socket

Abstract

The present application provides a socket capable of preventing crosstalk in high-speed differential transmission. The socket comprises: a housing in the shape of a box with an opening, a matrix with through holes in the bottom; a plurality of contact pieces including ground contact pieces and pairs of high-speed differential transmission contact pieces; a plurality of LCP components supporting the plurality of contact pieces, pressing the contact pieces out of the through holes of the housing to the side opposite the opening; and a plurality of conductive resin components fitted in the plurality of LCP components at positions in contact with the ground contact pieces. Thus, the pairs of high-speed differential transmission contact pieces are arranged separately in the row direction and the column direction of the matrix, and the ground contact pieces are arranged at positions adjacent in the row direction and the column direction of each pair of high-speed differential transmission contact pieces, surrounding the pair.

Description

TECHNICAL FIELD

[0001] The present application relates to a socket for high-speed transmission mounted on a circuit board. BACKGROUND

[0002] In an LGA (Land grid array) package, there are those which are not directly mounted on a circuit board by themselves, but are mounted on a circuit board via a dedicated socket. As a document which discloses a technology related to such an LGA package socket, there is Patent Literature 1. For the socket for electronic components disclosed in Patent Literature 1, a housing bottom is made of a metal plate having a plurality of through holes, signal contact pieces and ground contact pieces arranged in a lattice are inserted through the through holes of the metal plate, and the contact pieces are fixed to the housing. In this socket for electronic components, a first protruding piece protrudes from an inner wall of the through hole of the metal plate to an inner side, and a front end of the first protruding piece is in contact with and conducts the ground contact piece. Thus, the metal plate functions as a ground, and the shielding performance for the signal contact pieces is improved by the ground contact piece metal plate shielding against electrical reflection noise or congestion delay.

[0003]

Patent Literature 1

[0004] However, in an LGA package, there are those which perform high-speed differential (differential speed) transmission at a transmission rate of 112 Gbps. The technology of Patent Literature 1 cannot sufficiently prevent crosstalk generated in such high-speed differential transmission. SUMMARY

[0005] The present application has been achieved in view of such a problem, and an object thereof is to provide a socket capable of preventing crosstalk generated in high-speed differential transmission.

[0006] To solve the above problem, a socket according to a preferred embodiment of the present application is characterized by including: a housing which is in a box shape having an opening, and which has a matrix of through holes provided in a bottom portion; a plurality of contact pieces including ground contact pieces and pairs of high-speed differential transmission contact pieces; a plurality of insulating members which support the plurality of contact pieces so that the contact pieces are exposed from the through holes of the housing to an opposite side to the opening, and which are pressed into the housing; and a plurality of conductive resin members which are fitted in positions of the plurality of insulating members in contact with the ground contact pieces, the pairs of high-speed differential transmission contact pieces being arranged separately in a row direction and a column direction of the matrix, and the ground contact pieces being arranged at positions adjacent in the row direction and the column direction of each of the pairs of high-speed differential transmission contact pieces so as to surround the pairs.

[0007] In this embodiment, the insulating members can be LCP.

[0008] Furthermore, the conductive resin member may have a conductivity of 5 S / m to 1000 S / m.

[0009] Alternatively, the plurality of conductive resin members that are in contact with the plurality of ground contact pieces surrounding the respective pairs of high-speed differential transmission contact pieces may be in contact with each other.

[0010] Alternatively, the shell may have two pairs of side wall portions opposite to each other with the opening clamped therebetween, and grooves may be provided on both sides of each column of the through holes in a pair of side wall portions, and components formed by inserting the insulating component and the conductive resin component into the plurality of contact pieces as assemblies corresponding to each column, and the insulating component of each column assembly may be pressed into the grooves.

[0011] Alternatively, the high-speed differential transmission contact piece may pass through a portion of the insulating member not fitted with the conductive resin member and be supported by the portion, and the grounding contact piece may pass through a portion of the insulating member fitted with the conductive resin member and be supported by the portion.

[0012] Alternatively, the insulating component may be in the shape of a rectangular parallelepiped and have a plurality of recesses separated in the row direction, the conductive resin component may be the same as the recesses and have a width in the column direction, and the conductive resin component may be fitted into the recesses of the insulating component.

[0013] Alternatively, the width of the conductive resin component in the column direction may be greater than the width of the insulating component in the column direction, a protrusion may be provided on the front surface of the conductive resin component, and the rear surface of the conductive resin component on the front side in the column direction may abut against the protrusion of the conductive resin component on the rear side in the column direction.

[0014] Furthermore, at the position of the conductive resin member on the front side in the column direction and at the position of the conductive resin member on the rear side in the column direction, the contact pieces may be staggered in the row direction by three.

[0015] Alternatively, the contact piece may have: a base extending in a straight line; a solder connection portion bent in an "L" shape at the lower end of the base; and an inclined portion extending at an obtuse angle relative to the base at the upper end of the base, wherein a solder ball is fixed to the solder connection portion.

[0016] Furthermore, the base portion of the contact piece may protrude from the through hole and extend downward, and the solder connection portion and the solder ball may be exposed toward the bottom side of the bottom portion.

[0017] Furthermore, a tapered surface inclined toward one side of the inclined portion may be provided at a corner where the front surface and the upper surface intersect, and at a corner where the rear surface and the lower surface intersect, of the conductive resin member.

[0018] The present invention comprises: a housing in the shape of a box with an opening and a matrix of through-holes formed in the bottom; a plurality of contact pieces, including grounding contact pieces and pairs of high-speed differential transmission contact pieces; a plurality of insulating members that support the plurality of contact pieces so that the contact pieces are exposed from the through-holes of the housing toward the side opposite the openings and are pressed into the housing; and a plurality of conductive resin members that are fitted into positions of the insulating members that contact the grounding contact pieces. The pairs of high-speed differential transmission contact pieces are spaced apart in the row and column directions of the matrix, and the grounding contact pieces are disposed adjacent to each pair of high-speed differential transmission contact pieces in the row direction and adjacent to each pair in the column direction, surrounding the pair. Therefore, the generation of crosstalk during high-speed differential transmission can be reliably prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a perspective view of the socket 1 and the cover 8 according to one embodiment of the present invention.

[0020] Figure 2 It means in Figure 1 FIG. 1 is a diagram showing a state where a cover 8 is installed on the socket 1.

[0021] Figure 3 Middle (A) is observed from other angles Figure 1 (B) is a perspective view of the socket 1, and (A) is a partial enlarged view of (B).

[0022] Figure 4 Middle (A) is viewed from the +Z side Figure 1 1, (B) is a diagram showing the arrangement of the contact pieces 7 in (A).

[0023] Figure 5 It is from Figure 4 (A) A diagram after removing the contact sheet 7.

[0024] Figure 6 (A) is Figure 1 (B) is a perspective view of the contact piece 7 of the socket 1, and (A) is a perspective view of the contact piece 7 with the solder ball 70 mounted on the contact piece 7.

[0025] Figure 7 Middle (A) is viewed from the -Y direction Figure 1(A) is a diagram of the assemblies 3-1, 3-3, 3-5, 3-7, 3-9 and 3-11 of the 1st, 3rd, 5th, 7th, 9th and 11th columns in the socket 1, (B) is a diagram of the assemblies 3-2, 3-4, 3-6, 3-8, 3-10 and 3-12 of the 2nd, 4th, 6th, 8th, 10th and 12th columns observed from the -Y direction, and (C) is a diagram of the assemblies 3-12 and 3-13 of the 12th and 13th columns observed from the -Y direction.

[0026] Figure 8 Observed from the -X direction Figure 4 A diagram of a cross-section parallel to the XZ plane in the assembly 3-j (j=1 to 13).

[0027] Figure 9 yes Figure 1 A partial enlarged view of socket 1.

[0028] Figure 10 It means to Figure 1 FIG. 1 is a diagram showing the order of installing the housing 10 of the socket 1 to the assembly 3 - j (j=1 to 13).

[0029] Figure 11 Yes Figure 1 FIG. 1 is a diagram showing a state where the socket 1 is mounted on a circuit board 100 .

[0030] Figure 12 (A) is a perspective view of an IC package 9 according to an embodiment of the present invention, and (B) is a perspective view of the IC package 9 shown in (A) from another angle.

[0031] Figure 13 yes Figure 12 (A) is an exploded perspective view of an IC package 9 and a remover 90 .

[0032] Figure 14 It means to Figure 11 (B) is a diagram showing a state where the socket 1 on the circuit board 100 is fitted with the IC package 9 .

[0033] Figure 15 It will Figure 13 (A) is a diagram showing the contraction of the coil spring 94 when the IC package 9 is fitted into the socket 1 .

[0034] Figure 16 It will Figure 13 (A) is a diagram showing the contraction of the coil spring 94 when the IC package 9 is removed from the socket 1 .

[0035]

Explanation of symbols

[0036] 1 socket; 1A socket; 3'-1 assembly; 3'-8 assembly; 3-1 assembly; 3-2 assembly; 3-3 assembly; 3-4 assembly; 3-5 assembly; 3-6 assembly; 3-7 assembly; 3-8 assembly; 3-9 assembly; 3A assembly; 3B assembly; 3-j assembly; 7 contact piece; 7C contact piece; 8 cover; 9 package; 10 housing; 11 side wall portion; 12 side wall portion; 13 bottom portion; 17 anchor bolt; 17-i through hole; 17-i-j through hole; 19-1 groove; 19-8 groove; 19-j groove; 20 bracket; 22a protrusion; 22b protrusion; 22c protrusion; 22d protrusion; 22e protrusion; 23 protrusion; 40 member; 40A insulating member; 41 member; 50 insulating member; 60 conductive resin member; 60B conductive resin member; 60B conductive resin member; 63 tapered surface; 64 tapered surface; 69 insulating reinforcing member; 70 solder ball; 71 base portion; 72 connecting portion; 73 inclined portion; 74 contact portion; 75 notch; 83 rod; 88 cover; 90 ejector; 92 first mechanical board; 93 locking board; 95 mechanical board; 96 printed board; 100 circuit board; 110 opening; 120 rib; 122a housing land; 122a' through hole; 122b housing land; 122c housing land; 122d housing land; 122e housing land; 170 contact piece land; 230 support hole; 237 positioning pin; 41 recess; 51 recess; 612 protrusion; 830 protrusion; 831 protruding piece; 832 tapered surface; 835 gap; 920 round hole; 921 rectangular hole; 923 rectangular hole; 931 protruding piece; 932 tapered surface; 933 rectangular hole; 990 package. DETAILED DESCRIPTION

[0037] One embodiment of the socket 1 will be described below with reference to the drawings. The socket 1 is mounted on a circuit board 100, and an IC package 9 is fitted thereto at an opening 110 on the side opposite the mounting surface. The IC package 9 is an optical transceiver. The IC package 9 performs high-speed differential (differential speed) transmission of up to 112 Gbps based on PAM (Pulse Amplitude Modulation).

[0038] In the following description, the direction in which the IC package 9 is fitted to the socket 1 will be referred to as the Z direction, one direction orthogonal to the Z direction will be referred to as the X direction, and a direction orthogonal to both the Z direction and the X direction will be referred to as the Y direction. In addition, the side on which the opening 110 of the socket 1 is open in the Z direction will be referred to as the upper side, and the side opposite the upper side will be referred to as the lower side.

[0039] As shown in FIG. 1, Figure 1 , Figure 3 (A) of FIG. 1, Figure 4 (A) of FIG. 1, Figure 7 (A) of FIG. 1, Figure 7 (B) Figure 7 (C) and Figure 8 As shown, the socket 1 includes a housing 10, a bracket 20, contact pieces 7, insulating components 40 and 50, a conductive resin component 60, and an insulating reinforcement component 69. The housing 10 is box-shaped with an opening 110. The housing 10 includes a bottom 13, which serves as the bottom of the opening 110, and two pairs of side walls 11 and 12, which face each other in the X and Y directions, sandwiching the opening 110. The insulating components 40 and 50 and the insulating reinforcement component 69 are made of LCP (Liquid Crystal Polymer). The conductive resin component 60 is made of a conductive resin with a conductivity ranging from 20 S / m to 200 S / m.

[0040] On the bottom 13, there is a matrix of through holes 17-i (i=1 to 22)-j (j=1 to 13) with 22 rows and 13 columns. Figure 5 as well as Figure 9 As shown, grooves 19-j (j=1-13) are provided on both sides of the through holes 17-i (i=1-22)-j (j=1-13) in the matrix row direction in the inner surface of the side wall portion 11 facing the X direction.

[0041] Eight ribs 120a, 120b, 120c, 120d, 120e, 120f, 120g, and 120h are provided on each side of the two sidewalls 11 facing each other in the X direction. The cross-sections of the ribs 120a, 120b, 120c, 120d, 120e, 120f, 120g, and 120h are perfectly circular. The eight ribs 120a, 120b, 120c, 120d, 120e, 120f, 120g, and 120h on the ±X sidewalls 11 are welded to the eight support holes of the ±X side brackets 20.

[0042] The portions directly below the eight support holes at the lower end of the bracket 20 extend downward as protrusions 22a, 22b, 22c, 22d, 22e, 22f, 22g, and 22h. The protrusions 22a, 22b, 22c, 22d, 22e, 22f, 22g, and 22h of the bracket 20 on the +X side are bent toward the +X side, which is the outer side, at the lower side of the lower end of the housing 10. The protrusions 22a, 22b, 22c, 22d, 22e, 22f, 22g, and 22h of the bracket 20 on the -X side are bent toward the -X side, which is the outer side, at the lower side of the lower end of the housing 10. The lower surfaces of these bent portions form the mounting surfaces to be soldered to the circuit board 100.

[0043] The portions of the upper end of the bracket 20 separated on the +Y side and the -Y side as protrusions 23 extend further up than the upper end of the case 10. At the protrusions 23, rectangular support holes 230 are provided. At the support holes 230, the protruding pieces 831 of the cover 88 and the protruding pieces 931 of the IC package 9 are fitted. Details will be described later.

[0044] As shown in (B) of FIG. 6, Figure 1 As shown in (A) of FIG. 6, and Figure 4 As shown in (A) of FIG. 6, and Figure 5 As shown in (A) of FIG. 6, and

[0045] As shown in (A) of FIG. 6, and Figure 6 As shown in (A) of FIG. 6, and

[0046] Here, the contact pieces 7 include those for high-speed differential transmission of - signals, those for high-speed differential transmission of + signals, those for ground, and those for low-speed signal transmission. In the following description, the contact pieces 7 for high-speed differential transmission of - signals are labeled with the letter (N), the contact pieces 7 for high-speed differential transmission of + signals are labeled with the letter (P), the contact pieces 7 for ground are labeled with the letter (G), and the contact pieces 7 for low-speed signals are labeled with the letter (S), as appropriate, to distinguish them.

[0047] The contact pieces 7 are arranged in a matrix corresponding to the through holes 17-i (i = 1 to 22) -j (j = 1 to 13). The contact pieces 7 are juxtaposed at intervals of 0.65 mm. Among the contact pieces 7 forming each column, the insulating members 40 or 50 and the conductive resin members 60 or the insulating reinforcing members 69 are inserted.

[0048] The components formed by integrating the contact pieces 7, the insulating components 40 and the conductive resin components 60 of the 1st, 3rd, 5th, 7th, 9th and 11th columns become the assemblies 3-1, 3-3, 3-5, 3-7, 3-9 and 3-11 of the 1st, 3rd, 5th, 7th, 9th and 11th columns. The components formed by integrating the contact pieces 7, the insulating components 50 and the conductive resin components 60 of the 2nd, 4th, 6th, 8th and 10th columns become the assemblies 3-2, 3-4, 3-6, 3-8 and 3-10 of the 2nd, 4th, 6th, 8th and 10th columns. The components formed by integrating the contact pieces 7, the insulating components 40 and the insulating reinforcement components 69 of the 12th and 13th columns become the assemblies 3-12 and 3-13 of the 12th and 13th columns.

[0049] Thus, the insulating components 40 and 50 of the assembly expose the solder connection portion 72 of the contact piece 7 from the through-hole 17-i (i=1 to 22)-j (j=1 to 13) of the housing 10 to the side opposite to the opening 110 and are pressed into the groove 19-j (j=1 to 13) of the housing 10.

[0050] In more detail, Figure 4 As shown in (B), the contact pads 7 (N) and contact pads 7 (P) in each pair of columns 1 to 7 are separated in the row and column directions. Contact pads 7 (G) are arranged at adjacent positions in the column direction and adjacent positions in the row direction of each pair of contact pads 7 (N) and contact pads 7 (P), respectively, surrounding the pair.

[0051] like Figure 7 (A) and Figure 7 As shown in FIG. 1 (C), the insulating members 40 of the assemblies 3-1, 3-3, 3-5, 3-7, 3-9, 3-11, 3-12, and 3-13 in the 1st, 3rd, 5th, 7th, 9th, 11th, 12th, and 13th columns are rod-shaped and extend in the X direction. The insulating members 40 are recessed downward as recessed portions 41 at positions corresponding to the 1st to 4th rows, positions corresponding to the 7th to 10th rows, and positions corresponding to the 13th to 16th rows.

[0052] like Figure 7 As shown in (B), the insulating members 50 of the assemblies 3-2, 3-4, 3-6, 3-8, and 3-10 in the second, fourth, sixth, eighth, and tenth columns are rectangular parallelepiped-shaped and have the same width in the X direction as the insulating member 40. The insulating members 50 are recessed downward as recesses 51 at positions corresponding to the first row, positions corresponding to the fourth to seventh rows, positions corresponding to the tenth to thirteenth rows, and a position corresponding to the sixteenth row.

[0053] like Figure 7 (A) and Figure 7 As shown in (B), the conductive resin member 60 is fitted into the recess 41 of the insulating member 40 of the assemblies 3-1, 3-3, 3-5, 3-7, 3-9 and 3-11 and the recess 51 of the insulating member 50 of the assemblies 3-2, 3-4, 3-6, 3-8 and 3-10. Figure 7 As shown in (C), the insulating reinforcement member 69 is fitted into the recess 41 of the insulating member 40 of the assemblies 3-12 and 3-13. Figure 5 As shown, the position of the conductive resin member 60 on the front side in the column direction and the position of the conductive resin member 60 on the rear side in the column direction are shifted by three contact pieces in the row direction.

[0054] like Figure 5 as well as Figure 8 As shown, the conductive resin member 60 is substantially U-shaped, having the same width in the X direction as the recessed portions 41 and 51 of the insulating members 40 and 50, and a greater width in the Y direction than the insulating members 40 and 50. On the front surface of the conductive resin member 60, slightly inward of both ends in the Y direction, there is a protrusion 612 that protrudes toward the -Y side.

[0055] The corners where the front and upper surfaces of the conductive resin member 60 intersect, as well as the corners where the rear and lower surfaces intersect, are notched. Tapered surfaces 63 and 64 are provided on one side of the inclined portion 73 of the contact piece 7 and are inclined substantially parallel to the inclined portion 73. The insulating reinforcement member 69 has the same shape as the conductive resin member 60.

[0056] like Figure 7 As shown in (A), the bases 71 of the 5th row of contact pieces 7 (N), the 6th row of contact pieces 7 (P), the 11th row of contact pieces 7 (N), the 12th row of contact pieces 7 (P), the 17th row of contact pieces 7 (N) and the 18th row of contact pieces 7 (P) of the assemblies 3-1, 3-3, 3-5, 3-7, 3-9 and 3-11 pass through the portion of the insulating component 40 where the conductive resin component 60 is not embedded, and each base 71 is supported by the pass-through portion.

[0057] Furthermore, the contact pieces 7 (G) in the 1st to 4th, 7th to 10th, 13th to 16th, and 19th to 22nd rows of assemblies 3-1, 3-3, 3-5, 3-7, 3-9, and 3-11 penetrate the portion of the insulating member 40 where the conductive resin member 60 is fitted, and the respective bases 71 are supported by these penetrated portions. The conductive resin member 60 is in contact with the contact pieces 7 (G) and not in contact with the contact pieces 7 (N) or 7 (P).

[0058] like Figure 7As shown in (B), the bases 71 of the second row of contact pieces 7 (N), the third row of contact pieces 7 (P), the eighth row of contact pieces 7 (N), the ninth row of contact pieces 7 (P), the fourteenth row of contact pieces 7 (N), the fifteenth row of contact pieces 7 (P), the twentieth row of contact pieces 7 (N) and the twenty-first row of contact pieces 7 (P) of the assemblies 3-2, 3-4, 3-6, 3-8 and 3-10 pass through the portion of the insulating component 50 in which the conductive resin component 60 is not fitted, and each base 71 is supported by the passed-through portion.

[0059] Furthermore, the contact pieces 7 (G) in the first, fourth to seventh, tenth to thirteenth, sixteenth to nineteenth, and twenty-second rows of assemblies 3-2, 3-4, 3-6, 3-8, and 3-10 penetrate the portion of the insulating member 50 where the conductive resin member 60 is fitted, and the respective bases 71 are supported by the penetrated portions. The conductive resin member 60 is in contact with the contact pieces 7 (G) but not with the contact pieces 7 (N) or 7 (P).

[0060] like Figure 7 As shown in (C), the bases 71 of the 5th row of contact pieces 7(S), the 6th row of contact pieces 7(S), the 11th row of contact pieces 7(S), the 12th row of contact pieces 7(S), the 17th row of contact pieces 7(N) and the 18th row of contact pieces 7(P) of the assemblies 3-12 and 3-13 pass through the portion of the insulating component 40 in which the insulating reinforcement component 69 is not engaged, and each base 71 is supported by the passing portion.

[0061] The contact pieces 7 (G) of the 1st to 4th, 7th to 10th, 13th to 16th, and 19th to 22nd rows of the assemblies 3-12 and 3-13 penetrate the portion of the insulating member 40 where the insulating reinforcement member 69 is fitted, and the respective bases 71 are supported by the penetrated portions.

[0062] like Figure 7 (A) and Figure 7 As shown in (B), the protrusions 612 of the conductive resin member 60 are located on the -Y side of the contact pieces 7 (S) in the 1st, 4th, 7th, 10th, 13th and 16th rows. Figure 8 As shown, the rear surface of the conductive resin member 60 on the front side in the column direction abuts against the protrusion 612 of the conductive resin member 60 on the rear side in the column direction. Therefore, the plurality of conductive resin members 60 that are in contact with the plurality of grounding contact pieces 7(G) surrounding each pair of contact pieces 7(N) and contact piece 7(P) are in contact with each other, and these plurality of conductive resin members 60 are electrically connected.

[0063] Here, in the assembly step of the socket 1, the assembly 3-j is pressed into the housing 10 in order starting from the 13th column. Figure 10As shown in (A), both ends of the assembly 3'-13 with the contact piece 7 fixed to the anchor bolt 17 are pressed into the groove 19-13 of the 13th column of the housing 10. Figure 10 As shown in (B), the anchor bolt 17 of the assembly 3'-13 is bent and removed, and the assembly 3-13 of the 13th row is obtained.

[0064] In the same manner, the assemblies 3-12, 3-11, 3-10, 3-9, 3-8, 3-7, 3-6, 3-5, 3-4, 3-3 and 3-2 of the 12th, 11th, 10th, 9th, 8th, 7th, 6th, 5th, 4th, 3rd and 2nd columns are pressed into the housing 10. Finally, as Figure 10 As shown in (C), both ends of the assembly 3'-1 with the anchor bolts 17 fixed to the contact piece 7 are pressed into the grooves 19-1 of the first row, and the anchor bolts 17 of the assembly 3'-1 are bent and removed to obtain the first row assembly 3-1.

[0065] like Figure 6 As shown in (B), a solder ball 70 is fixed to the solder connection portion 72 of the contact piece 7. Figure 3 As shown in FIG. 1B , the contact piece 7 passes through the through hole 17 - ij of the bottom 13 of the housing 10 and extends downward. The solder connection portion 72 and the solder ball 70 of the contact piece 7 are exposed below the lower surface of the bottom 13 .

[0066] like Figure 1 As shown, the cover 8 has a generally rectangular parallelepiped shape. A rod 83 is provided at the center of the Y direction on the ±X side surfaces of the cover 8. A rectangular parallelepiped convex portion 830 is located at the upper center of the outer surface of the rod 83. Furthermore, generally triangular prism-shaped protrusions 831 are located at locations on the outer surface of the rod 83, separated toward the +Y and -Y sides.

[0067] The outer ends of the protrusion 830 and the protruding piece 831 protrude further outward than the ±X side surfaces of the cover 8. Furthermore, positioning grooves (not shown) are provided at positions near the +X side of one corner of the lower surface of the cover 8 and at positions separated from this position toward the +X side and the +Y side.

[0068] When the cover 8 is inserted and pressed between the protrusion 23 on the -X side and the protrusion 23 on the +X side from the opening 110 of the socket 1, the protrusion 23 slides on the tapered surface 832 of the protrusion piece 831 and pushes the protrusion piece 831 at the same time, and the rod 83 falls inward while flattening the gap 835 on the inside.

[0069] When cover 8 is pressed further, its protruding piece 831 engages with the support hole 230 of socket 1, and rod 83 returns to its original position due to its own restoring force. The three positioning pins 237 of socket 1 engage with the three positioning grooves of cover 8, and cover 8 is supported by bracket 20 of socket 1. Thus, the cover 8 is mounted on socket 1. Alternatively, by tilting rod 83 of cover 8 inward, releasing the engagement between protruding piece 831 and support hole 230, and lifting upward, cover 8 can be removed from socket 1.

[0070] like Figure 11 As shown, the socket 1 is placed on the circuit board 100 while the cover 8 is mounted, and reflow is performed. In addition to the contact pads 170 for soldering the contact pads 7, the circuit board 100 may also include housing pads 122a, 122b, 122c, 122d, 122e, 122f, 122g, and 122h for soldering the protrusions 22a, 22b, 22c, 22d, 22e, 22f, 22g, and 22h of the housing 10.

[0071] like Figure 12 (A) and Figure 12 As shown in (B), the IC package 9 is in a substantially rectangular parallelepiped shape having the same size as the cover 8. Figure 13 As shown, IC package 9 includes screws 91, a first mechanical plate 92, two locking plates 93, two coil springs 94, a second mechanical plate 95, and a printed board 96. The first mechanical plate 92 functions as a frame that holds the locking plates 93, coil springs 94, the second mechanical plate 95, and the printed board 96.

[0072] The first mechanical plate 92 is box-shaped with an open bottom. A circular hole 920 is centrally located on the top plate of the first mechanical plate 92, and rectangular holes 923 are located on the +X and -X sides of the circular hole 920. Rectangular holes 921 are located at locations separating the +Y and -Y sides of the side plates of the first mechanical plate 92.

[0073] A rectangular hole 933 is provided in the center of the +X-side locking plate 93. The inner wall surface of the rectangular hole 933 on the -X side of the +X-side locking plate 93 is inclined toward the +X side relative to the Z direction. A roughly triangular prism-shaped protrusion 931 is provided on the +X-side outer surface of the +X-side locking plate 93, at locations separated from the +Y and -Y sides. An upwardly recessed groove 934 is provided at each location on the lower surface of the +X-side locking plate 93, separated from the +Y and -Y sides. This groove 934 is open on the +X side and closed on the -X side. The -X-side locking plate 93 has a mirror-symmetrical structure with the +X-side locking plate 93.

[0074] A screw seat 958 is provided in the center of the second mechanical plate 95. A screw hole 950 is provided in the screw seat 958. A positioning groove 957 is provided near the +X side of a corner of the second mechanical plate 95 and at a position separated from this position toward the +X and +Y sides. A positioning groove 967 is provided near the +X side of a corner of the printed board 96 and at a position separated from this position toward the +X and +Y sides.

[0075] The second mechanical plate 95 and printed board 96 are aligned with the positioning grooves 957 and 967. Two locking plates 93 on the +X and -X sides and coil springs 94 housed in these grooves 934 are placed around the screw seats 958 on the second mechanical plate 95, and the first mechanical plate 92 covers these components.

[0076] The rectangular hole 933 of the locking plate 93 is located below the rectangular hole 923 of the first mechanical plate 92. The screw 91 passes through the circular hole 920 of the locking plate 93 and screws into the screw hole 950 of the second mechanical plate 95. The locking plates 93 on the +X side and the locking plates 93 on the -X side are biased outward by the coil spring 94, which serves as an elastic body in the grooves 934 between them.

[0077] The outer surface of the +X-side locking plate 93 abuts the inner surface of the +X-side side plate of the first mechanical plate 92. A protruding piece 931 of the +X-side locking plate 93 is supported in a retractable manner by a rectangular hole 921 in the +X-side side plate of the first mechanical plate 92. The protruding piece 931 protrudes from the rectangular hole 921 toward the +X side.

[0078] The outer surface of the -X-side locking plate 93 abuts the inner surface of the -X-side side plate of the first mechanical plate 92. The protruding piece 931 of the -X-side locking plate 93 is supported in a retractable manner by the rectangular hole 921 of the -X-side side plate of the first mechanical plate 92. The protruding piece 931 protrudes from the rectangular hole 921 toward the -X side.

[0079] like Figure 15 As shown, when the IC package 9 is inserted and pressed between the protrusion 23 on the -X side and the protrusion 23 on the +X side from the opening 110 of the socket 1, the protrusion 23 slides on the tapered surface 932 of the protrusion piece 931 of the IC package 9 while pushing the protrusion piece 931. The protrusion piece 931 resists the force of the coil spring 94 and retreats to the inside.

[0080] When IC package 9 is further pressed, protruding piece 931 of IC package 9 engages with supporting hole 230 of socket 1, and three positioning pins 237 of socket 1 engage with three positioning grooves 957 and 967 of IC package 9, thereby supporting IC package 9 on bracket 20 of socket 1. Thus, IC package 9 is mounted on socket 1.

[0081] like Figure 16As shown, when the two-pronged portion of the ejector 90 is inserted and pressed into the rectangular hole 933 of the locking plate 93 of the IC package 9, the ejector 90 slides on the inner wall of the rectangular hole 933 of the locking plate 93 of the ejector 90, pushing the locking plate 93. The locking plate 93 then retreats inward against the force of the coil spring 94. In this state, the IC package 9 can be removed from the socket 1 by lifting it.

[0082] The above details are for this embodiment. The socket 1 of this embodiment includes: a housing 10 in a box-like shape with an opening 110, and a matrix of through-holes 17-i (i=1-22)-j (j=1-13) formed in a bottom 13; a plurality of contact pieces 7, including pairs of high-speed differential transmission contact pieces 7(N) and 7(P) and a grounding contact piece 7(G); a plurality of insulating members 40 and 50 supporting the plurality of contact pieces 7, such that the contact pieces 7 are exposed through the through-holes 17-i (i=1-22)-j (j=1-13) of the housing 10 to the side opposite the opening 110 and are then press-fitted into the housing 10; and a plurality of conductive resin members 60, which are fitted into the insulating members 40 and 50 at locations where they contact the grounding contact pieces 7(G). Thus, each pair of high-speed differential transmission contact pads 7(N) and 7(P) is separated in the row and column directions of the matrix, and the ground contact pads 7(G) are placed adjacent to each pair of high-speed differential transmission contact pads 7(N) and 7(P) in the row and column directions, surrounding the pair. This reliably prevents the generation of crosstalk during high-speed differential transmission caused by the contact pads 7(N) and 7(P).

[0083] The socket 1 of this embodiment includes: a bottom portion 13, which serves as the bottom of an opening 110 for accommodating the IC package 9 and is provided with a plurality of through holes 17-i (i=1 to 22)-j (j=1 to 13); a housing 10, which has two pairs of side walls 11 and 12 facing each other with the opening 110 interposed therebetween, and a plurality of ribs 120a, 120b, 120c, 120d, 120e, 120f protruding outward on the pair of side walls 12. 0f, 120g, and 120h; multiple contact pieces 7, exposed on the side opposite the opening 110 through multiple through-holes 17-i (i=1 to 22)-j (j=1 to 13), supported on the housing 10; and a bracket 20 having multiple support holes through which ribs 120a, 120b, 120c, 120d, 120e, 120f, 120g, and 120h are passed and secured to the side of the housing 10. Consequently, a portion of the lower end of the bracket 20 extends below the lower end of the housing 10 and bends outward. This bent portion forms the mounting surface for soldering to the substrate 100. Thus, even if the solder melts during reflow, the socket 1 is held on the substrate 100 by the lower end of the bracket 20, preventing the solder from moving up and down and causing the contact pieces 7 to sink. Consequently, a socket 1 with high positioning accuracy for the contact pieces 7 is provided.

[0084] As mentioned above, although embodiment of this invention was demonstrated, the following deformation|transformation can also be added to this embodiment.

[0085] (1) In the above embodiment, the through holes 17-ij and the contact pieces 7 of the socket 1 are arranged in 22 rows and 13 columns. However, the number of rows of through holes 17-ij and the contact pieces 7 may be greater or less than 22. Also, the number of columns of through holes 17-ij and the contact pieces 7 may be greater or less than 13.

[0086] (2) In the above embodiment, the number of support holes and protrusions 22a, 22b, 22c, 22d, 22e, 22f, 22g, and 22h on the +Y side and -Y side of the lower end of the bracket 20 may be 2 to 7, or may be 9 or more.

[0087] (3) In the above embodiment, the conductivity of the conductive resin member 60 may be in a range other than 20 S / m to 200 S / m. The conductivity of the conductive resin member 60 may be in a range of 5 S / m to 1000 S / m.

[0088] (4) In the above embodiment, the plurality of conductive resin members 60 that are in contact with the plurality of grounding contact pieces 7 (G) surrounding each pair of contact pieces 7 (N) and contact piece 7 (P) may be separated from each other without being in contact.

Claims

1. A socket, characterized in that: have: The housing is in the shape of a box with an opening and a matrix of through holes provided at the bottom; a plurality of contact pieces, including a grounding contact piece and pairs of high-speed differential transmission contact pieces, wherein the high-speed differential transmission contact pieces are adjacently arranged in the same column direction of the matrix; a plurality of insulating members supporting the plurality of contact pieces so that the contact pieces are exposed from the through-holes of the housing to the side opposite to the opening and are pressed into the housing; as well as a plurality of conductive resin members fitted into positions of the plurality of insulating members in contact with the grounding contact pieces; The pairs of high-speed differential transmission contact pads are separated from each other in the row direction and the column direction of the matrix. The grounding contact pieces are respectively arranged at adjacent positions in the row direction and adjacent positions in the column direction of each pair of the high-speed differential transmission contact pieces, surrounding the pair. a plurality of conductive resin members contacting the plurality of grounding contact pieces surrounding the respective pairs of the high-speed differential transmission contact pieces, and The high-speed differential transmission contact piece passes through a portion of the insulating member where the conductive resin member is not fitted and is supported by the portion. The grounding contact piece passes through a portion of the insulating member into which the conductive resin member is fitted and is supported by the portion. The width of the conductive resin member in the column direction is greater than the width of the insulating member in the column direction. A convex portion is provided on the front surface of the conductive resin member, The rear surface of the conductive resin member on the front side in the column direction and the convex portion of the conductive resin member on the rear side in the column direction abut against each other.

2. The socket according to claim 1, wherein: The insulating component is LCP.

3. The socket according to claim 1, wherein: The conductivity of the conductive resin member is 5 S / m to 1000 S / m.

4. The socket according to claim 1, wherein: The housing has two pairs of side walls sandwiching the opening, and grooves are provided on both sides of each row of through holes in the pair of side walls. The insulating member and the conductive resin member are inserted into the plurality of contact pieces as assemblies corresponding to the respective columns, and the insulating member of the assemblies in each column is press-fitted into the groove.

5. The socket according to claim 1, wherein: The insulating member is in a rectangular parallelepiped shape and has a plurality of recessed portions separated in the row direction. The conductive resin member has the same shape as the recess and has a width in the column direction. The conductive resin member is fitted into the recessed portion of the insulating member.

6. The socket according to claim 1, wherein: At the position of the conductive resin member on the front side in the column direction and at the position of the conductive resin member on the rear side in the column direction, the contact pieces are staggered by three in the row direction.

7. The socket according to any one of claims 1 to 6, characterized in that: The contact piece has: a base extending in a straight line; a solder connection portion bent in an "L" shape at the lower end of the base; and an inclined portion extending at an obtuse angle relative to the base at the upper end of the base. A solder ball is fixed to the solder connection portion.

8. The socket according to claim 7, characterized in that The base portion of the contact piece protrudes from the through hole and extends downward, and the solder connection portion and the solder ball are exposed on the lower side of the bottom portion.

9. The socket according to claim 7, characterized in that A tapered surface inclined toward one side of the inclined portion is provided at a corner where the front surface and the upper surface intersect, and at a corner where the rear surface and the lower surface intersect, of the conductive resin member.

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