectangular, the number of thin film pressure sensors is at least four, and the four thin film pressure sensors are respectively arranged at the four azimuths of the sole of the robot. Alternatively, when the shape of the sole of the robot is the shape of a human foot, the number of thin film pressure sensors is at least six, and the six thin film pressure sensors are respectively arranged at the five toes and the heel.

[0044] In applications, when the robot is in any motion state, such as standing (which can be considered a motion state with a speed of zero), walking, or running, the soles of its feet will be subject to external pressure. When the robot's feet are not under any pressure, the pressure on the soles of its feet is zero. The thin film pressure sensor changes its resistance in response to the pressure change on the soles of the robot's feet, causing the signal amplification circuit to respond to the resistance change of the thin film pressure sensor electrically connected to it and output a voltage signal with a corresponding voltage magnitude to the processor. The processor then calculates the pressure magnitude on the soles of the robot's feet based on the voltage magnitudes of the voltage signals output by all signal amplification circuits. The pressure magnitude on the soles of the robot's feet can be used to accurately determine the robot's motion state, provide reference data for the robot's posture and motion control, and help the robot achieve excellent motion control performance.

[0045] In one embodiment, the processor is specifically configured to:

[0046] First, the voltage signal output by each signal amplifier is collected and analog-to-digital converted to obtain the voltage magnitude of the voltage signal output by each signal amplifier;

[0047] Then, the conductance of each thin film pressure sensor is calculated based on the voltage of the voltage signal output by each signal amplifier and the characteristic parameters of each electronic component in each signal amplification circuit;

[0048] Finally, the pressure on the sole of the robot is obtained based on the average value of the conductance of all thin film pressure sensors and a preset correlation relationship. The preset correlation relationship is the correlation relationship between the pressure on the sole of the robot and the average value of the conductance of all thin film pressure sensors.

[0049] In application, the processor can be a processor with an analog-to-digital conversion function. When the processor does not have the analog-to-digital conversion function, a multi-input single-output analog-to-digital converter can be electrically connected between all signal amplification circuits and the processor, or a single-input single-output analog-to-digital converter can be electrically connected between each signal amplification circuit and the processor.

[0050] In practice, the linearity of the resistance characteristics of thin-film pressure sensors is poor, but the linearity of their conductivity characteristics is good. By performing a linear fit on the conductivity characteristics of thin-film pressure sensors at different pressures, a correlation between the pressure applied to the thin-film pressure sensor and its conductivity can be obtained. Since the pressure applied to the sole of the robot's foot is equal to the pressure applied to the thin-film pressure sensor, this correlation is also a correlation between the pressure at the sole of the robot's foot and the conductivity of the thin-film pressure sensor. By installing multiple thin-film pressure sensors on the sole of the robot's foot and obtaining a correlation between the pressure at the sole of the robot's foot and the average value of the conductivity of all thin-film pressure sensors, a more accurate pressure measurement of the robot's foot can be obtained based on this correlation and the average value of the conductivity of all thin-film pressure sensors during the actual movement of the robot, thereby improving pressure measurement accuracy.

[0051] In one embodiment, the processor is specifically configured to:

[0052] When a preset pressure is applied to the sole of the robot's foot, the conductance of each corresponding thin film pressure sensor under the preset pressure is obtained according to the voltage signal output by each signal amplifier;

[0053] A preset correlation relationship is obtained based on the correlation relationship between the average value of the conductance of all the thin film pressure sensors under multiple different preset pressures and the multiple different preset pressures.

[0054] In application, since all thin film pressure sensors are evenly distributed on the sole of the robot's foot, when pressure is applied to the sole of the robot's foot, the pressures exerted on all thin film pressure sensors can be considered to be the same. However, since different thin film pressure sensors may be subjected to different pressures, there may also be certain measurement errors between different thin film pressure sensors. Therefore, after obtaining the conductance of all thin film pressure sensors, the average value of the conductance of all thin film pressure sensors can be calculated, and then the correlation between the average value of the conductance of all thin film pressure sensors at a preset pressure and the preset pressure can be obtained based on the average value.

[0055] In application, the correlation between the average value of the conductivity of all thin film pressure sensors under a preset pressure and the preset pressure can be used as a preset correlation. During the actual movement of the robot, a more accurate pressure on the sole of the robot's foot can be obtained based on the preset correlation and the average value of the conductivity of all thin film pressure sensors.

[0056] In application, in order to further improve the measurement accuracy of the pressure on the sole of the robot's foot, the average value of the conductance of all thin film pressure sensors at multiple different preset pressures and multiple different preset pressures can be linearly fitted to obtain a preset correlation relationship. The preset correlation relationship satisfies the correlation relationship between the average value of the conductance of all thin film pressure sensors at each preset pressure and each preset pressure, that is, based on the preset correlation relationship and the average value of the conductance of all thin film pressure sensors at each preset pressure, each corresponding preset pressure can be calculated. During the actual movement of the robot, a more accurate pressure on the sole of the robot's foot can be obtained based on the preset correlation relationship and the average value of the conductance of all thin film pressure sensors.

[0057] like Figure 2 As shown, the correlation between the conductance of a single thin film pressure sensor and the pressure applied to the thin film pressure sensor is exemplified; wherein the horizontal axis is conductance, the vertical axis is pressure, y=0.0035x+0.0007 is the expression of the correlation relationship, y represents pressure, x represents conductance, 0.0035 and 0.0007 are constants obtained by linearly fitting the conductance of the thin film pressure sensor at multiple different pressures and multiple different pressures.

[0058] like Figure 3 As shown, in one embodiment, the signal amplifying circuit 2 includes an operational amplifier U1, a first resistance unit, a second resistance unit and a third resistance unit;

[0059] The non-inverting input terminal of the operational amplifier U1 is electrically connected to the first end of the first resistor unit, the inverting input terminal of the operational amplifier U1 is electrically connected to the output terminal of a thin film pressure sensor 3 and the first end of the third resistor unit, the positive power supply terminal of the operational amplifier U1 is connected to the reference voltage source VCC, the negative power supply terminal of the operational amplifier U1 is grounded, and the output terminal of the operational amplifier U1 is electrically connected to the voltage signal acquisition terminal Force_A of the processor and the second end of the third resistor unit;

[0060] The second end of the first resistance unit is electrically connected to the first end of the second resistance unit;

[0061] The second end of the second resistance unit is grounded.

[0062] In applications, the first resistance unit, the second resistance unit, and the third resistance unit can all be implemented by one resistor or multiple resistors connected in series. Figure 3 exemplarily shown in FIG. 1 , the first resistance unit includes a first resistor R1 , the second resistance unit includes a second resistor R2 , and the third resistance unit includes a third resistor R3 .

[0063] like Figure 3 As shown, in one embodiment, the signal amplifying circuit 2 further includes a filtering unit;

[0064] The filter unit is electrically connected between the output terminal of the operational amplifier U1 and the voltage signal acquisition terminal Force_A of the processor.

[0065] In applications, the filtering unit may be a low-pass filtering unit, which may be implemented by an L-type or π-type filtering circuit consisting of at least one resistor and at least one capacitor.

[0066] In one embodiment, the filtering unit includes a fourth resistor unit and a first capacitor unit;

[0067] A first end of the fourth resistance unit is electrically connected to the output end of the operational amplifier, and a second end of the fourth resistance unit is electrically connected to the input end of the first capacitance unit and the processor;

[0068] An output terminal of the first capacitor unit is grounded.

[0069] In applications, the fourth resistance unit can be implemented by one resistor or multiple resistors connected in series, and the first capacitance unit can be implemented by one capacitor or multiple capacitors connected in parallel. Figure 3 exemplarily shown in FIG4 , the fourth resistor unit includes a fourth resistor R4 , and the first capacitor unit includes a first capacitor C1 .

[0070] like Figure 3 As shown, in one embodiment, the signal amplifying circuit 2 further includes a second capacitor unit;

[0071] The second capacitor unit is electrically connected between the inverting input terminal and the output terminal of the operational amplifier U1 .

[0072] In applications, the second capacitor unit can be implemented by a single capacitor or multiple capacitors connected in parallel. The second capacitor unit is a compensation capacitor unit used to maintain the voltage amplification factor of the operational amplifier at a high level, change the phase shift of the feedback network, and compensate for the signal lag of the operational amplifier. Figure 3 exemplarily shown in FIG. 5 , the second capacitor unit includes a second capacitor C2.

[0073] like Figure 3 As shown, in one embodiment, the signal amplifying circuit 2 further includes a third capacitor unit;

[0074] The third capacitor unit is electrically connected between the positive power supply terminal of the operational amplifier U1 and the ground.

[0075] In applications, the third capacitor unit can be implemented by a single capacitor or multiple capacitors connected in parallel. The third capacitor unit is a decoupling capacitor unit, which is used to reduce the impedance from the reference voltage source, power supply noise, and increase the stability of the operational amplifier. Figure 3 exemplarily shown in FIG, the third capacitor unit includes a third capacitor C3.

[0076] In one embodiment, based on the specific circuit structure of the signal amplification circuit provided in any of the above embodiments, the calculation formula for the conductance of each thin film pressure sensor is:

[0077] Vo=(1 / Rx+1 / R3)*Vcc*R2 / (R1+R2)

[0078] Wherein, Vo represents the voltage of the voltage signal output by the signal amplifier, Rx represents the resistance of the thin film pressure sensor, 1 / Rx represents the conductance of the thin film pressure sensor, R3 represents the resistance of the third resistance unit, Vcc represents the voltage of the reference voltage source, R1 represents the resistance of the first resistance unit, and R2 represents the resistance of the second resistance unit.

[0079] In applications, based on the specific circuit structure of the signal amplification circuit, the processor can calculate the conductance of each thin film pressure sensor based on the above calculation formula.

[0080] like Figure 4 or Figure 5 As shown, in one embodiment, the pressure measurement system further includes a power interface 4 and a communication interface 5;

[0081] The power interface 4 is electrically connected to the processor 1 and the plurality of signal amplifying circuits 2 respectively;

[0082] The communication interface 5 is electrically connected to the processor 1;

[0083] The power interface 4 is configured to electrically connect to an external power source to provide working power to the processor 1 and a reference voltage source to the signal amplifying circuit 2;

[0084] The communication interface 5 is configured to be electrically connected to an external device.

[0085] In applications, an external power source can be a power source for the robot located outside the mainboard, such as a battery installed in the robot, specifically a rechargeable lithium battery. An external power source can also be an external power source located outside the robot, such as an AC power source, a power-frequency AC power source, an AC or DC power source provided by a generator or battery. External devices specifically refer to other components of the robot located outside the mainboard, such as the robot's display screen, control panel, audio device, signal lights, etc.

[0086] like Figure 4 or Figure 5 As shown, an embodiment of the present application further provides a foot structure, including a foot plate 101, a board 102 and the above-mentioned pressure measurement system;

[0087] The board 102 is set in a local area of ​​the sole plate 101, the processor and signal amplification circuit are set on the board 102, and multiple thin film pressure sensors 3 are evenly distributed on the sole plate 101. Each thin film pressure sensor 3 is electrically connected to the board 102 through a cable 103.

[0088] In application, the board can be integrated into any local area of ​​the sole plate according to actual needs to save space and reduce volume. It can also be the same shape as the sole plate and cover the entire area of ​​the sole plate, which is conducive to heat dissipation and production manufacturing.

[0089] In application, the shape of the sole plate is the shape of the sole of the robot. Please refer to the relevant description in the above embodiment and will not be repeated here. Figure 4 and Figure 5 The pressure measurement system exemplarily shown in FIG. 1 includes four thin film pressure sensors 3 , which are evenly distributed at four different positions of the sole plate 101 .

[0090] like Figure 4 or Figure 5 As shown, in one embodiment, the foot structure further includes a support frame 104;

[0091] The support frame 104 is set on the sole plate 101, and multiple thin film pressure sensors 3 are evenly distributed between the support frame 104 and the sole plate 101. Elastic components are filled between each thin film pressure sensor 3 and the support frame 104 and between the support frame 104 and the sole plate 101.

[0092] In applications, the elastic component can be made of any non-conductive, soft and elastic material, so that the thin film pressure sensor can better contact the force-bearing surface of the sole of the foot.

[0093] An embodiment of the present application provides a pressure measurement method that can be executed by a processor when running a corresponding computer program. By obtaining the conductance of the corresponding thin film pressure sensor based on the voltage signal output by each signal amplifier, and then obtaining the pressure of the sole of the foot based on the average value of the conductance of multiple thin film pressure sensors and a preset correlation relationship, the measurement accuracy of the sole pressure of the robot can be improved.

[0094] like Figure 6 As shown, the pressure measurement method provided in the embodiment of the present application includes the following steps S101 and S102 executed by the processor:

[0095] Step S101: obtaining the conductance of the corresponding thin film pressure sensor according to the voltage signal output by each signal amplifier;

[0096] Step S102: Obtain the pressure of the sole of the foot according to the average value of the conductance of the multiple thin film pressure sensors and a preset correlation relationship, wherein the preset correlation relationship is the correlation relationship between the pressure of the sole of the foot and the average value of the conductance of the multiple thin film pressure sensors.

[0097] In the application, step 101 specifically includes the following steps executed by the processor:

[0098] First, the voltage signal output by each signal amplifier is collected and analog-to-digital converted to obtain the voltage magnitude of the voltage signal output by each signal amplifier;

[0099] Then, the conductance of each thin film pressure sensor is calculated based on the voltage of the voltage signal output by each signal amplifier and the characteristic parameters of each electronic component in each signal amplification circuit;

[0100] Finally, the pressure on the sole of the robot is obtained based on the average value of the conductance of all thin film pressure sensors and a preset correlation relationship. The preset correlation relationship is the correlation relationship between the pressure on the sole of the robot and the average value of the conductance of all thin film pressure sensors.

[0101] like Figure 7 As shown, in one embodiment, step S101 includes the following steps S103 and S104:

[0102] Step S103: when a preset pressure is applied to the sole of the foot, obtaining the conductance of each corresponding thin film pressure sensor under the preset pressure according to the voltage signal output by each signal amplifier;

[0103] Step S104 : performing linear fitting on an average value of the conductances of the plurality of thin film pressure sensors at a plurality of different preset pressures and the plurality of different preset pressures to obtain a preset correlation relationship.

[0104] In the application, step S104 can be equivalently replaced by the following steps:

[0105] The correlation between the average value of the conductance of the plurality of thin film pressure sensors at the preset pressure and the preset pressure is obtained to obtain a preset correlation.

[0106] In one embodiment, the robot further includes a memory storing a computer program that can be run on a processor. When the processor executes the computer program, the steps in the above-mentioned pressure measurement method embodiment are implemented.

[0107] In application, the robot may include, but is not limited to, multiple foot structures and memory. The above embodiments are merely examples of robots and do not constitute a limitation on the robot. The robot may include more or fewer components than those in the above embodiments, or a combination of certain components, or different components. For example, the robot may also include moving components, input / output devices, network access devices, etc. Moving components may include servos, motors, drivers, and other devices for driving the movement of the robot's joints. Input / output devices may include the aforementioned human-machine interaction devices and may also include a display screen for displaying the robot's operating parameters. The network access device may include a communication module for communication between the robot and a user terminal.

[0108] In applications, in some embodiments, the memory can be the robot's internal storage unit, such as the robot's hard drive or memory. In other embodiments, the memory can also be an external storage device of the robot, such as a plug-in hard drive, a Smart Media Card (SMC), a Secure Digital (SD) card, a Flash Card, etc. The memory can also include both the robot's internal storage unit and an external storage device. The memory is used to store operating systems, application programs, boot loaders, data, and other programs, such as the program code of computer programs. The memory can also be used to temporarily store data that has been output or is about to be output.

[0109] In applications, the display screen can be a thin film transistor liquid crystal display (TFT-LCD), a liquid crystal display (LCD), an organic electroluminesence display (OLED), a quantum dot light emitting diode (QLED) display screen, a seven-segment or eight-segment digital tube, etc.

[0110] In applications, the communication module can be set to any device that can directly or indirectly communicate with the client over long distances, either wired or wirelessly, according to actual needs. For example, the communication module can provide communication solutions for network devices, including wireless local area networks (WLAN) (such as Wi-Fi networks), Bluetooth, Zigbee, mobile communication networks, global navigation satellite systems (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), and other communication technologies. The communication module can include an antenna, which can have only one element or an antenna array including multiple elements. The communication module can receive electromagnetic waves through the antenna, frequency modulate and filter the electromagnetic wave signals, and then send the processed signals to the processor. The communication module can also receive signals to be sent from the processor, frequency modulate and amplify them, and convert them into electromagnetic waves for radiation through the antenna.

[0111] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / modules are based on the same concept as the method embodiment of this application. Their specific functions and technical effects can be found in the method embodiment section and will not be repeated here.

[0112] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The functional modules in the embodiment can be integrated into a processing module, or each module can exist physically alone, or two or more modules can be integrated into one module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software functional modules. In addition, the specific names of the functional modules are only for the convenience of distinguishing each other and are not used to limit the scope of protection of this application. The specific working process of the modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0113] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned pressure measurement method embodiment can be implemented.

[0114] An embodiment of the present application provides a computer program product. When the computer program product is run on a robot, the robot can implement the steps in the above-mentioned pressure measurement method embodiment.

[0115] If the integrated module is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the process in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program, when executed by the processor, can implement the steps of the above-mentioned various method embodiments. Wherein, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form, etc. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the robot, a recording medium, a computer memory, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), an electric carrier signal, a telecommunication signal and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk, etc.

[0116] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0117] Those skilled in the art will appreciate that the modules and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0118] In the embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the modules is merely a logical function division. In actual implementation, there may be other division methods, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0119] The modules described as separate components may or may not be physically separate, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed across multiple network modules. Some or all of the modules may be selected to achieve the purpose of the present embodiment according to actual needs.

[0120] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A pressure measurement system, characterized in that: including a processor, a plurality of signal amplification circuits and a plurality of thin film pressure sensors; Each of the signal amplifying circuits is connected between the processor and a corresponding one of the thin film pressure sensors, and the multiple thin film pressure sensors are evenly distributed on the sole of the robot; The thin film pressure sensor is configured to change its resistance in response to pressure changes on the sole of the foot; The signal amplification circuit is configured to output a corresponding voltage signal to the processor in response to a change in the resistance of the corresponding thin film pressure sensor; The processor is specifically configured to: According to the voltage signal output by each signal amplifier, the conductance of the corresponding thin film pressure sensor is obtained; Obtaining the pressure of the sole of the foot according to an average value of the conductances of the plurality of thin film pressure sensors and a preset correlation relationship, wherein the preset correlation relationship is a correlation relationship between the pressure of the sole of the foot and the average value of the conductances of the plurality of thin film pressure sensors; The signal amplifying circuit includes an operational amplifier, a first resistance unit, a second resistance unit and a third resistance unit; The non-inverting input terminal of the operational amplifier is electrically connected to the first end of the first resistance unit, the inverting input terminal of the operational amplifier is electrically connected to the output terminal of one of the thin film pressure sensors and the first end of the third resistance unit, the positive power supply terminal of the operational amplifier is connected to a reference voltage source, the negative power supply terminal of the operational amplifier is grounded, and the output terminal of the operational amplifier is electrically connected to the voltage signal acquisition terminal of the processor and the second end of the third resistance unit; The second end of the first resistance unit is electrically connected to the first end of the second resistance unit; The second end of the second resistance unit is grounded; The processor is specifically configured to obtain the voltage of the voltage signal output by the signal amplifier according to the resistance values ​​of the first resistance unit, the second resistance unit, the third resistance unit and the thin film pressure sensor and the voltage of the reference voltage source.

2. The pressure measurement system according to claim 1, wherein: The calculation formula of the voltage of the pressure signal is: Vo=(1 / Rx+1 / R3)*Vcc*R2 / (R1+R2) Among them, Vo represents the voltage of the voltage signal, Rx represents the resistance of the thin film pressure sensor, 1 / Rx represents the conductance of the thin film pressure sensor, R3 represents the resistance of the third resistance unit, Vcc represents the voltage of the reference voltage source, R1 represents the resistance of the first resistance unit, and R2 represents the resistance of the second resistance unit.

3. The pressure measurement system according to claim 1, wherein: The signal amplifying circuit further includes a filtering unit; The filtering unit is electrically connected between the output terminal of the operational amplifier and the processor.

4. The pressure measurement system according to claim 3, wherein: The filtering unit includes a fourth resistor unit and a third capacitor unit; A first end of the fourth resistor unit is electrically connected to the output end of the operational amplifier, and a second end of the fourth resistor unit is electrically connected to the input end of the third capacitor unit and the processor; An output terminal of the third capacitor unit is grounded.

5. The pressure measurement system according to claim 1, wherein: The signal amplifying circuit further includes a second capacitor unit and a third capacitor unit; The second capacitor unit is electrically connected between the inverting input terminal and the output terminal of the operational amplifier; The third capacitor unit is electrically connected between the positive power supply terminal of the operational amplifier and the ground.

6. The pressure measurement system according to any one of claims 1 to 5, characterized in that: Also includes power supply and communication interfaces; The power supply is electrically connected to the processor and the plurality of signal amplifying circuits respectively; The communication interface is electrically connected to the processor; The power supply is configured to provide an operating power supply for the processor and a reference voltage source for the signal amplifying circuit; The communication interface is configured to electrically connect to an external device.

7. The pressure measurement system according to any one of claims 1 to 5, characterized in that: The processor is specifically configured to: When a preset pressure is applied to the sole of the foot, obtaining the conductance of each corresponding thin film pressure sensor under the preset pressure according to the voltage signal output by each signal amplifier; A linear fit is performed on an average value of the conductances of the plurality of thin film pressure sensors at a plurality of different preset pressures and the plurality of different preset pressures to obtain the preset correlation relationship.

8. A foot structure, characterized in that: comprising a plantar plate, a board and a pressure measurement system according to any one of claims 1 to 7; The board is arranged on the sole of the foot, the processor and the signal amplification circuit are arranged on the board, the multiple thin film pressure sensors are evenly distributed on the sole of the foot, and each thin film pressure sensor is electrically connected to the board via a flat cable.

9. The foot structure according to claim 8, wherein: The foot structure also includes a support frame; The support frame is arranged on the sole of the foot, the multiple thin film pressure sensors are evenly distributed between the support frame and the sole of the foot, and elastic components are filled between the thin film pressure sensors and the support frame and between the support frame and the sole of the foot.

10. The foot structure according to claim 8 or 9, characterized in that The pressure measurement system includes four thin film pressure sensors, which are evenly distributed at four different positions on the sole of the foot.

11. A robot, characterized in that: The method comprises a plurality of foot structures according to any one of claims 8 to 10.

12. A pressure measurement method, characterized in that: The method is implemented based on the pressure measurement system according to any one of claims 1 to 7, or based on the foot structure according to any one of claims 8 to 10, or based on the robot according to claim 11, and includes: According to the voltage signal output by each signal amplifier, the conductance of the corresponding thin film pressure sensor is obtained; The pressure of the sole of the foot is obtained according to the average value of the conductance of the multiple thin film pressure sensors and a preset correlation relationship, where the preset correlation relationship is the correlation relationship between the pressure of the sole of the foot and the average value of the conductance of the multiple thin film pressure sensors.

13. The pressure measurement method according to claim 12, wherein: Before obtaining the conductance of the corresponding thin film pressure sensor according to the voltage signal output by each signal amplifier, the method includes: When a preset pressure is applied to the sole of the foot, obtaining the conductance of each corresponding thin film pressure sensor under the preset pressure according to the voltage signal output by each signal amplifier; A linear fitting is performed on an average value of the conductances of the plurality of thin film pressure sensors at a plurality of different preset pressures and the plurality of different preset pressures to obtain a preset correlation relationship.

14. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the pressure measurement method according to claim 12 or 13 are implemented.

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