Atomizer components, atomizers and electronic atomizer devices

Abstract

The present invention discloses an atomizing element, an atomizer and an electronic atomizing device. The atomizing element includes a substrate and a heating film; the substrate has an atomizing surface; the heating film is arranged on the atomizing surface, and can heat and atomize the aerosol-generating matrix on the atomizing surface when powered on; the heating film includes an inorganic protective layer and a metal heating layer arranged in layers; wherein the inorganic protective layer is located on the surface of the metal heating layer away from the substrate; the metal heating layer includes at least two layers of sub-metal layers stacked in sequence, and the components of any two adjacent metal layers are different. The atomizing element, the atomizer and the electronic atomizing device can improve the stability and life of the atomizing element and reduce the cost of the atomizing element.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomization devices, and in particular to an atomization element, an atomizer and an electronic atomization device. Background Art

[0002] An electronic atomization device is a device that can heat an aerosol generating substrate to generate aerosol. Its atomization element usually includes a ceramic substrate and a metal film arranged on the atomization surface of the ceramic substrate. When the metal film is energized, it heats the aerosol generating substrate near the atomization surface.

[0003] The metal film is prone to oxidation failure during the sintering and atomization process, especially when the oil supply is insufficient during the atomization process, which seriously affects the stability and life of the electronic atomization device. Therefore, the existing atomization components use heating metal films containing precious metal materials and with a relatively high proportion of precious metals. The precious metals are usually materials such as gold and platinum. However, when the oil supply is insufficient, the heating metal film with a high proportion of precious metals is prone to overburning, and the precious metal particles therein are prone to agglomeration, which in turn causes the metal film to fail, reducing the stability and life of the atomization component; and the cost of precious metals is relatively high, which makes the cost of the atomization component relatively high. Summary of the invention

[0004] The atomizing element, atomizer and electronic atomizing device provided by the present invention can solve the problems of poor stability and short life of the atomizing element.

[0005] In order to solve the above technical problems, the first technical solution provided by the present application is: to provide an atomizing element, including a substrate and a heating film; the substrate has an atomizing surface; the heating film is arranged on the atomizing surface, and can heat and atomize the aerosol-generating substrate on the atomizing surface when powered on;

[0006] The heating film comprises a metal heating layer and an inorganic protective layer which are stacked; wherein the inorganic protective layer is arranged on the surface of the metal heating layer away from the substrate;

[0007] The metal heating layer comprises at least two sub-metal layers stacked in sequence; the components of any two adjacent sub-metal layers are different.

[0008] Among them, the substrate is a porous substrate; or, the metal heating layer and / or the inorganic protective layer is a porous structure.

[0009] Wherein, the inorganic protective layer includes at least one of a ceramic material and a glass material.

[0010] The inorganic protective layer has lipophilicity and / or hydrophilicity.

[0011] The metal heating layer includes a stacked first sub-metal layer and a second sub-metal layer; the first sub-metal layer is made of NiCr or 316L stainless steel, and the second sub-metal layer is made of TiZr.

[0012] The metal heating layer is in contact with the substrate through the second sub-metal layer.

[0013] The number of layers of the first sub-metal layer and the second sub-metal layer are both at least two.

[0014] The total thickness of the first sub-metal layer is 1 μm-20 μm, the total thickness of the second sub-metal layer is 0.5 μm-5 μm, and the thickness of the inorganic protective layer is 0.1 μm-5 μm.

[0015] Among them, the shape of the heating film or the metal heating layer is S-shaped, circular, elliptical, semicircular or ring-shaped.

[0016] The atomizing element further includes two electrodes, which are respectively arranged on opposite sides of the metal heating layer and electrically connected to the metal heating layer; the inorganic protective layer covers the portion of the metal heating layer located between the two electrodes.

[0017] The heating film is rectangular, two electrodes are arranged on two opposite sides of the rectangle, and a non-heat-generating hollow portion is arranged in the rectangular heating film.

[0018] Among them, the hollow part includes a first hollow part and a second hollow part. The first hollow part is located on the other two opposite sides of the rectangle and is fan-shaped; the second hollow part is located in the middle of the heating film and is elliptical or circular.

[0019] The atomized surface of the porous substrate is also provided with a modification layer; the thickness of the modification layer is 50 μm-300 μm.

[0020] The modified layer includes the following components in parts by mass: 56-67.5 parts of silicon dioxide, 12-18 parts of aluminum oxide and 2.8-5.5 parts of lithium oxide.

[0021] In order to solve the above technical problems, the second technical solution provided in the present application is: to provide a nebulizer, including a liquid reservoir and a nebulizer element, the liquid reservoir is used to store an aerosol-generating matrix, wherein the nebulizer element is the nebulizer element involved in any of the above items.

[0022] In order to solve the above technical problems, the third technical solution provided by the present application is: through an electronic atomization device, including a battery assembly and an atomizer, the battery assembly is used to power the atomizer, wherein the atomizer is the atomizer involved in any of the above items.

[0023] The atomizing element, atomizer and electronic atomizing device provided by the present invention are characterized in that the atomizing element is provided with a heating film, and the heating film is provided on a substrate, so that the heating film generates heat when power is supplied, thereby forming an aerosol-generating matrix on the atomizing surface of the atomizing substrate. The heating film includes a metal heating layer and an inorganic protective layer arranged in layers. The metal heating layer includes at least two sub-metal layers stacked in sequence, and the components of any two adjacent sub-metal layers are different. By setting the components of any two adjacent sub-metal layers to be different, the internal stress of the metal heating layer can be reduced. On the one hand, the continuity of the metal heating layer film can be improved to avoid cracks in the metal heating layer; on the other hand, the risk of crack failure of the heating film under thermal shock is also reduced.

[0024] In addition, by arranging an inorganic protective layer on the surface of the metal heating layer away from the substrate, not only can the inorganic protective layer protect the metal heating layer, but also due to the low cost of inorganic materials, the production cost of the atomization element can be reduced; at the same time, since the inorganic material particles are not easy to overburn and agglomerate when the oil supply is insufficient, the metal heating layer is not easy to fail, which effectively improves the stability of the atomization element and increases the life of the atomization element. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of the structure of the electronic atomization device provided in this application;

[0027] Figure 2 A schematic diagram of the structure of the atomizer provided in this application;

[0028] Figure 3 A schematic structural diagram of a first embodiment of an atomizing element provided in the present application;

[0029] Figure 4 A schematic structural diagram of a second embodiment of the atomizing element provided in the present application;

[0030] Figure 5 A schematic structural diagram of a third embodiment of the atomizing element provided in the present application;

[0031] Figure 6 The scanning electron microscope image of the heating film prepared by directly setting a NiCr alloy or 316L stainless steel metal layer on the substrate;

[0032] Figure 7A scanning electron microscope image of an embodiment of the atomizing element provided in the present application;

[0033] Figure 8 A schematic structural diagram of a fourth embodiment of the atomizing element provided in the present application;

[0034] Fig. 9 A schematic structural diagram of a fifth embodiment of the atomizing element provided in the present application;

[0035] Fig.10 A schematic structural diagram of a sixth embodiment of the atomizing element provided in the present application;

[0036] Fig.11 A schematic structural diagram of a seventh embodiment of the atomizing element provided in the present application;

[0037] Fig.12 A flow chart of a method for preparing an atomizing element provided in the first embodiment of the present application;

[0038] Fig.13 A flow chart of a method for preparing an atomizing element provided in the second embodiment of the present application;

[0039] Fig.14 A flow chart of a method for preparing an atomizing element provided in the third embodiment of the present application;

[0040] Fig.15 A flow chart of a method for preparing an atomizing element provided in the fourth embodiment of the present application. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0042] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0043] The terms "first", "second" and "third" in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products or devices.

[0044] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0045] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0046] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of the electronic atomization device provided in the present application. In this embodiment, an electronic atomization device is provided. The electronic atomization device can be used for atomization of an aerosol-generating substrate. The electronic atomization device includes an atomizer 10 and a battery assembly 20 electrically connected to each other.

[0047] The atomizer 10 is used to store the aerosol-generating substrate and atomize the aerosol-generating substrate to form an aerosol that can be inhaled by the user. The atomizer 10 can be used in different fields, such as medical treatment, electronic aerosolization devices, etc. In a specific embodiment, the atomizer 10 can be used in an electronic aerosolization device to atomize the substrate to be atomized and generate an aerosol for the inhaler to inhale. The following embodiments are all taken as an example; of course, in other embodiments, it is used in medical equipment for treating upper and lower respiratory system diseases to atomize medical drugs.

[0048] The specific structure and function of the atomizer 10 may refer to the specific structure and function of the atomizer 10 involved in any of the following embodiments, and the same or similar technical effects can be achieved, which will not be repeated here.

[0049] The battery assembly 20 includes a battery (not shown) and a controller (not shown). The battery is used to power the atomizer 10 so that the atomizer 10 can atomize the aerosol-generating substrate to form an aerosol; and the controller is used to control the atomizer 10 to work.

[0050] The atomizer 10 and the battery assembly 20 may be integrally arranged or detachably connected, and may be designed according to specific needs.

[0051] See also Figure 2 , Figure 2 1 is a structural schematic diagram of the atomizer provided by the present application. In this embodiment, a nebulizer 10 is provided, the nebulizer 10 includes an atomizing element 11 and a liquid reservoir 12, the liquid reservoir 12 is used to store an aerosol generating substrate, and the atomizing element 11 is used to heat and atomize the aerosol generating substrate in the liquid reservoir 12. The specific structure and function of the atomizing element 11 can refer to the specific structure and function of the atomizing element 11 involved in any of the following embodiments, and the same or similar technical effects can be achieved, which will not be repeated here.

[0052] See also Figure 3 , Figure 3 1 is a schematic diagram of the structure of the first embodiment of the atomizing element 11 provided in the present application. In this embodiment, an atomizing element 11 is provided; the atomizing element 11 comprises a substrate 111 and a heating film 112. The substrate 111 has an atomizing surface 1111, and the heating film 112 is arranged on the atomizing surface 1111 to heat the aerosol-generating matrix near the atomizing surface 1111 when power is turned on to form an aerosol.

[0053] Specifically, the substrate 111 can be a porous material, for example, porous ceramics, porous glass, porous plastics, porous metals, etc. In the present embodiment, the material of the substrate 111 is a porous ceramic substrate, and the porous ceramic has pores and has the functions of conducting and storing liquid, so that the aerosol generating matrix can penetrate into the substrate 111 to be heated and atomized on the atomizing surface 1111. Porous ceramics are chemically stable and will not react chemically with the aerosol generating matrix; and they are resistant to high temperatures and will not deform due to excessive heating temperatures. Porous ceramics are insulators and will not be electrically connected to the heating film 112 formed thereon to cause a short circuit, and they are easy to manufacture and have low cost. In one embodiment, the surface of the substrate 111 opposite to the atomizing surface 1111 has a liquid reservoir (not shown). The aerosol generating matrix in the reservoir 12 first enters the liquid reservoir and then penetrates into the atomizing surface 1111.

[0054] In some embodiments, the porosity of the porous ceramic may be 30% to 70%. Porosity refers to the ratio of the total volume of the micro-voids in the porous medium to the total volume of the porous medium. The porosity may be adjusted according to the composition of the aerosol generating matrix. For example, when the viscosity of the aerosol generating matrix is ​​relatively high, a higher porosity is selected to ensure the liquid guiding effect.

[0055] In other embodiments, the porosity of the porous ceramic is 50-60%. The porosity of the porous ceramic is 50-60%. On the one hand, it can ensure that the porous ceramic has a good liquid conduction efficiency, prevent the phenomenon of dry burning due to poor circulation of the aerosol-generating matrix, and improve the atomization effect. On the other hand, it can prevent the porous ceramic from conducting liquid too quickly, making it difficult to lock the liquid, and causing a greatly increased probability of leakage.

[0056] In other embodiments, the atomized surface 1111 of the porous substrate 111 is further provided with a modifying layer. In particular, when the porous substrate 111 is made of porous ceramics, the surface smoothness of the porous ceramics is extremely low, which is not conducive to the metal heating layer 1121 being deposited on its surface as a continuous and dense porous structure. The modifying layer can improve the surface flatness of the atomized surface 1111 of the porous substrate 111, so that the metal heating layer 1121 is deposited on its surface as a continuous and dense porous structure. Preferably, the thickness of the modifying layer is 50μm-300μm. It can be understood that if the thickness of the modifying layer is too thin, the modification effect is not good; if the modifying layer is too thick, a large amount of pores in the porous substrate will be covered, thereby reducing the thermal conductivity efficiency.

[0057] Further, the modified layer includes the following components in parts by mass: 56-67.5 parts of silicon dioxide, 12-18 parts of aluminum oxide and 2.8-5.5 parts of lithium oxide. Preferably, the modified layer also includes 1.8-2.8 parts of phosphorus pentoxide, 0.5-2.0 parts of calcium oxide, 0.15-1.5 parts of magnesium oxide and 2.5-5.25 parts of barium oxide. Further preferably, the modified layer also includes the following components in parts by mass: at least one of 0.1-5 parts of zirconium oxide and 0.3-0.45 parts of zinc oxide.

[0058] The heating film 112 includes an inorganic protective layer 1122 and a metal heating layer 1121. Among them, the metal heating layer 1121 is used to generate heat when power is turned on to heat and atomize the aerosol to generate the matrix. The metal heating layer 1121 is arranged on the substrate 111. In this embodiment, the metal heating layer 1121 is arranged on the atomization surface 1111 of the substrate 111. The metal heating layer 1121 includes a plurality of stacked sub-metal layers 1121a. The number of sub-metal layers 1121a can be two or more. The number of sub-metal layers 1121a in this embodiment is three. In the metal heating layer 1121, the composition of any two adjacent sub-metal layers 1121a is different, that is, the metal heating layer 1121 is formed by stacking at least two sub-metal layers 1121a with different compositions in sequence, and the composition of the two adjacent sub-metal layers 1121a is different. For example, when the metal heating layer 1121 is formed by stacking two sub-metal layers A and sub-metal layers B with different compositions, and the number of sub-metal layers 1121a is four, the structure of the metal heating layer 1121 can be ABAB, or BABA. When the metal heating layer 1121 is formed by stacking three sub-metal layers A, sub-metal layer B and sub-metal layer C with different compositions, and the number of sub-metal layers 1121a is five, the structure of the metal heating layer 1121 can be ABCBA or ABCAB, etc. Transitions can be made between sub-metal layers 1121a with different compositions, and part of the sub-metal layers 1121a can be used as transitions to reduce the residual stress inside the metal heating layer 1121, thereby improving the continuity of the film layer of the metal heating layer 1121, reducing cracks on the surface of the heating film 112, effectively improving the adhesion of the heating film 112, and improving the stability and life of the atomizing element 11.

[0059] Furthermore, the heating film 112 is a porous film. The porous structure on the heating film 112 allows the liquid aerosol-generating matrix to more efficiently penetrate into the surface of the heating film 112 or the atomizing surface 1111, thereby improving the liquid and heat conduction efficiency of the heating film 112 and improving the atomization effect of the atomizing element 11. It can be understood that the inorganic protective layer 1122 and the metal heating layer 1121 included in the heating film 112 are also porous films. Specifically, in some embodiments, the inorganic protective layer 1122 and the metal heating layer 1121 are continuous porous structures. The metal heating layer 1121 can be deposited on the porous substrate 111 by physical vapor deposition (PVD) or chemical vapor deposition (CVD). During the film formation process, a porous structure corresponding to the holes on the porous substrate 111 will be formed, and a continuous and dense metal film will be formed corresponding to the solid part between the pores; therefore, the continuous porous structure mainly comes from the preparation process, and the parameters such as the pore size and porosity on the heating film 112 can be adjusted by controlling the porosity and pore size of the porous substrate 111 and the thickness of the metal film. Similarly, the porous structure of the inorganic protective layer 1122 also comes from the preparation process. During the sintering process, due to its fluidity, part of the raw material coating of the inorganic protective layer 1122 will enter the pores of the porous substrate 111, and the other part will be continuously and densely covered on the metal heating layer 1121 to form a continuous porous structure.

[0060] The inorganic protective layer 1122 is arranged on the surface of the metal heating layer 1121 away from the substrate 111. The inorganic protective layer 1122 is used to protect the metal heating layer 1121. Specifically, the inorganic protective layer 1121 is arranged on the surface of the outermost sub-metal layer 1121a of the metal heating layer 1121 away from the substrate 111. The heating film 112 with only the metal heating layer 1121 is easily corroded by the aerosol-generating matrix or the aerosol that has been atomized, thereby causing the metal heating layer 1121 to fail, resulting in poor stability and a short life of the atomizing element 11. The inventors have found that the resistance of the heating film 112 can be reduced by adding the inorganic protective layer 1122. At the same time, the increase in the resistance of the heating film 112 can also be significantly reduced during use; this also proves that the stability of the heating film 112 is improved during use, which can effectively prevent the failure of the heating film 112 when the oil supply is insufficient, and improve the service life of the atomizing element 11. Regarding the realization of the above-mentioned effects, the inventors analyzed that by setting the inorganic protective layer 1122 on the surface of the metal heating layer 1121, the inorganic protective layer 1122 can block the aerosol generating matrix or the atomized aerosol from contacting the metal heating layer 1121, thereby greatly reducing the corrosion of the aerosol generating matrix or the atomized aerosol to the metal heating layer 1121 and extending the service life of the atomizing element 11.

[0061] The present application reduces the internal stress of the metal heating layer 1121 by setting a multi-layer stacked sub-metal layer 1121a as the metal heating layer 1121; on the one hand, the continuity of the film layer of the metal heating layer 1121 is improved to avoid the occurrence of cracks, and on the other hand, the risk of crack failure of the heating film 112 under thermal shock is reduced. At the same time, an inorganic protective layer 1122 is set on the surface of the metal heating layer 1121 away from the substrate 111 to protect the metal heating layer 1121, which further improves the corrosion resistance of the heating film 112 and increases the life of the heating film 112. Compared with the solution of using precious metal as a protective layer, the heating film 112 may not contain precious metal materials or reduce the amount of precious metal materials, with low overall cost, which can reduce the cost of the atomizing element 11, and it is not easy to overburn and agglomerate in the case of insufficient oil supply or thermal shock, thereby making the metal heating layer 1121 not easy to fail, effectively improving the stability of the atomizing element 11 and increasing the life of the atomizing element 11.

[0062] The material of the inorganic protective layer 1122 can be selected according to actual needs, and its sintering temperature is usually below 1000°C. For example, it can be a ceramic material or a glass material. In some embodiments, when the inorganic protective layer 1122 is mainly a ceramic material, it mainly includes at least one component of Al2O3, SiO2, MgO, BaO, CaO, ZrO2 or ZnO; during the sintering process, the above components will be presented in the inorganic protective layer 1122 as corresponding silicates or other compound components such as Ca2SiO3 and Mg2SiO3. In other embodiments, when the inorganic protective layer 1122 is mainly a glass material, it mainly includes at least one of Na2SiO3, CaSiO3, SiO2, Li2O or Na2O·CaO·6SiO2.

[0063] In one embodiment, in order to ensure the continuity of liquid supply and avoid dry burning, the heating film 112 needs to have a certain wettability; according to the specific type of atomization matrix, the heating film 112 can be roughly divided into a lipophilic heating film, a hydrophilic heating film and a hydrophilic lipophilic heating film. In this embodiment, the surface properties of the heating film 112 are mainly determined by the inorganic protective layer 1122; therefore, the inorganic protective layer 1122 has lipophilicity and / or hydrophilicity. The lipophilicity and / or hydrophilicity can be prepared by impregnating and modifying the raw materials with different solvents or additives or changing the process conditions to prepare an inorganic protective layer 1122 with lipophilicity and / or hydrophilicity. For example, a mixture of hydrogenated silicone oil, ethanol and sodium acetate can be selected as a modified solution, the ceramic raw material is impregnated at room temperature, and heated and dried at about 100°C to obtain an lipophilic ceramic raw material. The inventors have also found that the inorganic protective layer 1122 prepared by sintering the raw materials of the inorganic protective layer 1122 at 400 degrees Celsius to 650 degrees Celsius exhibits good wettability to the liquid atomization matrix, that is, lipophilicity and hydrophilicity. The main components of the liquid atomization matrix include: propylene glycol (PG), glycerol (vegetable glycerin / VG), flavors, etc.

[0064] The thickness of the inorganic protective layer 1122 can range from 0.1 μm to 5 μm. For example, the thickness of the inorganic protective layer 1122 can be 0.1 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, etc. An inorganic protective layer 1122 that is too thin does not protect the metal heating layer 1121 well enough; an inorganic protective layer 1122 that is too thick may cover the porous structure of the substrate 111 and the metal heating layer 1121 during the preparation process, making it difficult for the heating film 112 to form a continuous porous grid structure, thereby reducing the liquid conduction and heat conduction efficiency of the heating film 112. Setting the thickness of the inorganic protective layer 1122 within the range of 0.1 μm to 5 μm can achieve that the inorganic protective layer 1122 can effectively protect the metal heating layer 1121, and a continuous porous grid structure can be formed in the heating film 112, and the liquid conduction and heat conduction efficiency of the heating film 112 are good.

[0065] See also Figure 4 and Figure 5 , Figure 4 This is a schematic structural diagram of a second embodiment of the atomizing element 11 provided in the present application. Figure 5 This is a schematic structural diagram of a third embodiment of the atomizing element 11 provided in the present application.

[0066] The metal heating layer 1121 includes a first sub-metal layer 1121b and a second sub-metal layer 1121c. The first sub-metal layer 1121b is used as the heating layer of the metal heating layer 1121 to generate heat. The material of the first sub-metal layer 1121b can be a metal or alloy material with good continuity, oxidation resistance and corrosion resistance, such as NiCr alloy or 316L stainless steel. NiCr alloy has high resistivity and good thermal stability; 316L stainless steel has excellent corrosion resistance and high temperature strength due to the addition of Mo element.

[0067] The second sub-metal layer 1121c may be disposed between the lowermost first sub-metal layer 1121b and the substrate 111 (eg Figure 4 ), and in contact with the atomized surface 1111, so as to serve as a transition layer between the substrate 111 and the bottom first sub-metal layer 1121b; or, when there are multiple first sub-metal layers 1121b, the second sub-metal layer 1121c can also be disposed between adjacent first sub-metal layers 1121b (as shown in FIG. Figure 5 As shown in FIG. 1 ), it serves as a transition layer between multiple first sub-metal layers 1121b. In one embodiment, the second sub-metal layer 1121c is disposed between the substrate 111 and the bottom first sub-metal layer 1121b, and also between adjacent first sub-metal layers 1121b. The material of the second sub-metal layer 1121b may be TiZr alloy (titanium zirconium alloy).

[0068] See also Figure 6 , Figure 6 FIG. 1 is a scanning electron microscope image of a heating film 112 prepared by only setting a first sub-metal layer 1121b (made of NiCr alloy or 316L stainless steel) on a substrate 111. Figure 6 It can be seen that the heating film 112 with only the first sub-metal layer 1121b is provided. Due to the good continuity of the NiCr film and the 316L stainless steel film, there is a great residual stress on its surface. After sintering, there will be a large number of cracks on the surface of the heating film 112, and the film layer adhesion is poor, and the film layer falls off more seriously, which seriously affects the stability and life of the heating film 112.

[0069] By setting the second sub-metal layer 1121c as a transition layer between multiple layers of the first sub-metal layer 1121b or a transition layer between the first sub-metal layer 1121b and the substrate 111, the residual stress on the surface of the first sub-metal layer 1121b can be effectively reduced, thereby reducing cracks on the surface of the heating film 112, effectively improving the film layer shedding situation, and improving the stability and life of the atomizing element 11.

[0070] See also Figure 4 and Figure 5In one embodiment, the first sub-metal layer 1121b and the second sub-metal layer 1121c are alternately distributed between the atomized surface 1111 and the inorganic protective layer 1122. The second sub-metal layer 1121c may be in contact with the atomized surface 1111, or the first sub-metal layer 1121b may be in contact with the atomized surface 1111; the number of the first sub-metal layer 1121b and the second sub-metal layer 1121c may be the same or different.

[0071] Preferably, the number of the first sub-metal layer 1121b and the second sub-metal layer 1121c is the same, the second sub-metal layer 1121c is in contact with the atomized surface 1111, and the outermost sub-metal layer is the first sub-metal layer 1121b. Figure 4 , Figure 4 In the embodiment of the present invention, the number of the first sub-metal layer 1121b and the second sub-metal layer 1121c are both one, and the second sub-metal layer 1121c is in contact with the atomized surface 1111; see Figure 5 , the number of the first sub-metal layer 1121b and the second sub-metal layer 1121c are both 3 layers, and one of the second sub-metal layers 1121c is in contact with the atomizing surface 1111. The second sub-metal layer 1121c is arranged in contact with the surface of the substrate 111, which can effectively improve the situation where there are many cracks on the surface of the heating film 112 and the heating film 112 is easy to fall off; in the layered structure in which the first sub-metal layer 1121b and the second sub-metal layer 1121c are alternately arranged, the number of the first sub-metal layer 1121b and the second sub-metal layer 1121c is the same, and the second sub-metal layer 1121c is in contact with the atomizing surface 1111, then the outermost sub-metal layer is the first sub-metal layer 1121b, and the first sub-metal layer 1121b is at the top, which can prevent the metal layer 1121 from failing when the oil supply is insufficient or the liquid oil is half dry.

[0072] Furthermore, in the structure where the first sub-metal layer 1121b and the second sub-metal layer 1121c are alternately arranged, the total number of layers may be two to ten. Figure 4 As shown, in the second embodiment, the total number of layers is two, the number of the first sub-metal layer 1121 b and the number of the second sub-metal layer 1121 c are both one, and the second sub-metal layer 1121 c is disposed between the first sub-metal layer 1121 b and the substrate 111 .

[0073] The number of layers of the first sub-metal layer 1121b and the second sub-metal layer 1121c may also be at least two. Figure 5As shown, in the third embodiment, the total number of layers in the layered structure in which the first sub-metal layer 1121b and the second sub-metal layer 1121c are alternately arranged is six layers, the number of the first sub-metal layer 1121b and the second sub-metal layer 1121c are three layers respectively, and the three first sub-metal layers 1121b and the three second sub-metal layers 1121c are alternately stacked. Preferably, the material of the three second sub-metal layers 1121c is TiZr, and the material of the first sub-metal layer 1121b is 316L or NiCr, then the layered structure of the second sub-metal layer 1121c and the first sub-metal layer 1121b can be TiZr-316L-TiZr-316L-TiZr-316L or TiZr-NiCr-TiZr-NiCr-TiZr-NiCr. When the number of layers of the layered structure in which the first sub-metal layer 1121b and the second sub-metal layer 1121c are alternately arranged is small, the total thickness of the heating film 112 remains unchanged while the total resistance of the heating film 112 remains unchanged, and the thickness of the single metal layer 1121 increases. The metal particles accumulate more stress during the single-layer deposition process, resulting in more cracks in the heating film 112. When the total number of layers in the layered structure in which the first sub-metal layer 1121b and the second sub-metal layer 1121c are alternately arranged is six, the thickness of the single metal layer 1121 is relatively moderate, the heating film 112 formed has fewer cracks, has a stronger ability to resist thermal shock, and has a longer service life of the atomizing element 11.

[0074] It can be understood that when the number of layers of the first sub-metal layer 1121b and the second sub-metal layer 1121c is at least two, the total thickness of the first sub-metal layer 1121b can be 1μm-20μm, for example, 1μm, 5μm, 10μm, 15μm, 20μm, etc. The total thickness of the second sub-metal layer 1121c can be 0.5μm-5μm, for example, 0.5μm, 1μm, 2μm, 3μm, 4μm, 5μm; the total thickness is the superposition of the thickness of all the same sub-metal layers, and the thickness of a single sub-metal layer can be adjusted according to actual needs. The thickness of a single sub-metal layer and the total thickness are usually adjusted in consideration of the resistance value of the heating film 112. For example, in one embodiment, the total number of layers of the layered structure of the metal heating layer 1121 is six; wherein the first sub-metal layer 1121b and the second sub-metal layer 1121c have three layers respectively, the total thickness of the first sub-metal layer 1121b is 6μm, and the total thickness of the second sub-metal layer 1121c is 3μm. The thickness of a single sub-metal layer may be the same or different; in this embodiment, the thickness of a single sub-metal layer is the same, wherein the thickness of a single first sub-metal layer 1121b is 2μm, and the thickness of a single second sub-metal layer 1121c is 1μm. In some other embodiments, the thickness of a single sub-metal layer may be partially the same or completely different; for example: along the direction from the substrate 111 to the inorganic protective layer 1122, the thickness of the second sub-metal layer 1121c is 0.5μm, 2μm, 0.5μm, and the total thickness is 3μm; the thickness of the first sub-metal layer 1121b is 1μm, 2μm, 3μm, and the total thickness is 6μm. It can be understood that in a preferred embodiment, the metal heating layer 1121 contacts the substrate 111 through the second sub-metal layer 1121c. The second sub-metal layer 1121c acts as a transition layer, so the thickness of the second sub-metal layer 1121c in contact with the inorganic protective layer 1122 or the porous substrate 111 can be relatively thinner than the thickness of other second sub-metal layers 1121c, so as to improve the continuity and density of the heating film 112, reduce cracks, avoid failure under thermal shock, and increase the life of the atomizing element 11. Please refer to Figure 7 , Figure 7 This is a scanning electron microscope image of an embodiment of the present application. Figure 7 The surface of the heating film 112 in a is continuous and dense, and has a certain amount of pore distribution, and the heating film 112 presents a porous continuous structure as a whole. Figure 7 b is Figure 7 The partial enlarged view in a shows that the heating film 112 is Figure 6 In the comparative example, the heating film 112 is continuous and dense without cracks, and completely covers the non-porous area of ​​the substrate.

[0075] See also Figure 8 and Fig. 9 , Figure 8 and Fig. 9 They are schematic structural diagrams of the fourth embodiment and the fifth embodiment of the atomizing element 11 provided in the present application.

[0076] The atomizing element 11 further includes two electrodes 113, which are respectively arranged on opposite sides of the metal heating layer 1121 and electrically connected to the metal heating layer 1121, and the inorganic protective layer 1122 covers the portion of the uppermost sub-metal layer 1121a located between the two electrodes 113. The two electrodes 113 are respectively electrically connected to the positive and negative leads so that the metal heating layer 1121 between the two electrodes 113 can conduct current and generate heat. The two electrodes 113 can be partially or completely arranged on the side of the uppermost sub-metal layer 1121a away from the substrate 111. In the fourth embodiment, as Figure 8 As shown, the two electrodes 113 are all disposed on a portion of the surface of the uppermost sub-metal layer 1121a away from the substrate 111, and are spaced apart at opposite ends of the uppermost sub-metal layer 1121a, and the inorganic protective layer 1122 covers another portion of the surface of the uppermost sub-metal layer 1121a away from the substrate 111. In the fifth embodiment, as Fig. 9 As shown, the metal heating layer 1121 is disposed on a part of the atomized surface 1111 of the substrate 111, a part of the two electrodes 113 is disposed on the uppermost sub-metal layer 1121a, another part of the two electrodes 113 is disposed on another part of the atomized surface 1111 of the substrate 111, and the inorganic protective layer 1122 covers the part of the uppermost sub-metal layer 1121a located between the two electrodes 113. The materials of the two electrodes 113 can be selected from metal materials with good conductivity, such as gold, silver, etc.; silver is preferred in consideration of both cost and ease of preparation.

[0077] See also Fig.10 and Fig.11 , Fig.10 This is a top view of the sixth embodiment of the atomizing element 11 provided in the present application. Fig.11 This is a top view of the seventh embodiment of the atomizing element 11 provided in the present application. The shaded portion is the heating film 112 or the metal heating layer 1121 of the atomizing element 11. In this embodiment, the shape of the heating film 112 or the metal heating layer 1121 is a preset pattern, which can be a regular pattern such as an S-shaped, circular, elliptical, semicircular or ring-shaped pattern. For example, Fig.10 In the embodiment, the shape of the heating film 112 is S-shaped. Two ends of the S-shaped heating film 112 are connected to two electrodes 113 respectively.

[0078] The shape of the heating film 112 can also be an irregular shape, for example, Fig.11 In the embodiment of the present invention, the shape of the heating film 112 is an irregular pattern. In the embodiment, the heating film 112 may be a regular pattern, and one or more hollow portions 1123 are provided on the regular pattern. Fig.11 In the embodiment of the present invention, the shape of the heating film 112 is a rectangle, and a non-heating hollow portion 1123 is provided in the rectangular heating film. The hollow portion 1123 includes a first hollow portion 1123a and a second hollow portion 1123b. The number of the first hollow portions 1123a is two, and the two electrodes 113 are symmetrically arranged on the opposite sides of the rectangle, and the first hollow portion 1123a is located on the other opposite sides of the rectangle. Among them, the shape of the first hollow portion 1123a is a fan-shaped; the second hollow portion 1123b is arranged in the middle of the two first hollow portions 1123a and is located in the middle of the heating film 112, and the second hollow portion 1123b is an ellipse. In other embodiments, the shape of the heating film 112 can also be a square, a triangle, a circle, a semicircle, etc., and the shape of the first hollow portion 1123a and the second hollow portion 1123b can also be a circle, a triangle, a rectangle, a square, etc. The number of the first hollow portion 1123a and the second hollow portion 1123b can be one or more. When the heating film 112 is not patterned, the highest temperature of the matrix generated by the atomized aerosol is between 210°C and 230°C, and the generated aerosol is difficult to volatilize fragrance, the stimulation is weak, and the taste is poor. By patterning the heating film 112, the heating film 112 can be configured with a better heating temperature gradient according to its shape, the surface power density is improved, the high temperature area of ​​the heating film 112 is increased, and the aerosol generated by the atomization has greater sweetness and fragrance, stronger stimulation, and can effectively improve the taste of the aerosol.

[0079] See also Fig.12 , Fig.12 A flow chart of a method for preparing an atomizing element provided in the first embodiment of the present application.

[0080] In this embodiment, the method for preparing the atomizing element includes:

[0081] Step S11: forming a metal heating layer on the substrate.

[0082] Among them, the substrate 111 can be a porous ceramic substrate. The metal heating layer 1121 is composed of at least two sub-metal layers 1121a stacked in sequence, and the components of any two adjacent sub-metal layers 1121a are different, that is, the metal heating layer 1121 is composed of at least two sub-metal layers 1121a with different components stacked in sequence, and the components of any two adjacent sub-metal layers 1121a are different. Transition can be made between sub-metal layers 1121a with different components, and part of the sub-metal layers 1121a can be used as a transition to reduce the residual stress inside the metal heating layer 1121, thereby improving the continuity of the film layer of the metal heating layer 1121, reducing cracks on the surface of the heating film 112, effectively improving the adhesion of the heating film 112, and improving the stability and life of the atomizing element 11.

[0083] In a specific implementation process, the raw materials of at least two sub-metal layers 1121a used to form the metal heating layer 1121 can be made into a variety of target materials, and then the magnetron sputtering process is used to sputter the various target materials multiple times on the atomized surface 1111 of the substrate 111 to form the metal heating layer 1121. Among them, the metal heating layer 1121 is formed on the surface of the substrate 111 by magnetron sputtering, and the metal heating layer 1121 has high purity, good adhesion, uniform film thickness, and good process repeatability.

[0084] Step S12: forming an inorganic protective layer on the surface of the metal heating layer away from the substrate to obtain a heating film on the substrate.

[0085] Specifically, the inorganic protective layer 1122 is used to protect the metal heating layer 1121. The material of the inorganic protective layer 1122 can be at least one of a ceramic material or a glass material. In some embodiments, when the inorganic protective layer 1122 is a ceramic material, it mainly includes at least one of Al2O3, SiO2, Ca2SiO3, and Mg2SiO3. In other embodiments, when the inorganic protective layer 1122 is a glass material, it mainly includes Na2SiO3, CaSiO3, SiO2, or Na2O·CaO·6SiO2, etc.

[0086] After the prepared inorganic protective layer 1122 filter material is dried, a spraying process or a magnetron sputtering process is used to form an inorganic protective layer 1122 on the surface of the metal heating layer 1121 away from the substrate 111 to obtain a heating film 112 on the substrate 111. When the filter material of the inorganic protective layer 1122 is sprayed by the spraying process, a small amount of spray is used multiple times on the surface of the metal heating layer 1121 away from the substrate 111. In one embodiment, the intermediate after spraying can be dried in an oven at 80°C for 15 minutes, and the dried intermediate can be sintered at 600°C and then cooled to obtain the heating film 112.

[0087] In the preparation method of the atomizing element, by setting a multi-layer stacked sub-metal layer 1121a as the metal heating layer 1121, the internal stress of the metal heating layer 1121 is reduced; on the one hand, the continuity of the film layer of the metal heating layer 1121 is improved to avoid the occurrence of cracks, and on the other hand, the risk of crack failure of the heating film 112 under thermal shock is also reduced. At the same time, an inorganic protective layer 1122 is set on the surface of the metal heating layer 1121 away from the substrate 111 to protect the metal heating layer 1121, which further improves the corrosion resistance of the heating film 112 and increases the life of the heating film 112. Compared with the solution of using precious metal as a protective layer, the heating film 112 does not contain precious metal materials or reduces the amount of precious metal, and the overall cost is low, which can reduce the cost of the atomizing element 11, and it is not easy to overburn and agglomerate in the case of insufficient oil supply or thermal shock, so that the metal heating layer 1121 is not easy to fail, which effectively improves the stability of the atomizing element 11 and increases the life of the atomizing element 11.

[0088] See also Fig.13 , Fig.13 A flow chart of a method for preparing an atomizing element provided in the second embodiment of the present application. In this embodiment, the method for preparing an atomizing element includes:

[0089] Step S21: forming a metal heating layer on the substrate.

[0090] Specifically, the specific implementation process of step S21 is the same as above Fig.11 The specific implementation process of step S21 in the corresponding embodiment is the same or similar, and can achieve the same or similar technical effects. Please refer to the above for details, and no further details will be given here.

[0091] Step S22: forming two electrodes on opposite sides of the metal heating layer.

[0092] Specifically, two electrodes 113 may be formed on opposite sides of the metal heating layer 1121 by using a silk-screen printing process, and the intermediate body after silk-screen printing of the electrodes is placed in an oven at 80° C. and dried for 30 minutes.

[0093] Step S23: forming an inorganic protective layer on the surface of the metal heating layer that is located between the two electrodes and is away from the substrate, so as to obtain a heating film on the substrate.

[0094] Specifically, after shielding the two electrodes 113 with a mask plate, the inorganic protective layer 1122 may be formed on the surface of a portion of the metal heating layer 1121 located between the two electrodes 113 by spraying or magnetron sputtering.

[0095] In the second embodiment, two electrodes 113 are formed on opposite sides of the metal heating layer 1121. The two electrodes 113 can be connected to external leads, so that when the two electrodes 113 are energized, the metal heating layer 1121 between the two electrodes 113 can be energized and generate heat.

[0096] See also Fig.14 , Fig.14 A flow chart of a method for preparing an atomizing element provided in the third embodiment of the present application. In this embodiment, the method for preparing an atomizing element includes:

[0097] Step S31: using magnetron sputtering to alternately form a first sub-metal layer and a second sub-metal layer in sequence according to a preset number of layers on the atomized surface of the substrate.

[0098] Specifically, the preset number of layers is the sum of the number of layers of the first sub-metal layer 1121b and the second sub-metal layer 1121c. The first sub-metal layer 1121b and the second sub-metal layer 1121c are alternately stacked between the atomized surface 1111 and the inorganic protective layer 1122 according to the preset number of layers. Among them, it can be arranged that the second sub-metal layer 1121c is in contact with the atomized surface 1111, or the first sub-metal layer 1121b is in contact with the atomized surface 1111; the number of the second sub-metal layer 1121c and the first sub-metal layer 1121b can be the same or different. Preferably, the number of the second sub-metal layer 1121c is the same as that of the first sub-metal layer 1121b, and the second sub-metal layer 1121c is in contact with the atomized surface 1111.

[0099] Specifically, the material of the first sub-metal layer 1121b may be NiCr alloy or 316L stainless steel. In one embodiment, the magnetron sputtering process parameters of the first sub-metal layer 1121b may be sputtering power of 3500W, sputtering time of 80min, sputtering pressure of 0.5Pa, and sputtering temperature of room temperature to 200°C. When the raw material of the first sub-metal layer 1121b is NiCr, the magnetron sputtering process parameters of NiCr are: sputtering power of 3500W, sputtering time of 60min, sputtering pressure of 0.5Pa, and sputtering temperature of 200°C. When the raw material of the first sub-metal layer 1121b is 316L stainless steel, the magnetron sputtering process parameters of 316L stainless steel may be: sputtering power of 3000W, sputtering time of 80min, sputtering pressure of 0.5Pa, and sputtering temperature of 200°C.

[0100] The material of the second sub-metal layer 1121c may be TiZr alloy. When the material of the second sub-metal layer 1121b is TiZr alloy, in one embodiment, the magnetron sputtering process parameters for forming the second sub-metal layer 1121b are: vacuum degree is 3.0*10 -3Pa, sputtering power is 2500W, sputtering time is 30min, sputtering pressure is 0.5Pa, sputtering temperature is 200℃, and sputtering particle size is 200nm-400nm.

[0101] Step S32: forming an inorganic protective layer on the surface of the metal heating layer facing away from the substrate to obtain a heating film on the substrate.

[0102] Specifically, the specific implementation process of step S32 is the same as above Fig.11 The specific implementation process of step S12 in the corresponding embodiment is the same or similar, and can achieve the same or similar technical effects. Please refer to the above for details, and no further details will be given here.

[0103] In the third embodiment, by providing the second sub-metal layer 1121c, the residual stress on the surface of the first sub-metal layer 1121b can be effectively reduced, the cracks on the surface of the heating film 112 can be reduced, and the stability and life of the atomizing element 11 can be improved.

[0104] See also Fig.15 , Fig.15 A flow chart of a method for preparing an atomizing element provided in the fourth embodiment of the present application. In this embodiment, the method for preparing an atomizing element includes:

[0105] Step S41: forming a metal heating layer on the substrate.

[0106] Step S42: forming an inorganic protective layer on the surface of the metal heating layer facing away from the substrate to obtain a heating film on the substrate.

[0107] Specifically, the specific implementation process of step S41 and step S42 is the same as above. Fig.11 The specific implementation processes of step S11 and step S12 in the corresponding embodiments are the same or similar, and can achieve the same or similar technical effects. For details, please refer to the above and will not be repeated here.

[0108] Step S43: performing graphic processing on the heating film according to a preset graphic.

[0109] The preset shape of the heating film 112 may be an S-shape, a circle, an ellipse, a semicircle or a ring. Fig.10 As shown, Fig.10 The preset pattern of the heating film 112 shown is an S-shape. The preset pattern of the heating film 112 can also be an irregular pattern, for example, Fig.11 The shaded portion shows an irregular pattern. Specifically, the hollow portion 1123 of the heating film 112 can be removed by etching to make the shape of the heating film 112 a preset pattern. Fig.11In the embodiment of the present invention, the rectangular heating film 112 obtained in step S42 is subjected to an etching process to remove the first hollow portion 1123a and the second hollow portion 1123b to obtain Fig.11 Irregular heating film.

[0110] In the fourth embodiment, by patterning the heating film 112, the heating film 112 can construct a better heating temperature gradient according to its shape, the surface power density is improved, the high temperature area of ​​the heating film 112 is increased, the aerosol generated by its atomization has greater sweetness and aroma, and a stronger sense of stimulation, which can effectively improve the taste of the aerosol.

[0111] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An atomizing element, characterized in that: include: A substrate and a heating film; the substrate has an atomizing surface; the heating film is arranged on the atomizing surface and can heat and atomize the aerosol-generating matrix on the atomizing surface when powered on; The heating film comprises a metal heating layer and an inorganic protective layer which are stacked; wherein the inorganic protective layer is arranged on a surface of the metal heating layer away from the substrate, and the inorganic protective layer comprises at least one of a ceramic material and a glass material; The metal heating layer comprises at least two sub-metal layers stacked in sequence; any two adjacent sub-metal layers have different compositions; Among them, at least two layers of the sub-metal layers include a stacked first sub-metal layer and a second sub-metal layer, and the number of layers of the first sub-metal layer and the second sub-metal layer are at least two; wherein the material of the first sub-metal layer is NiCr or 316L stainless steel, and the material of the second sub-metal layer is TiZr; the metal heating layer is in contact with the substrate through the second sub-metal layer.

2. The atomizing element according to claim 1, characterized in that: The substrate is a porous substrate; or the metal heating layer and / or the inorganic protective layer is a porous structure.

3. The atomizing element according to claim 1, characterized in that: The inorganic protective layer has oleophilicity and / or hydrophilicity.

4. The atomizing element according to claim 1, characterized in that: The total thickness of the first sub-metal layer is 1 μm-20 μm, the total thickness of the second sub-metal layer is 0.5 μm-5 μm, and the thickness of the inorganic protective layer is 0.1 μm-5 μm.

5. The atomizing element according to claim 1, characterized in that: The shape of the heating film or the metal heating layer is S-shaped, circular, elliptical, semicircular or ring-shaped.

6. The atomizing element according to claim 1, characterized in that: It also includes two electrodes, which are respectively arranged on two opposite sides of the metal heating layer and electrically connected to the metal heating layer; the inorganic protective layer covers the part of the metal heating layer located between the two electrodes.

7. The atomizing element according to claim 6, characterized in that: The heating film is rectangular, the two electrodes are arranged on two opposite sides of the rectangle, and a non-heating hollow portion is arranged in the rectangular heating film.

8. The atomizing element according to claim 7, characterized in that: The hollow portion includes a first hollow portion and a second hollow portion, wherein the first hollow portion is located on the other two opposite sides of the rectangle and is fan-shaped; the second hollow portion is located in the middle of the heating film and is elliptical or circular.

9. The atomizing element according to claim 2, characterized in that: The atomized surface of the porous substrate is also provided with a modification layer; the thickness of the modification layer is 50 μm-300 μm.

10. The atomizing element according to claim 9, characterized in that: The modified layer includes the following components in parts by mass: 56-67.5 parts of silicon dioxide, 12-18 parts of aluminum oxide and 2.8-5.5 parts of lithium oxide.

11. An atomizer, characterized in that: It comprises a liquid reservoir and an atomizing element, wherein the liquid reservoir is used to store an aerosol-generating matrix, wherein the atomizing element is the atomizing element as described in any one of claims 1-10.

12. An electronic atomization device, characterized in that: It comprises a battery assembly and an atomizer, wherein the battery assembly is used to power the atomizer, wherein the atomizer is the atomizer according to claim 11.

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