Communication antenna and communication equipment

Abstract

The embodiment of the present invention provides a communication antenna and a communication device. The first metal routing layer and the second metal routing layer are arranged on an insulating structural member, and the orthographic projection of the second metal routing layer on the routing surface of the first metal routing layer at least partially overlaps with the first metal routing layer, so that the inner and second metal routing layers form a capacitor for high-frequency signals to pass through. When the first metal routing layer and the second metal routing layer are independent of each other and there is no physical wire connection, the transmission of radio frequency signals between the inner and second metal routing layers is realized. The first metal routing layer is connected to the radio frequency port of the communication device, and the structural space is fully utilized without substantially increasing the tiling area of ​​the antenna itself, thereby improving the communication performance of the antenna. At the same time, the second metal routing layer acts as a director for the antenna pattern, and can pull the antenna pattern toward the external space, thereby further improving the antenna performance.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a communication antenna and communication equipment. Background Art

[0002] As the frequency bands and functions supported by terminals increase, the number of terminal antennas also increases, and the space available for antennas is becoming increasingly limited. How to fully and effectively utilize the structural space while maximizing antenna efficiency has become a technical problem that needs to be solved urgently. Summary of the invention

[0003] The communication antenna and the communication device provided by the embodiments of the present invention mainly solve the technical problem of how to reduce the space occupied by the antenna while improving the performance of the antenna.

[0004] To solve the above technical problems, an embodiment of the present invention provides a communication antenna, including an insulating structural member, a first metal routing layer and a second metal routing layer arranged on the structural member, the first metal routing layer being connected to a radio frequency port of a communication device through a physical wire, and there being no physical wire connection between the first metal routing layer and the second metal routing layer; the orthographic projection of the second metal routing layer on the routing surface of the first metal routing layer at least partially overlaps with the first metal routing layer.

[0005] An embodiment of the present invention further provides a communication device, which includes the above-mentioned communication antenna.

[0006] The beneficial effects of the present invention are:

[0007] The communication antenna and communication device provided by the embodiment of the present invention are provided with a first metal routing layer and a second metal routing layer on an insulating structural member, and the orthographic projection of the second metal routing layer on the routing surface of the first metal routing layer overlaps at least partially with the first metal routing layer. Therefore, by this arrangement, the inner and second metal routing layers can form a capacitor for high-frequency signals to pass through, and the transmission of radio frequency signals between the inner and second metal routing layers can be realized when the first metal routing layer and the second metal routing layer are independent of each other and have no physical wire connection. The first metal routing layer is connected to the radio frequency port of the communication device, and the second metal routing layer is provided on the outer surface of the structural member. Therefore, the first metal routing layer can transmit the radio frequency signal from the radio frequency port to the second metal routing layer by electromagnetic coupling, and then transmit it to the external space, and can also transmit the radio frequency signal received by the second metal routing layer from the external space to the radio frequency port, so that the communication terminal can process the received radio frequency signal. The communication antenna provided by the embodiment of the present invention is provided with a second metal routing layer on the outer surface of the structural member, and the space of the structural member is fully utilized without increasing the paving area of ​​the antenna itself, thereby improving the communication performance of the antenna. At the same time, the second metal routing layer acts as a director for the antenna pattern, which can pull the antenna pattern toward the external space, thereby further improving the antenna performance.

[0008] Other features and corresponding beneficial effects of the present invention are described in the latter part of the specification, and it should be understood that at least part of the beneficial effects become obvious from the description in the specification of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic diagram of the structure of a communication antenna provided in Embodiment 1 of the present invention;

[0010] Figure 2 A schematic diagram of the first metal wiring layer and the second metal wiring layer shown in the first embodiment of the present invention;

[0011] Figure 3 A schematic diagram of the first metal wiring layer shown in the first embodiment of the present invention;

[0012] Figure 4 Another schematic diagram of the first metal wiring layer shown in the first embodiment of the present invention;

[0013] Figure 5 A transmission schematic diagram of a radio frequency signal shown in Embodiment 1 of the present invention;

[0014] Figure 6 Another transmission schematic diagram of the radio frequency signal shown in the first embodiment of the present invention;

[0015] Figure 7A schematic diagram of the coordination between the communication antenna and the communication device provided in the first embodiment of the present invention;

[0016] Figure 8 This is a schematic diagram of an equivalent model of a communication antenna in a communication device provided in Embodiment 1 of the present invention;

[0017] Fig. 9 A schematic diagram of a configuration of a communication antenna provided in Embodiment 2 of the present invention on a mobile phone;

[0018] Fig.10 for Fig. 9 A schematic diagram of the first metal routing layer in a communication antenna. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the following is a further detailed description of the embodiments of the present invention through specific implementation methods combined with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0020] Embodiment 1:

[0021] In order to solve the problem of insufficient antenna performance and limited antenna installation space in the related art, this embodiment provides a communication antenna, see Figure 1 The structural diagram of the communication antenna is shown:

[0022] The communication antenna 10 includes a structural component 11, a first metal wiring layer 12 and a second metal wiring layer 13, wherein the structural component 11 is made of an insulating material, and the orthographic projection of the second metal wiring layer 13 on the wiring surface of the first metal wiring layer 12 at least partially overlaps with the first metal wiring layer 12. The orthographic projection of the second metal wiring layer 13 on the first metal wiring layer 12 is actually the projection of the second metal wiring layer 13 along the projection direction perpendicular to the first metal wiring layer 12. Therefore, "the orthographic projection of the second metal wiring layer 13 on the wiring surface of the first metal wiring layer 12 at least partially overlaps with the first metal wiring layer 12" is actually equivalent to the orthographic projection of the first metal wiring layer 12 on the wiring surface of the second metal wiring layer 13 at least partially overlapping with the second metal wiring layer 13.

[0023] In this embodiment, there is no physical wire connection between the first metal routing layer 12 and the second metal routing layer 13, so a capacitor can be formed between the first metal routing layer 12 and the second metal routing layer 13, and high-frequency signals can pass through the capacitor. Therefore, even if no vias, wall climbing, or spring clips are provided between the first metal routing layer 12 and the second metal routing layer 13, the transmission of radio frequency signals between the first metal routing layer 12 and the second metal routing layer 13 can be achieved. In this embodiment, the first metal routing layer 12 and the radio frequency port of the communication device can be connected by physical wire communication, so that the first metal routing layer 12 can receive the radio frequency signal that the communication device needs to transmit to the external space from the radio frequency port, and then the first metal routing layer 12 uses the capacitor formed by itself and the second metal routing layer 13 to transmit the radio frequency signal to the second metal routing layer 13, and then the second metal routing layer 13 transmits and transmits the radio frequency signal. On the other hand, after receiving the radio frequency signal from the external space, the second metal wiring layer 13 couples the radio frequency signal to the first metal wiring layer 12, and then the first metal wiring layer 12 transmits the radio frequency signal to the radio frequency port.

[0024] exist Figure 1 Among them, the routing surfaces of the first metal routing layer 12 and the second metal routing layer are planes and parallel to each other. However, in fact, the routing surface of the first metal routing layer 12 and the routing surface of the second metal routing layer 13 do not necessarily have to be set in parallel. Even in a non-parallel state, the two can form a capacitor. However, when the routing surface of the first metal routing layer 12 and the routing surface of the second metal routing layer 13 are set in parallel, the coupling amount between the first metal routing layer 12 and the second metal routing layer 13 is greater, which can improve the transmission efficiency of the RF signal energy.

[0025] It is worth noting that, in the present embodiment, the routing surface of the first metal routing layer 12 is parallel to the routing surface of the second metal routing layer 13, which does not mean that the routing surface of the first metal routing layer 12 and the second metal routing layer 13 are parallel to each other. For example, in some examples of the present embodiment, the routing surface of the first metal routing layer 12 and the routing surface of the second metal routing layer 13 are both curved surfaces, and the shortest distance from any position on the routing surface of the first metal routing layer 12 to the routing surface of the second metal routing layer 13 is the same. It is understandable that the routing surface of the first metal routing layer 12 is composed of countless points, and the routing surface of the second metal routing layer 13 is also composed of countless points. Here, the points constituting the routing surface of the first metal routing layer 12 are referred to as "first points", and the points constituting the routing surface of the second metal routing layer 13 are referred to as "second points". For any first point, there is and only one corresponding second point, and for any second point, there is and only one corresponding first point, that is, each first point corresponds to each second point one by one, and the height difference of each first point relative to its corresponding second point is the same. It is understandable that in this case, the routing surface of the first metal routing layer 12 and the routing surface of the second metal routing layer 13 are also set "parallel", such as Figure 2 Even in some other examples, the routing surfaces of the two metal routing layers can be a combination of multiple planes, a combination of multiple curved surfaces, or a combination of a plane and a curved surface.

[0026] In some examples of this embodiment, at least one of the first metal wiring layer 12 and the second metal wiring layer 13 may be disposed on the surface of the structural member 11. For example, the second metal wiring layer 13 is usually disposed on the surface of the structural member 11. In some examples of this embodiment, the structural member 11 is a flat sheet structure, the second metal wiring layer 13 is disposed on one of the surfaces, and the first metal wiring layer 12 is disposed on the other surface of the structural member 11. Of course, in some other examples of this embodiment, the first metal wiring layer 12 may also be disposed inside the structural member 11 and be wrapped by the structural member 11.

[0027] In some examples of this embodiment, the first metal wiring layer 12 and the second metal wiring layer 13 are each a whole, that is, the first metal wiring layer 12 is a whole, and there is an actual physical communication path between any part of the first metal wiring layer 12 and any other part thereof, and at the same time, the second metal wiring layer 13 is a whole, and there is an actual physical communication path between any part of the second metal wiring layer 13 and any other part thereof. In this case, the first metal wiring layer 12 and the second metal wiring layer 13 should be equivalent to a capacitor.

[0028] In some other examples of this embodiment, the second metal wiring layer 13 is still a whole, but the first metal wiring layer 12 can be divided into at least two independent parts, each of which is separated by a gap formed by a structural member and has no physical wire connection between them. Figure 3 In the schematic diagram of the arrangement of the first metal wiring layer 12 shown in FIG. 1 , the first metal wiring layer 12 is divided into three parts: a first part 12a, a second part 12b and a third part 12c. The first part 12a, the second part 12b and the third part 12c are metal layers arranged on one surface of the structural member 11, and the three parts are separated by an insulating zone formed by the exposed structural member 11. Figure 3 The shapes and specifications of the various sections of the first metal wiring layer 12 are the same, that is, elliptical. However, in some other examples of this embodiment, the various sections of the first metal wiring layer 12 may have different shapes and / or sizes. For example, the various sections may be circular, triangular, rectangular, or even irregular in shape, such as Figure 4 When the first metal wiring layer includes at least two divisions, the orthographic projections of each division on the wiring surface of the second metal wiring layer 13 overlap with the second metal wiring layer 13, so at least two capacitors can be equivalent between the first metal wiring layer 12 and the second metal wiring layer 13.

[0029] The shape and size of the second metal routing layer 13 are not limited in this embodiment. It should be understood that the specifications of the second metal routing layer 13 are not strictly affected by the first metal routing layer 12. However, when the distribution range of the various sections of the first metal routing layer 12 is wide and the area is large, in order to ensure that the projection of the second metal routing layer 13 on the routing surface of the first metal routing layer 12 can overlap with each section to a certain extent, the area and distribution range of the second metal routing layer 13 may also be relatively large.

[0030] In some cases, each division of the first metal routing layer 12 can be connected to the RF port of the communication device, but in other cases, each division of the first metal routing layer 12 can be divided into two categories, one of which is connected to the RF port and the other is not connected to the RF port. For ease of introduction, in this embodiment, the first metal routing layer division connected to the RF port is referred to as a "port connection division", and the first metal routing layer division not connected to the RF port of the communication device is referred to as a "non-connection division". In these examples, the communication between the non-connection division and the port connection division needs to be achieved through the second metal routing layer 13: Continuing with the example that the first metal routing layer 12 in the communication antenna 10 includes a first division 12a, a second division 12b and a third division 12c, assuming that the first division 12a and the second division 12b are port connection divisions, and the third division 12c is a non-connection division, for the RF signal that the RF port of the communication device needs to transmit to the external space, please refer to Figure 5 A transmission diagram of RF signals is shown: the RF port 50 can directly transmit the RF signal to the first section 12a and the second section 12b. The first section 12a and the second section 12b use the capacitance formed between themselves and the second metal wiring layer 13 to transmit the RF signal to the second metal wiring layer 13. After the second metal wiring layer 13 receives the RF signal, it can transfer the RF signal to the third section 12c using the capacitance effect. Part of the RF signal reaching the second metal wiring layer 13 can directly enter the external space, and the other part can be emitted through the gap between the second metal wiring layer 13 and the third section 12c. For RF signals from the external space, please combine Figure 6 , the first and second metal wiring layers can receive a part. For the RF signal received by the third subdivision 12c, it can be transmitted to the second metal wiring layer 13 through the capacitance effect, and the second metal wiring layer can transmit the received RF signal (including the RF signal directly received by the second metal wiring layer 13 from the external space and the RF signal received by the second metal wiring layer 13 from the third subdivision 12c) to the first subdivision 12a and the second subdivision 12b through the capacitance effect coupling, so that the first subdivision 12a and the second subdivision 12b transmit the received RF signal to the RF port 50 of the communication device.

[0031] It should be understood that when the first metal wiring layer 12 is composed of three sections, one of the sections may be a port connection section, and the other two may be non-connection sections.

[0032] Considering that the first metal wiring layer 12 is composed of two subdivisions, it can meet the communication requirements of the communication device. Therefore, in some other examples, the first metal wiring layer 12 can be divided into only two subdivisions, namely, the first subdivision and the second subdivision. Of course, one of them is a port connection subdivision and the other is a non-connection subdivision. For example, in an example of this embodiment, the first subdivision is a port connection subdivision and the second subdivision is a non-connection subdivision.

[0033] In some examples of this embodiment, the communication antenna 10 may be a component of the communication device, and it is not significant to exist independently of the communication device. Although the communication antenna 10 may be removed from the communication device, the communication antenna 10 will not be manufactured or sold independently of the communication device. For example, in some examples of this embodiment, the structural member 11 of the communication antenna 10 may be a shell of the communication device, the first metal wiring layer 12 is arranged on the side of the shell facing the inside of the communication device, and the second metal wiring layer 13 is arranged on the outer surface of the shell. Optionally, in an example of this embodiment, the communication device is a mobile terminal such as a mobile phone, a PDA (Personal Digital Assistant) or a PAD (Portable Android Device), the structural member 11 is the back shell of the mobile terminal, the second metal wiring layer 13 is arranged on the outer surface of the back shell, and the first metal wiring layer 12 is arranged on the side of the back shell facing the inside of the mobile terminal. Optionally, the first metal wiring layer 12 is arranged on the side of the back shell facing the RF port, that is, the first metal wiring layer 12 and the RF port are located on the same side of the back shell (i.e., the structural member 11).

[0034] The emergence of cold-melt spraying technology has made the realization of communication antennas no longer limited to traditional FPC (Flexible Printed Circuit), LDS (Laser-Direct-structuring) and other processes. The cold-melt spraying process can spray a layer of metal coating on the structural part 11 to form a metal trace with a certain width and thickness, and use this metal trace layer as an antenna. In this way, the antenna performance can be improved, and the outer surface traces will not affect the ID (Industrial Design), modeling and other requirements of the structural part. Therefore, in this embodiment, at least one of the first metal trace layer 12 and the second metal trace layer 13 of the communication antenna 10 can be a metal layer of the cold-melt spraying process. Optionally, in one example, the first metal trace layer 12 and the second metal trace layer 13 are both metal layers set on the structural part 11 by the cold-melt spraying process. Moreover, because the metal layer set by the cold spraying process will not affect the ID on the structural part, if the structural part 11 of the communication antenna 10 is the shell of the communication device, such as the back shell, the second metal routing layer 13 can be exposed on the outer surface of the shell or the back shell.

[0035] In some other examples of the present embodiment, the communication antenna 10 may also be an accessory that can be independent of the communication device. For example, in some examples of the present embodiment, the communication antenna 10 may be made into a communication device accessory that can be installed and removed anytime and anywhere, such as headphones, device protective covers, device accessories, etc. Optionally, the communication antenna 10 can be connected to the mobile phone in a pluggable manner as a mobile phone accessory. Undoubtedly, in these examples, it also makes sense for the communication antenna 10 to exist independently of the communication device, and it can be produced and sold separately. In these examples, the communication device itself may have its own antenna or may not have an antenna. In the case where the communication device already has its own antenna, the communication antenna 10 can be used as an additional accessory to improve the communication performance of the communication device, such as Figure 7 As shown, the communication antenna 10 can be inserted into the RF port connection hole reserved on the mobile phone as a decorative pendant to achieve communication connection with the RF port, and assist the internal antenna of the mobile phone to transmit and receive RF signals when the mobile phone communicates.

[0036] This embodiment also provides a communication device, which includes the communication antenna 10 provided in any of the above examples. Moreover, the communication device includes but is not limited to the mobile terminals such as mobile phones, PDAs, and PADs introduced above, and can also be electronic devices such as all-in-one machines and CPEs (Customer Premise Equipment).

[0037] In some examples of this embodiment, the communication device further includes a matching network. It can be understood that the first metal wiring layer 12 and the second metal wiring layer 13 on the structural member 11 can be equivalent to the metal layer capacitor C as a whole, and the metal wiring layer forms an inductance effect to the whole machine, which is equivalent to the inductance L, so that LC can form a resonant circuit, see Figure 8 The equivalent model schematic diagram is shown: A is the RF port and B is the external space. In this case, a matching network is set up to cooperate with the LC resonant circuit including the metal layer capacitor C, which can further improve the antenna transmission efficiency.

[0038] The communication antenna provided in this embodiment is provided with a first metal routing layer and a second metal routing layer whose routing surfaces are parallel to each other on the structural part, and at the same time, it is ensured that the orthographic projection of the second metal routing layer on the routing surface of the first metal routing layer overlaps with the first metal routing layer at least partially, so that a capacitor is formed between the first metal routing layer and the second metal routing layer, so that the high-frequency signal is transmitted between the first metal routing layer and the second metal routing layer. On the one hand, the second metal routing layer is provided on the surface of the structural part, which can significantly improve the antenna performance without substantially increasing the volume of the communication antenna. On the other hand, because there is no physical wire provided between the first metal routing layer and the second metal routing layer for connection, the production process of the communication antenna can be simplified and the cost of the communication antenna can be reduced. Moreover, because the first and second metal routing layers can be provided by the cold fusion spraying process, and the metal routing layer provided by the cold fusion spraying process does not affect the ID and shape of the surface of the structural part, it is beneficial to improve the aesthetic appearance of the communication antenna or the communication device.

[0039] Embodiment 2:

[0040] This embodiment will continue to introduce the aforementioned communication antenna with examples. Here, the communication device is a mobile phone for exemplary description. Fig. 9 As shown:

[0041] The communication antenna can be arranged on the shell of the mobile phone 9, for example, on the back shell 9a of the mobile phone. It should be understood that the back shell 9a of the mobile phone as a structural member should be made of insulating material. Usually, the back shell 9a is flat as a whole, and includes two surfaces: an inner surface and an outer surface, wherein the inner surface faces the inside of the mobile phone 9, and the outer surface faces the space outside the mobile phone 9. In some examples of this embodiment, the first metal wiring layer ( Fig. 9 The second metal wiring layer 93 is arranged on the inner surface of the rear shell 9a, while the second metal wiring layer 93 is arranged on the outer surface of the rear shell 9a.

[0042] The first metal routing layer and the second metal routing layer 93 are arranged on two opposite surfaces of the rear shell 9a, and the routing surfaces of the two are parallel to each other. Moreover, the orthographic projections of the first metal routing layer and the second metal routing layer 93 on the inner surface (or outer surface) of the rear shell 9a at least partially overlap. In this embodiment, the first metal routing layer is divided into two sub-parts, namely the first sub-part 92a and the second sub-part 92b. The first sub-part 92a and the second sub-part 92b are independent of each other, and there is no physical wire connection between the two. Fig.10 shown.

[0043] In this embodiment, the orthographic projection of the first metal wiring layer on the inner surface of the rear shell 9a is entirely contained in the orthographic projection of the second metal wiring layer 93 on the inner surface of the rear shell 9a, that is, the orthographic projection area S1 corresponding to the first metal wiring layer belongs to a subset of the orthographic projection area S2 of the second metal wiring layer 93. However, the orthographic projection area S2 corresponding to the second metal wiring layer is not a subset of the orthographic projection area S1 of the first metal wiring layer, and the area of ​​the projection area S2 is larger than the area of ​​the projection area S1. In other embodiments, the orthographic projection area of ​​one of the two divisions of the first metal wiring layer is a subset of the orthographic projection area S2 of the second metal wiring layer 93, and the orthographic projection area of ​​the other one intersects with the orthographic projection area S2.

[0044] In this embodiment, the first subdivision 92a is a port connection subdivision, and the second subdivision 92b is a non-connection subdivision. The first subdivision 92a can receive the RF signal transmitted from the RF port, and couple the RF signal to the second metal wiring layer 93, which is directly emitted to the external space by the second metal wiring layer 93 or further coupled and transmitted to the second subdivision 92b. The RF signal received by the second subdivision 92b from the external space can be transmitted to the second metal wiring layer 93 by using the capacitive coupling effect, and the second metal wiring layer 93 can transmit the received RF signal to the first subdivision 92a by using the capacitive coupling effect, so that the first subdivision 92a can transmit it to the RF port.

[0045] It can be understood that when the first metal routing layer includes at least two sections, and one section of each section is a port connection section and the other section is a non-connection section, the second metal routing layer acts as a "bridge" between these sections to facilitate the transmission of radio frequency signal energy between these sections. In addition, for the communication antenna, the second metal routing layer acts as a director for the directional pattern, which can pull the directional pattern toward the external space, thereby improving the performance of the communication antenna.

[0046] The communication antenna and communication device provided in this embodiment fully utilize the outer surface of the structural component in a limited space, and well balance the performance requirements and volume requirements of the antenna through the coupling of the second internal metal wiring layer, thereby maximizing the benefits.

[0047] The above contents are further detailed descriptions of the embodiments of the present invention in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A communication antenna, characterized in that: The invention comprises an insulating structural member, a first metal routing layer and a second metal routing layer arranged on the structural member, wherein the first metal routing layer is connected to a radio frequency port of a communication device through a physical wire, and there is no physical wire connection between the first metal routing layer and the second metal routing layer; an orthographic projection of the second metal routing layer on a routing surface of the first metal routing layer at least partially overlaps with the first metal routing layer; The first metal routing layer includes at least two independent sections that are not physically connected to each other by wires; the orthographic projection of the second metal routing layer on the routing surface of the first metal routing layer at least partially overlaps with each of the sections.

2. The communication antenna according to claim 1, characterized in that: The routing surface of the first metal routing layer is parallel to the routing surface of the second metal routing layer.

3. The communication antenna according to claim 1, characterized in that: The second metal wiring layer is disposed on a surface of the structural component.

4. The communication antenna according to claim 1, characterized in that: At least one of the first metal wiring layer and the second metal wiring layer is a metal layer produced by a cold spraying process.

5. The communication antenna according to claim 1, characterized in that: The sections in the first metal routing layer are divided into two categories, one is a port connection section physically connected to the RF port, and the other is a non-connection section; signals are transmitted between the non-connection section and the port connection section through the second metal routing layer.

6. The communication antenna according to claim 5, characterized in that: The first metal routing layer is composed of three divisions, including two port connection divisions and one non-connection division; or, the first metal routing layer is composed of a first division and a second division, the first division is a port connection division, and the second division is a non-connection division.

7. A communication device, characterized in that: The communication device comprises the communication antenna according to claims 1-6.

8. The communication device according to claim 7, characterized in that The communication device also includes a matching network, which is used to cooperate with an LC resonant circuit formed by a metal layer capacitor, and the metal layer capacitor is a capacitor formed by the first metal routing layer and the second metal routing layer.

9. The communication device according to claim 7 or 8, characterized in that: The communication device is a mobile terminal, the structural component is a rear shell of the mobile terminal, the second metal wiring layer is exposed on a second surface of the rear shell, and the first metal wiring layer is disposed on a side of the rear shell facing the inside of the mobile terminal.

Images