Display device

Abstract

A display device includes a substrate including a display region and a non-display region; a first wiring at the non-display region of the substrate; a second wiring at the non-display region of the substrate on a different layer from the first wiring; an inorganic insulating layer on the first wiring and the second wiring; a pad on the inorganic insulating layer and connected to a first end of the first wiring; a contact bridge on the inorganic insulating layer and connecting the second wiring to a second end of the first wiring; an electrostatic electrode on the inorganic insulating layer between the pad and the contact bridge; a first organic insulating layer covering the contact bridge and the electrostatic electrode and exposing the pad; a first upper wiring on the first organic insulating layer and overlapping the contact bridge and the electrostatic electrode; and a second organic insulating layer on the first upper wiring.

Description

TECHNICAL FIELD

[0001] Embodiments relate to a display device for reducing or preventing a possibility of damage. BACKGROUND

[0002] A display device can include a display panel and a driving chip that provides a signal and a voltage, etc. to the display panel. The driving chip can be connected to the display panel through a pad formed on the display panel.

[0003] In a case where the driving chip is not aligned when being bonded to the pad, the driving chip can be re-bonded to the pad through a rework process. During the rework process, in a process of cleaning the pad bonded to the driving chip, the pad is exposed and an organic insulating layer covering a contact bridge can be damaged. Then, an external impurity can be introduced through the damaged organic insulating layer, and a wiring connected to the contact bridge can be corroded. The corrosion of the wiring can cause a defect in a vertical line of the display device. SUMMARY

[0004] Embodiments provide a display device for reducing or preventing corrosion of a wiring.

[0005] A display device according to some embodiments includes a substrate including a display area and a non-display area; a first wiring at the non-display area of the substrate; a second wiring at the non-display area of the substrate on a different layer from the first wiring; an inorganic insulating layer on the first wiring and the second wiring; a pad on the inorganic insulating layer and connected to a first end of the first wiring; a contact bridge on the inorganic insulating layer and connecting the second wiring to a second end of the first wiring; an electrostatic electrode on the inorganic insulating layer between the pad and the contact bridge; a first organic insulating layer covering the contact bridge and the electrostatic electrode and exposing the pad; a first upper wiring on the first organic insulating layer and overlapping the contact bridge and the electrostatic electrode; and a second organic insulating layer on the first upper wiring.

[0006] A distance from the pad to the contact bridge can be greater than a distance from the pad to the electrostatic electrode.

[0007] The first upper wiring can include at least one of molybdenum (Mo), aluminum (Al), neodymium (Nd), nickel (Ni), lanthanum (La), titanium (Ti), copper (Cu), silver (Ag), indium tin oxide (ITO), and indium zinc oxide (IZO).

[0008] The first upper wiring can include a sidewall extending between the pad and the electrostatic electrode and in contact with the inorganic insulating layer.

[0009] The display device can further include an active pattern on the display area of the substrate; a first gate electrode on the active pattern; a second gate electrode on the first gate electrode; a source electrode and a drain electrode connected to the active pattern; a first via insulating layer on the source electrode and the drain electrode; a pixel electrode on the first via insulating layer and electrically connected to the drain electrode; and a pixel defining layer on a portion of the pixel electrode.

[0010] The first organic insulating layer, the first upper wiring, and the second organic insulating layer can be on the same layer as the first via insulating layer, the pixel electrode, and the pixel defining layer, respectively.

[0011] The display device can further include a second via insulating layer between the first via insulating layer and the pixel defining layer; and a connection electrode between the first via insulating layer and the second via insulating layer and connecting the drain electrode to the pixel electrode.

[0012] The first organic insulating layer, the first upper wiring, and the second organic insulating layer can be on the same layer as the first via insulating layer, the connection electrode, and the second via insulating layer, respectively.

[0013] The first organic insulating layer, the first upper wiring, and the second organic insulating layer can be on the same layer as the first via insulating layer and the second via insulating layer, the pixel electrode, and the pixel defining layer, respectively.

[0014] The display device can further include an electrostatic active pattern connected to the electrostatic electrode and on the same layer as the active pattern, wherein the electrostatic active pattern, the first wiring, and the electrostatic electrode form an electrostatic diode.

[0015] The display device can further include a third organic insulating layer on the second organic insulating layer.

[0016] The display device can further include a second upper wiring between the second organic insulating layer and the third organic insulating layer and overlapping the first upper wiring.

[0017] The second upper wiring can include at least one of molybdenum (Mo), aluminum (Al), neodymium (Nd), nickel (Ni), lanthanum (La), titanium (Ti), copper (Cu), silver (Ag), indium tin oxide (ITO), and indium zinc oxide (IZO).

[0018] The second upper wiring can include a sidewall extending between the pad and the electrostatic electrode and in contact with the inorganic insulating layer.

[0019] The second upper wiring can be connected to the first upper wiring.

[0020] The display device can further include an active pattern on the display area of the substrate; a first gate electrode on the active pattern; a second gate electrode on the first gate electrode; a source electrode and a drain electrode connected to the active pattern; a first via insulating layer on the source electrode and the drain electrode; a connection electrode on the first via insulating layer and connected to the drain electrode; a second via insulating layer on the connection electrode; a pixel electrode on the second via insulating layer and connected to the connection electrode; and a pixel definition layer on a portion of the pixel electrode.

[0021] The first organic insulating layer, the first upper wiring, the second organic insulating layer, the second upper wiring, and the third organic insulating layer can be on the same layer as the first via insulating layer, the connection electrode, the second via insulating layer, the pixel electrode, and the pixel definition layer, respectively.

[0022] The display device can further include a driving chip on a pad exposed by the first organic insulating layer and electrically connected to the pad.

[0023] A display device according to some embodiments includes a substrate; a first wiring on the substrate; a second wiring on the substrate on a different layer from the first wiring; an inorganic insulating layer on the first wiring and the second wiring; a pad on the inorganic insulating layer and connected to a first end of the first wiring; a contact bridge on the inorganic insulating layer and connecting a second end of the first wiring to the second wiring; an electrostatic electrode on the inorganic insulating layer between the pad and the contact bridge; and an organic insulating layer covering the contact bridge and the electrostatic electrode and exposing the pad.

[0024] A distance from the pad to the contact bridge can be greater than a distance from the pad to the electrostatic electrode.

[0025] In a display device according to some embodiments, the pad, the electrostatic electrode, and the contact bridge can be sequentially disposed such that the contact bridge can be distanced from an end portion of the organic insulating layer, and such that an upper wiring overlapping the contact bridge and the electrostatic electrode can be disposed on the organic insulating layer. Accordingly, the contact bridge can be protected from external impurities. Then, a wiring connected to the contact bridge can not be corroded. BRIEF DESCRIPTION OF DRAWINGS

[0026] The illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0027] Figure 1 FIG. 1 is a plan view illustrating a display device according to some embodiments of the present disclosure.

[0028] Figure 2 FIG. 2 is a cross-sectional view illustrating a display area of the display device of Figure 1 FIG. 3 is a cross-sectional view illustrating a display area of the display device of

[0029] Figure 3 FIG. 4 is a cross-sectional view illustrating a display area of the display device of Figure 1is a plan view of a non-display area of a display device.

[0030] Figure 4 is a cross-sectional view taken along Figure 3 line I-I' of

[0031] Figure 5 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0032] Figure 6 is a cross-sectional view of a display area of a display device according to some embodiments of the present disclosure.

[0033] Figure 7 is a plan view of a non-display area of a display device according to some embodiments of the present disclosure.

[0034] Figure 8 is a cross-sectional view taken along Figure 7 line II-II' of

[0035] Figure 9 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0036] Figure 10 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0037] Figure 11 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0038] Figure 12 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0039] Figure 13 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0040] Figure 14 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0041] Figure 15 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0042] Figure 16 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0043] Figure 17 is a cross-sectional view of a non-display area of a display device according to some embodiments of the present disclosure.

[0044] Figure 18 is a cross-sectional view illustrating a non-display area of a display device according to some embodiments of the present disclosure.

[0045] Figure 19 is a cross-sectional view illustrating a non-display area of a display device according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0046] Aspects of some embodiments of the present disclosure and methods of implementing them can be understood more readily by reference to the following detailed description of embodiments and the accompanying drawings. In the following detailed description of embodiments, reference is made to the accompanying drawings that form a part hereof, and in which are shown by way of illustration embodiments in which aspects of the disclosure can be practiced. It is to be understood that other embodiments can be utilized and structural or logical changes can be made without departing from the scope of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense, as the scope of the present disclosure is defined by the appended claims.

[0047] Unless otherwise indicated, like numbers in the figures and words or combinations thereof indicate like elements, and thus, descriptions thereof will not be repeated. In addition, portions that are irrelevant to the description of the embodiments can not be shown so as to make the description clear. In the drawings, the relative sizes of the elements, layers, and regions can be exaggerated for clarity. In addition, the use of cross-hatching and / or shading in the drawings is for clarity and illustration purposes only and does not purport to be a limitation of the scope of the present disclosure to a specific material, material property, structure, dimension, proportion, or any other characteristic, attribute, property, quality, or the like. Rather, such designated elements are exemplary only and thus are not to be considered as limiting the scope of the present disclosure in any way.

[0048] Various embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of embodiments and / or intermediate structures that are described in the present disclosure. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. In addition, the particular structural and functional descriptions set forth herein are not to be interpreted as being limiting but merely as being exemplary embodiments of the present disclosure. Thus, embodiments disclosed herein are not to be interpreted as being limited to the particular combinations of components set forth herein but are to be interpreted that the embodiments can be practiced with any or a combination of the components set forth herein and / or components that are to be understood by those of ordinary skill in the art.

[0049] For example, the injection region illustrated as rectangular will typically have circular or curved features at its edges and / or a gradient of injectant concentration, rather than a binary change from the injection region to the non-injection region. Similarly, the embedded region formed by injection can result in some injection in the region between the embedded region and the surface through which the injection occurs. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to represent the actual shape of the regions of the device, nor are they intended to be limiting. Furthermore, as those skilled in the art will recognize, the described embodiments can be modified in various different ways without departing entirely from the spirit or scope of this disclosure.

[0050] In this detailed description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of the various embodiments. However, it will be apparent that the various embodiments can be practiced without these specific details or using one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various embodiments.

[0051] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the spirit and scope of this disclosure, the first element, component, region, layer, or portion described below may be referred to as the second element, component, region, layer, or portion.

[0052] For ease of explanation, spatial relative terms such as “below,” “under,” “down,” “below,” “above,” and “above” may be used herein to describe the relationship of one element or feature to another element(s) as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as “below,” “under,” or “below” other elements or features will subsequently be oriented “above” other elements or features. Thus, the example terms “below” and “below” can encompass both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or otherwise), and the spatial relative descriptive terms used herein should be interpreted accordingly. Similarly, when a first component is described as being arranged “above” a second component, this means that the first component is arranged above or below the second component, not limited to being above it based on the direction of gravity.

[0053] Also in the present specification, the phrase "on plane" or "plan view" means to observe a target portion from the top, and the phrase "on cross section" means to observe a cross section formed by cutting a target portion vertically from the side.

[0054] It will be understood that when an element, layer, region or a component is referred to as being "formed on", "on", "connected to" or "coupled to" another element, layer, region or component, it can be directly formed on, directly on, directly connected to or directly coupled to another element, layer, region or component, or indirectly formed on, indirectly on, indirectly connected to or indirectly coupled to another element, layer, region or component, such that one or more intermediate elements, layers, regions or components can be present. For example, when a layer, region or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region or component, it can be directly electrically connected or coupled to another layer, region and / or component, or there can be an intermediate layer, region or component. However, "directly connected / directly coupled" means that one component is directly connected or coupled to another component without an intermediate component. Meanwhile, other expressions describing the relationship between components, such as "between", "immediately between" or "adjacent to", and "directly adjacent to", can be similarly interpreted. Also, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there can be one or more intermediate elements or layers.

[0055] For the purpose of the present disclosure, expressions such as "at least one of", when followed by a listing of elements, modify the entire listing of elements and do not modify the individual elements of the listing. For example, "at least one of X, Y, and Z" or "at least one of X, Y, or Z" can be interpreted as X alone, Y alone, Z alone, two or more of X, Y, and Z in any combination, such as, for example XYZ, XYY, YZ, and ZZ, or any variation of the above. Similarly, an expression such as "at least one of A and B" can include A, B, or A and B. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, an expression such as "A and / or B" can include A, B, or A and B.

[0056] In examples, the x-axis, the y-axis, and / or the z-axis are not limited to three axes of a rectangular coordinate system, and can be interpreted in a broad sense. For example, the x-axis, the y-axis, and the z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. The same applies to the first direction, the second direction, and / or the third direction.

[0057] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" "comprising," "includes" and "including" when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0058] As used herein, the terms "substantially," "approximately," "about," and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art. "About" or "approximately," as used in this application, includes the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ± 30%, 20%, 10%, 5% of the stated value. Furthermore, the use of "may" when describing embodiments of the present disclosure means "one or more embodiments of the present disclosure."

[0059] When one or more embodiments can be implemented differently, a particular process can be performed in a different order from the described order. For example, two processes described consecutively can be performed substantially simultaneously or in the reverse order from the described order.

[0060] Electronic or electrical devices and / or any other related devices or components according to embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., an application-specific integrated circuit), software, or a combination of software, firmware, and hardware. For example, various components of these devices can be formed on one integrated circuit (IC) chip or on separate IC chips. In addition, various components of these devices can be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on one substrate.

[0061] Furthermore, the various components of the devices can be processes or threads running on one or more processors in one or more computing devices, executing computer program instructions at the one or more processors and interacting with other system components for performing the various functionalities described herein. The computer program instructions are stored in memory which can be implemented using standard memory devices such as, for example, Random Access Memory (RAM). The computer program instructions can also be stored in other non-transitory computer readable media such as, for example, a Compact Disc Read Only Memory (CD-ROM), or a flash drive. Further, those skilled in the art should appreciate that functions of various system components can be combined or integrated into a single computing device, or distributed among several computing devices, without departing from the spirit and scope of embodiments of the present disclosure.

[0062] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0063] In the following, reference will be made to Figures 1 to 5 A display device according to embodiments is described.

[0064] Figure 1 is a plan view showing a display device according to some embodiments of the present disclosure.

[0065] Reference is made to Figure 1 A display device according to some embodiments of the present disclosure can include a substrate 100, pixels PX disposed on the substrate 100, scan drivers SDV, a driving chip IC, and a driving film DF.

[0066] The substrate 100 can include a display area DA and a non-display area NDA. The non-display area NDA can be adjacent to the display area DA. In some embodiments, the non-display area NDA can surround a periphery of the display area DA.

[0067] The pixels PX can be disposed on the display area DA of the substrate 100. The pixels PX can be arranged in the display area DA along a first direction DR1 and along a second direction DR2 intersecting the first direction DR1. Each of the pixels PX can be connected to a corresponding scan line SL and a corresponding data line DL to receive a scan signal and a data signal. Each of the pixels PX can emit light based on the scan signal and the data signal, and the display area DA can display an image formed by the emitted light.

[0068] The scan driver SDV can be disposed on the non-display area NDA of the substrate 100. The scan driver SDV can be disposed on the second direction DR2 from the display area DA. The scan driver SDV can provide a scan signal to the scan line SL.

[0069] The output pad OPD, the input pad IPD, the film pad FPD, the output line OL, and the input line IL can be disposed on the non-display area NDA of the substrate 100. The output pad OPD, the input pad IPD, the film pad FPD, the output line OL, and the input line IL can be disposed on the first direction DR1 from the display area DA.

[0070] The input pad IPD can be disposed on the first direction DR1 from the output pad OPD, and the film pad FPD can be disposed on the first direction DR1 from the input pad IPD. The output line OL can connect the output pad OPD to the data line DL, and the input line IL can connect the input pad IPD to the film pad FPD.

[0071] The driving chip IC can be disposed on the non-display area NDA of the substrate 100. The driving chip IC can be disposed on the input pad IPD and the output pad OPD. In some embodiments, the driving chip IC can be mounted on the input pad IPD and the output pad OPD in a chip on glass (COG) manner or a chip on plastic (COP) manner. The driving chip IC can include an input bump and an output bump, and the input bump and the output bump can be electrically connected to the input pad IPD and the output pad OPD.

[0072] The driving chip IC can include a data driver. The data driver can provide a data signal to the data line DL through the output line OL.

[0073] The driving film DF can be disposed on the non-display area NDA of the substrate 100. The driving film DF can be disposed on the film pad FPD. In some embodiments, the driving film DF can be mounted on the film pad FPD in a film on glass (FOG) manner or a film on plastic (FOP) manner. The driving film DF can include a bump, and the bump can be electrically connected to the film pad FPD, respectively.

[0074] Figure 2 is a cross-sectional view showing a display area DA of a display device of Figure 1 For example, Figure 2 may show one example of a pixel PX of Figure 1

[0075] Referring to Figure 2 ​The display device can include a buffer layer 110, an active pattern 120, a first gate insulating layer 130, a first gate electrode 140, a second gate insulating layer 150, a second gate electrode 160, an interlayer insulating layer 170, a source electrode 180a, a drain electrode 180b, a first via insulating layer 190, a pixel electrode 220, a pixel defining layer 230, an emission layer 240, and a counter electrode 250 disposed in a display area DA on a substrate 100.

[0076] The substrate 100 can be a transparent insulating substrate. For example, the substrate 100 can be formed of glass, quartz, or plastic, etc.

[0077] The buffer layer 110 can be disposed on the substrate 100. The buffer layer 110 can prevent impurities from flowing into the active pattern 120 from the outside through the substrate 100. The buffer layer 110 can be an inorganic insulating layer including an inorganic insulating material such as silicon nitride, silicon oxide, and silicon oxynitride.

[0078] The active pattern 120 can be disposed on the buffer layer 110. The active pattern 120 can include amorphous silicon, polysilicon, and oxide semiconductor, etc. The active pattern 120 can include a source region, a drain region, and a channel region disposed between the source region and the drain region. The source region and the drain region can be doped with a P-type or N-type impurity, and the channel region can not be doped with an impurity or can be doped with an impurity having a type different from that of the source region and / or the drain region.

[0079] The first gate insulating layer 130 can be disposed on the active pattern 120. The first gate insulating layer 130 can be disposed on the buffer layer 110 while covering the active pattern 120. In some embodiments, the first gate insulating layer 130 can be formed along the contour of the buffer layer 110 and the active pattern 120. The first gate insulating layer 130 can be an inorganic insulating layer including an inorganic insulating material such as silicon nitride, silicon oxide, and silicon oxynitride.

[0080] The first gate electrode 140 can be disposed on the first gate insulating layer 130. The first gate electrode 140 can overlap the channel region of the active pattern 120. The first gate electrode 140 can include a conductive material such as molybdenum (Mo), copper (Cu), aluminum (Al), and titanium (Ti).

[0081] The second gate insulating layer 150 can be disposed on the first gate electrode 140. The second gate insulating layer 150 can be disposed on the first gate insulating layer 130 while covering the first gate electrode 140. In some embodiments, the second gate insulating layer 150 can be formed along the contour of the first gate insulating layer 130 and the first gate electrode 140. The second gate insulating layer 150 can be an inorganic insulating layer including an inorganic insulating material such as silicon nitride, silicon oxide, and silicon oxynitride.

[0082] A second gate electrode 160 can be disposed on the second gate insulating layer 150. The second gate electrode 160 can overlap the first gate electrode 140. The second gate electrode 160 can include a conductive material such as molybdenum (Mo), copper (Cu), aluminum (Al), and titanium (Ti). The first gate electrode 140 and the second gate electrode 160 can form a capacitor CAP.

[0083] An interlayer insulating layer 170 can be disposed on the second gate electrode 160. The interlayer insulating layer 170 can be disposed on the second gate insulating layer 150 while covering the second gate electrode 160. In some embodiments, the interlayer insulating layer 170 can be formed along the profile of the second gate insulating layer 150 and the second gate electrode 160. The interlayer insulating layer 170 can be an inorganic insulating layer including an inorganic insulating material such as silicon nitride, silicon oxide, and silicon oxynitride.

[0084] A source electrode 180a and a drain electrode 180b can be disposed on the interlayer insulating layer 170. The source electrode 180a and the drain electrode 180b can be connected to a source region and a drain region of the active pattern 120, respectively. The source electrode 180a and the drain electrode 180b can include a conductive material such as molybdenum (Mo), aluminum (Al), neodymium (Nd), nickel (Ni), lanthanum (La), titanium (Ti), copper (Cu), silver (Ag), indium tin oxide (ITO), and indium zinc oxide (IZO). The active pattern 120, the first gate electrode 140, the source electrode 180a, and the drain electrode 180b can form a transistor TR.

[0085] A via insulating layer 190 can be disposed on the source electrode 180a and the drain electrode 180b. The via insulating layer 190 can be disposed on the interlayer insulating layer 170 while covering the source electrode 180a and the drain electrode 180b. In some embodiments, the via insulating layer 190 can have a flat top surface. The via insulating layer 190 can be an organic insulating layer including an organic insulating material such as polyimide (PI).

[0086] A pixel electrode 220 can be disposed on the first via insulating layer 190. The pixel electrode 220 can be connected to the drain electrode 180b. The pixel electrode 220 can include a conductive material such as molybdenum (Mo), aluminum (Al), neodymium (Nd), nickel (Ni), lanthanum (La), titanium (Ti), copper (Cu), silver (Ag), indium tin oxide (ITO), and indium zinc oxide (IZO).

[0087] A pixel definition layer 230 can be disposed on the pixel electrode 220. The pixel definition layer 230 can be disposed on the first via insulating layer 190 while covering the pixel electrode 220. The pixel definition layer 230 can have a pixel opening exposing at least a portion of the pixel electrode 220. The pixel opening can expose a central portion of the pixel electrode 220, and the pixel definition layer 230 can cover a peripheral portion of the pixel electrode 220. In some embodiments, the pixel definition layer 230 can have a flat top surface. The pixel definition layer 230 can be an organic insulating layer including an organic insulating material such as polyimide (PI).

[0088] A light emitting layer 240 can be disposed on the pixel electrode 220. The light emitting layer 240 can be disposed on the pixel electrode 220 exposed by the pixel opening. The light emitting layer 240 can include at least one of an organic light emitting material and a quantum dot.

[0089] In some embodiments, the organic light emitting material can include a low molecular organic compound or a high molecular organic compound. For example, the low molecular organic compound can include copper phthalocyanine, N,N'-diphenylbenzidine, and tris-(8-hydroxyquinoline)aluminum, etc., and the high molecular organic compound can include poly(3,4-ethylenedioxythiophene), polyaniline, poly-p-phenylenevinylene, and polyfluorene, etc.

[0090] In some embodiments, the quantum dot can include a core including a group II-VI compound, a group III-V compound, a group IV-VI compound, a group IV element, a group IV compound, or any combination thereof. In some embodiments, the quantum dot can have a core-shell structure including a core and a shell surrounding the core. The shell can reduce or prevent the possibility of chemical degradation of the core, thereby functioning as a protective layer for maintaining a semiconductor property and as a charging layer for imparting electrophoretic properties to the quantum dot.

[0091] A counter electrode 250 can be disposed on the light emitting layer 240. In some embodiments, the counter electrode 250 can also be disposed on the pixel definition layer 230. The counter electrode 250 can include a conductive material, for example, a metal, an alloy, or a transparent conductive oxide. For example, the conductive material can include aluminum (Al), platinum (Pt), silver (Ag), magnesium (Mg), gold (Au), chromium (Cr), tungsten (W), and titanium (Ti), etc. The pixel electrode 220, the light emitting layer 240, and the counter electrode 250 can form a light emitting element EL.

[0092] Figure 3 is a plan view illustrating a non-display area NDA of the display device of Figure 1 For example, Figure 3 may illustrate one example of the area A of Figure 1 . Figure 4 is a cross-sectional view taken along line I-I' of Figure 3 .

[0093] Referring to Figure 3 and Figure 4 The display device can include a buffer layer 110, an electrostatic active pattern 121, a first gate insulating layer 130, a first wiring 141, a second gate insulating layer 150, a second wiring 161, an interlayer insulating layer 170, a pad 181, a contact bridge 182, an electrostatic electrode 183, a first organic insulating layer 310, a first upper wiring 410, and a second organic insulating layer 320 disposed in a non-display area NDA on a substrate 100.

[0094] The buffer layer 110 can be disposed on the substrate 100. The buffer layer 110 can extend from the display area DA to the non-display area NDA.

[0095] The electrostatic active pattern 121 can be disposed on the buffer layer 110. The electrostatic active pattern 121 can include substantially the same material as the active pattern 120 and can be disposed on the same layer as the active pattern 120.

[0096] The first gate insulating layer 130 can be disposed on the electrostatic active pattern 121. The first gate insulating layer 130 can be disposed on the buffer layer 110 while covering the electrostatic active pattern 121. The first gate insulating layer 130 can extend from the display area DA to the non-display area NDA.

[0097] The first wiring 141 can be disposed on the first gate insulating layer 130. The first wiring 141 can extend in the first direction D1. The first wiring 141 can include substantially the same material as the first gate electrode 140 and can be disposed on the same layer as the first gate electrode 140.

[0098] The second gate insulating layer 150 can be disposed on the first wiring 141. The second gate insulating layer 150 can be disposed on the first gate insulating layer 130 while covering the first wiring 141. The second gate insulating layer 150 can extend from the display area DA to the non-display area NDA.

[0099] The second wiring 161 can be disposed on a different layer from the first wiring 141. The second wiring 161 can be disposed on the second gate insulating layer 150. The second wiring 161 can extend in the first direction D1. The second wiring 161 can include substantially the same material as the second gate electrode 160 and can be disposed on the same layer as the second gate electrode 160.

[0100] The interlayer insulating layer 170 can be disposed on the second wiring 161. The interlayer insulating layer 170 can be disposed on the second gate insulating layer 150 while covering the second wiring 161. The interlayer insulating layer 170 can extend from the display area DA to the non-display area NDA.

[0101] A pad 181 can be disposed on the interlayer insulating layer 170. The pad 181 can be connected to the first end 141a of the first wire 141. The pad 181 can contact the first end 141a of the first wire 141 through a first contact hole formed in the second gate insulating layer 150 and the interlayer insulating layer 170. In some embodiments, the pad 181 can be an output pad OPD of the static electricity. Figure 1

[0102] A contact bridge 182 can be disposed on the interlayer insulating layer 170. The contact bridge 182 can connect the second wire 161 to the second end 141b of the first wire 141 opposite the first end 141a of the first wire 141. The contact bridge 182 can contact the second end 141b of the first wire 141 through at least one second contact hole formed in the second gate insulating layer 150 and the interlayer insulating layer 170, and can contact the second wire 161 through at least one third contact hole formed in the interlayer insulating layer 170. In some embodiments, the first wire 141, the second wire 161, and the contact bridge 182 can form an output wire OL of the static electricity. Figure 1

[0103] A static electrode 183 can be disposed on the interlayer insulating layer 170. The static electrode 183 can be disposed between the pad 181 and the contact bridge 182. Thus, when viewed in a plan view, a distance from the pad 181 to the contact bridge 182 can be greater than a distance from the pad 181 to the static electrode 183. In other words, the static electrode 183 can be positioned in the first direction DR1 from the contact bridge 182, and the pad 181 can be positioned in the first direction DR1 from the static electrode 183.

[0104] A first portion of the static electrode 183 can be connected to the static active pattern 121, and a second portion of the static electrode 183 can overlap the first wire 141. In some embodiments, the static active pattern 121, the first wire 141, and the static electrode 183 can form a static diode ED. The static diode ED can function to radiate static electricity transmitted through the output wire OL.

[0105] The pad 181, the contact bridge 182, and the static electrode 183 can include a conductive material such as molybdenum (Mo), aluminum (Al), neodymium (Nd), nickel (Ni), lanthanum (La), titanium (Ti), copper (Cu), silver (Ag), indium tin oxide (ITO), and indium zinc oxide (IZO). The pad 181, the contact bridge 182, and the static electrode 183 can include substantially the same material as the source electrode 180a and the drain electrode 180b, and can be disposed on the same layer as the source electrode 180a and the drain electrode 180b.

[0106] ​​The first organic insulating layer 310 can be disposed on the contact bridge 182 and the electrostatic electrode 183. The first organic insulating layer 310 can be disposed on the interlayer insulating layer 170 while covering the contact bridge 182 and the electrostatic electrode 183. The first organic insulating layer 310 can expose the pad 181. The first organic insulating layer 310 can include substantially the same material as the first via insulating layer 190, and can be disposed on the same layer as the first via insulating layer 190. The first organic insulating layer 310 can be physically separated from the first via insulating layer 190. In other words, the first via insulating layer 190 disposed in the display area DA and the first organic insulating layer 310 disposed in the non-display area NDA can not be connected to each other.

[0107] The first upper wiring 410 can be disposed on the first organic insulating layer 310. The first upper wiring 410 can overlap the contact bridge 182 and the electrostatic electrode 183. The first upper wiring 410 can include a conductive material such as molybdenum (Mo), aluminum (Al), neodymium (Nd), nickel (Ni), lanthanum (La), titanium (Ti), copper (Cu), silver (Ag), indium tin oxide (ITO), and indium zinc oxide (IZO). The first upper wiring 410 can include substantially the same material as the pixel electrode 220, and can be disposed on the same layer as the pixel electrode 220.

[0108] The second organic insulating layer 320 can be disposed on the first upper wiring 410. The second organic insulating layer 320 can be disposed on the first organic insulating layer 310 while covering the first upper wiring 410. The second organic insulating layer 320 can include substantially the same material as the pixel defining layer 230, and can be disposed on the same layer as the pixel defining layer 230. The second organic insulating layer 320 can be physically separated from the pixel defining layer 230. In other words, the pixel defining layer 230 disposed in the display area DA and the second organic insulating layer 320 disposed in the non-display area NDA can not be connected to each other.

[0109] In the display device according to the embodiment, because the contact bridge 182 is positioned relatively far from the end of the first organic insulating layer 310 and the end of the second organic insulating layer 320 positioned between the pad 181 and the electrostatic electrode 183, even when the end of the first organic insulating layer 310 and / or the end of the second organic insulating layer 320 is damaged, the contact bridge 182 can be prevented from being damaged by impurities introduced through the damaged first organic insulating layer 310 and / or the second organic insulating layer 320.

[0110] In addition, the first upper wiring 410 overlapping the contact bridge 182 is disposed above the contact bridge 182, so that the contact bridge 182 can be prevented from being damaged by impurities introduced through the damaged second organic insulating layer 320. Thus, corrosion of the first wiring 141 and the second wiring 161 connected to the contact bridge 182 can be reduced or prevented.

[0111] Figure 5 is a cross-sectional view illustrating a non-display area of a display device according to some embodiments of the present disclosure.

[0112] The display device described with reference to Figure 5 may be the same as or similar to the display device described with reference to Figure 3 and Figure 4 Thus, a repeated description of substantially the same or similar configurations will be omitted.

[0113] The display device described with reference to Figure 5 may include a sidewall 412 extending between the pad 181 and the electrostatic electrode 183 and in contact with the interlayer insulating layer 170 in some embodiments. The sidewall 412 can be interposed between a side portion of the first organic insulating layer 310 and a side portion of the second organic insulating layer 320 to separate them from each other. When the first upper wiring 410 includes the sidewall 412 extending between the pad 181 and the electrostatic electrode 183, an impact on the first organic insulating layer 310 otherwise caused by damage to the second organic insulating layer 320 can be reduced or prevented even when the second organic insulating layer 320 is damaged in the process of manufacturing the display device.

[0114] Hereinafter, a display device according to other embodiments will be described with reference to Figures 6 to 19 .

[0115] Figure 6 is a cross-sectional view illustrating a display area of a display device according to some embodiments of the present disclosure. For example, Figure 6 may illustrate Figure 1 another example of the pixel PX.

[0116] The display device described with reference to Figure 6 may be the same as or similar to the display device described with reference to Figure 2 Thus, a repeated description of substantially the same or similar configurations will be omitted.

[0117] The display device described with reference to Figure 6The display device according to some embodiments can include a buffer layer 110, an active pattern 120, a first gate insulating layer 130, a first gate electrode 140, a second gate insulating layer 150, a second gate electrode 160, an interlayer insulating layer 170, a source electrode 180a, a drain electrode 180b, a first via insulating layer 190, a connection electrode 200, a second via insulating layer 210, a pixel electrode 220, a pixel defining layer 230, an emission layer 240, and a counter electrode 250 disposed in a display area DA on a substrate 100.

[0118] The second via insulating layer 210 can be disposed between the first via insulating layer 190 and the pixel defining layer 230. In some embodiments, the second via insulating layer 210 can have a flat top surface. The second via insulating layer 210 can be an organic insulating layer including an organic insulating material such as polyimide (PI).

[0119] The connection electrode 200 can be disposed between the first via insulating layer 190 and the second via insulating layer 210. The connection electrode 200 can connect the drain electrode 180b to the pixel electrode 220. The connection electrode 200 can include a conductive material such as molybdenum (Mo), aluminum (Al), neodymium (Nd), nickel (Ni), lanthanum (La), titanium (Ti), copper (Cu), silver (Ag), indium tin oxide (ITO), and indium zinc oxide (IZO).

[0120] Figure 7 FIG. 1B is a plan view illustrating a non-display area of a display device according to some embodiments of the present disclosure. For example, Figure 7 FIG. 1C can illustrate Figure 1 another example of the area A of FIG. 1B. Figure 8 FIG. 1D is a cross-sectional view taken along line II-II' of Figure 7 FIG. 1B.

[0121] The display device described with reference to Figure 7 and Figure 8 may be the same as or similar to the display device described with reference to Figure 3 and Figure 4 . Thus, a repeated description of substantially the same or similar configurations will be omitted.

[0122] With reference to Figure 7 and Figure 8 , the first upper wiring 410 can be disposed on the first organic insulating layer 310. The first upper wiring 410 can overlap the contact bridge 182 and the static electrode 183. The first upper wiring 410 can include substantially the same material as the connection electrode 200 and can be disposed on the same layer as the connection electrode 200.

[0123] The second organic insulating layer 320 can be disposed on the first upper wiring 410. The second organic insulating layer 320 can be disposed on the first organic insulating layer 310 while covering the first upper wiring 410. The second organic insulating layer 320 can include substantially the same material as the second via insulating layer 210, and can be disposed on the same layer as the second via insulating layer 210. The second organic insulating layer 320 can be physically separated from the second via insulating layer 210. In other words, the second via insulating layer 210 disposed in the display area DA and the second organic insulating layer 320 disposed in the non-display area NDA can not be connected to each other.

[0124] Figure 9 FIG. 17 is a cross-sectional view illustrating a non-display area of a display apparatus according to some embodiments of the disclosure.

[0125] The display apparatus described with reference to FIGS. 16A and 16B can be the same or similar to the display apparatus described with reference to Figure 9 FIGS. 16A and 16B. Figure 7 and Figure 8 The display apparatus described with reference to FIGS. 16A and 16B can be the same or similar to the display apparatus described with reference to

[0126] The display apparatus described with reference to FIGS. 16A and 16B can be the same or similar to the display apparatus described with reference to Figure 9 The display apparatus of some embodiments can further include a third organic insulating layer 330 disposed on the non-display area NDA of the substrate 100. The third organic insulating layer 330 can be disposed on the second organic insulating layer 320. The third organic insulating layer 330 can include substantially the same material as the pixel defining layer 230, and can be disposed on the same layer as the pixel defining layer 230. The third organic insulating layer 330 can be physically separated from the pixel defining layer 230. In other words, the pixel defining layer 230 disposed in the display area DA and the third organic insulating layer 330 disposed in the non-display area NDA can not be connected to each other.

[0127] Figure 10 FIG. 17 is a cross-sectional view illustrating a non-display area of a display apparatus according to some embodiments of the disclosure.

[0128] The display apparatus described with reference to FIGS. 16A and 16B can be the same or similar to the display apparatus described with reference to Figure 10 and Figure 9 The display apparatus described with reference to FIGS. 16A and 16B can be the same or similar to the display apparatus described with reference to

[0129] The display apparatus described with reference to FIGS. 16A and 16B can be the same or similar to the display apparatus described with reference to Figure 10 The first upper wiring 410 can be disposed between the second organic insulating layer 320 and the third organic insulating layer 330. The first upper wiring 410 can overlap the contact bridge 182 and the static electrode 183. The first upper wiring 410 can include substantially the same material as the pixel electrode 220, and can be disposed on the same layer as the pixel electrode 220.

[0130] Figure 11 is a cross-sectional view illustrating a non-display area of a display device according to some embodiments of the present disclosure.

[0131] The display device described with reference to Figure 11 may be the same as or similar to the display device described with reference to Figure 9 . Thus, a repeated description of substantially the same or similar configurations will be omitted.

[0132] With reference to Figure 11 , the display device of some embodiments can further include a second upper wiring 420 disposed on the non-display area NDA of the substrate 100. The second upper wiring 420 can be disposed between the second organic insulating layer 320 and the third organic insulating layer 330. The second upper wiring 420 can overlap the first upper wiring 410. The second upper wiring 420 can include substantially the same material as the pixel electrode 220, and can be disposed on the same layer as the pixel electrode 220.

[0133] Figure 12 is a cross-sectional view illustrating a non-display area of a display device according to some embodiments of the present disclosure.

[0134] The display device described with reference to Figure 12 may be the same as or similar to the display device described with reference to Figure 7 and Figure 8 . Thus, a repeated description of substantially the same or similar configurations will be omitted.

[0135] With reference to Figure 12 , in some embodiments, the first upper wiring 410 can include a side wall 412 extending between the pad 181 and the electrostatic electrode 183 and in contact with the interlayer insulating layer 170. The side wall 412 can be interposed between a side portion of the first organic insulating layer 310 and a side portion of the second organic insulating layer 320 to separate them from each other. When the first upper wiring 410 includes the side wall 412 extending between the pad 181 and the electrostatic electrode 183, the influence on the first organic insulating layer 310 that would otherwise be exerted due to damage to the second organic insulating layer 320 can be reduced or prevented even when the second organic insulating layer 320 is damaged in the process of manufacturing the display device.

[0136] Figure 13 is a cross-sectional view illustrating a non-display area of a display device according to some embodiments of the present disclosure.

[0137] The display device described with reference to Figure 13 may be the same as or similar to the display device described with reference to Figure 9The display apparatuses described are the same or similar. Thus, repeated description of substantially the same or similar configurations will be omitted.

[0138] Referring to Figure 13 In some embodiments, the first upper wiring 410 can include a side wall 412 extending between the pad 181 and the electrostatic electrode 183 and in contact with the interlayer insulating layer 170. The side wall 412 can be interposed between the side of the first organic insulating layer 310 and the side of the second organic insulating layer 320 to separate them from each other. When the first upper wiring 410 includes the side wall 412 extending between the pad 181 and the electrostatic electrode 183, damage to the second organic insulating layer 320 and / or the third organic insulating layer 330 can not affect the first organic insulating layer 310 even if the second organic insulating layer 320 and / or the third organic insulating layer 330 are damaged in the process of manufacturing the display apparatus.

[0139] Figure 14 FIG. 1 is a cross-sectional view illustrating a non-display area of a display apparatus according to some embodiments of the present disclosure.

[0140] In addition to the first upper wiring 410, referring to Figure 14 The display apparatuses described can be the same or similar to the display apparatuses described with reference to Figure 10 The display apparatuses described are the same or similar. Thus, repeated description of substantially the same or similar configurations will be omitted.

[0141] Referring to Figure 14 In some embodiments, the first upper wiring 410 can include a side wall 412 extending between the pad 181 and the electrostatic electrode 183 and in contact with the interlayer insulating layer 170. The side wall 412 can be interposed between the side of the second organic insulating layer 320 and the side of the third organic insulating layer 330 to separate them from each other. When the first upper wiring 410 includes the side wall 412 extending between the pad 181 and the electrostatic electrode 183, damage to the third organic insulating layer 330 can be reduced or prevented from affecting the first organic insulating layer 310 and / or the second organic insulating layer 320 due to the damage to the third organic insulating layer 330 even if the third organic insulating layer 330 is damaged in the process of manufacturing the display apparatus.

[0142] Figure 15 FIG. 1 is a cross-sectional view illustrating a non-display area of a display apparatus according to some embodiments of the present disclosure.

[0143] In addition to the first upper wiring 410 and the second upper wiring 420, referring to Figure 15 The display apparatuses described can be the same or similar to the display apparatuses described with reference to Figure 11 The display apparatuses described are the same or similar. Thus, repeated description of substantially the same or similar configurations will be omitted.

[0144] Referring to Figure 15In some embodiments, the first upper wiring 410 may include a first sidewall 412 extending between the pad 181 and the electrostatic electrode 183 and contacting the interlayer insulating layer 170, while the second upper wiring 420 may include a second sidewall 422 extending between the pad 181 and the electrostatic electrode 183 and contacting the interlayer insulating layer 170. The first sidewall 412 may be inserted between the sides of the first organic insulating layer 310 and the second organic insulating layer 320 to separate them from each other, while the second sidewall 422 may be inserted between the sides of the second organic insulating layer 320 and the third organic insulating layer 330 to separate them from each other. When the first upper wiring 410 and the second upper wiring 420 respectively include the first sidewall 412 and the second sidewall 422 extending between the pad 181 and the electrostatic electrode 183, the impact on the first organic insulating layer 310 due to damage to the third organic insulating layer 330 can be reduced or prevented, even if the third organic insulating layer 330 is damaged during the manufacturing of the display device.

[0145] Figure 16 This is a cross-sectional view showing the non-display area of ​​a display device according to some embodiments of the present disclosure.

[0146] In addition to the second wiring 420, refer to Figure 16 The described display device can be compared with the reference. Figure 11 The described display devices are the same or similar. Therefore, repeated descriptions of substantially the same or similar structures will be omitted.

[0147] refer to Figure 16 The second upper wiring 420 can be connected to the first upper wiring 410. The second upper wiring 420 can contact the first upper wiring 410 through at least one contact hole formed in the second organic insulating layer 320. Because the first upper wiring 410 and the second upper wiring 420 can provide a path for static electricity inflow when they are electrically floated, the first upper wiring 410 and the second upper wiring 420 can be connected to each other, and at least one of the first upper wiring 410 and the second upper wiring 420 can be electrically connected to another conductive layer to which a voltage is applied. Thus, the first upper wiring 410 and the second upper wiring 420 may not provide a path for static electricity inflow.

[0148] Figure 17 This is a cross-sectional view showing the non-display area of ​​a display device according to some embodiments of the present disclosure.

[0149] In addition to the first wiring 410, refer to Figure 17 The described display device can be compared with the reference. Figure 16 The described display devices are the same or similar. Therefore, repeated descriptions of substantially the same or similar structures will be omitted.

[0150] refer to Figure 17In some embodiments, the first upper wiring 410 can include a sidewall 412 extending between the pad 181 and the static electrode 183 and in contact with the interlayer insulating layer 170. The sidewall 412 can be interposed between the side of the first organic insulating layer 310 and the side of the second organic insulating layer 320 to separate them from each other.

[0151] Figure 18 FIG. 7 is a cross-sectional view illustrating a non-display area of a display device according to some embodiments of the present disclosure.

[0152] The display device described with reference to Figure 18 may be the same as or similar to the display device described with reference to Figure 16 . Thus, a repeated description of substantially the same or similar configurations will be omitted.

[0153] The display device described with reference to Figure 18 In some embodiments, the second upper wiring 420 can include a sidewall 422 extending between the pad 181 and the static electrode 183 and in contact with the interlayer insulating layer 170. The sidewall 422 can be interposed between the side of the second organic insulating layer 320 and the side of the third organic insulating layer 330 to separate them from each other.

[0154] Figure 19 FIG. 7 is a cross-sectional view illustrating a non-display area of a display device according to some embodiments of the present disclosure.

[0155] The display device described with reference to Figure 19 may be the same as or similar to the display device described with reference to Figure 16 . Thus, a repeated description of substantially the same or similar configurations will be omitted.

[0156] The display device described with reference to Figure 19 In some embodiments, the first upper wiring 410 can include a first sidewall 412 extending between the pad 181 and the static electrode 183 and in contact with the interlayer insulating layer 170, and the second upper wiring 420 can include a second sidewall 422 extending between the pad 181 and the static electrode 183 and in contact with the interlayer insulating layer 170. The first sidewall 412 can be interposed between the side of the first organic insulating layer 310 and the side of the second organic insulating layer 320 to separate them from each other, and the second sidewall 422 can be interposed between the side of the second organic insulating layer 320 and the side of the third organic insulating layer 330 to separate them from each other.

[0157] The display device according to an embodiment can be applied to a display device included in a computer, a notebook, a mobile phone, a smartphone, a smartpad, a PMP, a PDA, or an MP3 player, etc.

[0158] Although the display apparatus according to the embodiments has been described with reference to the accompanying drawings, the illustrated embodiments are examples, and can be modified and changed by those of ordinary skill in the related art without departing from the technical spirit described in the appended claims, and functional equivalents thereof will be included therein.

Claims

1. A display device, comprising: The substrate includes both the display area and the non-display area; A first wiring at the non-display area of ​​the substrate; A second wiring on a different layer than the first wiring, located in the non-display area of ​​the substrate; Inorganic insulating layer on the first wiring and the second wiring; The pads on the inorganic insulating layer and connected to the first end of the first wiring; A contact bridge on the inorganic insulating layer that connects the second wiring to the second end of the first wiring; An electrostatic electrode on the inorganic insulating layer between the pad and the contact bridge; A first organic insulating layer covers the contact bridge and the electrostatic electrode and exposes the pads; A first upper wiring on the first organic insulating layer and overlapping with the contact bridge and the electrostatic electrode; as well as A second organic insulating layer on the first upper wiring.

2. The display device according to claim 1, wherein, The distance from the pad to the contact bridge is greater than the distance from the pad to the electrostatic electrode.

3. The display device according to claim 1, wherein, The first upper wiring includes at least one of molybdenum, aluminum, neodymium, nickel, lanthanum, titanium, copper, silver, indium tin oxide, and indium zinc oxide.

4. The display device according to claim 1, wherein, The first upper wiring includes a sidewall that extends between the pad and the electrostatic electrode and contacts the inorganic insulating layer.

5. The display device according to claim 1, further comprising: Active pattern on the display area of ​​the substrate; The first gate electrode on the active pattern; The second gate electrode on the first gate electrode; The source electrode and drain electrode are connected to the active pattern; A first through-hole insulating layer on the source electrode and the drain electrode; A pixel electrode on the first through-hole insulating layer and electrically connected to the drain electrode; as well as A pixel-defining layer on a portion of the pixel electrode.

6. The display device according to claim 5, wherein, The first organic insulating layer, the first upper wiring layer, and the second organic insulating layer are respectively on the same layer as the first through-hole insulating layer, the pixel electrode, and the pixel defining layer.

7. The display device according to claim 5, further comprising: A second via insulating layer between the first via insulating layer and the pixel defining layer; as well as A connection electrode is placed between the first through-hole insulating layer and the second through-hole insulating layer, and the drain electrode is connected to the pixel electrode.

8. The display device according to claim 7, wherein, The first organic insulating layer, the first upper wiring and the second organic insulating layer are respectively on the same layer as the first through-hole insulating layer, the connecting electrode and the second through-hole insulating layer.

9. The display device according to claim 7, wherein, The first organic insulating layer, the first upper wiring layer, and the second organic insulating layer are respectively on the same layer as the first through-hole insulating layer, the second through-hole insulating layer, the pixel electrode, and the pixel defining layer.

10. The display device of claim 5, further comprising an electrostatic active pattern, the electrostatic active pattern being connected to the electrostatic electrode and being on the same layer as the active pattern. in, The electrostatic active pattern, the first wiring, and the electrostatic electrode form an electrostatic diode.

11. The display device according to claim 1, further comprising a third organic insulating layer on the second organic insulating layer.

12. The display device of claim 11, further comprising a second upper wiring, the second upper wiring being located between the second organic insulating layer and the third organic insulating layer and overlapping the first upper wiring.

13. The display device according to claim 12, wherein, The second upper wiring includes at least one of molybdenum, aluminum, neodymium, nickel, lanthanum, titanium, copper, silver, indium tin oxide, and indium zinc oxide.

14. The display device according to claim 12, wherein, The second upper wiring includes a sidewall that extends between the pad and the electrostatic electrode and contacts the inorganic insulating layer.

15. The display device according to claim 12, wherein, The second upper wiring is connected to the first upper wiring.

16. The display device according to claim 12, further comprising: Active pattern on the display area of ​​the substrate; The first gate electrode on the active pattern; The second gate electrode on the first gate electrode; The source electrode and drain electrode are connected to the active pattern; A first through-hole insulating layer on the source electrode and the drain electrode; A connection electrode is located on the first through-hole insulating layer and connected to the drain electrode; The second through-hole insulating layer on the connecting electrode; The pixel electrode is located on the second through-hole insulating layer and connected to the connecting electrode; as well as A pixel-defining layer on a portion of the pixel electrode.

17. The display device according to claim 16, wherein, The first organic insulating layer, the first upper wiring, the second organic insulating layer, the second upper wiring, and the third organic insulating layer are respectively on the same layer as the first via insulating layer, the connection electrode, the second via insulating layer, the pixel electrode, and the pixel defining layer.

18. The display device of claim 1, further comprising a driver chip on and electrically connected to the pads exposed by the first organic insulating layer.

19. A display device, comprising: substrate; First wiring on the substrate; A second wiring on the substrate, on a layer different from the first wiring; Inorganic insulating layer on the first wiring and the second wiring; The pads on the inorganic insulating layer and connected to the first end of the first wiring; On the inorganic insulating layer, and connecting the second end of the first wire to the contact bridge of the second wire; An electrostatic electrode on the inorganic insulating layer between the pad and the contact bridge; as well as An organic insulating layer covers the contact bridge and the electrostatic electrode and exposes the pads.

20. The display device according to claim 19, wherein, The distance from the pad to the contact bridge is greater than the distance from the pad to the electrostatic electrode.

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