Patterned article comprising a conductive element

Abstract

The present disclosure relates to a patterned article, the patterned article comprising an integral polymer layer and a plurality of conductive elements at least partially embedded in the integral polymer layer. Each conductive element comprises a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the integral polymer layer, and comprising a metal body disposed on the top major surface of the conductive seed layer. The metal body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the integral polymer layer and extends from the bottom major surface of the metal body toward or to but not beyond the top major surface of the integral polymer layer. The conductive elements may be electrically insulated and isolated from each other. The present disclosure describes a method for making the patterned article.

Description

Background Art

[0001] Articles useful as antennas, EMI shields, or touch sensors may include micropatterns of conductive traces formed on a substrate by photolithography. Summary of the invention

[0002] The present disclosure generally relates to patterned articles including conductive elements. The conductive elements may be electrically isolated from each other or may be electrically connected to each other only by means of one or more bus bars.

[0003] In some aspects of the present disclosure, a patterned article is provided. The patterned article includes an integral polymer layer and a plurality of conductive elements at least partially embedded in the integral polymer layer and electrically insulated and isolated from each other. Each conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the integral polymer layer, and includes a metal body disposed on the top major surface of the conductive seed layer. The metal body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the integral polymer layer and extends from the bottom major surface of the metal body toward or to but not beyond the top major surface of the integral polymer layer.

[0004] In some aspects of the present disclosure, a patterned article is provided. The patterned article includes an integral polymer layer extending along orthogonal first and second directions, and a plurality of conductive elements at least partially embedded in the integral polymer layer and extending along the first direction. The conductive elements are electrically connected to each other only by means of one or more busbars extending along the second direction and at least partially embedded in the integral polymer layer, so that for each busbar, each of the conductive elements is arranged on the same side of the busbar, or a plurality of conductive elements are arranged on opposite sides of the busbar. Each conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface directly in contact with the integral polymer layer, and including a metal body arranged on the top major surface of the conductive seed layer. The metal body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the integral polymer layer and extends from the bottom major surface of the metal body toward or to but not beyond the top major surface of the integral polymer layer.

[0005] In some aspects of the present disclosure, a method for making a patterned article is provided. The method includes providing a tool, the tool including at least one raised portion; disposing a conductive layer on the top surface of the first portion of the at least one raised portion, so that at least a majority of the total area of ​​the side surface of the first portion of the at least one raised portion does not contain the conductive layer; after the step of disposing the conductive layer, disposing a polymer or a polymer precursor on the tool; hardening the polymer or the polymer precursor to form a polymer layer, the polymer layer including at least one cavity corresponding to the at least one raised portion; removing the polymer layer and the conductive layer from the tool, so that the conductive layer is disposed at the bottom surface of the at least one cavity; depositing a conductive material into the at least one cavity, so that the conductive material covers the conductive layer, and the conductive material and the conductive layer define a plurality of conductive elements electrically connected to each other through one or more busbars; disconnecting the conductive elements from the one or more busbars, so that the disconnected conductive elements are electrically insulated and isolated from each other.

[0006] These and other aspects will become apparent from the following detailed description.This brief summary, however, should not be construed in any way as limiting the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a schematic top plan view of a portion of an exemplary patterned article.

[0008] Figures 2 to 3 is a schematic cross-sectional view of a portion of an exemplary patterned article.

[0009] Figure 4 is a schematic cross-sectional view of an exemplary conductive element.

[0010] FIG. 5A to FIG. 5H is a schematic diagram of steps in an exemplary method for making a patterned article.

[0011] Figure 6 to Figure 7 is a schematic cross-sectional view of a substrate including a trench or a cavity, wherein a conductive seed layer is disposed on a bottom surface of the trench or the cavity, according to some embodiments.

[0012] Figure 8 is a schematic top view of an exemplary conductive seed layer.

[0013] Figures 9 and 10 is a schematic cross-sectional view of an exemplary conductive seed layer.

[0014] FIG. 11A to FIG. 11B is a schematic cross-sectional view of an exemplary metal body in orthogonal cross-section.

[0015] FIG. 12A to FIG. 12B is a schematic top plan view of an exemplary antenna.

[0016] Figure 13 to Figure 14 is a schematic cross-sectional view of an exemplary patterned article.

[0017] Figures 15 to 19 is a schematic top plan view of an exemplary patterned article. DETAILED DESCRIPTION

[0018] In the following description, reference is made to the accompanying drawings, which form a part of the present invention and in which various embodiments are shown by way of example. The drawings are not necessarily drawn to scale. It should be understood that other embodiments may be conceived and carried out without departing from the scope or essence of the present description. Therefore, the following specific embodiments should not be considered to have a limiting meaning.

[0019] In some embodiments, the patterned article includes conductive elements that are electrically isolated from each other. In other embodiments, the patterned article includes conductive elements that are electrically connected to each other only by means of one or more bus bars. In some embodiments, the bus bars are removed or disconnected so that the conductive elements are electrically isolated from each other. The conductive elements can be arranged to provide any suitable function. For example, in some embodiments, a plurality of conductive elements define an antenna (see, e.g., FIG. 12A to FIG. 12B ), the antenna may be or include, for example, an antenna array, such as a directional back-tracking antenna array (see, for example Fig.19 ). Still other embodiments include electromagnetic interference (EMI) shields, static dissipative components, heaters, electrodes, or sensors. The device may be provided as a series of devices that can subsequently be cut to provide individual devices.

[0020] In some embodiments, the conductive elements are patterned. For example, the conductive elements may include or be formed of a micropattern of conductive traces. In some embodiments, at least some of the conductive elements (e.g., at least a majority of the conductive elements or in some cases all of the conductive elements) include a micropattern of conductive traces. The use of a micropattern of conductive traces can result in high optical transparency of the patterned article. In other embodiments, the conductive elements are formed of a non-patterned metal and may have low optical transparency.

[0021] Conductive elements, such as those containing micropatterns of conductive traces, can be formed on a substrate using a photolithography process. According to some aspects of the present specification, methods have been developed to form conductive elements at least partially within a substrate without using photolithography. In some embodiments, the processes described herein are less expensive and / or easier to implement than conventional photolithography processes. In some embodiments, such processes allow the formation of traces having, for example, a large (e.g., at least 0.8) aspect ratio (thickness divided by width). For applications requiring high transparency and high conductivity, a large aspect ratio may be required. For example, increasing the open area ratio can increase transparency, but can reduce conductivity for a fixed trace thickness. The trace can then be made thicker to increase conductivity, which can result in a high aspect ratio. In some embodiments, for example, the patterned article can be used at a relatively high operating frequency (e.g., the patterned article can be an antenna designed to operate at microwave frequencies), wherein the surface depth of the material of the trace is less than the width of the trace. Using a high aspect ratio increases the surface area of ​​a trace for a given trace width, compared to traces with lower aspect ratios of the same trace width (e.g., those conventionally formed by lithography or printing), and this increases conductor usage (and therefore conductivity at operating frequencies).

[0022] In some embodiments, the trace or other conductive element is formed by plating on a conductive layer (e.g., electroplating on a conductive seed layer) that is disposed on the bottom of a cavity in a substrate. The cavity in the substrate may be a groove in the substrate, a network of grooves in the substrate, or a micropattern, or other space within the substrate. The sidewalls of the cavity may be free of or substantially free of a conductive seed layer. It has been found that plating onto a conductive seed layer (disposed on the bottom of the cavity rather than on the sidewalls) provides improved control of the profile of the trace or other conductive element compared to plating into the cavity (where the seed layer is also located on the sidewalls). For example, if the seed layer is on the sidewalls, plating may result in metal being formed on the upper portion of the seed layer on the sidewalls, which may result in excessive deposition of metal on the top surface of the substrate, thereby crossing the edge of the cavity. For patterned articles made by conventional methods, such overdeposition is problematic, particularly where a high aspect ratio is desired, because this reduces optical transmission through the patterned article.

[0023] In addition, placing the conductive layer at the bottom of the cavity provides protection for the conductive layer (e.g., improved durability). For some applications, high conductivity may not be required, so in some embodiments, no conductor is plated onto the conductive layer. In some such embodiments, a non-metallic material may be disposed in the cavity on the conductive layer. For example, one or more of an adhesive, a polymer, or a dielectric material (e.g., a polymer optically clear adhesive) may be backfilled into the cavity above the conductive layer.

[0024] Unless otherwise specified, a conductive member (eg, a body, layer, trace, element, or material) is intended to be a member that conducts electricity. A conductive member may have, for example, a resistance of less than 1 ohm×m, or less than 0.01 ohm×m, or less than 10 -4 ohm×m, or less than 10 - 6 Unless otherwise specified, non-conductive materials refer to electrically non-conductive materials. Non-conductive materials may have, for example, a resistivity greater than 100 ohm×m, or greater than 10 4 ohm×m, or greater than 10 6 ohm×m, or greater than 10 8 Resistivity in ohm x m. Unless otherwise indicated, resistivity refers to direct current (DC) resistivity.

[0025] Figure 1 is a schematic top plan view of a portion of a patterned article 100. The article 100 includes a layer or substrate 110 and a conductive element 120 at least partially embedded in the layer or substrate 110. In the illustrated embodiment, the conductive element 120 includes a pattern (e.g., a micropattern) of conductive traces 121 at least partially embedded in the layer or substrate 110. In other embodiments, the conductive element 120 is not formed by a pattern of traces. Figure 1 Other portions of the patterned article 100 not shown may include other conductive elements electrically insulated from the conductive element 120. Each conductive trace 121 extends along a longitudinal direction 122 of the conductive trace 121. Each conductive trace 121 may have a length along the longitudinal direction 122 and a width along an orthogonal direction, wherein the width is substantially less than the length. In some embodiments, the layer or substrate 110 is integral or includes an integral layer. For example, the layer or substrate 110 may be a monolithic polymer layer or substrate, or may include a monolithic polymer first layer disposed on a second layer of a substrate, wherein the conductive element 120 is at least partially embedded in the monolithic polymer first layer.

[0026] In some embodiments, the layer or substrate 110 is substantially transparent. In some embodiments, the patterned article 100 is substantially transparent. For example, the article 100 can be substantially transparent when the article 100 has a sufficiently high open area ratio (the portion or percentage of area not covered by traces in a top plan view of the article 100). In some embodiments, the open area ratio of the article 100 or the micropattern of conductive traces 121 is in the range of 80% to 99.95%, or 80% to 99.9%, or 85% to 99.9%, or 90% to 99.9%, or 95% to 99.9%. In some embodiments, in a top plan view, the total area of ​​the pattern of conductive traces 121 is less than 50%, or less than 20%, or less than 10%, or less than 5%, or less than 3%, or less than 2%, or less than 1% of the total surface area of ​​the patterned article 100. In some embodiments, the average optical transmittance of the article 100 for normally incident visible light (wavelengths in the range of 400 nm to 700 nm) is at least 50%, or at least 70%, or at least 80%, or at least 90%. In some embodiments, the average optical transmittance may be less than 70% or less than 50%. For example, the article 100 may include additional layers, such as decorative films that reduce the average optical transmittance (e.g., FASARA window films available from 3M Company, St. Paul, MN). Other suitable films for additional layers include 3M DIAMOND GRADE reflective sheeting available from 3M Company, St. Paul, MN, and DI-NOC films available from 3M Company, Minnesota, USA, which may reduce or substantially eliminate the optical transmittance of the article, but may benefit from the high optical transmittance of the micropattern of conductive traces 121. The optical transmittance may be measured from the top major surface or the bottom major surface of the article 100. In some embodiments, the average optical transmittance of the substrate with conductive traces differs from the average optical transmittance of the substrate without conductive traces by no more than 5%, or by no more than 2%, or by no more than 1%.

[0027] In some embodiments, the article 100 is a flexible film (eg, bendable 180 degrees around a cylinder having a diameter of 10 cm without cracking). As described elsewhere, the flexible film can be substantially transparent.

[0028] In some embodiments, the article 100 is at least one of an antenna, an antenna array, a directional traceback antenna array, a Van Atta array, a heater, an electromagnetic interference (EMI) shield, an electrostatic dissipation component, a sensor, an electromagnetic wave filter, an architectural membrane, or an electrode. In some embodiments, the article 100 is or includes an array of any of these elements or devices. In some embodiments, the article 100 is an antenna as further described elsewhere herein. In some embodiments, the article 100 is a sensor, such as a touch sensor. In some embodiments, the article 100 is substantially transparent and / or a flexible film. In some embodiments, an antenna, an array of antennas, an antenna array, a directional traceback antenna array, a Van Atta array, a heater, an electromagnetic interference shield, an electrostatic dissipation component, a sensor, an electromagnetic wave filter, or an electrode is substantially transparent and / or a flexible film.

[0029] The pattern of conductive traces 121 can be or include a grid pattern, which can be a two-dimensional regular array (e.g., a rectangular, square, triangular, or hexagonal array) or a two-dimensional irregular array of traces. For example, suitable micropattern geometries for article 100 include those described in U.S. Patent Application Publication Nos. 2008 / 0095988 (Frey et al.), 2009 / 0219257 (Frey et al.), 2015 / 0138151 (Moran et al.), 2013 / 0264390 (Frey et al.), and 2015 / 0085460 (Frey).

[0030] In some embodiments, each conductive element 120 is at least partially disposed in a cavity in a layer or substrate 110. The cavity can be defined by a plurality of grooves in a layer or substrate. For example, in some embodiments, each trace 121 is at least partially disposed in a groove in a layer or substrate 110.

[0031] Figure 22 is a schematic cross-sectional view of a portion of a patterned article 200, the patterned article comprising a substrate 210 and a conductive element 220 at least partially embedded in the substrate 210. In the illustrated embodiment, the substrate 210 includes a layer 210-1 disposed on a layer 210-2. In some embodiments, the layer 210-1 is a one-piece polymer layer. In such embodiments, the layer 210-1 can be considered to be a first one-piece substrate disposed on a second substrate (layer 210-2). In some embodiments, the layer 210-2 is a one-piece layer. In some embodiments, the layer 210-1 can be formed by casting and curing a resin onto the layer 210-2. In some embodiments, the substrate 210 is substantially transparent and / or polymeric. For example, the conductive element 220 may include traces in a micropattern of conductive traces. The conductive element 220 includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234, the bottom major surface being in direct contact with the substrate 210 (e.g., in direct contact with the integral polymer layer 210-1 of the substrate 210). The conductive element 220 also includes a metal body 240 disposed on the top major surface 232 of the conductive seed layer 230. The metal body 240 may be an integral metal body and / or may be in direct contact with the conductive seed layer 230. For example, the conductive seed layer 230 may be or may include a cured conductive ink or a cured conductive coating, or may be or may include, for example, a transferred layer (e.g., a transferred metal layer). For example, the metal body 240 may be formed by plating. The metal body 240 and the conductive seed layer 230 may be coextensive with each other (e.g., in the xy plane). In some embodiments, the metal body 240 and the conductive seed layer 230 differ in at least one of composition or crystal morphology. Metal body 240 has sidewall 242 and sidewall 244. In some cases, sidewall 242 and sidewall 244 may be referred to as lateral sidewalls because they are located on the sides of metal body 240 in a top plan view of patterned article 200. In some embodiments, at least a majority (or at least 60%, or at least 70%, or at least 80%, or at least 90%) of the total area of ​​sidewall 242 and sidewall 244 is in direct contact with layer 210-1.

[0032] In some embodiments, the conductive pattern may be included in layer 210-2 as well as layer 210-1. Alternatively, a third layer (eg, another integral polymer layer) may be disposed on layer 210-2 opposite layer 210-1, and the conductive pattern may be formed in the third layer.

[0033] Alternatively or in addition, according to some embodiments, the patterned article 200 can be described as follows. The patterned article 200 includes a substrate 210 including a first cavity or groove 212 therein. For example, the substrate 210 can include a micropattern including grooves (see, e.g., Figure 1), wherein the first cavity or trench 212 is a trench, and the micropattern of the trench includes the trench, and wherein the conductive element 220 includes a trace at least partially disposed in the trench. In some embodiments, the first cavity or trench 212 extends in the longitudinal direction of the first cavity or trench 212 (the y direction of the xyz coordinate system shown), and has a bottom surface 218 and side surfaces 214 and 216. A conductive seed layer 230 is disposed in the first cavity or trench 212, and a metal body 240 is at least partially disposed in the first cavity or trench 212. In some embodiments, at least one cross-section of the first cavity or trench 212 (e.g., the cross-section shown in the xz plane) is perpendicular to the longitudinal direction, the conductive seed layer 230 covers at least a majority (>50% by area) of the bottom surface 218 of the first cavity or trench 212, and the metal body 240 covers the conductive seed layer 230 and at least a majority (>50% by area) of the side surfaces 214 and 216 of the first cavity or trench 212. In some embodiments, each of the side surfaces 214 and 216 and the metal body 240 define a conductor-insulator interface (245 and 247, respectively) therebetween, and the metal body 240 and the conductive seed layer 230 define a conductor-conductor interface 235 therebetween. In some embodiments, the metal body 240 is a unitary metal body.

[0034] In some embodiments, the first cavity or trench 212 is generally cubic in shape and includes four side surfaces, and the metal body 240 has four lateral side walls. In some embodiments, the first cavity or trench 212 is a trench having two opposing lateral side walls. In some embodiments, the first cavity or trench 212 is generally cylindrical in shape and has a single side surface, and the metal body has a single lateral side wall.

[0035] As further described elsewhere herein, in some embodiments, the metal body 240 has a lower first surface roughness at a first interface (245 and / or 247) joined to the side surfaces (214 and 216) and a higher second surface roughness at a second interface (235) joined to the conductive seed layer 230.

[0036] As further described elsewhere herein, in some embodiments, in a plane passing through the metal body 240 and parallel to and separated from the conductive seed layer 230, the metal body has a lower first line edge roughness at a first interface joined to the side surfaces 214, 216, and the conductive seed layer 230 has a higher second line edge roughness at an edge of the conductive seed layer 230.

[0037] In some embodiments, the metal body 240 can bottom fill the cavity (e.g., the top surface of the metal body 240 can be completely lower than the top major surface 211). In some embodiments, the metal body 240 can fill or overfill the cavity or trench 212 (e.g., a portion of the metal body can extend above the top major surface 211). Regardless of whether the top surface of the metal body extends beyond the top major surface 211, each sidewall preferably extends from the bottom major surface of the metal body toward or to but not beyond the top major surface of the integral polymer layer. Figure 3 An embodiment is schematically shown in which a top surface of the metal body extends above a top surface of the substrate.

[0038] Figure 3 3 is a schematic cross-sectional view of a portion of a patterned article 300, the patterned article including a substrate 310 including a first cavity or trench 312 therein, and also including an optional optical film 380 bonded to the substrate 310. A conductive seed layer 330 is disposed in the first cavity or trench 312, and a metal body 340 (which may be a unitary metal body) is at least partially disposed in the first cavity or trench 312. For example, the substrate 310 may include more than one layer (e.g., corresponding to the substrate 210) and may include a unitary top layer. The bottom surface 393 of the metal body 340 directly contacts the top surface of the conductive seed layer. The patterned article 300 may correspond to the patterned article 200, except that the metal body 340 extends beyond the top major surface 311 of the substrate 310 in a central portion of the metal body 340 (in the cross section shown), and the article 300 includes the optional optical film 380. For example, the top surface 376 of the metal body 340 or other metal bodies described herein can be convexly domed (concave downwardly) as shown, or can be concave upwardly, or can be substantially planar, or can have an irregular shape. In some embodiments, the top surface 376 of the metal body 340 extends at least partially above the top major surface 311 of the substrate 310 (or above the top major surface of an integral polymer layer of the substrate 310), such as Figure 3 In other embodiments, top surface 376 of metal body 340 is disposed entirely between top major surface 311 and bottom major surface 313 of substrate 310 (or between top major surface and bottom major surface of an integral polymer layer of substrate 310).

[0039] The optical film 380 can be laminated to the substrate 310 using an optically clear adhesive (not shown), or the substrate 310 can be formed directly on the optical film 380. The optical film 380 can be disposed on the bottom surface 313 of the substrate 310 as shown, or can be disposed on the top surface 311 of the substrate 310. In some embodiments, the optical film 380 is or includes one or more of a window film, a textured film, a patterned film, an infrared reflective film, or a retroreflector. For example, useful optical films include those described in U.S. Patent Application Publication Nos. 2017 / 0248741 (Hao et al.), 2015 / 0285956 (Schmidt et al.), 2010 / 0316852 (Condo et al.), 2016 / 0170101 (Kivel et al.), 2014 / 0204294 (Lv), 2014 / 0308477 (Derks et al.), 2014 / 0057058 (Yapel et al.), 2005 / 0079333 (Wheatley et al.), 2002 / 0012248 (Campbell et al.), and 2010 / 0103521 (Smith et al.).

[0040] In some embodiments, in at least one cross section of the first cavity or trench 312 (respectively 212), the metal body 340 (respectively 240) fills more than half of the cross-sectional area of ​​the first cavity or trench 312 (respectively 312). In some embodiments, the metal body 340 (respectively 240) fills at least 60%, or at least 70%, or at least 80%, or at least 90% of the cross-sectional area of ​​the first cavity or trench 312 (respectively 212). In some embodiments, the metal body 340 (respectively 240) and the conductive seed layer 330 (respectively 230) together fill the cross-sectional area of ​​the first cavity or trench 312 (respectively 212).

[0041] In some embodiments, the patterned article (e.g., 300, 200, 100) includes an integral polymer layer (e.g., 310, 210-1, 110) and a plurality of conductive elements (e.g., 320, 220, 120) at least partially embedded in the integral polymer layer and electrically insulated from each other. Figures 1 to 3 In the portion of the article shown, only one conductive element is shown; for example, Fig. 12A , Fig.15 and Fig.19A plurality of electrically insulated and isolated conductive elements are schematically shown. Each conductive element includes a conductive seed layer (e.g., 330, 230) having a top main surface (e.g., 235) and a relative bottom main surface (e.g., 234) in direct contact with an integral polymer layer (e.g., 310, 210-1); and a metal body (e.g., 340, 240) disposed on the top main surface of the conductive seed layer. The metal body has a bottom main surface (e.g., 393, 293) and at least one sidewall (e.g., 242, 244). The bottom main surface (e.g., 393, 293) contacts the conductive seed layer. Each sidewall is in direct contact with the integral polymer layer and extends from the bottom main surface of the metal body (e.g., 393, 293) toward or to but not exceeding the top main surface (e.g., 311, 211) of the integral polymer layer. In some embodiments, each sidewall extends toward but does not extend to the top main surface of the integral polymer layer.

[0042] Figure 4 4 is a schematic cross-sectional view of a conductive element 420 including a metal body 440 disposed on a conductive seed layer 430. The conductive element 420 may have substantially vertical sidewalls, such as Figure 4 , or the sidewalls may be sloped, as shown elsewhere herein. In some embodiments, the metal body 440 and the conductive seed layer 430 differ in at least one of composition or crystal morphology. For example, the composition may differ when the conductive seed layer 430 and the metal body 440 comprise different metals, or when the conductive seed layer 430 is a cured conductive ink or a cured conductive coating and the metal body 440 is a solid metal. For example, Figure 4 Different cross-hatching in the diagram may schematically represent different compositions. Alternatively or in addition, for example, Figure 4The different cross-hatched lines in the figure may schematically represent different crystal morphologies. For example, when the conductive seed layer 430 and the metal body 440 are formed of the same metal but have different grain size distributions due to different process conditions for forming the materials, the crystal morphologies may be different. For another example, when the conductive seed layer 430 is formed of a first metal having a first crystal structure (e.g., face-centered cubic (fcc), body-centered cubic (bcc), or hexagonal close-packed (hcp)), and the metal body 440 is formed of a different second metal having a different second crystal structure (e.g., a different one of fcc, bcc, or hcp), the composition and crystal morphology may be different. For another example, when one of the metal body 440 and the conductive seed layer 430 is amorphous or substantially amorphous and the other of the metal body 440 and the conductive seed layer 430 has significant crystallinity, the crystal morphologies may be different. In some embodiments, the metal body 440 and the conductive seed layer 430 have different crystal morphologies, which may be characterized by different average grain sizes. For example, average grain size can be determined as described in ASTM Standard E112-13 "Standard Test Methods for Determining Average Grain Size."

[0043] The metal body 440 and the conductive seed layer 430 define an interface 435 therebetween. The interface 435 can be sharp (e.g., when the metal body 440 and the conductive seed layer 430 have different compositions and there is little diffusion between the two layers) or widened (e.g., when the metal body 440 and the conductive seed layer 430 have the same composition but different crystal morphologies and there is a transition region between the different crystal morphologies, or when there is a large amount of diffusion between the two layers that widens the interface 435). The thickness (dimension along the z-direction) of the interface 435 is typically significantly less than the thickness of the metal body 440. In some embodiments, the thickness of the interface 435 is less than 5%, or less than 2%, or less than 1%, or less than 0.5% of the thickness of the metal body 440. In some embodiments, the interface 435 is a conductor-conductor interface having a thickness of less than 1 micrometer, or less than 500 nm, or less than 300 nm, or less than 100 nm, or less than 50 nm.

[0044] In some embodiments, each of the conductive elements in at least a majority of the conductive elements comprises or is defined by a micropattern of conductive traces. In some embodiments, each of the conductive traces in at least a majority of the conductive traces in the micropattern has a width W along a width direction (x direction) orthogonal to the longitudinal direction (y direction) and the thickness direction (z direction) of the substrate, and has a thickness T along the thickness direction. In the case of tapered traces, the width W can be understood as the width of the trace at a vertical position where the trace is widest (e.g., near the top of the trace). In some embodiments, T / W is at least 0.8, 1, 1.2, 1.5, 2, 5, or 7. In some such embodiments, the patterned article has an optical transmittance and / or an open area ratio in any range described elsewhere herein.

[0045] FIG. 5A to FIG. 5H The various steps in an exemplary process for making a patterned article are schematically shown. In some embodiments, the method includes providing a tool 550 having at least one raised portion 555 (e.g., at least one ridge), such as Figure 5A Schematically shown, the figure is a schematic cross-sectional view of a tool 550. In the illustrated embodiment, the tool 550 is schematically shown as having a substantially flat bottom surface. In other embodiments, the tool 550 has, for example, a generally cylindrical shape. The tool 550 can be made by, for example, diamond turning, laser machining, or photolithography. For example, the tool can be a metal tool or can be a polymer tool formed from a metal tool (e.g., by compression molding a polymer against a metal tool). The method includes disposing a conductive layer 530 on a top surface 556 of a first portion 557 of at least one raised portion 555, such that at least a majority of the total area of ​​a side surface 560 of the first portion 557 of the at least one raised portion 555 is free of the conductive layer 530, such as Figure 5B The top surface 556 may be substantially planar (eg, Figure 5A Schematically shown), or may be structured or formed to provide a desired structure or shape to the resulting conductive layer 530. The conductive layer 530 has a major surface 534 that contacts the tool 550 and an opposing major surface 532. In some embodiments, at least a majority of the total area of ​​the side surface of at least one raised portion 555 is free of the conductive layer 530. After the conductive layer 530 is disposed on the top surface 556, the conductive material of the conductive layer 530 covers less than half of the total area of ​​the side surface 560, and preferably less than 25% or less than 10%. In some embodiments, the first portion 557 may include all of the at least one raised portion 555, and the top surface 556 may be the top surface of all of the raised portions in the at least one raised portion 555. In other embodiments, the portion of the at least one raised portion 555 that receives the conductive layer (e.g., Figure 5C The illustrated first portion 557b) may include less than all of the at least one raised portion 555 .

[0046] In some embodiments, the conductive layer 530 is disposed on the top surface 556b of the first portion 557b of the at least one raised portion 555 (see Figure 5C ), the top surface 558 of the second portion 559 of at least one raised portion 555 does not contain the conductive layer 530. Figure 5C , which schematically illustrates a conductive layer 530b disposed only on the top surface of two of the four raised portions shown. Providing a conductive layer on only a portion of the top surface of the raised portions allows a tool having a uniform pattern (e.g., a uniform hexagonal pattern) to produce, for example, a conductor micropattern having an inconsistent pattern (e.g., a conductor may be hexagonal in some areas and may not be present in other areas). In some embodiments, a first portion 557b of at least one raised portion 555 includes a plurality of first raised portions, and a second portion 559 of at least one raised portion 555 includes a plurality of second raised portions.

[0047] In some embodiments, the conductive layer 530 or 530b is provided in the form of a transfer layer. In some embodiments, disposing the conductive layer 530 (or 530b) on the top surface 556 (or 556b) of the first portion 557 (or 557b) of the at least one raised portion 555 includes transferring the conductive layer from a transfer film to the top surface. FIG. 5D to FIG. 5E Schematically shown in , these figures are schematic cross-sectional views of the conductive layer 530 before and after being transferred to the top surface 556. The transfer film 590 includes a transfer layer 592 disposed on a substrate 594. When the transfer film 590 contacts the tool 550, a portion of the transfer layer 592 is transferred from the substrate 594 to the top surface 556 to form the conductive layer 530. The transfer layer 592 may include a sublayer. For example, the transfer layer 592 may include a metal layer (or other conductive layer) and an adhesive layer for releasably attaching the metal layer to the top surface 556. The metal layer (or other conductive layer) may be an integral conductive layer. The transfer layer 592 may also include a cross-linked polymer layer (e.g., an acrylic layer), wherein the metal or other conductive layer is disposed on either side of the cross-linked polymer layer. The transfer layer 592 may also include a dielectric layer, which may be disposed between the metal or other conductive layer and the cross-linked polymer layer. In some embodiments, the transfer layer 592 includes a dielectric layer that is located between the transferred conductive layer and the top surface 556 after being transferred to the tool 550. In such embodiments, the polymer layer 510 formed using the tool with the transferred conductive layer (see Figure 5G) may include a dielectric layer at the bottom of at least one cavity or trench 512 in the polymer layer 510, and the method may include removing (e.g., by reactive ion etching) the dielectric layer. For example, the transfer layer may be prepared as described in U.S. Patent No. 8,658,248 (Anderson et al.) or U.S. Patent No. 7,018,713 (Padiyath et al.). The substrate 594 may include a release layer disposed on the polymer substrate layer. The transfer film may be as described in U.S. Patent Application Publication No. 2020 / 0016879 (Nakahata et al.), International Patent Application No. WO 2018 / 178803 (Gotrik et al.).

[0048] In some embodiments, the conductive layer 530 or 530b is applied as a conductive ink or as a conductive coating. In some embodiments, disposing the conductive layer 530b (or 530) on the top surface 556b (or 556) of the first portion 557b (or 557) of at least one raised portion 555 includes inking the tool 550 with a conductive ink, or coating the tool with a conductive coating, so that the conductive ink or coating is disposed on the top surface. In some such embodiments, the conductive ink or coating is cured (e.g., by drying and sintering or by other curing means, such as those described elsewhere herein for curing resin layers), and the cured conductive ink or coating is the conductive layer 530b (or 530). The step of curing the conductive ink or coating may be performed before the step of hardening the polymer or polymer precursor step (described below), after the hardening step, or simultaneously with the hardening. Applying the conductive layer as a conductive ink or coating may result in some wetting of the side surface 560, such as Figure 5C It is schematically shown in FIG.

[0049] The method includes setting (e.g., casting) a polymer or polymer precursor 562 onto a tool 550 after a step of setting a conductive layer; hardening the polymer or polymer precursor to form a polymer layer 510, the polymer layer including at least one cavity 512 corresponding to at least one raised portion 555; and removing the polymer layer 510 and the conductive layer 530 from the tool 550 so that the conductive layer 530 is set at a bottom surface 518 of at least one cavity 512. Fig. 5F is a schematic cross-sectional view of a tool 550 including a polymer or polymer precursor 562 disposed on the tool 550 . Figure 5Gis a schematic cross-sectional view of a polymer layer 510 having a conductive layer 530 disposed at a bottom surface 518 of at least one cavity 512. A major surface 532 of the conductive layer 530 contacts the bottom surface 518 of the at least one cavity 512. The conductive layer 530 may cover all or substantially all of the total surface area of ​​the bottom surface 518 of the at least one cavity 512, or may cover a first portion 519 of the bottom surface 518 (e.g., corresponding to the first portion 557b), while a second portion 515 of the bottom surface 518 is free of the conductive layer 530, as shown in FIG. Figure 5H The at least one cavity 512 may be a plurality of cavities or may be a single cavity (eg, a network of interconnected cavities may alternatively be a single cavity).

[0050] For ease of description, spatially relative terms (including but not limited to "bottom", "lower", "upper", "below", "lower than", "above", "top", and "on top"), if used herein, are used to describe spatial relationships. In addition to the specific orientations depicted in the drawings and described herein, such spatially relative terms encompass different orientations of the article when in use or operation. For example, regardless of whether the substrate including the groove or cavity is flipped or inverted, the bottom surface of the groove or cavity is opposite to the open top of the groove or cavity.

[0051] When each cavity in at least one cavity is formed by a raised portion in at least one raised portion 555, at least one cavity 512 may be described as corresponding to at least one raised portion 555. For example, at least one cavity 512 may be a groove or include a groove, and at least one raised portion 555 may be a ridge forming a groove or include a ridge forming a groove. The correspondence may be one-to-one or not one-to-one. For example, in some embodiments, the tool is generally generally cylindrical and used in a continuous winding method, and the same raised portion may form a plurality of cavities in at least one cavity 512 (for example, if the tool has a circumference of 20 cm, the same raised portion in the tool may be used to make a plurality of cavities spaced 20 cm apart from each other in the polymer layer). In some cases, the tool may include additional raised portions that are not coated with resin, and there may be no cavity corresponding to the raised portion of the uncoated coating (for example, if no polymer or polymer precursor is cast on the end portion of the tool, any raised portion that may be present in the end portion will not produce a cavity in the resulting polymer layer).

[0052] In some embodiments, polymer or polymer precursor is molten polymer or comprises molten polymer, and hardened polymer or polymer precursor comprises cooling molten polymer.For example, polymer or polymer precursor can be thermoplastic resin (for example, polyethylene terephthalate, polypropylene, polycarbonate or other thermoplastic resins known in the art) applied as melt, and this melt is cooled to form thermoplastic polymer layer.In some embodiments, polymer or polymer precursor is heat softening polymer or comprises heat softening polymer, and hardened polymer or polymer precursor comprises cooling heat softening polymer.For example, polymer can be softened, embossed or otherwise structured by applying heat, then cools to harden polymer.In some embodiments, polymer or polymer precursor is polymer precursor or comprises polymer precursor, and hardened polymer or polymer precursor comprises polymerizing polymer precursor.In some embodiments, polymer or polymer precursor is resin or comprises resin, and hardened polymer or polymer precursor comprises curing resin.Curing resin can comprise applying actinic radiation, heating resin and / or catalyst curing to resin. For example, the resin can be cured by applying radiation (e.g., ultraviolet (UV) radiation or electron beam radiation or other actinic radiation) or by applying heat or by using other crosslinking mechanisms known in the art. The resin can be, for example, an acrylate or epoxy, or other resin chemistries can be used.

[0053] In some embodiments, the method further includes depositing a conductive material (e.g., by electroplating) into at least one cavity 512 such that the conductive material covers the conductive layer 530. This can be performed after removing the polymer layer 510 and the conductive layer 530 from the tool 550, such as Figure 5G to Figure 5H Schematically shown. The conductive material can form a metal body, as described elsewhere herein. In some embodiments, depositing the conductive material into at least one cavity 512 includes depositing the conductive material into a first portion 512a of the at least one cavity corresponding to a first portion of the at least one raised portion (e.g., a portion of the at least one cavity 512 that includes the conductive layer 530), and not depositing the conductive material into a second portion 512b of the at least one cavity that corresponds to a second portion of the at least one raised portion (e.g., a portion of the at least one cavity 512 that does not include the conductive layer 530).

[0054] In some embodiments, as further described elsewhere herein, a conductive material is deposited into at least one cavity 512 such that the conductive material covers the conductive layer 530, which results in the conductive material and the conductive layer 530 defining a plurality of conductive elements electrically connected to each other by one or more busbars (e.g., conductive wires or conductive rods or other elements that can be used to electrically connect the conductive elements to keep the conductive elements at substantially the same electrical potential). In some embodiments, the method also includes disconnecting the conductive elements from the one or more busbars such that the disconnected conductive elements are electrically insulated from each other. For example, the conductive material may be a metal (e.g., electroplated metal). Each conductive element may include a metal body (formed by a conductive material) disposed on a conductive seed layer, as further described elsewhere herein. The metal body and the conductive seed layer may be coextensive with each other.

[0055] In some embodiments, Figure 5G to Figure 5H The schematically illustrated article may be described as comprising a first cavity (e.g., Figure 5G Any one of the cavities 512 shown in Figure 5H The present invention relates to a substrate (e.g., polymer layer 510, or polymer layer 510 plus a substrate layer on which polymer layer 510 can be formed) having a cavity in any of the cavities in the first portion 512a shown, wherein the first cavity extends in the longitudinal direction (y direction) and has a bottom surface 518 and side surfaces 514 and 516 (e.g., the first cavity can be a groove, and side surfaces 514 and 516 can be opposite lateral side surfaces of the groove); and an integral conductive layer (e.g., conductive layer 530, or an integral sublayer of conductive layer 530 (e.g., a transferred metal layer) disposed in the first cavity. ). In at least one cross section of the first cavity perpendicular to the longitudinal direction, the conductive layer covers at least a majority of the bottom surface of the first cavity, and at least a majority of the side surface of the first cavity does not contact a material having the same composition as the integral conductive layer. For example, in some embodiments, side surface 514 and side surface 516 may contact air. In some embodiments, a dielectric material or a conductive material having a composition different from that of the integral conductive layer or a non-metallic material is at least partially disposed in the first cavity and in at least one cross section of the first cavity, wherein the material covers at least a majority of the side surface of the first cavity (see, e.g. Fig.14 ).

[0056] Figure 66 is a schematic cross-sectional view of a layer 610 (e.g., which may be an integral layer of a multilayer substrate and / or may be an integral polymer layer) including a groove or cavity 612, wherein a conductive seed layer 630 is disposed on a bottom surface of the groove or cavity 612. The bottom major surface of the conductive seed layer 630 may be in direct contact with the layer 610. A metal body may be formed on the conductive seed layer 630 (e.g., by plating) to form a conductive element, which may include, for example, a conductive trace extending along the length (y-direction) of the trace. In some embodiments, the conductive seed layer 630 has a central region 638 that extends along the length of the conductive trace and is disposed between a first edge region 637 and a second edge region 639 that extend along the length of the central region 638. In some embodiments, the average thickness (unweighted average of the thickness) of the central region 638 is greater than the average thickness of each of the first edge region 637 and the second edge region 639.

[0057] Figure 7 7 is a schematic cross-sectional view of a layer 710 (e.g., an integral layer of a substrate) including a trench or cavity 712, wherein a conductive seed layer 730 is disposed on a bottom surface of the trench or cavity 712. Layer 710 may correspond to layer 610, except for the thickness of a central region 738 and edge regions 737 and 739, and conductive seed layer 730 may correspond to conductive seed layer 630. A metal body may be formed on conductive seed layer 730 (e.g., by plating) to form a conductive element, which may include, for example, a trace extending along the length (y-direction) of the trace. In some embodiments, conductive seed layer 730 has a central region 738 extending along the length of the conductive trace and disposed between a first edge region 737 and a second edge region 739 extending along the length of the central region 738. In some embodiments, the average thickness of central region 738 is less than the average thickness of each of the first edge region 737 and the second edge region 739.

[0058] In some embodiments, the top surface of the raised portion (e.g., ridge) of the tool used to form the conductive seed layer is substantially flat, and the relative thickness of the central region and the edge region depends on one or more of the surface energy of the material deposited to form the conductive seed layer, the surface energy of the material of the tool, and the surface energy of the material of the substrate. In other embodiments, the top surface of the raised portion can be shaped to determine the relative thickness of the central region and the edge region. In some embodiments, the thickness of the central region and the edge region are approximately the same (e.g., differ by less than 10% or less than 5%).

[0059] In some embodiments, the conductive seed layer includes irregular edges or fractured edges. In some embodiments, the conductive seed layer includes multiple fractures. For example, in some embodiments, the conductive seed layer is a transferred layer, and the transfer process causes fractures. For example, the fractures can extend from the edge of the conductive seed layer to the interior region of the conductive seed layer. Figure 8 843 and 846. In some embodiments, the roughness of edge 843 and edge 846 can be characterized according to line edge roughness. The roughness parameter Ra can be used for line edge roughness. For example, edge 846 has a line edge roughness Ra, which can be described as the average of the absolute values ​​of the displacement of edge 846 relative to the average position 849 of the edge. The line edge roughness Ra can be in any range described elsewhere herein. In the illustrated embodiment, the conductive seed layer 830 includes a plurality of fractures 848, and edge 843 and edge 846 are fractured edges.

[0060] The conductive seed layer may be a single unitary layer or may include multiple sublayers. For example, the conductive seed layer may include a conductive sublayer disposed on a non-conductive sublayer, which may be at least one of a bonding layer or a cross-linked polymer layer. Fig. 9 9 is a schematic cross-sectional view of a conductive seed layer 930, which includes a conductive layer 951 disposed on a cross-linked polymer layer 953. The conductive layer 951 can be, for example, a sputtered or vapor deposited metal layer. The cross-linked polymer layer 953 can be, for example, a cross-linked acrylic layer. In some embodiments, the conductive seed layer 930 also includes a dielectric layer (e.g., an oxide layer) disposed between the conductive layer 951 and the cross-linked polymer layer 953. Fig.10 1 is a schematic cross-sectional view of a conductive seed layer 1030, which includes a conductive layer 1051 (indirectly) disposed on a cross-linked polymer layer 1053, wherein a dielectric layer 1052 is disposed between the conductive layer 1051 and the cross-linked polymer layer 1053. In some embodiments, the dielectric layer 1052 is an oxide layer or includes an oxide layer (e.g., a silicon aluminum oxide layer). In some embodiments, the thickness of the cross-linked polymer layer 953 or the cross-linked polymer layer 1053 is less than 500nm, or 300nm, or 100nm. In some embodiments, the conductive layer 951 or the conductive layer 1051 is or includes a metal layer having a thickness of less than 500nm, or 300nm, or 100nm. The conductive layer 951 and / or the conductive layer 1051 can be an integral conductive layer.

[0061] Fig.11A 1140 is a schematic cross-sectional view of the metal body 1140. The metal body 1140 may be at least partially disposed on a substrate ( Fig.11A1140 is a metal body 1140 having an interface 1145 bonded to the side surface, an interface 1147 bonded to the side surface, and an interface 1135 bonded to the conductive seed layer disposed on the bottom surface of the groove. In some embodiments, the metal body 1140 may have a lower first surface roughness at a first interface (1145 and / or 1147) bonded to the side surface, and a higher second surface roughness at a second interface (1135) bonded to the conductive seed layer. For example, in some embodiments, the substrate includes an integral polymer layer, and the metal body 1140 forms a relatively smooth interface bonded to the integral polymer layer, while the seed layer may include a fractured layer, which results in a relatively rough interface bonded to the metal body 1140. The first surface roughness and the second surface roughness may be the arithmetic average roughness Ra (the average value of the absolute value of the displacement of the surface relative to the average surface height) of the corresponding first interface and the second interface. In some embodiments, the first surface roughness is less than 1 micron, or less than 500 nm, or less than 200 nm, or less than 100 nm, less than 50 nm, or less than 30 nm. In some embodiments, the second surface roughness is greater than 0.4 micron, or greater than 500 nm, or greater than 1 micron, or greater than 2 microns, or greater than 5 microns. In some embodiments, the second surface roughness is greater than the first surface roughness by at least 0.5 micron, or at least 1 micron, or at least 2 microns.

[0062] Fig. 11B 1 is a schematic diagram of a metal body 1140 in a cross section within a plane P1. In some embodiments, within a plane P1 passing through the metal body 1140, the plane is parallel to the seed layer and is spaced apart from the seed layer (disposed at an interface 1135; FIG. 11A to FIG. 11B ), the metal body 1140 may have a lower first line edge roughness at the first interface 1145 or the first interface 1147 bonded to the side surface, and the seed layer may have a lower first line edge roughness at the edge of the conductive seed layer (eg, Figure 8846 shown in FIG. 1 . The plane P1 may be considered to be, for example, approximately midway between the top and bottom of the metal body 1140. The first line edge roughness and the second line edge roughness may each be an Ra roughness (the average of the absolute value of the displacement of the edge relative to the average line of the edge). In some embodiments, the first line edge roughness is less than 1 micron, or less than 500nm, or less than 200nm, or less than 100nm, less than 50nm, or less than 30nm. In some embodiments, the second line edge roughness is greater than 0.4 micron, or greater than 500nm, or greater than 1 micron, or greater than 2 microns, or greater than 5 microns. In some embodiments, the second line edge roughness is greater than the first line edge roughness by at least 0.5 micron, or at least 1 micron, or at least 2 microns.

[0063] In some embodiments, the patterned article includes a micropattern of conductive traces at least partially disposed in a micropattern of grooves, wherein the micropattern of grooves includes at least one groove filled or substantially filled (e.g., at least 60%, or at least 70%, or at least 80%, or at least 90% filled, or 100% filled or overfilled) with a non-conductive material. For example, the non-conductive material can be air or a dielectric material, which can be understood as a non-conductive material having a dielectric constant greater than that of air (e.g., a dielectric constant of at least 1.1, or at least 1.2, or at least 1.5 at a wavelength of 532 nm). Fig. 12A 1 is a schematic top plan view of a patterned article 1200a including conductive elements 1220a and conductive elements 1220b that are electrically insulated and isolated from each other. Each of conductive elements 1220a and conductive elements 1220b includes a micropattern of conductive traces 1221a at least partially disposed in a micropattern of grooves. The micropattern of grooves includes at least one groove 1275a (a plurality of grooves in the illustrated embodiment) filled or substantially filled with a non-conductive material. Similarly, Fig. 12B is a schematic top plan view of a patterned article 1200b comprising a micropattern of conductive traces 1221b at least partially disposed in a micropattern of grooves, wherein the micropattern of grooves comprises at least one groove 1275b (or a plurality of grooves in the illustrated embodiment) filled or substantially filled with a non-conductive material.

[0064] In some embodiments, patterned article 1200a or patterned article 1200b is an antenna. In some embodiments, the micropattern of conductive traces 1221a or conductive traces 1221b is configured to provide a predetermined spectral response. For example, the micropattern can have an overall size and shape so that it can effectively transmit and receive within a predetermined wavelength or frequency range. In some such embodiments, the micropattern of conductive traces 1221a or conductive traces 1221b is configured to provide a predetermined direction. For example, the micropattern can have an overall size and shape (e.g., Fig. 12A The schematically shown bow-tie antenna or Fig. 12B The patterned article 1200a or patterned article 1200b may be configured to transmit and receive within a predetermined wavelength range in a predetermined direction (e.g., more strongly in a specified direction than in another direction). The patterned article may be, for example, a 5G antenna and / or may be configured to transmit and receive within a frequency band of, for example, 10 GHz, 20 GHz, or 30 GHz to 300 GHz, 200 GHz, or 100 GHz (e.g., 20 GHz to 100 GHz). Useful antenna geometries are described, for example, in U.S. Patent Application Publication Nos. 2009 / 0051620 (Ishibashi et al.), 2009 / 0303125 (Caille et al.), and 2013 / 0264390 (Frey et al.). In some embodiments, patterned article 1200a or patterned article 1200b is a substantially transparent antenna. For example, in some embodiments, patterned article 1200a or patterned article 1200b is adjusted to be disposed on a window where the article is desired to be used as an antenna, and to be able to be seen through the antenna. In some embodiments, the substantially transparent antenna is an antenna array, such as a 5G antenna array or a directional traceback antenna array (e.g., a Van Atta array). In some embodiments, the patterned article includes an antenna array that is subsequently cut to provide an antenna corresponding to patterned article 1200a or patterned article 1200b.

[0065] Fig.1313 is a schematic cross-sectional view of, for example, a patterned article 1300 or a schematic cross-sectional view of a portion of an article 1300 that may correspond to patterned article 1200a or patterned article 1200b. Patterned article 1300 includes a layer 1310 (e.g., an integral top layer of a substrate) that includes a pattern of cavities or grooves (e.g., a micropattern of grooves) that includes a first cavity or groove 1312 and a second cavity or groove 1372. The first cavity or groove 1312 includes a conductive element 1320, which may be a trace or other conductive element, and includes a metal body 1340 (e.g., an integral metal body) disposed on a conductive seed layer 1330. The second cavity or groove 1372 may be substantially filled with a material 1375, which may be substantially transparent and / or non-conductive. For example, the micropattern of grooves may be provided with conductive traces in some of the grooves, as further described elsewhere herein, and then a coating 1370 may be applied over the grooves such that the material 1375 of the coating 1370 fills or substantially fills the grooves that do not contain the traces. In some embodiments, the second cavity or groove 1372 is substantially filled with a substantially transparent material in at least one cross-section orthogonal to the length of the second cavity or groove 1372. In some embodiments, the material 1375 is a dielectric material disposed on the top major surface of the integral polymer layer 1310 and covering the metal body 1340.

[0066] Material 1375 can be a non-conductive material and / or a substantially transparent material, and can be one or more of an adhesive, a polymer, or a dielectric material (e.g., a polymer optically clear adhesive). In some embodiments, the refractive index of material 1375 is within 0.02 of the refractive index of layer 1310. Unless otherwise specified, the refractive index is determined at a wavelength of 587.6 nm (spectral line from a helium source).

[0067] Fig.1414 is a schematic cross-sectional view of a patterned article 1400 or a schematic cross-sectional view of a portion of the article 1400. The patterned article 1400 includes a layer 1410 (e.g., an integral layer of a substrate) that includes a first cavity or groove 1412 (e.g., a groove in a micropattern of grooves) that may extend in a longitudinal direction (y-direction) and have a bottom surface and a side surface. The first cavity or groove 1412 includes an integral conductive layer 1430 disposed in the first cavity or groove. In some embodiments, in at least one cross-section of the first cavity or groove (e.g., perpendicular to the longitudinal direction), the conductive layer covers at least a majority of the bottom surface of the first cavity or groove, and at least a majority of the side surface of the first cavity or groove does not contact a material having the same composition as the conductive layer. In some embodiments, the integral conductive layer 1430 can be used as a conductive element (e.g., without plating a metal body onto the conductive layer 1430). This may be desirable in applications where the conductive layer 1430 provides sufficient conductivity and where the durability of the conductive layer 1430 is improved by positioning the layer at the bottom surface of the cavity or trench.

[0068] In some embodiments, the non-metallic material 1470 is at least partially disposed in the first cavity or groove 1412. In some embodiments, in at least one cross-section of the first cavity or groove, the non-metallic material 1470 covers at least a majority of the side surface of the first cavity or groove 1412. In the illustrated embodiment, the non-metallic material 1470 forms a continuous layer that fills the first cavity or groove 1412 (and fills other cavity grooves). For example, the non-metallic material 1470 can be one or more of an adhesive, a polymer, or a dielectric material (e.g., a polymer optically clear adhesive) that forms a continuous layer filled in each groove. In some embodiments, the refractive index of the material 1470 is within 0.02 of the refractive index of the layer 1410. In some embodiments, the material 1470 is substantially transparent. In some embodiments, the material 1470 is substantially disposed only in the cavity grooves in the layer 1410 (e.g., a portion of the coated material above the grooves can be erased). In some embodiments, material 1470 is conductive (eg, a transparent conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), PEDOT polystyrene sulfonate (PEDOT:PSS), or poly(4,4-dioctylcyclopentadithiophene)).

[0069] The busbars can be used to electrically connect the conductive elements or seed layers of the conductive elements to provide a common ground or common potential during, for example, an electroplating process. Therefore, the busbars may alternatively be referred to as ground wires or conductive common wires. The busbars may be subsequently removed from the patterned article or may be subsequently disconnected from the conductive elements. In embodiments where the busbars are disconnected from the conductive elements, the busbars may still be referred to as busbars, even though the busbars are no longer electrically connected to the conductive elements. In some embodiments, the busbars provide a functional active portion of the patterned article.

[0070] Fig.15 is a schematic top plan view of a patterned article 1500 according to some embodiments. The patterned article 1500 includes a plurality of conductive elements 10 at least partially embedded in an integral polymer layer 17. Each conductive element 10 (and optional busbars 15) may include a conductive seed layer disposed in a cavity of the polymer layer and a metal body disposed on the conductive seed layer, as further described elsewhere herein. In the illustrated embodiment, each conductive element 10 includes a plurality of electrical conductors 11 electrically connected to each other by conductive segments 12. For example, the electrical conductors 11 may be solid or may be composed of a micropattern of conductive traces. Similarly, for example, the conductive segments 12 may be solid or may be composed of a micropattern of conductive traces.

[0071] In the illustrated embodiment, the conductive elements 10 are electrically insulated from each other. The busbar 15 that is electrically disconnected from the conductive elements 10 is also Fig.15 The busbars 15 may be at least partially embedded in an integral polymer layer 17 and may include a conductive seed layer and a metal body disposed on a seed layer, as described elsewhere. In some embodiments, the patterned article 1500 is initially formed with conductive elements 10 electrically connected to each other by busbars 15. Fig.16 Schematically shown in FIG. 1 , where a patterned article 1600 includes conductive elements 10 electrically connected to each other only by means of busbars 15. Busbars may be included to electrically connect the conductive elements so that a metal body may be electroplated on a conductive seed layer in a single step, as described elsewhere herein. The conductive elements are subsequently disconnected from the busbars 15 so that the disconnected conductive elements 10 are electrically insulated from each other, for example, as Fig.15As shown. The busbars can be disconnected by, for example, etching (e.g., chemical etching or plasma etching). In some embodiments, the busbars can be removed from the patterned article. In some embodiments, the busbars are disconnected by, for example, film cutting or die cutting. In some cases, the conductive element 10 and the busbar 15 can be described as being at least partially disposed in the same cavity (e.g., having the same general shape as the combination of the conductive element 10 and the busbar 15 in a top plan view). In some cases, each of the conductive element 10 and the busbar 15 can be described as being at least partially disposed in its own cavity, wherein the cavity of each conductive element in the conductive element 10 is connected to the cavity of the busbar 15.

[0072] In some embodiments, more than one bus bar is included. Fig.17 is a schematic top plan view of a patterned article 1700 comprising a plurality of conductive elements 10 at least partially embedded in an integral polymer layer 17 and electrically connected to each other only by means of busbars 15 and busbars 25 .

[0073] In some embodiments, one location includes a bus bar such that the conductive elements are disposed on opposite sides of the bus bar. Fig.17 17 is a schematic top plan view of a patterned article 1700 comprising a plurality of conductive elements 10 at least partially embedded in a unitary polymer layer 17 and electrically connected to each other only by means of a bus bar 35. In the illustrated embodiment, a sub-plurality of conductive elements 10 (i.e., more than one and not all conductive elements) are disposed on opposite sides of the bus bar 35.

[0074] Any suitable number of busbars may be included. For example, busbars (e.g., 15 and / or 25) may be included at one or both ends of the conductive element 10 and one or more busbars (e.g., 35) separating the plurality of conductive elements. In some embodiments, one or more busbars are included such that for each busbar, each of the conductive elements is disposed on the same side of the busbar (e.g., as shown in FIG. 1 ). Figures 15 to 17 ) or multiple conductive elements are arranged on opposite sides of the busbar (for example, as shown schematically in Fig.18 Schematically shown in ). In some embodiments, for each bus bar, a plurality of conductive elements 10 are disposed on the same side of the bus bar. In some such embodiments, or in other embodiments, one or more bus bars include two parallel spaced apart bus bars. In some embodiments, for at least one each bus bar, a plurality of conductive elements are disposed on opposite sides of the bus bar.

[0075] In some embodiments, the integral polymer layer 17 extends along orthogonal first and second directions (x and y directions), the conductive element 10 extends along the first direction (x direction), and one or more busbars extend along the second direction (y direction). In some embodiments, the conductive element 10 extends primarily along the first direction (e.g., more along the first direction than along the second direction), while in other embodiments, the conductive element 10 extends as much in the second direction as in the first direction or more in the second direction than in the first direction. One or more busbars may extend primarily in the second direction. When more than one busbar is included, the busbars may be parallel to each other.

[0076] In some embodiments, the patterned article (e.g., 1600, 1700, 1800, 300, 200, 100) includes an integral polymer layer (e.g., 17, 310, 210-1, 110), a plurality of conductive elements (e.g., 10, 320, 220, 120) at least partially embedded in the integral polymer layer. The conductive elements (e.g., 10) are electrically connected to each other only by means of one or more busbars (e.g., 15, 25, 35) at least partially embedded in the integral polymer layer, so that for each busbar, each of the conductive elements is arranged on the same side of the busbar, or a plurality of conductive elements are arranged on opposite sides of the busbar. The integral polymer layer may extend along orthogonal first and second directions (x and y directions), the conductive elements may extend along the first direction, and the one or more busbars may extend along the second direction. The one or more busbars may be one busbar or a plurality of non-intersecting busbars. The busbars may be or may include, for example, straight conductive lines, curved conductive lines, or straight or curved conductive segments. Each conductive element (and optionally each busbar) includes a conductive seed layer (e.g., 330, 230) having a top major surface (e.g., 235) and an opposite bottom major surface (e.g., 234) in direct contact with an integral polymer layer (e.g., 310, 210-1); and a metal body (e.g., 340, 240) disposed on the top major surface of the conductive seed layer. The metal body has a bottom major surface (e.g., 393, 293) and at least one sidewall (e.g., 242, 244). The bottom major surface (e.g., 393, 293) contacts the conductive seed layer. Each sidewall is in direct contact with the integral polymer layer and extends from the bottom major surface of the metal body (e.g., 393, 293) toward or to but not beyond the top major surface (e.g., 311, 211) of the integral polymer layer.

[0077] Fig.191 is a schematic top plan view of an exemplary patterned article 1900, which includes a plurality of conductive elements 20 at least partially embedded in an integral polymer layer 17 and electrically insulated from each other. In the illustrated embodiment, the conductive elements 20 include a first conductive element 20a, a second conductive element 20b, and a third conductive element 20c, respectively. In the illustrated embodiment, each of the conductive elements 20 is substantially U-shaped. The patterned article 1900 can be, for example, a directional traceback antenna array (e.g., a Van Atta array). The patterned article 1900 can be made using a busbar on the left side (negative x direction) of the conductive element 20 as described elsewhere herein, which is then removed.

[0078] In some embodiments, the plurality of conductive elements 20 include a first conductive element 20a and a second conductive element 20b, such that in a top plan view of the patterned article 1900, the first conductive element 20a is at least partially disposed in a minimum rectangle 22b that includes the second conductive element 20b. In some embodiments, the plurality of conductive elements 20 further include a third conductive element 20c, such that in a top plan view of the patterned article, the second conductive element 20b is at least partially disposed in a minimum rectangle 22c that includes the third conductive element 20c. In some embodiments, in a top plan view, the second conductive element 20b is completely disposed outside the minimum rectangle 22a that includes the first conductive element 20a. In some embodiments, in a top plan view, the third conductive element 20c is completely disposed outside the minimum rectangle 22b that includes the second conductive element 20b.

[0079] Example

[0080] Preparation of UV curable resin

[0081] 75 parts of PHOTOMER 6210 (available from Cognis (Monheim am Rhein, Germany)), 25 parts of hexanediol diacrylate SARTOMER SR238 (available from Sartomer USA (Exton, PA)), and 0.5% LUCIRIN TPO (available from BASF (Ludwigshafen, Germany)) were blended with a high-speed stirrer and then heated in an oven at 160°F (71°C) for 24 hours. The composite resin was then cooled to room temperature.

[0082] Patterned products1

[0083] Molding of VISTAMAXX tools including linear channel arrays

[0084] A layer of 0.47 mm thick VISTAMAXX 3588 sheet (purchased from ExxonMobile Chemical, Houston TX, USA) was placed on a metal mold containing linear ribs with a width of 40 μm, a pitch of 125 μm, and a height of 81 μm. The dimensions of the film were 250 mm × 280 mm. The sample was pressed in a compression molding machine Rucker PHI400ton (City of Industry, CA) to form a molding tool. The molding conditions used were as follows:

[0085] Temperature: 225°F

[0086] Low pressure: 6,000lbs; Time: 1min

[0087] Raised low pressure: 80,000lbs; time: 20min

[0088] Cool to nominal 100°F

[0089] Silver transfer layer preparation

[0090] The transfer type thin seed layer film was made on a vacuum coater similar to the coaters described in U.S. Pat. Nos. 8,658,248 (Anderson et al.) and 7,018,713 (Padiyath et al.). A substrate in the form of a roll of indefinite length of 980 microinch (0.0250 mm) thick, 14 inch (35.6 cm) wide aluminized biaxially oriented polypropylene film (commercially available under the trade name TorayFAN PMX2 from Toray Plastics (America), Inc. (North Kingstown, RI)) was threadedly attached to the coater. The substrate was then advanced at a constant line speed of 32 fpm (9.8 m / min).

[0091] An acrylate liquid based on tricyclodecane dimethanol diacrylate (commercially available as SARTOMER SR833S from Sartomer, Exton, Pennsylvania, USA) was applied by ultrasonic atomization and flash evaporation to form a first organic layer on the substrate to a coating width of 12.5 inches (31.8 cm). The monomer coating was then immediately cured downstream with an electron beam curing gun operated at 7.0 kV and 10.0 mA. The flow rate of the liquid monomer into the evaporator was 0.67 ml / min, the nitrogen flow rate was 100 sccm and the evaporator temperature was set to 500°F (260°C). The temperature of the processing barrel was 14°F (-10°C).

[0092] On top of this first organic layer, a silver reflector layer was deposited by DC sputtering of a >99% silver cathode target. The system was operated at 3 kW with a line speed of 30 fpm (9.1 m / min). Two subsequent depositions with the same power and line speed were performed to form a 90 nm silver layer.

[0093] On top of the silver layer, an oxide layer of silicon aluminum oxide was deposited by AC reactive sputtering. The cathode had a Si (90%) / Al (10%) target, which was purchased from Soleras Advanced Coatings US (Biddeford, ME). During sputtering, the voltage of the cathode was controlled by a feedback control loop that monitored the voltage and controlled the oxygen flow rate so that the voltage remained high while the target voltage did not collapse. The system was operated at a power of 16 kW to deposit a 12 nm thick silicon aluminum oxide layer onto the silver reflector.

[0094] Similar to what is described in PCT Publication Nos. WO 2018 / 178802 (Gotrik et al.) or WO 2018 / 178803 (Gotrik et al.), it is expected that the aluminum surface of the Toray FAN PMX2 film and the first organic layer will release with a 180 peel force of about 7.2 g / in (0.28 g / mm).

[0095] Double-layer transfer process

[0096] The equipment used in this method includes a compression molded VISTAMAXX tool sample, a roll of the above-mentioned silver transfer film, a roll of 2 mil polyethylene terephthalate (PET) film with a primer on one side, a UV curable resin, a rubber hand roller with a diameter of 0.6 inches (1.52 cm) and a length of 9 inches (22.9 cm), a MASTER HEAT GUN (Model HG-501A) and an OMEGA Type J thermocouple, an RPC Industries (Hampton, VA) UV processor (Model QC120233AN), a plastic pipette, and an 11-inch×15-inch (27.9 cm*38.1 cm) metal plate.

[0097] The VISTAMAXX tool is provided in 8.5-inch × 9.5-inch (21.5cm*24.1cm) sheets, which are set on a flat surface with the microstructure facing up. The silver transfer layer film is cut into 10-inch × 11-inch (25.4cm*27.9cm) sheets. The hot air from the heat gun is evenly distributed to the sample surface to heat to 150°C. Since the sample deforms at high temperatures, a thermocouple is used to monitor the surface temperature. When the desired temperature is reached, the hot air is disconnected, and the silver transfer layer film is placed on the heated VISTAMAXX film with the silver transfer layer facing down. The sample is manually laminated once by applying gentle force using a rubber hand roller. The silver transfer layer is immediately pulled away from the VISTAMAXX sample, and it is found that the silver transfer layer is gently attached to the top of the ribs, but not where the open channels between the ribs are located. The quality of the silver transfer layer transfer is evaluated under an optical microscope, and it is found that there is electrical continuity.

[0098] After the silver transfer layer is transferred to the VISTAMAXX tool, it will be transferred to the resin layer as described below. With the lamp in normal settings and the conveyor speed at 50RPM, turn on the UV processor according to the operating manual. The VISTAMAXX sample with a silver transfer layer is taped to a metal plate. A UV curable resin line is distributed on one side of the sample using a pipette. The 2 mil PET film with primer is cut into a sheet of 10 inches × 11 inches (25.4cm*27.9cm), which is stacked on the top of the VISTAMAXX sample with the primer facing down. The sample is slowly laminated with a rubber hand roller to remove the bubbles trapped between the VISTAMAXX and the PET film. Thereafter, the sample is conveyed through the UV processor twice under an inert gas to complete the curing process. The PET film is slowly separated from the VISTAMAXX tool. The quality of the transfer of the silver transfer layer to the polymer film is evaluated under an optical microscope. The silver transfer layer is completely transferred to the bottom of the UV curing film. The samples were kept at ambient conditions for more than 24 h before further analysis.

[0099] The process of removing the dielectric layer from the transferred layer by RIE

[0100] The dielectric layer (silicon aluminum oxide layer) was removed by reactive ion etching (RIE) using a commercial intermittent plasma system (Plasma-Therm (Petersburg, FL) Model 3032) with a 26-inch lower powered electrode and a central gas pump. The chamber was pumped with a Roots blower (Edwards (Burgess Hill, UK) Model EH1200) supported by a dry mechanical pump (Edwards Model iQDP80). RF power was delivered by a 5kW, 13.56Mhz solid-state generator (RF Plasma Product Model RF50S0) through an impedance matching network. The system had a nominal base pressure of 5mTorr. The flow rate of the gas was controlled by an MKS flow controller (purchased from MKS Instruments (Andover, MA)).

[0101] The substrate sample was fixed on the powered electrode of the intermittent plasma equipment. After the chamber was evacuated to <10mTorr, plasma etching was completed by feeding 500SCCM of oxygen into the chamber. Once the flow was stable, RF power was applied to the electrode to generate a plasma of 1000W. The plasma was maintained for 15 seconds.

[0102] After the plasma treatment is completed, the chamber is vented to the atmosphere and the substrate is removed from the chamber.

[0103] Copper plating in trenches

[0104] The RIE etched film was rinsed with DI water and placed in a solution consisting of copper sulfate (217.5 g / L) and sulfuric acid (60 g / L). The solution flow rate was 0.7 L / s. The plating was performed in a constant potential mode using a power supply model DPR20-250-500 manufactured by DYNATRONIX (Amery WI) in Amery, Wisconsin, USA. The solution temperature was 21°C. The plating was controlled at 1.6V for 25 minutes. After plating, the part was rinsed and dried and examined with a microscope. Confirm that the copper was plated on the silver transfer layer, where the dielectric layer had been removed by RIE etching.

[0105] Patterned products 2-3

[0106] Process of Inoculating Tools with NovaCentrix Conductive Ink

[0107] Conductive silver ink was applied to the top of the ribs on the structured nickel tool by hand printing. The nickel tool had a hexagonal portion and a triangular portion (e.g., corresponding to the busbar portion). The hexagonal portion included a hexagon having a width of 1 mm across opposite parallel sides, a rib width of 25 microns, and a rib height of 25 microns. The triangular portion included a hexagon having the same geometry as the hexagonal portion and including additional ribs extending from each vertex of the hexagon to the center of the hexagon. The conductive silver ink was applied as follows:

[0108] (1) A continuous layer as the ink source was prepared by coating NovaCentrix (Round Rock, TX) DSPI-420 silver dispersion ink onto PET film using a #5 Mayer Rod to produce a wet film thickness of approximately 10 μm.

[0109] (2) A flat photopolymer flexographic printing plate was mounted on a mandrel approximately 4 inches in diameter using 3M E1120 CUSHION-MOUNT tape (available from 3M Company, St. Paul, MN) and immediately hand rolled over the coating of (1), thereby transferring a portion of the silver ink to the surface of the flexographic printing plate before it dried.

[0110] (3) The flexographic printing plate of (2) was then immediately rolled manually over the surface of the nickel tool, thereby transferring the silver ink only to the upper relief surface of the structured nickel tool before the silver ink dried on the printing plate surface.

[0111] The silver ink was then dried and sintered at 240°F for at least 2 minutes using a Despatch (Minneapolis, MN) solvent rated oven (Model LFC1-38-1).

[0112] Film forming process

[0113] The equipment used in the process included a Fusion UV processor running at about 10 ft / min, an H bulb for curing, a ChemInstruments (Chester Township, OH) laminator (model: hot roll laminator), and 5 mil PET film primed on both sides.

[0114] To start the process, the PET film was cut into pieces of approximately 6.5 inches by 7.5 inches (16.5 cm by 19.1 cm) to cover the entire surface of the tool. The UV processor was turned on according to the operating manual with the lamp at normal settings and the conveyor speed at 50 RPM. Nitrogen was also supplied to the UV processor to assist in the curing process.

[0115] Using a plastic pipette, UV curable resin was dispensed over the edge of the tool. A PET film was placed on top of the tool, which was held in place by taping one end to the tool. The sample was processed through a laminator, which spread the resin evenly over the tool.

[0116] The sample was then passed through a UV processor twice to ensure that the resin was fully cured. The sample was removed by gently pulling it away from the tool at a 90° angle. The resulting film was an inverted microstructure of the tool with a sintered silver seed layer at the bottom of the grooves.

[0117] Copper Plating Process

[0118] The above-mentioned replica film was placed in an acidic copper plating solution consisting of copper sulfate and sulfuric acid. The solution flow rate was 1.3 liters / second. The plating was carried out in a constant potential mode using a power supply model CRS12-200 manufactured by DYNATRONIX (Amery WI) of Amery, Wisconsin, USA. The solution temperature was 21°C. For Example 2 and Example 3, the plating was controlled at 1.4V for 12.5 minutes and 10 minutes respectively. After plating, the part was rinsed and dried and examined by microscopy. Confirm that copper was plated onto the seed layer in the groove to form a micropattern of conductive traces.

[0119] For Patterned Article 2: In the hexagonal portion, the traces extended approximately 15 to 22 microns above the top surface of the UV-cured layer. In the triangular portion, the top of the traces was approximately flush with the top surface of the UV-cured layer.

[0120] For patterned article 3: In the hexagonal portion, the top of the trace was approximately flush with the top surface of the UV-cured layer by about 20 microns. In the triangular portion, the top of the trace was recessed from the top surface of the UV-cured layer by about 15 microns to 21 microns.

[0121] An exemplary patterned article comprising a plurality of electrically insulated and isolated conductive elements is produced as described for patterned articles 1-3, except that the tool is structured to produce conductive elements that are electrically connected to each other only by means of one or more busbars. For example, the tool can be structured to produce a pattern such as Figures 16 to 18The conductive element is then electrically disconnected from one or more busbars. For example, the resulting patterned article may be as follows: Fig.15 or Fig.19 Schematically shown in FIG.

[0122] All references, patents, and patent applications cited above are hereby incorporated by reference in their entirety in a consistent manner. In the event of inconsistencies or conflicts between an incorporated reference portion and the present application, the information in the foregoing description shall prevail.

[0123] Unless otherwise indicated, the description of the elements in the drawings should be understood to apply equally to the corresponding elements in the other drawings. Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that the specific embodiments shown and described may be replaced with a variety of alternative and / or equivalent implementations without departing from the scope of the present disclosure. The present application is intended to cover any modification or variation of the specific embodiments discussed herein. Therefore, the present disclosure is intended to be limited only by the claims and their equivalents.

Claims

1. A patterned product, comprising: An integral polymer layer; and a plurality of conductive elements at least partially embedded in the integral polymer layer and electrically insulated from one another, each conductive element comprising: a conductive seed layer having a top major surface and an opposing bottom major surface in direct contact with the integral polymer layer; and A metal body disposed on the top major surface of the conductive seed layer, the metal body having a bottom major surface and at least one sidewall, the bottom major surface contacting the conductive seed layer, each sidewall directly contacting the integral polymer layer and extending from the bottom major surface of the metal body toward, or extending to but not exceeding the top major surface of the integral polymer layer, wherein at least some of the conductive elements include a micropattern of conductive traces, the open area ratio of the micropattern of conductive traces is in the range of 80% to 99.95%, and wherein the metal body has a first surface roughness at a first interface with the integral polymer layer, the metal body has a second surface roughness at a second interface with the conductive seed layer, and the second surface roughness is at least 0.5 microns greater than the first surface roughness.

2. The patterned article of claim 1, wherein the plurality of conductive elements comprises a first conductive element and a second conductive element such that, in a top plan view of the patterned article, the first conductive element is at least partially disposed within a smallest rectangle containing the second conductive element.

3. The patterned article of claim 2, wherein the plurality of conductive elements further comprises a third conductive element such that, in the top plan view of the patterned article, the second conductive element is at least partially disposed within a smallest rectangle containing the third conductive element. The patterned article of claim 1 , wherein the plurality of conductive elements define an antenna.

5. The patterned article of claim 4, wherein the antenna comprises a directional traceback antenna array.

6. The patterned article of claim 1, further comprising a dielectric layer disposed on the top major surface of the integral polymer layer and covering the metal body.

7. The patterned article of claim 1, wherein each of the conductive elements comprises a micropattern of conductive traces.

8. The patterned article of claim 7, wherein an open area ratio of each of the micropatterns of conductive traces is in a range of 80% to 99.95%.

9. The patterned article of any one of claims 1 to 8, wherein each of at least a majority of the conductive traces in the micropattern extends in a longitudinal direction of the conductive trace, has a width W in a width direction orthogonal to the longitudinal direction and the thickness direction of the integral polymer layer, and has a thickness T in the thickness direction, T / W being at least 0.

8.

10. A patterned article, comprising: an integral polymer layer extending in first and second orthogonal directions; and a plurality of conductive elements at least partially embedded in the integral polymer layer and extending in the first direction, the conductive elements being electrically connected to each other only by means of one or more busbars extending in the second direction and at least partially embedded in the integral polymer layer, such that for each busbar, each of the conductive elements is arranged on the same side of the busbar, or a second plurality of the conductive elements are arranged on opposite sides of the busbar, each conductive element comprising: a conductive seed layer having a top major surface and an opposing bottom major surface in direct contact with the integral polymer layer; and A metal body disposed on the top major surface of the conductive seed layer, the metal body having a bottom major surface and at least one sidewall, the bottom major surface contacting the conductive seed layer, each sidewall directly contacting the integral polymer layer and extending from the bottom major surface of the metal body toward, or extending to but not exceeding the top major surface of the integral polymer layer, wherein at least some of the conductive elements include a micropattern of conductive traces, the open area ratio of the micropattern of conductive traces is in the range of 80% to 99.95%, and wherein the metal body has a first surface roughness at a first interface with the integral polymer layer, the metal body has a second surface roughness at a second interface with the conductive seed layer, and the second surface roughness is at least 0.5 microns greater than the first surface roughness.

11. The patterned article of claim 10, wherein for each bus bar, the plurality of conductive elements are disposed on the same side of the bus bar.

12. The patterned article of claim 10 or 11, wherein the one or more busbars comprise two parallel spaced apart busbars.

13. A method for making a patterned article, the method comprising: providing a tool, the tool comprising at least one raised portion; Disposing a conductive layer on the top surface of the first portion of the at least one raised portion, so that at least a majority of the total area of ​​the side surface of the first portion of the at least one raised portion does not contain the conductive layer, wherein disposing the conductive layer on the top surface of the first portion of the at least one raised portion comprises: transferring the conductive layer from a transfer film to the top surface; After the step of providing the conductive layer, providing a polymer or a polymer precursor on the tool; hardening the polymer or polymer precursor to form a polymer layer, the polymer layer comprising at least one cavity corresponding to the at least one raised portion; removing the polymer layer and the conductive layer from the tool such that the conductive layer is disposed at a bottom surface of the at least one cavity; depositing a conductive material into the at least one cavity such that the conductive material covers the conductive layer, the conductive material and the conductive layer defining a plurality of conductive elements electrically connected to each other by one or more bus bars; and disconnecting the conductive elements from the one or more busbars so that the disconnected conductive elements are electrically insulated from each other, At least some of the conductive elements include a micropattern of conductive traces, the micropattern of conductive traces having an open area ratio in a range of 80% to 99.95%, and wherein the conductive material has a first surface roughness at a first interface with the polymer layer, the conductive material has a second surface roughness at a second interface with the conductive layer, and the second surface roughness is at least 0.5 microns greater than the first surface roughness.

14. The method of claim 13, wherein the polymer or polymer precursor comprises a molten polymer, and wherein hardening the polymer or polymer precursor comprises cooling the molten polymer.

15. The method of claim 13, wherein the polymer or polymer precursor comprises a resin, and hardening the polymer or polymer precursor comprises curing the resin.

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