Display panel, manufacturing method thereof and display device

Abstract

The application provides a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display panel comprises a display area and a binding area located at the periphery of the display area, the binding area comprises at least two laminated flexible substrates, and a signal trace is arranged between adjacent flexible substrates, the signal trace is connected with a binding pin through a via hole penetrating the flexible substrate, and the binding pin is located at the outermost side of the at least two laminated flexible substrates. The technical scheme of the application can realize curved display.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] With the rapid development of display technology, various types of display products gradually appear in people's life, and with people's pursuit of higher quality of life, people's visual requirements for display products are getting higher and higher. Four-edge curved display products cater to the needs of customers, but four-edge curved display products have higher requirements for the shape change of flexible display panels. SUMMARY

[0003] The technical problem to be solved by the present application is to provide a display panel, a manufacturing method thereof and a display device, which can realize curved display.

[0004] To solve the above technical problems, the technical solutions of the embodiments of the present application are as follows:

[0005] In one aspect, a display panel is provided, comprising a display area and a binding area located at the periphery of the display area, the binding area comprising at least two stacked flexible substrates, and signal traces arranged between adjacent flexible substrates, the signal traces being connected to binding pins through vias penetrating the flexible substrates, the binding pins being located at the outermost side of the at least two stacked flexible substrates.

[0006] In some embodiments, the at least two stacked flexible substrates comprise a first flexible substrate and a second flexible substrate arranged in layers, the binding area comprises signal traces between the first flexible substrate and the second flexible substrate, the first flexible substrate is provided with a binding pin on the side surface away from the second flexible substrate, and the signal traces are connected to the binding pin through vias penetrating the first flexible substrate.

[0007] In some embodiments, the aperture of the via is 4-6um.

[0008] In some embodiments, the signal traces are made of Al with a thickness of 0.5-0.6um.

[0009] In some embodiments, the line width of the signal traces is greater than or equal to 3um, and the distance between adjacent signal traces is greater than or equal to 3um.

[0010] In some embodiments, the thickness of the flexible substrate is 6-10um.

[0011] In some embodiments, further comprising:

[0012] A protective film located at the outermost side of the at least two stacked flexible substrates, the protective film comprising a hollowed-out region exposing the binding pin.

[0013] Embodiments of the present application also provide a display device comprising the display panel as described above.

[0014] In some embodiments, a driving chip is further included, and the binding pin is bound to the driving chip through ACF.

[0015] Embodiments of the present application also provide a manufacturing method of a display panel, comprising:

[0016] A rigid substrate is provided;

[0017] At least two flexible substrates are formed in a stacked manner on the rigid substrate;

[0018] Signal traces are formed between adjacent two layers of the flexible substrates;

[0019] A via hole is formed through the flexible substrates to expose the signal traces by using a photolithography process;

[0020] A binding pin is formed at the outermost side of the at least two stacked flexible substrates, and the binding pin is connected to the signal traces through the via hole.

[0021] In some embodiments, forming at least two flexible substrates in a stacked manner on the rigid substrate comprises:

[0022] A first flexible substrate and a second flexible substrate are formed in a stacked manner;

[0023] Forming signal traces between adjacent two layers of the flexible substrates comprises:

[0024] Signal traces are formed between the first flexible substrate and the second flexible substrate, the first flexible substrate is provided with a binding pin away from a side surface of the second flexible substrate, and the signal traces are connected to the binding pin through a via hole penetrating through the first flexible substrate.

[0025] In some embodiments, the method further comprises:

[0026] A protective film located at the outermost side of the at least two stacked flexible substrates is formed, and the protective film comprises a hollowed-out region exposing the binding pin.

[0027] Embodiments of the present application have the following beneficial effects:

[0028] In the above scheme, the binding area includes at least two layers of flexible substrates and signal lines arranged between adjacent flexible substrates, and the flexible substrates are organic materials, so that there is no inorganic layer in the binding area, and the crack is not easy to appear when folding and bending; in addition, the signal lines between the flexible substrates are located in the middle of the PAD area stack structure, at the neutral layer position, and are not easy to break when bending, so that the binding area can be bent and folded, and the PAD area can be changed in multiple forms to match the curved display panel. The application can significantly reduce the risk of PAD area folding deformation and breakage, and improve product yield. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 FIG. 1 is a structural schematic diagram of a related art display panel binding area;

[0030] Figure 2 FIG. 2 is a planar schematic diagram of a display panel according to an embodiment of the application;

[0031] Figures 3-6 FIG. 3 is a structural schematic diagram of a display panel binding area according to an embodiment of the application;

[0032] Figures 7-12 FIG. 4 is a manufacturing process schematic diagram of a display panel binding area according to an embodiment of the application.

[0033] REFERENCE NUMERALS

[0034] 01 first flexible substrate

[0035] 02 second flexible substrate

[0036] 03 gate insulating layer

[0037] 04 gate metal layer

[0038] 05 interlayer insulating layer

[0039] 06 driving chip

[0040] 07 binding pin

[0041] 08 signal line

[0042] 09 rigid substrate

[0043] 10 protective film

[0044] 11 ACF

[0045] 13 third flexible substrate

[0046] 14 display panel

[0047] 15 PAD area DETAILED DESCRIPTION

[0048] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present application more clear, the following will be described in detail in combination with the drawings and specific embodiments.

[0049] As shown in Figure 1 The film layer stack structure of the binding area (PAD area) of the existing display panel includes: a first flexible substrate 01, a second flexible substrate 02, a gate insulating layer 03, a gate metal layer 04, an interlayer insulating layer 05, wherein the gate metal layer 04 is used as a signal trace, the interlayer insulating layer 05 is punched, a via hole is formed, and a first source-drain metal layer is deposited in the via hole to form a binding pin 07, and the binding of the driving circuit and the signal trace is realized through the binding pin 07. The above structure has the following problems: 1) the material of the gate metal layer 04 is relatively brittle, and folding and bending easily cause disconnection; 2) there is an inorganic layer (interlayer insulating layer 05 and gate insulating layer 03) in the PAD area, and crack is easily generated when folding and bending. The existence of these problems makes the flexible screen PAD area unable to be folded and bent.

[0050] The embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device, which can realize the folding and bending of the PAD area, and further realize curved display.

[0051] The embodiments of the present application provide a display panel, as shown in Figure 2 The display panel includes a display area (i.e. AA area) and a binding area (i.e. PAD area) located at the periphery of the display area, the binding area includes at least two stacked flexible substrates, and a signal trace arranged between adjacent flexible substrates, the signal trace is connected with a binding pin through a via hole penetrating the flexible substrates, and the binding pin is located at the outermost side of the at least two stacked flexible substrates.

[0052] In the embodiments, the binding area includes at least two stacked flexible substrates, and a signal trace arranged between adjacent flexible substrates, the flexible substrates are made of organic material, so that there is no inorganic layer in the binding area, and crack is not easily generated when folding and bending; in addition, the signal trace between the flexible substrates is located in the middle of the PAD area stack structure, at the position of the neutral layer, and is not easily broken when bending, so that the binding area can be folded and bent, and the multi-form change of the PAD area is realized to match the curved display panel. The present application can significantly reduce the risk of disconnection of the PAD area folding deformation, and improve the product yield.

[0053] In the embodiment, the binding area can include two layers of flexible substrates, or three or more layers of flexible substrates, and the flexible substrates are generally made of polyimide. When the binding area includes two layers of flexible substrates, the binding area includes a layer of signal lines between the two layers of flexible substrates; when the binding area includes three or more layers of flexible substrates, the binding area can include multiple layers of signal lines between each two adjacent flexible substrates, or only one layer of signal lines between two layers of flexible substrates. When the binding area includes multiple layers of signal lines, the adjacent two layers of signal lines can be connected through vias penetrating the flexible substrates.

[0054] In addition, in the embodiment, not only the binding area includes at least two layers of stacked flexible substrates, but also the base of other areas of the display panel is of the same structure as the binding area, that is, the base of other areas of the display panel also includes at least two layers of stacked flexible substrates, but the signal lines can not be arranged between the flexible substrates of the other areas such as the display area; of course, in order to reduce the occupied area of the signal lines, the signal lines can also be arranged between the adjacent two layers of flexible substrates in the display area of the display panel.

[0055] In some embodiments, as shown in Figure 3 in the binding area of the display panel, at least two layers of stacked flexible substrates include a first flexible substrate 01 and a second flexible substrate 02 arranged in layers, the binding area further includes a signal line 08 between the first flexible substrate 01 and the second flexible substrate 02, the first flexible substrate 01 is provided with a binding pin 07 on the side surface away from the second flexible substrate 02, and the signal line 08 is connected with the binding pin 07 through a via penetrating the first flexible substrate 01.

[0056] In the embodiment, the via penetrating the first flexible substrate 01 can be formed by using a photolithography process, the via exposes the signal line 08, then a source / drain metal layer is formed on the first flexible substrate 01, the source / drain metal layer is patterned, the source / drain metal layer is deposited in the via, and a binding pin 07 is formed on the first flexible substrate 01 to be connected with the driving chip 06 to realize the transmission of driving signals.

[0057] In some embodiments, as shown in Figure 4 in the binding area of the display panel, a first flexible substrate 01, a second flexible substrate 02 and a third flexible substrate 13 arranged in layers are arranged, a signal line 08 is arranged between the first flexible substrate 01 and the second flexible substrate 02, and a signal line 08 is arranged between the second flexible substrate 02 and the third flexible substrate 13. Different layers of signal lines 08 can be connected together through a via penetrating the second flexible substrate 02, so as to reduce the resistance of the signal lines 08.

[0058] The first flexible substrate 01 is provided with a binding pin 07 on the side surface away from the second flexible substrate 02, and the signal wire 08 is connected with the binding pin 07 through a via hole penetrating the first flexible substrate 01.

[0059] In the embodiment, the via hole penetrating the first flexible substrate 01 is formed by using a photoetching process, the via hole exposes the signal wire 08, then a source-drain metal layer is formed on the first flexible substrate 01, the source-drain metal layer is patterned, the source-drain metal layer is deposited in the via hole, and the binding pin 07 is formed on the first flexible substrate 01 to be connected with the driving chip 06 to realize the transmission of the driving signal.

[0060] In the embodiment, the signal wire can be made of metal with good conductivity, such as Al, Mo, Au, Ag, etc. In some embodiments, the signal wire can be made of Al with a thickness of 0.5-0.6 um. Al has the advantages of good toughness, high tensile strength, etc., can be folded, and meets the needs of flexible display; in addition, the thickness of Al is 0.5-0.6 um, which can ensure that the wire resistance of the signal wire is small and can reduce the loss of signal transmission. In the embodiment, the signal wire between adjacent flexible substrates is located at the neutral layer position of the film layer structure, and is neither stretched nor compressed when folded, which can well protect the signal wire from being folded and broken, and can be folded and bent on the front and back surfaces at the same time, as shown in Figure 5 .

[0061] In related technologies, when the via hole of the binding area is made, a punching process is used to punch, and the diameter of the via hole made by the punching process is 25±15 um. The large hole diameter is not conducive to the arrangement of the wire, limits the number of wires, and is not conducive to the narrowing of the lower edge PAD area of the flexible display panel. In the embodiment, since the via hole is made by using a photoetching process, the hole diameter of the via hole is small, and the hole diameter of the via hole is 4-6 um, which is conducive to the arrangement of the wire and the narrowing of the lower edge PAD area of the flexible display panel.

[0062] In some embodiments, the line width of the signal wire is greater than or equal to 3 um, which can effectively reduce the resistance of the signal wire and be conducive to the transmission of the driving signal; the distance between adjacent signal wires is greater than or equal to 3 um, which can avoid the interference between adjacent signal wires.

[0063] In some embodiments, the thickness of the flexible substrate can be 6-10 um, which can ensure that the binding area has a certain structural strength and will not make the thickness of the binding area too large.

[0064] In some embodiments, as shown in Figure 4 , the display panel further comprises:

[0065] A protective film 10 is located at the outermost side of the at least two laminated flexible substrates, the protective film 10 is made of a waterproof erosion-resistant material and can protect the binding area, the protective film 10 includes a hollow area exposing the binding pins and does not affect the connection between the driving chip and the binding pins. In order to better protect the display panel, the protective film can cover both surfaces of the binding area, that is, the protective film is located at the outermost side of the at least two flexible substrates, as shown in Figure 4 The protective film is also located on the surface away from the second flexible substrate 02 of the third flexible substrate 13.

[0066] Embodiments of the present application also provide a display device comprising the display panel as described above.

[0067] The display device includes but is not limited to a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply, etc. Those skilled in the art can understand that the structure of the display device described above does not constitute a limitation on the display device, and the display device can include more or fewer components described above, or combine some components, or different component arrangements. In the embodiments of the present application, the display device includes but is not limited to a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, etc.

[0068] The display device can be a television, a display, a digital photo frame, a mobile phone, a tablet computer, etc. Any product or component with display function, wherein the display device further includes a flexible circuit board, a printed circuit board, and a back plate.

[0069] In some embodiments, as shown in Figure 4 The display device further includes a driving chip 06, and the binding pins 07 are bound to the driving chip 06 through an ACF (Anisotropic Conductive Film) 11. If the binding pins 07 are bound to the driving chip 06 by using a gold-tin eutectic welding process, it needs to be performed in a vacuum environment, which has high requirements on the equipment environment, slow production speed, and low efficiency. In the present embodiment, the binding pins 07 are pressed together with the driving chip 06 by using the ACF 11, which does not require a vacuum environment, has fast production speed, high efficiency, and low cost.

[0070] Four-sided curved surface display products are the trend of the market. In related technologies, the placement position of the PAD area after the flexible display panel is attached along the arc surface of the packaging cover plate is a big technical problem, because the wiring in the PAD area is fragile and cannot be bent and folded. As shown in Figure 6As shown, the wiring structure of the PAD area of the embodiment can be folded at any angle to match the shape of the four-edge curved packaging cover plate; wherein 14 is a display panel, in order to realize narrow frame, the PAD area 15 is folded to the back of the display panel, it can be seen that the PAD area can be folded with the display panel, in the part of the PAD area 15 and the driving chip 06 binding, due to the existence of the driving chip 06, it cannot be folded. The PAD area of the embodiment can be placed along the arc surface of the packaging cover plate, which can reduce the space occupied by the PAD area in the whole machine, provide more space for the layout of the battery, devices and the like of the whole display device, and has the advantages of improving the endurance of the display device.

[0071] Embodiments of the present application also provide a manufacturing method of a display panel, comprising:

[0072] providing a rigid substrate;

[0073] forming at least two layers of flexible substrates arranged in layers on the rigid substrate;

[0074] forming signal wires between the adjacent two layers of flexible substrates;

[0075] forming a via through the flexible substrates and exposing the signal wires by using a photoetching process;

[0076] forming a binding pin on the outermost side of the at least two layers of flexible substrates arranged in layers, the binding pin being connected with the signal wires through the via.

[0077] In the embodiment, the binding area includes at least two layers of flexible substrates and signal wires arranged between the adjacent flexible substrates, and the flexible substrates are organic materials, so that there is no inorganic layer in the binding area, and crack is not easy to occur when folding and bending; in addition, the signal wires between the flexible substrates are located in the middle of the PAD area stacking structure and are at the neutral layer position, and are not easy to break when bending, so that the binding area can be bent and folded, and the PAD area can change in multiple forms to match the curved display panel. The present application can significantly reduce the risk of folding deformation and disconnection of the PAD area, and improve the yield of products.

[0078] In the embodiment, the binding area can include two layers of flexible substrates, or three or more layers of flexible substrates, and the flexible substrates are generally polyimide. When the binding area includes two layers of flexible substrates, the binding area includes a layer of signal wires located between the two layers of flexible substrates; when the binding area includes three or more layers of flexible substrates, the binding area can include multiple layers of signal wires located between the adjacent two layers of flexible substrates, or can include only one layer of signal wires located between two layers of flexible substrates. When the binding area includes multiple layers of signal wires, the adjacent two layers of signal wires can be connected through the via penetrating the flexible substrates.

[0079] In addition, in the embodiment, the binding area includes at least two layers of stacked flexible substrates, and the base of other areas of the display panel is of the same structure as the binding area, that is, the base of other areas of the display panel also includes at least two layers of stacked flexible substrates, but the signal lines can not be arranged between the flexible substrates of the other areas such as the display area; of course, in order to reduce the area occupied by the signal lines, the signal lines can also be arranged between the adjacent two layers of flexible substrates in the display area of the display panel.

[0080] In some embodiments, as shown in Figure 3 In the binding area of the display panel, the at least two layers of stacked flexible substrates include the first flexible substrate 01 and the second flexible substrate 02 arranged in layers, and the at least two layers of flexible substrates arranged in layers formed on the rigid substrate include:

[0081] The first flexible substrate and the second flexible substrate arranged in layers are formed;

[0082] The signal lines are formed between the adjacent two layers of flexible substrates, and the signal lines are formed between the first flexible substrate and the second flexible substrate, and the first flexible substrate is provided with a binding pin on the side surface away from the second flexible substrate, and the signal lines are connected with the binding pin through the via hole penetrating the first flexible substrate.

[0083] The signal lines are formed between the first flexible substrate and the second flexible substrate, and the first flexible substrate is provided with a binding pin on the side surface away from the second flexible substrate, and the signal lines are connected with the binding pin through the via hole penetrating the first flexible substrate.

[0084] In some embodiments, the method further includes:

[0085] The protective film located at the outermost side of the at least two layers of stacked flexible substrates is formed, and the protective film includes a hollow area exposing the binding pin. The protective film 10 is made of a waterproof erosion-resistant material and can protect the binding area. The protective film 10 includes a hollow area exposing the binding pin and does not affect the connection between the driving chip and the binding pin. In order to better protect the display panel, the protective film can cover both surfaces of the binding area, that is, the protective film is located at the outermost side of the at least two layers of flexible substrates, as shown in Figure 4 The protective film is also located on the side surface of the third flexible substrate 13 away from the second flexible substrate 02.

[0086] In a specific example, the manufacturing method of the display panel of the embodiment includes the following steps:

[0087] Step 1, as shown in Figure 7 The rigid substrate 09 is provided, and the second flexible substrate 02 is formed on the rigid substrate 09;

[0088] The rigid substrate 09 can be a glass substrate or a quartz substrate. The second flexible substrate 02 can be formed by a coating process, and has a thickness of 6-10 um and can be made of polyimide.

[0089] Step 2, as shown in the figure, a source-drain metal layer is formed on the second flexible substrate 02, and the source-drain metal layer is patterned to form a signal trace 08. Figure 8

[0090] Specifically, the metal Al can be deposited by a magnetron sputtering method, and has a thickness of 0.5-0.6 um. A dry etching process is used to form a corresponding pattern, and the trace width formed by the dry etching process can be as small as 3 um and the pitch can be 3 um. In this embodiment, the signal trace is made of Al material with a thickness of 0.5-0.6 um, which has a relatively thick thickness, a small impedance, a low cost, a high tensile strength, and a high bending resistance.

[0091] Step 3, as shown in the figure, a first flexible substrate 01 is formed, and the first flexible substrate 01 is patterned to form a via hole. Figure 9

[0092] The first flexible substrate 01 can be formed by a coating process, and has a thickness of 6-10 um and can be made of polyimide. A via hole penetrating through the first flexible substrate 01 is formed by a photolithography process, and has a hole diameter of 6±2 um.

[0093] Step 4, as shown in the figure, a metal layer is deposited on the first flexible substrate 01, and the metal layer is patterned to form a binding pin 07. Figure 10

[0094] The binding pin 07 includes an IC bonding pin and a display panel bonding pin. Since the via hole formed by the photolithography process has a small hole diameter, the via hole can be punched at any position. The binding pin 07 can be double-row or multi-row, and can effectively reduce the width size of the display panel PAD area.

[0095] Step 5, as shown in the figure, the rigid substrate 09 is removed, and a protective film 10 is formed. Figure 11

[0096] Specifically, the protective film 10 can be formed by coating a waterproof erosion-resistant material. In order to better protect the display panel, the protective film 10 can cover both surfaces of the binding area. The protective film can be made of an organic material, such as solder resist (solder resist ink).

[0097] Step 6, as shown in the figure, the driving chip 06 is bound to the binding pin 07. Figure 12

[0098] ​​​​​In the embodiment, the driving chip 06 can be bonded with the bonding pin 07 through the ACF bonding process, without a vacuum condition environment, with high production speed and efficiency, and low cost. Specifically, the ACF can be coated on the bonding pin 07, and then the driving chip 06 is crimped on the bonding pin 07, and then the ACF is cured, to complete the bonding of the driving chip 06 and the bonding pin 07.

[0099] In the method embodiments of the present application, the serial numbers of the steps cannot be used to limit the sequence of the steps, and for those skilled in the art, the changes of the sequence of the steps without creative labor are within the protection scope of the present application.

[0100] It should be noted that each embodiment in the present specification is described in a progressive manner, and the same and similar parts between each embodiment can be referred to each other, and each embodiment mainly describes the differences from other embodiments. In particular, for the embodiment, since it is basically similar to the product embodiment, it is described more simply, and the related parts can be referred to the part of the description of the product embodiment.

[0101] Unless otherwise defined, technical terms or scientific terms used in the present disclosure should be understood as the common meaning thereof by those skilled in the art to which the present disclosure belongs. The terms "first", "second" and similar words used in the present disclosure do not represent any order, number or importance, but are only used to distinguish different components. "Include" or "contain" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connected" or "connected" and similar words are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to represent relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0102] It can be understood that when an element such as a layer, a film, a region or a substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element, or there can be an intermediate element.

[0103] In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0104] The above merely provides the specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto, any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display panel, characterized by, The display panel comprises a four-edge curved packaging cover plate, the display panel comprises a display area and a binding area located at the periphery of the display area, the binding area comprises at least two layers of stacked flexible substrates, and signal lines are arranged between adjacent flexible substrates, the signal lines are connected with binding pins through vias penetrating the flexible substrates, the binding pins are located at the outermost side of the at least two layers of stacked flexible substrates, and the signal lines between the flexible substrates are located in the middle of the binding area stack structure; the binding area stack structure is attached to the position corresponding to the arc surface area of the cover plate; The via is manufactured by a photolithography process, and the aperture of the via is 4-6 um.

2. The display panel of claim 1, wherein, The at least two layers of stacked flexible substrates comprise a first flexible substrate and a second flexible substrate arranged in layers, the binding area comprises signal lines between the first flexible substrate and the second flexible substrate, and the first flexible substrate is provided with a binding pin on the surface away from the second flexible substrate, and the signal lines are connected with the binding pin through a via penetrating the first flexible substrate.

3. The display panel of claim 1, wherein, The signal lines are made of Al and have a thickness of 0.5-0.6 um.

4. The display panel of claim 1, wherein, The line width of the signal lines is greater than or equal to 3 um, and the distance between adjacent signal lines is greater than or equal to 3 um.

5. The display panel of claim 1, wherein, The thickness of the flexible substrate is 6-10 um.

6. The display panel of claim 1, wherein, Further comprising: A protective film located at the outermost side of the at least two layers of stacked flexible substrates, the protective film comprises a hollow area exposing the binding pin.

7. A display device, characterized by comprising: The display panel comprises a four-edge curved packaging cover plate, the display panel comprises a display area and a binding area located at the periphery of the display area, the binding area comprises at least two layers of stacked flexible substrates, and signal lines are arranged between adjacent flexible substrates, the signal lines are connected with binding pins through vias penetrating the flexible substrates, the binding pins are located at the outermost side of the at least two layers of stacked flexible substrates, and the signal lines between the flexible substrates are located in the middle of the binding area stack structure; the binding area stack structure is attached to the position corresponding to the arc surface area of the cover plate; 8. The display device according to claim 7, wherein The display panel comprises a four-edge curved packaging cover plate, the display panel comprises a display area and a binding area located at the periphery of the display area, the binding area comprises at least two layers of stacked flexible substrates, and signal lines are arranged between adjacent flexible substrates, the signal lines are connected with binding pins through vias penetrating the flexible substrates, the binding pins are located at the outermost side of the at least two layers of stacked flexible substrates, and the signal lines between the flexible substrates are located in the middle of the binding area stack structure; the binding area stack structure is attached to the position corresponding to the arc surface area of the cover plate; 9. A manufacturing method of a display panel, comprising: The via is manufactured by a photolithography process, and the aperture of the via is 4-6 um. The at least two layers of stacked flexible substrates comprise a first flexible substrate and a second flexible substrate arranged in layers, the binding area comprises signal lines between the first flexible substrate and the second flexible substrate, and the first flexible substrate is provided with a binding pin on the surface away from the second flexible substrate, and the signal lines are connected with the binding pin through a via penetrating the first flexible substrate. The signal lines are made of Al and have a thickness of 0.5-0.6 um. The line width of the signal lines is greater than or equal to 3 um, and the distance between adjacent signal lines is greater than or equal to 3 um. The thickness of the flexible substrate is 6-10 um. Further comprising:

10. The manufacturing method of a display panel according to claim 9, wherein, A protective film located at the outermost side of the at least two layers of stacked flexible substrates, the protective film comprises a hollow area exposing the binding pin. The display panel comprises a four-edge curved packaging cover plate, the display panel comprises a display area and a binding area located at the periphery of the display area, the binding area comprises at least two layers of stacked flexible substrates, and signal lines are arranged between adjacent flexible substrates, the signal lines are connected with binding pins through vias penetrating the flexible substrates, the binding pins are located at the outermost side of the at least two layers of stacked flexible substrates, and the signal lines between the flexible substrates are located in the middle of the binding area stack structure; the binding area stack structure is attached to the position corresponding to the arc surface area of the cover plate; The display panel comprises a four-edge curved packaging cover plate, the display panel comprises a display area and a binding area located at the periphery of the display area, the binding area comprises at least two layers of stacked flexible substrates, and signal lines are arranged between adjacent flexible substrates, the signal lines are connected with binding pins through vias penetrating the flexible substrates, the binding pins are located at the outermost side of the at least two layers of stacked flexible substrates, and the signal lines between the flexible substrates are located in the middle of the binding area stack structure; the binding area stack structure is attached to the position corresponding to the arc surface area of the cover plate; The display panel comprises a four-edge curved packaging cover plate, the display panel comprises a display area and a binding area located at the periphery of the display area, the binding area comprises at least two layers of stacked flexible substrates, and signal lines are arranged between adjacent flexible substrates, the signal lines are connected with binding pins through vias penetrating the flexible substrates, the binding pins are located at the outermost side of the at least two layers of stacked flexible substrates, and the signal lines between the flexible substrates are located in the middle of the binding area stack structure; the binding area stack structure is attached to the position corresponding to the arc surface area of the cover plate; 11. The manufacturing method of a display panel according to claim 9, wherein, The display panel comprises a four-edge curved packaging cover plate, the display panel comprises a display area and a binding area located at the periphery of the display area, the binding area comprises at least two layers of stacked flexible substrates, and signal lines are arranged between adjacent flexible substrates, the signal lines are connected with binding pins through vias penetrating the flexible substrates, the binding pins are located at the outermost side of the at least two layers of stacked flexible substrates, and the signal lines between the flexible substrates are located in the middle of the binding area stack structure; the binding area stack structure is attached to the position corresponding to the arc surface area of the cover plate; ​

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