Encapsulated devices and electronic devices

Abstract

Embodiments of the present disclosure provide a packaging device and an electronic device. The packaging device includes a first substrate having a first surface; a semiconductor chip coupled to the first surface of the first substrate; and a signal transfer device coupled to the first surface of the first substrate; wherein at least a portion of signals of the semiconductor chip are coupled to an external circuit via the signal transfer device. By leading a portion of signals of the semiconductor chip out of the packaging device to the external circuit via the signal transfer device, the number of connections on the substrate is reduced, thereby reducing the product size of the packaging device.

Description

Technical Field

[0001] This disclosure relates to semiconductor devices, and more particularly, to a packaged device and an electronic device. Background Technology

[0002] With the rapid development of modern electronic design, the trend towards miniaturization of packaged devices in future high-frequency, high-speed, and high-density applications will present a series of challenges for traditional packaging processes (e.g., FCBGA, Flip Chip Ball Grid Array). For example, as the number of signals increases, the spacing between pins cannot be infinitely reduced (minimum spacing limit), thus requiring an increase in package size, which contradicts the miniaturization requirements. Furthermore, as the number of signals increases, excessive vias from the top to the bottom layer of the package can disrupt the integrity of the power layer, leading to power supply issues. Additionally, excessively long vias from the top to the bottom layer, and excessively large connectors (such as BGA solder balls) on the bottom layer used for electrical connections to external circuits, can cause impedance discontinuities. Summary of the Invention

[0003] In view of this, the purpose of this disclosure is to provide a packaged device and an electronic device to solve the above-mentioned problems.

[0004] According to a first aspect of the present disclosure, a packaging device is provided, comprising:

[0005] A first substrate has a first surface;

[0006] A semiconductor chip is coupled to the first surface of the first substrate;

[0007] A signal switching device is coupled to the first surface of the first substrate;

[0008] In this circuit, at least a portion of the signals from the semiconductor chip are coupled to the external circuit via the signal conversion device.

[0009] Optionally, it also includes:

[0010] Multiple connectors, including a first end and a second end, wherein the first end is coupled to a second surface of the first substrate opposite to the first surface, and the second end is used for coupling with an external circuit.

[0011] The remaining signals, excluding at least a portion of the signals, are coupled to the external circuit via the plurality of connectors.

[0012] Optionally, the signal switching device is disposed at the edge of the first surface of the first substrate.

[0013] Optionally, a groove is provided on the first surface of the first substrate to accommodate the signal switching device.

[0014] Optionally, the signal switching device includes:

[0015] An adapter plate is fixed to the first surface of the first substrate.

[0016] Connector, soldered to the adapter board,

[0017] A flexible circuit board includes a fixed end and a free end, the fixed end being fixedly connected to the connector, and the free end being used to connect to the external circuit.

[0018] Optionally, the connector includes a first connector and a second connector respectively soldered to opposite first and second surfaces of the adapter plate. The flexible circuit board includes a first flexible circuit board and a second flexible circuit board. The fixed end of the first flexible circuit board is fixedly connected to the first connector, and the free end of the first flexible circuit board is used to connect to the external circuit. The fixed end of the second flexible circuit board is fixedly connected to the second connector, and the free end of the second flexible circuit board is used to connect to the external circuit.

[0019] Optionally, the positions where the fixed end of the first flexible circuit board is fixedly connected to the first connector and the positions where the fixed end of the second flexible circuit board is fixedly connected to the second connector correspond, and the contact areas of the fixed connections are the same.

[0020] Optionally, the first substrate is a packaging substrate.

[0021] According to a second aspect of the present disclosure, a packaging device is provided, comprising:

[0022] Multiple substrates, each substrate having a first surface;

[0023] Multiple semiconductor chips, wherein the multiple semiconductor chips are respectively coupled to a first surface of the multiple substrates;

[0024] At least one signal switching device, each signal switching device being simultaneously coupled to a first surface of a first substrate and a second substrate among the plurality of substrates, and for transmitting at least a portion of a signal between two semiconductor chips between a semiconductor chip coupled to the first substrate and a semiconductor chip coupled to the second substrate, wherein the first substrate and the second substrate are any two of the plurality of substrates.

[0025] Optionally, it further includes: a plurality of connector arrays corresponding one-to-one with the plurality of substrates, each connector array including a plurality of connectors, a first end of each connector in each connector array being coupled to a second surface of its corresponding substrate opposite to the first surface, and a second end of each connector being used for coupling with an external circuit, wherein the remaining signals other than the at least a portion of the signals are coupled to the external circuit via the connector array.

[0026] Optionally, the signal switching device includes:

[0027] Two physically separate adapter plates are respectively coupled to the first surface of the first substrate and the first surface of the second substrate;

[0028] The two physically separate connectors are soldered to the two adapter plates respectively;

[0029] A flexible circuit board, including components respectively coupled to the two connectors. According to a third aspect of the present disclosure, an electronic device is provided, comprising:

[0030] The aforementioned packaging devices;

[0031] A printed circuit board used as the external circuit.

[0032] According to a fourth aspect of the present disclosure, an electronic device is provided, comprising:

[0033] The aforementioned packaging devices;

[0034] Printed circuit boards

[0035] The packaging device provided in this embodiment leads a portion of the electrical signals of the semiconductor chip to the external circuit through a signal conversion device, while the remaining electrical signals are led to the external circuit through connectors soldered to the substrate. Therefore, the number of connectors on the substrate can be reduced. When the number of connectors on the packaging substrate is reduced, the overall size of the packaging device will be reduced accordingly. At the same time, since the number and length of vias from the surface to the bottom layer of the packaging device are reduced, it helps to solve the problems of power supply and impedance discontinuity.

[0036] In BGA packaging, solder balls serve as connectors. Reducing the number of solder balls can significantly shrink the size of the packaged device, which is more conducive to the trend of products being lighter, thinner, and smaller. Attached Figure Description

[0037] The above and other objects, features, and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0038] Figure 1 This is a structural diagram of a packaging device provided in an embodiment of the present disclosure;

[0039] Figure 2 This is a structural diagram of a packaging device provided in another embodiment of this disclosure;

[0040] Figure 3 This is a structural diagram of a signal switching device provided in an embodiment of this disclosure;

[0041] Figure 4 It is a planar schematic diagram showing the positional relationship between multiple signal switching devices and semiconductor chips;

[0042] Figure 5 This is a schematic diagram of the structure of an electronic device constructed based on the above-described packaging device according to an embodiment of this disclosure;

[0043] Figure 6 This is a schematic diagram of the structure of an electronic device constructed based on the above-described packaging device according to another embodiment of this disclosure;

[0044] Figure 7 This is a structural block diagram of an electronic device provided in yet another embodiment of this disclosure. Detailed Implementation

[0045] The present disclosure is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present disclosure below, certain specific details are described in detail. Those skilled in the art will fully understand the present disclosure even without these details. To avoid obscuring the substance of the present disclosure, well-known methods, processes, and procedures are not described in detail. Furthermore, the accompanying drawings are not necessarily drawn to scale.

[0046] The following terms are used in this article.

[0047] The term "solder ball" or "solder ball" used in BGA packaging refers to a pin located outside the package, which is typically spherical in shape, hence the name solder ball or solder ball. The connector proposed in this disclosure is a broader electronic connection element, whose form includes, but is not limited to, a spherical shape, and can refer not only to BGA packaging but also to other packaging processes; therefore, the term "connector" is defined according to its function. Other packaging processes, such as mounting chips onto printed circuit boards using IC sockets, involve soldering the IC socket to the printed circuit board first to avoid damage to the chip during soldering, after which the chip can be inserted into the IC socket.

[0048] Figure 1 This is a structural diagram of a packaging device provided in an embodiment of the present disclosure. As shown in the figure, the packaging device 100 includes a substrate 103 and a semiconductor chip 101 disposed on the substrate 103.

[0049] As the core material for chip packaging, substrate 103 protects, fixes, and supports the chip, enhances its thermal conductivity and dissipation performance, and ensures the chip is not physically damaged. Substrate 103 typically consists of multiple layers. Depending on their function, these layers can be power layers, signal layers, ground layers, and insulating layers. Each layer is generally made of conductive and / or insulating materials; for example, signal layers are constructed using conductive metals such as copper foil, while ground layers are made of insulating materials. Electrical interconnections between different layers are achieved using vias. Vias are created by laser drilling followed by copper plating or copper bump plating.

[0050] The substrate 103 includes electrically connected signal wires and signal vias. The signal wires can be disposed on the signal layer and electrically connected to external circuits through the signal vias. The external circuits can be external PCBs (Printed Circuit Boards) or external semiconductor chips (die) 101.

[0051] As shown in the figure, a connector 102 is provided on the upper surface of the substrate 103 to electrically connect with the semiconductor chip 101. A pad 105 and solder balls 104 electrically connected to the pad 105 are provided on the lower surface of the substrate 103. The solder balls 104 are used for electrical connection with external circuits (e.g., printed circuit boards). However, it should be noted that the use of solder balls to connect external circuits is based on BGA packaging technology. BGA packaging, or Ball Grid Array packaging, is a packaging process in which an array of solder balls is fabricated on the bottom surface of the packaging substrate as terminals for interconnection with the substrate (e.g., printed circuit board). However, the connection method in this embodiment is not limited to BGA packaging; therefore, other forms of connectors can be used for electrical connection with external circuits. Such connectors (including solder balls) can be made of a single metal, such as, but not limited to, copper or nickel, or made of alloy materials with good electrical conductivity, such as, but not limited to, SnAg alloys, SnCu alloys, SnCuBi alloys, etc. Furthermore, the shape of the connector is not limited to a sphere; it can also be columnar, drum-shaped, or cuboid.

[0052] In this embodiment, according to function, the semiconductor chip 101 can be various chips, such as memory chips, radio frequency chips, processor chips, high-speed communication chips, microelectronic system chips, etc. Furthermore, it should be understood that although a single semiconductor chip is shown on the substrate in the figure, any number of chips can be coupled to the substrate 103.

[0053] Based on the device structure described above, it can be understood that electrical signals can be transmitted from the semiconductor chip 101 to the solder ball 104 via signal wires and signal vias in the substrate, and then to the external circuit via the solder ball 104; alternatively, electrical signals can be transmitted from the external circuit to the solder ball 104, and then to the semiconductor chip 101 via signal wires and signal vias in the substrate. This is the typical signal transmission path. Furthermore, power signals are also transmitted from an external power source to the semiconductor device 101 via the solder ball 104 and the substrate.

[0054] In this embodiment, the packaged device 100 further includes a signal transceiver 106 disposed on the upper surface of the substrate 103. The signal transceiver 106 undertakes a portion of the electrical signal transmission task between the semiconductor chip 101 and the external circuit. That is, a portion of the electrical signal from the semiconductor chip 101 is no longer transmitted to the solder balls and then to the external circuit, but is instead transmitted to the signal transceiver 106 and then to the external circuit.

[0055] As shown in the figure, the signal adapter 106 is explicitly disposed at a corresponding position on the upper surface of the substrate 103. However, in some embodiments, a recess (not shown) may be provided at a corresponding position on the upper surface of the substrate 103, with electrically connected pins disposed inside the recess to accommodate at least a portion of the signal adapter 106 and to be electrically connected to the signal adapter 106. This helps to reduce the size of the packaged device.

[0056] The signal transmission path between the signal switching device 106 and the semiconductor chip 101 can be various. In some embodiments, such as... Figure 1 As shown, the signal transducer 106 receives electrical signals from the semiconductor chip 101 from the substrate 103 and transmits the electrical signals to an external circuit. In other embodiments, such as Figure 2 The packaged device shown is related to Figure 1 The difference in the packaged device 100 shown is that the signal converter 106 is directly electrically connected to the semiconductor chip 101. Therefore, a portion of the electrical signal of the semiconductor chip 101 is first transmitted to the signal converter 106 via the wire 108, and then transmitted to the external circuit by the signal converter 106.

[0057] The packaging device provided in this embodiment leads a portion of the electrical signals of the semiconductor chip to the external circuit through a signal conversion device, while the remaining electrical signals are led to the external circuit through the connectors on the substrate. Therefore, the number of connectors on the substrate is reduced accordingly. When the number of connectors on the substrate is reduced, the overall size of the packaging device will be reduced. Especially in BGA packaging, where solder balls are used as connectors, the reduction in the number of solder balls can significantly reduce the size of the packaging device, thereby contributing to the overall trend of product lightness, thinness and miniaturization.

[0058] It should be understood that the number of signals transferred by the signal conversion device can be designed according to actual needs. For example, all signals of a semiconductor chip can be transferred to an external circuit through the signal conversion device (in this case, the connectors of the packaged device can be omitted), or only a portion of the signals can be transferred to an external circuit through the signal conversion device.

[0059] Figure 3 This is a structural diagram of a signal conversion device provided in an embodiment of the present disclosure. As shown in the figure, the signal conversion device 300 includes an adapter plate 301, a connector 302, and a flexible circuit board 303.

[0060] The adapter board 301 can be a PCB board or an FPC structure. The adapter board 301 includes corresponding first and second surfaces. A portion of its first surface contacts and is electrically connected to the upper surface of the substrate 103. The substrate 103 also serves to support and fix the signal adapter 300. A connector 302 is soldered onto a portion of the first surface and a corresponding portion of the second surface of the adapter board 301. Through the two connectors 302, the adapter board 301 is in fixed contact and electrically connected to two flexible circuit boards 303. For ease of explanation, the end of the flexible circuit board 303 fixed to the connector 302 is called the fixed end 3031, and the end away from the fixed end 3031 is called the free end 3032. Because the flexible circuit board 303 has bendable physical properties, the free end 3032 can be bent to facilitate electrical connection with external circuits.

[0061] In some embodiments, the position where the fixed end 3031 of the flexible circuit board is fixedly connected to the connector corresponds to the position where the fixed end of the second flexible circuit board is fixedly connected to the second connector, and the contact area of ​​the fixed connection is the same.

[0062] Based on the above embodiments, a modified embodiment can also be provided, in which a connector 302 is soldered to only one surface of the adapter plate 301, and electrically connected to a flexible circuit board 303 through the connector 302. However, two connectors can transmit more electrical signals than one connector, and with connectors provided on both opposite surfaces of the adapter plate, it is also easier to achieve a transition from high-density cabling to relatively low-density cabling when the size of the packaged device is fixed.

[0063] Based on the above embodiments, another variation can be provided, in which, based on Figure 3 As shown, connector 302 is removed, and in the area where connector 302 was originally located, flexible circuit board 303 is directly soldered to adapter board 301 by pressure welding.

[0064] Based on the above embodiments, another variation can be provided, in which only a flexible circuit board is used to construct the signal switching device. One end of the flexible circuit board can be directly fixed and electrically connected to the upper surface of the substrate by welding, and the other end is used to couple with an external circuit.

[0065] Based on the above embodiments, there can be multiple signal switching devices, and their positional relationship with the semiconductor chip is not fixed. Figure 4 It is a planar schematic diagram showing the positional relationship between multiple signal transceivers and a semiconductor chip, such as... Figure 4 As shown, four signal transducers 106 of arbitrary shapes are arranged around the four directions of the semiconductor chip 101. That is, the signals drawn from the semiconductor chip 101 can be provided to external circuits via the four signal transducers 106.

[0066] Figure 5 This is a schematic diagram of an electronic device constructed based on a packaged device according to an embodiment of the present disclosure. As shown in the figure, the electronic device 500 includes a packaged device and a substrate 501. The packaged device includes a substrate 503 and a substrate 514. A plurality of connectors 502 and a plurality of connectors 516 are provided on the lower surface of the substrates 503 and 514 for electrical connection with the printed circuit board 501. Connectors 504 and 513 are provided on the upper surface of the substrates 503 and 514 for electrical connection with semiconductor chip 505 and semiconductor chip 512, respectively.

[0067] In some embodiments, BGA packaging technology can be used to electrically connect substrates 502 and 516 to printed circuit board 501. In this case, the plurality of connectors 502 and the plurality of connectors 516 disposed on the lower surfaces of substrates 503 and 514 include pads and solder balls and are arranged in an array on the lower surfaces.

[0068] In some embodiments, flip-chip bonding (Filp Chip on Board) can be used to electrically connect semiconductor chips 505 and 512 to the upper surfaces of substrates 503 and 514, respectively. Filp Chip on Board involves creating various micro-sized solder bumps at corresponding points on the periphery of the chip and connecting them to pre-prepared solder joints on the top surface of the substrate. If solder bumps are deployed throughout the entire surface of the chip, this flip-chip bonding method is specifically called C4 (Controlled Collapsed Chip Connection). Wire bonding is then used to connect the solder pads on the chip to the solder pads on the substrate. Finally, a molding encapsulation process is used for encapsulation.

[0069] As shown in the figure, the signal conversion device includes an adapter plate 507, a connector 508, a flexible circuit board 509, a connector 510, and an adapter plate 511. The lower surface of the adapter plate 507 contacts and is electrically connected to the upper surface of the substrate 503. The connector 508 is soldered to the upper surface of the adapter plate 507, and is fixed and electrically connected to the flexible circuit board 509 via the connector 508. The flexible circuit board 509 is fixed and electrically connected to the adapter plate 511 via the connector 510. The upper surface of the adapter plate 511 is fixed and electrically connected to the connector 510, and the lower surface of the adapter plate 511 is fixed and electrically connected to the upper surface of the substrate 514. The substrates 503 and 514 serve to support, fix, and electrically connect the signal conversion device.

[0070] In the aforementioned electronic device, signal transmission between semiconductor chips 505 and 512 is achieved through two paths: one part of the signal travels from semiconductor chip 505 via connector 504, substrate 503, and connector 502 to printed circuit board 501, and then from printed circuit board 501 via connector 516, substrate 514, and connector 513 to semiconductor chip 512; the other part of the signal travels from semiconductor chip 505 via connector 504 and substrate 503 to adapter board 507, and then from adapter board 507 via connector 508 and flexible circuit board 509 to connector 510, and then from connector 510 via adapter board 511, substrate 514, and connector 513 to semiconductor chip 512. Of course, the signal can also be transmitted along the reverse path.

[0071] It should be understood that, although in Figure 5The packaged device shown includes two semiconductor chips, but the scope of protection of this disclosure is not limited thereto. In some embodiments, a packaged device including two or more semiconductor chips is provided, the specific structure of which is described as follows: a plurality of substrates, each substrate having a first surface and a second surface opposite to the first surface; a plurality of semiconductor chips, respectively coupled to a plurality of first surfaces of the plurality of substrates; a plurality of connector arrays corresponding one-to-one with the plurality of substrates, each connector array including a plurality of connectors, the first end of each connector in each connector array being coupled to the second surface of its corresponding substrate and the second end of each connector being used for coupling with an external circuit; at least one signal switching device, each signal switching device being simultaneously coupled to the first surface of the first substrate and the second substrate of the plurality of substrates, and the signal switching device transmitting at least a portion of the signal between the semiconductor chip coupled to the first substrate and the semiconductor chip coupled to the second substrate, wherein the first substrate and the second substrate are any two of the plurality of substrates. In other words, in a packaged device that includes multiple (two or more) semiconductor chips, at least two semiconductor chips transmit a portion of their signals through a signal switching device instead of through connectors. This reduces the number of connectors on the substrate and consequently reduces the size of the packaged device. At the same time, the reduction in the number and length of vias from the top to the bottom layer of the packaged device helps to solve power supply and impedance discontinuity problems.

[0072] Furthermore, it should be understood that in a packaged device comprising multiple (two or more) semiconductor chips, the number of signals transferred by the signal switching device can be designed according to actual needs. For example, all signals between two semiconductor chips can be transferred through the signal switching device, or only a portion of the signals can be transferred. Alternatively, some semiconductor chips can use signal switching devices to transfer signals, while others can not have signal switching devices.

[0073] Figure 6 This is a schematic diagram of an electronic device constructed based on the above-described packaging device according to another embodiment of this disclosure. As shown in the figure, the electronic device 600 includes a printed circuit board 601, a substrate 603, and a substrate 614.

[0074] Connectors 602 and 616 are provided on the lower surfaces of substrates 603 and 614 for electrical connection with printed circuit board 601. Connectors 604 and 613 are provided on the upper surfaces of substrates 603 and 614 for electrical connection with semiconductor chip 605 and semiconductor chip 612, respectively.

[0075] and Figure 5The difference is that this electronic device uses two separate signal conversion devices. Referring to the figure, one signal conversion device, consisting of conversion board 607, connector 608 and flexible circuit board 609, is electrically connected to printed circuit board 601, and the other signal conversion device, consisting of conversion board 611, connector 610 and flexible circuit board 617, is coupled to printed circuit board 601.

[0076] In the aforementioned electronic device, a portion of the signal transmission between semiconductor chips 605 and 612 is via two signal conversion devices and a printed circuit board 601. A portion of the signal travels from semiconductor chip 605 to printed circuit board 601 via a signal conversion device consisting of conversion board 607, connector 608, and flexible circuit board 609, and then from printed circuit board 601 to semiconductor chip 612 via a signal conversion device consisting of conversion board 611, connector 610, and flexible circuit board 617. The signal can also be transmitted along the reverse path.

[0077] In the electronic device provided in the above embodiments, a signal transducer handles a portion of the signal transmission between two semiconductor chips, thereby reducing the number of connectors between the substrate and the printed circuit board. Correspondingly, the number of vias between the top and bottom layers of the packaged device is reduced, thus avoiding damage to the integrity of the power layer in the substrate. Furthermore, due to the reduced number of connectors between the substrate and the printed circuit board, the size of the electronic device is also reduced. Especially in BGA packaging, where solder balls serve as connectors, reducing the number of solder balls can significantly reduce the size of the electronic device, thus contributing to the overall trend towards lighter, thinner, and smaller products.

[0078] Figure 7 This is a structural block diagram of an electronic device provided in another embodiment of this disclosure. As shown above, the electronic device provides a motherboard 1000 on which various components are disposed. The motherboard 1000 is, for example, a printed circuit board. Various components are carried on the motherboard 1000, including, but not limited to, a processor 1002, a graphics processor 1003, a dynamic random access memory 1004, a static random access memory 1010, a flash memory 1006, a GPS chip 1008, etc. These components are physically and electrically coupled to the motherboard 1000. The motherboard 1000 provides communication functions between the various components. In a further embodiment, for example, the functions of some components may be integrated into the processor; for example, the dynamic random access memory 1004 and the static random access memory 1010 may be integrated into a system-on-a-chip and used as the processor 1002 in this embodiment.

[0079] The processor, derived from traditional computer systems, plays a crucial role in overall control and scheduling. While highly efficient in logic control, processors often lack specialization. Therefore, they are sometimes integrated with various dedicated acceleration units, such as acceleration units specifically for neural network model calculations, or graphics processors (GPUs) that are more efficient in graphics processing. In this embodiment, the processor 1002 and the graphics processor 1003 are integrated into the same electronic device via a motherboard 1000.

[0080] The communication chip enables wireless communication to facilitate the transmission of data to and from electronic device 10. The term "wireless" does not imply that the associated device does not contain any wires, although in some embodiments they may not. The communication chip can implement any of a variety of wireless standards or protocols, including but not limited to Wi-Fi (IEEE 802.11 series), WiMAX (IEEE 802.16 series), IEEE 802.20, LTE, Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, its derivatives, and any other wireless protocols designated as 3G, 4G, 5G, and above. Since there are many different communication protocols, a separate communication chip can be built based on each protocol. For example, the motherboard 1000 in the figure contains a GPS chip 1008 and a Bluetooth chip 1007. In addition, the motherboard 1000 may also contain chips dedicated to long-range wireless communication, such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, and Ev-DO. In addition, other functions, such as video encoding and decoding, compass, various component drivers, etc., can also be formed into various components and integrated into the electronic device 10 through the motherboard 1000.

[0081] Although not shown in the figure, according to the embodiments described above, some components include signal switching devices, whereby signal transmission between two components having signal switching devices is partially achieved through the motherboard 1000 and partially through the signal switching devices. This helps reduce the number of connectors between the components and the motherboard 1000, and also helps reduce signal interference.

[0082] In addition, the electronic device also includes components that are not integrated into the device 10 via the motherboard 1000, such as a sound card 1009, a keyboard 1012, a network card 1014, and a mouse 1013. These components provide input and output functions for the device 10.

[0083] Based on the above-mentioned packaging device, this disclosure also provides a method for forming such a packaging device, comprising: respectively disposing a semiconductor chip and a signal conversion device on a first surface of a substrate; coupling a portion of the signal of the semiconductor chip to the substrate; and connecting the remaining signal of the semiconductor chip to the signal conversion device.

[0084] This method allows signals from a semiconductor chip to be transmitted to a printed circuit board via a substrate and a signal transducer, thereby helping to reduce the number of connectors between the substrate and the printed circuit board, and thus helping to reduce the size of the packaged device containing the substrate and the semiconductor chip.

[0085] It should be understood that the substrate in the above embodiments may be one of a packaging substrate, a printed circuit board, and an intermediate substrate.

[0086] The commercial value of the embodiments disclosed herein

[0087] The packaging device provided in this disclosure transmits a portion of the signals from a semiconductor chip to an external circuit via a signal switching device. This improvement helps reduce the product size of the packaging device, meeting the requirements for thinner and smaller products, and thus has economic and commercial value.

[0088] It should be understood that the same or similar parts between the various embodiments in this specification can be referred to mutually, and each embodiment focuses on describing the differences from other embodiments. In particular, for the method embodiments, since they are basically similar to the methods described in the apparatus and system embodiments, the description is relatively simple, and relevant parts can be referred to in the description of other embodiments.

[0089] It should be understood that the foregoing describes specific embodiments of this specification. Other embodiments are within the scope of the claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0090] It should be understood that the use of a singular form to describe an element or to show only one element in the accompanying drawings does not imply that the number of such element is limited to one. Furthermore, modules or elements described or shown as separate herein may be combined into a single module or element, and modules or elements described or shown as single herein may be broken down into multiple modules or elements.

[0091] It should also be understood that the terminology and expressions used herein are for descriptive purposes only, and one or more embodiments described herein should not be limited to these terms and expressions. The use of these terms and expressions does not exclude any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various modifications that may exist should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

Claims

1. A packaged device, comprising: A first substrate has a first surface; A semiconductor chip is coupled to the first surface of the first substrate; A signal switching device is coupled to the first surface of the first substrate; Wherein, at least a portion of the signals from the semiconductor chip are coupled to an external circuit via the signal conversion device; the signal conversion device includes: The adapter plate includes a first surface and a second surface that correspond to each other, and a portion of the first surface of the adapter plate is fixed to the first surface of the first substrate; Two connectors are provided, with one connector welded to a portion of the first surface of the adapter plate and a portion of the second surface corresponding to the first surface of the adapter plate; Two flexible circuit boards, each of which includes a fixed end and a free end. The fixed end is fixedly connected to the connector, and the free end is used to connect to an external circuit. The fixed ends of the two flexible circuit boards and the two connectors are fixedly connected at corresponding positions and have the same contact area.

2. The packaging device according to claim 1, wherein, Also includes: Multiple connectors, including a first end and a second end, wherein the first end is coupled to a second surface of the first substrate opposite to the first surface, and the second end is used for coupling with an external circuit. The remaining signals, excluding at least a portion of the signals, are coupled to an external circuit via the plurality of connectors.

3. The packaging device according to claim 1 or 2, wherein the signal switching device is disposed at the edge of the first surface of the first substrate.

4. The packaging device according to claim 1 or 2, wherein a groove is provided on the first surface of the first substrate for accommodating the signal switching device.

5. The packaging device according to claim 1, wherein the connector comprises a first connector and a second connector respectively soldered to opposite first and second surfaces of the adapter plate, the flexible circuit board comprises a first flexible circuit board and a second flexible circuit board, the fixed end of the first flexible circuit board is fixedly connected to the first connector, the free end of the first flexible circuit board is used for connection to an external circuit, the fixed end of the second flexible circuit board is fixedly connected to the second connector, and the free end of the second flexible circuit board is used for connection to an external circuit.

6. The packaging device according to claim 5, wherein the position where the fixed end of the first flexible circuit board is fixedly connected to the first connector corresponds to the position where the fixed end of the second flexible circuit board is fixedly connected to the second connector, and the contact area of ​​the fixed connection is the same.

7. The packaging device according to any one of claims 1 to 6, wherein, The first substrate is a packaging substrate.

8. An electronic device comprising: The packaging device as described in any one of claims 1 to 7; as well as Printed circuit boards used as external circuits.

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