Adhesive sheet attaching method, adhesive sheet attaching apparatus, and method for manufacturing semiconductor product

Abstract

The present application provides a dicing sheet attaching method, a dicing sheet attaching device, and a semiconductor product manufacturing method, which can attach a dicing sheet to a ring-shaped protrusion formation surface of a semiconductor wafer having a ring-shaped protrusion formed thereon with high accuracy and more reliably prevent damage to the semiconductor wafer. The dicing sheet attaching method includes a first attaching process in which a dicing tape (DT) and a wafer (W) having a ring-shaped protrusion (Ka) on the outer periphery of one surface are accommodated in a chamber (29), the dicing tape (DT) is brought into contact with the ring-shaped protrusion formation surface of the wafer (W) in a state in which the internal space of the chamber (29) is depressurized, and thereby the ring-shaped protrusion formation surface is covered with the dicing tape (DT); and a second attaching process in which the dicing tape (DT) is attached to the ring-shaped protrusion formation surface of the wafer (W) by increasing the pressure of the internal space of the chamber (29) after the first attaching process.

Description

TECHNICAL FIELD

[0001] The present application relates to an adhesive sheet attaching method, an adhesive sheet attaching apparatus, and a semiconductor product manufacturing method for attaching an adhesive sheet exemplified by an adhesive material in a tape shape to a workpiece exemplified by a semiconductor wafer (hereinafter appropriately referred to as "wafer") or a substrate. BACKGROUND

[0002] After a circuit pattern is formed on the surface of the wafer, the back surface of the wafer is ground by a back surface grinding process, and the wafer is divided into a plurality of chip components by a dicing process. In the back surface grinding process, there is a case where the back surface of the wafer is left with a peripheral portion and only a central portion is ground, and a ring-shaped protrusion is formed on the back surface of the wafer in a manner of surrounding a back surface ground area.

[0003] In this case, even in a case where the central portion of the wafer is thinned, since the wafer is reinforced by the ring-shaped protrusion, it is possible to avoid generation of strain and the like at the time of handling. After the back surface grinding process, the wafer having the ring-shaped protrusion is placed at the center of a ring-shaped holder, and an adhesive tape (dicing tape) for support is attached across the ring-shaped holder and the back surface of the wafer. The mounting holder is made by the attachment of the dicing tape for use in the dicing process.

[0004] As one example of a method of attaching an adhesive sheet exemplified by a dicing tape to a wafer having a step formed by a ring-shaped protrusion, a method as follows is proposed. That is, the adhesive sheet is sandwiched by a joint portion of a chamber constituted by an upper and lower pair of housings. Then, a pressure difference is generated between two spaces divided by the adhesive sheet by performing a depressurization in the chamber, and the adhesive tape is concave-bent, whereby the adhesive sheet is attached to the back surface of the wafer. Then, after the pressure difference in the chamber is eliminated, gas is supplied from the first pressing member to the adhesive sheet that is not completely attached at the inner side corner portion of the ring-shaped protrusion and is floating, whereby a second attachment process is performed (see Patent Document 1).

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-232582 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] However, in the above-described conventional apparatus, there are problems as follows. That is, in the conventional adhesive sheet attaching method, there is a problem that the adhesive sheet peels off from the inner side corner portion of the ring-shaped protrusion toward the center of the wafer as time elapses after the adhesive sheet is attached. In addition, in the conventional adhesive sheet attaching method, there is a problem that a crack, a defect, or the like is generated in the wafer at the time of attaching the adhesive sheet to the wafer.

[0008] The present application has been made in view of such circumstances, and has as its main object to provide an adhesive sheet attaching method, an adhesive sheet attaching apparatus, and a semiconductor product manufacturing method, which can attach an adhesive sheet to a ring-shaped protrusion formation surface of a semiconductor wafer with good precision and more reliably prevent damage to the semiconductor wafer.

[0009] Solution to the problem

[0010] To solve the above problem, the present inventors and others have conducted research, and as a result, have arrived at the following insight. That is, in the conventional structure using the first pressing member for the second-time attaching process, the force acting on the adhesive sheet is small. Therefore, it is difficult to sufficiently improve the adhesion of the wafer and the adhesive sheet, and thus it can be considered that the adhesive sheet will peel from the wafer over time.

[0011] In addition, in the second-time attaching process, a greater pressing force acts on the inner side corner portion of the ring-shaped protrusion of the wafer than on the central portion of the wafer. It can be considered that cracks or defects will particularly frequently occur in the inner side corner portion of the ring-shaped protrusion of the wafer on which a greater pressing force acts, due to the deviation in the pressing force.

[0012] Further, the first pressing member has a gas supply hole and is a columnar member composed of metal or resin. In the conventional structure, the bottom surface of the first pressing member is brought close to the wafer and gas is supplied. The following situation can occur: by bringing the first pressing member close, the first pressing member will come into contact with the central portion of the wafer, which has become concave due to the thinning process, and the thin concave portion of the wafer will be damaged. It can be considered that, in the case where the flatness of the bottom surface of the first pressing member is low, even in a state where the first pressing member is close to the inner side corner portion of the ring-shaped protrusion of the wafer, the first pressing member will come into contact with other portions (for example, the central portion) of the wafer, and as a result, the wafer will be damaged.

[0013] The present application has the following solution in order to achieve such an object.

[0014] That is, the present application provides an adhesive sheet attaching method characterized by comprising: a first attaching process in which an adhesive sheet and a workpiece having a ring-shaped protrusion on the outer periphery of one face are accommodated in a chamber, and the adhesive sheet is brought into contact with a ring-shaped protrusion formation surface of the workpiece in a state where the internal space of the chamber is depressurized, thereby covering the ring-shaped protrusion formation surface with the adhesive sheet; and a second attaching process in which the adhesive sheet is attached to the ring-shaped protrusion formation surface by increasing the pressure of the internal space of the chamber after the first attaching process.

[0015] (Action and effects)

[0016] With this arrangement, in the first bonding process, the adhesive sheet is brought into contact with the annular protrusion formation surface of the workpiece in a state in which the internal space of the chamber is depressurized, whereby the annular protrusion formation surface is covered with the adhesive sheet. That is, the peripheral space of the device mounted on the workpiece is depressurized to expel air, so that when the adhesive sheet covers the annular protrusion formation surface of the workpiece, it is possible to prevent air from being entrapped between the adhesive sheet and the workpiece. Thus, it is possible to avoid a decrease in the adhesion force due to the entrapped air.

[0017] Further, in the second bonding process, the adhesive sheet is bonded to the annular protrusion formation surface of the workpiece by increasing the pressure of the internal space of the chamber. In this case, by pressurizing the internal space, it is possible to uniformly apply a pressing force to the entire adhesive sheet. Thus, it is possible to reliably avoid damage such as cracks or defects on the annular protrusion formation surface of the workpiece due to a deviation in the force applied to the adhesive sheet.

[0018] Further, in the second bonding process, by appropriately pressurizing the internal space of the chamber, it is possible to arbitrarily adjust the air pressure of the internal space in the second bonding process. Thus, it is possible to apply a sufficiently large pressing force to the adhesive sheet, and thus it is possible to make the adhesive sheet adhere to the annular protrusion formation surface with good precision. Therefore, even after the second bonding process is completed, it is possible to more reliably prevent the adhesive sheet from peeling off the workpiece even after a lapse of time.

[0019] Further, in the above-described invention, it is preferable that, in the first bonding process, the adhesive sheet be deformed into a convex shape toward the annular protrusion formation surface of the workpiece, thereby bringing the adhesive sheet into contact with the annular protrusion formation surface of the workpiece.

[0020] (Action / Effect)

[0021] With this arrangement, since the adhesive sheet is deformed into a convex shape toward the annular protrusion formation surface of the workpiece, it is possible to bring the adhesive sheet into contact with the annular protrusion formation surface of the workpiece in a manner that the adhesive sheet spreads radially from one point. Thus, it is possible to avoid the entrapping of air bubbles when the adhesive sheet is brought into contact with the annular protrusion formation surface.

[0022] Further, in the above-described invention, it is preferable that, in the second bonding process, the pressure of the internal space of the chamber be increased to a pressure higher than the atmospheric pressure.

[0023] (Action / Effect)

[0024] With this arrangement, a relatively large pressing force is applied between the adhesive sheet and the annular protrusion formation surface of the workpiece, so that it is possible to further improve the adhesion between the annular protrusion formation surface and the adhesive sheet. Thus, it is possible to more reliably prevent the adhesive sheet from peeling off the workpiece after a lapse of time.

[0025] Further, in the above invention, it is preferable that the chamber have an upper housing and a lower housing, and the first bonding process have: an upper-and-lower-space forming process in which the inside space of the chamber is divided into a lower space in which the work in the state where the annular protrusion forming surface faces upward is disposed, and an upper space opposite to the lower space with the adhesive sheet interposed therebetween, by sandwiching the adhesive sheet with the upper housing and the lower housing; an upper-and-lower-space depressurizing process in which the upper space and the lower space are depressurized; and a contacting process in which, after the upper-and-lower-space depressurizing process, the adhesive sheet is deformed in a convex shape toward the annular protrusion forming surface under the action of a pressure difference generated between the upper space and the lower space by making the pressure of the upper space higher than the pressure of the lower space, and the adhesive sheet is brought into contact with the annular protrusion forming surface of the work.

[0026] (Action / Effect)

[0027] With this arrangement, in the first bonding process, the upper space and the lower space are depressurized, and then the adhesive sheet is brought into contact with the annular protrusion forming surface of the work using the pressure difference generated by making the pressure of the upper space higher than the pressure of the lower space. That is, the adhesive sheet is brought into contact with the annular protrusion forming surface in a state where the air in the lower space is exhausted by depressurization, so it is possible to more reliably avoid the situation where a bubble is entrapped between the adhesive sheet and the annular protrusion forming surface when the adhesive sheet is brought into contact with the work. Further, since the pressure difference acts uniformly on the entire adhesive sheet, it is possible to avoid a situation where the work is damaged due to a deviation in the force acting thereon.

[0028] Further, in the above invention, it is preferable that the chamber have an upper housing and a lower housing, and the first bonding process have: an upper-and-lower-space forming process in which the inside space of the chamber is divided into a lower space in which the work in the state where the annular protrusion forming surface faces upward is disposed, and an upper space opposite to the lower space with the adhesive sheet interposed therebetween, by sandwiching the adhesive sheet with the upper housing and the lower housing; and a depressurizing contacting process in which, under the action of a pressure difference generated between the upper space and the lower space by depressurizing only the lower space of the upper space and the lower space, the adhesive sheet is deformed in a convex shape toward the annular protrusion forming surface, and the adhesive sheet is brought into contact with the annular protrusion forming surface of the work in a state where the lower space is depressurized.

[0029] (Action / Effect)

[0030] With this configuration, in the first bonding process, only the lower space is depressurized, and the pressure difference generated causes the adhesive sheet to contact the annular protrusion formation surface of the workpiece. That is, the adhesive sheet is caused to contact the annular protrusion formation surface in a state in which the air in the lower space is exhausted by depressurization, so it is possible to more reliably prevent air bubbles from being trapped between the adhesive sheet and the annular protrusion formation surface when the adhesive sheet is caused to contact the workpiece. In addition, since the pressure difference acts uniformly on the entire adhesive sheet, it is possible to prevent the workpiece from being damaged due to a deviation in the force acting thereon. In addition, since only the lower space is depressurized, it is not necessary to provide a structure for depressurizing the upper space. Thus, it is possible to prevent the device from being complicated and high-cost.

[0031] In addition, in the above invention, it is preferable that the adhesive sheet have a predetermined shape corresponding to the annular protrusion formation surface of the workpiece, and be held by the long strip-shaped sheet for conveying, and that, in the upper and lower space formation process, the inside of the chamber be divided into a lower space in which the workpiece in an upside-down state of the annular protrusion formation surface is disposed, and an upper space opposite the lower space with the adhesive sheet held by the sheet for conveying interposed therebetween, by sandwiching the sheet for conveying with the upper housing and the lower housing.

[0032] (Action / Effect)

[0033] With this configuration, the adhesive sheet has a predetermined shape corresponding to the annular protrusion formation surface of the workpiece in advance. Thus, it is possible to appropriately bond the adhesive sheet to the annular protrusion formation surface in accordance with the position and shape of the annular protrusion formation surface of the workpiece. In addition, since it is not necessary to perform a process of cutting the adhesive sheet into an appropriate predetermined shape or the like, it is possible to shorten the process of bonding the adhesive sheet.

[0034] In addition, in the above invention, it is preferable that an elastic sheet be provided in the inside of the upper housing, and that the elastic sheet be provided so as to abut against the adhesive sheet by forming the chamber in the upper and lower space formation process.

[0035] (Action / Effect)

[0036] With this configuration, the elastic sheet as a whole deforms into a convex shape with a more uniform curvature under the action of the pressure difference. Thus, the adhesive sheet easily deforms in accordance with the shape of the annular protrusion formation surface of the workpiece, so it is possible to improve the adhesion of the annular protrusion formation surface and the adhesive sheet. Thus, it is possible to more accurately and favorably bond the adhesive sheet to the annular protrusion formation surface.

[0037] Furthermore, in the above invention, it is preferred that the adhesive sheet bonding method includes a heating process in which the adhesive sheet is heated by heating at least one of the lower space and the upper space, and in the first bonding process, the adhesive sheet, which has been heated by the heating process, is brought into contact with the annular protrusion forming surface of the workpiece.

[0038] (Functions and Effects)

[0039] This method utilizes a heating process to heat the adhesive sheet, making it more flexible. That is, the adhesive sheet can easily deform according to the shape of the annular protrusion forming surface of the workpiece, thus improving the adhesion between the annular protrusion forming surface and the adhesive sheet.

[0040] To achieve this objective, the present invention may also adopt the following approach.

[0041] That is, the present invention provides an adhesive sheet pasting device, characterized in that the adhesive sheet pasting device comprises: a first pasting mechanism that houses an adhesive sheet and a workpiece having an annular protrusion on the outer periphery of one side in a chamber, and, in a state where the internal space of the chamber is depressurized, brings the adhesive sheet into contact with the annular protrusion forming surface of the workpiece, thereby covering the annular protrusion forming surface with the adhesive sheet; and a second pasting mechanism that, after the first pasting mechanism has completed its work, the second pasting mechanism pastes the adhesive sheet onto the annular protrusion forming surface by increasing the pressure of the internal space of the chamber.

[0042] (Functions and Effects)

[0043] In this design, the first bonding mechanism contacts the adhesive sheet against the annular protrusion forming surface of the workpiece while the internal space of the chamber is depressurized, thereby covering the annular protrusion forming surface with the adhesive sheet. That is, air is expelled from the peripheral space of the device mounted on the workpiece through depressurization; therefore, when the adhesive sheet covers the annular protrusion forming surface of the workpiece, gas can be prevented from being trapped between the adhesive sheet and the workpiece. Thus, a reduction in the sealing force caused by gas entrapment can be avoided.

[0044] Furthermore, the second bonding mechanism adheres the adhesive sheet to the annular protrusion forming surface of the workpiece by increasing the pressure within the chamber. In this case, the pressure applied to the internal space ensures that the pressing force is evenly distributed across the entire adhesive sheet. Therefore, damage such as cracks or defects on the annular protrusion forming surface of the workpiece due to deviations in the force applied to the adhesive sheet can be reliably avoided.

[0045] Further, the second adhering mechanism arbitrarily adjusts the air pressure of the interior space during the second adhering process by appropriately pressurizing the interior space of the chamber. Therefore, a sufficient pressing force can be applied to the adhesive sheet, and thus the adhesive sheet can be closely adhered to the annular projection formation surface with high precision. Therefore, even after the lapse of time after the completion of the second adhering process, the adhesive sheet can be more reliably prevented from being peeled from the workpiece.

[0046] To achieve such an object, the present application can employ the following solution.

[0047] That is, the present application provides a method of manufacturing a semiconductor product which becomes a state in which an adhesive sheet is adhered to an annular projection formation surface of a workpiece having an annular projection in the outer periphery of one surface, the method of manufacturing a semiconductor product characterized by comprising: a first adhering process in which the workpiece and the adhesive sheet are accommodated in a chamber, and the adhesive sheet is brought into contact with the annular projection formation surface of the workpiece in a state in which the interior space of the chamber is depressurized, thereby covering the annular projection formation surface with the adhesive sheet; and a second adhering process in which the adhesive sheet is adhered to the annular projection formation surface by increasing the pressure of the interior space of the chamber after the first adhering process.

[0048] (Action and Effect)

[0049] With this solution, a semiconductor product which becomes a state in which an adhesive sheet is adhered to an annular projection formation surface of a workpiece having an annular projection in the outer periphery of one surface can be preferably manufactured. That is, in the first adhering process, the adhesive sheet is brought into contact with the annular projection formation surface of the workpiece in a state in which the interior space of the chamber is depressurized, thereby covering the annular projection formation surface with the adhesive sheet. In the first adhering process, the air in the peripheral space of the device mounted on the workpiece is discharged by the depressurization, and thus, when the adhesive sheet covers the annular projection formation surface of the workpiece, the gas can be prevented from being entrapped between the adhesive sheet and the workpiece. Therefore, the reduction in the close adhesion force due to the entrapped gas can be avoided.

[0050] Further, in the second adhering process, the adhesive sheet is adhered to the annular projection formation surface of the workpiece by increasing the pressure of the interior space of the chamber. In this case, by the pressurization of the interior space, the pressing force can be uniformly applied to the entire adhesive sheet. Thus, the damage such as a crack or a defect in the annular projection formation surface of the workpiece due to the deviation of the force applied to the adhesive sheet can be reliably avoided.

[0051] Effects of the Invention

[0052] The adhesive sheet attaching method, the adhesive sheet attaching apparatus, and the semiconductor product manufacturing method of the present application can prevent the adhesive sheet from peeling off the workpiece after the second attaching process. In the first attaching process, the adhesive sheet is brought into contact with the annular protrusion forming surface of the workpiece in a state in which the internal space of the chamber is depressurized, thereby covering the annular protrusion forming surface with the adhesive sheet. That is, the peripheral space of the device mounted on the workpiece is depressurized to discharge air, so that when the adhesive sheet covers the annular protrusion forming surface of the workpiece, air can be prevented from being entrapped between the adhesive sheet and the workpiece. Thus, a decrease in the adhesion force due to the entrapped air can be avoided.

[0053] In the second attaching process, the adhesive sheet is attached to the annular protrusion forming surface of the workpiece by increasing the pressure of the internal space of the chamber. In this case, the pressing force can be uniformly applied to the entire adhesive sheet by the pressurization of the internal space. Thus, a crack or a defect, or the like, can be reliably prevented from being generated in the annular protrusion forming surface of the workpiece due to a deviation in the force applied to the adhesive sheet.

[0054] In the second attaching process, the pressure of the internal space of the chamber can be arbitrarily adjusted by appropriately pressurizing the internal space of the chamber. Thus, a sufficiently large pressing force can be applied to the adhesive sheet, so that the adhesive sheet can be closely adhered to the annular protrusion forming surface with high precision. Therefore, even after the second attaching process is completed, the adhesive sheet can be more reliably prevented from peeling off the workpiece even after a lapse of time. BRIEF DESCRIPTION OF DRAWINGS

[0055] Figure 1 is a diagram showing the structure of a semiconductor wafer of Embodiment 1. Figure 1 (a) of FIG. 1 is a partial cutaway perspective view of a semiconductor wafer, Figure 1 (b) of FIG. 1 is a perspective view of the back surface side of the semiconductor wafer, Figure 1 (c) of FIG. 1 is a partial longitudinal sectional view of the semiconductor wafer.

[0056] Figure 2 is a sectional view showing the structure of an adhesive sheet of Embodiment 1.

[0057] Figure 3 is a plan view of an adhesive sheet attaching apparatus of Embodiment 1.

[0058] Figure 4 is a front view of the adhesive sheet attaching apparatus of Embodiment 1.

[0059] Figure 5 is a front view of an attaching unit of Embodiment 1.

[0060] Figure 6 is a longitudinal sectional view of a chamber of Embodiment 1.

[0061] Figure 7is a flowchart showing the operation of the adhesive sheet attaching device of the embodiment.

[0062] Figure 8 is a perspective view of the mounting rack of Embodiment 1.

[0063] Figure 9 is a diagram for explaining Step S2 of Embodiment 1.

[0064] Figure 10 is a diagram for explaining Step S3 of Embodiment 1.

[0065] Figure 11 is a diagram for explaining Step S3 of Embodiment 1.

[0066] Figure 12 is a diagram for explaining Step S4 of Embodiment 1.

[0067] Figure 13 is a diagram for explaining Step S4 of Embodiment 1.

[0068] Figure 14 is a diagram for explaining Step S5 of Embodiment 1.

[0069] Figure 15 is a diagram for explaining Step S6 of Embodiment 1.

[0070] Figure 16 is a diagram for explaining Step S6 of Embodiment 1.

[0071] Figure 17 is a diagram for explaining Step S7 of Embodiment 1.

[0072] Figure 18 is a diagram showing the structure of the adhesive sheet and the transport sheet of Embodiment 2. Figure 18 (a) of is a perspective view of the back side of the adhesive sheet and the transport sheet, Figure 18 (b) of is a longitudinal sectional view of the adhesive sheet and the transport sheet.

[0073] Figure 19 is a flowchart showing the operation of the adhesive sheet attaching device of Embodiment 2.

[0074] Figure 20 is a diagram for explaining Step S2 of Embodiment 2.

[0075] Figure 21 is a diagram for explaining Step S2 of Embodiment 2.

[0076] Figure 22 is a diagram for explaining Step S3 of Embodiment 2.

[0077] Figure 23is a view illustrating Step S3 of Example 2.

[0078] Figure 24 is a view illustrating Step S4 of Example 2.

[0079] Figure 25 is a view illustrating Step S5 of Example 2.

[0080] Figure 26 is a view illustrating Step S6 of Example 2.

[0081] Figure 27 is a view illustrating Step S6 of Example 2.

[0082] Figure 28 is a view illustrating a structure of a modification example.

[0083] Figure 29 is a view illustrating a structure of a modification example. Figure 29 (a) of FIG. 10 is a longitudinal sectional view showing a structure of an adhesive tape and a conveyance sheet of a modification example, Figure 29 (b) of FIG. 10 is a perspective view illustrating a structure of a sheet cutting device of the modification example.

[0084] Figure 30 is a view illustrating a structure of a modification example. Figure 30 (a) of FIG. 12 is a longitudinal sectional view showing a structure of a modification example provided with an elastic body, Figure 30 (b) of FIG. 12 is a view illustrating a problem that can occur in a structure not provided with an elastic body, Figure 30 (c) of FIG. 12 is a view illustrating an advantage in a structure provided with an elastic body.

[0085] Figure 31 is a view illustrating a structure of a modification example. Figure 31 (a) of FIG. 14 is a longitudinal sectional view showing a structure of a modification example provided with a heating mechanism, Figure 31 (b) of FIG. 14 is a longitudinal sectional view illustrating one example of a process of heating an adhesive tape by the heating mechanism.

[0086] BRIEF DESCRIPTION OF REFERENCE NUMERALS

[0087] 1. Adhesive sheet bonding device; 3. Wafer transport mechanism; 5. Container; 6. Rack recovery unit; 7. Aligner; 9. Holding stage; 12. Rack supply unit; 13. Bonding unit; 16. Wafer transport device; 17. Rack transport device; 23. Holding arm; 27. Adsorption plate; 28. Suction cup; 31. Vacuum device; 32. Pressurizing device; 33. Control unit; 38. Rack holding unit; 71. Wafer supply unit; 72. Separated wafer recovery unit; 73. Wafer bonding unit; 74. Wafer recovery unit; 81. Wafer bonding mechanism; 82. Wafer cutting mechanism; 85. Bonding roller; 86. Clamping roller; 95. Cutting tool; f. Ring frame; DT. Adhesive tape; P. Transport sheet; MF. Mounting frame; Ta. Substrate; Tb. Adhesive material; Pa. Substrate; Pb. Adhesive material. Detailed Implementation

[0088]

Example 1

[0089] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. In the adhesive sheet bonding apparatus 1 of Embodiment 1, the adhesive tape DT (cut tape) for support is used as the adhesive sheet, and the workpiece to which the adhesive sheet is bonded is a semiconductor wafer W (hereinafter referred to as "wafer W") and a ring frame f. That is, in the adhesive sheet bonding apparatus 1 of Embodiment 1, the mounting frame MF is fabricated by bonding the adhesive tape DT across the wafer W and the ring frame f.

[0090] like Figure 1 (a)~ Figure 1 As shown in (c), with a protective tape PT for circuit protection attached to the surface of the wafer W where the circuit pattern is formed, the wafer W is subjected to back-side grinding. The back side of the wafer W is ground with approximately 3 mm remaining radially on its outer periphery (back-side grinding). That is, the wafer is processed to have a flat recess He formed on the back side and an annular protrusion Ka retained along the outer periphery of the back side. As an example, the processing is performed such that the grinding depth d of the flat recess He is several hundred μm and the wafer thickness J of the flat recess He is 30 μm to 50 μm. Therefore, the annular protrusion Ka formed on the outer periphery of the back side functions as an annular rib to improve the rigidity of the wafer W, suppressing flexural deformation of the wafer W during handling and other processing steps. Furthermore, the inner corner of the annular protrusion Ka is indicated by the reference numeral Kf. The inner corner Kf corresponds to the boundary between the annular protrusion Ka and the flat recess He. The back side of wafer W corresponds to the annular protrusion forming surface of the workpiece in this invention.

[0091] like Figure 2As shown, the adhesive tape DT used in this embodiment has a long strip-like structure in which a non-adhesive base material Ta and an adhesive material Tb having adhesiveness are laminated. A separation sheet S is provided on the adhesive material Tb. That is, the separation sheet S is provided on the adhesive surface of the adhesive tape DT, and the adhesive surface of the adhesive tape DT is exposed by peeling the separation sheet S from the adhesive tape DT.

[0092] As examples of the material constituting the base material Ta, polyolefin, polyethylene, ethylene-vinyl acetate copolymer, polyester, polyimide, polyurethane, vinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyvinylidene chloride, polyethylene methacrylate copolymer, polypropylene, p-terephthalic acid methacrylate, polyamide imide, polyurethane elastomer, and the like can be given. In addition, a material in which a plurality of the above-described materials are combined can also be used as the base material Ta. In addition, the base material Ta can be a single layer, or can be a structure in which a plurality of layers are laminated.

[0093] The adhesive material Tb is preferably composed of a material capable of ensuring a function of being able to maintain the state in which the adhesive tape DT is adhered to the wafer W and the ring frame f, and a function of being able to prevent the chip components from being scattered in the subsequent cutting process. As examples of the material constituting the adhesive material Tb, acrylic copolymer and the like can be given. As examples of the separation sheet S, long strip-like paper, plastic, and the like can be given. In addition, an adhesive material or a tacky material can also be used instead of the adhesive material Tb.

[0094] <Explanation of overall structure>

[0095] Here, the overall structure of the adhesive sheet pasting device 1 of Embodiment 1 will be described. Figure 3 is a plan view showing the basic structure of the adhesive sheet pasting device 1 of Embodiment 1. The adhesive sheet pasting device 1 has a structure in which a rectangular portion la that is long in the lateral direction and a protruding portion lb are provided. The protruding portion lb has a structure in which the central portion of the rectangular portion la is connected and protrudes upward. In addition, in the following description, the length direction of the rectangular portion la will be referred to as the left-right direction (x direction), and the horizontal direction orthogonal thereto will be referred to as the front-rear direction.

[0096] A wafer conveying mechanism 3 is provided on the right side of the rectangular portion la. Two containers 5 in which wafers W are accommodated are placed side by side on the right side of the lower side of the rectangular portion la. The wafers W on which a protection tape PT is pasted are accommodated in a multilayered manner inside the containers 5 in a state in which the surface side faces downward. On the left end of the rectangular portion la, a wafer mounting mechanism 2 for mounting the wafers W on which the assembly of the wafer W is completed is provided. Figure 8 The mounting frame MF shown is a frame recovery portion 6.

[0097] An aligner 7, a holding stage 9, and a rack feeding section 12 are provided in this order from the right side of the upper side of the rectangular section la. A taping unit 13 is provided at the protruding section lb, which tapes an adhesive tape DT (dicing tape) across the back surface of the wafer W and the ring-shaped rack f.

[0098] As shown in Figure 4 The wafer conveying mechanism 3 is provided with a wafer conveying device 16 supported to the right side of a guide rail 15 so as to be able to reciprocate in the left-right direction, the guide rail 15 being horizontally erected at the upper portion of the rectangular section la. In addition, a rack conveying device 17 is provided at the left side of the guide rail 15 so as to be able to move in the left-right direction.

[0099] The wafer conveying device 16 is configured to be able to convey the wafer W taken out from any one of the containers 5 in the left-right and front-rear directions. The wafer conveying device 16 is equipped with a left-right movable stage 18 and a front-rear movable stage 19.

[0100] The left-right movable stage 18 is configured to be able to reciprocate in the left-right direction along the guide rail 15. The front-rear movable stage 19 is configured to be able to reciprocate in the front-rear direction along a guide rail 20 provided at the left-right movable stage 18.

[0101] Further, a holding unit 21 that holds the wafer W is equipped at the lower portion of the front-rear movable stage 19. The holding unit 21 is configured to be able to reciprocate in the up-down direction (z direction) along a vertical rail 22 extending in the vertical direction. In addition, the holding unit 21 is able to rotate around the axis of the z direction by means of a rotation shaft not shown.

[0102] A horseshoe-shaped holding arm 23 is equipped at the lower portion of the holding unit 21. A plurality of suction pads that slightly protrude are provided at the holding surface of the holding arm 23, by means of which the wafer W is suction-held. In addition, the holding arm 23 is communicatively connected with a compressed air device via a flow path formed inside thereof and a connection flow path connected with the proximal end side of the flow path.

[0103] By means of the movable configuration described above, the wafer W suction-held by the holding arm 23 is able to move in the front-rear direction, the left-right direction, and the rotation direction around the z direction axis.

[0104] The rack conveying device 17 is provided with a left-right movable stage 24, a front-rear movable stage 25, an extension link mechanism 26 connected with the lower portion of the left-right movable stage 24, and a suction plate 27 equipped at the lower end of the extension link mechanism 26, and the like. The suction plate 27 suction-holds the wafer W. A plurality of suction pads 28 that suction-hold the ring-shaped rack f are provided around the suction plate 27. Thus, the rack conveying device 17 is able to suction-hold and convey the ring-shaped rack f or the mounting rack MF placed and held at the holding stage 9 in the up-down and front-rear left-right directions. The suction pads 28 are able to be slidably adjusted in the horizontal direction in correspondence with the size of the ring-shaped rack f.

[0105] like Figure 5 and Figure 6 As shown, the holding stage 9 is a metal chuck stage with the same shape as or larger than the wafer W, and it is connected to an externally mounted vacuum device 31 and a pressurizing device 32. The operation of the vacuum device 31 and the pressurizing device 32 is controlled by the control unit 33.

[0106] In Embodiment 1, the holding platform 9 has an annular protrusion 9a on its outer periphery and is hollow overall. The protrusion 9a is configured to be positioned approximately in line with the configuration of the annular protrusion Ka of the wafer W when viewed from above. The protrusion 9a supports the annular protrusion Ka of the wafer W, thereby enabling the holding platform 9 to hold the wafer W without contacting the thinner flat recess He.

[0107] In addition, such as Figure 5 As shown, the holding platform 9 is housed in the lower housing 29A that constitutes the chamber 29, and is connected to one end of a rod 35 that passes through the lower housing 29A. The other end of the rod 35 is driven to a drive 37 equipped with a motor or the like. Therefore, the holding platform 9 can move up and down inside the chamber 29.

[0108] The lower housing 29A includes a frame holding portion 38 that encloses the lower housing 29A. The frame holding portion 38 is configured such that when the annular frame f is mounted, the upper surface of the annular frame f is flush with the top of the cylinder of the lower housing 29A. In addition, the top of the cylinder of the lower housing 29A is preferably subjected to a demolding process.

[0109] In addition, such as Figure 3 As shown, the retaining platform 9 is configured to reciprocate between an initial position and an adhesive position along a track 40 attached in the front-rear direction, together with the lower housing 29A. The initial position is located inside the rectangular portion 1a. Figure 3 The position of the holding stage 9 is indicated by a solid line. In this initial position, the wafer W and the ring holder f are placed on the holding stage 9.

[0110] The adhesive is applied inside the protrusion 1b. Figure 3 The position of the holding stage 9 is indicated by a dashed line. By moving the holding stage 9 toward the bonding position, a bonding process can be performed to bond the adhesive tape DT relative to the wafer W placed on the holding stage 9.

[0111] The shelf supply section 12 stores a predetermined number of circular shelf-type boxes in a drawer-style arrangement.

[0112] like Figure 5As shown, the bonding unit 13 comprises a sheet supply section 71, a sheet separation and recycling section 72, a sheet bonding section 73, and a sheet recycling section 74. The sheet supply section 71 includes a supply winding drum filled with a material roll on which adhesive tape DT for support is wound. Furthermore, it is configured such that during the supply of adhesive tape DT from the supply winding drum of the sheet supply section 71 to the bonding position, a peeling roller 75 peels off the sheet separation S. In addition, the supply winding drum of the sheet supply section 71 is connected to an electromagnetic brake and is subjected to appropriate rotational resistance. Therefore, excessive tape release from the supply winding drum can be prevented.

[0113] The separation sheet recovery section 72 is equipped with a recovery winding drum that winds up the separation sheets S peeled off from the adhesive tape DT. The recovery winding drum is driven and controlled by a motor to rotate in both directions.

[0114] The sheet pasting section 73 consists of a chamber 29, a sheet pasting mechanism 81, and a sheet cutting mechanism 82.

[0115] The chamber 29 is composed of a lower housing 29A and an upper housing 29B. The lower housing 29A is disposed in a manner that surrounds the retaining platform 9, and together with the retaining platform 9, it reciprocates in the front-to-back direction between the initial position and the bonding position. The upper housing 29B is provided on the protrusion 1b and is configured to be able to move up and down.

[0116] like Figure 6 As shown, the lower housing 29A and the upper housing 29B are respectively connected to the vacuum device 31 and the pressurization device 32 via flow path 101. Furthermore, a solenoid valve 103 is provided on the flow path 101 on the upper housing 29B side. Additionally, flow paths 109 are respectively connected to the two housings 29A and 29B, and these flow paths 109 are equipped with solenoid valves 105 and 107 for atmospheric opening.

[0117] Furthermore, a flow path 111 is connected to the upper housing 29B, and this flow path 111 is equipped with a solenoid valve 110 that adjusts the internal pressure after temporary decompression by venting. In addition, the opening and closing operations of these solenoid valves 103, 105, 107, and 110, the operation of the vacuum device 31, and the operation of the pressurizing device 32 are all performed by the control unit 33.

[0118] That is, the vacuum device 31 is configured to independently reduce the air pressure in the space on the lower housing 29A side and the air pressure in the space on the upper housing 29B side. Furthermore, the pressurization device 32 is configured to independently pressurize the air pressure in the space on the lower housing 29A side and the air pressure in the space on the upper housing 29B side.

[0119] The sheet pasting mechanism 81 includes a movable table 84, a pasting roller 85, and a clamping roller 86. The movable table 84 moves horizontally left and right along a guide rail 88 that is erected in the left-right direction. The pasting roller 85 is supported on a bracket, which is connected to the top of a working cylinder located on the movable table 84. The clamping roller 86 is provided on the side of the sheet recycling section 74 and includes a conveying roller 89 driven by a motor and a clamping roller 90 that is raised and lowered by the working cylinder.

[0120] The sheet cutting mechanism 82 is mounted on a lifting drive table 91 that raises and lowers the upper housing 29B, and includes a support shaft 92 extending in the z-direction and a hub 93 rotatable about the support shaft 92. The hub 93 includes a plurality of support arms 94 extending radially. A circular plate-shaped cutter 95 for cutting the adhesive tape DT along the annular frame f is mounted on the top of at least one support arm 94 in a vertically movable manner. A pressing roller 96 is mounted on the top of the other support arms 94 in a vertically movable manner.

[0121] The sheet recycling unit 74 is equipped with a recycling winding drum that winds up the cut and peeled unwanted adhesive tape DT. The recycling winding drum is driven and rotated in both directions by a motor (not shown).

[0122] like Figure 4 As shown, the rack recovery unit 6 is equipped with a box 41 for loading and recovering the mounting frame MF. The box 41 includes a longitudinal track 45, which is connected and fixed to the device frame 43; and a lifting platform 49, which is helically fed and lifted along the longitudinal track 45 by a motor 47. Therefore, the rack recovery unit 6 is configured to place the mounting frame MF on the lifting platform 49 and perform pitch-feed descent.

[0123] <Action Summary>

[0124] Here, the basic operation of the adhesive sheet pasting device 1 of Embodiment 1 will be explained. Figure 7 This is a flowchart illustrating a series of processes in which adhesive tape DT is bonded to wafer W using adhesive tape bonding device 1.

[0125] Step S1 (Workpiece Supply)

[0126] When a pasting command is issued, an annular frame f is conveyed from the frame supply section 12 to the frame holding section 38 of the lower housing 29A, and a wafer W is conveyed from the container 5 to the holding stage 9.

[0127] That is, the rack conveying device 17 sucks and carries the ring-shaped rack f from the rack supply section 12 to the rack holding section 38. After the rack conveying device 17 releases the suction of the ring-shaped rack f and rises, the alignment of the ring-shaped rack f is performed. As one example, the alignment is performed by moving a plurality of support pins, which are provided in a standing manner around the rack holding section 38, in synchronization toward the center direction. The ring-shaped rack f waits in a state of being set on the rack holding section 38 until the wafer W is conveyed.

[0128] The rack conveying device 17 conveys the ring-shaped rack f, and on the other hand, the wafer conveying device 16 inserts the holding arms 23 between the wafers W, which are housed in the inside of the container 5 in a plurality of layers. The holding arms 23 suck and carry the wafers W and deliver the wafers W to the aligner 7. The aligner 7 sucks the center of the wafer W with a suction pad protruding from the center thereof. At the same time, the wafer conveying device 16 releases the suction of the wafer W and retreats upward. The aligner 7 aligns the wafer W according to a notch or the like while holding and rotating the wafer W with the suction pad.

[0129] After the alignment is completed, the suction pad, on which the wafer W is sucked, is caused to protrude from the face of the aligner 7. The wafer conveying device 16 is caused to move to this position and suck and hold the wafer W. The suction pad releases the suction and descends.

[0130] The wafer conveying device 16 moves to the upper side of the holding table 9 and causes the wafer W to be placed on the holding table 9 in a state of the surface side to which the protective tape PT is attached facing downward. When the holding table 9 sucks and holds the wafer W and the rack holding section 38 sucks and holds the ring-shaped rack f, the lower housing 29A is caused to move along the rail 40 from the initial position to the attachment position of the tape-attaching mechanism 81. In Figure 9 A state in which the wafer W is supplied to the holding table 9 and moved to the attachment position is shown in FIG. 12.

[0131] Step S2 (supply of adhesive sheet)

[0132] When the workpiece is supplied with the wafer conveying device 16 or the like, the supply of the adhesive tape DT is performed in the attachment unit 13. That is, a predetermined amount of the adhesive tape DT is caused to be discharged from the sheet supply section 71 while peeling the separation sheet S. The adhesive tape DT, which is a whole long strip, is guided along a predetermined conveying path to the upper side of the attachment position.

[0133] Step S3 (formation of cavity)

[0134] After the workpiece and the adhesive tape DT are supplied, as shown in Figure 10 the attachment roller 85 is caused to descend. Then, the attachment roller 85 is caused to roll on the adhesive tape DT while attaching the adhesive tape DT so as to span the top of the lower housing 29A and the top of the ring-shaped rack f. In conjunction with the movement of this attachment roller 85, a predetermined amount of the adhesive tape DT is caused to be discharged from the sheet supply section 71 while peeling the separation sheet S.

[0135] After the adhesive tape DT is attached to the ring-shaped frame f, the attachment roller 85 is returned to the initial position, and the upper case 29B is lowered. As the upper case 29B is lowered, as shown in Figure 11 Fig. 6, the portion of the adhesive tape DT attached to the top of the lower case 29A is sandwiched by the upper case 29B and the lower case 29A to form a chamber 29.

[0136] At this time, the adhesive tape DT functions as a sealing material, and the chamber 29 is divided into two spaces by the adhesive tape DT. That is, it is divided into a lower space Hl on the lower case 29A side and an upper space H2 on the upper case 29B side across the adhesive tape DT. The wafer W located in the lower case 29A is in close proximity to and opposed to the adhesive tape DT with a predetermined gap therebetween.

[0137] Step S4 (1st attachment process)

[0138] After the chamber 29 is formed, the 1st attachment process is started. First, the control section 33 operates the vacuum device 31 to reduce the air pressure in the lower space Hl and the air pressure in the upper space H2 to predetermined values in the state where the electromagnetic valves 105, 107, 110 shown in Fig. 5 are closed. As examples of the predetermined values, 10 Pa to 100 Pa can be given. At this time, the opening degree of the electromagnetic valve 103 is adjusted so that the lower space Hl and the upper space H2 are reduced at the same speed. Figure 6 When the air pressure in the lower space Hl and the air pressure in the upper space H2 are reduced to the predetermined values, the control section 33 closes the electromagnetic valve 103 and stops the operation of the vacuum device 31. Then, the control section 33 adjusts the opening degrees of the electromagnetic valves 103, 105, 107, 110 to bleed so that the air pressure in the upper space H2 is higher than the air pressure in the lower space Hl. By making the air pressure in the upper space H2 higher than the air pressure in the lower space Hl, a pressure difference Fa is generated between the two spaces as shown in

[0139] Figure 12 Fig. 6. By generating the pressure difference Fa, the adhesive tape DT is drawn toward the lower case 29A side from the center portion to be deformed into a convex shape.

[0140] In the present embodiment, the control is performed as follows: in the state where the electromagnetic valves 103, 107 connected to the lower space Hl are closed, the opening degree of the electromagnetic valve 110 connected to the upper space H2 is adjusted to bleed, and finally becomes fully open. By this adjustment, the state where the air pressure in the lower space Hl is reduced to the predetermined value is maintained, and the air pressure in the upper space H2 gradually rises from the predetermined value to return to the atmospheric pressure, and thus the pressure difference Fa is generated.

[0141] After the pressure difference Fa is generated, as shown in Figure 13 ​As shown, the actuator 37 is driven to raise the holding stage 9. Through the deformation of the adhesive tape DT based on the pressure difference Fa and the raising of the holding stage 9, the adhesive tape DT, inside the lower space H1 where air is expelled, radiates outwards from the center and contacts the back side of the wafer W. Through this contact, the back side of the wafer W is covered by the adhesive tape DT.

[0142] When the back side of wafer W is covered by adhesive tape DT, control unit 33 fully opens solenoid valves 103, 105, 107, and 110, opening the upper space H2 and lower space H1 to the atmosphere. This atmospheric opening ends the first bonding process. Thus, during the first bonding process, the following operation is performed: by depressurizing the internal space of chamber 29, adhesive tape DT is brought into contact with the back side of wafer W, thereby covering the back side of wafer W with adhesive tape DT.

[0143] Step S5 (Second Paste Process)

[0144] After applying adhesive tape DT to cover the back of wafer W, the second application process begins. First, control unit 33 controls driver 37 to lower stage 9 to its initial position. Next, control unit 33 closes... Figure 6 When the solenoid valves 105, 107, and 110 are in their indicated states, the pressurizing device 32 is activated to supply gas to the lower space H1 and the upper space H2, pressurizing them to a specific value. Examples of this specific value include 0.3 MPa to 0.5 MPa. By pressurizing the device 32, the gas pressure in both the lower space H1 and the upper space H2 is increased to above atmospheric pressure.

[0145] By pressurizing the upper space H2, such as Figure 14 As shown, a pressing force V1 is applied from the upper space H2 towards the adhesive tape DT. Furthermore, since the entire upper space H2 is pressurized, the pressing force V1 is applied uniformly to the entire adhesive tape DT. Additionally, since the entire lower space H1 is pressurized, a pressing force V2 is applied uniformly from the lower space H1 to the downward-facing surface of the wafer W. That is, under the action of pressing forces V1 and V2, the adhesive tape DT is precisely adhered to the back side of the wafer W. As a result, the adhesion between the wafer W and the adhesive tape DT is improved, thus preventing the adhesive tape DT from peeling off from the back side of the wafer W over time.

[0146] After the pressing force acting between the adhesive tape DT and the wafer W for a predetermined time in a state where the lower space Hl and the upper space H2 are pressurized to a gas pressure higher than the atmospheric pressure, the control section 33 stops the operation of the pressurizing device 32. Then, the control section 33 fully opens the electromagnetic valves 103, 105, 107, and 110 to open the lower space Hl and the upper space H2 to the atmosphere. The control section 33 raises the upper housing 29B to open the chamber 29, and raises the holding table 9 to abut the surface of the wafer W against the wafer holding surface of the holding table 9.

[0147] Step S6 (cutting of the sheet)

[0148] Further, during the procedures of the steps S4 and S5 performed in the chamber 29, the sheet cutting mechanism 82 is operated to cut the adhesive tape DT. At this time, as shown in Figure 15 the knife 95 cuts the adhesive tape DT adhered to the ring-shaped holder f into the shape of the ring-shaped holder f, and the press roller 96 follows the knife 95 to roll on the sheet cutting position on the ring-shaped holder f while pressing.

[0149] Since the first adhering process of the step S4 and the second adhering process of the step S5 have been completed at the time of raising the upper housing 29B, the clamping roller 90 is raised to release the clamping of the adhesive tape DT. After that, as shown in Figure 16 the clamping roller 86 is moved to wind up and recover the unnecessary adhesive tape DT after the cutting toward the sheet recovery portion 74, and to release a predetermined amount of the adhesive tape DT from the sheet supply portion 71. Through each procedure up to the step S6, the mounting holder MF in which the ring-shaped holder f and the wafer W are integrated by the adhesive tape DT is formed.

[0150] After the unnecessary adhesive tape DT is wound up and recovered, the clamping roller 86 and the adhering roller 85 return to the initial positions. Then, the holding table 9 is moved from the adhering position to the initial position in a state of holding the mounting holder MF.

[0151] Step S7 (recovery of the mounting holder)

[0152] When the holding table 9 returns to the initial position, as shown in Figure 17 the suction pad 28 provided to the holder conveying device 17 holds and sucks the mounting holder MF to separate the mounting holder MF from the lower housing 29A. The holder conveying device 17 holding and sucking the mounting holder MF conveys the mounting holder MF to the holder recovery portion 6. The conveyed mounting holder MF is loaded and housed in the box 41.

[0153] The above series of operations of attaching the adhesive tape DT to the wafer W is completed. Thereafter, the above-described processing is repeated until the mounting frame MF reaches a predetermined number. In this way, the mounting frame MF in which the adhesive tape DT is attached to the wafer W is manufactured using the adhesive sheet attaching apparatus 1. The mounting frame MF in which the adhesive tape DT is attached to the wafer W by the second attaching process corresponds to the semiconductor device in the present application.

[0154] Further, in Embodiment 1, a case in which the ring-shaped frame f is used to manufacture the mounting frame MF in which the adhesive tape DT is attached to the wafer W is exemplified, but the process of manufacturing the semiconductor device using the adhesive sheet attaching apparatus 1 is not limited to the case in which the ring-shaped frame f is used. That is, the adhesive sheet attaching apparatus 1 in which each structure for operating the ring-shaped frame f is omitted can be used to attach the adhesive tape DT to the wafer W. In this case, each process of each step of Embodiment 1 is performed, whereby the adhesive tape DT is attached to the wafer W. In this case, the wafer W in which the adhesive tape DT is attached corresponds to the semiconductor device in the present application.

[0155] <Effects of the structure of Embodiment 1>

[0156] With the apparatus of Embodiment 1 described above, the first attaching process and the second attaching process are performed using the chamber. That is, after the adhesive tape DT is attached to the wafer W by the first attaching process, the second attaching process is performed, whereby the adhesive tape DT is attached to the wafer W more precisely. With this structure, for the wafer W having the ring-shaped convex portion Ka on one surface, the adhesive tape DT can be attached precisely while avoiding breakage of the wafer W.

[0157] In the first attaching process of the present application, the inside of the lower space Hl of the wafer W is depressurized inside the chamber 29. That is, the peripheral space of the adhesive tape DT and the peripheral space of the wafer W are depressurized to discharge air, so that when the adhesive tape DT contacts the wafer W and covers the back surface of the wafer W, air can be prevented from being entrapped between the adhesive tape DT and the wafer W. Therefore, a decrease in the adhesion force due to entrapped air can be avoided.

[0158] Further, in the second attaching process of the present application, the adhesive tape DT is attached to the back surface of the wafer W precisely by pressurizing the air pressure of the lower space Hl and the air pressure of the upper space H2 to be greater than the atmospheric pressure.

[0159] In a case where the pressure difference Fa is generated by reducing the pressure of the inside of the chamber by using the vacuum device, the magnitude of the pressure difference Fa generated by the reduction of the pressure from the atmospheric pressure state is below the atmospheric pressure. That is, in a case where the adhesive tape DT is pressed against the wafer W using the pressure difference Fa, there is an upper limit to the magnitude of the force by which the adhesive tape DT is pressed against the back surface of the wafer W.

[0160] Thus, in a state where the adhesive tape DT is brought into contact with the wafer W by the pressure difference Fa based on the reduction of the pressure, the adhesion of the adhesive tape DT to the wafer W is low. In addition, in the conventional structure using the first pressing member, the pressing force can be applied only to a limited portion of the adhesive tape DT. In addition, the magnitude of the pressing force is not sufficient, and thus it is difficult to improve the adhesion of the adhesive tape DT to the wafer W.

[0161] In contrast, in the present application, the upper space H2 and the lower space Hl inside the chamber 29 are pressurized to a pressure greater than the atmospheric pressure by using the pressurizing device 32. That is, in the second adhering process, the pressing forces VI, V2, which are sufficiently greater than the pressure difference Fa, can be applied to the adhesive tape DT and the wafer W. In addition, the pressing forces VI, V2 are applied to the entire surface of the adhesive tape DT adhered to the wafer W. Thus, by performing the second adhering process, the adhesion of the adhesive tape DT to the wafer W can be greatly improved, and thus peeling of the adhesive tape DT from the wafer W can be prevented even after a lapse of time after the completion of the series of adhering processes.

[0162] In addition, by appropriately controlling the pressurizing device 32 in the second adhering process, the magnitudes of the pressing forces VI and V2 can be adjusted to arbitrary values. Thus, even in a case where various conditions are changed, for example, the constituent material of the adhesive material Tb or the size of the wafer W and the thickness of the annular protrusion Ka, the adhesive tape DT can be reliably adhered to the annular protrusion formation surface of the wafer W by appropriately adjusting the magnitudes of the pressing forces VI and V2. In addition, since the pressing forces VI and V2 of appropriate magnitudes are uniformly applied to the entire adhesive tape DT, the wafer W can be prevented from being damaged by the application of excessive pressing forces or the deviation of the pressing forces.

[0163] [Example 2]

[0164] Hereinafter, Embodiment 2 of the present invention will be described with reference to the accompanying drawings. In Embodiment 1, an example was described where, after a strip of adhesive tape DT is pasted across the back side of the wafer W and the ring holder f, the adhesive tape DT is cut into a predetermined shape corresponding to the shape of the workpiece (here, the shape of the wafer W or the ring holder f). In Embodiment 2, an example was described where an adhesive tape having a predetermined shape corresponding to the shape of the workpiece is pasted onto the workpiece. Furthermore, for structures identical to the adhesive sheet pasting device 1 of Embodiment 1, only the same reference numerals are used; different structural parts will be described in detail.

[0165] First, the structure of the adhesive tape DT in Example 2 will be explained. Figure 18 (a) is a perspective view showing the back side of the conveyor sheet P and the adhesive tape DT. Figure 18 (b) is a longitudinal sectional view of the conveyor sheet P and the adhesive tape DT.

[0166] like Figure 18 As shown in (a), the adhesive tape DT of Example 2 is held by a strip-shaped transport sheet P. That is, the adhesive tape DT of a predetermined shape is adhered to one side of the strip-shaped transport sheet P at a predetermined interval and held thereby. The adhesive tape DT is pre-cut into a predetermined shape corresponding to the shape of the forming surface (back side in this example) of the annular protrusion Ka of the wafer W. In Example 2, the adhesive tape DT is pre-cut into a circular shape.

[0167] like Figure 18 As shown in (b), the transport sheet P has a structure consisting of a non-adhesive substrate Pa and an adhesive material Pb laminated together. Examples of materials constituting the substrate Pa include polyolefins and polyethylene. Examples of materials constituting the adhesive material Pb include acrylic copolymers. By attaching the substrate Ta of the adhesive tape DT to the adhesive material Pb of the transport sheet P, the transport sheet P holds the adhesive tape DT. In this embodiment, the shape of the adhesive tape DT is circular, but the shape of the adhesive tape DT can be appropriately changed according to the shape of the wafer W.

[0168] The basic structure of the adhesive sheet pasting device 1 in Example 2 is similar to... Figures 3-6 The basic structure of the device shown in Embodiment 1 is the same. However, a conveyor sheet P is loaded into the sheet supply section 71, which holds multiple adhesive tapes DT that have been pre-formed into a predetermined shape. The sheet cutting mechanism 82 cuts the portion of the conveyor sheet P that is adhered to the annular frame f. After the conveyor sheet P is cut by the sheet cutting mechanism 82, the sheet recycling section 74 collects the unwanted conveyor sheets P remaining around the mounting frame MF.

[0169] <Actions in Example 2>

[0170] Here, the operation of the adhesive sheet pasting device 1 of Embodiment 2 will be explained. Figure 19 This is a flowchart illustrating a series of steps in which adhesive tape DT is bonded to wafer W using the adhesive sheet bonding apparatus 1 of Embodiment 2. Steps that are identical to those in the adhesive sheet bonding apparatus 1 of Embodiment 1 are simplified, while different steps are described in detail.

[0171] Step S1 (Workpiece Supply)

[0172] When the bonding command is issued, the wafer W and the ring holder f are supplied in the same manner as in Embodiment 1. That is, the ring holder f housed in the holder supply section 12 is transferred to the holder holding section 38 by the holder transport device 17. Furthermore, the wafer W housed in the container 5 is transferred to the holding stage 9 by the wafer transport device 16 via the alignment device 7. After the ring holder f and the wafer W are transferred, the lower housing 29A moves along the track 40 from the initial position to the bonding position. Figure 20 The image shows the state where platform 9 is moved to the pasting position.

[0173] Step S2 (Supply of adhesive sheet)

[0174] After the workpiece is supplied using the wafer transport device 16, adhesive tape DT is supplied in the bonding unit 13. That is, a predetermined amount of adhesive tape DT is released from the wafer supply section 71 along with the transport sheet P while peeling off the separator S. The transport sheet P, which is generally elongated, is guided upwards towards the bonding position along a predetermined transport path. At this time, as... Figure 21 As shown, the adhesive tape DT held by the transport sheet P is positioned above the wafer W placed on the holding stage 9.

[0175] Step S3 (Cavity Formation)

[0176] After the adhesive tape DT is supplied above the holding platform 9, a chamber 29 is formed. That is, as... Figure 22 As shown, the adhesive roller 85 is lowered. Then, while rolling on the conveyor sheet P, the adhesive roller 85 adheres the conveyor sheet P to the top of the lower housing 29A and the top of the annular frame f. In conjunction with the movement of the adhesive roller 85, a predetermined amount of adhesive tape DT is released from the sheet supply section 71 along with the conveyor sheet P while peeling off the separating sheet S.

[0177] After the adhesive tape DT is applied to the ring frame f, the adhesive roller 85 is returned to its initial position, and the upper housing 29B is lowered. As the upper housing 29B lowers, as... Figure 23 As shown, the portion of the conveying sheet P that is adhered to the top of the lower housing 29A is clamped between the upper housing 29B and the lower housing 29A to form a chamber 29. At this time, the conveying sheet P functions as a sealing material, and the chamber 29 is divided into a lower space H1 and an upper space H2 by the adhesive tape DT.

[0178] Step S4 (1st attaching process)

[0179] After the formation of the chamber 29, the 1st attaching process is started as in Embodiment 1. The control section 33 operates the vacuum device 31 to reduce the air pressure in the lower space Hl and the air pressure in the upper space H2 to predetermined values, and then makes the air pressure in the upper space H2 higher than the air pressure in the lower space Hl. By this control of the air pressures, a pressure difference Fa is generated between the lower space Hl and the upper space H2. By the elevation of the holding stage 9 and the deformation of the adhesive tape DT based on the pressure difference Fa, as shown in FIG. 6, the adhesive tape DT comes into contact with the back surface of the wafer W radially from the center portion toward the outer peripheral portion, and the back surface of the wafer W is covered with the adhesive tape DT. Figure 24

[0180] Step S5 (2nd attaching process)

[0181] After the back surface of the wafer W is covered with the adhesive tape DT using the vacuum device 31, the 2nd attaching process is performed as in Embodiment 1. First, the control section 33 lowers the holding stage 9, and operates the pressurizing device 32 to supply gas to the lower space Hl and the upper space H2 to pressurize the lower space Hl and the upper space H2 to specified values. By the pressurizing operation of the pressurizing device 32, the air pressure in the lower space Hl and the air pressure in the upper space H2 are both higher than the atmospheric pressure.

[0182] By the pressurization of the upper space H2, as shown in FIG. 7, a pressing force Vl acts on the adhesive tape DT from the upper space H2. Also, since the entire lower space Hl is pressurized, a pressing force V2 acts on the downwardly facing surface of the wafer W from the lower space Hl. That is, under the actions of the pressing forces Vl and V2 which are sufficiently large forces, the adhesive tape DT is attached to the back surface of the wafer W with good precision, and the adhesion of the wafer W to the adhesive tape DT is improved. Figure 25

[0183] After the pressing force is applied between the adhesive tape DT and the wafer W for a predetermined time in the state where the lower space Hl and the upper space H2 are pressurized to air pressures higher than the atmospheric pressure, the control section 33 stops the operation of the pressurizing device 32. Then, the control section 33 fully opens the electromagnetic valves 103, 105, 107, and 110 to open the lower space Hl and the upper space H2 to the atmosphere. The control section 33 elevates the upper housing 29B to open the chamber 29, and elevates the holding stage 9 to abut the surface of the wafer W against the wafer holding surface of the holding stage 9.

[0184] Step S6 (cutting of the transport sheet)

[0185] ​​Further, during the processes of steps S4 and S5, the sheet cutting mechanism 82 is operated in the chamber 29. In Embodiment 2, the process differs from that of Embodiment 1 in that the sheet cutting mechanism 82 cuts the transport sheet P at this point. That is, as shown in FIG. 9, the cutter 95 cuts the transport sheet P adhered to the ring-shaped frame f into the shape of the ring-shaped frame f, and the press roller 96 follows the cutter 95 and rolls on the sheet cutting site on the ring-shaped frame f while pressing. Figure 26

[0186] After the transport sheet P is cut into a circular shape, the upper housing 29B is raised. Since the processes of steps S4 and S5 are completed at the time of raising the upper housing 29B, the clamping roller 90 is raised to release the clamping of the adhesive tape DT. Thereafter, the clamping roller 86 is moved to wind and recover the unnecessary transport sheet P after cutting toward the sheet recovery portion 74, and a predetermined amount of the adhesive tape DT is discharged from the sheet supply portion 71 together with the transport sheet P.

[0187] Through the respective processes up to step S6, the mounting frame MF is formed. In the mounting frame MF of Embodiment 2, the ring-shaped frame f and the wafer W are integrated by the adhesive tape DT and the transport sheet P. After the unnecessary transport sheet P is wound and recovered, the clamping roller 86 and the adhering roller 85 return to the initial positions. Then, the holding table 9 is moved from the adhering position to the initial position while holding the mounting frame MF.

[0188] Step S7 (Recovery of Mounting Frame)

[0189] When the holding table 9 returns to the initial position, the chuck 28 provided to the frame transport device 17 adsorptively holds the mounting frame MF and separates the mounting frame MF from the lower housing 29A, as in Embodiment 1. The frame transport device 17 adsorptively holding the mounting frame MF transports the mounting frame MF to the frame recovery portion 6. The transported mounting frame MF is loaded and housed in the cassette 41.

[0190] The series of operations of adhering the adhesive tape DT to the wafer W ends above. Thereafter, the above-described processing is repeated until the mounting frame MF reaches a predetermined number. By using the adhesive sheet adhering device 1 of Embodiment 2, even in the case of using the adhesive tape DT that is cut into a predetermined shape in advance, the same effects as in Embodiment 1 can be obtained. That is, in the case of adhering the adhesive tape DT to the annular convex portion formation surface of the wafer W having the annular convex portion, the adhesive tape DT can be adhered to the wafer W with good precision while avoiding damage to the wafer W.

[0191] ​Moreover, all the inventive points of the embodiments disclosed this time are illustrative, not restrictive. The scope of the present application is not shown by the description of the above embodiments, but is shown in the claims, and includes all modifications (variations) within the equivalent meaning and scope of the claims. As an example, the present application can be implemented by being modified as follows.

[0192] (1) In step S4 of each embodiment, after the air pressure of the lower space Hl and the air pressure of the upper space H2 are reduced to predetermined values, the air pressure of the upper space H2 is returned to the atmospheric pressure, thereby generating the pressure difference Fa, but the adjustment of the air pressure in step S4 is not limited to this. That is, after the air pressure of the lower space Hl and the air pressure of the upper space H2 are reduced to predetermined values, the air pressure of the lower space Hl can be maintained at the predetermined value, and the opening degree of the electromagnetic valve 105 can be appropriately adjusted to perform the discharge.

[0193] In this case, the air pressure of the upper space H2 is controlled to rise from the predetermined value to a specific value lower than the atmospheric pressure, and the pressure difference Fa is generated by this control. After the annular convex portion formation surface of the wafer W is covered with the adhesive tape DT by the use of the adhesive tape DT under the action of the pressure difference Fa, the control section 33 opens the electromagnetic valves 103, 105, 107, 110 to open the upper space H2 and the lower space Hl to the atmosphere. By this atmospheric opening, the first sticking process is completed.

[0194] In the structure in which the air pressure of the upper space H2 is returned to the atmospheric pressure to generate the pressure difference Fa as in each embodiment, the pressure difference Fa can be further increased, and thus the process of deforming the adhesive tape DT to cover the annular convex portion formation surface of the wafer W with the adhesive tape DT can be completed more quickly. On the other hand, in the structure in which the air pressure of the upper space H2 is adjusted to a specific value higher than the air pressure of the lower space Hl and lower than the atmospheric pressure to generate the pressure difference Fa as in the variation of (2), the deformation speed of the adhesive tape DT is suppressed to be low. Thus, it is possible to avoid a situation in which the adhesive tape DT prematurely covers the annular convex portion formation surface of the wafer W during the period in which the air discharge of the lower space Hl is not completed, and thus it is possible to prevent a gap from being generated between the adhesive tape DT and the wafer W.

[0195] (2) In step S5 of each embodiment, the pressurizing device 32 pressurizes the interiors of both the lower space Hl and the upper space H2, but is not limited to this. That is, the pressurizing device 32 can pressurize only the upper space H2 to an air pressure higher than the atmospheric pressure, and the adhesive tape DT can be stuck with higher precision and better accuracy by the use of the pressing force VI.

[0196] As a further modification of the structure in which only the upper space H2 is pressurized, there can be a structure in which the inside of the upper space H2 is pressurized to be higher than the atmospheric pressure while the inside of the lower space Hl is maintained to be depressurized to be lower than the atmospheric pressure, thereby adhering the adhesive tape DT. In this structure, after the first adhering process based on the pressure difference Fa is performed in step S4, the pressure of the lower space Hl is maintained to be depressurized to a predetermined value, and the electromagnetic valve 105 connected to the upper space H2 is opened to open only the upper space H2 to the atmosphere. Then, in step S5, the pressurizing device 32 is operated to pressurize the inside of the upper space H2 to be higher than the atmospheric pressure.

[0197] In this modification, in step S5, the inside of the upper space H2 is pressurized to perform the second adhering process in a state where the holding table 9 is raised to abut against the back surface of the wafer W. By pressurizing the upper space H2 to generate the pressing force VI in a state where the wafer W is held by the holding table 9, the pressing force VI can be uniformly applied to the entire surface of the adhesive tape DT and the entire surface of the wafer W even if the lower space Hl is depressurized to be lower than the atmospheric pressure.

[0198] (3) In step S4 of each embodiment, the inside of the chamber 29 is made to have the pressure difference Fa by using the vacuum device 31, thereby deforming the adhesive tape DT to be convex and contacting the annular convex portion forming surface of the wafer W, but the method of deforming the adhesive tape DT to be convex is not limited to the structure of generating the pressure difference Fa. That is, as shown in FIG. 14, there can be a structure in which a pressing member 141 is provided in the inside of the upper housing 29B. Figure 28

[0199] The bottom surface of the pressing member 141 is convex (as one example, hemispherical), and the pressing member 141 is disposed to be located above the adhesive tape DT. Therefore, by lowering the pressing member 141, the bottom surface of the pressing member 141 which is convex presses the adhesive tape DT, and the adhesive tape DT can be deformed to be convex and contact the wafer W. In this case, the structure required to generate the pressure difference Fa can be omitted. Further, as another structure of deforming the adhesive tape DT to be convex, there can be a structure of pressing the adhesive tape DT from above using a roller or the like.

[0200] (4) In each embodiment, the structure in which the adhesive tape DT for support is adhered to the wafer W is exemplified, but the adhesive sheet adhered to the wafer W is not limited thereto. If the structure in which the sheet-shaped adhesive material exemplified by the adhesive tape for circuit protection is adhered, the structure of each embodiment can be applied.

[0201] ​(5) In each embodiment, as the work to which the adhesive sheet is attached, a wafer W and a ring-shaped holder f are exemplified, but the work is not limited thereto. As one example, it can also be that the adhesive sheet is attached only to the wafer W by omitting the ring-shaped holder f. In addition, for the structure of the present embodiment, various semiconductor members such as a substrate, a panel, and the like can be applied as the work. Also, as the shape of the work, in addition to a circular shape, a rectangular shape, a polygonal shape, a substantially circular shape, and the like can be used.

[0202] (6) In each embodiment, the adhesive tape DT is attached to the wafer W by causing the holding table 9 to move up and down at a predetermined timing, but the up-and-down movement of the holding table 9 can be appropriately changed. As one example, it is not limited to the structure in which the pressing process of step S5 is performed after the holding table 9 is lowered, but the pressing process can be performed while the raised state is maintained.

[0203] (7) In each embodiment, the holder holding portion 38 is provided outside the lower housing 29A, but the holder holding portion 38 can be provided inside the lower housing 29A. In this case, the process after step S4 is performed in a state in which the ring-shaped holder f and the wafer W are respectively housed inside the chamber 29.

[0204] (8) In Embodiment 2, the adhesive tape DT is pre-formed into a predetermined shape corresponding to the shape of the annular convex portion forming surface of the wafer W, but it is not limited thereto. That is, it can also be that the sheet supply portion 71 is filled with a long strip-shaped adhesive tape DT to which a long strip-shaped transport sheet P is attached. The structure of the long strip-shaped adhesive tape DT to which the long strip-shaped transport sheet P is attached is as shown in (a) of FIG. 20. In this case, the adhesive sheet attaching device 1 is provided with a sheet cutting device 201 upstream of the chamber 29, and the sheet cutting device 201 forms the long strip-shaped adhesive tape DT into a predetermined shape. Figure 29

[0205] The structure of the sheet cutting device 201 is as shown in (b) of FIG. 20. The sheet cutting device 201 is provided with a support table 203, a cutter 205, and an adhesive sheet recovery portion 207. In addition, the adhesive tape DT and the transport sheet P discharged from the sheet supply portion 71 are inverted by an inversion device not shown, and the adhesive tape DT is supplied to the sheet cutting device 201 in a state in which it is positioned above the transport sheet P. Figure 29

[0206] The support table 203 is provided to horizontally receive the long strip-shaped adhesive tape DT and the transport sheet P positioned on the lower side among those supplied from the sheet supply portion 71 in the direction L. The cutter 205 is provided above the support table 203 and can move up and down by a movable table not shown. As one example of the cutter 205, a circular ring-shaped Thomson knife can be used.

[0207] ​​The adhesive tape DT is cut off by the knife 205 descending, so that the layer of the adhesive tape DT in the transport sheet P is cut off in the shape of the circular ring-like trajectory K. The structure of the knife 205 cutting off the adhesive tape DT is not limited to this, and as other examples, there are a structure in which the knife-like knife 205 moves along a circular trajectory to cut off the adhesive tape DT in a circular shape, and the like.

[0208] The adhesive sheet recovery section 207 recovers the unnecessary adhesive tape DTn remaining around the adhesive tape DT cut off in a circular shape. The unnecessary portion of the adhesive tape DTn is peeled off from the transport sheet P immediately behind the transport roller 208. The peeled-off adhesive tape DTn is guided to the recovery winding drum 210 by the guide roller 209. The recovery winding drum 210 winds and recovers the adhesive tape DTn peeled off from the transport sheet P. Thus, the adhesive tape DT shaped in a circle by the knife 205 by the sheet cutting device 201 becomes a state of remaining on the transport sheet P.

[0209] The adhesive tape DT cut off in a circle is guided to the chamber 29 together with the transport sheet P. Further, the adhesive tape DT and the transport sheet P are inverted again by an inversion device not shown downstream of the sheet cutting device 201, and the adhesive tape DT is guided to the chamber 29 in a state of being positioned on the lower side of the transport sheet P.

[0210] (9) In each of the embodiments, as shown in (a) of Figure 30 the chamber 29 can also be provided with a sheet-like elastic body Ds. Hereinafter, the structure of Embodiment 2 will be exemplified and the present modification will be described.

[0211] The elastic body Ds is disposed inside the upper housing 29B and is configured to be in contact with the inner diameter of the upper housing 29B. Further, the lower surface of the elastic body Ds and the cylindrical bottom portion of the upper housing 29B are configured to be flush. Thus, when the lower housing 29A and the upper housing 29B sandwich the transport sheet P to form the chamber 29, the elastic body Ds comes into abutment with the transport sheet P. Specifically, the elastic body Ds comes into abutment with the surface of the transport sheet P on the side opposite to the surface on which the adhesive tape DT is held (the upper surface side in the drawing). By disposing the elastic body Ds to be in contact with the inner diameter of the lower housing 29A, the elastic body Ds is not sandwiched when the chamber 29 is formed, and thus it is possible to prevent the airtightness of the chamber 29 from being reduced due to the elastic body Ds. As examples of the material constituting the elastic body Ds, there are rubber, elastomer, or gel-like high molecular materials, and the like.

[0212] By providing the chamber 29 with the elastic body Ds, it is possible to make the curvature of the adhesive tape DT more uniform when the adhesive tape DT is deformed into a convex shape in step S4. Here, the effects of the structure provided with the elastic body Ds will be described. As one example, in the case where the adhesive tape DT is constituted by a relatively hard material, as shown in Figure 30The curvature of the adhesive tape DT easily becomes uneven.

[0213] That is, in the region P1 of the transport sheet P in which the adhesive tape DT is held by the transport sheet P, the adhesive tape DT is relatively hard, and thus the curvature of the transport sheet P based on the pressure difference Fa is small. On the other hand, in the region P2 of the transport sheet P in which the adhesive tape DT is not held by the transport sheet P, the curvature of the transport sheet P based on the pressure difference Fa is relatively large. That is, under the action of the pressure difference Fa, the region P2 is more easily deformed, and thus the curvature of the transport sheet P in the region P1 is further reduced.

[0214] In addition, in the adhesive tape DT, the curvature of the adhesive tape DT is large on the side close to the region P2, and the curvature of the adhesive tape DT is small in the central portion of the adhesive tape DT. Thus, in the adhesive tape DT and the transport sheet P, respectively, the curvature based on the pressure difference Fa is uneven. As a result, for the adhesive tape DT which is attached to the wafer W, the adhesion of the adhesive tape DT to the wafer W is reduced.

[0215] On the other hand, in the case where the elastic body Ds is provided, as shown in Figure 30 As shown in (c) of FIG. 12, under the action of the pressure difference Fa, the entire elastic body Ds uniformly deforms convexly. Thus, the curvature of the transport sheet P in the region P1 is increased and the difference between the curvature in the region P1 and the curvature in the region P2 is reduced, and thus the curvature of the transport sheet P and the curvature of the adhesive tape DT become uniform as a whole. That is, the adhesive tape DT easily deforms in accordance with the shape of the annular convex portion forming surface of the wafer W, and thus the adhesion of the adhesive tape DT to the wafer W can be further improved.

[0216] (10) In each of the embodiments, a structure which heats the adhesive tape DT can also be provided. As one example of the structure which heats the adhesive tape DT, as shown in (a) of FIG. 13, a sheet attaching mechanism 81 has a heating mechanism 120 inside the upper case 29B. The heating mechanism 120 has a working cylinder 121 and a heating member 123. The working cylinder 121 is coupled to the upper portion of the heating member 123, and the heating member 123 is capable of ascending and descending inside the chamber 29 by the action of the working cylinder 121. In addition, the heating member 123 can also not be a structure which is capable of ascending and descending, provided that the heating member 123 is capable of heating the adhesive tape DT. Figure 31 A heater 125 which heats the adhesive tape DT is embedded inside the heating member 123. The heating temperature based on the heater 125 is adjusted to a temperature at which the adhesive tape DT becomes soft. As one example of the temperature of the heating, 50°C to 70°C or so can be given. The shape of the bottom surface of the heating member 123 can be changed in accordance with the shape of the wafer W. As one example, the heating member 123 as a whole is cylindrical.

[0217] In addition, in the adhesive tape DT, the curvature of the adhesive tape DT is large on the side close to the region P2, and the curvature of the adhesive tape DT is small in the central portion of the adhesive tape DT. Thus, in the adhesive tape DT and the transport sheet P, respectively, the curvature based on the pressure difference Fa is uneven. As a result, for the adhesive tape DT which is attached to the wafer W, the adhesion of the adhesive tape DT to the wafer W is reduced.

[0215] On the other hand, in the case where the elastic body Ds is provided, as shown in Figure 30 As shown in (c) of FIG. 12, under the action of the pressure difference Fa, the entire elastic body Ds uniformly deforms convexly. Thus, the curvature of the transport sheet P in the region P1 is increased and the difference between the curvature in the region P1 and the curvature in the region P2 is reduced, and thus the curvature of the transport sheet P and the curvature of the adhesive tape DT become uniform as a whole. That is, the adhesive tape DT easily deforms in accordance with the shape of the annular convex portion forming surface of the wafer W, and thus the adhesion of the adhesive tape DT to the wafer W can be further improved.

[0216] (10) In each of the embodiments, a structure which heats the adhesive tape DT can also be provided. As one example of the structure which heats the adhesive tape DT, as shown in (a) of FIG. 13, a sheet attaching mechanism 81 has a heating mechanism 120 inside the upper case 29B. The heating mechanism 120 has a working cylinder 121 and a heating member 123. The working cylinder 121 is coupled to the upper portion of the heating member 123, and the heating member 123 is capable of ascending and descending inside the chamber 29 by the action of the working cylinder 121. In addition, the heating member 123 can also not be a structure which is capable of ascending and descending, provided that the heating member 123 is capable of heating the adhesive tape DT. Figure 31 A heater 125 which heats the adhesive tape DT is embedded inside the heating member 123. The heating temperature based on the heater 125 is adjusted to a temperature at which the adhesive tape DT becomes soft. As one example of the temperature of the heating, 50°C to 70°C or so can be given. The shape of the bottom surface of the heating member 123 can be changed in accordance with the shape of the wafer W. As one example, the heating member 123 as a whole is cylindrical.

[0217]

[0218] Further, it is preferable that the upper space H2 be heated in advance using the heating mechanism 120 before the start of the step S4. That is, the control section 33 causes the heater 125 to operate to heat the heating member 123 to a predetermined temperature. By heating the heating member 123, the upper space H2 is heated by the heat conduction effect, and further the adhesive tape DT is heated.

[0219] The adhesive tape DT is heated to become soft, and therefore the deformability of the adhesive tape DT based on the pressure difference Fa is improved. That is, when the wafer W is covered with the adhesive tape DT, the followability of the adhesive tape DT to the wafer W can be further improved. Further, as Figure 31 As shown in (b) of FIG. 10, it is also possible that the heating member 123 is lowered to approach or abut against the adhesive tape DT, and the adhesive tape DT is directly heated by the heating member 123.

[0220] (11) In the embodiment, the heating mechanism 120 is provided on the upper space H2 side in the chamber 29, and is a structure for heating the upper space H2, but is not limited thereto. That is, the heating mechanism 120 can also be a structure for heating the lower space Hl. As one example, a structure in which the heater 125 is provided inside the holding table 9, and the adhesive tape DT is heated by heating the lower space Hl by the heater 125 can be given. Further, the heating mechanism 120 can also be a structure for heating both the upper space H2 and the lower space Hl.

Claims

1. A method for pasting adhesive sheets, characterized in that, The adhesive patch application method has the following features: In the first bonding process, an adhesive sheet and a workpiece having an annular protrusion on one side of its outer periphery are housed in a cavity. With the internal space of the cavity depressurized, the adhesive sheet is brought into contact with the annular protrusion forming surface of the workpiece, thereby covering the annular protrusion forming surface with the adhesive sheet; and The second bonding process, which occurs after the first bonding process, involves increasing the pressure within the chamber to bond the adhesive sheet to the annular protrusion forming surface. For the second bonding process, with the entire surface of the workpiece opposite to the annular protrusion forming surface in contact with space, a first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet are applied to the workpiece.

2. The adhesive sheet pasting method according to claim 1, characterized in that, During the first bonding process, the adhesive sheet is deformed into a convex shape towards the annular protrusion forming surface of the workpiece, thereby causing the adhesive sheet to contact the annular protrusion forming surface of the workpiece.

3. The adhesive sheet pasting method according to claim 1, characterized in that, During the second pasting process, the pressure inside the chamber is increased to above atmospheric pressure.

4. The adhesive sheet pasting method according to claim 2, characterized in that, The chamber comprises an upper shell and a lower shell. The first pasting process has the following characteristics: In the process of forming the upper and lower space, the internal space of the chamber is divided into a lower space for the workpiece in the state of having the annular protrusion forming surface facing upward, and an upper space opposite to the lower space through the adhesive sheet by using the upper shell and the lower shell to hold the adhesive sheet. The upper and lower spaces are depressurized during the depressurization process. as well as The contact process occurs after the decompression process in the upper and lower spaces. Under the pressure difference generated between the upper and lower spaces, where the pressure in the upper space is higher than that in the lower space, the adhesive sheet deforms into a convex shape toward the annular protrusion forming surface, causing the adhesive sheet to contact the annular protrusion forming surface of the workpiece.

5. The adhesive sheet pasting method according to claim 2, characterized in that, The chamber comprises an upper shell and a lower shell. The first pasting process has the following characteristics: In the process of forming the upper and lower space, the internal space of the chamber is divided into a lower space for the workpiece in the state of having the annular protrusion forming surface facing upward, and an upper space opposite to the lower space through the adhesive sheet by using the upper shell and the lower shell to hold the adhesive sheet. as well as In the decompression contact process, under the pressure difference generated between the upper and lower spaces by decompressing only the lower space, the adhesive sheet is deformed into a convex shape toward the annular protrusion forming surface. In the state where the lower space is decompressed, the adhesive sheet contacts the annular protrusion forming surface of the workpiece.

6. The adhesive sheet pasting method according to claim 4 or 5, characterized in that, The adhesive sheet has a predetermined shape corresponding to the annular protrusion forming surface of the workpiece and is held by a long conveying sheet. During the formation of the upper and lower spaces, the internal space of the chamber is divided into a lower space for the workpiece to be positioned with the annular protrusion facing upward, and an upper space opposite to the lower space by the adhesive sheet held by the conveyor plate.

7. The adhesive sheet pasting method according to claim 4 or 5, characterized in that, It has a sheet-like elastomer disposed inside the upper housing. The sheet-like elastomer is configured such that, by forming the cavity during the formation of the upper and lower spaces, the sheet-like elastomer abuts against the adhesive sheet.

8. The adhesive sheet pasting method according to claim 4 or 5, characterized in that, The adhesive patch bonding method includes a heating process, in which the adhesive patch is heated by heating at least one of the lower space and the upper space. During the first bonding process, the adhesive sheet, which has been heated by the heating process, is brought into contact with the annular protrusion forming surface of the workpiece.

9. An adhesive sheet pasting device, characterized in that, The adhesive patch application device has the following features: A first bonding mechanism houses an adhesive sheet and a workpiece having an annular protrusion on the outer periphery of one side within a chamber. While the internal space of the chamber is depressurized, the adhesive sheet is brought into contact with the annular protrusion forming surface of the workpiece, thereby covering the annular protrusion forming surface with the adhesive sheet. The second adhesive mechanism, after the first adhesive mechanism has covered the annular protrusion forming surface with the adhesive sheet, further adheres the adhesive sheet to the annular protrusion forming surface by increasing the pressure within the chamber. For the second adhesive mechanism, when the entire surface of the workpiece opposite to the annular protrusion is in contact with space, a first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet are applied to the workpiece.

10. A method for manufacturing a semiconductor product, comprising manufacturing a semiconductor product in a state in which an adhesive sheet is bonded to a workpiece having an annular protrusion forming surface on the outer periphery of one side, characterized in that... The manufacturing method of this semiconductor product includes: In the first bonding process, the workpiece and the adhesive sheet are housed in a chamber. With the internal space of the chamber depressurized, the adhesive sheet is brought into contact with the annular protrusion forming surface of the workpiece, thereby covering the annular protrusion forming surface with the adhesive sheet; and The second bonding process, which occurs after the first bonding process, involves increasing the pressure within the chamber to bond the adhesive sheet to the annular protrusion forming surface. For the second bonding process, with the entire surface of the workpiece opposite to the annular protrusion forming surface in contact with space, a first pressing force from the adhesive sheet toward the workpiece and a second pressing force from the workpiece toward the adhesive sheet are applied to the workpiece.

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