Dielectric resonator antenna module

Abstract

The present disclosure relates to dielectric resonator antenna modules. The present invention may provide an electronic device comprising an antenna module having a substrate. A phased antenna array of a dielectric resonator antenna and a radio frequency integrated circuit of the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antenna may include a dielectric column excited by a feed probe. The feed probe may be printed onto a side wall of the dielectric column or may be pressed against the side wall by a biasing structure. A plastic substrate may be molded over each dielectric column and each feed probe in the array. The feed probe may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned along a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle relative to the longitudinal axis.

Description

Technical Field

[0001] The present disclosure relates generally to electronic devices and, more particularly, to electronic devices having wireless circuitry. Background Art

[0002] Electronic devices often include wireless circuits. For example, cellular phones, computers, and other devices often contain antennas and wireless transceivers to support wireless communications.

[0003] It may be desirable to support wireless communications in millimeter wave and centimeter wave communication bands. Millimeter wave communications (sometimes referred to as extremely high frequency (EHF) communications) and centimeter wave communications involve communications at frequencies of approximately 10 GHz-300 GHz. Operations at these frequencies can support high bandwidths, but may present significant challenges. For example, radio frequency communications in millimeter wave and centimeter wave communication bands may be characterized by substantial attenuation and / or distortion during propagation of signals through various media. The presence of conductive electronic device components may also make it difficult to incorporate circuits for processing millimeter wave and centimeter wave communications into electronic devices. In addition, if care is not taken, manufacturing variations may undesirably limit the mechanical reliability and wireless performance of antennas in electronic devices.

[0004] It would therefore be desirable to be able to provide electronic devices with improved components for supporting millimeter-wave and centimeter-wave communications. Summary of the invention

[0005] An electronic device may be provided with a housing, a display, and wireless circuitry. The housing may include a peripheral conductive housing structure extending around the periphery of the device. The display may include a display cover mounted to the peripheral conductive housing structure. The wireless circuitry may include a phased antenna array that transmits radio frequency signals in one or more frequency bands between 10 GHz and 300 GHz. The phased antenna array may transmit the radio frequency signals through the display cover or other dielectric cover in the device.

[0006] The phased antenna array may include a probe-fed dielectric resonator antenna. The phased antenna array and a radio frequency integrated circuit (RFIC) of the phased antenna array may be integrated into an antenna module. The antenna module may include an antenna module substrate. The RFIC may be surface mounted to a first surface of the substrate, and the probe-fed dielectric resonator antenna is mounted to a second surface of the substrate. Alternatively, the RFIC and the probe-fed dielectric resonator antenna may be mounted to the same surface of the substrate. An overmolding structure may be provided above the RFIC. If desired, an additional phased antenna array may be mounted to the substrate.

[0007] Each probe-fed dielectric resonator antenna may include a dielectric resonant element mounted to a surface of a substrate. One or two feed probes may be coupled to the sidewalls of the dielectric resonant element at the surface of the substrate to feed the dielectric resonant element. In a suitable arrangement, the feed probes may be formed by conductive traces patterned onto the sidewalls. In this arrangement, each dielectric resonant element may be formed on the antenna module simultaneously, thereby minimizing mechanical changes to optimize the mechanical and wireless performance of the module. If desired, the antenna module may be cut from a substrate used to form multiple antenna modules for multiple devices to minimize manufacturing cost and complexity.

[0008] In another suitable arrangement, the feed probes may be formed from stamped metal sheets and may be pressed against the sidewalls by feed probe biasing structures that are molded over the feed probes and at least some of the dielectric resonant elements. If desired, the feed probe biasing structures may also press the parasitic elements against the sidewalls. A plastic substrate may be molded over the feed probes and at least some of the dielectric resonant elements of each antenna in the array to form an antenna package. The antenna package may be surface mounted to a substrate (e.g., a flexible printed circuit) to form an antenna module. The antenna module may be aligned with a notch in a display module of the device. The dielectric resonant elements may be aligned along a longitudinal axis. If desired, each sidewall of the dielectric resonant element may be rotated at a non-zero and non-perpendicular angle relative to the longitudinal axis to maximize isolation between the antennas. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a perspective view of an illustrative electronic device according to some embodiments.

[0010] Figure 2 is a schematic diagram of illustrative circuits in an electronic device according to some embodiments.

[0011] Figure 3 is a schematic diagram of an illustrative wireless circuit according to some implementations.

[0012] Figure 4 is a diagram of an illustrative phased antenna array that may be adjusted using control circuitry to steer a signal beam, according to some implementations.

[0013] Figure 5 is a cross-sectional side view of an illustrative electronic device with a phased antenna array for radiating through different sides of the electronic device in accordance with some embodiments.

[0014] Figure 6 is a perspective view of a dielectric resonator antenna for an exemplary probe feed covering multiple polarizations, according to some embodiments.

[0015] Figure 7is a top-down view of an illustrative probe-fed dielectric resonator antenna with multiple feed probes and a floating parasitic patch for mitigating cross-polarization interference, according to some embodiments.

[0016] Figure 8 is a top-down view of an illustrative probe-fed dielectric resonant antenna with a single feed probe and a grounded parasitic patch for mitigating cross-polarization interference, according to some embodiments.

[0017] Fig. 9 is a top-down view of an illustrative antenna module having a dielectric resonator antenna, according to some implementations.

[0018] Fig.10 is a cross-sectional side view of an illustrative antenna module having a dielectric resonator antenna according to some implementations.

[0019] Fig.11 is a perspective view of an illustrative antenna module having a dielectric resonator antenna according to some implementations.

[0020] Fig.12 is a top-down view of an illustrative antenna module having a dielectric resonator antenna and a radio frequency integrated circuit mounted to the same side of a substrate, according to some embodiments.

[0021] Fig.13 is a side view of an illustrative antenna module having a dielectric resonator antenna and a radio frequency integrated circuit mounted to the same side of a substrate according to some embodiments.

[0022] Fig.14 is a side view of an illustrative antenna module having dielectric resonator antennas on opposing sides of a substrate according to some implementations.

[0023] Fig.15 is a cross-sectional side view of an illustrative antenna module having a patch antenna and a dielectric resonator antenna at opposite sides of a substrate, according to some implementations.

[0024] Fig.16 and Fig.17 is a schematic diagram of an illustrative assembly process for an antenna module having a dielectric resonator antenna mounted to a substrate according to some embodiments.

[0025] Fig.18 is a flow chart of illustrative steps that may be performed in assembling an antenna module having a dielectric resonator antenna mounted to a substrate, according to some embodiments.

[0026] Fig.19is a perspective view of an illustrative antenna module having dielectric resonator antennas with feed probes biased toward dielectric resonant elements by biasing structures according to some implementations.

[0027] Fig. 20 is an illustration of how it can be assembled according to some embodiments Fig.19 A schematic diagram of an illustrative antenna module of the type shown.

[0028] Fig.21 is a top-down view of an illustrative electronic device with an antenna module aligned with a notch in a display module according to some embodiments.

[0029] Fig. 22 is a top-down view of an illustrative antenna module with a rotated dielectric resonant element according to some implementations.

[0030] Fig.23 is a perspective view of an illustrative antenna module with a rotated dielectric resonant element according to some embodiments.

[0031] Fig.24 According to some embodiments Fig. 22 and Fig.23 Exploded perspective view of an illustrative antenna module of the type shown in FIG. DETAILED DESCRIPTION

[0032] This patent application claims priority to U.S. patent application No. 16 / 920,297 filed on July 2, 2020, which is hereby incorporated by reference in its entirety.

[0033] Electronic devices such as Figure 1 The electronic device 10 may include wireless circuits. The wireless circuits may include one or more antennas. The antennas may include phased antenna arrays for performing wireless communications using millimeter wave and centimeter wave signals. Millimeter wave signals, sometimes referred to as extremely high frequency (EHF) signals, propagate at frequencies above about 30 GHz (e.g., at 60 GHz or other frequencies between about 30 GHz and 300 GHz). Centimeter wave signals propagate at frequencies between about 10 GHz and 30 GHz. If desired, the device 10 may also include antennas for processing satellite navigation system signals, cellular phone signals, wireless local area network signals, near field communications, optical-based wireless communications, or other wireless communications.

[0034] The electronic device 10 may be a portable electronic device or other suitable electronic device. For example, the electronic device 10 may be a laptop computer, a tablet computer, a slightly smaller device (such as a wristwatch device, a hanging device, an earphone device, a handset device or other wearable or miniature device), a handheld device (such as a cellular phone), a media player or other small portable device. The device 10 may also be a set-top box, a desktop computer, a display with a computer or other processing circuit integrated, a display without an integrated computer, a wireless access point, a wireless base station, an electronic device incorporated into a newsstand, a building or a vehicle, or other suitable electronic equipment.

[0035] Device 10 may include a housing such as housing 12. Housing 12 (which may sometimes be referred to as a casing) may be formed of plastic, glass, ceramic, fiber composite materials, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or combinations of these materials. In some cases, components of housing 12 may be formed of dielectric or other low conductivity materials (e.g., glass, ceramic, plastic, sapphire, etc.). In other cases, housing 12 or at least some of the structures making up housing 12 may be formed of metal elements.

[0036] If desired, device 10 may have a display such as display 14. Display 14 may be mounted on the front of device 10 (e.g., display 14 may form some or all of the front of the device). Display 14 may be a touch screen that incorporates capacitive touch electrodes or may be insensitive to touch. The back of housing 12 (i.e., the face of device 10 opposite to the front of device 10) may have a substantially flat housing wall, such as rear housing wall 12R (e.g., a planar housing wall). Rear housing wall 12R may have a slit that passes completely through the rear housing wall, and thus separates portions of housing 12 from each other. Rear housing wall 12R may include conductive portions and / or dielectric portions. If desired, rear housing wall 12R may include a planar metal layer covered by a thin layer or dielectric coating (such as glass, plastic, sapphire, or ceramic). Housing 12 may also have a shallow groove that does not pass completely through housing 12. The above-mentioned slot or groove may be filled with plastic or other dielectrics. If desired, portions of housing 12 that are separated from one another (eg, by through slots) may be joined by internal conductive structures (eg, metal sheets or other metal members bridging the slots).

[0037] Housing 12 may include peripheral housing structures such as peripheral structures 12W. Conductive portions of peripheral structures 12W and conductive portions of rear housing wall 12R may sometimes be collectively referred to herein as conductive structures of housing 12. Peripheral structures 12W may extend around the periphery of device 10 and display 14. In a configuration where device 10 and display 14 have a rectangular shape with four edges, peripheral structures 12W may be implemented using a peripheral housing structure having a rectangular ring shape with four corresponding edges and extending from rear housing wall 12R to the front of device 10 (as an example). If desired, peripheral structures 12W or a portion of peripheral structures 12W may serve as an outer frame for display 14 (e.g., a decorative trim that surrounds all four sides of display 14 and / or helps hold display 14 to device 10). If desired, peripheral structures 12W may form a sidewall structure for device 10 (e.g., by forming a metal strip having vertical sidewalls, curved sidewalls, etc.).

[0038] Peripheral structure 12W may be formed of a conductive material such as a metal, and thus may sometimes be referred to as a peripheral conductive housing structure, a conductive housing structure, a peripheral metal structure, a peripheral conductive sidewall, a peripheral conductive sidewall structure, a conductive housing sidewall, a peripheral conductive housing sidewall, a sidewall, a sidewall structure, or a peripheral conductive housing member (as examples). Peripheral conductive housing structure 12W may be formed of a metal such as stainless steel, aluminum, or other suitable material. One, two, or more than two separate structures may be used to form peripheral conductive housing structure 12W.

[0039] Peripheral conductive housing structure 12W does not necessarily have a uniform cross-section. For example, if desired, the top of peripheral conductive housing structure 12W may have an inwardly protruding flange that helps to hold display 14 in place. The bottom of peripheral conductive housing structure 12W may also have an enlarged lip (e.g., in the plane of the back of device 10). Peripheral conductive housing structure 12W may have substantially straight vertical sidewalls, may have curved sidewalls, or may have other suitable shapes. In some configurations (e.g., when peripheral conductive housing structure 12W is used as a frame for display 14), peripheral conductive housing structure 12W may extend around the lip of housing 12 (i.e., peripheral conductive housing structure 12W may only cover the edge of housing 12 surrounding display 14 and not the remaining sidewalls of housing 12).

[0040] Rear housing wall 12R may lie in a plane parallel to display 14. In configurations of device 10 in which some or all of rear housing wall 12R is formed of metal, it may be desirable to form a portion of peripheral conductive housing structure 12W as an integral part of the housing structure that forms rear housing wall 12R. For example, rear housing wall 12R of device 10 may include a planar metal structure, and a portion of peripheral conductive housing structure 12W on a side of housing 12 may be formed as a flat or curved vertically extending integrated metal portion of the planar metal structure (e.g., housing structures 12R and 12W may be formed from a continuous sheet of metal in a unitary configuration). If desired, housing structures such as these may be machined from a block of metal, and / or may include multiple metal pieces that are assembled together to form housing 12. Rear housing wall 12R may have one or more, two or more, or three or more portions. The conductive portions of the peripheral conductive housing structure 12W and / or the rear housing wall 12R may form one or more external surfaces of the device 10 (e.g., surfaces visible to a user of the device 10), and / or may be implemented using internal structures that do not form external surfaces of the device 10 (e.g., conductive housing structures that are not visible to a user of the device 10, such as conductive structures covered with a layer (such as a thin decorative layer, a protective coating, and / or other coatings that may include dielectric materials such as glass, ceramic, plastic), or other structures that form external surfaces of the device 10 and / or are used to hide the conductive portions of the peripheral conductive housing structure 12W and / or the rear housing wall 12R from the user's perspective).

[0041] Display 14 may have an array of pixels forming an active area AA that displays an image of a user of device 10. For example, active area AA may include an array of display pixels. The pixel array may be formed by a liquid crystal display (LCD) component, an electrophoretic pixel array, a plasma display pixel array, an organic light emitting diode display pixel or other light emitting diode pixel array, an electrowetting display pixel array, or display pixels based on other display technologies. If desired, active area AA may include a touch sensor, such as a touch sensor capacitive electrode, a force sensor, or other sensor for collecting user input.

[0042] The display 14 may have an inactive border area extending along one or more edges of the active area AA. The inactive area IA of the display 14 may have no pixels for displaying an image and may overlap with circuits and other internal device structures in the housing 12. In order to prevent these structures from being viewed by the user of the device 10, the lower side of the display cover layer or other layers in the display 14 that overlap the inactive area IA may be coated with an opaque masking layer in the inactive area IA. The opaque masking layer may have any suitable color. The inactive area IA may include a recessed area, such as a notch 8 extending into the active area AA. The active area AA may be defined, for example, by a lateral area of ​​a display module of the display 14 (e.g., a display module including pixel circuits, touch sensor circuits, etc.). The display module may have a recess or notch in the upper area 20 of the device 10 without an active display circuit (i.e., a notch 8 forming the inactive area IA). The notch 8 may be a substantially rectangular area, three sides of which are surrounded (defined) by the active area AA, and the fourth side is surrounded by the peripheral conductive housing structure 12W.

[0043] Display 14 may be protected using a display cover layer, such as a transparent glass, a light-transmitting plastic, a transparent ceramic, a sapphire or other transparent crystalline material layer, or one or more other transparent layers. The display cover layer may have a flat shape, a convex curved profile, a shape with flat and curved portions, a layout including a planar main area surrounded on one or more edges (wherein a portion of one or more edges is bent out of the plane of the planar main area), or other suitable shapes. The display cover layer may cover the entire front of device 10. In another suitable arrangement, the display cover layer may substantially cover all of the front of device 10 or only cover a portion of the front of device 10. An opening may be formed in the display cover layer. For example, an opening may be formed in the display cover layer to accommodate a button. An opening may also be formed in the display cover layer to accommodate a port such as a speaker port 16 or a microphone port in recess 8. If desired, an opening may be formed in housing 12 to form a communication port (e.g., an audio jack port, a digital data port, etc.) and / or an audio port for an audio component, such as a speaker and / or a microphone.

[0044] Display 14 may include conductive structures such as an array of capacitive electrodes for a touch sensor, conductive lines for addressing pixels, driver circuits, and the like. Housing 12 may include internal conductive structures such as a metal frame member and a planar conductive housing member (sometimes referred to as a backplane) that spans the walls of housing 12 (i.e., a substantially rectangular sheet formed by one or more metal portions welded or otherwise connected between opposite sides of peripheral conductive housing structure 12W). The backplane may form the outer rear surface of device 10, or may be covered by a layer such as a thin cosmetic layer, a protective coating, and / or other coatings that may include dielectric materials such as glass, ceramic, plastic, or other structures, which may form the outer surface of device 10 and / or be used to hide the backplane from the user's view. Device 10 may also include conductive structures such as printed circuit boards, components mounted on printed circuit boards, and other internal conductive structures. For example, these conductive structures that may be used to form a ground layer in device 10 may extend under active area AA of display 14.

[0045] In regions 22 and 20, openings may be formed within conductive structures of device 10 (e.g., between peripheral conductive housing structures 12W and opposing conductive ground structures such as conductive portions of rear housing wall 12R, conductive traces on a printed circuit board, conductive electronic components in display 14, etc.) If desired, these openings, which may sometimes be referred to as gaps, may be filled with air, plastic and / or other dielectrics and may be used to form slot antenna resonating elements for one or more antennas in device 10.

[0046] Conductive housing structures and other conductive structures in device 10 may serve as a ground plane for antennas in device 10. The openings in regions 22 and 20 may serve as slots in an open slot antenna or a closed slot antenna, may serve as a central dielectric region surrounded by a conductive path of material in a loop antenna, may serve as a space to separate an antenna resonating element (such as a strip antenna resonating element or an inverted-F antenna resonating element) from a ground plane, may facilitate performance of a parasitic antenna resonating element, or may otherwise serve as part of an antenna structure formed in regions 22 and 20. If desired, the ground plane beneath active area AA of display 14 and / or other metal structures in device 10 may have a portion extending into a portion of the end of device 10 (e.g., the ground portion may extend toward the dielectric-filled openings in regions 22 and 20), thereby narrowing the slots in regions 22 and 20.

[0047] In general, device 10 may include any suitable number of antennas (e.g., one or more, two or more, three or more, four or more, etc.). The antennas in device 10 may be located at opposite first and second ends of an elongated device housing (e.g., at Figure 1The device housing may be provided at areas 22 and ends of area 20 of device 10 , along one or more edges of the device housing, at the center of the device housing, at other suitable locations, or at one or more of these locations. Figure 1 The arrangement is for illustrative purposes only.

[0048] Portions of the peripheral conductive housing structure 12W may be provided with a peripheral gap structure. For example, the peripheral conductive housing structure 12W may be provided with one or more gaps, such as Figure 1 Gap 18 is shown. The gap in the peripheral conductive housing structure 12W can be filled with a dielectric such as a polymer, ceramic, glass, air, other dielectric materials, or a combination of these materials. Gap 18 can divide the peripheral conductive housing structure 12W into one or more peripheral conductive segments. If desired, the conductive segments formed in this manner can form a portion of an antenna in the device 10. If desired, gap 18 can be omitted. Other dielectric openings can be formed in the peripheral conductive housing structure 12W (e.g., dielectric openings other than gap 18) and can be used as dielectric antenna windows for antennas mounted inside the device 10. The antenna within the device 10 can be aligned with the dielectric antenna window for transmitting radio frequency signals through the peripheral conductive housing structure 12W. The antenna within the device 10 can also be aligned with the inactive area IA of the display 14 for transmitting radio frequency signals through the display 14.

[0049] In order to provide an end user of device 10 with as large a display as possible (e.g., to maximize the area of ​​the device available for displaying media, running applications, etc.), it may be desirable to increase the amount of area covered by active area AA of display 14 at the front face of device 10. Increasing the size of active area AA may reduce the size of inactive area IA within device 10. This may reduce the area behind display 14 available for antennas within device 10. For example, active area AA of display 14 may include conductive structures that are used to prevent radio frequency signals handled by an antenna mounted behind active area AA from radiating through the front face of device 10. It is therefore desirable to be able to provide an antenna that occupies a small amount of space within device 10 (e.g., to allow for as large a display active area AA as possible), while still allowing the antenna to communicate with wireless equipment external to device 10 with a satisfactory efficiency bandwidth.

[0050] In a typical scenario, device 10 may have one or more upper antennas and one or more lower antennas (as an example). For example, the upper antenna may be formed at the upper end of device 10 in region 20. For example, the lower antenna may be formed at the lower end of device 10 in region 22. If necessary, additional antennas may be formed along the edge of housing 12 extending between region 22 and region 20. Antennas may be used alone to cover the same communication band, overlapping communication bands, or separate communication bands. The antenna may be used to implement an antenna diversity scheme or a multiple-input multiple-output (MIMO) antenna scheme. Other antennas for covering any other desired frequencies may also be mounted at any desired location within the interior of device 10. Figure 1 The examples are merely illustrative. If desired, the housing 12 may have other shapes (eg, a square shape, a cylindrical shape, a spherical shape, a combination of these shapes and / or different shapes, etc.).

[0051] Figure 2 Schematic diagram of illustrative components that may be used in device 10 is shown. Figure 2 As shown, device 10 may include control circuitry 28. Control circuitry 28 may include a storage repository such as storage circuitry 30. Storage circuitry 30 may include hard drive storage, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory configured to form a solid-state drive), volatile memory (e.g., static random access memory or dynamic random access memory), etc. Control circuitry 28 may include processing circuitry such as processing circuitry 32. Processing circuitry 32 may be used to control the operation of device 10. Processing circuitry 32 may include one or more microprocessors, microcontrollers, digital signal processors, host processors, baseband processor integrated circuits, application specific integrated circuits, central processing units (CPUs), etc. Control circuitry 28 may be configured to perform operations in device 10 using hardware (e.g., dedicated hardware or circuitry), firmware, and / or software. Software code for performing operations in device 10 may be stored on storage circuitry 30 (e.g., storage circuitry 30 may include a non-transitory (tangible) computer-readable storage medium storing software code). The software code may sometimes be referred to as program instructions, software, data, instructions, or code. The software codes stored on storage circuitry 30 may be executed by processing circuitry 32 .

[0052] Control circuitry 28 may be used to run software on device 10, such as an Internet browsing application, a Voice over Internet Protocol (VOIP) phone call application, an email application, a media playback application, operating system functions, etc. To support interaction with external equipment, control circuitry 28 may be used to implement communication protocols. Communication protocols that may be implemented using control circuitry 28 include Internet protocols, wireless local area network protocols (e.g., IEEE 802.11 protocols—sometimes referred to as ), protocols for other short-range wireless communication links such as Protocol or other WPAN protocols, IEEE802.11ad protocol, cellular phone protocols, MIMO protocols, antenna diversity protocols, satellite navigation system protocols, antenna-based spatial ranging protocols (e.g., Radio Detection and Ranging (RADAR) protocol or other required distance detection protocols for signals transmitted at millimeter wave and centimeter wave frequencies), etc. Each communication protocol may be associated with a corresponding radio access technology (RAT) that specifies the physical connection method used to implement the protocol.

[0053] Device 10 may include input-output circuitry 24. Input-output circuitry 24 may include input-output devices 26. Input-output devices 26 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices. Input-output devices 26 may include user interface devices, data port devices, sensors, and other input-output components. For example, input-output devices may include a touch screen, a display without touch sensor capabilities, buttons, a joystick, a scroll wheel, a touch pad, a keypad, a keyboard, a microphone, a camera, a speaker, a status indicator, a light source, an audio jack, and other audio port components, a digital data port device, a light sensor, a gyroscope, an accelerometer, or other components that can detect motion and device orientation relative to the earth, a capacitive sensor, a proximity sensor (e.g., a capacitive proximity sensor and / or an infrared proximity sensor), a magnetic sensor, and other sensors and input-output components.

[0054] Input-output circuitry 24 may include wireless circuitry, such as wireless circuitry 34 for wirelessly transmitting radio frequency signals. Although for clarity, Figure 2 Although control circuitry 28 in the example of FIG. 1 is shown separately from radio circuitry 34, radio circuitry 34 may include processing circuitry forming part of processing circuitry 32 and / or memory circuitry forming part of memory circuitry 30 of control circuitry 28 (e.g., portions of control circuitry 28 that may be implemented on radio circuitry 34). For example, control circuitry 28 may include baseband processor circuitry or other control components forming part of radio circuitry 34.

[0055] Wireless circuitry 34 may include millimeter wave and centimeter wave transceiver circuitry such as millimeter wave / centimeter wave transceiver circuitry 38. Millimeter wave / centimeter wave transceiver circuitry 38 may support communications at frequencies between about 10 GHz and 300 GHz. For example, millimeter wave / centimeter wave transceiver circuitry 38 may support communications in extremely high frequency (EHF) or millimeter wave communication bands between about 30 GHz and 300 GHz and / or in centimeter wave communication bands between about 10 GHz and 30 GHz (sometimes referred to as super high frequency (SHF) bands). For example, millimeter wave / centimeter wave transceiver circuitry 38 may support communications in the following communication bands: the IEEE K communication band between about 18 GHz and 27 GHz, the K-band between about 26.5 GHz and 40 GHz, and the IEEE K-band between about 26.5 GHz and 40 GHz. a Communications band, K between approximately 12 GHz and 18 GHz u The millimeter wave / centimeter wave transceiver circuit 38 may support IEEE 802.11ad communications at 60 GHz and / or 5th generation mobile networks or 5th generation wireless systems (5G) communications bands between 27 GHz and 90 GHz, V communications bands between about 40 GHz and 75 GHz, W communications bands between about 75 GHz and 110 GHz, or any other desired frequency band between about 10 GHz and 300 GHz. If desired, the millimeter wave / centimeter wave transceiver circuit 38 may support IEEE 802.11ad communications at 60 GHz and / or 5th generation mobile networks or 5th generation wireless systems (5G) communications bands between 27 GHz and 90 GHz. The millimeter wave / centimeter wave transceiver circuit 38 may be formed by one or more integrated circuits (e.g., multiple integrated circuits mounted on a common printed circuit in a system package device, one or more integrated circuits mounted on different substrates, etc.).

[0056] If desired, the millimeter wave / centimeter wave transceiver circuit 38 (sometimes referred to herein as simply the transceiver circuit 38 or the millimeter wave / centimeter wave circuit 38) may use the radio frequency signal at the millimeter wave and / or centimeter wave signal transmitted and received by the millimeter wave / centimeter wave transceiver circuit 38 to perform a spatial ranging operation. The received signal may be a version of the transmitted signal that has been reflected from an external object and returned to the device 10. The control circuit 28 may process the transmitted signal and the received signal to detect or estimate the distance between the device 10 and one or more external objects around the device 10 (e.g., objects external to the device 10, such as the body of a user or other person, other devices, animals, furniture, walls, or other objects or obstacles near the device 10). If desired, the control circuit 28 may also process the transmitted signal and the received signal to identify the two-dimensional or three-dimensional spatial position of the external object relative to the device 10.

[0057] The spatial ranging operation performed by the millimeter wave / centimeter wave transceiver circuit 38 is unidirectional. In addition or alternatively, the millimeter wave / centimeter wave transceiver circuit 38 can perform two-way communication with external wireless equipment. The two-way communication involves the transmission of wireless data by the millimeter wave / centimeter wave transceiver circuit 38 and the reception of the transmitted wireless data by the external wireless equipment. The wireless data may, for example, include data encoded into corresponding data packets, such as wireless data associated with a phone call, streaming media content, Internet browsing, wireless data associated with a software application running on the device 10, email messages, etc.

[0058] If desired, wireless circuitry 34 may include transceiver circuitry for handling communications at frequencies below 10 GHz, such as non-millimeter wave / centimeter wave transceiver circuitry 36. Non-millimeter wave / centimeter wave transceiver circuitry 36 may include transceiver circuitry for handling communications at frequencies below 10 GHz. (IEEE 802.11) communication in the 2.4Ghz and 5GHz bands of wireless local area network (WLAN) transceiver circuits, processing 2.4Ghz The non-millimeter wave / centimeter wave transceiver circuit 36 ​​and the millimeter wave / centimeter wave transceiver circuit 38 may each include one or more integrated circuits, power amplifier circuits, low noise input amplifiers, passive radio frequency components, switching circuits, transmission line structures, and other circuits for processing radio frequency signals. If desired, the non-millimeter wave / centimeter wave transceiver circuit 36 ​​may be omitted.

[0059] The wireless circuit 34 may include an antenna 40. The non-millimeter wave / centimeter wave transceiver circuit 36 ​​may use one or more antennas 40 to transmit radio frequency signals below 10 GHz. The millimeter wave / centimeter wave transceiver circuit 38 may use an antenna 40 to transmit radio frequency signals above 10 GHz (e.g., at millimeter wave and / or centimeter wave frequencies). In general, the transceiver circuits 36 and 38 may be configured to cover (process) any suitable communication (frequency) band of interest. The transceiver circuit may use an antenna 40 to transmit a radio frequency signal (e.g., the antenna 40 may transmit a radio frequency signal for the transceiver circuit). As used herein, the term "transmitting a radio frequency signal" means the transmission and / or reception of a radio frequency signal (e.g., for performing unidirectional and / or bidirectional wireless communication with external wireless communication equipment). The antenna 40 may transmit a radio frequency signal by radiating the radio frequency signal (or through an intervening device structure such as a dielectric cover layer) into free space. In addition or alternatively, the antenna 40 may receive a radio frequency signal from free space (e.g., through an intervening device structure such as a dielectric cover layer). The transmission and reception of radio frequency signals by antenna 40 each involve the excitation or resonance of antenna currents on an antenna resonating element in the antenna by radio frequency signals within the antenna's operating frequency band.

[0060] In satellite navigation system links, cellular phone links, and other long-distance links, RF signals are often used to carry data over thousands of feet or miles. Link and In links and other short-range wireless links, radio frequency signals are typically used to transmit data over tens or hundreds of feet. The millimeter wave / centimeter wave transceiver circuit 38 can transmit radio frequency signals over short distances traveling on a line-of-sight path. To enhance signal reception for millimeter wave and centimeter wave communications, phased antenna arrays and beam steering techniques (e.g., schemes in which the antenna signal phase and / or amplitude of each antenna in the array is adjusted to perform beam steering) can be used. Since the operating environment of the device 10 can be switched out of use and higher performance antennas are used in their place, antenna diversity schemes can also be used to ensure that antennas have begun to be blocked or otherwise degraded.

[0061] The antenna 40 in the wireless circuit 34 can be formed using any suitable antenna type. For example, the antenna 40 may include an antenna having a resonant element, which is formed by a stacked patch antenna structure, a loop antenna structure, a patch antenna structure, an inverted F-shaped antenna structure, a slot antenna structure, a planar inverted F-shaped antenna structure, a monopole antenna structure, a dipole antenna structure, a helical antenna structure, a Yagi-Uda antenna structure, a mixture of these designs, etc. In another suitable arrangement, the antenna 40 may include an antenna having a dielectric resonant element, such as a dielectric resonant antenna. If necessary, one or more antennas 40 may be cavity-backed antennas. Different types of antennas may be used for different frequency bands and frequency band combinations. For example, one type of antenna may be used to form a non-millimeter wave / centimeter wave wireless link for a non-millimeter wave / centimeter wave transceiver circuit 36, while another type of antenna may be used to transmit radio frequency signals at millimeter wave and / or centimeter wave frequencies for a millimeter wave / centimeter wave transceiver circuit 38. The antenna 40 for transmitting radio frequency signals at millimeter wave and / or centimeter wave frequencies may be arranged in one or more phased antenna arrays.

[0062] Figure 3 Schematic diagram of an antenna 40 that may be formed in a phased antenna array for transmitting radio frequency signals at millimeter wave and / or centimeter wave frequencies is shown in FIG. Figure 3 As shown, antenna 40 may be coupled to millimeter / centimeter (MM / CM) wave transceiver circuitry 38. Millimeter and centimeter wave transceiver circuitry 38 may be coupled to antenna feed 44 of antenna 40 using a transmission line path including RF transmission line 42. RF transmission line 42 may include a positive signal conductor such as signal conductor 46, and may include a ground conductor such as ground conductor 48. Ground conductor 48 may be coupled to an antenna ground of antenna 40 (e.g., at a ground antenna feed terminal of antenna feed 44 located at the antenna ground). Signal conductor 46 may be coupled to an antenna resonating element of antenna 40. For example, signal conductor 46 may be coupled to a positive antenna feed terminal of antenna feed 44 located at the antenna resonating element.

[0063] In another suitable arrangement, the antenna 40 can be a probe-fed antenna that is fed using a feed probe. In this arrangement, the antenna feed 44 can be implemented as a feed probe. The signal conductor 46 can be coupled to the feed probe. The RF transmission line 42 can transmit RF signals to and from the feed probe. When the RF signal is being transmitted on the feed probe and the antenna, the feed probe can excite the resonant element of the antenna (for example, the electromagnetic resonant mode of the dielectric antenna resonant element of the antenna 40 can be excited). The resonant element can radiate the RF signal in response to being excited by the feed probe. Similarly, when the antenna receives a RF signal (for example, from free space), the RF signal can excite the resonant element of the antenna (for example, the electromagnetic resonant mode of the dielectric antenna resonant element of the antenna 40 can be excited). This can generate an antenna current on the feed probe, and the corresponding RF signal can be transmitted to the transceiver circuit through the RF transmission line.

[0064] The RF transmission line 42 may include a stripline transmission line (sometimes referred to herein simply as a stripline), a coaxial cable, a coaxial probe implemented by a metallized through hole, a microstrip transmission line, an edge-coupled microstrip transmission line, an edge-coupled stripline transmission line, a waveguide structure, a combination of these, etc. Various types of transmission lines may be used to form a transmission line path that couples the millimeter-wave / centimeter-wave transceiver circuit 38 to the antenna feed 44. If desired, filter circuits, switching circuits, impedance matching circuits, phase shifter circuits, amplifier circuits, and / or other circuits may be inserted on the RF transmission line 42.

[0065] The RF transmission lines in the device 10 may be integrated into a ceramic substrate, a rigid printed circuit board, and / or a flexible printed circuit. In one suitable arrangement, the RF transmission lines in the device 10 may be integrated into a multilayer laminate structure (e.g., layers of conductive material (such as copper) and dielectric material (such as resin) laminated together without an intervening adhesive), which may be folded or bent in multiple dimensions (e.g., two or three dimensions) and retain the bent shape or folded shape after bending (e.g., the multilayer laminate structure may be folded into a specific three-dimensional shape to route around other device components, and may be rigid enough to retain its shape after folding without being held in place by reinforcements or other structures). All multiple layers of the laminate structure may be laminated together in batches (e.g., in a single pressing process) without an adhesive (e.g., as opposed to performing multiple pressing processes to laminate the multiple layers together with an adhesive).

[0066] Figure 4 4 shows how an antenna 40 for processing radio frequency signals at millimeter wave and centimeter wave frequencies can be formed in a phased antenna array. Figure 4As shown in , a phased antenna array 54 (sometimes referred to herein as an array 54, an antenna array 54, or an array 54 of antennas 40) may be coupled to an RF transmission line 42. For example, a first antenna 40-1 in the phased antenna array 54 may be coupled to a first RF transmission line 42-1, a second antenna 40-2 in the phased antenna array 54 may be coupled to a second RF transmission line 42-2, an Nth antenna 40-N in the phased antenna array 54 may be coupled to an Nth RF transmission line 42-N, etc. Although the antennas 40 are described herein as forming a phased antenna array, the antennas 40 in the phased antenna array 54 may also sometimes be referred to as collectively forming a single phased array antenna.

[0067] The antennas 40 in the phased antenna array 54 may be arranged in any desired number of rows and columns or in any other desired pattern (e.g., the antennas need not be arranged in a grid pattern having rows and columns). During signal transmission operations, the RF transmission lines 42 may be used to transmit signals (e.g., RF signals such as millimeter wave and / or centimeter wave signals) from the millimeter wave / centimeter wave transceiver circuit 38 ( Figure 3 ) is supplied to the phased antenna array 54 for wireless transmission. During signal reception operation, the RF transmission line 42 may be used to supply a signal received at the phased antenna array 54 (e.g., a transmitted signal received from external wireless equipment, or reflected by an external object) to the millimeter wave / centimeter wave transceiver circuit 38 ( Figure 3 ).

[0068] The use of multiple antennas 40 in a phased antenna array 54 allows for a beam steering arrangement to be implemented by controlling the relative phase and amplitude (amplitude) of the radio frequency signals transmitted by the antennas. Figure 4 In the example, the antennas 40 each have a corresponding RF phase and amplitude controller 50 (for example, the first phase and amplitude controller 50-1 inserted on the RF transmission line 42-1 can control the phase and amplitude of the RF signal processed by the antenna 40-1, the second phase and amplitude controller 50-2 inserted on the RF transmission line 42-2 can control the phase and amplitude of the RF signal processed by the antenna 40-2, the Nth phase and amplitude controller 50-N inserted on the RF transmission line 42-N can control the phase and amplitude of the RF signal processed by the antenna 40-N, etc.).

[0069] The phase and amplitude controllers 50 may each include circuitry for adjusting the phase of the RF signal on the RF transmission line 42 (e.g., phase shifter circuitry) and / or circuitry for adjusting the amplitude of the RF signal on the RF transmission line 42 (e.g., power amplifier and / or low noise amplifier circuitry). The phase and amplitude controllers 50 may sometimes be collectively referred to herein as beam steering circuitry (e.g., beam steering circuitry that steers the beam of the RF signal transmitted and / or received by the phased antenna array 54).

[0070] The phase and amplitude controller 50 may adjust the relative phase and / or amplitude of the transmit signal provided to each antenna in the phased antenna array 54, and may adjust the relative phase and / or amplitude of the receive signal received by the phased antenna array 54. If desired, the phase and amplitude controller 50 may include a phase detection circuit for detecting the phase of the receive signal received by the phased antenna array 54. The term "beam" or "signal beam" may be used herein to collectively refer to wireless signals transmitted and received by the phased antenna array 54 in a specific direction. The signal beam may exhibit a peak gain that is oriented in a specific pointing direction at a corresponding pointing angle (e.g., based on constructive interference and destructive interference of the combination of signals from each antenna in the phased antenna array). The term "transmit beam" may sometimes be used herein to refer to a radio frequency signal transmitted in a specific direction, while the term "receive beam" may sometimes be used herein to refer to a radio frequency signal received from a specific direction.

[0071] For example, if the phase and amplitude controller 50 is adjusted to produce a first set of phases and / or amplitudes of the transmitted RF signal, the transmitted signal will be formed as follows: Figure 4 The transmit beam is directed in the direction of point A as shown in beam B1 of the transmit signal. However, if the phase and amplitude controller 50 is adjusted to generate a second set of phases and / or amplitudes of the transmit signal, the transmit signal will form a transmit beam directed in the direction of point B as shown in beam B2. Similarly, if the phase and amplitude controller 50 is adjusted to generate a first set of phases and / or amplitudes, a radio frequency signal (e.g., a radio frequency signal in a receive beam) can be received from the direction of point A, as shown in beam B1. If the phase and amplitude controller 50 is adjusted to generate a second set of phases and / or amplitudes, a radio frequency signal can be received from the direction of point B, as shown in beam B2.

[0072] Based on Figure 2 The control circuit 28 may receive a corresponding control signal 52 to control each phase and amplitude controller 50 to produce a desired phase and / or amplitude (e.g., control signal 52-1 may be used to control the phase and / or amplitude provided by phase and amplitude controller 50-1, control signal 52-2 may be used to control the phase and / or amplitude provided by phase and amplitude controller 50-2, etc.). If desired, the control circuit may actively adjust the control signal 52 in real time to steer the transmit beam or receive beam in different desired directions over time. If desired, the phase and amplitude controller 50 may provide information identifying the phase of the received signal to the control circuit 28. A codebook on the device 10 may map each beam pointing angle to a set of corresponding phase and amplitude values ​​to provide to the phase and amplitude controller 50 (e.g., the control circuit may generate the control signal 52 based on information from the codebook).

[0073] When wireless communication is performed using radio frequency signals at millimeter wave and centimeter wave frequencies, the radio frequency signals are transmitted on a line-of-sight path between the phased antenna array 54 and the external communication equipment. Figure 4 If the external communication equipment is located at point A, the phase and amplitude controller 50 may be adjusted to steer the signal beam toward point A (e.g., to steer the signal beam toward point A). The phased antenna array 54 may transmit and receive radio frequency signals in the direction of point A. Similarly, if the external communication equipment is located at point B, the phase and amplitude controller 50 may be adjusted to steer the signal beam toward point B (e.g., to steer the signal beam toward point B). The phased antenna array 54 may transmit and receive radio frequency signals in the direction of point B. Figure 4 In the example of FIG. 1 , for simplicity, beam steering is shown as being in a single degree of freedom (e.g., Figure 4 However, in practice, the method may be performed in two or more degrees of freedom (e.g., entering and leaving the page in three dimensions and in Figure 4 Phased antenna array 54 may have a corresponding field of view over which beam steering may be performed (e.g., in a hemisphere or segment of a hemisphere on the phased antenna array). If desired, device 10 may include multiple phased antenna arrays that each face a different direction to provide coverage from multiple sides of the device.

[0074] Figure 5 is a cross-sectional side view of device 10 in an example where device 10 has multiple phased antenna arrays. Figure 5 As shown, peripheral conductive housing structure 12W may extend around the (lateral) periphery of device 10 and may extend from rear housing wall 12R to display 14. Display 14 may have a display module, such as display module 64 (sometimes referred to as a display panel or conductive display structure). Display module 64 may include pixel circuits, touch sensor circuits, force sensor circuits, and / or any other desired circuits for forming active area AA of display 14. Display 14 may include a dielectric cover layer, such as display cover layer 56 that overlaps display module 64. Display module 64 may emit image light and may receive sensor input through display cover layer 56. Display cover layer 56 and display 14 may be mounted to peripheral conductive housing structure 12W. Lateral areas of display 14 that do not overlap display module 64 may form an inactive area IA of display 14.

[0075] Device 10 may include multiple phased antenna arrays (e.g., Figure 4Phased antenna array 54). For example, device 10 may include a rear-facing phased antenna array. The rear-facing phased antenna array may be adhered to rear housing wall 12R using an adhesive, may be pressed against (e.g., in contact with) rear housing wall 12R, or may be spaced apart from rear housing wall 12R. The rear-facing phased antenna array may transmit and / or receive radio frequency signals 60 at millimeter wave and centimeter wave frequencies through rear housing wall 12R. In the case where rear housing wall 12R includes a metal portion, radio frequency signals 60 may be transmitted through holes or openings in the metal portion of rear housing wall 12R, or may be transmitted through other dielectric portions of rear housing wall 12R. The holes may overlap a dielectric cover or dielectric coating extending across a lateral region of rear housing wall 12R (e.g., between peripheral conductive housing structures 12W). The rear-facing phased antenna array may perform beam steering of radio frequency signals 60 across at least some hemispheres below the back of device 10.

[0076] The field of view of the rear-facing phased antenna array is limited to a hemisphere below the back of device 10. Display module 64 and other components 58 (e.g., Figure 2 10, a battery for device 10, etc.) include conductive structures. If care is not taken, these conductive structures may prevent RF signals from being transmitted across the hemisphere on the front face of device 10 by the phased antenna array within device 10. Although a front-facing phased antenna array for covering the hemisphere on the front face of device 10 may be mounted against display cover layer 56 within inactive area IA, there may not be sufficient space between the lateral periphery of display module 64 and peripheral conductive housing structures 12W to form all of the circuitry and RF transmission lines necessary to fully support the phased antenna array, particularly when the size of active area AA is maximized.

[0077] To alleviate these issues and provide coverage throughout the front face of device 10, a front-facing phased antenna array may be mounted within peripheral region 66 of device 10. The antennas in the front-facing phased antenna array may include dielectric resonator antennas. The dielectric resonator antennas may be located at the front of the device 10. Figure 5 The front-facing phased antenna array 10 occupies less area in the XY plane than other types of antennas such as patch antennas and slot antennas. Implementing the antenna as a dielectric resonator antenna allows the radiating elements of the front-facing phased antenna array to fit within the inactive area IA between the display module 64 and the peripheral conductive housing structure 12W. At the same time, the RF transmission lines and other components of the phased antenna array can be located behind (below) the display module 64. The front-facing phased antenna array can transmit and / or receive RF signals 62 at millimeter wave and centimeter wave frequencies through the display cover layer 56. The front-facing phased antenna array can perform beam steering of the RF signal 62 across at least some hemisphere above the front of the device 10.

[0078] The device 10 may include both a front-facing phased antenna array (e.g., within the peripheral region 66) and a rear-facing phased antenna array (e.g., within the peripheral region 66 or elsewhere between the display module 64 and the rear housing wall 12R). If desired, in addition or alternatively, the device 10 may include one or more side-facing phased antenna arrays. The side-facing phased antenna arrays may be aligned with the dielectric antenna windows in the peripheral conductive housing structure 12W. If desired, the front-facing phased antenna array, the rear-facing phased antenna array, and / or the side-facing phased antenna array may be omitted. The front-facing phased antenna array and the rear-facing phased antenna array (and optionally the side-facing phased antenna array) may together provide a radio frequency cover across the entire sphere surrounding the device 10.

[0079] The phased antenna array 54 in the device 10 may be formed in a corresponding integrated antenna module. Each antenna module may include a substrate (such as a rigid printed circuit board substrate, a flexible printed circuit substrate, a plastic substrate, or a ceramic substrate) and one or more phased antenna arrays mounted to the substrate. Each antenna module may also include electronic components (e.g., radio frequency components) that support the operation of the phased antenna array therein. For example, each antenna module may include a radio frequency integrated circuit (e.g., an integrated circuit chip) or other circuit mounted to a corresponding substrate. Transmission line structures (e.g., radio frequency signal traces), conductive vias, conductive traces, solder balls, or other conductive interconnect structures may couple the radio frequency integrated circuit to each antenna in the phased antenna array of the antenna module. The radio frequency integrated circuit (RFIC) and / or other electronic components in the antenna module may include radio frequency components, such as amplifier circuits, phase shifter circuits (e.g., Figure 4 The phase and amplitude controller 50 of the device 10 and / or other circuits operating on the radio frequency signals may be provided. The rear-facing phased antenna array, the front-facing phased antenna array, and / or the side-facing phased antenna array in the device 10 may be formed within the corresponding antenna modules. In another suitable arrangement, the rear-facing and front-facing phased antenna arrays may be formed as part of the same antenna module in the device 10.

[0080] Figure 6 is a perspective view of an illustrative probe-fed dielectric resonator antenna that may be used to form an antenna for any phased antenna array in device 10 . Figure 6 Antenna 40 may be a dielectric resonator antenna. In this example, antenna 40 includes a dielectric resonant element 68 mounted to an underlying substrate such as substrate 72. Substrate 72 may be, for example, a substrate of a corresponding antenna module in device 10. Substrate 72 may be a rigid printed circuit board substrate, a flexible printed circuit substrate, a ceramic substrate, a plastic substrate, or any other desired substrate.

[0081] exist Figure 6 In the example of FIG. 4 , the antenna 40 is a dual-polarized antenna that transmits vertically and horizontally polarized RF signals 84 (e.g., linearly polarized signals with orthogonal electric field orientations). This example is merely illustrative, and in another suitable arrangement, the antenna 40 may cover only a single polarization. The antenna 40 may be fed using RF transmission lines such as RF transmission lines 88 (e.g., a first RF transmission line 88V for transmitting vertically polarized signals and a second RF transmission line 88H for transmitting horizontally polarized signals) formed on and / or embedded in the flexible substrate 72. The RF transmission lines 88V and 88H may, for example, form Figure 3 and Figure 4 RF transmission lines 88V and 88H may include ground traces on and / or embedded in substrate 72 (e.g., for forming a ground trace). Figure 3 A portion of the ground conductor 48) and a signal trace (eg, for forming Figure 3 RF transmission lines 88V and 88H may be coupled to an RF integrated circuit or other RF components on an antenna module including antenna 40.

[0082] The dielectric resonant element 68 of the antenna 40 may be formed from a column (pillar) of dielectric material mounted to the top surface of the substrate 72. If desired, the dielectric resonant element 68 may be embedded within (e.g., laterally surrounded by) a dielectric substrate such as the dielectric substrate 70 mounted to the top surface of the substrate 72. The dielectric resonant element 68 may have a height 96 extending from a bottom surface 82 at the substrate 72 to an opposing top surface 80. The dielectric substrate 70 (sometimes referred to herein as the overmold structure 70) may extend across some or all of the height 96. The top surface 80 may be flush with the top surface of the dielectric substrate 70, may protrude beyond the top surface of the dielectric substrate 70, or the dielectric substrate 70 may extend above and cover the top surface 80 of the dielectric resonant element 68.

[0083] By adjusting the size of the dielectric resonant element 68 (e.g., Figure 6The operating (resonant) frequency of the antenna 40 is selected by selecting the operating (resonant) frequency of the antenna 40 in the X-axis, Y-axis and / or Z-axis directions of the antenna 40. The dielectric resonant element 68 can be formed of a column of dielectric material having a dielectric constant dk1. The dielectric constant dk1 can be relatively high (e.g., greater than 10.0, greater than 12.0, greater than 15.0, greater than 20.0, between 22.0 and 25.0, between 15.0 and 40.0, between 10.0 and 50.0, between 18.0 and 30.0, between 12.0 and 45.0, etc.). In one suitable arrangement, the dielectric resonant element 68 can be formed of zirconium oxide or a ceramic material. If desired, other dielectric materials can be used to form the dielectric resonant element 68.

[0084] The dielectric substrate 70 may be formed of a material having a dielectric constant dk2. The dielectric constant dk2 may be less than the dielectric constant dk1 of the dielectric resonant element 68 (e.g., less than 18.0, less than 15.0, less than 10.0, between 3.0 and 4.0, less than 5.0, between 2.0 and 5.0, etc.). The dielectric constant dk2 may be less than the dielectric constant dk1 by at least 10.0, 5.0, 15.0, 12.0, 6.0, etc. In one suitable arrangement, the dielectric substrate 70 may be formed of molded plastic (e.g., injection molded plastic). Other dielectric materials may be used to form the dielectric substrate 70, or the dielectric substrate 70 may be omitted if desired. The difference in dielectric constant between the dielectric resonant element 68 and the dielectric substrate 70 may establish a radio frequency boundary condition between the dielectric resonant element 68 and the dielectric substrate 70 from the bottom surface 82 to the top surface 80. This may configure the dielectric resonant element 68 to function as a resonant waveguide for propagating radio frequency signals 84 at millimeter-wave and centimeter-wave frequencies.

[0085] The dielectric substrate 70 may have a width (thickness) 94 on some or all sides of the dielectric resonant element 68. The width 94 may be selected to isolate the dielectric resonant element 68 from surrounding device structures and / or from other dielectric resonant elements in the same antenna module and to minimize signal reflections in the dielectric substrate 70. The width 94 may be, for example, at least one-tenth of the effective wavelength of a radio frequency signal in a dielectric material having a dielectric constant of dk2. The width 94 may be 0.4 mm-0.5 mm, 0.3 mm-0.5 mm, 0.2 mm-0.6 mm, greater than 0.1 mm, greater than 0.3 mm, 0.2 mm-2.0 mm, 0.3 mm-1.0 mm, or greater than 0.4 mm to 0.5 mm, to name a few.

[0086] When excited by the signal conductors of the RF transmission lines 88V and / or 88H, the dielectric resonant element 68 can radiate the RF signal 84. In some cases, a slot is formed in a ground trace on the substrate 72, the slot is indirectly fed by the signal conductor embedded in the substrate 72, and the slot excites the dielectric resonant element 68 to radiate the RF signal 84. However, in these cases, the radiation characteristics of the antenna may be affected by how the dielectric resonant element is mounted to the substrate 72. For example, the air gap or the adhesive layer used to mount the dielectric resonant element to the flexible printed circuit may be difficult to control and may inadvertently affect the radiation characteristics of the antenna. In order to alleviate the problems associated with using an underlying slot to excite the dielectric resonant element 68, one or more RF feed probes 100 such as Figure 6 The feeding probes 100V and 100H of the antenna 40 are used to feed the antenna 40. The feeding probe 100 may form an antenna feeding portion (eg, Figure 3 A portion of the antenna feed portion 44).

[0087] like Figure 6 As shown, the feed probe 100V may be formed of the conductive structure 86V and the feed probe 100H may be formed of the conductive structure 86H. The conductive structure 86V may include a first portion patterned onto or pressed against the first side wall 102 of the dielectric resonant element 68. If desired, the conductive structure 86V may also include a second portion on the surface of the substrate 72 and the second portion may be coupled to the signal trace of the RF transmission line 88V (e.g., using solder, a weld, a conductive adhesive, etc.). If desired, the second portion of the conductive structure 86V may be omitted (e.g., the signal trace in the RF transmission line 88V may be directly soldered to the portion of the conductive structure 86V on the first side wall 102). As an example, the conductive structure 86V may include a conductive trace patterned directly onto the first side wall 102, or may include a stamped metal plate in the case where the conductive structure 86V is pressed against the first side wall 102.

[0088] The signal traces in the RF transmission line 88V can transmit RF signals to and from the feed probe 100V. The feed probe 100V can electromagnetically couple the RF signal on the signal trace of the RF transmission line 88V into the dielectric resonant element 68. This can be used to excite one or more electromagnetic modes (e.g., RF cavity modes or waveguide modes) of the dielectric resonant element 68. When excited by the feed probe 100V, the electromagnetic modes of the dielectric resonant element 68 can configure the dielectric resonant element to function as a waveguide that propagates the wavefront of the RF signal 84 along the height of the dielectric resonant element 68 (e.g., in the direction of the Z axis and along the center / longitudinal axis 76 of the dielectric resonant element 68). The RF signal 84 transmitted by the feed probe 100V can be vertically polarized.

[0089] Similarly, the conductive structure 86H may include a first portion that is patterned onto or pressed against the second sidewall 102 of the dielectric resonant element 68. If desired, the conductive structure 86H may also include a second portion on the surface of the substrate 72 and the second portion may be coupled to the signal trace of the RF transmission line 88H (e.g., using solder, a weld, a conductive adhesive, etc.). If desired, the second portion of the conductive structure 86H may be omitted (e.g., the signal trace in the RF transmission line 88H may be directly soldered to the conductive structure 86H on the sidewall 102). As an example, the conductive structure 86H may include a conductive trace that is patterned directly onto the second sidewall 102, or may include a stamped metal plate in the case where the conductive structure 86H is pressed against the second sidewall 102.

[0090] The signal traces in the RF transmission line 88H can transmit RF signals to and from the feed probe 100H. The feed probe 100H can electromagnetically couple the RF signals on the signal traces of the RF transmission line 88H into the dielectric resonant element 68. This can be used to excite one or more electromagnetic modes (e.g., RF cavity modes or waveguide modes) of the dielectric resonant element 68. When excited by the feed probe 100H, the electromagnetic modes of the dielectric resonant element 68 can configure the dielectric resonant element to function as a waveguide that propagates the wavefront of the RF signal 84 along the height of the dielectric resonant element 68 (e.g., along the center / longitudinal axis 76 of the dielectric resonant element 68). The RF signal 84 transmitted by the feed probe 100H can be horizontally polarized.

[0091] Similarly, during signal reception, an RF signal 84 may be received by the antenna 40. The received RF signal may excite the electromagnetic mode of the dielectric resonant element 68, thereby causing the RF signal to propagate downward along the height of the dielectric resonant element 68. The feed probe 100V may couple the received vertically polarized signal to the RF transmission line 88V. The feed probe 100H may couple the received horizontally polarized signal to the RF transmission line 88H. The RF transmission lines 88H and 88V may pass the received RF signal to the millimeter wave / centimeter wave transceiver circuit (e.g., a radio frequency integrated circuit) of the antenna 40. Figure 2 and Figure 3 The relatively large difference in dielectric constant between the dielectric resonant element 68 and the dielectric substrate 70 may allow the dielectric resonant element 68 to transmit the RF signal 84 with relatively high antenna efficiency (e.g., by establishing a strong boundary for the RF signal between the dielectric resonant element 68 and the dielectric substrate 70). The relatively high dielectric constant of the dielectric resonant element 68 may also allow the dielectric resonant element 68 to occupy a relatively small volume compared to when a material with a lower dielectric constant is used.

[0092] The dimensions of the feed probes 100V and 100H (e.g., height 90 and width 92 on the sidewall 102) may be selected to help match the impedance of the RF transmission lines 88V and 88H to the impedance of the dielectric resonant element 68. As an example, the width 92 may be between 0.3 mm and 0.7 mm, between 0.2 mm and 0.8 mm, between 0.4 mm and 0.6 mm, or other values. The height 90 may be between 0.3 mm and 0.7 mm, between 0.2 mm and 0.8 mm, between 0.4 mm and 0.6 mm, or other values. The height 90 may be equal to the width 92 or may be different from the width 92. The feed probes 100V and 100H may sometimes be referred to herein as feed conductors, feed patches, or probe feeds. Dielectric resonant element 68 may sometimes be referred to herein as a dielectric radiating element, dielectric radiator, dielectric resonator, dielectric antenna resonating element, dielectric column, dielectric pillar, radiating element, or resonant element. When fed by one or more feed probes such as feed probes 100V and 100H, a dielectric resonator antenna such as Figure 6 The antenna 40 may sometimes be referred to herein as a probe-fed dielectric resonator antenna.

[0093] Antenna 40 may be included in a rear-facing, front-facing, or side-facing phased antenna array in device 10 (e.g., RF signal 84 may form a Figure 5 In the case where the antenna 40 is formed in a front-facing phased antenna array, the top surface 80 may be pressed against Figure 5 In the case where antenna 40 is formed in a rear-facing phased antenna array, top surface 80 may be pressed against a display cover layer 56, adhered to the display cover layer, or separated from the display cover layer. Figure 5 12R of the rear housing wall 12R. An optional impedance matching layer may be interposed between the top surface 80 and the rear housing wall 12R or the display cover layer 56. The impedance matching layer may have a dielectric constant between the dielectric constant dk1 and the dielectric constant of the rear housing wall 12R or the display cover layer 56. If desired, the dielectric constant and thickness of the impedance matching layer may be selected to configure the impedance matching layer to form a quarter-wavelength impedance transformer for the antenna 40 at the operating frequency of the antenna 40. This may configure the impedance matching layer to help minimize signal reflections at the interface between the top surface 80 and the free space outside the device 10.

[0094] If desired, the RF transmission lines 88V and 88H may include impedance matching structures (e.g., transmission line stubs) to help match the impedance of the dielectric resonant element 68. Both the feed probes 100H and 100V may be active at the same time so that the antenna 40 transmits both vertically polarized signals and horizontally polarized signals at any given time. If desired, the phases of the signals transmitted by the feed probes 100H and 100V may be independently adjusted so that the antenna 40 transmits RF signals 84 having elliptical or circular polarization. In another suitable arrangement, a single one of the feed probes 100H and 100V may be active at the same time so that the antenna 40 transmits only a single polarized RF signal at any given time. In another suitable arrangement, the antenna 40 may be a single polarized antenna in the case where the RF transmission line 88V and the feed probe 100V have been omitted.

[0095] like Figure 6 As shown, dielectric resonant element 68 may have a height 96, a length 74, and a width 73. Length 74, width 73, and height 96 may be selected to provide dielectric resonant element 68 with a corresponding mix of electromagnetic cavity modes / waveguide modes that, when excited by feed probe 100H and / or 100V, configure antenna 40 to radiate at a desired frequency. For example, height 96 may be 2 mm-10 mm, 4 mm-6 mm, 3 mm-7 mm, 4.5 mm-5.5 mm, or greater than 2 mm. Width 73 and length 74 may each be 0.5 mm-1.0 mm, 0.4 mm-1.2 mm, 0.7 mm-0.9 mm, 0.5 mm-2.0 mm, 1.5 mm-2.5 mm, 1.7 mm-1.9 mm, 1.0 mm-3.0 mm, etc. The width 73 may be equal to the length 74 (e.g., the dielectric resonant element 68 may have a square transverse profile in the XY plane), or in other arrangements, may be different from the length 74 (e.g., the dielectric resonant element 68 may have a rectangular or non-rectangular transverse profile in the XY plane). The sidewalls 102 of the dielectric resonant element 68 may directly contact the surrounding dielectric substrate 70. The dielectric substrate 70 may be molded over the feed probes 100H and 100V, or may include openings, notches, or other structures to accommodate the presence of the feed probes 100H and 100V. Each sidewall 102 may be planar, or if desired, one or more sidewalls 102 may have a non-planar shape (e.g., a shape with a planar and curved portion, a planar shape with a notch or recessed portion, etc.). Figure 6 The example of is merely illustrative, and the dielectric resonant element 68 may have other shapes (eg, shapes having any desired number of straight sidewalls and / or curved sidewalls 102) if desired.

[0096] In practice, dielectric resonator antennas such as antenna 40 may be subject to undesirable cross-polarization interference if care is not taken. Cross-polarization interference may occur when an antenna feed that is intended to transmit radio frequency signals in a second polarization is used to inadvertently transmit or receive radio frequency signals that are intended to be transmitted in a first polarization. For example, cross-polarization interference may involve horizontally polarized signals being transmitted to a second polarization. Figure 6 The leakage and / or vertically polarized signal on the feed probe 100V (e.g., a feed probe intended to transmit a vertically polarized signal) to Figure 6 Cross-polarization interference may occur when the electric field generated by the feed probe 100V has components oriented at a mixed angle or when the electric field generated by the feed probe 100H has components oriented at a mixed angle within the dielectric resonant element 68. Cross-polarization interference may result in a reduction in overall data throughput, errors in transmitted or received data, or otherwise reduced antenna performance. These effects are also particularly detrimental in situations where the antenna 40 transmits independent data streams using horizontal and vertical polarizations (e.g., under a MIMO scheme) because the cross-polarization interference reduces the independence of the data streams. Therefore, it is desirable to provide a dielectric resonator antenna such as the antenna 40 with a structure for mitigating cross-polarization interference (e.g., for maximizing isolation between polarizations handled by the antenna).

[0097] Figure 7 is a top-down view of antenna 40 having structures for mitigating cross-polarization interference. Figure 7 In the example of , antenna 40 is a dual-polarized dielectric resonator antenna having feed probes 100V and 100H with different polarizations for exciting dielectric resonant element 68 .

[0098] like Figure 7 As shown, the dielectric resonant element 68 may have a rectangular lateral profile. The dielectric resonant element 68 may have four sidewalls 102 (e.g., four vertical faces or surfaces oriented in a manner perpendicular to the XY plane), such as a first sidewall 102A, a second sidewall 102B, a third sidewall 102C, and a fourth sidewall 102D. On the dielectric resonant element 68, the third sidewall 102C may be opposite the first sidewall 102A, and the fourth sidewall 102D may be opposite the second sidewall 102B. The conductive structure 86V of the feed probe 100V may be patterned onto or pressed against the first sidewall 102A. The conductive structure 86V may also be coupled to a conductive trace 106V on the underlying substrate 72 (e.g., using solder, a weld, a conductive adhesive, etc.). The conductive trace 106V may be coupled to the conductive trace 104V. The conductive traces 104V and 106V may form Figure 6Similarly, the conductive structure 86H of the feed probe 100H can be patterned onto or pressed against the second sidewall 102B. The conductive structure 86H can also be coupled to a conductive trace 106H on the substrate 72 (e.g., using solder, a weld, a conductive adhesive, etc.). The conductive trace 106H can be coupled to the conductive trace 104H. The conductive traces 104H and 106H can form Figure 6 The signal conductor portion of the RF transmission line 88H.

[0099] To mitigate cross-polarization interference, parasitic elements such as parasitic elements 108H and 108V may be patterned onto the sidewalls of dielectric resonant element 68. Parasitic elements 108H and 108V may be formed, for example, of floating patches of conductive material (e.g., conductive patches that are not coupled to ground or the signal traces of antenna 40) patterned onto or pressed against the sidewalls of dielectric resonant element 68. Figure 7 As shown, the parasitic element 108H may be patterned onto or pressed against the fourth side wall 102D opposite the feeding probe 100H. The parasitic element 108V may be patterned onto or pressed against the third side wall 102C opposite the first feeding probe 100V.

[0100] The presence of the conductive material in the parasitic element 108H can be used to change the boundary conditions of the electric field excited by the feed probe 100H within the dielectric resonant element 68. For example, in the case where the parasitic element 108H is omitted, the electric field excited by the feed probe 100H may include a mixture of different electric field components oriented in different directions. This may lead to cross-polarization interference, in which some vertically polarized signals are undesirably leaked onto the feed probe 100H. However, the boundary conditions created by the parasitic element 108H can be used to align the electric field excited by the feed probe 100H in a single direction between the side walls 102B and 102D, as shown by arrow 112 (e.g., in a horizontal direction parallel to the X-axis). Because the entire electric field excited by the feed probe 100H is horizontal, the feed probe 100H can transmit only horizontally polarized signals without vertically polarized signals interfering with horizontally polarized signals.

[0101] Similarly, the presence of conductive material in the parasitic element 108V can be used to change the boundary conditions of the electric field excited by the feed probe 100V within the dielectric resonant element 68. For example, in the case where the parasitic element 108V is omitted, the electric field excited by the feed probe 100V may include a mixture of different electric field components oriented in different directions. This may lead to cross-polarization interference, in which some horizontally polarized signals are undesirably leaked onto the feed probe 100V. However, the boundary conditions created by the parasitic element 108V can be used to align the electric field excited by the feed probe 100V in a single direction between the sidewalls 102A and 102C, as shown by arrow 110 (e.g., in a vertical direction parallel to the Y axis). Because the entire electric field excited by the feed probe 100V is vertical, the feed probe 100V can transmit only vertically polarized signals without horizontally polarized signals interfering with the vertically polarized signals.

[0102] Parasitic element 108V may have a shape (eg, lateral dimensions in the XZ plane) that matches the shape of the portion of conductive structure 86V on sidewall 102A (eg, parasitic element 108V may have Figure 6 Similarly, parasitic element 100H may have a shape (eg, lateral dimensions in the YZ plane) that matches the shape of the portion of conductive structure 86H on sidewall 102B (eg, parasitic element 108H may have Figure 6 92 and height 90). This ensures that symmetrical boundary conditions exist between the feeding probe 100V and the parasitic element 108V, and between the feeding probe 100H and the parasitic element 108H. If desired, the parasitic element 108V need not have exactly the same dimensions as the feeding probe 100V, and the parasitic element 108H need not have exactly the same dimensions as the feeding probe 100H.

[0103] In the case where only a single feed probe is used to feed the antenna 40, the antenna 40 may also include a cross-polarization interference mitigation parasitic element. Figure 8 is a top-down view showing how the antenna 40 may include a cross-polarization interference mitigation parasitic element in an arrangement where only a single feed probe 100 is used to feed the antenna 40 .

[0104] like Figure 8 As shown, antenna 40 may be fed using a single feed probe 100. Conductive structures 86 of feed probe 100 may be patterned onto sidewalls 102A of dielectric resonant element 68. Conductive structures 86 may be coupled to conductive traces 104 on underlying substrate 72. Ground traces such as ground trace 116 may also be patterned onto substrate 72.

[0105] The antenna 40 may include one or more parasitic elements 114, such as a first parasitic element 114-1 and a second parasitic element 114-2. The parasitic element 114-1 may be formed by a conductive trace patch (e.g., a conductive patch) patterned onto the sidewall 102D of the dielectric resonant element 68. The parasitic element 114-2 may be formed by a conductive trace patch (e.g., a conductive patch) patterned onto the sidewall 102B of the dielectric resonant element 68. The parasitic elements 114-1 and 114-2 may, for example, each have the same size and lateral dimensions (e.g., in the YZ plane) as the conductive structure 86 (e.g., in the XZ plane). The parasitic element 114-1 and the parasitic element 114-2 may each be coupled to the ground trace 116 at the substrate 72 via a conductive interconnect structure 118. The conductive interconnect structure 118 may include solder, a weld, a conductive adhesive, a conductive tape, a conductive foam, a conductive spring, a conductive bracket, and / or any other desired conductive interconnect structure. Thus, parasitic elements 114-1 and 114-2 may each be maintained at ground potential (eg, parasitic elements 114-1 and 114-2 may be ground patches). If desired, parasitic element 114-1 may be omitted or parasitic element 114-2 may be omitted (eg, antenna 40 may include only a single parasitic element 114, if desired).

[0106] The parasitic element 114-1 and / or the parasitic element 114-2 may be used to change the electromagnetic boundary conditions of the dielectric resonant element 68 to mitigate cross-polarization interference of the feed probe 100 (e.g., to isolate the feed probe 100 from interference from horizontally polarized signals in the case where the feed probe 100 processes vertically polarized signals). The sidewall 102C of the dielectric resonant element 68 may be free of conductive materials, such as the parasitic element 114.

[0107] Figure 4 The phased antenna array 54 (eg, for transmitting the RF signal 62 through Figure 5 The display cover layer 56 of the front-facing phased antenna array is used to transmit the radio frequency signal 60 through Figure 5 The phased antenna array 54 may include any desired number of antennas 40 arranged in any desired pattern (e.g., a pattern having rows and columns). Each antenna 40 in the phased antenna array 54 may be a dielectric resonator antenna such as a Figures 6 to 8 The probe-fed dielectric resonator antenna 40 (e.g., having a Figure 6 The two feed probes shown are 100V and 100H and optionally Figure 7 The parasitic elements 108V and 108H shown, or having a feed probe 100 and optionally Figure 8Parasitic elements 114-1 and 114-2 are shown). Phased antenna array 54 may be formed as part of an integrated antenna module.

[0108] Fig. 9 FIG. 5 is a top-down view of an integrated antenna module that may include a phased antenna array 54. Fig. 9 As shown, phased antenna array 54 may be formed as part of an integrated antenna module such as antenna module 120. Antenna module 120 may include substrate 72. Phased antenna array 54 may be mounted to a surface of substrate 72 such as surface 122. A board-to-board connector such as connector 123 may also be mounted to surface 122.

[0109] exist Fig. 9 In the example of , the phased antenna array 54 is a dual-band phased antenna array having a first set of antennas 40L that transmit radio frequency signals within a first frequency band and a second set of antennas 40H that transmit radio frequency signals within a second frequency band that is higher than the first frequency band. Thus, the antennas 40H may sometimes be referred to herein as high-band antennas 40H, and the low-band antennas 40L may sometimes be referred to herein as low-band antennas 40L. As just one example, the first frequency band may include frequencies between approximately 24 GHz and 31 GHz, and the second frequency band may include frequencies between approximately 37 GHz and 41 GHz.

[0110] The high band antenna 40H may be a dielectric resonator antenna having a dielectric resonant element 68H embedded in a dielectric substrate 70. The low band antenna 40L may be a dielectric resonator antenna having a dielectric resonant element 68H embedded in a dielectric substrate 70. The dielectric substrate 70 may be molded over and / or around the dielectric resonant elements 68H and 68L and may be mounted to the surface 122 of the substrate 72. To support satisfactory beamforming, each high band antenna 40H may be separated from one or two adjacent high band antennas 40H in the dielectric substrate 70, for example, by a distance approximately equal to half of an effective wavelength corresponding to a frequency in the second frequency band (e.g., where the effective wavelength is equal to the free space wavelength multiplied by a constant value determined by the dielectric material surrounding the antenna). Similarly, each low band antenna 40L may be separated from one or two adjacent low band antennas 40L in the dielectric substrate 70, for example, by a distance approximately equal to half of an effective wavelength corresponding to a frequency in the first frequency band.

[0111] exist Fig. 9In the example of , the phased antenna array 54 is a one-dimensional array having four high-band antennas 40H interlaced (interspersed) with four low-band antennas 40L arranged along a single longitudinal axis (e.g., extending in a manner parallel to the X-axis). This is merely illustrative. The phased antenna array 54 may include any desired number of low-band antennas 40L and / or high-band antennas 40H, and these antennas may be arranged in any desired one-dimensional pattern or two-dimensional pattern.

[0112] Fig.10 is a cross-sectional side view of the antenna module 120 (eg, along Fig. 9 AA' direction). Fig.10 As shown, the bottom surfaces 82 of the dielectric resonant elements 68L and 68H in the phased antenna array 54 can be mounted to the surface 122 of the substrate 72. The dielectric substrate 70 can be molded over the dielectric resonant elements 68L and 68H and can be mounted to the surface 122. If desired, the dielectric substrate 70 can be molded over each of the dielectric resonant elements 68L and 68H in the phased antenna array 54 to form a single integrated structure, which can then be mounted (e.g., surface mounted) to the surface 122 of the substrate 72. This can, for example, minimize mechanical variations between antennas in the phased antenna array 54 that could otherwise degrade antenna performance or mechanical reliability.

[0113] The substrate 72 may have a surface 124 opposite the surface 122. Additional electronic components such as a radio frequency integrated circuit (RFIC) 126 may be mounted to the surface 124 of the substrate 72. An optional overmold structure and / or shielding structure may be provided over the RFIC 126 and the surface 124 of the substrate 72 (not shown for clarity). Fig.10 ). RFIC 126 may have terminals or ports that are coupled to corresponding contact pads on surface 124 using solder balls, conductive adhesives, conductive pins, conductive springs, and / or any other desired conductive interconnect structures.

[0114] The radio frequency transmission line (e.g., Figure 6 RF transmission lines 88V and 88H) can couple ports of RFIC 126 to feed probes (e.g., Figure 6 The dielectric substrate 72 may include multiple stacked dielectric substrate layers (e.g., layers of printed circuit board material, flexible printed circuit material, ceramic, etc.). The RF transmission lines in the substrate 72 may include signal traces and ground traces on one or more of the stacked dielectric substrate layers (e.g., embedded within and / or on the surfaces 122 and / or 124 of the substrate 72) and / or conductive vias extending through one or more of the stacked dielectric substrate layers.

[0115] RFIC 126 may include, for example Figure 4 The RFIC 126 may include (for example, using additional RF transmission line structures on the substrate 72) a phase and amplitude controller 50, an upconverter circuit, a downconverter circuit, an amplifier circuit, or any other desired RF circuit. Fig. 9 RFIC 126 may be coupled to one or more additional ports or terminals of connector 123. Figure 2 and Figure 3 The millimeter wave / centimeter wave transceiver circuit 38 of the device 10. The millimeter wave / centimeter wave transceiver circuit 38 can be mounted to an additional substrate such as an additional rigid printed circuit board, a flexible printed circuit, a main logic board, etc. of the device 10. If desired, the signals transmitted between the millimeter wave / centimeter wave transceiver circuit and the RFIC 126 can be at an intermediate frequency (e.g., radio frequency) that is greater than the baseband frequency and less than the frequency at which the antennas 40L and 40H transmit radio frequency signals. In these cases, the up-converter circuit in the RFIC 126 can up-convert these signals from the intermediate frequency to the operating frequency of the antennas 40L and 40H. Similarly, the down-converter circuit in the RFIC 126 can down-convert the signals received by the antennas 40L and 40H to the intermediate frequency. If desired, the RFIC 126 may include multiple separate (discrete) radio frequency integrated circuits mounted to the substrate 72 (e.g., the antenna module 120 may be an integrated circuit package including one or more RFICs and one or more phased antenna arrays mounted to a common / shared substrate such as the substrate 72).

[0116] Fig.11 yes Fig. 9 and Fig.10 A perspective view of the antenna module 120 is shown. Fig.11 As shown, phased antenna array 54 (e.g., dielectric resonant elements 68L and 68H and dielectric substrate 70) can be mounted to surface 122 of substrate 72. Dielectric substrate 70 can have a standoff structure 128 at surface 122 that is wider than the top surface of dielectric substrate 70 (e.g., to increase the mechanical stability of antenna module 120). If desired, phased antenna array 54 can be secured to surface 122 using an adhesive layer. If desired, an underfill can be provided under dielectric substrate 70 and phased antenna array 54. Fig.11 In the example of FIG. 1 , a dielectric overmold structure such as overmold 131 is provided on surface 124 of substrate 72. Overmold 131 may cover Fig.10 RFIC 126 (eg, RFIC 126 may be embedded within overmold 131, thereby hiding RFIC 126 and not being visible on the Fig.11). The overmold 131 may be used to protect the RFIC 126 from damage or contaminants, and may perform heat dissipation, isolation, shielding, etc. As an example, the phased antenna array 54 may be mounted on Figure 5 The device 10 is within the peripheral area 66 and can transmit radio frequency signals through the front or back of the device 10.

[0117] exist Figures 9 to 11 In the example of FIG. 5 , RFIC 126 is mounted to the side of substrate 72 opposite to phased antenna array 54 . This is merely illustrative. In another suitable arrangement, RFIC 126 may be mounted to the same side of substrate 72 as phased antenna array 54 . Fig.12 is a top-down view showing how the RFIC 126 may be mounted to the same side of the substrate 72 as the phased antenna array 54 .

[0118] like Fig.12 As shown, both the RFIC 126 and the phased antenna array 54 may be mounted to the surface 122 of the substrate 72. Some or all of the RFIC 126 may be interposed laterally between the phased antenna array 54 and the peripheral edge of the substrate 72, for example. Fig.13 is along Fig.12 A side view of the antenna module 120 taken in the direction of arrow 132. Fig.13 As shown, the phased antenna array 54 can be higher than the RFIC 126 in the direction of the Z axis. This can, for example, allow the RFIC 126 to be placed below the display module 64 while the phased antenna array 54 radiates through the display cover layer 56 (e.g., when the antenna module 120 is mounted). Figure 5 and the phased antenna array 54 is a front-facing phased antenna array in the device 10).

[0119] If desired, antenna module 120 may include multiple phased antenna arrays mounted to different sides of substrate 72 . Fig.14 7 is a side view showing how multiple phased antenna arrays 54 can be mounted to different sides of the substrate 72. Fig.14As shown, antenna module 120 may include a first phased antenna array 54-1 and a second phased antenna array 54-2. First phased antenna array 54-1 may include antenna 40 having dielectric resonant element 68 mounted to surface 122 of substrate 72, while second phased antenna array 54-2 includes antenna 40 having dielectric resonant element 68 mounted to surface 124 of substrate 72. First phased antenna array 54-1 may steer a beam of radio frequency signal 134 across at least some hemisphere above surface 122. Second phased antenna array 54-2 may steer a beam of radio frequency signal 136 across at least some hemisphere below surface 124. First phased antenna array 54-1 may be a one-dimensional array or a two-dimensional array of antenna 40. Second phased antenna array 54-2 may be a one-dimensional array or a two-dimensional array of antenna 40.

[0120] Fig.14 The antenna module 120 may be mounted, for example, on Figure 5 The first phased antenna array 54-1 may be a front-facing phased antenna array (eg, where the RF signal 134 is used to transmit through the antenna array). Figure 5 The second phased antenna array may be a rear-facing phased antenna array (e.g., where the RF signal 136 is used to transmit the RF signal 62 through the display cover layer 56). Figure 5 In another suitable arrangement, the first phased antenna array 54-1 may be a rear-facing phased antenna array, while the second phased antenna array 54-2 is a front-facing phased antenna array.

[0121] like Fig.14 As shown, connector 123 may be mounted to surface 122. This is merely illustrative, and in another suitable arrangement, connector 123 may be mounted to surface 124. RFIC 126 may be mounted to surface 124. This is merely illustrative, and in another suitable arrangement, RFIC 126 may be mounted to surface 122. If desired, RFIC 126 and connector 123 may be mounted to the same surface. RF transmission lines in substrate 72 may couple RFIC 126 to each antenna 40 in phased antenna arrays 54-1 and 54-2. If desired, an overmolded structure may be provided over RFIC 126 and surface 124. Fig.14 In the example of FIG. 5 , for clarity, the phased antenna arrays 54 - 1 and 54 - 2 are shown without the corresponding dielectric substrate 70 ( Figure 6 and Figures 9 to 13 If desired, the dielectric substrate 70 may be molded over the first phased antenna array 54 - 1 and / or the second phased antenna array 54 - 2 .

[0122] Phased antenna arrays 54-1 and 54-2 are both formed of dielectric resonator antennas. Fig.14 The example is merely illustrative. In another suitable arrangement, the antennas in the first phased antenna array 54-1 may be stacked patch antennas, such as Fig.15 is shown in a cross-sectional side view.

[0123] like Fig.15 1 , antennas 40 in first phased antenna array 54-1 may be stacked patch antennas. Each antenna 40 in first phased antenna array 54-1 may include one or more conductive patches 140 embedded within dielectric layer 138 of substrate 72. Conductive patches 140 may be spaced apart from and extend parallel to ground traces 144 in substrate 72. Conductive patches 140 in antenna 40 may include directly fed patch antenna resonating elements and / or indirectly fed parasitic antenna resonating elements that at least partially overlap at least one directly fed patch antenna resonating element. Conductive patches 140 may have a length 142 that determines the frequency response of first phased antenna array 54-1. Length 142 may, for example, be approximately equal to half of an effective wavelength corresponding to a frequency in an operating band of first phased antenna array 54-1.

[0124] In practice, dielectric resonant elements 68 in second phased antenna array 54-2 may occupy a greater height (e.g., in the direction of the Z axis) than conductive patches 140 in first phased antenna array 54-1. At the same time, conductive patches 140 may occupy a larger area (e.g., in the XY plane) than dielectric resonant elements 68. This may allow antenna module 120 to be mounted at a location within device 10 where there may be more room to place an antenna to radiate through one side of device 10 rather than another side. As an example, Fig.15 The antenna module 120 may be mounted on Figure 5 within a peripheral region 66 where the second phased antenna array 54-2 faces the display cover layer 56 and the first phased antenna array 54-1 faces the rear housing wall 12R (e.g., there may be more space to place antennas to radiate through the rear housing wall 12R rather than through the display cover layer 56 (due to the presence of the display module 64)). Fig.15 The example is merely illustrative, and in another suitable arrangement, the first phased antenna array 54-1 may include dielectric resonator antennas, while the second phased antenna array 54-2 includes stacked patch antennas.

[0125] In practice, antenna modules with dielectric resonator antennas such as Figures 9 to 15Antenna modules 120 can be challenging to manufacture. In some cases, antenna modules are manufactured by individually forming each dielectric resonant element (e.g., by sintering ceramic powders), individually metalizing the probe feed of each dielectric resonant element, injection molding a dielectric substrate over each individually formed dielectric resonant element in the array, grinding the portions of the dielectric resonant elements that protrude beyond the dielectric substrate, and surface mounting the result to a board. This process can be very complex, time consuming, and expensive, and can result in antenna modules that exhibit a large amount of mechanical variation that limits the overall mechanical and / or wireless performance of the module (e.g., due to poor dielectric resonant element parallelism, height coplanarity and size, contact pad tolerance issues, and unpredictable dielectric resonant element tilt). To alleviate these issues, antenna modules 120 can be manufactured using a double-sided molding process that is largely scalable and compatible with IC assembly processes, such as Fig.16 and Fig.17 shown.

[0126] Fig.16 and Fig.17 is a schematic diagram of an exemplary assembly process of the antenna module 120. Fig.16 As shown, antenna module 120 may be manufactured in a manufacturing system such as manufacturing system 146. Manufacturing system 146 may include manufacturing equipment 148. Manufacturing system 146 may collect substrates 72 and electronic components 150 for assembly into a given antenna module 120. Substrate 72 may include RF transmission line structures (e.g., signal traces and ground traces located on or embedded in dielectric layers of substrate 72) and corresponding contact pads coupled to the RF transmission line structures at the surface of substrate 72. Electronic component 150 may include RFIC 126 ( Figures 9 to 15 ) or any other required RF components (e.g., RF switching circuits, filter circuits, discrete capacitors, resistors and inductors, amplifier circuits, etc.).

[0127] The manufacturing equipment 148 can surface mount the electronic component 150 to the surface 122 of the substrate 72, as indicated by arrow 152 (e.g., using surface mount technology (SMT) equipment in the manufacturing equipment 148). For example, solder balls 154 or any other desired conductive interconnect structures can be used to couple the terminals (ports) of the electronic component 150 to corresponding contact pads on the surface 122 of the substrate 72. The manufacturing equipment 148 can then layer the overmold 131 over the surface mounted component 150 and the surface 122 of the substrate 72, as indicated by arrow 156. This can be used to encapsulate or embed the electronic component 150 at the surface 122 within the overmold 131.

[0128] The manufacturing equipment 148 can then flip the substrate 72 and each dielectric resonant element 68 in the antenna module can be simultaneously formed on the surface 124 of the substrate 72. For example, the manufacturing equipment 148 can form the dielectric resonant elements 68 by performing a molding / selective molding process using a high dielectric constant epoxy molding compound to simultaneously mold each dielectric resonant element 68 in the module (e.g., so that the dielectric resonant elements 68 exhibit a dielectric constant). Figure 6 The process may also form a top layer 164 on the surface 124 of the substrate 72. The top layer 164 may cover the RF transmission line (e.g., Figure 6 Although the top-most layer 164 may be formed of the same material as the dielectric resonant element 68, the top-most layer 164 may sometimes be referred to herein as forming a portion of the substrate 72 or forming the top-most layer of the substrate 72.

[0129] The fabrication equipment 148 may then perform laser activation and metallization (e.g., using a laser direct structuring (LDS) process) on the dielectric resonant element 68, as indicated by arrow 162. For example, the laser in the fabrication equipment 148 may be used to form a pattern or seed layer for metallizing the parasitic elements of the feed probe and optional antenna 40 (e.g., on the sidewalls 102 of the dielectric resonant element 68 and / or on the top layer 164). The fabrication equipment 148 may then perform a physical deposition or electroless plating process that metallizes the pattern or seed layer formed by the laser. This may be used to form conductive structures 86V and 86H on the sidewalls 102 of the dielectric resonant element 68 (e.g., at the bottom surface 82 of the dielectric resonant element 68) and / or on the top layer 164. If desired, the process may also be used to form parasitic elements 108H and 108V ( Figure 7 ) and / or parasitic elements 114-1 and 114-2 ( Figure 8 ). In the case where the dielectric resonant element 68 covers only a single polarization, the manufacturing equipment 148 may form only a single feed probe on each dielectric resonant element 68.

[0130] Additionally, fabrication equipment 148 may couple conductive structures 86V and 86H to corresponding contact pads on surface 124 of substrate 72 (eg, by forming conductive vias extending through topmost layer 164). Figure 8In the case of parasitic elements 114-1 and / or 114-2, fabrication equipment 148 may form conductive vias through top-most layer 164 to couple parasitic elements to ground traces at surface 124. Contact pads that couple conductive structures 86V and 86H to surface 124 may be used to couple conductive structures 86V and 86H to corresponding RF transmission lines in substrate 72. RF transmission lines may couple conductive structures 86V and 86H to electronic components 150 at surface 122.

[0131] If desired, multiple antenna modules 120 may be fabricated from the same substrate 72, such as Fig.17 As shown in the perspective view of Fig.17 As shown, substrate 72 can be used to form nine antenna modules, each having four antennas and therefore four dielectric resonant elements 68 arranged in a 1×4 pattern. This example is merely illustrative, and in general, any desired number of antenna modules can be formed from the same substrate 72. Each antenna module formed from substrate 72 can be simultaneously performed Fig.16 The process of manufacturing multiple antenna modules simultaneously in this manner can increase the reliability of the antenna modules (both within each antenna module and between antenna modules) and reduce the cost and time required to manufacture multiple devices 10. The process can allow the antenna module 120 to exhibit a smaller form factor for multiple applications, eliminating additional injection molding, sintering, surface mounting, and underfilling relative to an arrangement where each dielectric resonant element is molded separately and then mounted to a substrate. The arrangement can also allow for tighter process control and improved yield relative to an arrangement where each dielectric resonant element is molded separately and then mounted to a substrate.

[0132] As shown by arrow 166, manufacturing equipment 148 may surface mount connector 123 to connector contact pads 168 at surface 124 of substrate 72. For example, after the antenna module is assembled into device 10, connector 123 may couple electronic components 150 in overmold 131 to transceiver circuitry on a separate substrate. Cutting equipment (e.g., a blade or laser cutting tool) in manufacturing equipment 148 may dice (cut) substrate 72 into separate antenna modules, as shown by arrow 170. Fig.17 In the example of FIG. 5 , this may result in nine separate strips of substrate 72 that form nine separate antenna modules 120, each of which includes four antennas 40 with corresponding dielectric resonant elements 68. Dielectric structure 70 may be molded over dielectric resonant elements 68 after dicing, at any other desired time after conductive structures 86H and 86V have been formed on dielectric resonant elements 68, or may be omitted if desired.

[0133] Fig.18 It can be Fig.16 and Fig.17 148 when manufacturing the antenna module 120. At step 172, the manufacturing equipment 148 may surface mount the electronic components 150 (e.g., one or more radio frequency integrated circuits) onto a surface of the substrate 72 (e.g., Fig.16 Manufacturing equipment 148 may layer overmold 131 over surface mounted electronic component 150 (e.g., as shown by arrow 152). Fig.16 156).

[0134] At step 174, the manufacturing equipment 148 may mold the dielectric resonant element 68 onto the surface of the substrate 72 (e.g., as shown in FIG. Fig.16 The dielectric resonant element 68 may be molded onto the surface of the substrate 72 opposite the surface mounted electronic component 150. This is merely exemplary, and if desired, the dielectric resonant element 68 may be molded onto the same surface of the substrate 72 as the surface mounted electronic component 150 (e.g., as shown in FIG. Fig.12 and Fig.13 shown).

[0135] At step 176, the manufacturing equipment 148 patterns the conductive traces onto the dielectric resonant element 68 (e.g., as Fig.16 The manufacturing equipment 148 may, for example, use a laser to activate or form a seed layer on the dielectric resonant element 68. The manufacturing equipment 148 may then deposit a conductive material over the activated portion of the dielectric resonant element 68. The conductive material may form the conductive structures 86V and 86H of the antenna (e.g., for Figure 6 feed probe 100V and 100H) and / or parasitic elements.

[0136] At step 178, manufacturing equipment 148 may surface mount connector 123 onto connector contact pads 168 of substrate 72 (e.g., as shown in FIG. Fig.17 166).

[0137] At step 180, the manufacturing equipment 148 may cut the substrate 180 into individual antenna modules 120 and may add corresponding shielding structures to the antenna modules (e.g., Fig.17 For example, the shielding member may be used to isolate the electronic component 150 from electromagnetic interference.

[0138] At step 182, manufacturing equipment 148 may assemble the manufactured antenna module 120 into device 10. For example, manufacturing equipment 148 may install antenna module 120 in Figure 5 10 or elsewhere within the device 10. For example, antenna module 120 may be mounted to transmit radio frequency signals through Figure 5 display cover layer 56 or rear housing wall 12R. Fig.18 The steps are merely illustrative, and other processes may be used to manufacture the antenna module 120 if desired.

[0139] In practice, the implementation of dielectric resonator antennas in electronic devices can be challenging because dielectric resonator antennas have a high aspect ratio, which makes it difficult to control system alignment, reliability, and interconnect reliability. In other phased antenna arrays, each antenna may require two RF connectors to feed, which can make the volume undesirably bulky. Integrating dielectric resonator antennas into antenna module 120 can allow the antennas to be individually fed without requiring so many connectors, and can allow the antennas to be properly aligned with a high degree of reliability.

[0140] In practice, metallization for feeding dielectric resonant element 68 may be expensive to implement on a large scale. In another suitable arrangement, a feed probe biasing structure may be used to press a feed probe of dielectric resonant element 68 against dielectric resonant element 68. This may allow the antenna to be fed without the need for additional metallization on the ceramic, which may reduce cost and design complexity.

[0141] Fig.19 is a perspective view of an exemplary antenna module 120 having a feed probe pressed against a dielectric resonant element 68 using a feed probe biasing structure. Fig.19 In the example of , substrate 72 is a flexible printed circuit. Phased antenna array 54 may include dielectric resonant elements 68 embedded within dielectric substrate 70 to form antenna package 184. Antenna package 184 may then be surface mounted to contact pads on surface 122 of substrate 72. Fig.19 In the example of , the phased antenna array 54 includes two low-band antennas 40L interlaced with two high-band antennas 40H (e.g., in a 1×4 array). This is merely illustrative, and in general, the phased antenna array 54 may include any desired number of antennas for covering any desired frequency band. The antennas may be arranged in any desired pattern.

[0142] like Fig.19 As shown, the dielectric resonant element 68H in the high-band antenna 40H can be separated from the dielectric resonant element 68L in one or two adjacent low-band antennas 40L by a distance 192. The distance 192 can be selected to provide satisfactory electromagnetic isolation between the low-band antenna 40L and the high-band antenna 40H. Each dielectric resonant element in the phased antenna array 54 can be fed by a feed probe having conductive structures 86V and 86H. The feed probe bias structure (not shown in the figure for clarity) in the antenna package 184 can be used to bias the dielectric resonant element 68H in the high-band antenna 40H. Fig.19102 (shown in FIG. 104 ) presses conductive structures 86V and 86H against dielectric resonant element 68. The feed probe biasing structure may, for example, press or bias conductive structure 86H against sidewall 102 of dielectric resonant element 68 (e.g., by applying a biasing force in the −X direction). Similarly, the feed probe biasing structure may press or bias conductive structure 86V against sidewall 102 of dielectric resonant element 68 (e.g., by applying a biasing force in the +Y direction).

[0143] The dielectric substrate 70 may be molded over the feed probe biasing structure and the dielectric resonant element 68. The dielectric substrate 70 may have a bottom surface 188 at the substrate 72 and an opposing top surface 190. Fig.19 In the example of FIG. 1 , top surface 80 of dielectric resonant element 68 protrudes above top surface 190 of dielectric substrate 70. This is merely illustrative, and top surface 190 may be flush with top surface 80 if desired. In another suitable arrangement, dielectric substrate 70 may cover top surface 80 of dielectric resonant element 70. Attachment structure 186 may be partially embedded within dielectric substrate 70 (e.g., dielectric substrate 70 may be molded over a portion of attachment structure 186). If desired, attachment structure 186 may help secure antenna module 120 in place within device 10 (e.g., using screws, pins, or other structures that extend through openings in attachment structure 186).

[0144] Fig. 20 yes Fig.19 Schematic diagram of an exemplary assembly process of the antenna module 120. Fig. 20 1 , the antenna module may be manufactured in a manufacturing system 146. The manufacturing equipment 148 may include an alignment post 194. The alignment post 194 may press the conductive structure 86H against the first side wall 102 of the dielectric resonant element 68 and may press the conductive structure 86V against the second (orthogonal) side wall 102 of the dielectric resonant element 68. The conductive structures 86H and 86V may include a stub portion 196 located in the XY plane. The conductive structures 86H and 86V may be stamped, for example, from a sheet of metal (e.g., while the alignment post is pressed against the conductive structures 86H and 86V, thereby leaving the stub portion 196). This may allow the size and position of the stamped conductive structures 86H and 86L to be tightly controlled while minimizing the gap between the conductive structures and the dielectric resonant element 68.

[0145] During a first molding process (e.g., a first injection molding process), the manufacturing equipment 148 may mold a feed probe biasing structure such as a biasing structure 200 (sometimes referred to herein as a retaining structure 200) over the sidewall 102 and the conductive structures 86H and 86V at the bottom surface 82 of the dielectric resonant element 68 (e.g., as indicated by arrows 198). The alignment posts 194 may hold the conductive structures 86H and 86V in place during the first molding process, and once the biasing structure 200 has been formed, these alignment posts may be removed (e.g., leaving alignment post holes 202 in the biasing structure 200). Once the alignment posts 194 have been removed, the biasing structure 200 may hold the conductive structures 86V and 86H in place against the sidewall 102 of the dielectric resonant element 68. The biasing structure 200 may, for example, apply a biasing force to the conductive structure 86H in the −X direction, and may apply a biasing force to the conductive structure 86V in the +Y direction. After the bias structure 200 is molded onto the dielectric resonant element 68, the stub portions 196 of the conductive structures 86H and 86V may remain exposed. This may allow the stub portions 196 to couple to the Fig.19 The bias structure 200 may be connected to a corresponding contact pad at the surface 122 of the substrate 72 (e.g., using solder, conductive adhesive, etc.) to form a feed probe for the antenna module 120. The bias structure 200 may have a bottom surface 206. The bottom surface 206 may be flush with the bottom surface 82 of the dielectric resonant element 68.

[0146] This process may be performed for each antenna in antenna module 120. Dielectric substrate 70 may then be molded over each of dielectric resonant element 68, corresponding bias structure 200, and attachment structure 186 (e.g., using a second injection molding process) to form antenna package 184, as indicated by arrows 204. For example, a tool in manufacturing equipment 148 may be positioned to over-mold dielectric substrate 70 through plastic in bias structure 200 to maintain contact positions of conductive structures 86H and 86V. Dielectric substrate 70 may include one or more openings 208 (e.g., where a tool in manufacturing equipment 148 maintains a position of dielectric resonant element during over-molding). Spring features on the tool may be positioned on top surfaces 80 of dielectric resonant elements 68 to prevent displacement during molding, thereby maintaining reliable coplanarity across bottom surfaces 82 of each dielectric resonant element 68 in antenna package 184 (e.g., bottom surface 206 of bias structure 200 may be coplanar with bottom surfaces 82 of dielectric resonant elements 68L and 68H, stub portions 196 of conductive structures 86H and 86V, and bottom surface 188 of dielectric substrate 70 across antenna package 184 to very tight tolerances). This uniform and reliable coplanarity may allow the bottom surface of antenna package 184 to be surface mounted to substrate 72 (thereby forming antenna module 120) with minimal or uniform clearance across antenna package 184, thereby optimizing mechanical reliability and wireless performance of antenna module 120. Antenna module 120 may then be mounted within device 10.

[0147] Fig.21 is a top-down view showing that antenna module 120 may be installed within device 10 (e.g., Fig.19 An exemplary location of an antenna module 120 of the invention or other antenna modules 120 as described herein. Fig.21 As shown, the display module 64 in the display 14 may include a notch 8. For clarity, the notch 8 has been removed from the display 14. Fig.21 Omitted Figure 5 The display module 64 may form an active area AA of the display 14, while the recess 8 may form a portion of the inactive area IA of the display 14 ( Figure 1 ). The edges of the recess 8 may be defined by the peripheral conductive housing structure 12W and the display module 64. For example, the recess 8 may have two or more edges (eg, three edges) defined by the display module 64 and one or more edges defined by the peripheral conductive housing structure 12W.

[0148] Device 10 may include speaker port 16 (e.g., ear speaker) within notch 8. If desired, device 10 may include other components 210 within notch 8. Other components 210 may include one or more image sensors, such as one or more cameras, infrared image sensors, infrared light emitters (e.g., infrared dot projectors and / or flood illuminators), ambient light sensors, fingerprint sensors, capacitive proximity sensors, thermal sensors, humidity sensors, or any other desired input / output components (e.g., Figure 2 An antenna module 120 (e.g., an antenna module having dielectric resonant elements 68L interleaved with dielectric resonant elements 68H to cover a different frequency band) may be mounted within device 10 (e.g., Figure 5 The antenna module 120 is positioned within the peripheral area 66 of the rear panel 10 and aligned with the portion of the recess 8 not occupied by other components 210 or the speaker port 16. The antenna module 120 can be inserted laterally between two components 210, such as between an image sensor (e.g., a rear-facing camera) and, for example, an ambient light sensor, a dot projector, a flood illuminator, or an ambient light sensor.

[0149] Substrate 72 may extend below display module 64 to another substrate such as substrate 214 (e.g., another flexible printed circuit, a rigid printed circuit board, a main logic board, etc.). If desired, the radio frequency transceiver circuitry of antenna module 120 may be mounted to substrate 214. Connector 123 on substrate 72 may be coupled to connector 212 (e.g., a board-to-board connector) on substrate 214. For example, this may allow the antenna in antenna module 120 to cover at least some of the hemisphere above the front face of device 10 without occupying an excessive amount of space within device 10. Fig.21 The examples are merely illustrative, and in general, antenna module 120 may be mounted at any desired location within device 10. Antenna module 120 may have any desired number of antennas for covering any desired frequency band. The antennas in antenna module 120 may be arranged in any desired one-dimensional or two-dimensional pattern.

[0150] To further increase the isolation between adjacent antennas 40 in the phased antenna array 54, the Figures 9 to 21 The orientation shown rotates each dielectric antenna resonating element in the array. Fig. 22 is a top view showing how phased antenna array 54 may include a rotated dielectric antenna resonating element.

[0151] like Fig. 22As shown, antenna module 120 may include dielectric resonant elements 68H and 68L arranged in a one-dimensional pattern along longitudinal axis 216 (e.g., an axis extending through the center / longitudinal axis of each dielectric resonant element). Dielectric substrate 70 may be molded over dielectric resonant elements 68H and 68L. Prior to mounting to substrate 72, dielectric resonant elements 68H and 68L may be rotated so that sidewalls of the dielectric resonant elements (e.g., lateral / peripheral edges of the dielectric resonant elements as viewed from above) are each oriented at a non-parallel angle relative to longitudinal axis 216. For example, each dielectric resonant element 68H and 68L may include a first pair of opposing sidewalls 102 oriented at an angle θ relative to longitudinal axis 216. Each dielectric resonant element 68H and 68L may also include a second pair of opposing sidewalls 102 oriented perpendicular to the first pair of opposing sidewalls (e.g., at an angle of 90 degrees relative to the first pair of opposing sidewalls or at an angle θ+90 degrees relative to longitudinal axis 216). Thus, if desired, the sidewalls may also be oriented at a non-parallel angle relative to each lateral edge of the substrate 72. The angle θ may be between 0 and 90 degrees (e.g., 45 degrees, 30-60 degrees, 40-50 degrees, etc.). Orienting the dielectric resonant elements 68L and 68H in this manner may be used to minimize cross-coupling between adjacent antennas 40L and 40H, thereby maximizing isolation between the antennas and, therefore, maximizing the RF performance of the antenna module 120.

[0152] exist Fig. 22 In the example of , the phased antenna array 54 includes four low-band antennas 40L interlaced with four high-band antennas 40H. This example is merely illustrative. In general, the phased antenna array 54 may include any desired number of antennas for covering any desired frequency band and arranged in any desired one-dimensional pattern or two-dimensional pattern on the surface 122 of the substrate 72. The connector 123 may be mounted to the surface 122 or the opposite surface of the substrate 72.

[0153] Fig.23 yes Fig. 22 A perspective view of the antenna module 120 is shown. Fig. 22 and Fig.23 In the example of FIG. 1 , the RFIC of the antenna module 120 is mounted to the surface 124 of the substrate 72 and the overmold 131 is layered under the surface 124 and the RFIC. This is merely illustrative, and in another suitable arrangement, the RFIC may be mounted to the surface 122 (e.g., as shown in FIG. 1 ). Fig.12 and Fig.13 shown).

[0154] like Fig.23As shown, feed probe biasing structures such as biasing structure 218 can press feed probes of phased antenna array 54 against dielectric resonant elements 68L and 68H (e.g., by applying a biasing force to a conductive structure in the feed probe that is oriented perpendicular to sidewall 102 against which the feed probe is pressed). Dielectric substrate 70 can be molded over dielectric resonant elements 68L and 68H and biasing structure 218 (e.g., to form a single integrated antenna package that is then surface mounted to substrate 72). If desired, dielectric substrate 70 can include openings that expose biasing structure 218. Dielectric substrate 70 can also include openings (holes) 219 that are laterally interposed between each pair of adjacent dielectric resonant elements in phased antenna array 54. Openings 219 can be used, for example, to further increase isolation between antennas 40L and 40H in phased antenna array 54.

[0155] Fig.24 yes Fig. 22 and Fig.23 An exploded view of the antenna module 120. Fig.24 As shown, the feed probes 100V and 100H and the optional parasitic element 108 may be pressed against the dielectric resonant elements 68L and 68H by the biasing structure 218. In the case where the dielectric resonant elements 68L and 68H are fed by only a single feed probe, the parasitic element 108 may be omitted and / or a parasitic element 108 may be used. Figure 8 The parasitic elements 114-1 and 114-2.

[0156] The biasing structure 218 may be formed during a first molding process (e.g., similar to Fig. 20 The bias structure 218 may be molded over the dielectric resonant elements 68L and 68H, the feed probes 100H and 100V, and the parasitic element 108 during a first molding process (e.g., a first molding process associated with arrow 198 in FIG. 1 ). The alignment posts may press the feed probes 100H and 100V and the parasitic element 108 against the dielectric resonant elements during the first molding process, and may leave alignment post openings in the bias structure 218 after molding. The bias structure 218 may press the feed probes 100H and 100V and the parasitic element 108 against the dielectric resonant elements 68L and 68H to maintain reliable coupling between the feed probes, the parasitic element, and the dielectric resonant elements. The dielectric substrate 70 may be molded over the dielectric resonant elements 68L and 68H, the feed probes 100H and 100V, and the parasitic element 108 during a second molding process (e.g., similar to the Fig. 20 The assembled phased antenna array 54 may then be surface mounted to a Fig. 22 and Fig.23 The substrate 72 is used to form the antenna module 120.

[0157] According to one embodiment, an electronic device is provided, which includes a substrate; a phased antenna array, which includes a probe-fed dielectric resonator antenna mounted to a surface of the substrate, the phased antenna array being configured to transmit radio frequency signals having a frequency greater than 10 GHz within a signal beam; and a radio frequency integrated circuit (RFIC) mounted to the substrate, the RFIC being configured to adjust the direction of the signal beam.

[0158] According to another embodiment, the substrate includes an additional surface opposite the surface, the RFIC being mounted to the additional surface of the substrate.

[0159] According to another embodiment, the electronic device includes a board-to-board connector mounted to the surface of the substrate, and a radio frequency transceiver circuit coupled to the RFIC via the board-to-board connector.

[0160] According to another embodiment, the electronic device includes an overmold structure on the additional surface, and the RFIC is embedded in the overmold structure.

[0161] According to another embodiment, the RFIC is mounted to the surface of the substrate.

[0162] According to another embodiment, the substrate includes an additional surface opposite to the surface, the electronic device includes an additional phased antenna array mounted to the additional surface of the substrate, the additional phased antenna array is configured to transmit the radio frequency signal of the frequency within an additional signal beam, and the RFIC is configured to adjust the direction of the additional signal beam.

[0163] According to another embodiment, the electronic device includes a peripheral conductive housing structure that extends around the periphery of the electronic device; a display having a display cover layer mounted to the peripheral conductive housing structure and having a display module configured to emit light through the display cover layer; and a housing wall that is mounted to the peripheral conductive housing structure and opposite to the display cover layer, the phased antenna array being configured to transmit the RF signal within the signal beam through the display cover layer, and the additional phased antenna array being configured to transmit the RF signal within the additional signal beam through the housing wall.

[0164] According to another embodiment, the additional phased antenna array includes antennas selected from the group consisting of stacked patch antennas embedded within the substrate and dielectric resonator antennas mounted to the additional surface of the substrate.

[0165] According to another embodiment, each of the probe-fed dielectric resonator antennas includes a dielectric resonant element mounted to the surface of the substrate and a feeding probe coupled to a sidewall of the dielectric resonant element.

[0166] According to another embodiment, the feed probe includes a conductive trace patterned on the sidewall of the dielectric resonant element, the dielectric resonant element is formed of a material having a dielectric constant greater than 10, the electronic device includes a layer of the material on the surface of the substrate, the dielectric resonant element is mounted to the layer of material, and the conductive trace is coupled to a radio frequency transmission line in the substrate through a conductive via extending through the layer of material.

[0167] According to another embodiment, the feed probe includes a stamped metal plate, which is pressed against the side wall of the dielectric resonant element by a biasing structure molded over the feed probe, the phased antenna array includes a dielectric structure, which is molded over each dielectric resonator antenna in the phased antenna array to form an antenna package, the substrate includes a flexible printed circuit substrate and the antenna package is surface mounted to the flexible printed circuit substrate, and the electronic device includes a peripheral conductive housing structure, which extends around the periphery of the electronic device; and a display, the display having a display cover layer mounted to the peripheral conductive housing structure and having a display module configured to emit light through the display cover layer, the display including a recess, the display module defining a first side, a second side and a third side of the recess, the peripheral conductive housing structure defining a fourth side of the recess, and the phased antenna array is aligned with the recess.

[0168] According to another embodiment, the dielectric resonator antenna is aligned along a longitudinal axis, and the sidewall of the dielectric resonant element is oriented at a non-zero and non-perpendicular angle relative to the longitudinal axis.

[0169] According to one embodiment, an antenna module configured to handle wireless communications at frequencies greater than 10 GHz is provided, comprising an antenna module substrate; a phased antenna array comprising a dielectric resonant element mounted to a surface of the antenna module substrate, the dielectric resonant element having a sidewall; a feed probe coupled to the sidewall at the surface of the antenna module substrate and configured to excite a resonant mode of the dielectric resonant element; a feed probe biasing structure that presses the feed probe against the sidewall, the feed probe biasing structure being molded over the feed probe and at least some of the dielectric resonant element; and a plastic substrate molded over the feed probe biasing structure and at least some of the dielectric resonant element.

[0170] According to another embodiment, the antenna module includes an additional dielectric resonant element mounted to the surface of the antenna module substrate, the additional dielectric resonant element having an additional sidewall, the antenna module includes an additional feed probe coupled to the additional sidewall at the surface of the antenna module substrate, the additional feed probe being configured to excite a resonant mode of the additional dielectric resonant element, the antenna module includes an additional feed probe biasing structure pressing the additional feed probe against the additional sidewall, the additional feed probe biasing structure being molded over the additional feed probe and at least some of the additional dielectric resonant element, and the plastic substrate being molded over the additional feed probe biasing structure and at least some of the additional dielectric resonant element.

[0171] According to another embodiment, the substrate comprises a flexible printed circuit substrate.

[0172] According to another embodiment, the dielectric resonant element has an additional sidewall oriented in a perpendicular manner to the sidewall, the antenna module includes an additional feed probe coupled to the additional sidewall at the surface of the antenna module substrate, the resonant mode is associated with a first linear polarization, the additional feed probe is configured to excite an additional resonant mode of the dielectric resonant element associated with a second linear polarization orthogonal to the first linear polarization, the feed probe biasing structure presses the additional feed probe against the additional sidewall, and the feed probe biasing structure is molded over the additional feed probe.

[0173] According to one embodiment, an antenna module configured to handle wireless communications at frequencies greater than 10 GHz is provided, comprising a substrate; and a phased antenna array having dielectric resonant elements mounted to a surface of the substrate, the dielectric resonant elements aligned along a longitudinal axis, each dielectric resonant element having a sidewall oriented at a non-zero and non-perpendicular angle relative to the longitudinal axis, and the dielectric resonant elements being fed by a feed probe coupled to the sidewall at the surface of the substrate.

[0174] According to another embodiment, the phased antenna array includes a feed probe biasing structure molded over the feed probe and configured to hold the feed probe against the sidewall.

[0175] According to another embodiment, the antenna module includes a dielectric substrate molded over each dielectric resonant element and the feed probe bias structure and an opening in the dielectric substrate, each opening being laterally interposed between a corresponding pair of dielectric resonant elements in the phased antenna array.

[0176] According to another embodiment, each dielectric resonant element includes a first side wall, a second side wall, a third side wall, and a fourth side wall; a first feeding probe pressed against the first side wall by a corresponding one of the feeding probe biasing structures; a second feeding probe pressed against the second side wall by a corresponding one of the feeding probe biasing structures; a first parasitic element pressed against the third side wall by a corresponding one of the feeding probe biasing structures; and a second parasitic element pressed against the fourth side wall by a corresponding one of the feeding probe biasing structures.

[0177] The foregoing is merely illustrative, and various modifications may be made by those skilled in the art without departing from the scope and spirit of the embodiments described. The foregoing embodiments may be implemented independently or in any combination.

Claims

1. An electronic device, comprising: substrate; A phased antenna array having dielectric resonator antennas mounted to a surface of the substrate, wherein one of the dielectric resonator antennas comprises: Dielectric resonant element, a feeding probe configured to excite a resonant mode of the dielectric resonant element, and A biasing structure presses the feed probe against the dielectric resonant element, the biasing structure being molded over the feed probe and at least some of the dielectric resonant element.

2. The electronic device according to claim 1, further comprising: A radio frequency integrated circuit RFIC is mounted to the substrate, wherein the RFIC is configured to adjust the direction of a signal beam formed by the phased antenna array, the substrate includes an additional surface opposite to the surface, and the RFIC is mounted to the additional surface of the substrate.

3. The electronic device according to claim 2, further comprising: a board-to-board connector mounted to the surface of the substrate; as well as A radio frequency transceiver circuit is coupled to the RFIC via the board-to-board connector.

4. The electronic device according to claim 2, further comprising: An overmold structure is provided on the additional surface, wherein the RFIC is embedded within the overmold structure.

5. The electronic device of claim 2, wherein the RFIC is soldered to the surface of the substrate.

6. The electronic device according to claim 2, further comprising: An additional phased antenna array is mounted to the additional surface of the substrate, wherein the additional phased antenna array is configured to transmit radio frequency signals having a frequency greater than 10 GHz within a signal beam, and the RFIC is configured to adjust the direction of the signal beam.

7. The electronic device according to claim 6, further comprising: a peripheral conductive housing structure extending around a periphery of the electronic device; a display having a display cover layer mounted to the peripheral conductive housing structure and having a display module configured to emit light through the display cover layer; and a housing wall mounted to the peripheral conductive housing structure and opposite the display cover layer, wherein the phased antenna array is configured to transmit additional RF signals within additional signal beams through the display cover layer, and the additional phased antenna array is configured to transmit the RF signals within the signal beams through the housing wall.

8. The electronic device of claim 6, wherein the additional phased antenna array comprises antennas selected from the group consisting of stacked patch antennas embedded within the substrate and dielectric resonator antennas mounted to the additional surface of the substrate.

9. The electronic device of claim 1, wherein the biasing structure presses the feed probe against a side wall of the dielectric resonant element.

10. The electronic device according to claim 9, further comprising: A plastic substrate is molded over the biasing structure and at least some of the dielectric resonant elements.

11. The electronic device of claim 10, wherein the dielectric resonator antenna comprises an additional dielectric resonator antenna, the additional dielectric resonator antenna comprising: an additional dielectric resonant element mounted to the surface of the substrate; an additional feeding probe configured to excite a resonant mode of the additional dielectric resonant element; as well as an additional feed probe biasing structure that presses the additional feed probe against the additional dielectric resonant element, wherein the additional feed probe biasing structure is molded over the additional feed probe and at least some of the additional dielectric resonant elements, and the plastic substrate is molded over the additional feed probe biasing structure and at least some of the additional dielectric resonant elements, wherein the substrate comprises a flexible printed circuit substrate.

12. The electronic device of claim 9, wherein the dielectric resonant element has an additional sidewall oriented perpendicularly to a sidewall of the dielectric resonant element contacting the feed probe, the dielectric resonator antenna comprising an additional feed probe coupled to the additional sidewall, the resonant mode being associated with a first linear polarization, the additional feed probe being configured to excite an additional resonant mode of the dielectric resonant element associated with a second linear polarization orthogonal to the first linear polarization, the biasing structure pressing the additional feed probe against the additional sidewall, and the biasing structure being molded over the additional feed probe.

13. An antenna module, the antenna module being configured to handle wireless communications at frequencies greater than 10 GHz, the antenna module comprising: Antenna module substrate; a phased antenna array comprising a dielectric resonant element mounted to a surface of the antenna module substrate, wherein the dielectric resonant element has sidewalls; a feed probe coupled to the sidewall at the surface of the antenna module substrate and configured to excite a resonant mode of the dielectric resonant element; a feed probe biasing structure that presses the feed probe against the sidewall, wherein the feed probe biasing structure is molded over the feed probe and at least some of the dielectric resonant elements; and A plastic substrate is molded over the feed probe biasing structure and at least some of the dielectric resonant elements.

14. The antenna module of claim 13 , wherein the antenna module comprises an additional dielectric resonant element mounted to the surface of the antenna module substrate, the additional dielectric resonant element having an additional sidewall, the antenna module comprises an additional feed probe coupled to the additional sidewall at the surface of the antenna module substrate, the additional feed probe being configured to excite a resonant mode of the additional dielectric resonant element, the antenna module comprises an additional feed probe biasing structure pressing the additional feed probe against the additional sidewall, the additional feed probe biasing structure being molded over the additional feed probe and at least some of the additional dielectric resonant element, and the plastic substrate being molded over the additional feed probe biasing structure and at least some of the additional dielectric resonant element.

15. The antenna module of claim 14, wherein the antenna module substrate comprises a flexible printed circuit substrate.

16. The antenna module of claim 13 , wherein the dielectric resonant element has an additional sidewall oriented in a perpendicular manner to the sidewall, the antenna module further comprising an additional feed probe coupled to the additional sidewall at the surface of the antenna module substrate, the resonant mode being associated with a first linear polarization, the additional feed probe being configured to excite an additional resonant mode of the dielectric resonant element associated with a second linear polarization orthogonal to the first linear polarization, the feed probe biasing structure pressing the additional feed probe against the additional sidewall, and the feed probe biasing structure being molded over the additional feed probe.

17. An electronic device comprising: substrate; and a phased antenna array having a dielectric resonator antenna mounted to a surface of the substrate, wherein the dielectric resonator antenna is aligned along a longitudinal axis, includes a dielectric resonant element having a sidewall oriented at a non-zero and non-perpendicular angle relative to the longitudinal axis, and is fed by a feed probe coupled to the sidewall at the surface of the substrate; as well as A feed probe biasing structure is molded over the feed probe and is configured to hold the feed probe against the sidewall.

18. The electronic device according to claim 17 further includes a radio frequency integrated circuit, which is mounted to the substrate and is configured to control the phased antenna array to form a signal beam in a first direction at a first time, and is configured to control the phased antenna array to form a signal beam in a second direction different from the first direction at a second time.

19. The electronic device according to claim 17, further comprising: a dielectric substrate molded over each of the feed probe bias structures; and openings in the dielectric substrate, wherein each of the openings is laterally interposed between a corresponding pair of dielectric resonant elements in the dielectric resonator antenna.

20. The electronic device according to claim 18, wherein each of the dielectric resonant elements comprises a first side wall, a second side wall, a third side wall and a fourth side wall, a first feeding probe, a second feeding probe, a first parasitic element and a second parasitic element, the first feeding probe being pressed against the first side wall by a corresponding one of the feeding probe biasing structures, the second feeding probe being pressed against the second side wall by the corresponding one of the feeding probe biasing structures, the first parasitic element being pressed against the third side wall by the corresponding one of the feeding probe biasing structures, and the second parasitic element being pressed against the fourth side wall by the corresponding one of the feeding probe biasing structures.

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