A modular press-fit semiconductor module

Abstract

The present invention discloses a modular, press-fit semiconductor module, comprising: a top plate, a chip unit group, an elastic component, and a bottom plate, each electrically connected in sequence. The chip unit groups and elastic components each comprise a plurality of groups; a group of elastic components is positioned above each chip unit group, each elastic component comprising at least as many elastic members as the number of chips contained in each chip unit group. Advantages: The semiconductor module of the present invention, through its modular design and conductive path structure, can enhance conductivity, equalize current, and reduce thermal resistance. The elastic press-fit ensures balanced force between the chips. The modular design also facilitates production, allowing for easy configuration of the number of modules based on demand.

Description

Technical Field

[0001] The invention relates to a modular press-fit semiconductor module, belonging to the technical field of power modules. Background Art

[0002] Press-fit IGBT devices, with their advantages such as a short-circuit failure mode and double-sided heat dissipation, are particularly suitable for series and parallel applications in high-voltage, high-power power electronics. The core of elastic press-fit modules lies in the design of the conductive path and elastic components. Existing elastic components place an elastic unit per chip, carrying current through independent conductive plates, resulting in poor current distribution. The disc springs in the elastic components contribute significantly to their cost, necessitating a comprehensive consideration of force buffering design and cost control. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the defects of the prior art and provide a modular press-fit semiconductor module.

[0004] To solve the above technical problems, the present invention provides a modular press-fit semiconductor module, comprising: a top plate, an elastic component, a chip unit group, and a bottom plate electrically connected in sequence, wherein the chip unit group and the elastic component each have a plurality of groups;

[0005] A group of elastic component groups is correspondingly arranged above each chip unit group. The chip unit group consists of at least two chip units. Each elastic component group is provided with elastic members having a number no less than that of the chip units contained in each chip unit group.

[0006] Furthermore, each of the chip units includes a chip and a metal sheet, the chip is arranged on the base plate, and the metal sheet is arranged on the chip.

[0007] Furthermore, a lining plate and a reserved glue injection port are provided on the bottom plate, and the chip is connected to the lining plate.

[0008] Furthermore, each elastic component is provided with elastic members having the same number as the chip units included in each chip unit group, and the elastic members correspond to the chip units one by one.

[0009] Furthermore, the plurality of elastic members in the elastic assembly are arranged in a straight line.

[0010] Furthermore, the elastic member includes: a conductive column, a conductive frame and a spring;

[0011] One end of the conductive frame is electrically connected to the top plate, and the other end is electrically connected to the conductive column. The spring is arranged in the conductive frame, and the conductive column is electrically connected to the chip unit.

[0012] Furthermore, the conductive frame in the elastic member is integrally connected to the conductive frame of the adjacent elastic member in the same group of elastic components.

[0013] Furthermore, the conductive frame is a deformable conductive frame.

[0014] Furthermore, the two ends of the spring are respectively connected to the upper and lower ends of the conductive frame. In the working state, the conductive frame is compressed and deformed, and the spring is compressed.

[0015] Furthermore, all the chip unit groups are arranged on the bottom plate around a plurality of liner plates, and the gate of each chip of the chip unit is led out to one of the liner plates through an aluminum wire.

[0016] The beneficial effects achieved by the present invention are:

[0017] The semiconductor module of the present invention can improve conductivity, current distribution and reduce thermal resistance through modular design, and elastic compression makes the force between chips balanced; the modular design also facilitates production and the number of modules can be configured according to demand. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 It is a schematic diagram of the layout structure of the elastic component;

[0020] Figure 3 It is a schematic diagram of the chip layout structure;

[0021] Figure 4 This is another schematic diagram of the chip layout structure;

[0022] Figure 5 This is a schematic diagram of the elastic components corresponding to another chip layout structure;

[0023] Figure 6 It is a schematic diagram of the overall structure corresponding to another chip layout structure. DETAILED DESCRIPTION

[0024] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention.

[0025] like Figure 1-3 As shown, a modular press-fit semiconductor module comprises: a top plate 1, a chip unit group, an elastic component 4 and a bottom plate 2 electrically connected in sequence, wherein the chip unit group and the elastic component 4 each have several groups;

[0026] A group of elastic components 4 is provided above each chip unit group. Each elastic component 4 is provided with elastic members 5 whose number is not less than the number of the three chip units included in each chip unit group.

[0027] The chip unit group includes three chip units 3 . Each chip unit 3 includes a chip 32 and a metal sheet 31 . The chip 32 is arranged on the base plate 2 , and the metal sheet 31 is arranged on the chip 32 .

[0028] The chip and the liner are welded on the bottom plate 2. There is a strong buffer transfer metal sheet 31 on the chip. The gate of the chip 32 is led out to the metal surface of the liner 6 through an aluminum wire. The blank space in the middle is used to match the plastic shell and a glue injection port 7 is reserved.

[0029] Implementation case 1: In this embodiment, each elastic component 4 is provided with elastic parts with the same number of chips 3 contained in each chip unit group, and three are in a group. The elastic parts 5 correspond to the chips 3 one by one. The three elastic parts 5 in the elastic component 4 are arranged in a straight line, the three chips are set as a group, and the conductive sheet is set as an integrated structure, which greatly improves the current distribution, electrical conductivity and thermal conductivity.

[0030] Implementation Case 2: Figure 4-6 As shown, the difference from the first embodiment is that there are two chip units 3 in the chip unit group, and each elastic component 4 is provided with the same number of elastic members as the two chips contained in each chip unit group, and each group is two.

[0031] It should be noted that the chip unit group and the elastic component 4 can be combined in other ways, with two, three, four or other numbers forming a group and then being combined.

[0032] The chip unit group can be arranged in the U-shaped manner in Example 1 or in the non-U-shaped manner in Example 2. All chip unit groups are arranged on the base plate around several linings, and the gate of each chip of the chip unit is led out to one of the linings through an aluminum wire.

[0033] In order to improve the elastic pressing and make the force between the chips balanced, the elastic member 5 includes: a conductive column 51, a conductive frame 52 and a spring 53; one end of the conductive frame 52 is electrically connected to the top plate 1, and the other end is electrically connected to the conductive column 51. The spring 53 is arranged in the conductive frame 53, and the conductive column 51 is electrically connected to the chip 3; the conductive frame 52 in the elastic member 5 is integrally connected with the conductive frame 52 of the adjacent elastic member 5 in the same group of elastic components 4; the conductive frame 52 is a deformable conductive frame; the two ends of the spring 53 are respectively connected to the upper and lower ends of the conductive frame. In the working state, the pressure on the conductive frame 52 is compressed and deformed, and the spring 53 is compressed.

[0034] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A modular press-fit semiconductor module, characterized in that: include: A top plate (1), an elastic component (4), a chip unit group, and a bottom plate (2) electrically connected in sequence, wherein the chip unit group and the elastic component (4) each have a plurality of groups; A group of elastic components (4) is correspondingly provided above each chip unit group, the chip unit group is composed of at least two chip units (3), and each elastic component (4) is provided with elastic members (5) having a number not less than the number of chip units (3) included in each chip unit group; Several elastic members (5) in the elastic component (4) are arranged in a straight line; the elastic member (5) comprises: a conductive column (51), a conductive frame (52) and a spring (53); one end of the conductive frame (52) is electrically connected to the top plate (1), and the other end is electrically connected to the conductive column (51); the spring (53) is arranged in the conductive frame (52), and the conductive column (51) is electrically connected to the chip unit (3); the conductive frame (52) in the elastic member (5) is integrally connected to the conductive frame (52) of the adjacent elastic member (5) in the same group of elastic components (4); the conductive frame (52) is a deformable conductive frame.

2. The modular press-fit semiconductor module according to claim 1, wherein: Each chip unit (3) includes a chip (32) and a metal sheet (31), wherein the chip (32) is arranged on the bottom plate (2), and the metal sheet (31) is arranged on the chip (32).

3. The modular press-fit semiconductor module according to claim 2, wherein: The bottom plate (2) is further provided with a lining plate (6) and a reserved glue injection port (7), and the chip (32) is connected to the lining plate (6).

4. The modular press-fit semiconductor module according to claim 1, wherein: Each elastic component (4) is provided with elastic members (5) having the same number as the chip units (3) contained in each chip unit group, and the elastic members (5) correspond one to one with the chip units (3).

5. The modular press-fit semiconductor module according to claim 1, wherein: The two ends of the spring (53) are respectively connected to the upper and lower ends of the conductive frame (52). In the working state, the conductive frame (52) is pressed and deformed, and the spring (53) is compressed.

6. The modular press-fit semiconductor module according to claim 3, wherein: All the chip unit groups are arranged on the bottom plate (2) around a plurality of lining plates (6), and the gate of each chip of the chip unit is led out to one of the lining plates (6) through an aluminum wire.

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