Display device and manufacturing method

Abstract

The present invention provides a display device and a manufacturing method, comprising: a substrate, the substrate comprising a connecting electrode; a light-emitting diode, the light-emitting diode being arranged on one side of the substrate and electrically connected to the connecting electrode; an isolation layer, the isolation layer being arranged on one side of the substrate, the isolation layer comprising an isolation groove and an isolation unit surrounding the isolation groove, the light-emitting diode being arranged in the isolation groove; a barrier structure, the barrier structure being arranged on a side of the light-emitting diode away from the substrate, the barrier structure comprising a first barrier layer and a second barrier layer stacked, the second barrier layer comprising a barrier unit, the barrier unit being located in the isolation groove; a color conversion layer, the color conversion layer being arranged on a side of the barrier structure away from the substrate, and in the thickness direction of the substrate, the color conversion layer is opposite to the light-emitting diode; and a protective layer, the protective layer being arranged on a side of the color conversion layer away from the substrate.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and in particular relates to a display device and a manufacturing method thereof. Background Art

[0002] Micro / Mini LED technology, or LED miniaturization and matrixing, refers to the integration of high-density, tiny LEDs on a single chip. For example, each pixel in an LED display can be addressed and individually driven, reducing the pixel level from millimeters to microns. Micro / Mini LEDs not only inherit the advantages of traditional LEDs, such as high efficiency, high brightness, high reliability, and fast response time, but also offer energy savings, simple structure, small size, thinness, and the ability to generate light without a backlight.

[0003] Existing Micro / Mini LED chip display devices usually use blue light Micro / Mini LED chips as excitation light because red / green light Micro / Mini LED chips are inferior to blue light Micro / Mini LED chips in terms of yield and cost. Quantum dots or phosphors are added for color conversion to enable Micro / Mini LED to achieve full-color display.

[0004] Current solutions for using quantum dots or phosphors to convert color to achieve full-color displays in Micro / Mini LEDs involve fabricating the quantum dots or phosphors on a separate substrate, known as a conversion substrate, which is then laminated to the Micro / Mini LED substrate to form a display device. The disadvantage of this approach is that a gap exists between the Micro / Mini LED substrate and the conversion substrate, potentially causing light crosstalk in the Micro / Mini LEDs, resulting in poor display quality.

[0005] Furthermore, currently proposed display solutions that utilize quantum dot or phosphor conversion layers fabricated directly on Micro / Mini LED chips suffer from the problem of poor color conversion layer lifespan due to the direct contact of the quantum dots or phosphors with the Micro / Mini LED chips. Heat generated by the operation of the Micro / Mini LED chips directly affects the quantum dots or phosphors, leading to a poor color conversion layer lifespan. Furthermore, the quantum dot or phosphor conversion layer is produced on the display device substrate using inkjet printing. Due to the height differences between the different film layers on the substrate, the cured quantum dot or phosphor conversion layer is prone to uneven areas. These uneven areas can easily lead to uneven light output from the display device at different viewing angles, resulting in poor subsequent packaging, reduced device lifespan, and degraded display quality. Summary of the Invention

[0006] The purpose of the present invention is to provide a display device and a manufacturing method for overcoming the problems in existing display devices such as the degradation of the color conversion layer material performance caused by the color conversion layer being directly manufactured on the Micro / Mini LED chip, as well as the uneven light output caused by the uneven areas on the surface of the color conversion layer, poor packaging effect, reduced device life, and deterioration of display effect.

[0007] To solve the above problems, the technical solution of the present invention provides a display device, which includes: a substrate, the substrate including a connecting electrode; a light-emitting diode, the light-emitting diode is arranged on one side of the substrate, and the light-emitting diode is electrically connected to the connecting electrode; an isolation layer, the isolation layer is arranged on one side of the substrate, the isolation layer includes an isolation groove and an isolation unit surrounding the isolation groove, and the light-emitting diode is arranged in the isolation groove; a barrier structure, the barrier structure is arranged on a side of the light-emitting diode away from the substrate, the barrier structure includes a first barrier layer and a second barrier layer stacked together, the second barrier layer includes a barrier unit, and the barrier unit is located in the isolation groove; a color conversion layer, the color conversion layer is arranged on a side of the barrier structure away from the substrate, and in the thickness direction of the substrate, the color conversion layer is opposite to the light-emitting diode; and a protective layer, the protective layer is arranged on a side of the color conversion layer away from the substrate.

[0008] As an optional technical solution, the first barrier layer is an inorganic barrier layer; and the second barrier layer is an organic barrier layer.

[0009] As an optional technical solution, the first surface of the organic barrier layer away from the light-emitting diode is a flat surface.

[0010] As an optional technical solution, the inorganic barrier layer covers the light emitting diode and is in direct contact with the light emitting diode, and the organic barrier layer is arranged on the inorganic barrier layer.

[0011] As an optional technical solution, the color conversion layer is arranged above the first surface.

[0012] As an optional technical solution, the organic barrier layer covers the light emitting diode and is in direct contact with the light emitting diode, and the inorganic barrier layer covers the organic barrier layer.

[0013] As an optional technical solution, the inorganic barrier layer includes a flat portion, and the flat portion is located in the isolation groove, wherein in the thickness direction of the substrate, the flat portion is stacked above the first surface and opposite to the light-emitting diode.

[0014] As an optional technical solution, the color conversion layer is arranged above the flat portion.

[0015] As an optional technical solution, the protective layer includes a first inorganic layer, an intermediate organic layer, and a second inorganic layer stacked from bottom to top, and the first inorganic layer covers the color conversion layer.

[0016] The present invention further provides a method for manufacturing a display panel, the method being used to manufacture the display panel described above, the method comprising:

[0017] Providing a substrate, wherein one side of the substrate includes an electrode and a light-emitting diode electrically connected to the electrode;

[0018] forming an isolation layer on one side of the substrate, wherein the isolation layer has an isolation groove, and the light-emitting diode is exposed from the isolation groove;

[0019] forming a barrier structure on a side of the light emitting diode away from the substrate;

[0020] forming a color conversion layer on a side of the barrier structure away from the light emitting diode; and

[0021] forming a protective layer on a side of the color conversion layer away from the substrate;

[0022] The barrier structure includes a first barrier layer and a second barrier layer, the second barrier layer includes a barrier unit, the barrier unit is located in the isolation groove, and the first surface of the barrier unit away from the light-emitting diode is a flat surface.

[0023] Compared to the prior art, the present invention provides a display device and manufacturing method. A barrier structure is provided on one side of the display device's isolation layer. The barrier structure comprises a stacked first and second barrier layers. The second barrier layer provides a flat surface, allowing the subsequently fabricated color conversion layer to rest above it. This prevents the unevenness of the color conversion layer, which can lead to inconsistent light output at different viewing angles. Furthermore, the barrier structure prevents direct contact between the color conversion layer and the LEDs, preventing material degradation and effectively extending the lifespan of the color conversion layer.

[0024] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this does not limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 FIG. 1 is a cross-sectional schematic diagram of a display device provided in one embodiment of the present invention.

[0027] Figure 2 for Figure 1 Schematic cross-sectional view of a substrate of a display device.

[0028] Figures 3 and 4 for Figure 1 Schematic cross-sectional view of the manufacturing process of the isolation layer.

[0029] Figure 5 For production Figure 1 Schematic cross-sectional view of the organic barrier layer.

[0030] Figure 6 For production Figure 1 Schematic cross-sectional view of the inorganic barrier layer.

[0031] Figure 7 For production Figure 1 Schematic cross-sectional view of the middle light-shielding layer.

[0032] Figure 8 For production Figure 1 Schematic cross-section of the neutral color conversion layer.

[0033] Figure 9 For production Figure 1 Schematic cross-sectional view of the first inorganic layer of the middle protective layer.

[0034] Figure 10 For production Figure 1 Schematic cross-sectional view of the middle organic layer of the middle protective layer.

[0035] Figure 11 For production Figure 1 Schematic cross-sectional view of the second inorganic layer of the middle protective layer.

[0036] Figure 12 FIG. 1 is a schematic cross-sectional view of a display device provided in another embodiment of the present invention.

[0037] Figure 13 For production Figure 12 Schematic diagram of the inorganic barrier layer.

[0038] Figure 14 For production Figure 12 Schematic cross-sectional view of the middle light-shielding layer.

[0039] Figure 15 For production Figure 12 Schematic cross-sectional view of the organic barrier layer.

[0040] Figure 16 For production Figure 12 Schematic cross-section of the neutral color conversion layer

[0041] Figure 17 For production Figure 12 Schematic cross-sectional view of the first inorganic layer of the middle protective layer.

[0042] Figure 18 For production Figure 12 Schematic cross-sectional view of the middle organic layer of the middle protective layer.

[0043] Figure 19 For production Figure 12 Schematic cross-sectional view of the second inorganic layer of the middle protective layer.

[0044] Figure 20 This is a flow chart of a method for manufacturing a display device provided by the present invention. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with the embodiments and drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0046] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0047] The object of the present invention is to provide a display device and a manufacturing method. The display device includes a substrate, a light-emitting diode, an isolation layer, a barrier structure, a color conversion layer and a protective layer. The barrier structure covers the light-emitting diode, and the color conversion layer is arranged above the barrier structure. The barrier structure prevents the color conversion layer from directly contacting the light-emitting diode, which can effectively avoid the influence of the light-emitting diode on the color conversion layer.

[0048] In addition, the protective layer covers the color conversion layer, so that the color conversion layer is covered by the barrier structure and the protective layer, effectively isolating the color conversion layer from the influence of water and oxygen in the external environment, thereby increasing the service life of the color conversion layer.

[0049] like Figure 1As shown, in one embodiment of the present invention, a display device 100 is provided, including a substrate 10, a light-emitting diode 20, an isolation layer 30, a barrier structure, a color conversion layer 90 and a protective layer 70, wherein the barrier structure includes a first barrier layer 50 and a second barrier layer 40 stacked together, and the first barrier layer 50 and the second barrier layer 40 are used together to prevent the color conversion layer 90 from directly contacting the light-emitting diode 20; and the protective layer 70 covers the color conversion layer 90, and the barrier structure and the protective layer 90 together isolate the color conversion layer 90 from contact with external water and oxygen, thereby improving the service life of the color conversion layer 90.

[0050] The following will be combined Figures 2 to 10 illustrate Figure 1 1. The manufacturing process of the display device 100 is shown in FIG.

[0051] like Figure 2 As shown, an electrode 11 is provided on the substrate 10 , and the device electrode of the light emitting diode 20 is electrically connected to the electrode 11 on the substrate 10 , such as the driving electrode 11 .

[0052] In a preferred embodiment, the light emitting diode 20 is transferred onto the substrate 10 by mass transfer technology and is electrically connected to the electrode 11 .

[0053] The LED 20 is, for example, a micro / mini LED, preferably a blue micro / mini LED; the substrate 10 is, for example, a glass substrate, a driver circuit board, or a silicon substrate; and the electrode 11 is made of, for example, a metal such as tin (Sn), indium (In), or gold (Au), or alloys thereof. Furthermore, the LED 20 and the electrode 11 may be electrically connected via a conductive adhesive, such as ACF.

[0054] In a preferred embodiment, the light emitting diodes 20 on the substrate 10 are arranged in an array, for example.

[0055] like Figure 1 、 Figure 3 and Figure 4 As shown, an isolation material is applied to one side of the substrate 10, and after the isolation material is cured, an isolation material layer 30' is formed, wherein the isolation material layer 30' entirely covers one side of the substrate 10; and then a patterning process is performed to form an isolation groove 32 and an isolation unit 31 surrounding the isolation groove 32.

[0056] The isolation material layer 30' is, for example, a non-transparent resin material. Colors of the non-transparent resin material include black, gray, white, or yellow. The thickness of the isolation material layer 30' is approximately 10-100 μm. In this embodiment, the isolation layer 30 obtained by patterning the isolation material layer 30' serves as a support carrier for the inorganic barrier layer and the organic barrier layer of the barrier structure. Therefore, it needs to have a certain film thickness.

[0057] The steps of the patterning process of the isolation material layer 30' generally include:

[0058] A photoresist (not shown) is applied to the side of the isolation material layer 30' facing away from the substrate 10. The thickness of the photoresist layer is approximately 1-100 μm. Exposure and development are performed to form a photoresist pattern, with portions of the isolation material layer 30' exposed from the photoresist pattern. Dry etching is then performed to etch the exposed portions of the isolation material layer 30' to form isolation trenches 32. The isolation trenches 32 are in the shape of an inverted trapezoid. The upper portion of the light-emitting diode 20 is exposed from the bottom 321 of the inverted trapezoidal isolation trench 32.

[0059] The etching gases used in dry etching are mainly O2, CF4, and Ar; the equipment used in dry etching includes plasma etcher (plasma), reactive ion etcher (RIE), inductively coupled plasma etcher (ICP-RIE) and other equipment.

[0060] It should be noted that due to the limitations of existing etching processes, it is difficult for the top surface of the LED 20 to be flush with the upper surface of the bottom 321 of the isolation trench 32. Consequently, a step exists between the top surface of the LED 20 and the upper surface of the bottom 321. This step can easily lead to an uneven structure in the color conversion layer 90 after curing, resulting in uneven light output at different viewing angles and reduced display quality. This uneven structure in the color conversion layer 90 after curing can also affect the barrier effect of the subsequent barrier layer, shortening the life of the display device.

[0061] like Figure 1 and Figure 5 As shown, an organic barrier layer 40 is formed on the side of the light-emitting diode 20 away from the substrate 10. The organic barrier layer 40 includes a plurality of barrier units 41. Each barrier unit 41 is located in the isolation groove 32 and covers the bottom 321 of the isolation groove 32 and the upper part of the light-emitting diode 20.

[0062] In this embodiment, the plurality of barrier units 41 of the organic barrier layer 40 are applied to the isolation trench 32 via inkjet printing. The organic barrier layer 40 has a thickness of 5-10 μm and is made of, for example, a transparent thermal insulation resin. The first surface 401 of the barrier units 41, facing away from the substrate 10, is flat.

[0063] Furthermore, in the thickness direction of the substrate 10, the first surface 401 is located below the top surface of the isolation unit 31 on the side away from the substrate 10, that is, the barrier unit 41 is filled within the isolation trench 32. The barrier unit 41 is filled within the isolation trench 32, and the space above the isolation trench 32 is used to limit the formation position of the color conversion layer 90, facilitating alignment of the different color conversion units in the color conversion layer 90 and the light-emitting diodes 20, reducing manufacturing difficulty and achieving color display.

[0064] As part of the barrier structure, the organic barrier layer 40 provides a flat surface, eliminating the step between the bottom 321 of the isolation groove 32 and the upper portion of the light-emitting diode 20. The color conversion layer 90 subsequently formed above the flat surface does not have an uneven structure, thereby achieving consistent light output color of the color conversion layer 90 at different viewing angles and improving display quality. On the other hand, the organic barrier layer 40 prevents the color conversion layer 90 from directly contacting the light-emitting diode 20, thereby blocking the heat generated by the operation of the light-emitting diode 30 from affecting the material of the color conversion layer 90 and reducing the material degradation of the color conversion layer 90.

[0065] like Figure 1 and Figure 6 As shown, an inorganic barrier layer 50 is formed on a side of the organic barrier layer 40 away from the substrate. In the thickness direction of the substrate 10, the inorganic barrier layer 50 has a flat portion 501, which is stacked above the first surface 401. The flat portion 501 is located in the isolation trench 32 and opposite to the light-emitting diode 20.

[0066] The inorganic barrier layer 50 is fabricated by atomic layer deposition (ALD), plasma enhanced chemical vapor deposition (PECVD), or other methods.

[0067] The inorganic barrier layer 50 has a thickness of 0.01 to 1 μm and is made of materials selected from SiO2, Si3N4, Al2O3, AlN, TiO2, HfO2, and the like. In this embodiment, the color conversion unit of the color conversion layer 90 is formed on the side of the flat portion 501 facing away from the substrate 10. The inorganic barrier layer 50 provides good contact stability with the color conversion layer 90, isolating water and oxygen from the external environment from entering the color conversion layer 90, protecting the material of the color conversion layer 90 and increasing its service life.

[0068] In which, the flat portion 501 of the inorganic layer 50 is manufactured by using the flat first surface 401 as a template, and the upper surface of the flat portion 501 is located below the top surface of the isolation unit 31. The space between the upper surface of the flat portion 501 and the top surface of the isolation unit 31 defines the formation position of the color conversion unit of the color conversion layer 90. At this time, the color conversion unit is formed above the flat portion 501 and directly contacts the flat portion 501.

[0069] In addition, in this embodiment, the planarization layer 50 entirely covers the side of the isolation layer 30 away from the substrate 10 .

[0070] like Figure 7 As shown, a light-shielding layer 60 is formed on the side of the inorganic layer 50 away from the substrate. The light-shielding layer 60 includes a light-shielding unit 61 and an opening 62. In the thickness direction of the substrate 10, the light-shielding unit 61 is located above the portion of the inorganic barrier layer 50 corresponding to the isolation unit 31; the opening 62 corresponds to the isolation groove 32, and the flat portion 501 is exposed from the opening 62.

[0071] In this embodiment, the light shielding layer 60 is, for example, a black matrix with a thickness of 1-10 μm. The light shielding layer 60 is formed by coating a light shielding material on the inorganic barrier layer 50 and then performing an exposure and development patterning process.

[0072] The light shielding units 61 of the light shielding layer 60 are used to overcome light crosstalk between adjacent light emitting diodes 20 and form a good hydrophobic surface.

[0073] like Figure 1 and Figure 8 As shown, the color conversion layer 90 is formed on the flat portion 501 of the inorganic layer 50 .

[0074] To achieve color display, when the LED 20 is a blue LED, the display device 100 typically includes a color conversion layer 90 comprising a first color conversion unit 91, a second color conversion unit 92, and a blank-filling unit 93. Light emitted from the corresponding LED 20 is converted into corresponding red and green colors by the first color quantum dots 911 of the first color conversion unit 91 and the second color quantum dots 921 of the second color conversion unit 92, respectively. Light emitted from the LED 20 remains unchanged after passing through the blank-filling unit 93. The first color conversion unit 91, the second color conversion unit 92, and the blank-filling unit 93 each further comprise scattering particles, which are used to ensure uniform light output and enhance display quality.

[0075] The first color conversion unit 91 , the second color conversion unit 92 and the blank filling unit 93 in the color conversion layer 90 are respectively manufactured by inkjet printing.

[0076] In this embodiment, the color conversion layer 90 is manufactured after the light shielding layer 60 , so the first color conversion unit 91 , the second color conversion unit 92 and the blank filling unit 93 are respectively confined to the space between the corresponding isolation unit 31 , the light shielding unit 61 and the flat portion 501 .

[0077] The blank-filling cells 93 fill the corresponding flat portions 501, preventing the subsequent protective layer 70 from forming a noticeable depression in this area. This overcomes the problem of large height differences in the film layers within the display device 100 and helps improve the manufacturing yield of the display device 100. Furthermore, the blank-filling cells 93 ensure that the film thickness of each light-emitting unit is consistent, and the light emission angles of each light-emitting unit are more consistent, achieving a more uniform display effect.

[0078] like Figure 1 and Figure 9 As shown, the first inorganic layer 71 of the protective layer 70 is formed on the color conversion layer 90 .

[0079] The first inorganic layer 71 entirely covers one side of the substrate 10 and is fabricated by atomic layer deposition (ALD), plasma enhanced chemical vapor deposition (PECVD), or other methods.

[0080] The thickness of the first inorganic layer 71 is 0.01-1 μm; its material is selected from SiO 2 , Si 3 N 4 , Al 2 O 3 , AlN, TiO 2 , HfO 2 and the like.

[0081] The first inorganic layer 71 and the inorganic barrier layer 50 located below the color conversion layer 90 jointly isolate water and oxygen in the external environment from contacting the color conversion layer 90 .

[0082] like Figure 1 and Figure 10 As shown, an intermediate organic layer 72 is formed on the first inorganic layer 71 .

[0083] The thickness of the intermediate organic layer 72 is 5-10 μm, and it is formed by coating or inkjet printing. The material of the intermediate organic layer 72 is, for example, acrylic resin (PMMA), novolac resin, polyimide (PI), etc.

[0084] like Figure 1 and Figure 11 As shown, a second inorganic layer 73 is formed on the middle organic layer 72 .

[0085] The second inorganic layer 73 is fabricated by atomic layer deposition (ALD), plasma enhanced chemical vapor deposition (PECVD), or other methods.

[0086] The thickness of the second inorganic layer 73 is 0.01-1 μm; its material is selected from SiO2, Si3N4, Al2O3, AlN, TiO2, HfO2, etc.

[0087] The protective layer 70 composed of the first inorganic layer 71 , the middle organic layer 72 and the second inorganic layer 73 can be regarded as a composite encapsulation film, which can effectively prevent moisture and oxygen from penetrating and contacting the color conversion layer 90 , thereby reducing the service life of the color conversion layer 90 .

[0088] like Figure 1 As shown, the display device 100 further includes a color filter layer 80 formed above the protective layer 70. The color filter layer 80 includes a first filter unit 81, a second filter unit 82, and a third filter unit 83. In the thickness direction of the substrate 10, the first filter unit 81, the second filter unit 82, and the third filter unit 83 correspond to the corresponding light-emitting diodes 20, respectively.

[0089] Among them, the first color conversion unit 91 is located between the first filter unit 81 and the corresponding light emitting diode 20; the second color conversion unit 92 is located between the second filter unit 82 and the corresponding light emitting diode 20; and the blank filling unit 93 is located between the third filter unit 83 and the corresponding light emitting diode 20.

[0090] The light output color of the first color conversion unit 91 is the same as the color of the first filter unit 81, for example, red; the light output color of the second color conversion unit 92 is the same as the color of the second filter unit 82, for example, green; the color of the third filter unit 83 is the same as the color of the corresponding light-emitting diode 20, for example, blue.

[0091] In this embodiment, filter materials of different colors are coated on the protective layer 70 , and the corresponding first filter unit 81 , second filter unit 82 and third filter unit 83 are formed through a patterning process of exposure and development.

[0092] The thickness of the first filter unit 81 , the second filter unit 82 and the third filter unit 83 are 1-5 μm respectively.

[0093] like Figure 12 As shown, another embodiment of the present invention further provides a display device 200.

[0094] like Figure 1 and Figure 12 As shown, the difference between the display device 200 and the display device 100 is that the interlayer structure of the barrier structure is different. Figure 1 and Figure 12 The same reference numerals represent the same components with similar functions and are not described in detail.

[0095] like Figure 4 、 Figure 12 and Figure 13 As shown, the inorganic barrier layer 210 of the barrier structure is formed on the side of the isolation layer 30 away from the substrate 10 , and the portion of the inorganic barrier layer 210 located in the isolation trench 32 covers the side of the light emitting diode 20 away from the substrate 10 .

[0096] The inorganic barrier layer 210 is fabricated by atomic layer deposition (ALD), plasma enhanced chemical vapor deposition (PECVD), or other methods.

[0097] The inorganic barrier layer 210 has a thickness of 0.01 to 1 μm; its material is selected from SiO 2 , Si 3 N 4 , Al 2 O 3 , AlN, TiO 2 , HfO 2 and the like.

[0098] In this embodiment, a step is formed between the inorganic barrier layer 210 in the isolation trench 32 and the upper portion of the LED 20. To mitigate the impact of this step on the subsequently fabricated color conversion layer 90, an organic barrier layer 220 is formed to cover the step, and the color conversion layer 90 is then fabricated on the flat first surface 222 of the organic barrier layer 220.

[0099] like Figure 12 and Figure 15 As shown, the organic barrier layer 220 forms the side of the inorganic barrier layer 210 away from the substrate 10, and the organic barrier layer 220 includes a plurality of barrier units 221. The plurality of barrier units 221 are located in the isolation groove 32 and cover the portion of the inorganic barrier layer 210 located in the isolation groove 32 and the upper portion of the light-emitting diode 20.

[0100] The barrier unit 221 is sprayed in the isolation groove 32 by inkjet printing.

[0101] The thickness of the organic barrier layer 220 is 5-10 μm. The material of the organic barrier layer 220 is, for example, a transparent heat-insulating resin. The first surface 222 of the organic barrier layer 220 away from the substrate 10 is a flat surface.

[0102] Furthermore, in the thickness direction of the substrate 10, the first surface 222 of the barrier unit 221 is located below the top surface of the isolation unit 31 on the side away from the substrate 10. That is, the barrier unit 221 fills the interior of the isolation trench 32. The barrier unit 221 fills the interior of the isolation trench 32, and the space above the isolation trench 32 is used to limit the formation position of the color conversion layer 90. This facilitates alignment of the different color conversion units in the color conversion layer 90 and the light-emitting diodes 20, reduces manufacturing difficulty, and achieves color display.

[0103] like Figure 12 and Figure 14 As shown, before forming the organic barrier layer 220 , a light shielding layer 60 is further formed on the side of the inorganic barrier layer 210 away from the substrate.

[0104] The light shielding layer 60 includes a light shielding unit 61 and an opening 62 . In the thickness direction of the substrate 10 , the light shielding unit 61 is located above the portion of the inorganic barrier layer 210 corresponding to the isolation unit 31 . The opening 62 corresponds to the isolation groove 32 , and the light emitting diode 20 is exposed from the opening 62 .

[0105] In this embodiment, the light shielding layer 60 is, for example, a black matrix with a thickness of 1-10 μm. The light shielding layer 60 is formed by coating a light shielding material on the inorganic barrier layer 210 and then performing an exposure and development patterning process.

[0106] The light shielding units 61 of the light shielding layer 60 are used to overcome light crosstalk between adjacent light emitting diodes 20 .

[0107] like Figure 12 and Figure 16As shown, a color conversion layer 90 is formed on the first surface 222 of the organic barrier layer 220. The flat first surface 222 of the barrier units 221 of the organic barrier layer 220 eliminates uneven areas on the color conversion layer 90, ensuring consistent light output from the color conversion layer 90 at different viewing angles, thereby improving display quality.

[0108] like Figure 12 、 Figures 17 to 19 As shown, the protective layer 70 further includes a first inorganic layer 71, an intermediate organic layer 72, and a second inorganic layer 73 formed in sequence above the color conversion layer 90. The thickness, fabrication method, and materials of the first inorganic layer 71, the intermediate organic layer 72, and the second inorganic layer 73 can be found in the description of the display device 100 and are not described in detail here.

[0109] like Figure 20 As shown, the present invention further provides a manufacturing method 300 of the display panels 100 and 200 .

[0110] The manufacturing method 300 includes:

[0111] Providing a substrate, wherein one side of the substrate includes an electrode and a light-emitting diode electrically connected to the electrode;

[0112] An isolation layer is formed on one side of the substrate, wherein the isolation layer has an isolation groove, and the light-emitting diode is exposed from the isolation groove;

[0113] forming a barrier structure on a side of the light emitting diode away from the substrate;

[0114] forming a color conversion layer on a side of the barrier structure away from the light emitting diode; and

[0115] A protective layer is formed on a side of the color conversion layer away from the substrate.

[0116] The barrier structure includes a first barrier layer and a second barrier layer. The second barrier layer includes a barrier unit. The barrier unit is located in the isolation groove. The first surface of the barrier unit away from the light emitting diode is a flat surface.

[0117] In a preferred embodiment, the first barrier layer is an inorganic barrier layer, and the second barrier layer is an organic barrier layer, wherein the organic barrier layer includes a barrier unit, and the first surface of the barrier unit away from the substrate is a flat surface.

[0118] In addition, when the inorganic barrier layer is formed above the organic barrier layer, the area of the inorganic barrier layer corresponding to the first surface is a flat portion, and the color conversion layer directly contacts the flat portion of the inorganic barrier layer; and when the organic barrier layer is formed above the inorganic barrier layer, the barrier unit of the organic barrier layer covers the portion of the inorganic barrier layer located in the isolation groove, and the color conversion layer directly contacts the flat first surface of the barrier unit.

[0119] In summary, the present invention provides a display device and manufacturing method. A barrier structure is provided on one side of the display device's isolation layer. The barrier structure comprises a first and second stacked barrier layers. The second barrier layer provides a flat surface, allowing the subsequently fabricated color conversion layer to be positioned above the flat surface. This prevents the unevenness of the color conversion layer, which can lead to inconsistent light output at different viewing angles. Furthermore, the barrier structure prevents direct contact between the color conversion layer and the light-emitting diodes, preventing material degradation and effectively extending the lifespan of the color conversion layer.

[0120] The present invention has been described by the above-mentioned embodiments. However, the above-mentioned embodiments are merely examples of the present invention. In addition, the technical features involved in the different embodiments of the present invention described above may be combined with each other as long as they do not conflict with each other. It must be pointed out that the present invention may also have various other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention. However, such corresponding changes and modifications shall fall within the scope of protection of the claims appended to the present invention.

Claims

1. A display device, characterized in that: The display device includes: a substrate, the substrate comprising connecting electrodes; a light emitting diode, the light emitting diode being disposed on one side of the substrate and electrically connected to the connecting electrode; an isolation layer, the isolation layer being disposed on one side of the substrate, the isolation layer comprising an isolation groove and an isolation unit surrounding the isolation groove, the light-emitting diode being disposed in the isolation groove; a barrier structure, the barrier structure being disposed on a side of the light-emitting diode away from the substrate, the barrier structure comprising a first barrier layer and a second barrier layer stacked together, the second barrier layer comprising a barrier unit, and the barrier unit being located in the isolation trench; a color conversion layer, the color conversion layer being disposed on a side of the barrier structure away from the substrate, and facing the light-emitting diode in a thickness direction of the substrate; and a protective layer, the protective layer being disposed on a side of the color conversion layer away from the substrate; The first barrier layer is an inorganic barrier layer, the second barrier layer is an organic barrier layer, the first surface of the barrier unit away from the substrate is located below the top surface of the isolation unit away from the substrate, the upper surface of the inorganic barrier layer located in the isolation groove is located below the top surface of the isolation unit, and the space above the isolation groove is used to limit the formation position of the color conversion layer.

2. The display device according to claim 1, wherein The first surface of the organic barrier layer away from the light emitting diode is a flat surface.

3. The display device according to claim 2, wherein: The inorganic barrier layer covers the light emitting diode and is in direct contact with the light emitting diode, and the organic barrier layer is arranged on the inorganic barrier layer.

4. The display device according to claim 3, wherein The color conversion layer is disposed above the first surface.

5. The display device according to claim 2, wherein The organic barrier layer covers the light emitting diode and is in direct contact with the light emitting diode, and the inorganic barrier layer covers the organic barrier layer.

6. The display device according to claim 5, wherein: The inorganic barrier layer includes a flat portion located in the isolation trench, wherein the flat portion is stacked above the first surface in a thickness direction of the substrate and is opposite to the light emitting diode.

7. The display device according to claim 6, wherein: The color conversion layer is disposed above the flat portion.

8. The display device according to claim 1, wherein The protective layer includes a first inorganic layer, an intermediate organic layer, and a second inorganic layer stacked from bottom to top, wherein the first inorganic layer covers the color conversion layer.

9. A method for manufacturing a display device, wherein the method is used to manufacture the display device according to any one of claims 1 to 8, wherein: The production method comprises: Providing a substrate, wherein one side of the substrate includes an electrode and a light-emitting diode electrically connected to the electrode; forming an isolation layer on one side of the substrate, wherein the isolation layer has an isolation groove, and the light-emitting diode is exposed from the isolation groove; forming a barrier structure on a side of the light emitting diode away from the substrate; forming a color conversion layer on a side of the barrier structure away from the light emitting diode; and forming a protective layer on a side of the color conversion layer away from the substrate; The barrier structure includes a first barrier layer and a second barrier layer, the second barrier layer includes a barrier unit, the barrier unit is located in the isolation groove, the first surface of the barrier unit away from the light-emitting diode is a flat surface, the first barrier layer is an inorganic barrier layer, the second barrier layer is an organic barrier layer, the first surface of the barrier unit away from the substrate is located below the top surface of the isolation unit away from the substrate, the upper surface of the inorganic barrier layer located in the isolation groove is located below the top surface of the isolation unit, and the space above the isolation groove is used to limit the formation position of the color conversion layer.

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