Liquid treatment method and liquid treatment device

Abstract

The present invention provides a liquid processing method and a liquid processing apparatus capable of improving productivity when a substrate is subjected to liquid processing using a liquid processing apparatus. In a liquid processing method in which a substrate is supplied with a processing liquid to be subjected to liquid processing, when trial spraying of a first nozzle is performed in a first coating module, it is determined and decided whether or not to perform trial spraying of a second nozzle before the second coating module becomes a state in which liquid processing can be started on a substrate that is a next liquid processing target, wherein the first nozzle is a nozzle for supplying the substrate with the processing liquid to be subjected to liquid processing of the substrate in the first coating module, and the second nozzle is a nozzle for supplying a substrate that is the next liquid processing target of the substrate with the processing liquid to be subjected to liquid processing in the second coating module.

Description

Technical Field

[0001] This invention relates to liquid treatment methods and liquid treatment apparatus. Background Technology

[0002] Patent Document 1 discloses a substrate processing apparatus that forms a thin film on the surface of a substrate by feeding and processing a substrate into and out of multiple processing units. Each processing unit includes a thin film forming unit for supplying processing liquid from a nozzle member to form the thin film. The substrate processing apparatus includes: a liquid release drive device for releasing the processing liquid from the nozzle member during a thin film forming period when the processing liquid is supplied to the substrate to form the thin film, and during a pre-dispense period when the processing liquid is released outside the thin film forming period; a control device for controlling the liquid release drive device; and a timing setting device for setting the timing of the pre-dispense operation to a timing corresponding to the processing conditions of the substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 10-32157 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] The technology of this invention improves productivity when using a liquid treatment device to perform liquid treatment on substrates.

[0008] Technical solutions for solving technical problems

[0009] One aspect of the present invention is a liquid treatment method for supplying a processing liquid to a substrate for liquid treatment. When a test spray of a first nozzle is performed in a first coating module, before the substrate, which is the next target for liquid treatment, is in a state where liquid treatment can begin in a second coating module, it is determined and decided whether to perform a test spray of a second nozzle. The first nozzle is a nozzle in the first coating module used to supply the processing liquid to the substrate for liquid treatment, and the second nozzle is a nozzle in the second coating module used to supply the processing liquid to the substrate, which is the next target for liquid treatment, for liquid treatment.

[0010] Invention Effects

[0011] According to the present invention, productivity can be improved when liquid treatment apparatus is used to treat substrates. Attached Figure Description

[0012] Figure 1 This is a top view schematically showing the outline structure of the resist coating apparatus of this embodiment.

[0013] Figure 2 It means that it is in use Figure 1 A diagram illustrating the wafer processing sequence when a resist coating apparatus applies resist to a wafer.

[0014] Figure 3 This is a flowchart illustrating an example of a process for test spraying using the resist coating apparatus of this embodiment.

[0015] Figure 4 This is a timing diagram showing the processing status of each coating module when a resist coating device is used to coat a wafer with resist. (a) shows the existing processing flow, and (b) shows the processing flow of the implementation method.

[0016] Figure 5 This is an explanatory diagram showing the wafer processing sequence when a resist coating process is performed on a wafer using a resist coating apparatus according to another embodiment.

[0017] Figure 6 This is an explanatory diagram showing the wafer processing sequence when a resist coating process is performed on a wafer using a resist coating apparatus according to another embodiment.

[0018] Explanation of reference numerals in the attached figures

[0019] 1. Resist Coating Device

[0020] 10, 50 Coating Treatment Units

[0021] 20, 30, 60, 70 Coating Modules

[0022] 40 and 80 nozzles

[0023] 41, 31 arms

[0024] 42, 82 Guide Components

[0025] 43, 83 Horizontal moving parts

[0026] 44, 84 Nozzle Groove

[0027] 100 Control Department

[0028] W chip. Detailed Implementation

[0029] In semiconductor device manufacturing processes, substrates such as semiconductor wafers (hereinafter sometimes referred to as "wafers") are liquid-treated by supplying processing solutions, such as photoresist and developer, through nozzles. In this process, to prevent nozzle clogging due to solidification of the processing solution and the falling of solidified material onto the substrate, a dummy dispense of a predetermined amount of processing solution is performed in the nozzle standby section. Since liquid treatment of the substrate cannot be performed during the dummy dispense, it is crucial to perform the dummy dispense efficiently.

[0030] Regarding this point, the prior art disclosed in Japanese Patent Application Publication No. 10-32157 pertains to a liquid treatment apparatus having a single nozzle within a coating module. However, for liquid treatment apparatuses that supply treatment liquid to two or more coating modules using a shared nozzle, or for so-called multi-module systems that perform the same liquid treatment on multiple coating modules, there is no instruction on how to efficiently perform test spraying. Therefore, for such multi-module systems, it is desirable to perform test spraying efficiently to improve productivity.

[0031] Therefore, the technology of the present invention enables efficient trial spraying in multi-module liquid treatment devices to improve productivity.

[0032] The structure of the liquid treatment apparatus of this embodiment will now be described with reference to the accompanying drawings. Furthermore, in this specification, elements having substantially the same functional configuration are labeled with the same reference numerals, and repeated descriptions are omitted.

[0033] <Resist Coating Device>

[0034] Figure 1 This is a top view showing the general structure of a resist coating apparatus 1, which is an example of the liquid treatment apparatus of this embodiment. The resist coating apparatus 1 has two coating processing units 10 and 50. Since each coating processing unit 10 and 50 has the same structure, the description will focus on the coating processing unit 10.

[0035] The coating processing unit 10 has two coating modules 20 and 30 and a nozzle 40 for supplying resist liquid to the wafer W disposed in the two coating modules 20 and 30. The coating modules 20 and 30 are in the lateral direction ( Figure 1 They are arranged side by side in the X direction. Each coating module 20 and 30 is constructed in the same manner, so the description will be based on coating module 20 as an example.

[0036] The coating module 20 includes a spin chuck 21, which is a substrate holding part that holds the central portion of the back side of the wafer W horizontally. The spin chuck 21 is configured to rotate about a vertical axis while holding the wafer W via a rotation drive mechanism (not shown), and the spin chuck 21 holds the wafer W with its center located at its rotation center. The rotational speed of the spin chuck 21, i.e., the rotational speed of the wafer W, is controlled by the control unit 100. A cup-shaped body 22 with an open upper surface surrounds the wafer W on the spin chuck 21.

[0037] Three lifting pins 23, for example, are provided inside the cup-shaped body 22, which move vertically. These lifting pins 23 are raised and lowered by a lifting mechanism (not shown), thereby enabling the transfer of the wafer W between the substrate transport mechanism (not shown) that transports the wafer W in the photoresist coating apparatus 1 and the rotary chuck 21.

[0038] The coating module 30 also has a rotary chuck 31, a cup-shaped body 32, and a lifting pin 33 with the same structure as the coating module 20.

[0039] The nozzle 40 disposed within the coating unit 10 is supported by an arm 41, which is mounted on a horizontally moving part 43 along the arrangement direction of the coating modules 20 and 30. Figure 1 The guide 42, which extends in the X direction, moves. Furthermore, the arm 41 can be raised and lowered in the vertical direction via a lifting mechanism (not shown).

[0040] The nozzle 40 has: 10 resist dispensing nozzles, each supplying a variety (e.g., 10 types) of resist with different concentrations and compositions; and a diluent dispensing nozzle, supplying a processing liquid, i.e., a solvent, such as a diluent, to facilitate the diffusion of the resist on the wafer W. These resist dispensing nozzles and diluent dispensing nozzles are positioned relative to the moving direction of the nozzle 40. Figure 1 Arranged in a parallel manner (in the X direction).

[0041] Therefore, nozzle 40 can supply the prescribed resist solution and diluent to the wafers W disposed in coating modules 20 and 30 to perform liquid treatment on each wafer W. That is, nozzle 40 is a common nozzle for coating modules 20 and 30.

[0042] In non-treatment situations, i.e., when no treatment fluid is supplied, such as Figure 1 As shown, the nozzle 40 is located in the nozzle bus 44, which serves as a nozzle standby section. The nozzle bus 44 houses the front ends of each nozzle release section of the nozzle 40 within a solvent atmosphere, thus suppressing the evaporation of the resist liquid, etc. Furthermore, test spraying is performed within this nozzle bus 44.

[0043] The control unit 100 determines and decides on the release and cessation of the resist liquid during liquid treatment of the nozzle 40, the release and cessation of the solvent, and the execution and cessation of test spraying, and outputs necessary control signals to the nozzle 40, arm 41, and rotary chucks 21 and 31.

[0044] The coating processing unit 10 is configured as described above, and the other coating processing unit 50 also has the same configuration. That is, the coating processing unit 50 has two coating modules 60 and 70 and a nozzle 80. Each coating module 60 and 70 has a rotary chuck 61 and 71, a cup-shaped body 62 and 72, and lifting pins 63 and 73 with the same structure as coating modules 20 and 30.

[0045] Therefore, the nozzle 80 is supported by the arm 81 and moved towards the coating modules 60 and 70 by the horizontal moving part 83, enabling the supply of a specified resist solution and thinner to the wafers W disposed in the coating modules 60 and 70 for liquid treatment of each wafer W. That is, the nozzle 80 is a shared nozzle for the coating modules 60 and 70. In addition, a test spray of the nozzle 80 is performed in the nozzle groove 84. The operation of these nozzles 80 is controlled by the control unit 100 in the same manner as the coating processing unit 10.

[0046] The control unit 100 is, for example, a computer with a CPU, memory, etc., and has a program storage unit (not shown). The program storage unit stores programs for controlling the processing, test spraying, etc., of the wafer W in the resist coating apparatus 1. Alternatively, the aforementioned programs can be recorded in a computer-readable storage medium and installed from that storage medium into the control unit 100.

[0047] <Resistant Application Method>

[0048] The following describes an example of a resist coating method performed by a resist coating apparatus 1 configured as described above, which is an example of a liquid treatment method. Figure 2 As shown, the wafer W, which is the object to be coated with the resist solution, is transported to each coating module in the order of coating module 20 → coating module 60 → coating module 30 → coating module 70 → coating module 20... by the aforementioned substrate transport mechanism (not shown) for resist coating.

[0049] Next, for example, for wafers processed in batches (e.g., 25 wafers), a test spray is performed on the nozzle used for resist coating before applying resist to the wafers that are the first to be processed in each batch. Combined with Figure 2 To explain this, when coating module 20 is used on the last wafer AW of batch A... LWhen applying the resist, the first wafer BW1 of the next batch B is applied using the coating module 60, then the second wafer BW2 of the batch B is applied using the coating module 30, the third wafer BW3 of the batch B is applied using the coating module 70, and so on.

[0050] Next, for the first wafer BW1 of batch B coated by coating module 60, resist solution is supplied from nozzle 80. However, before supplying resist solution to wafer BW1, nozzle 80 needs to perform a test spray. This test spray is typically called a process-job pilot spray. Therefore, hereinafter, process-job pilot spray is sometimes simply referred to as PJ pilot spray. That is, the wafer that is the first to undergo liquid treatment among a group of wafers that will be continuously liquid-treated according to a predetermined processing plan is called wafer BW1. Furthermore, the continuous liquid treatment mentioned here means, for example, when combined with… Figure 2 During the explanation, the liquid processing flow is described as follows: before the coating process (liquid processing) is completed on the wafer BW1 by the coating module 60, the subsequent wafer BW2 is started by the coating module 30, which is another liquid processing module.

[0051] Next, after a pilot PJ test spray is performed on the nozzle 80 responsible for resist coating in coating module 60, a virtual PJ test spray is performed on the nozzle 40 in another coating module 30 that is first responsible for resist coating of wafers belonging to batch B. In this case, specifically, the control unit 100 is configured based on, for example... Figure 3 The judgments and decisions are made in the order shown in the flowchart.

[0052] First, the input to the module is detected (step S1). Here, the control unit 100 confirms whether the wafer BW1 can be sent into the coating module 60. Regarding whether it can be sent in, a corresponding signal is usually output to the control unit 100 from other control devices that control the substrate transport mechanism. The state of the coating module controlled by the control unit 100 as described above (e.g., the operating state of the nozzle, rotary chuck, and lifting pin) is also taken into consideration.

[0053] Next, it is determined whether the nozzle 80 of the coating module 60 meets the conditions for test spraying (step S2). The conditions for test spraying mentioned here include, in addition to the conditions for PJ pilot test spraying mentioned above, namely the initial substrate of the batch, the nozzle state, which is preset. The nozzle state is a necessary condition for test spraying determined based on, for example, whether a predetermined number of wafers have been coated with resist solution, and whether a predetermined time has elapsed since the last test spraying.

[0054] Next, after judging based on the nozzle status, when the conditions for test spraying are met, the nozzle 80 performs test spraying in the nozzle slot 84 (step S3).

[0055] Next, for multiple modules accessed by the same substrate transport mechanism in the same step, namely the coating processing unit 10 with coating module 30, it is checked whether there is a plan to send wafers of the same PJ, i.e., the same batch B, into the coating processing unit 10 (step S5). Then, if there is a plan, i.e., if there is a plan to send wafer BW2 into the coating module 30 of the coating processing unit 10, it is determined whether the nozzle state of the nozzle 40 responsible for liquid treatment in the coating module 30 meets the conditions for test spraying (step S6). Then, if the conditions are met, the nozzle 40 performs test spraying in the nozzle groove 44 (step S7).

[0056] In this manner, test spraying is performed on the common nozzles, namely nozzles 80 and 40, in each coating treatment unit 10 and 50 of the multi-module resist coating apparatus 1. Afterward, the wafers of batch B are sequentially subjected to the usual resist coating treatment.

[0057] Comparing the above processing order with the existing processing order yields... Figure 4 The timing diagrams shown are as follows: (a) represents the existing processing flow, and (b) represents the processing flow of the implementation method. Furthermore, in the diagrams, a represents coating module 20, b represents coating module 30, c represents coating module 60, d represents coating module 70, e represents the allocation state of nozzles 40 in coating modules 20 and 30, and f represents the allocation state of nozzles 80 in coating modules 60 and 70. The dotted portions indicate the normal release time of the resist solution. Additionally, "post-standby" refers to the standby state from the point where the resist coating process performed by the nozzles is completed and the wafer for which the coating process has been completed is sent out until the next wafer to be processed is fed in. "R1Dmy" indicates, for example, the state where the nozzle releasing resist solution R1 performs a test spray. Furthermore, "BathW" indicates the state where nozzles 40 and 80 are in standby mode within nozzle slots 44 and 84 after the test spray. The duration of “BathW” varies depending on various conditions, such as the absence of a coating module with a shared nozzle and the time required for coating processing. If the next processing can be performed, this duration may not be set.

[0058] Accordingly, in the prior art, in multi-module coating processing units, even when different nozzles are shared, there is no time period for simultaneous test spraying. This is because, for each coating module about to be fed into the wafer, the nozzle status of the nozzle responsible for releasing the resist solution in that coating module must be checked, and then a test spray is performed. Therefore, in the prior art, such as Figure 4As shown in (a), a wasted time "LOSS" occurs in the coating module 30 indicated by reference numeral b.

[0059] In contrast, in this embodiment, when it is decided to perform a PJ pilot test spray using the coating module 60, for coating modules 30 using different nozzles, it is checked in advance whether there is a plan to send in wafers BW2 of the same PJ, i.e., the same batch B. The timing is, for example, before the resist coating process is completed, in the coating module 30 (shown as reference numeral b) where the nozzle 40 can begin liquid treatment (coating process) on the next substrate (wafer). The state where liquid treatment can begin refers to a state where the functional parts of the liquid treatment module (coating module) such as nozzles, rotary chucks, and lifting pins required for liquid treatment (coating process) are not performing any liquid treatment-related actions (substrate treatment-related actions). Then, as shown in the aforementioned flowchart, if planned, the nozzle state of the nozzle 40 responsible for applying the resist liquid in the coating module 30 is checked, and the control unit 100 determines whether to perform a PJ pilot test spray in the same manner as the coating module 60. When it is determined that execution is required, after the necessary actions of the nozzle 40 during the coating process in the coating module 20 are completed, a test spray is immediately performed while the nozzle 40 is located in the nozzle slot 44, even if other remaining actions in the coating process have not been completed. As a result, for the different shared nozzles—nozzles 40 and 80—between coating processing units 10 and 50, their respective test sprays can be performed overlappingly. In addition, the other remaining actions in the above-mentioned coating process include, for example, adjusting the thickness of the coating liquid film, drying, and wafer feeding, which are performed by rotating the rotary chuck.

[0060] Therefore, comparison Figure 4 As shown in (a) and (b), the time for "LOSS" to occur in the prior art can be reduced, the wasted standby time can be eliminated, and productivity can be improved accordingly. That is, by determining whether test spraying can be performed earlier than in the prior art, the timing of test spraying can be made earlier than in the prior art, thereby shortening the time required for resist coating treatment of wafers in batches and thus improving productivity.

[0061] Furthermore, regarding the aforementioned control unit 100's determination of the nozzle state during test spraying, the determination can also consider the elapsed time of the nozzle 80's non-processing state. This elapsed time of the nozzle 80's non-processing state includes the time remaining until the predetermined time for the test spraying of the target nozzle. Based on Figure 4 The nozzle 80 will be described. The control unit 100 controls the wafer AW in the coating processing module 70. 24Before the coating process is completed, and before the coating process of wafer BW1 is performed using coating module 60 (before wafer BW1 is fed in), it is determined whether a pilot test spray of nozzle 80 is required. The test spray is performed when the wafer AW is being coated. 24 After the necessary actions of nozzle 80 related to the coating process are completed, therefore, when the wafer AW 24 When a long non-processing period occurs between the coating process of the first wafer and the subsequent coating process of the wafer BW1, a long delay also occurs in determining whether a test spray is needed. In this case, by performing a test spray only at the time corresponding to the coating process of the wafer BW1, the number of times it is performed can be reduced. In order to make a more appropriate determination based on the nozzle state during the processing of the wafer BW1, the determination of whether a test spray needs to be performed at this time can be based on the elapsed time of the non-processing period after adding the time from the time of determination to the time of execution.

[0062] Although the resist coating device 1 in the aforementioned embodiments is a multi-module type in which each of the coating processing units 10 and 50 has multiple coating modules 20, 30, 60, and 70, the present invention is not limited thereto and can also be applied to other resist coating devices.

[0063] For example, Figure 5 The resist coating apparatus 110 shown has a structure where each of the coating processing units 120 and 130 has only one coating module 121 and 131, respectively. Therefore, nozzle 122 is a dedicated nozzle for coating module 121, and nozzle 132 is a dedicated nozzle for coating module 131. In this case, since the resist coating apparatus 110 as a whole has multiple coating modules 121 and 131, the technology of the present invention can be applied.

[0064] That is, such as Figure 5 As shown, when the coating module 121 is used on the last wafer AW of batch A... L When applying the resist, the first wafer BW1 of the next batch B is applied using the coating module 131, and then the second wafer BW2 of the batch B is applied using the coating module 121.

[0065] In this situation, when nozzle 132, which applies resist to the first wafer BW1 of batch B, is in the PJ pilot spray state, the last wafer AW of batch A... LBefore the resist coating process in the coating module 121 is completed, a test spray is performed based on the nozzle state of the nozzle 132, allowing the test spray to be performed earlier than in the prior art. Similarly, for the nozzle 122, when it is determined that the resist coating process in the coating module 121 is complete and the second wafer BW2 of batch B is to be fed in, a test spray is immediately performed, thereby shortening the time required for resist coating of wafers in batches compared to the prior art and improving productivity.

[0066] In addition, this invention can also be applied to Figure 6 The resist coating device 140 shown is an example of this. Figure 6 The resist coating device 140 shown has the function of applying the resist to the surface. Figure 2 The coating processing unit 10 shown has two coating modules 20 and 30 and Figure 5 The diagram shows the structure of a coating processing unit 120 assembly having a coating module 121. The resist coating apparatus 140 of this structure generally has multiple coating modules.

[0067] In the resist coating apparatus 140 with this structure, when the coating module 20 coats the last wafer AW of batch A... L At that time, the coating module 121 is used to coat the first wafer BW1 of the next batch B. Then, the coating module 30 is used to coat the second wafer BW2 of the batch B, the coating module 20 is used to coat the third wafer BW3 of the batch B, and so on.

[0068] In this situation, when nozzle 122, which applies resist to the first wafer BW1 of batch B, is in the PJ pilot spray state, the last wafer AW of batch A... L Before the resist coating process in coating module 20 is completed, a test spray is performed based on the nozzle state of nozzle 122, allowing the test spray to be performed earlier than in the prior art. Similarly, for nozzle 40 used in coating module 30 to process the second wafer BW2 of batch B, when it is determined that the resist coating process in coating module 121 is complete and the second wafer BW2 of batch B is to be fed into coating module 30, a test spray is immediately performed based on the nozzle state of nozzle 40, thereby shortening the time required for resist coating of wafers per batch compared to the prior art and improving productivity.

[0069] Furthermore, the control unit 100 may not be limited to the above conditions and may make a decision on the execution of test spraying in advance. For example, when using... Figure 4In the description, it can also be configured such that the coating process module 20 shown in a begins the coating process for the last wafer AW of batch A. L During the coating process, the control unit 100 determines the execution of the test spray of nozzle 40 before determining the start time of the next batch B. As shown in the example above, when the control unit 100 decides that the first wafer BW1 of batch B will be processed by another coating process module using another nozzle 80, the execution of the test spray of nozzle 40 can be determined without any problems.

[0070] As another example, consider arranging them horizontally... Figure 2 , Figure 5 or Figure 6 The apparatus is a structure in which liquid processing module blocks, as shown, are stacked vertically. For nozzles contained within the same block as the liquid processing module used for liquid processing the first wafer in the batch, and not used in that liquid processing module, it is possible to use a device based on... Figure 3 The described process similarly determines and decides on the execution of the PJ pilot spray. In this case, the technology of the present invention is applicable.

[0071] The embodiments disclosed herein should be considered exemplary rather than restrictive in all respects. The above embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

Claims

1. A liquid treatment method for supplying a processing solution to a substrate for liquid treatment, characterized in that: When a test spray is performed on the first nozzle in the first coating module, before the second coating module reaches a state where liquid treatment can begin on the substrate that will be the next target for liquid treatment, a determination is made as to whether to perform a test spray on the second nozzle. Wherein, the first nozzle is a nozzle in the first coating module used to supply the processing liquid to the substrate for liquid treatment of the substrate, and the second nozzle is a nozzle in the second coating module used to supply the processing liquid to the substrate that is the next target for liquid treatment of the substrate for liquid treatment. The decision on whether to perform a test spray of the second nozzle is based on the nozzle state of the second nozzle at the time of the determination. The decision on whether to perform a test spray of the second nozzle is also based on the nozzle state of the second nozzle based on the elapsed time of the untreated state of the second nozzle, wherein the elapsed time of the untreated state of the second nozzle is the time from the moment of the decision until the predetermined moment of the execution of the test spray of the second nozzle.

2. The liquid treatment method as described in claim 1, characterized in that: In the first coating module, the substrate to which the processing liquid is supplied by the first nozzle for liquid treatment is the first substrate to be liquid treated among a plurality of substrates that are continuously liquid treated according to a predetermined processing plan.

3. The liquid treatment method as described in claim 1, characterized in that: Before the test spray of the first nozzle is completed, a decision is made as to whether to perform a test spray of the second nozzle.

4. The liquid treatment method according to any one of claims 1 to 3, characterized in that: The test spraying of the second nozzle begins after the second nozzle has been set to a state where it is not performing any substrate processing associated actions.

5. A liquid treatment apparatus for supplying a processing solution to a substrate for liquid treatment, characterized in that, include: A first coating module supplies the processing liquid to the substrate from a first nozzle for liquid treatment; The second coating module supplies the processing liquid to the substrate from the second nozzle for liquid treatment; and A control device that controls the first coating module and the second coating module. The control device is configured such that, when it is determined to perform a test spray of the first nozzle, before liquid treatment in the second coating module can begin, it determines and decides whether to perform a test spray of the second nozzle. The decision on whether to perform a test spray of the second nozzle is based on the nozzle state of the second nozzle at the time of the determination. The decision on whether to perform a test spray of the second nozzle is also based on the nozzle state of the second nozzle based on the elapsed time of the untreated state of the second nozzle, wherein the elapsed time of the untreated state of the second nozzle is the time after adding the predetermined execution time of the test spray of the first nozzle.

6. The liquid treatment apparatus as described in claim 5, characterized in that: In the first coating module, the substrate for liquid treatment, which is supplied with the processing liquid by the first nozzle, is the substrate that is liquid treated first according to the predetermined processing plan.

7. The liquid treatment apparatus as described in claim 5, characterized in that: Before the test spray of the first nozzle is completed, the control device decides whether to perform a test spray of the second nozzle.

8. The liquid treatment apparatus according to any one of claims 5 to 7, characterized in that: The test spraying of the second nozzle begins after the second nozzle has been set to a state where it is not performing any substrate processing associated actions.

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