Attaching apparatus, attaching method, and manufacturing method of display device

Abstract

It is possible to pressurize the entire surface in a state where alignment is performed with high precision, and to pressurize the entire surface substantially uniformly. A substantially plate-shaped first adsorption portion adsorbs a substantially plate-shaped first member, a substantially plate-shaped second adsorption portion provided on a vertical direction upper side of the first adsorption portion adsorbs a transparent substantially plate-shaped second member, and they are attached. The second adsorption portion is a substantially cylindrical member whose both ends are covered, a lower side surface of the second adsorption portion is a transparent adsorption pad in which a hole penetrating in a thickness direction is formed, and the second member is adsorbed to the adsorption pad by suction of air from a suction port. At least a part of an upper side surface of the second adsorption portion includes a transparent member, and a photographing portion provided on a vertical direction upper side of the second adsorption portion photographs the first member and / or the second member through the transparent member and the adsorption pad.

Description

TECHNICAL FIELD

[0001] The present application relates to a bonding apparatus, a bonding method, and a manufacturing method of a display device. BACKGROUND

[0002] In Patent Literature 1, there is disclosed an element transfer apparatus having a substrate holding section which supports a transfer substrate and a temporary holding substrate in a state of facing each other, a camera which photographs an alignment mark of the transfer substrate and photographs an alignment mark of the temporary holding substrate through the transfer substrate, an alignment unit which aligns positions of the transfer substrate and the temporary holding substrate, and a pressurizing unit which pressurizes the temporary holding substrate in a direction in which the temporary holding substrate becomes a curved state of being protruded toward the transfer substrate side.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Laid-Open No. 2009-295853 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In the invention described in Patent Literature 1, since the temporary holding substrate is pressurized in a direction in which the temporary holding substrate becomes a curved state of being protruded toward the transfer substrate side, the transfer substrate also becomes a curved state. Therefore, when a process of bonding a wafer on which an LED is formed and a circuit substrate is performed, if the invention described in Patent Literature 1 is used, it is not possible to pressurize the entire surface substantially uniformly, and there is a concern that a damage of the LED, a non-uniform lighting of the LED, and a breakage of the wafer are caused.

[0008] The present application has been achieved in view of such circumstances, and has an object to provide a bonding apparatus, a bonding method, and a manufacturing method of a display device which can pressurize the entire surface substantially uniformly in a state in which alignment is performed with high precision.

[0009] MEANS FOR SOLVING THE PROBLEMS

[0010] To solve the above problems, the present application relates to a bonding device that bonds a first member that is substantially plate-shaped and a second member that is substantially plate-shaped and transparent, for example. The bonding device is characterized by including: a first suction portion that is substantially plate-shaped and that suctions the first member; a second suction portion that is substantially plate-shaped and that is provided on a vertically upper side of the first suction portion and suctions the second member; a first moving portion that moves the first suction portion or the second suction portion in a vertical direction; a second moving portion that moves the first suction portion in a horizontal direction; and an imaging portion that is provided on a vertically upper side of the second suction portion, the second suction portion being a substantially cylindrical member whose both ends are covered, the second suction portion being provided with a suction port that suctions air, at least a part of a surface on a vertically upper side of the second suction portion including a transparent member, a surface on a vertically lower side of the second suction portion being a transparent suction pad in which a hole that penetrates in a thickness direction is formed, the imaging portion imaging the first member and / or the second member through the transparent member and the suction pad.

[0011] According to the bonding device of the present application, a first suction portion that is substantially plate-shaped suctions a first member that is substantially plate-shaped, a second suction portion that is substantially plate-shaped and that is provided on a vertically upper side of the first suction portion suctions a second member that is substantially plate-shaped and transparent, and these are bonded. The second suction portion is a substantially cylindrical member whose both ends are covered, a surface on a vertically lower side of the second suction portion is a transparent suction pad in which a hole that penetrates in a thickness direction is formed, and the second member is suctioned to the suction pad by suctioning air from the suction port. At least a part of a surface on a vertically upper side of the second suction portion includes a transparent member, and an imaging portion that is provided on a vertically upper side of the second suction portion images the first member and / or the second member through the transparent member and the suction pad. The first member and the second member are directly observed by the imaging portion, and alignment is performed with high precision. Furthermore, the first member and the second member are sandwiched by the first suction portion and the second suction portion that are substantially plate-shaped, and the entire surface is pressurized substantially uniformly.

[0012] Here, the first member and the second member can have a plurality of LEDs formed on one side and a connection pattern formed on the other side, and can include a plurality of probes that are connected to a power source and that are movable in a vertical direction between a position at which the probes abut against the connection pattern and a position at which the probes do not abut against the connection pattern. Thus, the bonding device can be used to confirm the lighting of the LEDs.

[0013] Here, the bonding device can include a third moving portion that moves the second suction portion in a horizontal direction, the third moving portion being a substantially cylindrical member that is provided on a vertically upper side of the second suction portion. Thus, the imaging portion can image the first member and / or the second member through the third moving portion, the transparent member, and the suction pad.

[0014] In this case, it can also be provided with: a substantially columnar mounting portion that holds the imaging portion and the second adsorption portion; a light irradiation portion provided to the mounting portion so that the height is between the imaging portion and the second adsorption portion; and a mirror that can be moved in the horizontal direction between a position overlapping the optical path of the imaging portion and a position not overlapping. Thus, the first member and the second member can be connected using a photocurable resin.

[0015] In this case, it can also be provided with: a first control portion that controls the second moving portion to move the first adsorption portion while taking and observing the first member through the second adsorption portion and the second member using the imaging portion. Thus, alignment can be performed with high precision.

[0016] In this case, it can also be provided with: a fourth moving portion that moves the probe in the vertical direction; and a second control portion that controls the first moving portion to pressurize the first member and the second member, and controls the fourth moving portion to abut the probe against the connection pattern while maintaining the state of the pressurization. In this way, by confirming the lighting of the LED before connecting the first member and the second member, the first member and the second member can be separated in the case where the LED is not lit, and the defective condition can be corrected. Therefore, the yield at the time of manufacturing can be improved.

[0017] To solve the above problem, the present application relates to a bonding method characterized by, for example, having: a process of placing a first member that is a plate shape on a first adsorption portion that is a plate shape, and adsorbing a second member that is a transparent plate shape on a second adsorption portion that is a transparent plate shape provided on the vertical direction upper side of the first adsorption portion, and arranging the first member and the second member substantially in parallel; a process of moving the first member in the horizontal direction while taking and observing the first member through the second adsorption portion and the second member using an imaging portion provided on the vertical direction upper side of the second adsorption portion, and performing alignment of the first member and the second member; and a process of pressurizing the first member and the second member. Thus, the entire surface can be pressurized substantially uniformly in a state where alignment has been performed with high precision.

[0018] In this case, the first member and the second member can be formed with a plurality of LEDs on one side and a connection pattern on the other side, and an adhesive can be applied to the first member and / or the second member. The method can include the steps of moving a probe while maintaining pressure on the first member and the second member, causing the probe to abut against the connection pattern to light up the LEDs; capturing an image of the first member and the second member using the imaging unit, and confirming the lighting of the LEDs from the captured image; and curing the adhesive when all of the LEDs are lit. In this way, the lighting of the LEDs is confirmed before the first member and the second member are connected, and the first member and the second member can be separated and the defect can be corrected when the LEDs are not lit. Therefore, the yield during manufacturing can be improved.

[0019] In this case, the first member and the second member can be arranged substantially in parallel by the following steps: placing the second member on the first suction unit; moving the first suction unit in the horizontal direction while capturing and observing the second member through the second suction unit using the imaging unit; suctioning the second member by the second suction unit; and placing the first member on the first suction unit. In this way, the first member and the second member can be directly observed using one imaging unit while being aligned. As a result, the alignment can be performed with high precision.

[0020] To solve the above problem, the manufacturing method of a display device according to the present application is a manufacturing method of a display device including a bonding step of bonding a first member that is a substantially plate-shaped member formed with a plurality of LEDs on one side and a connection pattern on the other side, and a second member that is a transparent substantially plate-shaped member, characterized by including: a step of placing the first member on a first suction unit that is a substantially plate-shaped member, suctioning the second member on a second suction unit that is a transparent substantially plate-shaped member provided on the upper side in the vertical direction of the first suction unit, and arranging the first member and the second member substantially in parallel; a step of moving the first member in the horizontal direction while capturing and observing the first member through the second suction unit and the second member using an imaging unit provided on the upper side in the vertical direction of the second suction unit, and aligning the first member and the second member; and a step of applying pressure to the first member and the second member.

[0021] In this case, the bonding process can be performed with the first member and the second member coated with an adhesive. The bonding process includes a process of moving the probe while maintaining the state in which the first member and the second member are pressed, bringing the probe into contact with the connection pattern to light up the LED; a process of capturing the first member and the second member using the imaging section, and confirming the lighting up of the LED from the captured image; and a process of curing the adhesive when the LED is lit up.

[0022] In this case, the first member and the second member can be arranged substantially in parallel by a process including a process of placing the second member on the first suction section; a process of moving the first suction section in the horizontal direction while capturing and observing the second member using the imaging section through the second suction section; a process of suctioning the second member by the second suction section; and a process of placing the first member on the first suction section.

[0023] Effects of Invention

[0024] According to the present application, the entire surface can be pressed substantially uniformly in a state in which alignment is performed with high precision. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a diagram showing an outline of a display device 1 manufactured using a manufacturing apparatus and a manufacturing method of the present application.

[0026] Figure 2 is a diagram showing an outline of a display device 1.

[0027] Figure 3 is a diagram schematically showing a manufacturing method of the display device 1.

[0028] Figure 4 is a diagram schematically showing a manufacturing method of the display device 1.

[0029] Figure 5 is a diagram showing an outline of a bonding apparatus 2.

[0030] Figure 6 is a diagram showing an outline of a suction section 69, Figure 6 (A) of FIG. 69 is a side view, Figure 6 (B) of FIG. 69 is a plan view.

[0031] Figure 7 is a diagram schematically showing a case where a wafer 25 is suctioned to a suction pad 62.

[0032] Figure 8 is a diagram showing an outline of an imaging section 71 and a mounting section 72,Figure 8 (A) is the main view, Figure 8 (B) is a side view.

[0033] Figure 9 It is a block diagram showing the electrical structure of the bonding apparatus 2.

[0034] Figure 10 It is a flowchart showing the processing flow of the bonding step.

[0035] Figure 11 It is a diagram schematically showing the bonding process.

[0036] Figure 12 It is a diagram schematically showing the position of the probe 81 in the bonding step.

[0037] Figure 13 It is a diagram schematically showing the bonding apparatus 3.

[0038] Figure 14 It is a flowchart showing the processing flow of the bonding step.

[0039] Figure 15 It is a diagram schematically showing the lamination process. DETAILED DESCRIPTION

[0040] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0041] <First embodiment>

[0042] Figure 1 This is a diagram schematically showing a display device 1 manufactured using the manufacturing apparatus and method of the present invention. The display device 1 is a full-color LED display panel in which a plurality of micro LEDs are arranged in a matrix, and displays images in color.

[0043] Figure 1 This is a schematic top view of a display device 1. Display device 1 includes a plurality of LEDs 20 arranged on a circuit substrate 10, which is a generally plate-shaped circuit board. LEDs 20 are ultra-small LEDs, approximately 50 μm x approximately 50 μm or less, and emit, for example, ultraviolet light (wavelength 385 nm). The structure of LEDs 20 is well known, and therefore a detailed description thereof will be omitted.

[0044] The LEDs 20 are arranged continuously in the longitudinal direction and the transverse direction. A fluorescent light emitting layer 30 including a red fluorescent light emitting layer 30R, a green fluorescent light emitting layer 30G, and a blue fluorescent light emitting layer 30B is provided above the LEDs 20.

[0045] Figure 2is a schematic partial cross-sectional view showing an outline of the display device 1. The circuit substrate 10 is a light-transmissive substrate, for example, formed using sapphire glass. On the circuit substrate 10, a wiring pattern 11 having a connection pattern 12 (refer to Figure 3 ) connected to the LED 20 is provided. The LED 20 is adhered to the wiring pattern 11, and the connection pattern 12 on the wiring pattern 11 is electrically connected to the p-electrode 22 and the n-electrode 23 of the LED 20.

[0046] The planarization film 32 is provided so as to cover the LED 20, and the phosphor light-emitting layer 30 and the partition wall 31 partitioning the phosphor light-emitting layer 30 are provided on the upper side of the planarization film 32. A metal film (omitted from illustration) for preventing color mixing is provided on the surface of the partition wall 31.

[0047] Each LED 20 becomes a sub-pixel, and sub-pixels of three colors of R, G, and B constitute one pixel. In the present embodiment, the sub-pixels are arranged in stripes (refer to Figure 1 ), but the arrangement of the sub-pixels can be a mosaic arrangement, a triangular arrangement, or the like.

[0048] The driving circuit 40 is electrically connected to the wiring pattern 11. The driving circuit 40 supplies a driving signal to each LED 20, and performs on / off driving of each LED 20 to perform lighting / extinction.

[0049] Figure 3 , Figure 4 is a view schematically showing a manufacturing method of the display device 1.

[0050] <Process 1> As shown in (A) of Figure 3 , the circuit substrate 10 formed with the wiring pattern 11 and the connection pattern 12 (omitted from illustration) is prepared. The circuit substrate 10 is a substantially plate-shaped member. The circuit substrate 10 can be transparent or can not be transparent.

[0051] <Process 2> As shown in (B) of Figure 3 , the adhesive 41 is applied to the connection pattern 12 for connecting the wiring pattern 11 and the LED 20. The adhesive 41 can be applied to the wiring pattern 11 and the connection pattern 12, or can be applied to either one of the wiring pattern 11 or the connection pattern 12. The adhesive 41 desirably uses a resin having conductivity, for example, a resin mixed with carbon, a metal (for example, silver). This process of applying the adhesive has a process of applying the adhesive to the wiring pattern 11 using an applicator or the like, a pre-baking process of heating at substantially 90°C for about 2 minutes to evaporate the solution, a process of placing the mask 101 on the circuit substrate 10 to perform alignment, an exposure process of performing exposure at ordinary temperature to cure (pre-cure) the adhesive using light, and a developing process of removing the uncured adhesive.

[0052] <Process 3> Figure 3 As shown in (C), a transparent substantially plate-shaped wafer 25 on which a plurality of LEDs 20 are formed is bonded to the circuit board 10 coated with an adhesive, thereby fixing the LEDs 20 to the connection pattern. This bonding step will be described in detail later.

[0053] <Step 4> If the LED 20 is fixed to the circuit board 10, Figure 3 As shown in (D), a planarizing film 32 is formed to cover the LEDs 20. This planarizing film forming process includes: a step of applying the material of the planarizing film 32 onto the wiring pattern 11 using a coater or the like; a pre-baking step of heating to evaporate the solution; a step of placing the mask 102 on the circuit substrate 10 and performing alignment; an exposure step of curing the planarizing film 32 by exposure at room temperature; a development step of removing the uncured material of the planarizing film; and a post-baking step of removing moisture and the like.

[0054] <Process 5> Figure 3 As shown in (E), partition walls 31 are formed on the upper side of the planarization film 32. The partition wall formation process includes: a step of applying a material for the partition walls 31 onto the wiring pattern 11 using a coater or the like; a pre-baking step of heating to evaporate the solution; a step of placing a mask 103 on the circuit substrate 10 and performing alignment; an exposure step of curing the partition walls 31 by exposure at room temperature; a development step of removing uncured partition wall material; and a post-baking step of removing moisture and the like.

[0055] <Process 6> Figure 3 As shown in (F), the partition walls 31 formed in step 5 are plated to form a metal film 33 on the surfaces of the partition walls 31 and the planarization film 32. The plating process can be, for example, electroless Ni plating.

[0056] <Process 7> Figure 3 As shown in (G), the portion of the metal film 33 formed on the surface of the planarizing film 32 among the metal film 33 formed in step 6 is removed. In this embodiment, the metal film is removed by laser processing.

[0057] <Process 8> Figure 4 As shown in (A), a fluorescent resist containing a red fluorescent pigment (pigment or dye) is filled between the partition walls 31 and cured to form the red fluorescent layer 30R. The process for forming the red fluorescent layer 30R includes: a step of filling the fluorescent resist between the partition walls 31 using a squeegee; a pre-baking step of heating to evaporate the solution; a step of placing a mask 104 on the circuit board 10 and performing alignment; an exposure step of curing the red fluorescent layer 30R by exposing at room temperature; a development step of removing uncured fluorescent resist; and a post-baking step of removing moisture and the like.

[0058] <Process 9> As shown in (B) of FIG. 9, a fluorescent emitting resist containing a green fluorescent pigment is filled between the partition walls 31 and cured to form a green fluorescent emitting layer 30G. The green fluorescent emitting layer 30G formation process is substantially the same as the red fluorescent emitting layer 30R formation process except for the use of the mask 105, and thus the description is omitted. Figure 4

[0059] <Process 10> As shown in (C) of FIG. 10, a fluorescent emitting resist containing a blue fluorescent pigment is filled between the partition walls 31 and cured to form a blue fluorescent emitting layer 30B. The blue fluorescent emitting layer 30B formation process is substantially the same as the red fluorescent emitting layer 30R formation process except for the use of the mask 106, and thus the description is omitted. Figure 4

[0060] <Process 11> As shown in (D) of FIG. 11, the rigid-flexible substrate 43 is mounted on the wiring pattern 11. In addition, a substrate other than the rigid-flexible substrate can be mounted on the wiring pattern 11. Figure 4

[0061] <Process 12> As shown in (E) of FIG. 12, the driving circuit 40 is connected to the rigid-flexible substrate 43. Thereby, the driving signal from the driving circuit 40 is transmitted to the LED 20 via the wiring pattern 11, and functions as the display device 1. Figure 4

[0062] Next, the bonding device used in the bonding process (Process 3) of electrically connecting the LED 20 and the wiring pattern 11 by bonding the wafer 25 and the circuit substrate 10 will be described. Figure 5 is a diagram showing an outline of the bonding device 2. In Figure 5 , the vertical direction is set as the Z direction, and the directions substantially orthogonal to the Z direction are set as the X direction and the Y direction. The X direction and the Y direction are substantially orthogonal.

[0063] The bonding device 2 mainly has a stage 50, a suction stage 60, an imaging section 71, a probe 81, and a support frame 90.

[0064] The support frame 90 is a substantially box-shaped case that covers the outside of the bonding device 2. The stage 50, the suction stage 60, the inspection section 80, and the like are provided inside the support frame 90.

[0065] The stage 50 mainly has a heated stage 51 (corresponding to a first suction section), an inclined stage 52, a theta stage 53, an XY stage 54, and a Z moving section 55.

[0066] ​​​​The heating stage 51 is a substantially plate-shaped member (here, a substantially thick plate-shaped member) on which the circuit board 10 is placed on the upper surface 51a. A hole (omitted from the drawing) is formed in the heating stage 51 so as to open in the upper surface 51a, and the circuit board 10 is adsorbed and fixed to the upper surface 51a by suction of air using an air suction device 91 (refer to FIG. 8) connected to the hole. Figure 9 ) adsorbing the circuit board 10 and fixing it to the upper surface 51a. In addition, the heating stage 51 can also use a porous material.

[0067] Further, the heating stage 51 has a heating portion (omitted from the drawing). The heating portion maintains the entire heating stage 51 at a certain temperature (for example, approximately 120 degrees, approximately 200 degrees or more).

[0068] The tilt stage 52, the θ stage 53, and the XY stage 54 are provided between the heating stage 51 and the Z moving portion 55. The tilt stage 52 rotates the heating stage 51 around the X axis and the Y axis (inclines the heating stage 51). The θ stage 53 rotates the heating stage 51 around the Z axis. The XY stage 54 moves the heating stage 51 in parallel along the X direction and the Y direction. The Z moving portion 55 moves the heating stage 51, the tilt stage 52, the θ stage 53, and the XY stage 54 in parallel along the Z axis. The tilt stage 52, the θ stage 53, the XY stage 54, and the Z moving portion 55 can use already known technologies, and thus the description thereof is omitted.

[0069] The adsorption stage 60 is provided on the vertically upward side (+Z side) of the work stage 50. The adsorption stage 60 mainly has a cylindrical bracket 61, an adsorption pad 62, a cover glass 63, a tilt stage 64, and a θ stage 65.

[0070] The cylindrical bracket 61, the adsorption pad 62, and the cover glass 63 are adsorption portions 69 (corresponding to the second adsorption portions) that adsorb the wafer 25, and are substantially cylindrical members with both ends covered. In the present application, the substantially cylindrical shape is a hollow bar, and is a concept including a substantially circular cylindrical shape, a substantially square cylindrical shape, and the like. Further, the substantially cylindrical shape also includes a shape having a protruding portion or a recessed portion on the side surface. In the substantially cylindrical member, a member in which the boundary between the side surface and the upper surface or the side surface and the bottom surface has a rounded corner so as to be indistinctly distinguished is also included. Further, in the substantially cylindrical member, a member in which a reinforcing member such as a rib or a column is added to the hollow portion is also included.

[0071] Figure 6 is a diagram showing an outline of the adsorption portion 69, Figure 6 (A) of is a side view, Figure 6 (B) of is a bottom view. In Figure 6 (A) of, a part is shown in cross section.

[0072] In order to maintain high strength, the cylindrical holder 61 is made of a metal such as aluminum, iron, or the like. The cylindrical holder 61 is a substantially cylindrical shape, and the adsorption pad 62 and the cover glass 63 cover both ends of the cylindrical holder 61.

[0073] The adsorption pad 62 is a transparent substantially plate-shaped member that covers the lower end of the cylindrical holder 61. A hole 62a that penetrates in the thickness direction (Z direction) is formed in the adsorption pad 62. The hole 62a for adsorption can be one or a plurality of holes.

[0074] As an example of the material of the adsorption pad 62, glass, resin, or the like can be given. The adsorption pad 62 is preferably transparent as a whole, but can have a portion that is not transparent. For example, the adsorption pad 62 can be a combination of a plurality of materials such as glass and rubber. Furthermore, the adsorption pad 62 can not necessarily be transparent as a whole, and can be partially transparent as long as the imaging portion 71 can capture an image of a portion of the alignment mark or the circuit board 10 or the wafer 25 that is necessary for alignment.

[0075] The cover glass 63 is a transparent member that covers the upper side of the cylindrical holder 61. The material of the cover glass 63 can be a transparent resin, but is preferably glass. A recess 61a is formed on the upper end side of the cylindrical holder 61, and the cover glass 63 is installed inside the recess 61a, so that the cover glass 63 covers the upper end surface of the cylindrical holder 61. In other words, at least a portion of the upper side of the adsorption portion 69 includes a transparent member.

[0076] A vacuum adsorption joint 68 that is connected to an air suction device 92 (see Figure 9 ) is provided on the side surface of the cylindrical holder 61. The two end surfaces of the cylindrical holder 61 are covered by the adsorption pad 62 and the cover glass 63, so that the air inside the adsorption portion 69 is sucked by the air suction device 92 via the vacuum adsorption joint 68, and as a result, as shown in Figure 7 , the wafer 25 is adsorbed by the bottom surface 62b of the adsorption pad 62.

[0077] Returning to the description of Figure 5 , the tilt stage 64 and the theta stage 65 are provided on the vertical direction upper side of the adsorption portion 69, and move the adsorption portion 69 in the horizontal direction. Specifically, the tilt stage 64 rotates (inclines) the adsorption portion 69 about the X axis and the Y axis. Furthermore, the theta stage 53 rotates the adsorption portion 69 about the Z axis. The tilt stage 64 and the theta stage 65 can use a technology that is already known, and thus the description thereof is omitted. Note that the movement in the horizontal direction in the present application includes not only parallel movement, but also tilting movement and rotational movement.

[0078] The imaging unit 71 is a camera that captures images used to align the circuit board 10 and wafer 25. The imaging unit 71 is equipped with a zoom optical system to enable magnified observation and variable magnification. A conventional camera can be used for the imaging unit 71, so its description is omitted. The imaging unit 71 is mounted vertically above the suction unit 69 via a generally columnar mounting portion 72.

[0079] Figure 8 1 is a diagram schematically showing the imaging unit 71 and the mounting unit 72. Figure 8 (A) is the main view, Figure 8 (B) is a side view. Figure 8 (A) Figure 8 In (B), a portion is shown in cross section.

[0080] The mounting portion 72 holds the imaging portion 71 so as to be movable in the X, Y, and Z directions (see Figure 8 As a result, the imaging unit 71 can observe the entire area of ​​the wafer 25 adsorbed on the adsorption pad 62 .

[0081] Furthermore, the attachment portion 72 holds the adsorption stage 60 on the vertically lower side (−Z side) of the imaging portion 71 .

[0082] The tilting table 64 and the θ table 65 are generally cylindrical. In addition, the upper and lower surfaces of the adsorption portion 69 (the adsorption pads 62 and the cover glass 63) are transparent. Therefore, the camera unit 71 can capture the wafer 25 through the adsorption pads 62, the cover glass 63, the tilting table 64, and the θ table 65. In addition, since the wafer 25 is transparent, the camera unit 71 can capture the circuit substrate 10 through the wafer 25 (see FIG. 1 ). Figure 5 ).

[0083] A light irradiation unit 73 for irradiating ultraviolet rays is provided on the mounting portion 72. The light irradiation unit 73 is provided on the mounting portion 72 so as to be positioned at a height between the imaging unit 71 and the adsorption stage 60. The light irradiation unit 73 irradiates light in the horizontal direction (-Y direction).

[0084] like Figure 8 As shown in (B), the reflector 74 (in Figure 8 (A) is an optical component that reflects the ultraviolet light irradiated from the light irradiation unit 73 and bends the light path by approximately 90 degrees. The reflector 74 is set to a position that can overlap with the light path of the camera unit 71 (see Figure 8 (B) dotted line) and the position that does not overlap with the optical path of the imaging unit 71 (refer to Figure 8 (B) solid line) between the horizontal direction (refer to Figure 8The ultraviolet light irradiated from the light irradiation section 73 is reflected by the mirror 74 and is irradiated to the circuit substrate 10 and the wafer 25 in a state where the mirror 74 is disposed at a position overlapping the optical path of the imaging section 71.

[0085] Returning to Figure 5 The explanation of the inspection section 80. The inspection section 80 mainly has a plurality of probes 81 and a moving section 82. The plurality of probes 81 are respectively connected to a power supply 85 (refer to Figure 9 ). Further, the probes 81 are provided to the moving section 82. The moving section 82 is capable of moving the probes 81 in the up and down direction between a position abutting against the wiring pattern 11 provided to the circuit substrate 10 and a position not abutting against the wiring pattern 11. In the present embodiment, the wiring pattern 11 has a power supply pad for the lighting inspection (omitted from the drawing), and the probes 81 are abutted against this power supply pad.

[0086] Further, in the present embodiment, the inspection section 80 is mounted to the support frame 90, and the position thereof is in the vicinity of the suction table 60, but the position and the disposition method of the inspection section 80 are not limited to this. The probes 81 are only required to be disposed so as to be capable of moving in the up and down direction, and for example, the moving section 82 can be provided to the XY table 54.

[0087] Figure 9 is a block diagram showing the electric structure of the bonding apparatus 2. The bonding apparatus 2 has a CPU (Central Processing Unit) 151, a RAM (Random Access Memory) 152, a ROM (Read Only Memory) 153, an input output interface (I / F) 154, a communication interface (I / F) 155, and a medium interface (I / F) 156, which are connected to each other with the table 50, the suction table 60, the imaging section 71, the inspection section 80, the power supply 85, the air suction apparatuses 91, 92, and the like.

[0088] The RAM 152 is a volatile memory. The ROM 153 is a non-volatile memory in which various control programs and the like are stored. The CPU 151 acts based on the programs stored in the RAM 152, the ROM 153, and performs control of each section.

[0089] The CPU 151 has a function of a control section 151a which controls each section of the bonding apparatus 2. The control section 151a is constructed by executing a given program which is read into the CPU 151.

[0090] The control section 151a mainly has a function section for alignment, a function section for pressurization, and a function section for inspection. In the function section for alignment, the tilt stage 52, the θ stage 53, and the XY stage 54 are controlled so that the heating stage 51 moves in the horizontal direction while the circuit board 10 is photographed and observed through the adsorption stage 60 and the wafer 25 by the imaging section 71. Further, in the function section for pressurization, the Z moving section 55 is controlled so that the heating stage 51 moves in the vertical direction (+Z direction) to pressurize the circuit board 10 and the wafer 25. At this time, the control section 151a controls the set pressure to be optimum by detecting the pressurization pressure with a load cell (not shown). Further, in the function section for inspection, the probe 81 is brought into contact with the wiring pattern 11 while the state of pressurizing the circuit board 10 and the wafer 25 is maintained by controlling the moving section 82. The processing performed by the control section 151a will be described later in detail.

[0091] The CPU 151 controls the input / output devices 161 such as a keyboard and a mouse via the input / output interface 154. The communication interface 155 receives data from other devices via the network 162 and transmits to the CPU 151, and transmits data generated by the CPU 151 to other devices via the network 162.

[0092] The medium interface 156 reads programs and data stored in the storage medium 163 and stores in the RAM 152. In addition, the storage medium 163 is, for example, an IC card, an SD card, a DVD, or the like. In addition, programs that realize each function are read out from the storage medium 163, for example, installed in the bonding apparatus 2 via the RAM 152, and executed by the CPU 151.

[0093] Figure 9 The structure of the bonding apparatus 2 shown is a structure in which the main structure is described when the features of the present embodiment are described, and is not a structure in which structures possessed by, for example, a general information processing apparatus are excluded. The constituent elements of the bonding apparatus 2 can be classified into more constituent elements according to the processing content, and one constituent element can perform the processing of a plurality of constituent elements.

[0094] Next, the processing (process 3) of bonding the circuit board 10 and the wafer 25 using the bonding apparatus 2 will be described. This bonding process is mainly performed by the control section 151a. In the bonding process, the wafer 25 in which a plurality of LEDs 20 are formed and the circuit board 10 are bonded, and the LEDs 20 are fixed to the connection pattern.

[0095] Figure 10 is a flowchart showing the processing flow of the bonding process. Figure 11 is a diagram schematically showing the bonding process. Figure 12 is a diagram schematically showing the position of the probe 81 in the bonding process.

[0096] 1. Alignment process (steps S100 to S106)

[0097] <Step S100>

[0098] First, if Figure 11 As shown in (A), the wafer 25 is placed on the upper surface 51a of the workbench 50 (here, the heating workbench 51) so that the LED 20 (in Figure 11 At this time, the control unit 151a sucks air through the air suction device 91 to adsorb and fix the chip 25 on the upper surface 51a.

[0099] Then, if Figure 11 As shown in (B), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 upward (in the +Z direction), bringing the wafer 25 closer to the adsorption stage 60. The control unit 151a then controls the tilt stage 52, the θ stage 53, and the XY stage 54 to move the heating stage 51 (i.e., the wafer 25) horizontally, while using the imaging unit 71 to image and observe the wafer 25 through the adsorption stage 60. At this time, the control unit 151a moves the wafer 25 horizontally so that the alignment mark formed on the wafer 25 aligns with the center (optical axis) of the imaging unit 71.

[0100] <Step S102>

[0101] If the alignment mark formed on the wafer 25 aligns with the optical axis of the imaging unit 71, the control unit 151a stops the air suction by the air suction device 91, releasing the wafer 25 from being attracted to the upper surface 51a. Furthermore, the control unit 151a uses the air suction device 92 to suck the air inside the adsorption unit 69 via the vacuum adsorption joint 68, thereby adsorbing the wafer 25 onto the adsorption pad 62. Thus, the wafer 25 is fixed to the adsorption pad 62 with the LED 20 facing downward.

[0102] <Step S104>

[0103] Then, if Figure 11 As shown in (C), the control unit 151a controls the Z moving unit 55 to move the heating workbench 51 downward (-Z direction), places the circuit substrate 10 on the upper surface 51a of the workbench 50 (here is the heating workbench 51) so that the wiring pattern 11 faces upward, and uses the air suction device 91 to suck air to adsorb and fix the circuit substrate 10 on the upper surface 51a.

[0104] <Step S106>

[0105] like Figure 11As shown in (D), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 in the +Z direction, bringing the circuit substrate 10 closer to the wafer 25. However, the circuit substrate 10 and the wafer 25 do not contact each other. The control unit 151a then controls the tilting stage 52, the θ stage 53, and the XY stage 54 to move the heating stage 51 (i.e., the circuit substrate 10) horizontally, while using the imaging unit 71 to image and observe the circuit substrate 10 through the adsorption stage 60 and the wafer 25. Furthermore, since the wafer 25 is transparent, the circuit substrate 10 can be imaged through the wafer 25.

[0106] At this time, the control unit 151a moves the circuit substrate 10 horizontally so that the alignment mark formed on the circuit substrate 10 is aligned with the center (optical axis) of the imaging unit 71. Once the alignment mark formed on the circuit substrate 10 is aligned with the optical axis of the imaging unit 71, the control unit 151a ends the alignment process. As a result, the circuit substrate 10 and wafer 25 are positioned and arranged substantially parallel to each other.

[0107] 2. Lamination process

[0108] <Step S108>

[0109] like Figure 11 As shown in (E), the control unit 151a controls the Z moving unit 55 to move the heating table 51 in the +Z direction, thereby clamping the circuit substrate 10 and the wafer 25 with the heating table 51 and the adsorption pad 62 and applying pressure from both sides of the circuit substrate 10 and the wafer 25. As a result, the circuit substrate 10 and the wafer 25 are pressurized. In addition, when pressurizing, as shown in FIG. Figure 12 As shown in (A), the probe 81 and the wiring pattern 11 (in Figure 12 (not shown in the figure) do not abut.

[0110] In this embodiment, the circuit substrate 10 and wafer 25 are held together by the heating stage 51 and the suction pads 62. Therefore, when pressure is applied, the circuit substrate 10 and wafer 25 do not warp, and pressure can be applied uniformly across the entire surface of the wafer 25. This allows multiple LEDs 20 formed on the wafer 25 to be fixed to the circuit substrate 10 at once. However, if the circuit substrate 10 or wafer 25 warps, excessive force may be applied to LEDs 20 located close to the wafer 25, potentially damaging the LEDs 20 or cracking the wafer 25. In contrast, in this embodiment, uniform pressure is applied across the entire surface of the wafer 25, preventing damage to the LEDs 20, uneven lighting of the LEDs 20, and cracking of the wafer 25.

[0111] 3. Inspection process (steps S110 to S118)

[0112] <Step S110>

[0113] like Figure 11 (F) and Figure 12 As shown in FIG. 2B , the control unit 151 a moves the probe 81 in the −Z direction while applying pressure from both sides of the wafer 25 and the circuit board 10 , so that the probe 81 comes into contact with the wiring pattern 11 (not shown).

[0114] <Step S112>

[0115] The control unit 151a applies a current from the power supply 85 to the wiring pattern 11 via the probe 81. As a result, the LED 20 lights up.

[0116] <Step S114>

[0117] The control unit 151a checks whether all the LEDs 20 are lit based on the image captured by the camera unit 71. Figure 12 As shown in (C), all LEDs 20 are lit.

[0118] <Step S116>

[0119] When all LEDs 20 are not lit ("No" in step S114), that is, when even one LED 20 is not lit, the control unit 151a controls the Z moving unit 55 to move the heating workbench 51 in the -Z direction to separate the circuit substrate 10 and the chip 25.

[0120] <Step S118>

[0121] The control unit 151a then uses a blower (not shown) to blow away dust and other debris, thereby correcting any defects. In this embodiment, since the inspection is performed before the circuit board 10 and wafer 25 are connected (before the adhesive cures), the circuit board 10 and wafer 25 can be separated, allowing the defect to be corrected. The control unit 151a then returns the process to step S106.

[0122] 4. Curing process

[0123] <Step S200>

[0124] If all LEDs are lit ("Yes" in step S114), Figure 12As shown in (D), the control unit 151a controls the moving unit 82 to separate the probe 81 from the wiring pattern 11. Then, the control unit 151a uses a heating unit (not shown) to heat the entire heating stage 51 while applying pressure from both sides of the circuit substrate 10 and the wafer 25. This heats the circuit substrate 10 and the wafer 25, curing the adhesive 41. As a result, the LED 20 is fixed to the circuit substrate 10.

[0125] Furthermore, the adhesive is not limited to thermosetting resins; ultraviolet curing resins can also be used. When using ultraviolet curing resins, the reflector 74 is moved to a position overlapping the optical path of the imaging unit 71, and ultraviolet light is irradiated from the light irradiation unit 73. Thus, the ultraviolet light irradiates the circuit board 10 and the wafer 25, curing the adhesive.

[0126] 5. Pressurization release process

[0127] <Step S202>

[0128] The control unit 151 a stops the suction of air by the air suction device 92 , returns the air to the inside of the adsorption unit 69 , and separates the wafer 25 from the adsorption pad 62 .

[0129] <Step S204>

[0130] like Figure 11 As shown in (G), the control unit 151 a controls the Z moving unit 55 to move the heating stage 51 in the −Z direction, so that the member in which the wafer 25 is connected to the circuit substrate 10 moves in the −Z direction together with the heating stage 51 .

[0131] <Step S206>

[0132] Finally, the control unit 151a stops the air suction by the air suction device 91 and separates the circuit board 10 from the upper surface 51a. Then, the circuit board 10 is removed from the upper surface 51a. The above is the processing flow of the bonding step.

[0133] According to this embodiment, by using transparent suction pads 62 and cover glass 63, and cylindrical tilting stage 64 and θ stage 65, the circuit board 10 and wafer 25 can be directly observed by the imaging unit 71. Furthermore, since alignment is performed while directly observing the circuit board 10 and wafer 25 by the imaging unit 71, high-precision positioning is possible. Furthermore, since the circuit board 10 and wafer 25 are clamped and pressurized between the generally plate-shaped heating stage 51 and suction pads 62, pressure can be applied substantially uniformly across the entire surface.

[0134] Furthermore, according to this embodiment, the probe 81 is configured to be movable. During inspection, the probe 81 is brought into contact with the wiring pattern 11, and when the adhesive cures, the probe 81 is moved away from the wiring pattern 11. This allows the bonding apparatus 2 to verify that the LEDs are lit. Furthermore, since the lighting of the LEDs 20 is verified before the adhesive 41 cures and connects the circuit substrate 10 and the wafer 25, if any LEDs 20 are not lit, the circuit substrate 10 and the wafer 25 can be separated to correct the problem. Consequently, the yield rate during the manufacture of the display device 1 can be improved.

[0135] In this embodiment, the stage 50 includes the Z-moving portion 55 that moves the heating stage 51 in the +Z direction or the -Z direction. However, the portion that can be moved in the +Z direction or the -Z direction is not limited to the heating stage 51. For example, the adsorption stage 60 may include a Z-moving portion that moves the adsorption portion 69 in the +Z direction or the -Z direction.

[0136] In this embodiment, the workbench 50 includes a heating table 51, but the heating table 51 is not essential. When a photocurable resin is used as the adhesive, the laminating device 2 only needs to include the light irradiation unit 73 and the reflector 74. Furthermore, the light irradiation unit 73 and the reflector 74 are not essential. When a thermosetting resin is used as the adhesive, the laminating device 2 only needs to include the heating table 51.

[0137] In addition, in the present embodiment, alignment is performed by aligning the alignment marks formed on the circuit substrate 10 and the chip 25 with the center (optical axis) of the camera unit 71, respectively. However, alignment marks are not essential. For example, the camera unit 71 may photograph the circuit substrate 10 and the chip 25, and the heating workbench 51 may be moved in the horizontal direction so that the position of the LED 20 provided on the chip 25 is aligned with the position of the wiring pattern 11 of the circuit substrate 10 for alignment. In the present embodiment, since the camera unit 71 can directly observe the circuit substrate 10 and the chip 25, the circuit substrate 10 and the chip 25 can be aligned even without alignment marks. In particular, since the camera unit 71 has a zoom optical system and is configured to be movable in the X and Y directions, accurate alignment can be performed by zooming in on a portion of the circuit substrate 10 and the chip 25 for photographing.

[0138] In this embodiment, the alignment mark is marked at the center of the wafer 25. However, the location of the alignment mark is not limited to the center. Furthermore, the alignment mark may be one or more. By marking multiple alignment marks, not only can the height be accurately aligned, but also the tilt and rotation offset can be accurately aligned. Marking three or more alignment marks is particularly preferred.

[0139] <Second embodiment>

[0140] The second embodiment of the present invention is a method in which imaging units other than the imaging unit 71 are also used for alignment. The laminating device 3 according to the second embodiment is described below. Parts identical to those in the first embodiment are denoted by the same reference numerals, and their descriptions are omitted. Furthermore, the display device 1 manufactured using the laminating device 3 is identical to that in the first embodiment, and the manufacturing method of the display device 1 is also identical, so the description thereof is omitted.

[0141] Figure 13 1 is a diagram schematically showing the bonding device 3. The bonding device 3 is used in the bonding process (process 3) of bonding the wafer 25 and the circuit substrate 10 to electrically connect the LED 20 and the wiring pattern 11, and mainly includes a workbench 50, an adsorption workbench 60, imaging units 71, 76, and 77, an inspection unit 80, and a support frame 90.

[0142] The imaging unit 77 is a camera that captures an image of the circuit board 10 and is installed on the upper surface of the support frame 90. The imaging unit 76 is a camera that captures an image of the wafer 25 and is installed on the XY stage 54. Since the imaging units 76 and 77 can use common cameras, their description is omitted.

[0143] Figure 14 It is a flowchart showing the processing flow of the bonding step. Figure 15 The first embodiment differs from the second embodiment only in the alignment step and the bonding step, and therefore detailed descriptions of steps other than the alignment step and the bonding step will be omitted.

[0144] 1. Alignment process (steps S102 to S107)

[0145] <Step S102>

[0146] First, if Figure 15 As shown in (A), the air suction device 92 is used to suck the air inside the adsorption part 69 through the vacuum adsorption joint 68, and the chip 25 is adsorbed on the adsorption pad 62 so that the LED 20 (in Figure 15 Figure omitted) facing downward.

[0147] <Step S103>

[0148] Next, the control unit 151a adjusts the tilt and rotation offset of the wafer 25 while imaging and observing the wafer 25 using the imaging unit 76. Specifically, the control unit 151a controls the tilt stage 64 and the θ stage 65 to move the wafer 25 in the horizontal direction so that the alignment mark formed on the wafer 25 is aligned with the center (optical axis) of the imaging unit 71.

[0149] <Step S104>

[0150] Next, the control unit 151 a fixes the circuit substrate 10 on the upper surface 51 a of the stage 50 (here, the heating stage 51 ) so that the wiring pattern 11 faces upward.

[0151] <Step S105>

[0152] Then, the control unit 151a uses the imaging unit 77 to image and observe the circuit substrate 10 while adjusting the tilt and rotation offset of the circuit substrate 10. Specifically, the control unit 151a controls the tilt stage 52, the θ stage 53, and the XY stage 54 to move the heating stage 51 (i.e., the circuit substrate 10) horizontally. At this time, the control unit 151a moves the circuit substrate 10 horizontally so that the alignment mark formed on the circuit substrate 10 aligns with the center (optical axis) of the imaging unit 77.

[0153] <Step S107>

[0154] like Figure 15 As shown in FIG10B , the control unit 151a controls the XY stage 54 to move the heating stage 51 (i.e., the circuit substrate 10) in the horizontal direction so that the position of the alignment mark formed on the circuit substrate 10 is substantially aligned with the position of the optical axis of the imaging unit 76 in step S103. As a result, the circuit substrate 10 and the wafer 25 are positioned and arranged substantially parallel to each other.

[0155] 2. Lamination process

[0156] <Step S109>

[0157] like Figure 15 As shown in (C), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 in the +Z direction. Furthermore, the control unit 151a uses the imaging unit 71 to capture images of the circuit substrate 10 and the wafer 25. If there is a positional misalignment between the circuit substrate 10 and the wafer 25, the control unit 151a controls the θ stage 53 and the XY stage 54 to move the heating stage 51 (i.e., the circuit substrate 10) horizontally so that the alignment marks on the circuit substrate 10 align with those on the wafer 25. At this point, the circuit substrate 10 and the wafer 25 are not in contact.

[0158] If the alignment marks of the circuit board 10 and the alignment marks of the wafer 25 coincide, as shown in (D) of FIG. 8, the circuit board 10 and the wafer 25 are pressed from both sides thereof by the heating stage 51 and the suction pads 62. Figure 15

[0159] Thus, the circuit board 10 and the wafer 25 are pressed. Since the circuit board 10 and the wafer 25 are held by the heating stage 51 and the suction pads 62, the circuit board 10 and the wafer 25 do not bend at the time of pressing, and the entire surface of the wafer 25 can be pressed substantially uniformly, and the plurality of LEDs 20 formed in the wafer 25 can be fixed to the circuit board 10 at one time, and damage to the LEDs 20, non-uniform lighting of the LEDs 20, and breakage of the wafer 25 can be prevented.

[0160] 3. Inspection process (steps S110 to S118)

[0161] <Steps S110, S112>

[0162] As shown in (E) of FIG. 8, the control section 151a moves the probe 81 in the -Z direction to make the probe 81 abut against the wiring pattern 11 while pressing the wafer 25 and the circuit board 10 from both sides thereof, and applies a current from the power supply 85 to the wiring pattern 11 via the probe 81. Figure 15

[0163] <Steps S114 to S118>

[0164] The control section 151a confirms whether all the LEDs 20 are lit based on the image captured by the imaging section 71. In the case where not all the LEDs 20 are lit (even if there is one LED 20 that is not lit), the control section 151a controls the Z moving section 55 to move the heating stage 51 in the -Z direction to separate the circuit board 10 and the wafer 25, and corrects the defective condition. Then, the control section 151a returns the process to step S106.

[0165] 4. Curing process

[0166] <Step S200>

[0167] In the case where all the LEDs 20 are lit, the control section 151a moves the probe 81 away from the wiring pattern 11 by the moving section 82, and heats the entire heating stage 51 by a heating section not shown while pressing the wafer 25 and the circuit board 10 from both sides thereof, thereby heating the circuit board 10 and the wafer 25 to cure the adhesive 41. Thus, the LEDs 20 are fixed to the circuit board 10.

[0168] 5. Pressing release process ​​

[0169] <Steps S202 to S206>

[0170] The control section 151a stops the suction of air by the air suction device 92, and separates the wafer 25 from the suction pad 62. Then, as shown in (F) of FIG. 6, the control section 151a controls the Z moving section 55 to move the heating stage 51 in the -Z direction, and moves the member to which the wafer 25 is connected together with the heating stage 51 in the -Z direction. Finally, the control section 151a stops the suction of air by the air suction device 91, and separates the circuit board 10 from the upper surface 51a. Then, the circuit board 10 is taken out from the upper surface 51a. Figure 15

[0171] According to the present embodiment, since the imaging sections 76, 77 are used, the alignment process can be performed simply.

[0172] In addition, in the present embodiment, although the imaging sections 76, 77 are used, the imaging section 76 is not essential. In the case where the imaging section 76 is not used, it is sufficient to perform the process in the order of steps S100 (refer to FIG. 2), S102 (refer to FIG. 3), S104 (refer to FIG. 4), S105 (refer to FIG. 5), and S106 (refer to FIG. 6). Figure 10 Figure 10 Figure 14 Figure 14

[0173] The above-described embodiments of the present application have been described in detail with reference to the attached drawings, but it is to be noted that specific configurations are not limited to the above-described embodiments, and design changes and the like within a scope that does not depart from the gist of the present application are also included. Further, a configuration in which the configurations described in the above-described embodiments and modified examples are appropriately combined can be employed.

[0174] In particular, in the above-described embodiments, the bonding apparatuses 2, 3 that bond the circuit board 10 and the wafer 25 have been described, but the objects (corresponding to the first member and the second member) to be bonded by the bonding apparatuses 2, 3 are not limited to the circuit board 10 and the wafer 25, and the bonding apparatuses 2, 3 can be used in the bonding of various members each having a substantially plate shape. Further, in the above-described embodiments, the circuit board 10 is fixed to the heating stage 51, and the wafer 25 is fixed to the suction pad 62, but the wafer 25 can be fixed to the heating stage 51, and the circuit board 10 can be fixed to the suction pad 62.

[0175] Further, in the present application, the term "substantially" includes not only the case where they are strictly the same, but also the case where there is an error or a deformation within a range that does not lose the same. For example, the term "substantially parallel" is not limited to the case where they are strictly parallel. Further, for example, in the case where it is simply stated that they are parallel, orthogonal, or the like, it is assumed that not only the case where they are strictly parallel, orthogonal, or the like, but also the case where they are substantially parallel, substantially orthogonal, or the like is included.​​​​​

[0176] Symbol explanation

[0177] 1: display device

[0178] 2, 3: bonding apparatus

[0179] 10: circuit substrate

[0180] 11: wiring pattern

[0181] 12: connection pattern

[0182] 20: LED

[0183] 22: p electrode

[0184] 23: n electrode

[0185] 25: wafer

[0186] 30: fluorescent light emitting layer

[0187] 30B: blue fluorescent light emitting layer

[0188] 30G: green fluorescent light emitting layer

[0189] 30R: red fluorescent light emitting layer

[0190] 31: partition wall

[0191] 32: planarization film

[0192] 33: metal film

[0193] 40: drive circuit

[0194] 41: adhesive

[0195] 43: rigid-flexible substrate

[0196] 50: stage

[0197] 51: heating stage

[0198] 51a: upper surface

[0199] 52: inclined stage

[0200] 53: theta stage

[0201] 54: XY stage

[0202] 55: Z moving portion

[0203] 60: adsorption stage

[0204] 61: cylindrical holder

[0205] 61a: recess

[0206] 62: suction pad

[0207] 62a: hole

[0208] 62b: bottom surface

[0209] 63: cover glass

[0210] 64: tilt stage

[0211] 65: theta stage

[0212] 68: vacuum suction joint

[0213] 69: suction portion

[0214] 71, 76, 77: imaging portion

[0215] 72: mounting portion

[0216] 73: light irradiation portion

[0217] 74: mirror

[0218] 80: inspection portion

[0219] 81: probe

[0220] 82: moving portion

[0221] 85: power supply

[0222] 90: support frame

[0223] 91, 92: air suction device

[0224] 101, 102, 103, 104, 105, 106: mask

[0225] 151: CPU

[0226] 151a: control portion

[0227] 152: RAM

[0228] 153: ROM

[0229] 154: input / output interface

[0230] 155: communication interface

[0231] 156: medium interface

[0232] 161: input / output device

[0233] 162: network

[0234] 163: storage medium.

Claims

1. A laminating device for laminating a substantially plate-shaped first member and a transparent substantially plate-shaped second member, the laminating device comprising: a substantially plate-shaped first adsorption portion that adsorbs the first member; a second substantially plate-shaped adsorption portion disposed vertically above the first adsorption portion and adapted to adsorb the second member; a first moving portion that moves the first adsorption portion or the second adsorption portion in a vertical direction; a second moving portion that moves the first adsorption portion in a horizontal direction; as well as a camera unit disposed on the upper side of the second adsorption unit in the vertical direction; The second adsorption part is a substantially cylindrical member with both ends covered and provided with a suction port for sucking air. At least a portion of the upper surface of the second adsorption portion includes a transparent member, The lower surface of the second adsorption portion is a transparent adsorption pad that is flat as a whole and has a hole penetrating in the thickness direction. The imaging unit captures an image of the first member and / or the second member via the transparent member and the adsorption pad.

2. The laminating device according to claim 1, characterized in that: The first member and the second member have a plurality of LEDs formed on one side and a connection pattern formed on the other side. The bonding device includes a plurality of probes connected to a power source, The probe can move in the vertical direction between a position where it contacts the connection pattern and a position where it does not contact the connection pattern.

3. The laminating device according to claim 1 or 2, characterized in that: have: a third moving portion that moves the second adsorption portion in a horizontal direction, The third moving portion is a substantially cylindrical member, and is provided on the upper side in the vertical direction of the second adsorption portion.

4. The laminating device according to any one of claims 1 to 3, characterized in that: have: a substantially columnar mounting portion that holds the imaging portion and the second adsorption portion; a light irradiation unit provided on the mounting portion so as to be located at a height between the imaging unit and the second adsorption unit; as well as The reflecting mirror is movable in the horizontal direction between a position where it overlaps with the optical path of the imaging unit and a position where it does not overlap with the optical path of the imaging unit.

5. The laminating device according to any one of claims 1 to 4, characterized in that: have: The first control unit controls the second moving unit to move the first adsorption unit while the imaging unit images and observes the first member via the second adsorption unit and the second member.

6. The laminating device according to claim 2, characterized in that: have: a fourth moving portion that moves the probe in a vertical direction; and The second control unit controls the first moving unit to pressurize the first member and the second member, and controls the fourth moving unit to bring the probe into contact with the connection pattern while maintaining the pressurized state.

7. A laminating method, characterized in that: have: A step of placing a plate-shaped first member on a substantially plate-shaped first suction portion, sucking a transparent plate-shaped second member onto a transparent substantially plate-shaped second suction portion provided above the first suction portion in a vertical direction, and arranging the first member and the second member substantially in parallel; A step of performing alignment between the first member and the second member by moving the first member in the horizontal direction while photographing and observing the first member via the second adsorption portion and the second member using a camera provided above the second adsorption portion in the vertical direction; and a step of pressurizing the first member and the second member, The second adsorption part is a substantially cylindrical member with both ends covered and provided with a suction port for sucking air. At least a portion of the upper surface of the second adsorption portion includes a transparent member, The lower surface of the second adsorption portion is a transparent adsorption pad that is flat as a whole and has a hole that penetrates in the thickness direction.

8. The laminating method according to claim 7, characterized in that: The first member and the second member have a plurality of LEDs formed on one side and a connection pattern formed on the other side. An adhesive is applied to the first member and / or the second member. The bonding method comprises: a step of moving a probe while keeping the first member and the second member pressurized, so that the probe comes into contact with the connection pattern to light up the LED; a step of photographing the first member and the second member using the imaging unit, and confirming lighting of the LED based on the photographed image; and and curing the adhesive when all the LEDs are lit.

9. The laminating method according to claim 7 or 8, characterized in that: The first member and the second member are arranged substantially in parallel by the following steps, the steps comprising: a step of placing the second member on the first adsorption portion; a step of moving the first adsorption unit in a horizontal direction while photographing and observing the second member via the second adsorption unit using the imaging unit; a step of adsorbing the second member by the second adsorption portion; and a step of placing the first member on the first adsorption portion.

10. A method for manufacturing a display device, comprising a step of laminating a first substantially plate-shaped member having a plurality of LEDs formed on one side and a connection pattern formed on the other side and a second substantially plate-shaped transparent member, wherein the method is characterized in that: The laminating process comprises: The step of placing the first member on a first substantially plate-shaped adsorption portion, adsorbing the second member on a transparent second substantially plate-shaped adsorption portion provided above the first adsorption portion in a vertical direction, and arranging the first member and the second member substantially in parallel; A step of performing alignment between the first member and the second member by moving the first member in the horizontal direction while photographing and observing the first member via the second adsorption portion and the second member using a camera provided above the second adsorption portion in the vertical direction; and a step of pressurizing the first member and the second member, The second adsorption part is a substantially cylindrical member with both ends covered and provided with a suction port for sucking air. At least a portion of the upper surface of the second adsorption portion includes a transparent member, The lower surface of the second adsorption portion is a transparent adsorption pad that is flat as a whole and has a hole that penetrates in the thickness direction.

11. The method for manufacturing a display device according to claim 10, wherein: An adhesive is applied to the first member and / or the second member. The laminating process comprises: a step of moving a probe while keeping the first member and the second member pressurized, so that the probe comes into contact with the connection pattern to light up the LED; a step of photographing the first member and the second member using the imaging unit, and confirming lighting of the LED based on the photographed image; and and curing the adhesive when all the LEDs are lit.

12. The method for manufacturing a display device according to claim 10 or 11, wherein: The first member and the second member are arranged substantially in parallel by the following steps, the steps comprising: a step of placing the second member on the first adsorption portion; a step of moving the first adsorption unit in a horizontal direction while photographing and observing the second member via the second adsorption unit using the imaging unit; a step of adsorbing the second member by the second adsorption portion; and a step of placing the first member on the first adsorption portion.

Images